JP2011060801A - Light-emitting device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin light-emitting device which has a high degree of freedom in wiring on a secondary mounting substrate. <P>SOLUTION: The light-emitting device 100 includes a light-emitting element 103, a base 101 which has a plurality of recessed parts S1 where light-emitting elements are mounted and is made of a light-reflecting resin, and at least a pair of conductive members 102 each comprising a plating layer which has an upper surface exposed from a bottom surface of each recessed part and also has a lower surface exposed to the outside, a conductive member being provided apart from a conductive member provided to at least one adjacent recessed part. Consequently, the light-emitting device is thin and has the high degree of freedom in wiring on the secondary mounting substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light-emitting device that can be used for a display device, a lighting device, and the like, and particularly relates to a light-emitting device that is thin and has high light extraction efficiency and high yield and a method for manufacturing the same.

  Research on light-emitting devices (LEDs) using semiconductor light-emitting elements as a light source for display devices and lighting devices that replace conventional fluorescent lamps and incandescent bulbs has been underway. Since this LED has a longer life than the above light source and can emit light with energy saving, it is highly expected as a light source for next generation illumination. However, in order to obtain brightness (illuminance) similar to that of a fluorescent lamp, a single semiconductor light emitting element has a small luminous flux, and thus it is necessary to use a plurality of semiconductor light emitting elements.

  As such a light source for illumination, for example, a plurality of light emitting devices mounted with light emitting elements are mounted on a wiring board (for example, Patent Document 1), or a plurality of light emitting elements are directly mounted on a wiring board ( For example, Patent Document 2) is known.

JP 2007-59371 A JP 2004-95655 A

  Since the light source described in Patent Document 1 is mounted on a wiring board with a light emitting device whose normal driving has been confirmed in advance, it is possible to prevent mounting a defective product having a problem such as unlighting. In addition, when a problem occurs in some light emitting devices during driving, it is relatively easy to replace only the defective product. However, there are limits to miniaturization and thinning. Further, the light source described in Patent Document 2 has a problem that the degree of freedom of wiring is low although the light emitting element is directly mounted on a wiring board or the like, and can be made thinner than the above method. .

  In order to solve the above problems, a light-emitting device of the present invention includes a light-emitting element, a base made of light-reflecting resin having a plurality of recesses on which the light-emitting elements are placed, and an upper surface exposed to the bottom surface of each recess. At least one pair of conductive members made of a plating layer whose lower surface is exposed to the outside, and the conductive members are provided so as to be separated from the conductive members provided in at least one adjacent recess. And Accordingly, a light-emitting device that is thin and has a high degree of freedom in wiring on a mounting substrate can be easily formed.

  In the light emitting device manufacturing method of the present invention, the first step of forming a plurality of pairs of conductive members spaced apart from each other on the support substrate and a part of the upper surfaces of the pair of conductive members are exposed to the bottom surface. A second step of forming a substrate having a plurality of recesses, a third step of placing a light emitting element on a conductive member exposed on the bottom surface of the recess, and a light emitting element from a translucent resin. A fourth step of covering with a sealing member, and a fifth step of cutting the base at a position having a plurality of recesses after removing the support substrate. Accordingly, a light-emitting device that is thin and has a high degree of freedom in wiring on a mounting substrate can be easily formed.

  According to the present invention, a thin light-emitting device with a high degree of freedom of wiring on a secondary mounting substrate can be easily formed with a high yield.

FIG. 1A is a perspective view showing a light emitting device according to the present invention. 1B is a perspective view showing a conductive member of the light emitting device according to FIG. 1A. FIG. 1C is a top view showing the inside of the light emitting device according to FIG. 1A. FIG. 2 is a top view showing the inside of the light emitting device according to the present invention.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light-emitting device for embodying the technical idea of the present invention, and is not limited to the following.

  Moreover, this specification does not limit the member shown by the claim to the member of embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the extent that there is no specific description. It is just an example. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

  A light-emitting device 100 of this embodiment is shown in FIGS. 1A, 1B, and 1C. 1A is a perspective view of the light emitting device 100, FIG. 1B is a perspective view for explaining the inside of the light emitting device 100 shown in FIG. 1A, and FIG. 1C is a top view for explaining the inside of the light emitting device 100 shown in FIG.

