JP2011139076A - Coat/development module accompanying common distribution - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus which distributes fluid in semiconductor substrate processing operation. <P>SOLUTION: The apparatus includes a center fluid distribution bank which has a plurality of distribution nozzles combined to a plurality of fluid sources and a first processing chamber which is positioned on a first side of a center fluid distribution bank. Moreover, the apparatus includes a second processing chamber which is located on a second side of the center fluid distribution bank and a distribution arm which translates between the center fluid distribution bank, the first processing chamber, and the second processing chamber in parallel. The apparatus, further, includes a distribution arm access shutter which is positioned between the first processing chamber and second processing chamber. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  [0001] The present invention relates generally to the field of semiconductor processing equipment. In particular, the present invention relates to a method and apparatus for dispensing fluid onto a semiconductor substrate. By way of example only, the method and apparatus have been applied to two processing chambers in a coat / develop module that share a central fluid distribution bank. However, it goes without saying that the present invention has many broad applicability.

  [0002] Part of the process of forming an electronic device is typically performed within a multi-chamber processing system (eg, a cluster tool) that has the ability to continuously process substrates (eg, semiconductor wafers) in a controlled processing environment. . A typical cluster tool used to deposit (ie, coat) and develop a photoresist material and commonly known as a track lithography tool includes a main frame, which includes a pod / cassette mounting device and a main frame. A plurality of substrate transfer robots for transferring a substrate to and from a plurality of processing chambers connected to the frame are accommodated. Cluster tools are often used to process substrates in a repeatable manner within a controlled processing environment. A controlled processing environment has many advantages, including minimizing contamination of the substrate surface during transport and completion of various substrate processing steps. Thus, processing in a controlled environment reduces the number of defects formed and increases device yield.

  [0003] Two types of processing chambers commonly included in track lithography tools are substrate coating modules and substrate development modules, sometimes collectively referred to as coat / development modules. Generally, in a coat module, a spin coating process is used to form a photoresist layer or other coating layer on the top surface of a substrate. One method mounts the substrate on a spin chuck that is rotated up to thousands of revolutions per minute (RPM). A few millimeters of liquid (eg, photoresist) is applied to the central region of the substrate, and the spin chuck's rotational motion distributes the liquid over the surface of the substrate. In a subsequent step, the coating is processed to form features on the substrate as is well known to those skilled in the art. In the development module, a developer is applied to the surface of the substrate after the exposure of the photoresist. The coat / develop module has a number of similarities and differences, including different nozzle structures corresponding to various viscosities of the dispensing fluid, although there are other factors.

  [0004] In some known coating / development modules, a single spin ball is attached to the system to dispense photoresist or other coating liquid. In some photoresist coating applications, it is desirable to supply many different coating agents including different thicknesses and materials. In particular, the number of different coating liquids increased with the production shift to 300 mm substrates. Thus, in some coat / develop modules, particularly photoresist coat modules, the dispensing system may include a number of different dispensing nozzles that dispense different photoresists. Also, many other dispensing nozzles that supply photoresist with various concentrations of solution and solvent may be included.

  [0005] In some coat / develop modules, the dispensing nozzle is manufactured with precise tolerances according to the tolerances associated with a particular semiconductor process. As a result of the number and quality of dispensing nozzles in some of these modules, the cost of the dispensing system may be significantly greater than the cost of the spinball.

  [0006] Generally, coat / development applications rotate a substrate to obtain a predetermined rotational speed to dispense a coating fluid, and then continue to rotate the substrate for a predetermined period of time after the dispensing step is completed. . As previously mentioned, the rotation of the substrate is utilized to disperse the coating fluid over the surface of the substrate. In these processes, the dispensing system is not active while the substrate rotation dispenses the resist. Thus, in some distribution systems, the most expensive system components, i.e. the components contained within the distribution device, are idle for a significant portion of the processing time.

  [0007] Other already known court modules use multiple spin balls. One example of a coating apparatus in which two spin chucks are arranged in one casing is described in US Pat. No. 5,250,114. The wafer is loaded and unloaded with respect to the spin chuck by one robot arranged outside the casing. One resist nozzle for dispensing resist liquid is attached to a nozzle arm attached to an endless belt surrounding the two rollers. The endless belt is driven by a motor. Through the use of a motor and endless belt, the nozzle arm can handle both spin chucks.

  [0008] The system shown in US Pat. No. 5,205,114 has several problems. First, the system includes only one resist nozzle that dispenses one resist. Thus, the system does not supply a number of different coating agents, including coatings made of different materials. Second, the only separator provided between the spin chuck and other items contained in the casing is a cup that surrounds each spin chuck. The cup is raised to a predetermined position during coating. This cup structure may provide some containment for liquid particles scattered from the wafer surface, but the atmosphere in the vicinity of the wafer is not controlled by this structure. As a result, suspended particles and solvent mist move freely from one spin chuck to the other, or move freely from a standby trench where one nozzle is waiting to one of the wafers.

  Accordingly, there is a need in the art for an improved coat / develop module and an improved method of operating the coat / develop module.

  [0010] According to the present invention, techniques related to the field of semiconductor processing equipment are provided. In particular, the present invention includes a method and apparatus for dispensing fluid onto a semiconductor substrate. By way of example only, the method and apparatus have been applied to two processing chambers in a coat / develop module that share a central fluid distribution bank. However, it goes without saying that the present invention has many broad applicability.

  [0011] In certain embodiments of the invention, an apparatus for dispensing fluid during a semiconductor substrate processing operation is provided. The apparatus includes a central fluid distribution bank comprising a plurality of distribution nozzles coupled to a plurality of fluid sources, and a first processing chamber located on a first side of the central fluid distribution bank. The apparatus also translates between a second processing chamber located on the second side of the central fluid distribution bank, and between the central fluid distribution bank, the first processing chamber, and the second processing chamber. And a dispensing arm.

  [0012] In another embodiment of the invention, an apparatus comprising a central fluid distribution bank including a plurality of distribution nozzles, a first processing chamber and a second processing chamber, and a distribution arm is used on a semiconductor substrate. A method of dispensing fluid to The method includes selecting a first distribution nozzle from a plurality of distribution nozzles and moving the distribution arm to a first position in the first processing chamber. The method also includes dispensing the first fluid from the first dispensing nozzle and returning the dispensing arm to a second position above the central fluid dispensing bank.

  [0013] In yet another particular embodiment, an apparatus for dispensing fluid during a semiconductor processing operation is provided. The apparatus includes a central fluid distribution bank comprising a plurality of distribution nozzles coupled to a plurality of fluid sources, a first processing chamber located on a first side of the central fluid distribution bank, the central fluid distribution bank, and the first. And a first dispensing arm adapted to translate to and from one processing chamber. The apparatus also includes a second processing chamber located on the second side of the central fluid distribution bank and a second distribution adapted to translate between the central fluid distribution bank and the second processing chamber. Includes an arm.

  [0014] In an alternative embodiment of the present invention, a track lithography tool is provided. The track lithography tool includes a front end module adapted to receive a FOUP containing a plurality of substrates, a central module with a plurality of processing tools, and a rear module coupled to the scanner. The track lithography tool also includes at least one robot adapted to receive a substrate from the front end module and supply the substrate to either the processing tool and / or the rear module, of the plurality of processing tools. One is an apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid distribution bank comprising a plurality of distribution nozzles coupled to a plurality of fluid sources, a first processing chamber located on a first side of the central fluid distribution bank, and a first number of central fluid distribution banks. A second processing chamber located on the second side, a central fluid distribution bank and a distribution arm adapted to translate between the first processing chamber and the second processing chamber.

