JP2011192698A - Method and apparatus of determining sealing resin surface shape and sealing resin filling amount of semiconductor device, method of manufacturing semiconductor device, semiconductor device manufactured by the same method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To rapidly determine a surface shape of sealing resin and a filling amount of the sealing resin with high accuracy. <P>SOLUTION: The determining apparatus includes a projector 21 for projecting a pattern on a surface of a translucent resin 15, a CCD camera 22 for photographing the pattern projected on the surface of the translucent resin 15, and an arithmetic processing unit 23 for determining the surface shape or filling amount of the translucent resin 15 based on a pattern image captured by the CCD camera 22. As the surface shape of the translucent resin 15 changes according to the filling amount of the translucent resin 15 on a recessed part 11b of a package 11 and an image of the pattern changes, the surface shape or filling amount of the translucent resin 15 can be determined based on the captured pattern image. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a determination method of a sealing resin surface shape or a sealing resin filling amount in a semiconductor device formed by sealing a light emitting element with a resin, a determination device, a manufacturing method of a semiconductor device, and a semiconductor manufactured by the manufacturing method Relates to the device.

  As a light emitting element of this type, there is a light emitting diode (LED). In recent years, a high brightness and high output device has been developed and utilized in various fields by taking advantage of characteristics such as low power consumption, small size, and light weight. Yes. For example, it is used for the backlight of LED display devices, liquid crystal display devices, the light source of various other display devices, the light source of illumination devices, and the like.

  Such an LED is often provided as a resin-sealed semiconductor device, and an example thereof is a surface mount type as shown in FIG. In this semiconductor device, the recess 101b is formed in the package 101, each lead electrode 102 is integrally provided on the bottom side of the recess 101b of the package 101, the LED 103 is mounted on the bottom surface of the recess 101b, and each terminal electrode of the LED 103 is mounted. Each lead electrode 102 is connected via a bonding wire 104. Then, a translucent resin 105 (transparent thermosetting resin such as epoxy resin or silicon resin) is quantitatively injected into the inside of the recess 101b of the package 101 using a filling device (for example, an air dispenser). The resin 105 is thermally cured, and the LED 103 is resin-sealed with the translucent resin 105. As a result, a semiconductor device that emits the light of the LED 103 through the translucent resin 105 of the recess 101b is formed.

  Thus, in the configuration in which the LED 103 is resin-sealed with the translucent resin 105, the LED 103, the bonding wire 104, and the like can be protected from the external environment such as moisture and external force, and a semiconductor device having extremely high reliability can be obtained. .

  However, if the surface shape of the translucent resin 105 varies, the directivity angle of the emitted light of the LED 103 changes. Therefore, in order to manufacture a semiconductor device having a uniform directivity angle with a high yield, the translucent resin 105 is filled. It is important to make the amount uniform and to control the surface shape of the translucent resin 105 constant.

  In recent years, there has been an increasing demand for semiconductor devices that use LEDs that emit blue light and contain a phosphor in a sealing resin to emit white light.

  As an example of this semiconductor device, a surface mount type as shown in FIG. In this semiconductor device, the same package 101, each lead electrode 102, each bonding wire 104, and the like as the semiconductor device in FIG. 16 are used. However, instead of the LED 103 and the translucent resin 105 in the semiconductor device in FIG. LED 111 and translucent resin 112 are used. The translucent resin 112 contains a yellow phosphor. Alternatively, in Patent Document 1, two colors of phosphors (a blue-green phosphor and a red phosphor) are contained in the one corresponding to the translucent resin 112.

  In such a semiconductor device, part of the blue light emitted from the blue LED 111 is converted into yellow light, green light, or red light by the phosphor contained in the translucent resin 112, so that the blue light and the yellow light are converted. Pseudo white light mixed with light or white light mixed with blue light, green light, and red light is emitted.

  However, if there is a variation in the filling amount of the translucent resin 112, the amount of phosphor in the translucent resin 112 naturally changes, and white light having a desired chromaticity cannot be obtained. It is important to accurately control the filling amount of the translucent resin 112.

JP 2009-188274 A

  As described above, if the surface shape of the translucent resin 105 varies, the directivity angle of the emitted light of the LED 103 changes, or if the filling amount of the translucent resin 112 varies, the translucent property Since the amount of the phosphor in the resin 112 naturally changes and white light having a desired chromaticity cannot be obtained, a filling device such as an air dispenser is used to inject a fixed amount of the sealing resin.

  In this air dispenser, a predetermined amount of sealing resin can be injected into the recess of the package by adjusting the discharge time and discharge pressure of the resin.

  The filling amount of the sealing resin is often set so that the surface of the sealing resin is flush with the upper end of the package, with the upper end of the side wall of the package as a reference. Thereby, confirmation of the filling amount of sealing resin becomes easy.

  However, in actuality, in the filling process of sequentially filling the sealing resin into a large number of packages with an air dispenser, the pressure applied to the sealing resin in the syringe decreases as the sealing resin in the syringe decreases. Therefore, the filling amount of the sealing resin sequentially filled in each package is gradually reduced.

  For this reason, in the past, the actual amount of sealing resin filled by the air dispenser was confirmed every predetermined time, and if the actual amount of filling changed from the initial set value, the air dispenser each time The troublesome work of resetting the discharge time and discharge pressure was performed, which caused the productivity to decrease.

  On the other hand, along with the expansion of the field of use of LEDs, a large number of LEDs may be used side by side, and in this case, the conditions for color unevenness and brightness unevenness of the LEDs become more severe.

  In particular, in order to emit white light, a semiconductor device in which a blue LED 111 and a translucent resin 112 containing a phosphor are combined is used for a backlight of a liquid crystal display device, a light source of a lighting device, etc. The conditions for unevenness are particularly severe. In addition, since human color sensation is particularly sensitive to white color and can be sensed even with a slight chromaticity difference, the required tolerance range of white chromaticity variation is small. Since the filling amount of the translucent resin 112 directly affects the chromaticity of white light, it is necessary to manage the filling amount of the translucent resin 112 with higher accuracy.

