JP2011118163A5

JP2011118163A5 -

Info

Publication number: JP2011118163A5
Application number: JP2009275618A
Authority: JP
Filing date: 2009-12-03
Publication date: 2012-11-01

Description

上記目的を達成するために、本発明は次の構成を備える。
すなわち、光電気モジュールについては、支持基板の一方の面に光導波路が形成され、該光導波路の一方側と他方側とにそれぞれ光素子が搭載され、前記支持基板の一方の面には接続パターンが、他方の面には実装用のパッドが前記接続パターンと電気的に接続して形成され、前記光導波路は、第１のクラッド層、コア、第２のクラッド層が積層して形成され、前記コアの一方側と他方側のそれぞれには溝が形成され、前記溝は、光の投入射面である端面が前記コアの光信号の進行方向に対して垂直面となり、前記端面に対向する面が前記光素子に向けて開いた傾斜面となり、前記傾斜面がミラーとして形成され、前記溝内に、前記ミラーを封止して前記第２のクラッド層が形成され、前記光素子は、前記光導波路の表層である前記第２のクラッド層上に、前記ミラーに対して所定の位置となるよう位置合わせして光学的に接続され、前記接続パターンと電気的に接続して搭載されていることを特徴とする。
なお、前記傾斜面は、金などの反射率の高い金属をスパッタリング等によって被着されてミラー面となる。金等のミラー材を被着することなく、コアの基材によってミラー面とすることも可能である。 In order to achieve the above object, the present invention comprises the following arrangement.
That is, for the photoelectric module, an optical waveguide is formed on one surface of the support substrate, and optical elements are mounted on one side and the other side of the optical waveguide, respectively, and a connection pattern is formed on one surface of the support substrate. However, a mounting pad is formed on the other surface in electrical connection with the connection pattern, and the optical waveguide is formed by laminating a first cladding layer, a core, and a second cladding layer, A groove is formed on each of the one side and the other side of the core, and the end surface, which is a light incident surface, is perpendicular to the traveling direction of the optical signal of the core and faces the end surface. The surface becomes an inclined surface that opens toward the optical element, the inclined surface is formed as a mirror, the mirror is sealed in the groove, and the second cladding layer is formed . The second core which is a surface layer of the optical waveguide. The head layer, said aligned to a predetermined position is optically connected to the mirror, characterized in that it is mounted the connecting pattern are electrically connected.
The inclined surface becomes a mirror surface when a highly reflective metal such as gold is deposited by sputtering or the like. A mirror surface can be formed by a core base material without depositing a mirror material such as gold.

また、前記第１のクラッド層は、前記支持基板の一方の面の全面を覆うように形成されていることを特徴とする。The first clad layer is formed so as to cover the entire surface of one surface of the support substrate.

また、光電気モジュール基板として、実装基板上に、光導波路、及び光導波路の一方側と他方側とに光素子が搭載された光電気モジュールと、半導体パッケージと、前記光電気モジュールと前記半導体パッケージとの間に介在するドライバICまたはアンプICとが搭載され、前記光電気モジュールは、支持基板の一方の面に光導波路が形成され、前記支持基板の一方の面には接続パターンが、他方の面には実装用のパッドが前記接続パターンと電気的に接続して形成され、前記光導波路は、第１のクラッド層、コア、第２のクラッド層が積層して形成され、前記コアの一方側と他方側のそれぞれには溝が形成され、前記溝は、光の投入射面である端面が前記コアの光信号の進行方向に対して垂直面となり、前記端面に対向する面が前記光素子に向けて開いた傾斜面となり、前記傾斜面がミラーとして形成され、前記溝内に、前記ミラーを封止して前記第２のクラッド層が形成され、前記光素子は、前記光導波路の表層である前記第２のクラッド層上に、前記ミラーに対して所定の位置となるよう位置合わせして光学的に接続され、前記接続パターンと電気的に接続して搭載されていることを特徴とする。
また、前記第１のクラッド層は、前記支持基板の一方の面の全面を覆うように形成されていることを特徴とする。 Further, as an optoelectric module substrate, an optical waveguide on a mounting substrate, an optoelectric module in which an optical element is mounted on one side and the other side of the optical waveguide, a semiconductor package, the optoelectric module, and the semiconductor package A driver IC or an amplifier IC interposed between the optical module and the photoelectric module, an optical waveguide is formed on one surface of the support substrate, a connection pattern is formed on one surface of the support substrate, and the other the surface formed pad for mounting is connected to the connection pattern electrically, the optical waveguide, the first cladding layer, a core, a second cladding layer is formed by laminating, one of the core A groove is formed on each of the side and the other side. The groove has an end surface that is a light incident surface that is perpendicular to the optical signal traveling direction of the core, and a surface that faces the end surface is the light. Suitable for elements The inclined surface is formed as a mirror, and the second cladding layer is formed by sealing the mirror in the groove, and the optical element is a surface layer of the optical waveguide. The second clad layer is optically connected to the mirror so as to be positioned at a predetermined position, and is mounted in electrical connection with the connection pattern. .
The first clad layer is formed so as to cover the entire surface of one surface of the support substrate.

