JP2012044029A - Thermoelectric conversion device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain high conversion efficiency even if a thermoelectric conversion element is multilayered in a sheet-like thermoelectric conversion device which generates electric power by converting temperature difference between the upper and lower surfaces of a sheet into in-plane temperature difference.SOLUTION: The thermoelectric conversion device has a second insulating sheet 2 laminated on a first insulating sheet 1 through a clearance 9, a first heat conduction member 3 composed of a high thermal conductivity material and penetrating the first insulating sheet 1 and projecting from the upper surface thereof, a second heat conduction member 4 composed of a high thermal conductivity material and penetrating the second insulating sheet 2 and projecting from the lower surface thereof, a thermoelectric conversion element 5 provided on the upper surface of the first insulating sheet 1 between the first and second heat conduction members 3 and 4, and an adhesive 6 filling the clearance 6.

Description

  The present invention relates to a thermoelectric conversion device and a manufacturing method thereof.

  Thermoelectric conversion devices that convert a temperature difference into electricity using a thermoelectric conversion element utilizing the Seebeck effect have been put into practical use. In particular, thin film thermoelectric conversion elements using thin film thermoelectric conversion materials are expected to have high conversion efficiency and easy manufacture, and are being developed.

  Such a thin film thermoelectric conversion element is formed as a thin film on the upper surface of the insulating sheet. The thermoelectric conversion device is formed so that the thin film thermoelectric conversion element is sandwiched between two insulating sheets from above and below and has a sheet-like outer shape as a whole. In such a sheet-shaped thermoelectric conversion device, the upper and lower surfaces of the sheet-shaped device are brought into contact with heat sources having different temperatures. Therefore, the temperature difference occurs in the thickness direction of the sheet-like device, and the temperature distribution in the surface of the insulating sheet is small. For this reason, only a small temperature difference is generated at both ends of the thermoelectric conversion element, and the thermoelectric conversion efficiency of the thin film thermoelectric conversion device is limited.

  A thermoelectric conversion device that improves the thermoelectric conversion efficiency by converting the temperature difference between the upper and lower surfaces (thickness direction) of the sheet-like thermoelectric conversion device using thin-film thermoelectric conversion elements into the temperature difference within the sheet surface is known. It has been.

  In this thermoelectric conversion device, the p-type and n-type thin film thermoelectric conversion elements are brought into contact with each other on the upper surface of the heat-insulating lower sheet to form a pn junction, and the heat-insulating upper side adhered thereon. Cover with sheet. A member made of a high thermal conductivity material embedded in the upper sheet above the p-type thin film thermoelectric conversion element is provided, and a high thermal conductivity material embedded in the lower sheet below the n-type thin film thermoelectric conversion element The member which consists of is provided.

  In this sheet-like thermoelectric conversion device, the heat flow flowing between the upper and lower surfaces of the sheet-like thermoelectric conversion device is mainly composed of two high thermal conductivity material members embedded in different regions in the surface of the heat insulating sheet, and the thin film thermoelectric conversion element. It flows through. Therefore, a temperature difference can be generated at both ends of the thin film thermoelectric conversion element. However, a sheet material layer having a low thermal conductivity is interposed between the member made of the high thermal conductivity material and the thin film thermoelectric conversion element, and a temperature difference is generated in the sheet material layer, so that the thin film thermoelectric conversion element The temperature difference between the both ends of the substrate becomes small, and improvement in thermoelectric conversion efficiency is limited.

  Furthermore, the thin film thermoelectric conversion element is sandwiched from above and below by a heat insulating sheet, immediately below the area close to one end of the thin film thermoelectric conversion element (part of the thin film thermoelectric conversion element, the area near one end of the thin film thermoelectric conversion element). The side sheet is provided with a member made of a high thermal conductivity material passing through the lower sheet and in contact with a region close to one end of the thin film thermoelectric conversion element, and a region close to the other end side of the thin film thermoelectric conversion element (part of the thin film thermoelectric conversion element) The upper sheet directly above the region near the other end of the thin film thermoelectric conversion element is provided with a member made of a high thermal conductivity material that penetrates the upper sheet and contacts the other end side region of the thin film thermoelectric conversion element. Thermoelectric conversion devices are known.

  In this improved thermoelectric conversion device, the member made of a high thermal conductivity material and the thin film thermoelectric conversion element are in contact with each other through a thin insulating film, and there is no sheet material layer having a low thermal conductivity. A temperature difference close to the temperature difference between the upper and lower surfaces of the thermoelectric conversion device can be generated at both ends of the conversion element. For this reason, high thermoelectric conversion efficiency is realized.

JP 2006-186255 A JP 2009-016812 A

  As described above, the p-type and n-type thin film thermoelectric conversion elements are abutted and formed, and the upper and lower sides thereof are sandwiched between heat-insulating sheets, and the high thermal conductivity material is placed on the upper sheet above the p-type thin film thermoelectric conversion elements. In a conventional thermoelectric conversion device in which a member made of a lower sheet high thermal conductivity material below an n-type thin film thermoelectric conversion element is embedded, a thin film thermoelectric conversion element and a member made of a high thermal conductivity material A sheet material having a low thermal conductivity is interposed between the two. For this reason, there is a problem that the temperature difference in the intervening low thermal conductivity sheet material is large and the temperature difference between both ends of the thin film thermoelectric conversion element is reduced, so that the thermoelectric conversion efficiency is low.

  In addition, the thin film thermoelectric conversion element is provided with a member made of a high thermal conductivity material that is sandwiched between upper and lower thermal insulating sheets and is in contact with the lower surface of a region near one end of the thin film thermoelectric conversion element and penetrates the lower sheet. There is an improved conventional thermoelectric conversion device provided with a member made of a high thermal conductivity material that is in contact with the upper surface of a region close to the other end side and penetrates the upper sheet. In this apparatus, the heat flow passes through a member made of a high thermal conductivity material penetrating the upper sheet and the lower sheet from the upper surface and the lower surface of the sheet, respectively, and the thin film thermoelectric conversion is opposed to the lower surface or the upper surface of this member via an insulating film. It flows to the element. That is, heat transfer to the thermoelectric conversion element is performed from the upper surface or the lower surface of the thermoelectric conversion element.

  However, since the thermal conductivity of the thermoelectric conversion element is significantly lower than that of a member made of a high thermal conductivity material, if the heat is transferred from the upper or lower surface of the thermoelectric conversion element, if the thermoelectric conversion element is thick, the vertical direction (thickness direction) ) Has a large temperature difference. For this reason, when a thick thermoelectric conversion element is used, there is a problem that the temperature difference between both ends of the thermoelectric conversion material located away from the member made of the high thermal conductivity material in the thickness direction becomes small, and the thermoelectric conversion efficiency decreases. .

  This problem becomes a major obstacle to improving the thermoelectric conversion efficiency when thin film thermoelectric conversion materials are formed in multiple layers in order to increase the thermoelectric conversion efficiency of the thermoelectric conversion device. In a thermoelectric conversion element using a multilayer thin film, in order to keep the effective thermal conductivity of a thin film thermoelectric conversion material formed in a multilayer, an interlayer insulating film provided between the multilayers is made of a low thermal conductivity material. When the thermal conductivity of the interlayer insulating film is lowered in this way, the heat conduction in the vertical direction of the thermoelectric conversion element is reduced, and a large temperature difference is generated in the vertical direction of the thermoelectric conversion element. For this reason, the effective temperature difference applied to the both ends of a thermoelectric conversion element becomes small, and thermoelectric conversion efficiency falls.

  The present invention relates to a thermoelectric conversion device that generates electricity by converting a temperature difference between the upper and lower surfaces of a sheet-shaped thermoelectric conversion device into a temperature difference within a sheet surface and generating a temperature difference at both ends of a thin film thermoelectric conversion element. An object of the present invention is to provide a thermoelectric conversion device that has a small distribution of temperature differences applied to both ends of a conversion element in the film pressure direction and high thermoelectric conversion efficiency.

According to one aspect of the present invention for solving the above problems,
A first insulating sheet, a second insulating sheet laminated on the first insulating sheet via a gap, and penetrates the first insulating sheet and protrudes from an upper surface of the first insulating sheet. A first heat conducting member made of a material having a higher thermal conductivity than the first and second insulating sheets, and the first insulating member penetrating through the second insulating sheet and projecting from the lower surface of the second insulating sheet. And a second heat conductive member made of a material having a higher thermal conductivity than the second insulating sheet, and the upper surface of the first sheet between the first heat conductive member and the second heat conductive member. Provided as a thermoelectric conversion device having a thermoelectric conversion element and an adhesive filling the gap.

  In the thermoelectric conversion device of the present invention, both ends of the thermoelectric conversion element are close to or in contact with the side surface of the heat conducting member made of a high thermal conductivity material. For this reason, the temperature at both ends of the thermoelectric conversion element is substantially determined by the surface temperature of the heat conducting member. The heat conducting member is made of a high heat conductivity material, and a uniform temperature distribution is maintained inside. Therefore, the temperature difference between both ends of the thermoelectric conversion element is almost the same in the vertical direction, and the decrease in thermoelectric conversion efficiency due to the distribution of the temperature difference in the vertical direction at both ends of the thermoelectric conversion element is avoided. A high thermoelectric conversion device is realized.

The thermoelectric conversion apparatus top view of 1st Embodiment of this invention 1 is a cross-sectional view of a thermoelectric conversion device according to a first embodiment of the present invention. The thermoelectric conversion apparatus perspective view of 1st Embodiment of this invention Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 1st Embodiment of this invention (the 1) Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 1st Embodiment of this invention (the 2) Thermoelectric conversion element sectional drawing concerning the modification of 1st Embodiment of this invention Thermoelectric conversion device sectional view concerning other modifications of a 1st embodiment of the present invention. The graph showing the temperature difference of the thermoelectric conversion element both ends of 1st Embodiment of this invention Cross section of thermoelectric conversion device of comparative example Thermoelectric conversion device sectional view of a second embodiment of the present invention Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 2nd Embodiment of this invention (the 1) Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 2nd Embodiment of this invention (the 2) The thermoelectric conversion apparatus top view of 3rd Embodiment of this invention Thermoelectric conversion device sectional view of a third embodiment of the present invention. Thermoelectric conversion element sectional view of a third embodiment of the present invention Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 3rd Embodiment of this invention. The thermoelectric conversion apparatus top view of 4th Embodiment of this invention Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 5th Embodiment of this invention. Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 6th Embodiment of this invention. The thermoelectric conversion apparatus top view of 7th Embodiment of this invention Thermoelectric conversion device sectional view of a seventh embodiment of the present invention Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 7th Embodiment of this invention (the 1) Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 7th Embodiment of this invention (the 2) Manufacturing process sectional drawing of the thermoelectric conversion apparatus of 7th Embodiment of this invention (the 3)

  1st Embodiment of this invention is related with the thermoelectric conversion apparatus 100 provided with the heat conductive member which has the column-shaped head part formed in the 1st insulating sheet upper surface.

  FIG. 1 is a plan view of a thermoelectric conversion device according to a first embodiment of the present invention, in which a thermoelectric conversion element 5, a wiring 11, and first and second heat conductions formed on an upper surface 1a of a first insulating sheet 1 are illustrated. The plane arrangement of the 1st and 2nd head parts 3a and 4a which make a part of member 3 and 4 is represented. FIG. 2 is a cross-sectional view of the thermoelectric conversion device according to the first embodiment of the present invention, and shows a cross section of the thermoelectric conversion device 100 along AA ′ in FIG. 1. FIG. 3 is a perspective view of the thermoelectric conversion device according to the first embodiment of the present invention. In FIG. 3, the second insulating sheet 2 is drawn transparent for easy understanding.

  With reference to FIGS. 1-3, the thermoelectric conversion apparatus 100 which concerns on 1st Embodiment of this invention is through the 1st insulating sheet 1 and the clearance gap 9 with which the adhesive agent 6 was filled on the upper surface 1a. It has the 2nd insulating sheet 2 laminated | stacked.

