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JP2010118958A - Ultrasonic transducer - Google Patents

Ultrasonic transducer Download PDF

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Publication number
JP2010118958A
JP2010118958A JP2008291476A JP2008291476A JP2010118958A JP 2010118958 A JP2010118958 A JP 2010118958A JP 2008291476 A JP2008291476 A JP 2008291476A JP 2008291476 A JP2008291476 A JP 2008291476A JP 2010118958 A JP2010118958 A JP 2010118958A
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ultrasonic
ultrasonic transducer
ultrasonic transducers
electronic circuit
preamplifier module
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Japanese (ja)
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Takumi Shigemori
巧 重森
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Nippon Ceramic Co Ltd
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Nippon Ceramic Co Ltd
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Priority to JP2008291476A priority Critical patent/JP2010118958A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein automation is disturbed by complication in routing of I/O leads in preamplifier modules using ultrasonic transducers for transmission and reception of ultrasonic frequency bands. <P>SOLUTION: The preamplifier modules use the ultrasonic transducers. In the ultrasonic transducers, piezoelectric elements are bonded inside a bottom surface of a bottomed cylindrical case to form unimorph vibrators, and ultrasonic waves are transmitted and received by vibration of the unimorph vibrators. When electronic circuit boards are electrically connected to the ultrasonic transducers, metal terminals buried in housings are provided, and the electronic circuit boards are electrically connected to the ultrasonic transducers via the metal terminals to enable assembly by automatic machines, thus providing preamplifier modules using inexpensive ultrasonic transducers. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、超音波周波数帯の送信、受信を行う超音波送受波器を用いたプリアンプモジュールに関するものである。   The present invention relates to a preamplifier module using an ultrasonic transducer that transmits and receives an ultrasonic frequency band.