  In the present embodiment, the light-emitting device 100 includes a light-emitting element, a base made of a plurality of light reflecting resins having recesses on which the light-emitting elements are placed, an upper surface exposed at the bottom surface of each recess, and a lower surface externally And at least one pair of conductive members made of a plated layer exposed to the surface. The conductive member is provided so as to be separated from the conductive member provided in at least one adjacent recess.

(Substrate)
In the present embodiment, the base has a plurality of recesses having side walls and a bottom surface and an upper surface as an opening, and includes a reflective member capable of reflecting light from a light emitting element placed in the recess. It consists of light reflecting resin. A pair of conductive members serving as electrodes for supplying power to the light emitting elements are exposed on the bottom surface of each recess, and at least one light emitting element is placed thereon.

  As shown in FIG. 1C, the base body 100 has a quadrangular shape (square) when viewed from above, and nine recesses having circular openings are arranged in a matrix of 3 columns × 3 columns. One light emitting element is placed in the recess.

  As for the outer shape of the base body 100, an arbitrary shape such as a rectangle, a circle, a polygon, an ellipse, and a shape such as a combination of these, in addition to the square shown in FIG. 1C, can be selected. .

  As shown in FIG. 1A, the upper surface of the base body 100 may have a step or a groove other than the opening portion of the recess in addition to substantially the same plane, and may be a paraboloid or a curved surface. Depending on the application and the like, various shapes can be used.

  The height of the substrate (side wall) 100 is preferably set such that the light emitting element 103 and the conductive wire 104 are positioned below the upper surface of the recess S1.

  In addition to the circular shape as described above, the concave portion S1 can have a square shape, a rectangular shape, a polygonal shape, an elliptical shape, and the like. Although it is easy to make uniform light emission, it is not limited to this, it can be regularly arranged such as point symmetry and line symmetry, or can be arranged irregularly, and the size, shape, and number can be selected variously. it can.

  The inner surface of the side wall of the recess S1 can be a surface perpendicular to the bottom surface or an inclined surface, and in particular, an inclined surface that spreads toward the upper surface can facilitate light extraction. This is preferable. Moreover, although it is set as the inner surface of a curved surface in FIG. 1A, it is not restricted to this, It can be set as a plane, the surface which gave the process of a level | step difference part, a groove part, etc. can do. Furthermore, a reflective film such as a metal film for improving the reflectance can be provided on the surface.

  The side wall between the recess and the adjacent recess is determined by the upper area of the substrate and the area and number of the openings of the recess. If the thickness (distance to the adjacent recess) becomes too thin, It is not preferable because the strength tends to decrease, and a certain distance is preferable. In the case of a recess having a side surface that is inclined so as to spread toward the upper surface, there is no problem even if the thickness is reduced on the upper surface side. Here, the thickness on the bottom surface side will be described.

  As shown in FIG. 1C, the bottom surface of the side wall is embedded so that the conductive member is separated inside. Each conductive member must be provided at a sufficient distance so as not to be short-circuited on the back surface of the light emitting device when bonded to a circuit board or the like using solder or the like. The side walls are preferably longer (thicker) than the distance between the conductive members. The conductive member may not be embedded in the side wall of the recess, that is, the outer edge of the conductive member may be exposed on the bottom surface of the recess, but in this case, the heat dissipation is reduced by reducing the area of the conductive member. In addition, since the conductive member is easily detached from the base during the manufacturing process, the conductive member is preferably embedded in the inner wall between the recesses. Of the side walls of the recess, those constituting the outer periphery of the substrate are preferably of a thickness that allows the light from the light emitting element to be reflected (not easily transmitted).

  The bottom surface of the recess may have an area where the pair of positive and negative conductive members are exposed and on which the light emitting element can be placed, and may have the same shape as the opening, a similar shape, or a different shape. The base provided between the positive and negative conductive members is preferably the same height as the conductive member or higher. In the case of increasing the height, it is preferable that a part thereof extends on the conductive member, thereby improving the strength of the base between the conductive members and suppressing dropping and breakage during the manufacturing process. it can.

