JP2010105053A - Composite processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such problems that a temperature of water reserved in a work tank rises to cause a structure of the work tank to thermally displace and, in addition, that cut abrasive grains remain to increase a load of cleaning the work tank. <P>SOLUTION: A drain pump P1 is driven during processing to discharge the reserved water by a predetermined amount each time, and a processing water supply pump P4 is concurrently driven to feed fresh water at a predetermined temperature to the work tank 10 by a predetermined amount or more each time to circulate the reserved water in the tank 10. A processing liquid recycling and supplying device 2 includes a first centrifugal separator 41 for filtering primary wastewater, a recovery tank 20 for recovering the filtered wastewater comprising secondary wastewater filtered by a filtering tank 60, a second centrifugal separator 42 for re-filtering the filtered wastewater, a soil tank 30 for reserving clean water, and a fresh water tank 40 for reserving the fresh water comprising the clean water filtered by a paper filter 7. A cooling apparatus 6 cools the fresh water to a predetermined temperature. The processing water supply pump P4 is inverter-controlled by a controller CNT. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a combined machining apparatus capable of performing water jet machining and wire cut electric discharge machining with a single processing machine. In particular, the present invention relates to a combined machining apparatus that includes a machining liquid regeneration supply device that collects and purifies machining fluid used for machining, regenerates the machining liquid, and supplies the machining liquid to the machining site, and stabilizes the temperature and cleanliness of stored water in the machining tank. .

  Abrasive water jet that cuts the workpiece by injecting high-pressure cutting water mixed with abrasive grains such as garnet and sand or abrasive grains as cutting aids (hereinafter referred to as cutting abrasive grains) from a cutting nozzle. Wire-cut electric discharge machining that cuts the workpiece by intermittently generating electric discharge in the machining gap while supplying water-based electric discharge machining liquid (hereinafter referred to as machining water) from the machining liquid jet nozzle coaxially with the machining and wire electrode Has been put into practical use, which is capable of cutting a workpiece into a desired shape at a high speed and with high accuracy by carrying out the above with a single processing machine.

  In water jet processing, raw water from which impurities have been removed from tap water through a filter can be used as cutting water. Unnecessary sewage after being used for processing is stored in a processing tank (catch tank). The stored water in the processing tank is used as buffer water that absorbs the impact of the high-pressure cutting water and does not hinder processing, so it can be left in the processing tank. Since sewage does not contain harmful substances, it is possible to remove the processing waste and cutting abrasive grains by simple filtration and drain it into sewage. Therefore, a processing water circulation system that collects, purifies, and reuses wastewater for processing is unnecessary.

  In wire-cut electric discharge machining, machining water is used as a machining medium for electric discharge machining, and thus a high degree of insulation is required to induce spark discharge that contributes to machining. Further, the processing water supplied from the processing liquid jet nozzle to the processing gap is used as cleaning water for removing metal processing waste from the processing gap and purifying it, so that it has an appropriate cleanness without impurities. There is a need. Further, since the machining water is used as cooling water for cooling the wire electrode and the machining site where the temperature rises due to the electric current and heat generated by the electric discharge machining, it is necessary to be cooled to a predetermined temperature in advance.

  Therefore, it is necessary to prepare the processing water having a cleanliness and specific resistance value suitable for electric discharge machining and cooled to a predetermined temperature before processing, and tap water cannot be directly supplied as processing water, Appropriate processes and time are required to generate the processing water that can be supplied to the processing gap. Therefore, there is a need for a processing water circulation system that collects, purifies, and reuses wastewater for processing. Therefore, a general wire-cut electric discharge machining apparatus includes a supply device having a fresh water tank for storing machining water suitable for electric discharge machining, and a recovery device for supplying a machining liquid having a recovery device having a sewage tank for storing wastewater from the machining tank. Is provided (see Patent Document 1).

  In order to purify the sewage and regenerate the processed water, the processing fluid regeneration supply device removes the metal processing debris from the paper filter or diatomaceous earth filter that removes the metal processing debris from the sewage collected in the sewage tank, and the filter. An ion exchanger (pure water device) in which ion exchange resin that gives pure water to give pure water the required specific resistance value by ion exchange and loaded in an ion exchange resin tower, and a cooling device that cools water to a set temperature (See Patent Document 2).

  In the case of a combined machining apparatus, a machining fluid regeneration supply apparatus that regenerates and supplies machining water in the same manner as the wire cut electrical discharge machining apparatus is necessary to perform wire cut electrical discharge machining. In the case of the combined machining apparatus, unlike the wire cut electric discharge machining apparatus, the sewage used in the water jet machining contains high-hardness and sharp cutting abrasive grains as a cutting aid.

  When electric discharge machining is performed by immersing the workpiece in machining water, if the abrasive grains are contained in the water stored in the machining tank, the cutting abrasive grains may be an obstacle to good electric discharge machining. Further, the cutting abrasive grains may cause the wire electrode to run poorly, and may damage members such as a wire guide and a pulley. Alternatively, if cutting abrasive grains remain in the wire guide, it may cause an unexpected wire electrode disconnection. Therefore, in the combined machining apparatus, all of the sewage stored in the machining tank after the water jet machining is drained into the sewage tank and the machining tank is washed, and then the wire cut electric discharge machining is performed.

  The processing water circulation system collects and purifies the sewage used for processing and reuses it as processing water. Therefore, it is basically required that the total amount of water contained in the processing fluid regeneration supply device be as constant as possible. Is done. Therefore, the processing fluid regeneration supply device of the combined processing device is configured to regenerate and supply the processing water from the sewage used for processing discharged from the processing tank without using tap water even during water jet processing. Yes (see Patent Document 3).

JP-A-2005-219201 Japanese Patent Laid-Open No. 5-42414 JP 2006-110697 A

  The temperature of the high-pressure cutting water at the time of high-pressure pump output becomes a high temperature close to 90 degrees Celsius. In addition, considerable heat is generated during cutting. Therefore, the temperature of the buffer water stored in the processing tank rapidly increases during processing. As a result, thermal displacement occurs in a structure such as a bed that forms a processing tank, and the position of the work stand provided on the structure changes, so that the mounting position of the workpiece is displaced and the processing shape accuracy is lowered. Cause. Since the complex machining apparatus is required to have a higher machining shape accuracy than general water jet machining, it is necessary to make the thermal displacement of the structure as small as possible.

  Also, if the cutting water contained in the buffer water contains a large amount of cutting abrasive grains, a large amount of cutting abrasive grains remain attached to the processing tank, and the work tank cleaning operation is performed before wire-cut electric discharge machining. The burden of will be greater. In particular, the manual cleaning performed by the operator does not clean the abrasive grains adhering to the hard-to-clean parts of the processing tank, leaving a lot of abrasive grains, which is an obstacle to wire-cut electrical discharge machining. May be.

  An object of the present invention is to provide a combined processing apparatus capable of stabilizing water temperature and cleanliness by suppressing an increase in temperature and impurity concentration of water stored in a processing tank during processing. A plurality of advantages of the combined machining apparatus of the present invention will be described as appropriate when describing the combined machining apparatus of the embodiment.

  In order to solve the above-mentioned problems, a combined machining apparatus capable of performing water jet machining and wire-cut electrical discharge machining according to the present invention is a drainage pump that discharges stored water in a machining tank (10) by a predetermined amount per unit time during machining. (P1), the first centrifuge (41) for centrifuging impurities from the primary drainage discharged from the processing tank (10), and the impurities centrifuged by the first centrifuge (41) A collection tank (20) for collecting secondary waste water, a second centrifuge (42) for centrifuging impurities from the secondary waste water collected in the collection tank (20), and a first centrifuge (41 ) And a second centrifuge (42) for storing purified water from which impurities have been centrifuged, a sewage tank (30) for storing fresh water from which impurities have been removed, and a fresh water tank (40) for storing fresh water. A cooling device (6) for cooling to a temperature, and a predetermined Every Shimizu supply pump to water (P4) in each processing tank (10) over a predetermined amount per unit time, the provision.

  The composite processing apparatus has a control device (CNT) that controls the frequency of the supply pump (P4) by an inverter so that the same amount of fresh water as that of the primary waste water is supplied per unit time. In particular, the combined processing apparatus includes a filtration tank (60) that is accommodated in the recovery tank (20) and filters the secondary drainage to accumulate impurities contained in the secondary drainage.

  The composite processing apparatus preferably includes a filtration pump (P2) that pumps up the secondary wastewater and feeds it to the second centrifuge (42) when the water level of the secondary wastewater is equal to or higher than a preset water level. It becomes. More preferably, the combined processing apparatus drives the filtration pump (P2) when the water level of the secondary drainage is equal to or higher than a preset first water level to pump up the secondary drainage, and the second centrifuge ( 42) and when the water level of the secondary drainage is below the second water level lower than the first water level, the filtration pump (P2) is stopped and the secondary drainage is sent to the second centrifuge (42). And a control device (CNT) for controlling the filtration pump (P2) so as not to feed water.

  Another combined machining apparatus of the present invention includes a drainage pump (P1) that discharges a predetermined amount of water stored in the processing tank (10) per unit time during processing, and a primary drainage discharged from the processing tank (10). A first centrifuge (41) for centrifuging impurities, a recovery tank (20) for recovering secondary drainage containing impurities centrifuged by the first centrifuge (41), and a recovery tank (20 The second centrifuge (42) for centrifuging impurities from the secondary wastewater collected in (2), the impurities are centrifuged by the first centrifuge (41) and the second centrifuge (42). A sewage tank (30) consisting of a first tank (30A) for storing purified water and a second tank (30B) for storing quasi-clean water from which impurities are removed from the purified water by a mesh filter (32), and the quasi-clean water at a predetermined temperature A cooling device (6) that cools to the A supply pump for water supply (P4) to the processing tank by a predetermined amount or more (10) per time, and provided.

  The another combined processing apparatus has a control device (CNT) that controls the frequency of the supply pump (P4) by inverter so as to feed the same amount of semi-clean water as the primary drainage per unit time. In particular, the other combined processing apparatus includes a filtration tank (60) which is accommodated in the recovery tank (20) and filters the secondary drainage to accumulate impurities contained in the secondary drainage.

  The composite processing apparatus preferably includes a filtration pump (P2) that pumps up the secondary wastewater and feeds it to the second centrifuge (42) when the water level of the secondary wastewater is equal to or higher than a preset water level. It becomes. More preferably, the other combined processing device drives the filtration pump (P2) when the water level of the secondary drainage is equal to or higher than a preset first water level, pumps up the secondary drainage, and performs the second centrifugal separation. When the water level of the secondary drainage is below the second water level lower than the first water level, the filtration pump (P2) is stopped and the secondary drainage is sent to the second centrifuge (42). 42) has a control device (1) for controlling the filtration pump (P2) so as not to feed water.

  Said another combined processing apparatus comprises the fresh water tank (40) which stores the fresh water from which the impurity was removed from the semi-clean water by the paper filter (7).

