[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP2011066169A - Led package - Google Patents

Led package Download PDF

Info

Publication number
JP2011066169A
JP2011066169A JP2009215079A JP2009215079A JP2011066169A JP 2011066169 A JP2011066169 A JP 2011066169A JP 2009215079 A JP2009215079 A JP 2009215079A JP 2009215079 A JP2009215079 A JP 2009215079A JP 2011066169 A JP2011066169 A JP 2011066169A
Authority
JP
Japan
Prior art keywords
substrate
translucent cover
adhesive
led package
inclined portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009215079A
Other languages
Japanese (ja)
Inventor
Tatsuya Minato
達也 湊
Shintaro Hakamada
新太郎 袴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2009215079A priority Critical patent/JP2011066169A/en
Publication of JP2011066169A publication Critical patent/JP2011066169A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a constitution that prevents an adhesive for joining a translucent cover and a substrate together from being forced out for an LED package having the translucent cover joined to the substrate. <P>SOLUTION: The LED package includes a substrate 10, an LED element 20 mounted on the substrate, and a dome-shaped translucent cover 30 attached to the substrate via an adhesive 50 and surrounding the LED element, wherein a junction part 31 for the translucent cover with respect to the substrate has an inclined part 32 and a plane part 33, the inclined part being inclined to the substrate along an inner edge and/or an outer edge of the junction part, and the plane part continuing with the inclined part to come into contact with the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、透光性カバーを有するＬＥＤパッケージの改良に関する。 The present invention relates to an improvement of an LED package having a translucent cover.

従来、基板に実装されたＬＥＤ素子を囲繞する透光性カバーが基板に接合されたＬＥＤパッケージにおける、透光性カバーの取り付け態様の例が、特許文献１〜４に開示されている。特許文献１〜３に開示のＬＥＤパッケージではいずれも、接着材を使用して基板と透光性カバーを取り付けている。一方、特許文献４に開示のＬＥＤパッケージでは基板のカバーに対する接合部に接着材の逃がし用の溝を備える。   Conventionally, Patent Documents 1 to 4 disclose examples of an attachment mode of a translucent cover in an LED package in which a translucent cover surrounding an LED element mounted on the substrate is bonded to the substrate. In any of the LED packages disclosed in Patent Documents 1 to 3, the substrate and the translucent cover are attached using an adhesive. On the other hand, the LED package disclosed in Patent Document 4 is provided with a groove for releasing an adhesive material in a joint portion with respect to the cover of the substrate.

特開２００７−２５０８１７号公報JP 2007-250817 A 特開２００６−３５１３３３号公報JP 2006-351333 A 特開２００８−１６３６２号公報JP 2008-16362 A 特開２００６−３０３１２２号公報JP 2006-303122 A

特許文献１〜３のＬＥＤパッケージでは、透光性カバー取り付け用の接着材が、透光性カバーと基板との間から透光性カバーの内側（ＬＥＤ素子側）にはみ出してＬＥＤ素子のボンディングワイヤに干渉したり、透光性カバーの外側にはみ出してＬＥＤパッケージの電極パッドに干渉したりするなどの問題があった。このような問題に対して、引用文献４に開示のように、基板に接着材の逃がし用の溝を設けて接着材のはみ出しを防止することが行われる。しかし、基板を放熱性の高いセラミック基板やＡｌ基板であると、このような溝を設けることは手間がかかるものであり、コスト面で不利となる。
そこで、本発明は、透光性カバーが基板に接合されるＬＥＤパッケージにおいて、透光性カバーと基板とを接合する接着材のはみ出しが防止される構成を提供することを目的の一つとする。また、コスト面で有利となる構成を提供することを目的の一つとする。 In the LED packages of Patent Documents 1 to 3, the adhesive for attaching the translucent cover protrudes from the space between the translucent cover and the substrate to the inner side (LED element side) of the translucent cover, and the bonding wire for the LED element. There is a problem that it interferes with the electrode pad of the LED package. In order to solve such a problem, as disclosed in the cited document 4, a groove for releasing the adhesive is provided on the substrate to prevent the adhesive from protruding. However, if the substrate is a ceramic substrate or an Al substrate having a high heat dissipation property, it is troublesome to provide such a groove, which is disadvantageous in terms of cost.
Accordingly, an object of the present invention is to provide a configuration in which an adhesive that joins the translucent cover and the substrate is prevented from protruding in the LED package in which the translucent cover is joined to the substrate. Another object is to provide a configuration that is advantageous in terms of cost.

