JP2010276901A - Exposure device, chuck position detection method of exposure device, and manufacturing method of panel substrate for display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately detect a chuck position using a laser measuring system. <P>SOLUTION: An exposure device includes: a substrate 1 mounted on a chuck 10; a light source 41 for generating laser beam; mirrors 43 and 45 attached to the chuck 10; and interferometers 42 and 44 for measuring the interference of the laser beam from a light source 41, with the laser beam which is reflected by mirrors 43 and 45 from the source 41 and irradiated to mirrors 43 and 45. Distortions of the mirrors 43 and 45 are measured by the interferometers 42 and 44 of the laser measuring system, by moving the chuck 10 by an X-stage 5 and a Y-stage 7, beforehand, by using the laser measuring system for detecting a position of the chuck 10 from a measurement result of the interferometers 42 and 44. When the position of the chuck 10 is detected by the laser measuring system, the detection result of the laser measuring system is corrected, according to the distortion of the mirrors 43 and 45 which are measured beforehand. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an exposure apparatus for exposing a substrate, a chuck position detection method for the exposure apparatus, and a method for manufacturing a display panel substrate using them in manufacturing a display panel substrate such as a liquid crystal display device, and more particularly to a laser. The present invention relates to an exposure apparatus that detects the position of a chuck on which a substrate is mounted using a length measurement system, a chuck position detection method for the exposure apparatus, and a method for manufacturing a display panel substrate using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  Japanese Patent Application Laid-Open No. 2004-228561 discloses a technique for detecting the position of a chuck on which a substrate is mounted using a laser length measurement system and positioning the substrate with high accuracy in a proximity exposure apparatus. Further, in Patent Document 2, before the substrate is mounted on the chuck, the tilt of the substrate in the θ direction is detected, and the substrate is rotated relative to the chuck by rotating the chuck in the θ direction by the detected tilt of the substrate. A technique for preventing the chuck from being mounted in a posture rotated in the θ direction is disclosed.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Literature 3, Patent Literature 4, and Patent Literature 5.

JP 2005-331542 A JP 2008-9012 A JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  As described in Patent Document 1 and Patent Document 2, the position detection of the chuck by the laser length measuring system is performed by attaching a mirror to the chuck and irradiating the mirror with laser light from the light source. Interference with the laser beam reflected by the interferometer is performed. It is difficult to process the reflecting surface of the mirror completely flat, and if the mirror attached to the chuck is distorted, the detection result of the chuck position includes an error due to the distortion of the mirror.

  Further, before starting the position detection of the chuck by the laser length measurement system, it is necessary to perform a parallel operation for making each side of the chuck parallel to the X direction or the Y direction. In the paralleling operation, the chuck is moved by the stage, the position of the chuck is detected at two or more positions by the laser length measurement system, and the inclination of the chuck in the θ direction is detected. At that time, if the laser length measurement mirror is distorted, the tilt of the chuck in the θ direction cannot be detected accurately.

  An object of the present invention is to accurately detect the position of a chuck using a laser length measurement system. Another object of the present invention is to accurately detect the inclination of the chuck in the θ direction using a laser length measuring system. Another object of the present invention is to manufacture a high-quality display panel substrate by accurately adjusting the position of the substrate.

  An exposure apparatus of the present invention irradiates a mirror with a chuck on which a substrate is mounted, a stage that moves the chuck, a light source that generates laser light, a mirror attached to the chuck, and laser light from the light source. Laser interferometer that measures the interference between the laser beam and the laser beam reflected by the mirror, and a laser length measurement system that detects the position of the chuck from the measurement result of the interferometer, and a control that controls the stage and the laser length measurement system And the control means moves in advance the chuck by the stage, measures the distortion of the mirror by the laser measuring system interferometer, and detects the position of the chuck by the laser measuring system in advance. The detection result of the laser measurement system is corrected according to the distortion of the mirror.

  Further, the chuck position detection method of the exposure apparatus of the present invention includes mounting a substrate on a chuck, irradiating the mirror with a light source that generates laser light, a mirror attached to the chuck, and laser light from the light source. It has an interferometer that measures the interference between the laser beam and the laser beam reflected by the mirror, and uses a laser length measurement system that detects the position of the chuck from the measurement result of the interferometer. Measures the distortion of the mirror with a laser measurement system interferometer, and corrects the detection result of the laser measurement system according to the mirror distortion measured in advance when the position of the chuck is detected by the laser measurement system It is.

