JP2011149756A - Processing operation device, acf attached condition inspection method, or display substrate module assembly line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing operation device or an ACF attachment inspection method capable of effectively inspecting various ACF attached conditions or surely inspecting ACF attached conditions and distinguishing a cause of trouble when luminance has changed, in particular trouble of luminance drop such as illumination deterioration has generated, or a display substrate module assembly line with a higher uptime ratio by noticing the cause of trouble and providing maintenance of the cause (preparation, correspondence). <P>SOLUTION: A predetermined position is illuminated and imaged, a determination area is set at a region where the ACF must exist in the image data obtained by the imaging, the image data on a circumference of the determination area is processed, an attached condition of the ACF is inspected based on the processing result or a luminance level of the image data is detected, and the cause of change of the luminance level is distinguished based on the change with time of the luminance level. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is a so-called TAB (= Tape Automated Bonding) such as mounting of a driving IC around a display substrate of an FPD (= Flat Panel Display) such as liquid crystal or plasma, COF (Chip on Film), FPC (Flexible Printed Circuits), etc. The present invention relates to a processing work apparatus for mounting a connection and a peripheral board (PCB = printed circuit board), and a display board module assembly line composed of them. More specifically, the present invention relates to an inspection unit and an inspection method for inspecting the application state of an anisotropic conductive film (ACF) and a display substrate module assembly line configured based on the inspection unit or the inspection result. .

  The display substrate module assembly line is a process substrate for FPD display substrates such as liquid crystal and plasma (hereinafter, simply abbreviated as a substrate, and clearly described as a PCB substrate in the case of a PCB, for example). Is a device for mounting a driving IC, a COF, a PCB substrate, and the like around the substrate by sequentially performing the above.

  For example, as an example of the processing step, (1) a terminal cleaning step for cleaning the TAB pasting portion at the substrate end, (2) an ACF step for pasting ACF on the substrate end after cleaning, and (3) an ACF pasted ACF inspection process for inspecting the pasting state, (4) Mounting process for positioning and mounting TAB and IC on the substrate wiring at the position where ACF is pasted, (5) Fixing by ACF by thermocompression bonding of the mounted TAB Crimping process, (6) Mounting inspection process for inspecting the position and connection state of TAB and IC that have been crimped, (7) Inspecting the ACF adhering state by attaching a PCB substrate to the side opposite to the TAB substrate side with ACF etc. It consists of a PCB process (a plurality of processes). Furthermore, the number of processing apparatuses, processing units for rotating the substrates, and the like are required depending on the number of sides of the substrate to be processed and the number of TABs and ICs to be processed. By obtaining such a process, both electrodes are electrically connected by thermocompression bonding of an ACF provided between an electrode on the substrate side and an electrode on the TAB / IC side.

  As a conventional technique for inspecting the ACF sticking state described in the above (3) and (6), there is Patent Document 1. Japanese Patent Application Laid-Open No. 2004-133620 images the end of the ACF attached to the substrate, sets a threshold value between the luminance differences between the ACF part and the lead part, and sets the threshold value to the brightness of the lead part when the brightness of the lead part is high. Set based on. Further, Patent Document 1 binarizes the image pickup range into an ACF portion (black pixel) and a lead portion (white pixel), and detects the end of the ACF from the ratio of black and white pixels in the image pickup range.

JP 2008-185574 A

  However, although Patent Document 1 states that a change in lead luminance is caused by unevenness in the process of lead formation, there is no disclosure as to what is the other cause and what is actually the cause.

  In addition, in the inspection of the ACF attachment state, there are ACF misalignment, twisting, etc. in addition to forgetting ACF attachment and curling (peeling). is there. Further, if the imaging range is the entire ACF attachment position, it may take time for image processing.

The first object of the present invention is to provide a processing work apparatus or an ACF sticking inspection method capable of efficiently inspecting various ACF sticking states.
A second object of the present invention is a processing work apparatus or ACF that can reliably inspect the state of ACF sticking and determine the cause of a failure even if a failure in brightness reduction such as a change in brightness, particularly illumination deterioration occurs. It is to provide a sticking inspection method.
Further, the third object of the present invention is to know the cause of the failure by using the processing apparatus or the ACF sticking inspection method, so that the operation for preserving (preparing and coping with) the cause can be performed in advance. It is to provide a display board module assembly line with a high rate.

  In order to achieve the first object, when inspecting the attachment state of the ACF attached to a predetermined position of the substrate, the predetermined position is illuminated and imaged, and the imaging data obtained by the imaging is added to the imaging data obtained by the imaging. Setting a determination area in an area where an ACF must exist, processing a part or all of imaging data of an outer peripheral portion of the determination area, and inspecting the pasting state of the ACF based on the processing result First feature.