  As the first and second insulating sheets 1 and 2, it is preferable to use a sheet made of a material having excellent insulating properties and heat insulating properties, for example, a sheet of polyimide or polyester resin. Since the insulating sheets 1 and 2 made of these resins are excellent in flexibility, the flexible sheet-like thermoelectric conversion device 100 can be manufactured. Of course, if flexibility is not required, a material having high rigidity can be used.

  In the first embodiment, a polyimide or polyester resin sheet having a thickness of 50 μm is used as the first and second insulating sheets 1 and 2. The thickness of the insulating sheets 1 and 2 is the temperature between the upper and lower surfaces of the thermoelectric converter 100, that is, between the upper surface 2 a of the second insulating sheet 2 and the lower surface 1 b of the first insulating sheet 1 for power generation. When a difference is applied, a decrease in thermoelectric conversion efficiency due to the amount of heat leaking between the upper and lower surfaces due to heat conduction in the first and second insulating sheets 1 and 2 is reduced to an extent that is practically acceptable. Designed to thickness.

  On the upper surface 1a of the first insulating sheet 1, head portions 3a, 4a made of a high thermal conductivity material, for example, copper, are provided in a matrix (that is, in a lattice shape). The head portions 4a and 3a are formed in a columnar shape, for example, a quadrangular columnar shape having a square horizontal cross section with a height and width of 60 μm, and the upper surface and side surfaces of the head portions 4a and 3a are insulating films 7 having a high thermal conductivity, for example, It is covered with a silicon oxide film having a thickness of 1 μm. The insulating film 7 is preferably formed so as to also cover the upper surface 1a of the first insulating sheet 1. In this way, the upper surface 1a of the first insulating sheet 1 is formed of a silicon oxide film. By covering with, the characteristic deterioration of the thermoelectric conversion element 5 formed on it is suppressed. The insulating film 7 is for thermally connecting and electrically insulating the thermoelectric conversion element 5 and the head portions 4a and 3a, and the head portions 4a and 3a are formed of an insulating material. Sometimes it is not necessary. Moreover, when the characteristic deterioration resulting from the secular change of the thermoelectric conversion element 5 does not become a problem, the insulating film 7 with high heat conductivity is not formed in the insulating sheet 1 upper surface 1a. By doing so, the leakage heat flow that flows through the insulating film 7 can be reduced.

  The first and second head portions 3a and 4a are alternately arranged so as to occupy the face center positions of the two-dimensional lattice. That is, the first head portion 3a is arranged so as to form a two-dimensional face-centered lattice, and similarly, the second head portion 4a is also arranged so as to form another two-dimensional face-centered lattice. Then, the two two-dimensional face-centered lattices formed by the first and second head portions 3a and 4a are arranged so as to be shifted by 1/2 lattice in the vertical and horizontal directions, and as a result, the first head portion 3a. And the second head portion 4a are respectively arranged at the face center positions of the face center lattice. In other words, the second head portion 4a is disposed adjacent to the first head portion 3a in the vertical and horizontal directions, and the first head portion 3a is disposed adjacent to the vertical and horizontal directions of the second head portion 4a. When it repeats further, the 1st head part 3a and the 2nd head part 4a are alternately arrange | positioned along a row direction and a column direction. Note that the first and second head portions 3a and 4a are arranged at intervals of 60 μm in the column direction (vertical direction in the drawing in FIG. 1) (that is, arranged at a pitch of 120 μm), and in the row direction (FIG. 1). Are arranged at intervals of 160 μm (that is, arranged at a pitch of 220 μm).

  A through portion 3b penetrating the first insulating sheet 1 is provided on the lower surface of the first head portion 3a. The penetrating portion 3 b is a columnar shape, for example, a cylinder having a diameter of 50 μm, the upper surface is in close contact with the lower surface of the head portion 3 a, and the lower surface is exposed on the lower surface 1 b of the first insulating sheet 1.

  In addition, a penetrating portion 4b penetrating the second insulating sheet 2 is provided on the upper surface of the second head portion 4a. The penetrating portion 4b is columnar, for example, a cylinder having a diameter of 50 μm, the lower surface is in close contact with the upper surface of the head portion 3a, and the upper surface is exposed on the upper surface 2a of the first insulating sheet 1.

  The first head portion 3a and the penetrating portion 3b in contact with the first head portion 3a constitute the first heat conducting member 3, and the second head portion 4a and the penetrating portion 4b in contact with the first head portion 3a constitute the second heat conducting member 4. . The head portions 3a and 4a and the penetrating portions 3b and 4b constituting the first and second heat conducting members 3 and 4 have a higher thermal conductivity than the first and second insulating sheets 1 and 2. It is formed using a material such as a metal such as copper or aluminum, solder, a conductive paste having high thermal conductivity, or a ceramic material. Therefore, the 1st and 2nd heat conductive members 3 and 4 have higher heat conductivity than the 1st and 2nd insulating sheet 1 and 2 material which embeds the circumference. For this reason, heat transfer between the lower surface 1 b and the gap 9 and between the upper surface 2 a and the gap 9 is mainly performed through heat conduction in the first and second heat conducting members 3.

  The upper surface 1a of the first insulating sheet 1 is further formed with a thermoelectric conversion element 5 and a thermoelectric conversion element 5 made of a thin film pattern, and wiring 11 for outputting generated electric power to the outside.

  The thermoelectric conversion element 5 is formed of a thin film pattern of a thermoelectric conversion material, and is provided on the upper surface 1 a of the first insulating sheet 1 via the insulating film 7. The thermoelectric conversion element 5 is provided between the head portion 3 a of the first heat conducting member 3 and the head portion 4 a of the second heat conducting member 4, and has one end on the side surface of the head portion 3 a via the insulating film 7. Is formed so that the other end contacts the side surface of the head portion 4a.

  The thermoelectric conversion element 5 can be provided between the head portions 3a and 4a that are alternately arranged in the column direction (vertical direction in the drawing of FIG. 1) of the head portions 3a and 4a arranged in a matrix. At this time, it is preferable that the thermoelectric conversion elements 5 are formed of p-type and n-type thin film thermoelectric conversion materials, and the p-type and n-type thermoelectric conversion elements 5p, 5n are arranged alternately in the column direction. By arranging in this way, as will be described in detail below, all the thermoelectric conversion elements 5 can be easily connected in series simply by connecting the adjacent thermoelectric conversion elements 5 with the wiring 11.

  The p-type thermoelectric conversion elements 5p and the n-type thermoelectric conversion elements 5n arranged so as to be alternately arranged in the column direction are connected in series by wirings 11 (wirings 11a to 11c). The wiring 11a extends from above the insulating film 7 to the upper surface of the opposite end of the thermoelectric conversion elements 5p, 5n adjacent in the column direction, and electrically connects the adjacent thermoelectric conversion elements 5p, 5n in series. . Furthermore, the wiring 11b electrically connects between the thermoelectric conversion element 5 located at one end of the row and the thermoelectric conversion element 5 located on the one end side of the adjacent row. The wiring 11b connects the thermoelectric conversion elements 5 in one of the adjacent columns on one end side of the column so that the thermoelectric conversion elements 5 connected in series for each column are further connected in series to another column. The thermoelectric conversion elements 5 on the other side on both sides are connected on the other end side of the column. Therefore, the wiring 11 connects all the thermoelectric conversion elements 5 arranged in a matrix in series through a zigzag path.

  In the first embodiment, the thermoelectric conversion elements 5p and 5n having different conductivity types are alternately arranged between the head portions 3a and 4b. In this arrangement, for example, the p-type thermoelectric conversion element 5a is arranged from one side (above the paper surface in FIG. 1) to the head portion 3a of the first heat conducting member 3 from the other side (below the paper surface in FIG. 1) along the column direction. The n-type thermoelectric conversion element 5n abuts so as to sandwich the head portion 3a. Since the other ends of the thermoelectric conversion elements 5p and 5n are in contact with the head portion 4a of the second heat conducting member 4, based on the temperature difference applied between the first and second heat conducting members 3 and 4, the same The electromotive force in the same direction is generated in the thermoelectric conversion elements 5p and 5n in the row. Therefore, by connecting these thermoelectric conversion elements 5p and 5n in series, a voltage that is several times the number of thermoelectric conversion elements 5p and 5n is output. As described above, the outputs of the thermoelectric conversion elements 5p and 5n are connected in series by the wiring 11, and are output to the outside from the electrode pads 11c provided at both ends of the wiring 11.

The material of the thermoelectric conversion element 5 described above may be a thermoelectric conversion material that produces the Seebeck effect, and may be a bulk material in addition to a thin film material. However, the thin film material is easy to manufacture, and a material having excellent flexibility can be easily selected, so that it is particularly suitable for manufacturing a flexible thermoelectric conversion device at low cost. As such a thin film thermoelectric conversion material, for example, chromel (Ni ₉₀ Cr ₁₀ ) can be used as a p-type thermoelectric conversion material, and constantan (Ni ₄₈ Cu ₅₂ ) can be used as an n-type thermoelectric conversion material. A compound semiconductor such as Bi ₂ Te ₂ , CoSb, SiGe, or PbTe can also be used, and a single metal such as Bi, Pt, Au, Cu, or Ni may be used.

  The gap 9 between the first and second insulating sheets 1 and 2 is not particularly limited as long as there is an interval in which the head portions 3a and 3b and the thermoelectric conversion element 5 are sandwiched by the gap 9, and is set to 8 μm, for example. Further, the upper surfaces of the head portions 3 a and 3 b may be embedded in the lower surface 2 b of the upper second insulating sheet 2, or may be embedded, for example, about 1 μm, that is, about the thickness of the insulating film 7. The gap 9 is filled with an adhesive 6, and the first and second insulating sheets 1 and 2 are attached by the adhesive 6. The adhesive 6 desirably has low thermal conductivity from the viewpoint of suppressing heat leakage between the insulating sheets 1 and 2 and preferably has insulating properties to ensure electrical insulation of the element. From this viewpoint, it is preferable to use, for example, an adhesive 6 made of a thermosetting resin.

  Next, the manufacturing method of the thermoelectric conversion apparatus 100 of 1st Embodiment of this invention mentioned above is demonstrated.

  FIG. 4 is a manufacturing process sectional view (No. 1) of the thermoelectric conversion device of the first embodiment of the present invention, FIG. 5 is a manufacturing process sectional view (No. 2) of the thermoelectric conversion device of the first embodiment of the present invention, The cross section of the thermoelectric conversion apparatus 100 in the middle of manufacture is represented. 4 (a) to (c), (d) and FIGS. 5 (f) to (j) are cross-sectional views taken along line AA 'in FIG. 1, and FIGS. 4 (cB) and 4 (dB) to (d). e-B) represents the BB 'cross section in FIG.

  Referring to FIG. 4A, first, a first insulating sheet 1 made of a polyester resin having a thickness of 50 μm, in which a copper layer 1d having a thickness of 8 μm is laminated on the upper surface 1a, is prepared. Next, a cylindrical hole c having a diameter of, for example, 50 μm is opened to penetrate the first insulating sheet 1 from the lower surface of the first insulating sheet 1 and expose the lower surface of the copper layer 1d. 1 and 2, the hole 1c is a lattice of a face-centered lattice having a lattice spacing of 440 μm in the row direction and 240 μm in the column direction, that is, the position of the through portion 3b of the first heat conducting member 3. Formed at a point. The hole 1c is made by, for example, laser processing. Alternatively, it can be formed by etching.

