JP2012071365A - Apparatus and method for cutting of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the efficiency of working after forming a dividing line on a substrate.SOLUTION: A substrate cutting apparatus includes: a substrate placing device having a placing surface where the substrate is placed; a dividing line forming device for forming the dividing line for an exposed surface, which is a main surface of the substrate placed on the substrate placing device, and which is the main surface opposite to a facing surface being the main surface opposed to the placing surface; and a stressing device for stressing the substrate along the dividing line by decompressing a sealing area defined by the facing surface of the substrate and the placing surface of the substrate placing device.

Description

  The present invention relates to a substrate cutting apparatus and a substrate cutting method.

  Conventionally, as a substrate cutting apparatus for cutting a glass substrate, a tensile stress is generated by adsorbing a substrate with a dividing line on a cutting table having a curved surface and deforming the substrate along the curved surface. A substrate cutting device for applying and cutting is known (see, for example, Patent Document 1).

JP-A-6-148614

By the way, with the conventional substrate cutting apparatus, after the formation of the dividing line, it is necessary to dispose one side where the dividing line is formed opposite to the curved surface of the cutting table, and the substrate must be turned over once. It was an adverse effect of efficient workability.
The subject of this invention is improving the working efficiency after forming a parting line in a board | substrate.

In order to solve the above problems, according to one aspect of the present invention,
Substrate mounting means having a mounting surface on which the substrate is mounted;
A dividing line with respect to an exposed surface which is a main surface of the substrate placed on the substrate placing means and which is a main surface opposite to the opposing surface which is the main surface facing the mounting surface. Breaking line forming means for forming
A stress applying means for applying a stress along the dividing line to the substrate by depressurizing a sealed region defined by the facing surface of the substrate and the mounting surface of the substrate mounting means; A substrate cutting apparatus is provided.

In the substrate cutting apparatus, preferably, the substrate mounting means includes a stationary portion that is stationary with respect to the placed substrate, and a movable portion that moves so as to be in contact with and away from the facing surface of the substrate. Have
In the substrate cutting apparatus, preferably, the substrate mounting means has suction means for sucking the substrate through suction holes formed in the mounting surface of the stationary part.
In the substrate cutting apparatus, preferably, the substrate mounting unit includes a driving unit that drives the movable part,
The driving means arranges the movable part so that the placement surface of the movable part is flush with the placement surface of the stationary part before performing the pressure reduction, and places the movable part during the pressure reduction. The movable part is arranged so that the surface is separated from the facing surface of the substrate.
Preferably, in the substrate cutting apparatus, an exhaust hole communicating with the stress applying means is formed on the mounting surface of the movable part,
The stress applying unit discharges the gas in the sealed region through the exhaust hole when the mounting surface of the movable part is separated from the facing surface of the substrate.
Preferably, in the substrate cutting apparatus, the dividing line forming means overlaps the entire predetermined endless frame shape overlapping the periphery of the mounting surface of the movable part or the entire predetermined endless frame shape similar to the periphery. Forming the parting line,
The stress applying means cuts the substrate by applying stress along the dividing line of the substrate.
Preferably, in the substrate cutting apparatus, the placement surface of the substrate placing unit is in contact with the placed substrate, adsorbs the substrate and is separated from the placed substrate, And a recess defining the sealed region between the opposing surface of the substrate.
In the substrate cutting apparatus, preferably, the substrate mounting means has a suction means for sucking the substrate through a suction hole formed in the suction portion.
Preferably, in the substrate cutting apparatus, an exhaust hole communicating with the stress applying means is formed in the concave portion on the mounting surface.
The stress applying means discharges the gas in the sealed region through the exhaust hole.
Preferably in the substrate cutting apparatus, and preferably in the substrate cutting apparatus, the dividing line forming means is a predetermined endless frame shape that overlaps the planar peripheral edge of the concave portion on the placement surface or the planar peripheral edge. To form the dividing line so as to overlap the entire predetermined endless frame shape similar to
The stress applying means cuts the substrate by applying stress along the dividing line of the substrate.

