JP2011247908A - Maintenance method of positioning device and positioning device of ic handler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC handler that can prevent occurrence of inspection failure due to wear of a guide pin and a guide hole by grasping a wear state of the guide pin and the guide hole in the IC handler that conducts position adjustment by engaging the guide pin and the guide hole when an IC chip is mounted on an inspection socket.SOLUTION: The guide hole 59 is provided to a guide block 54, and the guide pin 69 to be engaged with the guide hole 59 is provided on a tester base 68. An insulation layer 60 is provided to an inner circumferential surface 59a of the guide hole 59. A wear detection device 80 is prepared for measuring a resistance between the guide block 54 and tester base 68 in a state where the guide pin 69 is inserted into the guide hole 59. The wear detection device 80 lights a warning lamp 81 based on a change in the resistance between the guide block 54 and tester base 68. The wear state of the insulation layer 60 can be grasped by the lighting of the warning lamp 81.

Description

  The present invention relates to a positioning apparatus maintenance method and an IC handler positioning apparatus.

  Electronic parts such as semiconductor devices are inspected by an IC inspection apparatus before shipment. The IC inspection apparatus is also called an IC handler, and the IC handler is provided with a measurement robot. The measuring robot holds an electronic component by vacuum suction with a suction pad, and attaches it to a test socket of a tester. At this time, the electronic component is mounted on the inspection socket while being pressed with a predetermined force, and the terminal provided on the electronic component and the terminal provided on the inspection socket are electrically connected to perform inspection. When the inspection is completed by the tester, the measurement robot vacuum-sucks the electronic component mounted on the inspection socket, removes it from the inspection socket, and places the electronic component on a collection tray corresponding to the inspection result.

  By the way, the inspection of the electronic component cannot be performed unless the terminals provided on the electronic component and the inspection socket are electrically connected. Therefore, the terminal of the electronic component and the terminal of the inspection socket must be accurately connected. Therefore, it is desirable to mount the electronic component after adjusting its position with high accuracy with respect to the socket for inspection. However, if the position is adjusted with higher accuracy, the inspection cannot be performed efficiently.

  Therefore, in consideration of inspection efficiency and position adjustment accuracy, a method of adjusting the position of the electronic component with respect to the inspection socket by providing a guide pin on one side and a guide hole on the other side and engaging them is devised. (For example, Patent Document 1). Furthermore, a device has been devised in which a slit is provided in the guide hole to adjust the position with higher accuracy (for example, Patent Document 2).

Japanese Patent Laid-Open No. 10-185993 Japanese Patent Laid-Open No. 5-41599

  However, in the methods of Patent Document 1 and Patent Document 2, when the guide hole and the guide pin are repeatedly engaged, one of them wears and wears down. Accordingly, when the guide pin and the guide hole are engaged with each other, the gap between the guide pin and the guide hole is increased. This gap makes it impossible to perform position adjustment with high accuracy as before wear.

  Therefore, if the wear further progresses, the terminals of the electronic component and the terminals of the inspection socket cannot be electrically connected, and the inspection cannot be performed. Since the methods of Patent Document 1 and Patent Document 2 do not include a confirmation means for confirming the wear state of the guide pins and the guide holes, the work of confirming the wear state requires a great deal of labor.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an IC handler that performs position adjustment when an electronic component is mounted on an inspection socket by engaging a guide pin and a guide hole. It is an object of the present invention to provide an IC handler capable of grasping the wear state between the guide pin and the guide hole and preventing an inspection failure due to wear.

