JP2010280791A - Heat-conductive molding, heat-conductive sheet, and method for producing heat-conductive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-conductive molding and a heat-conductive sheet having low thermal resistance and excellent adhesion, lamination performance, and piercing strength. <P>SOLUTION: The heat-conductive molding includes: (A) a hydrogenated copolymer that is obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit and that satisfies the following (a) to (d); and (B) a heat-conductive filler, wherein the heat-conductive molding has surface glossiness (60-degree specular glossiness) based on JIS K7105 of 15% or more. (a) A content of a vinyl aromatic compound is more than 50 mass% and equal to or less than 90 mass%; (b) an amount of a vinyl aromatic compound polymer block is 40 mass% or less; (c) a weight-average molecular weight is 50,000-1,000,000; and (d) 10% or more of double bonds based on a conjugated diene compound are hydrogenated. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a thermally conductive molded body, a thermally conductive sheet, and a method for producing a thermally conductive sheet.

  Conventionally, with the spread of digital home appliances, there is an increasing demand for higher speed and higher functionality of electrical and electronic devices. Semiconductor devices such as LSI (Large Scale Integrated Circuit) and CPU (Central Processing Unit) that perform electronic control in electrical and electronic devices only increase power consumption due to increased computer integration and faster operation. Besides, the calorific value is also increasing. In order to solve problems and the like that occur in a semiconductor element, it is necessary to dissipate heat generated from a heating element such as a semiconductor element.

  As a heat dissipation method in electric and electronic devices, a method of attaching cooling parts such as a heat sink and forcibly cooling the heat sink with a cooling fan or the like is used. For small electric devices such as notebook personal computers and electronic devices that are mounted with high density, a method of dissipating heat by applying silicone grease is performed due to restrictions such as a small space for installing a cooling fan. ing.

  Thermally conductive sheets are used to meet the demand for higher performance of electrical and electronic devices. The heat conductive sheet is used by being sandwiched between a hard cooling component such as a heat sink and a hard heating element, and is a soft sheet effective for improving the proximity of both. If both are close, heat can be efficiently transferred to the cooling component.

  As the heat conductive sheet, a heat conductive sheet in which silicone rubber is mixed with a filler having relatively high heat conductivity is used. This silicone rubber thermal conductive sheet is easy to handle. Patent Document 1 discloses a heat conductive material using aluminum hydroxide as a synthetic rubber. Patent Document 2 discloses a heat dissipating composition in which aluminum hydroxide and a softening agent are blended with a styrenic thermoplastic elastomer.

JP 2000-150740 A JP 2004-146106 A

  However, the silicone rubber thermal conductive sheet has a problem that the number of steps increases because the silicone rubber itself as a raw material is expensive and a curing step is required. Silicone rubber contains low molecular weight siloxane in the resin. For this reason, when a silicone rubber thermal conductive sheet is used by being attached to a heating element, a low molecular siloxane gas is generated. When this gas adheres to electrode contacts or the like to generate silicon dioxide, contact failure may occur.

  In addition, a sheet made by mixing a synthetic rubber or styrene thermoplastic elastomer with a high thermal conductive filler shrinks due to crystallization of the synthetic rubber or styrene thermoplastic elastomer, so the surface of the sheet formed during heating and melting decreases in temperature. Accordingly, the sheet surface is less likely to be smooth, and the contact thermal resistance between the sheet and the heating element may increase.

  The thermal conductive sheet is required to satisfy various physical properties in addition to the thermal conductivity. First, the heat conductive sheet is required to reduce the thermal resistance between the heating element and the cooling component. And it is calculated | required that the contact resistance of a sheet | seat surface and a heat generating body etc. is low.

  Moreover, when using a heat conductive sheet closely_contact | adhered to an electronic device, if an adhesive layer is provided in a heat conductive sheet, it will become a thermal resistance itself and is unpreferable. Therefore, the heat conductive sheet itself is required to be sticky.

  Furthermore, when giving strong adhesiveness to a heat conductive sheet, laminating | stacking an adhesion layer on a heat conductive sheet is performed. In that case, in order to prevent bubbles from entering between the heat conductive sheet and the adhesive layer, the heat conductive sheet itself is required to have surface smoothness.

  Furthermore, since an electronic component has many pointed heads, a puncture strength that does not break even when a heat conductive sheet is pressed against the pointed heads is required.

  Therefore, the present invention has been made in view of the above-mentioned matters, and has a low thermal resistance, a thermal conductive molded body, a thermal conductive sheet, and a thermal conductive molding that are excellent in adhesiveness, laminating property, and puncture strength. It aims at providing the manufacturing method of a body.

  As a result of diligent research to solve the above problems, the present inventors have found that a hydrogenated copolymer obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit that is substantially free of a crystallization peak. By controlling the surface glossiness (60 ° specular glossiness) in accordance with JIS K7105 to be equal to or higher than a predetermined value, including coalescence and a thermally conductive filler, the thermal resistance is low, and the adhesiveness and laminating properties And it discovered that the heat conductive molded object and heat conductive sheet excellent in puncture strength were obtained, and came to complete this invention.

That is, the present invention provides the following.
[1]
(A) a hydrogenated copolymer satisfying the following (a) to (d) obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit;
(B) a heat conductive filler,
A thermally conductive molded article having a surface glossiness (60-degree specular glossiness) of 15% or more according to JIS K7105.
(A) The content of the vinyl aromatic compound is more than 50% by mass and 90% by mass or less,
(B) The amount of the vinyl aromatic compound polymer block is 40% by mass or less,
(C) a weight average molecular weight of 50,000 to 1,000,000,
(D) 10% or more of the double bond based on the conjugated diene compound is hydrogenated.
[2]
The heat conductive molded object of [1] whose content of the said (B) component in a molded object is 40-95 volume%.
[3]
Furthermore, (C) The heat conductive molded object of [1] or [2] containing a rubber softener.
[4]
The heat conductive molded article according to [3], wherein the content of the component (C) is 50% by mass or less based on the total amount of the component (A) and the component (C).
[5]
The heat conductive molded article according to any one of [1] to [4], wherein the content of the vinyl aromatic compound polymer block in the component (A) is less than 10% by mass.
[6]
The heat conductive molded article according to any one of [1] to [4], wherein the amount of the vinyl aromatic compound polymer block in the component (A) is 10 to 40% by mass.
[7]
The thermal conductive molding according to any one of [1] to [6], wherein the component (B) includes any one selected from the group consisting of metal oxides, metal hydroxides, metal nitrides, and metal carbides. body.
[8]
The heat conductive sheet formed by shape | molding the heat conductive molded object in any one of [1]-[7] into a sheet form.
[9]
(A) a hydrogenated copolymer satisfying the following (a) to (d) obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit; and (B) a thermally conductive filler. A step of heating and melting the resin composition to be formed into a molded body, and pressing the molded body to a surface of a transfer material having a molded body temperature of 50 ° C. or higher and a surface glossiness of 15% or higher in accordance with JIS K7105 Thereafter, a heat comprising a step of obtaining a molded body having a surface having a surface glossiness of 15% or more according to JIS K7105 by pulling the molded body away from the surface of the transfer material at a molded body temperature of less than 50 ° C. A method for producing a conductive molded body.
(A) The content of the vinyl aromatic compound is more than 50% by mass and 90% by mass or less,
(B) The amount of the vinyl aromatic compound polymer block is 40% by mass or less,
(C) a weight average molecular weight of 50,000 to 1,000,000,
(D) 10% or more of the double bond based on the conjugated diene compound is hydrogenated.

  According to this invention, it can be set as the heat conductive molded object and heat conductive sheet which were not only excellent in low heat resistance but excellent in adhesiveness, laminating property, and puncture strength.

It is the schematic of the roll structure used in the Example.

  Hereinafter, a mode for carrying out the present invention (hereinafter simply referred to as “the present embodiment”) will be described in detail. The following embodiment is an exemplification of the present invention and is not intended to limit the present invention to the following contents. The present invention can be implemented with appropriate modifications within the scope of the gist thereof.

The thermally conductive molded body of this embodiment is
(A) a hydrogenated copolymer satisfying the following (a) to (d) obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit; (B) a thermally conductive filler; Is a thermally conductive molded article having a surface glossiness (60-degree specular glossiness) of 15% or more in accordance with JIS K7105.
(A) Content of vinyl aromatic compound exceeds 50 mass% and is 90 mass% or less.
(B) The amount of the vinyl aromatic compound polymer block is 40% by mass or less.
(C) The weight average molecular weight is 50,000 to 1,000,000.
(D) 10% or more of the double bond based on the conjugated diene compound is hydrogenated.

<(A) component>
In the present embodiment, (A) a hydrogenated copolymer obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit is used.

  The content of the vinyl aromatic compound in the hydrogenated copolymer (A) obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit is more than 50% by mass and preferably 90% by mass or less, preferably It is more than 50% by weight and 88% by weight or less, more preferably more than 50% by weight and 86% by weight or less. By setting the content of the vinyl aromatic compound in the above range, a molded article excellent in flexibility, abrasion resistance, scratch resistance, strength, and the like can be obtained.

  The component (A) may contain a hydrogenated vinyl aromatic compound. The content of the vinyl aromatic compound in the hydrogenated copolymer is also the hydrogenated vinyl aromatic compound. Shall be included. In the present embodiment, the content of the vinyl aromatic unit can be measured using an ultraviolet spectrophotometer. The content of the vinyl aromatic compound in the hydrogenated copolymer can be determined from the content of the vinyl aromatic compound in the copolymer before hydrogenation.