  The substrate may be any substrate that can reflect light from the light-emitting element, and preferably has a small difference in linear expansion coefficient from the support substrate. Furthermore, it is preferable to use an insulating member. As preferable materials, resins such as thermosetting resins and thermoplastic resins can be used. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins, and epoxy-modified resins. Examples thereof include a modified silicone resin composition such as a silicone resin, a polyimide resin composition, and a modified polyimide resin composition.

  In particular, a thermosetting resin is preferable, and a resin described in JP-A-2006-156704 is preferable. For example, among thermosetting resins, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, urethane resins and the like are preferable. Specifically, (i) an epoxy resin composed of triglycidyl isocyanurate and hydrogenated bisphenol A diglycidyl ether, and (ii) hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride It is preferable to use a solid epoxy resin composition containing a colorless and transparent mixture in which an acid anhydride composed of an acid is dissolved and mixed so as to be equivalent. Furthermore, with respect to 100 parts by weight of these mixtures, 0.5 parts by weight of DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator, 1 part by weight of ethylene glycol as a co-catalyst, oxidation A solid epoxy resin composition in which 10 parts by weight of a titanium pigment and 50 parts by weight of glass fiber are added and partially cured by heating to form a B stage is preferable.

  Moreover, the thermosetting epoxy resin composition which has the epoxy resin containing a triazine derivative epoxy resin as an essential component as described in international publication number WO2007 / 015426 is preferable. For example, it is preferable to include a 1,3,5-triazine nucleus derivative epoxy resin. In particular, an epoxy resin having an isocyanurate ring is excellent in light resistance and electrical insulation. It is desirable to have a divalent, more preferably a trivalent epoxy group for one isocyanurate ring. Specifically, tris (2,3-epoxypropyl) isocyanurate, tris (α-methylglycidyl) isocyanurate, or the like can be used. The softening point of the triazine derivative epoxy resin is preferably 90 to 125 ° C. These triazine derivative epoxy resins may be used in combination with a hydrogenated epoxy resin or other epoxy resins. Furthermore, in the case of a silicone resin composition, a silicone resin containing a methyl silicone resin is preferable.

  In particular, the case where a triazine derivative epoxy resin is used will be specifically described. It is preferable to use an acid anhydride that acts as a curing agent for the triazine derivative epoxy resin. In particular, light resistance can be improved by using an acid anhydride which is non-aromatic and does not have a carbon-carbon double bond. Specific examples include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, and hydrogenated methylnadic acid anhydride. In particular, methylhexahydrophthalic anhydride is preferred. Moreover, it is preferable to use antioxidant, for example, a phenolic-type and sulfur-type antioxidant can be used. Moreover, as a curing catalyst, a well-known thing can be used as a curing catalyst of an epoxy resin composition.

And the filler for providing light reflectivity in these resins, and various additives can be mixed as needed. In the present invention, these are referred to as a light reflecting resin constituting the base 101. For example, light can be transmitted by mixing fine particles such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , MgO, MgCO ₃ , CaCO ₃ , Mg (OH) ₂ , and Ca (OH) ₂ as a filler (filler). You can adjust the rate. It is preferable to reflect about 60% or more of the light from the light emitting element, more preferably about 90%.

  Various fillers as described above can be used alone or in combination of two or more. For example, it is possible to use a combination of a filler for adjusting the reflectance and a filler for adjusting the linear expansion coefficient as will be described later.

For example, when TiO ₂ is used as a white filler, it is preferably added in an amount of 10 to 30 wt%, more preferably 15 to 25 wt%. TiO ₂ may be either a rutile type or an anatase type. The rutile type is preferable from the viewpoint of light shielding properties and light resistance. Furthermore, when it is desired to improve dispersibility and light resistance, a filler modified by surface treatment can also be used. For the surface treatment of the filler made of TiO _2, hydrated oxides such as alumina, silica and zinc oxide, oxides and the like can be used. In addition to these, it is preferable to use SiO ₂ in the range of 60～80Wt% as a filler, further, preferably used 65~75wt%. As the SiO _2, less amorphous silica coefficient of linear expansion than the crystalline silica is preferable. Further, a filler having a particle size of 100 μm or less, and further a filler of 60 μm or less is preferable. Furthermore, a spherical filler is preferable, which can improve the filling property when molding the substrate.