以上の目的を達成するため、本発明の構成からなる。即ち、
基板と、該基板に実装されるＬＥＤ素子と、前記基板に接着材を介して取り付けられ、前記ＬＥＤ素子を囲繞するドーム状の透光性カバーとを、備えるＬＥＤパッケージであって、
前記透光性カバーの前記基板に対する接合部が傾斜部と平面部とを備え、
前記傾斜部はその内縁及び／又は外縁に沿って前記基板に対して傾斜し、
前記平面部は前記傾斜部に連続して前記基板に当接する、ことを特徴とするＬＥＤパッケージである。 In order to achieve the above object, the present invention is configured. That is,
An LED package comprising: a substrate; an LED element mounted on the substrate; and a dome-shaped translucent cover that is attached to the substrate via an adhesive and surrounds the LED element,
A joint portion of the translucent cover to the substrate includes an inclined portion and a flat portion,
The inclined portion is inclined with respect to the substrate along its inner edge and / or outer edge;
The flat surface portion is an LED package that is in contact with the substrate continuously with the inclined portion.

本発明のＬＥＤパッケージによれば、透光性カバーの基板に対する接合部において、傾斜部はその内縁及び／又は外縁に沿って基板に対して傾斜しているため透光性カバーと基板とを接合する接着材の逃がしの空間が確保され、当該接着材が透光性カバーの内側または外側にはみ出して、ボンディングワイヤや電極パッド等に干渉することが防止される。さらに、傾斜部に連続する平面部が備えられることにより、透光性カバーと基板との接合面積が確保され、十分な接着強度が得られる。また、接着材を逃がすための溝や凹部を基板に形成する必要がないため、手間がかからない。   According to the LED package of the present invention, since the inclined portion is inclined with respect to the substrate along the inner edge and / or outer edge of the light transmitting cover to the substrate, the light transmitting cover and the substrate are bonded to each other. A space for releasing the adhesive material is secured, and the adhesive material is prevented from protruding inside or outside the translucent cover and interfering with bonding wires or electrode pads. Furthermore, by providing a flat portion continuous with the inclined portion, a bonding area between the translucent cover and the substrate is ensured, and sufficient adhesive strength is obtained. Moreover, since it is not necessary to form a groove or a recess for releasing the adhesive on the substrate, it does not take time.

図１は本発明の実施例であるＬＥＤパッケージ１の上面図である。FIG. 1 is a top view of an LED package 1 according to an embodiment of the present invention. 図２Ａは図１のＡ−Ａ線断面図であり、図２Ｂは図２Ａの要部Ｂの拡大図であり、図２Ｃは図２Ａの要部Ｃの拡大図である。2A is a cross-sectional view taken along line AA of FIG. 1, FIG. 2B is an enlarged view of a main part B of FIG. 2A, and FIG. 2C is an enlarged view of a main part C of FIG. 図３は本発明の変形例を示す図である。FIG. 3 is a diagram showing a modification of the present invention.

以下、本発明のＬＥＤパッケージについて詳述する。本発明では基板に実装されるＬＥＤ素子を透光性カバーで囲繞する。基板の種類は限定されず、公知のものを使用することができる。中でも、Ａｌ基板、セラミック基板などの放熱の高いものが好ましい。装置の信頼性が向上するからである。基板にはＬＥＤ素子が実装される。ＬＥＤ素子の種類は時に限定されない。 Hereinafter, the LED package of the present invention will be described in detail. In the present invention, the LED element mounted on the substrate is surrounded by a translucent cover. The kind of board | substrate is not limited, A well-known thing can be used. Of these, materials with high heat dissipation such as an Al substrate and a ceramic substrate are preferable. This is because the reliability of the apparatus is improved. An LED element is mounted on the substrate. The type of LED element is sometimes not limited.

