JP2011222564A - Heat sink, heat dissipation member, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink in which dirt such as dust accumulated on a fin part of the heat sink can be removed easily, and which improves heat dissipation efficiency and a contact between the fin part and a heat sink main body.SOLUTION: A heat sink comprises a heat sink main body thermally connected to a heating member, and a heat dissipation member in which a plurality of fins are provided on a base including a fitting part joining the heat dissipation member to the heat sink main body. The fitting part has an uneven surface, and the heat dissipation member is removable from the heat sink main body.

Description

  The present invention relates to a technique for removing dust or the like from a heat sink.

  A heating element such as a CPU (Central Processing Unit) is incorporated in an electronic device such as a personal computer. If the heating element generates excessive heat, the CPU performance cannot be fully exhibited, and cooling is necessary. It becomes. Here, as a method of cooling the heating element, for example, a heat receiving part that receives heat from the heating element and a radiation fin are thermally connected by a heat pipe to transmit heat to the radiation fin side, and the radiation fin is cooled by a cooling fan. There is a technology for forced air cooling.

  The mechanism of this technology is as follows. That is, there is a heat sink in which a plurality of radiating fins are arranged side by side, and heat of the heat generating component is sent to the heat sink from an electronic component material or the like through a heat pipe. Further, cooling is performed by sending cooling air to the radiating fin with a cooling fan or the like and transferring this heat to the cooling air.

  However, this technology cannot completely prevent dust and other dirt contained in the cooling air taken in from the outside air from adhering to the radiating fins. This causes problems such as lowering.

  As a countermeasure, there is a case where a door is prepared for facilitating removal of dust and the like accumulated on the fin portion of the heat sink.

  In addition, as a related technology, sufficient bonding can be achieved with extrusion processing accuracy, the heat exchange total area of the fin material is taken large, and the bonding of the base member and the fin material with good thermal conductivity is ensured, and the base member There are some which provide a fin material for a heat sink and a coupling structure using the same, which can be easily formed into a coupling structure simply by forcibly inserting the fin material into the casing. The structure of the coupling structure is such that the insertion groove of the box-shaped base member provided with the insertion groove for fitting the fin material has a height slightly larger than the cross section of the base member and has a cross-sectional shape. A fin material composed of a curved line or a broken line is forcibly inserted so that the oxides on the fitting surfaces of both the base member and the fin material are stripped off and the metal surfaces are joined together. (For example, refer to Patent Document 1).

JP 2001-24115 A

However, dirt such as dust accumulated on the fin portion of the heat sink is difficult to remove even if a dust removal door is attached because the fins are narrow and stick to the fins.
In addition, when the fin part is configured to be detachable from the heat sink body, the heat dissipation efficiency decreases if the heat conduction area of the attachment / detachment part is small, while the contact between the fin part and the heat sink body by bonding or the like on the heat conduction surface of the attachment / detachment part. It was also necessary to improve.

  In the related art described above, the parts constituting the fins cannot be removed, cleaned with a brush or the like, and attached again, and it is difficult to remove dirt such as dust from the gaps of the fins.

  The present invention has been made to solve the above-described problems. It is easy to remove dirt such as dust accumulated on the fin portion of the heat sink, and the heat radiation efficiency can be improved. The fin portion and the heat sink It is an object of the present invention to provide a heat sink, a heat radiating member, and an electronic device in which contact with the main body is improved.

The heat sink of the present invention has a heat sink main body portion thermally connected to the heat generating member, and a heat dissipating member in which a plurality of fins are arranged on a base having a fitting portion joined to the heat sink main body portion,
The mating part is an uneven shape,
The heat dissipation member is detachable from the heat sink body.

The heat dissipating member of the present invention is a heat dissipating member having a fitting portion joined to a heat sink main body part thermally connected to the heat generating member,
Multiple fins are placed on the base,
The mating part is an uneven shape,
It is detachable from the heat sink body.

  According to the present invention, dirt such as dust accumulated on the fin portion of the heat sink can be easily removed, heat dissipation efficiency can be improved, and contact between the fin portion and the heat sink main body can be improved.

