JP2011187217A - Organic el module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a COG type organic EL module, capable of improving heat dissipation efficiency of a driver IC and of enhancing the operating reliability of the driver IC at high temperatures, while maintaining thinning. <P>SOLUTION: The organic EL module includes a support substrate 11; a light-emitting display section 12 in which a first electrode, an organic light-emitting layer, and a second electrode are at least laminated and formed on the support substrate 11; the driver IC 13 which is mounted on the support substrate 11 and applies a driving current between the first and the second electrodes, and a circuit board 14 in order to input a power supply and a driving signal into the driver IC 13. The circuit board 14 includes a connecting wiring 18 to input the power supply and the driving signal into the driver IC 13; and a heat dissipation wiring 19 in direct contact with a rear face side of the driver IC 13. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL (electroluminescence) device, and more particularly to a COG type organic EL module in which a driver IC is mounted on a support substrate.

  Conventionally, as an organic EL panel, for example, an organic layer having at least an organic light emitting layer includes an anode line (first electrode line) made of ITO (Indium Tin Oxide) or the like and a cathode line (second electrode) made of aluminum (Al) or the like. It is known that a plurality of organic EL elements sandwiched between lines) are formed on a supporting substrate made of a glass material as light emitting pixels to constitute a light emitting display portion (see, for example, Patent Document 1). Such an organic EL element emits light by injecting holes from the anode and injecting electrons from the cathode and recombining the holes and electrons in the light emitting layer. The organic EL element has a so-called diode characteristic in which current does not easily flow from the cathode side to the anode side.

  Further, as a method of mounting a driver IC for driving the organic EL element, a COG (Chip on Glass) form in which the driver IC is directly mounted on a support substrate is known (for example, see Patent Document 2). The COG type organic EL module is superior in that it can be reduced in size with respect to other mounting methods such as a TCP (Tape Career Package) type in which a driver IC is mounted on an FPC (Flexible Printed Circuit).

JP-A-8-315981 JP 2000-40585 A JP 2007-199393 A

  Since the COG type organic EL module has a configuration in which the driver IC is directly mounted on the metal wiring (thickness of about 0.5 μm) formed on the support substrate, the thermal resistance becomes very large and the heat radiation from the driver IC is performed. The temperature of the driver IC is likely to be high due to obstruction. For this reason, especially in organic EL modules that are required for high-luminance light emission used in in-vehicle devices such as meters, the temperature of the driver IC may exceed the rated temperature, and problems such as operational reliability at high temperatures are likely to occur. There is a problem.

  On the other hand, as a method for improving the heat dissipation efficiency of the driver IC, in Patent Document 3, in the liquid crystal display module, a heat dissipation pattern is formed in the vicinity of the driver IC on the support substrate to make the heat distribution uniform. A device is disclosed that is connected to an FPC on which a drive circuit for inputting a drive signal to the driver IC is mounted so that the heat generated by the driver IC is also conducted to the FPC.

  However, since the metal pattern formed on the support substrate is very thin and thin, there is a problem that heat transfer efficiency to the FPC is poor and heat dissipation is insufficient. In addition, the organic EL module needs to maintain the characteristic of being thin and increase the heat dissipation efficiency, and there is a problem that a large heat dissipation member cannot be used.

  Accordingly, in view of the above-described problems, the present invention can improve the heat radiation efficiency of the driver IC and improve the operation reliability of the driver IC when the heat is high in the COG type organic EL module while maintaining the thin shape. The object is to provide an organic EL module.

In order to solve the above problems, the present invention provides a support substrate,
A light-emitting display unit formed by laminating at least a first electrode, an organic light-emitting layer, and a second electrode on the support substrate;
A driver IC mounted on the support substrate and applying a drive current between the first and second electrodes;
A circuit board for inputting power and drive signals to the driver IC, and an organic EL module comprising:
The circuit board includes a connection wiring for inputting a power source and a driving signal to the driver IC, and a heat radiation wiring that is in direct contact with the back side of the driver IC.

