JP2011018847A - Power module with cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide, as a power module which cools a power semiconductor element etc., by a cooling device, a power module with a cooling device having a wiring structure that can be made compact as the module while maintaining cooling capability thereof.SOLUTION: The power module with the cooling device 11 exchanges heat between a power component 10 mounted on the cooling device 11 and a refrigerant flowing in a cooling passage 11A in the cooling device 11. The power module includes a block 11B which is provided on one surface orthogonal to a mounting surface of the cooling device 11 for the power component 10 so as to block one side face of the cooling passage 11A, and made of an insulating resin, and a resin layer which is led out of the block 11B so as to crosses in the cooling passage 11A parallel to the mounting surface for the power component 10, and made of an insulating resin. Bus bars P, N, U and W as a power supply line of the power component 10 are led out of the cooling device 11 from the block 11B through inside the resin layer.

Description

  The present invention relates to a power module with a cooling device that cools a power module on which a power component such as a power semiconductor element is mounted by a cooling device, and particularly relates to an improvement of a wiring structure that is useful for downsizing the module.

  As is well known, a vehicle such as a hybrid vehicle or an electric vehicle is provided with a plurality of power modules including a plurality of motors and inverters for supplying a driving current obtained by performing power conversion on these motors. Of these, in particular, power modules that constitute inverters are often configured to include power semiconductor elements such as IGBTs (insulated gates, bipolar transistors), and DC power is based on switching control of these power semiconductor elements. Is converted into, for example, three-phase AC power and supplied to the motor.

  On the other hand, the power semiconductor element generates heat according to the amount of current flowing therethrough, and its own temperature rises. For this reason, such a module is usually provided with a heat radiating device and a cooling device for suppressing the temperature rise of the semiconductor element so that the element temperature is maintained at the operation guaranteed temperature. In particular, in a vehicle, the power module having such a cooling device is required to be downsized for the purpose of effectively utilizing a limited space.

  Under such circumstances, various techniques for reducing the size of a power module having a cooling device have been proposed, and Patent Document 1 proposes an example of such a technique. In the power module with a cooling device described in Patent Document 1, a power semiconductor element is joined to a bus bar having an insulating film formed on the back surface, and the back surface of the bus bar is cooled by cooling water as a refrigerant. . As a result, in conjunction with cooling of the power module itself on which the power semiconductor element is mounted, the installation space for the power semiconductor element mounted on the module can be reduced.

JP 2000-315757 A

  However, in the power module of the device described in Patent Document 1, since the bus bar does not have a structure for heat dissipation, heat dissipation of the power semiconductor element performed through the bus bar is also efficient. Cannot be ignored. In addition, although the bus bar itself is cooled, the temperature of the bus bar itself increases according to the amount of current flowing therethrough, so that the cooling capacity of the power semiconductor element provided on the bus bar is also reduced. Inevitable. That is, there is room for improvement in the mounting mode itself of the power semiconductor element using the bus bar including the wiring structure.

  The present invention has been made in view of such circumstances, and its purpose is to reduce the size of the module while maintaining its cooling capability in a power module that cools power semiconductor elements and the like by a cooling device. Another object is to provide a power module with a cooling device having a wiring structure that can be achieved together.

Hereinafter, means for solving the above-described problems and the effects thereof will be described.
In order to solve the above-mentioned problem, the invention according to claim 1 is a power module with a cooling device in which heat is exchanged between a power semiconductor element mounted on the cooling device and a refrigerant flowing through a cooling passage in the cooling device. A block portion made of an insulating resin provided in such a manner that one side surface of the cooling device perpendicular to the mounting surface of the power semiconductor element is closed on the side surface of the cooling passage; An intermediate layer portion made of the same insulating resin derived from the block portion in a manner crossing in parallel with the mounting surface of the power semiconductor element, and a wiring serving as a power supply line of the power semiconductor element is the block The gist of the present invention is that it is drawn out from the part to the outside of the cooling device through the inside of the intermediate layer part.

  According to such a configuration, since the wiring passes through the inside of the cooling passage, the wiring space is reduced on the mounting surface of the power semiconductor element of the cooling device, that is, on the surface or upper part of the power module. It is also downsized. In addition, even if it is a power semiconductor element with much calorific value, since the power semiconductor element is suitably cooled by a cooling device through a heat radiating portion such as a heat radiating fin as usual, its cooling performance is maintained.

  In addition, the power semiconductor element installed in the power module requires a work space for wiring work on the upper part. However, when the wiring passes through the cooling passage, a part of the work space is wired. Occupancy is suppressed, and the wiring space secured to prevent the work space from being reduced can be saved. As a result, the work on the power semiconductor element is facilitated, and the degree of freedom is increased such that the arrangement of the power semiconductor element on the surface of the power module is not restricted by the wiring. Implementation of the attached power module is facilitated.

  Further, by cooling the wiring, a temperature rise due to heat generation generated according to the flowing current is suppressed, and a resistance value increase caused by the temperature rise is also suppressed. In other words, by suppressing the temperature rise, the wiring can increase the amount of current that can flow per unit area, and the cross-sectional area can be reduced, and the space occupied by itself can also be saved. become. For example, although the cross-sectional area of the wiring is determined based on the maximum amount of current to flow and the fusing current accompanying heat generation, the area required for the amount of fusing current that increases due to the suppression of temperature rise is reduced. This also makes it possible to reduce the size of the power module with a cooling device.

  Further, in the cooling passage, an intermediate layer portion is often formed to control the circulation of the refrigerant, and by using such an intermediate layer portion for wiring arrangement, wiring arrangement is facilitated, Space required for wiring can be further reduced.