In order to achieve the first object, in addition to the first feature, a second feature is that the determination area is set on the inner side adjacent to the region.
Furthermore, in order to achieve the first object, in addition to the first feature, the image processing means is means for obtaining binarized data of the image, and the inspection means is one of the binarized data. The third feature is to inspect the application state of the ACF based on the level continuity.

In order to achieve the first object, in addition to the first feature, a fourth feature is that the determination area is a quadrangular shape and the outer peripheral portion is a quadrilateral four sides.
Furthermore, in order to achieve the first object, in addition to the first or second feature, the inspection is to inspect at least one of ACF misalignment, twist, no sticking, and peeling. Is the fifth feature.

In order to achieve the first object, in addition to the first feature, the sixth feature is that the imaging is performed while the substrate is being transported to another processing work apparatus at a subsequent stage.
Furthermore, in order to achieve the first object, in addition to any of the first to sixth features, a seventh feature is that the imaging is performed by a line sensor camera.

In order to achieve the second object, when inspecting the attachment state of the ACF attached to a predetermined position of the substrate, the predetermined position is illuminated and imaged, and the imaging data obtained by the imaging is obtained. The eighth feature is that a luminance level is detected and the cause of the change is determined based on a time-series change of the luminance level.
Furthermore, in order to achieve the second object, in addition to the eighth feature, the ninth feature is that the luminance level is detected by the luminance of the alignment mark on the substrate.

In order to achieve the second object, in addition to the eighth feature, the tenth feature is that the luminance level is detected by the luminance of a lead provided on the substrate.
Further, in order to achieve the second object, in addition to the eighth feature, the brightness level is detected by the brightness of a dedicated mark for brightness level detection provided on the substrate. Eleven features.

In order to achieve the second object, in addition to the eighth feature, a twelfth feature is that a threshold value for binarizing the imaging is corrected based on the luminance level.
Furthermore, in order to achieve the second object, in addition to the eighth feature, the imaging is carried out while the substrate is being transported to a subsequent processing apparatus.
In order to achieve the second object, in addition to any of the eighth to thirteenth features, a fourteenth feature is that the imaging is performed by a line sensor camera.

  Finally, in order to achieve the third object, the substrate is transported, ACF is pasted at a predetermined position on the side of the substrate, the ACF pasting state is inspected, and the two processing operations and other processing operations are sequentially performed. When assembling the display board module in a row, the predetermined position is illuminated and imaged, the luminance level of the image data obtained by the imaging is detected, and the cause of the change is determined based on the time-series change of the luminance level The fifteenth feature is that maintenance (preparation, coping) for the two processing operations and other processing operations is performed or promoted.

ADVANTAGE OF THE INVENTION According to this invention, the ACF sticking inspection apparatus or the ACF sticking inspection method which can test | inspect various ACF sticking states efficiently can be provided.
In addition, according to the present invention, even if a failure in luminance, such as a deterioration in luminance, such as illumination deterioration, occurs, a processing work apparatus or an ACF attachment inspection method that can reliably inspect the application state of the ACF and determine the cause of the failure. Is to provide.
Furthermore, according to the present invention, since the cause of the failure can be known by using the processing work apparatus or the ACF sticking inspection method, maintenance (preparation, countermeasure) for the cause can be performed in advance. It is to provide a display substrate module assembly line.

It is the figure which showed the display substrate module assembly line which is the 1st Embodiment of this invention. It is a basic composition and operation explanatory view of a display board transfer device which is an embodiment of the present invention. It is the figure which showed the ACF sticking processing work apparatus, the ACF sticking state inspection unit, the TAB / IC mounting processing work apparatus, etc. among the display board module assembly lines shown in FIG. It is the figure which showed the display substrate which is the main part required for the test | inspection of an ACF sticking state among the structures shown in FIG. 3, and a test object. It is a figure explaining the method which can test | inspect efficiently the various ACF sticking states which are one characteristic of this embodiment. It is the figure which showed relatively each luminance level and determination threshold value with respect to a board | substrate, a lead | read | reed, and ACF. It is the figure which showed the black-and-white image of the outer peripheral part of the determination area with respect to various sticking states of ACF. It is the figure which showed the processing flow mainly having the test | inspection operation | movement of an ACF sticking state test | inspection. It is the figure which showed the example of the kind parameter based on work content. It is the figure which showed the example of a fluctuation | variation of each luminance level when malfunctions, such as a brightness fall, and the correction method of a determination threshold value. It is the figure which showed the time series fluctuation | variation example of the determination threshold value. 12 is a table that summarizes possible causes and countermeasures for each time-series variation example in FIG. 11. It is the figure which showed the processing flow about the correction | amendment of the determination threshold value with respect to a luminance change, the discrimination | determination of the cause of a luminance change, and the operation | movement of the countermeasure. It is the figure which showed the other Example of the determination area.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a diagram showing a basic configuration of a display board module assembly line 1 according to an embodiment of the present invention, and FIG.

