JP2010197404A - Apparatus and system for imaging radiation - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lightweight radiation image pickup device and system. <P>SOLUTION: The radiation image pickup device includes an image pickup element substrate, having a conversion element for converting an incident radiation into an electrical signal; two or more flexible circuit boards connected to the image pickup element substrate; two or more circuit chips, which are arranged laterally to the image pickup element substrate, and each of which is connected to the image pickup element substrate via one of the two or more flexible circuit boards; and two or more radiation-shielding members. The two or more circuit chips and two or more radiation-shielding members have one-to-one correspondence. Each of the two or more radiation-shielding members is arranged, at a position which covers a surface on the radiation-incident side from among the surfaces of a corresponding circuit chip, but is not arranged at a position which covers a surface other than the surface on the radiation-incident side. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a radiation imaging apparatus and system for capturing a one-dimensional or two-dimensional image used for a medical measuring instrument, a nondestructive inspection instrument, and the like.

  In this specification, the category of radiation includes electromagnetic waves such as X-rays, α-rays, β-rays, and γ-rays.

  As a representative example of a radiation imaging apparatus that captures an image of radiation obtained by exposing a subject with radiation, an X-ray imaging apparatus will be described as an example.

  In an X-ray imaging apparatus, imaging is performed by converting an X-ray image received by an imaging element into an electrical signal. Since X-rays have higher energy than visible light, not all X-rays are absorbed by the image sensor. The X-rays transmitted through the image sensor constitute a peripheral circuit of the image sensor. The semiconductor integrated circuit element may be incident on the semiconductor integrated circuit element and cause the semiconductor integrated circuit element to malfunction.

  Therefore, in the specification and drawings of US Pat. No. 5,777,335 and Japanese Patent Laid-Open No. 9-152486, a shielding member such as lead is used to shield a semiconductor integrated circuit element from such X-rays. A configuration has been proposed.

  FIG. 16 is a schematic diagram illustrating an example of a conventional radiation imaging apparatus. In FIG. 16, 1 is an image sensor, 2 is a support such as an image sensor substrate 1, 3 is a circuit board, 4 is a radiation shielding member such as a lead plate, 5 is an active element such as a semiconductor integrated circuit element, and 11 is a housing. The body, 12 is a wiring member such as a flexible wiring board, and 13 is radiation.

  Radiation emitted from a radiation source (not shown) passes through the subject and enters the radiation imaging apparatus. The incident radiation 13 includes X-ray information of the subject.

  The X-ray including the information of the subject incident on the image pickup device substrate 1 generates an electric signal directly or indirectly there and becomes an electric signal that can be read out by an electronic circuit.

  Since X-rays have higher energy than visible light, they are not completely absorbed by the image sensor substrate 1 and may pass through the image sensor substrate 1. Therefore, a shielding member 4 such as a lead plate is provided on the surface (back surface) opposite to the light receiving surface of the imaging device substrate 1 to prevent X-rays from entering the circuit substrate 3 having the active elements 5. .

US Pat. No. 5,777,335 JP-A-9-152486

  However, in the configuration as shown in FIG. 16, since the shielding member 4 having a considerably large area is mounted as compared with the circuit board 3 to be X-ray shielded, the imaging device becomes considerably heavy. As a simple imaging device that can be used even in examination rooms, beds, ambulances, etc., in recent years, there is a strong demand in the market, even though it is an acceptable weight for applications such as standing and lying down It becomes difficult to carry.

  Therefore, an object of the present invention is to provide a lightweight radiation imaging apparatus and system.

In order to solve the above-described problem, the gist of the present invention is an imaging device substrate having a conversion element that converts incident radiation into an electrical signal, a plurality of flexible circuit boards connected to the imaging device substrate, and the imaging Radiation imaging having a plurality of circuit chips disposed on the side of the element substrate and connected to the imaging element substrate via any one of the plurality of flexible circuit boards, and a plurality of radiation shielding members The plurality of circuit chips and the plurality of radiation shielding members have a one-to-one correspondence, and each of the plurality of radiation shielding members is incident on the radiation of the corresponding circuit chip. It is provided in the position which covers the surface on the side to perform, and is not provided in the position which covers the surface other than the surface on which the radiation is incident .