Further, it is preferable to control the linear expansion coefficient of the substrate so that the difference from the linear expansion coefficient of the support substrate to be removed (peeled) before being separated into pieces is reduced. The difference is preferably 30% or less, more preferably 10% or less. When a SUS plate is used as the support substrate, the difference in coefficient of linear expansion is preferably 20 ppm or less, and more preferably 10 ppm or less. In this case, it is preferable to add 70 wt% or more, preferably 85 wt% or more of the filler. Thereby, since the residual stress between the support substrate and the base can be controlled (relaxed), the warpage of the assembly of the light emitting devices before being separated into pieces can be reduced. By reducing the warpage, internal damage such as cutting of the conductive wire can be reduced, and the positional deviation at the time of singulation can be suppressed, and manufacturing can be performed with high yield. For example, the linear expansion coefficient of the substrate is preferably adjusted to 5 to 25 × 10 ⁻⁶ / K, more preferably 7 to 15 × 10 ⁻⁶ / K. Thereby, it is possible to easily suppress the warpage that occurs during cooling after the base is molded, and it is possible to manufacture with high yield. In this specification, the linear expansion coefficient of the substrate refers to the linear expansion coefficient below the glass transition temperature of the substrate made of a light-shielding resin adjusted with various fillers. The linear expansion coefficient of the substrate in this temperature region is preferably close to the linear expansion coefficient of the support substrate.

  From another viewpoint, it is preferable to control the linear expansion coefficient of the base so that the difference from the linear expansion coefficient of the conductive member is small. The difference is preferably 40% or less, more preferably 20% or less. Thereby, in the light-emitting device after separation, it is possible to suppress the peeling of the conductive member and the substrate, and to obtain a light-emitting device with excellent reliability.

(Conductive member)
The conductive member functions as a pair of positive and negative electrodes for energizing the light emitting element, and is composed of a plating layer whose upper surface is exposed at the bottom surface of the concave portion of the substrate and whose lower surface is exposed to the outside. At least two conductive members are exposed through the base so that the light emitting element can be energized as a pair of positive and negative electrodes on the bottom surface of each recess provided in the base. In the present invention, the conductive member provided in each recess is provided so as to be separated from the conductive member provided in at least one adjacent recess. Since the conductive member is composed only of the plating layer, the conductive members can be provided independently so as to be separated from each other.

  For example, as shown in FIG. 1C, the conductive members of the recess S1 adjacent in the X direction among the adjacent recesses can be separated, and the recess S1 adjacent in the Y direction can be continuous. . Further, like the light emitting device 200 shown in FIG. 2, the conductive members 202 provided in the recesses S2 adjacent to each other in the X direction and the Y direction can be provided so as to be separated from each other in both directions. As described above, since the pair of conductive members are provided between the respective concave portions, independent driving for each concave portion is possible, so that the output can be easily adjusted. In addition, heat generated from the light emitting element can be made difficult to be transmitted to the light emitting element and other members in the adjacent recesses, so that heat resistance is improved. With such a structure, the light emitting device can be made more compact than when a plurality of light emitting devices are used. Further, the degree of freedom of wiring on the secondary mounting substrate is high, and the design, light distribution characteristics, etc. can be freely designed when used as various lighting devices. Furthermore, when the conductive member is independent, it can be made less susceptible to warping due to a difference in linear expansion coefficient, and damage or the like can be made less likely to occur.

  The conductive member only needs to be exposed on the bottom surface in each recess so as to form a pair of positive and negative electrodes, and the light emitting element may be directly or indirectly via another member such as a submount. It is preferable to provide a portion having a mountable area. In FIG. 1A, one conductive member 102 is exposed in an area that occupies approximately half or more of the bottom surface of each recess S1, and the light emitting element 103 is placed thereon. In this case, the light emitting element 103 is placed substantially at the center of the bottom surface of the recess S1, which is preferable because it makes it easy to make the alignment characteristics uniform. In addition, it is preferable to place the light emitting element 103 directly on the conductive member 102 because heat from the light emitting element 103 is easily released to the outside.

  The conductive members exposed on the bottom surface of each recess S1 are preferably the same shape as shown in FIG. 1C, but are not limited to this, and can have various shapes, sizes, and numbers.

