JP2010192261A - Method of manufacturing solid-sealing organic el device, its manufacturing device, and solid-sealing organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method as well as a device of a solid-sealing organic EL with improved manufacturing yield, and to provide a solid-sealing organic EL device. <P>SOLUTION: The method and device of manufacturing the organic EL element comprises a step of forming an adhesive layer 16 on the surface of a sealing substrate 18, a step of forming an organic EL element 40 on the surface of an ITO substrate 10, a step of forming a jig 50 loading springs 52a and 52b at either end part of the sealing substrate 18, a step of forming jigs 54a and 54b for gripping the ITO substrate 10, a step of positioning the ITO substrate 10 on the sealing substrate 18 by setting the sealing substrate 18 and the ITO substrate 10 opposed to each other so as to make the adhesive layer 16 and the organic EL element 40 face each other and by making the jigs 54a and 54b opposed to the springs 52a and 52b, respectively, and a step of stacking together the organic EL element 40 and the adhesive layer 16 by pressing the ITO substrate 10 onto the sealing substrate 18 with the adhesive layer 16 softened by vacuum heating. The solid-sealing organic EL device is also provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a manufacturing method and manufacturing apparatus for a solid-sealed organic EL device, and a solid-sealed organic EL device, and more particularly, a manufacturing method for a solid-sealed organic EL device with improved workability and yield, a manufacturing apparatus therefor, and a solid sealing. The present invention relates to a stop organic EL device.

  In recent years, display devices and illumination devices using organic EL (EL) elements as organic light emitting elements have been developed for practical use. Conventionally, an organic EL element has been significantly deteriorated by moisture and therefore needs to be moisture-proof. For this reason, an organic EL element mounted on a substrate is sealed with a sealing plate or the like.

  Conventionally, as a method of sealing an organic EL element, for example, the substrate surface on which the organic EL element is mounted is sealed with a sealing can via a sealing material, and a gas such as an inert gas is sealed in the sealed internal space. A hollow sealing technique for filling is known (for example, see Patent Document 1). Alternatively, a liquid sealing technique is known in which a substrate surface on which an organic EL element is mounted is sealed with a sealing can through a sealing material, and the sealed internal space is filled with a filler made of a liquid such as silicone oil. (For example, refer to Patent Document 2) In addition, a fluid sealant such as a resin is applied to the substrate surface, and a glass plate or the like is stacked to cure the sealant by a method such as UV light irradiation or heating. Solid sealing technology for sealing is known. (For example, refer to Patent Document 3 and Patent Document 4.)

  A method for manufacturing a solid-sealed organic EL device according to a conventional example using a solid sealant such as a resin is expressed as shown in FIG.

(A) First, as shown in FIG. 16A, an ITO glass substrate 100 on which an organic EL element 140 is mounted and a sealing substrate 18 on which an adhesive 160 is applied are formed.

(B) Next, as shown in FIG. 16B, together with the alignment step, the ITO glass substrate 100 on which the organic EL element 140 is mounted and the sealing substrate 18 to which the adhesive 160 is applied are bonded together to form an organic EL. The element 140 is brought into contact with the adhesive 160. In this case, the adhesive 160 holds a hard state.

(C) Next, as shown in FIG. 16C, vacuuming is performed using a vacuum laminator, and the sealing substrate 18 coated with the adhesive is heated at a temperature T to soften the adhesive 160. To do.

(D) Next, as shown in FIG. 16 (d), the ITO glass substrate 100 on which the organic EL element 140 is mounted and the sealing substrate 18 coated with the adhesive 160 are pressed from above using a vacuum laminator ( Diaphragm type: pressure P) to be brought into close contact. At this time, the sealing substrate 18 coated with the adhesive is heated at the temperature T.

(E) Thereafter, as shown in FIG. 16 (e), the bonding of the ITO glass substrate 100 on which the organic EL element 140 is mounted and the sealing substrate 18 to which the adhesive 160 is applied is completed. Further, a main curing process for completely curing the adhesive 160 is performed thereafter.

  As a result, the ITO glass substrate 100 on which the organic EL element 140 is mounted and the sealing substrate 18 coated with the adhesive 160 are bonded to prevent the organic EL element 140 from coming into contact with moisture or moisture from the outside, and to the outside. Can be protected from impact from.

  However, in the method of curing the adhesive 160 by a method such as UV light irradiation or heating, when the adhesive 160 is pasted on the ITO glass substrate 100, the UV resin pasting method before curing and the viscosity at the time of adhesion are large. Depending on the situation, the organic EL element 140 may be damaged by a foreign substance and a short circuit may occur.