  Furthermore, the gist of the present invention is a radiation imaging system including the above-described radiation imaging apparatus and a display for displaying an image captured by the radiation imaging apparatus.

According to the present invention, since a heavy shielding member can be reduced, the radiation imaging apparatus and system can be reduced in weight.

It is sectional drawing of the radiation imaging device of Embodiment 1 of this invention. It is sectional drawing of the radiation imaging device of Embodiment 2 of this invention. It is typical sectional drawing which shows the structure of the shielding member of FIG. It is a schematic diagram which shows the structure in the case of arrange | positioning the shielding member 4 on the one-to-one with respect to the active element 5 of FIG. It is typical sectional drawing of the semiconductor integrated circuit element mounted in the circuit board 3 used for the radiation imaging device of Embodiment 3 of this invention. It is typical sectional drawing of the circuit board 3 of the radiation imaging device of Embodiment 4 of this invention. It is a schematic perspective view for demonstrating an example of the radiation imaging device of Embodiment 5 of this invention. It is sectional drawing which shows the internal structure of the cassette type imaging device of Embodiment 6 of this invention. It is sectional drawing of the radiation image pick-up element module 16 of FIG. It is a top view of the radiation imaging element module 16 of FIG. It is a figure which shows the structure of the radiation imaging device of Embodiment 6 of this invention. FIG. 12 is an enlarged view of the periphery of the extraction electrode portion 32 and the flexible circuit board 33 of the sensor base material of FIG. 11. It is a figure which shows the structure of the radiation imaging device of Embodiment 7 of this invention. It is the typical block diagram and typical sectional drawing of the radiation imaging device of Embodiment 8 of this invention. It is a schematic diagram for demonstrating the X-ray diagnostic system of this invention. It is typical sectional drawing which shows the structure of the conventional radiation imaging device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  (Embodiment 1) FIG. 1 is a sectional view of a radiation imaging apparatus according to Embodiment 1 of the present invention. Here, reference numeral 1 is an image pickup device substrate, 2 is a support, 3 is a circuit board, 11 is a housing, and 12 is a wiring member.

  As the image pickup device substrate 1, a direct conversion element of a type that absorbs radiation such as X-rays and generates charges, or indirect that absorbs visible rays and then generates charges after the radiation is once converted into visible rays. Any of the type conversion elements can be used.

  For example, as the indirect image pickup device substrate 1, a required photoelectric conversion element is formed on the image pickup device substrate 1 by a thin film semiconductor process, and on the image pickup device substrate 1, a wavelength such as a scintillator or a phosphor is further provided. There is a configuration in which a converter is provided. In this case, the phosphor converts the wavelength of X-rays into visible light in the sensitivity wavelength range of the photoelectric conversion element, and enters the image pickup device substrate 1 so that electricity after photoelectric conversion is obtained. Signal. The imaging element substrate 1 is composed of a plurality of photoelectric conversion element substrates.

  Specifically, a non-single-crystal semiconductor material such as hydrogenated amorphous silicon (hereinafter referred to as “a-Si”) is used to form a photoelectric conversion semiconductor layer of a photoelectric conversion element and a thin film field effect transistor (hereinafter referred to as “ The two-dimensional area-type imaging device for visible light is formed simultaneously or sequentially with a semiconductor layer (referred to as “TFT”), and a sheet of a wavelength converter such as a CsI phosphor is bonded to the radiation layer. An imaging element is formed.

  Another indirect conversion element may be a structure in which a CCD or MOS transistor is formed on a single crystal silicon substrate together with a photodiode, and a wavelength converter is provided on the light receiving surface.

  On the other hand, as a direct conversion element, there is an element having a configuration in which an address circuit is formed with a transistor or the like on the surface of a single crystal silicon substrate or a glass substrate, and a radiation absorbing element made of a compound semiconductor such as GaAs is connected to the address circuit. Used.

