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JP2011086615A - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
JP2011086615A
JP2011086615A JP2010204269A JP2010204269A JP2011086615A JP 2011086615 A JP2011086615 A JP 2011086615A JP 2010204269 A JP2010204269 A JP 2010204269A JP 2010204269 A JP2010204269 A JP 2010204269A JP 2011086615 A JP2011086615 A JP 2011086615A
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Japan
Prior art keywords
heat
substrate
light emitting
lighting device
heat radiating
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Pending
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JP2010204269A
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Japanese (ja)
Inventor
秉佑 ▲シン▼
Ping-Yu Chen
Eiketsu Ro
英傑 呂
Zheng-Jay Hunag
正杰 黄
Hsin-Fei Huang
▲きん▼斐 黄
Ying-Ching Chen
穎慶 陳
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Foxsemicon Integrated Technology Inc
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Foxsemicon Integrated Technology Inc
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Publication of JP2011086615A publication Critical patent/JP2011086615A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination device having high efficiency of heat dissipation. <P>SOLUTION: The illumination device includes a heat-dissipating member equipped with a first end and a second end installed facing mutually ; a thermally-conductive member installed at the first end of the heat-dissipating member; a substrate installed on the thermally-conductive member; at least one solid light-emitting element which is installed on the substrate and of which the electrode is electrically connected to a circuit of the substrate; and a base installed at the second end of the heat-dissipating member and electrically connected to the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、照明装置に関するものであって、特に放熱効率を高めることができる照明装置に関するものである。   The present invention relates to a lighting device, and more particularly to a lighting device capable of improving heat dissipation efficiency.

半導体発光素子を採用して製作された発光ダイオード（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ，ＬＥＤ）は、高輝度、低消費電力、長寿命である等の利点を有することから、冷陰極蛍光ランプ（Ｃｏｌｄ Ｃａｔｈｏｄｅ Ｆｌｕｏｒｅｓｃｅｎｔ Ｌａｍｐ，ＣＣＦＬ）に代わってランプの光源として広く応用される。   A light emitting diode (LED) manufactured using a semiconductor light emitting device has advantages such as high brightness, low power consumption, and long life. Therefore, a cold cathode fluorescent lamp (Cold Cathode Fluorescent Lamp, Widely applied as a lamp light source instead of CCFL).

従来の発光ダイオードランプは、放熱部材、口金、基板及び複数の発光ダイオードを備える。前記口金は、前記放熱部材の一端に接続されており、前記基板は、前記放熱部材の他端に接続されており、前記複数の発光ダイオードは、前記基板に設置されている。   A conventional light emitting diode lamp includes a heat dissipation member, a base, a substrate, and a plurality of light emitting diodes. The base is connected to one end of the heat radiating member, the substrate is connected to the other end of the heat radiating member, and the plurality of light emitting diodes are installed on the substrate.

前記基板は、ガラス繊維などの材質からなるプリント基板であり、高温に耐える効果を有するため、熱伝導効果が悪い。前記発光ダイオードランプは長時間作動すると、前記発光ダイオードが発生する熱量が多くなるが、前記熱量は前記基板に当止されて前記放熱部材に高効率に熱伝導することができなくなり、温度が一定のレベルに達すると、発光ダイオードの内部量子効率が低下し、発光ダイオードの寿命が短縮される。従って、発光ダイオードが作動する時に発生する熱量を即時に放熱しなければならない。   The substrate is a printed substrate made of a material such as glass fiber, and has an effect of withstanding high temperatures, and therefore has a poor heat conduction effect. When the light emitting diode lamp operates for a long time, the amount of heat generated by the light emitting diode increases. However, the amount of heat is stopped by the substrate and cannot be efficiently conducted to the heat radiating member, and the temperature is constant. When this level is reached, the internal quantum efficiency of the light emitting diode is lowered, and the lifetime of the light emitting diode is shortened. Therefore, the amount of heat generated when the light emitting diode is activated must be radiated immediately.

本発明の目的は、前記課題を解決し、高い放熱効率を有する照明装置を提供することにある。   The objective of this invention is providing the illuminating device which solves the said subject and has high heat dissipation efficiency.

