JP2011003798A - Electric connection member and socket connector using the same - Google Patents

Abstract

An electrical connection member that eliminates the need for solder / reflow, avoids heat damage during reflow of LED elements, and facilitates rework when an LED is defective, and a socket connector using the same.
A socket connector includes an electrical connection member and a base shell that holds the electrical connection member. The base shell 30 includes a substrate fixing portion 31 that fixes the substrate 40, an accommodation portion 39 that accommodates the electrical connection member 20 and the semiconductor package 10, and the electrical connection member 20 and the semiconductor package 10. And holding portions 35 and 36 held in the housing portion 39 in a state of being press-connected to the storage portion 39. The electrical connection member 20 includes a plate-like elastic body 21, and an electrical connection conductor and a heat radiation conductor disposed so as to be continuous from the upper surface to the lower surface side of the elastic body 21.
[Selection] Figure 3

Description

  The present invention relates to a socket connector of a semiconductor package such as a light-emitting diode (LED) chip used for an in-vehicle light source such as a general illumination, a backlight, and a headlight. Specifically, the LED chip package is electrically and thermally applied to a substrate. The present invention relates to an electrical connection member and a socket connector to be connected.

  Conventionally, with respect to substrate mounting of this type of LED package, for example, as shown in Patent Document 1, a method of performing solder reflow is the most common and common. In Patent Document 1, since the LED element is vulnerable to heat, problems such as element destruction and a decrease in luminance at the time of reflow always occur. As a solution to this problem, mounting with a socket has recently been required.

JP 2008-288536 A

  However, conventionally, there is no electrical connection member or socket that can electrically and thermally connect the connection terminal and the heat dissipation terminal of this type of LED chip (semiconductor package) to the substrate, and it has been exclusively based on the soldering method.

  Therefore, one technical problem of the present invention is to provide an electrical connection member that eliminates the need for solder / reflow, avoids damage due to heat during reflow of the LED element, and facilitates rework when the LED is defective. Is to provide a socket connector.

  Another technical problem of the present invention is to use an electrical connection member capable of easily and reliably electrically and thermally connecting an LED having an electrical connection terminal and a heat dissipation terminal to a substrate. It is to provide a socket connector.

  The present invention provides a thermal connection function in addition to an electrical connection function to an electrical connection member formed by winding a conductor film around an elastic body in order to solve the problem of mounting this type of LED on a substrate. A semiconductor package such as an LED having an electrical connection terminal and a heat dissipation terminal on the lower surface is configured so that it can be easily and reliably electrically and thermally connected to the substrate.

  That is, according to the present invention, there is provided an electrical connection member for connecting a semiconductor package having a planar electrical connection terminal and a heat dissipation terminal on a lower surface to a substrate, comprising a plate-like elastic body and a lower surface side from the upper surface of the elastic body. The electrical connection terminal and the heat dissipation terminal of the semiconductor package are disposed on the substrate and pressed against the semiconductor package from above by being provided with an electrical connection conductor and a heat dissipation conductor disposed so as to be continuous with each other. An electrical connection member characterized in that it can be electrically and thermally connected between the electrical connection pad and the heat dissipation pad of the substrate via the electrical connection conductor and the heat dissipation conductor, respectively. can get.

  Further, according to the present invention, in the electrical connection member, the electrical connection member is characterized in that the electrical connection conductor and the heat dissipation conductor are each made of a metal thin film.

  According to the present invention, in any one of the electrical connection members, the electrical connection conductor and the heat dissipation conductor are provided on the surface of the insulating film disposed so as to be wound from the upper surface to the lower surface of the elastic body. Electrical connection members characterized by being formed respectively are obtained.

  Further, according to the present invention, in the electrical connection member, a base film is disposed between the upper surface or the lower surface of the elastic body 21 and the insulating film, and the base film is attached to both ends of the elastic body from both ends of the elastic body. An electrical connection member having a positioning protrusion formed so as to protrude in the direction is obtained.

  According to the present invention, in any one of the electrical connection members, the elastic body includes an elastic portion for electrical connection corresponding to the electrical connection conductor and heat dissipation of a portion corresponding to the thermal radiation conductor. An electrical connection member characterized in that it is divided into an elastic portion for use is obtained.

