JP2011138929A - Wiring sheet, solar cell with wiring sheet, solar cell module, and method for manufacturing the wiring sheet and the solar cell module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring sheet capable of safely enhancing a filling factor of a rear-surface electrode type solar cell in a solar cell module, and to provide a solar cell with the wiring sheet, a solar cell module, and a method for manufacturing the wiring sheet and the solar cell module. <P>SOLUTION: The wiring sheet includes an insulating base material and a wiring disposed on one surface side of the insulating base material, and has a removed part of the wiring sheet, in a region in the vicinity of its end part, with at least one part removed in a thickness direction, and there are provided the solar cell with the wiring sheet, the solar cell module, and the method for manufacturing the wiring sheet and the solar cell module. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wiring sheet, a solar battery cell with a wiring sheet, a solar battery module, a method for manufacturing a wiring sheet, and a method for manufacturing a solar battery module.

In recent years, development of clean energy has been demanded due to problems of depletion of energy resources and global environmental problems such as an increase in CO _{2 in} the atmosphere. In particular, solar power generation using solar cells is a new energy source. It has been developed, put into practical use, and is on the path of development.

  Conventionally, a solar cell has formed a pn junction by diffusing an impurity having a conductivity type opposite to that of a silicon substrate into a light receiving surface of a monocrystalline or polycrystalline silicon substrate, for example, Double-sided electrode type solar cells manufactured by forming electrodes on the back surface opposite to the light receiving surface are mainly used. In a double-sided electrode type solar cell, it is also common to increase the output by the back surface field effect by diffusing impurities of the same conductivity type as the silicon substrate at a high concentration on the back surface of the silicon substrate. .

  In addition, a solar cell with a wiring sheet in which a back electrode type solar cell in which an electrode is formed only on the back surface of the silicon substrate without forming an electrode on the light receiving surface of the silicon substrate is provided on the wiring sheet (solar cell with wiring sheet) Research and development is also underway for (cell) (see, for example, Patent Document 1).

  Hereinafter, a conventional method for manufacturing a solar cell with a wiring sheet described in Patent Document 1 will be described with reference to the schematic cross-sectional views of FIGS.

  First, as shown in FIG. 29A, the back electrode type solar cell 80 is installed on the wiring sheet 100.

  Here, the solder 119 formed on the surface of the p-type silver electrode 106 in contact with the p + layer 102 on the back surface of the n-type silicon substrate 101 of the back electrode type solar cell 80 is formed on the glass epoxy substrate 111 of the wiring sheet 100. The surface of the n-type silver electrode 107 which is placed on the solder 119 formed on the surface of the p wiring 112 and is in contact with the n + layer 103 on the back surface of the n-type silicon substrate 101 of the back electrode type solar cell 80 The solder 119 formed on the wiring sheet 100 is placed on the solder 119 formed on the surface of the n wiring 113 formed on the glass epoxy substrate 111 of the wiring sheet 100.

  Then, by applying heat from the back electrode type solar cell 80 side to melt both the solders 119 and cooling them, as shown in FIG. 29 (b), for the p type of the back electrode type solar cell 80 The silver electrode 106 and the p wiring 112 of the wiring sheet 100 are connected by solder 119, and the n-type silver electrode 107 of the back electrode type solar cell 80 and the n wiring 113 of the wiring sheet 100 are connected by solder 119. Thus, the back electrode type solar cell 80 and the wiring sheet 100 are integrated to produce a solar cell with a wiring sheet.

  Patent Document 2 also prepares one printed circuit board having a wiring pattern that matches the electrode of the back electrode type solar cell for each back electrode type solar cell, and prints the electrodes and prints of the back electrode type solar cell. A method of manufacturing a solar cell with a wiring sheet by electrically connecting wiring patterns of a printed circuit board with lead wires after electrically connecting the wiring patterns of the substrate is disclosed.

JP 2005-340362 A JP 2009-43842 A

  In actual photovoltaic power generation, in the state of a solar cell module in which a solar cell with a wiring sheet produced as described above is sealed in a sealing material made of a transparent resin such as EVA (ethylene vinyl acetate). used.

  A solar cell module having a large amount of power generation per light receiving area has good characteristics, and a solar cell with a wiring sheet as described in Patent Document 1 is sealed in a sealing material. Even in a stopped solar cell module, it is desired to improve its characteristics.

  However, in the method of Patent Document 1, it has not yet been conceived to improve the power generation efficiency of the solar cell module by improving the filling rate of the back electrode type solar cells in the solar cell module.

  In order to solve this problem, as described in Patent Document 2, the end of the wiring sheet on which the back electrode type solar cells are arranged is folded back to the side opposite to the light receiving surface of the back electrode type solar cells. Proposal to install has been made.

  However, it has been demanded to produce a solar cell module having a higher filling rate of the back electrode type solar cells by further improving the accuracy of the folded position of the wiring sheet than the method described in Patent Document 2.

  In view of the above circumstances, an object of the present invention is to provide a wiring sheet, a solar cell with a wiring sheet, a solar battery module, and a wiring that can stably increase the filling rate of the back electrode type solar battery cells in the solar battery module. It is providing the manufacturing method of a sheet | seat, and the manufacturing method of a solar cell module.

  The present invention is a wiring sheet including an insulating base material and wiring installed on one surface side of the insulating base material, and at least a part in the thickness direction is removed in the vicinity of the end portion A wiring sheet having a removed portion.

  Here, in the wiring sheet of the present invention, the removed portion can be formed by removing at least a part of the insulating substrate.

  In the wiring sheet of the present invention, the removed portion can be formed by removing at least a part of the wiring.

  In the wiring sheet of the present invention, the removed portion can be formed continuously or intermittently in the plane.

  In the wiring sheet of the present invention, a plurality of removed portions may be provided in the plane.

  Moreover, the wiring sheet of this invention WHEREIN: The removal part can have a part which penetrates an insulating base material and wiring.

  Moreover, this invention contains said wiring sheet and a back electrode type photovoltaic cell, and the wiring of a wiring sheet has the wiring for 1st conductivity types, and the wiring for 2nd conductivity types. The back electrode type solar cell has a semiconductor substrate, a first conductivity type electrode and a second conductivity type electrode installed on one surface side of the semiconductor substrate, and the first conductivity type wiring and the first conductivity type wiring A solar cell with a wiring sheet in which a first conductivity type electrode is electrically connected, and a second conductivity type wiring and a second conductivity type electrode are electrically connected.

  Moreover, this invention is a solar cell module containing said photovoltaic cell with a wiring sheet.

  Further, the present invention includes a wiring sheet in which wiring is installed on one surface side of the insulating base and a back electrode type solar cell, and the wiring of the wiring sheet includes a first conductivity type wiring, A back electrode type solar battery cell having a semiconductor substrate, a first conductivity type electrode and a second conductivity type electrode installed on one surface side of the semiconductor substrate. The first conductivity type wiring and the first conductivity type electrode are electrically connected, and the second conductivity type wiring and the second conductivity type electrode are electrically connected. The sheet has a removed portion from which at least a part in the thickness direction is removed between the end portion of the wiring sheet and the connection portion of the back electrode type solar cell closest to the end portion, and Folded to the insulating substrate side, the back electrode type solar cells connected to the wiring sheet are sealed A solar cell module is sealed with.

  In the solar cell module of the present invention, it is preferable that a plurality of wiring sheets are included, and the insulating bases of the plurality of wiring sheets are arranged adjacent to each other so that at least a part thereof overlaps.

  Moreover, in the solar cell module of the present invention, the removed portion of the wiring sheet includes an insulating base material and a penetrating portion penetrating the wiring, and between the insulating base materials of the portion folded to the insulating base material side of the wiring sheet It is preferable that the sealing material interposed in is integrated with the outer sealing material through the penetrating portion.

  Moreover, the present invention includes a step of forming a wiring on one surface side of the insulating base material, and a step of removing at least a part of at least one of the insulating base material and the wiring in the thickness direction. It is a manufacturing method of a sheet.

  Moreover, in the manufacturing method of the wiring sheet of this invention, it is preferable to include the process of removing at least one part in a thickness direction by irradiating a laser beam to at least one of an insulating base material and wiring.