本発明に係る照明装置は、相対向して設置される第一端及び第二端を備える放熱部材と、前記放熱部材の第一端に設置される熱伝導部材と、前記熱伝導部材上に設置される基板と、前記基板上に設置され、且つその電極が前記基板の回路に電気接続する少なくとも１つの固体発光素子と、前記放熱部材の第二端に設置され且つ前記基板に電気接続する口金と、を備える。   The lighting device according to the present invention includes a heat dissipating member having a first end and a second end that are installed opposite to each other, a heat conducting member installed at a first end of the heat dissipating member, and the heat conducting member. A substrate to be installed; at least one solid-state light-emitting element installed on the substrate and having an electrode electrically connected to the circuit of the substrate; and a second end of the heat dissipation member and electrically connected to the substrate And a base.

本発明の照明装置において、放熱部材と基板との間には熱伝導効果に優れた熱伝導部材が設置されているため、前記照明装置を長時間使用すると、固体発光素子が生じる熱量は多くなるが、前記熱量は前記熱伝導部材により前記放熱部材に高効率に熱伝導されて熱交換が行われるため、前記固体発光素子の寿命が短縮しなくなり、前記照明装置の放熱効率を高めて、前記照明装置の製品性能を高めることができる。   In the illuminating device of the present invention, since a heat conducting member having an excellent heat conducting effect is installed between the heat radiating member and the substrate, when the illuminating device is used for a long time, the amount of heat generated by the solid light emitting element increases. However, since the heat quantity is thermally transferred to the heat radiating member with high efficiency by the heat conducting member and heat exchange is performed, the life of the solid state light emitting device is not shortened, and the heat radiating efficiency of the lighting device is increased, The product performance of the lighting device can be improved.

本発明の第一実施形態に係る照明装置の構造を示す図である。It is a figure which shows the structure of the illuminating device which concerns on 1st embodiment of this invention. 本発明の第二実施形態に係る照明装置の構造を示す図である。It is a figure which shows the structure of the illuminating device which concerns on 2nd embodiment of this invention. 本発明の第三実施形態に係る照明装置の構造を示す図である。It is a figure which shows the structure of the illuminating device which concerns on 3rd embodiment of this invention.

以下、図面を参照して、本発明の実施形態について説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１に示されたように、本発明の第一実施形態に係る照明装置１００は、放熱部材１０と、熱伝導部材２０と、基板３０と、固体発光素子４０と、口金５０と、ランプカバー６０と、を備える。   As shown in FIG. 1, the lighting device 100 according to the first embodiment of the present invention includes a heat radiating member 10, a heat conducting member 20, a substrate 30, a solid light emitting element 40, a base 50, and a lamp cover. 60.

前記放熱部材１０は、相対向して設置される第一端及び第二端を備える。前記放熱部材１０の外周面には放熱フィン１２が設置されているため、前記放熱部材１０の熱交換効率を向上させる。本実施形態において、前記放熱部材１０は、銅、アルミニウムなどのような放熱効果に優れた材質からなり、その第一端は、単一平面である。   The heat radiating member 10 includes a first end and a second end that are installed to face each other. Since the heat radiating fins 12 are installed on the outer peripheral surface of the heat radiating member 10, the heat exchange efficiency of the heat radiating member 10 is improved. In the present embodiment, the heat radiating member 10 is made of a material having an excellent heat radiating effect such as copper or aluminum, and the first end thereof is a single plane.

前記熱伝導部材２０は、前記放熱部材１０の第一端に設置される。本実施形態において、前記熱伝導部材２０は、電気絶縁する熱伝導ゴムである。   The heat conducting member 20 is installed at the first end of the heat radiating member 10. In the present embodiment, the heat conducting member 20 is a heat conducting rubber that is electrically insulated.

前記基板３０は、前記熱伝導部材２０の上に設置される。本実施形態において、前記基板３０は、プリント基板である。   The substrate 30 is installed on the heat conducting member 20. In the present embodiment, the substrate 30 is a printed circuit board.

前記固体発光素子４０は、相対向して設置される底面及び光射出面を備える。前記固体発光素子４０の底面は、前記基板３０に接続されて、前記固体発光素子４０の電極を前記基板３０の回路に電気接続させる。前記固体発光素子４０の寸法及び数量は、実際の照明に対する要求によって決める。本実施形態において、前記固体発光素子４０は、発光ダイオードである。   The solid state light emitting device 40 includes a bottom surface and a light emitting surface that are installed opposite to each other. The bottom surface of the solid state light emitting device 40 is connected to the substrate 30 to electrically connect the electrode of the solid state light emitting device 40 to the circuit of the substrate 30. The size and quantity of the solid state light emitting device 40 are determined according to the actual lighting requirements. In the present embodiment, the solid state light emitting device 40 is a light emitting diode.