  [0015] Many advantages are achieved with the present invention over the prior art. For example, according to the present technology, several common components can be shared, thereby reducing system cost, complexity, and footprint. Embodiments of the present invention also increase system reliability while reducing the number of redundant systems provided for each processing chamber. These and other advantages are described in more detail throughout the specification, particularly in the following.

  [0016] These and other embodiments of the present invention, as well as many of its advantages and features, will be described in further detail in conjunction with the following text and accompanying drawings.

1 is a simplified perspective view of a fluid dispensing device according to an embodiment of the present invention. FIG. FIG. 6 is a simplified perspective view of a fluid dispensing apparatus according to another embodiment of the present invention. 1 is a simplified schematic plan view of a fluid dispensing device according to an embodiment of the present invention. FIG. FIG. 2 is a simplified schematic plan view of a fluid dispensing device in a first mode of operation according to an embodiment of the present invention. FIG. 6 is a simplified schematic plan view of a fluid dispensing device in a second mode of operation according to another embodiment of the present invention. 6 is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to an embodiment of the present invention. 6 is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to another embodiment of the present invention. 6 is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to yet another embodiment of the present invention. FIG. 6 is a simplified schematic plan view of a fluid dispensing apparatus according to another embodiment of the present invention. 1 is a plan view of one embodiment of a track lithography tool illustrating many aspects of the present invention. FIG. FIG. 6 is a simplified timing diagram illustrating the operation of a fluid dispensing apparatus according to an embodiment of the present invention.

  [0028] According to the present invention, techniques related to the field of semiconductor processing equipment are provided. In particular, the present invention includes a method and apparatus for dispensing fluid over a semiconductor substrate. By way of example only, the method and apparatus have been applied to two processing chambers in a coat / developer module that share a central fluid distribution bank. However, it goes without saying that the present invention has a very wide range of applications.

  [0029] FIG. 7 is a plan view of one embodiment of a track lithography tool 710 illustrating a number of aspects of the invention that can be used to advantage. One embodiment of track lithography 710 shown in FIG. 7 includes a front end module (sometimes referred to as a factory interface) 750, a central module 850, and a rear module (sometimes referred to as a scanner interface) 900. Including. The front end module 750 generally includes one or more pod assemblies or FOUPs 805 (eg, items 805A-D), a front end robot 808, and a front end processing rack 752. The central module 850 generally includes a first central processing rack 852, a second central processing rack 854, and a central robot 807. The rear module 900 generally includes a rear processing rack 902 and a back end robot 809. In one embodiment, the track lithography tool 710 includes a front end robot 808 adapted to access processing modules in the front end processing rack 752; a front end processing rack 752, a first central processing rack 852, a second A central robot 807 adapted to access the processing modules in the central processing rack 854 and / or the rear processing rack 902; and access to the processing modules in the rear processing rack 902 and possibly a stepper / scanner 705 A back-end robot 809 adapted to exchange substrates between them. In one embodiment, the shuttle robot 810 is a substrate between two or more adjacent processing modules held in one or more processing racks (eg, front-end processing rack 752, first central processing rack 852, etc.). Is to be handed over. In one embodiment, a front end housing 804 is used to control the environment around the front end robot 808 and between the pod assembly 805 and the front end processing rack 752.

  [0030] FIG. 7 also includes further details of possible process chamber structures found in aspects of the present invention. For example, the front end module 750 generally includes one or more pod assemblies or FOUPs 805, a front end robot 808, and a front end processing rack 752. The one or more pod assemblies 805 are generally adapted to receive one or more cassettes 806 that can contain one or more substrates “W” or wafers that are processed in the track lithography tool 710. The front end processing rack 752 includes a plurality of processing modules (eg, bake plate 790, chill plate 780, etc.) adapted to perform various processing steps found in the substrate processing sequence. In one embodiment, the front end robot 808 is adapted to pass substrates between cassettes mounted in the pod assembly 805 and between one or more processing modules held in the front end processing rack 752.

  [0031] The central module 850 generally includes a central robot 807, a first central processing rack 852, and a second central processing rack 854. The first central processing rack 852 and the second central processing rack 854 can include various processing modules (eg, coater / developer module 100, bake, etc.) adapted to perform various processing steps found in the substrate processing sequence. Module 790, chill plate 780, etc.). In one embodiment, central robot 807 is adapted to pass substrates between front end processing rack 752, first central processing rack 852, second central processing rack 854 and / or rear processing rack 902. . In one aspect, the central robot 807 is positioned at a central position between the first central processing rack 852 and the second central processing rack 854 of the central module 850.

  [0032] The rear module 900 generally includes a rear robot 809 and a rear processing rack 902. The rear processing rack 902 generally includes processing modules (eg, coater / developer module 760, bake module 790, chill plate 780, etc.) adapted to perform various processing steps found in the substrate processing sequence. Yes. In one embodiment, the rear robot 809 delivers a substrate between the rear processing rack 900 and the stepper / scanner 705. A stepper / scanner 705, which may be purchased from Canon USA, San Jose, California, Nikon Precision, Belmont, California, or ASMLUS, Tempe, Arizona, is used, for example, in the manufacture of integrated circuits (ICs). A lithographic projection apparatus. The scanner / stepper tool 705 exposes the photosensitive material (resist) deposited on the substrate in the cluster tool to some form of electromagnetic radiation to separate layers of integrated circuit (IC) devices formed on the substrate surface. A corresponding circuit pattern is formed.

  [0033] In one embodiment, the controller 801 is used to control all the components in the cluster tool 710 and the processes that take place in the cluster tool 710. The controller 801 is generally in communication with the stepper / scanner 705 to monitor and control aspects of the process performed within the cluster tool 810 and to control all aspects of the overall substrate processing sequence. It has become. The controller 801, typically a microprocessor-based controller, receives input from a user and / or from various sensors in one of the processing chambers and in accordance with the various inputs and software instructions held in the controller's memory. It is configured to properly control the components of the processing chamber. The controller 801 generally includes a memory and CPU (not shown) that is used by the controller to hold various programs, process the programs, and execute the programs when needed. A memory (not shown) is connected to the CPU and can be used immediately, such as a random access memory (RAM) or a read only memory (ROM), a floppy disk, a hard disk, or any other It may be one or more of a digital storage device, a local storage, or a remote storage. Software instructions and data can be encoded and stored in memory for instructing the CPU. A support circuit (not shown) is also connected to the CPU to support the processor in a conventional manner. Support circuits can include caches, power supplies, clock circuits, input / output circuits, subsystems, etc., all of which are well known in the art. A program (or computer instructions) that can be read by controller 801 determines which tasks can be performed in the processing chamber. Preferably, the program is software readable by the controller 801 and includes instructions for monitoring and controlling the process based on defined rules and input data.

  [0034] Further, FIG. 7 illustrates a coater / developer module 100 mounted in a second central processing rack 854 that may be adapted to perform a photoresist coating step or a development step in both processing chambers 110, 111. Is shown. This structure is beneficial because it can share some of the common components found in the two processing chambers 110, 111, thereby reducing system cost, complexity and tool footprint. is there. As shown in FIG. 7 and as will be described in more detail below, two spin chucks 130 and 131 are provided in the processing chambers 110 and 111, respectively. A shared central fluid distribution bank 112 is located between the two processing chambers, and the distribution arm assembly 118 can handle both spin chucks by selecting a nozzle from the central fluid distribution bank. In an embodiment of the present invention, the central robot 807 can access both processing chambers 110, 111 independently.

  [0035] FIG. 1A is a simplified perspective view of a fluid dispensing apparatus according to an embodiment of the present invention. The fluid dispensing device 100 is shown as including a frame 105. Additional components are provided by embodiments of the present invention, but not all components are shown for clarity. For example, the intake and exhaust ports and the power supply that are generally present on the side of the frame are not shown in FIG. 1A. Further details regarding some of the components are given in FIG.