  When the chuck is moved in advance, the distortion of the mirror is measured by the interferometer of the laser length measurement system, and the position of the chuck is detected by the laser length measurement system, the laser measurement is performed according to the mirror distortion measured in advance. Since the detection result of the long system is corrected, the position of the chuck can be accurately detected even if the mirror attached to the chuck is distorted.

  Further, the exposure apparatus of the present invention includes a detecting means for detecting the amount of movement of the stage, and the control means is irradiated with laser light from the interferometer of the laser length measurement system based on the amount of movement of the stage detected by the detecting means. The position on the mirror is determined, the correction amount at the position is calculated from the previously measured distortion of the mirror, and the detection result of the laser length measurement system is corrected. Further, the chuck position detection method of the exposure apparatus of the present invention detects the moving amount of the stage, and the position on the mirror irradiated with the laser light from the laser measuring system interferometer from the detected moving amount of the stage. The correction amount at the position is calculated from the mirror distortion measured in advance, and the detection result of the laser length measurement system is corrected.

  In order to correct the detection results of the laser length measurement system, the position on the mirror irradiated with the laser light from the laser length measurement interferometer is determined, and the correction at that position is determined from the previously measured mirror distortion. The amount needs to be calculated. When determining the position on the mirror to which the laser beam from the laser measuring system interferometer is irradiated, if the detection result of the chuck position by the laser measuring system is used, the detection result contains an error due to the distortion of the mirror. Since it is included, the position cannot be determined accurately. Therefore, separately from the chuck position detection by the laser length measurement system, the amount of movement of the stage is detected, and the detected amount of movement of the stage is used on the mirror irradiated with the laser light from the laser length measurement system interferometer. Determine the position. Even if the mirror attached to the chuck is distorted, the position on the mirror irradiated with the laser light from the laser measuring system interferometer is accurately determined. Therefore, the correction amount at the position is accurately calculated from the mirror distortion measured in advance, and the position of the chuck is detected with higher accuracy.

  Furthermore, in the exposure apparatus of the present invention, the control device moves the chuck by the stage, detects the position of the chuck at two or more locations by the laser length measurement system, and performs laser length measurement according to the mirror distortion measured in advance. The inclination of the chuck in the θ direction is detected by correcting the detection result of the system. Also, the chuck position detection method of the exposure apparatus of the present invention moves the chuck by the stage, detects the chuck position at two or more locations by the laser length measurement system, and performs laser measurement according to the mirror distortion measured in advance. By correcting the detection result of the long system, the inclination of the chuck in the θ direction is detected. Since the chuck position is accurately detected at two or more locations, the inclination of the chuck in the θ direction can be accurately detected.

  The method for producing a display panel substrate of the present invention is to expose a substrate using any of the above exposure apparatuses, or adjust the position of the substrate using the chuck position detection method of any of the above exposure apparatuses. The substrate is exposed. By using the above exposure apparatus or the chuck position detection method of the exposure apparatus, the position of the chuck can be detected with high accuracy using a laser length measurement system. A panel substrate can be manufactured.

  According to the exposure apparatus and the chuck position detection method of the exposure apparatus of the present invention, the chuck is moved in advance by the stage, the distortion of the mirror is measured by the interferometer of the laser measurement system, and the position of the chuck is measured by the laser measurement system. Is detected, the position of the chuck can be accurately detected using the laser length measurement system by correcting the detection result of the laser length measurement system in accordance with the mirror distortion measured in advance.

  Further, according to the exposure apparatus and the chuck position detection method of the exposure apparatus of the present invention, the amount of movement of the stage is detected, and laser light from the interferometer of the laser length measurement system is irradiated from the detected amount of movement of the stage. The laser from the laser measuring system interferometer by determining the position on the mirror and calculating the correction amount at the position from the mirror distortion measured in advance and correcting the detection result of the laser measuring system. Since the position on the mirror irradiated with light can be accurately determined, the correction amount at the position can be calculated with high accuracy from the previously measured distortion of the mirror, and the position of the chuck can be detected with higher accuracy. can do.

  Furthermore, according to the exposure apparatus and the chuck position detection method of the exposure apparatus of the present invention, the chuck is moved by the stage, the position of the chuck is detected at two or more positions by the laser length measurement system, and the pre-measured mirror distortion is detected. Accordingly, by correcting the detection result of the laser length measurement system and detecting the inclination of the chuck in the θ direction, the inclination of the chuck in the θ direction can be accurately detected using the laser length measurement system.