  That is, when a thermoplastic resin material is attached onto the organic EL element 140 and the resin material is mounted on the organic EL element 140 in a hard state, foreign substances existing between the hard resin or the resin and the organic EL element 140 are removed. The organic EL element 140 is damaged, and a vertical short circuit occurs between the cathode and the anode of the organic EL element 140. For this reason, the problem that the yield of the conventional solid sealing organic electroluminescent apparatus falls arises.

JP 11-214152 A JP 2003-173868 A JP 2005-32682 A JP 2000-195660 A

  An object of the present invention is to provide a method for manufacturing a solid-sealed organic EL device, a manufacturing device thereof, and a solid-sealed organic EL device capable of improving the manufacturing yield without causing physical damage to the organic EL element during solid-sealing. It is to provide.

  According to one aspect of the present invention, a step of forming an adhesive layer on the surface of the sealing substrate, a step of forming an organic EL element on the substrate, and a first lifting / lowering means mounted on both ends of the sealing substrate. A step of forming a jig, a step of forming a second jig for gripping the substrate, the sealing substrate and the substrate facing each other such that the adhesive layer and the organic EL element face each other, and A step of positioning the substrate on the sealing substrate with a second jig facing the elevating means, and pressing the substrate against the sealing substrate in a state where the adhesive layer is softened by vacuum heating. The manufacturing method of the organic light emitting element which has the process of bonding the said organic EL element and the said contact bonding layer is provided.

  According to another aspect of the present invention, a step of forming an adhesive layer on the surface of the sealing substrate, a step of forming an organic EL element on the substrate, and a first mounting the sealing substrate via an elevating means. A step of forming a jig, a step of making the sealing substrate and the substrate face each other so that the adhesive layer and the organic EL element face each other, and aligning the substrate on the sealing substrate; There is provided a method for manufacturing an organic light-emitting element including a step of pressing the substrate against the sealing substrate in a state where the adhesive layer is softened by heating, and bonding the organic EL element and the adhesive layer.

  According to another aspect of the present invention, the lifting means, the sealing substrate having the adhesive layer formed on the upper surface, the first jig having the lifting means mounted thereon, and the substrate having the organic EL element mounted on the upper surface are gripped. A second jig, the first and second jigs are lifted and lowered by the lifting means, and the adhesive layer is softened under vacuum heating, and the organic EL element and the sealing substrate An apparatus for manufacturing a solid-sealed organic EL device that presses and adheres the substrate and the sealing substrate is provided.

  According to another aspect of the present invention, an elevating means and a sealing substrate having an adhesive layer facing the organic EL element formed on the upper surface facing the substrate on which the organic EL element is mounted on the upper and lower means. And a jig on which the lifting means is mounted, the sealing substrate is lifted and lowered by the lifting means, and the adhesive layer is pressed against the organic EL element in a softened state under vacuum heating. Thus, a manufacturing apparatus for a solid-sealed organic EL device for bonding the substrate and the sealing substrate is provided.

  According to another aspect of the present invention, a substrate, an organic EL element disposed on the substrate, an adhesive layer disposed to cover the organic EL element, and the organic EL element are sealed via the adhesive layer. A sealing substrate, and the adhesive layer presses the organic EL element and the sealing substrate in a softened state under vacuum heating to bond the substrate and the sealing substrate together. A stop organic EL device is provided.

  According to the present invention, there is provided a method for manufacturing a solid-sealed organic EL device, a manufacturing device thereof, and a solid-sealed organic EL device capable of improving the manufacturing yield without causing physical damage to the organic EL element during solid-sealing. Can be provided.