前記口金５０は、前記放熱部材１０の第二端に接続される。前記口金５０の外部には、前記口金５０を外部電源に電気接続するために用いられる螺合部又は係合部が設置されている。本実施形態において、前記口金５０は、螺合部を有する口金である。電気接続用導線（図示せず）は、前記放熱部材１０を貫いて前記口金５０及び前記基板３０に電気接続して、前記基板３０及び前記固体発光素子４０に電力を提供する。   The base 50 is connected to the second end of the heat radiating member 10. On the outside of the base 50, a screwing part or an engaging part used for electrically connecting the base 50 to an external power source is provided. In the present embodiment, the base 50 is a base having a threaded portion. An electrical connection lead (not shown) penetrates the heat radiating member 10 and is electrically connected to the base 50 and the substrate 30 to provide power to the substrate 30 and the solid state light emitting device 40.

前記ランプカバー６０は、前記放熱部材１０の第一端に結合された開放端６４から開放される収容空間６２を有し、前記熱伝導部材２０、前記基板３０及び前記固体発光素子４０は、前記収容空間６２に収容される。前記ランプカバー６０は、前記固体発光素子４０の光学素子として、前記固体発光素子４０の照射パターン（illumination pattern）を調整することができる。光学素子は、レンズ又は反射カバーとすることができ、前記固体発光素子４０からの光線の射出角度又は配光曲線を変えるために用いられる。   The lamp cover 60 includes a receiving space 62 that is opened from an open end 64 that is coupled to a first end of the heat radiating member 10, and the heat conducting member 20, the substrate 30, and the solid state light emitting device 40 are configured as described above. It is accommodated in the accommodation space 62. The lamp cover 60 can adjust an illumination pattern of the solid light emitting element 40 as an optical element of the solid light emitting element 40. The optical element may be a lens or a reflective cover, and is used to change the light emission angle or light distribution curve from the solid state light emitting element 40.

前記放熱部材１０と前記基板３０との間には熱伝導効果に優れた熱伝導部材２０が設置されているため、前記照明装置１００を長時間使用しても、前記固体発光素子４０が発生する熱量は多くなるが、前記熱量は前記熱伝導部材２０により前記放熱部材１０に高効率に熱伝導されて熱交換が行われるため、前記固体発光素子４０の寿命が短縮しなくなり、前記照明装置１００の放熱効率を高めて、前記照明装置１００の製品性能を高めることができる。   Since the heat conducting member 20 having an excellent heat conducting effect is installed between the heat radiating member 10 and the substrate 30, the solid state light emitting device 40 is generated even when the lighting device 100 is used for a long time. Although the amount of heat increases, the heat amount is efficiently conducted to the heat radiating member 10 by the heat conducting member 20 and heat exchange is performed, so that the life of the solid state light emitting device 40 is not shortened, and the lighting device 100 Can improve the product performance of the lighting device 100.

固体発光素子の数量を増加することにより、照明装置の輝度を高めることができる。図２を参照すると、本発明の第二実施形態に係る照明装置１００ａは、放熱部材１０と、複数の熱伝導部材２０ａと、基板３０ａと、複数の固体発光素子４０ａと、口金５０と、ランプカバー６０と、を備える。前記第一実施形態に係る照明装置１００と比べて、本実施形態に係る照明装置１００ａにおいては、複数の固体発光素子４０ａの底面がそれぞれ前記基板３０ａに接続され、前記放熱部材１０と前記基板３０ａとの間の前記複数の固体発光素子４０ａに対応する位置には複数の熱伝導部材２０ａが設置されており、従って前記複数の固体発光素子４０ａが発生する熱量は、前記複数の熱伝導部材２０ａにより前記放熱部材１０ａに高効率に熱伝導されて熱交換が行われて、前記照明装置１００ａの放熱効率を高める。   By increasing the number of solid state light emitting elements, the luminance of the lighting device can be increased. Referring to FIG. 2, a lighting device 100a according to a second embodiment of the present invention includes a heat radiating member 10, a plurality of heat conducting members 20a, a substrate 30a, a plurality of solid light emitting elements 40a, a base 50, and a lamp. And a cover 60. Compared with the illuminating device 100 according to the first embodiment, in the illuminating device 100a according to the present embodiment, the bottom surfaces of the plurality of solid state light emitting elements 40a are connected to the substrate 30a, respectively, and the heat dissipation member 10 and the substrate 30a. A plurality of heat conductive members 20a are installed at positions corresponding to the plurality of solid light emitting elements 40a between the plurality of solid light emitting elements 40a. Accordingly, the amount of heat generated by the plurality of solid light emitting elements 40a is equal to the plurality of heat conductive members 20a. As a result, heat is transferred to the heat radiating member 10a with high efficiency, and heat exchange is performed, thereby increasing the heat radiating efficiency of the lighting device 100a.