  The support 2 is a plate made of metal, ceramics, glass, or the like, and is fixed so that the imaging element substrate 1 is planarly overlapped on the front side, and the circuit board 3 is fixed on the back side. This is covered with an exterior cover as the casing 11.

  X-rays incident from the image sensor substrate 1 side are converted into visible light by a phosphor plate, enter the image sensor substrate 1, and become an electrical signal after photoelectric conversion by the photoelectric conversion element, but are not wavelength converted. The X-rays are transmitted through the image sensor substrate 1 on which the phosphor plate is mounted, and are bombarded on the circuit board 3 disposed on the back surface side (lower side of the drawing) of the image sensor substrate 1.

  The circuit board 3 is a so-called printed circuit board in which a conductive layer pattern such as copper and an insulating layer such as glass epoxy are laminated. If a multi-layer printed wiring board in which a large number of conductive layer patterns and a large number of insulating layers are stacked on each other, higher-density mounting is possible.

  The circuit board 3 stores, for example, a control circuit block for controlling the operation of the image sensor board 1, an image signal obtained from the image sensor board 1, an image processing circuit block for image processing, Interface circuit blocks and the like are formed.

  As the wiring member 12, a TAB tape of a tape carrier package having a semiconductor integrated circuit chip may be used, or a simple flexible printed circuit board may be used.

  The circuit of the circuit board 3 is composed of individual semiconductor elements such as individual diodes and individual transistors, active elements 5 such as semiconductor integrated circuit elements, and passive elements 6 such as capacitors and resistors. It is mounted on at least one of the front surface and the back surface of the substrate 3.

  In particular, the active element 5 made of a single crystal semiconductor element may malfunction due to X-rays, which may reduce the quality of the extracted information signal and the reliability of the device itself.

  Therefore, in the present embodiment, as shown in FIG. 1, the imaging element substrate 1 and the circuit board 3 are disposed between the support body 2 and the circuit board 3 that are arranged to face each other on the back surface of the glass substrate of the imaging element substrate 1. The shielding member 4 having an area smaller than any of the above is provided.

  In other words, below the image pickup device substrate 1, there is a partially provided layered shielding member 4 for shielding X-rays, and an active element 5 is provided on the circuit board 3 corresponding to the installation position thereof. The active element 5 can be protected from transmitted X-rays. Further, the circuit board 3 is not disposed around the image pickup device substrate 1 but is placed at a position where it is overlapped in the X-ray projection direction, and the active element 5 is provided there.

  By doing so, the X-rays that have passed through the imaging element substrate 1 are shielded by the shielding member 4, and it is possible to avoid the X-ray exposure to the active elements 5 of the circuit board 3.

  (Embodiment 2) FIG. 2 is a sectional view of a radiation imaging apparatus as Embodiment 2 of the present invention. In the present embodiment, as shown in FIG. 2, each of the shielding members is provided only between the support 2 disposed opposite to the back surface of the imaging element substrate 1 and the active element 5 mounted on the circuit board 3. 4 is provided.

  The shielding member 4 is divided in a one-to-one correspondence with the active elements 5 provided on the back side circuit board 3 of the imaging element substrate 1, and a plurality of more miniaturized layered shielding members 4 are provided. . Thereby, the peripheral circuit can be efficiently protected from the transmitted X-rays.

  Here, the size of the shielding member 4 (the area on the surface along the surface of the circuit board 3) is slightly larger than the size of the outer shape of the active element 5. The circuit board 3 is a double-sided mounting board, and the active element 5 is mounted only on one side thereof.

  By doing so, the shielding member 4 can be easily laid out according to the layout of various components on the circuit board 3. The total area of the shielding members is smaller than the area of the circuit board.

  In addition, the circuit board 3 is not arranged around the image pickup device substrate 1, but is arranged at a position where it is overlapped in the X-ray projection direction, and moreover, corresponding to the active element 5 on the circuit substrate 3, Since the miniaturized shielding member 4 is provided, the amount of heavy metal used as the material of the X-ray shielding member can be reduced, and the entire apparatus can be further reduced in weight. In addition, since the apparatus can be simplified and thinned, the entire apparatus can be reduced in size.

