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JP2012044038A5 - Electronics - Google Patents

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Publication number
JP2012044038A5
JP2012044038A5 JP2010184944A JP2010184944A JP2012044038A5 JP 2012044038 A5 JP2012044038 A5 JP 2012044038A5 JP 2010184944 A JP2010184944 A JP 2010184944A JP 2010184944 A JP2010184944 A JP 2010184944A JP 2012044038 A5 JP2012044038 A5 JP 2012044038A5
Authority
JP
Japan
Prior art keywords
housing
electronic equipment
casing
electrical component
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010184944A
Other languages
Japanese (ja)
Other versions
JP2012044038A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2010184944A priority Critical patent/JP2012044038A/en
Priority claimed from JP2010184944A external-priority patent/JP2012044038A/en
Publication of JP2012044038A publication Critical patent/JP2012044038A/en
Publication of JP2012044038A5 publication Critical patent/JP2012044038A5/en
Pending legal-status Critical Current

Links

Description

また、上記電子機器の放熱構造は、前記電気部品で発熱の大きい電気部品は、前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする。 Further, the heat dissipation structure of the electronic device is characterized in that the electric component that generates a large amount of heat is attached in contact with any surface of the first casing .

また、上記電子機器の放熱構造は、前記電気部品は面積の大きい面を前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする Further, in the heat dissipation structure of the electronic device, the electric component is attached with a surface having a large area in contact with any surface of the first casing.

また、上記電子機器の放熱構造は、前記電気部品は少なくとも源および記録装置であり、前記電源および前記記録装置が前記第1の筺体の面に当接して取り付けられることを特徴とする。 Further, the heat dissipation structure of the electronic device, the electrical component is at least supply Contact and recording apparatus, wherein said power supply and said recording device is attached in contact with a surface of the first housing.

また、上記電子機器の放熱構造は、前記電気部品のうちで発熱の大きい電気部品が前記第1の筺体内の底部付近に配置されることを特徴とする。
Further, the heat dissipation structure of the electronic device is characterized in that an electrical component that generates a large amount of heat among the electrical components is disposed near the bottom of the first casing.

Claims (7)