  According to the display panel substrate manufacturing method of the present invention, the position of the chuck can be accurately detected using a laser length measurement system. A substrate can be manufactured.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of a laser length measurement system. It is a figure explaining parallel alignment work. It is a figure explaining parallel alignment work. It is a figure which shows schematic structure of an example of a drawing control part. It is a figure explaining the data for correction memorized by memory. It is a flowchart which shows operation | movement of an XY position correction | amendment part. It is a figure which shows schematic structure of the other example of a drawing control part. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The present embodiment shows an example of an exposure apparatus that draws a pattern on a substrate. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, A laser length measurement system, a laser length measurement system control device 40, a stage drive circuit 60, and a main control device 70 are included. 2 and 3, the laser light source 41 of the laser measurement system, the laser measurement system control device 40, the stage drive circuit 60, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and seven or less or nine or more light beams are used. An irradiation device may be used.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction.

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 5 is a diagram for explaining the operation of the laser length measurement system. In FIG. 5, the gate 11 and the light beam irradiation device 20 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 to the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position of the chuck 10 in the X direction from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser light source 41 and the laser reflected by the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  Hereinafter, a chuck position detection method of an exposure apparatus according to an embodiment of the present invention will be described. In the present embodiment, before starting the exposure of the substrate, the parallel alignment work of the chuck 10 and the distortion of the bar mirrors 43 and 45 are measured. 6 and 7 are diagrams for explaining the parallel operation. The main controller 70 controls the stage drive circuit 60 to move the chuck 10 by the X stage 5 so that the laser light from the laser interferometer 44 is irradiated to predetermined positions on both ends of the bar mirror 45. The laser interferometer 44 measures interference between the laser light from the laser light source 41 and the laser light reflected by the bar mirror 45 at predetermined positions on both ends of the bar mirror 45. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from two measurement results of the laser interferometer 44, and the main control device 70 determines the chuck 10 based on the difference between the two detection results. Is detected in the θ direction. Based on the detected inclination of the chuck 10 in the θ direction, the main controller 70 controls the stage drive circuit 60 so that each side of the chuck 10 is parallel to the X direction or the Y direction. 10 is rotated.

  After the parallel alignment operation of the chuck 10 is completed, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 by the X stage 5 and measures the distortion of the bar mirror 45 at a plurality of locations by the laser interferometer 44. To do. The main controller 70 creates correction data for correcting the detection result of the position of the chuck 10 in the Y direction from the measurement result, and stores it in the memory 76 described later. Subsequently, the main controller 70 controls the stage driving circuit 60 to move the chuck 10 by the Y stage 7 and measures the distortion of the bar mirror 43 by a laser interferometer 42 at a plurality of locations. The main controller 70 creates correction data for correcting the detection result of the position of the chuck 10 in the X direction from the measurement result, and stores it in the memory 76 described later.

  In FIG. 1, the main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 8 is a diagram illustrating a schematic configuration of an example of the drawing control unit. The drawing control unit 71 includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, an XY position correction unit 77, and a travel error detection unit 78. The memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as addresses.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The memory 76 stores correction data for correcting the detection result of the position of the chuck 10 in the X and Y directions created by the main controller 70 from the measurement results of the distortion of the bar mirrors 43 and 45. FIG. 9 is a diagram for explaining correction data stored in the memory. FIG. 9A shows correction data for correcting the detection result of the position in the Y direction. The correction data for correcting the detection result of the position in the Y direction includes the X coordinate X (n) of each measurement point at which the distortion on the bar mirror 45 is measured, and the laser beam from the laser interferometer 44 is measured on the bar mirror 45. This is composed of a correction value ΔY (n) for correcting the detection result of the position of the chuck 10 in the Y direction when the point is irradiated. FIG. 9B shows correction data for correcting the detection result of the position in the X direction. The correction data for correcting the detection result of the position in the X direction includes the Y coordinate Y (n) of each measurement point at which the distortion on the bar mirror 43 is measured, and the laser beam from the laser interferometer 42 measured on the bar mirror 43. It comprises a correction value ΔX (n) for correcting the detection result of the position of the chuck 10 in the X direction when the point is irradiated.