  In this embodiment, (A) a hydrogenated copolymer obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit is a copolymer including a polymer block composed of a vinyl aromatic unit. In this case, the content of the vinyl aromatic compound polymer block is preferably 40% by mass or less, more preferably 3 to 40% by mass, and still more preferably 5 to 35% by mass. By setting the content of the vinyl aromatic compound polymer block within the above numerical range, a molded article excellent in flexibility and blocking resistance can be obtained.

  In the case of a heat conductive molded body having more excellent flexibility, the content of the vinyl aromatic compound polymer block is preferably less than 10% by mass, more preferably 8% by mass, based on the total amount of the component (A). Less than, more preferably less than 5% by mass.

  Further, when it is desired to make the copolymer excellent in blocking resistance as a hydrogenated copolymer or the like, the content of the vinyl aromatic compound polymer block is preferably 10 to 40% by mass with respect to the total amount of the component (A), More preferably, it is 13-37 mass%, More preferably, it is 15-35 mass%.

  Measurement of the content of the vinyl aromatic compound polymer block is, for example, a method in which osmium tetroxide is used as a catalyst to oxidatively decompose the copolymer before hydrogenation with tertiary butyl hydroperoxide (IM KOLTHOFF, et al The mass of the vinyl aromatic hydrocarbon polymer block component obtained by the method described in J. Polym. Sci. 1, 429 (1946; hereinafter sometimes referred to as “KOLTHOFF method”) (however, the average The vinyl aromatic hydrocarbon polymer component having a degree of polymerization of about 30 or less is excluded.

  Content of block component of vinyl aromatic hydrocarbon polymer (mass%) = {(mass of vinyl aromatic hydrocarbon polymer block component in copolymer before hydrogenation / mass of copolymer before hydrogenation) )} × 100

  In addition, the block ratio of the vinyl aromatic unit in the component (A) is preferably less than 50% by mass, more preferably 20% by mass or less, and further preferably 18% by mass or less. By setting the block ratio of the vinyl aromatic unit within the above numerical range, it is possible to obtain a molded article with better flexibility. The block ratio of vinyl aromatic units refers to the ratio of the content of polymer blocks composed of vinyl aromatic units to the total amount of vinyl aromatic units in the hydrogenated copolymer of (A).

  The weight average molecular weight of the hydrogenated copolymer as the component (A) is 50,000 to 1,000,000, preferably 80,000 to 800,000, and more preferably 130,000 to 500,000. When the weight average molecular weight of the hydrogenated copolymer is 50,000 or more, excellent toughness can be imparted, and when it is 1,000,000 or less, excellent moldability can be imparted. Furthermore, since content of a low molecular weight component can be reduced by making a weight average molecular weight into the said range, it can be set as a heat conductive molded object with few volatile components. As a result, it is possible to suppress the generation of volatile gas even when it is attached to a heating element or the like.

  When the hydrogenated copolymer having a vinyl aromatic compound polymer block content of 10 to 40% by mass is used, the weight average molecular weight is more than 100,000 and less than 500,000, preferably 130,000 to 400,000, Preferably it is 150,000 to 300,000.

  In this embodiment, (A) molecular weight distribution (Mw / Mn) of a hydrogenated copolymer obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit (weight relative to number average molecular weight (Mn)) The ratio of the average molecular weight (Mw) is preferably from 1.01 to 8.0, more preferably from 1.1 to 6.0, and even more preferably from 1.1 to 5.0 in terms of moldability. .

  The shape of the molecular weight distribution measured by gel permeation chromatography (GPC) is not particularly limited, and may have a polymodal molecular weight distribution in which two or more peaks (peaks) exist. Hydrogenated copolymers having a modal molecular weight distribution are preferred.

  The weight average molecular weight of the hydrogenated copolymer as component (A) was measured by gel permeation chromatography (GPC), and the molecular weight of the chromatogram peak was determined from a calibration curve obtained from measurement of commercially available standard polystyrene ( The weight average molecular weight determined using the peak molecular weight of standard polystyrene). Similarly, the molecular weight distribution of a copolymer comprising a conjugated diene unit and a vinyl aromatic unit can also be determined from measurement by GPC.

The component (A) is a hydrogenated product of a copolymer composed of a conjugated diene unit and a vinyl aromatic unit, and the hydrogenation rate of the unsaturated double bond based on the conjugated diene unit in the copolymer is 10% or more, Preferably it is 20% or more, More preferably, it is 30% or more. When the hydrogenation rate is 10% or more, good heat resistance can be imparted without lowering flexibility, strength, and elongation due to thermal deterioration.
In particular, in the case of obtaining a thermally conductive molded article having excellent weather resistance, the hydrogenation rate is preferably 75% or more, more preferably 85% or more, and further preferably 90% or more.
When the hydrogenated copolymer is crosslinked, the hydrogenation rate is preferably 98% or less, more preferably 95% or less, and still more preferably 90% or less.

  Furthermore, when obtaining a heat conductive molded article having excellent heat resistance, the hydrogenation rate of the vinyl bond of the hydrogenated copolymer is preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more. is there.

  Here, the hydrogenation rate of vinyl bonds refers to the proportion of vinyl bonds that have been hydrogenated among the vinyl bonds in the conjugated diene incorporated in the copolymer before hydrogenation.

  (A) Hydrogenation rate of aromatic double bond based on vinyl aromatic in hydrogenated copolymer obtained by adding hydrogen to copolymer comprising conjugated diene unit and vinyl aromatic unit is not particularly limited. , Preferably 50% or less, more preferably 30% or less, and still more preferably 20% or less.

  The hydrogenation rate of aromatic double bonds based on vinyl aromatic in the hydrogenated copolymer as component (A) is the aromatic double bond of vinyl aromatic contained in the copolymer before hydrogenation The ratio of the hydrogenated aromatic double bond of the hydrogenated copolymer with respect to.

  Here, the total hydrogenation rate of the unsaturated double bond based on the conjugated diene compound means that the hydrogenated copolymer was hydrogenated with respect to the conjugated diene double bond contained in the copolymer before hydrogenation. The ratio of double bonds.

  The hydrogenation rate of the hydrogenated copolymer can be measured using a nuclear magnetic resonance apparatus (NMR). The vinyl bond content can be measured using a nuclear magnetic resonance apparatus (NMR).

  The hydrogenated copolymer used in the present embodiment is preferably a hydrogenated product having substantially no crystallization peak in the temperature range of −50 to 100 ° C. in the differential scanning calorimetry (DSC method). Here, substantially no crystallization peak exists in the temperature range of −50 to 100 ° C. when no peak due to crystallization appears in this temperature range or when a peak due to crystallization is observed. The crystallization peak calorific value in the crystallization is less than 3 J / g, preferably less than 2 J / g, more preferably less than 1 J / g, and particularly preferably no crystallization peak calorie.

  The peak of the loss tangent (tan δ) in the dynamic viscoelastic spectrum of the hydrogenated copolymer obtained by adding hydrogen to the copolymer consisting of (A) a conjugated diene unit and a vinyl aromatic unit used in this embodiment. It is preferable that at least one exists in -30-80 degreeC, More preferably, it is -20-70 degreeC, More preferably, it is -20-50 degreeC. By having at least one tan δ peak in the range of −30 to 80 ° C., a copolymer having excellent flexibility and toughness can be obtained.

In this embodiment, the structure of the hydrogenated copolymer is not particularly limited, and any structure can be used. However, what is particularly recommended is at least one selected from the following general formulas (a) to (e): It is a hydrogenated product of a copolymer having a structure.
The hydrogenated copolymer used in the present embodiment may be any mixture composed of a hydrogenated copolymer having a structure represented by the following general formulas (A) to (E).
Further, a vinyl aromatic compound polymer may be mixed with the hydrogenated copolymer.

(I) X
(B) XY
(C) XYX
(D) (XY) _m -Z
_{(E) (X-Y) n -Z} -Y p
(Where X is a random copolymer block of a conjugated diene and a vinyl aromatic compound, Y is a vinyl aromatic compound polymer block, m is an integer of 2 or more, and n and p are each 1) (It is an integer above. Z represents a coupling agent residue.)

  In the general formulas (a) to (e), the vinyl aromatic hydrocarbons in the random copolymer block X may be distributed uniformly or in a tapered shape. In the copolymer block X, a plurality of portions where vinyl aromatic hydrocarbons are uniformly distributed and / or a portion where they are distributed in a tapered shape may coexist. M is 2 or more, preferably an integer of 2 to 10, and n and p are each 1 or more, preferably an integer of 1 to 10.

  By making the block X have a random structure of a conjugated diene and a vinyl aromatic, the crystal portion in the copolymer can be reduced or eliminated as much as possible, and a large amount of filler can be mixed.

  In the present embodiment, the conjugated diene unit is a diolefin having a pair of conjugated double bonds. For example, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1 1,3-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 1,3-hexadiene, etc., and particularly common examples include 1,3-butadiene and isoprene. These may be used alone or in combination of two or more.

  Examples of the vinyl aromatic unit include styrene, α-methylstyrene, p-methylstyrene, divinylbenzene, 1,1-diphenylethylene, N, N-dimethyl-p-aminoethylstyrene, N, N-diethyl. -P-aminoethylstyrene etc. are mentioned, These may use not only 1 type but 2 or more types.

