JP2011033951A5 - - Google Patents
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- JP2011033951A5 JP2011033951A5 JP2009181993A JP2009181993A JP2011033951A5 JP 2011033951 A5 JP2011033951 A5 JP 2011033951A5 JP 2009181993 A JP2009181993 A JP 2009181993A JP 2009181993 A JP2009181993 A JP 2009181993A JP 2011033951 A5 JP2011033951 A5 JP 2011033951A5
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即ち、第１の発明は、カルボキシル基を有しない式量７０〜１２０のエチレン性不飽和モノマー（ａ）１０〜７５重量％、エポキシ基含有エチレン性不飽和モノマー（ｃ）２０〜８０重量％を含むエチレン性不飽和モノマー（Ｍ’）をラジカル重合してなる共重合体（Ｉ’）中のエポキシ基１モルに対し、
カルボキシル基含有エチレン性不飽和モノマー（ｂ）中のカルボキシル基を０．２〜１モル反応させて水酸基含有樹脂（ＩＩ’）を生成し、
得られた水酸基含有樹脂（ＩＩ’）中の水酸基１モルに対し、多塩基酸無水物（ｄ）中の酸無水物基を０．２〜１モル反応させてなる感光性樹脂を含有する感光性組成物であって、さらに、エチレン性不飽和モノマー（Ｍ’） が、下記一般式［２］で表されるモノマーを含むことを特徴とする感光性組成物。
一般式［２］
ＣＨ 2 ＝ＣＲ 2 −ＣＯＯ−（ＣＨ 2 ＣＨ 2 Ｏ） m −Ｒ 3
（式中、Ｒ 2 は水素原子もしくはメチル基であり、Ｒ 3 は水素原子、炭素数１〜８の直鎖状もしくは分岐状のアルキル基、脂環族炭化水素基、または芳香族炭化水素基であり、ｍは１〜１０の整数である。）
That is, the first invention comprises 10 to 75% by weight of an ethylenically unsaturated monomer (a) having a formula weight of 70 to 120 having no carboxyl group, and 20 to 80% by weight of an epoxy group-containing ethylenically unsaturated monomer (c). To 1 mol of epoxy groups in the copolymer (I ′) obtained by radical polymerization of the ethylenically unsaturated monomer (M ′) containing,
Carboxyl group-containing ethylenically unsaturated monomer (b) is reacted with 0.2 to 1 mol of carboxyl group to produce hydroxyl group-containing resin (II ′),
Photosensitivity containing photosensitive resin obtained by reacting 0.2 to 1 mol of acid anhydride group in polybasic acid anhydride (d) with respect to 1 mol of hydroxyl group in the obtained hydroxyl group-containing resin (II ′). A photosensitive composition, wherein the ethylenically unsaturated monomer (M ′) further comprises a monomer represented by the following general formula [2].
General formula [2]
CH 2 = CR 2 -COO- (CH 2 CH 2 O) m -R 3
Wherein R 2 is a hydrogen atom or a methyl group, and R 3 is a hydrogen atom, a linear or branched alkyl group having 1 to 8 carbon atoms, an alicyclic hydrocarbon group, or an aromatic hydrocarbon group. And m is an integer from 1 to 10.)
三つ目の樹脂は、カルボキシル基を有しない式量７０〜１２０のエチレン性不飽和モノマー（ａ）１０〜７５重量％、エポキシ基含有エチレン性不飽和モノマー（ｃ）２０〜８０重量％を含むエチレン性不飽和モノマー（Ｍ’）をラジカル重合してなる共重合体（Ｉ’）中のエポキシ基１モルに対し、
カルボキシル基含有エチレン性不飽和モノマー（ｂ）中のカルボキシル基を０．２〜１モル反応させて水酸基含有樹脂（ＩＩ’）を生成し、
得られた水酸基含有樹脂（ＩＩ’）中の水酸基１モルに対し、多塩基酸無水物（ｄ）中の酸無水物基を０．２〜１モル反応させてなる感光性樹脂であって、さらに、エチレン性不飽和モノマー（Ｍ’） が、下記一般式［２］で表されるモノマーを含むことを特徴とする感光性樹脂である。
一般式［２］
ＣＨ 2 ＝ＣＲ 2 −ＣＯＯ−（ＣＨ 2 ＣＨ 2 Ｏ） m −Ｒ 3
（式中、Ｒ 2 は水素原子もしくはメチル基であり、Ｒ 3 は水素原子、炭素数１〜８の直鎖状もしくは分岐状のアルキル基、脂環族炭化水素基、または芳香族炭化水素基であり、ｍは１〜１０の整数である。）
The third resin contains 10 to 75 % by weight of an ethylenically unsaturated monomer (a) having a formula weight of 70 to 120 having no carboxyl group, and 20 to 80 % by weight of an epoxy group-containing ethylenically unsaturated monomer (c). With respect to 1 mol of the epoxy group in the copolymer (I ′) obtained by radical polymerization of the ethylenically unsaturated monomer (M ′),
Carboxyl group-containing ethylenically unsaturated monomer (b) is reacted with 0.2 to 1 mol of carboxyl group to produce hydroxyl group-containing resin (II ′),
A photosensitive resin obtained by reacting 0.2 to 1 mol of an acid anhydride group in the polybasic acid anhydride (d) with respect to 1 mol of a hydroxyl group in the obtained hydroxyl group-containing resin (II ′) , Furthermore, the ethylenically unsaturated monomer (M ′) is a photosensitive resin characterized by containing a monomer represented by the following general formula [2].
