JP2010251487A - Circuit device, and method of manufacturing the circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a circuit device which packages a plurality of electronic components in proximity on a circuit board, and also has superior junction reliability between a lead terminal of the electronic component and a through-hole of the circuit board. <P>SOLUTION: The circuit device includes: a guide member provided with a recessed guide mechanism having an opening and a positioning hole forming part having a positioning hole; an electronic component in which a main frame is inserted into the guide mechanism, and the lead terminal is inserted into the positioning hole; the circuit board which is provided on the outer face side of the positioning hole forming part of the guide member, and in which the lead terminal extended from the positioning hole is inserted into the through-hole for joint; and a base plate covering the opening of the guide member opposing to the positioning hole forming part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit device including a plurality of electronic components and a manufacturing method thereof, and relates to a circuit device in which electronic components are efficiently positioned and miniaturized and a manufacturing method thereof.

In recent years, due to the increase in capacity of circuit devices, electronic components used in circuit devices have become larger, and the use of components that are not suitable for surface mounting has increased. Further, circuit devices are required to have high performance in addition to large capacity, and the number of electronic components mounted is increasing, and positioning of lead terminals of electronic components has become important.
In addition, circuit devices are used in automobiles and the like, and are often exposed to severe environments such as vibration and heat. In such a circuit device used in a severe environment such as vibration and heat, reliability and vibration resistance of the joint are required.

  A large number of terminals extending from a plurality of IGBTs can be easily fitted into the connection holes of the power board, and as an inverter device that protects external stresses such as vibration applied to the terminals, an IGBT mounted metal plate and IGBT Between the power board to which the terminal is connected, a guide body having a U-shaped cross section and a flange projecting at right angles from the tip edge thereof, and an IGBT terminal drilled in a flat portion of the guide body There is an inverter provided with a guide member including a through hole to be penetrated, a first positioning pin for positioning a metal plate, and a second positioning pin for positioning a power board (for example, refer to Patent Document 1).

JP 2008-215089 A (7th, 8th pages, 8th and 9th figures)

  However, different types of electronic components such as large coils and capacitors are mounted on a plate similar to the metal plate on which the IGBT described in Patent Document 1 is mounted, and Patent Document 1 is provided between the plate and the wiring board. In the circuit device in which the terminal of each electronic component positioned by the guide member is connected to the through hole of the circuit board, that is, the circuit device to which the structure of the inverter device described in Patent Document 1 is applied. Since the positional relationship between the coil windings and capacitor electrodes to be mounted and the lead terminals is large, mounting must be performed with a large distance between adjacent electronic components, which reduces the size of the circuit device. There was a problem that it was difficult.

Moreover, in the circuit device to which the structure of the inverter device described in Patent Document 1 is applied, when inserting a lead terminal whose electronic component is misaligned into the through hole, the lead terminal is not interfered with an adjacent electronic component. Since the mounting is performed by forcibly deforming, there is a problem that the lead terminal is inserted so as to contact the end surface of the through hole of the circuit board, and the inner wall surface of the through hole may be damaged.
In addition, when the lead terminal is inserted so as to contact the end surface of the through hole of the circuit board, the solder thickness between the lead terminal and the inner periphery of the through hole is reduced, and the fatigue life due to heat cycle is reduced. .
Further, there is a problem that stress is applied to the base of the lead terminal of the electronic component due to the relative displacement of the positioning guide member, and the fatigue life and vibration resistance of the heat cycle are lowered.

  The present invention has been made to solve the above-described problems. The object of the present invention is to mount a plurality of electronic components in close proximity to each other and to mount the lead terminals of the electronic components on the circuit board. It is an object of the present invention to provide a circuit device that is positioned with respect to a through hole, prevents damage to the inner wall surface of the through hole, and has excellent bonding reliability between a lead terminal and the through hole, and a manufacturing method thereof.