  In FIG. 8, the XY position correction unit 77 corrects the detection result of the laser measurement system control device 40 using the correction data stored in the memory 76. FIG. 10 is a flowchart showing the operation of the XY position correction unit. The XY position correction unit 77 first inputs the position in the X direction and the position in the Y direction of the chuck 10 detected by the laser length measurement system control device 40 (step 301), and from the input position in the X direction of the chuck 10 The position on the bar mirror 45 irradiated with the laser beam from the laser interferometer 44 is determined (step 302). Subsequently, the XY position correction unit 77 searches the X coordinate before and after the determined position on the bar mirror 45 from the X coordinate of each measurement point stored in the memory 76 (step 303), and the front and rear X coordinate and the front and rear The correction value at the X coordinate is read (step 304). Then, the XY position correction unit 77 calculates a correction value ΔY of the position of the chuck 10 in the Y direction at the determined position on the bar mirror 45 from the read X coordinates and correction values by a linear approximation formula (step 305). ), The input position in the Y direction is corrected by the calculated correction value ΔY (step 306).

  Next, the XY position correcting unit 77 determines the position on the bar mirror 43 to which the laser beam from the laser interferometer 42 is irradiated from the corrected position of the chuck 10 in the Y direction (step 307). Subsequently, the XY position correction unit 77 searches the Y coordinate before and after the determined position on the bar mirror 43 from the Y coordinate of each measurement point stored in the memory 76 (step 308), and the front and rear Y coordinates and the front and rear Y coordinates. The correction value at the Y coordinate is read (step 309). Then, the XY position correction unit 77 calculates a correction value ΔX of the position in the X direction of the chuck 10 at the determined position on the bar mirror 43 from the read Y coordinates and correction values by a linear approximation formula (step 310). ), The input position in the X direction is corrected by the calculated correction value ΔX (step 311).

  The chuck 10 is moved in advance by the X stage 5 and the Y stage 7, the distortion of the bar mirrors 43 and 45 is measured by the laser interferometers 42 and 44 of the laser length measurement system, and the position of the chuck 10 is detected by the laser length measurement system. Since the detection result of the laser length measurement system is corrected according to the distortion of the bar mirrors 43 and 45 measured in advance, the XY direction of the chuck 10 even if the bar mirrors 43 and 45 attached to the chuck 10 are distorted. Is accurately detected.

  FIG. 11 is a diagram illustrating a schematic configuration of another example of the drawing control unit. In step 302 of FIG. 10, the XY position correction unit 77 ′ of this example counts the pulse signal from the encoder 32 to detect the movement amount of the X stage 5, and from the detected movement amount of the X stage 5, the laser The position on the bar mirror 45 to which the laser beam from the interferometer 44 is irradiated is determined. The subsequent operations are the same as those in the flowchart of FIG.

  When determining the position on the bar mirror 45 irradiated with the laser light from the laser interferometer 44, if the detection result of the position of the chuck 10 in the X direction by the laser length measurement system is used, the distortion of the bar mirror 43 is used as the detection result. The position cannot be accurately determined. In this example, apart from detecting the position of the chuck 10 in the X direction by the laser length measurement system, the amount of movement of the X stage 5 is detected, and the laser light from the laser interferometer 44 is detected from the detected amount of movement of the X stage 5. Since the position on the irradiated bar mirror 45 is determined, even if the bar mirror 43 attached to the chuck 10 is distorted, the position on the bar mirror 45 irradiated with the laser light from the laser interferometer 44 is accurately determined. It is determined. Therefore, the correction amount ΔY of the position in the Y direction at the position is accurately calculated from the distortion of the bar mirror 45 measured in advance, and the position of the chuck 10 in the Y direction is detected with higher accuracy.

  For example, before mounting the substrate 1 on the chuck 10 using the technique described in Patent Document 2, the tilt of the substrate 1 in the θ direction is detected, and the chuck 10 is rotated in the θ direction by the detected tilt of the substrate 1. In this case, if the chuck 10 is greatly rotated in the θ direction, the laser interferometers 42 and 44 cannot receive the laser beam reflected by the bar mirrors 43 and 45 attached to the chuck. Interrupted. In that case, after the substrate 1 is mounted on the chuck 10, the rotation of the chuck 10 is returned to its original state, and then the position detection of the chuck by the laser length measuring system is resumed. Need to be done again.