  Moreover, according to this invention, the said electrical connection member WHEREIN: The said elastic part for heat radiation consists of material excellent in thermal conductivity, The electrical connection member characterized by the above-mentioned is obtained.

  According to the present invention, there is provided a socket connector having any one of the electrical connection members and a frame for holding the electrical connection member, wherein the frame includes a board fixing portion that is fixed on the board, and an upper and lower side. And a holding portion that holds the electrical connection member and the semiconductor package in a stacked manner, and a holding portion that holds the electrical connection member and the semiconductor package in the receiving portion in a state of being press-connected to the substrate. A socket connector characterized by the above is obtained.

  Further, according to the present invention, in the socket connector, the holding portion is an inner wall surface facing each other in a first direction among inner wall surfaces constituting the housing portion, and the housing is accommodated in one inner wall surface thereof. When the semiconductor package is housed in the housing portion, the fixed engagement projecting portion provided to project into the housing portion and the elastic engagement projecting portion provided to project into the housing portion on the other inner wall surface Further, one side portion of the semiconductor package facing in the first direction is engaged with the lower side of the fixed engagement projection, and the other side portion is pressed downward so that the elastic engagement projection is A socket connector is obtained in which the electrical connecting member and the semiconductor package are accommodated and held in the accommodating portion by being elastically passed and engaged with the lower side thereof.

  Also, according to the present invention, in the socket connector, the elastic engagement projection is formed on the other inner wall surface along the second direction orthogonal to the first direction and in the first direction. The socket connector is characterized in that it has a cantilever-like elastic arm that is provided so as to be elastically displaceable, and a protrusion that is provided at the free end of the elastic arm so as to protrude into the accommodating portion.

  Further, according to the present invention, in the socket connector, the upper surface of the projection is pressed against the other side of the semiconductor package downward to allow the other of the semiconductor cage to pass through the projection. A socket connector is obtained, in which the side portion is in contact with each other and is formed on a tapered surface that immerses the protruding portion inside the other inner wall surface.

  Further, according to the present invention, in any one of the socket connectors, the inner wall surface constituting the housing portion and opposed in the second direction orthogonal to the first direction is provided with the electric wall. A socket connector is obtained, in which a positioning projecting piece for the connection member is inserted, and a guide groove for electrical connection member is formed for receiving and positioning the electrical connection member at a predetermined position in the storage portion.

  Further, according to the present invention, in any one of the socket connectors, the outer surface of the semiconductor package is regulated on the inner wall surface constituting the storage portion, and the semiconductor package is stored in a predetermined position in the storage portion. A socket connector characterized in that a semiconductor package guide portion for guiding and positioning is formed.

  According to the present invention, in any one of the socket connectors, the lower opening surface of the housing portion is provided with a fall prevention portion that protrudes into the housing portion and prevents the electrical connection member from falling downward. Thus, a socket connector is obtained.

  Furthermore, according to the present invention, in any one of the socket connectors, a socket connector is obtained in which the frame is punched and bent from a metal plate.

  As described above, according to the present invention, there is no need for soldering / reflowing of LEDs in board mounting, avoiding damage to LEDs due to heat during reflowing, and facilitating reworking when LEDs are defective. And a socket connector using the same can be provided.

  In addition, according to the present invention, an electrical connection member that can simultaneously and easily and reliably connect electrical and thermal connections between an electrical connection terminal and an LED having a heat dissipation terminal, and a socket using the same A connector can be provided.

  Furthermore, according to the present invention, as a contact for connecting the LED and the substrate, by using a metal thin film connector in which a metal thin film conductor is provided on the peripheral surface of the elastic body, the contact area of the thermal connection portion is increased, and It is possible to provide an electrical connection member capable of realizing close connection and improving the heat dissipation effect and a socket connector using the electrical connection member.