  Furthermore, since the wiring is insulated by the intermediate layer portion having insulation properties, it becomes possible to traverse the inside of the cooling passage even when the refrigerant has conductivity such as cooling water, as a power module with a cooling device. The degree of freedom is increased.

  Further, the cooling device is often formed from a resin material, and if the intermediate layer portion is integrally formed when the cooling device is formed, the intermediate layer portion can be easily formed. As a result, wiring disposed inside the intermediate layer portion is also facilitated.

The invention according to claim 2 is characterized in that the intermediate layer portion is led out from the block portion in a mode in which the cooling passage is divided in a direction parallel to a mounting surface of the power semiconductor element.
According to this configuration, even if the cooling passage is divided by the intermediate layer portion in the direction parallel to the mounting surface, the wiring can be disposed inside the intermediate layer portion and traverse the cooling passage. Thereby, the freedom degree of arrangement | positioning of the wiring arrange | positioned inside an intermediate | middle layer part can also be raised.

  According to a third aspect of the present invention, the wiring drawn out from the block portion through the inside of the intermediate layer portion as a power supply line of the power semiconductor element is a bus bar made of a plate-like conductive metal material. Is the gist.

  Usually, the bus bar is made of a plate-like metal material to ensure a cross-sectional area through which a large current can flow, but because it is a metal plate and an insulation distance is required to ensure safety, etc. , The degree of freedom of its arrangement is not high.

  According to such a configuration, the bus bar as the wiring is wired inside the cooling device to reduce the wiring space such as the surface of the power module, thereby increasing the degree of freedom of arrangement of the power semiconductor elements and the like on the module. In addition, the risk of interference between the bus bar and the work space is reduced.

The gist of the invention described in claim 4 is that the intermediate layer portion is integrally provided with a temperature sensor.
According to such a configuration, the temperature of the cooling water can be accurately adjusted by providing the temperature sensor in the intermediate layer portion, and the temperature of each power semiconductor element and each wiring can be managed with high accuracy. It becomes like this. Thereby, the reliability as a power module comes to be improved.

  According to the fifth aspect of the present invention, a plurality of elements constituting an inverter that converts DC power into AC power as the power semiconductor element are collectively mounted on the cooling device, and the bus of the inverter and the converted phase The gist is that a current line through which a current flows is drawn out from the block part through the inside of the intermediate layer part as a power supply line of the power semiconductor element.

  According to such a configuration, the power semiconductor elements that generate a large amount of heat constituting the inverter are cooled by the cooling device in which they are collectively mounted, and each power supply line connected to the power semiconductor elements is also cooled by the cooling device. The cooling performance as an inverter is maintained by being cooled at. Thereby, as an inverter, the wiring space on a power module is reduced and size reduction is attained.

  The gist of the invention described in claim 6 is that the power semiconductor element constituting the inverter includes an insulated gate bipolar transistor and a diode connected in antiparallel to the transistor.

  Even if a power semiconductor device having an IGBT (insulated gate bipolar transistor) and a diode for protecting the IGBT is used for the inverter as in this configuration, the temperature rise is suppressed and the temperature is reduced. Is maintained at the guaranteed operating temperature.

  The invention according to claim 7 is that the cooling device is provided symmetrically with the block portion interposed therebetween, and the power semiconductor element is mounted on both of the cooling devices with the block portion interposed therebetween. The gist.

  According to this configuration, by arranging the power semiconductor elements across the block portion where the wirings are concentratedly arranged, the wiring length of the entire power module can be increased by sharing these wirings with a plurality of power semiconductor elements. It can be shortened.

The gist of the invention described in claim 8 is that the power semiconductor element is mounted on both surfaces of the cooling device across a cooling passage provided with the intermediate layer portion.
According to such a configuration, since the power semiconductor elements are arranged on both sides of the cooling device, the surface of the cooling device can be used efficiently. In addition, when inverters are provided on both sides of the cooling device, a part of the wiring arranged inside the cooling device can be shared, so that the wiring space can be further saved. It also becomes.

The perspective view which shows the perspective structure about one Embodiment which actualized the power module with a cooling device which concerns on this invention. The front view which shows the front structure of the power components (power semiconductor element) mounted in the power module of the embodiment. The perspective view which shows the wiring structure of the bus bar in the power module of the embodiment. Sectional drawing which shows the cross-sectional structure along line 4-4 of FIG. 1 about the power module of the embodiment. Sectional drawing which shows the cross-sectional structure along line 5-5 of FIG. 1 about the power module of the embodiment. The side view which shows the wiring structure of the power component (semiconductor element for electric power) and the bus-bar in the power module of the embodiment. The wiring diagram which shows the wiring aspect about the inverter for a three-phase motor drive to which the power module of the embodiment is applied. Sectional drawing which shows the cross-sectional structure about other embodiment which actualized the power module with a cooling device which concerns on this invention.

  Hereinafter, an embodiment in which a power module with a cooling device of the present invention is embodied will be described with reference to the drawings. FIG. 1 is a diagram showing a structure of a power module with a cooling device according to the present embodiment as seen from the upper right, and FIG. 2 shows a structure of a power component (power semiconductor element) used in the power module as seen from the front. FIG. In the present embodiment, the power module includes a so-called inverter that converts DC power into three-phase AC power.

  As shown in FIG. 1, the power module includes six power components 10 used for power conversion, first and second radiators 20 and 21 that radiate heat from the power components 10, and the first and second radiators 20 and 21. A cooling device 11 that cools each power component 10 through the second radiators 20 and 21 is provided.