  A maintenance method for a positioning device according to the present invention includes a gripping member that grips an electronic component, and a receiving member that includes a storage portion that stores the electronic component, and guides either one of the gripping member or the receiving member. A hole is provided, and the other is provided with a slidable guide pin that is inserted into the guide hole. When the electronic component held by the holding member is disposed in the housing portion, the guide pin is inserted into the guide hole. A positioning device maintenance method for positioning an electronic component gripped by the gripping member with respect to the housing portion by bringing the receiving member and the gripping member close to each other while being in sliding contact with the guide hole. An electrical resistance film is formed on either the inner peripheral surface or the outer peripheral surface of the guide pin, and when the guide pin is inserted into the guide hole, the inner peripheral surface of the guide hole Based on the electrical resistance between the outer peripheral surface of serial guide pin, and detects wear of the electrically resistive film.

  According to the maintenance method of the positioning device of the present invention, the electrical resistance film is worn by the guide hole and the guide pin being repeatedly inserted and slidably contacted. Due to this wear, the inner peripheral surface of the guide hole and the outer peripheral surface of the guide pin are electrically short-circuited, that is, the electric resistance value between the guide member and the guide pin is reduced.

Due to this change in electrical resistance, the wear state between the guide hole and the guide pin can be grasped, and the replacement time and the like can be predicted.
An IC handler positioning device according to the present invention includes a gripping member that grips an electronic component, and a receiving member that includes a storage portion that stores the electronic component, and guides either one of the gripping member or the receiving member. A hole is provided, and a guide pin that is slidable through the guide hole is provided on the other side. When the electronic component gripped by the gripping member is disposed in the housing portion, the guide pin is inserted into the guide hole. An IC handler positioning device that positions an electronic component gripped by the gripping member with respect to the housing portion by bringing the receiving member and the gripping member close to each other while being in sliding contact with the guide hole. An electric resistance film formed on either the inner peripheral surface or the outer peripheral surface of the guide pin, and a measuring means for measuring the electric resistance between the inner peripheral surface of the guide hole and the outer peripheral surface of the guide pin; The is characterized in that provided.

  According to the IC handler positioning apparatus of the present invention, the guide hole and the guide pin are repeatedly inserted and slid to contact each other, whereby the electric resistance film is worn. Due to this wear, the inner peripheral surface of the guide hole and the outer peripheral surface of the guide pin come into direct contact. At this time, the inner peripheral surface of the guide hole and the outer peripheral surface of the guide pin are electrically short-circuited, that is, the electrical resistance value between the guide member and the guide pin is reduced.

  Therefore, for example, when the electrical resistance value becomes smaller than a predetermined electrical resistance value, if the alarm lamp is turned on to clearly indicate that the electrical resistance film is worn, the positioning accuracy of the electronic component is reduced. It is easy to know that it is present, and it is possible to inform the replacement time in advance.

In the IC handler positioning apparatus, the housing portion may be an inspection socket that performs an electrical inspection by contacting a terminal of an electronic component.
According to this IC handler positioning device, the electronic component can be inserted into the inspection socket to inspect the quality of the electronic component.

In the IC handler positioning apparatus, the electrical resistance film may be an electrical insulator.
According to this IC handler positioning device, when the electric resistance film is worn, the inner peripheral surface of the guide hole and the outer peripheral surface of the guide pin are in direct contact with each other, and the electric resistance value is reduced by short-circuiting. Therefore, the measuring means can detect that the electric resistance film is worn by detecting that the electric resistance value has become smaller than a predetermined electric resistance value.

In the IC handler positioning device, the electric resistance film may be provided on an inner peripheral surface of the guide hole.
According to this IC handler positioning device, since the electric resistance film is provided on the inner peripheral surface of the guide hole, the thickness of the electric resistance film can be formed with high accuracy. For example, after the electrical resistance film is formed on the inner peripheral surface of the guide hole, the thickness of the electrical resistance film can be adjusted using a tool such as a drill so as to have a predetermined inner diameter. Therefore, it can be manufactured more efficiently than adjusting the thickness of the electric resistance film formed on the guide pin. As a result, the cost of the IC handler can be reduced.