  As described above, according to the present invention, in the COG type organic EL module, it is possible to improve the heat dissipation efficiency of the driver IC while maintaining the thin shape, and to obtain high reliability of the driver IC.

The top view which shows the organic electroluminescent module which is embodiment of this invention. The side view which shows an organic EL module same as the above. The principal part enlarged view of an organic EL module same as the above. Sectional drawing which shows the organic EL element which shows an organic EL module same as the above. The figure which shows the organic EL module which is other embodiment of this invention.

  Hereinafter, an organic EL module according to an embodiment of the present invention will be described with reference to the accompanying drawings. 1 and 2 are overall views of the organic EL module, and FIGS. 3 and 4 are enlarged views of main parts of the organic EL module. In the drawing, a part of each wiring described later is omitted.

  The support substrate 11 is an electrically insulating substrate made of a rectangular transparent glass material. On the support substrate 11, a light emitting display unit 12 and a driver IC 13 are provided. Further, an FPC 14 is mounted on the support substrate 11 as means for electrical connection with the driver IC 13. Further, on the support substrate 11, an anode wiring 15 connected to each anode line of the light-emitting display unit 12 described later, a cathode wiring 16 connected to each cathode line of the light-emitting display unit 12 described later, and a driver IC 13 are external circuits. And an input wiring 17 for electrical connection. In addition, although the sealing member which covers the light emission display part 12 airtightly is arrange | positioned on the support substrate 11, the sealing member is abbreviate | omitted in FIG.1 and FIG.3.

  As shown in FIGS. 2 and 3, the light emitting display unit 12 includes a plurality of anode lines (first electrodes) 12a, an insulating film 12b, a partition wall 12c, an organic layer 12d, and a plurality of cathode lines. (Second electrode) 12e, and so-called passive comprising a plurality of light-emitting pixels (organic EL elements) mainly composed of portions where each anode line 12a and each cathode line 12e cross each other and sandwich the organic layer 12d. This is a matrix-type light emitting display portion. Moreover, as shown in FIG. 3, the light emitting display part 12 is airtightly covered with the sealing member 12f.

  The anode line 12a is made of a light-transmitting conductive material such as ITO. The anode 12a is formed so as to be substantially parallel to each other by a photolithography method or the like after the conductive material is formed in layers on the support substrate 11 by means such as vapor deposition or sputtering. Each anode line 12a is connected to each anode wiring 15 on one side of the end (the lower side in FIG. 1).

  The insulating film 12b is made of, for example, a polyimide-based electrically insulating material, and is formed so as to be positioned between the anode line 12a and the cathode line 12e, and prevents a short circuit between the electrode lines 12a and 12e. The insulating film 12b is formed with an opening 12b1 that defines each light emitting pixel and makes the outline clear. The insulating film 12b also extends between the cathode wiring 16 and the cathode line 12e, and has a contact hole 12b2 that connects each cathode wiring 16 and each cathode line 12e.

  The partition wall 12c is made of, for example, a phenol-based electrically insulating material, and is formed on the insulating film 12b. The partition wall 12c is formed by means such as a photolithography method so that the cross section thereof has a reverse taper shape with respect to the insulating film 12b. A plurality of partition walls 12c are formed at equal intervals in a direction orthogonal to the anode line 12a. The partition wall 12c has a structure in which the organic layer 12d and the cathode line 12e are divided when the organic layer 12d and the cathode line 12e are formed from above by a vapor deposition method, a sputtering method, or the like.

  The organic layer 12d is formed on the anode line 12a and includes at least an organic light emitting layer. In the present embodiment, the organic layer 12d is formed by sequentially laminating a hole injection layer, a hole transport layer, an organic light emitting layer, and an electron transport layer by means of vapor deposition or sputtering.

