JP2010279946A - Droplet discharge device, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus - Google Patents

Abstract

An object of the present invention is to provide a droplet discharge device, an electro-optical device, and an electronic apparatus capable of easily adjusting a nozzle pitch and performing drawing with high accuracy.
In a droplet discharge device that discharges droplets from a nozzle of a head to a substrate, each of a head group including a stage that holds the substrate, and one or a plurality of heads each having a nozzle row, and A plurality of moving means for moving in the sub-scanning direction on one axis or a plurality of axes arranged in parallel, and the plurality of moving means are independently driven and adjacent to the sub-scanning direction or the main scanning direction. Position control means for adjusting the relative positional relationship between the head groups of the moving means to adjust the nozzle pitch, and by moving the carriage relative to the stage in the main scanning direction, Droplets are discharged to the discharge target portion of the substrate.
[Selection] Figure 1

Description

  The present invention relates to a droplet discharge device, an electro-optical device, and an electronic apparatus, and more specifically, for applying a liquid material to a periodically arranged region in a color filter substrate, a color matrix display device, or the like. The present invention relates to a suitable droplet discharge device, an electro-optical device, and an electronic apparatus.

  For the formation of a thin film, for example, a spin coating method which is one of thin film coating methods is generally used. This spin coating method is a method of forming a thin film by forming a thin film by rotating a substrate and applying the whole surface of the substrate by centrifugal force after the liquid material is dropped on the substrate. The film thickness is controlled by viscosity or the like.

  However, in the spin coating method, since most of the supplied liquid material is scattered, there is a problem that it is necessary to supply a large amount of liquid material, and there is a lot of waste, resulting in an increase in production cost. Further, since the substrate is rotated, the liquid material flows from the inner side to the outer side due to the centrifugal force, and the film thickness of the outer peripheral region tends to be thicker than that of the inner side.

  Against this background, recently, a droplet discharge method such as an ink jet method has been proposed, and an ink jet apparatus has been proposed as a device for carrying out this coating method. This ink jet apparatus is preferably used mainly for forming a thin film because a predetermined amount of liquid can be disposed at a desired position. For example, it is known to form filter elements of a color filter substrate by using an ink jet device or light emitting portions arranged in a matrix in a matrix display device (see, for example, Patent Document 1).

JP 2003-127343 A

  Along with the increase in the number of pixels in a color display device or the like, in a filter element or the like of a color filter substrate, it is necessary to form a plurality of discharged portions to be coated with a material with high density. Here, the discharged portion is, for example, a portion where a filter element is to be provided. For this reason, the ink jet head of the ink jet apparatus is also required to have a high density. If an inkjet head having the same width as the width of the substrate can be manufactured with high accuracy, it is possible to draw the entire coated surface of the substrate with high accuracy in one scan. It is very difficult to manufacture, and the number of nozzles that can be manufactured with high accuracy for one inkjet head is about 200 to 400 at most. Therefore, a method is adopted in which a plurality of inkjet heads are mounted on the carriage in the horizontal direction to widen the drawing width. In this case, the assembly is performed by positioning a plurality of ink jet heads in the carriage. When the assembly accuracy is poor and a desired nozzle pitch cannot be obtained, it is necessary to disassemble and reassemble, and there is a problem that it is difficult to adjust the nozzle pitch.

  The present invention has been made in view of the above problems, and a droplet discharge device, an electro-optical device, a method of manufacturing an electro-optical device, which can easily adjust the nozzle pitch and perform drawing with high accuracy, and An object is to provide electronic equipment.

  In order to solve the above-described problems and achieve the object, the present invention provides a droplet discharge apparatus that discharges droplets from a nozzle of a head to a substrate, and includes a stage that holds the substrate and a nozzle row. Alternatively, a plurality of moving means each holding a head group including a plurality of heads and moving in a sub-scanning direction on one axis or on a plurality of axes arranged in parallel, and the plurality of moving means are independently provided And a position control means for adjusting a nozzle pitch by adjusting a relative positional relationship between head groups of the moving means adjacent to each other in the sub-scanning direction or the main scanning direction. Are moved relative to each other in the main scanning direction, and the head group discharges droplets onto the discharge target portion of the substrate.

  Thus, the head group is mounted on each of a plurality of moving means that move in the sub-scanning direction on one axis or on a plurality of axes arranged in parallel, and the plurality of moving means are independently driven by the position control means. Thus, since the nozzle pitch is adjusted by adjusting the relative positional relationship between the head groups of the moving means adjacent in the sub-scanning direction or the main scanning direction, the liquid droplet ejection device is mounted on a plurality of moving means. The nozzle pitch between the head groups can be adjusted, the nozzle pitch can be adjusted by a simple method, and drawing can be performed with high accuracy. As a result, it is possible to provide a droplet discharge device that can easily adjust the nozzle pitch and perform drawing with high accuracy.

  Also, according to a preferred aspect of the present invention, it is desirable that the position control unit moves the plurality of moving units in the sub-scanning direction in synchronization with maintaining the adjusted relative positional relationship. Thereby, it is possible to perform drawing on the entire surface of the substrate with the adjusted nozzle pitch.

  Also, according to a preferred aspect of the present invention, the position control means is configured to make relative movement between head groups of moving means adjacent in the sub-scanning direction or the main scanning direction so that the nozzle pitch in the sub-scanning direction is equal. It is desirable to adjust the positional relationship. Thereby, it is possible to draw on the substrate with a wide drawing width, and it is possible to reduce the number of scans when the substrate is formed.

  Also, according to a preferred aspect of the present invention, the position control means is arranged between head groups of moving means adjacent to the sub-scanning direction or the main scanning direction so that the nozzle linear density in the sub-scanning direction is increased. It is desirable to adjust the relative positional relationship. Thereby, high-density drawing can be performed with a desired nozzle pitch.

  Further, according to a preferred aspect of the present invention, the planar image of the discharged portion has a substantially rectangular shape determined by a long side and a short side, and the stage has a direction of the long side parallel to the sub-scanning direction. And it is desirable to hold | maintain the said board | substrate so that the direction of the said short side may become parallel to the said main scanning direction. As a result, it is possible to discharge droplets onto a rectangular discharge target portion.

  Further, according to a preferred aspect of the present invention, it is desirable that the nozzle rows of the heads constituting the head group are arranged in parallel with the sub-scanning direction. As a result, it is possible to eject liquid droplets with high accuracy with a wide drawing width.

  According to a preferred aspect of the present invention, it is desirable that the nozzle rows of the heads constituting the head group are arranged in an oblique direction with respect to the sub-scanning direction. Thereby, a droplet can be discharged with high accuracy.

  According to a preferred aspect of the present invention, it is desirable to use the droplet discharge device of the present invention in a method for manufacturing an electro-optical device. As a result, the electro-optical device can be drawn with high accuracy.

  According to a preferred aspect of the present invention, the electro-optical device is desirably manufactured using the droplet discharge device of the present invention. Thereby, an electro-optical device capable of performing high-quality display or the like can be provided.

  Further, according to a preferred aspect of the present invention, it is desirable that the electronic apparatus is equipped with the electro-optical device of the present invention. Thereby, an electronic apparatus equipped with an electro-optical device capable of performing high-quality display or the like can be provided.

FIG. 3 is a schematic diagram illustrating a droplet discharge device according to an example. FIG. 3 is a schematic diagram illustrating a carriage according to an embodiment. The schematic diagram which shows the head which concerns on an Example. FIG. 3 is a schematic diagram illustrating a discharge unit of a head according to an example. FIG. 3 is a schematic diagram illustrating a discharge unit of a head according to an example. FIG. 3 is a schematic diagram showing a relative positional relationship of heads in a head group according to an example. The schematic diagram which shows the control part which concerns on an Example. FIG. 3 is a schematic diagram illustrating a head driving unit according to an embodiment. 6 is a timing chart illustrating a drive signal, a selection signal, and an ejection signal in the head drive unit according to the embodiment. The schematic diagram for demonstrating an example of the coating method of the droplet discharge apparatus which concerns on an Example. The schematic diagram for demonstrating the modification of the relative positional relationship of a 1st carriage and a 2nd carriage. The schematic diagram for demonstrating the modification of the arrangement | sequence of a head. The schematic diagram for demonstrating the modification 1 of a carriage. The schematic diagram for demonstrating the modification 1 of a carriage. The schematic diagram for demonstrating the modification 2 of a carriage. The flowchart explaining a color filter manufacturing process. The schematic cross section of the color filter shown to the manufacturing process order. The schematic cross section of the color filter shown to the manufacturing process order. The schematic cross section of the color filter shown to the manufacturing process order. The schematic cross section of the color filter shown to the manufacturing process order. The schematic cross section of the color filter shown to the manufacturing process order. FIG. 3 is a cross-sectional view of a main part illustrating a schematic configuration of a liquid crystal device using a color filter according to an example. FIG. 6 is a cross-sectional view of a main part illustrating a schematic configuration of a liquid crystal device of a second example using the color filter according to the embodiment. FIG. 6 is a cross-sectional view of a main part illustrating a schematic configuration of a liquid crystal device of a third example using the color filter according to the embodiment. Sectional drawing of the principal part of the display apparatus which is an organic electroluminescent apparatus. The flowchart explaining the manufacturing process of the display apparatus which is an organic electroluminescent apparatus. Process drawing explaining formation of an inorganic bank layer. Process drawing explaining formation of an organic substance bank layer. Process drawing explaining the process of forming a positive hole injection / transport layer. Process drawing explaining the state in which the positive hole injection / transport layer was formed. Process drawing explaining the process of forming a blue light emitting layer. Process drawing explaining the state in which the blue light emitting layer was formed. Process drawing explaining the state in which the light emitting layer of each color was formed. Process drawing explaining formation of a cathode. The principal part disassembled perspective view of the display apparatus which is a plasma type display apparatus (PDP apparatus). Sectional drawing of the principal part of the display apparatus which is an electron emission apparatus (FED apparatus). 1 is a perspective view of a personal computer equipped with an electro-optical device according to an embodiment. 1 is a perspective view of a mobile phone including an electro-optical device according to an example.

  Hereinafter, the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art or those that are substantially the same.

  Preferred embodiments of a droplet discharge device, an electro-optical device, a method of manufacturing an electro-optical device, and an electronic apparatus according to the present invention are described in [Droplet discharge apparatus], [Manufacture of electro-optical apparatus], This will be described in detail in the order of “Apply”.

[Droplet discharge device]
The liquid droplet ejection apparatus according to the embodiment of the present invention includes (a whole structure of the liquid droplet ejection apparatus), (carriage), (head), (head group), (control unit), (coating method), (relative positional relationship) A modification example of adjustment, a modification example of the arrangement of the heads, a modification example 1 of the carriage, and a modification example 2 of the carriage will be described in detail in this order.