It is a figure which shows the basic structure of the LED socket connector by embodiment of this invention, and the state mounted in the board | substrate after fitting LED to the LED socket connector. It is the II-II line perspective sectional view of FIG. It is a disassembled assembly perspective view which shows the state before fitting LED to a LED socket connector. It is a figure which shows the lower surface (mounting surface) of the submount board | substrate 5 of LED. It is a perspective view which shows the whole structure of an electrical connection member. It is a perspective view when the insulating film which has the conductor film metal thin film of the one surface of the electrical connection member of FIG. 5 is removed. It is an assembly exploded perspective view of the LED socket connector which mounted the base shell on the board | substrate. It is a perspective view which shows the assembly state of a LED socket connector, and also shows a partially expanded perspective view. It is a perspective view which shows the state which mounted the base shell on the board | substrate. It is a perspective view which shows the state before board | substrate mounting of an LED socket connector. It is a perspective view which shows the state before mounting LED in the LED socket connector mounted in the board | substrate. It is a perspective view which shows the state which mounted LED in the LED socket connector mounted in the board | substrate. It is a top view which shows the state which mounted LED in the LED socket connector mounted in the board | substrate. FIG. 2 is a cross-sectional view of the LED socket connector according to the embodiment of the present invention, taken along a cutting line at the same position as the II-II line in FIG. 1, showing a state before the LEDs are mounted on the LED socket connector mounted on the substrate. FIG. 15 is a cross-sectional view of the LED socket connector of FIG. 14 taken along the cutting line at the same position as the II-II line of FIG. 1, showing a state where LEDs are mounted on the LED socket connector mounted on the substrate. It is a figure which shows the thermal radiation path | route of the semiconductor package of the socket connector by embodiment of invention. It is a disassembled perspective view which shows another example of mounting of the LED socket connector 70 by embodiment of this invention. FIG. 18 is a perspective view of the LED socket connector of FIG. 17. It is a perspective view which shows the modification of the LED socket connector by embodiment of this invention. It is a partial expansion perspective view of the part 65 of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 are views showing a basic configuration of an LED socket connector according to an embodiment of the present invention. FIG. 1 is a view showing a state where an LED is mounted on a board after being fitted to the socket connector, and FIG. II is a perspective sectional view taken along line II-II, and FIG. 3 is an exploded perspective view showing a state before the LED is fitted into the socket connector.

  1 to 3, the LED socket connector 70 has a configuration in which a semiconductor package (LED) 10 having an LED element having an output of about 3 W can be mounted with one touch.

  Referring to FIGS. 2, 4, and 16, the LED 10 includes a light emitting element 1 including a rectangular submount substrate 5 and an LED chip mounted on the submount substrate 5 via a support bottom 4 made of an insulating material. And a dome-shaped lens 2 covering the light emitting element 1, a resin casing 3 for supporting and fixing the dome-shaped lens 2 on the submount substrate 5, and a lower surface (mounting surface) of the submount substrate 5. The planar heat radiation terminal 12 and the electrical connection terminal 11 are provided, and the electrical connection terminal 11 and the light emitting element 1 are electrically connected by a conductive member (not shown).

  As shown in FIG. 4, the electrical connection terminals 11 of the LED 10 have an elongated rectangular shape and are respectively provided on opposite sides of the lower surface of the submount substrate 5, and the heat dissipation terminals 12 are between the electrical connection terminals 11 and have a relatively large rectangular shape. I am doing.

  As best shown in FIG. 3, the LED socket connector 70 includes a base shell (frame) 30 as a socket connector main body for positioning and maintaining connection of the LED 10, and an electrical connection member 20 that connects the LED 10 and the substrate 40. Have. The electrical connecting member is made of a metal thin film connector, and the metal thin film connector is denoted by the same reference numeral 20 hereinafter.

  FIG. 5 is a perspective view showing the overall configuration of the electrical connection member, and FIG. 6 is a perspective view when the conductive film on one side of the electrical connection member in FIG. 5, that is, the insulating film having a metal thin film on one side is removed.

  7 to 10 are perspective views for explaining the assembly of the LED socket connector and the mounting method on the board. FIG. 7 is an exploded perspective view of the LED socket connector having the base shell mounted on the board. FIG. It is a perspective view which shows the assembly state of a LED socket connector, and also shows a partially expanded perspective view. FIG. 9 is a perspective view showing a state where the base shell is mounted on the substrate, and FIG. 10 is a perspective view showing a state before the LED socket connector is mounted on the substrate.

  Referring to FIGS. 5 and 6, the metal thin film connector 20 as an electrical connecting member includes an insulating base film 25, plate-like elastic bodies 21 formed on both surfaces of the base film 25, and the upper surface of the base film 25. And a conductor film 22 that is continuously wound and stuck on the elastic body 21 on the lower surface of the base film 25 from above the elastic body 21. The conductor film 22 is composed of an insulating film 22a having a conductor 23 (23a, 23b) made of a metal thin film on one surface, and is fixed on the elastic body 21 by pasting or double-sided adhesive tape.

