JP2011211859A - Power supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power supply device that has an environmental power generation function that prevents deterioration of antenna characteristics, and allows small and inexpensive configuration by using a laminate.SOLUTION: The power supply device is configured by using a laminate 20 formed by alternately laminating an insulating layer and a conductor layer. The laminate 20 is integrally configured with an antenna 10a for receiving a radio wave from the outside, an input circuit to which a received signal of the antenna 10a is input, and a rectifier circuit for rectifying an output AC voltage of the input circuit to convert it into a DC voltage. The antenna 10a is included in the region R1 while circuit components (D1, D2) and an inner-layer region R2a are included in the region R2 as a circuit region. The antenna 10a does not overlap with the region R2 as the circuit region in the lamination direction of the laminate 20. Therefore, a small and inexpensive power supply device is achieved while preventing deterioration in antenna performance of the antenna 10a.

Description

  The present invention relates to a power supply device having a circuit structure in a laminated body, among power supply devices having an energy harvesting function of receiving radio waves coming from outside and extracting DC power.

  Generally, a secondary battery is mounted on a portable electronic device such as a mobile phone, and the secondary battery needs to be charged when used to some extent. However, a mobile phone or the like usually has a long standby operation time that consumes less power than a transmission operation. Devices such as sensors that are installed in facilities that are difficult to access and operate intermittently are known, but this type of sensor also consumes less power. If it is possible to eliminate the need for installing a secondary battery, replacing the battery, or laying a cable for such a device with low power consumption, the utility value of these devices can be increased. Therefore, conventionally, energy harvesting that draws electric power from energy existing in the natural environment has attracted attention. For example, techniques for receiving radio waves used in urban spaces and taking out DC power have been proposed (see, for example, Patent Documents 1 and 2). Although direct current power that can be extracted from radio waves by such a technique is small, it can be sufficiently applied if it is used for low power consumption as described above.

JP-A-8-33243 JP 2003-88005 A

  It is desirable that the power supply apparatus having the above-described energy harvesting function is configured to be small and low cost. For example, if an antenna and various circuits are integrally arranged using a multilayer laminate in which dielectric layers and conductor layers are alternately laminated, a reduction in size and cost can be realized. However, since a high-frequency signal is transmitted inside the power supply device, electromagnetic interference when a small-sized laminated antenna and circuit are integrated becomes a problem. In particular, if there is a circuit disposed opposite to the antenna between different layers of the laminate, it is inevitable that the antenna characteristics deteriorate due to the influence of the conductor pattern of the circuit element. Further, if an external antenna is attached or the size of the laminate itself is increased in order to prevent such deterioration of the antenna characteristics, it becomes impossible to realize a reduction in size and cost of the power supply device.

  The present invention has been made to solve these problems, and the antenna and circuit are integrally arranged in a laminate to reduce the size and cost, and the antenna is caused by interference between the antenna and the circuit. It is an object of the present invention to provide a power supply device having an energy harvesting function that can prevent deterioration of characteristics.

  In order to solve the above-described problems, a power supply device according to the present invention includes an antenna for receiving radio waves from the outside in a power supply device configured using a laminate in which insulating layers and conductor layers are alternately laminated, and the antenna. An input circuit for receiving the received signal and a rectifier circuit for rectifying the output AC voltage of the input circuit and converting it to a DC voltage are each configured in the laminate, and the antenna includes the input circuit and the rectifier circuit. It is characterized by not overlapping with the arranged circuit area in the stacking direction of the stack.

  According to the power supply device of the present invention, since the antenna, the circuit area in which the input circuit and the rectifier circuit are arranged are configured in the laminate, and the antenna and the circuit area are arranged so as not to overlap in the stacking direction. And electromagnetic interference of the antenna can be suppressed. That is, the conductor pattern of the circuit elements arranged in a plane in the circuit area has a stronger influence on the antenna in the stacking direction than in the plane direction. It is. Therefore, it is possible to realize a small and low-cost power supply device while arranging the antenna and the circuit region integrally using a multilayer laminate and ensuring good antenna characteristics.