  6 and 7, the main controller 70 moves the chuck 10 with the X stage 5 when measuring the distortion of the bar mirrors 43 and 45 and generating correction data and then performing parallel operation of the chuck 10. Then, two or more positions in the Y direction of the chuck 10 are detected by the laser length measurement system, and the detection result of the laser length measurement system is corrected by the XY position correction units 77 and 77 ′, and the inclination of the chuck 10 in the θ direction is corrected. Is detected. Since the position of the chuck 10 in the Y direction is accurately detected at two or more locations, the inclination of the chuck 10 in the θ direction is accurately detected.

  8 and 11, the laser measurement system control device 40 detects the position of the chuck 10 in the XY direction before the exposure of the substrate 1 at the exposure position, and the XY position correction units 77 and 77 ' Using the correction data stored in 76, the detection result of the laser length measurement system controller 40 is corrected. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 corrected by the XY position correction units 77 and 77 ′. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7.

  8 and 11, the laser length measurement system control device 40 detects the position of the chuck 10 in the XY direction, and the XY position correction units 77 and 77 ′ use the correction data stored in the memory 76, The detection result of the laser length measurement system control device 40 is corrected. The travel error detection unit 78 detects a travel error such as rolling or yawing when the X stage 5 moves in the X direction from the position in the XY direction of the chuck 10 corrected by the XY position correction units 77 and 77 ′. By detecting the position of the chuck 10 using the laser length measurement system, the position of the chuck 10 can be detected with high accuracy, so that the running error of the X stage 5 can be detected with high accuracy.

  The center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34 to detect the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction. Determine the XY coordinates of the point. Then, the center point coordinate determination unit 74 corrects the determined XY coordinates of the center point of the chuck 10 based on the detection result of the travel error detection unit 78.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 corrected by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  The travel error of the X stage 5 is detected, the coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 are corrected based on the detection result of the travel error of the X stage 5, and the drawing data of the corrected coordinates Are supplied to the DMD drive circuit 27 of each light beam irradiation device 20, so that even if a running error such as rolling or yawing occurs in the X stage 5, the pattern is drawn with high accuracy.

  12 to 15 are diagrams for explaining scanning of the substrate by the light beam. 12 to 15 show an example in which the entire substrate 1 is scanned by performing four scans in the X direction of the substrate 1 with the eight light beams from the eight light beam irradiation apparatuses 20. 12-15, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 12 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 12 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 13 shows the second scan, and a pattern is drawn in the scan area shown in gray in FIG. 13 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 14 shows the third scan, and a pattern is drawn in the scan area shown in gray in FIG. 14 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 15 shows the fourth scan. With the fourth scan in the X direction, the pattern is drawn in the scan area shown in gray in FIG. 15, and the scan of the entire substrate 1 is completed.

  Even when the substrate 1 is scanned with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, patterns drawn by the light beams from the respective light beam irradiation apparatuses 20 are prevented from being shifted from each other due to a running error of the X stage 5. Therefore, the pattern can be drawn with high accuracy. Then, by scanning the substrate 1 with a plurality of light beams from the plurality of light beam irradiation devices 20 in parallel, it is possible to shorten the time required for scanning the entire substrate 1 and to shorten the tact time. it can.

  12 to 15 illustrate an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the chuck 10 is moved in advance by the X stage 5 and the Y stage 7, the distortion of the bar mirrors 43 and 45 is measured by the laser interferometers 42 and 44 of the laser length measurement system, and the laser When the position of the chuck 10 is detected by the length measurement system, the detection result of the laser length measurement system is corrected in accordance with the distortion of the bar mirrors 43 and 45 measured in advance, so that the XY of the chuck 10 is obtained using the laser length measurement system. The position in the direction can be detected with high accuracy.

  Further, according to the example shown in FIG. 11, the movement amount of the X stage 5 is detected, and the position on the bar mirror 45 where the laser light from the laser interferometer 44 is irradiated from the detected movement amount of the X stage 5. By calculating the correction amount of the position in the Y direction at the position from the distortion of the bar mirror 45 measured in advance, and correcting the detection result of the position in the Y direction of the laser length measurement system, the laser interferometer 44 Since the position on the bar mirror 45 irradiated with the laser beam from can be accurately determined, the correction amount of the position in the Y direction at the position can be accurately calculated from the distortion of the bar mirror 45 measured in advance. The position of the chuck 10 in the Y direction can be detected with higher accuracy.