  The conductive member embedded in the side wall of the recess is preferably not in contact with the adjacent conductive member. Further, as shown in FIGS. 1B and 1C, a through hole H is formed in a part of the embedded portion. By providing the substrate and providing the substrate therein, the adhesion between the conductive member having a relatively large area and the substrate can be improved.

  Specific materials for the conductive member include metals such as copper, aluminum, gold, silver, tungsten, iron, nickel, and cobalt, or eutectic such as iron-nickel alloy, phosphor bronze, iron-containing copper, molybdenum, and Au-Sn. Examples thereof include solder, solder such as SnAgCu and SnAgCuIn, and ITO. Among these solder materials, those that are adjusted to a composition that is not re-dissolved during additional heat treatment such as reflow mounting are particularly preferred when the composition is controlled and once melted and solidified by the reaction between the solder particles and the first metal part.

  These can be used as a simple substance or an alloy, and can also be provided in a plurality of layers such as stacked. For example, a material capable of reflecting light from the light emitting element is preferable for the outermost surface, and specifically, gold, silver, copper, Pt, Pd, Al, W, Mo, Ru, Rh, and the like are preferable. Furthermore, it is preferable that the outermost conductive member has high reflectivity and high gloss. Specifically, the reflectance in the visible range is preferably 70% or more, and in this case, Ag, Ru, Rh, Pt, Pd, etc. are preferably used. Further, it is preferable that the surface gloss of the conductive member is high. Specifically, the glossiness is preferably 0.5 or more, more preferably 1.0 or more. The glossiness shown here is a number obtained by 45 ° irradiation and vertical light reception using a Nippon Denshoku Industries micro surface color difference meter VSR 300A. Further, eutectic solder plating such as Au, Sn, Sn alloy, AuSn and the like, which are advantageous for mounting on a circuit board or the like, is preferable on the support substrate side.

  Further, an intermediate layer may be formed between the outermost surface (uppermost layer) of the conductive member and the support substrate side (lowermost layer). In order to improve the mechanical strength of the conductive member and the light emitting device, it is preferable to use a metal having high corrosion resistance, for example, Ni for the intermediate layer. Moreover, in order to improve heat dissipation, it is preferable to use copper with high thermal conductivity for the intermediate layer. Thus, it is preferable to use a suitable member for the intermediate layer according to the purpose and application. Also for this intermediate layer, Pt, Pd, Al, W, Ru, Pd, etc. can be used in addition to the above metals. As the intermediate layer, a metal having good adhesion to the metal of the uppermost layer or the lowermost layer may be laminated. The intermediate layer is preferably formed thicker than the uppermost layer or the lowermost layer. In particular, it is preferably formed at a ratio in the range of 80% to 99% of the entire film thickness of the conductive member, and more preferably in the range of 90% to 99%.

Particularly, in the case of a plating layer made of metal, the linear expansion coefficient is defined by the composition thereof, and therefore, the lowermost layer and the intermediate layer preferably have a linear expansion coefficient that is relatively close to that of the support substrate. For example, when SUS430 having a linear expansion coefficient of 10.4 × 10 ⁻⁶ / K is used as the support substrate, the conductive member thereon includes the following metal (main component) laminated structure: can do. From the bottom layer side, Au (0.04 to 0.1 μm) having a linear expansion coefficient of 14.2 × 10 ⁻⁶ / K, and a linear expansion coefficient of 12.8 × 10 ⁻⁶ / K as the first intermediate layer Ni (or Cu having a linear expansion coefficient of 16.8 × 10 ⁻⁶ / K) (25 to 100 μm), Au (0.01 to 0.07 μm) as the second intermediate layer, and a linear expansion coefficient of 119. A laminated structure such as Ag (2 to ⁶ μm) of 7 × 10 ⁻⁶ / K is preferable. Although Ag of the uppermost layer has a linear expansion coefficient that is significantly different from that of other layers of metal, Ag is used because priority is given to the reflectance of light from the light emitting element. Since the uppermost layer Ag has a very thin thickness, the influence on the warp is extremely weak. Therefore, there is no practical problem.