  In the power supply device of the present invention, in addition to the antenna and the circuit region, it is desirable to form a ground pattern that is opposed to the antenna, the circuit region, and one side in the stacking direction of the stacked body. As a result, this ground pattern functions as a ground plate for the antenna as well as a shield plate for the circuit area.

  The input circuit can be composed of various circuits. For example, the input circuit may include a matching circuit for matching the impedance of the antenna, or may include a transformer having a primary coil connected to the antenna and a secondary coil connected to the rectifier circuit. Also good. The input circuit may be configured by connecting a plurality of circuits in series. For example, two of a matching circuit, a transformer, and a tuning circuit may be connected in series to serve as an input circuit.

  The laminate can have various arrangements. For example, not only the antenna but also the transformer may be configured not to overlap an area where the inductor and the capacitor are arranged in the circuit area in the stacking direction of the stacked body. Or you may comprise the area | region where the inductor and the capacitor | condenser are arrange | positioned among the said circuit area | regions with the conductor pattern of the inner layer of the said laminated body.

  Various forms can be adopted as the antenna. For example, a chip antenna mounted on the surface of the laminate may be used. In this case, the chip antenna and the electronic component included in the rectifier circuit can be mounted on the surface of the laminate. Moreover, you may comprise the said antenna by the conductor pattern of the inner layer of the said laminated body.

  According to the present invention, in a power supply device configured by integrating an antenna and various circuits in a laminated body, the antenna and the circuit area are arranged so as not to overlap in the stacking direction, so that the circuit elements in the circuit area are connected to the antenna. An adverse effect caused by electromagnetic interference can be suppressed. Therefore, while maintaining good antenna characteristics, it is possible to configure a small size and low cost by using a small-sized laminate, and thereby a highly convenient power supply device that supplies power to portable devices, sensors, etc. in the field of energy harvesting Can be realized.

It is a figure which shows an example of the circuit structure of the power supply device of 1st Embodiment. It is a figure which shows the structural example of the laminated body with which the power supply device of 1st Embodiment is comprised. It is a perspective view which shows the structural example of each layer of the laminated body of FIG. It is a figure which shows an example of the circuit structure of the power supply device of 2nd Embodiment. It is a figure which shows the structural example of the laminated body by which the power supply device of 2nd Embodiment is comprised. It is a figure which shows the 1st modification of the circuit structure of a power supply device. It is a figure which shows the 2nd modification of the circuit structure of a power supply device. It is a figure which shows the 3rd modification of the circuit structure of a power supply device. It is a figure which shows the 1st modification of the structure of a laminated body. It is a figure which shows the 2nd modification of the structure of a laminated body.

  Embodiments of the present invention will be described with reference to the drawings. Below, two embodiment to which this invention is applied is described sequentially.

[First embodiment]
FIG. 1 shows an example of a circuit configuration of the power supply device 1 of the first embodiment. The power supply device 1 according to the first embodiment is configured as a multilayer laminate, and has an energy harvesting function for receiving electric waves coming from the outside and extracting power. As shown in FIG. 1, the power supply device 1 includes an antenna 10, a matching circuit 11 that matches the impedance of the antenna 10, and a rectifier circuit 12 that rectifies the output AC voltage of the matching circuit 11 and converts it into a DC voltage. Composed.

  The antenna 10 is an antenna element that has a structure mounted on a laminate and receives radio waves coming from the outside. The frequency band of the antenna 10 is not particularly limited, but is desirably a frequency band that can obtain a certain electric field strength in the use environment. For example, among radio waves in a wide frequency range of about several MHz to several GHz, the frequency band for mobile phones, the frequency band for broadcasting, and the like have strong electric field strength and are suitable for use. In addition, since the laminate on which the antenna 10 is mounted is small, it is desirable to use a small antenna element such as a chip antenna that can be mounted on the surface of the laminate or a pattern antenna that is configured using a conductor pattern of the laminate. .