前記放熱部材１０と前記基板３０ａとの間に前記複数の固体発光素子４０ａの底面を覆うことができる大きい面積を有する１つの熱伝導部材２０ａを設置してもよい。   One heat conducting member 20a having a large area that can cover the bottom surfaces of the plurality of solid state light emitting devices 40a may be installed between the heat radiating member 10 and the substrate 30a.

図３に示されたように、本発明の第三実施形態に係る照明装置１００ｂは、放熱部材１０と、複数の熱伝導部材２０ｂと、基板３０ｂと、複数の固体発光素子４０ｂと、口金５と、ランプカバー６０と、を備える。前記第二実施形態に係る照明装置１００ａと比べて、本実施形態に係る照明装置１００ｂにおいては、前記放熱部材１０の第一端に複数の斜面が設置されており、複数の熱伝導部材２０ｂ、基板３０及び複数の固体発光素子４０ｂが、それぞれ前記複数の斜面に対応して設置されるため、前記複数の固体発光素子４０ｂの光射出面が異なる方向に向って、前記照明装置１００ｂによって広い領域を照明することができる。   As shown in FIG. 3, the illuminating device 100b according to the third embodiment of the present invention includes a heat dissipating member 10, a plurality of heat conducting members 20b, a substrate 30b, a plurality of solid state light emitting elements 40b, and a base 5 And a lamp cover 60. Compared with the illuminating device 100a according to the second embodiment, in the illuminating device 100b according to the present embodiment, a plurality of inclined surfaces are installed at the first end of the heat radiating member 10, and a plurality of heat conducting members 20b, Since the substrate 30 and the plurality of solid state light emitting elements 40b are respectively installed corresponding to the plurality of inclined surfaces, the illumination device 100b has a wide area in which the light emitting surfaces of the plurality of solid state light emitting elements 40b are directed in different directions. Can be illuminated.

前記基板３０ｂと前記放熱部材１０の複数の斜面との間には、熱伝導効果に優れた複数の熱伝導部材２０ｂが設置されているため、前記固体発光素子４０ｂが発生する熱量は、前記熱伝導部材２０ｂにより前記放熱部材１０の複数の斜面に高効率に熱伝導されて熱交換が行われるため、前記固体発光素子４０ｂの寿命が短縮しなくなり、前記照明装置１００ｂの放熱効率を高めて、前記照明装置１００ｂの製品性能を高めることができる。   Since a plurality of heat conducting members 20b having an excellent heat conduction effect are installed between the substrate 30b and the plurality of inclined surfaces of the heat radiating member 10, the amount of heat generated by the solid light emitting element 40b is the heat amount. The conductive member 20b conducts heat to the plurality of inclined surfaces of the heat radiating member 10 with high efficiency, and heat exchange is performed. Therefore, the life of the solid light emitting element 40b is not shortened, and the heat radiating efficiency of the lighting device 100b is increased. The product performance of the lighting device 100b can be enhanced.

以上、本発明を実施例に基づいて具体的に説明したが、本発明は、上述の実施例に限定されるものではなく、その要旨を逸脱しない範囲において、種々の変更可能であることは勿論であって、本発明の保護範囲は、以下の特許請求の範囲から決まる。   The present invention has been specifically described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. Therefore, the protection scope of the present invention is determined from the following claims.

１０ 放熱部材
１２ 放熱フィン
２０、２０ａ、２０ｂ 熱伝導部材
３０、３０ａ、３０ｂ 基板
４０、４０ａ、４０ｂ 固体発光素子
５０ 口金
６０ ランプカバー
６２ 収容空間
６４ 開放端
１００、１００ａ、１００ｂ 照明装置 DESCRIPTION OF SYMBOLS 10 Radiation member 12 Radiation fin 20, 20a, 20b Thermal conduction member 30, 30a, 30b Substrate 40, 40a, 40b Solid light emitting element 50 Base 60 Lamp cover 62 Storage space 64 Open end 100, 100a, 100b Illuminating device

Claims (7)