  The apparatus shown in FIG. 1 includes a substrate holding means 12 for holding a substrate P and a substrate transfer means 11 for transferring the substrate to the position of the adjacent processing work apparatus. Is a device that performs various processing operations on the periphery of the substrate while sequentially transporting ICs, and performs mounting assembly operations such as IC and TAB. The apparatus shown in FIG. 1 first performs processing on the long side of the substrate by the processing work device group 13L on the long side of the left substrate, performs processing on the long side of the substrate, and then rotates the substrate with the substrate rotating means 19. Then, processing on the short side of the substrate is performed by the processing apparatus group 13S on the short side of the substrate having the same configuration. In the substrate long side 13L and the substrate short side 13S, the same symbols are used for the same devices and functions.

  As the substrate long side processing shown in FIG. 1, from the left, (1) a terminal cleaning process for cleaning the TAB attachment portion at the substrate end, (2) an anisotropic conductive film (ACF) is attached to the substrate end after cleaning ACF process, (3) ACF inspection process for inspecting the attached state of the ACF, (4) Mounting process for positioning and mounting the TAB and IC on the substrate wiring at the position where the ACF is attached, (5) Mounted TAB It is configured to perform a process of mounting a PCB substrate, which is a peripheral substrate, after sequentially performing a crimping process in which the IC and the IC are heat-bonded and fixed with an ACF film, and after the end of the substrate side or all the processing sides are completed. ing.

  14 to 20 in the figure are denoted by the same reference numerals on the long side and the short side, respectively, and the terminal cleaning processing work device 14, the ACF sticking processing work device 15, the TAB / IC mounting processing work device 16, and the main pressure bonding processing work, respectively. The apparatus 17, the substrate rotating means 19, and the ACF sticking state inspection unit 20 provided on the conveyance path between the ACF sticking processing work device 15 and the TAB / IC mounting processing work device 16 are shown. Note that a PCB substrate mounting processing work apparatus is omitted. The reason why the ACF attachment processing work device 15 has a plurality of ACF attachment processing work units on both the long side of the substrate and the short side of the substrate is because the processing time of the work is long, and the work is shared by each unit. In order to improve the throughput of the display substrate module assembly line, the processing time of each device of the display substrate module assembly line is made uniform.

  FIG. 2 is a cross-sectional view taken along the line AA when viewed from the X direction, which is the transport direction of the substrate P. As shown in the figure, the transfer apparatus 2 has a substrate transfer means 11 and a substrate holding means 12, and detects the position of each substrate transferred to each processing work apparatus as shown in FIG. 2a is provided. The substrate holding means 12 has a plurality (four in FIG. 2) of substrate holding members 12A elongated in the substrate transport direction. On the other hand, a plurality of substrate transfer means (three in FIG. 2) are juxtaposed between the substrate holding members 12A, and the substrate transfer member 11A is elongated in the substrate transfer direction, as shown in FIGS. 2 (a) and 2 (b). A substrate transport member lifting / lowering means 11B for moving the substrate transport member 11A up and down in order to place or separate the substrate P on the substrate holding member 12A, and a slider 11D for moving the substrate transport means 11 on the guide rail 11C in the transport direction. Have.

  A transport method in such a structure will be described by taking as an example the case where the substrate P shown in FIG. 1 is transported from the ACF attachment processing work device 15 to the TAB / IC mounting processing work device 16. As shown in FIG. 2B, the substrate transfer means 11 holds the substrate P by the substrate transfer member 11A and raises the substrate P by the substrate transfer member lifting / lowering means 11B at the location of the ACF attaching processing work device 15. Separated from the holding member 12A. Thereafter, the substrate P is transported to the position of the TAB / IC mounting processing work device 16 by the slider 11D while the substrate P is held upward. At this time, the substrate transport member 11A moves between the members of the substrate holding member 12A. In the TAB / IC mounting processing work device 16, the substrate P is lowered and placed on the substrate holding member 12A (FIG. 2A), and the substrate transport member 11A is separated from the substrate P. The substrate P is loaded by the TAB / IC loading processing work device 16. During this mounting operation, the substrate transfer means 11 holds the posture not holding the substrate, and returns to the ACF application processing work device 15 to transfer the next substrate. Since the above series of operations are performed in synchronism with all the substrates P working in the assembly line 1, all the substrates are conveyed in synchronism and processed.

  The display substrate module assembly line and the transfer device shown in FIG. 1 and FIG. 2 are an embodiment. In particular, what kind of processing work devices need to be connected depends on the configuration of the display substrate module that performs the assembly work. Needless to say.