  The cathode line 12e is formed of a plurality of metallic conductive materials having higher conductivity than the anode line 12a such as aluminum (Al) and magnesium silver (Mg: Ag) so as to intersect the anode line 12a by means such as vapor deposition. It will be. Each cathode line 12e is connected to each cathode wiring 16 via a contact hole 12b2 provided in the insulating film 12b.

  The sealing member 12f is made of, for example, a glass material, and is disposed on the support substrate 1 via an adhesive 12g to house the light emitting display unit 12 in an airtight manner.

  The driver IC 13 constitutes a drive circuit that drives the light emitting display unit 12 to emit light, and includes a signal line drive circuit, a scanning line drive circuit, and the like. The driver IC 13 is mounted on the support substrate 11 according to the light emitting display unit 12 by the COG mounting technique, and is electrically connected to each anode line 12a and each cathode line 12e via each anode wiring 15 and each cathode wiring 16. A drive current is applied between each anode line 12a and each cathode line 12e based on a drive signal from an external circuit.

  The FPC 14 is a flexible circuit board made of a polyimide-based electrically insulating material, is formed in a substantially rectangular shape, and has one end (the upper end in FIG. 1) disposed on the support substrate 11. Further, the FPC 14 is formed with extending portions 14a that extend toward the driver IC 13 (upward in FIG. 1) on both sides. A connection wiring 18 connected to the input wiring 17 is formed in the central region of the FPC 14, and a heat radiation wiring 19 is formed in both side regions of the FPC 14 including the extending portion 14a. In FIG. 1, the connection wiring 18 and the heat radiation wiring 19 formed on the back surface side of the FPC 14 are illustrated by dotted lines.

  The anode wiring 15 is a wiring connecting the anode line 12a and the driver IC 13, and is made of, for example, a conductive material such as ITO, chrome (Cr), aluminum (Al), or the like, which is the same material as the anode line 12a, or a laminate of these conductive materials. Become. The anode wiring 15 is formed integrally with the anode line 12a on the support substrate 11, or is formed separately so as to be connected to the anode line 12a.

  The cathode wiring 16 is a wiring connecting the cathode line 12e and the driver IC 13, and is made of, for example, a conductive material such as ITO, chromium (Cr) or aluminum (Al), which is the same material as the anode line 12a, or a laminate of these conductive materials. Become. The cathode wiring 16 is a wiring formed by being routed alternately to the left and right with respect to each cathode line 12e on the side on the support substrate 11, and one end is connected to the cathode line 12e and the other end is connected to the driver IC 13. As shown in FIG. 3, the cathode wiring 16 has at least an end portion of the cathode line 12e connected to the cathode line 12e via the insulating film 12b so that it can be connected to the cathode line 12e via the contact hole 12b2. It is formed so as to be positioned below.

  The input wiring 17 is a wiring for electrically connecting the driver IC 13 and an external circuit. For example, a conductive material such as ITO, chromium (Cr) or aluminum (Al), which is the same material as the anode line 12a, or these conductive materials. It consists of a laminate of materials. The input wiring 17 is formed in the vicinity of the driver IC 13 on the support substrate 11, and one end is connected to the driver IC 13 and the other end is connected to the connection wiring 18 formed on the FPC 14 via the ACF.

  The connection wiring 18 is a wiring formed in the central region on the FPC 14 and is made of, for example, a copper foil (Cu) having a layer thickness of several μm to several tens of μm. One end of the connection wiring 18 is connected to the input wiring 17 via the ACF, and the other end has a terminal portion 18a connected to an external circuit. The power supply and drive signal from the external circuit are input to the driver IC 13 via the connection wiring 18 and the input wiring 17.

  The heat radiation wiring 19 is a wiring formed in a lateral region including the extending portion 14a on the FPC 14, and is made of, for example, a copper foil (Cu) having a layer thickness of several μm to several tens μm and having excellent thermal conductivity. is there. One end of the heat dissipation wiring 19 is in direct contact with the back side of the driver IC 13. Note that the other end of the heat dissipation wiring 19 may be connected to a wiring on an external circuit to further increase the heat dissipation efficiency.