本発明で使用する透光性カバーは基板に実装されたＬＥＤ素子を囲繞するように設けられる。透光性カバーの材質は透光性を有するものであれば特に限定されず、ガラス、アクリル樹脂など、公知の材料から適宜選択できる。透光性カバーの形状はドーム状であって、その外形は半球型、楕円半球型、部分球型、部分楕円球型とすることができる。透光性カバーは基板に接着材を介して接合される。接着材の種類は基板の材質、透光性カバーの材質等を考慮して決定することができる。ＡｌＮ製の基板とガラス製の透光性カバーを使用する場合、例えば、エポキシ樹脂系の接着材を使用することができる。   The translucent cover used by this invention is provided so that the LED element mounted in the board | substrate may be enclosed. The material of the translucent cover is not particularly limited as long as it has translucency, and can be appropriately selected from known materials such as glass and acrylic resin. The translucent cover has a dome shape, and its outer shape can be a hemispherical shape, an elliptical hemispherical shape, a partial spherical shape, or a partial elliptical spherical shape. The translucent cover is bonded to the substrate via an adhesive. The type of the adhesive can be determined in consideration of the material of the substrate, the material of the translucent cover, and the like. When using an AlN substrate and a glass translucent cover, for example, an epoxy resin adhesive can be used.

透光性カバーの基板に対する接合部は傾斜部と平面部とを備える。傾斜部は接合部の内縁及び／又は外縁に沿って基板に対して傾斜している。傾斜部の形状は平面状であってよいことはもちろん、曲面状であっても良い。傾斜部を接合部の内縁に沿って設けることにより、当該接合部の内縁に沿って接合部と基板との間に接着材の逃がしの空間が形成されることとなる。これにより、透光性カバーの内側、即ちＬＥＤ素子側に接着材が過度にはみ出さず、ＬＥＤ素子のボンディングワイヤやＬＥＤ素子自体に干渉することが防止される。一方、傾斜部を接合部の外縁に沿って設けることにより、当該接合部の外縁に沿って接合部と基板との間に接着材の逃がしの空間が形成されることとなる。これにより、透光性カバーの外側、即ちＬＥＤ素子の反対側に接着材が過度にはみ出さず、電極パッド、配線パターン等に干渉することが防止される。傾斜部を接合部の内縁及び外縁のそれぞれに沿って設けることにより、透光性カバーの内側及び外側の両方から接着剤が過度にはみ出さず、ボンディングワイヤ、ＬＥＤ素子、電極パッド、配線パターン等に干渉することが防止される。   A joint portion of the translucent cover with respect to the substrate includes an inclined portion and a flat portion. The inclined portion is inclined with respect to the substrate along the inner edge and / or outer edge of the joint portion. The shape of the inclined portion may be a flat surface as well as a curved surface. By providing the inclined portion along the inner edge of the joint portion, an escape space for the adhesive material is formed between the joint portion and the substrate along the inner edge of the joint portion. Thereby, the adhesive does not protrude excessively inside the translucent cover, that is, on the LED element side, and interference with the bonding wire of the LED element or the LED element itself is prevented. On the other hand, by providing the inclined portion along the outer edge of the joint portion, a space for releasing the adhesive material is formed between the joint portion and the substrate along the outer edge of the joint portion. As a result, the adhesive does not protrude excessively on the outer side of the translucent cover, that is, on the opposite side of the LED element, and interference with electrode pads, wiring patterns and the like is prevented. By providing the inclined part along each of the inner edge and the outer edge of the joint part, the adhesive does not excessively protrude from both the inner side and the outer side of the translucent cover, and bonding wires, LED elements, electrode pads, wiring patterns, etc. Is prevented from interfering with.

傾斜部の傾斜角度は例えば、基板に対して約１０°〜約６０°、好ましくは約１５°〜約４５°、好ましくは約２０°〜約４０°である。接着材の逃がしの空間が十分に形成されて、接着材のはみ出しが効果的に防止されるからである。平面部は傾斜部に連続して基板に当接する。例えば、平面部は基板に平行な面とすることができる。傾斜部及び平面部は接合部の全域に形成されていることが好ましい。接合部の全域において接着材のはみ出しが防止されるからである。   The inclination angle of the inclined portion is, for example, about 10 ° to about 60 °, preferably about 15 ° to about 45 °, preferably about 20 ° to about 40 ° with respect to the substrate. This is because the space for the release of the adhesive is sufficiently formed and the protrusion of the adhesive is effectively prevented. The flat portion contacts the substrate continuously with the inclined portion. For example, the plane portion can be a plane parallel to the substrate. It is preferable that the inclined portion and the flat portion are formed in the entire area of the joint portion. This is because the sticking out of the adhesive material is prevented in the entire joint portion.