(Sealing member)
The sealing member covers the light emitting element in the recess of the base and is provided so as to be in contact with the conductive member. In addition to the light emitting element, the light receiving element, the protective element, and further electronic components such as a conductive wire are provided. It is a member that protects against dust, moisture, and external force.

  As a material for the sealing member, a material having a light-transmitting property capable of transmitting light from the light-emitting element and having light resistance that is not easily deteriorated by them is preferable. Specific examples of the material include a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition. A composition can be mentioned. Furthermore, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can also be used. Furthermore, it is not limited to these organic materials, and inorganic materials such as glass and silica sol can also be used. In addition to such materials, a colorant, a light diffusing agent, a light reflecting material, various fillers, a wavelength conversion member (fluorescent member), and the like can be included as desired. The filling amount of the sealing member may be an amount that covers the electronic component.

  The shape of the outer surface of the sealing tree member can be variously selected according to the light distribution characteristics. In FIG. 1A, the upper surface of the sealing member is a flat plane. However, the present invention is not limited to this. For example, the directivity can be adjusted by forming the upper surface into a convex lens shape, a concave lens shape, a Fresnel lens shape, or the like. Can do. In addition to the sealing member, a lens member may be provided as a separate member. Furthermore, when using a molded article containing a fluorescent member, for example, a plate-like molded article containing a fluorescent member, a dome-shaped molded article, etc., it is preferable to select a material having excellent adhesion as the sealing member. In addition to the resin composition, the fluorescent member-containing molded body may be made of an inorganic material such as glass.

(Joining member)
The bonding member is a bonding member for mounting and connecting a light emitting element, a light receiving element, a protection element, etc. directly or indirectly via a submount on a conductive member or a base. Any of the adhesive bonding members can be selected. As the insulating bonding member, an epoxy resin composition, a silicone resin composition, a polyimide resin composition, a modified resin thereof, a hybrid resin, or the like can be used. In the case of using these resins, a metal layer having a high reflectance such as an Al or Ag film or a dielectric reflecting film can be provided on the back surface of the light emitting element in consideration of deterioration due to light or heat from the light emitting element. In this case, a method such as vapor deposition, sputtering, or bonding a thin film can be used. In addition, as the conductive bonding member, a conductive paste such as silver, gold, or palladium, solder such as Au—Sn eutectic, or a brazing material such as a low melting point metal can be used. Furthermore, when using a translucent joining member among these joining members, the fluorescent member which absorbs the light from a semiconductor light-emitting element and light-emits light of a different wavelength can also be contained in it.

(Conductive wire)
Examples of the conductive wire that electrically connects the electrode of the light emitting element and the conductive member include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof. In particular, it is preferable to use gold excellent in thermal resistance.

(Wavelength conversion member)
In the sealing member, a fluorescent member that emits light having a different wavelength by absorbing at least a part of light from the light emitting element may be contained as a wavelength conversion member.

  As the fluorescent member, it is more efficient to convert the light from the light emitting element into a longer wavelength. However, the present invention is not limited to this, and various fluorescent members such as one that converts light from the light emitting element into a short wavelength or one that further converts light converted by another fluorescent member can be used. Such a fluorescent member may be formed of a single layer of a single type of fluorescent material or a single layer in which two or more types of fluorescent materials are mixed. Two or more single layers containing the same may be laminated, or two or more single layers each containing two or more kinds of fluorescent substances may be laminated.

In the case of using a semiconductor light-emitting element having a nitride-based semiconductor as a light-emitting layer as the light-emitting element, a fluorescent member that absorbs light from the light-emitting element and converts the wavelength into light having a different wavelength can be used. For example, a nitride phosphor or an oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce can be used. More specifically, (a) Eu-activated α- or β-sialon phosphor, various alkaline earth metal nitride silicates, various alkaline earth metal aluminum silicon nitrides (eg, CaSiAlN ₃ : Eu, SrAlSi ₄ N ₇ : Eu), (b) lanthanoid elements such as Eu, alkaline earth metal halogenapatites mainly activated by transition metal elements such as Mn, alkaline earth metal halosilicates, alkaline earth metal silicates, Alkaline earth metal halogen borate, alkaline earth metal aluminate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkaline earth metal silicon nitride, germanate, or (c) lanthanoids such as Ce Rare earth aluminates, rare earth silicates, alkaline earth metal rare earth silicates activated mainly by elements The salt (d) is preferably at least one selected from organic and organic complexes mainly activated by a lanthanoid element such as Eu. A YAG phosphor that is a rare earth aluminate phosphor mainly activated by a lanthanoid element such as Ce is preferable. YAG-based phosphors include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce , (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ . Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu, or the like. Furthermore, phosphors other than the above phosphors and having the same performance, function, and effect can be used.