  A circuit device according to the present invention includes a guide member provided with a hollow guide mechanism portion having an opening and a positioning hole forming portion having a positioning hole, a main body portion inserted into the guide mechanism portion, and a positioning hole. An electronic component having a lead terminal inserted therein, a circuit board provided on the outer surface side of the positioning hole forming portion of the guide member, and a lead terminal inserted from the positioning hole into the through hole and joined thereto, and a positioning hole formation And a base plate that covers the opening of the guide member facing the portion.

  The manufacturing method of a circuit device according to the present invention includes a hollow guide mechanism portion and a positioning hole forming portion having a positioning hole in the first step, and has an opening at a portion facing the positioning hole forming portion. Electronic component installation in which the lead member of the electronic component is inserted into the positioning hole from the opening side in the guide member preparation step for preparing the guide member and the second step, and then the main body portion of the electronic component is inserted into the guide mechanism portion Positioning of the step, the base plate installation step of fixing the base plate to the guide member after covering the opening of the guide member on which the electronic component is installed with the base plate in the third step, and the fourth step And a circuit board installation step for joining the lead terminal and the through hole after the lead terminal extending from the hole is inserted into the through hole and the circuit board is placed in the positioning hole forming portion. Realize the process in order It is intended to.

  A circuit device according to the present invention includes a guide member provided with a hollow guide mechanism portion having an opening and a positioning hole forming portion having a positioning hole, a main body portion inserted into the guide mechanism portion, and a positioning hole. An electronic component having a lead terminal inserted therein, a circuit board provided on the outer surface side of the positioning hole forming portion of the guide member, and a lead terminal inserted from the positioning hole into the through hole and joined thereto, and a positioning hole formation And a base plate that covers the opening of the guide member that opposes the portion, and a plurality of electronic components are mounted in close proximity and downsized, and lead terminals of the electronic components and through-circuits of the circuit board are provided. Excellent bonding reliability with holes.

  The manufacturing method of a circuit device according to the present invention includes a hollow guide mechanism portion and a positioning hole forming portion having a positioning hole in the first step, and has an opening at a portion facing the positioning hole forming portion. Electronic component installation in which the lead member of the electronic component is inserted into the positioning hole from the opening side in the guide member preparation step for preparing the guide member and the second step, and then the main body portion of the electronic component is inserted into the guide mechanism portion Positioning of the step, the base plate installation step of fixing the base plate to the guide member after covering the opening of the guide member on which the electronic component is installed with the base plate in the third step, and the fourth step And a circuit board installation step for joining the lead terminal and the through hole after the lead terminal extending from the hole is inserted into the through hole and the circuit board is placed in the positioning hole forming portion. Realize the process in order Is intended to, a plurality of electronic components are mounted in close proximity, and obtain a superior circuit device bonding reliability between the lead terminals and the circuit through holes of the board of the electronic component.

Side surface cross-sectional schematic diagram (a) of the circuit device according to Embodiment 1 of the present invention, a side cross-sectional schematic diagram (b) of a printed circuit board used in this circuit device, and a side cross-sectional view of a guide member used in this circuit device It is a schematic diagram (c). It is a partial cross section schematic diagram of the guide member used for the circuit apparatus concerning Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the circuit apparatus concerning Embodiment 1 of this invention. In the circuit device concerning Embodiment 1 of this invention, the fragmentary sectional schematic diagram (a) which shows the state by which the lead terminal was inserted in the positioning hole, and the state by which the main-body part of an electronic component is positioned by a guide mechanism part are shown. They are a partial cross-sectional schematic diagram (b) and a partial cross-sectional schematic diagram (c) showing the state of the completed circuit device. FIG. 6 is a schematic perspective view (a) showing a guide member used in a circuit device according to Embodiment 2 of the present invention, and a schematic perspective view (b) of an electronic component disposed in a guide mechanism portion of the guide member. . It is a partial cross section schematic diagram of the guide member used for the circuit apparatus concerning Embodiment 3 of this invention. It is a figure which shows the condition which installs an electronic component in the guide member used for the circuit apparatus concerning Embodiment 3 of this invention. It is the partial cross section schematic diagram (a) of the guide member used for the circuit apparatus concerning Embodiment 4 of this invention, and the enlarged schematic diagram (b) of the inner wall surface of the guide mechanism part of this guide member. It is a side surface cross-section schematic diagram of the circuit apparatus concerning Embodiment 5 of this invention. It is a cross-sectional schematic diagram of the guide member used for the circuit apparatus concerning Embodiment 6 of this invention. It is the side surface schematic diagram (a) of the circuit device concerning Embodiment 7 of this invention, and the side surface schematic diagram (b) of the guide member used for this circuit device. It is a cross-sectional schematic diagram of the heat radiating member used for the circuit apparatus concerning Embodiment 7 of this invention.