  In addition, the said code | symbol is provided for convenience, making it correspond with the code | symbol described in drawing attached to the specification in order to make a structural member easy to understand, and this invention is limited to embodiment shown by drawing. Not what you want.

  The combined processing apparatus of the present invention continuously supplies fresh water or semi-fresh water at a predetermined temperature equal to or higher than the same amount to the processing tank while discharging a predetermined amount of water stored in the processing tank per unit time during processing. A predetermined amount of stored water is circulated between the processing fluid regeneration and supply device, and the stored water in the processing tank whose water temperature and impurity concentration rise due to processing has the required cleanliness as the stored water and reaches a predetermined temperature. It is always replaced with a cooled amount of fresh water or semi-fresh water. Therefore, the rise of the temperature and impurity concentration of the storage water of a processing tank is suppressed, and water temperature and cleanliness are stabilized moderately.

  As a result, the thermal displacement of the structure of the processing tank is small, and a decrease in processing shape accuracy is suppressed. In addition, since the amount of cutting abrasive grains remaining in the processing tank after discharging all the sewage from the processing tank is reduced, it is easier to clean the processing tank, reducing the burden on the operator, and leaving it unwashed. Therefore, it is possible to prevent a failure from occurring in the next wire cut electric discharge machining.

  At this time, the stored water in the processing tank is contaminated with high-pressure cutting water containing cutting abrasive grains at a high concentration at high temperatures, so the amount of high-pressure cutting water sprayed per unit time and the total amount of stored water in the processing tank Even if the stored water is circulated at a small ratio compared to the above, it is not possible to expect the effect of suppressing the increase in the temperature and impurity concentration of the stored water in the processing tank. In order to be able to constantly supply a large amount of fresh water that can stabilize the water temperature and cleanliness of the stored water without interrupting the processing water circulation system during processing, large-capacity processing is required. A liquid regeneration supply device is required. However, it is difficult to carry out the processing liquid regeneration supply apparatus which is enlarged to an extent that is practically unacceptable.

  The combined processing apparatus of the present invention includes a centrifuge capable of directly introducing a larger amount of primary wastewater per unit time and performing primary filtration, and filtering the primary wastewater with a centrifuge without draining it into a sewage tank. Store purified water in the tank. Therefore, it is not mixed again in the purified water from which impurities are separated and removed from the primary waste water, and the filtration efficiency and filtration accuracy are high. Therefore, it is possible to filter the primary drainage of a sufficient amount of water that can appropriately stabilize the water temperature and cleanliness of the stored water.

  In addition, since the amount of secondary wastewater containing impurities separated and removed from the centrifuge is considerably smaller than the amount of primary wastewater introduced, the filtration efficiency is high, and the wastewater is not recycled and is not recycled. The amount of surplus water remaining can be extremely reduced with respect to the total capacity that can be accommodated in the machining fluid regeneration supply device. Therefore, the filtration time is significantly shortened compared to the method of generating purified water only by precipitation filtration and paper filter, and the primary drainage of sufficient amount of water that can stabilize the water temperature and cleanliness of the stored water appropriately per unit time In order to be able to supply approximately the same amount of fresh water or semi-fresh water in a sufficiently short time after filtration.

  Then, the secondary drainage discharged by filtering the primary wastewater is collected in a recovery tank, and the secondary drainage is filtered again to produce purified water, so that the amount of surplus water left without being regenerated in the recovery tank is further increased. Few. Therefore, it regenerates so that filtration efficiency is high and can supply about the same amount of fresh water or semi-fresh water as primary drainage.

  As a result, the processing water circulation system stops unexpectedly, the processing is interrupted, and the work efficiency is not reduced. The required and sufficient amount can be obtained. In addition, while ensuring a sufficient amount of clean water or semi-clean water that can be supplied per unit time, the capacity of the processing fluid regeneration supply device is made as small as possible to make the processing fluid regeneration supply device practical, and the unit time The amount of water circulated per hit can be set to a necessary and sufficient predetermined amount that is effective in suppressing the rise in the temperature and impurity concentration of the stored water in the processing tank.

  By providing a filtration tank accommodated in the recovery tank, the secondary drainage (filtered wastewater) can be filtered again with a centrifuge after removing impurities contained in the secondary wastewater collected in the recovery tank as much as possible. This can reduce the possibility that cutting abrasive grains will be mixed again in the centrifuge, and improve the filtration efficiency.

  When the secondary wastewater is sent to the centrifuge when the water level of the secondary wastewater stored in the recovery tank is higher than the specified water level, the secondary wastewater remaining in the recovery tank is centrifuged and refiltered in a timely manner. The amount of surplus water can be further reduced, the amount of fresh water or semi-fresh water that can be supplied per unit time without unexpectedly stopping the processing water circulation system can be increased, and the processing liquid regeneration supply device can be downsized.

  When the secondary drainage water stored in the recovery tank is below the specified water level, the secondary drainage with a high concentration of residual impurities, especially fine residual abrasive grains, should not be sent to the centrifuge. Since no water is fed to the centrifuge, the possibility that cutting abrasive grains are mixed again into the purified water can be extremely reduced, and the filtration accuracy is not lowered.

  When the sewage tank of the processing liquid regeneration supply device is composed of a first tank provided with a mesh filter and a second tank that stores quasi-fresh water or quasi-pure water that has passed through the mesh filter, the filtration time is the time required to generate fresh water from the quasi-clean water Can be shortened. In addition, the water stored in the processing tank does not require cleanliness to the same level as that of fresh water filtered with a high-precision paper filter, so it is possible to supply semi-clean water or semi-pure water as the stored water. Highly clean water or pure water with high cleanliness and insulation is not wasted and used as stored water, and the amount of water circulated per unit time is increased in the temperature and impurity concentration of processing tank stored water. It can be set to a necessary and sufficient predetermined amount that is effective for suppression.

  FIG. 1 is a schematic diagram showing a specific configuration of a processing tank and a processing liquid regeneration supply device in the combined processing apparatus according to the first embodiment of the present invention. The composite processing apparatus includes a processing machine main machine 1 and a processing fluid regeneration supply device 2. The relative movement device of the machine 1 and the numerical control device attached to the machine 1 are not shown. Further, illustration and detailed description of an accessory device provided in a complex processing apparatus not directly related to the present invention are omitted.

  A cutting nozzle 11 for water jet machining is attached to a first machining head (not shown). The first processing head is provided on a beam (not shown) installed so as to be able to reciprocate in the horizontal one-axis direction (Y-axis direction) that is the front-rear direction of the machine 1 across the processing tank 10. The first machining head reciprocates on the beam in a horizontal one-axis direction (X-axis direction) that is the left-right direction of the machine 1 orthogonal to the Y-axis direction by a linear motor.

  The first machining head includes a slider, and reciprocates the cutting nozzle 11 in the vertical one-axis direction (Z-axis direction) by moving the slider. In addition, an A-axis rotating device and a B-axis rotating device are provided, and the cutting nozzle 11 can be rotated around the X axis and the Y axis by the movement of the rotating device to be inclined with respect to the Z axis direction.

  An upper guide assembly 12A including an upper wire guide that supports and guides a wire electrode that is a tool in wire-cut electric discharge machining is attached to a second machining head (not shown) via an upper arm 13A. The upper guide assembly 12A includes an upper machining liquid jet nozzle 14A that supplies a machining liquid jet downward so as to surround the wire electrode coaxially with the wire electrode.

  The second machining head is provided on the beam. The second machining head is provided side by side with the first machining head, and reciprocates on the beam in the X-axis direction by a linear motor within a range that does not interfere with the first machining head. The second machining head includes a slider (not shown), and reciprocates the upper guide assembly 12A in the Z-axis direction by moving the slider.

  The second machining head includes a taper device configured by a cross table, and the taper device causes the upper guide assembly 12A to be parallel to the horizontal one-axis direction (U-axis direction) parallel to the X-axis direction and the Y-axis direction. The wire electrode stretched between the upper wire guide and the lower wire guide can be inclined by moving in the horizontal one-axis direction (V-axis direction).

  A lower guide assembly 12B including a lower wire guide that supports and guides the wire electrode is attached to the tip of the lower arm 13B. The lower arm 13B can reciprocate in the X-axis direction and the Y-axis direction by a linear motor. The lower guide assembly 12B includes a lower processing liquid jet nozzle 14B that supplies a processing liquid jet upward so as to surround the wire electrode coaxially with the wire electrode.

  The machine 1 includes a processing tank 10. The processing liquid regeneration supply device 2 includes a recovery tank 20, a sewage tank 30, a fresh water tank 40, and a super fresh water tank 50, one for each. A filtration tank 60 is provided so as to be accommodated in the collection tank 20. The processing liquid regeneration supply device 2 has a capacity capable of simultaneously storing at least the sewage discharged from the full processing tank 10 and the regenerated processing water that fills the processing tank 10.

  In wire-cut electric discharge machining, in order to prevent the occurrence of rust on the workpiece and perform good electric discharge machining, the workpiece is often immersed in machining water for machining. In water jet processing, high-pressure cutting water may damage the base structure. Therefore, a sufficiently deep processing tank 10 is provided so that the workpiece can be immersed in the processing water and the impact force of the high-pressure cutting water can be weakened by the buffer water to such an extent that the base structure is not damaged. The lower part of the processing tank 10 is formed in the space of the bed 3 so that the deep processing tank 10 is not disposed at a height position that makes the operation difficult.

  The processing tank 10 is divided into a lower part formed in the bed 3 and an upper part formed in a space surrounded by the processing tank wall 15 standing on the bed 3. Therefore, the work stand 16 for attaching and fixing the workpiece is provided inside the processing tank 10 with the column attached and fixed to the bed 3. In addition, a drain 17 having a drain outlet in the deepest part at the center of the bottom surface of the processing tank 10 is provided through the bed 3 for discharging all the stored water. Therefore, since the temperature of the stored water stored in the processing tank 10 directly affects the bed 3 forming the processing tank 10, when the temperature of the stored water in the processing tank 10 changes, the work stand 16 installed in the bed 3. The position of is displaced.

  Therefore, the combined processing apparatus of the present invention is sufficiently cooled to a predetermined temperature equal to or higher than the primary drainage discharged per unit time while discharging a predetermined amount of water stored in the processing tank per unit time during processing. The clean water or pure water having a high cleanliness is supplied to the processing tank, the rise of the temperature of the stored water in the processing tank is suppressed, and the displacement of the work stand is reduced. The processing fluid regeneration supply device in the combined processing apparatus of the present invention is a filtration system that can filter primary wastewater with high filtration efficiency in a short time and with less excess water during filtration so that a sufficient amount of fresh water or pure water can be supplied. Prepare.

  The first centrifugal separator 41 of the cyclone device 4 includes primary wastewater which is sewage discharged from the processing tank 10, and includes metal processing waste generated by processing from the primary wastewater and cutting abrasive grains used for processing. Centrifuge the impurities. The first centrifuge 41 sends purified water, which is separated water obtained by centrifuging impurities from the primary waste water, to the sewage tank 30.