従来の実施の形態に関わる超音波送受波器において、これを車のバンパー等に埋め込み設置し、周辺の障害物を検出する場合、超音波送受波器にパルスバースト電気信号を入力することで超音波送受波器からその入力パルスバースト電気信号に応じた超音波信号が発振され、発振された超音波信号は障害物に到達した後、その障害物で反射し、超音波信号の一部は同じ超音波送受波器に戻ってくる。超音波送受波器はその反射信号を受信することで障害物を検出している。
図3に従来の実施の形態に関わる超音波送受波器を用いたプリアンプモジュールの概略縦断面図を表す。図3において、アルミニウム材等からなる有底筒状ケース2の底面内部に圧電素子1を固着しユニモルフ振動子を形成する。圧電素子1は銀電極が裏面から折り返し構造で表に取り出されて2つの電極が1面に設置されている。これらの銀電極に入出力リード5a、5bを半田付け等をして取り出す。入出力リード線5aおよび5bはPVC被覆ワイヤ付きコネクタ7のワイヤ6にそれぞれ半田付けされている。圧電素子8の上面にシリコーン発泡体等から成る吸音材3を設置し、更にその上からシリコーン材、ウレタン材等の弾性体から成る封止剤4を有底筒状ケース2内に充填する。これをPBT樹脂等からなるハウジング9に弾性樹脂からなるクッション10で固定する。電子回路が搭載された基板11の然るべきパターンにコネクタ7の端子を半田付け等を行い電気的に接続する。コントローラに接続するためのワイヤー13が設けられ、ウレタン等からなる封止剤12で封止してプリアンプモジュールを構成する。
図4に従来の実施の形態に関わる別の超音波送受波器を用いたプリアンプモジュールの概略縦断面図を表す。図4において、アルミニウム材等からなる有底筒状ケース2の底面内部に圧電素子1を固着しユニモルフ振動子を形成する。圧電素子1は銀電極が裏面から折り返し構造で表に取り出されて2つの電極が1面に設置されている。これらの銀電極に入出力リード5a、5bを半田付け等をして取り出す。これをPBT樹脂等からなるハウジング9に弾性樹脂からなるクッション10で固定する。圧電素子の銀電極に入出力リード5a、5bを半田付け等をして取り出す。圧電素子1の上面にシリコーン発泡体等から成る吸音材3を設置し、更にその上からシリコーン材、ウレタン材等の弾性体から成る封止剤4を有底筒状ケース2内に充填する。電子回路が搭載された基板11の然るべきパターンに入出力リード5a、5bを半田付け等を行い電気的に接続する。コントローラに接続するためのワイヤー13が設けられ、ウレタン等からなる封止剤12で封止してプリアンプモジュールを構成する。
従来、超音波送受信器において、入出力リードと電子回路を搭載した基板の電気的接続の方法として長いワイヤーを引き回す必要があり、手作業による組み立ての必要があるが、自動化が困難でコストダウンの妨げとなっている。
谷腰欣司著 「超音波とその使い方−超音波送受波器・超音波モータ」 日刊工業新聞 1994年 特開平11−345818
In an ultrasonic transducer according to a conventional embodiment, when this is embedded in a vehicle bumper or the like and an obstacle around it is detected, the pulse transducer electric signal is input to the ultrasonic transducer to obtain the super An ultrasonic signal corresponding to the input pulse burst electric signal is oscillated from the sonic transducer, and the oscillated ultrasonic signal is reflected by the obstacle after reaching the obstacle, and part of the ultrasonic signal is the same Return to the ultrasonic transducer. The ultrasonic transducer detects an obstacle by receiving the reflected signal.
FIG. 3 is a schematic longitudinal sectional view of a preamplifier module using an ultrasonic transducer according to a conventional embodiment. In FIG. 3, the piezoelectric element 1 is fixed inside the bottomed cylindrical case 2 made of an aluminum material or the like to form a unimorph vibrator. In the piezoelectric element 1, silver electrodes are taken out from the back in a folded structure from the back, and two electrodes are installed on one surface. The I / O leads 5a and 5b are soldered out of these silver electrodes. The input / output lead wires 5a and 5b are respectively soldered to the wire 6 of the connector 7 with the PVC coated wire. A sound absorbing material 3 made of a silicone foam or the like is placed on the upper surface of the piezoelectric element 8, and a sealing agent 4 made of an elastic material such as a silicone material or a urethane material is further filled into the bottomed cylindrical case 2. This is fixed to a housing 9 made of PBT resin or the like with a cushion 10 made of elastic resin. The terminals of the connector 7 are soldered to an appropriate pattern on the board 11 on which the electronic circuit is mounted, and electrically connected. A wire 13 for connecting to the controller is provided, and the preamplifier module is configured by sealing with a sealant 12 made of urethane or the like.
FIG. 4 is a schematic longitudinal sectional view of a preamplifier module using another ultrasonic transducer according to the conventional embodiment. In FIG. 4, the piezoelectric element 1 is fixed inside the bottom surface of the bottomed cylindrical case 2 made of an aluminum material or the like to form a unimorph vibrator. In the piezoelectric element 1, silver electrodes are taken out from the back in a folded structure from the back, and two electrodes are installed on one surface. The I / O leads 5a and 5b are soldered out of these silver electrodes. This is fixed to a housing 9 made of PBT resin or the like with a cushion 10 made of elastic resin. The input / output leads 5a and 5b are soldered to the silver electrodes of the piezoelectric element and taken out. A sound absorbing material 3 made of a silicone foam or the like is installed on the upper surface of the piezoelectric element 1, and a sealing agent 4 made of an elastic material such as a silicone material or a urethane material is further filled in the bottomed cylindrical case 2. The input / output leads 5a and 5b are soldered to an appropriate pattern of the substrate 11 on which the electronic circuit is mounted, and are electrically connected. A wire 13 for connecting to the controller is provided, and the preamplifier module is configured by sealing with a sealant 12 made of urethane or the like.
Conventionally, in an ultrasonic transmitter / receiver, it is necessary to route a long wire as a method of electrical connection between an input / output lead and a board on which an electronic circuit is mounted, which requires manual assembly, but is difficult to automate and reduces costs. It is a hindrance.
Tanikoshi Shinji “Ultrasound and its usage-Ultrasonic transducers and ultrasonic motors” Nikkan Kogyo Shimbun 1994 JP-A-11-345818

超音波周波数帯の送信、受信を行う超音波送受波器を用いたプリアンプモジュールにおいて、超音波送受波器より取り出された入出力リードと電子回路を搭載した基板の電気的接続の方法として長いワイヤーを引き回す必要があり、手作業による組み立ての必要があり、自動化が困難でコストダウンの妨げとなっている。   In a preamplifier module using an ultrasonic transducer that transmits and receives ultrasonic frequency bands, a long wire is used as a method of electrical connection between the input / output leads taken out of the ultrasonic transducer and the board on which the electronic circuit is mounted. Must be routed, and manual assembly is required, which is difficult to automate and hinders cost reduction.