  For this reason, conventionally, the accuracy of checking the filling amount of the sealing resin is improved, or the frequency of checking is increased, and the discharge time and discharge pressure of the air dispenser are frequently adjusted to increase the accuracy of the filling amount of the sealing resin. However, the work became more complicated and the productivity was significantly reduced.

  In addition, in order to improve the accuracy of checking the filling amount of the sealing resin, the edge of the surface of the sealing resin is flush with the upper end of the side wall of the package, and the center of the surface of the sealing resin is the center of the package. It is necessary to confirm that it is flush with the upper end of the side wall, that is, the height and flatness of the surface of the sealing resin (that it is not concave or convex due to the surface tension of the sealing resin). However, since this confirmation is performed visually by an operator or using a stereomicroscope, there is a problem that the skill of the operator is required and it is difficult to increase the frequency of confirmation.

  Further, in the sealing resin filling process, in order to improve the yield, it is necessary not only to check the filling amount of the sealing resin but also to correct the excess or shortage of the filling amount. However, when removing excess sealing resin with a spatula or the like and replenishing the shortage, the operation is extremely complicated, and the productivity is greatly reduced.

  Accordingly, the present invention has been made in view of the above-described conventional problems, and can determine the surface shape of the sealing resin or the filling amount of the sealing resin with high accuracy and speed, and thus the emitted light of the light emitting element. Sealing resin surface shape or filling with sealing resin in a semiconductor device capable of reducing variation in directivity angle, reducing chromaticity variation of emitted light for sealing resin containing phosphor, and improving yield An object of the present invention is to provide an amount determination method, a determination apparatus, a semiconductor device manufacturing method, and a semiconductor device manufactured by the manufacturing method.

  In order to solve the above problems, a determination method of the present invention is a determination method of a sealing resin surface shape or a sealing resin filling amount in a semiconductor device in which a light emitting element is sealed with a resin, the surface of the resin A pattern is projected onto the image, the pattern is photographed, and the surface shape or filling amount of the resin is determined based on the shape or area of the image of the pattern.

  In such a determination method of the present invention, the pattern projected on the surface of the resin is photographed, and the surface shape or filling amount of the resin is determined based on the shape or area of the image of this pattern. Without depending on the determination, the surface shape or the filling amount of the resin can be determined with high accuracy and speed. For this reason, it is possible to reduce the variation in the radiation light directivity angle of the light emitting element, to reduce the chromaticity variation of the emitted light for the sealing resin containing the phosphor, and to further improve the yield.

  Moreover, in the determination method of this invention, the said light emitting element is arrange | positioned at the bottom face of a recessed part, and the said resin is filled inside the said recessed part.

  Thus, when filling the resin inside the recess, the surface of the resin is formed in the opening of the recess. When the resin filling amount matches the volume of the recess, the surface of the resin becomes flat. When the resin filling amount is larger than the volume of the recess, the resin surface becomes convex due to its surface tension, and the resin filling amount further decreases. When the capacity is less than the above, the surface of the resin becomes concave. Since the shape or area of the pattern projected onto the surface changes according to such a change in the shape of the surface, the surface shape or filling amount of the resin is determined based on the shape or area of the image of the photographed pattern. Can do.

  In the determination method of the present invention, the image of the pattern projected and photographed on the flat surface of the resin is used as a reference, and the shape or area of the image of the reference pattern is projected onto the surface of the resin to be determined. The surface shape or the filling amount of the resin to be determined is determined by comparing the shape or area of the image of the pattern formed. Alternatively, based on the image of the pattern projected and photographed on the convex surface of the resin, the shape or area of the image of the reference pattern and the shape of the image of the pattern projected on the surface of the resin to be determined Alternatively, the surface shape or filling amount of the resin to be determined is determined by comparing the areas.

  If the shape or area of the image of the reference pattern is set as described above, the surface shape or filling amount of the resin to be determined can be easily determined by comparison with the reference.

  In the determination method of the present invention, the resin contains a phosphor.

  For example, when a light-emitting element that emits blue light is applied, and a phosphor that emits yellow light, or blue-green light and red light is applied as a phosphor in the resin, a part of the blue light is yellow light, or Since the light is converted into green light or red light, pseudo white light in which blue light and yellow light are mixed or white light in which blue light, green light, and red light are mixed is emitted.

  In this case, it is preferable to shift the main wavelength peak of the projection light of the pattern from the peak wavelength of the emission spectrum of the phosphor.

  This is because when the main wavelength peak of the pattern projection light coincides with the peak wavelength of the emission spectrum of the phosphor, the light emitted from the phosphor hinders pattern imaging.

  In the determination method of the present invention, the surface shape or filling amount of the resin is determined based on the light intensity of the image of the photographed pattern.

  For example, when the resin filling amount is extremely small, it is difficult to project a pattern on the surface of the resin, capture a pattern, and determine the surface shape or filling amount of the resin based on the shape or area of the pattern image. . However, when the resin filling amount is extremely small, the light intensity of the image of the photographed pattern clearly changes. For this reason, it is preferable to use the determination of the surface shape or filling amount of the resin based on the light intensity of the photographed pattern image.

  In this case, the focal position when photographing the pattern projected on the surface of the resin may be fixed.

  This is because if the focus position when shooting a pattern is fixed, the position of the resin surface will be significantly deviated from the focus position when the amount of resin filling becomes extremely small. This is because the strength changes clearly.

  In the determination method of the present invention, the pattern has an asymmetric shape.

  If the position of the resin surface is significantly deviated, the image of the captured pattern may be flipped up and down and left and right. Inversion can be determined, and a significant shift in the position of the resin surface, that is, a significant change in the resin filling amount can be determined.

  In the determination method of the present invention, the pattern has a plurality of dispersed pattern portions.

  In this case, since the interval between the pattern portions changes as the shape or area of the entire pattern changes, the surface shape or filling amount of the resin is determined based on the interval between the pattern portions.