  (A) Microstructure of conjugated diene portion of hydrogenated copolymer obtained by adding hydrogen to copolymer consisting of conjugated diene unit and vinyl aromatic unit used in this embodiment (ratio of cis, trans, vinyl) Is not particularly limited, and can be arbitrarily changed by using a polar compound described later.

  When 1,3-butadiene is used as the conjugated diene, the 1,2-vinyl bond content is 5 to 80% by mass, preferably 10 to 60% by mass, based on 100% by mass of the conjugated diene moiety.

  When isoprene is used as the conjugated diene, or when 1,3-butadiene and isoprene are used in combination, the total content of 1,2-vinyl bonds and 3,4-vinyl bonds is preferably 3 to 75%, More preferably, it is 5 to 60%. In this embodiment, the total content of 1,2-vinyl bonds and 3,4-vinyl bonds (however, when 1,3-butadiene is used as the conjugated diene, 1,2-vinyl bonds are contained. Amount) is called “vinyl bond content”.

  (A) The vinyl bond content based on a conjugated diene in a hydrogenated copolymer obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit can be measured by a nuclear magnetic resonance apparatus (NMR). .

  In this embodiment, the difference between the maximum value and the minimum value of the vinyl bond content in the copolymer chain before hydrogenation is less than 10%, preferably 8% or less, more preferably 6% or less. The vinyl bonds in the copolymer chain may be distributed uniformly or in a tapered shape. Here, the difference between the maximum value and the minimum value of the vinyl bond content is the difference between the maximum value and the minimum value of the vinyl bond content determined by the polymerization conditions, that is, the type, amount and polymerization temperature of the vinyl content modifier. It is.

The difference between the maximum value and the minimum value of the vinyl bond content in the conjugated diene polymer chain can be controlled, for example, by the polymerization temperature during the polymerization of the conjugated diene or during the copolymerization of the conjugated diene and the vinyl aromatic compound.
When the type and amount of a vinyl amount modifier such as a tertiary amine compound or an ether compound is constant, the vinyl bond content incorporated into the polymer chain during polymerization is determined by the polymerization temperature. Therefore, a polymer polymerized isothermally becomes a polymer in which vinyl bonds are uniformly dispersed.
In contrast, polymers polymerized at elevated temperatures become polymers with different vinyl bond contents, such as high vinyl bond content in the initial (polymerization at low temperature) and low vinyl bond content in the latter half (polymerization at high temperature). .
A hydrogenated copolymer having a specific structure can be obtained by adding hydrogen to the copolymer having such a structure.

In the present embodiment, the content of the vinyl aromatic unit can be known using an ultraviolet spectrophotometer.
Further, the amount of the vinyl aromatic unit polymer block can be known by the KOLTHOFF method described above.
The vinyl bond content based on the conjugated diene in the copolymer before hydrogenation can be known using a nuclear magnetic resonance apparatus (NMR) or the like.
The hydrogenation rate of the hydrogenated copolymer can be known using a nuclear magnetic resonance apparatus (NMR) or the like.

  In the present embodiment, the molecular weight of the hydrogenated copolymer is measured by gel permeation chromatography (GPC), and the molecular weight of the peak of the chromatogram is obtained from a standard curve obtained by measuring a standard polystyrene (standard polystyrene). The weight average molecular weight was determined using the following formula.

  In this embodiment, (A) the copolymer before hydrogenation of the hydrogenated copolymer obtained by adding hydrogen to the copolymer composed of the conjugated diene unit and the vinyl aromatic unit is, for example, in a hydrocarbon solvent. It can be obtained by anion living polymerization using an initiator such as an organic alkali metal compound.

  Examples of the hydrocarbon solvent include aliphatic hydrocarbons such as n-butane, isobutane, n-pentane, n-hexane, n-heptane, and n-octane, and alicyclic groups such as cyclohexane, cycloheptane, and methylcycloheptane. Hydrocarbons and aromatic hydrocarbons such as benzene, toluene, xylene and ethylbenzene.

  In addition, as the initiator, aliphatic hydrocarbon alkali metal compounds, aromatic hydrocarbon alkali metal compounds, organic amino alkalis generally known to have anionic polymerization activity for conjugated diene compounds and vinyl aromatic compounds. Examples of the alkali metal include lithium, sodium, and potassium. Suitable organic alkali metal compounds are aliphatic and aromatic hydrocarbon lithium compounds having 1 to 20 carbon atoms, a compound containing one lithium in one molecule, and a dilithium compound containing a plurality of lithiums in one molecule , Trilithium compounds, and tetralithium compounds.

  Specifically, n-propyllithium, n-butyllithium, sec-butyllithium, tert-butyllithium, n-pentyllithium, n-hexyllithium, benzyllithium, phenyllithium, tolyllithium, diisopropenylbenzene and sec -Reaction product of -butyllithium, further reaction product of divinylbenzene, sec-butyllithium and a small amount of 1,3-butadiene.

  Further, 1- (t-butoxy) propyllithium disclosed in US Pat. No. 5,708,092 and a lithium compound in which 1 to several molecules of isoprene monomer are inserted to improve its solubility, British Patent 2 Siloxy group-containing alkyllithium such as 1- (t-butyldimethylsiloxy) hexyllithium disclosed in US Pat. No. 5,241,239, amino group-containing alkyl disclosed in US Pat. No. 5,527,753 Aminolithiums such as lithium, diisopropylamidolithium and hexamethyldisilazide lithium can also be used.

  In this embodiment, when an organic alkali metal compound is used as a polymerization initiator to copolymerize a conjugated diene unit and a vinyl aromatic unit, a vinyl bond (1, 2 or 3, 4 bond) resulting from the conjugated diene unit incorporated in the polymer ) And a tertiary amine compound or an ether compound is preferably added as an adjusting agent in order to adjust the random copolymerizability between the conjugated diene unit and the vinyl aromatic unit.

  As the tertiary amine compound, a general formula RR′R ″ N (wherein R, R ′ and R ″ each independently represents a hydrocarbon group having 1 to 20 carbon atoms or a tertiary amino group). It is a hydrocarbon group. For example, trimethylamine, triethylamine, tributylamine, N, N-dimethylaniline, N-ethylpiperidine, N-methylpyrrolidine, N, N, N ′, N′-tetramethylethylenediamine, N, N, N ′, N′— Tetraethylethylenediamine, 1,2-dipiperidinoethane, trimethylaminoethylpiperazine, N, N, N ′, N ″, N ″ -pentamethylethylenetriamine, N, N′-dioctyl-p-phenylenediamine and the like It is done.

  The ether compound is selected from linear ether compounds and cyclic ether compounds, and the linear ether compound is ethylene such as dimethyl ether, diethyl ether, diphenyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, or ethylene glycol dibutyl ether. Examples include dialkyl ether compounds of glycol, dialkyl ether compounds of diethylene glycol such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol dibutyl ether. Cyclic ether compounds include tetrahydrofuran, dioxane, 2,5-dimethyloxolane, 2,2,5,5-tetramethyloxolane, 2,2-bis (2-oxolanyl) propane, and alkyl ethers of furfuryl alcohol. Etc.

  In this embodiment, the method of copolymerizing a conjugated diene compound and a vinyl aromatic compound using an organic alkali metal compound as a polymerization initiator may be batch polymerization, continuous polymerization, or a combination thereof. . In particular, the continuous polymerization method is preferable in that the molecular weight distribution is adjusted to a preferable appropriate range.

The polymerization temperature when copolymerizing the conjugated diene compound and the vinyl aromatic compound is not particularly limited, and is preferably 0 ° C to 180 ° C, more preferably 30 ° C to 150 ° C.
The time required for the polymerization varies depending on the conditions, but is usually within 48 hours, particularly preferably 0.1 to 10 hours.
The polymerization atmosphere is preferably an inert gas atmosphere such as nitrogen gas.

  The polymerization pressure is not particularly limited as long as the polymerization pressure is in a range sufficient to maintain the monomer and solvent in a liquid phase within the above polymerization temperature range. Further, it is preferable to take care not to mix impurities that inactivate the catalyst and living polymer, for example, water, oxygen, carbon dioxide gas, etc. in the polymerization system.

  In this embodiment, a coupling reaction can be performed by adding a necessary amount of a bifunctional or higher functional coupling agent at the end of the polymerization.

  Any known bifunctional coupling agent may be used, and is not particularly limited. Examples thereof include dihalogen compounds such as dimethyldichlorosilane and dimethyldibromosilane, and acid esters such as methyl benzoate, ethyl benzoate, phenyl benzoate, and phthalates.

In addition, any known trifunctional or higher polyfunctional coupling agent may be used without any particular limitation. For example, trihydric or higher polyalcohols, polyepoxy compounds such as epoxidized soybean oil, diglycidyl bisphenol A, general formula R _4-n SiX _n (where R is a hydrocarbon group having 1 to 20 carbon atoms, X Is a halogenated silicon compound, and n is 3 or 4), for example, methylsilyl trichloride, t-butylsilyltrichloride, silicon tetrachloride and bromides thereof, and the general formula R _4-n SnX _n ( However, R is a hydrocarbon group having 1 to 20 carbon atoms, X is a halogen, n is a halogenated compound represented by 3 or 4), such as methyltin trichloride, t-butyltin trichloride, tin tetrachloride and the like Valent halogen compounds. Dimethyl carbonate or diethyl carbonate can also be used.