The top view which shows the whole structure of an IC handler. The perspective view for demonstrating the measurement robot with which the IC handler was equipped. (A) Cross-sectional view of the pressing device of the measuring robot and the inspection socket (b) Cross-sectional view when the IC chip is mounted on the inspection socket. (A) Schematic diagram when the guide pin is inserted into the guide hole provided with the insulating layer (b) Schematic diagram when the guide pin is inserted into the guide hole where the insulating layer is worn.

  Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the configuration of the IC handler. The IC handler 10 includes a base 11, a safety cover 12, a high temperature chamber 13, a supply robot 14, a collection robot 15, a first slide table 16, a second slide table 17, and a plurality of conveyors C1 to C6.

  The base 11 has the elements mounted on the upper surface thereof. The safety cover 12 surrounds a large area of the base 11 and is supplied with dry air. Further, in the safety cover 12, the supply robot 14, the recovery robot 15, the first slide table 16 and the second slide table 17 are accommodated.

  The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 11 such that one end thereof is located outside the safety cover 12 and the other end is located within the safety cover 12. Each of the conveyors C1 to C6 conveys the tray 18 containing a plurality of IC chips T as electronic components from the outside of the safety cover 12 into the safety cover 12, or conversely, moves the tray 18 into the safety cover 12. To the outside of the safety cover 12.

  The supply robot 14 includes an X-axis frame FX and a first Y-axis frame FY1. The collection robot 15 includes the X-axis frame FX and the second Y-axis frame FY2. The X-axis frame FX is disposed in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged so as to be parallel to each other along the Y direction, and are supported so as to be movable in the X direction with respect to the X-axis frame FX. . The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

  On the lower side of the first Y-axis frame FY1, the supply-side robot hand unit 20 is supported so as to be movable in the Y direction. The supply-side robot hand unit 20 is reciprocated in the Y direction along the first Y-axis frame FY1 by a motor (not shown) provided on the first Y-axis frame FY1. Then, the supply-side robot hand unit 20 supplies, for example, the IC chip T before inspection accommodated in the tray 18 of the conveyor C1 to the first slide table 16, for example.

  A collection-side robot hand unit 21 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The collection-side robot hand unit 21 reciprocates in the Y direction along the second Y-axis frame FY2 by a motor (not shown) provided on the second Y-axis frame FY2. Then, the collection-side robot hand unit 21 supplies, for example, the inspected IC chip T supplied to the second slide table 17 to, for example, the tray 18 of the conveyor C6.

  Two rails 22 are fixed on the upper surface of the base 11 between the supply robot 14 and the collection robot 15. One rail 22 is provided with a first slide table 16 that can reciprocate in the X-axis direction, and the other rail 22 is provided with a second slide table 17 that can reciprocate in the X-axis direction.

  A measuring robot 25 constituting a positioning device is provided in the high temperature chamber 13. The measuring robot 25 includes, for example, an inspection socket 65 (FIG. 3) as an accommodating portion provided in the tester 64 provided between the pair of rails 22 with the IC chip T before inspection supplied to the first slide table 16. To be attached). The IC chip T mounted in the inspection socket 65 is subjected to electrical inspection (hereinafter simply referred to as inspection). Further, the measurement robot 25 supplies the IC chip T after completion of the inspection mounted on the inspection socket 65 to, for example, the second slide table 17.

  FIG. 2 is an overall perspective view of the measurement robot 25, and the measurement robot 25 includes a measurement robot side wall 30. The measurement robot side wall 30 is provided so as to be reciprocally movable in the Y direction with respect to the robot body by a Y-axis motor (not shown) provided in the robot body of the measurement robot 25.

  A Z-axis motor MZ as a moving means is fixed to the measurement robot side wall 30. The Z-axis motor MZ includes an encoder SE1, and the rotation speed, rotation position, and rotation direction of the Z-axis motor MZ are detected by a detection signal from the encoder SE1.