  The matching circuit 11 as an input circuit is disposed between the feeding point of the antenna 10 on the input side and the node N1 on the output side, and includes a capacitor C1 and an inductor L1. Capacitor C1 is connected between the feeding point of antenna 10 and node N1, and inductor L1 is connected between one end of capacitor C1 and the ground potential. The matching circuit 11 has a role of matching the impedance of the antenna 10 and reducing the loss of the received signal transmitted from the antenna 10 to the subsequent rectifier circuit 12. The circuit configuration of the matching circuit 11 is not limited to the example of FIG. 1 and can be configured in various forms combining capacitors and inductors.

  The rectifier circuit 12 is disposed between the input-side node N1 and the output-side external terminal To, and includes two diodes D1 and D2 and a capacitor C2. The diode D1 has an anode connected to the node N1 and a cathode connected to the external terminal To. The diode D2 has an anode connected to the ground potential and a cathode connected to the node N1. The capacitor C2 is connected between the external terminal To and the ground potential. The rectifier circuit 12 has a role of inputting an AC voltage transmitted from the antenna 10 through the matching circuit 11 to the node N1 and outputting a DC voltage obtained by the rectifying action of the diodes D1 and D2 to the external terminal To. In the rectifier circuit 12, when the AC voltage at the node N1 is in a positive cycle, the capacitor C2 is charged from the node N1 via the diode D1, and a DC voltage appears at the external terminal To. The rectifier circuit 12 in FIG. 1 is an example of a half-wave rectifier circuit. However, the rectifier circuit 12 is not limited thereto, and various rectifier circuits 12 including a full-wave rectifier circuit and the like can be configured using various components. .

  The DC voltage obtained by the rectifier circuit 12 is supplied to a load (not shown) connected to the external terminal To. As a load that can be connected, for example, various electronic / electrical devices such as a portable device having a wireless communication function and a sensor terminal having no unique power source are assumed. Since the power that can be supplied by the power supply device 1 is small, the power supply 1 is effective for applications such as power supply during standby of a mobile phone or power supply to a low-power consumption independent sensor that operates periodically. When a secondary battery is mounted on an external device, the secondary battery may be charged using the power supply device 1. Thus, the power supply device 1 functions as a power generation module that supplies power to an external device.

  Next, an example of the structure of the stacked body in which the power supply device 1 of the first embodiment is configured will be described with reference to FIGS. The power supply device 1 of 1st Embodiment is comprised by the laminated body which consists of a several dielectric layer in which the conductor pattern of the circuit element was formed. 2A is a diagram showing a planar arrangement of the surface of the laminate 20 constituting the power supply device 1, and FIG. 2B is a diagram showing a cross-sectional structure of the laminate 20 in FIG. 2A. is there.

  As shown in FIG. 2A, the stacked body 20 viewed from above is divided into two regions R1 and R2 in the planar direction. In the region R1, a chip antenna 10a as the antenna 10 in FIG. 1 is arranged. In the region R2, two diodes D1 and D2 that are circuit components of the rectifier circuit 12 of FIG. 1 are arranged. For example, the stacked body 20 in FIG. 2A is formed in a rectangular shape of 30 mm × 40 mm.

  As shown in FIG. 2B, in the stacked body 20 as viewed from the side, the region R1 includes all layers that overlap in the stacking direction (direction orthogonal to the planar direction of the stacked body 20), and the region R2 is a stacked layer. It shall include all layers that overlap in the direction. In the example of FIG. 2, the circuit elements other than the chip antenna 10 a and the diodes D <b> 1 and D <b> 2 arranged on the surface of the multilayer body 20 are configured by the conductor pattern and via conductor of the inner layer region R <b> 2 a included in the region R <b> 2.