According to another aspect of the invention,
A substrate mounting means having a mounting surface on which the substrate is mounted; and a main surface of the substrate mounted on the substrate mounting means, which is a main surface facing the mounting surface. And a sealed region defined by a parting line forming unit that forms a parting line with respect to an exposed surface that is a main surface opposite to the substrate, and the opposing surface of the substrate and the mounting surface described above of the substrate mounting unit A pressure applying means for applying a stress along the dividing line to the substrate by depressurizing the inside, and the substrate mounting means is immovable with respect to the mounted substrate; and A substrate cutting method using a substrate cutting apparatus having a movable part that moves so as to move toward and away from the opposite surface of the substrate,
The entire predetermined endless frame shape overlapping the periphery of the mounting surface of the movable part on the exposed surface of the substrate mounted on the mounting surface of the substrate mounting means, or a predetermined endless similar to the peripheral edge A dividing line forming step of forming the dividing line by the dividing line forming means so as to overlap the entire frame shape;
By reducing the pressure of the sealed region by the stress applying means while keeping the facing surface of the substrate on which the dividing line is formed in contact with the mounting surface of the substrate mounting means, the dividing line of the substrate is reduced. And a cutting step of cutting the substrate by applying a stress along the substrate.

According to another aspect of the invention,
A substrate mounting means having a mounting surface on which the substrate is mounted; and a main surface of the substrate mounted on the substrate mounting means, which is a main surface facing the mounting surface. And a sealed region defined by a parting line forming unit that forms a parting line with respect to an exposed surface that is a main surface opposite to the substrate, and the opposing surface of the substrate and the mounting surface described above of the substrate mounting unit A pressure applying means for applying a stress along the dividing line to the substrate, wherein the mounting surface of the substrate mounting means is in contact with the mounted substrate and A substrate cutting method using a substrate cutting device having a suction part to be sucked and a recess that is spaced apart from the placed substrate and defines the sealed region between the facing surface of the substrate,
The exposed surface of the substrate placed on the placement surface of the substrate placing means is similar to the entire predetermined endless frame shape overlapping the planar shape periphery of the recess of the placement surface or similar to the planar shape periphery. A dividing line forming step of forming the dividing line by the dividing line forming means so as to overlap the entire predetermined endless frame shape;
Along the dividing line of the substrate by reducing the pressure of the hermetic region by the stress applying means while the facing surface of the substrate on which the dividing line is formed is in contact with the mounting surface of the substrate mounting means. And a cutting step of cutting the substrate by applying stress to the substrate.

  According to the present invention, after the dividing line is formed on the substrate, the substrate can be cut without turning over, so that the working efficiency can be improved.

It is a top view which shows typically schematic structure of the board | substrate cutting device which concerns on 1st embodiment. It is the schematic cross section seen from the II-II cutting line in FIG. It is a block diagram which shows the main control structure of the board | substrate cutting device of FIG. It is a top view which shows the state in the parting line formation process in 1st embodiment. It is a schematic cross section which shows the state in the parting line formation process in 1st embodiment. It is a schematic cross section which shows the state in the cutting process in 1st embodiment. It is a schematic cross section which shows the state after the cutting process in 1st embodiment. It is a schematic cross section which shows schematic structure of the board | substrate cutting device which concerns on 2nd embodiment. It is a schematic cross section which shows the state in the parting line formation process in 2nd embodiment. It is a schematic cross section which shows the state in the cutting process in 2nd embodiment. It is a schematic cross section which shows the state after the cutting process in 2nd embodiment. It is a top view which shows the modification of the board | substrate cutting device in the said embodiment.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

[First embodiment]
FIG. 1 is a top view schematically showing a schematic configuration of the substrate cutting apparatus according to the first embodiment, and FIG. 2 is a schematic sectional view taken along the II-II cutting line in FIG. As shown in FIGS. 1 and 2, the substrate cutting apparatus 1 includes a substrate placing means 3, a dividing line forming means 4, a stress applying means 5 (see FIG. 3), and a control device 6 (see FIG. 3). And are provided.