  A ball screw 31 extending in the Z direction (vertical direction) is rotatably supported by a pair of upper and lower bearings 32 at a position adjacent to the Z-axis motor MZ on the measurement robot side wall 30. A driven pulley 33 is fixed to a portion of the ball screw 31 that protrudes from the bearing 32. The driven pulley 33 is drivingly connected to a driving pulley 35 fixed to the rotating shaft of the Z-axis motor MZ via a connecting belt 34. Therefore, when the Z-axis motor MZ rotates forward and backward, the ball screw 31 rotates forward and backward via the drive pulley 35, the connecting belt 34, and the driven pulley 33.

  A guide rail 36 extending in the Z direction (vertical direction) is fixed between the Z-axis motor MZ and the ball screw 31 on the measurement robot side wall 30. The guide rail 36 is provided with a carriage 37 movably provided along the guide rail 36, and the carriage 37 is provided with a connecting member 38. The connecting member 38 is provided with a screwing portion 38a in which a female screw into which the ball screw 31 is screwed is formed. Therefore, when the ball screw 31 rotates in the forward and reverse directions, the connecting member 38 (carriage 37) that is screwed with the ball screw 31 can move along the guide rail 36, so that the contact arm 39 reciprocates in the Z direction (vertical direction). To do.

  A contact arm 39 is connected and fixed to the connecting member 38. The contact arm 39 extends in the anti-X direction (forward) from the connecting member 38, and a compliance unit CU is provided on the lower surface thereof.

  The compliance unit CU includes a pressing device 40. The pressing device 40 holds (sucks and holds) the IC chip T and presses it against the inspection socket 65 provided on the tester base 68 (see FIG. 3A), and is fixed to the lower surface of the contact arm 39. Has been.

The compliance unit CU is detachably connected to the contact arm 39, and can be appropriately replaced according to the number and arrangement of the IC chips T to be inspected.
Next, the pressing device 40 will be described with reference to FIG.

  In FIG. 3A, the pressing device 40 includes an air cylinder SL fixed to the connection base 41 and a device chuck DC connected to the tip of the air cylinder SL.

  In the air cylinder SL, the base end portion of the cylinder tube 42 is fixed to the connection base 41. The cylinder tube 42 includes a bottomed cylindrical tube main body 42a and a front plate 42b that closes the opening of the tube main body 42a, and a piston 43 as an operating body in a cylinder chamber formed by the tube main body 42a and the front plate 42b. Are arranged so as to be movable in the Z direction (vertical direction). Therefore, the cylinder chamber and the piston 43 are partitioned into a first chamber a on the upper side and a second chamber b on the lower side.

  The piston 43 is lifted upward by a spring SP as an elastic member, and a position where the surface of the piston 43 on the first chamber a side comes into contact with the bottom surface of the tube main body 42a shown in FIG. It is located at the upper end position).

  An air introduction port 44 is formed at the end of the tube main body 42a on the first chamber a side, and the first connection port P1 is attached to the air introduction port 44. The first connection port P1 is connected to an electropneumatic regulator (not shown) via an air supply pipe (not shown). Then, when air is supplied from the electropneumatic regulator to the first chamber a, the piston 43 is elasticated by the spring SP of the device chuck DC from the uppermost position where the piston 43 abuts against the bottom surface of the tube main body 42a. It moves downward against the force.

  Incidentally, the stroke amount of the piston 43 is the position at which the lower surface of the piston 43 abuts against the inner surface of the front plate 42b from the time when the piston 43 is at the uppermost position shown by the solid line in FIG. Up to the distance, that is, the distance in the vertical direction of the second chamber b shown in FIG.

  The device chuck DC includes a connection block 51, and a connection recess 51a formed on the upper surface thereof is connected and fixed to the piston 43 and a screw N through a through hole formed in the front plate 42b. Therefore, the connection block 51 (device chuck DC) moves in the vertical direction together with the piston 43.