The typical plane pattern block diagram of the solid sealing organic electroluminescent apparatus which concerns on the 1st Embodiment of this invention. FIG. 2 is a schematic cross-sectional structure diagram taken along line II in FIG. 1. BRIEF DESCRIPTION OF THE DRAWINGS It is a manufacturing method of the solid sealing organic electroluminescent apparatus concerning the 1st Embodiment of this invention, Comprising: Typical sectional structure drawing (the 1) explaining 1 process of (a) manufacturing process, (b) Manufacturing process Schematic cross-sectional structure diagram for explaining one step (No. 2), (c) Schematic cross-sectional structure diagram for explaining one step of the production process (No. 3). The typical explanatory view of the piston applied to the manufacturing method of the solid encapsulation organic EL device concerning a 2nd embodiment of the present invention. It is a manufacturing method of the solid sealing organic EL device which concerns on the 2nd Embodiment of this invention, Comprising: Typical sectional structure drawing (the 1) explaining 1 process of (a) manufacturing process, (b) Manufacturing process Schematic cross-sectional structure diagram for explaining one step (No. 2), (c) Schematic cross-sectional structure diagram for explaining one step of the production process (No. 3). The typical explanatory view of the piston applied to the manufacturing method of the solid encapsulation organic EL device concerning a 3rd embodiment of the present invention. It is a manufacturing method of the solid sealing organic EL device which concerns on the 3rd Embodiment of this invention, Comprising: Typical sectional structure drawing (the 1) explaining 1 process of (a) manufacturing process, (b) Manufacturing process Schematic cross-sectional structure diagram for explaining one step (No. 2), (c) Schematic cross-sectional structure diagram for explaining one step of the production process (No. 3). The typical explanatory view of the piston applied to the manufacturing method of the solid encapsulation organic EL device concerning a 4th embodiment of the present invention. It is a manufacturing method of the solid sealing organic electroluminescent apparatus which concerns on the 4th Embodiment of this invention, Comprising: Typical sectional structure drawing (the 1) explaining 1 process of (a) manufacturing process, (b) Manufacturing process Schematic cross-sectional structure diagram for explaining one step (No. 2), (c) Schematic cross-sectional structure diagram for explaining one step of the production process (No. 3). Typical explanatory drawing of the piston applied to the manufacturing method of the solid sealing organic electroluminescent apparatus which concerns on the 5th Embodiment of this invention. It is a manufacturing method of the solid sealing organic electroluminescent apparatus which concerns on the 5th Embodiment of this invention, Comprising: Typical sectional structure drawing (the 1) explaining 1 process of (a) manufacturing process, (b) Manufacturing process FIG. 2 is a schematic cross-sectional structure diagram for explaining one step (No. 2). It is a manufacturing method of the solid sealing organic electroluminescent apparatus which concerns on the 6th Embodiment of this invention, Comprising: Typical sectional structure drawing explaining 1 process of a manufacturing process (the 1). It is a manufacturing method of the solid sealing organic electroluminescent apparatus which concerns on the 6th Embodiment of this invention, Comprising: Typical sectional structure drawing explaining 1 process of a manufacturing process (the 2). It is a manufacturing method of the solid sealing organic EL device which concerns on the 6th Embodiment of this invention, Comprising: Typical sectional structure drawing explaining 1 process of a manufacturing process (the 3). It is a manufacturing method of the solid sealing organic EL device which concerns on the 6th Embodiment of this invention, Comprising: Typical sectional structure drawing explaining 1 process of a manufacturing process (the 4). It is a manufacturing method of the solid sealing organic EL device which concerns on a prior art example, Comprising: (a) Typical cross-section figure explaining 1 process of a manufacturing process (the 1), (b) Model explaining 1 process of a manufacturing process (2), (c) schematic cross-sectional structure diagram for explaining one step of the manufacturing process (3), (d) schematic cross-sectional structure diagram for explaining one step of the manufacturing process (4) (E) Typical cross-section FIG. (5) explaining 1 process of a manufacturing process.

  Next, first to sixth embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Also, the following first to sixth embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention are components. The material, shape, structure, arrangement, etc. are not specified below. Various modifications can be made to the embodiment of the present invention within the scope of the claims.

(First embodiment)
(Solid sealing organic EL device)
A schematic planar pattern configuration of the solid-sealed organic EL device 1 according to the first embodiment of the present invention is expressed as shown in FIG. A schematic cross-sectional structure taken along line II in FIG. 1 is expressed as shown in FIG.

  As shown in FIGS. 1 to 2, the solid-sealed organic EL device 1 according to the first embodiment includes an ITO substrate 10, an organic EL element 40 disposed on the ITO substrate 10, and a sealing substrate 18. And an adhesive layer 16 disposed on the sealing substrate 18. The organic EL element 40 includes an anode layer 12 disposed on the ITO substrate 10, an organic EL layer 30 disposed on the anode layer 12, a cathode layer 14 disposed on the organic EL layer 30, and a cathode layer 14. A protective film 20 is provided. The organic EL layer 30 includes a hole transport layer 32 disposed on the anode layer 12, a light emitting unit (not shown) disposed on the hole transport layer 32, and an electron transport layer 31 disposed on the light emitting unit. With.

  That is, in the solid-sealed organic EL device 1 according to the first embodiment, the sealing substrate 18 is disposed so as to face the ITO substrate 10, and the ITO substrate 10 and the sealing substrate 18 are connected via the adhesive layer 16. Provided with a laminated structure. Thereby, the organic EL element 40 can be prevented from coming into contact with moisture or moisture from the outside and can be protected from an impact from the outside.