  On both sides in the longitudinal direction of the base film 25, positioning protrusions 25a inserted into guide grooves 34 formed on both sides in the longitudinal direction of the base shell 30 (see FIGS. 1 and 3, etc.), and grooves 25c on both sides thereof, Furthermore, the protrusion piece 25b is provided in the both sides. The elastic body 21 is formed on both front and back sides of the base film 25, and the elastic body 21 on each side is formed between two electrical connection elastic portions 21a near the both ends in the longitudinal direction and the electrical connection elastic portion 21a. The heat radiating elastic portion 21b is divided. As the material of the elastic body 21, a silicone material can be cited, but it is possible to further satisfy the connection reliability by using a material that matches the required performance. In addition, as a material of the heat radiating elastic portion 21b, it is desirable to use, for example, a material in which particles such as carbon are mixed with a silicone material to increase thermal conductivity.

  The conductor film 22 is formed on the insulating film 22a and the surface thereof with two electrical connection conductors 23a and a base film 25 formed at positions corresponding to the length of the base film 25 and the electrical connection elastic portions 21a closer to both ends. And a heat dissipating conductor 23b formed at a position corresponding to the heat dissipating elastic portion 21b provided between the electrical connecting conductors 23a near the center in the length direction.

  Here, the elastic bodies 21 are provided on both front and back sides of the base film 25, and the elastic bodies 21 on each side are separately divided into an elastic portion 21a for electrical connection and an elastic portion 21b for heat dissipation, respectively. The elastic body 21 may be formed integrally with a single silicone rubber sheet or the like without being divided, and the elastic bodies 21 on both the front and back sides may be formed integrally. The elastic body 21 may be formed only on one side of the front and back sides of the base film 25. Further, the base film 25 is not always necessary.

  Moreover, although the electrical connection conductor 23a and the heat dissipation conductor 23b are formed on the insulating film 22a here, they may be formed directly on the elastic body 21 and the insulating film 22a may be omitted.

  As shown in FIG. 3 and FIGS. 7 to 10, the LED socket connector 70 includes a base shell 30 and a metal thin film connector 20 that is an electrical connection member accommodated in the accommodating portion 39 in the base shell 30. The base shell 30 is a frame having a quadrangular frame shape formed by punching and bending from a single metal plate, and has an accommodating portion 39 inside.

  The base shell 30 has a pair of first partial frames 32 that form two opposite sides of the quadrangular shape and two outer sides of the first partial frame 32 that form the other two opposite sides of the quadrangular shape. And a pair of second partial frames 33 provided so as to be connected. The first partial frame 32 includes a guide groove 34 extending from the upper end to the lower end at the center thereof. In the guide groove 34, the metal thin film connector 20 is positioned and guided by using the positioning protrusion 25a.

  The base shell 30 is composed of an L-shaped plate piece that extends from the upper end of the first partial frame 32 to the housing portion 39 of the base shell 30 and bends downward, and performs housing guidance into the housing portion 39 of the semiconductor package, A semiconductor package guide portion 37 for positioning is provided. In addition, the first partial frame 32 includes a board fixing portion 31 that is formed of a rectangular plate piece extending from the lower end of the first partial frame 32 to the outside of the base shell 30 and is soldered to the pad 43 of the board 40. Further, the lower end of the first partial frame 32 is connected to both side portions of the guide groove 34, extends inside the base shell 30, and is made of a rectangular plate piece that is provided so as to form a part of the bottom portion. A portion 38 is provided.

  As best shown in FIGS. 14 and 15, which will be described in detail later, the second partial frame 33 has a lock mechanism for locking and releasing the LED 10 mounted in the housing portion 39 of the base shell 30. Yes. The lock mechanism includes a fixed-side lock mechanism provided on one second partial frame 33 and a movable-side lock mechanism provided on the other second partial frame 33.

  One second partial frame 33 has a fixed engagement protrusion (first holding portion) 35 that forms a fixed-side lock mechanism symmetrically by cutting and raising the second partial frame 33 into the accommodating portion 39. A pair is formed. The fixed engagement protrusion 35 includes a base 35c, a protrusion 35b, and a notch 35a with which one end of the submount substrate 5 of the semiconductor package 10 provided on the lower side of the tip of the protrusion 35b engages. Yes.