  Next, a determination device according to the present invention is a determination device for a sealing resin surface shape or a sealing resin filling amount in a semiconductor device in which a light emitting element is sealed with a resin, and projects a pattern onto the surface of the resin. A projection unit; an imaging unit that captures a pattern projected by the projection unit; and a determination unit that determines a surface shape or a filling amount of the resin based on a shape or area of an image of the pattern captured by the imaging unit. I have.

  Such a determination apparatus also has the same effect as the determination method of the present invention.

  The manufacturing method of the present invention is a manufacturing method of a semiconductor device in which a light emitting element is sealed with a resin, the step of disposing the light emitting element in a recess, and filling the resin inside the recess; Projecting a pattern onto the surface of the resin filled inside the recess, photographing the pattern, and determining the surface shape or filling amount of the resin based on the shape or area of the image of the pattern; and the resin And a step of outputting the determination result of the surface shape or the filling amount.

  Also in such a manufacturing method, there exists an effect similar to the determination method of the said invention.

  In the manufacturing method of the present invention, a filling device for filling a resin in the concave portion of the light emitting element is provided, and the filling amount of the resin by the filling device is adjusted according to the determination result of the surface shape or filling amount of the resin. is doing.

  Thereby, the filling amount of the resin is automatically adjusted.

  Moreover, in the manufacturing method of this invention, the opening part of the said recessed part is circular with a diameter of 2.8 mm or less, or has an opening area below the said circular area.

  By defining the size of the opening as described above, an appropriate surface tension is generated on the surface of the resin, and the surface of the resin is deformed into a flat surface, a convex surface, and a concave surface according to the filling amount.

  The semiconductor device of the present invention is manufactured by the manufacturing method of the present invention.

  In such a semiconductor device, the surface shape or filling amount of the resin is determined with high accuracy and speed, and the surface shape or filling amount of the resin is adjusted. With respect to the sealing resin containing the phosphor, the chromaticity variation of the emitted light is reduced.

  According to the present invention, since the pattern projected on the surface of the resin is photographed and the surface shape or filling amount of the resin is determined based on the shape or area of the image of this pattern, it depends on the judgment of the operator. In addition, the surface shape or filling amount of the resin can be determined with high accuracy and speed. For this reason, it is possible to reduce the variation in the radiation light directivity angle of the light emitting element, to reduce the chromaticity variation of the emitted light for the sealing resin containing the phosphor, and to further improve the yield.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view schematically showing a first embodiment of a sealing resin surface shape or sealing resin filling amount determination device of the present invention. (A) And (b) is a figure which shows the pattern projected on the sealing resin surface of a semiconductor device and the side view which shows the determination apparatus and semiconductor device of FIG. (A) And (b) is a figure which shows the change of the pattern projected on the sealing resin surface of a semiconductor device and the side view which shows the determination apparatus and semiconductor device of FIG. (A) And (b) is a side view which shows the determination apparatus and semiconductor device of FIG. 1, and the figure which shows the other change of the pattern projected on the sealing resin surface of a semiconductor device. It is a perspective view which shows schematically 2nd Embodiment of the determination apparatus of the sealing resin surface shape or sealing resin filling amount of this invention. It is process transition diagram which shows the manufacturing method of the semiconductor device using the determination apparatus. It is a perspective view which shows the some package integrally molded with respect to the flame | frame. It is a figure which shows schematically the process by which translucent resin is sequentially filled inside the recessed part of each package by an air dispenser. It is a figure which shows roughly the process of determining the surface shape or filling amount of translucent resin with a determination apparatus for every package. It is a graph which calculates | requires and shows the fluctuation | variation of the filling amount of translucent resin with respect to the frequency | count of discharge of an air dispenser in the case of manufacture of a several semiconductor device. It is a graph which calculates | requires and shows the fluctuation | variation of the y value measured value of the CIE chromaticity coordinate of each semiconductor device with respect to the frequency | count of discharge of an air dispenser, after thermosetting the translucent resin of a several semiconductor device. It is a side view which shows the determination apparatus and semiconductor device of FIG. It is a figure which shows the asymmetrical pattern projected on the sealing resin surface of a semiconductor device. It is a figure which shows the dispersion | distribution pattern which consists of a some pattern part projected on the sealing resin surface of a semiconductor device. It is a figure which shows roughly the process of determining sequentially the surface shape or filling amount of a translucent resin by a determination apparatus, following it, filling the recessed part of each package sequentially with an air dispenser. . It is sectional drawing which shows an example of the conventional semiconductor device. It is sectional drawing which shows the other example of the conventional semiconductor device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view schematically showing a first embodiment of a determination apparatus for sealing resin surface shape or sealing resin filling amount of the present invention. 2 (a) and 2 (b), 3 (a) and 3 (b), 4 (a) and 4 (b) are a side view showing the determination device and the semiconductor device of the present embodiment, and FIG. It is a figure which shows the pattern projected on the sealing resin surface.

  First, in the semiconductor device 1 to be determined by the determination device 2 of this embodiment, an LED (light emitting element) 13 is arranged inside a package 11 as shown in FIG. 1 and the LED 13 is sealed with a translucent resin 15. It has stopped. Specifically, the recess 11b is formed in the package 11, each lead electrode 12 is integrally provided on the bottom side of the recess 11b of the package 11, the LED 13 is die-bonded on the bottom surface of the recess 11b, and each terminal electrode of the LED 13 is bonded to each other. After connecting to each lead electrode 12 via the wire 14 and using a filling device (for example, an air dispenser), a transparent resin 15 (transparent heat such as epoxy resin or silicon resin) is placed inside the recess 11 b of the package 11. Curable resin) is quantitatively injected, the light-transmitting resin 15 is thermally cured, and the LED 13 is sealed with the light-transmitting resin 15.

  In the semiconductor device 1 having such a configuration, the LED 13, the bonding wire 14, and the like are protected from the external environment such as moisture and external force, and extremely high reliability is obtained.