有底筒状ケースの底面内部に圧電素子を貼り合わせユニモルフ振動子を形成し、ユニモルフ振動子の振動によって超音波の送受信を行う超音波送受波器を用いたプリアンプモジュールににおいて、ハウジングに一部を埋設した金属端子を設け、これを介して電子回路基板と超音波送受波器の電気的接続を行う事で生産性を上げ自動化も可能にした。  In a preamplifier module using an ultrasonic transducer that forms a unimorph vibrator by laminating a piezoelectric element inside the bottomed cylindrical case to form a unimorph vibrator, and transmits and receives ultrasonic waves by the vibration of the unimorph vibrator. By providing a metal terminal with embedded wiring and making an electrical connection between the electronic circuit board and the ultrasonic transducer via this, it is possible to increase productivity and automate.

本発明は、超音波送受波器を用いたプリアンプモジュールにおて、自動化が容易で安価な超音波送受波器を用いたプリアンプモジュールを提供出来るという利点を持つ。   The present invention has an advantage that it is possible to provide a preamplifier module using an ultrasonic transducer that is easy to automate and inexpensive, in a preamplifier module using an ultrasonic transducer.

車載用コーナーセンサ等に用いる際、バンパー等に埋め込み設置し、近距離まで安定した障害物検知を誤作動無く高い信頼性、ローコストで実現出来る。   When used in in-vehicle corner sensors, etc., it can be embedded in a bumper, etc., and stable obstacle detection up to a short distance can be realized without malfunction and with high reliability and low cost.