  Further, the other second partial frame 33 has a base shell 30 that intersects the pressing insertion direction (first direction) of the LED 10 by being cut and raised into the housing portion 39 from the center of the second partial frame 33. A pair of elastic engagement protrusions (second holding portions) 36 that form a movable side locking mechanism that can move along the width direction (second direction) are symmetrical with respect to the center of the other second partial frame. Is formed. The elastic engagement protrusion 36 includes an elastic arm portion 36c formed of a spring piece, and a protrusion 36b that is bent from one end of the elastic arm portion 36C to the inside of the base shell 30 and protrudes inward. The protruding portion 36b includes a tapered portion 36d whose upper end portion is cut obliquely, and a notched portion 36a with which the other end portion of the submount substrate 5 of the semiconductor package 10 provided on the lower side of the distal end portion is engaged. Yes.

  As shown in FIGS. 3 and 10, the board 40 on which the LED socket connector 70 is mounted is for four frame soldering for soldering and fixing a board fixing portion 31 for soldering the base shell 30 to one surface. A pair of electrical connection pads 41 and a heat dissipation pad provided in correspondence with the electrical connection conductor 23a and the heat dissipation conductor 23b of the conductor film for connecting the metal thin film connector 20 to the inside of the pads 43, 43 42.

  As shown in FIGS. 7 to 10, the LED 10 and the metal thin film connector 20 are automatically positioned by the outer shape and the inner shape of the base shell 30 by the base shell 30 soldered / reflowed onto the substrate 40. . As a result, it is only necessary to place each component in the base shell 30 in order, which facilitates mounting.

  The mounting method of the base shell 30 and each component will be described more specifically.

  The base shell 30 and the metal thin film connector 20 will be described with reference to FIGS.

  Referring to FIG. 7, positioning protrusions 25a provided at both ends of the base film 25 are inserted into the guide grooves 34 of the first partial frame 32 of the base shell 30 soldered or reflow-mounted on the substrate 40, respectively. As a guide, the metal thin film connector 20 is slid into the accommodating portion 39 of the base shell 30. Then, as shown in FIG. 8, the metal thin film connector 20 is positioned and mounted at a predetermined position of the accommodating portion 39 of the base shell 30, and the electrical connection conductor 23 a and the heat dissipation conductor 23 b of the metal thin film connector 20 are electrically connected to the substrate 40. It is placed on the pad 41 and the heat radiation pad 42.

  Here, since the base shell 30 is provided with the drop prevention portions 38, 38 of the metal thin film connector 20, by pre-mounting the metal thin film connector 20 on the base shell 3 at the time of shipment from the manufacturer, The user can omit the mounting process of the metal thin film connector 20 when the LED socket connector 70 is mounted on the board, which can lead to cost reduction. For the base film 25 and the insulating film 22a of the metal thin film connector 20, it is desirable to use a material having excellent heat resistance such as PI (polyimide).

  Next, a method for mounting the LED 10 after mounting the metal thin film connector 20 shown in FIG. 8 will be described with reference to FIGS. 11 to 15.

  11 is a perspective view showing a state before LEDs are mounted on the LED socket connector 70 mounted on the board, and FIG. 12 is a perspective view showing a state where the LEDs 10 are mounted on the LED socket connector 70 mounted on the board. 13 is a plan view showing a state in which the LED 10 is mounted on the LED socket connector 70 mounted on the substrate. 14 is a cross-sectional view showing a state before the LED 10 is mounted on the LED socket connector 70 mounted on the board 40 at the same cutting line as the line II-II in FIG. 1, and FIG. 15 is similar to FIG. It is sectional drawing which shows the state which mounted LED10 in the LED socket connector 70 mounted in the board | substrate 40 in a cutting line in the same position as the II-II line | wire of FIG.

  As shown in FIG. 11, in a state where the metal thin film connector 20 is mounted on the base shell 30 mounted on the substrate 40, the LED 10 is accommodated in the housing portion 39 along the semiconductor package guide portion 37 provided on the base shell 30. Push into. At this time, the four engagement protrusions 35 and 36 constituting the lock mechanism are engaged with the LED 10, and the LED 10 is mounted and held at a predetermined position of the base shell 30.