1 is a perspective view of a notebook personal computer according to an embodiment of the present invention. It is a figure explaining an example of the cooling unit which concerns on the form of this invention. It is aa sectional drawing of FIG. It is a block diagram of the heat sink which concerns on the form of this invention. It is a block diagram of the heat sink which concerns on the form of this invention. It is a figure which shows the example of a shape of the fitting part which concerns on the form of this invention. It is a figure which shows the example of the pressurization direction which concerns on the form of this invention. It is a figure which shows the example of the contact improvement material which concerns on the form of this invention.

Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. A notebook personal computer 1 as an electronic apparatus in the present embodiment shown in FIG. 1 has a known configuration such as a main body and a display.
The outline of the notebook personal computer 1 in the present embodiment will be described. The main body has a flat, substantially box-shaped main body housing 11, and an operation unit such as a keyboard and a pointing device is provided on the upper surface side thereof. It is done. In addition, a part of the lower surface side of the main body housing 11 may be missing, and a cover 12 may be provided to fill that portion (see FIG. 3).
The main body is provided with a printed circuit board (not shown) incorporating a CPU 13 (see FIG. 2) as a heating element for controlling the operation unit, the display device and the like, and a cooling unit 2 for cooling the CPU 13 and the like. (See FIG. 2). In addition, the heat generating body as a target to be cooled by the cooling unit 2 is not limited to the CPU 13.
Moreover, it has a display part provided with the display screen of display devices, such as LCD.

  Next, an example of the cooling unit 2 will be described with reference to FIG. The configuration of the cooling unit 2 is not limited to water cooling, and various types may be used. FIG. 2 is a perspective view of the notebook personal computer 1 as viewed from the lower surface side of the main body.

  The cooling unit 2 includes a heat receiving part 21, a heat pipe 22, a heat sink 3 (comprising a heat sink main body 31 and a fin part 32), and a fan unit 4.

  The heat receiving part 21 is a flat member having a high thermal conductivity such as copper or aluminum. The heat receiving unit 21 is thermally connected to the CPU 13 via a heat conducting member such as grease, for example. The heat receiving unit 21 has a role of receiving heat generated by the CPU 13 and transmitting the heat to the heat pipe 22.

  The heat pipe 22 has a rod-like shape and has a role of transmitting the heat of the CPU 13 received by the heat receiving unit 21 from one end to the other end. The heat pipe 22 is a hollow tube in which water is enclosed, and water is converted into water vapor by heat received at one end, and this heat is carried to the other end, and the other end is cooled. It is a mechanism that carries heat by becoming water again and circulating to one end.

  The heat sink 3 (consisting of the heat sink main body 31 and the fin portion 32) is a heat radiating member in which a plurality of fins are arranged on a base having a fitting portion to be joined to the heat sink main body 31, referring also to FIG. The fin part 32 is provided and the heat diffusion area is ensured to release the heat received from the heat pipe 22 to the outside. A heat pipe 22 is brazed with a brazing metal 23 on the heat sink body 31 side of the heat sink 3. The heat sink 3 may be composed of a heat diffusion metal plate that is a member having high thermal conductivity such as copper or aluminum. The heat sink body 31 and the heat pipe 22 may be integrated so that the heat pipe 22 penetrates to the heat sink body 31 side. FIG. 2 shows an external view of the internal configuration in which the upper surface side of the main body housing 11 is not provided, but the heat sink 3 makes it easy to grasp the positional relationship with other components. Simplified for purposes of illustration.

  The fan unit 4 includes a casing having an intake hole and an exhaust hole, and a fan mounted in the casing. The fan unit 4 exhausts the air sucked from the intake holes through the exhaust holes as the fan rotates. The fin portion 32 of the heat sink 3 (consisting of the heat sink main body 31 and the fin portion 32) and the exhaust hole of the fan unit 4 are provided at substantially opposite positions, and the air exhausted from the fan unit 4 (exhaust air) is The air is blown toward the heat sink 3 to promote the heat diffusion of the heat sink 3, and the exhaust air is discharged to the outside through an exhaust hole provided on the side surface of the cover 12 or the main body housing 11. Note that FIG. 3, which is a cross-sectional view taken along the line aa in FIG. 2, shows a schematic diagram (only the main body housing 11, the cover 12, the heat sink 3, and the fan unit 4).