  Since the solid-sealed organic EL device 1 according to the first embodiment is configured to emit light from the ITO substrate 10 side, the ITO substrate 10 is a transparent substrate that transmits light. An example of the material of the ITO substrate 10 is glass. The thickness is preferably about 0.1 to 1.1 mm, for example. The ITO substrate 10 can be made flexible by using a transparent resin such as polycarbonate or polyethylene terephthalate. In this case, a gas barrier layer is preferably disposed between the ITO substrate 10 and the adhesive layer 16 in order to prevent intrusion of water vapor, oxygen, or the like that causes the life of the solid-sealed organic EL device 1 to deteriorate. . Examples of the gas barrier layer include metal oxides such as silicon oxide and aluminum oxide, or metal nitrides such as aluminum nitride and silicon nitride.

  The anode layer 12 can transmit light and is made of a transparent electrode made of ITO (indium-tin oxide) having a thickness of about 150 to 160 nm, for example.

  In the organic EL layer 30, a hole transport layer 32, a light emitting unit (not shown), and an electron transport layer 31 are sequentially stacked from the ITO substrate 10 side.

  The hole transport layer 32 is for smoothly transporting holes injected from the anode layer 12 to the light emitting part. For example, NPB (N, N-di (naphthalyl)-) having a thickness of about 60 nm is used. N, N-diphenyl-benzidene).

The electron transport layer 31 is for smoothly transporting electrons injected from the cathode layer 14 to the light emitting portion, and is made of, for example, Alq ₃ (aluminum quinolinol complex) having a thickness of about 35 nm.

The light emitting portion is for emitting light by recombination of injected holes and electrons. For example, about 1% of a coumarin compound (C545T) which is a light emitting species is doped, and the thickness is about 30 nm. consisting of Alq _3.

  The organic EL layer 30 may be configured using a layer other than the hole transport layer 32 and the electron transport layer 31, for example, a hole injection layer, an electron injection layer, or the like.

  The cathode layer 14 has a thickness of about 150 nm, for example, and is made of, for example, aluminum.

  The adhesive layer 16 seals the organic EL layer 30 and transmits Joule heat generated in the organic EL layer 30 to the sealing substrate 18 side to dissipate heat. The adhesive layer 16 has a thickness of about 3 to 500 μm, for example.

The material of the adhesive layer 16 is not particularly limited as long as it has the above-described function, and examples thereof include a thermoplastic resin, a thermosetting resin, and a UV curable resin. Preferably, a thermoplastic resin is used. Examples of the thermoplastic resin include resins such as vinyl chloride resin, polyethylene, polypropylene, acrylic, polyethylene terephthalate, polyamide, and polycarbonate. The thermoplastic resin preferably has fluidity than the organic EL layer 30 in a state where it is softened by heating. The viscosity of the thermoplastic resin may be, for example, less than about 1 × 10 ⁴ Pa · s (pascal second) when softened by heating. Preferably, the range is about 1 × 10 to 1 × 10 ⁴ Pa · s. Examples of the thermosetting resin include an epoxy resin, a phenol resin, a polyurethane resin, and a melamine resin. Examples of the UV curable resin include acrylic resins, epoxy resins, and polyester resins.

  Further, since the sealing substrate 18 has a function of radiating the heat transmitted from the adhesive layer 16 to the outside, it is desirable that the sealing substrate 18 has a high thermal conductivity.

  The operation of the solid-sealed organic EL device 1 according to the first embodiment is as follows.

  First, a constant voltage is applied between the anode layer 12 and the cathode layer 14 of the solid-sealed organic EL device 1. As a result, holes are injected from the anode layer 12 into the light emitting part through the hole transport layer 32, and electrons are injected from the cathode layer 14 into the light emitting part through the electron transport layer 31. Light is emitted by recombination of holes and electrons injected into the light emitting portion. The emitted light is emitted to the outside through the ITO substrate 1.

(Method for producing solid-sealed organic EL device)
The manufacturing method of the solid-sealed organic EL device according to the first embodiment is expressed as shown in FIGS.

