JP2011040542A - Dividing method of package substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dividing method of package substrate, the method economically dividing a warped package substrate. <P>SOLUTION: The method includes: a mounting step of mounting a package substrate 2 on a fixture 20 including a holding surface for holding the package substrate 2; a holding step of operating a suction source to suck and hold the package substrate 2 by the fixture 20; and a division step of cutting and dividing the package substrate 2 held by the fixture 20 into individual packages with a cutting blade 40. The fixture includes: a plurality of recessed portions 56 formed on the holding surface to correspond to each package of the package substrate 2; a plurality of bellows suction pads 24 each disposed within each recessed portion 56 and having a suction portion protruding from the holding surface; suction paths 68 and 59 allowed to communicate with the suction source which gives suction effect to the suction pads 24; and a plurality of release grooves 22 formed on the holding surface to avoid the contact with the cutting blade 40, the holding surface being formed of at least rubber. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a package substrate dividing method in which a package substrate such as a CSP substrate is cut and divided into individual packages.

  For example, in a manufacturing process of a semiconductor package, a plurality of semiconductor chips on which circuits such as LSI are formed are mounted on a lead frame and bonded, and then sealed with a resin such as glass epoxy to obtain a CSP (Chip Size). A package substrate such as a package substrate is formed. Then, the package substrate is cut along the planned division line by the cutting device, whereby the package is divided into packages having substantially the same size as the semiconductor chip.

  In order to reduce the occurrence of warpage due to resin sealing, the package substrate has a device region (a region where a semiconductor chip exists and is resin-sealed) and a non-device region (a region where no semiconductor chip exists and is not resin-sealed). ) And are alternately adjacent.

  A cutting apparatus that cuts a package substrate includes a holding table that holds the package substrate by suction, and a cutting unit that includes a cutting blade that cuts the package substrate held by the holding table. The package substrate is mounted on the holding table via a fixing jig.

  The fixing jig is used to hold the package substrate by negative pressure. In order to hold the individual packages after being divided, a relief groove of the cutting blade is formed in an area corresponding to the division line of the package substrate to be cut. In addition, a suction port for transmitting a negative pressure is formed in a region corresponding to each package (see, for example, JP-A-2001-24003).

  When cutting package substrates with different package sizes, the package substrates with different package sizes can be cut with a single cutting device by exchanging with a fixing jig corresponding to the package substrate to be cut.

  On the other hand, when the semiconductor chip is sealed with resin, the substrate is likely to warp due to heat. Even if an attempt is made to suck and hold a warped package substrate with the holding table of the cutting device, a negative pressure leaks from a portion where the package substrate and the holding table are not in close contact, so that the package substrate cannot be sucked and held, and the package substrate has a large warp. Has the problem that it cannot be cut.

  In view of this, Japanese Patent Laid-Open No. 2000-124161 proposes a substrate dividing method for dividing a warped package substrate. In this method, the amount of warpage is reduced by dividing the package substrate into small pieces (largely dividing) in advance, and then the package substrate divided by the holding table of the cutting device is sucked and held and divided into individual packages. ing.

JP 2001-24003 A JP 2000-124161 A

  However, for a package substrate with a large amount of warpage, use a device other than a normal cutting device to divide the package substrate, or attach a tape to the package substrate and attach it to an annular frame, and fix the annular frame with a clamp. Therefore, there is a problem that the process is complicated and other devices, tapes, frames and the like are separately required, which is uneconomical.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a package substrate dividing method capable of economically dividing a warped package substrate.

  According to the present invention, there is provided a method for dividing a package substrate in which a package substrate in which a package is formed in each region partitioned by a plurality of division lines formed in a lattice shape is divided into individual packages, the package substrate A plurality of recesses formed in the holding surface so as to correspond to each package of the package substrate, and a plurality of suction portions that are respectively disposed in the recesses and protrude from the holding surface. An accordion-type suction pad, a suction path communicating with a suction source that applies a suction action to the accordion-type suction pad, and a plurality of escape grooves formed on the holding surface to avoid contact with a cutting blade, The holding surface mounts the package substrate on a fixing jig formed of at least rubber, and operates the suction source to suck the package substrate with the fixing jig. And a dividing step of dividing the package substrate held by the fixing jig into individual packages by cutting the package substrate with a cutting blade. The

  If the substrate has a warp, a large division step for dividing the package substrate into a plurality of pieces is performed before the above-described division step.

  According to the present invention, since the package substrate placed on the holding table is adsorbed by the suction pad of the fixing jig, even the warped package substrate can be sucked and held without leaking negative pressure. By making the suction pad into a bellows shape, for example, the amount of protrusion from the holding surface can be increased even with a small diameter compared to a conical suction pad, and it is possible to deal with a substrate having a smaller package size.