  The substrate mounting means 3 is configured to place the substrate 7 on a mounting surface 31 that is the upper surface thereof. Here, of the pair of main surfaces of the substrate 7 mounted on the mounting surface 31, the main surface facing the mounting surface 31 is set as a counter surface 71, and the main surface opposite to the counter surface 71 is an exposed surface. 72. The substrate placing means 3 is provided with a stationary part 32 that is immovable with respect to the placed substrate 7 and a movable part 33 that moves so as to be in contact with and away from the facing surface 71 of the substrate 7. ing.

  The immovable portion 32 is a pedestal having an upper surface formed in a flat surface, and a rectangular opening 321 is formed at substantially the center thereof. The upper surface of the stationary part 32 is a mounting surface 322 that is a part of the mounting surface 31. A plurality of suction holes 323 are formed on the mounting surface 322 of the stationary part 32.

  The movable portion 33 is disposed in the opening 321 of the immovable portion 32. The movable part 33 is provided with a main body part 331 disposed below the placement surface 322 and an elevating part 332 that can be raised and lowered with respect to the main body part 331. A guide hole 333 into which the elevating part 332 is inserted is formed in the main body part 331. Further, a seal member 334 is disposed on the upper surface of the main body portion 331 so as to surround the guide hole 333. In the elevating part 332, a shaft part 335 disposed in the guide hole 333 of the main body part 331, and a placement surface 336 which is disposed above the shaft part 335 and whose upper surface is a part of the placement surface 31. A mounting unit 337 is provided. The mounting surface 336 of the mounting table 337 is formed in a flat surface, and an exhaust hole 338 communicating with the stress applying means 5 is formed at the center.

  The dividing line forming means 4 forms a dividing line with respect to the exposed surface 72 of the substrate 7 placed on the placement surface 31 of the substrate placing means 3. The dividing line forming unit 4 includes a cut part 41 that forms a dividing line, and a cut part drive mechanism 42 that drives the cut part 41. The cut portion 41 is a substrate cutting diamond tool or cemented carbide tool formed in a straight line, and the entire length thereof is formed to be larger than one side of the opening 321 of the stationary portion 32. The cut unit driving mechanism 42 includes a main body 44 having a surface facing the substrate mounting unit 3 disposed in parallel to the mounting surface 31, and is supported by the main body 44, and the mounting surface of the substrate mounting unit 3. 31 moves in parallel with respect to the substrate 31 and rotates itself with the normal line of the placement surface 31 of the substrate placement means 3 as the central axis, whereby the cut portion 41 is moved relative to the placement surface 31 of the substrate placement means 3. And a support portion 45 that translates and rotates. Further, the support portion 45 performs an expansion / contraction operation for moving the cut portion 41 so that the tip thereof approaches or separates from the placement surface 31 of the substrate placement means 3.

  The stress applying means 5 depressurizes the inside of the sealed region R (see FIG. 6) defined by the facing surface 71 of the substrate 7 and the placement surface 31 of the substrate placement means 3, and applies stress along the dividing line to the substrate. 7 is given. The stress applying means 5 is, for example, a vacuum pump and the like, and the inside of the sealed region R is decompressed by discharging the gas in the sealed region R through the exhaust hole 338.

  FIG. 3 is a block diagram showing a main control configuration of the substrate cutting apparatus 1. As shown in FIG. 3, the substrate cutting apparatus 1 is provided with a control device 6 that controls each part. The control device 6 of the substrate cutting apparatus 1 includes a suction means 34 such as a vacuum pump for sucking the substrate 7 to the placement surface 31 through the suction holes 323 and a driving means for driving the elevating part 332 of the movable part 33. 35, the stress application means 5, and the cut part drive mechanism 42 are electrically connected. The control device 6 includes a CPU, a ROM, and a RAM. The processing program recorded in the ROM is expanded on the RAM and executed by the CPU, thereby controlling each unit and performing a substrate cutting process. Yes.