  Referring to FIGS. 14 and 15, when mounting the LED 10, first, the one end portion of the submount substrate 5 of the LED 10 is slanted so as to be engaged with the notch portions 35 a of the two fixed engaging portions 35. Then, the LED 10 is rotated around the notch 35a as shown by an arrow 81, and the other end of the submount substrate 5 is moved to the taper 36d of the protrusion 36b. By abutting and pushing against the spring force of the elastic arm portion 36c, the projection portion 36b is displaced outward in the width direction of the base shell 30 as indicated by an arrow 82, and the tip portion of the projection portion 36b is passed. . After the other end portion of the submount substrate 5 passes through the tip end portion of the projection portion 36b, the projection portion 36b is returned to the original position by the elastic return force of the elastic arm portion 36c, so that the notch portion 36a becomes the submount substrate. 5 is engaged with the other end, and the mounting state is as shown in FIGS.

  In this mounted state, the LED 10 is held in the accommodating portion 39 of the base shell 30 in a state where the elastic body 21 (see FIG. 6) of the metal thin film connector 20 is slightly compressed between the LED 10 and the elastic body 21 (FIG. 6). The electrical connection conductor 23a and the heat dissipation conductor 23b of the metal thin film connector 20 are in close contact with the electrical connection pad 41 and the heat dissipation pad 42 of the substrate 40 and the electrical connection terminal 11 and the heat dissipation terminal 12 of the LED 10 by the elastic restoring force of the reference 10). Then, the LED 10 and the substrate 40 are electrically and thermally connected.

  In order to remove the LED 10 from the LED socket connector 70, the engagement with the LD 10 may be released by displacing the protrusion 36b outward in the width direction of the base shell 30 using a jig or the like.

  As described above, the LED socket connector 70 according to the embodiment of the present invention includes the base shell 30 and the metal thin film connector 20 as an electrical connection member. The base shell 30 is detachably attachable to the LED 10, and the LED 10 can be connected to the substrate 40 via the metal thin film connector 20. Therefore, when the LED 10 is mounted on the substrate 40, solder / reflow of the LED 10 is not required, LED damage due to heat can be avoided, and rework when the LED is defective can be facilitated.

  The metal thin film connector 20 has a heat radiating conductor 23b in addition to the electrical connecting conductor 23a, and can be thermally connected simultaneously with the electrical connection when connected to the LED 10. Is very easy to handle.

  Further, by using the metal thin film connector 20, the contact area connecting the LED 10 and the substrate 40 and the space between them can be increased and close contact can be made, so that the heat dissipation effect can be improved.

  Furthermore, since the LED 10 can be engaged and locked by a one-touch operation by simply pushing it into the base shell 30, the connection work is simple.

  Further, the elastic engagement protrusion 36 as a lock (spring) mechanism provided on the base shell 30 of the LED socket connector 70 according to the embodiment of the present invention is provided laterally on the side surface of the base shell 30, thereby providing an elastic arm. The length of the portion 36c can be increased, and as a result, the amount of deformation can be increased.

  Further, when the LED 10 is fitted (connected) to the LED socket connector 70 according to the embodiment of the present invention, the elastic arm portion 36c is easily deformed by receiving a force in the plate thickness direction, and the LED 10 is easily connected. In addition, by receiving a reaction force in the plate width direction during fitting and holding, there is an effect of suppressing deformation, and it is possible to enhance a function of preventing the removal.

  Next, heat dissipation of the LED socket connector 70 according to the embodiment of the present invention will be described.

  FIG. 16 is a diagram schematically showing a heat dissipation path of the semiconductor package (LED 10) of the LED socket connector according to the embodiment of the present invention.

  Referring to FIG. 16, the first path 71 radiates heat from the LED light emitting element portion 1 that is a heat generating portion to the LED heat radiating terminal 12, the heat radiating conductor 23 b (and the heat radiating elastic portion 21 b) of the metal thin film connector 20, and the substrate 40. A main heat dissipation path is formed by a path extending in the order of the pads 42 for use.

  Further, the second path 72 is for electrical connection of the LED light emitting element portion 1 to the LED electrical connection terminal 11, the electrical connection conductor 23 a (and the electrical connection elastic portion 21 a) of the metal thin film connector 20, and the substrate 40. This is the path that reaches the pad 41 in this order.