It is a top view of a package substrate. It is a side view which expands and shows a part of package substrate. It is a perspective view which shows a mode that a package board | substrate is mounted in a fixing jig. It is a partially broken perspective view of a cutting device. It is an expanded sectional view of a fixing jig. It is a flowchart of the division method of the present invention. It is sectional drawing of the fixing jig which shows a holding step. It is sectional drawing of the fixing jig which shows a division | segmentation step. FIG. 9A is a plan view of the package substrate, and FIG. 9B is a front view thereof. It is a top view of the package board | substrate after large division. It is a top view of the package board | substrate divided | segmented into each package.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a plan view of an example of a package substrate that is an object of the dividing method of the present invention. The package substrate 2 has, for example, a rectangular metal frame 4. In the example shown in the figure, there are three device regions 6 a and 6 b in the region surrounded by the outer peripheral surplus region 5 and the non-device region 5 a of the metal frame 4. , 6c.

  In each of the device regions 6a, 6b, 6c, a plurality of device forming portions 10 defined by first and second scheduled division lines 8a, 8b provided vertically and horizontally so as to be orthogonal to each other are defined. A plurality of electrodes 12 are formed on the forming portion 10.

  The electrodes 12 are insulated from each other by a resin molded on the metal frame 4. By cutting the first division planned line 8a and the second division planned line 8b, the electrodes 12 of each device appear on both sides thereof.

  As shown in FIG. 2, devices 14 are formed on the back surfaces of the device forming portions 10 in the device regions 6 a, 6 b, 6 c, and the electrodes included in the devices 14 and the electrodes 12 are connected. The devices 14 in the device regions 6a, 6b, and 6c are sealed with resin, and a resin sealing portion 16 is formed on the back surface of the device regions 6a, 6b, and 6c.

  The package substrate 2 configured as described above is fixed to a fixing jig 20 as shown in FIG. 3, and is divided into individual packages (devices) by cutting the dividing lines 8a and 8b.

  The fixing jig 20 has a plurality of relief grooves 22 for avoiding contact between the fixing jig 20 and the cutting blade when a cutting blade of a cutting apparatus, which will be described later, is cut into the division lines 8 a and 8 b of the package substrate 2. Are formed, and a plurality of bellows-type suction pads 24 for sucking individual devices mounted on the package substrate 2 are formed for each device 14.

  Through holes 28 are formed at the four corners of the fixing jig 20, and two protrusions are formed adjacent to the through holes 28, respectively, for a total of eight protrusions 26. The package substrate 2 is positioned and mounted on the fixing jig 20 by abutting the vicinity of the four corners of the package substrate 2 with the two protruding portions 26, respectively.

  The fixing jig 20 is placed on the suction table (holding table) 32 of the cutting device 30 shown in FIG. 4 in a state where each through hole 28 is fitted to the protruding portion 34 of the suction table 32. The suction table 32 is movable in the X-axis direction and is rotatable, and a suction part 36 communicating with a suction source (not shown) is provided.

  When the fixing jig 20 on which the package substrate 2 is placed is placed on the suction table 32 and a suction force is applied from the suction portion 36, each suction force is applied to the suction pad 24 of the fixing jig 20 shown in FIG. Acts, and the package substrate 2 is sucked and held.

  The cutting device 30 shown in FIG. 4 is provided with a cutting means (cutting unit) 42 configured by attaching a cutting blade 40 to the tip of a spindle 38. Furthermore, an alignment unit 44 that detects a scheduled cutting line of the package substrate 2 so as to be movable in the Y-axis direction and the Z-axis direction integrally with the cutting unit 42 is provided.

  The package substrate 2 held on the suction table 32 via the fixing jig 20 is positioned immediately below the alignment means 44 by moving in the + X-axis direction, and is captured by an imaging unit 46 such as a CCD camera constituting the alignment means 44. The surface is imaged and a division line 8a or 8b to be cut is detected. After the alignment is completed, the cutting blade 38 is moved in the Y-axis direction, and the planned dividing line 8a or 8b and the cutting blade 38 are aligned in the Y-axis direction.

  Next, the detailed structure of the fixing jig 20 will be described with reference to FIG. FIG. 5 shows a cross-sectional view of the state in which the fixing jig 20 is mounted on the suction table 32. The fixing jig 20 includes a holding plate 50. The holding plate 50 includes a plurality of round holes 52 having a first diameter, and a first diameter larger than the first diameter formed continuously from the round holes 52. A plurality of round holes 54 having a diameter of 2 and a large concave portion 56 communicating with each round hole 54 are formed.

  A suction fitting 58 having a suction path 59 is mounted in each round hole 52, and a bellows-type suction pad 24 made of resin is mounted on each suction fitting 58. A holding member 62 having a holding surface 62 a made of rubber is mounted in the recess 56.

