JP2011170678A - Card having magnetic stripe and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card having a magnetic stripe and a method for manufacturing the same which prevent a pattern from becoming distorted due to a heat press mark in heat molding, during manufacturing of the card with a magnetic stripe, preventing a mounted contact type IC module from being observed through, and minimizing thickness and variation in thickness for preventing separation between layers. <P>SOLUTION: An ID-1 card stipulated in JIS X6301 has a single layer structure formed of a while base material, and the card has a magnetic stripe disposed being flush with one side of the base material, and a pattern is printed on the surface of the magnetic stripe. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a card having a magnetic stripe among ID-1 cards defined in JIS X6301 that can be used for a credit card, a cash card, a point card, and the like.

  Conventionally, as a method of manufacturing a card with a magnetic stripe, for example, a white vinyl chloride resin core sheet is used as a card core, and a desired overprinting is performed on the card core in advance, and a transparent oversheet made of vinyl chloride resin is formed by transferring a magnetic stripe. It is known that the card core and the oversheet are laminated and bonded together by fusing by hot flat pressing method, and the laminated sheet is punched out to a predetermined dimension.

  Furthermore, a method is disclosed in which a magnetic stripe is arranged on a card substrate, the surface is covered so that the magnetic stripe is embedded with a thick protective layer, and the surface is flush (Patent Document 2).

Japanese Patent No. 386825 JP 2000-30029 JP

  For the magnetic stripe, the core substrate and the exterior substrate are bonded together by thermal fusion, and at the same time, thermoforming is performed so that the magnetic stripe is flush with the surface of the card substrate. At this time, there is a problem that the resin of the base material flows, and accordingly, a phenomenon occurs in which the pattern around the magnetic stripe is distorted by a hot press mark.

  As a countermeasure, a method of lowering the temperature of thermoforming by using an adhesive (without adhesive: 140 to 160 ° C., with adhesive: 100 ° C. to 130 ° C.) can be considered. The pattern layer in contact with the adhesive also flows in the same manner, and distortion of the pattern occurs.

  For contact type IC modules, when the contact type IC module is arranged together with a magnetic stripe, a concave portion is provided by counterbore in a pre-arranged region, and the IC module is mounted using a thermoplastic or thermosetting adhesive. A fixing method is common.

  However, if the thickness of the white core substrate is thin, a hole is made through the white core substrate, or a recess is provided until the white core is transparent even if it does not penetrate. When viewed from the surface, there is a problem that the bottom surface of the IC module can be seen because the oversheet is transparent.

  Therefore, the thickness of the white core layer is generally 0.6 mm or more and the total thickness is 0.8 mm or more, and the card thickness standard defined by JIS X 6301 is 0.68 to 0.84 mm. It will be near the upper limit of, and may deviate from the standard.

At present, a core substrate and an exterior substrate are laminated or bonded together, and a plurality of substrates are used. In general, a thin base material has a larger variation ratio with respect to the base material thickness than a thick base material, and is made of a plurality of base materials than a card made of a single base material. Cards that have been used have more variation and may deviate from the standard. Furthermore, the problem of delamination also occurs.

  Therefore, in the manufacture of a card with a magnetic stripe, the present invention prevents the pattern from being distorted by the hot press marks at the time of thermoforming. It is an object of the present invention to provide a card having a magnetic stripe that does not cause delamination and a manufacturing method thereof.

  As means for solving the above-mentioned problems, the invention according to claim 1 is an ID-1 card defined in JISX6301, which is a single-layered structure composed of a white base material, on one side of the base material. It is a card having a magnetic stripe, characterized in that it has magnetic stripes arranged on the same plane, and a pattern is printed on the surface.

  The invention according to claim 2 is the card having a magnetic stripe according to claim 1, wherein the white single-layer base material is made of a thermoplastic resin.

  According to a third aspect of the present invention, there is provided a card having a magnetic stripe according to the first or second aspect, comprising a contact IC module.

  The invention described in claim 4 is a step of arranging magnetic stripes on a white single-layer substrate, a step of leveling by thermoforming, a step of printing on the front and back sides, and a step of surfaceizing by heat. 4. The method of manufacturing a card having a magnetic stripe according to claim 3, comprising a step of cutting into small pieces and a step of disposing a contact IC module by providing a recess.