(Denaturation)
In this embodiment, (A) at least one polymer of a polymer as a copolymer before hydrogenation of a hydrogenated copolymer obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit A modified copolymer in which a polar group-containing atomic group is bonded to the chain can be used. The modified copolymer is not particularly limited as long as it has a polar group-containing atomic group in the polymer chain.

  Examples of polar group-containing atomic groups include hydroxyl groups, carboxyl groups, carbonyl groups, thiocarbonyl groups, acid halide groups, acid anhydride groups, carboxylic acid groups, thiocarboxylic acid groups, aldehyde groups, thioaldehyde groups, and carboxylic acid esters. Group, amide group, sulfonic acid group, sulfonic acid ester group, phosphoric acid group, phosphoric acid ester group, amino group, imino group, nitrile group, pyridyl group, quinoline group, epoxy group, thioepoxy group, sulfide group, isocyanate group, Examples include isothiocyanate group, silicon halide group, silanol group, alkoxysilicon group, tin halide group, alkoxytin group, and phenyltin group. Among them, preferably, the polymer chain has at least one of a hydroxyl group, an amino group, an epoxy group, a silanol group, and an alkoxysilane group, and more preferably at least one of a hydroxyl group, an amino group, and an epoxy group. In the polymer chain.

  The modified copolymer is obtained by reacting a compound having these polar group-containing atomic groups at the end of polymerization of the copolymer. As the compound having a polar group-containing atomic group, specifically, a modification treatment agent described in Japanese Patent Publication No. 4-39495 can be used.

  A preferred modified hydrogenated copolymer used in this embodiment is a modified hydrogenated copolymer in which an atomic group having at least one functional group selected from a hydroxyl group, an epoxy group, an amino group, a silanol group, and an alkoxysilane group is bonded. It is a coalescence. Such a modified hydrogenated copolymer is obtained by adding a functional group-containing modifier to the living end of a copolymer obtained by the above-described method using an organolithium compound as a polymerization catalyst, thereby adding a hydroxyl group to the copolymer. , A modified product in which at least one atomic group having at least one functional group selected from an epoxy group, an amino group, a silanol group, and an alkoxysilane group is bonded (hereinafter, referred to as “modified copolymer”). ) Can be obtained by adding hydrogen.

  As another method for obtaining a modified copolymer, a hydrogenated copolymer before modification is reacted with an organic alkali metal compound such as an organic lithium compound (metalation reaction), and a functional group is added to the copolymer to which an organic alkali metal is added. The method of carrying out addition reaction of the containing modifier | denaturant is mentioned. Depending on the type of modifier, the hydroxyl group and amino group may generally be an organometallic salt at the stage of reaction of the modifier, but in that case, treatment with a compound having active hydrogen such as water or alcohol. By doing so, a hydroxyl group, an amino group, or the like can be obtained.

  In the present embodiment, the atomic group preferred as the atomic group having at least one functional group selected from a hydroxyl group, an epoxy group, an amino group, a silanol group, and an alkoxysilane group is an atomic group selected from those represented by the following general formula: Can be mentioned.

In the above formula, R ^{1 to} R ⁴ are hydrogen or a hydrocarbon group having 1 to 24 carbon atoms, or a functional group selected from a hydroxyl group, an epoxy group, an amino group, a silanol group, and an alkoxysilane group. Represents a hydrocarbon group.

R ⁵ represents a hydrocarbon chain having 1 to 48 carbon atoms or a hydrocarbon chain having 1 to 48 carbon atoms having a functional group selected from a hydroxyl group, an epoxy group, an amino group, a silanol group, and an alkoxysilane group.

In the hydrocarbon groups of R ^{1 to} R ⁴ and the hydrocarbon chain of R ⁵ , elements such as oxygen, nitrogen, and silicon are bonded in a bonding mode other than a hydroxyl group, an epoxy group, a silanol group, and an alkoxysilane group. You may do it.

R ⁶ represents hydrogen or an alkyl group having 1 to 8 carbon atoms.

  In this embodiment, it is used to obtain a modified hydrogenated copolymer in which at least one atomic group having at least one functional group selected from a hydroxyl group, an epoxy group, an amino group, a silanol group, and an alkoxysilane group is bonded. Examples of the modifying agent to be used include the following.

  For example, tetraglycidylmetaxylenediamine, tetraglycidyl-1,3-bisaminomethylcyclohexane, tetraglycidyl-p-phenylenediamine, tetraglycidyldiaminodiphenylmethane, diglycidylaniline, diglycidylorthotoluidine, γ-glycidoxyethyltrimethoxy Silane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxybutyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltripropoxysilane, γ-glycidoxypropyltributoxy Examples include silane, γ-glycidoxypropyltriphenoxysilane, and γ-glycidoxypropylmethyldimethoxysilane.

  Γ-glycidoxypropylethyldimethoxysilane, γ-glycidoxypropylethyldiethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropylmethyldipropoxysilane, γ-glycidoxy Propylmethyldibutoxysilane, γ-glycidoxypropylmethyldiphenoxysilane, γ-glycidoxypropyldimethylmethoxysilane, γ-glycidoxypropyldiethylethoxysilane, γ-glycidoxypropyldimethylethoxysilane, γ-glycyl Sidoxypropyldimethylphenoxysilane, γ-glycidoxypropyldiethylmethoxysilane, and γ-glycidoxypropylmethyldiisopropeneoxysilane are exemplified.

  Also, bis (γ-glycidoxypropyl) dimethoxysilane, bis (γ-glycidoxypropyl) diethoxysilane, bis (γ-glycidoxypropyl) dipropoxysilane, bis (γ-glycidoxypropyl) di Butoxysilane, bis (γ-glycidoxypropyl) diphenoxysilane, bis (γ-glycidoxypropyl) methylmethoxysilane, bis (γ-glycidoxypropyl) methylethoxysilane, bis (γ-glycidoxypropyl) ) Methylpropoxysilane, bis (γ-glycidoxypropyl) methylbutoxysilane, and bis (γ-glycidoxypropyl) methylphenoxysilane.

  Further, tris (γ-glycidoxypropyl) methoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-methacryloxymethyltrimethoxysilane, γ-methacryloxyethyltriethoxysilane, Examples include bis (γ-methacryloxypropyl) dimethoxysilane and tris (γ-methacryloxypropyl) methoxysilane.

  Β- (3,4-epoxycyclohexyl) ethyl-trimethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-triethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-tripropoxysilane, β- (3,4-epoxycyclohexyl) ethyl-tributoxysilane, β- (3,4-epoxycyclohexyl) ethyl-triphenoxysilane, β- (3,4-epoxycyclohexyl) propyl-trimethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-methyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-ethyldimethoxysilane.

  Β- (3,4-epoxycyclohexyl) ethyl-ethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-methyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-methyldi Propoxysilane, β- (3,4-epoxycyclohexyl) ethyl-methyldibutoxysilane, β- (3,4-epoxycyclohexyl) ethyl-methyldiphenoxysilane, β- (3,4-epoxycyclohexyl) ethyl-dimethyl Examples include methoxysilane, β- (3,4-epoxycyclohexyl) ethyl-diethylethoxysilane.

  Furthermore, β- (3,4-epoxycyclohexyl) ethyl-dimethylethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-dimethylpropoxysilane, β- (3,4-epoxycyclohexyl) ethyl-dimethylbutoxysilane , Β- (3,4-epoxycyclohexyl) ethyl-dimethylphenoxysilane, β- (3,4-epoxycyclohexyl) ethyl-diethylmethoxysilane, β- (3,4-epoxycyclohexyl) ethyl-methyldiisopropeneoxy Examples include silane, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N, N′-dimethylpropylene urea, N-methylpyrrolidone, and the like.

  A functional group selected from a hydroxyl group, an epoxy group, an amino group, a silanol group, and an alkoxysilane group by reacting the above modifier with the living end of the copolymer obtained by the above-described method using an organolithium compound as a polymerization catalyst. A modified copolymer in which the residue of the modifying agent to which the atomic group having at least one group is bonded is bonded.

  In the present embodiment, (A) the hydrogenated copolymer obtained by adding hydrogen to the copolymer composed of a conjugated diene unit and a vinyl aromatic unit is the copolymer obtained before the hydrogenation or the modified copolymer obtained above. It can be obtained by hydrogenating the polymer.

The hydrogenation catalyst is not particularly limited, and the following catalysts that are conventionally known can be used.
(I) a supported heterogeneous hydrogenation catalyst in which a metal such as Ni, Pt, Pd, or Ru is supported on carbon, silica, alumina, diatomaceous earth, or the like;
(Ii) a so-called Ziegler-type hydrogenation catalyst using an organic acid salt such as Ni, Co, Fe, Cr or a transition metal salt such as acetylacetone salt and a reducing agent such as organic aluminum;
(Iii) Homogeneous hydrogenation catalysts such as so-called organometallic complexes such as organometallic compounds such as Ti, Ru, Rh and Zr.

  In addition, as specific hydrogenation catalysts, JP-B-42-8704, JP-B-43-6636, JP-B-63-4841, JP-B-1-37970, JP-B-1-53851 The hydrogenation catalyst described in JP-B-2-9041 can be used.