  In addition, the present invention seals a solar cell with a wiring sheet including a wiring sheet in which wiring is installed on one surface side of the insulating substrate and a back electrode type solar cell connected to the wiring of the wiring sheet. A method for manufacturing a solar cell module that is sealed using a material, between an end portion of a wiring sheet and a connection portion of a back electrode type solar cell closest to the end portion of an insulating substrate and wiring A step of removing at least a part in at least one thickness direction, a step of folding the wiring sheet back to the insulating base material at a position including a portion removed in the removing step, and using the sealing material for the wiring sheet And a step of sealing the solar cell module.

  Moreover, in the manufacturing method of the solar cell module of the present invention, the sealing step is performed after the first sealing material and the support are arranged in this order on the connection side of the back electrode type solar cell of the wiring sheet. A step of sealing the solar cell with the first sealing material, and after arranging the second sealing material and the protective member in this order on the side opposite to the connection side of the back electrode solar cell of the wiring sheet Sealing the wiring sheet with a second sealing material, and removing between the step of sealing with the first sealing material and the step of sealing with the second sealing material; It is preferable to perform the folding process.

  Moreover, in the manufacturing method of the solar cell module of this invention, it is preferable to include the process of arrange | positioning a sealing material between the insulating base materials of the part by which the wiring sheet was return | folded to the insulating base material side.

  Moreover, in the manufacturing method of the solar cell module of this invention, it is preferable to include the process of arranging a plurality of wiring sheets adjacently so that at least one part of an insulating base material may overlap.

  ADVANTAGE OF THE INVENTION According to this invention, the wiring sheet which can improve stably the filling rate of the back electrode type photovoltaic cell in a solar cell module, a photovoltaic cell with a wiring sheet, a solar cell module, the manufacturing method of a wiring sheet, and a solar cell A method for manufacturing a module can be provided.

It is a typical top view when an example of the wiring sheet of this invention is seen from the installation side of wiring. It is a typical top view when the wiring sheet shown in FIG. 1 is seen from the insulating base material side. It is a typical enlarged plan view when the wiring sheet shown in FIG. 1 and FIG. 2 is seen from the installation side of wiring. FIG. 4 is a schematic cross-sectional view taken along IV-IV in FIG. 3. It is a typical perspective view of an example of the wiring sheet roll by which the wiring sheet shown in FIG.1 and FIG.2 is wound up by the core. It is a typical side view illustrating an example of the usage method of the wiring sheet roll shown in FIG. FIG. 3 is a schematic plan view illustrating a part of the manufacturing process of an example of the method for manufacturing the wiring sheet shown in FIGS. 1 and 2. FIG. 5 is a schematic plan view illustrating another part of the manufacturing process of the example of the method for manufacturing the wiring sheet shown in FIGS. 1 and 2. It is a typical top view of the back surface of an example of a back electrode type photovoltaic cell used for the present invention. It is typical sectional drawing in alignment with XX of FIG. It is a typical top view when an example of the photovoltaic cell with a wiring sheet of this invention is seen from the light-receiving surface side. It is typical sectional drawing along XII-XII of FIG. (A) And (b) is typical sectional drawing illustrating about an example of the manufacturing method of the photovoltaic cell with a wiring sheet shown to FIG. 11 and FIG. It is typical sectional drawing illustrating an example of the process of installing a 1st sealing material in the installation side of the back electrode type photovoltaic cell of the photovoltaic cell with a wiring sheet shown to FIG. 11 and FIG. It is typical sectional drawing of an example after the back surface electrode type photovoltaic cell of the photovoltaic cell with a wiring sheet shown to FIG. 11 and FIG. 12 is sealed in the 1st sealing material. It is typical sectional drawing illustrating an example of the form which turned up the both ends of the wiring sheet of the photovoltaic cell with a wiring sheet shown in FIG. 15 to the insulating base material side. It is a typical expanded sectional view of the folding | turning part of the wiring sheet of the photovoltaic cell with a wiring sheet shown in FIG. It is a typical top view of an example of the form which connected the conducting wire to the folding | turning part of the wiring sheet of the photovoltaic cell with a wiring sheet shown in FIG. It is a typical top view of an example of the 2nd sealing material used for the present invention. It is a typical top view of an example of a back surface protection sheet used for the present invention. It is typical sectional drawing illustrating an example of the process of installing a 2nd sealing material and a back surface protection sheet in the return side of the wiring sheet of the photovoltaic cell with a wiring sheet shown in FIG. It is typical sectional drawing of an example of the solar cell module with which the photovoltaic cell with a wiring sheet shown in FIG. 16 was sealed in the sealing material. It is a typical top view illustrating attachment of the terminal box to the solar cell module shown in FIG. It is a typical top view illustrating an example of the form which installed the back electrode type solar cell shown in Drawing 9 and Drawing 10 on the wiring of the surface of the insulating substrate shown in Drawing 7. FIG. 9 is a schematic diagram illustrating an example of a process of installing the first sealing material on the back electrode type solar cell shown in FIG. 9 and FIG. 10 installed on the wiring on the surface of the insulating base shown in FIG. It is sectional drawing. It is typical sectional drawing of an example of the form after the back surface electrode type photovoltaic cell shown in FIG. 25 was sealed in the 1st sealing material. The typical perspective view of an example of the process of removing a part of insulating base material after the back surface electrode type photovoltaic cell shown in FIG. 26 was sealed in the 1st sealing material, and forming a removal part. It is. On the surface of the translucent substrate, two insulating base materials provided with wiring in which the electrodes of the back electrode type solar cells are electrically connected are arranged side by side so that at least a part thereof overlaps and removed. It is a typical perspective view illustrating an example of the process of forming a part. (A) And (b) is typical sectional drawing illustrated about the manufacturing method of the conventional photovoltaic cell with a wiring sheet.

  Embodiments of the present invention will be described below. In the drawings of the present invention, the same reference numerals represent the same or corresponding parts.

<Embodiment 1>
FIG. 1 shows a schematic plan view of an example of the wiring sheet of the present invention when viewed from the wiring installation side, and FIG. 2 shows the wiring sheet shown in FIG. 1 when viewed from the insulating substrate side. A schematic plan view is shown. Here, the wiring sheet 10 has the insulating base material 11 and the wiring 16 patterned in the shape shown in FIG.

  Further, the wiring sheet 10 is provided with a removal portion 61 in each of the end vicinity region 62a on one end side in the first direction 50 and in the end vicinity region 62b on the other end side. .

  Here, the removed portion 61 is a portion where at least a part of the wiring sheet 10 is removed in the thickness direction of the wiring sheet 10. In this example, the removed portion 61 is the insulating base material 11 and the wiring 16. Both of these are composed of a removed portion 61a which is a through-hole removed in the thickness direction and a removed portion 61b which is a portion where only the insulating base material 11 is removed in the thickness direction. For example, it may be configured from either the removed portion 61a or the removed portion 61b.

  In this example, the removal portion 61 a is intermittently formed along the second direction 51, and the removal portion 61 b is formed continuously along the second direction 51. The shape and number (for example, singular or plural) are not particularly limited, and wiring is performed in at least one of the end vicinity region 62a and the end vicinity region 62b, which is a partial region in the plane of the wiring sheet 10. A part of the sheet 10 (the insulating base material 11 and / or the wiring 16) may be removed in the thickness direction.

  Further, as shown in FIG. 1, it is preferable that a removal position guide mark 63 is formed on the wiring 16 so as to overlap a part of the removal portion 61. The removal position guide mark 63 can increase the accuracy of the formation position of the removal portion 61 in the formation step of the removal portion 61 described later.

  In this specification, the case where the angle formed by the first direction 50 and the second direction 51 is 90 ° will be described. However, in the present invention, the first direction 50 and the second direction 51 are different from each other. The angle between the first direction 50 and the second direction 51 may be, for example, within a range of 90 ° ± 14 °. Further, in the present specification, the first direction 50 and the second direction 51 each include any of the same direction, the opposite direction, and the bidirectional direction of the arrows in the drawings of the present invention, and are appropriately used depending on the situation. be able to.