  [0036] As shown in FIG. 1A, two separate processing chambers 110, 111 are positioned within the frame 105 on each of the left and right sides of the central fluid distribution bank 112. In some coat / developer modules, the processing chambers 110, 111 are referred to as processing stations. Here, the terms processing chamber and processing station are used interchangeably. By way of example only, the present invention has been applied to a coater / developer module in which a pair of coat / develop balls are horizontally disposed on either side of the central fluid distribution bank, but this is not essential to the present invention. In certain embodiments, the coat module is a photoresist module that uses different photoresists and photoresists combined with different concentrations of solvents. As will be apparent to those skilled in the art, the fluid dispensed by the central fluid dispensing bank may be supplied in the form of a liquid, vapor, mist or droplet.

  [0037] In other embodiments, the processing chamber is a processing module that may be adapted to perform a coating process using, for example, organic and inorganic fluids, mixed organic / inorganic fluids, aqueous fluids, and the like. By way of example only, these fluids include bottom anti-reflective coating (BARC), resist, top anti-reflective coating (TARC), development, shrink coat, PIQ® (polyisoindoloquinazolinedione), spin-on glass, spin-on It may be utilized in processes that include spin-on materials including dielectrics, spin-on hard masks, and the like. Also, processes that utilize other fluids, including fluids used in chemical and electrochemical plating processes and wet cleans, are within the scope of the present invention.

  [0038] In the embodiment shown in FIG. 1A, the processing chambers 110, 111 generally include all of the processing components described in US Provisional Application No. 60 / 639,109 along with the coater module or developer module. Yes. The two chambers also share a central fluid distribution bank 112. The central fluid distribution bank includes a number of distribution nozzles 114. Each of the spin chucks 130 and 131 is coupled to a motor (not shown) via a shaft (not shown) and rotates about an axis perpendicular to the surface of the spin chuck. In some embodiments, the spin chucks 130, 131 include a sealing surface connected to a vacuum source adapted to hold the substrate while the substrate is being rotated.

  [0039] A controller (not shown) is provided and connected to the motor so that the timing and rotational speed of the spin chuck can be controlled in a predetermined manner. In some embodiments, the rotational speed may vary with time or may be constant. In one embodiment, the rotary motor is configured to rotate a 300 mm semiconductor substrate between about 1 revolution / minute (RPM) and about 5,000 RPM with an acceleration of up to about 50,000 RPM / s. Those skilled in the art will recognize many variations, modifications, and alternatives.

  [0040] The dispensing arm assembly 118 is actuated in three dimensions by motors 105, 106, 107. The motor 105 is used to move the dispensing arm assembly along the guide rail 119 in a first direction, sometimes referred to as the longitudinal direction. The motor is selected to move the dispensing arm assembly accurately and repeatably at a predetermined speed. In one embodiment, movement of the dispensing arm assembly along the guide rail is sufficient for the dispensing arm assembly to reach the center of both wafers. In some embodiments, motion stops, position feedback, and interlocks are provided, as is well known to those skilled in the art.

  [0041] The motor 106 is used to move the extension arm 117 in a second (vertical) direction, sometimes referred to as the vertical direction. The motor is selected to move the extension arm accurately and repeatably at a predetermined speed. In one embodiment, the movement of the extension arm in the vertical direction is sufficient for the gripper assembly to reach the dispensing nozzle and lift the dispensing nozzle above the top edge of the cup, the extension arm access door, and other obstacles. is there. In some embodiments, motion stops, position feedback, and interlocks are provided, as is well known to those skilled in the art.

  [0042] The motor 107 is used to move the gripper assembly 108 in a third direction, sometimes referred to as the lateral direction. As shown in FIG. 1A, the gripper assembly 107 can move along the extension arm 220, and a first arbitrary position above the nozzle holder assembly 117 and a second arbitrary position above the nozzle holder assembly 116. It is shown in The motor is selected to move the gripper assembly accurately and repeatably at a predetermined speed. In one embodiment, movement of the gripper assembly in the lateral direction is sufficient for the gripper assembly to reach both nozzle banks. In embodiments where one vertically oriented nozzle bank is utilized, the movement of the gripper assembly is sufficient for the gripper assembly to reach all the nozzles in the bank. In some embodiments, motion stops, position feedback, and interlocks are provided, as is well known to those skilled in the art.

  [0043] FIG. 1B is a simplified perspective view of a fluid dispensing apparatus according to another embodiment of the present invention. As shown in FIG. 1B, distribution arm access shutters 122 and 123 are provided inside the frame 105. The distribution arm access shutter 122 is located between the first processing chamber 110 and the central fluid distribution bank 112. The distribution arm access shutter 123 is located between the central fluid distribution bank and the second processing chamber 111. In an embodiment of the invention, the dispensing arm access shutter can move between an open position and a closed position and is positioned between these positions. As shown in FIG. 1B, the dispensing arm access shutter 122 is approximately halfway between the open and closed positions. The distribution arm access shutter 123 is shown in the closed position. When the dispense arm access shutter is in the open position, the dispense arm assembly is free to move between the processing chamber and the central fluid dispense bank.

  [0044] FIG. 2 is a simplified schematic plan view of a fluid dispensing device according to an embodiment of the present invention. Referring to FIG. 2, the cups 140, 141 are manufactured from a material characterized by suitable stiffness and solvent resistance. For example, in some embodiments of the present invention, the cups 140, 141 are made of plastic material (eg, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), polypropylene, or polyvinylidene fluoride (PVDF)). Manufactured from ceramic materials, metals coated with plastic materials (eg, aluminum or SST coated with either PVDF or Halar), or other materials compatible with the processing fluid supplied from the fluid distribution system 112 Is done.

  [0045] A lift assembly (not shown) generally includes an actuator (not shown) such as an air cylinder or servo motor and a guide (not shown) such as a linear ball bearing slide, which includes: The rotatable spin chucks 130 and 131 are moved up and down to a desired position. Therefore, the lift assembly positions the substrate mounted on the rotatable spin chuck in the cup and cups the substrate during processing to exchange the substrate using an external robot located outside the housing 100. It is designed to be lifted above the upper end. A robot blade (not shown) attached to the external robot enters the apparatus 100 via the robot access shutters 120 and 121.

  [0046] As shown in FIG. 2, the pre-wet nozzle 115 is located at the tip of the extension arm assembly 118. In some embodiments, the pre-wet nozzle is piped through a component coupled to the extension arm. In these embodiments, since a single pre-wet nozzle is present on the extension arm, the structure of each individual dispensing nozzle is simplified. In particular, in some embodiments, a pre-wet nozzle is not included as part of each dispensing nozzle. As will be described more fully below, the extension arm is a telescoping arm, and thus the pre-wet nozzle 115 can be controllably positioned at a desired distance from the guide mechanism 119. Further, a backside rinse (BSR) nozzle 138 is included on a portion of the ball positioned on the lower side of the substrate positioned on the spin chucks 130 and 131. The BSR nozzle supplies a solvent that is applied to the back side of the substrate during the cleaning step. In one embodiment, edge bead removal (EBR) arms 150 are provided at the corners of each processing chamber. As shown in FIG. 2, the EBR arm rotates around a pivot 152 located at the proximal end of the EBR arm, and positions the distal end of the EBR arm at a position on the edge of the substrate mounted on the spin chuck. To do. To remove edge beads present on the substrate, EBR fluid is dispensed through a nozzle located at the tip of the EBR arm.