(Overall configuration of droplet discharge device)
FIG. 1 is a schematic diagram schematically showing the overall configuration of the droplet discharge device 100. As shown in FIG. 1, the droplet discharge apparatus 100 includes a tank 101 that holds a liquid material 111, a tube 110, and a discharge scanning unit to which the liquid material 111 is supplied from the tank 101 via the tube 110. 102. The ejection scanning unit 102 holds a carriage (moving means) 103 that holds a plurality of heads 114 (FIG. 2), a first position control device (position control means) 104 that controls the position of the carriage 103, and a substrate that will be described later. Stage 106, a second position control device 108 that controls the position of the stage 106, and a control unit 112. The tank 101 and the plurality of heads 114 in the carriage 103 are connected by a tube 110, and the liquid material 111 is supplied from the tank 101 to each of the plurality of heads 114.

  The first position control device 104 moves the carriage 103 along the X-axis direction (sub-scanning direction) and the Z-axis direction orthogonal to the X-axis direction in response to a signal from the control unit 112. Further, the first position control device 104 also has a function of rotating the carriage 103 around an axis parallel to the Z axis. In this embodiment, the Z-axis direction is a direction parallel to the vertical direction (that is, the direction of gravitational acceleration). The second position controller 108 moves the stage 106 along the Y-axis direction (main scanning direction) orthogonal to both the X-axis direction and the Z-axis direction in accordance with a signal from the control unit 112. Further, the second position control device 108 also has a function of rotating the stage 106 around an axis parallel to the Z axis. In the present specification, the first position control device 104 and the second position control device 108 may be referred to as “scanning units”.

  The stage 106 has a plane parallel to both the X-axis direction and the Y-axis direction. Further, the stage 106 is configured so that a substrate having a discharge target portion to which a predetermined material is to be applied can be fixed or held on the plane. In the present specification, a substrate having a portion to be ejected may be referred to as a “receiving substrate”.

  In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction coincide with the direction in which one of the carriage 103 and the stage 106 moves relative to the other. The virtual origin of the XYZ coordinate system that defines the X-axis direction, the Y-axis direction, and the Z-axis direction is fixed to the reference portion of the droplet discharge device 100. In this specification, the X coordinate, the Y coordinate, and the Z coordinate are coordinates in such an XYZ coordinate system. Note that the above virtual origin may be fixed to the stage 106 or may be fixed to the carriage 103.

  As described above, the carriage 103 is moved in the X-axis direction by the first position control device 104. On the other hand, the stage 106 is moved in the Y-axis direction by the second position control means 108. That is, the relative position of the head 114 with respect to the stage 106 is changed by the first position control device 104 and the second position control device 108. More specifically, by these operations, the carriage 103, the head group 114G (FIG. 2), the head 114, or the nozzle 118 (FIG. 3) moves with respect to the discharge target portion positioned on the stage 106 with respect to the Z axis. While maintaining a predetermined distance in the direction, the X-axis direction and the Y-axis direction move relatively, that is, relatively scan. Here, the carriage 103 may move in the Y-axis direction with respect to the stationary discharged portion. Then, the material 111 may be discharged from the nozzle 118 to the stationary target portion within a period in which the carriage 103 moves between two predetermined points along the Y-axis direction. “Relative movement” or “relative scanning” includes moving at least one of the side on which the liquid material 111 is discharged and the side on which the discharged material is landed (on the discharged portion side) with respect to the other. .

  Further, the relative movement of the carriage 103, the head group 114G (FIG. 2), the head 114, or the nozzle 118 (FIG. 3) means that their relative positions with respect to the stage, the substrate, or the discharge target portion are changed. Therefore, in this specification, even when the carriage 103, the head group 114G, the head 114, or the nozzle 118 is stationary with respect to the droplet discharge device 100 and only the stage 106 moves, the carriage 103, the head It is expressed that the group 114G, the head 114, or the nozzle 118 moves relative to the stage 106, the substrate, or the discharge target portion. In addition, a combination of relative scanning or relative movement and material ejection may be referred to as “application scanning”.

  The carriage 103 and the stage 106 further have a degree of freedom of translation and rotation other than those described above. However, in the present embodiment, descriptions relating to the degrees of freedom other than the above degrees of freedom are omitted for the purpose of simplifying the explanation.

  The control unit 112 is configured to receive ejection data representing a relative position at which the liquid material 111 is to be ejected from an external information processing apparatus. The detailed configuration and function of the control unit 112 will be described later.

(carriage)
FIG. 2 is a view of the carriage 103 observed from the stage 106 side, and the direction perpendicular to the paper surface of FIG. 2 is the Z-axis direction. 2 is the X-axis direction (sub-scanning direction), and the vertical direction of the paper surface is the Y-axis direction (main scanning direction).

  As shown in FIG. 2, the carriage (moving means) 103 includes a first carriage 103A (moving means) and a second carriage (moving means) 103B arranged on the same XY plane. The first carriage 103A moves in the X-axis direction on the first feed shaft 107A that extends in the X-axis direction under the control of the first position control device 104. The second carriage 103B moves in the X-axis direction on the second feed shaft 107B arranged in parallel on the same XY plane as the first feed shaft 107A in accordance with the control of the first position control device 104. Thus, the first carriage 103A and the second carriage 103B are configured to be movable independently in the X-axis direction.

  The first and second carriages 103A and 103B each hold a head group 114G. Each of the head groups 114G is composed of four heads 114, and the arrangement of the heads 114 has the same configuration. The head 114 has a bottom surface provided with a plurality of nozzles 118 described later. The shape of the bottom surface of the head 114 is a polygon having two long sides and two short sides. As shown in FIG. 2, the bottom surface of the head 114 held by the first and second carriages 103A and 103B faces the stage 106 side, and the long side direction and the short side direction of the head 114 are respectively X It is parallel to the axial direction and the Y-axis direction. Details of the relative positional relationship between the heads 114 will be described later.

  The first position controller 104 relatively moves the first carriage 103A and the second carriage 103B to adjust the nozzle pitch between the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B. Then, the relative position is adjusted so that the nozzle pitch between the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B is a predetermined distance. FIG. 2 shows a case where the drawing width is doubled by arranging the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B in the X-axis direction. As a method for adjusting the relative positional relationship between the first carriage 104A and the second carriage 103B, various methods can be considered. For example, there are first and second methods described below.

(1) First Method When the first carriage 103A and the second carriage 103B are arranged at predetermined positions, the liquid material 111 is drawn on the substrate in correspondence with the test pattern. The amount of deviation of the pattern at the joint between the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B of the test pattern drawn on the substrate is measured, and the first carriage 103A and the first carriage 103A are measured by the amount of deviation. The nozzle pitch is adjusted by relatively moving the two carriages 103B.

(2) Second method Pins are set on the nozzles of the heads 114 of the first carriage 103A and the second carriage 103B, both pins are photographed with a camera, and the distance between the two pins is measured. The amount of deviation is calculated, and the nozzle pitch is adjusted by relatively moving the first carriage 103A and the second carriage 103B by the amount of deviation.

  After adjusting the relative positional relationship, the first position control device 104 synchronizes the first carriage 103A and the second carriage 103B while maintaining the adjusted relative positional relationship between the first carriage 103A and the second carriage 103B. To move in the X-axis direction. Here, after the relative positional relationship is adjusted, the first carriage 103A and the second carriage 103B are moved in synchronization. However, it is not always necessary to synchronize, and it is only necessary to maintain the relative positional relationship after the movement. The same applies to the following description.

  Here, the head group 114G is configured to include four heads, but the number of heads included in the head group 114G is not limited, and one head may be provided. In this specification, a head group refers to a group of one or more heads.

(head)
FIG. 3 shows the bottom surface of the head 114. The head 114 has a plurality of nozzles 118 arranged in the X-axis direction. The plurality of nozzles 118 are arranged such that the nozzle pitch HXP in the X-axis direction of the head 114 is about 70 μm. Here, the “nozzle pitch HXP in the X-axis direction of the head 114” is a pitch between a plurality of nozzle images obtained by projecting all the nozzles 118 in the head 114 on the X-axis along the Y-axis direction. Equivalent to.

  In this embodiment, the plurality of nozzles 118 in the head 114 form a nozzle row 116A and a nozzle row 116B that extend in the X-axis direction. The nozzle row 116A and the nozzle row 116B are arranged in the Y-axis direction. In each of the nozzle row 116A and the nozzle row 116B, 180 nozzles 118 are aligned in the X-axis direction at regular intervals. In this embodiment, this regular interval is about 140 μm. That is, the nozzle pitch LNP of the nozzle row 116A and the nozzle pitch LNP of the nozzle row 116B are both about 140 μm.

  The position of the nozzle row 116B is shifted from the position of the nozzle row 116A in the positive direction in the X-axis direction (the right direction in FIG. 3) by half the nozzle pitch LNP (about 70 μm). Therefore, the nozzle pitch HXP in the X-axis direction of the head 114 is half the length (about 70 μm) of the nozzle pitch LNP of the nozzle row 116A (or nozzle row 116B).

  Therefore, the nozzle line density in the X-axis direction of the head 114 is twice the nozzle line density of the nozzle row 116A (or nozzle row 116B). In the present specification, “nozzle line density in the X-axis direction” means the number per unit length of a plurality of nozzle images obtained by projecting a plurality of nozzles on the X-axis along the Y-axis direction. It corresponds to.

  Of course, the number of nozzle rows included in the head 114 is not limited to two. The head 114 may include M nozzle rows. Here, M is a natural number of 1 or more. In this case, in each of the M nozzle rows, the plurality of nozzles 118 are arranged at a pitch that is M times the nozzle pitch HXP. Further, when M is a natural number of 2 or more, the other (M−1) nozzle rows are only i times as long as the nozzle pitch HXP with respect to one of the M nozzle rows. There is no overlap in the X-axis direction. Here, i is a natural number from 1 to (M−1).

  Now, since each of the nozzle row 116A and the nozzle row 116B is composed of 180 nozzles, one head 114 has 360 nozzles. However, 10 nozzles at both ends of the nozzle row 116A are set as “pause nozzles”. Similarly, 10 nozzles at both ends of the nozzle row 116B are also set as “pause nozzles”. The liquid material 111 is not discharged from these 40 “pause nozzles”. For this reason, of the 360 nozzles 118 in the head 114, 320 nozzles 118 function as nozzles that discharge the liquid material 111. In the present specification, these 320 nozzles 118 may be referred to as “ejection nozzles”.