Embodiment 1 FIG.
FIG. 1A is a side cross-sectional schematic diagram (a) of a circuit device according to Embodiment 1 of the present invention, a side cross-sectional schematic diagram (b) of a printed circuit board used in this circuit device, and a guide used in this circuit device. It is a side cross-sectional schematic diagram (c) of a member.
As shown in FIG. 1, the circuit device 100 according to the present embodiment includes a guide member 3 provided with a guide mechanism portion 1 and a positioning hole forming portion 3 a having a positioning hole 2, and a main body portion at the guide mechanism portion 1. The electronic component 4 such as the first capacitor 4a, the second capacitor 4b, and the coil 4c that are inserted and the lead terminal 8 is inserted through the positioning hole 2 and the positioning hole forming portion 3a of the guide member 3 are in contact with each other. Each of the lead terminals 8 extending from the positioning hole 2 is inserted through the printed circuit board 7 which is a circuit board having a through-hole 11 and is joined to the opening of the guide member 3. And a base plate 9.
Further, as shown in FIG. 1A, the arrangement of the positioning holes 2 provided in the guide member 3 is the same as the arrangement of the through holes 11 provided in the printed board 7, and the guide member of the printed board 7 is provided. The fixing to 3 is performed with a screw (not shown).

As shown in FIG. 1 (c), the guide member 3 of the present embodiment has a recessed guide mechanism portion 1 that fits with the electronic component 4, and has one surface that is open. A positioning hole forming portion 3a is provided in a portion facing the surface. The shape of the guide mechanism part 1 of this Embodiment is concave shape.
Further, the thickness of the wall portion 1a between the adjacent guide mechanism portions in the guide member 3 is as thin as possible, and the depth of the guide mechanism portion 1, that is, the distance from the opening surface to the positioning hole forming portion 3a is disposed. The height of the main body of each electronic component 4 is the same.
Further, the guide member 3 is provided with a flange portion 3b protruding from the edge of the opening surface of the side wall. As shown in FIG. 1 (a), the base plate 9 is screwed to the flange portion 3b. It is fixed.

FIG. 2 is a partial cross-sectional schematic view of a guide member used in the circuit device according to Embodiment 1 of the present invention.
As shown in FIG. 2, the positioning hole 2 passes through the positioning hole forming portion 3a in the guide member 3, and includes a tapered portion 2a and a straight portion 2b. The taper portion 2a is provided on the guide mechanism portion 1 side of the guide member 3, and the straight portion 2b is provided on the side of the guide member 3 on which the printed board 7 is in contact. The tapered portion 2a is wide on the guide mechanism portion 1 side, and the portion connected to the straight portion 2b is narrow, and the hole diameter of the straight portion 2b is larger than the diameter of the through hole 11 (not shown) of the printed circuit board 7. It is getting smaller.