  [0047] The gas flow distribution system is adapted to provide a uniform flow of gas through the housing 100 and the processing chambers 110,111. In certain embodiments, the gas flow distribution system supplies temperature and / or humidity controlled air through supply port 160. Cup exhaust 162 removes air from the processing chamber. Cup drain 164 removes fluid from the cup. As shown in FIG. 2, four ports are shown in relation to temperature and / or humidity controlled air, cup exhaust, and cup drain. This example is given because in some embodiments four distribution systems are stacked vertically to reduce the system footprint. Thus, for example, each of the illustrated cup exhausts is coupled to a cup in one of the four distribution systems.

  [0048] Although the various air and fluid treatment components shown in FIG. 2 are shown as four separate ports, this is not required in the present invention. In other embodiments, the air and fluid treatment components are provided in different numbers depending on the overall system structure. Also, the ports are shown to be uniform in size within each group, but this is not essential in the present invention. Furthermore, in other embodiments, separate ports are combined into large shared ports. Those skilled in the art will recognize many variations, modifications, and alternatives.

  [0049] Also, as will be apparent to those skilled in the art, the supply of temperature and humidity controlled gas, such as air, to the processing chamber generally extends to the monitoring and control of various air flow parameters. By way of example only, in one embodiment of the present invention, the chamber environment is monitored and parameters including solvent partial pressure and vapor concentration, air flow rate, air flow rate, especially differential pressure are controlled to achieve the desired air temperature. And humidity is achieved. Further, in some embodiments, electrostatic discharge from the film present on the substrate is controlled in addition to the chamber environment. Thus, coating characteristics can be controlled by controlling factors such as processing chamber environment and substrate parameters, particularly chuck spin rate.

  [0050] Also, each of the two chambers includes a robot access shutter 120/121 to alternately provide a seal for the access port and access for the robot arm to pass through the access port. If the substrate is ready for processing and the processing chamber is available for processing the substrate, the robot access shutter is opened. A robot arm (not shown) on which the substrate is supported is moved through the access port to move the substrate from a position outside the processing chamber to a position on one spin chuck. Utilizing methods well known to those skilled in the art, the robot arm places the substrate on the spin chuck and exits the processing chamber and the robot access shutter is closed.

  [0051] Using the robot access shutters 120, 121, the robot can alternately load substrates into the processing chambers 110, 111 independently. In some embodiments, the robot access shutter 121 is opened and a substrate is loaded into the processing chamber 111 while the coating / developing process is performed in the processing chamber 110. Alternatively, the robot access shutter 120 allows independent access to the processing chamber 110 during the coating / developing process in the processing chamber 111. Using embodiments of the present invention, system loading is increased because substrate loading and processing are performed simultaneously in two processing chambers.

  [0052] As shown in FIG. 2, each of the two processing chambers also includes a distribution arm access shutter 122, 123 positioned between each of the spin chucks 130, 131 and the central fluid distribution bank 112. . Although the distribution arm access shutter is not provided in the embodiment shown in FIG. 1, in some embodiments the distribution arm access shutter is shielded to isolate the processing chamber from the central fluid distribution bank during system operation. I do. Generally, the dispense arm access shutter is opened to allow the dispense arm assembly 118 to be moved into the processing chamber and closed after the dispense step is complete and the dispense arm assembly has returned to the central fluid dispense bank area. It is done. In general, the coating process includes accelerating the substrate to a desired rotational speed, dispensing a coating fluid, such as a resist, for several seconds and continuously rotating the substrate for tens of seconds. By way of example only, in one embodiment of the invention, the substrate is rotated until it reaches a speed of 500 RPM, the resist is dispensed for about 3 seconds, and the substrate is maintained at a rotational speed of 1800 RPM for about 60 seconds. In this embodiment, after the resist fluid has been dispensed, the dispense arm returns to the central fluid dispense bank and the dispense arm access shutter is closed while the substrate continues to rotate for approximately 55 seconds.

  [0053] In some embodiments of the present invention, the distribution arm access shutters 122, 123 not only provide separation from the liquid present in the central fluid distribution bank, but also provide additional particle control within each processing chamber. Also do. For example, in one embodiment, the distribution arm access shutter provides a seal for the processing chamber that restricts the flow of suspended particles from the central fluid distribution bank into the processing chamber. Thus, the dispensing arm access shutter minimizes crosstalk between process chambers and prevents contaminants from moving across the chamber boundaries. The distribution arm access shutter also substantially restricts the flow between the processing chambers, thereby reducing the air flow between each processing chamber and the central fluid distribution bank. Generally, for other reasons, the dispensing arm access shutter is formed from a chemically resistant material such as aluminum to provide an acceptable service life.

  [0054] Although shown as sliding vertically between an open position and a closed position in FIG. 1B, this is not required in the present invention. In other embodiments, the distribution arm access shutter is moved between various positions in a linear trajectory, a rotational trajectory, an oblique trajectory, and the like. In some embodiments, the dispensing arm access shutter is actuated by air pressure, solenoid or motor, depending on the particular application. In general, the movement of the dispensing arm access shutter is controlled with one or more interlocks. In certain embodiments, the interlock operates using a mechanical, electrical, or software switch or controller. Those skilled in the art will recognize many variations, modifications, and alternatives.

  [0055] Also, independent control of temperature and / or humidity in the vicinity of each substrate is performed according to embodiments of the present invention. In some coating processes, the parameters associated with the finish coating are the temperature of the coating process, the humidity near the substrate, or a function of both. Embodiments of the present invention provide independent temperature and / or humidity control in the processing chambers 110, 111. Thus, for coating processes where different temperature and / or humidity settings are required in a particular process, embodiments of the present invention provide the necessary control. By way of example only, in the processing chamber 110, the coating process may require temperature and humidity control of the surrounding environment of the substrate to be coated, while the development process may require only temperature control. In still other embodiments, either temperature, humidity, or both may be controlled independently within the two processing chambers.

  [0056] In some embodiments, the temperature and / or humidity in the processing chamber may be controlled before, during, and after the dispensing operation by use of the robot arm access door. In a process adapted to operate at a predetermined temperature and / or humidity, the access door can be opened to allow entry of the dispensing arm and can be partially closed during the fluid dispensing step, Can be fully opened again so that it can exit the processing chamber and can be fully closed during the end of the dispensing process.

  [0057] The central fluid distribution bank 112 includes a plurality of nozzles 114 housed within one or more nozzle holder assemblies 116. As described more fully in U.S. Provisional Application No. 60 / 639,109, a fluid distribution system used in a coater or developer module is a substrate having one or more processing fluids mounted on a spin chuck 130. One or more fluid source assemblies (not shown) may be included to supply the surface of the. In some embodiments of the invention, the home position of the dispensing arm is in the central fluid dispensing bank area. Accordingly, during substrate loading and unloading operations through the robot access doors 120, 121, the dispensing arm is located at a home position within the central fluid dispensing bank area.

  [0058] As shown in FIG. 1, in one embodiment of the present invention, two dispensing nozzle banks are provided. Each nozzle 114 housed within the nozzle holder assembly 116 is generally connected to piping elements (including supply tubes, pumps, filters, suction back valves, fluid sources, etc.) and one type of processing fluid. Are to be distributed. In certain embodiments, the processing fluid is a photoresist, a solvent, a coating, a developer, and the like. Those skilled in the art will recognize many variations, modifications, and alternatives. Each central fluid distribution bank can handle both processing chambers because the distribution arm can be positioned either in the left processing chamber or in the right processing chamber, thereby providing the required redundancy within each processing chamber. (Duplicate) is reduced.

  [0059] As will be appreciated by those skilled in the art, the nozzle structures utilized in the various processes generally vary depending on the characteristics of the particular application. By way of example only, a resist nozzle bank typically includes 4 to 10 nozzles. In certain embodiments of the invention, the resist nozzle bank includes more than 10 nozzles. In general, resist nozzles are adapted to dispense various chemicals including resists, anti-reflective coatings, and spin-on materials (eg, SOG and SOD). On the other hand, the developing nozzle bank generally includes 1 to 3 nozzles. In some embodiments, four or more development nozzles are included in the development nozzle bank. Some developer nozzle banks also include a number of rinse lines suitable for a particular application.