  In the present specification, for the purpose of explaining the relative positional relationship between the heads 114, the eleventh nozzle 118 from the left among the 180 nozzles 118 included in the nozzle row 116 </ b> A is expressed as “reference nozzle 118 </ b> R” of the head 114. To do. That is, among the 160 discharge nozzles in the nozzle row 116A, the leftmost discharge nozzle is the “reference nozzle 118R” of the head 114. Note that the “reference nozzle 118R” may be specified in the same manner for all the heads 114, so the position of the “reference nozzle 118R” does not have to be the above position.

  As shown in FIGS. 4A and 4B, each head 114 is an inkjet head. More specifically, each head 114 includes a diaphragm 126 and a nozzle plate 128. Between the diaphragm 126 and the nozzle plate 126, a liquid pool 129 in which the liquid material 111 supplied from the tank 101 through the hole 131 is always filled is located.

  In addition, a plurality of partition walls 122 are located between the diaphragm 126 and the nozzle plate 128. A portion surrounded by the diaphragm 126, the nozzle plate 128, and the pair of partition walls 122 is a cavity 120. Since the cavities 120 are provided corresponding to the nozzles 118, the number of the cavities 120 and the number of the nozzles 118 are the same. The liquid material 111 is supplied from the liquid pool 129 to the cavity 120 via the supply port 130 positioned between the pair of partition walls 122.

  On the diaphragm 126, the vibrator 124 is positioned corresponding to each cavity 120. The vibrator 124 includes a piezoelectric element 124C and a pair of electrodes 124A and 124B that sandwich the piezoelectric element 124C. By applying a driving voltage between the pair of electrodes 124A and 124B, the liquid material 111 is discharged from the corresponding nozzle 118. The shape of the nozzle 118 is adjusted so that a liquid material is discharged from the nozzle 118 in the Z-axis direction.

  Here, the “liquid material” in this specification refers to a material having a viscosity that can be discharged from a nozzle. In this case, it does not matter whether the material is aqueous or oily. It is sufficient if it has fluidity (viscosity) that can be discharged from the nozzle, and even if a solid substance is mixed, it may be a fluid as a whole.

  The control unit 112 (FIG. 1) may be configured to give a signal to each of the plurality of transducers 124 independently of each other. That is, the volume of the material 111 ejected from the nozzle 118 may be controlled for each nozzle 118 according to a signal from the control unit 112. In such a case, the volume of the material 111 discharged from each of the nozzles 118 is variable between 0 pl and 42 pl (picoliter). Further, as will be described later, the control unit 112 can also set the nozzle 118 that performs the ejection operation during the application scan and the nozzle 118 that does not perform the ejection operation.

  In this specification, a portion including one nozzle 118, a cavity 120 corresponding to the nozzle 118, and a vibrator 124 corresponding to the cavity 120 may be referred to as “ejection unit 127”. According to this notation, one head 114 has the same number of ejection units 127 as the number of nozzles 118. The discharge unit 127 may include an electrothermal conversion element instead of the piezo element. That is, the discharge unit 127 may have a configuration for discharging a material by utilizing thermal expansion of the material by the electrothermal conversion element.

(Head group)
Next, the relative positional relationship of the four heads 114 in the head group 114G will be described. FIG. 5 shows two head groups 114G adjacent in the Y-axis direction in the carriage 103 (first and second carriages 103A and 103B) of FIG.

  As shown in FIG. 5, each head group 114 </ b> G includes four heads 114. The four heads 114 are arranged in the head group 114 so that the nozzle pitch GXP in the X-axis direction of the head group 114G is ¼ times the nozzle pitch HXP in the X-axis direction of the head 114. . More specifically, with respect to the X coordinate of the reference nozzle 118R of one head 114, the X coordinate of the reference nozzle 118R of the other head 114 is the length of j / 4 times the nozzle pitch HXP in the X-axis direction. Are located without any overlap. Here, j is a natural number from 1 to 3. For this reason, the nozzle pitch GXP in the X-axis direction of the head group 114G is 1/4 times the nozzle pitch HXP.

  In the present embodiment, since the nozzle pitch HXP in the X-axis direction of the head 114 is about 70 μm, the nozzle pitch GXP in the X-axis direction of the head group 114G is about 17.5 μm, which is a quarter of that. Here, the “nozzle pitch GXP of the head group 114G in the X-axis direction” is the interval between a plurality of nozzle images obtained by projecting all the nozzles 118 in the head group 114G onto the X-axis along the Y-axis direction. It corresponds to the pitch.

  Of course, the number of heads 114 included in the head group 114G is not limited to four. The head group 114G may include N heads 114. Here, N is a natural number of 2 or more. In this case, N heads 114 may be arranged in the head group 114G so that the nozzle pitch GXP is 1 / N times as long as the nozzle pitch HXP. Alternatively, with respect to the X coordinate of the reference nozzle 118R in one of the N heads 114, the X coordinate of the reference nozzle 118 in the other (N−1) heads 114 is j / N times the nozzle pitch HXP. It suffices if the length is shifted without overlap. In this case, j is a natural number from 1 to (N−1).

  Hereinafter, the relative positional relationship of the head 114 of this embodiment will be described more specifically.

  First, for the purpose of simplifying the description, the four heads 114 included in the upper left head group 114G in FIG. 5 are respectively represented as a head 1141, a head 1142, a head 1143, and a head 1144 from the top. Similarly, the four heads 114 included in the lower right head group 114G in FIG. 5 are respectively expressed as a head 1145, a head 1146, a head 1147, and a head 1148 from the top.

  The nozzle rows 116A and 116B in the head 1141 are denoted as nozzle rows 1A and 1B, the nozzle rows 116A and 116B in the head 1142 are denoted as nozzle rows 2A and 2B, and the nozzle rows 116A and 116B in the head 1143 are denoted as nozzle row 3A. 3B, and the nozzle rows 116A and 116B in the head 1144 are indicated as nozzle rows 4A and 4B. Similarly, the nozzle rows 116A and 116B in the head 1145 are denoted as nozzle rows 5A and 5B, the nozzle rows 116A and 116B in the head 1146 are denoted as nozzle rows 6A and 6B, and the nozzle rows 116A and 116B in the head 1147 are denoted as nozzle rows. 7A and 7B, and the nozzle arrays 116A and 116B in the head 1148 are expressed as nozzle arrays 8A and 8B.

  Each of these nozzle arrays 1A to 8B is actually composed of 180 nozzles 118. And as above-mentioned, in each of nozzle row 1A-8B, these 180 nozzles are located in a line with the X-axis direction. However, in FIG. 5, for convenience of explanation, each of the nozzle rows 1 </ b> A to 8 </ b> B is drawn to include four discharge nozzles (nozzles 118). Further, in FIG. 5, the leftmost nozzle 118 of the nozzle row 1A is the reference nozzle 118R of the head 1141, the leftmost nozzle 118 of the nozzle row 2A is the reference nozzle 118R of the head 1142, and the leftmost nozzle of the nozzle row 3A. No. 118 is the reference nozzle 118R of the head 1143, the leftmost nozzle 118 of the nozzle row 4A is the reference nozzle 118R of the head 1144, and the leftmost nozzle 118 of the nozzle row 5A is the reference nozzle 118R of the head 1145. .

  The absolute value of the difference between the X coordinate of the reference nozzle 118R of the head 1141 and the X coordinate of the reference nozzle 118R of the head 1142 is ¼ times the nozzle pitch LNP, ie, ½ times the nozzle pitch HXP. Length. In the example of FIG. 5, the position of the reference nozzle 118R of the head 1141 is negative in the X-axis direction by a length that is 1/4 times the nozzle pitch LNP with respect to the position of the reference nozzle 118R of the reference nozzle 118R of the head 1142. It is shifted in the direction (left direction in FIG. 5). However, the direction in which the head 1141 is displaced from the head 1142 may be a positive direction in the X-axis direction (the right direction in FIG. 5).

  The absolute value of the difference between the X coordinate of the reference nozzle 118R of the head 1143 and the X coordinate of the reference nozzle 118R of the head 1144 is ¼ times the nozzle pitch LNP, that is, ½ times the nozzle pitch HXP. Length. In the example of FIG. 5, the position of the reference nozzle 118R of the head 1143 is negative in the X-axis direction by a length that is 1/4 times the nozzle pitch LNP with respect to the position of the reference nozzle 118R of the reference nozzle 118R of the head 1144. It is shifted in the direction (left direction in FIG. 5). However, the direction in which the head 1143 is displaced from the head 1144 may be a positive direction in the X-axis direction (the right direction in FIG. 5).

  The absolute value of the difference between the X coordinate of the reference nozzle 118R of the head 1142 and the X coordinate of the reference nozzle 118R of the head 1143 is a length that is 1/8 times or 3/8 times the nozzle pitch LNP, that is, the nozzle pitch HXP. 1/4 or 3/4 times longer. In the example of FIG. 5, the position of the reference nozzle 118R of the head 1142 is 1/8 of the nozzle pitch LNP, that is, the positive direction in the X-axis direction (17.5 μm) with respect to the position of the reference nozzle 118R of the head 1143 (see FIG. (To the right of 5). However, the direction in which the head 1142 is displaced from the head 1143 may be a negative direction in the X-axis direction (the left direction in FIG. 5).

  In this embodiment, the heads 1141, 1142, 1143, and 1144 are arranged in this order toward the negative direction in the Y-axis direction (downward in the drawing). However, the order of these four heads 114 along the Y-axis direction may not be the order of this embodiment. Specifically, the head 1141 and the head 1142 may be adjacent to each other in the Y-axis direction, and the head 1143 and the head 1144 may be adjacent to each other in the Y-axis direction.

  With the above arrangement, the X coordinate of the leftmost nozzle 118 in the nozzle row 2A and the X coordinate of the leftmost nozzle 118 in the nozzle row 1B and the X coordinate of the leftmost nozzle 118 in the nozzle row 1B The X coordinate of the leftmost nozzle 118 of 3A and the X coordinate of the leftmost nozzle 118 of the nozzle row 4A are accommodated. Similarly, between the X coordinate of the leftmost nozzle 118 of the nozzle row 1B and the X coordinate of the second nozzle 118 from the left of the nozzle row 1A, the X coordinate of the leftmost nozzle 118 of the nozzle row 2B and the nozzle The X coordinate of the leftmost nozzle 118 in the row 3B and the X coordinate of the leftmost nozzle 118 in the nozzle row 4B fit. Similarly, between the X coordinate of the other nozzle 118 in the nozzle row 1A and the X coordinate of the other nozzle 118 in the nozzle row 1B, the X coordinate of the nozzle 118 in the nozzle row 2A (or 2B), the nozzle row 3A The X coordinate of the nozzle 118 in (or 3B) and the X coordinate of the nozzle 118 in the nozzle row 4A (or 4B) are contained.