  The structural feature of the first embodiment is that at least the antenna 10 does not overlap the circuit region in the stacking direction of the stacked body 20. The region R1 is set to a range including the chip antenna 10a as the antenna 10, and includes only the ground pattern and the pattern near the feeding point in addition to the chip antenna 10a, and the circuit elements and patterns of the matching circuit 11 and the rectifier circuit 12 are included. Does not contain. On the other hand, the region R2 is a circuit region in which the matching circuit 11 and the rectifier circuit 12 are configured, and includes the diodes D1 and D2 on the surface, and the capacitors C1 and C2 and the inductor L1 in the inner layer region R2a. Therefore, since the two regions R1 and R2 are set separately in the stacking direction, the condition that at least the chip antenna 10a does not overlap the circuit region in the stacking direction is satisfied.

  The arrangement in FIG. 2 is an example, and the arrangement of the regions R1 and R2 can be freely changed as long as the above conditions are satisfied. For example, the region R1 can be set to a narrower range including the chip antenna 10a, or can be set to a wider range that does not overlap the circuit region. Further, the region R2 can be set to a narrower range including the circuit region, or can be set to a wider range that does not overlap the chip antenna 10a. Further, there are various modifications of the chip antenna 10a and the diodes D1 and D2 mounted on the surface of the multilayer body 20 in FIG.

  In the first embodiment, by arranging the antenna 10 so as not to overlap the circuit region in the stacking direction, adverse effects caused by electromagnetic interference from the circuit elements in the circuit region to the antenna 10 can be suppressed. That is, in the first embodiment, since the elements constituting the antenna 10 are spread out in a plane and the capacitor and inductor in the circuit area are mainly formed in a planar pattern, the antenna 10 and the circuit area are planar. However, when they are in different regions, the electromagnetic coupling is reduced, while when they are opposed in the stacking direction, the electromagnetic coupling is increased. As a result, if the arrangement as shown in FIG. 2 is adopted, electromagnetic coupling between the antenna 10 and the circuit area can be suppressed, and deterioration of the radiation characteristics and frequency characteristics of the antenna 10 can be prevented.

  FIG. 3 is a perspective view showing a structural example of each layer of the laminate 20 of FIG. In the laminated body 20, five dielectric layers L1 to L5 are laminated in order from the lower layer. These dielectric layers L1 to L5 are formed using, for example, ceramic. The dielectric layers L1 to L5 include ground patterns 30 and 40, a plurality of conductor patterns 31 to 39 constituting a circuit element, and a plurality of via conductors V1 penetrating in the stacking direction to connect the conductor patterns of the respective layers. ~ V6 is formed. The chip antenna 10a and the diodes D1 and D2 shown in FIG. 2 are mounted on the uppermost dielectric layer L5, and side electrodes of the external terminals To are formed. Each of the dielectric layers L1 to L5 in FIG. 3 is divided into regions R1 and R2 similar to those in FIG.

  The chip antenna 10a mounted on the uppermost dielectric layer L5 is connected to a conductor pattern 37 that is a feeding point, and the conductor pattern 37 is connected to the conductor pattern 36 of the dielectric layer L4 and the dielectric layer L3 via the via conductor V4. The conductor patterns 33 are respectively connected. The conductor pattern 36 of the dielectric layer L4 is connected to the via conductor V5, the conductor pattern 34 of the dielectric layer L3, the via conductor V3, the conductor pattern 32 of the dielectric layer L2, and the via conductor V1 in this order to constitute the inductor L1. The lower end of the via conductor V1 is connected to the ground pattern 30 that covers the entire surface of the lowermost dielectric layer L1. On the other hand, the conductor pattern 33 of the dielectric layer L3 constitutes the capacitor C1 with the conductor pattern 35 of the dielectric layer L4 arranged opposite to each other.