  [0060] The structure of the nozzle, whether resist or development, may share similarities in structure to suit a particular application. Also, the time during which the dispensing operation is performed generally varies with the resist operation occurring over a period of several seconds, while the developing operation may occur over a period of several hundred seconds. Accordingly, embodiments of the present invention include nozzles in the central fluid distribution bank that are suitable for the function of a particular distribution assembly.

  [0061] As shown in FIGS. 1 and 2, the central fluid distribution bank includes a number of distribution nozzles. In the embodiment shown in FIGS. 1A, 1B, 2, the dispensing nozzle comprises two groups of nozzles, specifically a first group of five nozzles housed within the nozzle holder assembly 116. , And a second group of five nozzles housed in the nozzle holder assembly 117. As shown, the dispensing nozzles are arranged longitudinally within the nozzle holder assembly. In other words, the longitudinal dimension of the nozzle holder assembly is adjusted in parallel with the line connecting the center of the spin chuck 130 to the center of the spin chuck 131. In embodiments where the spin chucks are centered inside their corresponding processing chamber, the nozzle holder assembly is aligned parallel to the line connecting the center of the first processing chamber and the center of the second processing chamber. The Another reference frame that can reference the nozzle holder assembly is the length of the guide mechanism 119. As shown in FIG. 1, the nozzle holder assemblies 116, 117 are aligned parallel to the length of the guide mechanism 119.

  [0062] Although FIGS. 1-3 show a structure in which each nozzle holder assembly 116 includes five nozzles 114, in other embodiments, the nozzle holder assembly 116 departs from the basic scope of the present invention. It may also include a smaller number of nozzles or a larger number of nozzles. For example, in one embodiment, there are two banks with eight nozzles per bank. In FIG. 1, the nozzle holder assembly is shown to be aligned parallel to the length of the guide mechanism 119, but this is not essential in the present invention. In an alternative embodiment, the nozzle holder assembly is aligned perpendicular to the length of the guide mechanism. Also, in one particular embodiment, a single bank containing 8 nozzles is provided. In this particular embodiment, a single nozzle bank is placed with the nozzle holder assembly aligned perpendicular to the length of the guide mechanism. These alternative embodiments are described in more detail below.

  [0063] As shown in FIG. 1, all of the dispensing nozzles provided in the nozzle dispensing bank are arranged in one plane parallel to the plane containing the spin chuck. However, this is not essential in the present invention. In an alternative embodiment (not shown), the dispensing nozzles are stacked vertically, the first number of nozzles are arranged in a first plane, and the second number of nozzles are arranged in a second plane. Is done. Also, in some embodiments, the nozzles are stacked vertically and arranged in a staggered manner in the lateral direction, thereby providing access to nozzles that are suitable for a particular application.

  [0064] FIG. 3A is a simplified schematic plan view of a fluid dispensing device in a first mode of operation according to an embodiment of the present invention. In a particular embodiment of the invention, the fluid dispensing device is a coater / developer module. As shown in FIG. 3A, a dispensing arm assembly 118, sometimes referred to as a nozzle arm assembly, is positioned on the right processing chamber for dispensing processing fluid onto a substrate 210 held on a spin chuck 130. . The dispensing arm assembly 118 may include an arm 220 and a nozzle holding mechanism 222. The dispensing arm assembly 118 is attached to an actuator 224 that is adapted to move the dispensing arm assembly 118 to any position along the guide mechanism 226. In one embodiment, a system controller (not shown) can accurately position the nozzle 114 above the substrate 210 during processing, and the nozzle retention mechanism can pick up and remove the nozzle 114 from the nozzle holder assembly 116. To do so, the dispensing arm assembly 118 is moved vertically. As described above, the dispensing arm access shutter 123 moves vertically and closes, and also separates one processing chamber 111 from the central fluid distribution bank 112 and the other process module 110 during processing to remove two of the substrates being processed. It is designed to prevent secondary contamination.

  [0065] FIG. 3B is a simplified schematic plan view of a fluid dispensing device in a second mode of operation according to another embodiment of the present invention. As shown in FIG. 3B, the dispensing arm assembly 118 is positioned on the left processing chamber 110 for dispensing processing fluid onto the substrate 310 held on the spin chuck 130. The distribution arm access shutter 122 moves vertically and closes, and separates the processing chamber 110 from the central fluid distribution bank 112 and the other processing chamber 111 during processing to prevent cross-contamination of the substrate being processed. It has become.

  [0066] FIG. 6 is a simplified schematic plan view of a fluid dispensing apparatus according to another embodiment of the present invention. As shown in FIG. 6, the fluid dispensing device shares some common points with the device shown in FIG. For example, the apparatus shown in FIG. 6 includes a central fluid distribution bank 612 with a number of distribution nozzles, a home region 614, and two processing chambers located on opposite sides of the central fluid distribution bank and the home region. . As shown in FIG. 6, the central fluid distribution bank includes a single nozzle holder assembly 616, where the long dimension of the nozzle holder assembly connects the center of the processing chamber 610 and the center of the processing chamber 611. It is substantially perpendicular to the line to be performed.

  [0067] The assembly shown in FIG. 6 also accesses a nozzle holder assembly housed in a shared central fluid distribution bank to select one distribution nozzle 618 from the nozzle holder assembly and to remove the distribution nozzle. Two nozzle arm assemblies 620, 622 adapted to be removably coupled are included. Each dispensing arm assembly is actuated by a motor (not shown) to translate the selected dispensing nozzle to a desired position on the associated substrate surface. For example, dispense arm assembly 620 is associated with spin chuck 630 and dispense arm assembly 622 is associated with spin chuck 632. As shown in FIG. 6, the dispensing arm assembly 622 is located in the home region and is not coupled to the dispensing nozzle. On the other hand, the dispensing arm assembly 620 is coupled to the dispensing nozzle that was originally located at location 640 in the nozzle holder assembly. Also, the dispensing arm assembly 620 has been moved to a position for causing the coating fluid dispensed from the dispensing nozzle to strike the center of the substrate 650.

  [0068] In the embodiment shown in FIG. 6, the distribution arm access shutter is split to allow individual access to the distribution arm assembly relative to the home position and the central fluid distribution bank. In further embodiments, additional movable or non-movable partitions are included as will be apparent to those skilled in the art. By way of example only, a non-movable partition 660 located between the central fluid distribution bank 612 and the home location 614 provides environmental isolation between the central fluid distribution bank and the home region. In the embodiment shown in FIG. 6, each dispensing nozzle is plumbed to supply a different fluid solution. Alternatively, multiple nozzles may share the same pump and dispense the same fluid, such as a particular resist. Accordingly, the fluid dispensing apparatus shown in FIG. 6 can perform a wide variety of coating processes and developing processes.

  [0069] FIG. 4A is a simplified flowchart illustrating a method of operating a fluid dispensing device according to one embodiment of the present invention. The method includes, at step 410, providing a central fluid distribution bank with a number of distribution nozzles. In certain embodiments, the central fluid distribution bank includes 16 nozzles that supply 16 different resists. In other embodiments, 16 nozzles are provided, but each nozzle supplies one resist. In this case, the concentration of the solvent varies depending on each nozzle. In other embodiments, the central fluid distribution bank includes a smaller or larger number of nozzles depending on the particular application. The method also includes providing a first processing chamber located on the first side of the central fluid distribution bank and providing a second processing chamber located on the second side of the central fluid distribution bank. (Step 412). In this case, the first side is the opposite side of the second side. The method further includes, at step 414, providing a dispensing arm assembly that is disposed at a home position. In an embodiment of the present invention, the home position is in the central fluid distribution bank region, and the distribution arm assembly is adapted to translate between the central fluid distribution bank and the first processing chamber and the second processing chamber. . The home position is not limited to a particular location within the central fluid distribution bank area, but it will be appreciated that it is a common location near the distribution nozzle.