(A) First, as shown in FIG. 3A, a jig 50 on which a sealing substrate 18 having an adhesive layer 16 formed on the upper surface and springs 52a and 52b on both ends is formed. Also, jigs 54a and 54b are formed to hold the ITO substrate 10 on which the organic EL element 40 is mounted on the upper surface at both ends. Here, a method for forming the adhesive layer 16 on the upper surface of the sealing substrate 18 and a method for forming the organic EL element 40 on the upper surface of the ITO substrate 10 are as follows. For example, a thermoplastic resin having a viscosity of about 1 × 10 to 1 × 10 ⁴ Pa · s on the surface of the sealing substrate 18 made of glass having a substantially rectangular shape in plan view, for example, when softened by heating. The adhesive layer 16 made of resin is uniformly formed with a thickness of, for example, about 3 to 500 μm. The adhesive layer 16 having high fluidity in a high temperature state can be formed using, for example, spin coating, dispenser, spray application, dipping, flexographic printing, or screen printing. On the other hand, after the adhesive layer 16 having a low fluidity formed into a pellet shape when placed at a low temperature is placed on the sealing substrate 18, it can be formed in close contact by heating and reflowing. Alternatively, the adhesive layer 16 previously formed into a sheet shape can be formed on the sealing substrate 18 by a laminator. In the first embodiment, the sheet-like adhesive layer 16 is attached to the sealing substrate 18 and formed. On the other hand, after forming the anode layer 12 on the ITO substrate 10, the hole transport layer 32, the light emitting portion, and the electron transport layer 31 are sequentially formed, and then the cathode layer 14 is formed to form the organic EL element 40. To do. As the material for the springs 52a and 52b, metal or plastic can be used.

(B) Next, as shown in FIG. 3A, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are bonded to the adhesive layer 16 and the organic EL. The element 40 is made to face each other and the jigs 54a and 54b are made to face the springs 52a and 52b to prepare for bonding.

(C) Next, as shown in FIG. 3B, for example, in an argon atmosphere, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are formed. Positioning is performed so that the adhesive layer 16 and the organic EL element 40 face each other, and the jigs 54a and 54b are brought into contact with the springs 52a and 52b. Further, for example, vacuuming is performed to about 1 to 10 kPa, and the jig 50 side is heated at about 60 to 90 ° C. at a temperature T, for example, to soften the adhesive layer 16.

(D) Next, as shown in FIG. 3 (c), the pressure is returned to atmospheric pressure and the adhesive layer 16 is softened, and a pressure P of about 100 kPa is applied to the top of the ITO substrate 1 to 52a and 52b are contracted, and the adhesive layer 16, the organic EL element 40, the ITO substrate 10, and the sealing substrate 18 are brought into close contact with each other. Since heating is performed from the sealing substrate 18 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened. 3A to 3C are side views, in which the anode layer 12, the organic EL layer 30, the protective film 20, and the cathode layer 14 are omitted and simplified. Here, it should be noted that the adhesive layer 16 and the organic EL element 40 are not attached to each other by the effect of the springs 52a and 52b, as shown in FIG. By pressing after the vacuum heating, the springs 52a and 52b contract as shown in FIG. 3C, and the adhesive layer 16 and the organic EL element 40 are bonded together. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the springs 52a and 52b are bonded with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 are formed of a material that has a strength that does not come into contact with each other and that shrinks when pressed.

(E) Finally, it cools to room temperature, the contact bonding layer 16 is hardened, and the solid sealing organic electroluminescent apparatus 1 shown in FIGS. 1-2 is completed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

  According to the manufacturing method of the solid-sealed organic EL device according to the first embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state. Even if there is a foreign matter such as dust on the surface of the organic EL element 40, the adhesive layer 16 takes in the foreign matter such as dust or dust into the inside, so that the bonding can be performed without damaging the organic EL element 40. . In addition, since the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Further, according to the method for manufacturing the solid-sealed organic EL device according to the first embodiment, since the sheet-like thermosetting resin, thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 at room temperature. Can be held. This is advantageous in terms of manufacturing process for increasing the size of the solid-sealed organic EL device.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the first embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, in the manufacturing process, a roll type The supply form can be taken. This makes it possible to improve the efficiency of the manufacturing process.

  According to the method for manufacturing the solid-sealed organic EL device according to the first embodiment, the yield can be improved.

(Manufacturing device for solid-sealed organic EL device)
The manufacturing apparatus for a solid-sealed organic EL device according to the first embodiment includes a lifting / lowering means, a jig 50 on which a sealing substrate 18 having an adhesive layer 16 formed on the upper surface and a lifting / lowering means are mounted, and an organic EL element 40. Jigs 54a and 54b for holding the ITO substrate 10 mounted on the upper surface, and the jig 50 and the jigs 54a and 54b are moved up and down by lifting means, and the adhesive layer 16 is organically softened under vacuum heating. The ITO substrate 10 and the sealing substrate 18 are bonded by pressing with the EL element 40.