  Here, if the surface shape of the translucent resin 15 varies, the directivity angle of the emitted light of the LED 13 changes. Therefore, in order to manufacture the semiconductor device 1 having a uniform directivity angle with a high yield, the translucent resin is used. It is necessary to make the filling amount of 15 uniform and to control the surface shape of the translucent resin 15 to be constant.

  Further, the LED 13 that emits blue light is applied, and the translucent resin 15 that includes a phosphor that converts blue light into yellow light or a phosphor that converts blue light into green light or red light is applied. In the case where white light is emitted from the semiconductor device 1, if the filling amount of the translucent resin 15 varies, the amount of phosphor in the translucent resin 15 naturally changes, and white light having a desired chromaticity is obtained. Therefore, it is necessary to accurately control the filling amount of the translucent resin 15.

  Therefore, the determination device 2 of the present embodiment includes a projection device 21 that projects a pattern on the surface of the translucent resin 15, a CCD camera 22 that captures the pattern projected on the surface of the translucent resin 15, and a CCD camera. And an arithmetic processing unit 23 for determining the surface shape or the filling amount of the translucent resin 15 based on the pattern image photographed by 22.

  Here, when the filling amount of the translucent resin 15 into the recess 11b of the package 11 is an appropriate amount, the edge of the surface of the translucent resin 15 is the upper end of the side wall 11c of the package 11 as shown in FIG. The surface 15a of the translucent resin 15 becomes flat. In this case, when the cross pattern 16 having a linear outline is projected onto the surface 15a of the translucent resin 15 by the projection device 21, for example, it is projected onto the surface 15a of the translucent resin 15 as shown in FIG. The cross pattern 16 is not distorted at all, and the image of the cross pattern 16 photographed by the CCD camera 22 is not distorted. The arithmetic processing unit 23 performs image processing on the image of the cross pattern 16, determines that the image is not distorted, and the surface 15 a of the translucent resin 15 is flat and is filled with the translucent resin 15. The amount is determined to be appropriate.

  When the filling amount of the translucent resin 15 in the recess 11b of the package 11 is excessive, the edge of the surface 15a of the translucent resin 15 is the upper end of the side wall 11c of the package 11 as shown in FIG. The surface 15a becomes convex due to the surface tension of the translucent resin 15. At this time, when the cross pattern 16 is projected onto the surface 15a of the translucent resin 15 by the projection device 21, the cross pattern 16 projected onto the surface 15a of the translucent resin 15 is distorted as shown in FIG. The image of the cross pattern 16 taken by the CCD camera 22 is also distorted and enlarged. The arithmetic processing unit 23 performs image processing on the image of the cross pattern 16 and determines distortion or enlargement of the image. The surface 15a of the translucent resin 15 is a convex surface, and the filling amount of the translucent resin 15 is determined. Is determined to be excessive. Further, an excess amount of the filling amount is obtained based on the degree of distortion or enlargement of the image.

  Furthermore, when the filling amount of the translucent resin 15 into the recess 11b of the package 11 is insufficient, the edge of the surface 15a of the translucent resin 15 is formed on the side wall 11c of the package 11 as shown in FIG. Even if it is flush with the upper end, the surface 15a of the translucent resin 15 is concave. At this time, when the cross pattern 16 is projected onto the surface 15a of the translucent resin 15 by the projection device 21, the cross pattern 16 projected onto the surface 15a of the translucent resin 15 is distorted as shown in FIG. The image of the cross pattern 16 photographed by the CCD camera 22 is also distorted and reduced. The arithmetic processing unit 23 performs image processing on the image of the cross pattern 16 to determine distortion or reduction of the image. The surface 15a of the translucent resin 15 is a concave surface, and the filling amount of the translucent resin 15 is determined. Is determined to be insufficient. Further, the shortage of the filling amount is obtained based on the degree of distortion or reduction of the image.

  For example, the determination of distortion or enlargement / reduction of the image of the cross pattern 16 by the image processing unit 23 is performed by extracting the contour of the image of the cross pattern 16 and obtaining the area inside the contour and setting the area inside the contour in advance. This is done by comparison with the reference area. The reference area is an area inside the contour of the image of the cross pattern 16 when projected onto the flat surface 15a of the translucent resin 15 and not distorted at all. A difference (absolute value) between the area inside the outline of the cross pattern 16 projected on the surface 15a of the translucent resin 15 to be determined and the reference area is obtained, and whether or not this difference falls within a preset allowable range. If the difference falls within the allowable range, it is determined that the image of the cross pattern 16 is not distorted and is not enlarged or reduced, and the filling amount of the translucent resin 15 is determined to be an appropriate amount.

  In addition, if the area difference deviates from the allowable range and the area inside the outline of the cross pattern 16 projected onto the surface 15a of the translucent resin 15 to be determined is larger than the reference area, the image of the cross pattern 16 is displayed. It is determined that the amount of filling of the translucent resin 15 is excessive. Further, as the excess of the filling amount of the translucent resin 15 increases, the curvature of the convex surface of the surface 15a of the translucent resin 15 increases and the difference increases, so that the filling is performed based on the degree of the difference. Find the excess amount.

  Further, if the area difference deviates from the allowable range and the area inside the contour of the cross pattern 16 projected onto the surface 15a of the translucent resin 15 to be determined is smaller than the reference area, the image of the cross pattern 16 is displayed. It is determined that the filling amount of the translucent resin 15 is insufficient. In addition, as the shortage of the filling amount of the translucent resin 15 increases, the curvature of the concave surface of the surface 15a of the translucent resin 15 increases and the difference increases. Therefore, the filling is performed based on the degree of the difference. Find the shortage.

  Alternatively, the distortion or enlargement / reduction determination of the image of the cross pattern 16 by the image processing unit 23 is performed by extracting the contour of the image of the cross pattern 16 and comparing this contour with a preset reference contour. The reference contour is a contour of the image of the cross pattern 16 when projected onto the surface 15a of the translucent resin 15 and is not distorted at all, that is, a linear contour. A difference (absolute value) in curvature between the contour of the image of the cross pattern 16 projected on the surface 15a of the translucent resin 15 to be determined and the reference contour is obtained, and this difference falls within a preset allowable range. If the difference falls within the allowable range, it is determined that the image of the cross pattern 16 is not distorted, and the filling amount of the translucent resin 15 is determined to be an appropriate amount.