  FIG. 3 shows a schematic enlarged plan view of the wiring sheet shown in FIGS. 1 and 2 when viewed from the wiring installation side. As shown in FIG. 3, the wiring 16 of the wiring sheet 10 includes an n-type wiring 12, a p-type wiring 13, a first connection wiring 14 a, and a second wiring that are installed on the surface of the insulating substrate 11. Connection wiring 14b.

  Here, the n-type wiring 12, the p-type wiring 13, the first connection wiring 14 a and the second connection wiring 14 b are each conductive, and the n-type wiring 12 and the p-type wiring 13 are respectively The first connection wiring 14 a and the second connection wiring 14 b are each formed in a shape extending in the second direction 51.

  One end of each of the plurality of n-type wirings 12 is electrically connected to the first connection wiring 14 a at the connection portion 21, and one end of each of the plurality of p-type wirings 13 is connected to the connection portion 21. It is electrically connected to the second connection wiring 14b.

  Then, one n-type comb wiring is constituted by one first connection wiring 14a and a plurality of strip-shaped n-type wirings 12 electrically connected thereto, and one second connection One p-type comb wiring is constituted by the wiring 14b and a plurality of strip-shaped p-type wirings 13 electrically connected thereto.

  Here, one p-type comb-shaped wiring and one n-type comb-shaped wiring are arranged so that their comb teeth face each other, and the band-shaped n-type wiring corresponding to the comb teeth of the n-type comb-shaped wiring The wiring 12 and the strip-shaped p-type wiring 13 corresponding to the comb teeth of the p-type comb-shaped wiring are arranged in the second direction 51 alternately with each other, thereby forming the alternating arrangement unit 20. is doing. The alternate arrangement portion 20 is a wiring region in which n-type wirings 12 and p-type wirings 13 are alternately arranged one by one.

  FIG. 4 shows a schematic cross-sectional view along IV-IV in FIG. Here, as shown in FIG. 4, in the wiring sheet 10, the n-type wiring 12 and the p-type wiring 13 are provided only on one surface of the insulating substrate 11, and the n-type wiring 12 is provided. And the p-type wiring 13 are alternately arranged one by one at a predetermined interval to constitute an alternating array portion 20. Here, the alternating arrangement | sequence part 20 becomes a connection location which is a location where the back surface electrode type photovoltaic cell mentioned later is electrically connected.

  In addition, as shown in FIG. 3, in one alternating array portion 20, between the end of the n-type wiring 12 opposite to the first connection wiring 14 a side and the second connection wiring 14 b, and A gap 18 is provided between the end of the p-type wiring 13 opposite to the second connection wiring 14b side and the first connection wiring 14a. The gap 18 is a region where the wiring 16 is not provided on the surface of the insulating substrate 11 of the wiring sheet 10.

  Further, in FIG. 3, one end of each of the plurality of p-type wirings 13 is electrically connected to the first side surface which is one side surface of the second connection wiring 14 b at the connection portion 21. Since one end of each of the plurality of n-type wirings 12 is electrically connected to the second side surface, which is the other side surface of the two connection wirings 14b, at the connection portion 21, it is adjacent to the first direction 50. The arranged alternate arrangement portions 20 are electrically connected by the second connection wiring 14b. Further, as shown in FIG. 1, since the wiring 16 is also formed in the end vicinity region 62 b, the alternating array portions 20 that are adjacent to the end vicinity region 62 b and arranged in the second direction 51 are arranged. They are also electrically connected. Thereby, in the wiring sheet 10 shown to FIG. 1 and FIG. 2, the alternate arrangement | sequence part 20 will be electrically connected in U shape.

  In addition, each of the end portion vicinity region 62a and the end portion vicinity region 62b is at least a part from one end in the first direction 50 of the wiring sheet 10 to the end of the alternating array portion 20 disposed at the position closest to the one end. It is an area. Here, each of the end vicinity region 62a and the end vicinity region 62b has a distance of 1 mm or more from one end in the first direction 50 of the wiring sheet 10 to one end side from the end of the alternating array portion 20 closest to the one end. It is preferable that it is the area | region to the location opened.

  Each of the end portion vicinity region 62a and the end portion vicinity region 62b is, for example, a region that enters from the one end in the first direction 50 of the wiring sheet 10 to the inside in the first direction 50 of the wiring sheet 10 by a distance of 10 mm or more and 150 mm or less. be able to.

  In the above, the insulating base material 11 can be used without particular limitation as long as it is an electrically insulating material. For example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN). ), Polyphenylene sulfide (PPS), polyvinyl fluoride (PVF), and a material containing at least one resin selected from the group consisting of polyimide (Polyimide) can be used.

  Moreover, the thickness of the insulating base material 11 is not specifically limited, For example, it is 25 micrometers or more and 150 micrometers or less.

  The insulating substrate 11 may have a single-layer structure consisting of only one layer or a multi-layer structure consisting of two or more layers.

  Further, the material of the wiring 16 can be used without any particular limitation as long as it is a conductive material. For example, a metal including at least one selected from the group consisting of copper, aluminum, and silver is used. Can do.

  Further, the thickness of the wiring 16 is not particularly limited, and can be, for example, 10 μm or more and 50 μm or less.

  Further, on at least a part of the surface of the wiring 16, for example, nickel (Ni), gold (Au), platinum (Pt), palladium (Pd), silver (Ag), tin (Sn), SnPb solder, and ITO You may install the electroconductive substance containing at least 1 sort (s) selected from the group which consists of (Indium Tin Oxide). In this case, there is a tendency that the electrical connection between the wiring 16 of the wiring sheet 10 and the electrode of the back electrode type solar battery cell to be described later can be improved, and the weather resistance of the wiring 16 can be improved.

  Further, at least a part of the surface of the wiring 16 may be subjected to a surface treatment such as a rust prevention treatment or a blackening treatment.

  Note that the wiring 16 may also have a single-layer structure consisting of only one layer or a multi-layer structure consisting of two or more layers.

  In the wiring sheet 10 shown in FIGS. 1 and 2, for example, the long wiring sheet 10 in which the patterns of the wiring 16 and the removal portion 61 shown in FIGS. 1 and 2 are continuously formed is wound around the core 22. For example, the wiring sheet roll shown in the schematic perspective view of FIG. 5 can be obtained by, for example, drawing it out to a required length as shown in the schematic side view of FIG.

  From the wiring sheet roll having the structure shown in FIG. 5 in which the wiring sheet 10 is wound in this way, for example, as shown in FIG. It becomes possible to produce solar cell modules of various sizes using a common wiring sheet roll.

  For example, the wiring sheet 10 shown in FIG. 1 and FIG. 2 drawn out from the wiring sheet roll in the first direction 50 is cut along the second direction 51 in the middle of the alternate arrangement portion 20, so that both ends of the wiring sheet 10 are in the middle. In the case of being composed of the alternately arranged portions 20 cut in step 1, for example, one strip-shaped conductive member is attached to the two alternately arranged portions 20 cut in the middle at one end of the cut wiring sheet 10. The wiring sheet 10 can be used so that its longitudinal direction is aligned with the second direction 51. Thereby, the n-type wiring 12 and the p-type wiring 13 arranged in the second direction 51 of the two alternating arrangement portions 20 located at one end of the cut wiring sheet 10 are electrically connected. Therefore, it is possible to electrically connect these two alternating arrangement portions 20 adjacent in the second direction 51 to electrically connect the alternating arrangement portions 20 of the wiring sheet 10 in a U shape.

  In addition, as the core 22, what can wind up the wiring sheet 10 can be used without particular limitation.

  Moreover, the wiring sheet 10 shown in FIG. 1 and FIG. 2 is not only the one obtained by pulling out from the wiring sheet roll as described above, for example, on the surface of the insulating base material 11 cut out in advance to a predetermined size. In addition, it is also possible to use one in which the wiring 16 and the removed portion 61 are formed in advance or after the insulating base material 11 is cut out.

  The wiring sheet 10 shown in FIGS. 1 and 2 can be manufactured as follows, for example.

  First, as shown in the schematic plan view of FIG. 7, the wiring 16 is formed on the surface of the insulating substrate 11. Here, the wiring 16 is formed by, for example, pasting a conductive material on the surface of the insulating substrate 11 and then patterning the conductive material by removing a part of the conductive material by photoetching or the like. can do. Further, by this patterning, the wiring 16 portion in the region corresponding to the formation portion of the removal portion 61a is removed.

