JP2010252164A - Solid-state image sensing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image sensing device securing the strength of a solid-state image sensing element mounted on a glass board, facilitating the adjustment of an optic axis and facilitating the terminal connection of an automatic focusing mechanism. <P>SOLUTION: The connection of electrical equipment is formed to a cavity, a reference hole and the inner wall of the reference hole in a printed-wiring board. The solid-state image sensing element mounted on the glass board is mounted on the bottom of the cavity while a lens box body including a reference projection is inserted and fitted into the reference hole. Consequently, the adjustment of the optic axis and the connection of an electrical terminal for the automatic focusing mechanism are conducted simultaneously. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device, and more particularly to a small-sized solid-state imaging device formed using a solid-state imaging device such as a surveillance camera, a medical camera, an in-vehicle camera, and an information communication terminal camera.

  In recent years, the demand for small cameras for mobile phones, in-vehicle components, etc. has been rapidly increasing. This type of small camera uses a solid-state imaging device that outputs an image input as an electric signal by an optical system such as a lens by a solid-state imaging device. With the downsizing and high performance of this image pickup apparatus, the camera has become smaller and the use in various fields has increased, expanding the market as a video input apparatus. 2. Description of the Related Art Conventional imaging devices using a semiconductor imaging element are formed by combining parts such as an LSI mounted with a lens, a semiconductor imaging element, a driving circuit thereof, a signal processing circuit, and the like in a housing or a structure.

  The mounting structure by such a combination is formed by mounting each element on a printed circuit board on a flat plate. However, the demand for further thinning of individual devices has been increasing year by year due to the demand for further thinning of cellular phones and the like, and in order to respond to the demand, a flexible wiring board is used, or a transparent member is directly applied. Attempts have been made to make the imaging device thinner by flip-chip mounting the IC.

  In the structure of Patent Document 1, a solid-state imaging device is mounted on a light-transmitting substrate, and a lens unit is directly mounted on the light-transmitting substrate. The structure of Patent Document 2 is such that a translucent substrate on which a solid-state image sensor is mounted is mounted on a printed circuit board, and a lens unit is directly mounted thereon.

JP 2001-203913 A JP 2007-288755 A

  However, in each of the solid-state imaging devices disclosed in Patent Documents 1 and 2, a lens unit is mounted directly on a light-transmitting substrate. In such a configuration, there are problems that it is difficult to adjust the optical axis and that the strength of the apparatus itself cannot be secured. In addition, when the lens has an automatic focusing mechanism, there is a problem in that the electrical wiring is accompanied by manufacturing difficulties that must be taken out separately and soldered.

The present invention has been made in view of the above circumstances, and a translucent board on which a solid-state imaging device is mounted is mounted on a multilayer wiring board, and a through-hole based on a wiring pattern for mounting is opened to form a lens housing. The body is inserted with the through hole as a reference hole. Furthermore, when the through hole is inserted, the electrical terminal for the automatic focus adjustment mechanism is also connected at the same time.
Therefore, the optical axis can be easily adjusted, the strength of the apparatus can be ensured, and the electrical terminal for the automatic focusing mechanism can be connected. As a result, an excellent solid-state imaging device capable of easily manufacturing a small and thin solid-state imaging device can be provided.

  The solid-state imaging device of the present invention is a solid-state imaging device comprising a wiring substrate having a recess, a solid-state imaging element portion mounted on a light-transmitting member having a wiring pattern on the surface, an optical lens and a lens housing, A translucent member on which a solid-state image sensor is mounted is installed in an electric terminal portion formed in the recess, and an optical lens and a lens housing are installed on a wiring board so as to face the solid-state image sensor. It is a feature. With this configuration, it is possible to provide a solid-state imaging device that ensures strength even with a low profile.

  The solid-state imaging device of the present invention uses a multilayer wiring board having a cavity portion, and the translucent member on which the solid-state imaging element is mounted is mounted on the electrical terminal portion at the bottom of the cavity portion. It is a feature. With this configuration, the strength can be secured with a lower height. That is, the concave portion of the multilayer wiring board constitutes a cavity portion.