  The conductor pattern 35 of the dielectric layer L4 corresponds to the node N1 in FIG. 1 and is connected to the cathode of the diode D2 of the uppermost dielectric layer L5 through the via conductor V6, and further through the conductor pattern 38 of the diode D1. Also connected to the anode. The anode of the diode D2 is connected to a ground pattern 40 that covers a substantially half region of the dielectric layer L5. The cathode of the diode D1 is connected to the conductor pattern 39, and the end of the conductor pattern 39 is a side electrode of the external terminal To. The conductor pattern 39 is connected to the conductor pattern 31 of the dielectric layer L2 through the via conductor V2. The conductor pattern 31 is disposed opposite to the ground pattern 30 of the dielectric layer L1, and constitutes a capacitor C2.

  As described above, the chip antenna 10a has a positional relationship in which only the ground pattern 30 of the dielectric layer L1 overlaps in the stacking direction except for the conductor pattern 37 at the feeding point. Further, it can be seen that the ground pattern 40 exists even if the region R1 including the chip antenna 10a is extended, but there is no conductor pattern or via conductor in another circuit region. On the other hand, in the region R2, which is a circuit region, there is an inner layer region R2a including the conductor patterns 31 to 36 in addition to the diodes D1 and D2 of the dielectric layer L5, and the ground pattern 30 and 40 overlap with each other in the stacking direction. It is in.

  Here, paying attention to the ground pattern 30 of the dielectric layer L1, the ground pattern 30 is disposed to face the chip antenna 10a and the circuit region disposed in the upper layer. Therefore, the ground pattern 30 functions as a ground plate that improves the antenna characteristics of the chip antenna 10a, and also functions as a shield plate that blocks the circuit region from the outside and improves isolation. It is possible to form the ground pattern 30 on the inner dielectric layers L2 to L4. In this structure, the ground pattern 30 functions as a ground plate of the chip antenna 10a. If it exists, it will not function as a shield plate.

[Second Embodiment]
FIG. 4 shows an example of a circuit configuration of the power supply device 1 of the second embodiment. Although the basic function of the power supply device 1 of the second embodiment is the same as that of the first embodiment, the circuit configuration and structure are different. As shown in FIG. 4, the power supply device 1 according to the second embodiment rectifies the antenna 10, the transformer 13 disposed between the feeding point of the antenna 10 and the node N <b> 2, and the output AC voltage of the transformer 13. And a rectifier circuit 12a for converting to a DC voltage.

  The transformer 13 as an input circuit has a primary coil connected to the feeding point of the antenna 10 and a secondary coil connected to the node N2, and receives the reception signal of the antenna 10 from the number of turns of the primary coil and the secondary coil. It converts into the alternating voltage of the voltage amplitude according to ratio. For example, if the transformer turns ratio is 1:10, the received signal of the antenna 10 is expanded to a voltage amplitude of 10 times. One end of each of the primary coil and the secondary coil of the transformer 13 is connected to the ground.

  The rectifier circuit 12a has an input side connected to the node N2, an output side connected to the external terminal To, and includes two diodes D1 and D2 and two capacitors C2 and C3. Among these, the configurations and operations of the circuit portions of the diodes D1 and D2 and the capacitor C2 are the same as those of the rectifier circuit 12 of FIG. On the other hand, the input-side capacitor C3 is inserted between the node N2 and the connection point between the two diodes D1 and D2. Thus, when the AC voltage at the node N2 is in a negative cycle, the capacitor C3 is charged by the diode D1, and when the AC voltage at the node N2 is in a positive cycle, the charged capacitor C3 passes through the diode D2. The capacitor C2 is charged, and a DC voltage appears at the external terminal To.

  The basic function of the power supply device 1 of the second embodiment is the same as that of the first embodiment, but there is a slight difference in the usage pattern by replacing the matching circuit 11 with a transformer 13. That is, the power supply device 1 according to the second embodiment can expand the voltage amplitude by the turn ratio of the transformer 13, and is therefore suitable for use in a weak radio wave environment as compared with the first embodiment. Further, since there is a restriction on the frequency characteristics of the transformer 13, it is suitable for use in a relatively low frequency band as compared to the first embodiment.