  The holding member 62 has a plurality of round holes 64 communicating with the respective round holes 54. A concave portion is defined by the continuously formed round hole 54 and round hole 64, and the bellows type suction pad 24 is disposed in the concave portion. The bellows type suction pad 24 attached to the suction fitting 58 protrudes above the holding surface 62 a through the round hole 64 of the holding member 62.

  On the holding surface 62a of the holding member 62, a plurality of cutting blades 40 of the cutting device are used to avoid contact between the fixing jig 20 and the cutting blade 40 when the cutting blade 40 of the cutting device is cut into the division lines 8a and 8b of the package substrate 2. A relief groove 22 is formed.

  When the fixing jig 20 is mounted on the suction table 32, a suction path 68 is formed between the fixing jig 20 and the suction table 32. Therefore, the bellows type suction pad 24 is connected to the suction source 72 through the suction paths 59 and 68 and the suction part 36 of the suction table 32.

  FIG. 6 shows a flowchart of the method for dividing the package substrate according to the embodiment of the present invention using the fixing jig 20 configured as described above. First, before performing the mounting step of step S10, the fixing jig 20 is mounted on the suction table 32 of the cutting device 30 shown in FIG. 4 in a state where each through hole 28 is fitted to the protruding portion 34 of the suction table 32. Put.

  In step S10, the package substrate 2 is placed on the fixing jig 20 thus mounted on the suction table 32 in this manner. As shown in FIG. 3, the fixing jig 20 has eight protrusions 20 for positioning, so that the vicinity of the four corners of the package substrate 2 is brought into contact with two adjacent protrusions 26, respectively. As a result, the package substrate 2 is positioned and mounted on the fixing jig 20.

  Next, the holding step of Step S11 is performed. That is, by operating the suction source 72, a suction force acts on the bellows type suction pad 24 of the fixing jig 20 via the suction paths 59 and 68 and the suction part 36 of the suction table 32, and the package substrate 2 is bellows. It is sucked and held by the mold suction pad 24.

  In this holding step, even if the package substrate 2 is greatly warped as shown in FIG. 9B, the package substrate 2 is warped because the package substrate 2 is sucked and held by the bellows type suction pad 24 having a large protruding amount from the holding surface 62a. The package substrate 2 can also be sucked and held without leaking negative pressure.

  Next, the process proceeds to step S12, and the package substrate 2 held by the fixing jig 20 is cut by the cutting blade 40 and divided into a plurality of pieces, for example, four pieces as shown in FIG. Reference numeral 76 denotes a large-divided machining groove.

  Thus, the amount of warpage can be reduced by dividing the package substrate 2 into large parts. As a result, the large-divided package substrate 2 can be sucked and held by the bellows type suction pad 24 without leaking negative pressure.

  Next, the process proceeds to step S13, and the package substrate 2 held by the fixing jig 20 is cut by the cutting blade 40 and divided into individual chips. The state of being divided into individual chips in this way is shown in FIG.

  In this division step, the alignment means 44 detects the planned division lines 8a and 8b and performs alignment. After the alignment is completed, the cutting blade 40 is moved in the Y-axis direction to align the first division planned line 8a and the cutting blade 40 in the Y-axis direction, and the aligned first divided planned line 8a is cut.

  The package substrate 2 is cut along all the first division planned lines 8a extending in the longitudinal direction. Next, the suction table 32 is rotated by 90 degrees to cut the second scheduled division line 8b orthogonal to the first scheduled division line 8a, thereby dividing the package substrate 2 into individual chips.

2 Package substrate 6a, 6b, 6c Device area 8a, 8b Scheduled division line 20 Fixing jig 22 Escape groove 24 Bellows type suction pad 30 Cutting device 32 Suction table 40 Cutting blade 62a Holding surface

Claims (2)

A package substrate dividing method for dividing a package substrate in which a package is formed in each region partitioned by a plurality of division lines formed in a lattice shape into individual packages,
A holding surface for holding the package substrate, and a plurality of recesses formed on the holding surface so as to correspond to each package of the package substrate, and the suction portion projecting from the holding surface respectively disposed in the recess A plurality of bellows-type suction pads, a suction path communicating with a suction source that applies a suction action to the bellows-type suction pads, and a plurality of relief grooves formed on the holding surface to avoid contact with the cutting blade A mounting step of mounting the package substrate on a fixing jig formed of at least rubber.
A holding step of operating the suction source to suck and hold the package substrate with the fixing jig;
A dividing step of cutting the package substrate held by the fixing jig into individual packages by cutting with a cutting blade;
A method of dividing a package substrate, comprising: The package substrate has a warp,
The package substrate dividing method according to claim 1, further comprising a large dividing step of dividing the package substrate into a plurality of parts before performing the dividing step.

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