  The third path 73 is a path from the LED light emitting element portion 1 of the heat generating portion to the submount substrate 5, the base shell 30, and the substrate 40. Further, the fourth path 74 is a path from the LED light emitting element portion 1 of the heat generating portion to the submount substrate 5 and the base shell 30 and is radiated from the base shell 30 to the atmosphere.

  The above-described first to fourth heat radiation paths 71 to 74 are main heat radiation paths, and it is considered that there are actually innumerable such heat radiation paths. As described above, according to the embodiment of the present invention, the heat dissipation path is increased by the connection of the LED 10 to the socket connector 70, and as shown as the fourth path, it is possible to diverge into the air through the base shell 30. As a result, it is possible to realize heat dissipation superior to the solder connection to the substrate 40.

  17 and 18 are exploded perspective views showing another example of mounting the LED socket connector 70 according to the embodiment of the present invention, and FIG. 18 is a perspective view of the LED socket connector of FIG. The LED socket connector 70 of FIGS. 17 and 18 is the same as that described above except that the configuration of the mounted substrate 40 shown in FIGS. 1 to 16 is different.

  As shown in FIGS. 17 and 18, the heat dissipation pad 42 on the substrate 40 is enlarged in an H shape, that is, the pad 45 is further added continuously to the heat dissipation pad 42 to increase the area. Thus, the heat dissipation effect can be enhanced. Reference numeral 46 denotes a fixing hole for fixing the substrate 40 to another heat radiating member, for example, a heat sink 60 having heat radiating fins 62b used in FIGS. 19 and 20 described later.

  FIG. 19 is a perspective view showing a modification of the LED socket connector 70 according to the embodiment of the present invention. 20 is a partially enlarged perspective view of the portion 65 shown in FIG. As shown in FIGS. 19 and 20, the LED socket connector 70 according to the modification is different in that a base shell 50 having a shape different from that of the above-described base shell 30 is used. Moreover, the heat sink 60 provided with the base part 62 which mounts the board | substrate 40 has the several radiation fin 62b erected from the bottom face on the opposite side to the board | substrate mounting part of the base part 62a.

  As best shown in FIG. 20, the base shell 50 is formed from a rectangular plate piece extending outward from the lower end near the center of the second partial frame 33 instead of the board fixing portion 31 for soldering of the base shell 30. The board attaching part 51 for the screwing which becomes this is provided. The board attaching portion 51 has a fixing hole (not shown), and the LED socket connector 70 is mounted on the board 40 by tightening each other through the fixing hole and a fixing hole (not shown) provided in the board 40 with screws 52. To implement.

  19 and 20, the heat sink 60 is further arranged on the back surface of the substrate 40, and the screws 52 are screwed into the heat sink 60, thereby fixing the LED socket connector 70, the substrate 40 and the heat sink 60, and improving the heat dissipation effect. is doing.

  As described above, the electrical connection member according to the present invention and the socket connector using the electrical connection member are socket connectors for semiconductor packages such as light emitting diode (LED) chips used for in-vehicle light sources such as general lighting, backlights, and headlights. Ideal for.

DESCRIPTION OF SYMBOLS 1 Light emitting element part 2 Dome type lens 3 Resin housing | casing part 4 Support bottom part 5 Submount board | substrate 10 Semiconductor package (LED)
DESCRIPTION OF SYMBOLS 11 Electrical connection terminal 12 Thermal radiation terminal 20 Metal thin film connector 21 Elastic body 21a Elastic part for electrical connection 21b Elastic part for thermal radiation 22 Conductive film 22a Insulating film 23a Electrical connection conductor 23b Thermal radiation conductor 25 Base film 25a Positioning protrusion 25b Protrusion Piece 30 Base shell 31 Substrate fixing portion 32 First partial frame 33 Second partial frame 34 Guide groove 35 Fixed engaging protrusion (first holding portion)
35a Notch 35b Protrusion 35c Base 36 Elastic engagement protrusion (second holding part)
36a Notch portion 36b Projection portion 36c Elastic arm portion 36d Tapered portion 37 Semiconductor package guide portion 38 Drop prevention portion 39 Housing portion 40 Substrate 41 Electrical connection pad 42 Heat radiation pad 43 Frame soldering pad 46 Fixing hole 50 Base shell 60 Heat sink 62a Base part 62b Radiation fin 70 LED socket connector 71 1st path 72 2nd path 73 3rd path 74 4th path 81,82 arrow