  More specifically, due to the arrangement of the head described above, the X coordinate of the leftmost nozzle 118 in the nozzle row 1B is the second X from the left of the nozzle row 1A and the X coordinate of the leftmost nozzle 118 in the nozzle row 1A. It almost coincides with the X coordinate of the nozzle 118. Then, the X coordinate of the leftmost nozzle 118 of the nozzle row 2A substantially coincides with the X coordinate of the leftmost nozzle 118 of the nozzle row 1A and the X coordinate of the leftmost nozzle 118 of the nozzle row 1B. . The X coordinate of the leftmost nozzle 118 in the nozzle row 2B substantially coincides with the middle of the X coordinate of the second leftmost nozzle 118 in the nozzle row 1A and the X coordinate of the leftmost nozzle 118 in the nozzle row 1B. . The X coordinate of the leftmost nozzle 118 of the nozzle row 3A substantially coincides with the middle of the X coordinate of the leftmost nozzle 118 of the nozzle row 1A and the X coordinate of the leftmost nozzle 118 of the nozzle row 2A. The X coordinate of the leftmost nozzle 118 in the nozzle row 3B substantially coincides with the middle of the X coordinate of the leftmost nozzle 118 in the nozzle row 1B and the X coordinate of the leftmost nozzle 118 in the nozzle row 2B. The X coordinate of the leftmost nozzle 118 in the nozzle row 4A substantially coincides with the middle of the X coordinate of the leftmost nozzle 118 in the nozzle row 1B and the X coordinate of the leftmost nozzle 118 in the nozzle row 2A. The X coordinate of the leftmost nozzle 118 in the nozzle row 4B substantially coincides with the X coordinate of the second leftmost nozzle 118 in the nozzle row 1A and the X coordinate of the leftmost nozzle 118 in the nozzle row 2B. .

  The arrangement of the heads 1145, 1146, 1147, and 1148, that is, the configuration in the lower right head group 114G in FIG. 5 is the same as the arrangement of the heads 1141, 1142, 1143, and 1144.

  Next, the relative positional relationship between the first carriage 103A and the second carriage 103B is adjusted so that the relative positional relationship between the two head groups 114G adjacent to each other in the X-axis direction becomes the following relationship. The relative positional relationship between the two head groups 114G adjacent to each other in the X-axis direction will be described based on the relative positional relationship between the head 1145 and the head 1141.

  The position of the reference nozzle 118R of the head 1145 is the X-axis direction from the position of the reference nozzle 118R of the head 1141 by the product length of the nozzle pitch HXP in the X-axis direction of the head 114 and the number of ejection nozzles in the head 114. It is shifted in the positive direction. In this embodiment, the nozzle pitch HXP is about 70 μm and the number of ejection nozzles in one head 114 is 320. Therefore, the position of the reference nozzle 118R of the head 1145 is 22.2 from the position of the reference nozzle 118R of the head 1141. It is shifted in the positive direction along the X axis by 4 mm (70 μm × 320). However, in FIG. 5, for convenience of explanation, since the number of ejection nozzles in the head 1141 is eight, the position of the reference nozzle 118R of the head 1145 is shifted by 560 μm (70 μm × 8) from the position of the reference nozzle 1141 of the head 1141. It is drawn to be.

  Since the head 1141 and the head 1145 are arranged as described above, the X coordinate of the rightmost discharge nozzle of the nozzle row 1A and the X coordinate of the leftmost discharge nozzle of the nozzle row 5A are only the nozzle pitch LNP. It is off. For this reason, the nozzle pitch in the X-axis direction of the two heads 114G as a whole is 1/4 times the nozzle pitch HXP in the X-axis direction of the head 114.

  In addition, the six head groups 114G are arranged so that the nozzle pitch in the X-axis direction as a whole of the carriage 103 is also 17.5 μm, that is, 1/4 times the nozzle pitch HXP in the X-axis direction of the head 114. Is arranged.

(Control part)
Next, the configuration of the control unit 112 will be described. As shown in FIG. 6, the control unit 112 includes an input buffer memory 200, a storage unit 202, a processing unit 204, a scan driving unit 206, and a head driving unit 208. The buffer memory 202 and the processing unit 204 are connected so that they can communicate with each other. The processing unit 204 and the storage unit 202 are connected to be communicable with each other. The processing unit 204 and the scan driving unit 206 are connected so as to communicate with each other. The processing unit 204 and the head driving unit 20 are connected to be communicable with each other. The scanning drive unit 206 is connected to the first position control unit 104 and the second position control unit 108 so as to communicate with each other. Similarly, the head driving unit 208 is connected to each of the plurality of heads 114 so as to communicate with each other.

  The input buffer memory 200 receives ejection data for ejecting droplets of the liquid material 111 from the external information processing apparatus. The ejection data indicates data representing the relative positions of all the ejected parts on the substrate and the number of relative scans required to apply the liquid material 111 to all the ejected parts to a desired thickness. Data, data specifying the nozzle 118 functioning as the on-nozzle 118A, and data specifying the nozzle 118 functioning as the off-nozzle 118B. The on-nozzle 118A and the off-nozzle 118B will be described later. The input buffer memory 200 supplies the ejection data to the processing unit 204, and the processing unit 204 stores the ejection data in the storage unit 202. In FIG. 6, the storage means 202 is a RAM.

  The processing unit 204 gives data indicating the relative position of the nozzle 118 to the discharge target unit to the scan driving unit 206 based on the discharge data in the storage unit 202. The scanning drive unit 206 supplies the first position control means 104 and the second position control means 108 with a drive signal corresponding to this data and an ejection period EP (FIG. 7) described later. As a result, the head 114 performs relative scanning with respect to the discharge target portion. On the other hand, the processing unit 204 gives a selection signal SC for designating ON / OFF of the nozzle 118 at each ejection timing to the head driving unit 208 based on the ejection data stored in the storage unit 202 and the ejection cycle EP. . The head driving unit 208 gives the head 114 an ejection signal ES necessary for ejecting the liquid material 111 based on the selection signal SC. As a result, the liquid material 111 is discharged as droplets from the corresponding nozzle 118 in the head 114.

  The control unit 112 may be a computer including a CPU, a ROM, and a RAM. In this case, the function of the control unit 112 is realized by a software program executed by a computer. Of course, the control unit 112 may be realized by a dedicated circuit (hardware).

  Next, the configuration and function of the head drive unit 208 in the control unit 112 will be described.

  As illustrated in FIG. 7A, the head driving unit 208 includes one driving signal generation unit 203 and a plurality of analog switches AS. As illustrated in FIG. 7B, the drive signal generation unit 203 generates a drive signal DS. The potential of the drive signal DS changes with respect to the reference potential L over time. Specifically, the drive signal DS includes a plurality of ejection waveforms P that are repeated at the ejection cycle EP. Here, the discharge waveform P corresponds to a drive voltage waveform to be applied between a pair of electrodes of the corresponding vibrator 124 in order to discharge one droplet from the nozzle 118.

  The drive signal DS is supplied to each input terminal of the analog switch AS. Each of the analog switches AS is provided corresponding to each of the ejection units 127. That is, the number of analog switches AS and the number of ejection units 127 (that is, the number of nozzles 118) are the same.

  The processing unit 204 gives a selection signal SC indicating ON / OFF of the nozzle 118 to each analog switch AS. Here, the selection signal SC can take either a high level or a low level independently for each analog switch AS. On the other hand, the analog switch AS supplies the ejection signal ES to the electrode 124A of the vibrator 124 according to the drive signal DS and the selection signal SC. Specifically, when the selection signal SC is at a high level, the analog switch AS propagates the drive signal DS as the ejection signal ES to the electrode 124A. On the other hand, when the selection signal SC is at a low level, the potential of the ejection signal ES output from the analog switch AS becomes the reference potential L. When the drive signal DS is given to the electrode 124A of the vibrator 124, the liquid material 111 is discharged from the nozzle 118 corresponding to the vibrator 124. A reference potential L is applied to the electrode 124B of each vibrator 124.

  In the example shown in FIG. 7B, a high level period and a low level in each of the two selection signals SC so that the ejection waveform P appears in each of the two ejection signals ES in a cycle 2EP that is twice the ejection cycle EP. Level period is set. As a result, the liquid material 111 is discharged from each of the two corresponding nozzles 118 with a period of 2EP. Further, a common drive signal DS from the common drive signal generation unit 203 is given to each of the vibrators 124 corresponding to these two nozzles 118. For this reason, the liquid material 111 is discharged from the two nozzles 118 at substantially the same timing.

  With the above configuration, the droplet discharge device 100 performs application scanning of the liquid material 111 in accordance with the discharge data given to the control unit 112.

(Application method)
With reference to FIG. 8, an example of a coating method of the droplet discharge device 100 will be described. FIG. 8 is an explanatory diagram for explaining an example of a coating method of the droplet discharge device 100. In FIG. 8, a substrate 300 is held on the stage 106. In the base body 300, discharged portions 302 partitioned by banks 301 are formed in a matrix. The discharged portion 302 is a region where pixels and the like are formed. The planar image of the discharge target 302 has a substantially rectangular shape determined by the long side and the short side. The stage 106 holds the substrate 300 such that the long side direction of the discharged portion 302 of the substrate 300 is parallel to the X axis direction and the short side direction is parallel to the Y axis direction.

  In FIG. 8, first, the first position control device 104 aligns the position of the first carriage 103 </ b> A with the position of the substrate 300 on the stage 106. The nozzle pitch of the joint between the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B is set to a predetermined nozzle pitch (in the example shown in FIG. 5, the nozzle pitch GXP in the X-axis direction is 17.5 μm). As described above, the second carriage 103B is moved in the X-axis direction by the method described above. Thereby, the relative positional relationship between the first carriage 103A and the second carriage 103B is adjusted.

  Then, while moving the first and second carriages 103A and 103B relative to the stage 106 in the Y-axis direction, the head group 114G of the first and second carriages 103A and 103B along the Y-axis direction covers the substrate 300. A droplet of the liquid material 111 is discharged to the discharge unit 302.

  Next, while maintaining the relative positional relationship between the first carriage 103A and the second carriage 103B, the first carriage 103A and the second carriage 103B are moved in synchronization with the drawing width (effective scanning width) in the X-axis direction. Thereafter, the first and second carriages 103A and 103B are moved relative to the stage 106 in the Y-axis direction, and the head group 114G of the first and second carriages 103A and 103B is moved along the Y-axis direction. Liquid droplets of the liquid material 111 are discharged to the discharge target portion 302. A similar operation is executed until the entire coated surface of the substrate 300 is completed.