  Next, with reference to FIG. 4B, a through portion 3b made of copper for embedding the hole 1c is formed by using an electroless copper plating method. At this time, the electroless plated copper is formed so as to cover the surface of the hole 1c, and then the high thermal conductivity material formed by another method on the remaining portion of the hole 1c, for example, a paste with high thermal conductivity, conductivity You may form by embedding a paste, electrolytic plating copper, or solder. Next, in order to prevent damage to the lower surface 1b in a subsequent process, a protective sheet 1e made of resin is attached to the lower surface 1b.

  Next, referring to FIG. 4C, the copper layer 1d is patterned using a photo-etching method, and the head portions 3a and 3b made of a square copper pattern having a side length of 60 μm, for example, are formed on the first insulating sheet upper surface 1a. Form. Among these, the 1st head part 3a is provided immediately above the hole 1c formed in the 1st insulating sheet 1 so that the hole 1c may be plugged up. The first head portion 3a constitutes the first heat conducting member 3 together with the through portion 3b formed in contact therewith. On the other hand, the second head portion 4a has the center of the four holes 1c located at the closest positions in the row and column directions of the face-centered lattice formed by the first head portion 3a (four Are formed so as to be located at the intersection of diagonal lines of the rhombus formed by the hole 1c.

  Next, a silicon oxide film having a thickness of 1 μm is sputtered on the entire upper surface 1 a of the first insulating sheet 1 to form an insulating film 7 made of a silicon oxide film. The insulating film 7 is formed so as to cover the upper surface and side surfaces of the head portions 3a and 3b and the upper surface 1a of the first insulating sheet 1 exposed on the outside of the head portions 3a and 3b.

  4 (c-B), when the insulating film 7 is formed, the upper surface 1a of the first insulating sheet 1 is covered with the insulating film 7, and the lower surface 1b is covered with the protective sheet 1e. The head portions 3a and 4a covered with the insulating film 7 protrude from the upper surface 1a of the head.

  Next, referring to FIG. 4D, the thermoelectric conversion material is formed as a flat pattern having a thickness of 1 μm, for example, by sputtering using a metal mask, for example, and the thermoelectric conversion element 5 is formed. The thermoelectric conversion elements 5 are formed such that the p-type thermoelectric conversion elements 5p and the n-type thermoelectric conversion elements 5n are alternately positioned in the column and row directions, respectively. Note that the p-type and n-type thermoelectric conversion elements 5p and 5n are formed by two times of sputtering performed separately.

  1 and 4 (d-B), these thermoelectric conversion elements 5 have, for example, a central portion formed in a strip shape having a width of 60 μm, and both end portions are widened to a width of 120 μm, and the head portions 3a, 4a. It is formed in a flat pattern that embraces

  The formation of the thermoelectric conversion element 5 is not limited to sputtering, and other methods can be used as long as the thermoelectric conversion characteristics required for the thermoelectric conversion element 5 can be maintained and patterning can be performed without degrading the characteristics. Also good. For example, instead of sputtering, a vapor deposition method, an ion plating method, a screen printing method, or a flash vapor deposition method can be used. Since these thin film forming methods can form a thermoelectric conversion material having excellent characteristics at a forming temperature of 200 ° C. or lower, deformation of the first insulating sheet 1 made of a resin sheet having a heat resistance of about 200 ° C. It can be avoided. Further, a CVD method, a laser ablation method, a sol-gel method, or a thermal spraying method may be used.

  Next, referring to FIG. 4E-B, wiring 11 made of a conductive thin film, for example, a 0.2 μm thick copper thin film pattern is formed by sputtering using a metal mask. Referring to FIG. 1 and FIG. 4 (e-B), the wiring 11a extends from the upper surface of the ends of the p-type and n-type thermoelectric conversion elements 5p, 5n adjacent in the column direction to the end faces of the thermoelectric conversion elements 5p, 5n. It covers and extends on the insulating film 7 exposed between the thermoelectric conversion elements 5p and 5n, and the thermoelectric conversion elements 5p and 5n are connected in series. Further, the columns are connected by the wiring 11b, and as a result, all the thermoelectric conversion elements 5 are connected in series by the wirings 11a and 11b. Note that electrode pads 11c for outputting electric power to the outside are provided at both ends of the wiring 11.

  Next, referring to FIG. 5 (f), a second insulating sheet made of a polyester resin having a thickness of 50 μm in which a thermosetting adhesive 6 is laminated on the lower surface 2 b on the upper surface 1 a of the first insulating sheet 1. Next, referring to FIG. 5G, the adhesive 6 was pressure-bonded for 2 hours at a pressure of 5 MP and a temperature of 150 ° C., and the adhesive 6 was thermoset and laminated. At this time, the upper surfaces of the head portions 3a and 4b were bitten into the lower surface 2b of the softened second insulating sheet 2, and the gap 9 between the first and second insulating sheets 3 and 4 was set to 8 μm.

  Next, referring to FIG. 5 (h), a hole 2c having a diameter of 50 μm, for example, that penetrates the second insulating sheet 2 is opened immediately above the second head portion 4a. The hole 2c is formed by the same method as the hole 1c, for example, laser processing, and penetrates the second insulating sheet 2 and the insulating film 7 to expose the head portion 4a on the lower surface thereof.

  Next, referring to FIG. 5I, the hole 2c is filled with a material having a high thermal conductivity, for example, electroless copper plating, similarly to the hole 1c, to form the through-hole 4b. This penetration part 4b can be formed by the same method as the penetration part 3b. As a result, the second heat conducting member 4 in which the second head portion 4a was in close contact with the lower surface of the through portion 4b was formed.

  Next, referring to FIG. 5 (j), the protective sheet 1 e adhered to the lower surface 1 b of the first insulating sheet 1 is removed, and the thermoelectric conversion device 100 according to the first embodiment of the present invention is manufactured. .

  In the thermoelectric conversion device 100 according to the first embodiment of the present invention described above, each thermoelectric conversion element 5 is composed of a single thin film made of a thermoelectric conversion material. However, each thermoelectric conversion element 5 can be multi-layered.

  FIG. 6 is a cross-sectional view of a thermoelectric conversion element according to a modification of the first embodiment of the present invention, and shows a layer structure of a thermoelectric conversion element 5 composed of a multilayer thermoelectric conversion material thin film. FIGS. 6A and 6B show a first modification and a second modification of the first embodiment, respectively.

  Referring to FIG. 6A, in the first modification of the first embodiment, a plurality of thermoelectric conversion elements 5 are used instead of the thermoelectric conversion elements 5 of the first embodiment made of a single-layer thermoelectric conversion material thin film. For example, the thermoelectric conversion material thin film 5a has four layers. The thermoelectric conversion material thin films 5a are insulated by an insulating material having a low thermal conductivity, for example, an interlayer insulating film 8 made of resin.

  The thermoelectric conversion material thin film 5a and the interlayer insulating film 8 can be formed by alternately laminating the thermoelectric conversion material thin films 5a and the interlayer insulating film 8 by sputtering or vapor deposition using a metal mask. After the lamination, the interlayer insulating film 8 deposited on the end face of the multilayer structure composed of the thermoelectric conversion material thin film 5a and the interlayer insulating film 8 is removed to expose the end face of the thermoelectric conversion material thin film 5a on the end face of the multilayer structure. The removal of the interlayer insulating film 8 deposited on the end face can be performed by, for example, resin ashing or etching. Further, a resist can be used as the interlayer insulating film 8 and can be removed by development.

  A multilayer structure in which the thermoelectric conversion material thin film 5a and the interlayer insulating film 8 are formed on the entire upper surface 1a of the first insulating sheet 1 and then patterned by photoetching to expose the thermoelectric conversion material thin film 5a on the end face. The thermoelectric conversion element 5 may be formed.

  After the thermoelectric conversion element 5 having a multilayer structure is formed, the wiring 11 is formed as in the first embodiment. The wiring 11 covers the end face of the multilayer structure from the upper surface of the thermoelectric conversion element 5 and extends onto the insulating film 7. Therefore, the wiring 11 is in contact with the upper surface of the thermoelectric conversion element 5 and the end surface of the thermoelectric conversion material thin film 5 a exposed on the end surface of the multilayer structure, and is electrically connected to the thermoelectric conversion element 5. If necessary, an insulating film 7 made of a silicon oxide film is further formed on the entire upper surface 1a of the first insulating sheet 1 in order to prevent the thermoelectric conversion element 5 from deteriorating. Then, the thermoelectric conversion element 5 concerning the 1st modification of 1st Embodiment of this invention is manufactured through the process similar to the process shown in FIG. 5 of 1st Embodiment.

  The thermoelectric conversion element 5 according to the second modification of the first embodiment of the present invention has a wiring 11 in contact with the upper surface of the thermoelectric conversion material thin film 5a to ensure a wide contact area.

  With reference to FIG.6 (b), in the thermoelectric conversion element 5 concerning the 2nd modification of 1st Embodiment, the interlayer insulation film 8 is formed in the wiring contact region 11D in which the wiring 11 is formed on the thermoelectric conversion material thin film 5a. Does not form. Therefore, in the wiring contact region 11D, all the thermoelectric conversion material thin films 5a are laminated in direct contact. For this reason, each thermoelectric conversion material thin film 5a is electrically connected to the upper and lower thin films in the wiring contact region 11D, and is further connected to the wiring 11 formed on the wiring contact region 11D. Thus, since the connection between the thermoelectric conversion material thin films 5a and between the thermoelectric conversion material thin film 5a and the wiring 11 is made in the wiring contact region 11D wider than the end face of the thermoelectric conversion material thin film 5a, it is lower than in the first modification. Can be connected with contact resistance.

  In the second modification shown in FIG. 6B, the lowermost thermoelectric conversion material thin film 5a is formed by sputtering using a metal mask, and then the lowermost interlayer insulating film 7 made of resist is formed thereon. Then, the resist in the wiring contact region 11D is removed by exposure and development. Next, after forming the thermoelectric conversion material thin film 5a of the second layer from the bottom by the same method as that for the lowermost layer, a resist of the second layer from the bottom is formed, exposed and developed to remove the resist in the wiring contact region 11D. . This process was repeated to form a four-layer thermoelectric conversion material thin film 5a and an interlayer insulating film 8 made of a three-layer resist interposed therebetween. Thereafter, the wiring 11 is formed in the same manner as in the first modification, and the thermoelectric conversion device using the thermoelectric conversion element 5 according to the second modification of the first embodiment is manufactured.

  In the first and second modifications described above, the thermoelectric conversion element 5 in which the entire thermoelectric conversion material thin film is p-type is formed at the position where the p thermoelectric conversion element 5p is formed in the first embodiment. In the first embodiment, the thermoelectric conversion element 5 in which the entire layer of the thermoelectric conversion material thin film is n-type is formed at the position where the n-type thermoelectric conversion element 5n is formed.

  FIG. 7 is a cross-sectional view of a thermoelectric conversion device according to another modification of the first embodiment of the present invention, and relates to a thermoelectric conversion device 101 in which thermal diffusion plates 12 made of a high thermal conductivity material are provided on the upper and lower surfaces of the thermoelectric conversion device. .

  Referring to FIG. 7, a thermoelectric conversion device 101 according to another modification of the first embodiment of the present invention covers the entire upper surface 2a and lower surface 1b of the thermoelectric conversion device 100 of the first embodiment. A thermal diffusion plate 12 made of a material such as copper or metal such as Al is provided.

  As will be described later, the heat transfer between the upper surface 2 a and the lower surface 1 b of the thermoelectric conversion device 100 is mainly performed through the heat conducting members 3 and 4. Therefore, the upper and lower surfaces 2a and 1b on which the heat conducting members 3 and 4 are exposed may cause a temperature distribution around the heat conducting members 3 and 4. When such a temperature distribution becomes large, a temperature difference is generated between the exposed surfaces of the heat conducting members 3 and 4 and the heat source, and the thermoelectric conversion efficiency of the thermoelectric conversion device 100 is lowered. In another modification of the first embodiment, the temperature distribution generated in the upper and lower surfaces 2a and 1b is relaxed by the heat diffusion plate 12 provided on the upper and lower surfaces 2a and 1b. A decrease in thermoelectric conversion efficiency due to the occurrence of the in-plane temperature distribution is suppressed.