  Next, as shown in the schematic perspective view of FIG. 8, the laser beam 83 is applied to each of the predetermined regions in the end vicinity region 62 a and the end vicinity region 62 b in the second direction from the insulating base material 11 side. By continuously irradiating along 51, only the insulating base material 11 is linearly removed in the thickness direction, thereby forming the removed portion 61b.

  Here, the removal portion 61b is continuously moved from the laser light irradiation device 82 to the insulating base material 11 while moving the laser light irradiation device 82 along the guide 81 extending in the second direction 51, for example. Can be formed by removing at least a part of the thickness in the thickness direction.

The laser beam 83 has a wavelength that is difficult to be absorbed by the wiring 16 and easily absorbed by the insulating base material 11, and only the insulating base material 11 can be removed in the thickness direction. For example, when the wiring 16 is made of copper and the insulating base material 11 is made of PEN, the laser beam 83 may be, for example, a CO ₂ laser beam (for example, a wavelength of 9.3 μm to 10.6 μm) can be used.

  Next, the laser beam 83 is irradiated to the removal region of the wiring 16 in the region corresponding to the formation portion of the removal portion 61a in each of the end vicinity region 62a and the end vicinity region 62b. As a result, the insulating base material 11 in the removal region of the wiring 16 is all removed in the thickness direction to form a removal portion 61a.

  For convenience of explanation, in FIG. 1, FIG. 2 and FIG. 8, the removal portion 61b is shown as only one straight line, but in this example, the removal portion 61b extends in the second direction 51. The four linear grooves are arranged in parallel at a predetermined interval. However, the number of the removal portions 61b is not limited to this, and the shape of the removal portions 61b is not limited to a continuous linear shape, and may be, for example, a broken line shape. The number and shape of the removed portions 61b may be appropriately set so as to be the optimal curvature radius of the folded portion of the wiring sheet 10 that can be determined from, for example, the elastic modulus of the insulating base material 11 and the processing rate of the wiring 16. Good.

  In the present embodiment, the removal portion 61a and the removal portion 61b are formed so that the formation region of the removal portion 61a and the formation region of the removal portion 61b are different from each other. For example, the removal portion 61a May be formed in a region overlapping with the removed portion 61b, and a part or all of the removed portion 61b may be used as the removed portion 61a.

  In the present embodiment, the removal portion 61 is formed by irradiating the wiring sheet 10 with the laser beam 83. Thereby, since the wavelength of the laser beam 83 can be appropriately selected as described above, only a specific material can be removed. Further, since the intensity and the irradiation diameter of the laser beam 83 can be easily changed and controlled, it is easy to make the removal portion 61 in an arbitrary shape and thickness. The method for forming the removed portion 61 is not limited to the irradiation of the laser beam 83 to the wiring sheet 10, and for example, a method of cutting the wiring sheet 10 with a cutting tool or etching the wiring sheet 10 may be used. it can.

  For example, as shown in FIGS. 1 and 2, when the removal position guide mark 63 is formed on the wiring 16 so as to overlap a part of the removal portion 61, the removal portion 61 such as the laser beam irradiation device 82 or the like. By aligning the forming means and the removal position guide mark 63 in advance, the removal portion 61 tends to be formed with improved accuracy of the formation position of the removal portion 61.

  Next, for example, a back electrode type solar cell having a back surface shown in the schematic plan view of FIG. 9 is prepared. Here, in the back electrode type solar cell 30, the n-type electrode 34 and the p-type electrode 35 are each formed in a strip shape, and the strip-shaped n-type electrode 34 and the strip-shaped electrode 35 for p-type are formed. On the back surface of the semiconductor substrate 31, they are alternately arranged one by one at a predetermined interval.

  In addition, an electrode non-forming portion 38 that is a portion where the n-type electrode 34 and the p-type electrode 35 are not formed is provided on a part of the periphery of the back electrode type solar battery cell 30. For example, the portion 38 can be provided with an alignment mark for installing the back electrode type solar battery cell 30 at an accurate position on the wiring sheet 10.

  Note that the shape and arrangement of the n-type electrode 34 and the p-type electrode 35 on the back surface of the back electrode type solar cell 30 are not limited to the configuration shown in FIG. 9, and the n-type wiring 12 of the wiring sheet 10. And any shape and arrangement that can be electrically connected to the p-type wiring 13.

  Further, at least part of the surface of the n-type electrode 34 and / or at least part of the surface of the p-type electrode 35 of the back electrode type solar cell 30, for example, nickel (Ni), gold (Au), Conductive substance containing at least one selected from the group consisting of platinum (Pt), palladium (Pd), silver (Ag), tin (Sn), titanium (Ti), SnPb solder, and ITO (Indium Tin Oxide) May be installed. In this case, the electrical connection between the wiring 16 of the wiring sheet 10 (n-type wiring 12 and p-type wiring 13) and the electrode of the back electrode type solar cell 30 (n-type electrode 34 and p-type electrode 35). There is a tendency that the weather resistance of the electrodes (the n-type electrode 34 and the p-type electrode 35) of the back electrode type solar battery cell 30 can be improved.

  Further, at least a part of the surface of the n-type electrode 34 and / or at least a part of the surface of the p-type electrode 35 of the back electrode type solar battery cell 30 is subjected to a surface treatment such as rust prevention treatment or blackening treatment. May be applied.

  FIG. 10 shows a schematic cross-sectional view along XX in FIG. Here, the back electrode type solar cell 30 is formed on the concave and convex surface side of the semiconductor substrate 31 such as an n-type or p type silicon substrate and the semiconductor substrate 31 serving as the light receiving surface of the back electrode type solar cell 30. The antireflection film 37 and the passivation film 36 formed on the back surface side of the semiconductor substrate 31 that is the back surface of the back electrode type solar battery cell 30 are included.

  Further, on the back side of the semiconductor substrate 31, an n-type impurity diffusion region 32 formed by diffusing an n-type impurity such as phosphorus and a p-type impurity formed by diffusing a p-type impurity such as boron, for example. Diffusion regions 33 are alternately formed at predetermined intervals, and an n-type electrode 34 is in contact with the n-type impurity diffusion region 32 through a contact hole provided in the passivation film 36 on the back surface side of the semiconductor substrate 31. A p-type electrode 35 is provided in contact with the p-type impurity diffusion region 33.

  A plurality of pn junctions are formed at the interface between the n-type impurity diffusion region 32 or the p-type impurity diffusion region 33 and the inside of the semiconductor substrate 31 on the back side of the semiconductor substrate 31 having n-type or p-type conductivity. Will be. Regardless of whether the semiconductor substrate 31 has n-type or p-type conductivity, the n-type impurity diffusion region 32 and the p-type impurity diffusion region 33 are joined to the inside of the semiconductor substrate 31, respectively. The electrode 34 and the p-type electrode 35 are respectively electrodes corresponding to a plurality of pn junctions formed on the back side of the semiconductor substrate 31.

  Further, as the semiconductor substrate 31, for example, a silicon substrate made of n-type or p-type polycrystalline silicon, single crystal silicon, or the like can be used. The semiconductor substrate 31 is preferably a single crystal in order to form a pn junction on the back side.

  Further, as the n-type electrode 34 and the p-type electrode 35, for example, an electrode made of a metal such as silver can be used.

  Further, as the passivation film 36, for example, a silicon oxide film, a silicon nitride film, or a stacked body of a silicon oxide film and a silicon nitride film can be used.

  Further, as the antireflection film 37, for example, a silicon nitride film or the like can be used.

  In the concept of the back electrode type solar cell in the present invention, both the n-type electrode 34 and the p-type electrode 35 are formed only on one surface side (back side) of the semiconductor substrate 31 described above. In addition to the above, so-called back contact solar cells (solar cell cells) such as MWT (Metal Wrap Through) cells (solar cells having a part of electrodes arranged in through holes provided in a semiconductor substrate). All of the solar cells having a structure in which current is taken out from the back surface side opposite to the light receiving surface side are included.