  If the difference in curvature is out of the allowable range and the contour of the image of the cross pattern 16 is outside the reference contour, it is determined whether the image of the cross pattern 16 is distorted or enlarged, and the translucent resin 15 is filled. It is determined that the amount is excessive. Further, as the excessive amount of the filling amount of the translucent resin 15 increases, the curvature of the convex surface of the surface 15a of the translucent resin 15 increases and the curvature of the contour of the image of the cross pattern 16 increases. Based on the curvature of the contour, the excess amount of the filling amount is obtained.

  Further, if the difference in curvature is out of the allowable range and the contour of the image of the cross pattern 16 is inside the reference contour, it is determined whether the image of the cross pattern 16 is distorted or reduced, and the translucent resin 15 is filled. It is determined that the amount is insufficient. Further, as the shortage of the filling amount of the translucent resin 15 increases, the curvature of the concave surface of the surface 15a of the translucent resin 15 increases and the curvature of the contour of the image of the cross pattern 16 increases. Based on the degree of curvature of the contour, the insufficient amount of filling is obtained.

  In addition, in order for the surface 15a of the translucent resin 15 filled in the concave portion 11b of the package 11 to be clearly deformed into a flat surface, a convex surface, and a concave surface according to the filling amount, the translucent light is transmitted through the opening of the concave portion 11b. Appropriate surface tension needs to be generated in the conductive resin 15, and the opening of the recess 11 b is a circular shape having a diameter of 2.8 mm or less in the viscosity of an epoxy resin or a silicon resin as a commonly used translucent resin 15. If there is an opening area that is less than or equal to the circular area, a clear change appears on the flat surface, the convex surface, and the concave surface according to the filling amount, and the accuracy of determining the filling amount excess / deficiency according to the present invention can be improved. it can.

  FIG. 5 is a side view schematically showing a second embodiment of the determination apparatus of the present invention. The determination apparatus 2A of the present embodiment is obtained by adding a beam splitter 24 and a collimator lens 25 to the determination apparatus 2 of FIG.

  In the determination device 2A of the present embodiment, the projection light of the projection device 21 passes through the beam splitter 24, is collimated by the collimator lens 25, and is incident on the surface of the translucent resin 15, thereby translucency. A pattern is projected on the surface of the resin 15. Also, the reflected light from the surface of the translucent resin 15 passes through the collimator lens 25, is reflected by the beam splitter 24, and enters the lens of the CCD camera 22, thereby causing the surface of the translucent resin 15 to be reflected. A pattern is photographed.

  The arithmetic processing unit 23 performs image processing on the captured pattern image, and determines the surface shape or filling amount of the translucent resin 15 based on the image. A specific determination method is as described with reference to FIGS.

  In such a configuration, the optical axis of the projection light from the projection device 21 and the optical axis of the incident light to the CCD camera 22 pass through the same normal line on the surface of the translucent resin 15, and the projection light of the projection device 21. Is incident on the surface of the translucent resin 15 from directly above, and the CCD camera 22 captures the pattern of the surface of the translucent resin 15 from directly above, so that the accuracy of the pattern image captured by the CCD camera 22 is improved. Becomes higher.

  Next, a procedure for manufacturing the semiconductor device 1 using the determination device 2 in FIG. 1 (or the determination device 2A in FIG. 5) will be described with reference to the process transition diagram of the method for manufacturing the semiconductor device 1 shown in FIG. To do.

  Here, as shown in FIG. 7, it is assumed that a large number of packages 11 are formed integrally with the frame 31, and the respective packages 11 are arranged in parallel. For example, 4 × 25 = 100 packages 11 are arranged in parallel. Each lead electrode 12 of the package 11 is a part of the frame 31 and is arranged on the bottom side of the recess 11 b of the package 11.

  In this state, each LED 13 is die-bonded to the bottom surface of the recess 11 b of each package 11, and each terminal electrode of the LED 13 is connected to each lead electrode 12 via each bonding wire 14.

  Further, the discharge time and discharge pressure of the air dispenser 32 are adjusted, and the discharge amount of the translucent resin 15 from the air dispenser 32 through the nozzle 33 is set as shown in FIG. This single discharge amount is substantially equal to the capacity of the concave portion 11b of the package 11, and when the transparent resin 15 of this discharge amount is discharged to the concave portion 11b of the package 11, as shown in FIG. The edge of the surface of the light-transmitting resin 15 is flush with the upper end of the side wall 11c of the package 11, and the surface 15a of the light-transmitting resin 15 becomes flat (step S61 in FIG. 6).

  Further, as shown in FIG. 2B, when the cross pattern 16 projected on the surface 15a of the translucent resin 15 is not distorted at all, the linear contour of the image of the cross pattern 16 photographed by the CCD camera 22 is obtained. And the area inside the contour is set as the reference contour and the reference area (step S62 in FIG. 6).

  Thereafter, as shown in FIG. 8, the light dispenser 32 sequentially fills the inside of the recess 11b of each package 11 with the air dispenser 32 (step S63 in FIG. 6).

  As shown in FIG. 9, for each package 11, the cross pattern 16 is projected onto the surface of the translucent resin 15 by the projection device 21, and an image of the cross pattern 16 is taken by the CCD camera 22. Whether or not the surface shape or filling amount of the translucent resin 15 is appropriate is determined based on the image of the cross pattern 16, and further, the excess or deficiency of the filling amount is determined (steps S64, S65, and S66 in FIG. 6). . The method for determining whether the surface shape or the filling amount of the translucent resin 15 is appropriate or not is as described with reference to FIGS.