  Further, the chuck 10 is moved by the X stage 5, the position of the chuck 10 in the Y direction is detected at two or more locations by the laser length measurement system, and the laser length measurement system is detected according to the distortion of the bar mirror 45 measured in advance. By correcting the result and detecting the inclination of the chuck 10 in the θ direction, the inclination of the chuck 10 in the θ direction can be accurately detected using a laser length measurement system.

  In the embodiment described above, an example of an exposure apparatus that draws a pattern on a substrate has been shown. However, the present invention is also applicable to a proximity exposure apparatus that detects the position of a chuck using a laser length measurement system. be able to.

  The laser length measurement system is used by exposing the substrate using the exposure apparatus of the present invention or adjusting the position of the substrate using the chuck position detection method of the exposure apparatus of the present invention and exposing the substrate. Thus, the position of the chuck can be detected with high accuracy, so that a high-quality display panel substrate can be manufactured by adjusting the position of the substrate with high accuracy.

  For example, FIG. 16 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 17 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 16, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 17, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus of the present invention or the chuck position detection method of the exposure apparatus can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 20 Light beam irradiation device 20a Head part 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD (Digital Micromirror Device)
26 Projection lens 27 DMD drive circuit 31, 33 Linear scale 32, 34 Encoder 40 Laser measurement system controller 41 Laser light source 42, 44 Laser interferometer 43, 45 Bar mirror 60 Stage drive circuit 70 Main controller 71 Drawing controller 72, 76 Memory 73 Bandwidth setting unit 74 Center point coordinate determination unit 75 Coordinate determination unit 77, 77 ′ XY position correction unit 78 Travel error detection unit

Claims (8)

A chuck for mounting a substrate;
A stage for moving the chuck;
A light source for generating laser light, a mirror attached to the chuck, and laser light from the light source are irradiated onto the mirror, and interference between the laser light from the light source and the laser light reflected by the mirror is measured. A laser length measuring system that has an interferometer and detects the position of the chuck from the measurement result of the interferometer;
Control means for controlling the stage and the laser length measurement system,
The control means moves the chuck by the stage in advance, measures the distortion of the mirror by the interferometer of the laser length measurement system, and detects the position of the chuck by the laser length measurement system in advance. An exposure apparatus that corrects a detection result of the laser length measurement system in accordance with the measured distortion of the mirror. A detection means for detecting the amount of movement of the stage;
The control means determines the position on the mirror irradiated with the laser light from the interferometer of the laser length measurement system from the amount of movement of the stage detected by the detection means, and determines the position of the mirror measured in advance. 2. The exposure apparatus according to claim 1, wherein a correction amount at the position is calculated from the distortion, and the detection result of the laser length measurement system is corrected.   The controller moves the chuck by the stage, detects the position of the chuck at two or more locations by the laser length measurement system, and determines the laser length measurement system according to the mirror distortion measured in advance. The exposure apparatus according to claim 1, wherein a tilt of the chuck in the θ direction is detected by correcting a detection result. Mount the substrate on the chuck,
A light source that generates laser light, a mirror attached to the chuck, and an interferometer that irradiates the laser light from the light source to the mirror and measures the interference between the laser light from the light source and the laser light reflected by the mirror Using a laser length measurement system that detects the position of the chuck from the measurement results of the interferometer,
Move the chuck with the stage in advance, measure the distortion of the mirror with the laser measuring system interferometer,
A chuck position detection method for an exposure apparatus, wherein when a chuck position is detected by a laser length measurement system, a detection result of the laser length measurement system is corrected according to a mirror distortion measured in advance. Detect the amount of stage movement,
From the detected amount of movement of the stage, determine the position on the mirror irradiated with the laser light from the laser measuring system interferometer, and calculate the correction amount at the position from the distortion of the mirror measured in advance, 5. The chuck position detection method for an exposure apparatus according to claim 4, wherein the detection result of the laser length measurement system is corrected.   The chuck is moved by the stage, the position of the chuck is detected at two or more locations by the laser length measurement system, the detection result of the laser length measurement system is corrected according to the mirror distortion measured in advance, and the θ direction of the chuck 6. The method of detecting a chuck position of an exposure apparatus according to claim 4, wherein the inclination of the exposure apparatus is detected.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate position is adjusted by using the chuck position detection method of the exposure apparatus according to any one of claims 4 to 6 and the substrate is exposed.

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