図1に本発明の実施の形態に関わる超音波送受波器を用いたプリアンプモジュールの概略断面図を上部、電子部品が搭載された基板11を透過した上面よりの見取り図を下部に示す。図1において、アルミニウム材等からなる有底筒状ケース2の底面内部に圧電素子1を固着しユニモルフ振動子を形成する。圧電素子1は銀電極が裏面から折り返し構造で表に取り出されて2つの電極が1面に設置されている。これをPBT樹脂等からなるハウジング9に弾性樹脂からなるクッション10で固定する。圧電素子の銀電極に入出力リード5a、5bを半田付け等をして取り出す。これらの入出力リードをハウジング9に埋設された金属端子16a、16bに半田付け等により接続する。圧電素子8の上面にシリコーン発泡体等から成る吸音材3を設置し、更にその上からシリコーン材、ウレタン材等の弾性体から成る封止剤4を有底筒状ケース2内に充填する。ハウジングに設けられた埋設金属端子16a、16bの位置に予めスルーホール8が設けられた電子回路が搭載された基板11を装着し半田付け等により電気的に部に接続され、ワイヤ13等によりコントローラに接続するための端子が設けられ、ウレタン等からなる封止剤12で封止されてプリアンプモジュールを構成する。
図2は本発明の実施の形態に関わる別の超音波送受波器を用いたプリアンプモジュールの概略断面図を上部、電子部品が搭載された基板11を透過した上面よりの見取り図を下部に示す。図2において、アルミニウム材等からなる有底筒状ケース2の底面内部に圧電素子1を固着しユニモルフ振動子を形成する。圧電素子1は銀電極が裏面から折り返し構造で表に取り出されて2つの電極が1面に設置されている。これをPBT樹脂等からなるハウジング9に弾性樹脂からなるクッション10で固定する。圧電素子の銀電極に入出力リード5a、5bを半田付け等をして取り出す。これらの入出力リードをハウジング9に埋設された金属端子16a、16bに半田付け等により接続する。これに例えば発泡性シリコーン材や発泡性ウレタン剤15や砕いた発泡体等と弾性剤を混合した封止剤14を充填する。ハウジングに設けられた埋設金属端子16a、16bの位置に予めスルーホールが設けられた電子回路が搭載された基板11を装着し半田付け等により電気的に部に接続され、ワイヤ13等によりコントローラに接続するための端子が設けられ、ウレタン等からなる封止剤12で封止されてプリアンプモジュールを構成する。
従来の実施の形態に関わる超音波送受波器を用いたプリアンプモジュールにおて、図3、4の入出力リードと電子回路を搭載した基板との電気的接続は従来の構造では引き回しや取り回しが複雑で自動化が困難であったが、本発明により自動化が容易となりローコストの超音波送受信器を用いたプリアンプモジュールを提供出来る。
FIG. 1 shows a schematic cross-sectional view of a preamplifier module using an ultrasonic transducer according to an embodiment of the present invention at the upper part, and a schematic view from the upper surface through which a substrate 11 on which electronic components are mounted is shown at the lower part. In FIG. 1, a piezoelectric element 1 is fixed inside a bottomed cylindrical case 2 made of an aluminum material or the like to form a unimorph vibrator. In the piezoelectric element 1, silver electrodes are taken out from the back in a folded structure from the back, and two electrodes are installed on one surface. This is fixed to a housing 9 made of PBT resin or the like with a cushion 10 made of elastic resin. The input / output leads 5a and 5b are soldered to the silver electrodes of the piezoelectric element and taken out. These input / output leads are connected to metal terminals 16a and 16b embedded in the housing 9 by soldering or the like. A sound absorbing material 3 made of a silicone foam or the like is placed on the upper surface of the piezoelectric element 8, and a sealing agent 4 made of an elastic material such as a silicone material or a urethane material is further filled into the bottomed cylindrical case 2. A substrate 11 on which an electronic circuit in which a through hole 8 is provided in advance is mounted at the position of embedded metal terminals 16a and 16b provided in the housing and is electrically connected to the part by soldering or the like. The preamplifier module is configured by being provided with a terminal for connection to and sealed with a sealant 12 made of urethane or the like.
FIG. 2 shows a schematic cross-sectional view of a preamplifier module using another ultrasonic transducer according to the embodiment of the present invention at the top, and a bottom view from the top through the substrate 11 on which electronic components are mounted. In FIG. 2, a piezoelectric element 1 is fixed inside the bottom of a bottomed cylindrical case 2 made of an aluminum material or the like to form a unimorph vibrator. In the piezoelectric element 1, silver electrodes are taken out from the back in a folded structure from the back, and two electrodes are installed on one surface. This is fixed to a housing 9 made of PBT resin or the like with a cushion 10 made of elastic resin. The input / output leads 5a and 5b are soldered to the silver electrodes of the piezoelectric element and taken out. These input / output leads are connected to metal terminals 16a and 16b embedded in the housing 9 by soldering or the like. This is filled with, for example, a foaming silicone material, a foaming urethane agent 15, a crushed foam or the like and a sealing agent 14 mixed with an elastic agent. A substrate 11 on which an electronic circuit in which through holes are provided in advance is mounted at the positions of embedded metal terminals 16a and 16b provided in the housing, is electrically connected to the part by soldering or the like, and is connected to the controller by a wire 13 or the like. Terminals for connection are provided, and the preamplifier module is configured by being sealed with a sealant 12 made of urethane or the like.
In the preamplifier module using the ultrasonic transducer according to the conventional embodiment, the electrical connection between the input / output leads of FIGS. 3 and 4 and the board on which the electronic circuit is mounted is not routed or handled in the conventional structure. Although complicated and difficult to automate, the present invention facilitates automation and can provide a preamplifier module using a low-cost ultrasonic transceiver.

本発明は、車のバックセンサのみならず、防滴型超音波送受波器が利用されている様々な分野に適用できる。   The present invention can be applied not only to a back sensor of a car but also to various fields where a drip-proof ultrasonic transducer is used.