  Next, a structural example of the stacked body 20 in which the power supply device 1 of the second embodiment is configured will be described with reference to FIG. Compared with the first embodiment, the power supply device 1 according to the second embodiment is common in that the stacked body 20 is composed of a plurality of dielectric layers, but there is a difference in area division. FIG. 5A is a diagram showing a planar arrangement of the surface of the laminate 20 constituting the power supply device 1 of the second embodiment, and FIG. 5B is a cross-sectional view of the laminate 20 in FIG. It is a figure which shows a structure.

  As shown in FIG. 5A, the stacked body 20 is divided into three regions R1, R2, and R3 in the planar direction. That is, the region R2 in which the two diodes D1 and D2 are arranged is substantially the same as that in FIG. 2, but the region R1 in FIG. 2 is further divided into two regions R1 and R3. In the region R1, a chip antenna 10a similar to the region R1 in FIG. 2 is arranged, and in the region R3, the transformer 13 in FIG. 4 is arranged. Note that the inner layer region R2a included in the region R2 has the same meaning as in FIG.

  The structural feature of the second embodiment is that at least the antenna 10 does not overlap the circuit area in the stacking direction, and the transformer 13 does not overlap the circuit area in the stacking direction. The region R3 is set to a range including the transformer 13 having a relatively large outer shape mounted on the surface of the stacked body 20, and the region R3 does not overlap with the circuit region in the stacking direction. With such an arrangement, it is possible to prevent the high-frequency characteristics of the circuit element from being deteriorated by electromagnetically coupling the primary coil and the secondary coil of the transformer 13 to the circuit element in the circuit region. The reason why the antenna 10 and the transformer 13 are arranged so as not to overlap in the stacking direction is to prevent the characteristic deterioration of the antenna 10 as described in the first embodiment.

  In the second embodiment, a structural example of each layer (FIG. 3) is omitted, but the basic structure using the conductor pattern and the via conductor is common to the first embodiment. However, in the second embodiment, it is necessary to configure the transformer 13 mounted on the uppermost dielectric layer L5 and to replace the capacitor C1 and the inductor L1 with the capacitor C3. Also in the second embodiment, the role of the ground pattern 30 covering the entire surface of the lowermost dielectric layer L1 is the same as in the first embodiment.

[Modification]
The power supply device 1 of the first and second embodiments described above has various modifications in both the circuit configuration and the structure of the stacked body 20. 6 to 8 show modified examples of the circuit configuration of the power supply device 1. As an example of the input circuit arranged between the feeding point of the antenna 10 and the input side of the rectifier circuit 12, the matching circuit 11 (FIG. 1) is used in the first embodiment, and the transformer 13 (FIG. 4) is used in the second embodiment. Although shown, it is not restricted to these, Various circuits can be connected in series and an input circuit can be comprised.

  FIG. 6 shows a first modification of the circuit configuration of the power supply device 1. In the first modification of FIG. 6, an input circuit in which a matching circuit 11 and a tuning circuit 14 are connected in series is configured between the feeding point of the antenna 10 and the node N2. The matching circuit 11 has the same configuration as in FIG. The tuning circuit 14 is composed of a parallel resonance circuit including an inductor L2 and a capacitor C4, and the parallel resonance circuit is connected between the node N2 and the ground potential. The tuning circuit 14 selectively passes a component in a predetermined frequency band in the received signal of the antenna 10. For example, when receiving radio waves in a specific frequency band such as in the vicinity of a radio tower or a base station, the circuit configuration of FIG. 6 is suitable.

  FIG. 7 shows a second modification of the circuit configuration of the power supply device 1. In the second modification example of FIG. 7, an input circuit in which the matching circuit 11 and the transformer 13 are connected in series is configured between the feeding point of the antenna 10 and the node N2. The matching circuit 11 has the same configuration as that shown in FIG. 1, and the transformer 13 has the same configuration as that shown in FIG. The circuit configuration of FIG. 7 matches the impedance of the antenna 10 by the matching circuit 11 to reduce the loss of the received signal and expands the voltage amplitude by the transformer 13, so that radio waves are received in an environment where the electric field strength is small. Is suitable.