  [0070] At step 416, a dispensing nozzle is selected from a plurality of dispensing nozzles located in the central fluid distribution bank, and the selected nozzle is coupled to the dispensing arm assembly. In an embodiment of the present invention, the step of selecting the first dispensing nozzle includes removably coupling the nozzle to the dispensing arm using a gripper assembly incorporated within the extension arm of the dispensing arm assembly. It is out. As described above, the dispensing arm assembly is adapted to move in three dimensions so that the dispensing arm assembly can lift the selected nozzle from the nozzle holder assembly and remove the nozzle in any process. Can be moved into the chamber. In one embodiment, vertical translation is utilized to remove selected nozzles from the nozzle holder assembly and position the nozzles at a predetermined distance from the substrate surface prior to the fluid dispensing step. Those skilled in the art will recognize many variations, modifications, and alternatives. In step 418, the dispensing arm assembly is translated by actuation of a motor coupled to the dispensing arm assembly. The dispensing arm assembly is moved to position the dispensing nozzle in a first position within the first processing chamber.

  [0071] In some embodiments, the method includes positioning the nozzle at a first dispensing position positioned on a central region of a substrate mounted on the spin chuck 130, which includes It is not essential in the invention. Alternative embodiments utilize other locations within the processing chamber 110.

  [0072] The spin chuck is rotated to bring the substrate rotation speed to a predetermined value. In one embodiment, the spin chuck accelerates the substrate with an acceleration of up to about 50,000 RPM / s, thereby bringing the substrate from a rest position to a rotational speed of about 5,000 RPM. Alternatively, the acceleration ranges from about 10 RPM / s to about 50,000 RPM / s and the rotational speed ranges from about 1 RPM to about 5,000 RPM. Of course, the acceleration and rotational speed depend on the particular application.

  [0073] In embodiments where solvent prewetting is utilized, the first position is selected to position the solvent prewetting nozzle present on the dispensing arm assembly in the dispensing position. In certain embodiments, the dispensing position is the position where the solvent pre-wet nozzle is positioned on the center of the substrate. After the solvent pre-wet nozzle is positioned, the solvent is dispensed onto the rotating substrate. The dispensing arm assembly is then actuated to move the dispensing arm assembly and position the dispensing nozzle over the center of the substrate before dispensing fluid from the dispensing nozzle.

  [0074] In step 420, the coating fluid is dispensed from the selected dispensing nozzle, typically on the center of the substrate mounted on the spin chuck 130. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotational speed may be variable or constant depending on the time. Those skilled in the art will recognize many variations, modifications, and alternatives. In step 422, the dispensing arm is returned to the home position and the selected dispensing nozzle is returned to the central fluid dispensing bank.

  [0075] FIG. 4B is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to another embodiment of the present invention. Steps 450-460 in FIG. 4B are comparable to steps 410-420 in FIG. 4A. In an alternative embodiment shown in FIG. 4B, instead of returning the dispensing arm assembly back to the central fluid distribution bank and returning the selected dispensing nozzle to the central fluid distribution bank, it was mounted on the spin chuck 131 at step 462. The dispensing arm assembly is translated to a third position located on the central region of the second substrate. In embodiments where solvent prewetting is utilized, the second position is selected such that solvent can be dispensed onto the center of the second substrate and coating fluid can be dispensed from the dispense nozzle prior to adjustment of the dispense nozzle position. .

  [0076] In a manner similar to the first dispensing operation, the spin chuck 131 is rotated such that the substrate rotation speed reaches a predetermined value. The distribution parameter may be the same as or different from the distribution parameter used during the first distribution step, depending on the application. In step 464, any pre-wet solvent and coating fluid is dispensed from the selected dispensing nozzle, typically on the central portion of the substrate mounted on the spin chuck 131. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotational speed may be variable or constant depending on the time. Those skilled in the art will recognize many variations, modifications, and alternatives. After the second dispensing step, in step 466 the dispensing arm assembly is returned to the home position on the central fluid distribution bank and the selected dispensing nozzle is returned to the central fluid distribution bank.

  [0077] Although the previous embodiment utilizes one selected dispensing nozzle for the first dispensing step and the second dispensing step, this is not required in the present invention. In other embodiments, a step is inserted between step 460 and step 462 such that the first dispensing nozzle is selected in the first dispensing step and the second dispensing nozzle is selected in the second dispensing step. Is done. In yet another alternative embodiment, the method of dispensing fluid onto the substrate is not stopped after the second dispensing step and continues for more than two dispensing steps. The dispensing step may be alternated between the processing chambers, or may characterize a series of dispensing steps within one processing chamber using the same or different coating fluids. Possible variations on the home position for the dispensing arm assembly in the central fluid distribution bank area will be apparent to those skilled in the art.

  [0078] The substrate can be loaded into the two processing chambers using any suitable robot. For example, in one embodiment, the central robot alternately delivers substrates to both processing chambers in one embodiment of the present invention. In some embodiments, the distribution arm assembly is positioned at a home position in the central fluid distribution bank area while the substrate is loaded into the processing chamber by the central robot. During the robot loading and unloading process, the dispensing arm access door is generally kept closed, thereby limiting the movement of air and airborne particles between the processing chamber and the central fluid dispensing bag area.

  [0079] The aforementioned sequence of steps provides a method according to an embodiment of the invention for dispensing fluid onto a semiconductor substrate. As shown, the method uses a combination of steps including a method that utilizes a central fluid distribution bank shared by two processing chambers according to an embodiment of the invention. Also, other steps in which multiple steps are added, one or more steps are removed, or one or more steps are provided in a different sequence without departing from the scope of the claims described herein. Alternatives can be given. Further details of the method can be found throughout the specification.

  [0080] FIG. 5 is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to yet another embodiment of the present invention. The method includes, at step 510, providing a central fluid distribution bank. The central fluid distribution bank is equipped with a number of distribution nozzles. In a particular embodiment, the central fluid distribution bank includes 16 nozzles that supply 16 different resists. In other embodiments, 16 nozzles are provided, but each nozzle supplies a single resist. In this case, the concentration of the solvent varies depending on each nozzle. In other embodiments, the central fluid distribution bank includes a smaller or larger number of nozzles depending on the particular application. The method also provides a first processing chamber located on the first side of the central fluid distribution bank (step 512) and a second processing chamber located on the second side of the central fluid distribution bank. Providing (step 514) is also included. In certain embodiments, the first processing chamber and the second processing chamber are located on opposite sides of the central fluid distribution bank.

  [0081] Further, the method includes providing a dispensing arm assembly in a home position adapted to translate between the central fluid dispensing bank and the first processing chamber and the second processing chamber (step 516); and , Including selecting one distribution nozzle from a plurality of distribution nozzles. In an embodiment of the present invention, the step of selecting the dispensing nozzle includes removably coupling the nozzle to the dispensing arm using a gripper assembly incorporated within the extension arm of the dispensing arm assembly ( Step 518). Also, in some embodiments, the gripper assembly is translated vertically and laterally after coupling the nozzle to the gripper assembly. In one embodiment, vertical translation is utilized to separate the tube coupled to the selected dispensing nozzle from the tubes coupled to other dispensing nozzles in the nozzle holder assembly, so that the total number of particles is Will be reduced. Those skilled in the art will recognize many variations, modifications, and alternatives.