  The elevating means is a weight that includes the jig 50, the organic EL element 40, and the ITO substrate 10 when the jig 50 and the jigs 54 a and 54 b are aligned, and does not contact the adhesive layer 16 and the organic EL element 40. And the adhesive layer 16 and the organic EL element 40 can be bonded together.

  In the solid-sealed organic EL device manufacturing apparatus according to the first embodiment, the elevating means uses springs 52a and 52b.

  As shown in FIGS. 3A to 3C, the manufacturing apparatus for a solid-sealed organic EL device according to the first embodiment has a sealing structure in which springs 52a and 52b and an adhesive layer 16 are formed on the upper surface. A jig 50 on which the stop substrate 18 and springs 52a and 52b are mounted on both ends, and jigs 54a and 54b for holding the ITO substrate 10 on which the organic EL element 40 is mounted on both ends are provided.

The As described above, metal and plastic can be used as the material for the springs 52a and 52b. As shown in FIG. 3 (b), the springs 52a and 52b are not attached to each other as shown in FIG. 3B. As shown in (c), the adhesive layer 16 and the organic EL element 40 are contracted and have a strength enough to be bonded. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the springs 52a and 52b are bonded with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. It is sufficient that the layer 16 and the organic EL element 40 have a strength that does not come into contact with each other and are made of a material that can be shrunk by a press.

  In addition, for example, when the sealing substrate 18 has a substantially rectangular shape in plan view, the plurality of springs are arranged at the four corners. For example, when the sealing substrate 18 has an elongated rectangular shape in plan view, the sealing substrate 18 may be disposed at two locations on both ends of the rectangle.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the first embodiment, for example, a thermoplastic sheet-like resin material is used for solid-sealing the organic EL element 40 as the adhesive layer 16. In addition, since the thermoplastic sheet-like resin material is heated in a vacuum state and the resin is sufficiently melted, it can be bonded using the jig 50 equipped with the springs 52a and 52b. The thermoplastic sheet resin material can be brought into close contact with the organic EL element 40 without causing physical damage.

  When the jig 50 having the springs 52a and 52b and the jigs 54a and 54b holding the ITO substrate 10 at both ends are moved up and down, signals from various sensors such as a temperature sensor and a pressure sensor are used as electrical signals. By detecting and moving up and down the jig, the ITO substrate on which the organic EL element 40 is mounted and the sealing substrate can be bonded together.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the first embodiment, since the jig that can be bonded under vacuum heating is used, the bonding layer 16 is bonded in a soft state. Therefore, workability is improved and mass production can be achieved.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the first embodiment, the resin becomes soft when the thermoplastic resin of the adhesive layer 16 first contacts the organic EL element 40. Therefore, since the organic EL element 40 can be bonded without physically damaging, the manufacturing yield is improved even in an environment where foreign matter exists.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the first embodiment, the solid-sealing technology can be applied, so that it can be applied to a flexible element.

  When the up-and-down moving function is mounted in the bonding apparatus (vacuum laminator), the apparatus becomes a chamber-like structure, which greatly increases the cost, whereas the solid sealing according to the first embodiment According to the manufacturing method of an organic EL device and the manufacturing apparatus thereof, it is possible to perform bonding using a jig with an up-and-down lifting function, so that the cost of the manufacturing apparatus can be significantly reduced.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the first embodiment, since the bonding is performed under vacuum, the possibility of bubbles remaining when the bonding is performed is drastically reduced.

  According to the first embodiment, a method for manufacturing a solid-sealed organic EL device, which does not physically damage the organic EL element during solid-sealing, and the manufacturing yield is improved, its manufacturing apparatus, and solid-sealing An organic EL device can be provided.

(Second Embodiment)
As shown in FIG. 4, the piston 62 applied to the method for manufacturing the solid-sealed organic EL device according to the second embodiment includes a piston cylinder 60 filled with a predetermined gas 63 and a piston rod 61. As an operation method of the piston 62, there are a method of changing the height of the piston rod 61 using a magnet or a motor by an electric signal by remote control, and a method of changing the height of the piston rod 61 according to pressure or temperature. In the spring method, it is necessary to pressurize more than usual in the bonding press due to the elastic modulus of the spring. On the other hand, in the piston system, since the height of the piston rod 61 is constant, it is not necessary to apply pressure, and bonding can be performed under normal conditions.

(Method for producing solid-sealed organic EL device)
A manufacturing method of the solid-sealed organic EL device according to the second embodiment is expressed as shown in FIGS.