  The above-described thermoelectric conversion devices 100 and 101 have their upper and lower surfaces 2 a and 1 b in contact with heat sources having different temperatures, and convert the temperature difference applied to the upper and lower surfaces 2 a and 1 b into a temperature difference between both ends of the thermoelectric conversion element 5. To generate electricity. Hereinafter, the conversion efficiency will be described.

  Referring to FIG. 2, for example, a heat source at a high temperature, for example, 36 ° C. is brought into contact with the lower surface 1b of the first insulating sheet 1, and a heat source at a low temperature, for example, 6 ° C. is brought into contact with the upper surface 2a of the second insulating sheet 2. The case will be described.

  In the thermoelectric conversion device of the present invention, the first and second insulating sheets 1 and 2 are polyester resins having excellent heat insulation properties, and the leakage heat flow flowing in the thickness direction through the upper and lower surfaces 2a and 1b is sufficiently suppressed. Is done. On the other hand, the heat conducting members 1 and 2 are made of a material having high heat conductivity, for example, copper. The thermoelectric conversion element 5 is usually formed of a material having a higher thermal conductivity than the insulating sheets 1 and 2, for example, a metal such as chromel or constantan or a compound semiconductor material. Furthermore, since the thermoelectric conversion element 5 conducts heat also by electrical conduction, it functions as a heat transfer material. Therefore, the heat flow flowing from the lower surface 1b to the upper surface 2a mainly includes the heat conducting member 1 provided through the first insulating sheet 1, the heat conducting element 5 disposed between the heat conducting members 1 and 2, and It flows through the path of the heat conducting member 2 provided through the second insulating sheet 2.

  In 1st Embodiment of this invention, a thermoelectric conversion element is provided on the 1st insulating sheet 1 upper surface 1a. The first and second heat conducting members 3 and 4 are provided so that the thermoelectric conversion element 5 is sandwiched from both ends by head portions 3a and 4a provided to protrude from the first and second insulating sheets, respectively. It is done. That is, both ends of the thermoelectric conversion element are disposed in contact with or in proximity to the side surfaces of the protruding portions (head portions 3a, 4a) of the first and second heat conducting members.

  In this configuration, the heat conduction between the first and second heat conducting members 3 and 4 and the thermoelectric conversion element 5 is performed between the side surfaces of the first and second heat conducting members 3 and 4 and both ends of the thermoelectric conversion element 5. Made through the face. On the other hand, the first and second heat conducting members 3 and 4 have a large thermal conductivity, and the cross-sectional area perpendicular to the heat flow is remarkably larger than the cross section of the thermoelectric conversion element 5. The temperature difference (temperature distribution) inside the heat conducting members 3 and 4 is very small compared to the temperature difference generated in the thermoelectric conversion element 5. Therefore, the temperature of both end faces of the thermoelectric conversion element 5 is maintained at a temperature substantially equal to that of the first and second heat conducting members 3 and 4, and only a very small temperature distribution is generated in the thickness direction. Thus, since the end surface of the thermoelectric conversion element 5 is in contact with or close to the side surface of the head portions 3a and 4a having a small temperature distribution, the thermoelectric conversion element 5 is thick and the vertical direction (thickness) of the thermoelectric conversion element 5 is increased. Even when the thermal conductivity in the direction is small, the temperature of the end face is maintained at a temperature substantially equal to that of the heat conducting members 3 and 4. As a result, the temperature difference between both ends of the thermoelectric conversion element 5 does not change much in the vertical direction and is kept substantially constant. For this reason, a decrease in thermoelectric conversion efficiency caused by the distribution in the thickness direction of the temperature difference between both ends of the thermoelectric conversion element 5 is avoided, and the thermoelectric conversion device 100 having high thermoelectric conversion efficiency is realized. Such a temperature difference in the thickness direction becomes large particularly when the thermoelectric conversion elements or the thermoelectric conversion material thin films 5a are laminated in multiple layers via the interlayer insulating film 8 having a low thermal conductivity. However, in the first embodiment, as in the case of the thick thermoelectric conversion element 5 described above, the temperature difference between both ends of the thermoelectric conversion elements 5 constituting each layer does not change much even in the case of multiple layers. Is realized.

  FIG. 8 is a graph showing the temperature difference between both ends of the thermoelectric conversion element of the first embodiment of the present invention, and the temperature difference applied to both ends of the thermoelectric conversion element 5 of the thermoelectric conversion device 100 of the first embodiment is calculated by simulation. Represents the value. In addition, the bar graph A in FIG. 8 is a simulation result of the thermoelectric conversion apparatus 100 of 1st Embodiment, and the bar graphs A and B in FIG. 8 are the comparative examples of the simulation result of the normal thermoelectric conversion apparatus used conventionally. Are displayed together. FIG. 9 is a cross-sectional view of a thermoelectric conversion device of a comparative example, and FIGS. 9A and 9B are diagrams of normal thermoelectric conversion devices 61, which are simulation targets shown as comparative examples A and B in FIG. 62 structure is represented.

  Referring to FIG. 9A, a normal thermoelectric conversion device 61 sandwiches a thermoelectric conversion element 64 made of a thermoelectric conversion material thin film from above and below with a heat insulating sheet 63 made of a low thermal conductivity material. And the high thermoelectric material 65 which contacts the upper surface of one end vicinity of the thermoelectric conversion element 64 via an insulating film, penetrates the heat insulating sheet 63, and is exposed on the upper surface of the heat insulating sheet 63 is provided. On the other hand, a high thermoelectric material 65 that is in contact with the lower surface in the vicinity of the other end of the thermoelectric conversion element 64 through an insulating film and penetrates the heat insulating sheet 63 and is exposed on the lower surface is provided.

  Referring to FIG. 9B, another ordinary thermoelectric conversion device 62 has a low thermal conductivity from the top and bottom of the thermoelectric conversion element 64 that forms a pn junction by abutting the p-type and n-type thermoelectric conversion material thin films 64p and 64n. It is sandwiched between heat insulating sheets 63 made of a rate material. Then, the high thermoelectric material 65 is embedded on the upper surface and the lower surface of the heat insulating sheet 63 above the p-type thermoelectric conversion material thin film 64p and below the n-type thermoelectric conversion material thin film 65n, respectively. In this normal thermoelectric conversion device 61, a heat insulating sheet 63 made of polyester having a thickness of 15 μm is interposed between the high thermoelectric material 65 and the thermoelectric conversion element 64.

  In the simulation of the normal thermoelectric converters 61 and 62 whose results are shown in FIG. 8, the heat insulating sheet 63 is made of a polyester resin having a thickness of 50 μm, and the high thermoelectric material 65 is made of copper having a square plane pattern with a side length of 50 μm. It was a pillar body. Further, in the normal thermoelectric conversion device 61, the insulating film interposed between the high thermoelectric material 65 and the thermoelectric conversion element 64 is a silicon oxide film having a thickness of 1 μm. The thickness of the heat insulating sheet 63 interposed between the material 65 and the thermoelectric conversion element 64 was 12 μm. The shape of the thermoelectric conversion element 64 is the same as that of the first embodiment of the present invention. The material of the thermoelectric conversion element 64 is chromel, and when the thermoelectric conversion element 64 has a plurality of layers, the interlayer insulating film 8 is a resist having a thickness of 4 μm.

  With reference to the bar graph A in FIG. 8, in the thermoelectric conversion device 100 according to the first embodiment of the present invention, the temperature difference applied to both ends of the thermoelectric conversion element 5 is as follows when the thermoelectric conversion element 64 is one layer. It is approximately 24 ° C., and decreases almost linearly as the number of layers of the thermoelectric conversion element 64 increases to 2 layers and 3 layers.

  In the simulation, a heat source of 36 ° C. is brought into contact with the lower surface of the thermoelectric conversion device 101 (that is, the lower surface 1a of the first insulating sheet 1), and the upper surface of the thermoelectric conversion device 101 (that is, the upper surface of the second insulating sheet 1). The temperature difference between both ends of the thermoelectric conversion element 64 was calculated when a 6 ° C. heat source was brought into contact with 2a). Here, the temperature difference in FIG. 8 is a value obtained by averaging the temperature differences at both ends of the thermoelectric conversion elements 64 of a plurality of layers.

  When this is compared with the normal thermoelectric converter 61, with reference to the bar graph B in FIG. 8, in the normal thermoelectric converter 61, the temperature difference at the time of one layer is different from that of the thermoelectric converter 100 of the first embodiment. Although it is substantially the same, the decrease of the temperature difference per layer is larger in the two layers and the three layers than in the thermoelectric conversion device 100 of the first embodiment. Thermoelectric conversion efficiency greatly depends on this temperature difference. Therefore, the thermoelectric conversion device 100 according to the first embodiment has a higher thermoelectric conversion efficiency than the conventional thermoelectric conversion device 61 conventionally used when the thermoelectric conversion elements 5 are multilayered.

  Thus, in the normal thermoelectric conversion device 61, the reason why the decrease in the temperature difference due to the multi-layered thermoelectric conversion element 5 is large is estimated as follows.

  In the thermoelectric conversion device 100 of the present invention, all the layers of the multi-layer thermoelectric conversion element 5 are connected to the side surfaces of the heat conducting members 3 and 4 (more precisely, the head portions 3a and 4a) with the insulating film 7 therebetween. It touches. Since the heat conductivities of the heat conducting members 3 and 4 and the insulating film 7 are high, the temperature distribution inside and on the surfaces thereof is small. Accordingly, since a temperature difference substantially equal to the temperature difference between the heat conducting members 3 and 4 is applied to all the thermoelectric conversion elements 5, the temperature difference does not decrease so much even if the number of layers increases.

  In contrast, in a normal thermoelectric conversion device 61, both ends of one layer are in contact with the high thermal conductivity material 65 via an insulating film, and the temperature difference between the two ends is largely different from the temperature difference between the high thermal conductivity materials 65. Absent. However, since an interlayer insulating film having a low thermal conductivity is interposed between the upper and lower thermoelectric conversion elements 64 in a multilayer structure, a large temperature distribution (temperature gradient) is generated in the thickness direction in the interlayer insulating film having a low thermal conductivity. . For this reason, the temperature difference between both ends of the thermoelectric conversion element 64 is reduced according to the temperature gradient in the interlayer insulating film, in other words, according to the number of layers of the interlayer insulating film.

  Furthermore, in the normal thermoelectric conversion device 62, even in the case of a single layer, the heat insulating sheet 63 having a low thermal conductivity is interposed between the high thermal conductivity material 65 and the thermoelectric conversion elements 64p and 64n. Therefore, the temperature difference applied to both ends of the thermoelectric conversion elements 64p and 64n becomes small even in the case of a single layer due to the large temperature gradient in the interposed heat insulating sheet 63. The inventor of the present invention presumes in this way.

  2nd Embodiment of this invention is related with the thermoelectric conversion apparatus 102 manufactured using the 2nd insulating sheet 2 in which a part of 2nd heat conductive member 4 was embedded.

  FIG. 10 is a cross-sectional view of the thermoelectric conversion device according to the second embodiment of the present invention, and corresponds to the AA ′ cross-section of FIG. 1. In addition, the planar structure of the thermoelectric conversion apparatus 102 of the second embodiment is the same as that in FIG. 1 and will be described with reference to FIG.