General formula [2]
CH 2 = CR 2 -COO- (CH 2 CH 2 O) m -R 3
Wherein R 2 is a hydrogen atom or a methyl group, and R 3 is a hydrogen atom, a linear or branched alkyl group having 1 to 8 carbon atoms, an alicyclic hydrocarbon group, or an aromatic hydrocarbon group. And m is an integer from 1 to 10.)
Claims (11)
カルボキシル基含有エチレン性不飽和モノマー（ｂ）中のカルボキシル基を０．２〜１モル反応させて水酸基含有樹脂（ＩＩ’）を生成し、
得られた水酸基含有樹脂（ＩＩ’）中の水酸基１モルに対し、多塩基酸無水物（ｄ）中の酸無水物基を０．２〜１モル反応させてなる感光性樹脂を含有する感光性組成物であって、さらに、エチレン性不飽和モノマー（Ｍ’） が、下記一般式［２］で表されるモノマーを含むことを特徴とする感光性組成物。
一般式［２］
ＣＨ2＝ＣＲ2−ＣＯＯ−（ＣＨ2ＣＨ2Ｏ）m−Ｒ3
（式中、Ｒ2は水素原子もしくはメチル基であり、Ｒ3は水素原子、炭素数１〜８の直鎖状もしくは分岐状のアルキル基、脂環族炭化水素基、または芳香族炭化水素基であり、ｍは１〜１０の整数である。） An ethylenically unsaturated monomer (M) containing 10 to 75% by weight of an ethylenically unsaturated monomer (a) having a formula weight of 70 to 120 having no carboxyl group and 20 to 80% by weight of an epoxy group-containing ethylenically unsaturated monomer (c) ') With respect to 1 mol of the epoxy group in the copolymer (I') obtained by radical polymerization,
Carboxyl group-containing ethylenically unsaturated monomer (b) is reacted with 0.2 to 1 mol of carboxyl group to produce hydroxyl group-containing resin (II ′),
Photosensitivity containing photosensitive resin obtained by reacting 0.2 to 1 mol of acid anhydride group in polybasic acid anhydride (d) with respect to 1 mol of hydroxyl group in the obtained hydroxyl group-containing resin (II ′). A photosensitive composition, wherein the ethylenically unsaturated monomer (M ′) further comprises a monomer represented by the following general formula [2].
General formula [2]
CH 2 = CR 2 -COO- (CH 2 CH 2 O) m -R 3
Wherein R 2 is a hydrogen atom or a methyl group, and R 3 is a hydrogen atom, a linear or branched alkyl group having 1 to 8 carbon atoms, an alicyclic hydrocarbon group, or an aromatic hydrocarbon group. And m is an integer from 1 to 10.)
エポキシ基含有エチレン性不飽和モノマー（ｃ）中のエポキシ基を０．２〜０．９モル反応させてなる感光性樹脂を含有する感光性組成物。 Ethylenically unsaturated monomer (M) containing 10 to 90% by weight of ethylenically unsaturated monomer (a) having a formula weight of 70 to 120 and no carboxyl group and 10 to 70% by weight of carboxyl group-containing ethylenically unsaturated monomer (b) ) With respect to 1 mol of carboxyl groups in the copolymer (I) obtained by radical polymerization,
The photosensitive composition containing the photosensitive resin formed by making 0.2-0.9 mol of epoxy groups in an epoxy-group-containing ethylenically unsaturated monomer (c) react.
エポキシ基含有エチレン性不飽和モノマー（ｃ）中のエポキシ基を０．２〜１モル反応させて水酸基含有樹脂（ＩＩ）を生成し、
得られた水酸基含有樹脂（ＩＩ）中の水酸基１モルに対し、多塩基酸無水物（ｄ）中の酸無水物基を０．２〜１モル反応させてなる感光性樹脂を含有する感光性組成物。 Ethylenically unsaturated monomer (M) containing 10 to 90% by weight of ethylenically unsaturated monomer (a) having a formula weight of 70 to 120 and no carboxyl group and 10 to 70% by weight of carboxyl group-containing ethylenically unsaturated monomer (b) ) With respect to 1 mol of carboxyl groups in the copolymer (I) obtained by radical polymerization,
The epoxy group in the epoxy group-containing ethylenically unsaturated monomer (c) is reacted in an amount of 0.2-1 mol to produce a hydroxyl group-containing resin (II),
Photosensitivity containing photosensitive resin obtained by reacting 0.2 to 1 mol of acid anhydride group in polybasic acid anhydride (d) with respect to 1 mol of hydroxyl group in the obtained hydroxyl group-containing resin (II). Composition.