  The first centrifuge 41 can separate and remove more impurities from the water to be treated in a short time with respect to the amount of water to be treated per unit time. In addition, the first centrifuge 41 is effective at the same time as impurities having a relatively large diameter and a large specific gravity, such as particles having a small specific gravity that are not easily precipitated from the water to be treated or particles having a small size that are difficult to be captured by a filter having low filtration accuracy. Can be separated and removed.

  The first centrifuge 41 is installed immediately above the collection tank 20. The first centrifuge 41 discharges the secondary wastewater containing impurities separated and removed from the primary wastewater at a high concentration so as to flow down to the recovery tank 20 arranged immediately below. The amount of secondary wastewater per unit time discharged from the first centrifuge 41 is significantly smaller than the amount of primary wastewater per unit time introduced into the first centrifuge 41. In the first centrifuge 41 of the embodiment, for example, when the amount of primary wastewater to be introduced is 125 liters per minute, the amount of purified water is 100 liters per minute and the amount of secondary wastewater is 3 liters per minute. .

  A plurality of the first centrifuges 41 can be arranged in parallel corresponding to the amount of primary drainage discharged from the processing tank 10 per unit time and the filtration capacity per unit time of the centrifuge. The processing liquid regeneration and supply apparatus 2 of the embodiment is provided with two centrifuges having the same specifications. Therefore, the amount of primary wastewater that can be introduced per unit time can be approximately doubled, and the drainage speed can be increased to shorten the standby time due to filtration regeneration.

  The second centrifuge 42 of the cyclone device 4 introduces the secondary drainage recovered in the recovery tank 20 and centrifuges and removes impurities from the secondary drainage. In the processing liquid regeneration supply device 2 of the embodiment, the secondary waste water is filtered by the filtration tank 60 and stored in the recovery tank 20. Hereinafter, the secondary wastewater filtered in the filtration tank 60 is particularly referred to as filtered wastewater. The second centrifuge 42 centrifuges residual impurities containing a large amount of fine cutting abrasive grains that cannot be filtered from the filtered waste water by the filtration tank 60, and discharges secondary waste water containing residual impurities to the filtration tank 60. The second centrifuge 42 feeds purified water, which is separated water obtained by centrifuging residual impurities from the filtered waste water, to the sewage tank 30.

  The second centrifuge 42 can separate and remove more impurities from the water to be treated in a short time with respect to the amount of water to be treated per unit time. Further, like the first centrifuge 41, the first centrifuge 42 also effectively separates and removes particles having a small specific gravity that are difficult to precipitate from the water to be treated or particles having a small size that are difficult to be captured by the filter. it can. The second centrifuge 42 has a higher per unit time than the first centrifuge 41 that filters a large amount of primary wastewater so that a small amount of filtered wastewater stored in the recovery tank 20 can be filtered. The filtration capacity may be small.

  The second centrifuge 42 is installed immediately above the collection tank 20. The second centrifuge 42 again centrifuges the secondary drainage containing impurities discharged from the first centrifuge 41 and collected in the collection tank 20. The secondary waste water containing the centrifuged impurities of the second centrifuge 42 is returned to the recovery tank 20, and purified water, which is the separated water from which impurities have been removed, is sent to the sewage tank 30.

  The second centrifuge 42 of the embodiment is installed immediately above the filtration tank 60. The second centrifuge 42 re-centrifuges the filtered wastewater containing residual impurities that are discharged from the first centrifuge 41 and removed to some extent by the filtration tank 60 and collected in the collection tank 20. The second centrifuge 42 discharges the secondary drainage containing the centrifuged impurities so as to flow down to the filtration tank 60 and returns to the recovery tank 20 to remove purified water that is separated water from which impurities have been removed. Water is sent to the sewage tank 30. The amount of filtered waste water per unit time introduced into the second centrifuge 42 is remarkably small. In the second centrifuge 42 of the embodiment, for example, when the amount of filtered wastewater to be introduced is 80 liters per minute, the amount of purified water is 50 liters per minute and the amount of secondary wastewater is 2 liters per minute. .

  The second centrifuge 42 centrifuges fine residual impurities that cannot be filtered and contained in the filtered waste water from which impurities are removed from the secondary waste water discharged from the first centrifugal separator 41 by the filtration tank 60. Since the purified water is sent to the sewage tank 30 again, the impurities accumulated in the filtration tank 60 among the impurities removed from the primary drainage are not mixed again into the purified water, and the separated impurities are mixed into the purified water again. It is hard to let you. The second centrifuge 42 introduces filtered wastewater that increases in the collection tank 20 in a timely manner, and centrifuges residual impurities from the filtered wastewater.

  The machining fluid regeneration supply device 2 includes a filtration tank 60 as an auxiliary tank. The filtration tank 60 is detachably accommodated in an upper position or an inner position of the collection tank 20. Further, the filtration tank 60 is disposed directly below the cyclone device 4. Therefore, the filtration tank 60 does not affect the installation area of the machining fluid regeneration supply device 2.

  The filtration tank 60 has a high concentration of impurities including metal processing waste separated from the primary drainage by the first centrifuge 41 or the second centrifuge 42 of the cyclone device 4 and cutting abrasive grains used for processing. The secondary wastewater containing is allowed to pass through, and only impurities are deposited and accumulated in the tank. Therefore, the combined processing apparatus according to the embodiment removes impurities contained in the secondary drainage of the first centrifuge 41 and the second centrifuge 42 as much as possible by the filtration tank 60 as much as possible, and the second When the secondary drainage is centrifuged by the centrifuge 42, the probability that impurities are mixed again is extremely reduced, and it is easier to regenerate without discarding the secondary drainage without reducing the filtration accuracy, and the recovery tank This is advantageous in that the excess water remaining in 20 is reduced.

  Specifically, the filtration tank 60 is a rectangular water tank having a plurality of fine through holes on the side surface. The size of the fine through holes is sufficiently smaller than the average particle diameter of the cutting abrasive grains subjected to processing. The filtration tank 60 is made of, for example, a metal having rust resistance such as stainless steel, and a mesh that forms fine through holes is formed on the lower surface or the entire surface of all side surfaces.

  Since the filtration tank 60 is accommodated in the collection tank 20, the filtered waste water from which the primary drainage has passed through the filtration tank 60 and impurities have been removed flows down from the fine through holes of the filtration tank 60 and is discharged. 20 is stored. Impurities accumulated in the filtration tank 60 are discarded when the filtration tank 60 is removed. Impurities recovered in the filtration tank 60 are cut abrasive that is equal to or better than cutting abrasive grains having a minimum particle size that can be reused by removing unnecessary metal processing debris and conspicuous small-diameter cutting abrasive grains through a sieving machine. By sorting the grains, the cutting abrasive grains can be reused.

  The collection tank 20 accommodates the filtration tank 60. The collection tank 20 has casters and is installed on the floor surface so as to be able to be pushed and pulled. The collection tank 20 stores the filtered waste water in which the secondary waste water containing the impurities discharged from the first centrifuge 41 at a high concentration passes through the filtration tank 60 and is filtered. The filtered waste water is centrifuged again by the second centrifuge 42, and the secondary waste water containing impurities discharged by the second centrifuge 42 is returned to the collection tank 20 through the filtration tank 60.

  As described above, the amount of secondary wastewater per unit time discharged by the cyclone device 4 is significantly smaller than the amount of primary wastewater introduced. Therefore, since the filtration efficiency is high and the capacity required for the recovery tank 20 is small, the installation area of the recovery tank 20 can be reduced. And since the amount of surplus water that remains in the recovery tank without being regenerated is small, substantially the same amount of purified water is generated with respect to the amount of sewage discharged from the processing tank 10. As a result, the filtration time is greatly shortened, the loss of circulating water is small, and the primary drainage of the amount of water that can stabilize the water temperature and the cleanliness of the stored water per unit time is filtered. The same amount of fresh water or pure water can be generated so that it can be supplied again.

  In the combined processing apparatus of the embodiment, the configuration of the collection tank 20 including the cyclone apparatus 4 and the filtration tank 60 can remove impurities including cutting abrasive grains having a small specific gravity in a short time even if the amount of primary drainage water is large. The ratio at which the removed cutting abrasive grains are mixed again into the purified water is low, the amount of surplus water remaining without being regenerated is smaller, and the purified water can be generated with sufficiently less residual cutting abrasive grains. Hereinafter, in the processing liquid regeneration supply device 2 of the embodiment, the configuration of the collection tank 20 including the cyclone device 4 and the filtration tank 60 is referred to as a primary filtration system 100.

  The sewage tank 30 is a purified water that is a separated water obtained by centrifuging impurities including metal processing waste generated by processing in the first centrifuge 41 and the second centrifuge 42 and cutting abrasive grains used in the processing. To store. Here, the purified water is primary filtered water that has been primary filtered by the primary filtration system 100, and has a cleanliness suitable for electric discharge machining that can be directly supplied from the machining liquid jet nozzle to the machining gap only by secondary filtration using a paper filter. Water having such a cleanliness level that can be generated (hereinafter referred to as jet processing water) is shown.

  The sewage tank 30 is installed adjacent to the collection tank 20. However, the recovery tank 20 is installed completely independently of the sewage tank 30, and the sewage tank 30 is separated from the recovery tank 20 by having a tank wall that is equal to or lower than the height of the recovery tank 20. Therefore, water does not circulate between the recovery tank 20 and the sewage tank 30. Therefore, the secondary drainage containing the impurities separated and removed from the primary wastewater at a high concentration does not flow into the sewage tank 30, and the separated and removed impurities do not enter the purified water again.

  The sewage tank in the processing liquid regeneration and supply apparatus of the present invention basically has a single tank structure having one tank. The processing liquid regeneration supply device 2 according to the first embodiment performs primary filtration of sewage with high efficiency once in the primary filtration system 100 without directly discharging the primary drainage which is sewage from the processing tank 10 to the sewage tank 30. Since it is the structure which produces | generates purified water and stores purified water in the sewage tank 30, many water storage tanks for precipitation filtration are unnecessary.

  The purified water that is the primary filtered water stored in the sewage tank 30 contains residual impurities, particularly cutting abrasive grains having a relatively small diameter and a small specific gravity, which are not suitable for use as processing water, and at least the processing tank 10 does not have cleanliness that can be used as processing water for immersing a workpiece attached to a work stand 16 provided inside 10 (hereinafter referred to as immersing processing water). Moreover, clean water is not clean enough as water circulated in the ion exchange circuit.

  However, since the purified water stored in the sewage tank 30 has such a degree of cleanliness that the process water for jet can be generated only by the secondary filtration by the paper filter, the purified water is secondarily passed from the sewage tank 30 through the paper filter 7. Jet water can be obtained simply by filtering. Therefore, the sewage tank 30 can be made into one tank, and the capacity | capacitance of the sewage tank 30 can be made small. Moreover, since fresh water can be generated only by secondary filtration, the filtration time is shortened.