  Referring to FIG. 10, in the thermoelectric conversion device 102 according to the second embodiment, the second head in which the penetrating portion 4 b penetrating the second insulating sheet 2 is formed on the upper surface 1 a of the first insulating sheet 1. It is provided so as to contact the upper surface of the portion 4a. That is, the second head portion 4a and the penetrating portion 4b constituting the second heat conducting member 4 are separately manufactured and then assembled so as to contact each other. The thermoelectric conversion device 102 is the first in that the penetrating part 4b and the head part 4a are separated from each other, and that electrical insulation is provided by the side wall 7a instead of the insulating film 7 of the first embodiment. Different from the embodiment. Other structures are the same as those of the thermoelectric conversion device 100 of the first embodiment. Hereinafter, the thermoelectric conversion device 102 of the second embodiment will be described with reference to the manufacturing process.

  FIGS. 11 and 12 are a manufacturing process sectional view (part 1) of the thermoelectric conversion device of the second embodiment of the present invention and a manufacturing process sectional view of the thermoelectric conversion device of the second embodiment of the present invention (part 2), respectively. The cross section of the thermoelectric conversion apparatus 102 in the middle of manufacture is represented.

  Referring to FIG. 11A, first, an insulating sheet 2 made of, for example, polyimide or polyester resin is prepared, and a hole 2c penetrating the insulating sheet 2 is opened using, for example, laser processing. The arrangement and diameter of the holes 2c are the same as the formation position and diameter of the through portion 4b shown in FIG.

  Next, the insulating sheet 2 is placed on a support sheet 16 having a metal film 15 laminated on the upper surface, and is pressed and adhered. At this time, the metal film 15 is exposed on the bottom surface of the hole 2c.

  Next, referring to FIG. 11B, a high heat conductivity material, for example, copper is deposited on the metal film 15 exposed on the bottom surface of the hole 2c by using, for example, an electroless plating method, and the high heat filling the hole 2c. The through portion 4b made of a conductive material is formed. Next, the support sheet 16 is peeled off, and the metal film 15 is removed by etching.

  Next, referring to FIG. 11C, a protective sheet 2e for protecting the upper surface of the insulating sheet 2 is laminated and laminated on the upper surface of the insulating sheet 2 in a later step. Next, referring to FIG. 11D, an insulating adhesive layer made of a thermosetting resin is laminated on the lower surface of the insulating sheet 2 by, for example, laminating.

  On the other hand, through the same steps as in the first embodiment shown in FIGS. 4A to 4B, the head portions 4a and 3a are formed on the upper surface 1a of the first insulating sheet 1 in the same manner as in the first embodiment. A through portion 3b is formed immediately below the head portion 4a, and an insulating film 7 made of a silicon oxide film covering the entire upper surface 1a of the first insulating sheet 1 is formed (see FIG. 4C).

  Next, referring to FIG. 12E, the insulating film 7 is etched back to expose the upper surfaces of the head portions 4a and 3a, and at the same time, side walls 7a made of a silicon oxide film are formed on the side surfaces of the head portions 4a and 3a. Form.

  Next, through steps similar to those of the first embodiment shown in FIGS. 4D to 4E-B, referring to FIG. 12F, the thermoelectric conversion elements 5p and 5n and the wirings 11a to 11c ( 1 and 4 (e-B)).

  Next, referring to FIG. 12 (g), the insulating sheet 2 shown in FIG. 11 (d) that has been manufactured in advance is aligned on the insulating sheet 1 so that the penetrating portion 4 is positioned on the head portion 4a. After that, pressure bonding is performed through the adhesive 6. This pressure bonding was carried out, for example, by leaving it under a temperature of 150 ° C. and 5 MP for 2 hours, and at the same time, the adhesive 6 was subjected to a thermal effect.

  Through the above steps, the thermoelectric conversion device 102 of the second embodiment is manufactured. In the second embodiment, the first insulating sheet 1 on which the thermoelectric conversion element, the head portion 4a, the first heat conducting member 3, the wiring and the like are formed, and the second insulating sheet 2 on which the through portion 4b is formed. Can be manufactured separately, so that the manufacturing process is simplified.

  3rd Embodiment of this invention is related with the thermoelectric conversion apparatus which connected the thermoelectric conversion element laminated | stacked on two layers in series.

  FIG. 13 is a plan view of the thermoelectric conversion device according to the third embodiment of the present invention. FIG. 13A shows the arrangement of the lower layer thermoelectric conversion elements 5p and 5n and the lower layer wiring 11, and FIG. 13B shows the upper layer. The arrangement of the thermoelectric conversion elements 5p and 5n and the upper wiring 11 is shown. FIG. 14 is a cross-sectional view of the thermoelectric conversion device according to the third embodiment of the present invention, and represents a cross section along AA ′ in FIG. 13.

  Referring to FIGS. 13 and 14, the thermoelectric conversion device 103 according to the third embodiment of the present invention has the same arrangement and shape as the thermoelectric conversion device 100 according to the first embodiment shown in FIG. 1. The heat conducting members 3 and 4 are provided, and the head portions 3a and 4a are arranged so as to occupy the face-centered positions in a matrix like the thermoelectric conversion device 100 of the first embodiment.

  In the thermoelectric conversion device 103 of the third embodiment, the thermoelectric conversion elements 5p and 5n having the same plane pattern as the thermoelectric conversion device 100 of the first embodiment are arranged in two layers in the same in-plane position. ing. Otherwise, the thermoelectric conversion device 103 of the third embodiment is the same as the thermoelectric conversion device 100 of the first embodiment. Hereinafter, the thermoelectric conversion elements 5p and 5n of the thermoelectric conversion device 103 according to the third embodiment and the wiring 11 connecting them will be described in more detail.

  With reference to FIG.13 and FIG.14, in this 3rd Embodiment, the thermoelectric conversion element 5 consists of the lower-layer thermoelectric conversion element 5 and the upper-layer thermoelectric conversion element 5 which have the same plane pattern, The thermoelectric conversion of this upper and lower layers The element 5 is electrically isolated via the interlayer insulating film 8. The upper and lower thermoelectric conversion elements 5 have the same plane pattern as the thermoelectric conversion elements 5 of the thermoelectric conversion device 100 of the first embodiment and are arranged at the same in-plane positions.

  Referring to FIG. 13A, in the lower thermoelectric conversion elements 5p and 5n, the p-type thermoelectric conversion elements 5p and the n-type thermoelectric conversion elements 5n are arranged in the same arrangement as in the first embodiment. Further, the wirings 11a and 11b connecting the thermoelectric conversion elements 5p and 5n are also arranged in the same manner as in the first embodiment, whereby all the lower thermoelectric conversion elements 5p and 5n are connected in series. Note that one end of the lower wiring 11 forms an electrode pad 11c for external connection as in the first embodiment, and the other end of the lower wiring 11 is connected to the upper wiring 11 via the via 11v. An electrode pad 11c ′ is formed.

  Referring to FIG. 13B, the upper-layer thermoelectric change elements 5p and 5n have an n-type thermoelectric conversion element 5n at the position of the p-type thermoelectric conversion element 5p in the first embodiment and an n-type thermoelectric in the first embodiment. It arrange | positions so that the p-type thermoelectric conversion element 5p may be located in the position of the conversion element 5n. Therefore, the upper n-type thermoelectric conversion element 5n is stacked immediately above the lower p-type thermoelectric conversion element 5p, and the p-type thermoelectric conversion element 5p is stacked immediately above the lower n-type thermoelectric conversion element 5n.

  Further, the wirings 11a and 11b that connect the upper thermoelectric conversion elements 5p and 5n are arranged so as to connect all the upper thermoelectric conversion elements 5p and 5n in series as in the lower wiring 11. One end of the upper layer wiring 11 constitutes an electrode pad 11c 'for external connection, and the other end constitutes an electrode pad 11c' connected to the lower layer electrode pad 11c 'via the via 11v. As a result, all the thermoelectric conversion elements 5 in the upper and lower layers are connected in series via the wiring 11 and the via 11v, and the series output is output from the two electrode pads 11c for external connection.

  FIG. 15 is a cross-sectional view of the thermoelectric conversion element according to the third embodiment of the present invention, and shows an enlarged cross section of the two-layer thermoelectric conversion elements 5p and 5n shown in FIG.

  Referring to FIG. 15, a lower p-type thermoelectric conversion element 5 p made of, for example, 1 μm thick chromel is formed on insulating sheet 1 with an insulating film 7 made of, for example, a 1 μm thick silicon oxide film. . An upper n-type thermoelectric conversion element 5n made of constantan having a thickness of 1 μm, for example, is formed thereon via an interlayer insulating film 8 made of a resist having a thickness of 4 μm, for example. On top of that, for example, a second insulating sheet 2 is stuck via a thermosetting adhesive 6. The interlayer insulating film 8 is desired to have excellent insulating properties and high heat insulating properties in order to electrically insulate the upper and lower thermoelectric conversion elements 5p and 5n and to suppress unnecessary leakage of heat. From this viewpoint, a highly insulating resin is preferable, and a resist (photosensitive resin) that can be easily patterned is particularly preferable.

  In the thermoelectric conversion device 103 of the third embodiment described above, the thermoelectric conversion elements 5 are provided in two layers, and the number of thermoelectric conversion elements 5 per area is large. Moreover, all of these thermoelectric conversion elements 5 are connected in series. Therefore, a high output voltage and a large output power can be generated.

  Hereinafter, the manufacturing process of the thermoelectric conversion device 103 of the third embodiment will be described.

  FIG. 16 is a cross-sectional view of the manufacturing process of the thermoelectric conversion device according to the third embodiment of the present invention, and shows the cross-sectional structure of the thermoelectric conversion device in the middle of manufacture. 16 (a) to (b), (d), and (f) to (g) are cross sections taken along line AA 'in FIG. 13, and FIGS. 16 (cB) and (eB) are in FIG. The BB 'cross section of is shown. However, in FIG. 16 (e-B), the lower layer thermoelectric conversion element 5 is indicated by the BB ′ cross section in FIG. 13 (a), and the upper layer thermoelectric conversion element 5 is indicated by BB ′ in FIG. 13 (b). The cross section is shown.

  Referring to FIG. 16A, first, through the same process as the manufacturing process of the first embodiment shown in FIGS. 4A to 4C, the head portions 3a arranged on the upper surface of the insulating sheet 1, 4b, a high thermal conductivity material that penetrates the insulating sheet 1 directly below the head portion 3a, for example, a penetrating portion 3b made of copper, an insulating film 7 made of a silicon oxide film covering the entire upper surface, and affixed to the lower surface of the insulating sheet 1 The formed protective sheet 1e is formed.

  Next, referring to FIG. 16B, lower p-type thermoelectric conversion element 5p and n-type thermoelectric conversion element 5n are sequentially formed by sputtering using a metal mask. Next, with reference to FIG. 16C-B, the lower layer wiring 11 is formed by, for example, sputtering using a metal mask.

  Next, referring to FIG. 16D, a resist 8 that becomes an interlayer insulating film 8 is spin-coated on the entire upper surface of the insulating sheet 1 so as to have a thickness of 4 μm on the lower thermoelectric conversion element 5. Thereafter, exposure and development are performed to open an opening 8a for exposing the electrode pad 11c '. In this exposure and development, the resist 8 is formed so as to expose an extra portion of the lower layer thermoelectric conversion element 5 and lower layer wiring 11, for example, a portion that crawls up to the side surfaces of the head portions 3a and 4a, or a portion that protrudes from the metal mask. It is also possible to carry out patterning and to remove these excess portions by etching using the resist 8 (interlayer insulating film 8) as a mask.

  Next, upper layer thermoelectric conversion elements 5p and 5n are sequentially formed on the resist 8 in the same manner as the lower layer. Next, referring to FIG. 16E-B, upper layer wiring 11 is formed by the same method as the lower layer. At this time, the electrode pad 11c ′ is formed to extend from the upper surface of the resist 8 (interlayer insulating film 8) to the side surface and the bottom surface of the opening 8a, and is connected to the lower electrode pad 11c ′ exposed on the bottom surface of the opening 8a. . That is, vias 11v that connect the upper and lower electrode pads 11c 'are formed through the wiring 11 formed on the side surface of the opening 8a.