Next, a method for manufacturing the circuit device 100 according to the first embodiment of the present invention will be described.
FIG. 3 is a diagram illustrating a manufacturing process of the circuit device according to the first embodiment of the present invention.
In the guide member preparation step, which is the first step, as shown in FIG. 3A, a hollow-shaped guide mechanism portion 1 corresponding to the shape of the electronic component 4 to be mounted shown in FIG. A guide member 3 having a positioning hole 2 provided in the positioning hole forming portion 3a at a predetermined interval corresponding to the lead terminal 8 of the electronic component to be mounted and a flange portion 3b for fixing the base plate 10 is prepared. .
The guide member 3 can be prepared, for example, by molding a plastic material using a mold.
In the electronic component installation step which is the second step, as shown in FIG. 3B, the electronic component 4, for example, the first capacitor 4a, the second capacitor 4b, the coil 4c, etc. The lead terminal 8 of the electronic component 4 is first inserted into each positioning hole 2 formed in the positioning hole forming portion 3a from the opening side of the guide member 3 placed so as to be moved in the direction indicated by the arrow. . Next, the electronic component 4 is further moved in the direction of the arrow, and the main body portion of the electronic component 4 is positioned and installed on the guide mechanism portion 1.

In the base plate installation step, which is the third step, as shown in FIG. 3C, the lead terminal 8 is inserted through the positioning hole 2 and extended from the positioning hole forming portion 3a, and the main body portion of the electronic component 4 Is covered with the base plate 9, and the base plate 9 is fixed to the flange portion 3b with screws 10.
In the circuit board installation process which is the fourth process, as shown in FIG. 3D, the guide member 3 on which the electronic component 4 is installed is placed so that the side on which the base plate 9 is provided is on the lower side, A printed circuit board 7 is mounted on the outer surface side of the positioning hole forming portion 3 a of the guide member 3. At this time, the lead terminal 8 extending from the positioning hole forming portion 3a is inserted into the through hole 11 of the printed circuit board 7, and the lead terminal 8 and the through hole 11 are joined with a joining member such as solder.
The circuit device 100 according to the first embodiment of the present invention is manufactured by sequentially performing such first to fourth steps.
In the above circuit device manufacturing method, the circuit board installation process is performed after the base board installation process, but the circuit board installation process is performed immediately after the electronic component installation process, and finally the base board installation process is performed. good.

Next, a mechanism for positioning the electronic component 4 of the circuit device 100 according to Embodiment 1 of the present invention will be described.
FIG. 4A is a partial cross-sectional schematic diagram (a) showing a state in which the lead terminal is inserted into the positioning hole in the circuit device according to the first embodiment of the present invention, and the main body portion of the electronic component is positioned at the guide mechanism portion. FIG. 2 is a partial cross-sectional schematic diagram (b) showing the state of the circuit, and a partial cross-sectional schematic diagram (c) showing the state of the completed circuit device.
As shown in FIG. 4A, the lead terminal 8 in which the electronic component 4 is displaced is inserted into the positioning hole 2 of the guide member 3. Next, as shown in FIG. 4B, the main body portion of the electronic component 4 is inserted into the guide mechanism portion 1.
That is, as shown in FIG. 4C, in the completed circuit device, the lead terminal 8 is positioned by the positioning hole 2, the positional deviation of the lead terminal 8 is corrected by the guide mechanism unit 1, and the electronic component 4 The main body is positioned.
Moreover, as shown in FIG.4 (c), the diameter of the through hole 11 of the mounted printed circuit board 7 is larger than the diameter of the positioning hole.

Also, as shown in FIG. 4B, the length L of the lead terminal 8 when the electronic component 4 is installed on the guide member 3 is preferably equal to or greater than the depth D of the guide mechanism portion 1. In the guide mechanism portion 1 having side wall portions having different dimensions, it is preferable that the length L of the lead terminal 8 is not less than the depth D of the lowest side wall portion.
This facilitates the insertion of the lead terminal 8 into the positioning hole 2 and the insertion of the main body portion of the electronic component 4 into the guide mechanism portion 1 and also determines the position of the lead terminal 8 by determining the position of the lead terminal 8 first. It becomes easy to correct the position of the main body portion of the component 4 and the lead terminal 8.