The cooling device 11 is formed in a rectangular shape using an insulating resin or the like, and has a mounting surface for the power component 10 on its upper surface (upper surface in FIG. 1). As for the cooling device 11, the supply port 12 and the discharge port 13 are protrudingly formed in the front surface (front side surface in FIG. 1). In addition, the central protrusion 14 formed to protrude between the supply port 12 and the discharge port 13 on the mounting surface of the cooling device 11 is a back surface as an opposite side surface corresponding to the front surface from the front surface of the cooling device 11. (Rear side surface in FIG. 1). Inside the cooling device 11, a cooling passage 11A through which a refrigerant flows is formed in a semicircular shape in which the front end and the end thereof are arranged on the front side of the cooling device 11, respectively, and the supply port 12 is provided at the front end. A discharge port 13 is connected to each end. Further, the inner circumferential portion of the semicircular cooling passage 11A is formed with a block portion 11B that divides the cooling passage 11A into left and right in a manner to block one side surface of the cooling passage 11A orthogonal to the mounting surface. A part of the above-described central protrusion 14 is disposed on the upper part. In the cooling passage 11A, a resin layer 18A (see FIG. 3) that is parallel to the mounting surface and divides the cooling passage 11A vertically is provided so as to cross the cooling passage 11A in the horizontal direction from the block portion 11B. Yes. That is, the cooling device 11 uses cooling water as a refrigerant supplied from the supply port 12 to the resin layer 18A.
Thus, the cooling water is divided up and down to flow through the cooling passage 11 </ b> A, and the cooling water divided by the resin layer 18 </ b> A is collectively discharged from the discharge port 13. Thereby, the heat exchange capacity according to the temperature of the cooling water, specifically the cooling capacity is exhibited on the surface of the cooling device 11 by the circulation of the cooling passage 11A of the cooling water.

  When viewed from the front, the central protrusion 14 has a shape in which an upper portion (a tip portion of the protrusion protruding on the mounting surface of the cooling device 11) extends left and right, that is, the central protrusion 14 is directed leftward (supply). A first extending portion 15 extending in the direction in which the opening 12 is provided and a second extending portion 16 extending in the right direction (in the direction having the discharge port 13) are provided. In addition, the upper part of the second extension part 16 is lower than the upper surface of the central protrusion 14, and the step on the right side of the upper part of the central protrusion 14 is lower than the upper part in the part corresponding to the second extension part 16. A portion 17 is formed.

  On the mounting surface of the cooling device 11, the first heat radiator 20 is provided on the left side of the central protrusion 14, and the second heat radiator 21 is provided on the right side of the central protrusion 14. . Each of the first and second radiators 20 and 21 is a radiator for increasing the efficiency of heat exchange with the cooling device 11, and is made of a material having high thermal conductivity such as aluminum. . Further, the back surfaces of the first and second radiators 20 and 21 are provided with structures for increasing the heat exchange rate with the cooling water, such as the radiation fins 20F and 21F, respectively, and these radiation fins 20F and 21F. Projecting into the cooling passage 11A, the efficiency of heat exchange with the cooling water is enhanced. In the present embodiment, the third heat radiating body 22 and the fourth heat radiating body 22 are provided on the lower surface (the lower surface in FIG. 1) of the cooling device 11 corresponding to the first and second heat radiating bodies 20 and 21, respectively. The heat dissipating body 23 is provided. Similarly to the first and second radiators 20 and 21, the third and fourth radiators 22 and 23 are heat conducting materials such as aluminum in order to exchange heat efficiently with the cooling device 11. In addition to being made of a high-performance material, the back surface thereof is provided with the structure of heat radiation fins 22F and 23F protruding into the cooling passage 11A.

  Three power components 10 are respectively provided on the upper surfaces of the first and second radiators 20 and 21, and the aforementioned inverter is constituted by a total of six power components 10. In addition, in this embodiment, since all the power components 10 have the same structure, below, the structure is demonstrated in detail about the power components 10 provided in the 2nd heat sink 21, For convenience of explanation, The redundant description of the power component 10 provided in the first radiator 20 is omitted.

  As shown in FIG. 2, the power component 10 on the second heat radiator 21 includes an insulating layer 26, a conductive layer 27, a diode 28, and a transistor 29. The insulating layer 26 is a layer made of an insulating substrate or the like. The lower surface of the insulating layer 26 is bonded to the first heat radiating body 20 so that the power component 10 is placed on the second heat radiating body 21. A layer 27 is provided. The conductive layer 27 is made of a conductive material such as copper, and the lower surface of the diode 28 and the lower surface of the transistor 29 are mechanically bonded to the upper surface thereof. The diode 28 is a so-called rectifying element, and has a cathode terminal 28K on the lower surface and an anode terminal 28A on the upper surface. In the present embodiment, the transistor 29 is an IGBT capable of flowing a large amount of power, and has a collector terminal 29C on the lower surface and an emitter terminal 29E and a gate terminal 29G on the upper surface. That is, the cathode layer 28K on the lower surface of the diode 28 and the collector terminal 29C on the lower surface of the transistor 29 are also electrically connected to the conductive layer 27, and the conductive layer 27 also serves as a wiring layer to the cathode terminal 28K and the collector terminal 29C. ing. Since the transistor 29 such as an IGBT generates heat according to the amount of current flowing therethrough, particularly when a large current flows, the temperature may exceed the operation guarantee temperature due to a temperature rise based on the heat generation according to the current. For this reason, in the present embodiment, the temperature of the transistor 29 that generates heat and rises according to the flowing current is cooled by the cooling device 11 via the first and second radiators 20 and 21, and is maintained within the guaranteed operating temperature. It is like that.

  The power module is provided with a positive electrode bus bar P made of a conductive metal material as a positive electrode bus for supplying DC power to a plurality of power components 10 constituting the inverter, and a negative electrode bus bar N also made of a conductive metal material as a negative electrode bus. It has been. Moreover, the U-phase bus bar U made of a conductive metal material that outputs the power (phase current) of each phase (U-phase, V-phase, W-phase) of the three-phase AC power from the plurality of power components 10 constituting the inverter. V-phase bus bar V and W-phase bus bar W are provided. Accordingly, the positive electrode bus bar P and the negative electrode bus bar N, and the U-phase bus bar U, the V-phase bus bar V, and the W-phase bus bar W are power supply lines of the power component 10, respectively.