  During the processing while immersing the workpiece in the processing water and supplying the processing liquid jet to the processing gap, it is possible to purify the sewage and prepare the processing water for the next immersion. In consideration of the above, the capacity required for the sewage tank 30 is not more than twice the capacity of the processing tank 10 even if it is estimated by simple calculation. Moreover, since the collection tank 20 is small and there is little excess water, the total installation area of the collection tank 20 and the sewage tank 30 is considerably reduced as compared with the installation area of the conventional sewage tank that requires a plurality of water storage tanks.

  The fresh water tank 40 is a secondary filtered water from which residual impurities including small-diameter residual cutting abrasive grains are removed from the purified water by the secondary filtration by the filter 7 or a required specific resistance value necessary for electric discharge machining in the fresh water. To store pure water. Here, clear water refers to water having cleanliness that can be used as jet water. In particular, pure water refers to water having cleanliness that can be used as jet working water and a required specific resistance value (insulation degree) required for electric discharge machining.

  The fresh water tank 40 in the processing liquid regeneration supply device 2 of the embodiment is installed adjacent to the sewage tank 30. The fresh water tank 40 is installed so that the tank wall which contacts the dirty water tank 30 of the fresh water tank 40 is the same height as the tank wall of the dirty water tank 30. Therefore, when the fresh water or pure water stored in the fresh water tank 40 exceeds the capacity of the fresh water tank 40, the excess fresh water or pure water overflows the tank wall and returns to the dirty water tank 30.

  The filter 7 is an internal pressure paper filter with high filtration accuracy that can remove fine residual cutting abrasive grains. A filter that generates fresh water is required to have a capability of reliably filtering fine residual abrasive grains from raw water without re-mixing the raw water into the raw water. However, because the filtration accuracy of the paper filter is high, if the raw water contains many large-sized impurities, clogging occurs and the processing water circulation system is stopped, so the raw water introduced has a cleanliness higher than that of purified water. Need to be.

  The processing liquid regeneration and supply apparatus 2 of the embodiment introduces purified water that has been primarily filtered by the primary filtration system 100 into the paper filter 7, and therefore, does not include impurities having a relatively large size. An internal pressure type paper filter 7 with high filtration accuracy can be installed between the water tank 30 and the fresh water tank 40. Further, since the secondary filtration is performed by the paper filter 7 while the purified water is fed from the sewage tank 30 to the fresh water tank 40, there is no possibility that the cutting abrasive grains are mixed again into the fresh water as the secondary filtered water.

  For example, as a cutting abrasive grain suitable for commercially available abrasive water jet machining, there is garnet obtained by crushing ore into a fine grain size and adjusting the grain size to # 80, # 100, # 120, # 150, and # 200. The cutting abrasive used for cutting water is rounded and has a small particle size. Therefore, it is not captured by a filter with low filtration accuracy, floats without being precipitated in the water to be treated, and is treated after filtration. The cutting abrasive is mixed again.

  In the processing liquid regeneration and supply apparatus 2 of the embodiment, since fresh water is generated by being filtered by the paper filter 7 and sent to the fresh water tank 40, fine cutting abrasive grains removed by the paper filter 7 are mixed again into the fresh water. In addition, it is possible to purify even fresh water having the cleanliness required as jet processing water only by secondary filtration.

  In the combined processing apparatus of the embodiment, the fresh water tank 40 is provided with an ion exchange circuit and a cooling circuit. The fresh water that is secondarily filtered by the paper filter 7 and stored in the fresh water tank 40 is ion-exchanged by the ion exchanger 5 until reaching a preset specific resistance value, and has a specific resistance value suitable for electric discharge machining. Water is produced. The fresh water or pure water stored in the fresh water tank 40 is cooled by the cooling device 6 until a predetermined temperature set in advance is reached.

  In the processing liquid regeneration and supply apparatus 2 of the embodiment, the purified water stored in the sewage tank 30 does not have sufficient cleanliness as the immersion processing water, so basically only the jet processing water. Instead, the cleaning water for cleaning the processing water for immersion and the processing tank (hereinafter simply referred to as cleaning water) is supplied from the clean water tank 40. However, the cleaning water does not need to be pure water because the insulating property is not required.

  Since clean water with high cleanliness that can be supplied as jet water for processing does not contain sharp, large cutting abrasive grains, it does not wear the member. Therefore, it can be used as processing water supplied to the high-pressure pump during water jet processing (hereinafter referred to as high-pressure pump processing water). Therefore, the processing water for the high pressure pump is also supplied from the fresh water tank 40 to the high pressure pump. However, the water-cut high-pressure cutting water is not required to be pure water because insulation is not required.

  The processing liquid regeneration supply device 2 of the embodiment supplies fresh water, which is cooled to a predetermined temperature during processing and has high cleanliness, to the processing tank 10 by a predetermined amount per unit time, and circulates the stored water in the processing tank 10. The water temperature and cleanliness of the stored water are stabilized. Therefore, buffered water that does not require temperature management and does not require cleanliness is supplied from the fresh water tank 40. However, the buffer water does not need to be pure water because insulation is not required.

  Waste water whose temperature rises and cleanliness decreases as processing proceeds from the processing tank 10 by a predetermined amount, and is supplied to the processing tank 10 by a predetermined amount after being cooled to a predetermined temperature and having high cleanliness. Thus, the temperature of the stored water in the processing tank 10 is lowered by heat exchange while replacing the sewage and the fresh water, and the impurity concentration is reduced and lowered. Therefore, the water temperature and cleanliness of the stored water in the processing tank 10 are stabilized. Hereinafter, in order to stabilize the water temperature and cleanliness of the stored water in the processing tank 10, water such as fresh water with high cleanness that is cooled to a predetermined temperature that is constantly supplied in a predetermined amount as buffered water or immersion processing water during processing. Is generally referred to as circulating cooling water.

  Since the sewage discharged from the processing tank 10 is purified while the fresh water is being supplied to the processing tank 10 during the processing and the fresh water is continuously regenerated, the capacity of the fresh water tank 40 is simply calculated by the calculation of the processing tank 10. About 1.5 times the capacity is sufficient. Since fresh water or pure water exceeding the capacity of the fresh water tank 40 overflows and returns to the sewage tank 30, the processing water circulation system is not stopped by making the capacity of the sewage tank 30 larger than the capacity of the fresh water tank 40. The amount of water required for processing can be prepared during processing.

  The ultrapure water tank 50 stores ultrapure water from which ultrafine particles of residual cutting abrasive grains contained in fresh water are removed by a special filter that removes ultrafine particles having a particle size (maximum diameter) on the order of micromillimeters. Here, the ultra-clean water refers to water having a high cleanliness ratio of 1% or less containing ultra-fine particles on the order of micromillimeters.

  The super fresh water tank 50 in the machining liquid regeneration supply device 2 of the embodiment is installed adjacent to the fresh water tank 40. The ultra fresh water tank 50 is installed so that the tank wall in contact with the fresh water tank 40 of the ultra fresh water tank 50 is the same height as the tank wall of the fresh water tank 40. Therefore, when the super fresh water stored in the super fresh water tank 50 exceeds the capacity of the super fresh water tank 50, the excess super fresh water overflows the tank wall and returns to the fresh water tank 40.

  The machining fluid regeneration supply device 2 includes a ceramic filter 8 as a filter that can remove ultrafine particles having a particle size on the order of micromillimeters. Since the ceramic filter 8 has high filtration accuracy because it is filtered through the fine through holes provided in the material, the ceramic filter 8 is backwashed in a timely manner by providing a backwash chamber 81. Since the treated water sent to the ceramic filter 8 is fresh water, it is possible to avoid clogging of the ceramic filter 8 and stop of the processing water circulation system even when the composite processing apparatus is operated for a long period of time.

  The high-pressure pump 9 pressurizes the ultra-clean water processed water stored in the ultra-clean water tank 50 to a high pressure of 200 MPa to 450 MPa and supplies it to the cutting nozzle 11. New cutting abrasive grains are mixed in the processing water by the cutting nozzle 11 and high-pressure cutting water is sprayed toward the workpiece. The high pressure pump 9 is provided with a pressure booster as necessary.

  The ultra fresh water tank 50 supplies processing water to the high-pressure pump 9 during water jet processing. Since ultra-clean water is highly clean water that contains almost no ultrafine particles of cutting abrasive grains, the burden on the high-pressure pump is reduced. Moreover, the load applied to piping members such as a supply pipe, a flexible hose, and a valve for supplying high-pressure processed water is reduced. Therefore, the safety is further improved by providing the super fresh water tank 50.

  Since the amount of high-pressure pump processing water is the amount of high-pressure cutting water sprayed from the cutting nozzle 11 during processing, the amount of processing water is smaller than the total amount of water in the processing water circulation system. In the combined processing apparatus of the embodiment, the amount of high-pressure cutting water supplied from the cutting nozzle 11 is 3 liters per minute. Also, ultra-clean water is supplied and replenished during processing. Therefore, the capacity of the super fresh water tank 50 is about one tenth of that of the fresh water tank 40. Therefore, the ultra-fresh water tank 50 has little influence on the installation area of the machining fluid regeneration supply device.

  By providing the ultra-fresh water tank 50, the high-pressure pump processing water and the circulating cooling water can be supplied in separate systems. Therefore, the burden of the processing water supply pump which supplies fresh water is reduced. In addition, a necessary and sufficient amount of circulating cooling water that is effective in suppressing increases in the water temperature and impurity concentration of the stored water can always be secured.

  A main pipe and a sub-pipe are provided as pipes in the machining fluid regeneration supply device 2. The main pipeline is a main circulation pipeline of the processing water circulation system, and is a pipeline that circulates water between the processing tank 10 and each water storage tank of the processing liquid regeneration supply device 2. The secondary pipe is a pipe that assists the main pipe of the processing water circulation system or a pipe that circulates water in the processing water circulation system.

  The main pipeline in the machining liquid regeneration and supply apparatus 2 of the first embodiment shown in FIG. 1 includes a drain pipeline R1, a purified water feed pipeline R2, a fresh water feed circuit R3, a processed water feed pipeline R4, It consists of a jet flow supply line R5, an ultra fresh water supply line R6, and a cutting water supply line R7. The processing tank 10 that collects the primary drainage and supplies the circulating cooling water equal to or more than the primary drainage in the drainage pipe R1, the purified water feed pipe R2, the fresh water feed circuit R3, and the processed water supply pipe R4. A circulation circuit of the stored water is formed.

  The drainage pipe R1 is a pipe that connects the drain 17 of the processing tank 10 and the inlet for inputting the primary drainage of the first centrifuge 41. The purified water feed pipe R <b> 2 is a pipe that connects the outlet for outputting the purified water of the first centrifuge 41 or the second centrifuge 42 and the sewage tank 30. The fresh water supply pipe R <b> 3 is a pipe that connects the sewage tank 30 and the fresh water tank 40 through the paper filter 7. The drainage pipe R1 to the fresh water supply pipe R3 is a processing water regeneration circuit.