Moreover, what apply | coated fluorescent substance to other molded objects, such as glass and a resin composition, can also be used. Furthermore, a molded body containing a phosphor can also be used. Specifically, glass containing phosphor, YAG sintered body, sintered body such as YAG and Al ₂ O ₃ , SiO ₂ , B ₂ O ₃ , crystallized inorganic bulk in which YAG is precipitated in an inorganic melt. The body can be used. A phosphor integrally formed with epoxy, silicone, hybrid resin, or the like may be used.

(Light emitting element)
In the present invention, the light-emitting element is a semiconductor element that is mounted one or more in each recess, and has a structure in which positive and negative electrodes are formed on the same surface side, or a structure in which positive and negative electrodes are formed on different surfaces, and a growth substrate. Semiconductor elements having various structures such as a structure in which different substrates are bonded to each other can be used.

A light emitting element having an arbitrary wavelength can be selected. For example, the blue, the green light emitting element, ZnSe and nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), used after using GaP be able to. As the red light emitting element, GaAlAs, AlInGaP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose.

In the case of a light emitting device having a wavelength conversion member, a nitride semiconductor capable of emitting a short wavelength that can efficiently excite the wavelength conversion member (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferred. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

(Support substrate)
The support substrate is a plate-like or sheet-like member used for forming the conductive member, and is a member that is not provided in the light-emitting device because it is removed before the light-emitting device is finally separated. In order to remove at the final stage of the process, that is, to peel off from the conductive member or the substrate, it is necessary to use a foldable member, and it is preferable to use a plate-like member having a film thickness of about 10 μm to 300 μm depending on the material.

As the support substrate, a metal plate such as stainless steel (SUS), iron, copper, silver, kovar, nickel, or a resin sheet made of polyimide to which a metal thin film can be attached is preferable. In particular, it is preferable to use various stainless steels such as altensite, ferrite, and austenite. Particularly preferred is ferritic stainless steel. Particularly preferred is 400 series or 300 series stainless steel. More ^{specifically, SUS430 (10.4 × 10 -6 /K),SUS444(10.6×10} -6 /K),SUS303(18.7×10 -6 /K),SUS304(17.3 × 10 ⁻⁶ / K) or the like is preferably used. When the 400 series stainless steel is subjected to an acid treatment as a pretreatment for plating, the surface becomes more rough than the 300 series stainless steel. Accordingly, when a plating layer is formed on 400 series stainless steel that has been subjected to acid treatment, the surface of the plating layer is also likely to be rough. Thereby, adhesiveness with resin which comprises a sealing member and a base | substrate can be improved. In addition, the surface of 300 series is hardly roughened by acid treatment. For this reason, if 300 series stainless steel is used, it is easy to improve the glossiness of the surface of the plating layer, whereby the reflectance from the light emitting element is improved and a light emitting device with high light extraction efficiency can be obtained.

  Moreover, when raising the surface gloss of a conductive member, it forms using methods, such as plating, vapor deposition, and sputtering. In order to further increase the glossiness, the surface of the support substrate is preferably smooth. For example, when SUS is used as the support substrate, the outermost surface of the conductive member having a high surface gloss can be obtained by using SUS having a relatively low crystal grain boundary in the 300s.

Moreover, in order to relieve the warp after the resin molding, the support substrate can be processed into slits, grooves and corrugations.
<Manufacturing method>
Hereinafter, the manufacturing method of the light-emitting device of this invention is demonstrated using figures.

(First step)
First, a support substrate made of a SUS plate or the like is prepared, and a resist is applied to the surface as a protective film. The thickness of the conductive member formed later can be adjusted by the thickness of the resist. The resist may be formed only on the upper surface of the support substrate or on the entire lower surface (opposite surface). Thereby, it can prevent that a conductive member is formed in a lower surface by the plating of a post process.

