JP2011005668A - Support material removing device - Google Patents
Support material removing device Download PDFInfo
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- JP2011005668A JP2011005668A JP2009148972A JP2009148972A JP2011005668A JP 2011005668 A JP2011005668 A JP 2011005668A JP 2009148972 A JP2009148972 A JP 2009148972A JP 2009148972 A JP2009148972 A JP 2009148972A JP 2011005668 A JP2011005668 A JP 2011005668A
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- support material
- ultrasonic
- work
- printer
- material removing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/35—Cleaning
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
Abstract
Description
本発明は、3Dプリンタで造形された造形物からサポート材を除去する装置に関する。 The present invention relates to an apparatus for removing a support material from a modeled object modeled by a 3D printer.
3Dプリンタ(特開2008−302701)で造形された造形物からサポート材を除去する方式にはウォータージェット方式が用いられている。 A water jet method is used as a method of removing a support material from a modeled object modeled by a 3D printer (Japanese Patent Laid-Open No. 2008-302701).
しかし、このウォータージェット方式の場合、大量に水を消費するばかりでなく、手作業のため作業に時間がかかり、コストが嵩むと共に作業には経験が必要であった。 However, this water jet method not only consumes a large amount of water, but also requires time for manual work, which increases costs and requires experience.
本発明は斯る点に鑑みて提供されるものであって、その目的は、ウォータージェット方式を止めることにより水資源の保護を図り、併せて経験を要せずして能率的にサポート材の除去を行うことができる装置を提供することである。 The present invention is provided in view of such points, and its purpose is to protect water resources by stopping the water jet method, and to efficiently support the support material without requiring experience. It is to provide an apparatus that can perform the removal.
上記目的を達成するため、請求項1に記載の発明は、3Dプリンタで造形された造形物を超音波処理槽内に浸漬し、造形物に付着しているサポート材を超音波を用いて除去するように構成したことを特徴とするものである。
In order to achieve the above-mentioned object, the invention according to
また、請求項2に記載の発明は、請求項1に記載のサポート材除去装置において、前記超音波振動子を組み込んで成るサポート材処理槽と、前記超音波振動子を駆動する超音波発振器と、から成ることを特徴とするものである。 According to a second aspect of the present invention, there is provided the support material removing apparatus according to the first aspect, wherein a support material processing tank in which the ultrasonic vibrator is incorporated, an ultrasonic oscillator that drives the ultrasonic vibrator, It is characterized by comprising.
また、請求項3に記載の発明は、請求項2に記載のサポート材除去装置において、前記処理槽内に撹拌手段を取り付けて成ることを特徴とするものである。
The invention described in
この発明によると、造形物からのサポート材の分離を促進させて除去効率を高めることができる。 According to the present invention, it is possible to promote the separation of the support material from the modeled object and increase the removal efficiency.
また、請求項4に記載の発明は、請求項2に記載のサポート材除去装置において、処理槽内に温調手段を取り付けて成ることを特徴とするものである。 According to a fourth aspect of the present invention, there is provided the support material removing apparatus according to the second aspect, wherein a temperature adjusting means is attached in the treatment tank.
この発明によると、造形物からのサポート材を効率的に除去することができる。 According to this invention, the support material from a molded article can be efficiently removed.
本発明によると、超音波を利用して3Dプリンタで造形された造形物からサポート材を除去するため、大量の水を消費しないことにより水資源の保護を図り、然も超音波処理槽内に造形物を浸漬しておくだけのため作業に手間がかからず、コストの削減が可能であると共に作業に経験を必要としない。 According to the present invention, since the support material is removed from the modeled object formed by the 3D printer using ultrasonic waves, water resources are protected by not consuming a large amount of water. Since the molded object is simply immersed, the work is not time-consuming, the cost can be reduced and the work does not require experience.