  The processing water supply pipe R4 is a pipe connecting the fresh water tank 40 and the processing tank 10. The jet supply pipe R5 is a pipe that branches from the processing water supply pipe R4 and connects the fresh water tank 40 and the processing liquid jet nozzles 14A and 14B of the processing tank 10. The ultrapure water supply pipe R 6 is a pipe that connects the fresh water tank 40 and the ultrapure water tank 50 via the ceramic filter 8.

  The cutting water supply circuit R <b> 7 is a pipe line that connects the ultrapure water tank 50 and the cutting nozzle 11 via the high-pressure pump 9. When the machining liquid regeneration supply device 2 does not include the super fresh water tank 50, the cutting water supply circuit R 7 branches from the jet flow supply line R 4 at a bypass indicated by a dotted line in FIG. 40 is a pipe line connecting 40 and the cutting nozzle 11.

  The sub-lines are an overflow line R11, a water level adjustment line R12, an ion exchange line R13, a cooling line R14, a fresh water transfer line R15, a backwash line R16, and a return line R17. Is provided.

  The overflow line R11 is a line that connects the overflow discharge port of the processing tank 10 and the sewage tank 30. The water level adjustment pipe R12 is a pipe connecting the side discharge port of the processing tank 10 and the collection tank 20. The ion exchange line R13 is a line through which fresh water circulates through the fresh water tank 40 through the ion exchanger 5, and forms an ion exchange circuit. The cooling pipe R14 is a pipe through which fresh water or pure water circulates through the fresh water tank 40 through the cooling device 6, and forms a cooling circuit.

  The fresh water transfer pipe R15 is an auxiliary pipe that connects the fresh water tank 40 and the super fresh water tank 50 and supplies fresh water from the fresh water tank 40 to the super fresh water tank 50 when the super fresh water is unnecessary. The backwash pipe R16 is a drain pipe that connects the backwash chamber 81 to the ceramic filter 8 and discharges backwash water out of the water storage tank or returns it to the fresh water tank 40. A plurality of return pipes R17 are connected to the outlet side of the pump of the main pipe, and when there is a failure in the middle of the pipe, the relief valve is opened to release the weighted pressure water into the water storage tank to prevent damage to the equipment members. A relief circuit is formed.

  The pumps provided in the pipelines in the processing liquid regeneration supply apparatus 2 of the embodiment shown in FIG. 1 are a drainage pump P1, a filtration pump P2, a purified water feed pump P3, a processed water supply pump P4, and an ultra fresh water feed. A pump P5, an ion exchange pump P6, and a cooling pump P7. Each pump is driven and controlled synchronously or independently by the control device CNT.

  The valves provided in the pipeline in the machining liquid regeneration supply device 2 are a drain valve V1, a water level adjustment valve V2, a jet flow switching valve V3, a machining water switching valve V4, a super fresh water switching valve V5, and a fresh water switching valve V6. And a backwash opening valve V7, an ion exchange circuit valve V8, a super fresh water feed valve V9, and relief valves V10, V11, V12, and V13. Further, a check valve and a constant flow valve (not shown) are provided in the pipe line as necessary. Except for the manual valve and the pressure release valve (relief valve), the control device CNT basically controls opening and closing synchronously or independently.

  Water level detectors (float switches) S <b> 1 to S <b> 5 for detecting the presence of the water surface are provided in each of the processing tank 10, the recovery tank 20, the sewage tank 30, the fresh water tank 40, and the super fresh water tank 50. The float (floating ball) of the float switch S <b> 1 is accommodated in a chamber provided on the outlet side of the drain 17 of the processing tank 10.

  The control device CNT drives the drain pump P1 with a set output when the float switch S1 is on, and stops the drain pump P1 when it is off. At this time, in order to prevent chattering of the drain pump P1, the drain pump P1 is controlled to be driven after a preset time from when the float switch S1 is turned on.

  The float switch S2 is turned on when the stored water in the recovery tank 20 reaches the upper limit water level. The control device CNT stops the drainage pump P1 in response to the detection signal of the float switch S2 and closes the drain valve V1 to interrupt the drainage of the stored water in the processing tank 10, and the filtered drainage overflows from the recovery tank 20. To prevent.

  The float switches S3 to S5 are turned off when it is determined that the stored water is below the minimum water level in each of the sewage tank 30, the fresh water tank 40, and the super fresh water tank 50 and that each water tank is substantially empty. . The control device CNT stops the corresponding pumps in response to the detection signals of the float switches S3 to S5 to prevent idling of the pumps when each pump that pumps the stored water in each storage tank is driven. .

  The processing tank 10 includes a plurality of water level detectors (float switches) (not shown) that detect the presence of the surface of the immersion processing water or buffer water stored in the processing tank 10 and a liquid level detector that detects the level of the processing water. Is provided. Each float switch detects the upper limit water level of the processing tank 10, the safe water level, and the buffer water level. The safety water level is a water level at which the device member is not immersed in the stored water in the processing tank 10. The buffered water level is a level at which the workpiece is exposed from the buffered water so that the buffered water does not hinder water jet processing, and is slightly lower than the height position of the work stand 16.

  The liquid level detector measures the water level of the processing water stored in the processing tank 10. The water level is set at a position slightly higher than the upper surface of the workpiece on which the workpiece is immersed, corresponding to the plate thickness of the workpiece attached to the work stand 16. An optical sensor, a magnet float type sensor, or a pressure type sensor is applied to the liquid level detector. Instead of the liquid level detector, a workpiece detector (work sensor) can be provided to detect the upper surface position of the workpiece and adjust the water level. As the workpiece detector, for example, a transmissive multi-optical axis photoelectric sensor is applied.

  The jet supply pipe R5 is provided with pressure gauges G1 and G2 for measuring the pressure of the machining fluid jet in wire cut electric discharge machining, and flow meters L1 and L2 for measuring the flow rate. Moreover, the pressure gauge G3 which measures the pressure of the high pressure cutting water in water jet processing is provided in the cutting water supply pipe line R7.

  A water quality sensor 70 is provided in the fresh water tank 40. The water quality sensor is basically a resistivity meter or a conductivity meter (electric conductivity meter). If necessary, a hydrogen ion concentration meter (pH sensor) and a turbidity meter or a particle meter can be provided. A multi-item water quality meter (electric conductivity, turbidity, pH, water temperature, chlorine concentration, etc.) can be installed.

  The control device CNT inputs detection signals of float switches S1 to S5 and a plurality of float switches (not shown) provided in the processing tank 10. In addition, the control device CNT inputs measurement signals from the pressure gauges G1 to G3, the flow meters L1 and L2, the liquid level detector provided in the processing tank 10, and the water quality sensor 70. The control device CNT outputs a control signal for driving and controlling the pumps P1 to P7 to each pump P1 to P7 in synchronization or independently. Further, the control device CNT outputs a control signal for controlling the opening and closing of the valves V1 to V13 to each of the valves V1 to V13.

  The control device CNT drives and controls each pump so that the specific resistance value, the water temperature, and the machining fluid jet pressure or flow rate become set values, or controls the opening and closing of each valve. In addition, the control device CNT stops each pump when the water level of the stored water in the processing tank 10 or the water level of the filtered wastewater in the recovery tank 20 reaches the critical water level determined at the installation position of the float, or the pressure gauge G3 The pump is stopped when the pressure of the high-pressure cutting water supplied from the ultra-clean water tank 50 detected in (1) reaches a dangerous pressure.

  The control device CNT is connected to a numerical control device (integrated control device) provided in the machine 1 so that a detection signal or a measurement signal and a control signal can be input and output with each other. Further, the control device CNT can be connected to a control unit of the cooling device 6 to remotely operate the cooling device 6. The set value of the stored water level, specific resistance value, water temperature, cutting water limit pressure, working fluid jet pressure or flow rate of the processing tank is set by the control device CNT or the numerical control device.

  When the level of stored water such as immersion processing water or buffered water stored in the processing tank reaches the height position set by the liquid level detector or the float switch, the control device CNT controls the water level adjustment valve V2. Adjust to a proper opening and release. On the other hand, when the water level of the stored water falls below the set height, the control device CNT tightens the water level adjustment valve V2 to an appropriate opening degree or closes it completely.

  Therefore, when the high-pressure cutting water is supplied from the cutting nozzle 11, or when the processing liquid jet is supplied from the processing liquid jet nozzles 14A and 14B, or in order to circulate the stored water during processing, the side portion of the processing tank 10 is used. When the circulating cooling water is supplied from the supply port, the water level of the water stored in the processing tank 10 is maintained at the set water level. Therefore, if the amount of circulating cooling water supplied to the processing tank 10 per unit time is equal to or greater than the amount of primary drainage discharged from the processing tank 10, the water level of the stored water in the processing tank 10 is maintained.

  In the combined processing apparatus of the embodiment, the control device CNT is a unit in which the drainage pump P1 sucks the stored water in the processing tank 10 from the drain 17 of the processing tank 10 and discharges it to the first centrifuge 41 during processing. The frequency of the processing water supply pump P4 is inverter-controlled so that circulating cooling water of the same amount as the amount of primary wastewater per hour is sent to the processing tank 10. Therefore, the level of the stored water in the processing tank 10 does not drop while the stored water in the processing tank 10 is circulated during processing. Moreover, since the circulating cooling water more than necessary is not supplied, the fresh water stored in the fresh water tank 40 is not insufficient.

  The amount of liquid level adjustment drainage discharged to the recovery tank 20 through the water level adjustment pipe R12 is relatively small. Further, since the liquid level adjusting drainage is discharged from the side discharge port that is higher than the middle of the processing tank 10, it is discharged through the drain 17 from the discharge port located at the deepest center of the bottom surface of the processing tank 10. Compared to primary drainage, the proportion of cutting abrasive grains contained is smaller than primary drainage. Therefore, the liquid level adjustment wastewater is discharged to the collection tank 20. The secondary drainage stored in the collection tank 20 is free from loss because the impurities are removed by centrifugation in the second centrifuge 42 and the liquid level adjustment wastewater is not discarded.

  The recovery tank 20 is provided with a water level detector 80. The water level detector 80 detects when the water level of the filtered wastewater stored in the recovery tank 20 is at or above a preset first water level and below the second water level lower than the first water level. . Specifically, the water level detector 80 detects the upper first water level and the lower second water level by turning on and off the up / down switch following the float in which the control rod fixed to the float moves up and down due to fluctuations in the water surface. To detect.

  The detection signal of the water level detector 80 is input to the control device CNT. The control device CNT drives the filtration pump P2 when the water level of the filtered wastewater stored in the recovery tank 20 is equal to or higher than a preset first water level, and pumps the filtered wastewater to the second centrifuge 42. Send water. Further, the control device CNT stops the filtration pump P2 when the water level of the filtered wastewater is equal to or lower than the second water level, and prevents the filtered wastewater from being sent to the second centrifuge 42. Even when the recovery tank 20 is full and the drainage pump P1 is stopped, the filtration pump P2 is driven to feed the filtered wastewater as long as the water level of the filtered wastewater does not fall below the second water level.