  The solid-state imaging device of the present invention uses a multilayer wiring board having a cavity portion with a stepped portion, and a translucent member on which the solid-state imaging element is mounted is mounted on an electric terminal portion of the stepped portion of the cavity portion. It is characterized by being. With this configuration, the translucent member can be made lower than the height of the multilayer wiring board surface, so that the lens housing can be installed with the multilayer wiring board surface as a reference.

  Further, the solid-state imaging device of the present invention uses a multilayer wiring board having a through-opening portion having a stepped portion, and the translucent member on which the solid-state imaging element is mounted is on the electric terminal portion of the stepped portion of the through-opening portion. It is characterized by being installed in. With this configuration, the height can be further reduced.

  In addition, the solid-state imaging device of the present invention is characterized in that a positioning hole is formed on the basis of an electric terminal portion formed in a concave portion of the multilayer wiring board. With this configuration, the optical axes of the solid-state imaging device and the lens can be easily aligned.

  In the solid-state imaging device of the present invention, an electrically conductive film is formed on the inner wall of the positioning hole and is electrically connected to the wiring pattern of the multilayer wiring board. With this configuration, the electrical terminal for the automatic focusing mechanism can be easily connected by connecting the electrical terminal for the automatic focusing mechanism from the lens housing to the film.

  In the solid-state imaging device of the present invention, the lens housing has a protrusion, and the lens housing is inserted into the positioning hole for positioning, and the surface of the protrusion is electrically connected to an electric terminal for automatic focusing of the lens. A certain wiring pattern is formed. With this configuration, it is possible to electrically connect the electrical terminal for the automatic focus adjustment mechanism from the lens housing simply by inserting the protrusion into the reference through hole. In addition, the electric terminal connection for the automatic focusing mechanism can be easily performed.

  Moreover, the translucent member used for the solid-state imaging device of the present invention can improve optical characteristics by using an optical filter. Furthermore, it is possible to improve electrical characteristics by mounting a chip component in the recess of the wiring board and placing the chip component in the vicinity of the solid-state imaging device.

  As described above, by using the solid-state imaging device of the present invention, the optical axis can be easily adjusted, the strength of the device can be secured, and the electrical terminal for the automatic focusing mechanism can be connected. As a result, an excellent solid-state imaging device capable of easily manufacturing a small and thin solid-state imaging device can be provided.

Partially exploded perspective view of the solid-state imaging device of Embodiment 1 Partial assembly diagram of solid-state imaging device according to Embodiment 1 1 is an exploded perspective view of the solid-state imaging device according to the first embodiment. Assembly completed drawing of solid-state imaging device of Embodiment 1 Sectional drawing of the assembly completion figure of the solid-state imaging device of this Embodiment 1 Sectional drawing of the solid-state imaging device of this Embodiment 2. Sectional drawing of the solid-state imaging device of this Embodiment 3.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
The first embodiment will be described with reference to FIGS.
FIG. 1 is a partially exploded perspective view of the solid-state imaging device according to the first embodiment.
Electrode pads 2 and 4 are formed on the transparent glass substrate 1, and the electrode pads 2 and the electrode pads 4 are wired by the wiring pattern 3 on the surface of the glass substrate 1 and are electrically connected. The electrode pad 2 is for connection with the solid-state image sensor 5, and the electrode pad 4 is for electrical connection with a printed wiring board that takes out the signal of the solid-state image sensor 5 to the outside. The solid-state imaging device 5 is in a state where the imaging region 6 faces the transparent glass electrode. Then, metal bumps (not shown) are formed on the electrical wiring pads on the back surface and mounted on the electrode pads 2. At this time, insulative sealing resin is injected (not shown) in order to secure the adhesion strength and electrical connection reliability of the solid-state imaging device 5.

FIG. 2 is a partial assembly diagram of the solid-state imaging device according to the first embodiment.
As described with reference to FIG. 1, the solid-state imaging device 5 is mounted on the transparent glass substrate 1, and the insulating sealing resin 7 is injected. The insulating sealing resin 7 surrounds the periphery of the metal bump (not shown) of the solid-state imaging device 5 without leaking to the imaging region, and ensures the adhesion strength. A solder ball 8 is attached on the electrode pad 4.