接合部における、傾斜部と平面部の面積の割合は特に限定されないが、平面部に対して傾斜部が少なすぎれば、接着材の逃がしの空間が十分に形成されず、はみ出し防止の効果が十分に発揮されない。一方、平面部に対して傾斜部が多すぎれば、接合強度の低下や加工の容易性の低下を引き起こす。例えば、傾斜部の面積は平面部の面積に対して、約０．１倍〜約５．０倍、好ましくは約０．５倍〜約３．０倍、より好ましくは約１．０倍〜約２．０倍である。この範囲であれば、接着材の逃がしの空間が十分に形成されて、はみ出し防止の効果が十分に発揮されるとともに、十分な接合強度と、高い加工容易性が得られる。   The ratio of the area between the inclined part and the flat part in the joint part is not particularly limited, but if the inclined part is too small with respect to the flat part, the space for releasing the adhesive is not sufficiently formed, and the effect of preventing the protrusion is sufficient. Is not demonstrated. On the other hand, if there are too many inclined parts with respect to a plane part, it will cause the fall of joining strength and the ease of a process. For example, the area of the inclined portion is about 0.1 times to about 5.0 times, preferably about 0.5 times to about 3.0 times, more preferably about 1.0 times to the area of the plane portion. About 2.0 times. Within this range, a space for releasing the adhesive is sufficiently formed, and the effect of preventing the protrusion is sufficiently exhibited, and sufficient bonding strength and high processability are obtained.

本発明の基板には配線パターンが形成され、該配線パターンのエッジの一部が、透光性カバーと基板との接合部に対向することが好ましい。このようにすれば、当該接合部から接着材がはみ出したとしても、当該エッジの一部がこれを堰き止める壁面として機能するため、接着材が電極パッドやボンディングワイヤに干渉することがより一層防止されるからである。このような堰き止め用の配線パターンは、通電用として設けられる配線パターンを利用しても良いし、通電には利用されない、いわゆるダミーの配線パターンを設けて利用しても良い。
以下本発明の実施例について、より詳細に説明する。 It is preferable that a wiring pattern is formed on the substrate of the present invention, and a part of the edge of the wiring pattern is opposed to a joint portion between the translucent cover and the substrate. In this way, even if the adhesive protrudes from the joint, a part of the edge functions as a wall for blocking the adhesive, so that the adhesive further prevents interference with the electrode pad or bonding wire. Because it is done. As such a damming wiring pattern, a wiring pattern provided for energization may be used, or a so-called dummy wiring pattern that is not used for energization may be provided.
Examples of the present invention will be described in detail below.

本発明の実施例であるＬＥＤパッケージ１の上面図を図１に示す。図１に示すように、ＬＥＤパッケージ１は基板１０、ＬＥＤ素子２０、透光性カバー３０、電極パッド４０、配線パターン４１、ダミーパターン４２を備える。基板１０はＡｌＮ製の放熱性基板である。基板１０には配線パターン４１が形成されている。配線パターン４１のチップマウント部（図示せず）にＬＥＤ素子２０が実装され、ワイヤボンディングされている（符号２１参照）。透光性カバー３０はＬＥＤ素子２０を囲繞している。また、ダミーパターン４２は透光性カバー３０の内側、及び外側の基板１０上に設けられる。   FIG. 1 shows a top view of an LED package 1 according to an embodiment of the present invention. As shown in FIG. 1, the LED package 1 includes a substrate 10, an LED element 20, a translucent cover 30, an electrode pad 40, a wiring pattern 41, and a dummy pattern 42. The substrate 10 is an AlN heat dissipation substrate. A wiring pattern 41 is formed on the substrate 10. The LED element 20 is mounted on a chip mount portion (not shown) of the wiring pattern 41 and wire-bonded (see reference numeral 21). The translucent cover 30 surrounds the LED element 20. The dummy pattern 42 is provided on the inner and outer substrates 10 of the translucent cover 30.