  Therefore, the water level detector 80 and the filtration pump P2 provided in the recovery tank 20 of the primary filtration system 100 do not leave the filtered wastewater stored in the recovery tank 20 and do not leave the filtered wastewater as much as possible. Excess water can be further reduced. Further, when the amount of filtered waste water remaining in the recovery tank 20 is small and the residual impurity concentration is excessively high, the filtered waste water is not sent to the second centrifuge 42, and therefore the second centrifuge 42 in the sewage tank 30. Thus, the amount of residual cutting abrasive grains contained in the filtered waste water that cannot be separated in the purified water is reduced.

  By selectively sending filtered wastewater to the second centrifuge 41 depending on the water level in the recovery tank 20, it is possible to minimize wasteful surplus water remaining at the time of primary filtration without lowering the filtration accuracy. The same amount of fresh water can be regenerated with little loss relative to the amount of primary waste water discharged from the processing tank 10. Therefore, the amount of fresh water to be replaced with the sewage stored in the processing tank per unit time can be set to a sufficient predetermined amount that is effective for suppressing the increase in the water temperature and impurity concentration of the stored water.

  FIG. 2 is a schematic diagram showing a specific configuration of the processing tank and the processing liquid regeneration supply device in the combined processing apparatus according to the second embodiment of the present invention. The components denoted by the same reference numerals as those of the combined machining apparatus shown in FIG. 1 will be described only in parts different from the combined machining apparatus of the first embodiment. In addition, constituent members having the same reference numerals as those of the composite processing apparatus shown in FIG. 1 and not particularly described are basically the same as the composite processing apparatus of the first embodiment.

  The machining fluid regeneration supply device 2 of the second embodiment shown in FIG. 2 is different from the machining fluid regeneration supply device 2 of the first embodiment shown in FIG. 1 in that the sewage tank 30 has a two-tank structure. Different. However, in the two-tank sewage tank 30 of the embodiment, the sewage tank first tank 30A corresponds to a septic tank, and the sewage tank second tank 30B corresponds to a water supply tank. The original sewage tank is essentially one tank.

  The sewage tank 30 is a purified water that is a separated water obtained by centrifuging impurities including metal processing waste generated by processing in the first centrifuge 41 and the second centrifuge 42 and cutting abrasive grains used for processing. To store. The sewage tank 30 is installed adjacent to the collection tank 20. The sewage tank 30 includes a first tank 30A and a second tank 30B that are partitioned by a partition 31.

  The lower side of the partition 31 is opened, and the first tank 30A and the second tank 30B communicate with each other. Therefore, the purified water stored in the first tank 30A naturally flows into the second tank 30B so that the water level follows the amount of purified water sent to the first tank 30A.

  The first tank 30 </ b> A is a water storage tank that includes the mesh filter 32 and stores the purified water that has been primarily filtered by the primary filtration system 100 while being pre-filtered by the mesh filter 32. The 2nd tank 30B is a water storage tank which stores the quasi-pure water from which purified impurities were pre-filtered with the mesh filter 32, and the residual impurities were removed, or the quasi-pure water from which the quasi-clean water was ion-exchanged. Here, semi-fresh water refers to water having cleanliness that can be used as washing water. In particular, quasi-pure water refers to water having cleanliness and a required specific resistance value that can be supplied as immersing process water in semi-clean water.

  A mesh filter 32 is provided in the first tank 30A so as to divide the first tank 30A into a plurality of chambers. The purified water in the first tank 30A flows into the second tank 30B through the communication path so that the water levels in the plural chambers and the second tank 30B are the same, and is filtered by the mesh filter 32 when flowing into the second tank 30B. Is done. Residual impurities contained in the purified water in the plural chambers, especially fine cutting abrasive grains having a small specific gravity float in the purified water, but the mesh filter 32 becomes a barrier and does not go out of the plural chambers.

  Accordingly, the first tank 30 </ b> A allows the purified water to flow through the mesh filter 32 while preventing the floating abrasive grains from entering the mesh filter 32 as a barrier for impurities including residual abrasive grains that cannot be removed by the primary filtration in the primary filtration system 100. And the residual impurities having a large specific gravity are precipitated and filtered, and semi-fresh water is supplied to the second tank 30B.

  The quasi-clean water has a cleanliness level that can be used as processing water for immersion, and can be circulated in the ion exchange circuit. Therefore, an ion exchange circuit and a cooling circuit are provided in the second tank 30B. In the second tank 30B, the quasi-clean water flowing from the first tank 30A is sent to the ion exchanger 5 in a timely manner and returned to the second tank 30B. In the second tank 30B, the stored semi-clean water or semi-pure water is sent to the cooling device 6 and returned to the second tank 30B. Therefore, the second tank 30B stores quasi-pure water cooled to a predetermined temperature set in advance by the cooling device 6 or quasi-pure water made to have a required specific resistance value by the ion exchange 5.

  Since the semi-pure water or semi-pure water stored in the second tank 30B has a cleanliness level that can be used as washing water or processing water for immersion, it can be used as buffer water during water jet processing. Therefore, buffer water, washing water, and immersion processing water are supplied to the processing tank 10 from the second tank 30B.

  Since the 2nd tank 30B supplies the processing water which has required and sufficient cleanliness and required specific resistance value as processing water for immersion, it is corresponded to the fresh water tank of a wire cut electric discharge machining apparatus. However, in the case of a complex machining apparatus, there are fine cutting abrasive grains having a small specific gravity that are not present in wire-cut electric discharge machining. Therefore, a general filtration method performed in the machining water circulation system of the wire-cut electric discharge machining apparatus. Then, the fine cutting abrasive grains cannot be completely removed.

  Therefore, the processing liquid regeneration supply device 2 of the second embodiment generates quasi-clean water or quasi-pure water by filtering the purified water in the sewage tank 30, such as buffered water or immersion processing water from the sewage tank 30. Although it is possible to supply the stored water, the preliminary filtration by the mesh filter 32 requires high cleanliness as high-pressure pump processing water and jet processing water that require higher cleanliness than the stored water in the processing tank 10. Is insufficient, and it is not preferable to supply to the cutting nozzle 11 and the machining liquid jet nozzles 14A and 14B.

  Therefore, the fresh water tank 40 is provided even if it is the process liquid reproduction | regeneration supply apparatus 2 of 2nd Embodiment provided with the sewage tank which can supply the process water for immersion. And it filters with the paper filter 7 which removes fine cutting abrasive grain effectively and reliably so that the residual impurity which floats the semi-clean water or semi-pure water stored in the 2nd tank 30B may not mix again. Water is supplied to the fresh water tank 40. The fresh water tank 40 stores fresh water that is secondary filtered water that has been secondarily filtered by the paper filter 7. In the machining liquid regeneration supply device 2 of the second embodiment, the ion exchange circuit and the cooling circuit are provided in the sewage tank 30, so that it is not necessary to provide the ion exchange circuit and the cooling circuit in the fresh water tank 40.

  The immersion processing water, washing water, or buffer water does not require cleanliness as high as high pressure pump processing water or jet processing water, and does not need to be clean water or pure water. Since the processing liquid regeneration supply device 2 of the second embodiment includes the two-tank type sewage tank 30, it is possible to supply the processing water for immersion, washing water, and buffer water from the sewage tank 30 to the processing tank 10. . Therefore, the filtration time is shorter, the waiting time until a sufficient amount of the processing water for immersion, washing water, and buffer water is generated is shortened, and there is an excellent advantage that the working efficiency is further improved.

  The quasi-clean water has a cleanliness that can be used as immersion processing water. And the cooling circuit is provided in the sewage tank 2nd tank 30B. Therefore, the machining fluid regeneration supply device 2 in the second embodiment can supply semi-pure water or semi-pure water from the sewage tank 30B as circulating cooling water. When the circulating cooling water is supplied as buffered water, insulation is not required, so that semi-pure water is not generated in order not to waste the ion exchange resin of the ion exchanger 5. The circulating cooling water can reduce the temperature of the stored water in the processing tank 10 by heat exchange, and can also reduce the impurity concentration by reducing it.

  Further, since the jet working water or the high pressure pump working water is supplied from the fresh water tank 40 or the ultra fresh water tank 50, the jet working water or the high pressure pump working water and the circulating cooling water can be supplied in different systems. This alleviates the burden on the processing water supply pump that delivers semi-pure water or semi-pure water. In addition, a necessary and sufficient predetermined amount of circulating cooling water that is effective in suppressing the rise in the water temperature and impurity concentration of the stored water can be constantly secured.

  The processing liquid regeneration and supply apparatus according to the second embodiment in which the sewage tank 30 has a two-tank structure is different from the processing liquid regeneration and supply apparatus according to the first embodiment in which the sewage tank 30 has a single tank structure. Since water, cooling water, and buffered water can be supplied from the second tank 30B of the sewage tank, it is not necessary to store in the fresh water tank 40 the amount of fresh water that makes the processing tank 10 full. Therefore, the fresh water tank 30 should just have the capacity | capacitance which can store the quantity of fresh water required for high pressure pump processing water or jet processing water. As for the capacity of the fresh water tank 40, for example, about one tenth of the sewage tank 40 or about one fifth of the processing tank 10 is sufficient.

  The main pipeline in the machining liquid regeneration and supply apparatus 2 of the second embodiment is such that the fresh water feed circuit R3 feeds semi-fresh water or semi-pure water preliminarily filtered from the waste water tank 30 by the mesh filter 32 to the fresh water tank 40 and The processing water supply pipe R4 is different from the processing liquid regeneration supply device of the first embodiment in that the second tank 30B and the processing tank 10 are connected to the processing water supply pipe R4. The processing water supply pipe R4 is provided with a relief pipe as necessary. In addition, the secondary pipe in the machining liquid regeneration supply device 2 of the second embodiment is the same as that of the first embodiment in that the ion exchange pipe R13 and the cooling pipe R14 are provided in the second tank 30B. Different from the processing fluid regeneration supply device.

  A pipe that branches from the jet flow supply line R5 by a bypass indicated by a dotted line B1 in FIG. 2 is formed to supply the processing water for immersion, and the fresh water is supplied from the fresh water tank 40 to the processing tank 10 as the processing water for immersion. Can be. Further, a branch is formed by branching from the jet flow supply line R5 by a bypass indicated by a dotted line B2 to supply high pressure pump processing water, and the fresh water is supplied from the fresh water tank 40 to the high pressure pump 9 as high pressure pump processing water. You can

  Of the pumps provided in the machining fluid regeneration supply device 2 of the second embodiment, a jet pump P8 for feeding the machining water for jetting to the machining fluid jet nozzles 14A and 14B is provided separately from the machining water supply pump P4. It is different from the machining fluid regeneration supply device of the first embodiment. A valve can be provided between the cooling pump P7 and the cooling device 6 in the cooling pipe R14 as necessary.