In the rotating device 100 of the present embodiment, the lead terminal 8 is held by the inner wall of the straight portion 2b of the positioning hole 2, and the main body of the electronic component 4 is held by the guide mechanism portion 1, so that the position is shifted. Even when the electronic component 4 having the lead terminal 8 is used, the positional deviation of the lead terminal 8 is corrected, and the lead terminal 8 can be extended straight from the positioning hole forming portion 3 a of the guide member 3.
That is, the lead terminal 8 extends straight from the positioning hole forming portion 3 a and the diameter of the straight portion 2 b of the positioning hole 2 is smaller than the diameter of the through hole 11. It can be inserted without contact, and damage to the inner wall surface of the through hole 11 can be prevented. In addition, a necessary gap can be maintained between the lead terminal 8 and the inner wall surface of the through hole 11, and a solder thickness sufficient to join the lead terminal 8 and the through hole 11 can be maintained.

And since the solder thickness between the lead terminal 8 and the inner wall surface of the through hole 11 is sufficient, the bonding reliability between the lead terminal 8 and the through hole 11 is high, and this part has a problem due to vibration and heat cycle fatigue. Can be prevented.
Further, since the lead terminal 8 is fixed by the positioning hole 2, even if vibration is applied between the printed circuit board 7 and the guide member 3, the stress applied to the root portion of the lead terminal 8 can be relieved, and the heat cycle of this part And vibration resistance can be improved.
Furthermore, if the electronic component 4 is bonded to the guide mechanism portion 1 with an adhesive, the electronic component 4 is prevented from moving even if vibration is applied, and the vibration resistance of the joint portion is further improved. Since the electronic component 4 is in contact with the guide mechanism unit 1, the amount of the adhesive used for bonding and fixing the electronic component 4 can be reduced, and the increase in weight and cost of the circuit device due to the use of the adhesive are small. .

Further, in the electronic component 4 in which the main body portion is held by the guide mechanism unit 1, the side wall portion of the hollow guide mechanism unit 1 serves as a partition, so that the first capacitor 4 a, the second capacitor 4 b, the coil 4 c, etc. Each electronic component 4 can be mounted with a small interval without causing interference, and even a circuit device mounting a large electronic component can be reduced in size.
In addition, this circuit device is provided with a tapered portion 2a in the positioning hole 2 so that the lead terminal 8 can be easily inserted, and the guide member 3 is provided with the guide mechanism portion 1 so that electronic components can be easily mounted. The property is excellent. Further, since the positioning hole 2 is provided with the taper portion 2a, when the guide member 3 is molded with a mold, this portion acts as a draft, and the positioning hole 2 can be easily processed. Is excellent.

Embodiment 2. FIG.
FIG. 5A is a schematic perspective view showing a guide member used in the circuit device according to Embodiment 2 of the present invention, and FIG. 5B is a schematic perspective view of an electronic component disposed in the guide mechanism portion of the guide member. ).
A guide member 23 shown in FIG. 5 includes a semi-elliptical guide mechanism portion 21 in addition to the guide mechanism 1 of the first embodiment, and an elliptical columnar electronic component with which a main body portion is fitted to the guide mechanism portion 21. 24 is arranged.
That is, FIG. 5 illustrates the guide member 23 including the semi-elliptical guide mechanism portion 21 that is fitted to the main body portion of the elliptical columnar electronic component 24. However, the circuit device according to the present embodiment is The circuit device according to the first embodiment is the same as the circuit device according to the first embodiment except that a guide member having a guide mechanism having a shape fitted to the main body of an electronic component having a shape other than a rectangular parallelepiped is used.

Further, as shown in FIG. 5, in the electronic component 24 having the lead terminal 28 extending from the main body portion in a direction perpendicular to the insertion direction to the guide mechanism portion 21, the lead terminal 28 is directed in the guide mechanism portion direction. It is bent at a right angle. The length L1 of the lead terminal 28 from the tip to the ridge line position of the portion of the main body part of the electronic component 24 in contact with the bottom of the guide mechanism part 21 is preferably approximately the same as the depth D1 of the guide mechanism part 21. .
The circuit device according to the present embodiment has the same effects as the circuit device according to the first embodiment, and the shape of the guide mechanism unit matches the shape of the main body of the electronic component, thereby further reducing the size of the circuit device. It is effective for.
In particular, in the guide member 23 having the structure shown in FIG. 5, the wall thickness between the guide mechanism portions can be reduced, and the guide member 23 can be reduced in size and weight.