  The protective film (resist) to be used may be either a positive type or a negative type in the case of a resist formed by photolithography. Although a method using a positive resist is described here, a positive resist and a negative resist may be used in combination. In addition, a method of attaching a resist formed by screen printing or a sheet-like resist can be used.

  After the applied resist is dried, a mask having an opening is directly or indirectly placed on the resist and exposed to ultraviolet rays for exposure. As the ultraviolet light, a suitable wavelength can be selected depending on the sensitivity of the resist. Then, the resist which has an opening part is formed by processing with an etching agent. Here, if necessary, acid activation treatment or the like may be performed.

  Next, a conductive member is formed in the opening of the resist by electrolytic plating. At this time, by adjusting the plating conditions, the plating can be performed so as to be thicker than the thickness of the resist, and a conductive member having a protrusion on the side surface can be obtained. After plating, the resist is washed and removed, so that a plurality of pairs of conductive members separated from each other can be formed.

(Second step)
Next, a substrate having a plurality of recesses is formed. At this time, a part of the upper surface of the pair of conductive members is exposed to the bottom surface of the recess. The substrate can be formed by a method such as injection molding, transfer molding, or compression molding.

  For example, when the base is formed by transfer molding, the support substrate on which a plurality of conductive members are formed is set so as to be sandwiched between the upper and lower molds. At this time, you may set in a metal mold | die via a release sheet | seat. Resin pellets, which are base materials, are inserted into the mold, and the support substrate and the resin pellets are heated. After melting the resin pellets, pressurize and fill the mold. The heating temperature, heating time, pressure, and the like can be appropriately adjusted according to the composition of the resin used. After curing, the molded product can be obtained by taking out from the mold.

(Third step)
Next, the light emitting element is bonded onto the conductive member in the recess using a bonding member, and connected to the conductive member using a conductive wire.

(Fourth process)
Thereafter, a sealing member is formed by a method such as transfer molding, potting or printing so as to cover the light emitting element and the conductive wire.

(Fifth step)
After the sealing member is cured, the support substrate is peeled off and removed. Thereafter, the substrate is cut so as to have a plurality of recesses. As a cutting method, various methods such as dicing with a blade and dicing with a laser beam can be used.

  The light emitting device according to the present invention can easily obtain a light emitting device that is small and lightweight and has high light extraction efficiency. These light emitting devices can also be used for various display devices, lighting fixtures, and the like.

100, 200: Light emitting devices 101, 201: Base bodies 102, 202 ... Conductive member 103 ... Light emitting element 104 ... Sealing member 105 ... Conductive wires S1, S2 ... Recess H ... Through holes

Claims (6)

A light emitting element;
A substrate made of a light reflecting resin having a plurality of recesses on which the light emitting element is placed;
At least one pair of conductive members formed of a plating layer having an upper surface exposed at the bottom surface of each of the recesses and a lower surface exposed to the outside;
Have
The light emitting device, wherein the conductive member is provided so as to be separated from a conductive member provided in at least one of the adjacent concave portions.   The light emitting device according to claim 1, wherein the conductive member has a through hole in a lower surface of a side wall of the recess.   3. The light emitting device according to claim 1, wherein the conductive member has a laminated structure in which a lowermost layer, an uppermost layer, and a plurality of plating layers having intermediate layers therebetween are laminated.   The conductive member has a laminated structure in which a lowermost layer containing Au, a first intermediate layer containing Ni or Cu, a second intermediate layer containing Au, and an uppermost layer containing Ag are laminated. 3. The light emitting device according to 3.   The light emitting device according to claim 1, wherein the base includes a thermosetting resin. A first step of forming a plurality of pairs of conductive members spaced apart from each other on a support substrate;
A second step of forming a base having a plurality of recesses in which a part of the upper surface of the pair of conductive members is exposed on the bottom surface;
A third step of placing the light emitting element on the conductive member exposed on the bottom surface of the recess;
A fourth step of covering the light emitting element with a sealing member made of a translucent resin;
A fifth step of cutting the substrate at a position having a plurality of recesses after removing the support substrate;
A method for manufacturing a light emitting device.

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