発熱する電気部品を内装し、少なくとも5つの面で構成される第1の筺体と、
前記第1の筺体との間に間隙をおいて前記第1の筺体を内包した第2の密閉筺体と、
前記第1の筺体に取り付けられ、前記第1の筐体と前記第2の密閉筐体との間に形成された間隙または前記第1の筺体内に空気を強制対流させる送風機と、を備え、
前記第1の筺体を構成する面の中で送風機が取り付けられた面に送風機用の孔を有し、少なくとも他の1つの面に通気孔を有し、前記強制対流させられた空気が前記通気孔を介して前記第1の筺体と前記第2の密閉筺体との間に形成された間隙と前記第1の筐体の内部との間を行き来することで循環させることを特徴とする電子機器。
A first housing that is configured with at least five surfaces, and that includes an electrical component that generates heat;
A second sealed housing enclosing the first housing with a gap between the first housing and the first housing;
Attached to said first housing, and a blower for forced convection of the air inside formed gap or the first housing to between the second sealing housing and the first housing ,
Has a hole in the blower on a surface blower is mounted within the surface constituting the first housing has a vent hole to at least one other surface, air that has been allowed the Mandatory pair shed It is circulated by going back and forth between a gap formed between the first casing and the second sealed casing and the inside of the first casing through the vent hole. electronic devices.
発熱する電気部品を内装し、少なくとも5つの面で構成される第1の筺体と、
前記第1の筺体との間に間隙をおいて前記第1の筺体を内包した第2の密閉筺体と、を備え、
前記第1の筺体を構成する面の中で少なくとも2つの面に通気孔を有し、前記電気部品から発生した熱により自然対流した空気が前記通気孔を介して前記第1の筺体と前記第2の密閉筺体との間に形成された間隙と前記第1の筐体の内部との間を行き来することで循環させることを特徴とする電子機器。
A first housing that is configured with at least five surfaces, and that includes an electrical component that generates heat;
A second sealed housing enclosing the first housing with a gap between the first housing and the first housing,
Ventilation holes are provided on at least two surfaces of the surfaces constituting the first casing, and the air naturally convected by the heat generated from the electrical component is connected to the first casing and the first through the ventilation holes. electronic equipment characterized by circulating by moving between the interior of the the gap formed between the second sealing housing the first housing.
請求項1乃至2に記載の電子機器であって、
前記電気部品で発熱の大きい電気部品は、前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする電子機器。
An electronic equipment according to claim 1 or 2,
An electronic device, wherein the electric component generating a large amount of heat is attached in contact with any surface of the first casing .
請求項3に記載の電子機器であって、
前記電気部品は面積の大きい面を前記第1の筺体のいずれかの面に当接して取り付けられることを特徴とする電子機器。
The electronic device according to claim 3,
The electrical component is an electronic equipment, characterized by being mounted in contact with a large surface area on either side of the first housing.
請求項3乃至4に記載の電子機器であって、
前記発熱の大きい電気部品が取り付けられる面は、前記第1の筺体を構成する面の中で1番大きな面であることを特徴とする電子機器。
An electronic equipment according to claim 3 or 4,
The large surface electrical components are mounted in heat generation, the electronic equipment, which is a number one large surface in a plane that constitutes the first housing.
請求項3乃至に記載の電子機器であって、
前記電気部品は少なくとも源および記録装置であり、前記電源および前記記録装置は前記第1の筺体の面に当接して取り付けられることを特徴とする電子機器。
An electronic equipment according to claims 3 to 5,
The electrical component is at least supply Contact and recording apparatus, an electronic equipment in which the power and the recording device is characterized in that mounted in contact with a surface of the first housing.
請求項1乃至6に記載の電子機器であって、
前記電気部品のうちで発熱の大きい電気部品が前記第1の筺体内の底部付近に配置されることを特徴とする電子機器。
An electronic equipment according to any one of claims 1 to 6,
Electronic equipment, characterized in that a large electrical components of the heating among the electrical components are located near the bottom in the first housing.
JP2010184944A 2010-08-20 2010-08-20 Heat dissipation structure of electronic device Pending JP2012044038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010184944A JP2012044038A (en) 2010-08-20 2010-08-20 Heat dissipation structure of electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010184944A JP2012044038A (en) 2010-08-20 2010-08-20 Heat dissipation structure of electronic device

Publications (2)

Publication Number Publication Date
JP2012044038A JP2012044038A (en) 2012-03-01
JP2012044038A5 true JP2012044038A5 (en) 2013-09-19

Family

ID=45899993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010184944A Pending JP2012044038A (en) 2010-08-20 2010-08-20 Heat dissipation structure of electronic device

Country Status (1)

Country Link
JP (1) JP2012044038A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207820394U (en) * 2017-09-29 2018-09-04 西门子(中国)有限公司 Electronic equipment
CN114460406B (en) * 2022-02-15 2022-08-23 国网山东省电力公司宁津县供电公司 Line loss measuring and calculating device of power distribution network

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984885U (en) * 1982-11-30 1984-06-08 富士通株式会社 Heat dissipation structure of sealed housing
JPH11195878A (en) * 1998-01-05 1999-07-21 Mitsubishi Electric Corp Case body containing electronic device
JP2001156476A (en) * 1999-11-30 2001-06-08 Hitachi Cable Ltd Switching hub
JP2002185169A (en) * 2000-12-18 2002-06-28 Fujitsu Ltd Outdoor communication device
JP2004039692A (en) * 2002-06-28 2004-02-05 Fujitsu Ltd Cabinet for outdoor installation
JP2005236099A (en) * 2004-02-20 2005-09-02 Nec Corp Heat insulating method of electronic device cabinet, and electronic device housing type heat exchange structure applying the method thereto

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