(Modification of relative position adjustment)
FIG. 9A is a schematic diagram for explaining a modification of the relative positional relationship between the first carriage 103A and the second carriage 103B. In the above embodiment, the first carriage 103A and the second carriage 103B are arranged so that the drawing width is doubled by arranging the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B in the X-axis direction. The positional relationship is adjusted, but the present invention is not limited to this. For example, as shown in FIG. 9A, the first carriage 103A and the head group 114G of the first carriage 103A and the head group 114G of the second carriage 103B are arranged in the Y axis direction so that the nozzle linear density is increased. The relative positional relationship of the second carriage 103B may be adjusted. As described above, the relative positional relationship between the first and second carriages 103A and 103B includes a configuration in which the print width is doubled by arranging in the X-axis direction, and a linear density of the nozzles in the Y-axis direction is increased. There is a form.

(Modification of head arrangement)
FIG. 9B is a schematic diagram for explaining a modification of the arrangement of the heads 114. In the above embodiment, the head 114 is mounted on the carriage 103 so that the nozzle rows are parallel to the X-axis direction. On the other hand, in the modified example, as shown in FIG. 9B, the head 114 is mounted on the carriage 103 so that the nozzle row of the head 114 is inclined with respect to the X-axis direction. As shown in the figure, each head group 114G has two heads 114. If the nozzle rows are arranged obliquely with respect to the X-axis direction, high-density drawing can be performed with a small number of heads.

  As described above, according to the droplet discharge device 100 according to the present embodiment, a plurality of feeds each holding the head group 114 including one or a plurality of heads 114 having a nozzle row and arranged in parallel with each other. The first and second carriages 103A and 103B and the first and second carriages 103A and 103B that respectively move in the sub-scanning direction (X-axis direction) on the shafts 107A and 107B are independently driven, and the main scanning direction (Y And a first position control device 104 that adjusts the relative positional relationship between the head groups 114G adjacent in the axial direction to adjust the nozzle pitch, and performs main scanning of the first and second carriages 103A and 103B with respect to the stage 106. In the droplet discharge device 100, the first and second carriages 103 are configured so that the head group 114G discharges droplets to the discharge target portion 302 of the substrate 300 by relatively moving in the direction (X-axis direction). Moves the B, adjustment of the nozzle pitch between the head groups 114G can be performed, it is possible to adjust the nozzle pitch in a simple manner, it can be drawn with high accuracy.

(Carriage modification 1)
FIG. 10 is a schematic diagram for explaining a first modification of the carriage. In the above embodiment, the first carriage 103A and the second carriage 103B are arranged on different feed shafts. On the other hand, in the first modification, a plurality of carriages are arranged on the same feed shaft. As illustrated in FIG. 10A, the carriage 401 includes a first carriage 401A, a second carriage 401B, and a third carriage 401C. The first, second, and third carriages 401 </ b> A, B, and C are disposed on the same feed shaft 402. The first, second, and third carriages 401A, B, and C have the same structure, have a parallelogram shape in plan view, and have two sides parallel to the X-axis direction and a predetermined inclination in the Y-axis direction. And two parallel sides.

  The first, second, and third carriages 401A, B, and C each hold a head group 403G. Each of the head groups 403G includes three heads 114, and the arrangement of the heads 114 has the same configuration. The three heads constituting the head group 403G are arranged in the upper right, the center, and the lower left side by side in the X-axis direction so that the drawing width is three times the drawing width of each head 114. The head 114 has a bottom surface provided with a plurality of nozzles 118 described later. The bottom surface of the head 114 held by the first, second, and third carriages 401A, B, and C faces the stage 106 side, and the long side direction and the short side direction of the head 114 are respectively in the X-axis direction. And parallel to the Y-axis direction.

  When the carriages adjacent to each other in the X-axis direction are close to each other, the upper right head 114 of the head group 403G of one carriage and the lower left head 114 of the head group 403G of the other carriage are at least a part of the nozzle row. Are configured to overlap in the Y-axis direction. In the example shown in the figure, the upper right head 114 of the head group 403G of the first carriage 401A and the lower left head 114 of the head group 403G of the second carriage 401B, the upper right head 114 of the head group 403G of the second carriage 402A, and At least part of the nozzle rows overlaps in the Y-axis direction between the lower left head 114 of the head group 403G of the third carriage 401C.

  The first position control device 104 relatively moves the first carriage 401A and the second carriage 401B to adjust the nozzle pitch between the head group 403G of the first carriage 401A and the head group 403G of the second carriage 401B. The relative positional relationship is adjusted so that the nozzle pitch between the head group 403G of the first carriage 401A and the head group 402 of the second carriage 401B is a predetermined distance (in this case, θ is also adjusted). The method for adjusting the relative positional relationship can be performed by the same method as in the above-described embodiment.

  Next, the first position control device 104 relatively moves the third carriage 401C to adjust the nozzle pitch between the head group 403G of the second carriage 401B and the head group 403G of the third carriage 401C, and then moves the second carriage 401C. The relative positional relationship is adjusted so that the nozzle pitch between the head group 403G of the carriage 401A and the head group 403G of the third carriage 401C is a predetermined distance (in this case, θ is also adjusted). After adjusting the relative positional relationship, the first position control device 104 moves in the X-axis direction while synchronizing the first, second, and third carriages 401A, B, and C while maintaining the relative positional relationship. Let In this manner, by adjusting the relative positional relationship between the carriages, it is possible to perform drawing with a nozzle width that is three times the drawing width of one head group 114G and adjusted with high accuracy.

  According to the droplet discharge device 100 according to the first modification, each of the head groups 403G including one or a plurality of heads 114 each having a nozzle row is held, and the same feed shaft 402 is moved in the sub-scanning direction (X-axis). The first, second, and third carriages 401A, B, and C that respectively move in the direction) and the first, second, and third carriages 401A, B, and C are independently driven to perform the sub-scanning direction (X-axis direction). ) And a first position control device 104 that adjusts the relative positional relationship between the head groups 403G adjacent to each other to adjust the nozzle pitch, and the first, second, and third carriages 401A, B, and C with respect to the stage 106 are provided. Are moved relative to each other in the main scanning direction (X-axis direction), and the head group 403G discharges droplets to the discharge target 302 of the substrate 300. Therefore, in the droplet discharge device 100, the first, second, second 3 carriage 401 , B, to move the C, adjustment of the nozzle pitch between the head groups 403G can be performed, it is possible to adjust the nozzle pitch in a simple manner, it can be drawn with high accuracy.

  In the example shown in FIG. 10A, when the carriages adjacent in the X-axis direction are brought close to each other, the upper right head 114 of the head group 403G of one carriage and the lower left head 114 of the head group 403G of the other carriage. In order to allow at least a part of the nozzle rows to overlap in the Y-axis direction, the carriage has a parallelogram shape, but this is not a limitation. For example, as shown in FIG. 10B, the first, second, and third carriages 410A, B, and C arranged on the feed shaft 412 are formed with convex portions and concave portions, and are adjacent in the X-axis direction. A configuration may be adopted in which at least a part of the nozzle rows of the heads 114 overlap in the Y-axis direction.

  Also in the first modification, the nozzle rows of the head 114 may be arranged obliquely with respect to the X-axis direction.

(Carriage modification 2)
FIG. 11 is a schematic diagram for explaining a second modification of the carriage. In the second modification, a plurality of carriages are arranged on two feed shafts. In FIG. 11, the first feed shaft 432 and the second feed shaft 442 are arranged in parallel on the same XY plane. The carriage 431 includes first and second carriages 431A and 431B disposed on the first feed shaft 432, and third and fourth carriages 441A and B disposed on the second feed shaft 442.

  In the figure, a case will be described in which drawing is performed with a drawing width four times that of one head group 403G. The first position control device 104 relatively moves the first carriage 431A and the third carriage 441A to adjust the nozzle pitch between the head group 403G of the first carriage 431A and the head group 403G of the third carriage 441A. The relative positional relationship is adjusted so that the nozzle pitch between the head group 403G of the first carriage 431A and the head group 403G of the third carriage 441A is a predetermined distance.

  Next, the first position controller 104 relatively moves the second carriage 431B to adjust the nozzle pitch between the head group 403G of the third carriage 441A and the head group 403G of the second carriage 431B. The relative positional relationship is adjusted so that the nozzle pitch between the head group 403G of the carriage 441A and the head group 403G of the second carriage 431B is a predetermined distance (in this case, θ is also adjusted).

  Finally, the first position control device 104 relatively moves the fourth carriage 441B to adjust the nozzle pitch between the head group 403G of the second carriage 431B and the head group 403G of the fourth carriage 441B. The relative positional relationship is adjusted so that the nozzle pitch between the head group 403G of the carriage 431B and the head group 403G of the fourth carriage 441B is a predetermined distance. After adjusting the relative positional relationship, the first position control device 104 synchronizes the first, second, third, and fourth carriages 431A, B, 441A, and B while maintaining the adjusted relative positional relationship. And move in the X-axis direction. In this way, by adjusting the relative positional relationship between the carriages, it is possible to perform drawing with a nozzle width that is four times as wide as that of one head group 114G and adjusted with high accuracy.

  Here, the case of widening the drawing width has been described, but the first carriage 431A and the third carriage 441A are overlapped in the Y-axis direction, and the second carriage 431B and the fourth carriage 441B are overlapped in the Y-axis direction. The relative positional relationship may be adjusted so that the nozzle linear density increases.

  According to the droplet discharge device 100 according to Modification 2, each of the head groups 403G including one or a plurality of heads 114 each having a nozzle row is held, and the two shafts 432 and 442 arranged in parallel are subsidized. First and second carriages 431A, 431B, third and fourth carriages 441A, 441B, first, second carriages 431A, 431B, third and fourth carriages 441A, respectively moving in the scanning direction (X-axis direction), A first position control device 104 that independently drives 441B and adjusts the relative positional relationship between the head groups 403G adjacent in the main scanning direction (Y-axis direction) to adjust the nozzle pitch. Thus, the first and second carriages 431A and 431B and the third and fourth carriages 441A and 441B are relatively moved in the sub-scanning direction (X-axis direction), and the head group 114 is moved. In the droplet discharge device 100, the first and second carriages 431A and 431B, the third and fourth carriages 441A and 441B are applied to the stage 106 in the droplet discharge apparatus 100. The nozzle pitch between the head groups 403G can be adjusted by moving the main scanning direction (Y-axis direction), and the nozzle pitch can be adjusted by a simple method, and drawing can be performed with high accuracy. Can do.