  [0082] In one particular embodiment, the first processing chamber and the second processing chamber are controlled to provide a separate temperature and humidity environment for each processing chamber. Thus, in one embodiment, a distribution arm access shutter is provided between the central fluid distribution bank and both processing chambers, thereby providing environmental control for the processing chambers. In step 520, a first distribution arm access shutter positioned between the central fluid distribution bank and the first processing chamber is opened. When the first dispense arm access shutter opens, a path is provided for the dispense arm assembly to move the selected nozzle from the central fluid dispense bank to a first position in the first processing chamber (step 522). ). In general, the first distribution position is a position where the distribution nozzle is disposed on the central region of the substrate mounted on the spin chuck 130, but this is not essential in the present invention. Other embodiments utilize other locations within the processing chamber 110, such as locations where the solvent pre-wet nozzle is positioned on the center of the substrate.

  [0083] The spin chuck is rotated to bring the substrate rotation speed to a predetermined value. In one embodiment, the spin chuck accelerates the substrate with an acceleration of up to about 50,000 RPM / s, thereby bringing the substrate from a rest position to a rotational speed of about 5,000 RPM. Alternatively, the acceleration ranges from about 10 RPM / s to about 50,000 RPM / s and the rotational speed ranges from about 1 RPM to about 5,000 RPM. Of course, the acceleration and rotational speed depend on the particular application.

  [0084] In step 524, the coating fluid is dispensed from the dispensing nozzle, typically on the center of the substrate mounted on the spin chuck 130. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotational speed may be variable or constant depending on the time. Those skilled in the art will recognize many variations, modifications, and alternatives. In step 526, the dispensing arm assembly is translated to the home position. In certain embodiments, the time that the substrate is rotated after fluid dispensing is less than the translation time for the dispensing arm assembly to move from the dispensing position to the central fluid dispensing bank region. Thus, in this particular embodiment, the dispensing arm assembly exits the first processing chamber after the dispensing step and the first dispensing arm access shutter is closed before the spin step is complete.

  [0085] In step 530, a second dispensing arm access shutter positioned between the central fluid dispensing bank and the second processing chamber is opened. When the second dispensing arm access shutter opens, a path is provided for the dispensing arm assembly to move the selected nozzle from the central fluid distribution bank to a second position in the second processing chamber (step 532). ). In general, the second distribution position is a position where the distribution nozzle is disposed on the central region of the substrate mounted on the spin chuck 131, but this is not essential in the present invention. Other embodiments utilize other locations within the processing chamber 111, such as locations where the solvent pre-wet nozzle is positioned on the center of the substrate. As described in relation to the processing chamber 110, the spin chuck 131 is rotated so that the substrate rotation speed becomes a predetermined value.

  [0086] In step 534, the coating fluid is dispensed from the dispensing nozzle, typically on the center of the substrate mounted on the spin chuck 131. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotational speed may be variable or constant depending on the time. Those skilled in the art will recognize many variations, modifications, and alternatives. In step 536, the dispensing arm assembly is translated to the home position. In certain embodiments, the time that the substrate is rotated after fluid dispensing is less than the translation time for the dispensing arm assembly to move from the dispensing position to the central fluid dispensing bank region. Thus, in this particular embodiment, the dispensing arm assembly exits the second processing chamber after the dispensing step and the second dispensing arm access shutter is closed before the spin step is complete (step 538). In some embodiments, at step 540, the selected dispensing nozzle is removed from the dispensing arm assembly.

  [0087] The above sequence of steps provides a method for dispensing fluid over many semiconductor substrates in accordance with an embodiment of the present invention. As shown, the method uses a combination of steps including a method that utilizes a central fluid distribution bank shared by two environmentally controlled processing chambers in accordance with one embodiment of the present invention. Also, other steps in which multiple steps are added, one or more steps are removed, or one or more steps are provided in a different sequence without departing from the scope of the claims described herein. You can give choices. Further details of the method can be found throughout the specification.

  [0088] In other embodiments, the dispensing arm access shutter is opened, partially closed, and reopened during each coating process. In this particular embodiment, the dispensing arm access shutter is partially closed after the dispensing arm enters the processing chamber, and the dispensing arm is moved to the side of the processing chamber adjacent to the central fluid dispensing bank after the fluid is dispensed. Is moved. In this embodiment, during the coating process, the dispensing arm access shutter remains partially closed while the dispensing arm waits on the side of the processing chamber for the coating process to be completed. After completion of the coating process, the dispensing arm access shutter is opened and the dispensing arm returns to the central fluid dispensing bank area. In this case, the first dispensing nozzle is returned to the central fluid dispensing bank and the dispensing arm access shutter is closed again. In this particular embodiment, the time that the dispensing arm access shutter is opened and the time that the processing chamber is exposed to the central fluid distribution bank region is minimized, thereby reducing the central fluid distribution bank region or Secondary contamination from any of the other processing chambers is reduced.

  [0089] Although the previous embodiment utilizes one selected dispensing nozzle for the first dispensing step and the second dispensing step, this is not required in the present invention. In other embodiments, a step is inserted between step 528 and step 530 such that the first dispensing nozzle is selected in the first dispensing step and the second dispensing nozzle is selected in the second dispensing step. Is done. In yet another alternative embodiment, the method of dispensing fluid onto the substrate is not stopped after the second dispensing step and continues for more than two dispensing steps. The dispensing step may be alternated between the processing chambers, or may characterize a series of dispensing steps within one processing chamber using the same or different coating fluids. Possible variations on the home position for the dispensing arm assembly in the central fluid distribution bank area will be apparent to those skilled in the art.

  [0090] FIG. 8 is a simplified timing diagram illustrating the operation of a fluid dispensing device according to an embodiment of the present invention. This diagram is merely an example of a process flow and is not intended to limit the scope of the claims set forth herein. Also, the diagram shown in FIG. 8 is not drawn to scale, but merely represents a series of timed events that are related to each other. FIG. 8A shows the movement of the dispensing arm assembly along the guide rail 119 shown in FIG. Referring to FIG. 2 and FIG. 8B, the left and right sides of the dispensing arm assembly (to handle the processing chamber 110) are plotted by plotting the left and right velocity of the dispensing arm assembly as a function of time, respectively, as plus and minus velocity. ) And to the right (to handle the processing chamber 111) is shown.

[0091] In the embodiment shown in FIG. 8A, at time t ₀ , the dispensing arm assembly is translated from the home position to the left for a predetermined time and stopped. As will be apparent to those skilled in the art, the predetermined time is associated with the moving speed according to the distance from the home position to the dispensing position in the processing chamber 110. For clarity, the movement of the dispensing nozzle and dispensing arm assembly in the direction perpendicular to the guide rail and in the vertical direction (with respect to FIG. 2) in the plane of the figure is not shown in FIG. As can be seen, these movements are included as described above.

[0092] As shown in FIG. 8B, the rotational speed of the spin chuck in the processing chamber 110 (PC ₁ ) is shown as a function of time. In one embodiment, rotation of the chuck within the processing chamber 110 does not begin until the dispensing arm assembly is positioned and stopped at the desired position. In other embodiments, the spinning process is initiated while the dispensing arm assembly is still moving. Also, as described above, in some embodiments, the dispensing arm assembly may move from a first position where solvent for the prewetting process is dispensed to a second position where resist or other fluid is dispensed. Moved. In the embodiment shown in FIG. 8B, the spin process for the spin chuck in the processing chamber 110 is started at time t ₁ before the motion of the dispensing arm assembly has been stopped. The spin chuck is accelerated and maintained at a constant rotational speed R ₁ for a first predetermined time during the dispensing process and accelerated to a higher second rotational speed R ₂ for a second predetermined time. The Of course, the rotational speed and time depend on the particular application.