Preferred hydrogenation catalysts include mixtures with titanocene compounds and / or reducing organometallic compounds.
As the titanocene compound, compounds described in JP-A-8-109219 can be used. Specific examples thereof include (substitution) such as biscyclopentadienyl titanium dichloride and monopentamethylcyclopentadienyl titanium trichloride. Examples thereof include compounds having at least one ligand having a cyclopentadienyl skeleton, an indenyl skeleton, or a fluorenyl skeleton.
Examples of the reducing organometallic compound include organic alkali metal compounds such as organolithium, organomagnesium compounds, organoaluminum compounds, organoboron compounds, and organozinc compounds.

  The hydrogenation reaction is generally carried out in a temperature range of 0 to 200 ° C, more preferably 30 to 150 ° C. The pressure of hydrogen used for the hydrogenation reaction is usually 0.1 to 15 MPa, preferably 0.2 to 10 MPa, and more preferably 0.3 to 5 MPa. The hydrogenation reaction time is usually 3 minutes to 10 hours, preferably 10 minutes to 5 hours. The hydrogenation reaction can be any of a batch process, a continuous process, or a combination thereof.

In the reaction solution after the hydrogenation reaction, the catalyst residue can be removed if necessary, and the hydrogenated copolymer or the modified hydrogenated copolymer can be separated from the reaction solution.
Solvent separation methods include, for example, a method in which a polar solvent that is a poor solvent for a polymer such as acetone or alcohol is added to the solution after hydrogenation to recover the polymer by precipitation, a hydrogenated copolymer, or a modification. Examples thereof include a method in which a solution of a hydrogenated copolymer is poured into hot water with stirring and the solvent is removed by steam stripping, or a method in which the solvent is distilled off by directly heating the polymer solution. .

In addition, stabilizers such as various phenol stabilizers, phosphorus stabilizers, sulfur stabilizers and amine stabilizers are added to the hydrogenated copolymer or modified hydrogenated copolymer used in the present embodiment. be able to.
Examples of the phenol-based stabilizer include stearyl-β- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 2,2-methylenebis (4-methyl-6-tert-butylphenol), and the like.
A triphenyl phosphite is mentioned as a phosphorus stabilizer.
Examples of sulfur stabilizers include dilauryl 3,3-thiodipropionate.
Examples of amine stabilizers include phenyl-4-piperidinyl carbonate and bis (2,2,6,6-tetramethyl-4-piperidinyl) sebagate.

  The content of the hydrogenated copolymer obtained by adding hydrogen to the copolymer comprising (A) the conjugated diene unit and the vinyl aromatic unit in the thermally conductive molded body of the present embodiment is not particularly limited, and the heat conduction It is preferable that it is 5-25 mass% with respect to the total amount of a conductive resin composition, and it is more preferable that it is 5-20 mass%. (A) Sufficient moldability can be provided by making content of a component into 5 mass% or more. By setting the content of the component (A) to 25% by mass or less, excellent thermal conductivity and flame retardancy can be imparted.

<(B) component>
The (B) thermally conductive filler used in the present embodiment is not particularly limited, and for example, a known material can be used. Specific examples include metal powder, metal oxide, metal hydroxide, metal nitride, metal carbide, natural graphite, and spherical graphite particles.
Examples of the metal powder include gold, silver, copper, and aluminum.
Examples of the metal oxide include zinc oxide, aluminum oxide, magnesium oxide, and silicon oxide.
Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, sodium hydroxide, calcium hydroxide, and zinc hydroxide. Among them, one or a mixture of two or more selected from aluminum hydroxide, magnesium hydroxide, and zinc hydroxide is preferable. Aluminum hydroxide is more preferred because it is a flame retardant and acts as a thermally conductive filler. The endothermic amount of aluminum hydroxide is about 1.97 kJ / g, which is a large value compared to about 1.31 kJ / g of magnesium hydroxide and about 0.93 kJ / g of calcium hydroxide, and has a flame-retardant effect. It is also preferable from a high point.
Examples of the metal nitride include boron nitride, silicon nitride, and aluminum nitride.
Examples of the metal carbide include silicon carbide.
Moreover, the shape of these heat conductive fillers may be fibrous and / or non-fibrous (plate, scale, granular, indeterminate, spherical).

In the case of obtaining a thermally conductive molded article excellent in thermal conductivity and electrical insulation, the component (B) is at least one selected from the group consisting of metal oxides, metal hydroxides, metal nitrides, and metal carbides. It is preferable that Moreover, when obtaining the heat conductive molded object excellent in heat conductivity, electrical insulation, and a flame retardance, the said (B) component has a preferable metal hydroxide.
In applications that do not require electrical insulation, examples of the component (B) include metal powder, carbon fiber, natural graphite, and spherical graphite particles. From the viewpoint of cost, natural graphite and spherical graphite particles are preferable.

  (B) Although content of a heat conductive filler is not specifically limited, It is preferable from a viewpoint of low heat resistance that it is 40-95 volume% with respect to the total amount of a heat conductive molded object. By making content of (B) component 40 volume% or more, the outstanding low heat resistance can be provided to a heat conductive molded object. The moldability which was excellent by making content of (B) component 95 volume% or less can be provided to a heat conductive molded object. From this viewpoint, the content of the component (B) is preferably 50 to 90% by volume, more preferably 60 to 85% by volume.

  In the present embodiment, the particle size of the (B) thermally conductive filler is not particularly limited, but in order to achieve low thermal resistance, those having a cumulative median diameter of 1 to 95 μm are preferable. By setting it as this range, the low thermal conductivity and surface glossiness of the thermally conductive molded product can be remarkably improved. The cumulative median diameter is more preferably 5 to 90 μm, still more preferably 10 to 85 μm.

  Here, the cumulative median diameter refers to the particle diameter at which the cumulative curve is 50% in a particle size distribution of the powder aggregate with the total volume of the powder population being 100%, and the cumulative curve is 50%. Say.

  In the present embodiment, the particle size (μm) of the metal hydroxide component is a volume-based particle size measured using a laser diffraction / scattering particle size distribution measuring device. The particle size is measured by dispersing a metal hydroxide in water or an organic solvent. At this time, if it cannot be dispersed, a surfactant may be used, or it may be dispersed by a homogenizer or ultrasonic waves. The concentration of the metal hydroxide powder to be dispersed is 1% or less.

  The cumulative median diameter of the metal hydroxide is a particle size distribution consisting of the particle diameter and frequency (volume%) of the metal hydroxide powder aggregate measured by a laser diffraction / scattering particle size distribution measuring device. And the cumulative curve is obtained with the total volume of the set as 100%. The particle diameter (μm) at the point where the cumulative curve becomes 50% is defined as the cumulative median diameter of the metal hydroxide.

  In this embodiment, you may pre-process (B) heat conductive filler as needed. The pretreatment is not particularly limited, and for example, a metal hydroxide subjected to surface modification by pretreatment with a silane coupling agent, a titanate coupling agent, stearic acid or the like may be used.

<Surface gloss>
The heat conductive molded body of the present embodiment has a surface glossiness of 15% or more, more preferably 18% or more, and further preferably 20% or more.
By making the surface glossiness 15% or more, not only can the thermal resistance of the heat conductive molded body be lowered, but it can also provide excellent adhesiveness, and can significantly reduce the generation of bubbles when laminating with other adhesive layers. (Laminating properties) and puncture strength can be remarkably improved.
The surface glossiness in the present embodiment is a value of 60 ° specular glossiness based on JIS K7105 (plastic optical property test method).

<(C) component>
The thermally conductive molded body of this embodiment preferably contains (C) a rubber softener.
(C) The softener for rubber is not particularly limited, and a known one can be used. Examples thereof include silicone oil, synthetic oil, fluorine oil, mineral oil (petroleum oil), and synthetic oil. Among these, Preferably, paraffinic oil, naphthenic oil, aromatic oil, etc. are mentioned, More preferably, paraffinic oil, naphthenic oil, etc. are mentioned. By using paraffinic oil and naphthenic oil, excellent cold resistance and durability can be imparted to the heat conductive molded body. Of these, paraffinic oil is more preferable, and paraffinic oils having a small aromatic ring component are particularly suitable.

The kinematic viscosity at 40 ° C. of the paraffinic oil is not particularly limited, but is preferably 100 mm ² / sec or more, more preferably 100 to 10,000 mm ² / sec, and further preferably 200 to 5000 mm ² / sec. The kinematic viscosity is measured by a method based on the method of JIS K2283. By setting it as the said numerical range, a softness | flexibility can be provided to a heat conductive molded object, without oil bleeding from a heat conductive molded object.

  Examples of paraffinic oils include “NA Solvent (trade name)” manufactured by Nippon Oil & Fats Co., Ltd., “Diana (registered trademark) process oils PW-90 and PW-380” manufactured by Idemitsu Kosan Co., Ltd., “manufactured by Idemitsu Petrochemical Co., Ltd.” IP-solvent 2835 (trade name) "," Neothiozol (trade name) "manufactured by Sanko Chemical Co., Ltd. and the like.

  The rubber softener preferably has a flash point of 170 to 300 ° C. and a weight average molecular weight of 100 to 5000. Heat resistance can be improved by setting the flash point of the rubber softener to 170 ° C. or higher, and good moldability can be obtained by setting the flash point to 300 ° C. or lower. By setting the weight average molecular weight of the rubber softener to 100 or more, the softener for rubber does not bleed from the heat conductive molded body, and by setting it to 5000 or less, flexibility can be imparted to the heat conductive molded body. . The weight average molecular weight of the rubber softener can be measured by GPC using polystyrene as a standard substance and tetrahydrofuran as a mobile phase.