  Next, a modified example of the shielding member 4 used in this embodiment will be described.

  As shown in FIG. 3A, the shielding member 4 is composed of a heavy metal and a material containing heavy metal. Specifically, a lead plate whose surface is coated with resin or the like can be used.

  Further, as shown in FIG. 3B, the shielding material layers 51 may be integrally provided on both surfaces of a support 52 made of a material having no shielding effect or a low shielding effect.

  Furthermore, as shown in FIG. 3C, a configuration in which a layer of a shielding material is sandwiched between a pair of supports 52 may be employed.

  Furthermore, as shown in FIG. 3D, the shielding member 4 may be configured by integrating a large number of shielding materials 54 in a binder 53.

  FIG. 4 is a schematic diagram showing a configuration when the shielding members 4 are arranged one-on-one with respect to the active element 5 of FIG. In the case of the active element 5, particularly a semiconductor integrated circuit element made of a single crystal semiconductor element, the shielding member 4 is separated from the semiconductor integrated circuit element as shown in FIG. It is placed at a position away from the device package. For example, you may fix to the support body 2. FIG.

  Further, the shielding member 4 may be fixed directly on the active element 5 made of a semiconductor integrated circuit element or the like by a method such as pasting or printing / coating. FIG. 4B shows a case where a shielding member 4 that is slightly larger than the size of the package of the semiconductor integrated circuit element is fixed to the package.

  According to this embodiment, in particular, since the shielding member 4 is reduced in size, the shielding member can be fixed to the support 2 and the active element 5 even with a simple fixing method using a double-sided tape or the like. It is also effective in terms of points.

  (Embodiment 3) In Embodiment 3 of the present invention, the shielding member 4 for shielding the element 5 from radiation incident on the semiconductor integrated circuit element as the active element 5 corresponds one-to-one to the semiconductor integrated circuit element. Provided. The area of the shielding member 4 is smaller than the corresponding package of the semiconductor integrated circuit element and larger than the semiconductor integrated circuit chip of the semiconductor integrated circuit element.

  FIG. 5A is a schematic cross-sectional view of a semiconductor integrated circuit element mounted on the circuit board 3 used in the radiation imaging apparatus according to the third embodiment of the present invention. In FIG. 5A, 61 is a semiconductor integrated circuit chip formed on a silicon substrate, 62 is a gold wire as a bonding wire, 63 is a lead for external connection, 64 is a frame for supporting the chip 61, and 65 is a seal. It is a package made of a resin for stopping.

  In many of the semiconductor integrated circuit elements, the size of the semiconductor integrated circuit chip 61 is considerably smaller than the size of the package 6 whose outer shape is determined as shown in the figure. Therefore, the mounting area of the shielding member 4 (the area on the surface along the mounting surface of the circuit board 3) is made smaller than the mounting area of the package 65 and equal to or larger than the area of the semiconductor integrated circuit chip 61.

  Some large-scale semiconductor integrated circuit elements such as logic circuits and system LSIs have an extremely small chip area as compared with the package area. In such a case, the shielding member 4 to be used is used. It can be made smaller.

  FIG. 5B is a diagram showing a modification of FIG. 5A, in which the shielding member 4 is arranged on one side of the circuit board 3 and the semiconductor integrated circuit element 5 is arranged on the other side.

  Of course, it is also preferable to shield both surfaces of the semiconductor integrated circuit chip by combining the configuration of FIG. 5A and the configuration of FIG.

  (Embodiment 4) In a radiation imaging apparatus according to Embodiment 4 of the present invention, the shielding member 4 is formed by solder attached to the circuit board 3 as a radiation shielding member.

  FIG. 6 is a schematic cross-sectional view of the circuit board 3 of the radiation imaging apparatus according to the fourth embodiment of the present invention, in which the shielding member 4 is formed of solder containing lead and tin.

  The area occupied by the solder layer on the surface of the circuit board 3 is smaller than the area of the circuit board 3 and larger than the mounting area of the active element 5.