Embodiment 3 FIG.
FIG. 6 is a partial cross-sectional schematic view of a guide member used in the circuit device according to Embodiment 3 of the present invention.
As shown in FIG. 6, the circuit device according to the present embodiment uses the guide member 33 having a guide mechanism portion 31 having a tapered shape whose opening side is wider than the positioning hole forming portion 3a side. It is the same as the device.
FIG. 7 is a diagram illustrating a situation where electronic components are installed on a guide member used in a circuit device according to Embodiment 3 of the present invention.
As shown in FIG. 7A, first, the lead terminal 8 of the electronic component 4 is inserted into the positioning hole 2. Next, as shown in FIG. 7B, the main body portion of the electronic component 4 is inserted into the guide mechanism portion 31 along the inner wall surface of the guide mechanism portion 31.

The circuit device according to the present embodiment has the same effects as the circuit device according to the first embodiment, and the inner wall portion of the guide mechanism portion 31 is tapered, so that the electronic component 4 can be easily inserted into the guide mechanism portion 31. Therefore, positioning of the electronic component 4 is easy. Further, when the guide member 33 is molded with a mold, this portion has a draft angle, which makes it easier to remove the mold.
That is, the circuit device according to the present embodiment has improved productivity and improved formability of the guide member.

Embodiment 4 FIG.
FIG. 8 is a partial cross-sectional schematic view (a) of a guide member used in the circuit device according to Embodiment 4 of the present invention, and an enlarged schematic view (b) of the inner wall surface of the guide mechanism portion of this guide member. .
As shown in FIG. 8, the circuit device according to the present embodiment is the same as the circuit device according to the first embodiment except that a guide member 43 provided with a protruding portion 41d on the inner wall surface 41c of the guide mechanism portion 41 is used. is there. And this protrusion part 41d is formed in the depth direction of the guide mechanism part 41. As shown in FIG.
The circuit device according to the present embodiment has the same effects as the circuit device according to the first embodiment, and the protrusion 41d is provided on the inner wall surface 41c of the guide mechanism 41, so that the electronic component 4 can be inserted. The contact area between the guide mechanism 41 and the electronic component 4 is reduced, the friction can be reduced, and the electronic component 4 can be more easily inserted.

Embodiment 5 FIG.
FIG. 9 is a schematic side sectional view of a circuit device according to Embodiment 5 of the present invention.
As shown in FIG. 9, the circuit device 200 according to the present embodiment uses a guide member 53 having a spacer portion 53c provided on the peripheral portion of the surface facing the printed circuit board 7, and the printed circuit board 7 is mounted on the spacer portion 53c. The circuit device is the same as that of the first embodiment except that it is fixed. At this time, the printed circuit board 7 is placed in parallel with the surface of the opposing guide member 53.
The circuit device 200 according to the present embodiment has the same effect as the circuit device according to the first embodiment, and a space is provided between the guide member 53 and the printed circuit board 7. Therefore, a double-sided printed circuit board is used as the printed circuit board 7. be able to.
The spacer portion 53c may be formed by integral molding with the guide member 53, or may be formed by fixing the spacer member to the guide member 3 of the first embodiment.

In the circuit device having such a structure, when the electronic component 4 is fixed to the guide member 53 with an adhesive (not shown), both the printed circuit board 7 and the electronic component 4 are fixed to the same guide member 53, and vibration is caused. Even when an external force such as the above is applied, the joint between the through hole of the printed circuit board 7 and the lead terminal 8 moves in the same manner as the guide member 53, so that the stress at the joint does not increase and the through hole and the lead terminal are joined. High reliability of the parts can be maintained.
Such a structure in which the printed board is fixed to the guide member via the spacer can be applied to the circuit devices of the second to fourth embodiments, and the same effect can be obtained.