  The control device CNT has the same amount as the amount of primary wastewater per unit time that the drainage pump P1 sucks the stored water in the processing tank 10 from the drain 17 of the processing tank 10 and discharges it to the first centrifuge 41 during processing. The frequency of the processing water supply pump P4 is inverter-controlled so that the semi-fresh water is fed to the processing tank 10 as circulating cooling water. Therefore, the level of the stored water in the processing tank 10 does not drop while the stored water in the processing tank 10 is circulated during processing. Moreover, since the circulating cooling water more than necessary is not supplied, the quasi-clean water stored in the sewage tank 2nd tank 30B does not run short.

  Hereinafter, the circulation state of the machining water in the machining water circulation system of the combined machining apparatus according to the present invention will be described with reference to the operation of the machining fluid regeneration supply apparatus of the second embodiment shown in FIG. In addition, the operation of the machining fluid regeneration supply device of the first embodiment shown in FIG. 1 is partially cited.

  In the initial state, the fresh water tank 40 and the ultra fresh water tank 50 are filled with water, and unused commercial ultra pure water containing no impurities is used until the sewage tank 30 reaches a sufficiently safe water level below the upper limit water level. Supply water. When filtered tap water is used, raw water is poured into the sewage tank 30 to obtain the required specific resistance value and water temperature with the ion exchanger 5 and the cooling device 6, and then sequentially supplied to the fresh water tank 40 and the super fresh water tank 50. To do. The raw water is poured until the sewage tank 30 reaches a sufficiently safe water level below the upper limit water level.

  The quasi-clean water or quasi-pure water is supplied to the clean water tank 40 through the clean water supply pipe R3 by the purified water pump P3. In the case of the single tank sewage tank 30, the raw water poured into the sewage tank 30 is supplied to the fresh water tank 40 through the fresh water supply pipe R3, and is circulated to the ion exchange circuit and the cooling pipe in the fresh water tank 40. The fresh water in the fresh water tank 40 is sent to the super fresh water tank 50 through the fresh water transfer line R15 until full water.

  In the case where water jet machining is performed in a state where the stored water is already stored in the machining liquid regeneration supply device 2 after a long machining pause time, the cooling pump P7 is driven before the water jet machining, and the second tank of the sewage tank 30B quasi-clean water is sent to the cooling device 6 and cooled to a predetermined temperature. Moreover, the purified water feed pump P3 is driven to generate fresh water having a predetermined temperature. In the case of the combined processing apparatus of the first embodiment having the single tank type sewage tank 30, the fresh water in the fresh water tank 40 is supplied to the cooling device 6 and cooled to a predetermined temperature.

  Further, when wire-cut electric discharge machining is performed after a long machining downtime, the ion exchange pump P6 is driven, and quasi-clean water or fresh water is supplied to the ion exchanger 5 to obtain a required specific resistance value required for electric discharge machining. While generating the quasi-pure water, the cooling pump P7 is driven to cool to a predetermined temperature.

  Before the water jet processing, the semi-clean water is used as buffer water until the float switch provided in the processing tank 10 from the second tank 30B is turned on at the buffer water level or until the liquid level detector detects a preset water level. Supply to the processing tank 10. The amount of semi-clear water stored in the sewage tank 30 is reduced by the amount of supplied semi-clean water.

  At the time of water jet processing, ultra-high fresh water is supplied from the ultra-clean water tank 50 to the high-pressure pump 9 as high-pressure pump processing water, cutting abrasive grains are mixed into the cutting processing water by the cutting nozzle 11 and high-pressure cutting water is injected. The workpiece attached to the work stand 16 is cut with high-pressure cutting water. The high-pressure cutting water containing the cutting abrasive grains used for processing is absorbed by the buffer water as sewage.

  During the water jet processing, the drainage pump P1 is always driven to discharge the stored water stored in the processing tank 10 by a predetermined amount per unit time. In the combined processing apparatus of the embodiment, the fresh water storage amount of the processing tank 10 is 500 liters, for example, 250 liters of stored water per minute is discharged from the processing tank 10 by the discharge pump P1.

  At the same time, the processing water supply pump P4 is driven by the inverter control at a frequency corresponding to the suction amount of the drainage pump P1 by the control device CNT, and the quasi-fresh water of a predetermined temperature cooled by the cooling device 6 is pumped up, and the circulating cooling water is supplied per unit time. Water is sent to the processing tank 10 by a predetermined amount per hit. In the case of the single tank type sewage tank 30, the processing water supply pump P4 is driven to pump up fresh water having a predetermined temperature from the fresh water tank 40, and the circulating cooling water is supplied to the processing tank 10 by a predetermined amount per unit time. In the combined processing apparatus of the embodiment, for example, the processing water supply pump P4 is driven so that quasi-clean water of a predetermined temperature is fed from the second sewage tank 30B to the processing tank 10 by 250 liters per minute.

  The stored water in the processing tank 10 is sucked and discharged by the drain pump P1 from the drain 17 having a discharge port in the deepest part at the center of the bottom surface of the processing tank 10. The semi-clean water in the second sewage tank 30 </ b> B or the fresh water in the fresh water tank 40 is supplied from a side supply port provided in the middle of the processing tank 10. Therefore, the water stored in the processing tank 10 flows from the upper part to the lower part, and the sewage containing a large amount of metal processing waste and cutting abrasive grains is positively discharged. Therefore, the water temperature and cleanliness of the stored water in the processing tank 10 are effectively maintained and stabilized.

  In response to a detection signal from a liquid level detector or float switch (not shown), the buffer level exceeding the buffer level is opened by the control device CNT at an appropriate degree of opening of the water level adjustment valve V2, and passes through the water level adjustment line R12. It is recovered in the recovery tank 20. Since the liquid level adjustment wastewater discharged through the water level adjustment pipe R12 is clean water positioned relatively higher in the stored water in the processing tank 10, impurities having a large specific gravity are hardly contained. Since the secondary wastewater stored in the recovery tank 20 includes fine cutting abrasive grains that are not accumulated in the filtration tank 60, even if buffered water discharged through the water level adjusting pipe 12 is mixed, the filtration in the primary filtration process is performed. Does not affect efficiency.

  The primary waste water discharged from the processing tank 10 is introduced into the first centrifuge 41. The first centrifuge 41 centrifuges impurities including cutting abrasive grains from the primary wastewater, and discharges the secondary wastewater containing impurities down to the filtration tank 60. The purified water filtered by the first centrifuge 41 is sent to the first chamber divided by the mesh filter 32 of the sewage tank first tank 30A.

  The secondary waste water is filtered in the filtration tank 60 to remove metal processing waste and cutting abrasive grains, and the metal processing scrap and cutting abrasive grains are accumulated in the filtration tank 60 and collected. The filtered wastewater filtered in the filtration tank 60 is stored in a flow-down manner in the collection tank 20 that houses the filtration tank 60. When the water level of the filtered wastewater reaches the first water level and the water level detector 80 outputs a detection signal, the filtration pump P2 is driven by the control device CNT and the filtered wastewater is sent to the second centrifuge 42.

  The second centrifuge 42 introduces filtered wastewater, centrifuges impurities containing a lot of fine abrasive grains that have passed through the filtration tank 60 from the filtered wastewater, and filters secondary wastewater containing the separated impurities at a high concentration. It flows down into the tank 60 and is discharged. The purified water filtered by the second centrifuge 42 is sent to the first chamber divided by the mesh filter 32 of the sewage tank first tank 30A.

  The purified water sent to the first chamber of the sewage tank first tank 30A passes through the mesh filter 32 and flows into the second tank 30B so that the entire water level of the sewage tank 30 is stabilized. Residual impurities contained in the purified water that cannot pass through the mesh filter 32 float or settle in a plurality of chambers separated by the mesh filter 32.

  The purified water sent to the sewage tank first tank 30A passes through the mesh filter 32 and is preliminarily filtered, and stored in the sewage tank second tank 30B as semi-clean water. The semi-fresh water in the second sewage tank 30B is driven to a timely cooling pump P7 in accordance with the water temperature input by the control device CNT, and the semi-fresh water is cooled by the cooling device 6 to a predetermined temperature set in the cooling device 6. . In the case of the single tank type sewage tank 30, the cooling pump P7 is driven in the fresh water tank 40 in a timely manner, and the fresh water is cooled by the cooling device 6 to a predetermined temperature set in the cooling device 6.

  After the water jet machining, the machining water supply pump P4 is stopped to stop the supply of the circulating cooling water. Moreover, the supply of the high pressure water for cutting is stopped by stopping the ultrapure water supply pump P5 and the high pressure pump 9. On the other hand, the drain valve V1 is left open, and the drain pump P1 is driven to discharge the stored water in the processing tank 10 with the maximum amount of water that can be filtered by the filtration system 100 to absorb the high-pressure cutting water and cut abrasive grains. The buffered water in the processing tank 10 that is contaminated with is sucked as sewage and discharged entirely.

  The first centrifuge 41 introduces and filters the primary waste water until the float switch S1 is turned off and it is detected that the processing tank 10 is empty. Since the sewage tank 30 is after the sewage tank 30 has supplied the buffered water to the processing tank 10 from the initial state of full water at the upper limit water level, it can accommodate all the purified water that has been primarily filtered from the primary drainage from the processing tank 10.

  After all of the buffered water has been discharged from the processing tank 10, the sewage tank second tank 30B has a sufficient amount of quasi-clean water as washing water for washing the processing tank 10, so that the sewage tank first can be used without waiting time. The operation | work which supplies semi-clean water to the washing | cleaning nozzle from the 2 tanks 30B, and wash | cleans the processing tank 10 is performed.

  During water jet processing, a predetermined amount of stored water circulates between the processing tank 10 and the processing liquid regeneration supply device 2, and the buffer water whose water temperature and impurity concentration rise by processing has a cleanliness suitable for processing. However, it is constantly replaced with circulating cooling water that is fresh water or semi-fresh water cooled to a predetermined temperature. Therefore, the amount of cutting abrasive grains remaining in the processing tank 10 is reduced, the cleaning operation of the processing tank is easier, and the remaining washing can be reduced.

  While the processing tank 10 is being washed, in response to the float switch S1, the drain valve V1 is opened in a timely manner to drive the drainage pump P1, and the primary drainage which is the sewage containing the cutting abrasive grains after being washed is first. Aspirate and discharge to centrifuge 41. At the time when the cleaning operation of the processing tank 10 is completed, the second tank 30B of the sewage tank is returned to the same state as before the buffer water is supplied.

  Before the wire-cut electric discharge machining after the cleaning operation of the processing tank 10 is completed, the semi-pure water in the second sewage tank 30B is changed to semi-pure water having a required specific resistance value and a set temperature. However, ion exchange and cooling are performed even during the cleaning operation of the processing tank 10, and the amount of purified water sent to the first tank 30 </ b> A that has been centrifuged and filtered using the cleaning water as the primary drainage is the amount of the sewage tank 30. Since there is not so much that it has a large influence on the specific resistance value and the water temperature of the whole stored water, the waiting time is greatly shortened.

