JP2010114225A - Exposure device and production method of device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device reducing vibrations transmitted to a stage under an exposure operation from a power usage cable and reducing the deterioration in the stage-positioning accuracy and resolving power. <P>SOLUTION: The exposure device includes a mask stage 20 for moving a mask; a plate stage 30 for moving a substrate such as a wafer; and a projection optical system for projecting the pattern image of the mask to the substrate, wherein at least one of the mask stage and the plate stage is connected to its body structure 2, through a moving cable that includes a reactive force plate 3 and a plurality of power usage cables 1; and an attenuating material 5 for attenuating vibrations is interposed in between the plurality of power usage cables that attenuate the vibrations in the reactive force plate during the driving of the stage. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and a device manufacturing method for exposing an image of an original pattern on a substrate in a lithography process for manufacturing a device such as a liquid crystal display element, a semiconductor element, and a thin film magnetic head.

  Liquid crystal display elements and semiconductor elements are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a substrate. An exposure apparatus used in this photolithography process has a plate stage on which a substrate is placed and moved two-dimensionally, and a mask stage on which a mask having a pattern is placed and moved two-dimensionally. Further, the pattern formed on the mask is transferred to the substrate through the projection optical system while sequentially moving the mask stage and the plate stage.

  The exposure apparatus includes a batch exposure type exposure apparatus that simultaneously transfers the entire mask pattern onto the substrate, and a scanning exposure type exposure that continuously transfers the mask pattern onto the substrate while synchronously scanning the mask stage and the plate stage. Two types of devices are mainly known. In any apparatus, the mask pattern chucked on the mask stage is transferred to the plate chucked on the plate stage by matching the relative positions of the mask stage and the plate stage with high accuracy.

  Therefore, the positioning accuracy and synchronization accuracy of the mask stage and the plate stage are one of the most important performances of the exposure apparatus. The plate stage and the mask stage (hereinafter, both are collectively referred to as a stage) require connection of utility cables. This utility cable enables sliding of vacuum piping for adsorbing plates and masks, power supply cables to various drive mechanisms installed in the stage, signal lines of various sensors installed on the stage, and the stage. It has compressed air piping used for air bearings. However, if the utility cables are randomly connected and pulled out in various directions, the tension of each utility cable works in a complicated manner, which hinders movement of the stage.

Therefore, Patent Document 1 proposes a cable guide for a moving device for reducing stress applied to a tube or a cable when moving a movable part and greatly reducing vibration and resistance during movement. This conventional example is intended to guide a tube and a cable as a bendable member that engages a moving slider or the like that is a movable part that reciprocates along a traveling guide and a base or a pedestal that is a fixed part. And a tube and a cable are guide-held by the support member which can be bent in circular arc shape. The support member is integrally made of fluororesin, and the tube and cable are bound and fixed to the support member with a string-like member, so that the cables adjacent to each other along the surface of the support member have the same curvature. It is fixed in one layer.
JP 2002-27649 A

In the above-described conventional example, there is a problem in that the stage positioning accuracy and the resolving power deteriorate due to the vibration generated in the utility cable due to the stage movement being transmitted to the stage during the exposure operation.
SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus that reduces vibration transmitted from a utility cable to a stage during an exposure operation, and reduces deterioration in stage positioning accuracy and resolution.

An exposure apparatus of the present invention for solving the above problems is
An exposure apparatus comprising: an original stage for moving an original plate; a substrate stage for moving a substrate; and a projection optical system that projects an image of the pattern of the original plate onto the substrate; and at least one of the original stage and the substrate stage and a main body A moving cable including a reaction force plate connecting the structure and a plurality of utility cables is provided, and a damping material that attenuates vibration is interposed between the plurality of utility cables.

  According to the present invention, it is possible to reduce vibration transmitted from the utility cable to the stage during the exposure operation, and to reduce deterioration in stage positioning accuracy and resolution.

First, the overall configuration of a scanning exposure apparatus on which the moving cable of the present invention is mounted will be described with reference to FIG.
A mask stage (original stage) 20 for moving the mask (original plate) 23 is arranged above the projection optical system 10 in the vertical direction, and a plate stage (substrate stage) 30 for moving the plate (substrate) is arranged on the lower side. Has been. The projection optical system 10 is an optical system that projects a pattern image of the mask 23 onto a plate. The mask stage 20 and the plate stage 30 can be moved individually, and both of these movement positions can be measured and controlled by the laser interference length measuring device 50.

  The plate stage 30 has a Y stage 32 and an X stage 33 disposed on the main body base 31. Note that the X direction and the Y direction are orthogonal to each other. A θZ stage 34 is mounted on the XY stage, and a plate chuck 35 is disposed thereon, thereby supporting the plate 36 to be exposed. Accordingly, the plate 36 can be moved in the X, Y, and Z directions by the plate stage 30 and is also rotatably supported in the XY plane. The θZ stage 34 is for making the surface of the plate 36 coincide with the plate-side focal plane of the projection optical system 10 during exposure.

  The mask stage 20 includes a mask stage substrate 21 and an XYθ stage disposed thereon, and a mask 23 having a pattern to be projected thereon is disposed. Therefore, the mask 23 can be moved in the X and Y directions and is supported rotatably in the XY plane. Above the mask stage 20, an observation optical system 40 capable of observing the images of the mask 23 and the plate 36 via the projection optical system 10 is disposed, and an illumination optical system 41 is disposed further above.