  As shown in FIG. 2, a covering member 20 made of a silicone resin, a UV curable adhesive, or the like is formed so as to cover the driver IC 13 and its periphery. The covering member 20 protects the driver IC 13 and covers the contact portion between the heat radiation wiring 19 and the driver IC 13 to fix the heat radiation wiring 19 on the back surface of the driver IC 13. In FIG. 1, the covering member 20 is omitted.

  The organic EL module is configured by the above-described units.

  Such an organic EL module has a configuration in which a heat radiation line 19 is formed on the FPC 14 to directly contact the back side of the driver IC 13 and heat generated by the driver IC 13 is directly conducted to the heat radiation line 19 on the FPC 14 to dissipate heat. . In order to bring the heat radiation wiring 19 into direct contact with the driver IC 13, the FPC 14 is provided with an extended portion 14 a formed with the heat radiation wiring 19 and extending to the back side of the driver IC 13. The heat dissipating wiring 19 formed on the FPC 14 has a copper foil thickness of several μm to several tens of μm, which is much thicker than the wiring having a thickness of several nm formed on the support substrate 11 and has a high thermal conductivity. Therefore, the heat radiation efficiency can be improved as compared with the case where heat is transferred via the wiring on the support substrate 1, and the operation reliability of the driver IC 13 at a high temperature can be improved. In addition, since it is not necessary to provide a dedicated heat dissipation member, the thickness of the organic EL module does not increase, and the characteristics of the organic EL module that are thin can be maintained.

  Further, by forming the covering member 20 that covers at least the contact portion between the driver IC 13 and the heat radiation wiring 19, the heat radiation wiring 19 can be easily fixed on the back surface of the driver IC 13. In particular, since a silicone resin formed on the support substrate 11 for protecting the driver IC 13 is used as the covering member 20, it is not necessary to use a new material for fixing the heat radiation wiring 19, thereby suppressing an increase in cost. .

  In the present embodiment, the extending portions 14a are provided on both side portions of the FPC 14, and the two heat dissipating wires 19 formed in the both side regions are brought into contact with the back side of the driver IC 13, respectively. The present invention is not limited to this. For example, as shown in FIG. 5, a connecting portion 14b for connecting both extending portions 14a of the FPC 14 is provided, and a heat radiating wire 19 is also formed in the connecting portion 14b. The contact area between the driver 19 and the driver IC 13 may be increased. In this case, the heat dissipating wiring 19 is a single wiring formed in both side regions including both extending portions 14a of the FPC 14 and the connecting portion 14b.

  The present invention is suitable for a COG type organic EL module.

11 Support substrate 12 Light-emitting display part 12a Anode line (first electrode)
12b Insulating film 12c Partition 12d Organic layer 12e Cathode line (second electrode)
12f Sealing member 13 Driver IC
14 FPC
15 Anode wiring 17 Input wiring 18 Connection wiring 19 Heat radiation wiring 20 Coating member

Claims (4)

A support substrate;
A light-emitting display unit formed by laminating at least a first electrode, an organic light-emitting layer, and a second electrode on the support substrate;
A driver IC mounted on the support substrate and applying a drive current between the first and second electrodes;
A circuit board for inputting power and drive signals to the driver IC, and an organic EL module comprising:
The organic EL module, wherein the circuit board includes connection wiring for inputting a power source and a driving signal to the driver IC, and heat radiation wiring that directly contacts the back side of the driver IC. 2. The organic EL module according to claim 1, wherein the circuit board is formed with an extended portion on which the heat dissipation wiring is formed and extends to the back surface of the driver IC. The organic EL module according to claim 1, further comprising a covering member that covers at least a contact portion between the driver IC and the heat radiation wiring. The organic EL module according to claim 1, wherein the circuit board is a flexible board.

Images