図１のＡ−Ａ線断面図を図２Ａに示す。図２Ａに示すように、透光性カバー３０の形状はドーム状であって、ＬＥＤ素子２０を囲繞するように基板１０に取り付けられている。透光性カバー３０は、基板１０に対する接合部３１において接着材５０を介して基板１０と接合されている。接着材５０はエポキシ樹脂系の接着材である。接合部３１は透光性カバー３０の端面全域に形成されている。   FIG. 2A shows a cross-sectional view taken along line AA of FIG. As shown in FIG. 2A, the translucent cover 30 has a dome shape and is attached to the substrate 10 so as to surround the LED element 20. The translucent cover 30 is joined to the substrate 10 via an adhesive 50 at a joint 31 to the substrate 10. The adhesive 50 is an epoxy resin adhesive. The joint portion 31 is formed over the entire end face of the translucent cover 30.

図２Ａの要部Ｂの拡大図を図２Ｂに示す。図２Ｂに示すように接合部３１は傾斜部３２と平面部３３とからなる。傾斜部３２は接合部３１の内縁に沿って形成されている。平面部３３は傾斜部３２に連続して形成されている。透光性カバー３０が基板１０に取り付けられた状態において、傾斜部３２は基板１０とのなす角が約３０°となるように基板１０に対して傾斜しており、平面部３３は基板１０と略平行となっている。このように、接合部３１が傾斜部３２を備えることにより、接合部３１と基板１０（図２Ｂにおいては配線パターン４１）との間に、接着材５０が逃げる空間が確保されることとなる。これにより、接合時に接着材５０が透光性カバー３０の内側（ＬＥＤ素子２０側）に過度にはみ出さないため、当該接着材５０がボンディングワイヤ２１に干渉することが防止される。一方、接合部３１が平面部３３を備えることにより、基板１０（図２Ｂにおいては配線パターン４１）への接合面積が確保されるため、十分な接合強度が得られる。また、画像認識により透光性カバー３０の配置を設定したり、透光性カバー３０の配置状態を検査する場合に、当該接合部３１の平面部３３により接合部３１の配置の識別精度が高まる。これらにより、ＬＥＤパッケージ１の信頼性が向上する。
なお、接合時に、基板１０において接着材５０が塗布される領域は適宜設置できるが、少なくとも接合部３１の平面部３３に対向する領域を含む領域とする。これにより、平面部３３と基板１０との接合が確保され、十分な接着強度が得られる。 An enlarged view of the main part B of FIG. 2A is shown in FIG. 2B. As shown in FIG. 2B, the joint portion 31 includes an inclined portion 32 and a flat portion 33. The inclined portion 32 is formed along the inner edge of the joint portion 31. The flat portion 33 is formed continuously with the inclined portion 32. In a state where the translucent cover 30 is attached to the substrate 10, the inclined portion 32 is inclined with respect to the substrate 10 so that the angle formed with the substrate 10 is about 30 °, and the flat portion 33 is connected to the substrate 10. It is almost parallel. As described above, since the joint portion 31 includes the inclined portion 32, a space for the adhesive 50 to escape is secured between the joint portion 31 and the substrate 10 (the wiring pattern 41 in FIG. 2B). Thereby, since the adhesive 50 does not protrude excessively to the inner side (the LED element 20 side) of the translucent cover 30 at the time of joining, the adhesive 50 is prevented from interfering with the bonding wire 21. On the other hand, since the bonding portion 31 includes the flat portion 33, a bonding area to the substrate 10 (the wiring pattern 41 in FIG. 2B) is ensured, so that sufficient bonding strength can be obtained. Further, when setting the arrangement of the translucent cover 30 by image recognition or inspecting the arrangement state of the translucent cover 30, the identification accuracy of the arrangement of the joint portion 31 is enhanced by the flat portion 33 of the joint portion 31. . Thereby, the reliability of the LED package 1 is improved.
In addition, although the area | region where the adhesive material 50 is apply | coated in the board | substrate 10 at the time of joining can be installed suitably, let it be an area | region including the area | region which opposes the plane part 33 of the junction part 31 at least. Thereby, joining of the plane part 33 and the board | substrate 10 is ensured, and sufficient adhesive strength is obtained.