  FIG. 8 shows a third modification of the circuit configuration of the power supply device 1. In the third modification of FIG. 8, an input circuit in which a transformer 13 and a matching circuit 11a are connected in series is configured between a feeding point of the antenna 10 and a node N2. FIG. 8 corresponds to a configuration in which the positions of the matching circuit 11 and the transformer 13 in FIG. 7 are interchanged. The transformer 13 is the same as in FIGS. 4 and 7, but the matching circuit 11a differs from FIGS. 1 and 7 in that the inductor L3 connected between the secondary coil of the transformer 13 and the node N2, and the node N2 And a capacitor C5 connected between the ground potential. Depending on the relationship between the impedance of the antenna 10, the input / output impedance of the transformer 13, and the input impedance of the rectifier circuit 12a, the circuit configuration of FIG. 8 can be employed when the loss of the entire path can be reduced. .

  6 to 8 are examples in which an input circuit is configured by connecting two circuits in series, but an input circuit may be configured by connecting more circuits in series. Further, the input circuit is not limited to the above-described circuit, and may include a filter circuit, for example. Furthermore, the circuit configuration of the power supply device 1 is not limited to the input circuit, and another circuit may be inserted between the rectifier circuit 12 and the external terminal To. For example, a filter circuit, a booster circuit, a control circuit, or the like may be inserted between the rectifier circuit 12 and the external terminal To. In this case, a part of the electric power obtained by the power supply device 1 can be supplied to an internal circuit.

  Next, FIG.9 and FIG.10 has shown the modification about the structure of the laminated body 20 with which the power supply device 1 is comprised. The laminated body 20 of the first embodiment shows the structural example of FIG. 2, and the laminated body 20 of the second embodiment shows the structural example of FIG. 5, but is not limited to these structural examples, and circuit components and arrangement are changed. can do.

  Various modifications corresponding to the laminate 20 of the first embodiment will be described with reference to FIG. As shown in FIG. 9A, the semiconductor chip 15 may be mounted in the region R2 on the surface of the stacked body 20 instead of the two diodes D1 and D2 in FIG. The semiconductor chip 15 may include the rectifier circuit 12 including the diodes D1 and D2, but may include a part or all of the input circuit and other load circuits. In the following modification, a case where the semiconductor chip 15 is mounted on the stacked body 20 will be described as an example, but the same applies to the case where the diodes D1 and D2 are mounted. As shown in FIG. 9B, the semiconductor chip 15 may be mounted not only on the surface of the stacked body 20 but also in the region R <b> 2 on the back surface of the stacked body 20.

  On the other hand, as shown in FIG. 9C, instead of the chip antenna 10 a, a pattern antenna 10 b configured by a conductor pattern on the surface of the multilayer body 20 may be used as the antenna 10. The pattern antenna 10b is configured by, for example, a meandering conductor pattern. Further, as shown in FIG. 9D, the pattern antenna 10b may be configured by a conductor pattern in the inner layer of the multilayer body 20. The pattern antenna 10b shown in FIGS. 9C and 9D is suitable for reducing the number of components mounted on the stacked body 20 and reducing the cost.

  Next, various modifications corresponding to the stacked body 20 of the second embodiment will be described with reference to FIG. FIG. 10A shows an example in which the chip antenna 10a and the transformer 13 are arranged at the same position as in FIG. 5A, and two diodes D1 and D2 are replaced with the semiconductor chip 15 similar to FIG. Note that the semiconductor chip 15 may be mounted not only on the front surface of the stacked body 20 but also in the region R2 on the back surface, as in FIG. 9B. Further, as shown in FIG. 10B, a transformer 13 may be mounted in a region R3 on the back surface of the stacked body 20. Even in this case, the chip antenna 10a and the transformer 13 are arranged so as not to overlap in the stacking direction.