  In the second modification, the nozzle rows of the head 114 may be arranged in an oblique direction with respect to the X-axis direction.

[Manufacture of electro-optical devices]
Next, as an electro-optical device (flat panel display) manufactured using the droplet discharge device 100 of this embodiment, a color filter, a liquid crystal display device, an organic EL device, a PDP device, an electron emission device (FED device, SED). The structure and the manufacturing method thereof will be described by taking a device) as an example.

  First, a method for manufacturing a color filter incorporated in a liquid crystal display device, an organic EL device or the like will be described. FIG. 12 is a flowchart showing the manufacturing process of the color filter, and FIG. 13 is a schematic cross-sectional view of the color filter 500 (filter base body 500A) of this embodiment shown in the order of the manufacturing process.

  First, in the black matrix forming step (S11), a black matrix 502 is formed on a substrate (W) 501 as shown in FIG. The black matrix 502 is formed of metal chromium, a laminate of metal chromium and chromium oxide, resin black, or the like. A sputtering method, a vapor deposition method, or the like can be used to form the black matrix 502 made of a metal thin film. Further, when forming the black matrix 502 made of a resin thin film, a gravure printing method, a photoresist method, a thermal transfer method, or the like can be used.

  Subsequently, in the bank formation step (S12), the bank 503 is formed in a state of being superimposed on the black matrix 502. That is, first, as shown in FIG. 13B, a resist layer 504 made of a negative transparent photosensitive resin is formed so as to cover the substrate 501 and the black matrix 502. Then, an exposure process is performed with the upper surface covered with a mask film 505 formed in a matrix pattern shape. Further, as shown in FIG. 13C, the resist layer 504 is patterned by etching an unexposed portion of the resist layer 504 to form a bank 503. When the black matrix is formed from resin black, it is possible to use both the black matrix and the bank. The bank 503 and the black matrix 502 below the bank 503 serve as partition wall portions 507b that partition each pixel region 507a, and the colored layers (film forming portions) 508R, 508G, and 508B are formed by the head 114 in the subsequent colored layer forming step. In this case, the landing area of the functional droplet is defined.

  The filter substrate 500A is obtained through the above black matrix forming step and bank forming step. In the present embodiment, as the material for the bank 503, a resin material whose surface is lyophobic (hydrophobic) is used. Since the surface of the substrate (glass substrate) 501 is lyophilic (hydrophilic), the droplets into each pixel region 507a surrounded by the bank 503 (partition wall portion 507b) in the colored layer forming step described later. The landing position accuracy is improved.

  Next, in the colored layer forming step (S13), as shown in FIG. 13-4, functional droplets are ejected by the head 114 and landed in each pixel region 507a surrounded by the partition wall portion 507b. In this case, the functional liquid (filter material) of three colors R, G, and B is introduced using the head 114, and functional droplets are ejected. Note that the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  Thereafter, the functional liquid is fixed through a drying process (a process such as heating), and three colored layers 508R, 508G, and 508B are formed. Once the colored layers 508R, 508G, and 508B are formed, the process proceeds to the protective film forming step (S14), and as shown in FIG. 13-5, the upper surfaces of the substrate 501, the partition wall portion 507b, and the colored layers 508R, 508G, and 508B. A protective film 509 is formed so as to cover the surface. That is, after the protective film coating liquid is discharged over the entire surface of the substrate 501 where the colored layers 508R, 508G, and 508B are formed, the protective film 509 is formed through a drying process. After forming the protective film 509, the color filter 500 is obtained by cutting the substrate 501 for each effective pixel region.

  FIG. 14 is a cross-sectional view of a principal part showing a schematic configuration of a passive matrix liquid crystal device (liquid crystal device) as an example of a liquid crystal display device using the color filter 500 described above. By attaching auxiliary elements such as a liquid crystal driving IC, a backlight, and a support to the liquid crystal display device 520, a transmissive liquid crystal display device as a final product can be obtained. Since the color filter 500 is the same as that shown in FIG. 13, the corresponding parts are denoted by the same reference numerals, and description thereof is omitted.

  The liquid crystal device 520 is roughly composed of a color filter 500, a counter substrate 521 made of a glass substrate, and a liquid crystal layer 522 made of STN (Super Twisted Nematic) liquid crystal composition sandwiched between them, The filter 500 is arranged on the upper side (observer side) in the figure. Although not shown, polarizing plates are provided on the outer surfaces of the counter substrate 521 and the color filter 500 (surfaces opposite to the liquid crystal layer 522 side), and the polarizing plates located on the counter substrate 521 side are also provided. A backlight is disposed outside.

  On the protective film 509 of the color filter 500 (on the liquid crystal layer side), a plurality of strip-shaped first electrodes 523 elongated in the left-right direction in FIG. 14 are formed at predetermined intervals. The color of the first electrode 523 A first alignment film 524 is formed so as to cover the surface opposite to the filter 500 side. On the other hand, a plurality of strip-shaped second electrodes 526 elongated in a direction orthogonal to the first electrode 523 of the color filter 500 are formed on the surface of the counter substrate 521 facing the color filter 500 at a predetermined interval. A second alignment film 527 is formed so as to cover the surface of the two electrodes 526 on the liquid crystal layer 522 side. The first electrode 523 and the second electrode 526 are formed of a transparent conductive material such as ITO (Indium Tin Oxide).

  The spacer 528 provided in the liquid crystal layer 522 is a member for keeping the thickness (cell gap) of the liquid crystal layer 522 constant. The sealing material 529 is a member for preventing the liquid crystal composition in the liquid crystal layer 522 from leaking to the outside. Note that one end of the first electrode 523 extends to the outside of the sealing material 529 as a lead-out wiring 523a. A portion where the first electrode 523 and the second electrode 526 intersect with each other is a pixel, and the color layers 508R, 508G, and 508B of the color filter 500 are located in the portion that becomes the pixel.

  In a normal manufacturing process, patterning of the first electrode 523 and application of the first alignment film 524 are performed on the color filter 500 to create a portion on the color filter 500 side. Patterning of the electrode 526 and application of the second alignment film 527 are performed to create a portion on the counter substrate 521 side. Thereafter, a spacer 528 and a sealing material 529 are formed in the portion on the counter substrate 521 side, and the portion on the color filter 500 side is bonded in this state. Next, liquid crystal constituting the liquid crystal layer 522 is injected from the inlet of the sealing material 529, and the inlet is closed. Thereafter, both polarizing plates and the backlight are laminated.

  The droplet discharge device 100 of this embodiment applies, for example, a spacer material (functional liquid) that constitutes the above cell gap, and seals before attaching the color filter 500 side portion to the counter substrate 521 side portion. Liquid crystal (functional liquid) can be uniformly applied to a region surrounded by the material 529. In addition, the above-described sealing material 529 can be printed by the head 114. Furthermore, the first and second alignment films 524 and 527 can be applied by the head 114.

  FIG. 15 is a cross-sectional view of an essential part showing a schematic configuration of a second example of a liquid crystal device using the color filter 500 manufactured in the present embodiment. The liquid crystal device 530 is significantly different from the liquid crystal device 520 in that the color filter 500 is arranged on the lower side (the side opposite to the observer side) in the figure. The liquid crystal device 530 is generally configured by sandwiching a liquid crystal layer 532 made of STN liquid crystal between a color filter 500 and a counter substrate 531 made of a glass substrate or the like. Although not shown, polarizing plates and the like are provided on the outer surfaces of the counter substrate 531 and the color filter 500, respectively.

  On the protective film 509 of the color filter 500 (on the liquid crystal layer 532 side), a plurality of strip-shaped first electrodes 533 elongated in the depth direction in the figure are formed at predetermined intervals, and the liquid crystal of the first electrodes 533 is formed. A first alignment film 534 is formed so as to cover the surface on the layer 532 side. A plurality of strip-shaped second electrodes 536 extending in a direction orthogonal to the first electrode 533 on the color filter 500 side are formed on the surface of the counter substrate 531 facing the color filter 500 at a predetermined interval. A second alignment film 537 is formed so as to cover the surface of the second electrode 536 on the liquid crystal layer 532 side.

  The liquid crystal layer 532 is provided with a spacer 538 for keeping the thickness of the liquid crystal layer 532 constant and a sealing material 539 for preventing the liquid crystal composition in the liquid crystal layer 532 from leaking to the outside. Yes. Similarly to the liquid crystal device 520 described above, a portion where the first electrode 533 and the second electrode 536 intersect with each other is a pixel, and the colored layers 508R, 508G, and 508B of the color filter 500 are located at the portion that becomes the pixel. Is configured to do.

  FIG. 16 shows a third example in which a liquid crystal device is configured using a color filter 500 to which the present invention is applied, and is an exploded perspective view showing a schematic configuration of a transmissive TFT (Thin Film Transistor) type liquid crystal device. It is. In the liquid crystal device 550, the color filter 500 is arranged on the upper side (observer side) in the figure.

  The liquid crystal device 550 includes a color filter 500, a counter substrate 551 disposed so as to face the color filter 500, a liquid crystal layer (not shown) sandwiched therebetween, and an upper surface side (observer side) of the color filter 500. The polarizing plate 555 and the polarizing plate (not shown) arranged on the lower surface side of the counter substrate 551 are roughly configured. A liquid crystal driving electrode 556 is formed on the surface of the protective film 509 of the color filter 500 (the surface on the counter substrate 551 side). The electrode 556 is made of a transparent conductive material such as ITO, and is a full surface electrode that covers the entire region where a pixel electrode 560 described later is formed. An alignment film 557 is provided so as to cover the surface of the electrode 556 opposite to the pixel electrode 560.

  An insulating layer 558 is formed on the surface of the counter substrate 551 facing the color filter 500, and the scanning lines 561 and the signal lines 562 are formed on the insulating layer 558 in a state of being orthogonal to each other. A pixel electrode 560 is formed in a region surrounded by the scanning lines 561 and the signal lines 562. In an actual liquid crystal device, an alignment film is provided on the pixel electrode 560, but the illustration is omitted.

  In addition, a thin film transistor 563 including a source electrode, a drain electrode, a semiconductor, and a gate electrode is incorporated in a portion surrounded by the cutout portion of the pixel electrode 560 and the scanning line 561 and the signal line 562. . The thin film transistor 563 is turned on / off by application of signals to the scanning line 561 and the signal line 562 so that energization control to the pixel electrode 560 can be performed.

  Note that the liquid crystal devices 520, 530, and 550 in the above examples are transmissive, but a reflective liquid crystal device or a transflective liquid crystal device is provided by providing a reflective layer or a transflective layer. You can also.