  (Embodiment 5) FIG. 7 is a schematic perspective view for explaining an example of a radiation imaging apparatus according to Embodiment 5 of the present invention. As shown in the figure, in the radiation imaging apparatus of the present embodiment, the shielding member 4 is smaller than the photoelectric conversion substrate of the imaging element substrate 1 and is disposed so as to cover only a necessary portion above the circuit substrate 3. Yes.

  That is, on the support 2, an imaging element substrate 1 composed of a plurality (four in this case) of photoelectric conversion element substrates is arranged, and an exterior cover as a casing 11 below the imaging element substrate 1. A plurality of active elements 5 are arranged on the circuit board 3 provided on the bottom side of the image sensor, and at least the shielding member 4 is arranged between the image pickup element board 1 and the circuit board 3 corresponding to the active elements 5. Has been.

  An electrical signal from a photoelectric conversion element (not shown) on the photoelectric conversion element substrate is transmitted to the circuit board 3 side via a wiring member 12 such as a flexible circuit board. In addition, the exterior cover as the housing 11 has an opening 11 a corresponding to the X-ray irradiation region of the image pickup device substrate 1 formed on the upper surface thereof.

  In this embodiment, four photoelectric conversion element substrates are disposed on the support 2, but it is needless to say that a simple structure in which one imaging element substrate 1 is disposed may be employed.

  In each of the embodiments described above, various components such as the active element 5 are attached to the circuit board 3 with lead-free solder containing at least one kind selected from solder, such as silver, copper, and bismuth, and tin, which does not contain lead, It is also preferable to use lead only for the shielding member 4.

  In this case, if only the shielding member 4 is removed, it becomes easy to disassemble, repair, and discard the device that can no longer be used. Furthermore, in this case, it is better to assemble the shielding member 4 containing lead in a state sealed with resin or the like.

  (Embodiment 6) Before describing Embodiment 6 of the present invention, the configuration of a radiation imaging apparatus according to a reference example will be described with reference to FIGS.

  FIG. 8 is a cross-sectional view showing an internal configuration of a cassette type imaging apparatus according to Embodiment 6 of the present invention. The outer frame of the apparatus has a configuration in which a grid 15 is screwed to the housing 14, and the radiation imaging element module 16 is located in a region surrounded by a dotted frame illustrated in the apparatus.

  The radiation imaging element module 16 is supported by a support base 17 in the apparatus, and is fixed to the support base 17 and the grid 15 by a fixing material 18 having an adhesive or an adhesive on both sides.

  The flexible circuit board 33 is fixed to the heat radiating plate 19 by sandwiching the flexible circuit board 33 in the radiation imaging element module 16 between the heat radiating plate 19 and the flat plate 41 and narrowing the distance between the two plates with screws 42.

  Further, the heat radiating plate 19 is mechanically fixed to the housing 14 by being connected to the housing 14 with screws 42. At the same time, the heat generated from the image signal reading IC 35 mounted on the flexible circuit board 33 is guided to the housing 14 via the heat radiating plate 19 to increase the heat radiating area and provide a better cooling effect.

  The printed circuit board 34 is fixed to the housing 14 by screws 42 through the mounting plate 21. 55 and 56 are lead plates that shield the radiation 7, and 22 is an X-ray that is not converted by the fluorescent plate 30 and passes through the base 28.

  FIG. 9 is a cross-sectional view of the radiation imaging element module 16 of FIG. FIG. 10 is a top view of the radiation imaging element module 16 of FIG. 9 and 10, reference numerals 23 to 26 denote sensor base materials whose upper surfaces are light receiving portions, and 27 denotes pixel regions formed on the sensor base materials 23 to 26, respectively, and photoelectric conversion elements and TFT elements (transistors). And are provided. Reference numeral 28 denotes a base for holding the sensor bases 23 to 26, and 29 denotes an adhesive for fixing the sensor bases 23 to 26 and the base 28.

  The sensor base materials 23 to 26 are fixed to the base 28 in a state of being aligned so that the pixel pitch is aligned in the two-dimensional direction. This is done for the purpose of increasing the size by arranging a plurality of small substrates having a good manufacturing yield. Therefore, if a single large-area substrate with a good yield can be manufactured, a radiation solid-state imaging device without the base 29 may be configured.