(A) First, as shown in FIG. 5A, a jig 50 having a sealing substrate 18 with an adhesive layer 16 formed on the upper surface and pistons 62a and 62b on both ends is formed. Also, jigs 54a and 54b are formed to hold the ITO substrate 10 on which the organic EL element 40 is mounted on the upper surface at both ends. Here, the method of forming the adhesive layer 16 on the upper surface of the sealing substrate 18 and the method of forming the organic EL element 40 on the upper surface of the ITO substrate 10 are the same as in the first embodiment.

(B) Next, as shown in FIG. 5A, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are bonded to the adhesive layer 16 and the organic EL. The element 40 is made to face each other and the jigs 54a and 54b are made to face the pistons 62a and 62b to prepare for bonding.

(C) Next, as shown in FIG. 5B, for example, in an argon atmosphere, the sealing substrate 18 with the adhesive layer 16 formed on the upper surface and the ITO substrate 10 with the organic EL element 40 mounted on the upper surface are formed. Positioning is performed so that the adhesive layer 16 and the organic EL element 40 face each other, and the pistons 62a and 62b are pushed down by the weights of the jigs 54a and 54b, the ITO substrate 10, and the organic EL element 40. Further, for example, vacuuming is performed to about 1 to 10 kPa, and the jig 50 side is heated at about 60 to 90 ° C. at a temperature T, for example, to soften the adhesive layer 16.

(D) Next, as shown in FIG. 5C, the pressure is returned to the atmospheric pressure, and the pressure of about 100 kPa is applied to the upper portion of the ITO substrate 1 in a state where the adhesive layer 16 is softened. The adhesive layer 16, the organic EL element 40, the ITO substrate 10, and the sealing substrate 18 are brought into close contact with each other by compressing 62 a and 62 b. Since heating is performed from the sealing substrate 18 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened. It should be noted that the adhesive layer 16 and the organic EL element 40 are not bonded to each other by the effect of the pistons 62a and 62b as shown in FIG. Thus, as shown in FIG. 5C, the pistons 62a and 62b are compressed, and the adhesive layer 16 and the organic EL element 40 are pasted together. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 62a and 62b are bonded together with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 have a compressive strength that does not come into contact with each other, and are compressed by a press so that the adhesive layer 16 and the organic EL element 40 are bonded together.

(E) Finally, it cools to room temperature, the contact bonding layer 16 is hardened, and the solid sealing organic electroluminescent apparatus 1 shown in FIGS. 1-2 is completed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

  According to the method for manufacturing the solid-sealed organic EL device according to the second embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state. Even if there is a foreign matter such as dust on the surface of the organic EL element 40, the adhesive layer 16 takes in the foreign matter such as dust or dust into the inside, so that the bonding can be performed without damaging the organic EL element 40. . In addition, since the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the second embodiment, since the sheet-like thermosetting resin, thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 at room temperature. Can be held. This is advantageous in terms of manufacturing process for increasing the size of the solid-sealed organic EL device.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the second embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, in the manufacturing process, a roll type The supply form can be taken. This makes it possible to improve the efficiency of the manufacturing process.

  According to the method for manufacturing the solid-sealed organic EL device according to the second embodiment, the yield can be improved.

(Manufacturing device for solid-sealed organic EL device)
As shown in FIGS. 5 (a) to 5 (c), the solid-sealed organic EL device manufacturing apparatus according to the second embodiment is obtained by changing the lifting means from a spring to pistons 62a and 62b. The pistons 62a and 62b, the sealing substrate 18 with the adhesive layer 16 formed on the upper surface, the jig 50 with the pistons 62a and 62b mounted on both ends, and the ITO substrate 10 with the organic EL element 40 mounted on the upper surfaces And jigs 54a and 54b to be gripped.

  As shown in FIG. 5 (b), the pistons 62a and 62b are not attached to each other as shown in FIG. 5B. As shown in (c), the adhesive layer 16 and the organic EL element 40 are bonded together by being compressed. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 62a and 62b are bonded together with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 have such a pressure strength that they do not come into contact with each other, and are compressed by a press so that the adhesive layer 16 and the organic EL element 40 are bonded together.