  At the same time, the purified water feed pump P3 is driven, and the fresh water filtered by the paper filter 7 is sequentially supplied to the fresh water tank 40 through the fresh water supply pipe P3. Further, the fresh water feed pump P4 is driven, and the ultra fresh water filtered by the ceramic filter 8 through the ultra fresh water supply line R6 is supplied and replenished by the amount of water supplied as the cutting water during the water jet machining.

  After a short waiting time, the processing water supply pump P4 is driven to immerse the work water set in the numerical control device with a necessary and sufficient amount of quasi-pure water as the processing water for immersion from the second tank 30B to the processing tank. 10 is supplied. When the liquid level detector detects the set water level, the processing water supply pump P4 is stopped. In the sewage tank second tank 30B, the amount of stored water is reduced by the amount of supplied immersion processing water.

  At the time of wire cut electric discharge machining, the jet pump P8 is driven, and fresh water cooled to a predetermined temperature from the fresh water tank 40 and having a required specific resistance value is supplied to the machining liquid jet nozzles 14A and 14B as jet machining water and directly supplied. A machining liquid jet is ejected at a predetermined pressure into the machining gap. The machining fluid jet containing metal machining waste generated by electric discharge machining is absorbed by the machining water stored so as to immerse the workpiece in the machining tank 10 as sewage.

  In wire-cut electric discharge machining, cutting abrasive grains do not exist, so the water stored in the processing tank 10 is not contaminated by cutting abrasive grains. Further, since the machining liquid jet is used as cooling water for the machining gap, the machining liquid jet supplied from the machining liquid jet nozzles 14A and 14B has a predetermined temperature. Therefore, the temperature and cleanliness of the stored water in the processing tank 10 at the processing site of the workpiece are relatively stable. Therefore, it is not necessary to circulate the water stored in the processing tank 10 during wire cut electric discharge machining.

  Desirably, the water stored in the processing tank 10 is circulated during wire-cut electric discharge machining. When circulating the stored water in the processing tank 10 during processing, the discharge pump P1 is always driven to discharge the stored water in the processing tank 10 by a predetermined amount per unit time. The temperature of the processing water for immersion does not rise more than the buffered water during water jet processing. Therefore, the amount of stored water discharged may be equal to or less than the amount of water discharged during water jet processing.

  At the same time, the processing water supply pump P4 is driven by inverter control at a frequency corresponding to the suction amount of the drainage pump P1 by the control device CNT, and quasi-pure water of a predetermined temperature cooled by the cooling device 6 is pumped up, and the circulating cooling water is unit Water is fed into the processing tank 10 by a predetermined amount equal to the amount of drainage per hour. In the case of the single tank type sewage tank 30, the processing water supply pump P4 is driven to pump up pure water at a predetermined temperature from the fresh water tank 40, and the circulating cooling water is supplied to the processing tank 10 by a predetermined amount per unit time. .

  In the processing water stored in the processing tank 10 exceeding the set water level set with reference to the height of the workpiece, the water level adjustment valve V2 opens and closes in response to the measurement signal of the liquid level detector, By the opening and closing of the water level adjustment valve V2, it is intermittently collected in the collection tank 20 through the water level adjustment line R12. The liquid level adjustment drainage discharged through the water level adjustment pipe R12 is clean water located at a relatively high level of the stored water in the processing tank 10, and most of the impurities are metal processing waste having a large specific gravity. Since the secondary wastewater stored in the recovery tank 20 includes fine cutting abrasive grains that are not accumulated in the filtration tank 60, even if buffered water discharged through the water level adjusting pipe 12 is mixed, the filtration in the primary filtration process is performed. Does not affect efficiency.

  During wire cut electric discharge machining, as long as there is primary drainage, primary filtration in the primary filtration system 100 and preliminary filtration in the first sewage tank 30A are performed. In addition, ion exchange and cooling are performed in the second tank 30B of the sewage tank, and quasi-pure water continues to be generated. Then, the purified water feed pump P3 is driven to generate fresh water from the semi-pure water through the paper filter 7, and the fresh water tank 40 continues to be replenished with an amount of fresh water that supplements the jet water used for processing.

  After the wire cut electric discharge machining, the machining water supply pump P4 is stopped to stop the supply of the circulating cooling water. Further, the supply of the machining fluid jet is stopped by stopping the jet pump P8. On the other hand, the drain valve V1 is left open, and the drainage pump P1 is driven so as to discharge the stored water in the processing tank 10 with the maximum amount of water that the filtration system 100 can filter, so that the processing liquid jet is absorbed and the metal processing waste is absorbed. The processing water for dipping in the processing tank 10 containing is sucked as sewage and discharged entirely. Since the primary waste water after the wire-cut electric discharge machining does not contain fine cutting abrasive grains, sufficient quasi-clean water is generated by primary filtration and preliminary filtration in the primary filtration system 100.

  When all of the processing water for immersion is discharged from the processing tank 10, a sufficient amount of quasi-clean water is left as buffer water in the processing tank 10 in the second tank 30 </ b> B of the sewage tank. During setup work such as removal and attachment of the workpiece for performing the next water jet machining, purified water is sent from the primary filtration system 100 to the first sewage tank 30A. Since the buffered water does not require high cleanliness and the required specific resistance value, the quasi-clean water can be cooled to a predetermined temperature during the processing preparation time required for the setup operation, so the buffered water is supplied to the processing tank 10 without waiting time. can do.

  As described above, water jet machining, machining tank cleaning, and wire-cut electrical discharge machining are repeated to suppress the rise in the temperature and impurity concentration of the stored water in the machining tank without stopping the machining water circulation system. The necessary and sufficient amount of stored water can be circulated, and the temperature and cleanliness of the stored water are stabilized. In addition, the processing preparation time is greatly shortened, and the working efficiency is improved. Further, the machining fluid regeneration supply device is not increased in size to an extent that is practically unacceptable.

  The working fluid supply / regeneration device according to the embodiment of the present invention described above is modified within a range in which the operational effects of the present invention can be obtained, as described in some examples. One component can be replaced with another component, or can be implemented in combination with an existing complex machining apparatus or another complex machining apparatus.

  The present invention is applied to the manufacturing industry of machine tools, mold manufacturing, and parts manufacturing. In the combined machining apparatus of the present invention, the thermal displacement of the structure is small, and a decrease in machining shape accuracy is suppressed. In addition, the burden on the operator is reduced, and the amount of unwashed material is reduced so as not to cause a processing failure. Further, the waiting time for regenerating the machining water is short, there is no possibility that the machining is interrupted in the middle, and the machining liquid regeneration supply device is not enlarged. The present invention contributes to the development of the manufacturing industry of machine tools, mold manufacturing, and parts manufacturing by accelerating the introduction of composite processing devices.

It is a schematic diagram which shows the combined processing apparatus of the 1st Embodiment of this invention. It is a schematic diagram which shows the combined processing apparatus of the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing machine main machine 2 Processing liquid reproduction | regeneration supply apparatus 3 Bed 4 Cyclone apparatus 41 1st centrifuge 42 2nd centrifuge 5 Ion exchanger 6 Cooling device 7 Paper filter 8 Ceramic filter 9 High pressure pump 10 Processing tank 11 Cutting nozzles 12A, 12B Guide assemblies 13A, 13B Arms 14A, 14B Processing liquid jet nozzle 15 Processing tank wall 16 Work stand 17 Drain 20 Collection tank 30 Sewage tank 40 Fresh water tank 50 Ultra fresh water tank 60 Filtration tank 70 Water quality sensor 80 Water level detector 100 Primary filtration system CNT control device

Claims (11)

A drainage pump for discharging a predetermined amount of water stored in the processing tank per unit time during processing, a first centrifuge for centrifuging impurities from the primary drainage discharged from the processing tank, and the first centrifuge A collection tank for collecting secondary wastewater containing impurities centrifuged by a separator, a second centrifuge for centrifuging impurities from the secondary wastewater collected in the collection tank, and the first centrifugation And a sewage tank for storing purified water from which impurities have been centrifuged by the second centrifuge, a fresh water tank for storing fresh water from which impurities have been removed from the purified water, and a cooling device for cooling the fresh water to a predetermined temperature A combined processing apparatus capable of performing water jet machining and wire-cut electrical discharge machining, and a supply pump that feeds the predetermined temperature of fresh water to the machining tank by a predetermined amount or more per unit time. The combined machining apparatus according to claim 1, further comprising: a control device that performs inverter control of a frequency of the supply pump so as to supply the same amount of fresh water as the primary drainage per unit time. The combined processing apparatus according to claim 1, further comprising a filtration tank that is contained in the recovery tank and filters the secondary wastewater to accumulate the impurities contained in the secondary drainage. 2. The combined processing apparatus according to claim 1, further comprising a filtration pump that pumps up the secondary wastewater and feeds the secondary wastewater to the second centrifuge when the water level of the secondary wastewater is equal to or higher than a preset water level. When the water level of the secondary waste water is equal to or higher than a preset first water level, the filtration pump is driven to pump up the secondary waste water and feed the water to the second centrifuge and the water level of the secondary waste water A control device for controlling the filtration pump so that the filtration pump is stopped and the secondary drainage is not sent to the second centrifuge when the water level is lower than the second water level lower than the first water surface. The composite processing apparatus according to claim 1, comprising: A drainage pump for discharging a predetermined amount of water stored in the processing tank per unit time during processing, a first centrifuge for centrifuging impurities from the primary drainage discharged from the processing tank, and the first centrifuge A collection tank for collecting secondary wastewater containing impurities centrifuged by a separator, a second centrifuge for centrifuging impurities from the secondary wastewater collected in the collection tank, and the first centrifugation A sewage tank comprising a first tank for storing purified water from which impurities have been centrifuged by a second centrifuge and a second tank for storing quasi-clean water from which impurities have been removed from the purified water by a mesh filter; Water jet machining and wire-cut electrical discharge machining comprising: a cooling device that cools the quasi-clean water to a predetermined temperature; and a supply pump that feeds the quasi-clean water of the predetermined temperature to the processing tank by a predetermined amount or more per unit time. Playable composite processing equipment. The combined machining apparatus according to claim 6, further comprising: a control device that performs inverter control of a frequency of the supply pump so that the same amount of semi-clean water as that of the primary wastewater is supplied per unit time. The combined processing apparatus according to claim 6, further comprising a filtration tank that is accommodated in the recovery tank and accumulates the impurities contained in the secondary drainage by filtering the secondary drainage. The combined processing apparatus according to claim 6, further comprising a filtration pump that pumps up the secondary waste water and feeds the secondary waste water to the second centrifuge when the water level of the secondary waste water is equal to or higher than a preset water level. When the water level of the secondary waste water is equal to or higher than a preset first water level, the filtration pump is driven to pump up the secondary waste water and feed the water to the second centrifuge and the water level of the secondary waste water A control device for controlling the filtration pump so that the filtration pump is stopped and the secondary drainage is not sent to the second centrifuge when the water level is lower than the second water level lower than the first water surface. The combined machining apparatus according to claim 6, wherein: The combined processing apparatus according to claim 6, comprising a fresh water tank that stores fresh water from which impurities have been removed from the semi-fresh water by a filter.

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