  Next, FIG. 17 is a cross-sectional view of a main part of a display area of an organic EL device (hereinafter simply referred to as a display device 600).

  The display device 600 is schematically configured with a circuit element portion 602, a light emitting element portion 603, and a cathode 604 stacked on a substrate (W) 601. In the display device 600, light emitted from the light emitting element portion 603 to the substrate 601 side is transmitted through the circuit element portion 602 and the substrate 601 and emitted to the observer side, and the light emitting element portion 603 is opposite to the substrate 601. After the light emitted to the side is reflected by the cathode 604, the light passes through the circuit element portion 602 and the substrate 601 and is emitted to the observer side.

  A base protective film 606 made of a silicon oxide film is formed between the circuit element portion 602 and the substrate 601, and an island-shaped semiconductor film 607 made of polycrystalline silicon is formed on the base protective film 606 (on the light emitting element portion 603 side). Is formed. In the left and right regions of the semiconductor film 607, a source region 607a and a drain region 607b are formed by high concentration cation implantation, respectively. A central portion where no positive ions are implanted is a channel region 607c.

  In the circuit element portion 602, a transparent gate insulating film 608 covering the base protective film 606 and the semiconductor film 607 is formed, and a position corresponding to the channel region 607c of the semiconductor film 607 on the gate insulating film 608 is formed. For example, a gate electrode 609 made of Al, Mo, Ta, Ti, W or the like is formed. On the gate electrode 609 and the gate insulating film 608, a transparent first interlayer insulating film 611a and a second interlayer insulating film 611b are formed. Further, contact holes 612a and 612b are formed through the first and second interlayer insulating films 611a and 611b and communicating with the source region 607a and the drain region 607b of the semiconductor film 607, respectively.

  A transparent pixel electrode 613 made of ITO or the like is patterned and formed in a predetermined shape on the second interlayer insulating film 611b, and the pixel electrode 613 is connected to the source region 607a through the contact hole 612a. . A power line 614 is disposed on the first interlayer insulating film 611a, and the power line 614 is connected to the drain region 607b through the contact hole 612b.

  Thus, the driving thin film transistors 615 connected to the pixel electrodes 613 are formed in the circuit element portion 602, respectively.

  The light emitting element portion 603 includes a functional layer 617 stacked on each of the plurality of pixel electrodes 613, and a bank portion 618 provided between each pixel electrode 613 and the functional layer 617 to partition each functional layer 617. It is roughly structured. The pixel electrode 613, the functional layer 617, and the cathode 604 provided on the functional layer 617 constitute a light emitting element. Note that the pixel electrode 613 is formed by patterning in a substantially rectangular shape in plan view, and a bank portion 618 is formed between the pixel electrodes 613.

The bank unit 618 is laminated on the inorganic bank layer 618a (first bank layer) 618a formed of an inorganic material such as SiO, SiO ₂ , TiO _{2, and the} like, and is made of an acrylic resin, a polyimide resin, or the like. It is composed of an organic bank layer 618b (second bank layer) having a trapezoidal cross section formed of a resist having excellent heat resistance and solvent resistance. A part of the bank unit 618 is formed on the peripheral edge of the pixel electrode 613. An opening 619 that gradually expands upward with respect to the pixel electrode 613 is formed between the bank portions 618.

The functional layer 617 includes a hole injection / transport layer 617a formed in a stacked state on the pixel electrode 613 in the opening 619, and a light emitting layer 617b formed on the hole injection / transport layer 617a. Has been. In addition, you may further form the other functional layer which has another function adjacent to this light emitting layer 617b. For example, it is possible to form an electron transport layer.
The hole injection / transport layer 617a has a function of transporting holes from the pixel electrode 613 side and injecting them into the light emitting layer 617b. The hole injection / transport layer 617a is formed by discharging a first composition (functional liquid) containing a hole injection / transport layer forming material. As the hole injection / transport layer forming material, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrenesulfonic acid is used.

  The light emitting layer 617b emits light in red (R), green (G), or blue (B), and discharges a second composition (functional liquid) containing a light emitting layer forming material (light emitting material). Is formed. The solvent (nonpolar solvent) of the second composition is preferably insoluble in the hole injection / transport layer 120a. For example, cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene, tetramethylbenzene, or the like is used. be able to. By using such a nonpolar solvent for the second composition of the light emitting layer 617b, the light emitting layer 617b can be formed without re-dissolving the hole injection / transport layer 617a.

  The light emitting layer 617b is configured such that the holes injected from the hole injection / transport layer 617a and the electrons injected from the cathode 604 are recombined in the light emitting layer to emit light.

  The cathode 604 is formed so as to cover the entire surface of the light emitting element portion 603, and plays a role of flowing current to the functional layer 617 in a pair with the pixel electrode 613. Note that a sealing member (not shown) is disposed on the cathode 604.

Next, a manufacturing process of the display device 600 will be described with reference to FIGS.
As shown in FIG. 18, the display device 600 includes a bank part forming step (S21), a surface treatment step (S22), a hole injection / transport layer forming step (S23), a light emitting layer forming step (S24), It is manufactured through an electrode formation step (S25). In addition, a manufacturing process is not restricted to what is illustrated, and when other processes are removed as needed, it may be added.

  First, in the bank part forming step (S21), as shown in FIG. 19, an inorganic bank layer 618a is formed on the second interlayer insulating film 611b. The inorganic bank layer 618a is formed by forming an inorganic film at a formation position and then patterning the inorganic film by a photolithography technique or the like. At this time, a part of the inorganic bank layer 618 a is formed so as to overlap with the peripheral edge of the pixel electrode 613. When the inorganic bank layer 618a is formed, an organic bank layer 618b is formed on the inorganic bank layer 618a as shown in FIG. The organic bank layer 618b is also formed by patterning using a photolithography technique or the like in the same manner as the inorganic bank layer 618a. In this way, the bank portion 618 is formed. Accordingly, an opening 619 opening upward with respect to the pixel electrode 613 is formed between the bank portions 618. The opening 619 defines a pixel region.

  In the surface treatment step (S22), a lyophilic process and a lyophobic process are performed. The regions to be subjected to the lyophilic treatment are the first stacked portion 618aa of the inorganic bank layer 618a and the electrode surface 613a of the pixel electrode 613. These regions are made lyophilic by plasma treatment using, for example, oxygen as a treatment gas. Is done. This plasma treatment also serves to clean the ITO that is the pixel electrode 613. In addition, the lyophobic treatment is performed on the wall surface 618s of the organic bank layer 618b and the upper surface 618t of the organic bank layer 618b. ) By performing this surface treatment process, when forming the functional layer 617 using the head 114, the functional liquid droplets can be more reliably landed on the pixel area, and the functional liquid droplets landed on the pixel area Can be prevented from overflowing from the opening 619.

  Then, the display device base 600A is obtained through the above steps. The display device substrate 600A is placed on the stage 106 of the droplet discharge device 100 shown in FIG. 1, and the following hole injection / transport layer forming step (S23) and light emitting layer forming step (S24) are performed.

  As shown in FIG. 21, in the hole injection / transport layer forming step (S23), the first composition containing the hole injection / transport layer forming material is discharged from the head 114 into each opening 619 that is a pixel region. . Thereafter, as shown in FIG. 22, a drying process and a heat treatment are performed to evaporate the polar solvent contained in the first composition, thereby forming a hole injection / transport layer 617a on the pixel electrode (electrode surface 613a) 613.

  Next, the light emitting layer forming step (S24) will be described. In this light emitting layer forming step, as described above, in order to prevent re-dissolution of the hole injection / transport layer 617a, the hole injection / transport layer 617a is used as a solvent for the second composition used in forming the light emitting layer. A non-polar solvent insoluble in. However, since the hole injection / transport layer 617a has a low affinity for the nonpolar solvent, the hole injection / transport layer 617a has a low affinity even if the second composition containing the nonpolar solvent is discharged onto the hole injection / transport layer 617a. There is a possibility that the injection / transport layer 617a and the light emitting layer 617b cannot be adhered to each other, or the light emitting layer 617b cannot be applied uniformly. Therefore, in order to increase the surface affinity of the hole injection / transport layer 617a with respect to the nonpolar solvent and the light emitting layer forming material, it is preferable to perform a surface treatment (surface modification treatment) before forming the light emitting layer. In this surface treatment, a surface modifying material which is the same solvent as the non-polar solvent of the second composition used in the formation of the light emitting layer or a similar solvent is applied on the hole injection / transport layer 617a, and this is applied. This is done by drying. By performing such treatment, the surface of the hole injection / transport layer 617a is easily adapted to the nonpolar solvent. In the subsequent step, the second composition containing the light emitting layer forming material is added to the hole injection / transport layer. It can be uniformly applied to 617a.

  Then, as shown in FIG. 23, the second composition containing the light-emitting layer forming material corresponding to one of the colors (blue (B) in the example of FIG. 23) is used as a functional droplet as a pixel region ( A predetermined amount is driven into the opening 619). The second composition driven into the pixel region spreads on the hole injection / transport layer 617a and fills the opening 619. Even if the second composition deviates from the pixel region and lands on the upper surface 618t of the bank portion 618, the upper composition 618t is subjected to the liquid repellent treatment as described above. Things are easy to roll into the opening 619.

  Thereafter, by performing a drying process or the like, the discharged second composition is dried, and the nonpolar solvent contained in the second composition is evaporated. As shown in FIG. 24, the hole injection / transport layer 617a is dried. A light emitting layer 617b is formed thereon. In the case of this figure, a light emitting layer 617b corresponding to blue (B) is formed.

  Similarly, using the head 114, as shown in FIG. 25, the same steps as in the case of the light emitting layer 617b corresponding to the blue (B) described above are sequentially performed, and other colors (red (R) and green (G) The light emitting layer 617b corresponding to) is formed. Note that the order in which the light-emitting layers 617b are formed is not limited to the illustrated order, and may be formed in any order. For example, the order of formation can be determined according to the light emitting layer forming material. Further, the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  As described above, the functional layer 617, that is, the hole injection / transport layer 617a and the light emitting layer 617b are formed on the pixel electrode 613. And it transfers to a counter electrode formation process (S25).

In the counter electrode forming step (S25), as shown in FIG. 26, a cathode 604 (counter electrode) is formed on the entire surface of the light emitting layer 617b and the organic bank layer 618b by, for example, vapor deposition, sputtering, CVD, or the like. In this embodiment, the cathode 604 is formed by, for example, laminating a calcium layer and an aluminum layer. At the top of the cathode 604, Al film as the electrode, Ag film and a protective layer of SiO _2, SiN, or the like for its antioxidant is appropriately provided.