本発明の実施の形態に関わる有底筒状ケースとプリアンプモジュールの概略図Schematic of bottomed cylindrical case and preamplifier module according to an embodiment of the present invention 本発明の実施の形態に関わる有底筒状ケースとプリアンプモジュールの概略図Schematic of bottomed cylindrical case and preamplifier module according to an embodiment of the present invention 従来の実施の形態に関わる有底筒状ケースとプリアンプモジュールの概略図Schematic diagram of bottomed cylindrical case and preamplifier module according to the conventional embodiment 従来の実施の形態に関わる有底筒状ケースとプリアンプモジュールの概略図Schematic diagram of bottomed cylindrical case and preamplifier module according to the conventional embodiment

符号の説明Explanation of symbols

1 折り返し電極を設けた圧電素子
2 有底筒状ケース
3 吸音材
4 弾性材からなる封止剤
5a 入出力リード
5b 入出力リード
6 PVC被覆ワイヤ
7 PVC被覆ワイヤ付きコネクタ
8 電子回路基板に設けられたスルーホール
9 ハウジング
10 クッション
11 電子回路基板
12 プリアンプモジュール封止剤
13 プリアンプモジュールワイヤー
14 砕いた発泡体等と弾性剤を混合した封止剤
15 発泡性の弾性材からなる封止剤

16aハウジングに設けられた埋設金属端子
16bハウジングに設けられた埋設金属端子
DESCRIPTION OF SYMBOLS 1 Piezoelectric element provided with the return electrode 2 Bottomed cylindrical case 3 Sound absorbing material 4 Sealant made of elastic material 5a Input / output lead 5b Input / output lead
6 PVC coated wire 7 Connector with PVC coated wire 8 Through hole provided in electronic circuit board 9 Housing 10 Cushion 11 Electronic circuit board 12 Preamplifier module sealant 13 Preamplifier module wire 14 Crushed foam etc. and elastic agent were mixed Sealant 15 Sealant made of foaming elastic material

Embedded metal terminal provided in 16a housing Embedded metal terminal provided in 16b housing

Claims (1)

有底筒状ケースの底面内部に圧電素子を貼り合わせユニモルフ振動子を形成し、ユニモルフ振動子の振動によって超音波の送受信を行う超音波送受波器を用いたプリアンプモジュールにおいて、ハウジングに一部を埋設した金属端子を設け、これを介して電子回路基板と超音波送受波器の電気的接続を行う事を特徴とする超音波送受波器を用いたプリアンプモジュール。 In a preamplifier module using an ultrasonic transducer that forms a unimorph vibrator by bonding a piezoelectric element inside the bottom surface of a bottomed cylindrical case and transmits and receives ultrasonic waves by the vibration of the unimorph vibrator, a part of the housing is partly attached to the housing. A preamplifier module using an ultrasonic transducer characterized in that an embedded metal terminal is provided and an electronic circuit board and an ultrasonic transducer are electrically connected through the metal terminal.
JP2008291476A 2008-11-13 2008-11-13 Ultrasonic transducer Pending JP2010118958A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012032167A (en) * 2010-07-28 2012-02-16 Nippon Ceramic Co Ltd Ultrasonic transmitting/receiving apparatus
JP2012198106A (en) * 2011-03-22 2012-10-18 Panasonic Corp Ultrasonic sensor
CN102833658A (en) * 2011-06-15 2012-12-19 罗伯特·博世有限公司 Ultrasonic transducer with piezoelectric element and distance sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302384A (en) * 2002-04-10 2003-10-24 Ngk Spark Plug Co Ltd Sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302384A (en) * 2002-04-10 2003-10-24 Ngk Spark Plug Co Ltd Sensor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012032167A (en) * 2010-07-28 2012-02-16 Nippon Ceramic Co Ltd Ultrasonic transmitting/receiving apparatus
JP2012198106A (en) * 2011-03-22 2012-10-18 Panasonic Corp Ultrasonic sensor
CN102833658A (en) * 2011-06-15 2012-12-19 罗伯特·博世有限公司 Ultrasonic transducer with piezoelectric element and distance sensor
CN102833658B (en) * 2011-06-15 2018-03-30 罗伯特·博世有限公司 Ultrasonic tr-ansducer and manufacture method and range sensor with piezoelectric element

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