  Next, each bus bar provided in the power module will be described with reference to FIGS. 3 is a diagram showing a perspective structure of each bus bar arranged in the power module, FIG. 4 is a diagram showing a cross-sectional structure taken along line 4-4 of FIG. 1, and FIG. It is a figure which shows the cross-sectional structure along line 5-5.

  As shown in FIG. 3, the positive electrode bus bar P is arranged from the left side surface 11 </ b> L of the cooling device 11 to the left side portion of the central protrusion 14 through the inside of the cooling device 11. More specifically, as shown in FIGS. 3 and 4, the positive bus bar P has an external terminal P <b> 1 protruding from the left side surface 11 </ b> L of the cooling device 11, and an internal wiring P <b> 2 following the external terminal P <b> 1 is a cooling passage of the cooling device 11. The resin layer 18 </ b> A formed in a part of 11 </ b> A is extended to the left part of the block part 11 </ b> B (position corresponding to the left part of the central protrusion 14). The positive electrode bus bar P is connected to the internal wiring P2 and has a connecting portion P3 provided along the length direction of the central projecting portion 14 on the left portion of the central projecting portion 14. There are three connection terminals Pu, Pv, and Pw that are connected to the portion P3 and at least a part of which is exposed below the first extension portion 15 on the left side of the central protrusion 14. Thus, the positive electrode bus bar P is disposed in the cooling passage 11A of the cooling device 11, so that the surface area of the power module and the upper space of the power module required for the wiring of the positive electrode bus bar P are reduced. . Further, the positive electrode bus bar P is covered with the resin layer 18A in the cooling passage 11A, so that the insulation between the positive electrode bus bar P and the cooling water is ensured.

  Furthermore, the positive electrode bus bar P is cooled by the cooling device 11 by being arranged in the cooling device 11, particularly in the cooling passage 11 </ b> A and in the vicinity thereof. Generally, the cross-sectional area of the wiring is determined based on the maximum current amount and the fusing current accompanying heat generation, and the cross-sectional area of the positive electrode bus bar P having the height a1 and the width b1 is also the maximum current amount. An area determined based on the fusing current accompanying heat generation is secured. By the way, in this embodiment, since the positive electrode bus-bar P is cooled by the cooling device 11 and the temperature rise is suppressed, the electric current amount as a fusing current becomes large. As a result, the cross-sectional area of the positive bus bar P can be made relatively small as compared with the case where it is not cooled, and the power module required (occupied) along with the wiring of the positive bus bar P Space can be saved.

  In the present embodiment, a temperature sensor 19 is provided on the resin layer 18A. The temperature sensor 19 is integrally formed at the time of molding the resin layer 18A, and measures the temperature of the positive electrode bus bar P disposed on the resin layer 18A together with the water temperature of the channel. Thereby, the cooling capacity of the cooling device 11 can be adjusted according to the temperature rise of the positive electrode bus bar P.

Further, as shown in FIG. 3, the negative electrode bus bar N is arranged from the right side surface 11 </ b> R of the cooling device 11 to the right side portion of the central protrusion 14 through the inside of the cooling device 11. Specifically, as shown in FIGS. 3 and 4, the negative electrode bus bar N causes the external terminal N1 to protrude from the right side surface 11R of the cooling device 11, and the internal wiring N2 following the external terminal N1 is a cooling passage of the cooling device 11. The resin layer 18 </ b> A formed in a part of 11 </ b> A is extended to the right part of the block part 11 </ b> B (position corresponding to the right part of the central protrusion 14). The negative electrode bus bar N is connected to the internal wiring N2, and has a connecting portion N3 provided along the length direction of the central projecting portion 14 on the right portion of the central projecting portion 14, and the same connection. There are three connection terminals Nu, Nv, and Nw that are connected to the portion N3 and at least partially exposed at a position higher than the stepped portion 17 on the upper right side of the central protrusion 14. Thus, the negative electrode bus bar N is arranged in the cooling passage 11A of the cooling device 11, so that the surface area of the power module and the upper space of the power module required for the wiring of the negative electrode bus bar N are reduced. . Further, the negative electrode bus bar N is covered with the resin layer 18A in the cooling passage 11A, so that the insulation between the negative electrode bus bar N and the cooling water is ensured.

  Furthermore, the negative electrode bus bar N is cooled by the cooling device 11 by being disposed inside the cooling device 11, particularly in the cooling passage 11 </ b> A and in the vicinity thereof. At this time, the cross-sectional area of the negative electrode bus bar N having the height a2 and the width b2 is also secured based on the maximum current amount and the fusing current accompanying heat generation. By the way, in this embodiment, since the negative electrode bus bar N is cooled like the positive electrode bus bar P, the amount of current as a fusing current is increased, so that the cross-sectional area is relative to that when it is not cooled. Can be made smaller. As a result, the space of the power module required (occupied) along with the wiring of the negative electrode bus bar N can be reduced.

  Further, as shown in FIG. 3, the U-phase bus bar U, the V-phase bus bar V, and the W-phase bus bar W are arranged from the right side surface 11 </ b> R of the cooling device 11 to the right side of the central protrusion 14 through the inside of the cooling device 11. Yes. In this embodiment, the V-phase bus bar V and the W-phase bus bar W have the same structure, and the U-phase bus bar U and the W-phase bus bar W have mirror images having the same structure. Hereinafter, the structure of the W-phase bus bar W will be described in detail, and for the convenience of description, the overlapping description of the U-phase bus bar U and the V-phase bus bar V will be omitted. In FIG. 3, the portion concealed by the other members for the W-phase bus bar W is indicated by a broken line. However, for convenience of explanation, the concealed portions of the U-phase bus bar U and the V-phase bus bar V are not shown. ing.