  On the other hand, as shown in FIG. 10C, a pattern antenna 10b configured by a conductor pattern on the surface of the multilayer body 20 may be used as the antenna 10 as in FIG. 9C. Further, as shown in FIG. 10D, the pattern antenna 10b may be constituted by a conductor pattern in the inner layer of the multilayer body 20 as in FIG. 9D.

  In addition to the modifications shown in FIGS. 9 and 10, the laminate 20 can be formed with various structures. For example, not only one antenna 10 but also two or more antennas 10 may be arranged in the laminate 20. In this case, separate antennas 10 can be mounted on the front and back surfaces of the laminate 20 in the respective regions R1. The same applies to other components. For example, two or more transformers 13 can be mounted in the respective regions R3 on the front surface and the back surface of the laminate 20.

  As mentioned above, although the content of this invention was concretely demonstrated based on 1st and 2nd embodiment, this invention is not limited to each above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary. Can be applied. For example, the material of the laminated body 20 is not limited to ceramic, and various dielectric materials can be used, and the shape and size can be freely set. The circuit format of the power supply device 1 is not limited to that shown in FIGS. 1 and 4, and various circuit formats that realize the same function can be employed.

DESCRIPTION OF SYMBOLS 1 ... Power supply device 10 ... Antenna 10a ... Chip antenna 10b ... Pattern antenna 11, 11a ... Matching circuit 12, 12a ... Rectifier circuit 13 ... Transformer 14 ... Tuning circuit 15 ... Semiconductor chip 20 ... Laminated body 30, 40 ... Ground pattern 31- 39 ... Conductor patterns C1-C5 ... Capacitors D1, D2 ... Diodes L1, L2, L3 ... Inductors L1-L5 ... Dielectric layers R1, R2, R3 ... Area To ... External terminals V1-V6 ... Via conductors

Claims (11)

In a power supply device configured using a laminate in which insulating layers and conductor layers are alternately laminated,
An antenna that receives external radio waves,
An input circuit for receiving a reception signal of the antenna;
A rectifier circuit that rectifies the output AC voltage of the input circuit and converts it to a DC voltage;
Are each configured in the laminate,
The power supply apparatus according to claim 1, wherein the antenna does not overlap a circuit region in which the input circuit and the rectifier circuit are arranged in a stacking direction of the stacked body.   The feeding point of the antenna is connected to the input side of the input circuit, the output side of the input circuit is connected to the input side of the rectifier circuit, and the output side of the rectifier circuit is connected to an external terminal. The power supply device according to claim 1. A ground pattern is formed on a predetermined conductor layer of the laminate,
3. The power supply device according to claim 1, wherein the ground pattern is disposed to face the antenna and the circuit region on one side in a stacking direction of the stacked body.   The power supply apparatus according to claim 1, wherein the input circuit includes a matching circuit that matches the impedance of the antenna.   4. The power supply device according to claim 1, wherein the input circuit includes a transformer having a primary coil connected to the antenna and a secondary coil connected to the rectifier circuit. 5. The input circuit is
A matching circuit that matches the impedance on the input side;
A transformer having a primary coil on the input side and a secondary coil on the output side;
A tuning circuit that tunes to a predetermined frequency component of the input signal;
The power supply device according to claim 1, wherein at least two of them are connected in series.   7. The power supply device according to claim 5, wherein the transformer does not overlap a region in which the inductor and the capacitor are arranged in the circuit region in a stacking direction of the stacked body.   8. The power supply device according to claim 1, wherein an area where an inductor and a capacitor are arranged in the circuit area is configured by a conductor pattern of an inner layer of the multilayer body. 9.   The power supply apparatus according to claim 1, wherein the antenna is a chip antenna mounted on a surface of the laminate.   The power supply device according to claim 9, wherein the chip antenna and an electronic component included in the rectifier circuit are mounted on a surface of the stacked body. The power supply apparatus according to claim 1, wherein the antenna is configured by a conductor pattern in an inner layer of the multilayer body.

Images