  Next, referring to FIG. 16 (f), the insulating sheet 2 provided with the adhesive 6 on the lower surface is thermocompression bonded, then the insulating sheet 2 and the insulating film 7 are penetrated from the upper surface 2a, and the head portion 4a is formed on the bottom surface. Open the exposed hole 2c. This thermocompression bonding is performed, for example, by holding at a temperature of 150 ° C. and a pressure of 5 MP for 2 hours. The hole 2c can be formed by, for example, laser processing, and if necessary, etching of the insulating film 7 following laser processing.

  Next, referring to FIG. 16G, the hole 2c is filled by electroless copper plating, and a through portion 4b penetrating the insulating seed 2 and connected to the head portion 4a is formed. Finally, the protective sheet 1e is peeled off to manufacture the thermoelectric conversion device 104 of the third embodiment.

  The fourth embodiment of the present invention relates to a thermoelectric conversion device 104 using a single conductivity type thermoelectric conversion element 5.

  FIG. 17 is a plan view of the thermoelectric conversion device according to the fourth embodiment of the present invention, showing the head portions 3a, 4a, thermoelectric conversion elements 5-1 to 5-12, and wires 11b to 11d arranged on the insulating sheet 1. ing.

  Referring to FIG. 17, in the thermoelectric conversion device 104 of the fourth embodiment, the head portions 3a, 4a and the thermoelectric conversion element 5 are formed on the insulating sheet 1 in the same position and shape as in the first embodiment. . In this configuration, electromotive forces are generated in opposite directions in the thermoelectric conversion elements 5 that are adjacent vertically and horizontally. For example, an electromotive force opposite to that of the thermoelectric conversion element 5-1 is generated in the thermoelectric conversion element 5-9 adjacent to the thermoelectric conversion element 5-1 and the thermoelectric conversion element 5-2 adjacent to the side. The wiring 11 of the fourth embodiment is arranged so as to connect all of these thermoelectric conversion elements 5-1 to 5-12 in series.

  The electrode pad 11c-1 for external connection serving as the starting point of the wiring 11 is connected to the lower end (the lower end in the drawing in FIG. 17) of the thermoelectric conversion element 5-1 arranged in the first row and the first column. Next, the upper end of the thermoelectric conversion element 5-1 is connected to the upper end of the thermoelectric conversion element 5-2 arranged in the first row and the second column via the wiring 11b. Since the electromotive force of the thermoelectric conversion element 5-1 and the thermoelectric conversion element 5-2 is opposite to each other, the direction of the electromotive force along the extending direction of the wiring 11 is the same direction by this wiring 11b, that is, in series. Connected to.

  Further, the lower ends of the thermoelectric conversion element 5-2 and the thermoelectric conversion element 5-3 adjacent to the right side thereof are connected to each other by the wiring 11b, and the thermoelectric conversion element 5-3 and the thermoelectric conversion element 5- adjacent to the right side thereof are connected. 4 are connected by wiring 11b. Thereby, the thermoelectric conversion elements 5-1 to 5-4 arranged side by side are connected in series.

  Next, the lower end of the thermoelectric conversion element 5-4 is connected to the lower end of the thermoelectric conversion element 5-5 adjacent below the thermoelectric conversion element 5-4 via the wiring 11d. Thereby, the thermoelectric conversion elements 5-4 and 5-5 are connected in series.

  Further, as in the first row, the upper end of the thermoelectric conversion element 5-5, the upper end of the thermoelectric conversion element 5-6, the lower end of the thermoelectric conversion element 5-6, the lower end of the thermoelectric conversion element 5-7, and the thermoelectric conversion element The thermoelectric conversion elements 5-4 to 5-8 in the second row are connected in series by the wiring 11b connecting the upper ends of 5-7 and the upper ends of the thermoelectric conversion elements 5-8.

  Similarly, the thermoelectric conversion element 5-8 at the left end of the second row and the thermoelectric conversion element 5-9 at the left end of the third row are connected in series by a wiring 11d, and the thermoelectric conversion elements 5-9 to 5- 12 are connected in series by wiring 11b. As a result, all the thermoelectric conversion elements 5-1 to 5-12 are connected in series.

  Since the thermoelectric conversion device 104 of the fourth embodiment uses the thermoelectric conversion element 5 of the same conductivity type, the manufacturing process is simplified.

  5th Embodiment of this invention is related with the thermoelectric conversion apparatus 105 which has a column-shaped heat conductive member. Details will be described below with reference to the manufacturing process.

  FIG. 18 is a cross-sectional view of a manufacturing process of the thermoelectric conversion device according to the fifth embodiment of the present invention, and shows a cross section of the thermoelectric conversion device in the middle of manufacturing. In addition, the top view of the thermoelectric conversion apparatus 106 of this 5th Embodiment is the same as the top view of 1st Embodiment shown in FIG. 18A, 18B and 18D show the AA 'cross section in FIG. 18, and FIGS. 18A-B show the BB' cross section in FIG. Here, the figure (a) and the figure (a-B) represent two cross sections in the same manufacturing process.

  Referring to FIGS. 18A to 18B and FIG. 18B, in the fifth embodiment, first, the first intermediate member 1A and the second intermediate member 2A are manufactured. .

  Referring to FIGS. 18A to 18A, the first intermediate member 1A has an insulating film 7 on the upper surface of the first insulating sheet 1 on which the first heat conducting member 3 is provided. Thermoelectric conversion elements 5p and 5n are formed, and an insulating film 7b covering the thermoelectric conversion elements 5p and 5n and a protective film 1e covering the lower surface are provided. The first heat conducting member 3 and the thermoelectric conversion elements 5p and 5n are the same as those in the first embodiment.

  In the manufacture of the first intermediate member 1A, first, the first heat conductive member 3 is formed on the first insulating sheet 1, and then the insulating film 7 covering the entire upper surface of the insulating sheet 1 is formed, and then the first Thermoelectric conversion elements 5p and 5n having one end in contact with the side surface of the head portion 3a of the heat conducting member 3 are formed. Next, wirings 11a to 11c connecting the thermoelectric conversion elements 5p and 5n are formed. These steps may be the same as the manufacturing steps of the first embodiment shown in FIGS. 4A to 4F-B except for the following points.

  In the fifth embodiment, unlike the first embodiment, the first heat conductive member 3 is formed on the first insulating sheet 1, and the second heat conductive member 4 is not formed at all including the head portion 4a. . Accordingly, the other ends of the thermoelectric conversion elements 5p and 5n are not in contact with the second heat conducting member 4 and are opposed to each other with a space where the head portion 4a of the second heat conducting member 4 can be loosely fitted. . The insulating film 7 is preferably a flexible heat insulating material, for example, a resin thin film having a thickness of 1 μm.

  Next, an insulating film 7 b is formed on the entire surface of the insulating sheet 1. The insulating film 7b is provided for protecting the thermoelectric conversion elements 5p and 5n, and may be omitted if not necessary.

  Referring to FIG. 18B, the second intermediate member 2A includes a second insulating sheet 2, a penetrating portion 4b penetrating the second insulating sheet 2, and a head portion 4a formed on the penetrating portion 4b. And a second heat conducting member 4 and an adhesive 6 for embedding the head portion 4a on the second insulating sheet 2. Further, a protective film 2e that covers the surface opposite to the surface on which the head portion 4a is formed is provided. The second heat conducting member 4 has the same material and shape as the second heat conducting member 4 of the first embodiment.

  The second intermediate member 2A can be manufactured by a process similar to the process of manufacturing the heat conducting members 3 and 4 in the first embodiment shown in FIGS. 4 (a) to 4 (c). However, only the second heat conductive member 4 is formed without forming the first heat conductive member 3 shown in FIG. Further, the insulating film 7 shown in FIG. 4C is not formed.

  Next, with reference to FIG. 18C, the second intermediate member 2A is turned upside down, and the head portion 4a of the second heat conducting member 4 is placed on the first intermediate member 1A. It is positioned and placed so as to be positioned between the opposite end surfaces of 5n. Then, with reference to FIG.18 (d), it hold | maintains at pressure 5MP and temperature 150 degreeC for 2 hours, the adhesive agent 6 is hardened, and the 1st and 2nd intermediate members 1A and 2A are stuck. Finally, the protective films 1e and 2e are peeled off to manufacture the thermoelectric conversion element 105 of the fifth embodiment. At the time of sticking, the tips of the head portions 3a and 4a are embedded in the surfaces of the first and second insulating sheets 1 and 2, and accordingly, the insulating films 7 and 7b near the tips of the head portions 3a and 4a are also formed. It is deformed so as to be embedded in the insulating sheets 1 and 2. Therefore, the insulating films 7 and 7b are preferably thin films having flexibility in addition to heat insulating properties and insulating properties, for example, resin thin films such as resists, so that they are not destroyed by such deformation.

  In the fifth embodiment, after manufacturing the first intermediate member 1A in which the heat conductive member 3a and the thermoelectric conversion elements 5p and 5n are formed and the second intermediate member in which the heat conductive member 4a is formed, respectively, Manufactured by sticking. The heat conducting members 3a and 4a of the first and second intermediate members 1A and 2A are formed in the same step 5, and there is no complicated process such as drilling or patterning after the bonding, so that the manufacturing process is simple. It is.

  The sixth embodiment of the present invention relates to a thermoelectric conversion device 106 having columnar heat conducting members 3a and 4a. Hereinafter, the thermoelectric conversion apparatus 106 of 6th Embodiment is demonstrated, referring the manufacturing process.

  FIG. 19 is a manufacturing process sectional view of the thermoelectric conversion device according to the sixth embodiment of the present invention, and represents the thermoelectric conversion device in the middle of manufacture.

  Referring to FIG. 19A, first, thermoelectric conversion elements 5p and 5n having a strip-like plane pattern are arranged in a matrix on the first insulating sheet. Note that the horizontal direction in FIG. 19 is the column direction. Next, referring to FIG. 19B, a conductive film 11A that connects between the thermoelectric conversion elements 5p and 5n adjacent in the column direction is formed. The conductive film 11A connects the adjacent thermoelectric conversion elements 5p and 5n around the outer periphery of the heat conducting members 3 and 4 to be formed later if necessary, or connects the holes 1c for forming the heat conducting members 3 and 4 to each other. The planar pattern is designed so that the connection between the adjacent thermoelectric conversion elements 5p and 5n is cut by forming 2c.

  Next, with reference to FIG. 19 (c), the second insulating sheet 2 provided with the adhesive 6 on the lower surface is stuck on the first insulating sheet 1. This sticking was carried out by holding for 2 hours under a temperature of 150 ° C. and a pressure of 5 MP.

  Next, referring to FIG. 19D, the first insulating sheet 1, the conductive film 11 and the adhesive 6 are penetrated from the lower surface of the first insulating sheet 1, and the second insulating sheet 2 is formed on the bottom surface (upper surface). Is formed. Moreover, the 2nd insulating sheet 2, the electrically conductive film 11, and the adhesive agent 6 are penetrated from the upper surface of the 2nd insulating sheet 2, and the hole 2c which exposes the 1st insulating sheet 1 is formed in a bottom face (lower surface). By forming the holes 1c and 2c, the conductive film 11A is patterned to form wirings 11a connecting the thermoelectric conversion elements 5p and 5n. These holes 1c and 2c are opened in a columnar shape, for example, a quadrangular prism or a cylindrical shape, and are provided in the same arrangement as the head portions 3a and 4a of the first embodiment, that is, between the thermoelectric conversion elements 5p and 5n. The opening of the holes 1c and 2c can be made by laser processing.

  Next, referring to FIG. 19 (e), for example, by forming a silicon oxide film on the entire surface of the insulating sheets 2 and 2 adhered by using the CVD method, and removing the silicon oxide films on the upper and lower surfaces, An insulating film 7c made of a silicon oxide film covering the inner walls of the holes 1c and 2c is formed. The insulating film 7c covers the end surface of the conductive film 11A (wiring 11a) exposed on the side wall surfaces of the holes 1c and 2c, and may not be formed on the bottom surfaces of the holes 1c and 2c.