Reference numeral 30 denotes a phosphor plate that converts radiation into visible light, and is a coating of granular phosphor such as CaWO ₄ or Gd ₂ O ₂ S: Tb ₃ on a resin plate or a layer of CsI deposit. . Reference numeral 31 denotes an adhesive for bonding the sensor base materials 23 to 26 and the fluorescent plate 30 together. 32 exchanges an input signal for driving a photoelectric conversion element and a TFT element provided in the pixel region and an output signal obtained by reading X-ray information with an input or output system outside the sensor bases 23 to 26. It is an extraction electrode part.

  Here, the fluorescent plate 30 and the photoelectric conversion element constitute the conversion means. However, if a conversion means that directly converts radiation into an electrical signal is used, the fluorescent plate 30 becomes unnecessary.

  The lead electrode portion 32 is connected to the printed circuit board 34 via the flexible circuit board 33. ICs 35 and 36 for processing input signals or output signals are mounted on the flexible circuit board 33 and the printed circuit board 34, respectively.

  In addition, a sealing material 37 such as a silicone resin, an acrylic resin, or an epoxy resin is provided at a joint portion between the extraction electrode portion 32 and the flexible circuit board 33 in order to prevent electrolytic corrosion of the extraction electrode portion 32.

  Furthermore, 38 is a metal film having moisture-impermeable and radiation-transmitting properties, and is connected to the fluorescent plate 30 via an adhesive 39. When moisture-proofing or electromagnetic wave shielding is required for the photoelectric conversion element and the TFT element, the metal film 38 is used for the purpose of sealing the fluorescent plate 30 with the photoelectric conversion element and the TFT element.

  Further, in order to more surely seal the fluorescent plate 30 with the photoelectric conversion element and the TFT element, the space between the sensor base materials 23 to 26 may be filled with the sealing material 40 from above the metal film 38.

  The radiation imaging apparatus configured in this way converts the radiation 7 that has passed through the subject from the radiation source and entered the apparatus into visible light within the fluorescent screen 30. This visible light passes through the adhesive 31 directly under the fluorescent plate 30 and is incident on the photoelectric conversion element formed on the sensor substrate.

  In the photoelectric conversion element, this is photoelectrically converted and output to form a two-dimensional image. At this time, it is desirable that all the radiation 7 is converted into visible light by the fluorescent plate 30. Actually, the radiation 22 that could not be converted may pass through the sensor base material or the base 28 and be irradiated to the lead plate 56 provided in the support base 17.

  If there is no lead plate 56, the radiation 22 further passes through the support base 17 and enters the IC 36 mounted on the printed circuit board 34 below. Incidence of X-rays to the IC 36 may cause a malfunction, and may lead to a problem of deteriorating the characteristics of the photoelectric conversion element.

  Therefore, the radiation solid-state imaging device is devised so that the lead plate 56 is provided and the IC 36 on the printed circuit board 34 is not irradiated with radiation. However, as described above, the apparatus becomes heavy due to the weight of the lead plate 56 and the like.

  Embodiment 6 of the present invention will be described below with reference to the drawings.

  FIG. 11 is a diagram illustrating a configuration of a radiation imaging apparatus according to the sixth embodiment of the present invention. In FIG. 11, the shielding member 4 is made of a material made of an organic compound or an inorganic compound mixed with, for example, a powder having a radiation shielding property in powder form.

  The radiation 9 that has not been converted by the fluorescent plate 30 serving as a scintillator passes through the imaging element module 16 and the support base 17 and is irradiated to an IC (active element) 36 on the printed circuit board 34.

  In order to shield the radiation 9, the shielding member 4 is provided on the printed circuit board 34. The shielding member 4 is formed on the surface opposite to the mounting surface of the IC 36 of the circuit board 34 so as to have an area equal to or larger than the area of the mounting surface of the IC 36.