  A spring SP is connected between the connection block 51 and the connection base 41. That is, the connection block 51 is elastically suspended from the connection base 41 via the spring SP. In this embodiment, the spring SP pushes up the piston 43 via the connecting block 51 so that the piston 43 is positioned at the uppermost end position. When air is supplied to the first chamber a, the pressure causes the piston 43 to move downward against the elastic force of the spring SP, eventually reaching the lowermost position and hitting the front plate 42b. The downward movement is restricted.

  The connecting block 51 is recessed at the center of the lower surface, and a vacuum guide path 52 is formed by forming a through hole from the recessed position toward the outer surface. A second connection port P <b> 2 is attached to the vacuum guide path 52 on the outer side surface of the connection block 51. The second connection port P2 communicates with a pneumatic device (not shown). The pneumatic device places the suction pipe 55 in a negative pressure state or an atmospheric pressure state via the second connection port P2.

An intermediate block 53 is connected and fixed to the lower side of the connection block 51, and a guide block 54 as a holding member is connected and fixed to the lower side of the intermediate block 53.
In the central position between the intermediate block 53 and the guide block 54, a receiving hole communicating with the vacuum guide path 52 formed in the connecting block 51 is formed so as to penetrate therethrough, and a suction pipe 55 is disposed in the receiving hole.

  A suction pad 56 is connected and fixed to the tip of the suction pipe 55. Then, by bringing the suction pipe 55 into a negative pressure state, the suction pad 56 sucks and holds the IC chip T as shown in FIG. On the other hand, by releasing the negative pressure in the suction pipe 55, the suction pad 56 places the IC chip T held by suction in the test socket 65 provided on the tester base 68 of the tester 64, for example.

  Further, the guide block 54 is provided with cylindrical guide holes 59 penetratingly formed at predetermined positions (in this embodiment, two locations). The guide hole 59 is a through hole used for positioning the IC chip T (guide block 54) held by the suction pad 56 with respect to the inspection socket 65 (tester base 68) of the tester 64. The guide hole 59 is provided with a taper that increases the lower opening area at the lower opening, and the inner peripheral surface 59a of the guide hole 59 is made of an electrical insulator (for example, polyetheretherketone resin). An insulating layer 60 as an electric resistance film is formed with a uniform thickness.

The guide block 54 is a conductor, and is electrically insulated from peripheral components (for example, the intermediate block 53).
The tester 64 includes a tester base 68, an inspection socket 65, and a guide pin 69.

  The tester base 68 is made of a conductor that is insulated from surrounding components, and is provided with an inspection socket 65. The inspection socket 65 is provided with as many spring pins 62 having contact portions 61 at the upper end as the number of terminals Ta of the IC chip T. The spring pin 62 moves up and down with a predetermined stroke with respect to the inspection socket 65. Then, as shown in FIG. 3B, when the IC chip T is pushed down, each terminal Ta of the IC chip T comes into contact with the corresponding contact portion 61 from above and pushes down the spring pin 62 downward. As a result, each terminal Ta of the IC chip T and the contact portion 61 of the inspection socket 65 are in electrical contact with each other for inspection. Accordingly, since the IC chip T cannot be inspected unless it is accurately placed in the inspection socket 65, the IC chip T is arranged in the inspection socket 65 by adjusting the position.

  As shown in FIG. 3A, the tester base 68 is formed with guide pins 69 that are inserted into the guide holes 59 formed in the guide block 54 and are slidable. That is, the guide block 54 is lowered while the guide pin 69 provided on the tester base 68 is inserted into the guide hole 59 of the guide block 54, whereby the guide block 54 (IC chip T) is moved to the tester base 68 (inspection socket 65). ).

  The guide pin 69 is made of a cylindrical conductive metal body, slides in the axial direction relative to the guide hole 59 and moves relative to the guide hole 59, and has a substantially hemispherical shape so that its tip portion can be easily inserted into the guide hole 59. It is formed in a shape.