  The content of the (C) rubber softener is not particularly limited, and the content (C / (A + C)) of the component (C) with respect to the total amount of the components (A) and (C) is 50% by mass or less. It is preferable that it is 45 mass% or less, and more preferably 40 mass% or less. By setting the content (C / (A + C)) of the softening agent for rubber within such a range, bleeding out of the softening agent for rubber can be prevented, and excellent flame retardancy can be imparted to the thermally conductive composition.

  The heat conductive molded body of the present embodiment may contain a tackifier if necessary as long as the purpose is not impaired. The tackifier is added to fix the electronic component, the semiconductor device or the display device and the cooling heat dissipation device when the thermally conductive molded body is formed into a sheet shape and used.

  It does not specifically limit as the tackifier which can be used for this embodiment, A conventionally well-known thing can be used. For example, rosin resin (gum rosin, tall oil rosin, wood rosin, modified rosin resin (hydrogenated rosin, disproportionated rosin, polymerized rosin, maleated rosin etc.), rosin ester (rosin glycerin ester, hydrogenated rosin / glycerin Ester, rosin / pentaerythritol ester, hydrogenated rosin / pentaerythritol ester, perhydrogenated rosin / glycerin ester, stabilized rosin / pentaerythritol ester, etc.), petroleum resin (hydrocarbon (aliphatic petroleum, aromatic) Aromatic petroleum, dicyclopentadiene, thermal reaction type, aromatic modified aliphatic petroleum, etc.), aliphatic petroleum resin (C5), aromatic petroleum resin (C9), copolymer petroleum resin (C5) / C9), alicyclic petroleum resins (hydrogenated, dicyclopentadiene, etc.), tellurium Resin (α-pinene, β-pinene, d-limonene, aromatic modified, phenol modified terpene, polyterpene, hydrogenated terpene, etc.), pure monomer resin (styrene / α-methylstyrene, α-methylstyrene / vinyl) Toluene, styrene, (meth) acrylic), coumarone / indene resin, phenolic resin, xylene resin, etc. These may be used alone or in combination of two or more.

  Among them, more preferably, rosin (rosin resin, modified rosin resin), terpene (terpene resin), petroleum (petroleum resin, aliphatic petroleum resin, aromatic petroleum resin, copolymer) Based petroleum resin, alicyclic petroleum resin). Content in a heat conductive resin composition form is not specifically limited, Although it can add according to the target adhesive force, 1-20 mass% is preferable with respect to the total amount of a heat conductive molded object.

  The heat conductive molded body of the present embodiment can be added with a fatty acid, a fatty acid salt, an antioxidant, a crosslinking agent, a thermoplastic elastomer, a flame retardant, a filler other than the heat conductive filler, and the like as necessary. .

  It does not specifically limit as a fatty acid, For example, a stearic acid is mentioned.

  It does not specifically limit as a fatty acid salt, For example, a zinc stearate is mentioned.

  The antioxidant is not particularly limited, and examples thereof include aldehydes, amines, phenols, and the like. Examples of the crosslinking agent include organic peroxides, epoxies, isocyanates, di (meth) acrylates, and the like.

  The thermoplastic elastomer is not particularly limited, and examples thereof include styrene-based elastomers, olefin-based elastomers, nitrile rubber, and acrylic rubber.

  It does not specifically limit as fillers other than a heat conductive filler, For example, glass fiber, organic fiber, etc. are mentioned.

  The flame retardant is not particularly limited, and examples thereof include nitrogen flame retardants (such as triazines), PPE (polyphenylene ether), silicone flame retardants, aromatic carboxylic acids and metal salts thereof, boron compounds, and zinc compounds. It is done.

  The thermally conductive molded body and the thermally conductive sheet of this embodiment are highly filled with (B) a thermally conductive filler, have thermal conductivity, and have a thermal conductivity of 1.0 W / m · K. The above is preferable. The thermal conductivity is measured in accordance with ASTM (American Society for Testing and Materials) D5470.

<The manufacturing method of a heat conductive molded object>
The manufacturing method of the heat conductive molded object of this embodiment is (A) The hydrogenation copolymer which satisfy | fills following (a)-(d) formed by adding hydrogen to the copolymer which consists of a conjugated diene unit and a vinyl aromatic unit. A step of heating and melting a resin composition comprising a polymer and (B) a thermally conductive filler to form a molded body, and the molded body having a molded body temperature of 50 ° C. or higher and a surface gloss in accordance with JIS K7105 After pressing to the surface of the transfer material having a degree of 15% or more, the surface glossiness according to JIS K7105 is 15% or more by pulling the molded body away from the surface of the transfer material at a molding temperature of less than 50 ° C. The process of obtaining the molded object which has the surface which is.
(A) The content of the vinyl aromatic compound is more than 50% by mass and 90% by mass or less,
(B) The amount of the vinyl aromatic compound polymer block is 40% by mass or less,
(C) a weight average molecular weight of 50,000 to 1,000,000,
(D) 10% or more of the double bond based on the conjugated diene compound is hydrogenated.

<Kneading of thermally conductive molded body>
The kneading method for obtaining the heat conductive molded body of the present embodiment is not particularly limited, and a known method can be used. Examples include a blade type kneader (kneader, etc.), a roll type kneader (roll mill, taper roll, pressure kneader, Banbury mixer, internal mixer, lab plast mill, mix lab, extruder, etc.), etc. They are kneaders, roll mills, banburys and extruders. By the above kneading method, the components (a) to (d) can be kneaded to form a molded body.

  Next, the surface of the obtained molded product is made to have a surface glossiness of 15% or more. Examples of the method for setting the surface glossiness to 15% or more include a method for transferring the surface of a transfer material having a surface having a surface glossiness of 15% or more (surface transfer method), a surface polishing method, a surface coating method, and the like. Among these, the surface transfer method is preferable from the viewpoint of efficiency.

  As a method for performing the surface transfer method, after pressing the surface of a transfer material having a surface glossiness of 15% or more in accordance with JIS K7105 in a state where the molded body temperature of the obtained molded body is heated to 50 ° C. or higher. There is a method of obtaining a molded body having a surface having a surface glossiness of 15% or more in accordance with JIS K7105 by pulling the molded body away from the surface of the transfer material at a molded body temperature of less than 50 ° C.

  From the viewpoint of obtaining a thermally conductive molded article having a high surface glossiness, the molded article temperature before pressing is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and further preferably 70 ° C. or higher. preferable.

  It is preferable that the molded body temperature at the time of separating after pressing is less than 50 ° C. By separating at a temperature of less than 50 ° C., high surface gloss can be achieved over the entire surface of the molded body. More preferably, it is 45 degrees C or less, More preferably, it is 40 degrees C or less.

  The transfer material used in the surface transfer method may be any material having a surface with a surface glossiness of 15% or more in accordance with JIS K7105, and the type thereof is not particularly limited. Specifically, a resin sheet such as PET or PS can be used. The surface glossiness of the transfer material used in the surface transfer method is more preferably 30% or more, and further preferably 40% or more.

  The thickness of the transfer material is preferably 0.05 mm or more in order to prevent deformation of the thermally conductive molded body. More preferably, it is 0.1 mm or more, and particularly preferably 0.15 mm or more.

  When a metal mirror finish roll or a belt-like metal sheet is used as the transfer surface of the transfer material, the surface roughness is preferably in the range of 0.2 s to 0.8 s. The surface roughness is a roughness determined by a 10-point average height Rz. This is the difference between the average value of the altitude at the top of the peak from the highest to the fifth and the average value of the altitude at the bottom of the valley from the deepest to the fifth in the part where the reference length is extracted from the cross-sectional curve. ). For example, the surface roughness of 0.2 s has a 10-point average height of 0.2 μm, and the surface roughness of 0.8 s has a 10-point average height of 0.8 μm.

  Use of a metal roll having a surface roughness of 0.2 s to 0.8 s is preferable for obtaining a heat conductive resin sheet having a surface glossiness of 15% or more.

  Use of a material having a surface roughness of 0.2 s or more is economical for the equipment itself and its maintenance. Further, by using a high mirror surface having a surface roughness of 0.8 s or less, it is possible to prevent the heat conductive molded body from adhering to the surface (mirror surface) of the transfer material.

  The pressure and time for pressing a surface having a surface glossiness of 15% or more in accordance with JIS K7105 to the thermally conductive molded body are not particularly limited. For example, a metal sheet having a surface glossiness of 70% is heated. The linear pressure in the case of pressing the conductive molded body with a rolling roll is preferably in the range of 20 to 200 kgf / cm. By setting the linear pressure to 20 kgf / cm, sufficient transfer can be performed, and the surface glossiness of the heat conductive molded body becomes excellent. Moreover, the phenomenon that a heat conductive molded object adheres to a rolling roll and does not peel can be effectively prevented by setting it as a linear pressure of 200 kgf / cm or less.

  Although the contact time of a rolling roll and a heat conductive molded object is not specifically limited, It is preferable that it is 0.01 second or more. It is preferable to increase the contact time because the surface glossiness of the thermally conductive molded article is excellent. Preferably it is 1 second or more, more preferably 4 seconds or more.

<Thermal conductive sheet>
The thermally conductive molded body of the present embodiment can be processed into a sheet having a thickness of 0.1 to 3 mm depending on the application. The processing method is not particularly limited and can be processed by extrusion molding, compression molding, calendar molding, or the like. Among these, extrusion molding and calender molding which can be continuously formed and can be wound are preferable. Note that the “sheet” in the present embodiment may also be referred to as “film” or the like.