  In the present embodiment, the shielding member 4 is formed so as to wrap the IC 35 so that the radiation 8 transmitted through the housing 14 is not irradiated onto the IC 35 on the flexible circuit board 33 bent at 90 degrees. Theoretically, if the shielding member 4 is not formed, the shielding member 4 only needs to be formed in a region where the radiation 8 will be incident. Therefore, the side surface of the IC 35 may be covered.

  However, depending on how the mounting plate 21 is screwed with the screw 42, the flexible circuit board 33 may be slightly tilted and fixed, so that the IC 35 is encased in order to completely shield the IC 35 from the radiation 7. It is good to form like this. In FIG. 11, the same parts as those in FIGS. 8 to 10 are denoted by the same reference numerals.

  FIG. 12 is an enlarged view of the periphery of the extraction electrode portion 32 and the flexible circuit board 33 of the sensor base material of FIG. In FIG. 12, 55 is an insulating film provided as necessary, and is provided below the shielding member 4. This is useful when there is a part or wiring that is not insulated and protected in an area that requires shielding.

  Reference numeral 54 denotes a material having radiation shielding properties such as metals such as Pb, Ta, Ba, and W. In practice, solder balls are suitable because they are easy to process into granules. 53 is a binder of an organic compound or an inorganic compound, and examples thereof include silicone resin, epoxy resin, acrylic resin, polyurethane resin, alumina, and silicon carbide. In particular, when a silicone resin, an epoxy resin, an acrylic resin, or a polyurethane resin is selected, it becomes easy to form the film on the ICs 35 and 36, for example.

  For example, Sn—Pb (63 wt%: 37 wt%) eutectic solder or Sn—Pb (10 wt%: 90 wt%) high melting point solder is used as the solder used as the solder ball material.

  Further, the shielding member 4 can be coated in a necessary area in a liquid state by application by a dispenser, spray, or printing such as flexo, and then cured by heat, two-component mixing, moisture, ultraviolet light, or the like.

  Furthermore, a soft material is desired so that it does not peel off even if it is applied to a material whose shape is deformed, such as the flexible circuit board 33. Of the materials listed above, silicone resin is most suitable.

  Further, if the ICs 35 and 36 are covered with the shielding member 4, the radiation can be shielded from any direction from the inside of the apparatus.

  (Embodiment 7) FIG. 13 is a diagram showing a configuration of a radiation imaging apparatus according to Embodiment 7 of the present invention. In this embodiment, the cassette type radiation imaging apparatus shown in FIG. 11 is further provided with another lead plate 56.

  As shown in FIG. 13, by providing the lead plate 56 so as to cover the IC 36, when the radiation 8 that has entered the housing 14 reaches the bottom of the housing 14 and is scattered, depending on the intensity of the scattered radiation 8. It is also conceivable that the radiation 7 is irradiated on the surface of the IC 36 on the printed circuit board 34.

  Therefore, the surface of the IC 36 on the printed circuit board 34 is also covered with the lead plate 56. At this time, if the IC 36 is not insulated and protected, it is desirable to interpose an insulating film between the IC 36 and the lead plate 56 as shown in FIG.

  Embodiment 8 FIGS. 14A and 14B are a schematic configuration diagram and a schematic cross-sectional view of a radiation imaging apparatus according to Embodiment 8 of the present invention. A plurality of photoelectric conversion elements and TFTs are formed in an a-Si sensor substrate 6011, and a flexible circuit board 6010 on which an IC 35 constituting a shift register or an integrated circuit for detection is mounted is bent at 180 ° C. and connected. ing.

  The opposite side of the flexible circuit board 6010 is connected to the circuit boards PCB1 and PCB2. A plurality of a-Si sensor base materials 6011 are bonded on a base 6012, and a shielding member is provided under the base 6012 constituting a large photoelectric conversion device to protect the memory 6014 in the processing circuit 6018 from X-rays. A lead plate 6013 is mounted.

  A scintillator 6030 for converting X-rays into visible light, for example, CsI is deposited on the a-Si sensor base 6011. As shown in FIG. 14B, the whole is housed in a case 6020 made of carbon fiber.

  Next, the radiation imaging system of the present invention will be described.

