JP2010192903A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of improving the manufacture yield of a flexible printed wiring board by making a metal film thin, and avoiding cracking of the metal film. <P>SOLUTION: The flexible printed wiring board 1A includes a conductive pattern 21, a cover layer 30 covering the conductive pattern 21 and provided with an opening opposite a part of the conductive pattern 21, the metal film 42 covering the cover layer 30, and a conductive part 41 electrically connecting the metal film 42 and conductive pattern 21 to each other. The conductive part 41 is made of a material different from that of the metal film 42, positioned in the opening of the cover layer 30, and thicker than the metal film 42. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device including a flexible printed wiring board that handles high-frequency signals.

  In information processing equipment, a flexible printed wiring board having a high degree of freedom of wiring that can be mounted in a bent state in a casing is often used. With the increase in processing speed and circuit density in information processing equipment, the flexible printed wiring board mounted in the casing of the equipment is also changed from the microwave (UHF) band to the centimeter wave (SHF) band and further to the centimeter wave. From the viewpoint of the transition from the millimeter wave (EHF) band to the millimeter wave (EHF) band, there is a demand for a transmission line forming technique using printed wiring of high frequency band signals in consideration of transmission loss.

  In circuits where the signal transmission speed is not high, single-ended transmission lines are often used, but when transmitting signals in the high frequency band of several hundred MHz or more, the combination of low signal voltage and differential transmission methods A transmission line of a signal transmission form is frequently used.

  A conventional flexible printed wiring board having a signal transmission line by a differential transmission system includes a ground (GND) layer coated with a conductive paste (for example, silver paste), and has a differential transmission with a specified rated impedance. A track is formed. As for the signals transmitted on the signal transmission line of the differential transmission system, the frequency band of the signals handled as described above becomes higher and the formation of the transmission line considering the millimeter wave band is required. When a transmission line for transmitting such a high-frequency band signal (for example, a signal of about several hundred Mbps) is formed by the ground layer and the copper printed wiring layer made of the conductive paste, transmission loss increases. was there.

  The volume resistivity of the conductive paste used for the ground (GND) layer of a general flexible printed wiring board is about 100 to 50 μΩ · cm. The resistance (electric resistance on the ground (GND) side) of the conductive paste causes a signal transmission loss at the transmission end of the high-frequency signal, but the signal transmission speed in the current differential transmission (for example, serial ATA (SATA1)) In the case of 1.5 Gbps), a signal transmission line that normally operates in a circuit is formed. However, for example, serial ATA2 (SATA2; 3 Gbps) with a higher signal transmission speed, or higher-speed signal transmission, the signal transmission loss increases as the frequency band increases and normal. It is not possible to guarantee the signal transmission that operates normally.

  Therefore, instead of the above-described conductive paste, it has been studied to form a ground (GND) layer using a metal nanopaste having a small volume resistivity (for example, silver nanopaste). However, this nanopaste has the following problems. There is. In other words, since nanopaste strips the solvent from the wet state (volatilizes) and forms a metal film, it tries to embed the paste in the current coverlay opening (for example, opening diameter of about 0.8 to 1 mm) without any spots. Then, it is necessary to apply a large amount (applied with a thickness of about 40 to 50 μm). However, when a large amount of nanopaste is applied, the finished thickness varies, and as a result, cracks easily occur due to shrinkage during dry molding (if the finished thickness exceeds 10 micrometers, cracks are likely to occur). There is.

JP-A-8-125380

  As described above, in a flexible printed wiring board using metal nano paste instead of conductive paste, a large amount of metal nano paste must be applied. For this reason, the yield at the time of manufacture deteriorates and cracks are likely to occur.

  An object of the present invention is to obtain an electronic device that can reduce the thickness of a metal film, improve the yield during the manufacture of a flexible printed wiring board, and avoid cracks in the metal film.

In order to achieve the above object, an electronic apparatus according to one aspect of the present invention provides:
A first housing, a motherboard housed in the first housing, a hard disk drive housed in the first housing, and a flexible electrical connection between the motherboard and the hard disk drive A printed wiring board.