  Further, as shown in FIG. 9, the determination results relating to each package 11 are input to the external output device 26, and the external output device 26 outputs the determination results to the outside (step S67 in FIG. 6). External output includes display on a display device and printout. For example, No. 1 to No. 100 are allocated to 100 packages 11 and the respective determination results are externally output in association with No. 1 to No. 100.

  An operator refers to those determination results, and promptly detects the package 11 in which the surface shape or the filling amount of the translucent resin 15 is inappropriate and the excess or deficiency thereof is determined. The filling amount of the conductive resin 15 is corrected with a spatula or the like (step S68 in FIG. 6). For example, the appropriateness is output corresponding to No.1 to No.50 and No.61 to No.90, the inappropriateness and the lack thereof are output corresponding to No.51 to No.60, If inadequate or excessive amounts are output corresponding to No. 100, the insufficient amount of translucent resin 15 is replenished to No. 51 to No. 60 packages 11, and No. 91 to No. The excess light-transmitting resin 15 is removed from the package 11 of .100.

  In this case, in comparison with correcting the excess / deficiency while confirming the excess / deficiency of the filling amount by visual observation by the operator as in the prior art, in this embodiment, the operator transmits light without relying on visual observation. As a result, it is possible to know the package 11 in which the surface shape or filling amount of the transparent resin 15 is inadequate, and to accurately know the excess or deficiency of the translucent resin 15, so that the working time can be shortened. The difference in judgment between workers can be reduced, and the correction accuracy of the filling amount of the translucent resin 15 can be improved.

  After optimizing the filling amount of the translucent resin 15 in each package 11 in this way, each package 11 is heated together with the frame 31 to thermally cure the translucent resin 15 of each package 11 and further cut the frame 31. Thus, each lead electrode 12 is also separated from the frame 31 at the same time as each package 11 is separated from the frame 31 (step S69 in FIG. 6).

  Next, the effect obtained by optimizing the filling amount of the translucent resin 15 of the semiconductor device 1 will be described in detail. Here, the LED 13 that emits blue light is applied, and the translucent resin 15 that includes a phosphor that converts blue light into yellow light or a phosphor that converts blue light into green light or red light is applied. The semiconductor device 1 that emits white light is taken as an example.

  In such a semiconductor device 1, if the filling amount of the translucent resin 15 varies, the phosphor amount in the translucent resin 15 naturally changes, and white light having a desired chromaticity cannot be obtained. .

  FIG. 10 is a graph showing the variation of the filling amount of the translucent resin 15 with respect to the number of times the air dispenser is discharged during the manufacture of the plurality of semiconductor devices 1. Further, FIG. 11 shows the variation of the measured y value of the CIE chromaticity coordinate of each semiconductor device 1 with respect to the number of times the air dispenser is discharged after thermosetting the translucent resin 15 of those semiconductor devices 1. It is a graph. In the graphs of FIGS. 10 and 11, the number of times the air dispenser discharges corresponds, and the filling amount of the translucent resin 15 of the same semiconductor device 1 and the y value of the CIE chromaticity coordinates are indicated at the same number of discharges. Has been.

  As apparent from the graphs of FIGS. 10 and 11, the y value of the CIE chromaticity coordinate increases as the filling amount of the translucent resin 15 containing the phosphor increases. Accordingly, the chromaticity of the emitted light of the semiconductor device 1 varies due to an excess or shortage of the filling amount of the translucent resin 15.

  Also, assuming that the CIE chromaticity coordinate y value = 0.37 is a standard value and the allowable range of the CIE chromaticity coordinate y value is A (y = 0.365 to 0.375), the CIE chromaticity coordinate y When the value is out of the allowable range A, it can be seen that the filling amount of the translucent resin 15 is in the correction required region B.

  The human color sensation is sensitive to white color and can be detected even with a slight difference in chromaticity. Therefore, the allowable range for chromaticity variation is small, and it is necessary to narrow the allowable range A as shown in the graph of FIG. is there. For this purpose, as is apparent from the graph of FIG. 10, it is necessary to suppress the variation in the filling amount of the translucent resin 15, and when the filling amount of the translucent resin 15 enters the correction required region B, Immediately after the filling of the light-sensitive resin 15, the operator needs to correct the filling amount of the light-transmissive resin 15 with a spatula or the like.

  Further, when the discharge amount of the air dispenser fluctuates greatly and the filling amount of the translucent resin 15 deviates more than the correction required region B between the discharge times 300 to 400 as shown in the graph of FIG. It is necessary to set once again the discharge amount of the translucent resin 15 from the air dispenser by adjusting the discharge time and discharge pressure of the dispenser.

  In the present embodiment, it is possible to know the package 11 in which the surface shape or the filling amount of the translucent resin 15 is inappropriate without relying on the visual observation of the operator, and the excess or deficiency of the translucent resin 15 can be determined. Therefore, when the filling amount of the translucent resin 15 enters the correction required region B, the filling amount of the translucent resin 15 can be immediately corrected, and the translucent resin 15 When the filling amount deviates more than the correction required area B, the air dispenser can be reset immediately, and the chromaticity variation of the semiconductor device 1 can be suppressed and the productivity can be prevented from being lowered.

  By the way, when the filling amount of the translucent resin 15 is extremely reduced due to the clogging of the nozzle of the air dispenser, the edge of the surface of the translucent resin 15 is lower than the upper end of the side wall 11c of the package 11 as shown in FIG. The surface of the translucent resin 15 may be greatly recessed. In this case, even if the surface shape or filling amount of the translucent resin 15 is determined based on the pattern image of the surface of the translucent resin 15 photographed by the CCD camera 22, it is difficult to make an accurate determination.

  However, when the surface of the translucent resin 15 is greatly recessed, the light intensity of the pattern image is clearly reduced.