図２Ａの要部Ｃの拡大図を図２Ｃに示す。図２Ｃに示すように、接合部３１の近傍にはダミーパターン４２が設けられており、ダミーパターン４２のエッジ４２ａが接合部３１に対向している。これにより、接合部３１と基板１０との間から接着材５０がはみ出したとしても、エッジ４２ａがこれを堰き止める壁面として機能する。その結果、接着材５０が電極パッド４２やボンディングワイヤ２１に干渉することが防止される。これにより、ＬＥＤパッケージ１の信頼性が向上する。また、透光性カバー３０の接合部３１に傾斜部３２を設けて接着剤５０の逃がしの空間が形成されるため、基板１０に当該逃がしの空間としての溝や凹部を設ける必要がなく、手間がかからず、コスト面で有利となる。   An enlarged view of the main part C of FIG. 2A is shown in FIG. 2C. As shown in FIG. 2C, a dummy pattern 42 is provided in the vicinity of the joint portion 31, and an edge 42 a of the dummy pattern 42 faces the joint portion 31. Thereby, even if the adhesive material 50 protrudes from between the junction part 31 and the board | substrate 10, the edge 42a functions as a wall surface which dams this. As a result, the adhesive 50 is prevented from interfering with the electrode pad 42 and the bonding wire 21. Thereby, the reliability of the LED package 1 is improved. In addition, since the inclined portion 32 is provided in the joint portion 31 of the translucent cover 30 to form a relief space for the adhesive 50, it is not necessary to provide the substrate 10 with a groove or a recess as the relief space. This is advantageous in terms of cost.

本実施例では、接合部３１において傾斜部３２を接合部３１の内縁に沿って設けたが、図３Ａに示す変形例のように、接合部３１の傾斜部３４０を接合部３１０の外縁に沿って設け、平面３３を当該傾斜部３４０に連続して設けることとしてもよい。このようにすれば、接着剤５０が透光性カバー３０の外側に過度にはみ出さず、透光性カバー３０の外側の電極パッド４０や配線パターン４１に干渉することが防止される。
また、図３Ｂに示す変形例のように、第１の傾斜部３２０を接合部３１０の内縁に沿って設けるとともに、第２の傾斜部３４０を接合部３１１の外縁に沿って設け、第１の傾斜部３２０と第２の傾斜部３４０の間に平面３３０を当該第１の傾斜部３２０及び第２の傾斜部３４０に連続して設けることとしてもよい。このようにすれば、透光性カバー３０の内側及び外側の両方に対して、接着材５０のはみ出しが防止され、接着材５０がボンディングワイヤ２１、電極パッド４２、配線パターン４１に干渉することが防止される。 In the present embodiment, the inclined portion 32 is provided along the inner edge of the bonded portion 31 in the bonded portion 31, but the inclined portion 340 of the bonded portion 31 extends along the outer edge of the bonded portion 310 as in the modification shown in FIG. 3A. The flat surface 33 may be provided continuously to the inclined portion 340. In this manner, the adhesive 50 does not protrude excessively outside the translucent cover 30 and is prevented from interfering with the electrode pads 40 and the wiring patterns 41 outside the translucent cover 30.
3B, the first inclined portion 320 is provided along the inner edge of the joint portion 310, and the second inclined portion 340 is provided along the outer edge of the joint portion 311. A plane 330 may be provided between the inclined portion 320 and the second inclined portion 340 so as to be continuous with the first inclined portion 320 and the second inclined portion 340. In this way, the adhesive 50 is prevented from protruding from both the inside and the outside of the translucent cover 30, and the adhesive 50 may interfere with the bonding wires 21, the electrode pads 42, and the wiring pattern 41. Is prevented.

この発明は、上記発明の実施の形態及び実施例の説明に何ら限定されるものではない。特許請求の範囲の記載を逸脱せず、当業者が容易に想到できる範囲で種々の変形態様もこの発明に含まれる。   The present invention is not limited to the description of the embodiments and examples of the invention described above. Various modifications may be included in the present invention as long as those skilled in the art can easily conceive without departing from the description of the scope of claims.