[0093] FIG. 8C shows the amount of fluid dispensed from the dispensing nozzle as a function of time. As can be seen by comparing FIGS. 8A and 8C, the dispensing arm assembly is positioned within the processing chamber 110 (PC ₁ ) during this dispensing step. As shown in FIG. 8C, the fluid dispensing step is performed while the spin chuck in the processing chamber 110 is rotating at the first speed R ₁ . For clarity, further dispensing steps such as solvent prewetting have been omitted from this figure. Also, during the fluid dispensing step, the amount of fluid dispensed is shown as constant over time, but as will be appreciated by those skilled in the art, this is not essential to the present invention. In an alternative embodiment, the dispensed amount as a function of time follows other functional relationships, thereby increasing and / or decreasing the dispensed amount as a function of time, for example to suit a particular process.

[0094] FIGS. 8D and 8E show the amount of spin chuck in the processing chamber 111 (PC ₂ ) and the amount of fluid dispensed from the dispensing nozzle. Referring to FIGS. 2 and 8A, at time t ₃ , the dispensing arm assembly is translated from the left processing chamber 110 to the right, thereby moving the dispensing nozzle to a desired position within the processing chamber 111. The As shown, the time utilized to move the dispensing arm assembly from the processing chamber 110 to the processing chamber 111 is greater than the time originally required to move the dispensing arm assembly from the home position to the processing chamber 111. long. In some embodiments, this increase in time is due to the movement of the dispensing arm assembly moving at approximately equal speed but over a long distance. Of course, in alternative embodiments, speed, distance and time are associated as will be apparent to those skilled in the art. Also, translation of the dispensing arm assembly at time t ₃ shown in FIG. 8A is shown to occur at a constant speed. In other embodiments, the movement of the dispensing arm assembly is stopped at the home position, the dispensing nozzle is replaced as described above, and the movement continues in the left direction. Those skilled in the art will recognize many variations, modifications, and alternatives.

[0095] At time t ₄ , the spin chuck in the processing chamber 111 is rotated to the first rotational speed R ₃ , and after the fluid is dispensed at time t ₅ , the rotational speed is further increased to the speed R _4. The As shown, the spin processes in the two processing chambers are duplicated. Thus, in some embodiments of the present invention, the use of a shared distribution structure increases system throughput, although there are other advantages. At time t _6, the dispense arm assembly is translated to the home position.

  [0096] The examples and embodiments described herein are for illustrative purposes only. In view thereof, various modifications and changes will occur to those skilled in the art, and such modifications or changes should be included within the spirit and scope of this application and the scope of the appended claims. The invention is not to be limited except as indicated by the appended claims.

Claims (21)

An apparatus for dispensing fluid during a semiconductor substrate processing operation,
A first processing chamber;
A second processing chamber;
A dispensing arm assembly;
A dispensing arm access shutter positioned between the first processing chamber and the second processing chamber and movable between an open position and a closed position;
With
The apparatus, wherein the dispensing arm assembly is movable from the first processing chamber to the second processing chamber when the dispensing arm access shutter is in the open position.   The apparatus of claim 1, further comprising a central fluid distribution bank positioned between the first processing chamber and the second processing chamber.   The apparatus of claim 2, wherein the central fluid distribution bank comprises a plurality of distribution nozzles coupled to a plurality of fluid sources.   A second distribution arm access shutter positioned between the first processing chamber and the second processing chamber, the distribution arm access shutter including the first processing chamber and the central fluid distribution bank; 4. The apparatus of claim 3, wherein the second distribution arm access shutter is positioned between the central fluid distribution bank and the second processing chamber.   4. The apparatus of claim 3, wherein the plurality of fluid sources comprises a fluid selected from the group consisting of organic, inorganic, mixed, and water soluble.   The apparatus of claim 2, wherein the dispensing arm assembly is adapted to hold at least one nozzle selected from a plurality of dispensing nozzles.   The apparatus of claim 6, wherein the dispensing arm assembly comprises a plurality of parts, each part being actuated by a motor, wherein at least one nozzle is movable in three dimensions.   The process performed in the first processing chamber and / or the second processing chamber is selected from the group consisting of photoresist, developer, BARC, TARC, shrink coat, spin-on material, and polyisoindoloquinazolinedione. The device of claim 1, wherein the device is a processed process.   The first processing chamber includes a first spin chuck adapted to hold and rotate a first substrate, and the second processing chamber holds and rotates a second substrate. The apparatus of claim 1, comprising a second spin chuck that is On a semiconductor substrate using an apparatus comprising a distribution nozzle, a first processing chamber, a second processing chamber, and a distribution arm access shutter positioned between the first processing chamber and the second processing chamber A method of dispensing fluid to
Opening the dispensing arm access shutter;
Moving the dispensing nozzle to a first position in the first processing chamber;
Dispensing fluid from the dispensing nozzle;
Moving the dispensing nozzle to a second position between the first processing chamber and the second processing chamber;
Closing the dispensing arm access shutter;
A method comprising:   The step of selecting comprises positioning the distribution arm above the first distribution nozzle, grabbing a nozzle, and removing the first distribution nozzle from the central fluid distribution bank. Item 11. The method according to Item 10. Providing a second dispensing arm access shutter positioned between the first processing chamber and the second processing chamber;
Opening the second dispensing arm access shutter;
Moving the dispensing nozzle to a third position in the second processing chamber;
Dispensing fluid from the dispensing nozzle;
Moving the dispensing nozzle to a fourth position between the first processing chamber and the second processing chamber;
Closing the second dispensing arm access shutter;
The method of claim 10, further comprising: A controlled environment device for dispensing fluid during semiconductor substrate processing operations comprising:
A first processing chamber;
A second processing chamber;
A dispensing arm assembly having a home position;
A first dispensing arm access shutter positioned between the home position and the first processing chamber;
A second dispensing arm access shutter positioned between the home position and the first processing chamber;
With
A controlled environment apparatus, wherein a first temperature in the first processing chamber and a second temperature in the second processing chamber are independently controlled.   A first set of supply ports supplies temperature-controlled air to the first processing chamber and a second set of supply ports independently supplies temperature-controlled air to the second processing chamber; The apparatus of claim 13.   The apparatus of claim 13, wherein the first humidity in the first processing chamber and the second humidity in the second processing chamber are independently controlled.   The first processing chamber includes a first exhaust system, the second processing chamber includes a second exhaust system, and the first exhaust system and the second exhaust system are independently controlled. Item 14. The device according to Item 13.   14. The apparatus of claim 13, further comprising a central fluid distribution bank positioned between the first distribution arm access shutter and the second distribution arm access shutter. The apparatus of claim 17, wherein the central fluid distribution bank comprises a plurality of distribution nozzles coupled to a plurality of fluid sources.   The apparatus of claim 13, wherein the first processing chamber and the second processing chamber are located on opposite sides of the central fluid distribution bank.   The first processing chamber includes a first spin chuck adapted to hold and rotate a first substrate, and the second processing chamber holds and rotates a second substrate. The apparatus according to claim 13, comprising a second spin chuck. A front end module adapted to receive a FOUP containing a plurality of substrates;
A central module with multiple processing tools;
A rear module coupled to the scanner;
At least one robot adapted to receive a substrate from the front end module and supply the substrate to either a processing tool and / or the rear module;
With
One of the plurality of processing tools is an apparatus for dispensing fluid during a semiconductor substrate processing operation, the apparatus comprising:
A first processing chamber;
A second processing chamber;
A dispensing arm assembly;
A dispensing arm access shutter positioned between the first processing chamber and the second processing chamber and movable between an open position and a closed position;
With
A track lithography tool wherein the dispensing arm assembly is movable from the first processing chamber to the second processing chamber when the dispensing arm access shutter is in the open position.

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