  The flexible printed wiring board includes a conductive pattern, a cover layer that covers the conductive pattern and is provided with an opening facing a part of the conductive pattern, a metal film that covers the cover layer, and the metal film, Is made of a different material, has a thickness larger than that of the metal film, is positioned in the opening, and includes a conductive part that electrically connects the metal film and the conductive pattern. It is characterized by being.

Furthermore, an electronic device according to another aspect of the present invention is
A housing and a flexible printed wiring board housed in the housing are provided.

  The flexible printed wiring board includes a conductive pattern, a cover layer that covers the conductive pattern and is provided with an opening facing a part of the conductive pattern, a metal film that covers the cover layer, and the metal film, Is made of a different material, and includes a conductive portion located in the opening and electrically connected between the metal film and the conductive pattern.

  According to the present invention, it is possible to improve the yield at the time of manufacturing a flexible printed wiring board and to avoid cracks in the metal film.

Sectional drawing which shows the structure of the principal part of the flexible printed wiring board which concerns on 1st Embodiment of this invention. The top view which shows the structure of the principal part of the flexible printed wiring board which concerns on 1st Embodiment of this invention. The top view which expands and shows a part of flexible printed wiring board shown in FIG. Sectional drawing which shows the manufacturing process of the flexible printed wiring board which concerns on 1st Embodiment of this invention. Sectional drawing which shows the manufacturing process of the flexible printed wiring board which concerns on 1st Embodiment of this invention. Sectional drawing which shows the manufacturing process of the flexible printed wiring board which concerns on 1st Embodiment of this invention. Sectional drawing which shows the manufacturing process of the flexible printed wiring board which concerns on 1st Embodiment of this invention. The perspective view which shows the external appearance of the portable computer which concerns on 2nd Embodiment of this invention. The perspective view which shows the main body unit with which the portable computer which concerns on 2nd Embodiment of this invention is provided in the state from which the keyboard was removed. The perspective view which looked at the case which supports the hard disk drive and hard disk drive with which the portable computer which concerns on 2nd Embodiment of this invention is provided from diagonally lower side. The perspective view which looked at the case which supports the hard disk drive with which the portable computer which concerns on 2nd Embodiment of this invention is equipped, and a hard disk drive from diagonally upper side. The side view which shows the installation state of the flexible printed wiring board with which the portable computer which concerns on 2nd Embodiment of this invention is provided. The perspective view which shows a part of main body unit with which the portable computer which concerns on 2nd Embodiment of this invention is provided in the state from which the keyboard, the hard-disk drive, and the case were removed.

  Embodiments of the present invention will be described below with reference to the drawings.

  The cross-sectional structure of the principal part of the flexible printed wiring board according to the first embodiment of the present invention is shown in FIG. 1, the planar structure of the flexible printed wiring board is shown in FIG. 2, and the planar structure in which a part of FIG. This is shown in FIG. FIG. 1 shows a cross-sectional structure along the line AA shown in FIG. 3, and FIG. 3 shows an enlarged portion 1s shown in FIG.

  As shown in FIG. 1, a flexible printed wiring board 1 </ b> A according to a first embodiment of the present invention includes a base layer 10, a signal layer 20 laminated on the base layer 10, and a cover laminated on the signal layer 20. A layer 30, a metal layer 40 laminated on the cover layer 30, a conductive pattern 21 provided on the signal layer 20, and a spot-like (circular) shape on a surface portion of the cover layer 30 corresponding to the conductive pattern 21. A plurality of conductive paste filling portions (CH) each having an opening provided in the conductive paste filling portion (CH), and the conductive paste is embedded in the conductive paste filling portion (CH), and the metal layer 40 is conductively bonded to the conductive pattern 21. A plurality of conducting portions 41 are included.

  With the above configuration, a ground line that forms a current path of a DC power source is formed by the conductive pattern 21, and a signal that connects transmission ends of information processing elements to the signal layer 20 in a pattern layout along the ground line 21. Transmission lines 22a and 22b are formed, and the metal layer 40 forms a ground layer for the signal transmission lines 22a and 22b.