FIG. 3 is an exploded perspective view of the solid-state imaging device according to the first embodiment.
A cavity portion 10 is formed on the printed wiring board 9, and a mounting electrode pad (not shown) is formed on the bottom of the cavity portion 10. Further, a reference hole 11 is formed. The reference hole 11 is formed with reference to the electrode pad at the bottom of the cavity portion 10, and there is a wiring pattern 12 around the reference hole 11, and the inner wall 13 of the reference hole 11 is electrically connected. A conductive film is formed and electrically connected to the surrounding wiring pattern 12. The wiring pattern 12 is connected to the multilayer wiring of the printed wiring board 9.

  The transparent glass substrate 1 on which the solid-state imaging device 5 is mounted and the solder balls 8 are attached is inverted and solder mounted on the printed wiring board 9, and is reinforced by underfill (not shown). Next to the transparent glass substrate 1, chip components 14 are simultaneously solder-mounted and connected in an electric circuit.

  In this state, a lens housing 16 in which the lens 15 is installed from above is prepared. A reference protrusion 17 for fitting into the reference hole 11 is formed on the lens housing 16, and an electrode terminal 18 for an automatic focus adjustment mechanism has been drawn around the surface. The reference protrusion 17 is formed with the optical axis of the lens 15 as a reference.

FIG. 4 is an assembled view of the solid-state imaging device according to the first embodiment.
The lens housing 16 is integrated with the printed wiring board 9 on which the solid-state imaging device 5 of the transparent glass substrate 1 is mounted, thereby completing a solid-state imaging device. By inserting and fitting the reference protrusion 17 into the reference hole 11, the optical axis adjustment of the solid-state imaging device 5 and the lens 15 is simplified. In addition, electrical connection between the inner wall 13 of the reference hole 11 and the electrode terminal 18 on the surface of the reference protrusion 17 can be performed simultaneously.

FIG. 5 is a cross-sectional view of the completed assembly of the solid-state imaging device according to the first embodiment.
The transparent glass substrate 1 is mounted on the bottom of the cavity portion 10 of the printed wiring board 9 via the solder balls 8, and the periphery of the solder balls 8 is reinforced with an insulating sealing resin 19. A solid-state imaging device 5 having an imaging region 6 is mounted on the transparent glass substrate 1 via a connection portion 20 formed of a metal bump, and an insulating sealing resin 7 is injected and cured around the solid imaging device 5. Further, the insulating sealing resin 7 does not leak into the imaging region 6 of the solid-state imaging device 5. This is achieved by using a UV curable material for the insulating sealing resin 7 during manufacturing and injecting the imaging region 6 while irradiating the imaging region 6 with UV light. Further, the chip component 14 is mounted, and the lens housing 16 is assembled from the upper part by inserting and fitting the reference protrusion 17 into the reference hole 11, and at the same time, the electrode terminal 18 for the automatic focusing mechanism is electrically connected.

By adopting such a structure, the lens housing 16 is not fixed directly to the transparent glass substrate 1 but is fixed to the printed wiring board 9, so that it can be firmly fixed without fear of breakage. Also, the optical axis can be adjusted easily. Furthermore, the electrode terminal of the automatic focusing mechanism can be easily performed by inserting and fitting the lens housing 16 without separately taking out and soldering.
That is, by implementing the present invention, it is possible to obtain a solid-state imaging device having favorable imaging characteristics, high strength, and high electrical connection reliability.
The transparent glass substrate 1 may be an optical filter film or an antireflection film. In that case, the optical characteristics can be further improved.

  Moreover, although the example using a multilayer wiring board has been described in the above embodiment, the present invention is not limited to a multilayer wiring board, and may be a single-layer wiring board.

In addition, the solid-state imaging device chip is becoming thinner, and it is desirable to use a light-shielding substrate as a substrate having a cavity portion in order to prevent light from wrapping around from the back surface. It is desirable to use a light shielding resin such as an epoxy resin. Further, a ceramic substrate, a glass substrate on which a light-shielding film is formed, and the like are also applicable.
As the substrate structure, an upper layer substrate having a through hole may be laminated on a lower layer substrate on which a wiring pattern is formed, and a cavity formed by cutting or etching is also effective.