  In FIG. 11, the typical top view of an example of the photovoltaic cell with a wiring sheet of this invention is shown. Here, as for the photovoltaic cell with a wiring sheet, eight back electrode type solar cells 30 having the configuration shown in FIG. 9 and FIG. 10 have eight wirings 16 of one wiring sheet 10 shown in FIG. 1 and FIG. It has the structure each installed on the alternate arrangement | sequence part 20. FIG.

  FIG. 12 is a schematic cross-sectional view along XII-XII in FIG. As shown in FIG. 12, the solar cell with the wiring sheet has the wiring 16 of the wiring sheet 10 so that the back surface side of the back electrode type solar cell 30 faces the installation side of the wiring 16 of the wiring sheet 10. It is produced by installing the electrodes (n-type electrode 34 and p-type electrode 35) of the back electrode type solar battery cell 30 on the alternate arrangement part 20.

  In addition, the photovoltaic cell with a wiring sheet is prepared by installing the electrodes (the n-type electrode 34 and the p-type electrode 35) of the back electrode type solar cell 30 on the alternate arrangement portion 20 of the wiring 16 of the wiring sheet 10. Alternatively, the alternating array part 20 of the wirings 16 of the wiring sheet 10 may be installed on the electrodes (the n-type electrode 34 and the p-type electrode 35) of the back electrode type solar battery cell 30.

  Here, as shown in FIG. 12, in the solar cell with the wiring sheet, the n-type electrode 34 on the back surface side of the back electrode type solar cell 30 is installed on the surface of the insulating substrate 11 of the wiring sheet 10. The n-type wiring 12 and the p-type electrode 35 on the back surface of the back electrode type solar battery cell 30 are electrically connected to the n-type wiring 12 via the conductive adhesive 25. The p-type wiring 13 installed on the surface is electrically connected via a conductive adhesive 25.

  The connection between the wiring 16 (the n-type wiring 12 and the p-type wiring 13) of the wiring sheet 10 and the electrodes (the n-type electrode 34 and the p-type electrode 35) of the back electrode type solar cell 30 is performed by wiring. Since the wiring 16 of the sheet 10 and the electrode of the back electrode type solar battery cell 30 need only be connected so as to be in a conductive state, they are electrically connected via the conductive adhesive 25 as described above. For example, the wiring 16 of the wiring sheet 10 and the electrode of the back electrode solar cell 30 are in direct contact (that is, the n-type wiring 12 and the n-type electrode 34 are in direct contact). The p-type wiring 13 and the p-type electrode 35 may be in direct contact with each other.

  An insulating resin 17 is installed in a region other than the wiring 16 of the wiring sheet 10 and the electrodes of the back electrode solar cell 30 between the wiring sheet 10 and the back electrode solar cell 30. By installing the insulating resin 17 as described above, it is possible to obtain a solar cell with a wiring sheet in which the back electrode type solar cell 30 and the wiring sheet 10 are firmly joined by the insulating resin 17.

  In the solar cell with a wiring sheet having the above-described configuration, as described above, the adjacent alternately arranged portions 20 of the wiring sheet 10 of the solar cell with the wiring sheet are electrically connected. Adjacent back electrode type solar cells 30 on the wiring sheet 10 of the solar cells are electrically connected in series. Thereby, in the photovoltaic cell with a wiring sheet shown in FIG. 11, the back electrode type photovoltaic cell 30 is electrically connected in series in a U shape.

  In the solar cell with the wiring sheet shown in FIG. 11, the current generated by the light incident on the light receiving surface of the back electrode type solar cell 30 is the n-type electrode 34 and p of the back electrode type solar cell 30. The n-type wiring 12 and the p-type wiring 13 of the wiring sheet 10 are taken out from the type electrode 35. The current extracted to the n-type wiring 12 and the p-type wiring 13 of the wiring sheet 10 is extracted to the outside from the terminal ends 14 c and 14 d of the wiring 16 of the wiring sheet 10.

  Hereinafter, with reference to the schematic cross-sectional views of FIG. 13A and FIG. 13B, an example of a method for manufacturing a solar cell with a wiring sheet having the configuration shown in FIG. 11 and FIG. 12 will be described.

  First, as shown in FIG. 13A, a wiring sheet 10 having the configuration shown in FIGS. 1 and 2 is prepared, and a conductive adhesive 25 such as solder and an insulating resin 17 are provided on the surface of the wiring 16 of the wiring sheet 10. The resin composition 17a containing is applied.

  Moreover, the coating method of the resin composition 17a is not particularly limited, and for example, coating using a dispenser, inkjet coating, or a slit coater can be used.

  The insulating resin 17 preferably contains any one of an epoxy resin, an acrylic resin, and a mixed resin of an epoxy resin and an acrylic resin. In the present invention, it is needless to say that the insulating resin 17 is not limited to epoxy resin, acrylic resin, and mixed resin of epoxy resin and acrylic resin.

  Moreover, the resin composition 17a may contain one or more conventionally known additives such as a curing agent as components other than the resin component.

  Next, as shown in FIG. 13 (b), the n-type electrode 34 of the back electrode type solar cell 30 is positioned on the n type wire 12 of the wiring sheet 10, and the p of the back electrode type solar cell 30. The back electrode type solar cell 30 is placed on the wiring sheet 10 and heated so that the mold electrode 35 is positioned on the p-type wiring 13 of the wiring sheet 10.

  At this time, the resin composition 17 a is heated between the n-type electrode 34 and the n-type wiring 12 and the resin composition 17 a is heated between the p-type electrode 35 and the p-type wiring 13. The conductive adhesive 25 in the composition 17 a aggregates to electrically connect the n-type electrode 34 and the n-type wiring 12, and to electrically connect the p-type electrode 35 and the p-type wiring 13. On the other hand, the insulating resin 17 protrudes into the region between the connection portion of the n-type electrode 34 and the n-type wiring 12 and the connection portion of the p-type electrode 35 and the p-type wiring 13 and is connected to this region. It cures while filling.

  The solar cell with a wiring sheet having the configuration shown in FIGS. 11 and 12 is manufactured as described above.

  Here, when the insulating resin 17 is cured, the insulating resin 17 itself contracts. However, the insulating resin 17 is an insulating property of the passivation film 36 of the back electrode type solar battery cell 30 and the wiring sheet 10. Since it adheres to each of the base materials 11, the bonding between the back electrode type solar cell 30 and the wiring sheet 10 becomes stronger due to the shrinkage force when the insulating resin 17 is cured.

  Moreover, in this example, although the case where the resin composition 17a was apply | coated to each surface of the wiring 12 for n-types and the wiring 13 for p-types of the wiring sheet 10 was demonstrated, the n-type of the back electrode type photovoltaic cell 30 is demonstrated. The resin composition 17a may be applied to the surfaces of the electrode 34 and the p-type electrode 35, respectively.

  Hereinafter, with reference to FIGS. 14-23, an example of the manufacturing method of the solar cell module using the photovoltaic cell with a wiring sheet of the structure shown by FIG. 11 and FIG. 12 is demonstrated.

  First, as shown in the schematic cross-sectional view of FIG. 14, EVA (ethylene vinyl acetate) resin or the like between a pair of fluororesin sheets 1302 and 1303 made of fluororesin such as tetrafluoroethylene on a heatable plate 1301. After placing the underlay sheet 1305 with the intermediate resin 1304 sandwiched therebetween, the solar cell with the wiring sheet produced as described above is placed on the underlay sheet 1305. Here, the solar cell with the wiring sheet is installed on the underlay sheet 1305 so that the underlay sheet 1305 side becomes the insulating base material 11 side.

  And after installing the 1st sealing material 41a which consists of translucent resins, such as EVA, on the back surface electrode type photovoltaic cell 30 of the photovoltaic cell with a wiring sheet, it is a support body on the 1st sealing material 41a. As an example, a transparent substrate 40 transparent to sunlight such as a glass substrate is installed.

  Next, the plate 1301 is heated while pressure is applied between the translucent substrate 40 and the plate 1301, and as shown in the schematic cross-sectional view of FIG. The battery cell 30 can be sealed in the first sealing material 41a. Here, at least a part of the first sealing material 41a is cured by, for example, crosslinking.