光導波路のコアは、クラッド材にくらべて使用波長域における屈折率が大きいことが必要である。コア層２０を形成するコア材には、光素子の波長域において光透過性を有するとともに、光素子の波長域における屈折率がクラッドにくらべて大きい材料を選択して使用する。クラッド用及びコア用の樹脂材は、市販されている樹脂材から適宜選択することができる。 The core of the optical waveguide needs to have a higher refractive index in the operating wavelength range than the clad material. For the core material forming the core layer 20, a material having optical transparency in the wavelength region of the optical element and having a higher refractive index in the wavelength region of the optical element than that of the cladding is selected and used. The resin material for clad and core can be appropriately selected from commercially available resin materials.

図９に示す光電気モジュール３０は、独立した個片のモジュール品として形成された状態を示す。実際の工程においては、図１０（ａ）に示すように、光電気モジュール３０となる単位基板３０ａを縦横に整列した配置に形成した大判の基板３５から、単位基板３０ａを個片に切り離し（図１０（ｂ））、切り離した単位基板３０ａごとに光素子３２ａ、３２ｂを搭載して光電気モジュール３０とする（図１０（ｃ））。 The optoelectric module 30 shown in FIG. 9 shows a state formed as an independent individual module product. In the actual process, as shown in FIG. 10A, the unit substrate 30a is separated into individual pieces from the large substrate 35 in which the unit substrates 30a to be the photoelectric modules 30 are arranged in the vertical and horizontal directions (FIG. 10A). 10 (b) ) , the optical elements 32a and 32b are mounted on each separated unit substrate 30a to form the photoelectric module 30 (FIG. 10C).

Claims

An optical waveguide is formed on one surface of the support substrate, and optical elements are respectively mounted on one side and the other side of the optical waveguide,
A connection pattern is formed on one surface of the support substrate, and a mounting pad is electrically connected to the connection pattern on the other surface,
The optical waveguide is formed by laminating a first cladding layer, a core, and a second cladding layer,
A groove is formed on each of one side and the other side of the core,
The groove has an end surface which is a light incident surface as a surface perpendicular to the optical signal traveling direction of the core, and a surface facing the end surface is an inclined surface opened toward the optical element,
The inclined surface is formed as a mirror;
In the groove, the second clad layer is formed by sealing the mirror,
The optical element is mounted on the second cladding layer, which is a surface layer of the optical waveguide, optically connected to the mirror and electrically connected to the connection pattern. A featured photoelectric module.

2. The photoelectric module according to claim 1, wherein the first clad layer is formed so as to cover the entire surface of one surface of the support substrate.

Forming a large-sized support substrate in which a connection pattern is formed on one surface and a mounting pad is electrically connected to the connection pattern on the other surface;
Covering the one surface of the support substrate with a first cladding layer;
Forming a core layer on the first cladding layer;
Patterning the core layer and forming a core for each unit substrate;
A step of forming a groove on the core, where an end surface that is a light incident surface is a surface perpendicular to the longitudinal direction of the core and a surface that faces the end surface is an inclined surface;
A step of processing the inclined surface as a mirror;
Burying the grooved core and covering the surface of the substrate with a second cladding layer;
Forming a connection wiring electrically connected to the connection pattern on the first cladding layer and the second cladding layer;
Dividing the large substrate on which the second cladding layer is formed into individual unit substrates;
And a step of mounting an optical element on the unit substrate that is electrically connected to the connection wiring.

4. The method of manufacturing an optoelectric module according to claim 3, wherein gold is deposited on the inclined surface as a process using the inclined surface as a mirror.

In the step of forming the connection wiring,
Forming a via electrically connected to the connection pattern in the first cladding layer and the second cladding layer, and forming a connection pad connected to the optical element on the surface of the second cladding layer; 5. The method of manufacturing an optoelectric module according to claim 3 or 4.

The photoelectric module according to claim 3, further comprising a step of covering a surface of the second cladding layer with a protective film as a subsequent step of the step of forming the connection wiring. Production method.

The step of mounting the optical element on the unit substrate includes mounting the mirror formed on the core and the planar position of the light emitting / receiving element of the optical element in alignment with each other. The manufacturing method of the photoelectric module as described in any one of Claims.

On the mounting board,
An optical waveguide, a photoelectric module in which an optical element is mounted on one side and the other side of the optical waveguide, a semiconductor package, and a driver IC or an amplifier IC interposed between the photoelectric module and the semiconductor package Installed,
The photoelectric module is
An optical waveguide is formed on one side of the support substrate,
A connection pattern is formed on one surface of the support substrate, and a mounting pad is electrically connected to the connection pattern on the other surface,
The optical waveguide is formed by laminating a first cladding layer, a core, and a second cladding layer,
A groove is formed on each of one side and the other side of the core,
The groove has an end surface which is a light incident surface as a surface perpendicular to the optical signal traveling direction of the core, and a surface facing the end surface is an inclined surface opened toward the optical element,
The inclined surface is formed as a mirror;
In the groove, the second clad layer is formed by sealing the mirror,
The optical element is mounted on the second cladding layer, which is a surface layer of the optical waveguide, optically connected to the mirror and electrically connected to the connection pattern. A featured photoelectric module substrate.

9. The photoelectric module substrate according to claim 8, wherein the first clad layer is formed so as to cover the entire surface of one surface of the support substrate.