JP2012044038A5 - Electronics - Google Patents
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- Publication number
- JP2012044038A5 JP2012044038A5 JP2010184944A JP2010184944A JP2012044038A5 JP 2012044038 A5 JP2012044038 A5 JP 2012044038A5 JP 2010184944 A JP2010184944 A JP 2010184944A JP 2010184944 A JP2010184944 A JP 2010184944A JP 2012044038 A5 JP2012044038 A5 JP 2012044038A5
- Authority
- JP
- Japan
- Prior art keywords
- housing
- electronic equipment
- casing
- electrical component
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
また、上記電子機器の放熱構造は、前記電気部品で発熱の大きい電気部品は、前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする。 Further, the heat dissipation structure of the electronic device is characterized in that the electric component that generates a large amount of heat is attached in contact with any surface of the first casing .
また、上記電子機器の放熱構造は、前記電気部品は面積の大きい面を前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする Further, in the heat dissipation structure of the electronic device, the electric component is attached with a surface having a large area in contact with any surface of the first casing.
また、上記電子機器の放熱構造は、前記電気部品は少なくとも電源および記録装置であり、前記電源および前記記録装置が前記第1の筺体の面に当接して取り付けられることを特徴とする。 Further, the heat dissipation structure of the electronic device, the electrical component is at least supply Contact and recording apparatus, wherein said power supply and said recording device is attached in contact with a surface of the first housing.
また、上記電子機器の放熱構造は、前記電気部品のうちで発熱の大きい電気部品が前記第1の筺体内の底部付近に配置されることを特徴とする。
Further, the heat dissipation structure of the electronic device is characterized in that an electrical component that generates a large amount of heat among the electrical components is disposed near the bottom of the first casing.
Claims (7)
前記第1の筺体との間に間隙をおいて前記第1の筺体を内包した第2の密閉筺体と、
前記第1の筺体に取り付けられ、前記第1の筐体と前記第2の密閉筐体との間に形成された間隙または前記第1の筺体内に空気を強制対流させる送風機と、を備え、
前記第1の筺体を構成する面の中で送風機が取り付けられた面に送風機用の孔を有し、少なくとも他の1つの面に通気孔を有し、前記強制対流させられた空気が前記通気孔を介して前記第1の筺体と前記第2の密閉筺体との間に形成された間隙と前記第1の筐体の内部との間を行き来することで循環させることを特徴とする電子機器。 A first housing that is configured with at least five surfaces, and that includes an electrical component that generates heat;
A second sealed housing enclosing the first housing with a gap between the first housing and the first housing;
Attached to said first housing, and a blower for forced convection of the air inside formed gap or the first housing to between the second sealing housing and the first housing ,
Has a hole in the blower on a surface blower is mounted within the surface constituting the first housing has a vent hole to at least one other surface, air that has been allowed the Mandatory pair shed It is circulated by going back and forth between a gap formed between the first casing and the second sealed casing and the inside of the first casing through the vent hole. electronic devices.
前記第1の筺体との間に間隙をおいて前記第1の筺体を内包した第2の密閉筺体と、を備え、
前記第1の筺体を構成する面の中で少なくとも2つの面に通気孔を有し、前記電気部品から発生した熱により自然対流した空気が前記通気孔を介して前記第1の筺体と前記第2の密閉筺体との間に形成された間隙と前記第1の筐体の内部との間を行き来することで循環させることを特徴とする電子機器。 A first housing that is configured with at least five surfaces, and that includes an electrical component that generates heat;
A second sealed housing enclosing the first housing with a gap between the first housing and the first housing,
Ventilation holes are provided on at least two surfaces of the surfaces constituting the first casing, and the air naturally convected by the heat generated from the electrical component is connected to the first casing and the first through the ventilation holes. electronic equipment characterized by circulating by moving between the interior of the the gap formed between the second sealing housing the first housing.
前記電気部品で発熱の大きい電気部品は、前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする電子機器。 An electronic equipment according to claim 1 or 2,
An electronic device, wherein the electric component generating a large amount of heat is attached in contact with any surface of the first casing .
前記電気部品は面積の大きい面を前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする電子機器。 The electronic device according to claim 3,
The electrical component is an electronic equipment, characterized by being mounted in contact with a large surface area on either side of the first housing.
前記発熱の大きい電気部品が取り付けられる面は、前記第1の筺体を構成する面の中で1番大きな面であることを特徴とする電子機器。 An electronic equipment according to claim 3 or 4,
The large surface electrical components are mounted in heat generation, the electronic equipment, which is a number one large surface in a plane that constitutes the first housing.
前記電気部品は少なくとも電源および記録装置であり、前記電源および前記記録装置は前記第1の筺体の面に当接して取り付けられることを特徴とする電子機器。 An electronic equipment according to claims 3 to 5,
The electrical component is at least supply Contact and recording apparatus, an electronic equipment in which the power and the recording device is characterized in that mounted in contact with a surface of the first housing.
前記電気部品のうちで発熱の大きい電気部品が前記第1の筺体内の底部付近に配置されることを特徴とする電子機器。 An electronic equipment according to any one of claims 1 to 6,
Electronic equipment, characterized in that a large electrical components of the heating among the electrical components are located near the bottom in the first housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010184944A JP2012044038A (en) | 2010-08-20 | 2010-08-20 | Heat dissipation structure of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010184944A JP2012044038A (en) | 2010-08-20 | 2010-08-20 | Heat dissipation structure of electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012044038A JP2012044038A (en) | 2012-03-01 |
JP2012044038A5 true JP2012044038A5 (en) | 2013-09-19 |
Family
ID=45899993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010184944A Pending JP2012044038A (en) | 2010-08-20 | 2010-08-20 | Heat dissipation structure of electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2012044038A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207820394U (en) * | 2017-09-29 | 2018-09-04 | 西门子(中国)有限公司 | Electronic equipment |
CN114460406B (en) * | 2022-02-15 | 2022-08-23 | 国网山东省电力公司宁津县供电公司 | Line loss measuring and calculating device of power distribution network |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984885U (en) * | 1982-11-30 | 1984-06-08 | 富士通株式会社 | Heat dissipation structure of sealed housing |
JPH11195878A (en) * | 1998-01-05 | 1999-07-21 | Mitsubishi Electric Corp | Case body containing electronic device |
JP2001156476A (en) * | 1999-11-30 | 2001-06-08 | Hitachi Cable Ltd | Switching hub |
JP2002185169A (en) * | 2000-12-18 | 2002-06-28 | Fujitsu Ltd | Outdoor communication device |
JP2004039692A (en) * | 2002-06-28 | 2004-02-05 | Fujitsu Ltd | Cabinet for outdoor installation |
JP2005236099A (en) * | 2004-02-20 | 2005-09-02 | Nec Corp | Heat insulating method of electronic device cabinet, and electronic device housing type heat exchange structure applying the method thereto |
-
2010
- 2010-08-20 JP JP2010184944A patent/JP2012044038A/en active Pending
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