  As the first sealing material 41a, a resin transparent to sunlight can be used without particular limitation, and among them, ethylene vinyl acetate (EVA) resin, epoxy resin, acrylic resin, urethane resin, olefin resin It is preferable to use at least one translucent resin selected from the group consisting of polyester resin, silicone resin, polystyrene resin, polycarbonate resin and rubber resin. In this case, since the first sealing material 41a is excellent in weather resistance and has high sunlight permeability, the output (particularly, short-circuit current or operating current) of the solar cell module described later is greatly impaired. And can be fixed to the translucent substrate 40 with sufficient strength. Thereby, it exists in the tendency which can ensure the long-term reliability of a solar cell module.

  Moreover, the heat processing at the time of sealing the back surface electrode type solar cell 30 of the solar cell with the wiring sheet in the first sealing material 41a is, for example, that the first sealing material 41a is made of EVA resin. In this case, for example, the first sealing material 41a can be heated to a temperature of 100 ° C. or higher and 200 ° C. or lower.

  The pressure bonding and heat treatment for sealing the back electrode type solar battery cell 30 of the solar cell with wiring sheet in the first sealing material 41a is, for example, a vacuum pressure bonding and heat treatment apparatus called a laminator, etc. Can be used.

  Here, the vacuum pressure bonding is a process of pressure bonding in an atmosphere reduced in pressure from atmospheric pressure. Further, when vacuum pressure bonding is used as the pressure bonding method, it is preferable in that gas bubbles tend not to remain in the first sealing material 41a.

  For example, the first sealing material 41a is thermally deformed by a laminator, and the first sealing material 41a is thermally cured, whereby the back electrode type of the solar cell with the wiring sheet is contained in the first sealing material 41a. The solar battery cell 30 is encapsulated and sealed.

  Next, as shown in the schematic cross-sectional view of FIG. 16, the insulating base material 11 of the solar cell with the wiring sheet after the back electrode type solar cell 30 is sealed in the first sealing material 41a. A sheet-like third sealing material 41b having a length in the first direction 50 shorter than that of the insulating base material 11 is installed at both ends of the surface in the first direction 50, respectively.

  Thereafter, both ends in the first direction 50 of the wiring sheet 10 of the solar cell with the wiring sheet are folded back toward the insulating base material 11, and one end of the third sealing material 41 b is wrapped by the folded wiring sheet 10.

  Here, as shown in the schematic enlarged cross-sectional view of FIG. 17, the portion where the wiring sheet 10 is folded is removed by removing a part of the insulating base material 11 along the second direction 51 in the thickness direction. The portion 61b is used.

  Since the thickness of the insulating base material 11 is reduced in each of the removed portions 61b of the end vicinity regions 62a and 62b of the wiring sheet 10, the wiring sheet is compared with a portion where the insulating base material 11 is not removed. The elasticity of 10 becomes weak and it is easy to bend. Therefore, since the folding position when the wiring sheet 10 is folded is determined at the removal portion 61b, the folding position can be determined with high accuracy, and the filling rate of the back electrode type solar cells 30 in the solar cell module can be stably improved. Can be made.

  Thus, it is possible to determine the folding position with high accuracy by making the wiring sheet 10 easy to fold, but on the other hand, the curvature radius of the folded part becomes small, so that the wiring 16 in the folded part can be obtained. For example, when the wiring 16 is made of a metal, there is a possibility that it will become brittle due to a work hardening phenomenon. Therefore, the removal width, removal thickness, and removal region of the insulating base material 11 in the removal portion 61b of the wiring sheet 10 so that both high accuracy of the folded position of the wiring sheet 10 and high strength of the wiring 16 can be achieved. It is preferable to control the radius of curvature of the folded portion of the wiring sheet 10 by appropriately setting the shape of the removed portion 61b such as the number of removed portions.

  Moreover, the curvature radius of the folded part of the wiring sheet 10 can be effectively controlled by giving the third sealing material 41b a predetermined thickness. In the present embodiment, it is preferable that the thickness of the third sealing material 41b be 50 μm or more and 300 μm or less.

  In this example, both ends of the wiring sheet 10 are folded back to the insulating base material 11 side, but only one end of the wiring sheet 10 may be folded back to the insulating base material 11 side.

  Further, as the third sealing material 41b, for example, the same type of resin as the first sealing material 41a may be used, a different type of resin may be used, or a plurality of types of resins are laminated. May be used. Regardless of the configuration of the third sealing material 41b, the wiring sheet 10 may be folded so that the third sealing material 41b has a desired thickness even after the sealing process. This is preferable from the viewpoint of being effective in controlling the radius of curvature of the portion.

  Next, as shown in the schematic plan view of FIG. 18, lead wires 1501 are respectively connected to the terminal ends 14 c and 14 d of the wiring 16 appearing on the insulating base material 11 side of the wiring sheet 10 by folding both ends of the wiring sheet 10. Connect electrically.

  In the example shown in FIG. 18, the strip-shaped conductive wire 1501 extending in the first direction 50 is connected to the terminal ends 14 c and 14 d of the wiring 16 of the wiring sheet 10, but the shape of the conductive wire 1501 is not limited to the strip shape. Needless to say.

  The material of the conductive wire 1501 is not particularly limited as long as it is a conductive material. For example, nickel (Ni), gold (Au), silver (Ag), copper (Cu), iron (Fe), platinum (Pt ), Titanium (Ti), palladium (Pd), silver (Ag), tin (Sn), SnPb solder and the like.

  Moreover, the installation method of the conducting wire 1501 is not particularly limited. For example, the terminal ends 14c and 14d of the wiring 16 of the wiring sheet 10 and the conducting wire 1501 can be electrically connected using a conventionally known solder or the like. .

  Next, for example, a sheet-like second sealing material 41c shown in the schematic plan view of FIG. 19 is prepared. Here, an opening 1601 is provided in a part of the second sealing material 41 c, and the opening 1601 is formed in a strip shape extending in the second direction 51. However, the shape of the opening 1601 is not limited to this shape, and may be any shape as long as the two conductive wires 1501 described above can pass therethrough, and may be, for example, a slit shape extending in the second direction 51.

  Further, as the second sealing material 41c, for example, the same type of resin as the first sealing material 41a and / or the third sealing material 41b may be used, or a different type of resin may be used. Good.

  Further, for example, a sheet-like back surface protection sheet 42 shown in the schematic plan view of FIG. 20 is prepared as an example of a protection member. Here, an opening 1701 is provided in a part of the back surface protection sheet 42, and the opening 1701 is formed in a strip shape extending in the second direction 51. However, the shape of the opening 1701 is not limited to this shape, and may be any shape as long as the two conductive wires 1501 described above can be passed through without being in direct contact with each other.

  Moreover, as the back surface protection sheet 42, for example, a weather-resistant film such as PET conventionally used can be used. Further, from the viewpoint of sufficiently suppressing the permeation of water vapor and oxygen into the sealing material to ensure long-term reliability, the back surface protection sheet 42 may include a metal film such as aluminum.

  Next, as shown in the schematic cross-sectional view of FIG. 21, a solar cell with a wiring sheet in which both ends of the wiring sheet 10 are folded back to the insulating substrate 11 side on a heatable plate 1301 as described above. The translucent substrate 40 side is installed.

  And the 2nd sealing material 41c shown in FIG. 19 is installed on the folded part of the both ends of the wiring sheet 10, and also the back surface protection sheet shown in FIG. 20 on the 2nd sealing material 41c. 42 is installed.

  Here, the second sealing material 41 c is installed so as to draw out the conducting wire 1501 from the opening 1601, and the back surface protection sheet 42 is installed so as to draw out the conducting wire 1501 from the opening 1701.

  Next, the plate 1301 is heated while pressure is applied between the back surface protection sheet 42 and the plate 1301, so that the first sealant 41 a and the third sealant are sealed as shown in the schematic cross-sectional view of FIG. A solar battery module is manufactured by sealing the solar battery cell with a wiring sheet in the sealing material 41 which consists of the stop material 41b and the 2nd sealing material 41c.

  Here, at least a part of each of the third sealing material 41b and the second sealing material 41c is cured by, for example, crosslinking. Also, at least a part of the first sealing material 41a can be further cured by, for example, crosslinking.