Next, a substrate cutting method executed by the substrate cutting apparatus 1 will be described.
First, the control device 6 controls the driving unit 35 to adjust the vertical position of the elevating unit 332 so that the mounting surface 336 of the movable unit 33 and the mounting surface 322 of the non-moving unit 32 are flush with each other. After the adjustment, as shown in FIGS. 1 and 2, when the substrate 7 is placed on the placement surface 31 of the substrate placement means 3, the control device 6 drives the suction means 34. As a result, the substrate 7 is sucked to the placement surface 31 through the suction holes 323. The control device 6 executes the subsequent steps while maintaining the adsorption state.

  When the setting of the substrate 7 is completed, the control device 6 executes a parting line forming step. Specifically, the control device 6 controls the cut portion driving mechanism 42 to move the cut portion 41 along one side 321a of the opening 321 of the non-moving portion 32 as shown in FIG. In this way, the cut line 41 is lowered to form the dividing line 10 a along the one side 321 a on the exposed surface 72 of the substrate 7. Thereafter, the control device 6 controls the cut portion driving mechanism 42 to raise the cut portion 41 and then moves the cut portion 41 along one side 321b of the opening 321 of the non-moving portion 32 as shown in FIG. Then, the cut line 41 is lowered to form the dividing line 10b along the one side 321b on the exposed surface 72 of the substrate 7. By executing this also for the remaining sides 321 c and 321 d of the opening 321, the dividing lines 10 c and 10 d along the one side 321 c and 321 d are formed on the exposed surface 72 of the substrate 7. Thereby, each parting line 10a, 10b, 10c, 10d is formed on the exposed surface 72 of the board | substrate 7 so that it may overlap the whole of the predetermined endless frame shape which overlaps the periphery of the mounting surface 336 of the movable part 33. .

When the dividing line forming process is completed, the control device 6 executes the cutting process. Specifically, with the facing surface 71 of the substrate 7 kept in contact with the mounting surface 3 of the substrate mounting means 3, the control device 6 drives the stress applying means 5 to supply gas from the exhaust hole 338. By discharging, the inside of the sealed region R defined by the facing surface 71 of the substrate 7 and the mounting surface 31 of the substrate mounting means 3 is decompressed. During decompression, the control device 6 controls the driving means 35 to lower the elevating part 332 of the movable part 33 as shown in FIG. 6 so that the mounting surface 336 of the movable part 33 is moved toward the opposing surface 71 of the substrate 7. Separate from. Due to this lowering, the mounting table 337 of the elevating unit 332 touches and compresses the seal member 334, so that the airtightness of the sealed region R is ensured. When the sealed region R is depressurized, the cutting region 79 surrounded by the dividing lines 10a, 10b, 10c, and 10d in the substrate 7 is bent downward, and the dividing lines 10a, 10b, 10c, and 10d Along this, stress is applied to the substrate 7. As the depressurization proceeds, the cutting region 79 is cut along the dividing lines 10a, 10b, 10c, and 10d.
After the cutting, the control device 6 stops the stress applying unit 5 and the suction unit 34 and returns the inside of the sealed region R to atmospheric pressure so that the region other than the cutting region 79 in the substrate 7 can be removed. Then, after removing the area other than the cutting area 79 in the substrate 7, the control device 6 controls the driving means 35 to raise the elevating part 332 of the movable part 33 as shown in FIG. The mounting surface 336 and the mounting surface 322 of the stationary part 32 are flush with each other.

  As described above, according to the first embodiment, the inside of the sealed region R defined by the facing surface 71 of the substrate 7 and the mounting surface 31 of the substrate mounting means 3 is decompressed, and the dividing line 10a, Since stress along the lines 10b, 10c, and 10d is applied to the substrate 7, it is possible to cut the substrate 7 without turning the substrate 7 upside down after forming the dividing lines 10a, 10b, 10c, and 10d. . Therefore, the work efficiency after forming the dividing lines 10a, 10b, 10c, and 10d on the substrate 7 can be enhanced.