  More specifically, as shown in FIGS. 3 and 5, the W-phase bus bar W projects the external terminal W1 on the right side surface 11R of the cooling device 11, and the internal wiring W2 following the external terminal W1 is connected to the cooling device 11. The resin layer 18A formed in a part of the cooling passage 11A is passed through to the right part of the block portion 11B. The W-phase bus bar W exposes at least a part of the connection terminal Wd following the internal wiring W2 to the second extending portion 16 (stepped portion 17) and the stepped portion 17 in the length direction of the central protruding portion 14. The connecting portion W3 extends from the extended end of the connection terminal Wd to the upper left side of the central projection 14 (upper portion of the first extension portion 15) across the upper portion of the central projection 14. It is erected. Further, in the W-phase bus bar W, a connection terminal Wu provided subsequent to the connecting portion W3 is arranged on the upper left surface of the central protrusion 14. With such a structure, an external terminal as a part of the W-phase bus bar W is provided. W1, the connection terminal Wd, and the connection terminal Wu are electrically connected to each other.

  By arranging the W-phase bus bar W in the cooling passage 11A of the cooling device 11 in this way, the surface area of the power module and the upper space of the power module required for wiring of the W-phase bus bar W are reduced. become. Further, the W-phase bus bar W is covered with the resin layer 18A in the cooling passage 11A, so that the insulation between the W-phase bus bar W and the cooling water is ensured.

Further, the W-phase bus bar W is cooled by the cooling device 11 by being disposed in the cooling device 11, particularly in the cooling passage 11 </ b> A and in the vicinity thereof. At this time, the cross-sectional area of the W-phase bus bar W having the height a3 and the width b3 is also secured based on the maximum current amount and the fusing current accompanying heat generation. By the way, in this embodiment, since the W-phase bus bar W is cooled like the previous bus bars P and N, the amount of current as a fusing current is increased, so that the cross-sectional area is reduced when it is not cooled. In comparison, it can be made relatively small. Thereby, the space of the power module required (occupied) along with the wiring of the W-phase bus bar W can be saved. Note that the cross-sectional area of the connecting portion W3 of the W-phase bus bar W having the height a4 and the width b4 also secures an area determined based on at least the maximum current amount and the fusing current accompanying heat generation. At this time, a current smaller than that flowing through the internal wiring W2 flows through the connecting portion W3. Therefore, when the cross-sectional area is configured to be approximately equal to the previous cross-sectional area (a3 × b3), the amount of heat generated is small.

  Similarly to the W-phase bus bar W, the U-phase bus bar U is formed by internal wiring in which the external terminal U1 protruding from the right side surface of the cooling device 11 and the connection terminal Ud of the stepped portion 17 pass through the resin layer 18A and the block portion 11B. Electrically connected. In addition, the connection terminal Ud and the connection terminal Uu disposed on the upper left side of the central protrusion 14 are electrically connected by a connecting portion U3 installed on the upper portion of the central protrusion 14.

  Similarly to the W-phase bus bar W, the V-phase bus bar V also has an internal wiring V2 through which the external terminal V1 protruding from the right side surface of the cooling device 11 and the connection terminal Vd of the stepped portion 17 pass through the resin layer 18A and the block portion 11B. Are electrically connected. In addition, the connection terminal Vd and the connection terminal Vu disposed on the upper left surface of the central protrusion 14 are electrically connected by a connecting portion V <b> 3 installed on the upper portion of the central protrusion 14.

  Thus, by arranging the U-phase bus bar U and the V-phase bus bar V in the cooling passage 11A of the cooling device 11, the surface area of the power module and the upper space of the power module required for their wiring are reduced. Become so. In addition, the U-phase bus bar U and the V-phase bus bar V are covered with the resin layer 18A in the cooling passage 11A, thereby ensuring insulation between the U-phase bus bar U and the V-phase bus bar V. In the present embodiment, the U-phase bus bar U and the V-phase bus bar V are cooled in the same manner as the W-phase bus bar W, so that the amount of current as a fusing current increases. As compared with the case where it is not performed, it becomes possible to make it relatively small. As a result, the space of the power module required (occupied) along with the wiring of the U-phase bus bar U and the V-phase bus bar V can also be reduced.

  From the configuration as described above, in the present embodiment, the three power components 10 provided in the first radiator 20 constitute an upper arm connected to the positive bus bar P, and 3 provided in the second radiator 21. One power component 10 constitutes a lower arm connected to the negative electrode bus bar N. In addition, a pair of power components 10 arranged so as to sandwich the central protrusion 14 (block portion 11B) each outputs a three-phase AC phase (U phase, V phase, W phase), U phase arm, V phase An arm and a W-phase arm are configured.

  Next, the wiring structure between the power component of the power module and each bus bar will be described with reference to FIG. FIG. 6 is a diagram schematically showing a wiring structure including electrical connection between each bus bar P, N, U and power component 10 for the U-phase arm. Since the wiring structure including the electrical connection of the V-phase arm and the W-phase arm is the same as the wiring structure of the U-phase arm, for convenience of explanation, the explanation of the V-phase arm and the W-phase arm is as follows. Omitted. Moreover, in FIG. 6, illustration of the radiation fins 20F to 23F is omitted for convenience of explanation.