Embodiment 6 FIG.
FIG. 10 is a schematic cross-sectional view of a guide member used in a circuit device according to Embodiment 6 of the present invention.
As shown in FIG. 10, the circuit device according to the present embodiment is different from the embodiment except that a guide member 63 provided with a recess 63d is provided at a predetermined position on the surface facing the printed circuit board in the positioning hole forming portion 3a. This is the same as the circuit device 1.
The circuit device according to the present embodiment has the same effect as the circuit device according to the first embodiment, and a recess 63d is provided on the surface of the guide member 63 facing the printed circuit board. A double-sided printed board can be used by making it correspond to the position of the small component mounting portion of the printed board (not shown) placed on the guide member 63.
Such a guide member provided with a recess on the surface facing the printed circuit board can also be applied to the circuit devices of the second to fourth embodiments, and the same effect can be obtained.

Embodiment 7 FIG.
FIG. 11: is a side surface schematic diagram (a) of the circuit device concerning Embodiment 7 of this invention, and a side surface schematic diagram (b) of the guide member used for this circuit device.
As shown in FIG. 11B, the guide member 73 used in the circuit device 300 of the present embodiment has a positioning hole forming portion 73a from the depth of all the guide mechanism portions 71, that is, from the opening surface of the guide member 73. The depth is the same.
As shown in FIG. 11A, the circuit device 300 of the present embodiment uses the guide member 73 shown in FIG. 11B, and the mounted second capacitor 4b, coil 4c, and other electronic components. Potting material 13 is filled between the space between the component 4 and the positioning hole forming portion 73a, between the first capacitor 4a and the second capacitor 4b, and between the second capacitor 4b and the coil 4c. Other than this, the circuit device is the same as that of the first embodiment.

In addition to the positioning hole 2, the guide member 73 is provided with an injection hole (not shown) and an air vent hole (not shown) in the positioning hole forming portion 73a, and the potting material 13 is injected from the injection hole. . The potting material to be injected is preferably a heat-dissipating material.
In the present embodiment, a guide member in which guide mechanisms having the same depth are formed is used, but if the potting material can be filled into the space between the electronic component to be mounted and the positioning hole forming portion, for example, You may use the guide member from which the depth of the guide mechanism part shown in FIG.1 (c) differs.

FIG. 12 is a schematic cross-sectional view of a heat dissipation member used in a circuit device according to Embodiment 7 of the present invention.
In the circuit device of the present embodiment, the heat radiating member 12 shown in FIG. 12 may be used instead of the base plate 9, and the heat radiating member 12 is screwed with a bolt (not shown) inserted through the flange portion 3b into the female screw portion. And is fixed to the guide member 73.
The circuit device 300 according to the present embodiment has the same effect as the circuit device according to the first embodiment, and the potting material 13 is filled in the space between the electronic component 4 and the positioning hole forming portion 73a. The heat dissipation of heat generated from the electronic component 4 is high. In particular, when the heat radiating member 12 is used in place of the base plate 9, the heat dissipation is further improved.

Further, since the potting material 13 is fixed to the guide member 73 and also to the electronic component 4, the potting material 13 absorbs the vibration of the electronic component 4 even if the guide member 73 vibrates. In addition, since the root of the lead terminal 8 is fixed by the potting material 13, the potting material 13 around the lead terminal 8 remains on the lead terminal 8 even if the printed circuit board 7 vibrates relative to the guide member 73. The stress applied to the root is dispersed to improve the vibration resistance of the circuit device, and the reliability of the joint portion between the lead terminal 8 and the through hole 11 is also improved.
In addition, since the potted circuit device has an increased heat capacity and can suppress a transient temperature rise in an application that instantaneously requires a power larger than the rated current, the temperature range of the heat cycle can be reduced, Heat cycle stress has been alleviated.
Filling the space between the electronic component to be mounted and the positioning hole forming portion with a potting material and using a heat radiating member instead of the base plate is also applicable to the circuit devices of the third to sixth embodiments. It can be applied and a similar effect can be obtained.