  Moreover, you may form the removal part 61a which is a through-hole which penetrates each of the insulating base material 11 and the wiring 16 to thickness direction like the wiring sheet 10 shown, for example in FIG. 1 and FIG. Thereby, the sealing material 41 interposed between the insulating base materials 11 of the portion folded back to the insulating base material 11 side of the wiring sheet 10 is connected to the outer sealing material 41 through the removed portion 61a which is a through hole. Since it can integrate, the sealing material 41 can be more reliably filled in the part turned back to the insulating base material 11 side of the wiring sheet 10.

  Further, the back surface protection sheet 42 can be completely adhered to a portion where it is difficult to adhere the back surface protection sheet 42 such as the peripheral portion of the sealing material 41 by using a moisture permeation prevention tape such as a butyl rubber tape.

  Further, for example, as shown in the schematic plan view of FIG. 23, the terminal box 2001 is connected by connecting the lead wire 1501 drawn out from the opening 1701 of the back surface protection sheet 42 to the output terminal 2002 of the terminal box 2001. It can also be attached. Here, the electrical connection method between the conductive wire 1501 and the output terminal 2002 is not particularly limited, and for example, there is a method of connecting using a conventionally known solder or the like.

  Further, for example, a frame made of an aluminum alloy or the like can be attached so as to surround the outer periphery of the solar cell module.

  In the solar cell module produced as described above, the light receiving surface of the solar cell module is sealed in the sealing material in a state where both ends of the wiring sheet of the solar cell with the wiring sheet are folded back. As many light-receiving surfaces as possible of the back electrode type solar cells can be arranged on the surface of the translucent substrate.

  Furthermore, since the folding position of the wiring sheet 10 can be determined with high accuracy, the dimensional tolerance between the wiring sheet 10 and the translucent substrate 40 can be reduced. Therefore, the back electrode type solar cell 30 in the solar cell module. Since the amount of power generation (power generation efficiency) per light receiving area of the solar cell module is increased, the characteristics of the solar cell module can be improved.

  In addition, as described above, the wiring sheet can be easily folded by providing the removed part in which at least a part of the wiring sheet is removed in the thickness direction at the part where the wiring sheet of the solar cell with the wiring sheet is folded. And by making the said removal part into the through-hole penetrated in the thickness direction of a wiring sheet, it can be more reliably filled with the sealing material in the area | region enclosed by the folding | turning part of the wiring sheet. Further, the removal portion can be easily formed by forming the removal portion by laser light irradiation.

  In addition, the electric current which generate | occur | produced when light injects into the light-receiving surface of the back electrode type photovoltaic cell 30 of the solar cell module produced as mentioned above is the n-type electrode 34 of the back electrode type solar cell 30 and p. The n-type wiring 12 and the p-type wiring 13 of the wiring sheet 10 are taken out from the type electrode 35. The current extracted to the n-type wiring 12 and the p-type wiring 13 of the wiring sheet 10 is transmitted from the terminal ends 14c and 14d of the wiring 16 of the wiring sheet 10 to the conductive member 71, the conductive wire 1501, and the output terminal of the terminal box 2001. It will be taken out of the solar cell module through 2002.

<Embodiment 2>
The present embodiment is characterized in that the removed portion is formed after electrically connecting the wiring on the surface of the insulating base and the electrode of the back electrode type solar battery cell.

  First, as shown in FIG. 7, the wiring 16 is formed on the surface of the insulating substrate 11. Next, as shown in the schematic plan view of FIG. 24, the back electrode type solar cell 30 shown in FIGS. 9 and 10 is installed on the wiring 16 on the surface of the insulating base material 11 shown in FIG. The wiring on the surface of the insulating substrate and the electrode of the back electrode type solar battery cell are electrically connected.

  Next, as shown in the schematic cross-sectional view of FIG. 25, EVA (ethylene vinyl acetate) resin is placed between a pair of fluororesin sheets 1302 and 1303 made of fluororesin such as tetrafluoroethylene on a heatable plate 1301. An underlay sheet 1305 having a structure in which an intermediate resin 1304 is sandwiched is installed.

  And after installing the insulating base material 11 shown in FIG. 7 in which the back electrode type solar cell 30 shown in FIG. 9 and FIG. 10 is installed on the sheet 1305 for the underlay, on the back electrode type solar cell 30 The 1st sealing material 41a and the translucent board | substrate 40 are installed in this order.

  Next, the plate 1301 is heated while applying pressure between the translucent substrate 40 and the plate 1301, so that the back electrode type solar battery cell 30 is formed in the first cross section as shown in the schematic cross-sectional view of FIG. It seals in the sealing material 41a.

  Next, as shown in the schematic perspective view of FIG. 27, the laser beam 83 is emitted from the insulating base material 11 side to the predetermined direction in each of the end vicinity area 62a and the end vicinity area 62b in the second direction. The removal part 61b is formed by irradiating continuously along 51 and removing only the insulating base material 11 linearly in the thickness direction. The removal of the portion of the wiring 16 in the region corresponding to the formation portion of the removal portion 61a can be performed in advance together with the patterning of the wiring 16 when the wiring 16 is formed, for example.

  Here, the formation position of the removal portion 61b in the first direction 50 can be determined with reference to the end of the translucent substrate 40 in the first direction 50. Thereby, while ensuring the insulation strength of the solar cell module, the removal portion 61b is more accurately located at the folded portion where the area of the light receiving surface of the back electrode type solar cell 30 appearing on the surface of the translucent substrate 40 is maximized. Can be formed.

  Further, for example, by forming the removed portion 61b so as to be 5 mm or more away from the end in the first direction 50 of the translucent substrate 40 and folding the wiring sheet, the translucent substrate 40 becomes the outer periphery of the solar cell module. When assembled in a frame made of an alloy or the like, the distance between the wiring 16 on the insulating substrate 11 and the frame is maintained, and the insulation strength between the wiring 16 on the insulating substrate 11 and the frame is ensured. can do.

  Next, in the same manner as in the first embodiment, the removal portion 61a is formed in a region different from the formation region of the removal portion 61b in each of the end portion vicinity region 62a and the end portion vicinity region 62b. In the present embodiment, similarly to the first embodiment, the removal portion 61a and the removal portion 61b are formed so that the formation region of the removal portion 61a and the formation region of the removal portion 61b are different from each other. However, for example, the removal portion 61a may be formed in a region overlapping with the removal portion 61b, and a part or all of the removal portion 61b may be used as the removal portion 61a.

  Thereafter, in the same manner as in the first embodiment, the conductive wire 1501 is drawn through the opening 1601 of the second sealing material 41c and the opening 1701 of the back surface protection sheet 42 so that the solar cell with a wiring sheet passes therethrough. A solar cell module is manufactured by sealing in the sealing material 41 between the optical board | substrate 40 and the back surface protection sheet 42. FIG.

  Since the description other than the above in the present embodiment is the same as that in the first embodiment, the description thereof is omitted here.

<Embodiment 3>
In the present embodiment, at least a part of two insulating base materials each provided with a wiring in which the electrode of the back electrode type solar battery cell is electrically connected is overlapped on the surface of the translucent substrate. The removal portion is formed by arranging adjacent to each other.

  First, as shown in FIG. 7, the wiring 16 is formed on the surface of the insulating substrate 11. Next, as shown in FIG. 24, the back electrode type solar cells 30 shown in FIGS. 9 and 10 are installed on the wiring 16 on the surface of the insulating base 11 shown in FIG. The wiring on the front surface and the electrode of the back electrode type solar battery cell are electrically connected. The steps so far are the same as in the second embodiment.

  Next, as described above, two sheets of the insulating base material 11 including the wiring 16 to which the electrodes of the back electrode type solar cells 30 are electrically connected are arranged next to each other so that at least a part thereof overlaps. In this state, as shown in FIG. 25, the insulating base material 11 arranged in an overlapping manner is placed on the underlay sheet 1305. Then, the 1st sealing material 41a and the translucent board | substrate 40 are installed in this order on the back electrode type photovoltaic cell 30. FIG.