First, the wiring structure of the upper arm in the U-phase arm will be described.
As shown in FIG. 6, the connection terminal Pu of the positive bus bar P and the conductive layer 27 of the power component 10 are electrically connected (wired) by the connection line J <b> 1, whereby the cathode terminal 28 </ b> K of the diode 28 and the transistor 29 are connected. DC power is supplied to the collector terminal 29C via the positive bus bar P. The anode terminal 28A of the diode 28 and the emitter terminal 29E of the transistor 29 are electrically connected (wired) to the connection terminal Uu of the U-phase bus bar U via the connection line J2. Further, the gate terminal 29 of the transistor 29
G is electrically connected (wired) to a signal line GUu that transmits a drive signal for driving the transistor 29 output from the control board 30 via a connection line J3. Thereby, the transistor 29 is driven based on the drive signal input to the gate terminal 29G of the transistor 29, and a current flows from the collector terminal 29C to the emitter terminal 29E, whereby a current flows from the positive bus bar P to the U-phase bus bar U. Begins to flow.

Next, the wiring structure of the lower arm in the U-phase arm will be described.
As also shown in FIG. 6, the connection terminal Ud of the U-phase bus bar U and the conductive layer 27 of the power component 10 are electrically connected (wired) by the connection line J5, whereby the cathode terminal 28K of the diode 28 is connected to the cathode terminal 28K. DC power is supplied to the collector terminal 29C of the transistor 29 via the U-phase bus bar U. The anode terminal 28A of the diode 28 and the emitter terminal 29E of the transistor 29 are electrically connected (wired) to the connection terminal Nu of the negative bus bar N via the connection line J6. Further, the gate terminal 29G of the transistor 29 is electrically connected (wired) to the signal line GUd that transmits the drive signal output from the control substrate 30 and that drives the transistor 29 via the connection line J7. As a result, the transistor 29 is driven based on the drive signal input to the gate terminal 29G of the transistor 29, and a current flows from the collector terminal 29C to the emitter terminal 29E, whereby a current flows from the U-phase bus bar U to the negative bus bar N. Begins to flow.

  In the present embodiment, since the control board 30 is disposed so as to cover the mounting surface of the cooling device 11, the heat dissipation efficiency of the mounting surface is not so high, and the temperature of the upper space on the mounting surface is increased. There is also a fear. However, since each bus bar is cooled as well as the power component 10, compared to the case where the entire bus bar is arranged on the mounting surface of the cooling device 11, the temperature rise in the upper space is also suppressed, The reliability of the power module can be improved.

  Next, a motor drive system using a power module will be described with reference to FIG. FIG. 7 is a circuit diagram of a motor drive system configured using an inverter of a power module.

  As shown in FIG. 7, the DC power source E that supplies DC power has a positive electrode bus bar P connected to the positive electrode and a negative electrode bus bar N connected to the negative electrode. Between the positive electrode bus bar P and the negative electrode bus bar N, three series circuits (each phase arm) configured by serial connection of two power components 10 are arranged in parallel, and in each series circuit (each phase arm), A connection point between the two power components 10 is connected to each phase (U phase, V phase, W phase) of the motor M. Thus, when the upper arm transistor 29 connected to the positive bus bar P is driven and a current flows therethrough, a phase current is supplied to each phase of the motor, and the lower arm transistor 29 connected to the negative bus bar N When it is driven and a current flows therethrough, a phase current is returned from each phase of the motor. With such a configuration, a predetermined drive signal is input to each gate terminal so as to drive each transistor 29 at a predetermined timing, so that the power module operates as an inverter that converts DC power into three-phase AC power. The motor M is rotationally driven by the same three-phase AC power (three-phase current) output therefrom.

As described above, according to the power module with a cooling device of the present embodiment, the effects listed below can be obtained.
(1) Each bus bar P, N, U, V, W is made to pass through the interior of the cooling passage 11A. As a result, the wiring space is reduced on the mounting surface of the power component 10 of the cooling device 11, that is, on the surface or upper portion of the power module, and the power module is also downsized. Even if the power component 10 (transistor 29) has a large calorific value, the power component 10 is suitably cooled by the cooling device 11 through the heat radiating portions such as the heat radiating fins 20F and 21F as usual. Maintained.

  (2) The power component 10 installed in the power module requires a work space for connection work or the like above it. However, by passing each bus bar P, N, U, V, W through the cooling passage 11A, it is ensured to prevent a part of the work space from being occupied by wiring and to prevent a decrease in the work space. The wiring space to be saved was saved. As a result, work on the power component 10 is facilitated, and the degree of freedom is increased such that the arrangement of the power component 10 on the surface of the power module is not restricted by the wiring. Implementation of the module is facilitated.

  (3) By cooling each bus bar P, N, U, V, and W, a temperature rise caused by heat generation according to the flowing current is suppressed, and an increase in resistance value caused by the temperature rise is suppressed. . That is, by suppressing the temperature rise, each bus bar P, N, U, V, and W has an increased amount of current that can flow per unit area, and the cross-sectional area can be reduced. Space saving is also achieved. For example, although the cross-sectional area of the wiring is determined based on the maximum amount of current to flow and the fusing current accompanying heat generation, the area required for the amount of fusing current that increases due to the suppression of temperature rise is reduced. This also makes it possible to reduce the size of the power module with a cooling device.

  (4) A resin layer 18A is formed in the cooling passage 11A to control the flow of the cooling water. By using such a resin layer 18A for wiring arrangement, each bus bar P, N, U, V , W can be easily arranged, and the space required for each bus bar P, N, U, V, W can be further reduced.

  (5) Each bus bar P, N, U, V, W is insulated by a resin layer 18A having an insulating property. Thereby, even when the refrigerant has conductivity such as cooling water, the cooling passage 11A can be traversed, and the degree of freedom as a power module with a cooling device is increased.