  Next, referring to FIG. 19F, the holes 1c and 2c are filled with a high thermal conductivity material, for example, copper using electroless plating, and are made of columns of the high thermal conductivity material penetrating the insulating sheets 1 and 2. First and second heat conducting members 3 and 4 are formed. Thereby, the thermoelectric conversion device 106 according to the sixth embodiment is manufactured.

  Further, referring to FIG. 19G, a heat diffusion plate 12 made of a high thermal conductivity material, for example, a copper thin plate is formed on the entire lower surface of the first insulating sheet 1 and the entire upper surface of the second insulating sheet 2. You can also The heat diffusion plate 12 relaxes the temperature distribution of the upper and lower surfaces of the insulating sheets 1 and 2 caused by heat absorption and heat dissipation between the heat source and the heat conducting members 3 and 4. Thereby, the fall of the conversion efficiency of a thermoelectric converter is suppressed.

  Since the thermoelectric conversion device 106 according to the sixth embodiment described above forms the thermoelectric conversion elements 5p, 5n and the conductive film 11A on the top surface of the flat insulating sheet 1, a precise pattern can be easily formed. Further, since there is no process for forming the head portions 3a, 4a, the manufacturing process is simple.

  The seventh embodiment of the present invention relates to a thermoelectric conversion device 107 using a cone-shaped heat conduction member.

  FIG. 20 is a plan view of the thermoelectric conversion device according to the seventh embodiment of the present invention. The arrangement of the thermoelectric conversion elements 5n and 5p and the heat transfer member 25 formed on the support sheet 20 and the heat conducting members 23a and 24a is shown. Represents. FIG. 20 shows the arrangement in the vicinity of the upper surfaces of the thermoelectric conversion elements 5n and 5p. FIG. 21 is a cross-sectional view of a thermoelectric conversion device according to a seventh embodiment of the present invention, showing a cross section AA ′ in FIG. 20.

  20 and 21, in the thermoelectric conversion device 107 of the seventh embodiment, the thermoelectric conversion elements 5n and 5p having a width of 60 μm and a length of 90 μm, for example, are provided on the upper surface of the support sheet 20, for example, They are arranged in a line in the vertical direction on the paper surface of FIG. 20 with an interval of 120 μm. The thermoelectric conversion elements 5n and 5p are arranged so that p-type and n-type are alternately positioned. Furthermore, a plurality of rows of the thermoelectric conversion elements 5n and 5p are arranged in parallel with each other at a pitch interval of, for example, 480 μm. Therefore, the thermoelectric conversion elements 5n and 5p are arranged in a matrix. At this time, it is preferable to arrange the p-type and n-type thermoelectric conversion elements 5p, 5n in adjacent rows so as to have the same conductivity type, because all the thermoelectric conversion elements 5p, 5n can be easily connected in series.

  In order to simplify the drawing, FIG. 20 shows a diagram in which the thermoelectric conversion elements 5n and 5p are arranged in 3 rows and 4 columns. However, in order to generate a practical voltage, a large number of elements are used, for example, 4000 pieces. The thermoelectric conversion elements 5n and 5p can also be arranged in 100 rows and 40 columns. FIG. 21 illustrates a thermoelectric conversion device 107 in which a large number of such thermoelectric conversion elements 5n and 5p are arranged.

  The support sheet 20 is excellent in heat insulation and insulation, and a material having plasticity required in at least a joining process described later, for example, a polyethylene resin sheet is used. The thickness of the support sheet 20 needs to be strong enough to form and support a thermoelectric conversion element and a heat transfer portion, and is set to a thickness of 30 μm, for example.

  The heat transfer member 25 is made of a high thermal conductivity material having plasticity required in at least a joining process described later, and the thermoelectric conversion elements 5n, 5p having both ends adjacent to each other between the thermoelectric conversion elements 5n, 5p adjacent in the column direction. Are provided in contact with the opposite ends.

  For example, the heat transfer member 25 is formed in a rectangular pattern having a width of 150 μm and a length in the column direction of 180 μm, and is provided so as to cover the upper surfaces of the thermoelectric conversion elements 5n and 5p from the ends of the thermoelectric conversion elements 5n and 5p to a distance of 30 μm. . Alternatively, it may be a circular pattern having a diameter of 180 μm (extending 30 μm on the upper surface around the opposite ends of the thermoelectric conversion elements 5n and 5p).

  The heat transfer member 25 can be formed of a conductor having high thermal conductivity, such as a conductive paste. At the same time, the wiring 11b for connecting adjacent columns and, if necessary, the electrode pad 11c for external connection may also be formed with a conductive paste. Thereby, the wiring which connects between the thermoelectric conversion elements 5n and 5p can be shared by the heat transfer member 25, and the wiring 11 formation process can be omitted. When the heat transfer member 25 is formed of an insulator, the wires 11a to 11c that connect the thermoelectric conversion elements 5n and 5p are formed separately from the heat transfer member 25, as in the first embodiment.

  Referring to FIG. 21, the fourth insulating sheet 22 is formed on the upper surface of the support sheet 20, on which the thermoelectric conversion elements 5 n and 5 p and the heat transfer member 25 are formed, through the gap 9 filled with the adhesive 6. It is stuck. A third insulating sheet 21 is attached to the lower surface of the support sheet 20. As the material of the third and fourth insulating sheets 21 and 22, an insulating material having heat insulation and flexibility, for example, a polyester resin having a thickness of 40 μm is used.

  On the lower surface of the third insulating sheet 21 and the upper surface of the fourth insulating sheet 22, the head portions 23a of the heat conductive members 23, 24 made of a cone-shaped, for example, conical or pyramidal high thermal conductivity material, for example, copper. , 24a are formed. Note that these head portions 23a and 24a only need to have a cone at least at the tip, and may be a column with a sharp tip, for example.

  The head portion 23 a provided on the upper surface of the third insulating sheet 21 penetrates the support sheet 20, further penetrates substantially the center of the heat transfer member 25, and its upper end pierces the lower surface of the fourth insulating sheet 22. Is provided. On the other hand, the head portion 24 a provided on the lower surface of the fourth insulating sheet 22 penetrates substantially the center of the heat transfer member 25 and further penetrates the support sheet 20, and then the lower end thereof is on the upper surface of the third insulating sheet 21. It is provided to pierce. In addition, as long as these head parts 23a and 24a have penetrated the heat transfer member 25, the front-end | tip does not necessarily need to contact the insulating sheets 21 and 22 which oppose.

  Referring to FIGS. 20 and 21 again, the head portions 23a and 24a are formed so that their cross sections have substantially the same size on the upper surface of the support sheet 20. Specifically, each of the head portions 23a and 24a is a cone having a diameter of 180 μm and 120 μm and a height of approximately 50 μm. As a result, on the upper surface of the support sheet 20, the head portions 23a and 24a have a diameter of approximately 60 μm. In addition, the bottom surfaces of the head portions 23a and 24a may be made small by using columnar head portions 23a and 24a having only sharp tips.

  These head portions 23a and 24a are provided so as to penetrate substantially the center of the heat transfer member 25, that is, to penetrate substantially the center between the thermoelectric conversion elements 5p and 5n adjacent in the column direction. Accordingly, the thermoelectric conversion elements 5p and 5n adjacent to one of the head portions 23a and 24a from both sides are disposed substantially symmetrically with respect to the one head portion via the heat transfer member 25.

  Further, the third insulating sheet 21 has a columnar penetrating portion 23b that is in contact with the bottom surface of the conical head portion 23a and penetrates the insulating sheet 21, and the fourth insulating sheet 22 has a conical head portion 24a. A columnar penetrating portion 24b that is in contact with the bottom surface and penetrates the insulating sheet 21 is formed. The head portions 23a and 24a and the through portions 23b and 24b constitute the heat conducting members 23 and 24, respectively. The end surfaces of the thermoelectric conversion elements 5p and 5n are thermally connected to the side surfaces (conical surfaces) of the heat conducting members 23 and 24 via the heat transfer member 25. Therefore, similarly to the thermoelectric conversion device 101 of the first embodiment, even when the thermoelectric conversion elements 5p and 5n having a large film thickness or a multilayer film are used, the temperature difference between both ends of the thermoelectric conversion elements 5p and 5n is maintained large. And high thermoelectric conversion efficiency is realized.

  Hereinafter, the manufacturing process of the thermoelectric conversion device 107 of the seventh embodiment will be described.

  22-24 is sectional drawing (the 1)-(the 3) of the thermoelectric conversion apparatus manufacturing process of 7th Embodiment of this invention, and represents the thermoelectric conversion apparatus 107 in the middle of manufacture. 22 shows a manufacturing process of the sheet intermediate body 20A on which the thermoelectric conversion elements 5p and 5n are formed. FIG. 23 shows a manufacturing process of the sheet intermediate bodies 21A and 22A on which the heat conductive members 23 and 24 are formed. Reference numeral 24 denotes a process of manufacturing the thermoelectric conversion device 107 by sticking these sheet intermediates 20A, 21A, and 22A.

  Referring to FIG. 22A, in the manufacture of the sheet intermediate 20A, first, the upper surface of the support sheet 20 made of a polyester resin having a thickness of 30 μm is arranged in a matrix by, for example, a sputtering method using a metal mask. The thermoelectric conversion elements 5p and 5n are formed. The thermoelectric conversion elements 5p and 5n are provided in, for example, 40 columns in the width direction of the support sheet 20 and 100 rows in the extending direction.

  Next, referring to FIG. 22B, a heat transfer member 25 made of a conductive paste that connects opposite ends of the thermoelectric conversion elements 5p, 5n between the thermoelectric conversion elements 5p, 5n adjacent in the column direction. For example, it is formed by printing or dropping a conductive paste. The heat transfer member 25 is formed so as to cover the peripheral upper surface of the opposing ends of the thermoelectric conversion elements 5p and 5n.

  Next, referring to FIG. 22C, an insulating thermosetting adhesive 6 was applied to a thickness of 15 μm. Through these steps, a sheet-like sheet intermediate 20A in which the thermoelectric conversion elements 5p, 5n, the heat transfer member 25, and the adhesive 6 having a flat upper surface are formed on the upper surface of the support sheet 20 is formed.

  Next, the manufacturing process of the sheet intermediates 21A and 22A will be described.

  Referring to FIG. 23A, in the manufacture of the sheet intermediate 21A, first, a third insulating sheet 21 made of a polyester resin having a thickness of 40 μm, for example, a copper layer having a thickness of 50 μm is prepared. To do. Next, for example, the lower surface of the third insulating sheet 21 is irradiated with laser light, and a hole 21c that penetrates the insulating sheet 21 and exposes the copper layer is opened on the bottom surface. Next, the hole 21c is filled with copper to form a through portion 23b made of a copper pillar. The through portion 23b can be formed by, for example, copper electroless plating or electrolytic plating. Thereafter, a copper layer having a thickness of 10 μm is formed on the lower surface of the insulating sheet 21. The copper layer on the lower surface can be formed by vapor deposition or sputtering, or by electrolytic plating following the formation of the through portion 23b by electrolytic plating.

  Next, the copper layer on the lower surface of the insulating sheet 21 is photoetched to form a metal layer 26 made of a copper layer that remains in an island shape for each through portion 23b. This metal layer 26 prevents the penetration part 23b from peeling off from the insulating sheet 21 in a later step. It also functions as a heat diffusion plate.

  Next, a mask 28 having a circular plane pattern is formed on the copper layer on the upper surface of the insulating sheet 21 and is made of columnar copper having a maximum diameter (bottom diameter of the cone) of the head portion 23a by reactive ion etching. Columnar protrusions 27 are formed. In addition, a rectangular columnar protrusion can be formed by making the mask 28 into a rectangular pattern, for example.