  When the guide hole 59 and the guide pin 69 are sliding, the insulating layer 60 is worn. Further, the guide hole 59 and the guide pin 69 are inserted into the guide pin 69 through the guide hole 69 to adjust the position of the IC chip T even when the insulating layer 60 is no longer worn. It is formed so that it can be done.

  As shown in FIG. 4, lead terminals of the wear detecting device 80 are connected to the guide block 54 and the tester base 68, respectively. In the present embodiment, the wear detection device 80 is an electrical resistance measuring device, and the electrical resistance value (between the guide block 54 and the tester base 68 in a state where the guide pin 69 is inserted into the guide hole 59 ( Hereinafter, it is simply referred to as a resistance value). That is, as shown in FIG. 4A, when the insulating layer 60 in the guide hole 59 is not worn, the insulating layer 60 provides a high resistance value between the guide block 54 and the tester base 68. On the contrary, as shown in FIG. 4B, when the insulating layer 60 of the guide hole 59 is worn, the guide pin 69 is in direct contact with the guide block 54. In the meantime, the resistance value is low.

  When the wear detecting device 80 detects that the insulating layer 60 of the guide hole 59 is worn and the resistance between the guide block 54 and the tester base 68 is low, the alarm lamp 81 is turned on. Yes. Therefore, when the alarm lamp 81 is turned on, the insulating layer 60 of the guide hole 59 is worn, and the guide block 54 (IC chip) cannot be accurately adjusted with respect to the tester base 68 (inspection socket 65). I can know that.

According to the above embodiment, the following effects can be obtained.
(1) According to the above embodiment, the insulating layer 60 is provided on the inner peripheral surface 59 a of the guide hole 59. The insulating layer 60 is worn when the guide hole 59 and the guide pin 69 slide. Further, a wear detecting device 80 for detecting a resistance value between the tester base 68 and the guide block 54 is provided. As shown in FIG. 4B, when the insulating layer 60 is worn, the inner peripheral surface 59a of the guide hole 59 and the guide pin 69 are in direct contact with each other, so that a short circuit occurs between the guide block 54 and the tester base 68. When the interval becomes a low resistance value, the wear detection device 80 detects that the resistance value has become low, and turns on the alarm lamp 81.

Accordingly, the lighting of the alarm lamp 81 indicates that the guide block 54 (IC chip T) is not accurately adjusted with respect to the tester base 68 (inspection socket 65), that is, the positioning accuracy is lowered. You can easily know what you are doing.
(2) According to the above embodiment, the guide hole 59 and the guide pin 69 are formed so that the IC chip T can be inspected even when the insulating layer 60 is no longer worn. Therefore, as shown in FIG. 4B, the IC chip T can be continuously inspected even when the insulating layer 60 is not worn. As a result, it is possible to prevent an inspection failure due to the displacement of the IC chip T and to inspect the IC chip T efficiently and reliably.