  Hereinafter, the ACF sticking state inspection unit 20 that is the most characteristic feature of the present embodiment will be described. The basic concept of this embodiment is as follows. Conventionally, the luminance threshold value of imaging data for determining whether the ACF is in a normal region has been fixed. On the other hand, in the present embodiment, the luminance fluctuation amount is detected based on the time-series fluctuation of the chromium alignment mark that is stably generated in luminance, and the luminance threshold value is corrected based on the luminance fluctuation amount and inspected.

FIG. 3 is a diagram showing a configuration of the present embodiment for realizing the above-described method. FIG. 3 shows the display substrate module assembly line shown in FIG. 1 in which the ACF application processing device 15, the ACF application state inspection unit 20, the TAB / IC mounting processing device 16, the transfer device 2, and the entire display substrate module assembly line. It is the figure which showed the monitor 62 which displays the overall control part 60 to control, the state of a line, etc.
FIG. 4 is a diagram showing a main part necessary for inspection and the display substrate P to be inspected in the configuration shown in FIG. The transport device 2 is controlled by the overall control unit 60 and includes a drive unit 2d for driving the transport unit 11 shown in FIG. 2 and a linear encoder 2a for recognizing the position of the display substrate P.

Hereinafter, the configuration and operation of the ACF attachment state inspection unit 20 will be described with reference to FIGS. 3 and 4.
As shown in FIG. 1, on the long side, the ACF attachment processing work device 15 has four ACF attachment processing work units 15a to 15d. The ACF sticking state inspection unit 20 of the present embodiment is provided on the transport between the downstream unit device 15d and the TAB / IC mounting processing work device 16 among the four units, and the substrate is placed on the next TAB / IC mounting processing work device 16. During transportation, the ACF pasted by the four ACF pasting processing work units in the preceding stage is imaged and inspected. One ACF sticking state inspection unit 20 is provided at a position indicated by an ellipse for each of the processing apparatus groups 13L and 13S on the long side and the short side of the substrate.

  The ACF application state inspection unit 20 controls the imaging timing and the like in response to an instruction from the illumination unit 21, the imaging unit 22, and the device control unit 30 of the ACF application processing work device in order to image the ACF application unit. It has an image processing unit 23 that is an inspection control means for processing an image signal, and a display unit 24 that displays an ACF pasting result and the like.

  As shown in FIG. 4, the illumination unit 21 includes an LED 21a, a condenser lens 21b, and an LED power source 21c, and the imaging unit 22 includes a line sensor camera 22a, a lens 22b, and a polarization filter 22c. In addition, the line sensor camera 22a has a pixel resolution capable of detecting a substrate alignment mark 25 (hereinafter referred to as a substrate mark) and a shutter opening speed that does not cause image blur for the maximum transport speed during the ACF attachment state inspection. . SH denotes an imaging region for inspecting the ACF attachment state during substrate transport.

  FIG. 5 is a diagram for explaining a method capable of efficiently inspecting various ACF application states, which is one feature of the present embodiment. FIG. 5 is also a diagram showing the imaging region SH shown in FIG. 4 in more detail.

  In the ACF application state inspection of the present embodiment, an area (determination area 5) in which an ACF must exist is provided at each ACF application position, and only the pixels on the outer peripheral portion (four sides) that are the edges of the determination area. Perform processing. In FIG. 5, the top ACF 3a shows an example of acceptance, and the other ACFs 3b, 3c, and 3e show examples of failure. The determination area 5 is an inner area obtained by subtracting the pasting error from the ACF pasting position, as indicated by the position of the ACF 3a that passes.

  FIG. 6 shows the relative luminance levels Pv, 4v and 3v and the determination threshold value Sv for the substrate P, the lead 4 and the ACF 3. Usually, the ACF 3 is imaged in black (level), the lead 4 is imaged in white (level), and the substrate P is imaged in the middle ash (level). The determination threshold value Sv is set at an intermediate position between the ACF and the substrate.

  In the following description, pixels below the determination threshold are referred to as black pixels, and pixels above the determination threshold are referred to as white pixels. FIG. 7 is a diagram showing the outer periphery of the determination area with black pixels and white pixels when the lower side of the drawing is peeled off in the examples of ACF attachment examples 3a, 3b, 3c, 3e and 3a shown in FIG.

  Therefore, if the determination area 5 that is a pass condition is within the ACF 3 as in the case of the ACF 3a that is a pass example, all the luminance values of the outer peripheral portion become the brightness level 3v of the ACF 3, that is, all black pixels. ). Actually, the luminance value varies within a certain range due to various fluctuations due to various causes. The same applies to the luminance values of the substrate and leads. Further, if the ACF is displaced to the upper left side of the determination area as in ACF 3b in FIG. 5, the luminance values of the right and lower outer peripheries of the determination area 5 indicate the luminance level Pv or 4v of the substrate or the lead terminal. The pixel in the portion is a white pixel, as shown in FIG.