  T-die extrusion molding and calendar molding are preferred because the surface glossiness of the heat conductive sheet can be controlled by controlling the surface roughness and temperature, linear pressure, and contact time of the rolling roll.

  The heat conductive sheet of this embodiment can be rolled up with a release film or a transfer-type pressure-sensitive adhesive film interposed therebetween. The size of the sheet is not particularly limited, and can be processed according to the application.

  A preferable production method includes a method of forming a sheet by extruding it into a T-die while kneading each component with an extruder, and winding the sheet together with a release film or a transfer-type adhesive film using a sheet take-up device. The extrusion conditions at this time are not particularly limited, and vary depending on the components of the thermally conductive molded body, the width of the sheet to be molded, and the like. A preferable set temperature of the extruder is 90 to 190 ° C., a preferable screw rotation speed is 5 to 80 rpm, and a preferable L / D ratio (screw length to diameter ratio) is 20 or more.

  Moreover, it is preferable that the heat conductive sheet of this embodiment satisfy | fills the V-0 specification of UL94 standard (Underwriters Laboratories Inc. standard number 94). The UL94 standard is a standard related to a plastic material flammability test for apparatus and instrument parts, and satisfying this standard is classified as a material having high flame retardancy.

  For example, since aluminum hydroxide decomposes at 200 ° C. or higher to release water, flame retardancy can be imparted to a thermally conductive molded body containing aluminum hydroxide. When processed into a 0.5 mm sheet, the thermally conductive composition of this embodiment can be made excellent in thermal conductivity and dielectric breakdown characteristics while having flame retardancy that satisfies V-0 of the UL94 standard.

  The generated heat can be efficiently released by sandwiching the heat conductive sheet of the present embodiment between a heat generating portion of an electronic component or a semiconductor device and a heat radiating component, a heat radiating plate, or the like. As a result, the thermal deterioration of the equipment such as electronic components, semiconductor devices, and display devices can be reduced, so that the failure of the equipment can be reduced and the product life can be extended.

  Examples of equipment and parts / members that can use the heat conductive sheet of the present embodiment include a CPU (central processing element) of a computer, a liquid crystal backlight, a plasma display panel, an LED element, LED illumination, and organic EL elements, secondary batteries or peripheral devices thereof, motor radiators, Peltier elements, inverters, (high) power transistors, and the like. In particular, LED-related parts such as LED-backlights and LED lighting generate large amounts of heat, and heat unevenness is likely to occur, and structural design for heat dissipation and heat equalization is necessary. A structural design capable of heat dissipation and heat equalization can be realized by attaching the heat conductive sheet of the embodiment and further attaching a heat radiating plate (aluminum chassis or the like).

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.

The following components were used.
[material]
<(A) Hydrogenated copolymer obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit>
(A) A hydrogenated copolymer obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit was obtained in the following procedure. The properties and physical properties of the obtained polymer were measured as follows.

-Characteristics of copolymer (1) Content of vinyl aromatic hydrocarbon: Measured using an ultraviolet spectrophotometer (UV-2450, manufactured by Shimadzu Corporation).

(2) Content of polymer block composed of vinyl aromatic hydrocarbon: using polymer before hydrogenation; M.M. Kolthoff, et al. , J .; Polym. Sci. The measurement was performed according to the method described in US Pat.

(3) Vinyl bond amount and hydrogenation rate: Measured using a nuclear magnetic resonance apparatus (manufactured by BRUKER, DPX-400).

(4) Molecular weight and molecular weight distribution: Measured by GPC (measurement apparatus manufactured by Waters), tetrahydrofuran was used as a solvent, and measurement conditions were performed at a temperature of 35 ° C. The molecular weight is a weight average molecular weight obtained by using a calibration curve (created using the peak molecular weight of standard polystyrene) obtained by measuring the molecular weight of the peak of the chromatogram from measurement of commercially available standard polystyrene. The molecular weight when there are a plurality of peaks in the chromatogram refers to the average molecular weight obtained from the molecular weight of each peak and the composition ratio of each peak (obtained from the area ratio of each peak in the chromatogram). The molecular weight distribution is a ratio of the obtained weight average molecular weight and number average molecular weight.

(5) Crystallization peak and crystallization peak calorific value: Measured by DSC (manufactured by Mac Science, DSC3200S). The temperature was raised from room temperature to 150 ° C. at a rate of temperature rise of 30 ° C./min, and then the temperature was lowered to −100 ° C. at a rate of temperature drop of 10 ° C./min, and the crystallization curve was measured to confirm the presence or absence of a crystallization peak. Further, when there was a crystallization peak, the temperature at which the peak appeared was defined as the crystallization peak temperature, and the crystallization peak calorie was measured.

(6) tan δ peak of dynamic viscoelasticity: Measured from −70 ° C. to 180 ° C. at a temperature rising rate of 3 ° C./min using ARES (manufactured by Rheometric Scientific).

-Reactors such as reaction conditions: A stirrer having an internal volume of 10 L and a jacketed tank reactor were used.
Reaction temperature: 70 ° C. was maintained during the polymerization. The temperature was maintained at 65 ° C. during the hydrogenation reaction.
Hydrogenation catalyst: 1 L of dried and purified cyclohexane was charged into a hydrogenation catalyst preparation reaction vessel purged with nitrogen, and 100 mmol of bis (η5-cyclopentadienyl) titanium dichloride was added. While sufficiently stirring, an n-hexane solution containing 200 mmol of trimethylaluminum was added and reacted at room temperature for 3 days.

-Reaction procedure 10 mass parts of cyclohexane was prepared to the reactor, and it adjusted to the temperature of 70 degreeC. As the first step reaction, 0.076 parts by mass of n-butyllithium, N, N, N ′, N′-tetramethylethylenediamine (hereinafter abbreviated as “TMEDA”) is 0 with respect to 1 mol of n-butyllithium. .4 mol was added. A cyclohexane solution (monomer concentration of 22% by mass) containing 8 parts by mass of styrene was added over 3 minutes, and reacted for 30 minutes after the addition was completed.
As the second-stage reaction, a cyclohexane solution (monomer concentration of 22% by mass) containing 48 parts by mass of 1,3-butadiene and 36 parts by mass of styrene is continuously supplied to the reactor at a constant rate over 60 minutes and added. It was made to react for 30 minutes after completion | finish.
As a third-stage reaction, a cyclohexane solution containing 8 parts by mass of styrene (monomer concentration: 22% by mass) was added over 3 minutes, followed by reaction for 30 minutes after completion of addition, to obtain a copolymer.
To the obtained copolymer, 100 mass ppm of the hydrogenation catalyst was added in terms of titanium, and a hydrogenation reaction was performed at a hydrogen pressure of 0.7 MPa and a temperature of 65 ° C.
After completion of the reaction, methanol was added, and then octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate as a stabilizer was added in an amount of 0.3% by weight based on the copolymer. A hydrogenated copolymer was obtained.

The obtained hydrogenated copolymer had a weight average molecular weight of 16.5 × 10 ⁴ , a molecular weight distribution of 1.2, and a hydrogenation rate of 99%.
As a result of dynamic viscoelasticity measurement, the peak temperature of tan δ was at −15 ° C.
As a result of DSC measurement, there was no crystallization peak.

  The content of vinyl aromatic units determined from the pre-hydrogenation copolymer obtained after the third stage reaction was 52% by mass, the content of the polymer block composed of vinyl aromatic was 16% by mass, and 1,3-butadiene. Part vinyl bond content was 21% by weight.

<Thermoplastic elastomer>
EPDM (manufactured by Dow Chemical Co., Ltd., trade name “NORDEL IP 4770R”) was used as the thermoplastic elastomer of the comparative example. Table 1 shows the content.
<(B) Thermal conductive filler (aluminum hydroxide)>
(B) Aluminum hydroxide (made by Nippon Light Metal Co., Ltd., trade name “BW53”, cumulative median diameter: 51 μm) was used as the thermally conductive filler. Table 1 shows the respective contents.

<(C) Rubber softener>
As a rubber softener, Idemitsu Kosan Co., Ltd. product name "Diana Process Oil PW-380 (lubricating base oil, paraffin oil)" was used. Table 1 shows the content.

[Sheet manufacturing method]
<Kneading>
The composition of Table 1 was kneaded at 150 ° C. for 5 minutes using a 75 L kneader (manufactured by Moriyama Co., Ltd., pressure kneader DX75-150). The obtained kneaded product was extruded with a 150 ° C. feeder ruder to obtain pellets.

<Heat conductive sheet molding>
A schematic diagram of the roll configuration used is shown in FIG. The pellets were put into a 65φ extruder equipped with a die 1 having a width of 240 mm and extruded from a T die at a temperature of 120 ° C. The configuration of the metal roll for rolling the extruded sheet is as follows. The first roll 4 having a surface glossiness of 70% and the metal sheet having a surface glossiness of 70% and a thickness of 0.1 mm are belt-shaped (belt-shaped metal sheet 3). It consists of a wound second roll 5 and a third roll 6.
The temperature of the 1st roll 4, the 2nd roll 5, and the 3rd roll 6 was set to the conditions shown in Table 1, and the extrusion sheet | seat from T die was introduced between the 1st roll 4 and the 2nd roll 5, and it rolled. The heat conductive sheet temperature in a rolling part was 100 degreeC, and the roll linear pressure was 100 kg / cm.
The molded body 2 melted by the first roll 4 and the second roll 5 is rolled into a sheet, and the melted molded body 2 is peeled off from the belt-shaped metal sheet 3 through the third roll 6 to obtain a thickness of 0.3. A millimeter thermal conductive sheet 7 was obtained. The temperature of the heat conductive sheet 7 was measured with a thermocouple thermometer at a temperature measurement position 8 of 4 cm from the separation point from the belt-shaped metal sheet 3. Table 1 shows the surface glossiness, thermal resistance, adhesiveness, presence / absence of bubbles in the laminate, and puncture strength of the obtained heat conductive sheet 7.