  Next, referring to FIG. 23B, the columnar protrusions 27 are ion milled. At this time, the columnar protrusion 27 is removed so as to form an inclined surface from the outer periphery of the upper surface as the diameter decreases from the end surface of the mask 28. As a result, referring to FIG. 23C, the columnar protrusion 27 is finally processed into a conical shape to form the head portion 23a.

  Through this process, the third heat conductive member 23 having the conical head portion 23a is formed on the upper surface of the third insulating sheet 21, and the sheet having the island-shaped metal layer 26 in contact with the through portion 23b on the lower surface. Intermediate 21A is manufactured. Further, by the same manufacturing process, the fourth heat conductive member 24 having the conical head portion 24a is formed on the lower surface of the fourth insulating sheet 22, and the island-shaped metal layer 26 in contact with the penetrating portion 24b is formed on the upper surface. The provided sheet intermediate 22A is formed. This sheet intermediate 22A is the same as the sheet intermediate 21A except that the diameter of the columnar protrusions 27 is different and the top and bottom are inverted, and can be manufactured by the same process.

  The sheet intermediates 21A and 22A are formed by attaching a soft protective tape that covers and protects the head portions 23a and 24a to the surfaces of the insulating sheets 21 and 22 on which the head portions 23a and 24a are formed, and winding them in a roll shape. It can also be saved.

  Next, referring to FIG. 24, the sheet intermediates 21A and 22A manufactured by the process shown in FIG. 23 are respectively crimped to the upper and lower surfaces of the sheet intermediate 20A manufactured by the process shown in FIG.

  In this crimping step, first, the sheet intermediate 20A wound in a roll shape is pulled out horizontally and stretched horizontally. Next, the sheet intermediate bodies 22A and 21A wound in a roll shape are pulled out horizontally and held horizontally above and below the sheet intermediate body 20A, respectively. At this time, the head portions 21a and 22a forming surfaces (21a and 22b) are opposed to the upper and lower surfaces of the sheet intermediate 20A in parallel. In this state, the sheet intermediates 22A and 21A are aligned so that the head portions 21a and 22a are positioned at the center of the heat transfer member 25 when viewed in plan.

  Next, the sheet intermediate 22A is heated and pressed with rollers from above and below, and the sheet intermediate 22A is thermocompression bonded to the upper surface of the sheet intermediate 20A and the sheet intermediate 21A is thermocompression bonded to the lower surface of the sheet intermediate 20A. This thermocompression bonding is performed, for example, under a temperature of 150 ° C. and a pressure of 10 MP, and then a heat treatment for thermosetting the adhesive and the heat transfer member 25 is performed at a temperature of 150 ° C. for 2 hours.

  At the time of this thermocompression bonding, the cone-shaped head portion 21a formed on the upper surface 21a of the sheet intermediate 21A bites into the heated and softened support sheet 20, penetrates through the support sheet 20, and further from the conductive paste. The heat transfer member 25 is penetrated. Furthermore, the tip of the head portion 21a may be bitten into the lower surface 22b of the insulating sheet 22 of the sheet intermediate 21A that is adhered (thermally adhered) to the upper surface of the sheet intermediate 20A. Then, the sheet intermediates 20 </ b> A, 21 </ b> A, and 22 </ b> A that have been thermocompression bonded are cut in the width direction and separated for each thermoelectric conversion device 107.

  The thermoelectric conversion device 107 according to the seventh embodiment is manufactured through the above thermal raining process. In the seventh embodiment, three types of sheet intermediates 20A, 21A, and 22A are manufactured separately and then manufactured by thermocompression bonding. These sheet intermediates 20A, 21A, and 22A can be rolled and stored and transported, and thermocompression bonding can be produced by a continuous process using a roll, which is suitable for mass production. .

  By applying the present invention to a sheet-like thermoelectric conversion device, a thermoelectric conversion device having a high conversion efficiency using a plurality of layers or thick thermoelectric conversion elements is provided.

1 Insulation sheet (first insulation sheet)
1A, 2A Intermediate member 1a, 2a Upper surface 1b, 2b Lower surface 1c, 2c Hole 1d Copper layer 1e, 2e Protective sheet 2 Insulating sheet (second insulating sheet)
3 heat conduction member (first heat conduction member)
3a, 4a Head part 3b, 4b Penetration part 4 Thermal conduction member (2nd thermal conduction member)
5, 5n, 5p Thermoelectric conversion element 5a Thermoelectric conversion material thin film 6 Adhesive 7, 7b Insulating film 7a Side wall 8 Interlayer insulating film (resist)
9 Gap 11, 11a, 11b Wiring 11c, 11c ′ Electrode pad 11v Via 11A Conductive film 11D Wiring contact area 12 Thermal diffusion plate 15 Metal film 16, 20 Support sheet 20A, 21A, 22A Sheet intermediate 21 Third insulating sheet 21a 22a Upper surface 21b, 22b Lower surface 22 Fourth insulating sheet 23 Third heat conducting member 23a Third head portion 23b Third penetrating portion 24 Fourth heat conducting member 24a Fourth head portion 24b Fourth penetrating Part 25 heat transfer member 26 metal layer 27 columnar projection 28 mask 61, 62 normal thermoelectric conversion device 63 heat insulating sheet 64, 64p, 64n thermoelectric conversion element 65 high thermal conductivity material 66 electrode 100, 101, 102, 103, 104, 105, 106 Thermoelectric converter

Claims (8)

A first insulating sheet;
A second insulating sheet laminated on the first insulating sheet via a gap;
A first heat conducting member made of a material having a higher thermal conductivity than the first and second insulating sheets, which penetrates the first insulating sheet and protrudes from the upper surface of the first insulating sheet;
A second heat conducting member made of a material having a higher thermal conductivity than the first and second insulating sheets, which penetrates the second insulating sheet and protrudes from the lower surface of the second insulating sheet;
A thermoelectric conversion element provided on the upper surface of the first insulating sheet and provided between the first heat conductive member and the second heat conductive member;
An adhesive filling the gap;
A thermoelectric conversion device. The first heat conducting member and the second heat conducting member are arranged in a two-dimensional lattice so as to occupy face center positions in a plane parallel to the first and second insulating sheets,
The thermoelectric conversion device according to claim 1, wherein the thermoelectric conversion element is disposed between the first and second heat conducting members constituting each row of the lattice. The first heat conducting member includes a columnar first head portion formed on an upper surface of the first insulating sheet;
A columnar first penetrating portion that penetrates the first insulating sheet and contacts the lower surface of the first head portion;
The second heat conducting member includes a columnar second head portion formed on the upper surface of the first insulating sheet;
A column-shaped second penetrating portion that penetrates the second insulating sheet and contacts the upper surface of the first head portion;
The thermoelectric conversion device according to claim 1, wherein the thermoelectric conversion element is disposed between the first and second head portions.   At least one of the first and second heat conductive members embeds a hole provided through the adhesive that penetrates the first or second insulating sheet and fills the gap. The thermoelectric conversion device according to claim 1, wherein the thermoelectric conversion device is made of a high thermal conductivity material. A support sheet made of a thermoplastic resin sheet in which a plurality of thermoelectric conversion elements are arranged on the upper surface;
A heat transfer member that is provided between adjacent thermoelectric conversion elements and thermally connects ends of the thermoelectric conversion elements facing each other;
A third insulating sheet laminated on the lower surface of the support sheet;
A fourth insulating sheet laminated via a gap filled with an adhesive on the upper surface of the support sheet;
A third head portion formed on the upper surface of the third insulating sheet and made of a material having a higher thermal conductivity than the support sheet, the third insulating sheet, and the fourth insulating sheet and having a cone shape with a sharp upper end portion; ,
A fourth head portion formed on a lower surface of the fourth insulating sheet, and having a weight-like shape made of a material having a higher thermal conductivity than the support sheet, the third insulating sheet, and the fourth insulating sheet, and having a sharp lower end portion; ,
A third penetrating portion that penetrates the third insulating sheet and contacts the lower surface of the third head portion;
A fourth penetrating portion that penetrates the fourth insulating sheet and contacts the upper surface of the fourth head portion;
The third head portion is provided through the support sheet and the heat transfer member,
The fourth head portion is a thermoelectric conversion device provided through the gap and the heat transfer member. Forming a first hole penetrating the first insulating sheet in a first insulating sheet made of a material having a lower thermal conductivity than the high thermal conductivity material laminated on the upper surface with a layer made of a high thermal conductivity material; When,
The high thermal conductivity material is embedded in the first hole, and a first penetration portion made of the high thermal conductivity material is formed through the first insulating sheet and in contact with a lower surface of the layer made of the high thermal conductivity material. And a process of
The layer made of the high thermal conductivity material is patterned, and the first and second pillars made of the high thermal conductivity material are respectively formed immediately above the first through portion and at positions away from the first through portion. Forming a head part;
Forming a thermoelectric conversion element on the upper surface of the first insulating sheet and between the first and second head portions;
Next, a step of attaching a second insulating sheet made of a material having a lower thermal conductivity than the high thermal conductivity material, onto the first insulating sheet via an adhesive;
Forming a second hole penetrating the second insulating sheet and exposing the upper surface of the second head portion on the bottom surface;
Embedding the high thermal conductivity material in the second hole, and forming a second through portion made of the high thermal conductivity material through the second insulating sheet and in contact with the upper surface of the second head portion; ,
The manufacturing method of the thermoelectric conversion apparatus which has. Forming a thermoelectric conversion element on the upper surface of the first insulating sheet;
A step of attaching a second insulating sheet via an adhesive on the first insulating sheet on which the thermoelectric conversion element is formed;
Forming a third hole penetrating the first insulating sheet and the adhesive on one outer side of the thermoelectric conversion element;
Forming a fourth hole penetrating the second insulating sheet and the adhesive outside the other end of the thermoelectric conversion element;
A high thermal conductivity material made of a material having a higher thermal conductivity than the first and second insulating sheets is embedded in the third and fourth holes, and the first insulating sheet penetrates through the first insulating sheet. A first heat conducting member made of the high thermal conductivity material projecting on the upper surface of the second insulating sheet, and a second heat conducting material made of the high heat conductivity material penetrating the second insulating sheet and projecting on the lower surface of the second insulating sheet. Forming a heat conducting member of
The manufacturing method of the thermoelectric conversion apparatus which has this. A step of arranging thermoelectric conversion elements on an insulating support sheet;
A first high thermal conductivity material having a higher thermal conductivity than the support sheet, provided on the support sheet between the thermoelectric conversion elements so as to thermally connect opposing ends of the adjacent thermoelectric conversion elements. Forming a heat transfer member comprising:
Applying an adhesive on the support sheet on which the heat transfer member is formed;
The insulating sheet made of a material having a lower thermal conductivity than the first high thermal conductivity material and having flexibility is provided on one main surface of the insulating sheet, and has a second thermal conductivity higher than that of the insulating sheet and the support sheet. A cone-shaped head portion having a pointed tip portion made of a high thermal conductivity material and a penetrating portion made of the second high thermal conductivity material that penetrates the insulating sheet and contacts the bottom surface of the head portion. Arranging the heat transfer members between the heat transfer members along the extending direction of the sheets at a double interval;
Next, the insulating sheet is placed above and below the stretched support sheet, and the head portions with the tip of the head portion facing the support sheet and the top and bottom surfaces of the support sheet facing each other are adjacent to each other. Holding it so as to be located immediately above the transmission member;
Next, the insulating sheet is thermocompression bonded to the upper and lower surfaces of the support sheet, and the head portion penetrates the insulating sheet thermocompression bonded to the upper and lower surfaces of the support sheet, respectively. A step of penetrating the heat transfer member;
The manufacturing method of the thermoelectric conversion apparatus characterized by having.