  That is, the luminance values on the outer peripheral part (four sides) of the determination area are sequentially compared with the determination threshold value Sv, and if the luminance values of all the outer peripheral parts are lower than the determination threshold value Sv, the ACF is normal as shown by ACF 3a in FIG. It is affixed to the position in a normal state, and is determined to be acceptable. Otherwise, it will be rejected. Actually, considering the influence of electrical noise and the minute scattered light on the surface of the ACF, when continuous NG pixels (2 pixels or more) occur, the ACF application state is rejected (ACF application failure). Judgment.

  Also, as shown in FIG. 7, the type of sticking abnormality can be determined by the pattern of white pixels and black pixels. As described above, if all the pixels are black, it is normal. When the positions are shifted in parallel as in ACF 3b in FIG. 5, the opposite side where the position is shifted is the white pixel side. Further, when only a twist occurs in the ACF as in the ACF 3c in FIG. 5, an opposite pattern is generated on the side and the opposite side as shown in FIG. 7C. If no ACF is pasted as in ACF 3e in FIG. 5, the entire pixel is a white pixel, which is shown in FIG. 7 (e). Furthermore, in the example of the ACF 3a in FIG. 5, when the lower side of the drawing is peeled off, the peeled portion becomes a white pixel, and FIG. 7 (d) is obtained.

  Actually, there is a pattern in which the patterns of ACF 3b and ACF 3c in FIG.

  In the above embodiment, the determination area is an inner area obtained by subtracting the pasting error by the ACF pasting position. FIG. 14 is a diagram showing another embodiment of the determination area, and the outer periphery of the determination area is indicated by a thick line. In FIG. 14 (a), by setting the determination area additionally in the outer area in addition to the inner area, it is possible to detect the extra length and elongation when the ACF is pasted.

  FIG. 14B shows an example in the case of applying to the inspection object when the judgment is limited. In the above embodiment, the binarization process is performed on all the pixels on the four sides of the determination area. However, when the determination is limited, it is not always necessary to process the four sides. For example, in the case of misalignment or twisting, if two orthogonal sides are processed, pixels opposite to normal pixels always appear on the two sides.

FIG. 14C shows an example in which two sides perpendicular to the side of the substrate P among the four sides that define the determination area are set as regions outside the ACF. FIG. 14D shows that one of the four sides defining the determination area is not provided with two processing sides that are perpendicular to the side of the substrate P, and one or more are provided in the inner region in the direction parallel to the side of the substrate P. This is an example in which a processing side of a book is provided. 14 (e), 14 (f), and 14 (g) are the determination areas described in the above embodiment, and the corners of the outer periphery of the determination areas shown in FIGS. 14 (a) and 14 (c), respectively. This is an example of cutting. FIG. 14 (h) shows an example in which a part of the four side processing units forming the determination area is thinned to such an extent that it does not affect the inspection.
14C to 14H, it is possible to inspect the application state of the ACF similarly to the determination area described in the above embodiment.

  FIG. 8 shows a processing flow mainly including the inspection operation of the ACF attachment state inspection described above. First, it is detected by the ACF sticking processing work device 15 shown in FIG. 3 that the ACF sticking processing work has been completed, and the substrate P is transported to the next TAB / IC mounting processing work device 16 and shown in FIG. An image of the imaging region SH is acquired (Step 1). Thereafter, the substrate alignment mark (substrate mark) 25 is detected from the captured image (Step 2). Next, correction of a determination threshold for luminance change described later, determination of the cause of the luminance change, and countermeasures are performed (Step 3). Next, correction of image expansion / contraction is performed based on the length between the substrate marks 25 at both ends based on the product parameters of the work content shown in FIG. 9 and the length between the substrate marks 25 calculated based on the captured data, and the angle of the substrate by alignment. Correction is performed (Step 4). Further, the determination area 5 is set based on the substrate parameters 25 obtained by the product type parameters and the image processing (Step 5). The binarization processing of the outer peripheral portion of the determination area is performed using the determination threshold obtained in Step 3 to obtain binarized data shown in FIG. 7 (Step 6). Based on the result of the binarization process, the ACF application state is determined as described with reference to FIG. 7 (Step 7). The determination result, the captured image data, etc. are transferred to the overall control unit 60 (Step 8).

  As described above, according to the present embodiment, the ACF application state can be efficiently inspected only by processing the pixel data of the outer peripheral portion of the side of the determination area without processing all the image data at the ACF application position. .

  Further, as described above, according to the present embodiment, not only the presence / absence of pasting but also misalignment, twisting, or peeling can be detected by the white pixel and black pixel patterns of the pixel data in the outer peripheral portion of each side. .

  Next, another feature of the present embodiment, which is a method of reliably inspecting the ACF sticking state and determining the cause of a failure even when a failure in brightness reduction such as a change in brightness, particularly illumination deterioration, occurs. To do.