  Therefore, the arithmetic processing unit 23 not only determines the surface shape or the filling amount of the translucent resin 15 based on the area and contour of the pattern image, but also obtains the received light intensity (light intensity of the pattern image) of the CCD camera 22. It is preferable that a large variation in the filling amount of the translucent resin 15 can be determined based on the received light intensity. For example, if the focal position of the CCD camera 22 is fixed to a flat surface of the translucent resin 15 as shown in FIG. 2A, the surface of the translucent resin 15 becomes larger as shown in FIG. When the lens is recessed, the focus of the CCD camera 22 is not aligned with the surface of the translucent resin 15, and the received light intensity of the CCD camera 22 is significantly weakened. Is possible.

  In this case, it is determined whether or not the received light intensity of the CCD camera 22 is equal to or less than a certain value. If the received light intensity is equal to or less than a certain value, it is determined that the filling amount of the translucent resin 15 has changed greatly. If the intensity exceeds a certain value, the surface shape or filling amount of the translucent resin 15 is determined based on the area and contour of the pattern image. This makes it possible to determine more accurately and quickly whether or not the filling amount of the translucent resin 15 is appropriate.

  Further, as shown in FIG. 12, when the edge of the surface of the translucent resin 15 is lower than the upper end of the side wall 11c of the package 11 and the surface of the translucent resin 15 is greatly recessed, the surface of the translucent resin 15 The pattern projected on the top, bottom, left and right is inverted and changes from the pattern shown in FIG. 4B to the similar pattern shown in FIG. At this time, if the pattern is a cross pattern 16, the difference between the upside down pattern and the similar pattern in FIG. 3B is small, and therefore the inverted pattern of the surface 15 a of the translucent resin 15 that is greatly recessed. It is difficult to discriminate the pattern from the non-inverted pattern of the convex surface 15a as shown in FIG.

  For this reason, it is preferable to employ an asymmetric T-shaped pattern 16A as shown in FIG. 13 as a pattern projected onto the surface of the translucent resin 15 by the projection device 21. In this case, there is a difference in pattern directionality between the inverted pattern of the largely recessed surface of the translucent resin 15 and the non-inverted pattern of the convex surface 15a as shown in FIG. These patterns can be discriminated. In addition, it is possible to determine a large decrease in the filling amount of the translucent resin 15 based on the pattern inverted in the vertical and horizontal directions, and more accurately and quickly determine whether or not the filling amount of the translucent resin 15 is appropriate. It becomes possible to do.

  Further, instead of the cross pattern or the T-shaped pattern, a distributed pattern 16B composed of a plurality of pattern portions 16b as shown in FIG. 14 may be adopted. In this case, since the interval between the pattern portions 16b changes as the shape or area of the entire dispersion pattern 16B on the surface 15a of the translucent resin 15 changes, the interval between the pattern portions 16b is obtained, and based on this interval, the transmission is made. The surface shape or filling amount of the light-sensitive resin 15 is determined. For example, when the filling amount of the translucent resin 15 into the concave portion 11b of the package 11 is excessive and the surface 15a of the translucent resin 15 is convex as shown in FIG. As the interval between the portions 16b increases and the excess amount of the filling amount increases, the interval increases. Therefore, it is possible to determine whether the filling amount is inappropriate or excessive based on the interval between the pattern portions 16b. In addition, when the filling amount of the translucent resin 15 into the recess 11b of the package 11 is insufficient and the surface 15a of the translucent resin 15 is concave as shown in FIG. As the interval between the portions 16b is narrowed and the shortage of the filling amount is increased, the interval is narrowed. Therefore, it is possible to determine whether the filling amount is inappropriate or insufficient based on the interval between the pattern portions 16b.

  Further, when the surface 15a of the translucent resin 15 is flat, instead of determining that the filling amount of the translucent resin 15 is an appropriate amount, the surface 15a of the translucent resin 15 is a convex surface having a certain height ( When the height from the upper end of the side wall 11c of the package 11 to the center of the surface 15a of the translucent resin 15 becomes a constant height, the filling amount of the translucent resin 15 is an appropriate amount. It may be determined that In this case, as the reference area to be compared with the area inside the pattern outline, the area inside the pattern outline when projected onto the surface 15a of the translucent resin 15 having a convex surface having a certain height is set. Then, the difference (absolute value) between the area inside the contour of the pattern projected on the surface 15a of the determination target translucent resin 15 and the reference area is obtained, and based on this difference, is the filling amount of the translucent resin 15 appropriate? It is determined whether the filling amount is excessive or insufficient. Alternatively, as the reference contour to be compared with the contour of the pattern, the contour of the pattern when projected onto the surface 15a of the translucent resin 15 that is a convex surface having a certain height is set, and the translucent resin to be determined The difference (absolute value) in curvature between the contour of the pattern projected on the surface 15a and the reference contour is obtained, and the filling amount of the translucent resin 15 is appropriate based on the difference in curvature and the curvature of the pattern contour. It is determined whether the filling amount is excessive or insufficient.

  Thereby, the surface 15a of the translucent resin 15 can be set to a convex surface having a constant height. In this case, since the surface 15a of the translucent resin 15 acts as a convex lens, dispersion of the emitted light from the LED 13 is suppressed, and the directivity of the emitted light from the LED 13 is increased.

  In the same way, when the surface 15a of the translucent resin 15 becomes a concave surface having a certain level, the filling amount of the translucent resin 15 may be determined to be an appropriate amount.

  In addition, when the translucent resin 15 containing a phosphor is used, the phosphor in the translucent resin 15 may emit light by the projection light of the projection device 21. In this case, since the phosphor light is incident on the lens of the CCD camera 22, it becomes difficult to capture a clear pattern on the surface of the translucent resin 15 with the CCD camera 22. The determination of the surface shape or filling amount of the translucent resin 15 based on the image also becomes inaccurate.

  Therefore, the wavelength main peak of the projection light of the projection device 21 is shifted from the peak wavelength of the emission spectrum of the phosphor, for example, the wavelength main peak of the projection light is set longer than the peak wavelength of the phosphor, and the projection of the projection device 21 is performed. The phosphor is prevented from emitting light by light.

  As a result, the CCD camera 22 can clearly capture the pattern of the surface of the translucent resin 15, and the arithmetic processing unit 23 can also accurately determine the surface shape or filling amount of the translucent resin 15 based on the pattern image. It becomes possible.