  Before the pressure reduction, the placement surface 336 of the movable portion 33 and the placement surface 322 of the non-moving portion 32 are flush with each other, and the placement surface 336 of the movable portion 33 is separated from the facing surface 71 of the substrate 7 only during pressure reduction. Therefore, when the dividing lines 10a, 10b, 10c, and 10d are formed on the substrate 7, the mounting surface 336 of the movable portion 33 and the mounting surface 322 of the non-moving portion 32 are flush with each other. For this reason, in the parting line forming step, the entire substrate 7 can be supported by the mounting surface 336 of the movable part 33 and the mounting surface 322 of the non-moving part 32, and the board 7 bends downward when the parting line is formed. This can be prevented.

[Second Embodiment]
In the first embodiment, the case in which the sealed region R is formed by moving the movable portion 33 is described as an example. However, in the second embodiment, the concave portion that forms the sealed region R is previously provided in the substrate installation means. The case where it is formed will be described as an example. In the following description, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 8 is a schematic cross-sectional view showing a schematic configuration of the substrate cutting apparatus 1A according to the second embodiment. As shown in FIG. 8, on the mounting surface 31a of the substrate mounting means 3a in the substrate cutting apparatus 1A, an adsorbing portion 37 that contacts the adsorbed substrate 7 and adsorbs the substrate 7, and an adsorbing portion 37 And a recess 38 surrounded by the outer periphery. A plurality of suction holes 323 communicating with the suction means 34 are formed on the mounting surface 371 that is the upper surface of the suction portion 37. Moreover, the recessed part 38 is formed in the top view rectangular shape, and is arrange | positioned in the approximate center in the mounting surface 31a of the board | substrate mounting means 3a. Moreover, the recessed part 38 is formed in the cross-sectional view reverse trapezoid shape (refer FIG. 4). An exhaust hole 338 communicating with the stress applying means 5 is formed at the center of the recess 38.

Next, a substrate cutting method executed by the substrate cutting apparatus 1A will be described.
As shown in FIG. 8, when the substrate 7 is placed on the placement surface 31a of the substrate placement means 3a, the control device 6 drives the suction means 34. As a result, the substrate 7 is adsorbed to the placement surface 31a through the adsorption holes 323. The control device 6 executes the subsequent steps while maintaining the adsorption state.

  When the setting of the substrate 7 is completed, the control device 6 executes a parting line forming step. Specifically, the control device 6 controls the cut portion drive mechanism 42 to move the cut portion 41 along one side 38a of the recess 38 as shown in FIG. 4, and to cut the cut portion as shown in FIG. By lowering 41, a dividing line 10 a along one side 38 a is formed on the exposed surface 72 of the substrate 7. Thereafter, the control device 6 controls the cut portion driving mechanism 42 to raise the cut portion 41, and then moves the cut portion 41 along one side 38b of the recess 38 as shown in FIG. By lowering the portion 41, the dividing line 10 b along the one side 38 b is formed on the exposed surface 72 of the substrate 7. By executing this also for the remaining sides 38c and 38d of the recess 38, the dividing lines 10c and 10d along the one side 38c and 38d are formed on the exposed surface 72 of the substrate 7. Thereby, each parting line 10a, 10b, 10c, 10d is formed on the exposed surface 72 of the substrate 7 so as to overlap the entire predetermined endless frame shape overlapping the planar peripheral edge of the recess 38.

When the dividing line forming process is completed, the control device 6 executes the cutting process. Specifically, the control device 6 drives the stress applying means 5 to discharge the gas from the exhaust hole 338 while keeping the opposing surface 71 of the substrate 7 in contact with the mounting surface 31 of the mounting means 3. As a result, the inside of the sealed region R1 defined by the facing surface 71 of the substrate 7 and the mounting surface 31a of the substrate mounting means 3 is decompressed. When the sealed region R1 is depressurized, the cutting region 79 surrounded by the dividing lines 10a, 10b, 10c, and 10d in the substrate 7 is bent downward, and along the dividing lines 10a, 10b, 10c, and 10d. Stress is applied to the substrate 7. As the depressurization proceeds, the cutting region 79 is cut along the dividing lines 10a, 10b, 10c, and 10d.
After the cutting, the control device 6 stops the stress applying means 5 and the suction means 34 so that an area other than the cutting area 79 in the substrate 7 can be removed. When the region other than the cutting region 79 in the substrate 7 is removed, the cutting region 79 is restored to the original shape as shown in FIG.