  Further, the invention according to claim 5 is a process in which a magnetic stripe is arranged on a white single layer base material, and is made uniform by thermoforming together with a transfer film that has been printed on a release protective layer in advance. 4. The manufacturing of a card having a magnetic stripe according to claim 3, comprising: a step of performing transfer printing, a step of performing surface surfacing by heat, a step of cutting into small pieces, and a step of disposing a contact IC module by providing a recess. Is the method.

  The pattern is printed on the white core base material and then covered with a transparent outer sheet with magnetic stripes. It can be set as the card | curd which has a magnetic stripe which can make the distortion of the pattern by the heat press trace near a stripe small.

  Since a transparent exterior sheet is not used, all of the base material is made of white, so that even when a contact type IC module is arranged, it can be made difficult to see through.

  By using a thermoplastic resin as the base material, the magnetic stripe can be arranged flush with the base material by thermoforming.

  By comprising a single-layer base material, it is possible to reduce the thickness variation when it becomes a card.

  By comprising only a single-layer base material, the process is shorter than in a manufacturing method in which a plurality of base materials are laminated, and there is no need for considering adhesion of the base material, and there is no delamination.

  By printing the pattern on the transfer film in advance, the lead time can be shortened and the yield of the substrate can be improved.

It is a conceptual diagram which shows the structure of the ID-1 card | curd prescribed | regulated to JISX6301 and having a magnetic stripe on one side by the structure laminated | stacked or bonded together. It is a conceptual diagram which shows the structure of the ID-1 card | curd prescribed | regulated to JISX6301 and having a magnetic stripe on both surfaces by the structure laminated | stacked or bonded together. It is the conceptual diagram which showed an example of the manufacturing process of the card | curd which has a magnetic stripe of this invention. It is the conceptual diagram which showed the other example of the manufacturing process of the card | curd which has a magnetic stripe of this invention.

  An embodiment of a card having a magnetic stripe of the present invention will be described.

  The base material composing the card according to the present invention is composed only of a white single layer base material, and may satisfy the standard of JISX6301 and the thickness of 0.68 to 0.84 mm. .80 mm is preferable.

  The material used as the card substrate is preferably a thermoplastic resin because the magnetic stripe needs to be flush with the substrate by thermoforming. Polyvinyl chloride or polyvinyl chloride-polyvinyl acetate copolymer A copolymer of terephthalic acid with cyclohexanedimethanol and ethylene glycol, a copolymer of terephthalic acid with isophthalic acid and ethylene glycol, or a polymer alloy of the copolymer with polycarbonate and / or polyarylate Examples thereof include amorphous polyesters, amorphous resins such as ABS, and crystalline resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene, and polypropylene. Amorphous resin is preferable because it is easier to thermoform the magnetic stripes flush with each other, but crystalline resin is also possible.

  In general, the thickness of the core material is suppressed to ± 3%, but the thickness of the transparent exterior base material is ± 10%, and the thickness variation is larger than that of the core material. Therefore, from the current manufacturing method in which the exterior base material is bonded to both sides of the core material, the quality control regarding the thickness is facilitated by providing a necessary function with a single material corresponding to the core.

  The magnetic stripe is of a type in which at least a magnetic layer and an adhesive layer are printed on a plastic base film by gravure printing or the like, and the base film can be peeled off by thermal transfer. Examples of the base film include polyethylene terephthalate and polypropylene.

  The adhesive layer is preferably, but not limited to, polyvinyl chloride, polyvinyl acetate, polyvinyl alcohol, polyester, polyurethane, or a mixture or copolymer thereof. The magnetic stripe is adhered and arranged on one side or both sides of the card base by thermal transfer. At this time, the thickness of the magnetic stripe is 10 to 30 μm.

The magnetic stripe is embedded in the substrate by thermoforming so as to be flush with the substrate surface. This step is indispensable when using a method of printing a pattern directly on a card substrate, but when using a method of printing on a transfer film in advance and transferring to a substrate, a magnetic stripe is embedded in the substrate during thermal transfer, The surface is flush with the substrate surface. Thermoforming is possible if the molding temperature is at least the glass transition temperature of the substrate plus 20 ° C. and below the melting point, and the glass transition temperature plus 30 ° C. to the melting point minus 20 ° C. is particularly suitable. Pressure is 1.0-3.5MP
a is preferred.