相対向して設置される第一端及び第二端を備える放熱部材と、
前記放熱部材の第一端に設置される熱伝導部材と、
前記熱伝導部材上に設置される基板と、
前記基板上に設置され、且つその電極が前記基板の回路に電気接続する少なくとも１つの固体発光素子と、
前記放熱部材の第二端に設置され且つ前記基板に電気接続する口金と、
を備えることを特徴とする照明装置。 A heat dissipating member having a first end and a second end installed opposite to each other;
A heat conducting member installed at a first end of the heat dissipating member;
A substrate installed on the heat conducting member;
At least one solid state light-emitting element installed on the substrate and whose electrodes are electrically connected to the circuit of the substrate;
A base installed at the second end of the heat dissipating member and electrically connected to the substrate;
A lighting device comprising: 前記放熱部材の第一端は、単一平面からなることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein the first end of the heat dissipating member is a single plane. 前記放熱部材の第一端は、複数の斜面からなることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein the first end of the heat dissipating member includes a plurality of inclined surfaces. 前記放熱部材の外周面には放熱フィンが設置されることを特徴とする請求項２又は３に記載の照明装置。   The lighting device according to claim 2, wherein a heat radiating fin is installed on an outer peripheral surface of the heat radiating member. 前記固体発光素子の数量は複数であり、前記基板上に均一に分布されることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein the number of the solid-state light emitting elements is a plurality and is uniformly distributed on the substrate. 前記照明装置は、１つの開放端から開放される収容空間を有するランプカバーをさらに備え、前記開放端は前記放熱部材の第一端に結合され、前記熱伝導部材、前記基板及び前記固体発光素子は前記収容空間内に収容されることを特徴とする請求項１に記載の照明装置。   The lighting device further includes a lamp cover having a receiving space opened from one open end, the open end being coupled to a first end of the heat radiating member, the heat conducting member, the substrate, and the solid state light emitting device. The illumination device according to claim 1, wherein the illumination device is accommodated in the accommodation space. 前記ランプカバーは、前記固体発光素子の光学素子として、前記固体発光素子の照射パターンを調整することを特徴とする請求項６に記載の照明装置。   The lighting device according to claim 6, wherein the lamp cover adjusts an irradiation pattern of the solid light emitting element as an optical element of the solid light emitting element.
JP2010204269A 2009-10-16 2010-09-13 Illumination device Pending JP2011086615A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160247951A1 (en) * 2013-10-22 2016-08-25 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001243809A (en) * 2000-02-28 2001-09-07 Mitsubishi Electric Lighting Corp Led electric bulb
JP2006244725A (en) * 2005-02-28 2006-09-14 Atex Co Ltd Led lighting system
JP3133586U (en) * 2007-04-02 2007-07-19 禎圖 謝 LED lamp heat dissipation structure
JP3139851U (en) * 2007-12-11 2008-03-06 呉祖耀 LED light
JP2008293753A (en) * 2007-05-23 2008-12-04 Sharp Corp Illumination device
JP2009170114A (en) * 2008-01-10 2009-07-30 Toshiba Lighting & Technology Corp Led bulb and luminaire
JP2009206104A (en) * 2005-04-08 2009-09-10 Toshiba Lighting & Technology Corp Self-ballasted lamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787999B2 (en) * 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
EP1914470B1 (en) * 2006-10-20 2016-05-18 OSRAM GmbH Semiconductor lamp
KR101317429B1 (en) * 2007-01-31 2013-10-10 잘만테크 주식회사 LED assemblely having cooler using a heatpipe

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001243809A (en) * 2000-02-28 2001-09-07 Mitsubishi Electric Lighting Corp Led electric bulb
JP2006244725A (en) * 2005-02-28 2006-09-14 Atex Co Ltd Led lighting system
JP2009206104A (en) * 2005-04-08 2009-09-10 Toshiba Lighting & Technology Corp Self-ballasted lamp
JP3133586U (en) * 2007-04-02 2007-07-19 禎圖 謝 LED lamp heat dissipation structure
JP2008293753A (en) * 2007-05-23 2008-12-04 Sharp Corp Illumination device
JP3139851U (en) * 2007-12-11 2008-03-06 呉祖耀 LED light
JP2009170114A (en) * 2008-01-10 2009-07-30 Toshiba Lighting & Technology Corp Led bulb and luminaire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160247951A1 (en) * 2013-10-22 2016-08-25 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same
US9773932B2 (en) * 2013-10-22 2017-09-26 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same

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