  As described above, according to the second embodiment, the sealed region R1 is formed by the recess 38 even without the movable portion 33, and the inside of the sealed region R1 is decompressed so that the dividing lines 10a, 10b, and 10c. , 10d is applied to the substrate 7, so that it is possible to cut the substrate 7 without turning the substrate 7 upside down after the dividing lines 10a, 10b, 10c, 10d are formed. Therefore, the work efficiency after forming the dividing lines 10a, 10b, 10c, and 10d on the substrate 7 can be enhanced.

Note that the present invention is not limited to the above embodiment, and can be modified as appropriate.
For example, in the above embodiment, the case where the substrate 7 is placed along the horizontal direction is described as an example. However, if the substrate 7 can be sucked, the placement direction of the substrate 7 is limited to this. is not. For example, when the placement surface of the substrate placement means is formed along the vertical direction, the substrate 7 can be placed on the placement surface along the vertical direction.

Moreover, in the said embodiment, the case where the planar shape of the movable part 33 and the recessed part 38 is a rectangular shape is shown, The dividing line 10a, 10b, so that it may overlap the whole of the predetermined endless frame shape which overlaps the periphery of these planar shapes. Although the case where 10c and 10d are formed has been described as an example, the planar shape of the movable portion 33 and the concave portion 38 may be any shape as long as the peripheral edge has an endless frame shape. For example, as shown in FIG. 12, the planar shape of the movable part 33b and the recessed part 38b is circular.
In addition, the predetermined endless frame shape formed by the dividing line may be any shape as long as it is an endless frame shape that fits inside the planar shape, even if it does not follow the peripheral edges of the planar shape of the movable portion 33 and the recess 38. . Note that it is desirable that the endless frame shape be similar to the planar peripheral edges of the movable portion 33 and the recessed portion 38 because the stress applied in the cutting process can be uniformly applied to the entire dividing line.

DESCRIPTION OF SYMBOLS 1 Substrate cutting device 3 Substrate mounting means 4 Dividing line forming means 5 Stress applying means 6 Control device 7 Substrate 10a, 10b, 10c, 10d Dividing line 31 Mounting surface 32 Non-moving part 33 Movable part 34 Adsorbing means 35 Driving means 41 Cut Section 42 Cut section drive mechanism 44 Body section 45 Support section 71 Opposing surface 72 Exposed surface 79 Cutting area 321 Opening 322 Mounting surface 323 Adsorption hole 331 Main body section 332 Lifting section 333 Guide hole 334 Seal member 335 Shaft section 336 Mounting surface 337 Mounting base 338 Exhaust hole R Sealed area

Claims (12)