  Printing of the pattern, etc. was performed on the card base material on which the magnetic stripes were arranged flush with each other, and a protective layer laminated printing, or a release layer, a protective layer, an adhesive layer, etc. were formed on a polyethylene terephthalate film, etc. The pattern is printed on the transfer film, and then the pattern printing layer, the protective layer, and the release layer are thermally transferred.

  As the printing method, offset printing, screen printing, gravure printing, flexographic printing, or the like is used. Ink resin is thermoplastic resin such as vinyl chloride, vinyl acetate, vinyl alcohol, acrylic resin, polyester resin, polyurethane resin and their copolymers and mixtures, thermosetting type such as epoxy, phenol, melamine, etc. Resins such as resin and UV curable resin are used, but not limited thereto.

  The protective layer uses the same resin as the ink. In addition, it is preferable to add waxes such as polyethylene, silicon, and PTFE because the surface frictional resistance is reduced. The adhesive is preferably polyvinyl chloride, polyvinyl acetate, polyvinyl alcohol, polyester, polyurethane, or a mixture or copolymer thereof.

  A pattern is printed on the substrate, or thermal transfer is performed using a transfer film composed of a release layer and a protective layer on which the pattern is printed. In the case of a base material in which the magnetic stripe cannot be formed flush, thermoforming is also performed simultaneously. In the case where the magnetic stripe is not flushed by thermoforming, the temperature is preferably 90 to 130 ° C. and the pressure is preferably 1.0 to 3.5 MPa. In the case where the magnetic stripe is flushed by thermoforming, the temperature is preferably 100 to 150 ° C. and the pressure is preferably 1.0 to 3.5 MPa.

  A step of arranging a magnetic stripe on the white single-layer substrate, a step of performing transfer printing and leveling with a transfer film on which a pattern printing has been applied in advance on the peeling protective layer by performing thermoforming, In general, the step of performing the surface exposure by the method is performed on all the plate sheets arranged in a multi-sided manner, and is reduced to a card size by punching or the like.

  A contact type IC module is arranged as required. A recess is formed by counterboring the external terminal and the shape of the IC connected to the external terminal by an end mill or the like. The recess position is defined in JISX6320-2. Since the shape of the recess conforms to the shape of the external terminal, the adhesive, and the IC, it naturally becomes a two-step recess, and the maximum depth is generally 0.4 to 0.6 mm (temporary). Thereafter, a thermoplastic or thermosetting adhesive (adhesive sheet) is disposed on the back surface of the outer peripheral portion of the external terminal and fixed by hot pressing.

  A 20 μm thick magnetic stripe (Toppan TDK Label) is placed on both sides of a card substrate (Mitsubishi Resin) made of white polyvinyl chloride with a thickness of 0.76 mm, and conditions of 110 ° C., 1.5 MPa, 20 minutes Thermoforming was done to make it even. Thereafter, vinyl chloride-vinyl acetate copolymer resin was printed on the front and back surfaces with a thickness of 1.5 μm by screen printing, and a 1 mm pitch grid was printed by offset printing. Then, thermoforming under the conditions of 120 ° C, 1.5MPa, 20 minutes, cut into card pieces by punching, provided with a recess of 0.6mm in depth, and hot pressing at 180 ° C for 2 seconds, A contact IC module was placed.

Magnetic stripes having a thickness of 20 μm were arranged on both sides of a card substrate made of polyvinyl chloride having a thickness of 0.76 mm. Next, square patterns with a pitch of 1 mm were printed as offset patterns on the transfer film having a peeling protective layer, and a vinyl chloride-vinyl acetate copolymer resin was printed with a thickness of 1.5 μm by screen printing. Then, flush processing and pattern transfer are performed by thermoforming under conditions of 110 ° C., 1.5 MPa, 20 minutes, cut into card pieces by punching, provided with a recess having a depth of 0.6 mm, 180 ° C., 2 seconds A hot press was performed under the conditions described above to place a contact IC module.

  The base material of Example 1 was a white PETG base material (PG-WHI-FG; Mitsubishi resin).