  Next, the heat sink 3 (consisting of the heat sink main body 31 and the fin portion 32) of the notebook personal computer 1 in the present embodiment will be described in detail.

Referring to FIGS. 4 and 5, the heat sink 3 in the present embodiment is configured such that the fin portion 32 can be detached from the heat sink body portion 31.
The shape of the fitting part (detachable part) between the heat sink main body 31 and the fin part 32 has a jagged shape, but this increases the heat conduction area of the fitting part (detachable part) and improves the heat radiation efficiency. That is, if the shape of the fitting portion (detachable portion) is close to a flat surface, the heat conduction area is limited to a small size, thereby avoiding a reduction in heat dissipation efficiency.

  In addition, due to the shape of the fitting portion (detachable portion) between the heat sink main body 31 and the fin portion 32, the fitting cannot be completed unless it is correctly attached. The shape also has a positioning function for the fin portion 32, and the heat sink main body portion. The contact between 31 and the fin portion 32 is improved. That is, if the shape of the fitting portion (detachable portion) is close to a flat surface, the position of the fin portion 32 is likely to be displaced, and this problem is avoided.

  In addition, the shape of said fitting part (attachment / detachment part) may be, for example, a shape having irregularities as shown in FIG.

  Further, a method for improving the contact between the heat sink body 31 and the fin portion 32 will be described below.

  First, as shown in FIG. 7, there is a method of applying pressure to a fitting portion (detachable portion) that is a fastening portion. Up-down pressure and left-right pressure may be applied by screwing, spring fastening, magnet fastening, or the like.

  Next, as shown in FIG. 8, there is a method of adding a contact improving material 24 to a fitting portion (detachable portion) that is a fastening portion. A conductive grease may be applied, a conductive seal may be sandwiched, or a metal foil may be sandwiched.

  In addition, a part of the lower surface side of the main body housing 11 described in the description of FIG. 1 is missing, and a cover 12 is provided to fill the portion, and the cover 12 is removed and the fin portion 32 is opened from the opening. However, the position and shape of the cover 12 are arbitrary, and the cover 12 itself may not be provided.

  According to the above-described embodiment, parts of the fin part 32 that have been removed in the past can be divided into the heat sink main body part 31 and the fin part 32 by providing a large opening. It is possible to easily remove dirt such as dust from the gaps of the fins using a brush or the like.

  In addition, the stability of the electronic apparatus / device can be improved, heat loss can be prevented, and the need for maintenance can be appealed to the user.

  Each of the above-described embodiments is a preferred embodiment of the present invention, and various modifications can be made without departing from the scope of the present invention. Further, the present invention can be applied to all apparatuses and devices that require a heat sink.

DESCRIPTION OF SYMBOLS 1 Notebook type personal computer 11 Main part housing | casing 12 Cover 13 CPU
DESCRIPTION OF SYMBOLS 2 Cooling unit 21 Heat receiving part 22 Heat pipe 23 Wax metal 24 Contact improvement material 3 Heat sink 31 Heat sink main-body part 32 Fin part 4 Fan unit

Claims (7)

A heat sink main body thermally connected to the heat generating member, and a heat dissipating member in which a plurality of fins are arranged on a base having a fitting portion joined to the heat sink main body,
The mating part is an uneven shape,
The heat sink, wherein the heat dissipating member is detachable from the heat sink body.   The heat sink according to claim 1, wherein the heat sink body and the heat radiating member are pressed by a pressurizing unit and fitted together.   The heat sink according to claim 1, wherein a member is provided between the heat sink main body and the heat radiating member. A heat dissipating member having a fitting portion to be joined with a heat sink main body part thermally connected to the heat generating member,
Multiple fins are placed on the base,
The mating part is an uneven shape,
A heat dissipating member that is detachable from the heat sink body.   The heat radiating member according to claim 4, wherein the heat radiating member is pressed by a pressing means and fitted into the heat sink body.   6. A heat dissipation member according to claim 4, wherein a member is provided between the heat sink body and the heat sink body.   An electronic apparatus comprising the heat sink according to claim 1.

Images