In addition, you may change the said embodiment as follows.
In the above embodiment, the insulating layer 60 is provided as the electric resistance film. However, the electric resistance film may be formed using a conductor having a high resistance value. According to this, the resistance value between the guide block 54 and the tester base 68 decreases as the electric resistance film wears, that is, as the thickness of the electric resistance film decreases. Then, when the resistance value between the guide block 54 and the tester base 68 becomes smaller than a predetermined resistance value, the wear detection device 80 may light the alarm lamp 81.
In the above embodiment, the insulating layer 60 is provided on the inner peripheral surface 59a of the guide hole 59. However, the present invention is not limited thereto, and the insulating layer 60 may be provided on the outer peripheral surface of the guide pin 69. At this time, the guide pins 69 are preferably fixed to the tester base 68 using screws or the like and can be appropriately replaced.
In the above embodiment, the guide hole 59 is provided in the guide block 54, and the guide pin 69 is provided in the tester base 68. However, the guide hole 59 may be provided in the tester base 68 and the guide pin 69 may be provided in the guide block 54.
In the above embodiment, the wear state of the insulating layer 60 can be confirmed by measuring the resistance value between the guide block 54 and the tester base 68. However, the wear state may be confirmed based on the current value between the guide block 54 and the tester base 68.
In the above-described embodiment, the guide block 54 can suck and hold one IC chip T by vacuum. However, the present invention is not limited to this, and a plurality of IC chips T may be vacuum-sucked on the guide block 54 and embodied. At this time, the positions and numbers of the inspection socket 65, the guide hole 59, and the guide pins 69 may be changed as appropriate.
In the above embodiment, one compliance unit CU is provided on the contact arm 39. Not limited to this, the contact arm 39 may be provided with a plurality of compliance units CU. At this time, the positions and numbers of the inspection socket 65, the guide hole 59, and the guide pins 69 may be changed as appropriate.
In the above embodiment, the alarm lamp 81 is used to clearly indicate that the insulating layer 60 is worn. However, the present invention is not limited to this, and an alarm signal may be transmitted to the alarm buzzer or the controller of the IC handler to stop the apparatus.

  DESCRIPTION OF SYMBOLS 10 ... IC handler, 14 ... Supply robot, 15 ... Collection | recovery robot 15, 16 ... 1st slide table, 17 ... 2nd slide table, 25 ... Measuring robot, 54 ... Guide block, 59 ... Guide hole, 59a ... Guide hole 59 60 ... Insulating layer, 64 ... Tester, 65 ... Inspection socket, 68 ... Tester base, 69 ... Guide pin, 80 ... Wear detector, 81 ... Alarm lamp, CU ... Compliance unit, DC ... Device chuck , T ... IC chip, Ta ... terminal.

Claims (5)

A gripping member for gripping an electronic component;
A receiving member having an accommodating portion for accommodating an electronic component,
A guide hole is provided in one of the gripping member and the receiving member, and a guide pin that is slidably inserted into the guide hole is provided in the other.
When the electronic component gripped by the gripping member is disposed in the housing portion, the receiving member and the gripping member are brought close to each other while the guide pin is inserted and slidably contacted with the guide hole. A positioning device maintenance method for positioning a gripped electronic component with respect to the housing portion,
An electrical resistance film is formed on either the inner peripheral surface of the guide hole or the outer peripheral surface of the guide pin, and when the guide pin is inserted into the guide hole, the inner peripheral surface of the guide hole and the guide pin A positioning device maintenance method, comprising: detecting wear of the electric resistance film based on an electric resistance between the guide pin and an outer peripheral surface of the guide pin. A gripping member for gripping an electronic component;
A receiving member having an accommodating portion for accommodating an electronic component,
A guide hole is provided in one of the gripping member and the receiving member, and a guide pin that is slidably inserted into the guide hole is provided in the other.
When the electronic component gripped by the gripping member is disposed in the housing portion, the receiving member and the gripping member are brought close to each other while the guide pin is inserted and slidably contacted with the guide hole. An IC handler positioning device for positioning a gripped electronic component with respect to the housing portion,
An electric resistance film formed on either the inner peripheral surface of the guide hole or the outer peripheral surface of the guide pin;
Measuring means for measuring electrical resistance between the inner peripheral surface of the guide hole and the outer peripheral surface of the guide pin;
An IC handler positioning device characterized by comprising: An IC handler positioning device according to claim 2, comprising:
The IC handler positioning device, wherein the housing portion is an inspection socket that performs electrical inspection by contact of terminals of an electronic component. An IC handler positioning device according to any one of claims 2 to 3,
An IC handler positioning device, wherein the electric resistance film is an electrical insulator. An IC handler positioning device according to any one of claims 2 to 4,
The IC handler positioning device, wherein the electric resistance film is provided on an inner peripheral surface of the guide hole.

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