  When inspecting the above-described ACF application state, there may be a case where a problem of a decrease in luminance occurs due to a change in luminance, in particular, a decrease in illuminance, an optical axis shift, a substrate tilt, and the like. FIG. 10 is a diagram showing an example when the problem occurs. The solid line indicates the level before the occurrence of the defect, and the broken line indicates the level after the occurrence of the defect. As shown in FIG. 10, the luminance level 3v of the ACF is a black level close to zero, so that there is not much change. However, the luminance level Pv of the substrate P is greatly reduced as the luminance level 25v of the substrate mark 25 is decreased. When the value decreases and approaches the determination threshold value Sv, the detection luminance signal of the substrate P also has some fluctuation, but in an extreme case, the luminance level Pv of the substrate P becomes equal to or less than the determination threshold value Sv and the ACF is not attached to the substrate In other words, it is determined that all ACFs are correctly pasted. As a result, the cause investigation for the actual failure is delayed, and there is a possibility that many defective products are produced.

  Therefore, in this embodiment, the variation of the luminance value of the substrate mark 25 shown in FIG. 5 is monitored, the determination threshold value Sv is corrected by the luminance variation value, and the ACF application state is reliably inspected by the corrected determination threshold value. In the present embodiment, the cause of the luminance decrease is determined by monitoring the time-series fluctuation of the determination threshold.

  The reason for selecting the alignment mark 25 is that a stable high luminance can be obtained because it is made of metal such as chrome. Therefore, it is sufficient if a stable high luminance can be obtained in addition to the mark 25. For example, a dedicated mark made of metal such as chrome may be provided on the substrate P, or a lead shown in FIG. 5, particularly a dummy lead on the substrate that is not used for connection by ACF may be used.

  FIG. 10 also shows an example of a determination threshold value correction method. Assume that for some reason a problem of a decrease in luminance occurs and the luminance level 25v of the mark 25 decreases from the solid line to the broken line by ΔML. The influence of the defect is larger as the object has a higher luminance level and smaller as the object has a lower luminance level. Since the luminance level Pv of the substrate P is about 1/2 of the luminance level 25v of the mark, the determination threshold value Sv is lowered by 1/2 of the luminance fluctuation value ΔML to obtain a new determination threshold value Sv. In the formula (1), t in parentheses indicates time and 0 indicates an initial value.

Sv (t) = Sv (0) −1 / 2 * ML (t)
Note that the ratio of correction of the determination threshold with respect to the change in luminance is not limited to 1/2, and other ratios may be used.

  According to the embodiment for the correction of the determination threshold value with respect to the change in the luminance value, the ACF application state can be inspected stably even when the luminance changes.

  FIG. 11 is a diagram illustrating an example of time-series variation of the determination threshold. FIG. 11A shows an example in which the brightness of the alignment mark gradually decreases over time with the passage of time. FIG. 11B shows an example in which the voltage changes suddenly step by step. FIG. 11C shows an example in which the luminance value temporarily decreases. FIG. 11D shows an example in which the luminance value temporarily increases. FIG. 11E shows an example in which the determination threshold fluctuates.

FIG. 12 summarizes possible causes and countermeasures for each time series variation example of FIG. Basically, the determination result is displayed on the display unit 24 of the ACF sticking state inspection unit 20 and a nearby worker is requested to deal with it. Further, it may be displayed on the monitor 62 for displaying the line state and the like.
The case of FIG. 11A is caused by a decrease in illuminance of the LED 21a of the illumination means shown in FIG. That fact is displayed on the display unit 24 in FIG. 3 to inform nearby workers. If the illuminance drop is small, the worker feeds back to the LED power source and adjusts the light. Dimming may be performed automatically. If the tolerance limit is approached, the worker prepares for the replacement of the LED at the next task setup change.

  FIG. 11B is considered to be a mechanical sudden cause. As a cause of this, the deviation of the optical axis of the illumination means 21 or the imaging means 22 shown in FIG. 4 and the inclination of the substrate transfer member 11A of the transfer apparatus 2 shown in FIG. Since the transfer apparatus in the present embodiment is reciprocating with the next processing work apparatus, once the substrate transfer member 11A is inclined, it continuously occurs thereafter. In this case, the worker visually inspects the candidate and prepares it so that it can be adjusted when the next work is changed.

As a cause of the temporary decrease in FIG. 11C, the flowing substrate P may be inclined and the substrate mark portion may be warped. Further, if the transfer device is not a reciprocating movement type as in the present embodiment but a loop type, a temporary change appears at a constant cycle. As a countermeasure, the number of the corresponding board is recorded, and if necessary, the board is inspected at an appropriate place.
FIG. 11D shows an example in which the luminance increases temporarily. A possible cause is the substrate warpage of the substrate mark portion. The countermeasure content is the same as in the case of FIG.
The cause of the wobbling change in FIG. 11 (e) is considered to be due to the vibration of the transfer device. Take action in consideration of the overall condition of the line of the transport device.