Substrate mounting means having a mounting surface on which the substrate is mounted;
A dividing line with respect to an exposed surface which is a main surface of the substrate placed on the substrate placing means and which is a main surface opposite to the opposing surface which is the main surface facing the mounting surface. Breaking line forming means for forming
A stress applying means for applying a stress along the dividing line to the substrate by depressurizing a sealed region defined by the facing surface of the substrate and the mounting surface of the substrate mounting means; A substrate cutting apparatus. The substrate cutting apparatus according to claim 1,
The substrate mounting means includes a stationary part that is stationary with respect to the placed substrate, and a movable part that moves so as to be in contact with and away from the facing surface of the substrate. Cutting device. The substrate cutting apparatus according to claim 2, wherein
The substrate cutting device, wherein the substrate mounting means has suction means for sucking the substrate through suction holes formed on the mounting surface of the stationary part. The substrate cutting apparatus according to claim 2 or 3,
The substrate mounting means includes driving means for driving the movable part,
The driving means arranges the movable part so that the placement surface of the movable part is flush with the placement surface of the stationary part before performing the pressure reduction, and places the movable part during the pressure reduction. The substrate cutting apparatus, wherein the movable portion is arranged such that a surface is separated from the facing surface of the substrate. In the board | substrate cutting device as described in any one of Claims 2-4,
An exhaust hole communicating with the stress applying means is formed on the mounting surface of the movable part,
The stress applying means discharges the gas in the sealed region through the exhaust hole when the mounting surface of the movable part is away from the facing surface of the substrate. apparatus. In the board | substrate cutting device as described in any one of Claims 2-5,
The dividing line forming means forms the dividing line so as to overlap an entire predetermined endless frame shape overlapping the periphery of the mounting surface of the movable part or an entire predetermined endless frame shape similar to the periphery.
The substrate cutting apparatus, wherein the stress applying means cuts the substrate by applying a stress along the dividing line of the substrate. The substrate cutting apparatus according to claim 1,
The placement surface of the substrate placing means is in contact with the placed substrate, and adsorbs the substrate, and is separated from the placed substrate and between the facing surface of the substrate. And a recess for defining the sealed region. The substrate cutting apparatus according to claim 7, wherein
The substrate mounting means has a suction means for sucking the substrate through a suction hole formed in the suction portion. The substrate cutting apparatus according to claim 7 or 8,
An exhaust hole communicating with the stress applying means is formed in the recess in the placement surface,
The substrate cutting apparatus according to claim 1, wherein the stress applying means discharges the gas in the sealed region through the exhaust hole. In the board | substrate cutting device as described in any one of Claims 7-8,
Preferably, in the substrate cutting apparatus, the dividing line forming means is a predetermined endless frame shape that is similar to the entire predetermined endless frame shape overlapping the peripheral edge of the planar shape of the recess on the placement surface. The dividing line is formed so as to overlap the whole of
The substrate cutting apparatus, wherein the stress applying means cuts the substrate by applying a stress along the dividing line of the substrate. A substrate mounting means having a mounting surface on which the substrate is mounted; and a main surface of the substrate mounted on the substrate mounting means, which is a main surface facing the mounting surface. And a sealed region defined by a parting line forming unit that forms a parting line with respect to an exposed surface that is a main surface opposite to the substrate, and the opposing surface of the substrate and the mounting surface described above of the substrate mounting unit A pressure applying means for applying a stress along the dividing line to the substrate by depressurizing the inside, and the substrate mounting means is immovable with respect to the mounted substrate; and A substrate cutting method using a substrate cutting apparatus having a movable part that moves so as to move toward and away from the opposite surface of the substrate,
The entire predetermined endless frame shape overlapping the periphery of the mounting surface of the movable part on the exposed surface of the substrate mounted on the mounting surface of the substrate mounting means, or a predetermined endless similar to the peripheral edge A dividing line forming step of forming the dividing line by the dividing line forming means so as to overlap the entire frame shape;
By reducing the pressure of the sealed region by the stress applying means while keeping the facing surface of the substrate on which the dividing line is formed in contact with the mounting surface of the substrate mounting means, the dividing line of the substrate is reduced. And a cutting step of cutting the substrate by applying stress along the substrate. A substrate mounting means having a mounting surface on which the substrate is mounted; and a main surface of the substrate mounted on the substrate mounting means, which is a main surface facing the mounting surface. And a sealed region defined by a parting line forming unit that forms a parting line with respect to an exposed surface that is a main surface opposite to the substrate, and the opposing surface of the substrate and the mounting surface described above of the substrate mounting unit A pressure applying means for applying a stress along the dividing line to the substrate, wherein the mounting surface of the substrate mounting means is in contact with the mounted substrate and A substrate cutting method using a substrate cutting device having a suction part to be sucked and a recess that is spaced apart from the placed substrate and defines the sealed region between the facing surface of the substrate,
The exposed surface of the substrate placed on the placement surface of the substrate placing means is similar to the entire predetermined endless frame shape overlapping the planar shape periphery of the recess of the placement surface or similar to the planar shape periphery. A dividing line forming step of forming the dividing line by the dividing line forming means so as to overlap the entire predetermined endless frame shape;
Along the dividing line of the substrate by reducing the pressure of the hermetic region by the stress applying means while the facing surface of the substrate on which the dividing line is formed is in contact with the mounting surface of the substrate mounting means. And a cutting step of cutting the substrate by applying stress to the substrate.

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