１ ＬＥＤパッケージ１０ 基板
２０ ＬＥＤ素子
２１ ボンディングワイヤ
３０ 透光性カバー
３１、３１０、３１１ 接合部
３２ 傾斜部
３２０ 第１の傾斜部
３４０ 第２の傾斜部
３３ 平面部
４０ 電極パッド
４１ 配線パターン
４２ ダミーパターン DESCRIPTION OF SYMBOLS 1 LED package 10 Board | substrate 20 LED element 21 Bonding wire 30 Translucent cover 31,310,311 Joint part 32 Inclination part 320 1st inclination part 340 2nd inclination part 33 Plane part 40 Electrode pad 41 Wiring pattern 42 Dummy pattern

Claims (3)

基板と、該基板に実装されるＬＥＤ素子と、前記基板に接着材を介して取り付けられ、前記ＬＥＤ素子を囲繞するドーム状の透光性カバーとを、備えるＬＥＤパッケージであって、
前記透光性カバーの前記基板に対する接合部が傾斜部と平面部とを備え、
前記傾斜部は前記基板に対して傾斜し、該接合部の内縁及び／又は外縁に沿い、
前記平面部は前記傾斜部に連続し、前記基板に当接する、ことを特徴とするＬＥＤパッケージ。 An LED package comprising: a substrate; an LED element mounted on the substrate; and a dome-shaped translucent cover that is attached to the substrate via an adhesive and surrounds the LED element,
A joint portion of the translucent cover to the substrate includes an inclined portion and a flat portion,
The inclined portion is inclined with respect to the substrate, along an inner edge and / or an outer edge of the joint;
The flat surface portion is continuous with the inclined portion and contacts the substrate. 前記傾斜部及び前記平面部が、前記接合部の全域に形成されている、請求項１に記載のＬＥＤパッケージ。   The LED package according to claim 1, wherein the inclined portion and the planar portion are formed over the entire area of the joint portion. 前記基板には配線パターンが形成され、該配線パターンのエッジの一部が前記接合部に対向する、請求項１又は２に記載のＬＥＤパッケージ。   The LED package according to claim 1, wherein a wiring pattern is formed on the substrate, and a part of an edge of the wiring pattern is opposed to the joint portion.
JP2009215079A 2009-09-16 2009-09-16 Led package Pending JP2011066169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009215079A JP2011066169A (en) 2009-09-16 2009-09-16 Led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009215079A JP2011066169A (en) 2009-09-16 2009-09-16 Led package

Publications (1)

Publication Number Publication Date
JP2011066169A true JP2011066169A (en) 2011-03-31

Family

ID=43952121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009215079A Pending JP2011066169A (en) 2009-09-16 2009-09-16 Led package

Country Status (1)

Country Link
JP (1) JP2011066169A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013207189A (en) * 2012-03-29 2013-10-07 Konica Minolta Inc Lens unit for optical communication and semiconductor module
JP2017220664A (en) * 2016-06-06 2017-12-14 行政院原子能委員會核能研究所 Package structure of ultraviolet light-emitting diode part
CN109273412A (en) * 2017-07-18 2019-01-25 日本特殊陶业株式会社 Light-emitting component package for mounting
JP2021077692A (en) * 2019-11-06 2021-05-20 日本碍子株式会社 Package and transparent sealing member
JP2023522535A (en) * 2021-01-14 2023-05-31 泉州三安半導体科技有限公司 LED light emitting device and manufacturing method thereof
KR20230119107A (en) 2020-12-15 2023-08-16 니폰 덴키 가라스 가부시키가이샤 Lid members, packages and glass substrates
WO2024157781A1 (en) * 2023-01-23 2024-08-02 ソニーグループ株式会社 Light-emitting device
JP7583522B2 (en) 2019-11-06 2024-11-14 日本碍子株式会社 package