FIG. 13 summarizes, as a processing flow, the correction of the determination threshold for the luminance change described above, the determination of the cause of the luminance change, and the coping operation. This flow shows Step 3, which is the subroutine of FIG.
First, the luminance value of the substrate alignment mark is calculated (Step 1). Next, it is determined whether the calculated luminance value, that is, the luminance value of the mark is within an allowable range (Step 2). If it is within the allowable range, the luminance fluctuation value ΔML shown in FIG. 10 is calculated and the determination threshold value is corrected (Step 3). Next, it is determined whether the corrected determination threshold value is within the allowable range (Step 4). For example, in the present embodiment, it is determined whether the corrected determination threshold value has a certain value or more without becoming too low. If it is within the allowable range, go to Step 4 in FIG. If the determination threshold value corrected in Step 4 is outside the allowable range, the cause of the change is determined, and the result is displayed on the display unit 24 or the monitor 62 to prompt the worker to deal with it (Step 5). Finally, if the brightness value of the mark is outside the allowable range in Step 2, the brightness value abnormality is displayed on the monitor 62, and error processing is performed. As an error process, stopping the line is one candidate (Step 6). Since the line may be stopped, the determination of Step 2 may be performed by the upper overall control unit 60.

  According to the embodiment for discriminating the cause of the defect with respect to the change in the luminance value as described above, it is possible to provide a display substrate module assembly line that can detect the cause of the defect in advance, shorten the maintenance time, and have a high operating rate.

  In the above embodiment, the image of the imaging area is acquired while the substrate is being transported. However, the ACF sticking state inspection unit 20 is provided at the rear stage of the ACF sticking processing work apparatus, the board is transported and stopped, and the imaging region is picked up at once by the area camera. The present invention can be applied even if an image is taken and the ACF sticking state of the determination area is inspected to determine the cause of the defect with respect to the change in luminance value, and the same effect as in the above embodiment can be obtained.

  Further, the present invention can be applied even if the area including the ACF is imaged after the ACF is pasted in the ACF pasting processing work device, the ACF pasting state of the determination area is inspected, and the cause of the defect with respect to the luminance value change is determined, The same effect as the above embodiment can be obtained.

  Furthermore, although the case where ACF is affixed on a display board was demonstrated in the said embodiment, this invention can be applied also when affixing ACF on a PCB board | substrate, and the effect similar to the said embodiment can be acquired.

  Furthermore, in the above embodiment, the case where the ACF is attached to the display substrate has been described. However, the present invention can be applied to the case where the ACF is attached to a so-called TAB such as COF or FPC, and the same effect as the above embodiment can be obtained. be able to.

1: Display board module assembly line 2: Transfer device 2a: Linear encoder 2d: Drive unit 3 (3a-3c, 3e): ACF 3v: ACF luminance level 4 (4a-4c, 4e): Lead 4v: Lead luminance Level 5 (5a to 5c, 5e): Determination area 11: Substrate transport means 12: Substrate holding means 13L: Substrate long side processing work equipment group 13S: Substrate short side processing work equipment group 15: ACF attachment processing work Equipment 15a to d: ACF sticking processing unit 15ah to dh: ACF sticking head 16: TAB / IC mounting processing work device 20: ACF sticking state inspection unit 21: Illuminating means 22: Imaging means 22a: Line sensor camera 23: Image processing Unit 24: Display unit 25: Substrate alignment mark 30: Device control unit 60: General control unit P: Substrate (display substrate)
Pv: luminance level of the substrate (display substrate) SH: imaging region Sv: determination threshold value.

Claims (33)