  Further, the step of sequentially filling the concave portions 11b of the respective packages 11 with the translucent resin 15 by the air dispenser 32 as shown in FIG. 8, and the pattern of the translucent resin 15 by the projection device 21 as shown in FIG. Instead of separately performing the process of determining the surface shape or filling amount of the translucent resin 15 on the basis of the pattern image by the arithmetic processing unit 23, As shown in FIG. 15, the air dispenser 32 sequentially fills the recesses 11b of the respective packages 11 with the light-transmitting resin 15 and follows this, and the package 11 immediately after the filling of the light-transmitting resin 15 is completed. Then, the projection of the pattern by the projection device 21, the photographing of the pattern image by the CCD camera 22, and the determination by the arithmetic processing unit 23 are sequentially performed. The then one by one fed back to an air dispenser 32, by automatically controlling the discharge time and the discharge pressure of the air dispenser 32, it is also possible to maintain the resin discharge amount from the air dispenser 32 constant. Thereby, the fluctuation | variation of the resin discharge amount from the air dispenser 32 can be suppressed, and the effort of correction | amendment of the filling amount of the translucent resin 15 can be reduced significantly.

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2, 2A Determination apparatus 11 Package 12 Lead electrode 13 LED (light emitting element)
14 Bonding wires 15, 105, 112 Translucent resin 16 Cross pattern 21 Projector (projector)
22 CCD camera (shooting unit)
23 Arithmetic processing part (determination part)
24 Beam splitter 25 Collimator lens 26 External output device 32 Air dispenser (filling device)
33 nozzles

Claims (15)

A method for determining a sealing resin surface shape or a sealing resin filling amount in a semiconductor device formed by sealing a light emitting element with a resin,
A sealing resin surface in a semiconductor device, wherein a pattern is projected onto the surface of the resin, the pattern is photographed, and the surface shape or filling amount of the resin is determined based on the shape or area of the image of the pattern Method for determining shape or sealing resin filling amount. A method for determining a sealing resin surface shape or a sealing resin filling amount according to claim 1,
A method for determining a sealing resin surface shape or a sealing resin filling amount, wherein the light emitting element is disposed on a bottom surface of a recess, and the resin is filled inside the recess. A method for determining a sealing resin surface shape or a sealing resin filling amount according to claim 1 or 2,
Based on the image of the pattern projected and photographed on the flat surface of the resin, the shape or area of the image of the reference pattern and the shape or area of the image of the pattern projected on the surface of the resin to be determined A method of determining a sealing resin surface shape or a sealing resin filling amount in a semiconductor device, wherein the surface shape or filling amount of the resin to be determined is determined by comparison. A method for determining a sealing resin surface shape or a sealing resin filling amount according to claim 1 or 2,
Based on the image of the pattern projected and photographed on the convex surface of the resin, the shape or area of the image of the reference pattern and the shape or area of the image of the pattern projected on the surface of the resin to be determined The method for determining the surface shape or the filling amount of the sealing resin in the semiconductor device, wherein the surface shape or the filling amount of the resin to be determined is determined by comparing A method for determining a sealing resin surface shape or a sealing resin filling amount according to any one of claims 1 to 4,
The method for determining a sealing resin surface shape or a sealing resin filling amount, wherein the resin contains a phosphor. A method for determining a sealing resin surface shape or a sealing resin filling amount according to claim 5,
A method for determining a sealing resin surface shape or a sealing resin filling amount, wherein a wavelength main peak of projection light of the pattern is shifted from a peak wavelength of an emission spectrum of the phosphor. A method for determining a sealing resin surface shape or a sealing resin filling amount according to any one of claims 1 to 6,
A method for determining a sealing resin surface shape or a filling amount of a sealing resin, wherein the surface shape or filling amount of the resin is determined based on a light intensity of an image of the photographed pattern. A method for determining a sealing resin surface shape or a sealing resin filling amount according to claim 7,
A method for determining a sealing resin surface shape or a sealing resin filling amount, characterized in that a focal position when photographing a pattern projected on the surface of the resin is fixed. A method for determining a sealing resin surface shape or a sealing resin filling amount according to any one of claims 1 to 8,
The method for determining a sealing resin surface shape or a sealing resin filling amount, wherein the pattern has an asymmetric shape. A method for determining a sealing resin surface shape or a sealing resin filling amount according to any one of claims 1 to 9,
The method for determining a sealing resin surface shape or a sealing resin filling amount, wherein the pattern has a plurality of dispersed pattern portions. A determination device for a sealing resin surface shape or a sealing resin filling amount in a semiconductor device formed by sealing a light emitting element with a resin,
A projection unit that projects a pattern onto the surface of the resin;
An imaging unit for imaging the pattern projected by the projection unit;
A sealing resin surface shape or sealing resin filling in a semiconductor device, comprising: a determination unit that determines a surface shape or filling amount of the resin based on a shape or area of an image of a pattern photographed by the photographing unit Quantity judging device. A method for manufacturing a semiconductor device in which a light emitting element is sealed with a resin,
Placing the light emitting element in a recess, and filling the resin inside the recess;
Projecting a pattern onto the surface of the resin filled inside the recess, photographing the pattern, and determining the surface shape or filling amount of the resin based on the shape or area of the image of the pattern;
And a step of outputting a determination result of the surface shape or filling amount of the resin. A method of manufacturing a semiconductor device according to claim 12,
A filling device for filling a resin in the concave portion of the light emitting element;
A method of manufacturing a semiconductor device, comprising: adjusting a resin filling amount by the filling device according to a determination result of a surface shape or a filling amount of the resin. It is a manufacturing method of the semiconductor device according to claim 12 or 13,
The method for manufacturing a light-emitting element, wherein the opening of the recess has a circular shape with a diameter of 2.8 mm or less or an opening area with a circular area or less.   A semiconductor device manufactured by the method for manufacturing a semiconductor device according to claim 12.

Images