  In the configuration shown in FIG. 1 described above, the base layer 10 includes a base polyimide 11 and a baselay adhesive 12. The surface of the baselay adhesive 12 becomes a pattern forming surface of the signal layer 20 and forms a wiring layer by a copper pattern.

  The signal layer 20 uses the base lay adhesive 12 of the base layer 10 as an insulating base, and forms the conductive pattern 21 and the signal transmission lines 22a and 22b on the base. The conductive pattern 21 forms a ground line that forms a current path of a DC power supply. As shown in FIG. 2, the ground line 21 has a pattern layout along the signal transmission lines 22a and 22b and extends in the transmission end direction together with the signal transmission lines 22a and 22b. In this embodiment, the signal transmission lines 22a and 22b are pattern-laid out as two wiring patterns (copper patterns) parallel to each other on the surface of the base layer 10 (on the surface of the adhesive 12). This is a transmission signal transmission line (differential signal transmission line). In the pattern layout shown in FIG. 3, ground lines 21 are provided on both sides of the differential signal transmission lines 22a and 22b along the differential signal transmission lines 22a and 22b with a certain distance from the differential signal transmission lines 22a and 22b. Is provided. In addition to the ground line 21 and the differential signal transmission lines 22a and 22b, the signal layer 20 is provided with a plurality of transmission lines including a single-ended transmission line in a substantially parallel pattern layout.

  On the ground line 21, as shown in FIG. 3, a plurality of conductive portions 41 formed by embedding a conductive paste in a conductive paste filling portion (CH) provided in an opening in the cover layer 30 has a predetermined structure. It is provided at intervals. The conductive portion 41 is formed by conductively joining the ground line 21 and the metal layer 40 with a solid columnar conductor. As shown in FIG. 1, the conductive portion 41 closes an opening formed in the cover layer 30 to form a flat collar portion 41 f on the conductive paste filling portion (CH) of the cover layer 30. The cover layer 30 is covered with the metal layer 40 including the flange 41f.

  The cover layer 30 includes a coverlay polyimide 31 and a coverlay adhesive 32. The cover layer 30 is covered with a metal layer 40, and the metal layer 40 is further covered with a protective layer (overcoat) 34.

  The metal layer 40 forms a ground (GND) layer and an electromagnetic shield layer with respect to the differential signal transmission lines 22 a and 22 b formed in the signal layer 20.

  The metal layer 40 is composed of a metal film 42 using a silver nanopaste having a low volume resistivity (approximately several μΩ · cm). The metal film 42 is formed with a film thickness of 10 μm or less on the surface of the cover layer 30.

  On the surface of the cover layer 30, a flange portion 41 f formed on the top of the conducting portion 41 is provided so as to project like a spot. A thin metal film 42 having a flat surface with a film pressure of 10 μm or less is formed thereon.

  The surface and edges of the metal film 42 formed using this silver nanopaste are covered with a protective layer (overcoat) 34.

  Thus, on the ground line 21, the conductive paste is embedded in the conductive paste filling portion (CH) formed by opening the cover layer 30, and the ground line 21 and the metal layer 40 are conductively joined. By providing the portion 41, a metal film 42 having a film thickness of 10 μm or less and having a small transmission loss with respect to the differential signal transmission lines 22a and 22b using a silver nanopaste having a low volume resistivity is formed on the metal layer 40. It can be formed easily. The metal film 42 using the silver nanopaste forms a ground (GND) pattern with a low electrical resistance over the entire length of the differential signal transmission lines 22a and 22b, and forms a ground layer with a small transmission loss. To do.

  Thus, for example, a single-side shield structure suitable for serial ATA2 (SATA2; 3 Gbps), serial ATA3 (SATA3; 6 Gbps) conforming to the serial ATA standard, or equivalent or higher speed signal transmission. 1A of flexible printed wiring boards can be provided. Furthermore, it is possible to provide a flexible printed wiring board 1A having a single-sided shield structure that is suitable for application to a narrow space (a narrow gap portion excluding a component mounting region).