(Embodiment 2)
FIG. 6 is a cross-sectional view of the solid-state imaging device according to the second embodiment.
Unlike Embodiment 1, a printed wiring board 9 having a cavity portion 22 having a stepped portion 21 is used. The transparent glass substrate 1 is mounted not on the bottom portion of the cavity portion 22 but on the step portion 21. In this case, instead of using the solder balls 8 as in the first embodiment, the solder balls 8 are mounted via the connection portions 23 formed of metal bumps, and the insulating sealing resin 24 is injected and cured around the periphery. A chip component 25 is mounted on the step portion 21. The fitting part of the lens housing other than the mounting has the same structure as that of the first embodiment.
Since it has such a structure, in addition to the effect in the first embodiment, the effect of making the entire solid-state imaging device thinner can be obtained.

(Embodiment 3)
FIG. 7 is a cross-sectional view of the solid-state imaging device according to the third embodiment.
Although the structure is almost the same as that of the second embodiment, an opening 26 is formed in the printed wiring board 9, and an insulating sealing resin 27 is injected from the back surface of the solid-state imaging device 5 to fill the mounting portion. .
By having such a structure, in addition to the effects of the first and second embodiments, the solid-state imaging device can be further thinned, and the fixing strength of the solid-state imaging element 5 can be increased. have.

  The solid-state imaging device of the present invention has an effect that the manufacturing method is simple and highly accurate, and the strength of the device can be secured. As a result, a small and thin excellent solid-state imaging device can be provided, which is highly useful in industry and is a useful invention.

DESCRIPTION OF SYMBOLS 1 Transparent glass substrate 2, 4 Electrode pad 3, 12 Wiring pattern 5 Solid-state image sensor 6 Imaging area 7, 19, 24, 27 Insulating sealing resin
8 Solder ball 9 Printed circuit board 10, 22 Cavity part 11 Reference hole 13 Inner wall 14 Chip part 15 Lens 16 Lens housing 17 Reference protrusion 18 Electrode terminal 20, 23 Connection part 26 Opening part

Claims (9)

A solid-state imaging device comprising a wiring board having a recess, a solid-state imaging device portion mounted on a translucent member having a wiring pattern on the surface, an optical lens and a lens housing,
The translucent member on which the solid-state image sensor is mounted is mounted on the electric terminal portion formed in the recess, and the optical lens and the lens housing are installed on the multilayer wiring board so as to face the solid-state image sensor. Solid-state imaging device. The solid-state imaging device according to claim 1,
The wiring board is composed of a multilayer wiring board,
The concave portion of the multilayer wiring board constitutes a cavity portion;
A solid-state imaging device in which a translucent member on which the solid-state imaging element is mounted is mounted on an electric terminal portion at the bottom of the cavity portion. The solid-state imaging device according to claim 1,
The wiring board is composed of a multilayer wiring board,
The concave portion of the multilayer wiring board constitutes a cavity portion having a stepped portion,
A solid-state imaging device in which a translucent member on which the solid-state imaging element is mounted is mounted on an electric terminal portion of a step portion of the cavity portion. The solid-state imaging device according to claim 1,
The wiring board is composed of a multilayer wiring board,
The concave portion of the multilayer wiring board constitutes a through opening having a stepped portion,
A solid-state imaging device in which a translucent member on which the solid-state imaging element is mounted is installed on an electric terminal portion of a step portion of the through opening. The solid-state imaging device according to any one of claims 2 to 4,
A solid-state imaging device in which a positioning hole is formed with reference to an electric terminal portion formed in a concave portion of the multilayer wiring board. A solid-state imaging device according to any one of claims 2 to 5,
A solid-state imaging device in which an electrically conductive film is formed on an inner wall of the positioning hole and is electrically connected to a wiring pattern of the multilayer wiring board. The solid-state imaging device according to any one of claims 1 to 6,
The lens housing includes a protrusion,
Insert the protrusion into the positioning hole to perform positioning,
A solid-state image pickup device in which a wiring pattern electrically connected to an electric terminal for automatic focusing of a lens is formed on the surface of the protrusion. The solid-state imaging device according to claim 1,
The translucent member is a solid-state imaging device which is an optical filter. The solid-state imaging device according to any one of claims 1 to 8,
A solid-state imaging device in which a chip component is mounted in a recess of the wiring board.

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