Claims (14)

  An electrical connection member for connecting a semiconductor package having a planar electrical connection terminal and a heat dissipation terminal on a lower surface to a substrate, and is disposed so as to be continuous from the upper surface of the elastic body to the lower surface side of the elastic body. An electrical connection conductor and a heat dissipation conductor, mounted on the substrate and pressed against the semiconductor package from above, whereby the electrical connection terminal of the semiconductor package, the heat dissipation terminal, and the electrical connection pad of the substrate And a heat dissipating pad can be electrically and thermally connected to each other through the electric connecting conductor and the heat dissipating conductor, respectively.   The electrical connection member according to claim 1, wherein each of the electrical connection conductor and the heat radiation conductor is made of a metal thin film.   3. The electrical connection member according to claim 1, wherein the electrical connection conductor and the heat radiation conductor are respectively formed on a surface of an insulating film disposed so as to be wound from an upper surface to a lower surface of the elastic body. An electrical connection member characterized by comprising:   The electrical connection member according to claim 3, wherein a base film is disposed between the upper or lower surface of the elastic body and the insulating film, and protrudes outward from both ends of the elastic body at both ends of the base film. An electrical connection member having a positioning protrusion formed as described above.   5. The electrical connection member according to claim 1, wherein the elastic body includes an electrical connection elastic portion corresponding to the electrical connection conductor and a portion corresponding to the heat dissipation conductor. An electrical connection member divided into an elastic part for heat dissipation.   6. The electrical connection member according to claim 5, wherein the heat-dissipating elastic portion is made of a material having excellent thermal conductivity.   A socket connector comprising the electrical connection member according to any one of claims 1 to 5 and a frame that holds the electrical connection member, wherein the frame is a substrate fixing portion that is fixed on the substrate. A housing portion penetrating vertically and housing the electrical connection member and the semiconductor package in an overlapping manner; and a holding portion for holding the electrical connection member and the semiconductor package in the housing portion in a state of being pressed and connected to the substrate. A socket connector comprising:   The socket connector according to claim 7, wherein the holding portion is an inner wall surface facing each other in a first direction among inner wall surfaces constituting the housing portion, and projects into the housing portion on one inner wall surface thereof. A fixed engagement protrusion provided to be formed and an elastic engagement protrusion provided on the other inner wall surface so as to protrude into the storage portion, and when the semiconductor package is stored in the storage portion, One side of the semiconductor package facing in the first direction is engaged with the lower side of the fixed engagement protrusion, and the other side is pressed downward to elastically move the elastic engagement protrusion. A socket connector characterized in that the electrical connecting member and the semiconductor package are accommodated and held in the accommodating portion by passing and engaging with the lower side.   9. The socket connector according to claim 8, wherein the elastic engagement protrusion is elastically displaced along the second direction perpendicular to the first direction and in the first direction on the other inner wall surface. A socket connector comprising: a cantilever-like elastic arm provided in a possible manner; and a protrusion provided at a free end of the elastic arm so as to protrude into the accommodating portion.   10. The socket connector according to claim 9, wherein an upper surface of the protruding portion is formed on the other side portion of the semiconductor cage when the other side portion of the semiconductor package is pressed downward to pass the protruding portion. The socket connector is characterized in that it is formed on a tapered surface that makes contact with the inner wall surface of the other inner wall.   The socket connector according to any one of claims 7 to 10, wherein the inner wall surface constituting the housing portion and opposed in the second direction orthogonal to the first direction, A socket connector, wherein a positioning protrusion of the electrical connection member is inserted, and an electrical connection member guide groove for accommodating and positioning the electrical connection member at a predetermined position in the storage portion is formed.   12. The socket connector according to claim 7, wherein an outer wall portion of the housing portion is regulated on an inner wall surface constituting the housing portion, and the semiconductor package is placed at a predetermined position in the housing portion. A socket connector characterized in that a guide portion for semiconductor package is formed which is accommodated and guided in the socket.   The socket connector according to any one of claims 7 to 12, wherein a drop-preventing portion that protrudes into the housing portion and prevents the electrical connection member from falling downward is provided on a lower open surface of the housing portion. A socket connector characterized by being provided.   14. The socket connector according to any one of claims 7 to 13, wherein the frame is formed by punching and bending from a metal plate.

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