[Measuring method]
<Surface gloss>
The obtained sheet was cut out to 50 mm × 50 mm × 0.3 mm (thickness) to obtain a test piece. In accordance with JIS K7105 (plastic optical property test method), multi-light source spectrophotometer (manufactured by Suga Test Instruments Co., Ltd., MSC-5N) and digital gonio-gloss meter (manufactured by Suga Test Instruments Co., Ltd., UGV) -5D), the 60-degree specular gloss at a colorimetric angle of 60 degrees was measured. Three places of the test piece were measured and the average was calculated | required.

<Thermal resistance>
The obtained sheet was cut out to 10 mm × 10 mm × 0.3 mm (thickness) to obtain a test piece. Based on ASTM (American Society for Testing and Materials) D5470, a thermal resistance value was measured at a measurement temperature of 30 ° C. using a resin material thermal resistance measurement device (manufactured by Hitachi, Ltd.).

<Adhesiveness>
The obtained sheet was cut out to 100 mm × 100 mm × 0.3 mm (thickness) to obtain a test piece. The test piece was affixed on a 200 mm × 300 mm × 0.5 mm aluminum mirror plate. After standing this aluminum mirror surface plate vertically for 10 minutes, it was visually confirmed whether or not the test piece was peeled off by its own weight. In the evaluation, those that were not peeled off were marked with “◯”, and those that were peeled off were marked with “x”.

<Air bubbles in laminated products>
The obtained sheet was rolled up by 10 mm with a width of 240 mm with a low-density polyethylene interleaving paper (LDPE interleaving paper) sandwiched between the glossy surfaces. This was laminated with a transparent adhesive polyethylene terephthalate sheet (transparent adhesive PET sheet) having a thickness of 25 μm provided with a transparent adhesive layer having a thickness of 2 μm.
First, the laminate was laminated so that the surface overlapped with the adhesive layer on the transparent adhesive PET sheet while peeling the LDPE interleaf of the heat conductive sheet. Next, the laminated sheet was laminated by passing through two rolls of steel roll / elastic roll adjusted to a temperature of 50 ° C. and a linear pressure of 0.25 kg / cm to obtain a laminated product.
After lamination, both ends of the laminate were trimmed with a cutter and adjusted to a width of 210 mm. A laminate product 1 m having a width of 210 mm was sampled, and the number of bubbles containing 1 mmφ or more present therein was visually measured from the transparent adhesive PET sheet surface side.
In the evaluation, “◯” indicates that the number of bubbles per unit area of 210 mm × 1000 mm is 10 or less, and “x” indicates that the number of bubbles is 10 or more.

<Puncture strength>
The obtained sheet was cut out to 100 mm × 100 mm × 0.3 mm (thickness) to obtain a test piece. A test piece is fixed, a semicircular needle having a diameter of 1.6 mmφ and a tip-shaped radius of 0.8 mm is pierced at a speed of 100 mm / min on the surface of the fixed test piece, and the maximum load until the needle penetrates is obtained. It was measured. As a test apparatus (material tester), an autograph (manufactured by Shimadzu Corporation, AGS-1KNJ) was used.

[Example 1]
The composition shown in Table 1 was rolled at a rolling roll temperature of 60 ° C. to produce a heat conductive sheet having a 60 ° surface glossiness of 30%. The thermal resistance and adhesiveness of the obtained thermal conductive sheet, the evaluation of the number of bubbles in the laminate, and the puncture strength were measured and evaluated.

[Example 2]
The composition of the heat conductive filler was 85% by mass, and the composition shown in Table 1 was rolled at a rolling roll temperature of 60 ° C. to produce a heat conductive sheet having a 60 ° surface gloss of 20%. The thermal resistance and adhesiveness of the obtained thermal conductive sheet, the evaluation of the number of bubbles in the laminate, and the puncture strength were measured and evaluated.

[Example 3]
The composition of the heat conductive filler was 60% by mass, and the composition shown in Table 1 was rolled at a rolling roll temperature of 60 ° C. to produce a heat conductive sheet having a 60 ° surface gloss of 30%. The thermal resistance and adhesiveness of the obtained thermal conductive sheet, the evaluation of the number of bubbles in the laminate, and the puncture strength were measured and evaluated.

[Comparative Example 1]
Except that the hydrogenated copolymer was changed to EPDM, rolling was performed at a rolling roll temperature of 60 ° C. under the same conditions as in Example 1 to produce a heat conductive sheet having a 60 ° surface glossiness of 10%. The thermal resistance and adhesiveness of the obtained thermal conductive sheet, the evaluation of the number of bubbles in the laminate, and the puncture strength were measured and evaluated.

[Comparative Example 2]
A heat conductive sheet having a 60 ° surface glossiness of 8% was produced under the same conditions as in Example 1 except that the rolling roll temperature was changed to 40 ° C., with the formulation shown in Table 1. The thermal resistance and adhesiveness of the obtained thermal conductive sheet, the evaluation of the number of bubbles in the laminate, and the puncture strength were measured and evaluated.

Each of Examples 1 to 3 was a heat conductive sheet having a surface glossiness of 15% or more and excellent in low heat resistance, adhesiveness, laminating property, and puncture strength.
On the other hand, Comparative Examples 1 and 2 had a surface glossiness of 10% and 8%, no tackiness, and insufficient laminating properties and puncture strength.

  As described above, according to the present example, the thermally conductive molded body and the thermally conductive sheet of the present embodiment are not only excellent in low thermal resistance, adhesiveness, and laminating properties, but also in puncture strength when in contact with the heating element. It was also shown to be strong and excellent.

  Since the heat conductive molded object and the heat conductive sheet of this invention are excellent in low heat resistance, adhesiveness, and puncture strength, they can be used for a wide range of applications. For example, it can be used as a component or the like provided between a heating element and a radiator, and also used as a member that is in close contact with a semiconductor element such as an IC, a CPU, an LED, or an LSI on an electronic board inside an electric device and an electronic device. be able to.

DESCRIPTION OF SYMBOLS 1 Dice 2 Molded object 3 Belt-shaped metal sheet 4 First roll 5 Second roll 6 Third roll 7 Thermally conductive sheet 8 Temperature measurement position

Claims (9)

(A) a hydrogenated copolymer satisfying the following (a) to (d) obtained by adding hydrogen to a copolymer comprising a conjugated diene unit and a vinyl aromatic unit;
(B) a heat conductive filler,
A thermally conductive molded article having a surface glossiness (60-degree specular glossiness) of 15% or more according to JIS K7105.
(A) The content of the vinyl aromatic compound is more than 50% by mass and 90% by mass or less,
(B) The amount of the vinyl aromatic compound polymer block is 40% by mass or less,
(C) a weight average molecular weight of 50,000 to 1,000,000,
(D) 10% or more of the double bond based on the conjugated diene compound is hydrogenated.   The heat conductive molded object of Claim 1 whose content of the said (B) component in a molded object is 40-95 volume%.   Furthermore, (C) The heat conductive molded object of Claim 1 or 2 containing the softening agent for rubber | gum.   The heat conductive molded object according to claim 3, wherein the content of the component (C) with respect to the total amount of the component (A) and the component (C) is 50% by mass or less.   The heat conductive molded object as described in any one of Claims 1-4 whose content of the vinyl aromatic compound polymer block in the said (A) component is less than 10 mass%.   The heat conductive molded object as described in any one of Claims 1-4 whose quantity of the vinyl aromatic compound polymer block in the said (A) component is 10-40 mass%.   The heat conduction according to any one of claims 1 to 6, wherein the component (B) includes any one selected from the group consisting of metal oxides, metal hydroxides, metal nitrides, and metal carbides. Molded product.   The heat conductive sheet formed by shape | molding the heat conductive molded object as described in any one of Claims 1-7 in a sheet form. (A) a hydrogenated copolymer satisfying the following (a) to (d) obtained by adding hydrogen to a copolymer composed of a conjugated diene unit and a vinyl aromatic unit; and (B) a thermally conductive filler. A step of heating and melting the resin composition to be formed into a molded body, and pressing the molded body to a surface of a transfer material having a molded body temperature of 50 ° C. or higher and a surface glossiness of 15% or higher in accordance with JIS K7105 Thereafter, a heat comprising a step of obtaining a molded body having a surface having a surface glossiness of 15% or more according to JIS K7105 by pulling the molded body away from the surface of the transfer material at a molded body temperature of less than 50 ° C. A method for producing a conductive molded body.
(A) The content of the vinyl aromatic compound is more than 50% by mass and 90% by mass or less,
(B) The amount of the vinyl aromatic compound polymer block is 40% by mass or less,
(C) a weight average molecular weight of 50,000 to 1,000,000,
(D) 10% or more of the double bond based on the conjugated diene compound is hydrogenated.