The base material of Example 2 was a white PETG base material (PG-WHI-FG; Mitsubishi resin).
<Comparative Example 1>

A vinyl chloride-vinyl acetate copolymer resin is printed with a thickness of 1.5 μm by screen printing on the front and back of a card base (made by Mitsubishi Plastics) made of white polyvinyl chloride with a thickness of 0.6 mm, and 1 mm by offset printing. Pitch grids were printed. Next, a transparent exterior substrate (made by Mitsubishi Plastics) having a thickness of 0.1 mm in which magnetic stripes (made by Toppan TDK Label) having a thickness of 20 μm are disposed on both sides by thermal transfer is bonded to 150 ° C., 1.5 MPa, 20 minutes. Thermoforming was performed under the following conditions. Then, it cut out into the card | curd piece by punching, provided the recessed part with a depth of 0.6 mm, performed hot press on 180 degreeC and 2 second conditions, and arrange | positioned the contact IC module.
<Comparative example 2>

The base material of Comparative Example 1 was a white PETG base material (PG-WHI-FG; Mitsubishi resin).
<Comparative Example 3>

The thermoforming temperature of Comparative Example 1 was 110 ° C.
<Comparative example 4>

The thermoforming temperature of Comparative Example 2 was 110 ° C.
<Comparative Example 5>

The thickness of Comparative Example 1 was 0.56 mm.
<Comparative Example 6>

  The thickness of Comparative Example 2 was 0.56 mm.

  The evaluation results are shown in Table 1.

  With regard to the distortion of the pattern due to the heat press mark, the grid pattern was a pattern, and the distortion of the grid near the magnetic stripe was visually confirmed. However, Examples 1 to 4 were satisfactory regardless of the temperature and were good regardless of the temperature. . On the other hand, no distortion occurred in Comparative Examples 3 and 4 due to the low temperature condition, but square distortion occurred in Comparative Examples 1, 2, 5 and 6 due to the high temperature condition.

  Regarding the adhesiveness of the base material, it was confirmed whether there was a part to be peeled between the layers of the base material, but Examples 1 to 4 had no part to be peeled off because of a single layer. On the other hand, since Comparative Examples 1, 2, 5, and 6 were molded at a high temperature of 150 ° C., peeling did not occur, but in Comparative Examples 3 and 4, peeling occurred due to a lack of heat during thermoforming.

Regarding the see-through of the contact IC module, it was visually confirmed whether it could see through from the back surface of the area where the contact IC module was placed. Although Examples 1-6 consisted of only a white base material, the phenomenon of see-through did not occur, whereas in Comparative Examples 1-4, the phenomenon of see-through did not occur because the core base material was thick. In Comparative Examples 5 and 6, since the core substrate was thin, a phenomenon of being seen through occurred.

  Regarding the trace of the contact type IC module heat press, a visual check is performed to check whether the distortion of the pattern occurs on the back side by the heat press for arranging the contact type IC module. In Examples 1 to 4, no distortion of the pattern occurred, but in Comparative Examples 1 to 6, distortion of the pattern occurred. In particular, in Examples 5 and 6, the substrate was thin and the distortion was large.

  Comparative Examples 1 to 6 produced by a conventional method in which a transparent exterior base material was laminated had problems regarding delamination, transparent heat press trace thickness variation, and the like, but Examples 1 to 4 of the present invention were problematic. There was no occurrence, and it was found that the present invention was effective.

DESCRIPTION OF SYMBOLS 1 ... Single layer base material 2 ... Front exterior base material 3 ... Back exterior base material 4 ... Magnetic stripe 5 ... Picture printing 6 ... Protective layer 7 ... External terminal 8 ..IC module 9 ... adhesive 10 ... transfer film 11 ... peeling protective layer 12 ... film substrate 13 ... counterbore hole

Claims (5)

  The ID-1 card specified in JIS X6301 has a single-layer configuration consisting of a white base material, which has magnetic stripes arranged flush on one side of the base material, and prints a pattern on the surface. A card having a magnetic stripe.   2. A card having a magnetic stripe according to claim 1, wherein the white single layer base material is made of a thermoplastic resin.   3. A card having a magnetic stripe according to claim 1, further comprising a contact IC module.   The process of arranging magnetic stripes on a white single-layer substrate, the process of leveling by thermoforming, the process of printing on the front and back, the process of surfaceizing with heat, the process of cutting out into small pieces, and providing contact with recesses 4. The method of manufacturing a card having a magnetic stripe according to claim 3, further comprising a step of arranging an IC module.   A process of arranging magnetic stripes on a white single-layer substrate, a process of performing leveling and transfer printing by thermoforming together with a transfer film that has been printed on a peel protection layer in advance, and surface exposure by heat 4. The method for manufacturing a card having a magnetic stripe according to claim 3, comprising a step of performing, a step of cutting into small pieces, and a step of disposing a contact IC module by providing a recess.