  Furthermore, since the amount of nanopaste applied to form the metal layer 40 can be minimized, the yield during manufacturing can be improved, and by making the film thinner, cracks in the ground layer can be avoided and flexibility can be improved. Can be improved. The nanopaste used for the metal film 42 is not limited to the silver nanopaste, and for example, a nanopaste having a low volume resistivity such as a nanopaste in which gold nanoparticles are mixed with silver nanoparticles can be applied.

  The formation process of the conduction | electrical_connection part 41 in the above-mentioned flexible printed wiring board 1A is shown in FIG. 4 thru | or FIG. The steps shown in FIGS. 4 to 7 will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the signal layer 20 provided on the base layer 10 composed of the base polyimide 11 and the baselay adhesive 12 has a ground line 21 and a differential signal according to the designed pattern layout. Transmission lines 22a and 22b are patterned. The cover layer 30 formed of the coverlay polyimide 31 and the coverlay adhesive 32 has a plurality of conductive paste filling portions (CH) corresponding to the formation portions of the ground lines 21 based on the pattern layout. It is drilled with an interval of. The drilling process of the conductive paste filling part (CH) may be either laser processing or drilling.

  In step A shown in FIG. 4, the cover layer 30 composed of the coverlay polyimide 31 and the coverlay adhesive 32 is laminated on the base layer 10 formed of the base polyimide 11 and the baselay adhesive 12. The signal layer 20 is embedded between the base layer 10 and the cover layer 30 by bonding the adhesive 12 of the base layer 10 and the coverlay adhesive 32. By laminating the base layer 10 and the cover layer 30, in the conductive paste filling portion (CH) formed in the cover layer 30, the surface of a part of the pattern of the ground line 21 formed in the signal layer 20 is the conductive paste filling portion. It is exposed from (CH).

  In the process B shown in FIG. 5, the conductive paste filling part (CH) in which a part of the pattern surface of the ground line 21 is exposed is filled with the conductive paste (PA), and the conductive paste filling part (CH) is connected to the conduction part 41. Form. Here, the conductive paste filling part (CH) is filled with a certain amount of conductive paste (PA) rising from the coverlay polyimide 31 by screen printing, and the conductive paste filling part (CH) of the coverlay polyimide 31 is filled with the conductive paste filling part (CH). The conductive portion 41 having the flat flange portion 41f is formed. As the conductive paste (PA), various conductive pastes such as a silver paste, a gold + silver paste, and a hybrid paste in which silver powder and silver nanoparticles are blended can be used.

  In step C shown in FIG. 6, the metal layer 40 is formed on the conductive portion 41 and the cover layer 30. Here, a silver nano paste (PB) is applied on the cover lay polyimide 31 of the cover layer 30 by screen printing or ink jet method, followed by drying and curing treatment, and the cover lay polyimide 31 of the cover layer 30 is then processed. A metal film 42 of 10 μm or less is formed thereon.

  The metal film 42 formed of the silver nano paste (PB) forms a ground layer (GND pattern) for the differential signal transmission lines 22 a and 22 b provided in the signal layer 20.

  In step D shown in FIG. 7, the surface and the end of the metal film 42 formed on the coverlay polyimide 31 of the cover layer 30 are covered with a protective layer (overcoat) 34.

  Through such a process, a solid column-shaped conducting portion 41 is formed, in which the ground line 21 and the metal layer 40 are conductively joined in spots at a plurality of locations.

  In the above-described process, the thin metal film 42 that is conductively bonded to the conductive portion 41 is formed by applying silver nanopaste. However, the metal film 42 may be formed of, for example, copper (Cu) or silver (Ag). , Gold (Au), aluminum (Al), nickel (Ni) or other metals, or an alloy thereof, as a raw material (target), a means for forming by sputtering coating, or a metal foil bonded by an adhesive It may be a means.

  8 to 13 show the configuration of an electronic apparatus according to the second embodiment of the present invention that includes the flexible printed wiring board 1A according to the first embodiment of the present invention as a component.

  The electronic device shown in FIGS. 8 to 13 uses the flexible printed wiring board 1A shown in FIGS. 1 to 7 to transmit serial ATA2 (SATA2) signals between the motherboard and the hard disk drive (HDD). Has realized a portable computer to do.