図1において、1は超音波処理槽であって、この中には3Dプリンタにより造形された造形物2が浸漬されており、この造形物2に付着したサポート材は、内底部に組み付けた超音波振動子3により発生した超音波の作用で除去される。
In FIG. 1,
4は処理槽1内に組み付けられた撹拌翼であって、処理槽1内の液(アルカリ水溶液又は水)1aを撹拌することによりサポート材の除去効率を高める(請求項3)。
Reference numeral 4 denotes a stirring blade assembled in the
5は超音波発振器であって、前記超音波振動子3は、この発振器5により駆動される。
An
6は超音波処理槽1内への液1aの供給ライン、7は排出ライン、8は処理槽1内の液1aを自動温調するための温調手段である(請求項4)。なお、この超音波で除去がしにくい小孔や溝等にサポート材が付着している場合には、処理槽1内から造形物2を取り出した上で吸引ノズルを用いて除去する。
6 is a supply line for the
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009148972A JP2011005668A (en) | 2009-06-23 | 2009-06-23 | Support material removing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009148972A JP2011005668A (en) | 2009-06-23 | 2009-06-23 | Support material removing device |
Publications (1)
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JP2011005668A true JP2011005668A (en) | 2011-01-13 |
Family
ID=43562915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009148972A Pending JP2011005668A (en) | 2009-06-23 | 2009-06-23 | Support material removing device |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108454112A (en) * | 2018-06-15 | 2018-08-28 | 北京大学 | A method of removing 3D printing water-soluble support materials |
JP2019001069A (en) * | 2017-06-15 | 2019-01-10 | 株式会社ミマキエンジニアリング | Molding device and molding method |
KR20190015266A (en) * | 2016-06-01 | 2019-02-13 | 포스트프로세스 테크놀로지스 인코포레이티드 | DEVICE AND METHOD FOR SUPPORT REMOVAL |
GB2575544A (en) * | 2018-05-25 | 2020-01-15 | Additive Manufacturing Tech Ltd | Additive manufacturing |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111529A (en) * | 1988-10-19 | 1990-04-24 | Matsushita Electric Works Ltd | Forming method of three-dimensional form |
JPH04238022A (en) * | 1991-01-22 | 1992-08-26 | Fujitsu Ltd | Post-treating device and method of set resinous body |
JP2008507619A (en) * | 2004-07-26 | 2008-03-13 | ストラタシス・インコーポレイテッド | Soluble materials and processes for 3D modeling |
-
2009
- 2009-06-23 JP JP2009148972A patent/JP2011005668A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111529A (en) * | 1988-10-19 | 1990-04-24 | Matsushita Electric Works Ltd | Forming method of three-dimensional form |
JPH04238022A (en) * | 1991-01-22 | 1992-08-26 | Fujitsu Ltd | Post-treating device and method of set resinous body |
JP2008507619A (en) * | 2004-07-26 | 2008-03-13 | ストラタシス・インコーポレイテッド | Soluble materials and processes for 3D modeling |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190015266A (en) * | 2016-06-01 | 2019-02-13 | 포스트프로세스 테크놀로지스 인코포레이티드 | DEVICE AND METHOD FOR SUPPORT REMOVAL |
JP2019519396A (en) * | 2016-06-01 | 2019-07-11 | ポストプロセス テクノロジーズ インク | Device and method for removing a support |
JP7000354B2 (en) | 2016-06-01 | 2022-02-04 | ポストプロセス テクノロジーズ インク | Equipment and methods for removing the support |
KR102398373B1 (en) * | 2016-06-01 | 2022-05-16 | 포스트프로세스 테크놀로지스 인코포레이티드 | Apparatus and method for support removal |
JP2019001069A (en) * | 2017-06-15 | 2019-01-10 | 株式会社ミマキエンジニアリング | Molding device and molding method |
GB2575544A (en) * | 2018-05-25 | 2020-01-15 | Additive Manufacturing Tech Ltd | Additive manufacturing |
US11534973B2 (en) | 2018-05-25 | 2022-12-27 | Additive Manufacturing Technologies Limited | Additive manufacturing |
CN108454112A (en) * | 2018-06-15 | 2018-08-28 | 北京大学 | A method of removing 3D printing water-soluble support materials |
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