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354361A (en) * 1991-05-31 1992-12-08 Nippondenso Co Ltd Electronic device
JPH06104461A (en) * 1992-09-18 1994-04-15 Canon Inc Optical semiconductor apparatus and optical information processing apparatus using the same
JPH07237267A (en) * 1994-02-28 1995-09-12 Nippondenso Co Ltd Structure for bonding resin case
JP2006157420A (en) * 2004-11-29 2006-06-15 Alps Electric Co Ltd Camera module
JP2006202894A (en) * 2005-01-19 2006-08-03 Nichia Chem Ind Ltd Light emitting device
JP2007035802A (en) * 2005-07-25 2007-02-08 Matsushita Electric Works Ltd Light-emitting device
JP2009038215A (en) * 2007-08-01 2009-02-19 Nippon Carbide Ind Co Inc Package for storing light emitting element and light emitting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354361A (en) * 1991-05-31 1992-12-08 Nippondenso Co Ltd Electronic device
JPH06104461A (en) * 1992-09-18 1994-04-15 Canon Inc Optical semiconductor apparatus and optical information processing apparatus using the same
JPH07237267A (en) * 1994-02-28 1995-09-12 Nippondenso Co Ltd Structure for bonding resin case
JP2006157420A (en) * 2004-11-29 2006-06-15 Alps Electric Co Ltd Camera module
JP2006202894A (en) * 2005-01-19 2006-08-03 Nichia Chem Ind Ltd Light emitting device
JP2007035802A (en) * 2005-07-25 2007-02-08 Matsushita Electric Works Ltd Light-emitting device
JP2009038215A (en) * 2007-08-01 2009-02-19 Nippon Carbide Ind Co Inc Package for storing light emitting element and light emitting device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013207189A (en) * 2012-03-29 2013-10-07 Konica Minolta Inc Lens unit for optical communication and semiconductor module
JP2017220664A (en) * 2016-06-06 2017-12-14 行政院原子能委員會核能研究所 Package structure of ultraviolet light-emitting diode part
CN109273412A (en) * 2017-07-18 2019-01-25 日本特殊陶业株式会社 Light-emitting component package for mounting
JP2019021769A (en) * 2017-07-18 2019-02-07 日本特殊陶業株式会社 Light emitting element mounting package
JP2021077692A (en) * 2019-11-06 2021-05-20 日本碍子株式会社 Package and transparent sealing member
JP7583522B2 (en) 2019-11-06 2024-11-14 日本碍子株式会社 package
KR20230119107A (en) 2020-12-15 2023-08-16 니폰 덴키 가라스 가부시키가이샤 Lid members, packages and glass substrates
JP2023522535A (en) * 2021-01-14 2023-05-31 泉州三安半導体科技有限公司 LED light emitting device and manufacturing method thereof
JP7480313B2 (en) 2021-01-14 2024-05-09 泉州三安半導体科技有限公司 LED light emitting device and its manufacturing method
WO2024157781A1 (en) * 2023-01-23 2024-08-02 ソニーグループ株式会社 Light-emitting device

Similar Documents

Publication Publication Date Title
JP6415648B2 (en) Sensor package structure
JP5102051B2 (en) Semiconductor light emitting device
US8115106B2 (en) Surface mount device
JP2011066169A (en) Led package
US6635953B2 (en) IC chip package
TWI445200B (en) Semiconductor optical device
JP2005277227A (en) Semiconductor light emitting device
JP2019036701A (en) Sensor packaging structure
JP2012074483A (en) Light-emitting device housing package
JP5187746B2 (en) Light emitting device
WO2017208724A1 (en) Optical module, module, and methods for manufacturing optical module and module
JP2018006760A (en) Sensor package structure
JP4823729B2 (en) Optical communication module
JP6537259B2 (en) Light emitting device
JP6208447B2 (en) Electronic element storage package and electronic device
JP3212911U (en) Waterproof pressure sensor
JP2008205107A (en) Back mounting led
JP2007067190A (en) Semiconductor light emitting device
JP2006049624A (en) Light emitting element
JP2008021670A (en) Light-emitting device
US20080061313A1 (en) Photosensitive chip package
JP2007157958A (en) Electronic device
JP2005093635A (en) Resin-sealed semiconductor device
JPH08116094A (en) Surface mount type light emitting element
JPH098360A (en) Light emitting diode

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110927

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121204

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130723

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130912

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140107