  FIG. 15 is a diagram illustrating an application example to an X-ray diagnosis system using the radiation imaging apparatus according to each of the above-described embodiments. X-rays 6060 generated by an X-ray tube 6050 serving as a radiation source pass through a chest 6062 of a patient or subject 6061 and enter a radiation imaging apparatus 6040 having a scintillator mounted thereon. This incident X-ray includes information inside the body of the patient 6061.

  The scintillator emits light in response to the incidence of X-rays, and this is photoelectrically converted to obtain electrical information. This information is converted into digital data, processed by an image processor 6070, and can be observed on a display 6080 in a control room.

  Further, this information can be transferred to a remote place by a transmission means such as a telephone line 6090 and can be displayed on a display 6081 such as a doctor room in another place or stored in a storage means such as an optical disk, and a doctor at a remote place makes a diagnosis. It is also possible. It can also be recorded on the film 6110 by the film processor 6100.

  In each of the embodiments described above, the case where X-rays are used has been described as an example. However, radiation such as α, β, and γ rays can be used. Light is an electromagnetic wave in a wavelength region that can be detected by a photoelectric conversion element, and includes visible light. Furthermore, for example, the present invention can be applied to an electromagnetic wave electric signal conversion device that converts an electromagnetic wave including radiation into an electric signal.

DESCRIPTION OF SYMBOLS 1 Image pick-up element board | substrate 2 Support body 3 Circuit board 4 Shielding member 5 Active element 11,14 Case 12 Wiring member 15 Grid 16 Radiation image pick-up element module 17 Support stand 18 Fixing material 19 Heat sink 21 Mounting plates 23-26 Sensor base material 27 Pixel area 28 Bases 29, 31, 39 Adhesive material 30 Fluorescent plate 32 Lead electrode part 33 Flexible circuit board 34 Printed circuit board 35, 36 IC
37, 40 Sealing material 38 Metal film 41 Flat plate 42 Screw

Claims (7)

An image sensor substrate having a conversion element for converting incident radiation into an electrical signal;
A plurality of flexible circuit boards connected to the imaging device substrate;
A plurality of circuit chips disposed on the side of the image pickup device substrate, each connected to the image pickup device substrate via any one of the plurality of flexible circuit boards;
A plurality of radiation shielding members;
Have
The plurality of circuit chips and the plurality of radiation shielding members correspond one to one,
Each of the plurality of radiation shielding members is provided at a position that covers the surface on which the radiation is incident, and covers a surface other than the surface on which the radiation is incident. The radiation imaging apparatus is not provided in the radiation imaging apparatus. A housing,
The radiation imaging apparatus according to claim 1, wherein the plurality of circuit chips are fixed by a heat radiating plate fixed to the housing . The plurality of radiation shielding members may be any one of a layered member containing at least one metal selected from Pb, Ta, Ba, and W, a plurality of solder balls, the metal powder, and a cured product of the metal and resin. The radiation imaging apparatus according to claim 1, wherein the radiation imaging apparatus is formed . A circuit board that is disposed on the side opposite to the radiation incident side, and further includes a plurality of circuit chips electrically connected to the imaging element substrate via the plurality of flexible circuit boards;
A plurality of further radiation shielding members that are disposed between the circuit board and the imaging element substrate and include at least one metal selected from Pb, Ta, Ba, and W;
Further comprising
The further plurality of circuit chips and the further plurality of radiation shielding members correspond one-to-one, and each of the further plurality of radiation shielding members is located at a position where the corresponding circuit chip is shielded from the radiation. The radiation imaging apparatus according to claim 1, wherein the radiation imaging apparatus is provided . The imaging device substrate, a radiation imaging apparatus according to any one of claims 1 to 4 having a wavelength converter for converting radiation into visible light, a photoelectric conversion element. The imaging device substrate, a radiation imaging apparatus according to any one of claims 1 to 4 having a direct conversion element for converting radiation directly. The radiation imaging system, characterized by comprising: a radiation imaging apparatus according to any one of claims 1 to 6, and a display for displaying the captured image by the radiation imaging apparatus.

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