  (6) The cooling device 11 is formed of a resin material, and the resin layer 18 </ b> A is integrally formed when the cooling device 11 is formed. As a result, the resin layer 18A can be easily formed, and the arrangement of the bus bars P, N, U, V, and W inside the resin layer 18A is also facilitated.

  (7) Usually, the bus bar is made of a plate-like metal material to ensure a cross-sectional area through which a large current can flow. However, the bus bar is a metal plate and requires an insulating distance for ensuring safety. Therefore, the degree of freedom of arrangement is not high.

  However, in this embodiment, the bus bars P, N, U, V, and W are wired inside the cooling device 11 to reduce the wiring space on the power module surface and the like, thereby reducing the degree of freedom in arranging the power components 10 on the module. Is increased.

  (8) Since the temperature sensor 19 is provided on the resin layer 18A, the temperature of the cooling water can be adjusted with high accuracy, and the temperature of each power component and each bus bar P, N, U, V, W is highly accurate. It becomes possible to manage with. Thereby, the reliability as a power module comes to be improved.

(9) The power components 10 having a large amount of heat generation constituting the inverter are cooled on the mounting surface of the cooling device 11 on which they are collectively mounted, and each bus bar P as each power supply line connected to the power components 10 N, U, V, and W are also cooled by the cooling device 11 so that the cooling performance as an inverter is maintained. Thereby, as an inverter, the wiring space on a power module is reduced and size reduction is attained.

  (10) Even when the power component 10 having the transistor 29 such as an IGBT (insulated gate bipolar transistor) and the diode 28 for protecting the transistor 29 is used for the inverter, the temperature rise is suppressed, The temperature is maintained at the guaranteed operating temperature.

  (11) The power components 10 are arranged across the block portions 11B where the bus bars P, N, U, V, and W are arranged in a concentrated manner so that the plurality of power components 10 share the bus bars. As a result, the wiring length of the power module as a whole can be shortened.

In addition, the said embodiment can also be implemented in the following aspects, for example.
In the above embodiment, the case where the power component 10 is disposed only on the first and second radiators 20 and 21 is illustrated. However, the present invention is not limited to this, and power components may be arranged on the third and fourth radiators 22 and 23. By doing in this way, both sides of a cooling device can be used efficiently for cooling of power components etc.

  In the above embodiment, the case where the inverter is configured only in the first and second radiators 20 and 21 is illustrated. However, the present invention is not limited to this, and the third and fourth radiators 22 and 23 may also be configured with inverters. That is, as shown in FIG. 8, the upper central protrusion 14 </ b> A is provided on the mounting surface of the cooling device 11 corresponding to the block portion 11 </ b> B, and the lower central protrusion 14 </ b> B is provided on the lower surface of the cooling device 11. Then, similarly to the above embodiment, the upper central protrusion 14A is provided with the connecting portions P3 and N3, and the connection terminals Pu and Nu connected to the connecting portions P3 and N3 are provided corresponding to the respective phase arms. A U-phase bus bar UA that connects the upper arm and the lower arm is provided. The lower central projection 14B is provided with connecting portions P4 and N4 connected to the internal wirings P2 and N2, and connection terminals Pu and Nu connected to the connecting portions P4 and N4 correspond to the respective phase arms. And a U-phase bus bar UB that connects the upper arm and the lower arm. In this way, the power component 10 arranged on the first and second radiators 20 and 21 constitutes an inverter, and the inverter is constituted by the power component 10 arranged on the third and fourth radiators 22 and 23. Come to compose. Thereby, two inverters are installed in one power module, and the installation space of the inverter can be saved, and each of the inverters arranged on the surface of the power module by the wiring in the cooling device 11 of the bus bar. The area occupied by the bus bar is reduced. Furthermore, as compared with the case where each bus bar must be provided separately on the upper and lower surfaces of the power module, at least the internal wirings P2 and N2 can be shared, and the area required for these wirings is greatly reduced. As a result, the area occupied by the bus bar on the surface of the cooling device 11 is reduced.

  -In above-mentioned embodiment, the case where the power components 10 were arrange | positioned on the right and left of the center protrusion 14 was illustrated. However, the present invention is not limited to this, and the power component may be disposed only on the left side or the right side of the central protrusion 14. Thereby, the freedom degree of arrangement | positioning of a power component is raised.

  In the above embodiment, the case where the transistor is an IGBT has been illustrated, but the present invention is not limited to this, and the transistor may be another type of power transistor such as a power FET. In addition, a semiconductor element such as a diode or a transistor, a component that generates heat when energized, such as a capacitor, a resistor, or a coil may be provided. According to this, the degree of freedom of configuration of the power parts can be increased.

In the above-described embodiment, the case where an inverter is configured in the power module is illustrated. However, the present invention is not limited to this, and the power module may be configured with an electronic circuit that handles a large current and generates heat. Thereby, the freedom degree of the use of a power module is raised.

  In the above embodiment, the case where the temperature sensor 19 is provided in the resin layer 18A has been illustrated, but the present invention is not limited thereto, and the temperature sensor may not be provided in the resin layer. Thereby, the implementation can be facilitated as a power module with a cooling device.

  In the above embodiment, the case where the temperature sensor 19 capable of measuring the temperature of the positive electrode bus bar P together with the water channel temperature is illustrated, but the present invention is not limited thereto, and the temperature sensor may be provided in each bus bar. As a result, it becomes possible to adjust the water temperature of the water channel with higher accuracy with respect to the temperature rise of the bus bar, and the reliability of the power module with a cooling device can be improved.

  In the above-described embodiment, the case where the wiring is a bus bar has been illustrated. However, the present invention is not limited to this, and the wiring is a single core wire having a circular cross section or a multi-core number (stranded wire) as long as necessary power can flow. It may be. Thereby, the freedom degree of wiring of a power module is also raised.