  FIG. 8 shows a notebook type portable computer 100. The portable computer 100 includes a main unit 102 and a display unit 103.

  As shown in FIG. 8, the main unit 102 has a first housing 110 that can be installed on a desk. The first housing 110 has a flat box shape, and has a palm rest 111 and a keyboard mounting portion 112 on the upper surface. The palm rest 111 extends along the width direction of the first casing 110 in the front half of the first casing 110. The keyboard attachment portion 112 is located behind the palm rest 111. A keyboard 113 is attached to the keyboard attachment portion 112.

  The first housing 110 has a pair of display support portions 114a and 114b spaced apart in the width direction behind the first housing 110.

  The display unit 103 includes a second housing 120 and, for example, a liquid crystal display device 121 as a display device. The second housing 120 is formed in a flat box shape, and the display screen 121 a of the liquid crystal display device 121 is exposed in the display opening 122.

  The second housing 120 has a pair of leg portions 123a and 123b. These leg portions 123a and 123b are rotatably supported by the display support portions 114a and 114b of the first casing 110 via hinges (not shown). With this rotation mechanism, the display unit 103 can rotate between a closed position that covers the palm rest 111 and the keyboard 113 from above and an open position that stands up so that the palm rest 111 and the keyboard 113 are exposed.

  As shown in FIGS. 9, 12, and 13, a space S is formed in the keyboard mounting portion 112 of the main unit 102, below the mounting position of the keyboard 113. Yes.

  A motherboard 170 and a hard disk drive (HDD) 151 are mounted in the space S of the main unit 102. The hard disk drive (HDD) 151 and the mother board 170 perform read / write access to data at a communication speed of serial ATA2 (SATA2) specification via a differential signal transmission line.

  As shown in FIGS. 10 and 11, the hard disk drive 151 is mounted in the space S of the main unit 102 by a fastening mechanism (not shown) while being held in the case 160. In FIG. 12, the case 160 that holds the hard disk drive 151 is omitted. The motherboard 170 is mounted in the space S of the main unit 102 by a fastening mechanism (not shown) in a state of being juxtaposed to the hard disk drive 151.

  The motherboard 170 is mounted with a CPU that controls the system and peripheral circuits of the CPU. In the peripheral circuit of the CPU, for example, a south bridge IC 175 constituting an I / O hub for circuit connection of the hard disk drive 151 is mounted. Further, the motherboard 170 is mounted with a connector (for example, a connector having a lead insertion type crimp terminal) 171 for connecting the hard disk drive 151 to the south bridge IC 175.

  The hard disk drive 151 is provided with a connector (in this example, a connector receptacle) 152 constituting an external connection interface mechanism.

  Between the connector (connector receptacle) 152 of the hard disk drive 151 and the connector (connector having lead insertion type crimp terminals) 171 mounted on the motherboard 170, the flexible print shown in FIGS. The circuit is connected by the wiring board 1A.

  In this second embodiment, the flexible printed wiring board 1A uses the external connection interface of the hard disk drive 151 and the I / O connection interface of the motherboard 170 as transmission ends of information processing elements, respectively, and connects the transmission ends to each other. . The external connection interface of the hard disk drive 151 is a connector (connector receptacle) 152, and the I / O connection interface of the motherboard 170 is a connector (connector having a lead insertion type crimp terminal) 171 connected to the south bridge IC 175. .

  The flexible printed wiring board 1A applied to the second embodiment has a wiring length from one side of the first casing 110 to the approximate center of the casing, and a space in the first casing 110. In S, the narrow space (narrow gap excluding the component mounting area) formed on the back surface of the hard disk drive 151 is used as a wiring path, the back surface of the hard disk drive 151 is pointed, and the hard disk drive 151 and the motherboard 170 are arranged. Is done.

  This flexible printed wiring board 1A has a connector (connector plug) 153 that is connected to a connector (connector receptacle) 152 of the hard disk drive 151 at one end in the wiring direction, and is mounted on the motherboard 170 at one end in the wiring direction. The connector has a connecting lead terminal portion 172 that fits into the connector 171 (connector having a lead insertion type crimp terminal).