In a processing work apparatus having an ACF attachment state inspection unit for inspecting an attachment state of an ACF attached to a predetermined position of a substrate,
The ACF sticking state inspection unit is set to an area where the ACF must be present in an illuminating unit that illuminates the predetermined position, an imaging unit that images the predetermined position, and an image captured by the imaging unit. The image processing means for processing a part or all of the image of the outer periphery of the determination area, and the inspection means for inspecting the attachment state of the ACF based on the result of the image processing means Work equipment.   2. The processing work apparatus according to claim 1, wherein the determination area is set on an inner side adjacent to the area.   The image processing means is means for obtaining binarized data of the image of the outer periphery, and the inspection means inspects the ACF attachment state based on continuity of one level of the binarized data. The processing work apparatus according to claim 1.   The processing work apparatus according to claim 1, wherein the determination area is a quadrangle, and the outer peripheral portion is four sides of a quadrangle.   The processing work apparatus according to claim 4, wherein two sides parallel to the side of the substrate among the four sides are set on the inner side adjacent to the region.   6. The processing work apparatus according to claim 1, wherein the inspection is performed by inspecting at least one of ACF misalignment, twisting, no sticking, and peeling.   The processing work apparatus according to claim 1, wherein the imaging is performed during transfer by a transfer unit that transfers the substrate to another subsequent process work apparatus.   8. The processing work apparatus according to claim 1, wherein the imaging unit includes a line sensor camera.   The processing apparatus according to claim 7, wherein the imaging unit performs the imaging based on transport position information of the substrate obtained from the transport unit.   The processing operation apparatus according to claim 1, wherein the imaging is performed in an ACF application processing operation apparatus that attaches the ACF.   The processing work apparatus according to claim 1, wherein the processing work apparatus is provided at a subsequent stage of an ACF sticking processing work apparatus for sticking the ACF. In the ACF attachment state inspection method for inspecting the attachment state of the ACF attached to a predetermined position of the substrate,
Illuminate and image the predetermined position, set a determination area in an area where the ACF must be present in the image data obtained by the imaging, and process at least a part of the image data of the outer periphery of the determination area And the ACF sticking state inspection method characterized by testing the sticking state of the ACF based on the processing result.   The ACF sticking state inspection method according to claim 12, wherein the determination area is set on an inner side adjacent to the region.   13. The process according to claim 12, wherein the processing binarizes the imaging data, and the inspection inspects an ACF attachment state based on continuity of one of the binarization levels. Work method.   The ACF sticking state inspection method according to claim 12, wherein the inspection is performed by inspecting at least one of ACF misalignment, twisting, no sticking, and peeling.   The ACF sticking state inspection method according to claim 12, wherein the imaging is performed while the substrate is being transported to a subsequent processing work apparatus.   The ACF sticking state inspection method according to claim 12, wherein the imaging is performed by a line sensor camera. In a processing work apparatus having an ACF attachment state inspection unit for inspecting an attachment state of an ACF attached to a predetermined position of a substrate,
The ACF sticking state inspection unit includes an illumination unit that illuminates the predetermined position, an imaging unit that images the predetermined position, a luminance level detection unit that detects a luminance level of imaging data obtained by the imaging, and the luminance level. And a discriminating means for discriminating the cause of the change in the luminance level based on the time-series change.   The processing work apparatus according to claim 18, wherein the brightness level detecting means detects the brightness level based on brightness of an alignment mark on the substrate.   19. The processing work apparatus according to claim 18, wherein the brightness level detecting means detects the brightness level based on a brightness of a lead provided on the substrate.   19. The processing work apparatus according to claim 18, wherein the brightness level detecting means detects the brightness level based on brightness of a dedicated mark for detecting brightness level provided on the substrate.   19. The processing work apparatus according to claim 18, wherein the processing work apparatus corrects a threshold value for binarizing a luminance level of the imaging data obtained by the imaging based on the luminance level.   19. The processing work apparatus according to claim 18, wherein the imaging is performed during transport by a transport unit that transports the substrate to another processing work apparatus at a subsequent stage.   The processing apparatus according to claim 18, wherein the imaging unit includes a line sensor camera.   24. The processing apparatus according to claim 23, wherein the imaging unit performs the imaging based on transport position information of the substrate obtained from the transport unit. In the ACF attachment state inspection method for inspecting the attachment state of the ACF attached to a predetermined position of the substrate,
ACF pasting characterized in that the predetermined position is illuminated, imaged, a luminance level of imaging data obtained by the imaging is detected, and a cause of the luminance level change is determined based on a time-series change of the luminance level Condition inspection method.   27. The ACF sticking state inspection method according to claim 26, wherein the brightness level is detected by brightness of an alignment mark on the substrate.   27. The ACF sticking state inspection method according to claim 26, wherein the brightness level is detected by brightness of a lead provided on the substrate.   27. The ACF sticking state inspection method according to claim 26, wherein the brightness level is detected by brightness of a dedicated mark for brightness level detection provided on the substrate.   27. The ACF sticking state inspection method according to claim 26, wherein a threshold value for binarizing the luminance level is corrected based on the time series change.   27. The ACF sticking state inspection method according to claim 26, wherein the imaging is performed while the substrate is transported to a subsequent processing work apparatus.   32. The ACF attachment state inspection method according to claim 26, wherein the imaging is performed by a line sensor camera. A processing work apparatus having an ACF sticking state inspection unit for inspecting a sticking state of the ACF attached to a predetermined position on the side of the substrate, another processing work apparatus for performing other processing work on the substrate, and the substrate as the processing work apparatus. And in the display substrate module assembly line having a transport means for sequentially transporting between the other processing work devices, and a general control unit for controlling them,
The processing work device according to any one of claims 18 to 25, wherein the overall control unit is configured to determine the processing work device and the others based on a result of a determination unit of the ACF sticking state inspection unit. A display substrate module assembly line characterized by having means for promoting maintenance (preparation, handling) of processing work devices.

Images