  The circuit device according to the present invention is a device in which an electronic component and a circuit board are connected by using a guide member having a guide mechanism portion and a positioning hole, and a large electronic component is mounted in the vicinity to be miniaturized, In addition, it can be used as a circuit device having excellent bonding reliability between the lead terminals of electronic components and the circuit board.

1 guide mechanism part, 1a wall part, 2 positioning hole, 2a taper part,
2b straight part, 3 guide member, 3a positioning hole forming part, 3b flange part,
4 electronic component, 4a first capacitor, 4b second capacitor, 4c coil,
7 Printed circuit board, 8 Lead terminal, 9 Base plate, 10 Screw, 11 Through hole,
12 heat radiating member, 12a female thread part, 13 potting material, 21 guide mechanism part,
23 guide member, 24 electronic component, 28 lead terminal, 31 guide mechanism part,
33 guide member, 41 guide mechanism part, 41c inner wall surface, 41d protrusion part,
43 Guide member, 53 Guide member, 53c Spacer part, 63 Guide member,
63d concave part, 71 guide mechanism part, 73 guide member, 73a positioning hole forming part,
100, 200, 300 Circuit device.

Claims (12)

  A guide member provided with a hollow guide mechanism portion having an opening and a positioning hole forming portion having a positioning hole, a main body portion is inserted into the guide mechanism portion, and a lead terminal is inserted into the positioning hole. An electronic component, a circuit board provided on the outer surface side of the positioning hole forming portion of the guide member and having the lead terminal extending from the positioning hole inserted into the through hole and joined thereto, and the positioning hole forming portion, A circuit device comprising: a base plate covering an opening portion of the opposing guide member.   The circuit device according to claim 1, wherein a shape of the guide mechanism portion is a shape fitted to a main body portion of the electronic component.   2. The circuit device according to claim 1, wherein the guide mechanism portion of the guide member has a tapered shape whose opening side is wider than the positioning hole forming portion side.   The circuit device according to claim 1, wherein a protrusion is provided on an inner wall surface of the guide mechanism portion of the guide member.   The spacer part is provided in the peripheral part of the surface facing a circuit board of a guide member, The said circuit board is mounted and fixed to the said spacer part, The any one of Claims 1-4 characterized by the above-mentioned. Circuit device.   The circuit device according to claim 1, wherein a concave portion is provided on a surface of the guide member facing the circuit board.   4. A gap is provided between an electronic component having a main body inserted in the guide mechanism and a positioning hole forming portion, and at least the gap is filled with a potting material. The circuit device according to claim 6.   The circuit device according to claim 1, wherein the opening of the guide member is covered with a heat radiating member.   9. The circuit device according to claim 1, wherein a length of the lead terminal is equal to or greater than a depth of the guide mechanism.   The circuit device according to claim 1, wherein the electronic component is bonded to the guide mechanism portion with an adhesive.   A guide member preparing step of preparing a guide member having a recessed guide mechanism portion and a positioning hole forming portion having a positioning hole and having an opening in a portion facing the positioning hole forming portion; An electronic component installation step of inserting a main body portion of the electronic component into the guide mechanism after inserting a lead terminal of the electronic component into the positioning hole from the opening side in the second step; A base plate installation step of fixing the base plate to the guide member after covering the opening of the guide member on which the electronic component is installed with a base plate, and the positioning hole of the fourth step A circuit board installation step of inserting the lead terminal and the through hole after inserting the lead terminal extending from the through hole into the through hole and placing the circuit board on the positioning hole forming portion; Method of manufacturing a circuit device for implementing the Luo the fourth step in order.   12. The method of manufacturing a circuit device according to claim 11, wherein a circuit board installation step is performed after the electronic component installation step, and a base plate installation step is subsequently performed.

Images