一般式［１］
（式中、Ｒ１は水素原子もしくはメチル基であり、ｎは０または１の整数である。） The photosensitive composition according to any one of claims 1 to 4, wherein the epoxy group-containing ethylenically unsaturated monomer (c) is a monomer represented by the following general formula [1].
General formula [1]
(In the formula, R 1 is a hydrogen atom or a methyl group, and n is an integer of 0 or 1.)
一般式［２］
ＣＨ2＝ＣＲ2−ＣＯＯ−（ＣＨ2ＣＨ2Ｏ）m−Ｒ3
（式中、Ｒ2は水素原子もしくはメチル基であり、Ｒ3は水素原子、炭素数１〜８の直鎖状もしくは分岐状のアルキル基、脂環族炭化水素基、または芳香族炭化水素基であり、ｍは１〜１０の整数である。） The photosensitive composition in any one of Claims 2-5 in which an ethylenically unsaturated monomer (M) or an ethylenically unsaturated monomer (M ') contains the monomer represented by following General formula [2].
General formula [2]
CH 2 = CR 2 -COO- (CH 2 CH 2 O) m -R 3
Wherein R 2 is a hydrogen atom or a methyl group, and R 3 is a hydrogen atom, a linear or branched alkyl group having 1 to 8 carbon atoms, an alicyclic hydrocarbon group, or an aromatic hydrocarbon group. And m is an integer from 1 to 10.)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009181993A JP5504738B2 (en) | 2009-08-05 | 2009-08-05 | Photosensitive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009181993A JP5504738B2 (en) | 2009-08-05 | 2009-08-05 | Photosensitive composition |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013243121A Division JP5692339B2 (en) | 2013-11-25 | 2013-11-25 | Photosensitive composition |
| JP2013243120A Division JP5692338B2 (en) | 2013-11-25 | 2013-11-25 | Photosensitive composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011033951A JP2011033951A (en) | 2011-02-17 |
| JP2011033951A5 true JP2011033951A5 (en) | 2013-06-13 |
| JP5504738B2 JP5504738B2 (en) | 2014-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009181993A Active JP5504738B2 (en) | 2009-08-05 | 2009-08-05 | Photosensitive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5504738B2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5749886B2 (en) * | 2009-12-28 | 2015-07-15 | 株式会社タムラ製作所 | Curable resin composition and printed wiring board using the same |
| JP2012203361A (en) * | 2011-03-28 | 2012-10-22 | Mitsubishi Chemicals Corp | Coloring resin composition, color filter, liquid crystal display device, and organic el display device |
| JP5996851B2 (en) * | 2011-07-28 | 2016-09-21 | 株式会社タムラ製作所 | Photosensitive resin composition and use thereof |
| JP6183044B2 (en) * | 2012-10-18 | 2017-08-23 | Jsr株式会社 | Curable composition, cured film and display element |
| JP6587208B2 (en) * | 2015-07-31 | 2019-10-09 | 荒川化学工業株式会社 | UV curable ink binder resin, active energy ray curable resin composition and cured product |
| JP6905790B2 (en) * | 2016-08-29 | 2021-07-21 | 株式会社タムラ製作所 | Black photosensitive composition |
| TWI677761B (en) * | 2016-12-23 | 2019-11-21 | 奇美實業股份有限公司 | Negative photosensitive resin composition for black matrix, black matrix, color filter, and liquid crystal display device |
| WO2019163505A1 (en) * | 2018-02-21 | 2019-08-29 | 富士フイルム株式会社 | Curable composition, cured object, color filter, method for producing color filter, solid imaging element, and image display device |
| JP6617785B2 (en) * | 2018-03-22 | 2019-12-11 | 東洋インキＳｃホールディングス株式会社 | Photosensitive resin composition and coating film using the same |
| JPWO2020158741A1 (en) * | 2019-01-31 | 2021-02-18 | 住友ベークライト株式会社 | Photosensitive resin compositions, polymers, patterns, color filters, black matrices, display devices and image sensors |
| WO2023113014A1 (en) * | 2021-12-17 | 2023-06-22 | 東亞合成株式会社 | Alkali-soluble vinyl polymer, and active energy ray-curable composition containing same |
| WO2024122200A1 (en) * | 2022-12-09 | 2024-06-13 | 株式会社レゾナック | Photosensitive resin composition, cured resin film, and image display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3329877B2 (en) * | 1993-03-02 | 2002-09-30 | 互応化学工業株式会社 | Resist ink composition for manufacturing printed circuit board, resist film using the same, and printed circuit board |
| JP3363211B2 (en) * | 1993-08-06 | 2003-01-08 | 東京応化工業株式会社 | Photosensitive resin composition and method for producing the same |
| JP3681016B2 (en) * | 1996-01-11 | 2005-08-10 | 日本化薬株式会社 | Resin composition and cured product thereof |
| JP4019726B2 (en) * | 2002-02-07 | 2007-12-12 | 三菱化学株式会社 | Photosensitive composition for color filter and color filter |
| JP5154915B2 (en) * | 2007-12-26 | 2013-02-27 | 株式会社日本触媒 | Alkali-soluble resin having main chain ring structure and use thereof |
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2009
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