  Next, by heating the plate 1301 while applying pressure between the translucent substrate 40 and the plate 1301, as shown in FIG. 26, the back electrode type solar cell 30 is placed in the first sealing material 41a. To seal.

  Next, as shown in the schematic perspective view of FIG. 28, the laser beam 83 is applied to each of the predetermined regions in the end vicinity region 62a and the end vicinity region 62b from the insulating base material 11 side in the second direction. The removal part 61b is formed by irradiating continuously along 51 and removing at least one part of the insulating base material 11 linearly in the thickness direction. The removal of the portion of the wiring 16 in the region corresponding to the formation portion of the removal portion 61a can be performed in advance together with the patterning of the wiring 16 when the wiring 16 is formed, for example.

  Here, the intensity of the laser beam 83 applied to the portion where the insulating base material 11 overlaps may be made larger than the intensity of the laser light 83 applied to the portion where the insulating base material 11 does not overlap. Thereby, in the part where the insulating base material 11 overlaps and the part where the thickness of the insulating base material 11 is thick, a larger amount of the insulating base material 11 is removed than the part where the insulating base material 11 does not overlap. Therefore, the thickness after removal of the insulating base material 11 can be made more uniform over the entire second direction 51.

  Next, in the same manner as in the first and second embodiments, the removal portion 61a is formed in a region different from the formation region of the removal portion 61b in each of the end portion vicinity region 62a and the end portion vicinity region 62b. To do. In the present embodiment, similarly to the first and second embodiments, the removal portion 61a and the removal portion 61b are formed such that the formation region of the removal portion 61a and the formation region of the removal portion 61b are different from each other. However, for example, the removal portion 61a may be formed in a region overlapping the removal portion 61b, or a part or all of the removal portion 61b may be used as the removal portion 61a.

  Thereafter, in the same manner as in the first and second embodiments, the conductive wire 1501 is provided with a wiring sheet so as to be drawn out from the opening 1601 of the second sealing material 41c and the opening 1701 of the back surface protection sheet 42, respectively. A solar battery module is manufactured by sealing the solar battery cell in a sealing material 41 between the translucent substrate 40 and the back surface protective sheet 42.

  Since the description other than the above in the present embodiment is the same as that in the first and second embodiments, the description thereof is omitted here.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  INDUSTRIAL APPLICATION This invention can be utilized for the manufacturing method of a wiring sheet, a photovoltaic cell with a wiring sheet, a solar cell module, a wiring sheet, and a solar cell module.

  10, 100 wiring sheet, 11 insulating substrate, 12 n-type wiring, 13 p-type wiring, 14a first connection wiring, 14b second connection wiring, 14c, 14d termination, 16 wiring, 17 insulation Resin, 17a resin composition, 18 gap, 20 alternating array part, 21 connection part, 22 core, 25 conductive adhesive, 30, 80 back electrode type solar cell, 31 semiconductor substrate, 32 n-type impurity diffusion region, 33 p-type impurity diffusion region, 34 n-type electrode, 35 p-type electrode, 36 passivation film, 37 antireflection film, 38 electrode non-formation part, 40 translucent substrate, 41 sealing material, 41a first sealing Stop material, 41b 3rd sealing material, 41c 2nd sealing material, 42 Back surface protection sheet, 50 1st direction, 51 2nd direction, 61, 61a, 61b removal part, 62a, 62b edge part Side region, 63 removal position guide mark, 81 guide, 82 laser light irradiation device, 83 laser light, 101 n-type silicon substrate, 102 p + layer, 103 n + layer, 106 p-type silver electrode, 107 n-type silver Electrode, 111 glass epoxy substrate, 112 p wiring, 113 n wiring, 119 solder, 1301 plate, 1302, 1303 fluororesin sheet, 1304 intermediate resin, 1305 underlay sheet, 1501 conductor, 1601, 1701 opening, 2001 terminal box, 2002 Output terminal.

Claims (17)

A wiring sheet comprising an insulating substrate and wiring installed on one surface side of the insulating substrate,
The wiring sheet which has the removal part from which at least one part in the thickness direction was removed in the edge part vicinity area | region.   The wiring sheet according to claim 1, wherein the removed portion is formed by removing at least a part of the insulating base material.   The wiring sheet according to claim 1, wherein the removed portion is formed by removing at least a part of the wiring.   The wiring sheet according to claim 1, wherein the removed portion is formed continuously or intermittently in a plane.   The wiring sheet according to claim 1, wherein a plurality of the removal portions are provided in the plane.   The wiring sheet according to claim 1, wherein the removed portion has a portion that penetrates the insulating base material and the wiring. A wiring sheet according to any one of claims 1 to 6,
A back electrode type solar cell, and
The wiring of the wiring sheet has a first conductivity type wiring and a second conductivity type wiring,
The back electrode type solar cell has a semiconductor substrate, a first conductivity type electrode and a second conductivity type electrode installed on one surface side of the semiconductor substrate,
The first conductive type wiring and the first conductive type electrode are electrically connected;
The second conductivity type wiring and the second conductivity type electrode are electrically connected;
Solar cell with wiring sheet.   The solar cell module containing the photovoltaic cell with a wiring sheet of Claim 7. A wiring sheet in which wiring is installed on one surface side of the insulating substrate, and a back electrode type solar cell,
The wiring of the wiring sheet has a first conductivity type wiring and a second conductivity type wiring,
The back electrode type solar cell has a semiconductor substrate, a first conductivity type electrode and a second conductivity type electrode installed on one surface side of the semiconductor substrate,
The first conductive type wiring and the first conductive type electrode are electrically connected;
The second conductivity type wiring and the second conductivity type electrode are electrically connected;
The wiring sheet has a removed portion from which at least a part in the thickness direction is removed between an end portion of the wiring sheet and a connection portion of the back electrode type solar cell closest to the end portion. And is folded back to the insulating substrate side,
The solar cell module in which the said back surface electrode type photovoltaic cell connected to the said wiring sheet is sealed using the sealing material.   The solar cell module according to claim 9, wherein the solar cell module includes a plurality of the wiring sheets and is arranged adjacent to each other so that at least a part of the insulating base material of the plurality of wiring sheets overlaps. The removed portion of the wiring sheet includes a penetrating portion that penetrates the insulating base material and the wiring,
The sealing material interposed between the insulating base materials of the portion folded to the insulating base material side of the wiring sheet is integrated with an outer sealing material through the through portion. 10. The solar cell module according to 10. Forming a wiring on one surface side of the insulating substrate;
And a step of removing at least a part of at least one of the insulating base material and the wiring in the thickness direction.   The manufacturing method of the wiring sheet of Claim 12 including the process of removing at least one part in the thickness direction by irradiating a laser beam to at least one of the said insulating base material and the said wiring. Using a sealing material, a solar cell with a wiring sheet including a wiring sheet in which wiring is installed on one surface side of an insulating substrate and a back electrode type solar cell connected to the wiring of the wiring sheet. A method for manufacturing a solar cell module for sealing,
At least a part in the thickness direction of at least one of the insulating base material and the wiring is removed between an end portion of the wiring sheet and a connection portion of the back electrode type solar cell closest to the end portion. Process,
A step of folding the wiring sheet to the insulating substrate side at a position including the location removed in the removing step;
And a step of sealing the wiring sheet using a sealing material.   In the sealing step, after the first sealing material and the support are installed in this order on the connection side of the back electrode type solar cell of the wiring sheet, the back electrode type solar cell is connected to the first electrode. A step of sealing with a sealing material; and after the second sealing material and a protective member are installed in this order on the side of the wiring sheet opposite to the connection side of the back electrode solar cell, the wiring sheet is Sealing with the second sealing material, and removing between the step of sealing with the first sealing material and the step of sealing with the second sealing material, and The method for manufacturing a solar cell module according to claim 14, wherein the step of folding is performed.   The manufacturing method of the solar cell module of Claim 14 or 15 including the process of installing a 3rd sealing material between the said insulating base materials of the part by which the said wiring sheet was turned back by the said insulating base material side. .   The manufacturing method of the solar cell module according to any one of claims 14 to 16, comprising a step of arranging a plurality of the wiring sheets adjacent to each other so that at least a part of the insulating base material overlaps.

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