  In the flexible printed wiring board 1A, a connector (connector plug) 153 provided at one end in the wiring direction is connected to a connector (connector receptacle) 152 of the hard disk drive 151, and a connecting lead terminal portion 172 provided at the other end in the wiring direction. Is laid on the wiring path in a state of being fitted (crimped) on a connector (connector having a lead insertion type crimp terminal) 171 mounted on the motherboard 170.

  High-speed transmission of read / write data according to the serial ATA2 (SATA2) specification is performed between the hard disk drive 151 and the south bridge IC 175 mounted on the motherboard 170 via the flexible printed wiring board 1A.

  As shown in FIG. 1, the flexible printed wiring board 1A includes a base layer 10, a signal layer 20 laminated on the base layer 10, a cover layer 30 laminated on the signal layer 20, and this cover layer. A plurality of conductive layers including a metal layer 40 stacked on the conductive layer 30, a conductive pattern 21 provided on the signal layer 20, and openings provided in a spot shape on the surface of the cover layer 30 corresponding to the conductive pattern 21. A conductive paste filling portion (CH) and a plurality of conductive portions 41 in which a conductive paste is embedded in the conductive paste filling portion (CH) and the metal layer 40 is conductively bonded to the conductive pattern 21. Has been. The conductive pattern 21 constitutes a ground line that forms a current path of a DC power source, and signal transmission lines 22a and 22b that connect the transmission ends of the information processing elements to the signal layer 20 in a pattern layout along the ground line 21. The ground layer is formed with respect to the signal transmission lines 22a and 22b by the metal layer 40.

  Thus, on the ground line 21, the conductive paste is embedded in the conductive paste filling portion (CH) formed by opening the cover layer 30, and the ground line 21 and the metal layer 40 are conductively joined. By providing the portion 41, a metal film 42 having a film thickness of 10 μm or less and having a small transmission loss with respect to the differential signal transmission lines 22a and 22b using a silver nanopaste having a low volume resistivity is formed on the metal layer 40. Can be formed. The metal film 42 using the silver nanopaste forms a ground (GND) pattern with a low electrical resistance over the entire length of the differential signal transmission lines 22a and 22b, and forms a ground layer with a small transmission loss. To do. As a result, high-speed data transmission with low transmission loss and stable operation is performed between the hard disk drive 151 and the south bridge IC 175 mounted on the motherboard 170. Moreover, since it is a flexible printed wiring board structure using a single-sided metal layer of a thin film, it can be laid (wired) in a narrow space (narrow gap portion excluding the component mounting region) with a small interval, which contributes to reduction in size and weight.

  DESCRIPTION OF SYMBOLS 1A ... Flexible printed wiring board, 21 ... Conductive pattern, 30 ... Cover layer, 41 ... Conducting part, 42 ... Metal film, 110 ... 1st housing | casing, 120 ... 2nd housing | casing, 151 ... Hard disk drive, 170 ... Motherboard.

Claims (4)

A first housing;
A second housing supported by the first housing;
A motherboard housed in the first housing;
A hard disk drive housed in the first housing;
A flexible printed wiring board for electrically connecting the motherboard and the hard disk drive;
The flexible printed wiring board is
A conductive pattern;
A cover layer that covers the conductive pattern and is provided with an opening facing a part of the conductive pattern;
A metal film covering the cover layer;
A conductive portion made of a material different from that of the metal film, having a thickness larger than that of the metal film and positioned in the opening, and electrically connecting the metal film and the conductive pattern; An electronic device comprising:   The electronic device according to claim 1, wherein the metal film is a metal nanopaste. A housing,
A flexible printed wiring board housed in the housing;
The flexible printed wiring board is
A conductive pattern;
A cover layer that covers the conductive pattern and is provided with an opening facing a part of the conductive pattern;
A metal film covering the cover layer;
An electronic apparatus comprising: a conductive portion that is made of a material different from that of the metal film and is located in the opening and electrically connected between the metal film and the conductive pattern.   4. The electronic device according to claim 3, wherein the metal film is a metal nano paste.

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