  Both the mask stage 20 and the plate stage 30 are subjected to position measurement control by a laser interference length measuring device 50. The laser interference length measuring device 50 includes a laser head 51, interference mirrors 52 and 53, and a first reflection mirror 54 attached to the θZ stage 34 and a second reflection mirror 55 attached to the mask stage substrate 21. Have

  Here, the laser beam position of the laser interferometer 50 is set to the mask-side focal plane of the projection optical system 10 in the vertical direction (the optical axis direction of the projection optical system 10) for the mask stage 20. . In the horizontal plane, the optical axis position of the projection optical system 10 is set substantially. The plate stage 30 is set substantially at the optical axis position of the projection optical system 10 in the horizontal plane, but is displaced by a distance L downward from the plate-side focal plane of the projection optical system 10 in the vertical direction. It is set to pass through the position.

  Next, an embodiment of the moving cable of the present invention will be described with reference to FIGS. FIG. 1 is a side view of the moving cable of the present invention. FIG. 2 is a sectional view of the moving cable of the present invention. In the embodiment, the state of being attached to the mask stage 20 is shown. However, since the same structure is obtained even if it is attached to the plate stage 30, the structure of the plate stage 30 is omitted.

  The moving cable includes a reaction force plate 3 and a utility cable 1 that connect at least one of the mask stage 20 and the plate stage 30 and the main body structure 2. The main body structure 2 and the mask stage 20 serving as a driving unit include a pipe 11 for supplying a vacuum pipe and a compressed air pipe, and a utility cable including a power supply cable and a signal cable 12 integrally disposed inside the pipe 11. 1 is connected. Further, one end of a moving cable comprising a utility cable 1 and a reaction force plate 3 that receives the load of the utility cable 1 is connected to the outer periphery of the pipe 11, and the other end of the moving cable is connected to the main body structure 2.

  The damping material 4 (first damping material) is interposed in the laminated portion of the utility cable 1 and attenuates vibration. The damping material 4 that attenuates vibration is laminated between the power supply cable 1 and the signal cable 12 in the working cable 1 of the moving cable, and the damping material 5 (second damping material) is also laminated on the outermost periphery of the cable. Is. In FIG. 2, the power supply cable and the signal cable 12 are sandwiched between the attenuation members 4 and a plurality of layers are stacked. And the attenuation material 5 thicker than the attenuation material 4 is provided in the outer peripheral part.

  By laminating the damping members 4 and 5 in this way, it is possible to prevent the vibration generated individually in the cable from being transmitted to the whole and to attenuate the vibration generated in the reaction force plate 3. Therefore, it is possible to quickly attenuate the vibration generated in the utility cable due to the stage movement, reduce the vibration transmission to the stage during the exposure operation, and reduce the deterioration of the stage positioning accuracy and the resolution. Moreover, the effect which prevents that a utility cable will deteriorate, such as abrasion, when a moving cable contacts a structure can also be anticipated.

  The damping materials 4 and 5 are preferably viscoelastic materials, have a low deformation rate, and have a Young's modulus lower than that of the reaction force plate 3, such as a Teflon (registered trademark) material. The selection of the material varies depending on the mass of the utility cable 1, the strokes of the stages 20 and 30, and the selection of the reaction force plate 3, and the thickness of the damping material 4 can be allowed for the utility cable 1 to what extent the damping material 4 is tensioned. It depends on what.

  Further, it is preferable that the damping materials 4 and 5 are made of a thin material rather than a thick material so that the tension generated by the damping materials 4 and 5 can be reduced. Furthermore, the damping material 4 does not necessarily have to be laminated between the cables. However, by forming a multilayer structure by laminating between the cables, the tension generated in the damping material is reduced and the cables are generated individually. It is desirable not to transmit vibration to the whole.

  Next, examples of the device manufacturing method will be described. A device (semiconductor integrated circuit element, liquid crystal display element, etc.) is a step of exposing a substrate (wafer, glass plate, etc.) coated with a photosensitive agent using the exposure apparatus of any of the embodiments described above, and the exposure thereof. The substrate is formed and manufactured through a step of developing the formed substrate. Processes for processing the developed substrate include etching, resist stripping, dicing, bonding, packaging, and the like.

It is a front view of the moving cable which comprises the Example of this invention. It is the side view seen from the side surface of FIG. It is a front view which shows the whole exposure apparatus of the Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Utility cable 11 Piping 12 Electric power supply / signal cable 2 Main body structure 3 Reaction force plate 4, 5 Damping material 20 Mask stage 30 Plate stage

Claims (4)

An original stage for moving the original, and
A substrate stage for moving the substrate;
In an exposure apparatus having a projection optical system that projects an image of the pattern of the original plate onto the substrate,
A moving cable including a reaction force plate connecting at least one of the original stage and the substrate stage and a main body structure and a plurality of utility cables;
An exposure apparatus, wherein a damping material for damping vibration is interposed between the plurality of utility cables. The plurality of utility cables are arranged in a stacked manner,
The exposure apparatus according to claim 1, wherein the attenuation material is interposed in a laminated portion of the utility cable. The damping material includes a first damping material and a second damping material that is thicker than the first damping material,
The first damping material is interposed in the laminated portion of the utility cable,
The exposure apparatus according to claim 2, wherein the second attenuation member is provided on an outer peripheral portion of the stacked utility cables. A step of exposing the substrate using the exposure apparatus according to claim 1;
Developing the exposed substrate;
A device manufacturing method comprising:

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