  After forming the cathode 604 in this way, the display device 600 is obtained by performing other processes such as a sealing process for sealing the upper part of the cathode 604 with a sealing member and a wiring process.

  Next, FIG. 27 is an exploded perspective view of an essential part of a plasma display device (PDP device: hereinafter simply referred to as a display device 700). In the figure, the display device 700 is shown with a part thereof cut away. The display device 700 is schematically configured to include a first substrate 701 and a second substrate 702 that are disposed to face each other, and a discharge display portion 703 that is formed therebetween. The discharge display unit 703 includes a plurality of discharge chambers 705. Among the plurality of discharge chambers 705, the three discharge chambers 705 of the red discharge chamber 705R, the green discharge chamber 705G, and the blue discharge chamber 705B are arranged to form one pixel.

  Address electrodes 706 are formed in stripes at predetermined intervals on the upper surface of the first substrate 701, and a dielectric layer 707 is formed so as to cover the address electrodes 706 and the upper surface of the first substrate 701. On the dielectric layer 707, partition walls 708 are provided so as to be positioned between the address electrodes 706 and along the address electrodes 706. The partition 708 includes one extending on both sides in the width direction of the address electrode 706 as shown, and one not shown extending in the direction orthogonal to the address electrode 706. A region partitioned by the partition 708 is a discharge chamber 705.

  A phosphor 709 is disposed in the discharge chamber 705. The phosphor 709 emits red (R), green (G), or blue (B) fluorescence, and the red phosphor 709R is disposed at the bottom of the red discharge chamber 705R, and the green discharge chamber 705G. A green phosphor 709G and a blue phosphor 709B are arranged at the bottom and the blue discharge chamber 705B, respectively.

  On the lower surface of the second substrate 702 in the drawing, a plurality of display electrodes 711 are formed in stripes at predetermined intervals in a direction orthogonal to the address electrodes 706. A dielectric layer 712 and a protective film 713 made of MgO or the like are formed so as to cover them. The first substrate 701 and the second substrate 702 are bonded so that the address electrodes 706 and the display electrodes 711 face each other in a state of being orthogonal to each other. The address electrode 706 and the display electrode 711 are connected to an AC power source (not shown). When the electrodes 706 and 711 are energized, the phosphor 709 emits light in the discharge display portion 703, and color display is possible.

  In this embodiment, the address electrode 706, the display electrode 711, and the phosphor 709 can be formed using the droplet discharge device 100 shown in FIG. Hereinafter, a process of forming the address electrode 706 on the first substrate 701 will be exemplified. In this case, the following process is performed with the first substrate 701 placed on the X-axis table 25 of the droplet discharge device 100. First, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the address electrode formation region as a functional droplet by the head 114. This liquid material is obtained by dispersing conductive fine particles such as metal in a dispersion medium as a conductive film wiring forming material. As the conductive fine particles, metal fine particles containing gold, silver, copper, palladium, nickel, or the like, a conductive polymer, or the like is used.

  When the replenishment of the liquid material is completed for all the address electrode formation regions to be replenished, the address material 706 is formed by drying the discharged liquid material and evaporating the dispersion medium contained in the liquid material. .

By the way, although the formation of the address electrode 706 has been exemplified in the above, the display electrode 711 and the phosphor 709 can also be formed through the above steps.
In the case of forming the display electrode 711, as in the case of the address electrode 706, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the display electrode formation region as a functional droplet.
In the case of forming the phosphor 709, a liquid material (functional liquid) containing a fluorescent material corresponding to each color (R, G, B) is discharged as a droplet from the head 114, and a discharge chamber of the corresponding color. Land within 705.

  Next, FIG. 28 is a cross-sectional perspective view of an essential part of an electron emission device (FED device: hereinafter simply referred to as a display device 800). In the drawing, a part of the display device 800 is shown as a cross section. The display device 800 includes a first substrate 801, a second substrate 802, and a field emission display unit 803 formed therebetween, which are disposed to face each other. The field emission display unit 803 includes a plurality of electron emission units 805 arranged in a matrix.

  On the upper surface of the first substrate 801, a first element electrode 806a and a second element electrode 806b constituting the cathode electrode 806 are formed so as to be orthogonal to each other. In addition, an element film 807 having a gap 808 is formed in a portion partitioned by the first element electrode 806a and the second element electrode 806b. That is, a plurality of electron emission portions 805 are configured by the first element electrode 806a, the second element electrode 806b, and the element film 807. The element film 807 is made of, for example, palladium oxide (PdO), and the gap 808 is formed by forming after the element film 807 is formed.

  An anode electrode 809 that faces the cathode electrode 806 is formed on the lower surface of the second substrate 802. A lattice-shaped bank portion 811 is formed on the lower surface of the anode electrode 809, and a phosphor 813 is disposed in each downward opening 812 surrounded by the bank portion 811 so as to correspond to the electron emission portion 805. Yes. The phosphor 813 emits fluorescence of any one of red (R), green (G), and blue (B), and each opening 812 has a red phosphor 813R, a green phosphor 813G, and a blue color. The phosphors 813B are arranged in a predetermined pattern.

  The first substrate 801 and the second substrate 802 configured as described above are bonded together with a minute gap. In this display device 800, electrons that jump out of the first element electrode 806 a or the second element electrode 806 b that are cathodes are applied to the phosphor 813 formed on the anode electrode 809 that is an anode through the element film (gap 808) 807. Excited light emission enables color display.

  Also in this case, as in the other embodiments, the first element electrode 806a, the second element electrode 806b, and the anode electrode 809 can be formed using the droplet discharge device 100, and each color phosphor 813R, 813G and 813B can be formed using the droplet discharge device 100.

  In addition, as other electro-optical devices, devices including preparation of a preparation in addition to metal wiring formation, lens formation, resist formation, and light diffuser formation are conceivable. By using the droplet discharge device 100 described above for manufacturing various electro-optical devices (devices), various electro-optical devices can be efficiently manufactured.

[Application to electronic devices]
Next, a specific example of an electronic apparatus to which the electro-optical device according to the invention can be applied will be described with reference to FIG. FIG. 29A is a perspective view illustrating an example in which the electro-optical device according to the invention is applied to a display unit of a portable personal computer (so-called notebook personal computer) 900. As shown in the figure, a personal computer 900 includes a main body 902 having a keyboard 901 and a display 903 to which the electro-optical device according to the invention is applied. FIG. 29B is a perspective view illustrating an example in which the electro-optical device according to the invention is applied to the display unit of the mobile phone 950. As shown in the figure, the cellular phone 950 includes a plurality of operation buttons 951, a receiving mouth 952, a mouthpiece 953, and a display unit 954 to which the electro-optical device according to the invention is applied.

  The electro-optical device according to the present invention includes a portable information device called PDA (Personal Digital Assistants), a personal computer, a workstation, a digital still camera, an in-vehicle monitor, a digital video camera, in addition to the above-described cellular phone and notebook computer. Can be widely applied to electronic devices such as liquid crystal televisions, viewfinder type, monitor direct view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, and POS terminals. .

  The droplet discharge device according to the present invention can be widely used for film formation in various industrial fields. The electro-optical device according to the present invention includes an organic EL electroluminescence, a liquid crystal display device, an organic TFT display device, a plasma display device, an electrophoretic display device, and an electron emission display device (Field Emission Display and Surface-Conduction Electoron-Emitter Display). Etc.), LED (light emitting diode) display devices, electrochromic glass devices, and electro-optical devices of electronic paper devices. The electronic device according to the present invention includes a mobile phone, a portable information device called PDA (Personal Digital Assistants), a portable personal computer, a personal computer, a workstation, a digital still camera, an in-vehicle monitor, a digital video camera, and a liquid crystal display. It can be widely used in electronic devices such as televisions, viewfinder type, monitor direct view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, and POS terminals.

  100 droplet discharge device, 102 discharge scanning unit, 103 carriage, 103A first carriage, 103B second carriage, 104 first position control device, 106 stage, 107A, first feed shaft, 107B second feed shaft, 108 second Position control device, 111 liquid material, 112 control unit, 114 head, 114G head group, 116A, 116B nozzle row, 118 nozzle, 118R reference nozzle, 124 vibrator, 124A, 124B electrode, 124C piezo element, 127 ejection unit, 203 drive signal generation unit, 208 head drive unit, 300 base, 301 bank, 302 ejected unit, 401 carriage, 401A first carriage, 401B second carriage, 401C third carriage, 402 feed shaft, 403G head group 410 carriage, 411A first carriage, 411B second carriage, 411C third carriage, 412 feed shaft, 431 carriage, 431A first carriage, 431B second carriage, 432 first feed shaft, 441A third carriage, 441B fourth carriage 442 Second feed shaft.

Claims (10)

In a droplet discharge device that discharges droplets from a nozzle of a head to a substrate,
A stage for holding the substrate;
A plurality of moving means each holding a head group including one or a plurality of heads each having a nozzle row and moving in a sub-scanning direction on one axis or on a plurality of axes arranged in parallel;
Position control means for independently driving the plurality of moving means, and adjusting a nozzle pitch by adjusting a relative positional relationship between head groups of the moving means adjacent in the sub-scanning direction or the main scanning direction;
With
A liquid droplet ejection apparatus, wherein the carriage is moved relative to the stage in the main scanning direction, and the liquid droplets are ejected to an ejection portion of the substrate by the head group.   The liquid droplet ejection apparatus according to claim 1, wherein the position control unit moves the plurality of movement units in the sub-scanning direction in synchronization with the adjusted relative positional relationship maintained.   The position control means adjusts the relative positional relationship between the head groups of the moving means adjacent in the sub-scanning direction or the main scanning direction so that the nozzle pitches in the sub-scanning direction are equally spaced. The droplet discharge device according to claim 1 or 2.   The position control means adjusts the relative positional relationship between head groups of moving means adjacent to the sub-scanning direction or the main scanning direction so that the linear density of the nozzles in the sub-scanning direction is increased. The droplet discharge device according to claim 1 or 2. The planar image of the discharged portion has a substantially rectangular shape determined by a long side and a short side,
2. The stage holds the substrate such that the direction of the long side is parallel to the sub-scanning direction and the direction of the short side is parallel to the main scanning direction. The droplet discharge device according to claim 4.   6. The droplet discharge device according to claim 1, wherein nozzle rows of the heads constituting the head group are arranged in parallel to the sub-scanning direction.   6. The liquid droplet ejection apparatus according to claim 1, wherein nozzle rows of the heads constituting the head group are arranged in an oblique direction with respect to the sub-scanning direction.   An electro-optical device manufactured using the droplet discharge device according to claim 1.   An electro-optical device manufacturing method, wherein the electro-optical device is manufactured using the droplet discharge device according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 8.

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