  In the above embodiment, the case where one resin layer 18A is provided in the cooling passage 11A is illustrated. However, the present invention is not limited to this, and a plurality of intermediate layers may be provided in the cooling passage in such a manner that the cooling passage is divided in a direction parallel to the mounting surface. In this case, each bus bar corresponding to one of the plurality of intermediate layers may be provided so that each bus bar passes through the corresponding intermediate layer and crosses the cooling passage. Thereby, the freedom degree of a structure of the cooling passage of a cooling device is raised, and the freedom degree of adjustment of the cooling capability of such a power module and the freedom degree of implementation are raised.

  In the above embodiment, the resin layer 18A is illustrated as being integrally formed with the cooling device 11. However, the present invention is not limited to this, and the resin layer may be separately formed and incorporated in the cooling device. Thereby, the freedom degree of the structure of a cooling device is raised and the implementation possibility is also raised in connection with it.

In the above-described embodiment, the case where the bus bar is insulated by the resin layer 18A is illustrated, but the present invention is not limited thereto, and the wiring such as the bus bar may have an insulating coating.
In the above embodiment, the case where the third and fourth radiators 22 and 23 are provided on the lower surface of the cooling device 11 is illustrated. However, the present invention is not limited to this, and if a radiator is not required on the lower surface of the cooling device, the radiator may not be provided on the lower surface, or only one of the radiators may be provided. Thereby, the freedom degree of a structure of the cooling device of a power module is raised. The possibility of adopting such a wiring structure is also increased.

  In the above embodiment, the case where the first and second radiators 20 and 21 are provided on the mounting surface of the cooling device 11 is illustrated. However, the present invention is not limited to this, and if the heating element provided in the cooling device can be cooled without passing through the radiator, the radiator may not be provided on the mounting surface. Further, only one of the radiators may be provided. Thereby, the installation mode of the heating element to the power module and the degree of freedom of the configuration of the cooling device are increased, and the possibility of adopting such a wiring structure is also increased.

  -In above-mentioned embodiment, it illustrated about the case where the block part 11B is an inner peripheral part of 11 A of cooling passages. However, the present invention is not limited to this, and the block portion may include a central protrusion located at the upper portion thereof, together with the inner peripheral portion of the cooling passage 11A. According to this, the freedom degree of a structure of a power module is raised irrespective of the aspect of a block part.

  DESCRIPTION OF SYMBOLS 10 ... Power components as a power semiconductor element, 11 ... Cooling device, 11A ... Cooling passage, 11B ... Block part, 11L ... Left side, 11R ... Right side, 12 ... Supply port, 13 ... Discharge port, 14 ... Center protrusion 14A: upper central protrusion, 14B: lower central protrusion, 15: first extending part, 16: second extending part, 17: stepped part, 18A: resin layer as an intermediate layer part, 19 ... Temperature sensor, 20 ... first radiator, 21 ... second radiator, 22 ... third radiator, 23 ... fourth radiator, 20F to 23F ... radiation fin, 26 ... insulating layer, 27 ... conductive 28, diode, 28A, anode terminal, 28K, cathode terminal, 29, transistor, 29C, collector terminal, 29E, emitter terminal, 29G, gate terminal, 30 ... control board, E, DC power supply, M, motor, N ... Negative electrode bus bar, P ... Positive electrode S bar, U, UA, UB ... U phase bus bar, V ... V phase bus bar, W ... W phase bus bar, J1-J3, J5-J7 ... connection line, N1, P1, U1, V1, W1 ... external terminal, N2, P2, V2, W2... Internal wiring, N3, N4, P3, P4, U3, V3, W3... Connection terminal, GUd, GUu... Signal line.

Claims (8)

A power module with a cooling device in which heat is exchanged between a power semiconductor element mounted on the cooling device and a refrigerant flowing through a cooling passage in the cooling device,
A block portion made of an insulating resin provided in a mode of covering one side surface of the cooling passage on one surface orthogonal to a mounting surface of the power semiconductor device of the cooling device, and the power semiconductor device inside the cooling passage An intermediate layer portion made of the same insulating resin derived from the block portion in a manner transverse to the mounting surface of
A power module with a cooling device, wherein a wiring serving as a power supply line of the power semiconductor element is drawn from the block portion to the outside of the cooling device through the inside of the intermediate layer portion. The power module with a cooling device according to claim 1, wherein the intermediate layer portion is led out from the block portion in a mode in which the cooling passage is divided in a direction parallel to a mounting surface of the power semiconductor element. The cooling device according to claim 1 or 2, wherein the wiring drawn out from the block portion through the inside of the intermediate layer portion as a power supply line of the power semiconductor element is a bus bar made of a plate-like conductive metal material. With power module. The power module with a cooling device according to any one of claims 1 to 3, wherein a temperature sensor is integrally provided in the intermediate layer portion. A plurality of elements constituting an inverter that converts direct-current power to alternating-current power as the power semiconductor element are collectively mounted on the cooling device, and a bus line of the inverter and a current line through which the converted phase current flows are for the power The power module with a cooling device according to any one of claims 1 to 4, wherein the power module is drawn from the block portion through the inside of the intermediate layer portion as a power supply line of a semiconductor element. The power module with a cooling device according to claim 5, wherein the power semiconductor element constituting the inverter includes an insulated gate bipolar transistor and a diode connected in antiparallel to the transistor. The cooling device is provided symmetrically with the block portion interposed therebetween, and the power semiconductor element is mounted on both of the cooling devices with the block portion interposed therebetween. The power module with a cooling device as described. The power module with a cooling device according to any one of claims 1 to 7, wherein the power semiconductor element is mounted on both surfaces of the cooling device with a cooling passage provided with the intermediate layer portion interposed therebetween.

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