  Further, for example, when the sealing substrate 18 has a substantially square shape in plan view, the plurality of pistons are arranged at the four corners. For example, when the sealing substrate 18 has an elongated rectangular shape in plan view, the sealing substrate 18 may be disposed at two locations on both ends of the rectangle.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the second embodiment, as the adhesive layer 16, for example, when a thermoplastic sheet-like resin material is used for solid-sealing the organic EL element 40 In addition, since the thermoplastic sheet-like resin material is heated in a vacuum state and the resin is sufficiently melted, it can be bonded using the jig 50 equipped with the pistons 62a and 62b. The thermoplastic sheet resin material can be brought into close contact with the organic EL element 40 without causing physical damage.

  When the jig 50 having the pistons 62a and 62b and the jigs 54a and 54b for holding the ITO substrate 10 at both ends are moved up and down, signals from various sensors such as a temperature sensor and a pressure sensor are used as electrical signals. By detecting and moving up and down the jig, the ITO substrate on which the organic EL element 40 is mounted and the sealing substrate can be bonded together.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the second embodiment, since the jig that can be bonded under vacuum heating is used, the bonding layer 16 is bonded in a soft state. Therefore, workability is improved and mass production can be achieved.

  According to the method of manufacturing a solid-sealed organic EL device and the manufacturing device thereof according to the second embodiment, the resin becomes soft when the thermoplastic resin of the adhesive layer 16 is in contact with the organic EL element 40 for the first time. Therefore, since the organic EL element 40 can be bonded without physically damaging, the manufacturing yield is improved even in an environment where foreign matter exists.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the second embodiment, the solid-sealing technology can be applied, so that it can be applied to a flexible element.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the second embodiment, it is possible to perform bonding using a jig with an up-and-down lifting function, which can greatly reduce the cost of the manufacturing apparatus. it can.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the second embodiment, since the bonding is performed under vacuum, the possibility that air bubbles remain when the bonding is performed is drastically reduced.

  According to the second embodiment, a method for manufacturing a solid-sealed organic EL device, which does not physically damage the organic EL element during solid-sealing, and the manufacturing yield is improved, its manufacturing apparatus, and solid-sealing An organic EL device can be provided.

(Third embodiment)
As shown in FIG. 6, the piston 72 applied to the method for manufacturing the solid-sealed organic EL device according to the third embodiment includes a piston cylinder 70 filled with a predetermined thermoplastic material 73 and a piston rod 71. Prepare. As the thermoplastic material 73, for example, a thermoplastic elastomer made of polystyrene, polyolefin, polyester, or other composite materials can be applied.

  As the thermoplastic material 73 filled in the piston 72, a material that is hard at room temperature but melts and becomes fluid when the temperature is raised to a certain temperature is used. When the piston 72 filled with the thermoplastic material 73 rises to a certain temperature, the thermoplastic material 73 melts and becomes fluid, and the piston rod 71 of the piston 72 falls. In the spring method, it is necessary to pressurize more than usual in the bonding press due to the elastic modulus of the spring. On the other hand, in the piston system, since the height of the piston rod 71 is constant, there is no need for pressurization, and the bonding can be performed under normal conditions, as in the second embodiment. It is the same.

(Method for producing solid-sealed organic EL device)
A method for manufacturing a solid-sealed organic EL device according to the third embodiment is expressed as shown in FIGS.

(A) First, as shown in FIG. 7A, a jig 50 having a sealing substrate 18 with an adhesive layer 16 formed on the upper surface and pistons 72a and 72b on both ends is formed. Also, jigs 54a and 54b are formed to hold the ITO substrate 10 on which the organic EL element 40 is mounted on the upper surface at both ends. Here, the method of forming the adhesive layer 16 on the upper surface of the sealing substrate 18 and the method of forming the organic EL element 40 on the upper surface of the ITO substrate 10 are the same as in the first embodiment.

(B) Next, as shown in FIG. 7A, the sealing substrate 18 with the adhesive layer 16 formed on the upper surface and the ITO substrate 10 with the organic EL element 40 mounted on the upper surface are bonded to the adhesive layer 16 and the organic EL. The element 40 is made to face each other and the jigs 54a and 54b are made to face the pistons 72a and 72b to prepare for bonding.

(C) Next, as shown in FIG. 7B, for example, in an argon atmosphere, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are formed. Positioning is performed so that the adhesive layer 16 and the organic EL element 40 face each other, and the pistons 72a and 72b are pushed down by the weights of the jigs 54a and 54b, the ITO substrate 10, and the organic EL element 40. Further, for example, vacuuming is performed to about 1 to 10 kPa, and the jig 50 side is heated at about 60 to 90 ° C. at a temperature T, for example, to soften the adhesive layer 16. At the same time, as the thermoplastic material 73 filled in the piston cylinder 70, a material that is hard at room temperature but melts and becomes fluid when the temperature is raised to a certain temperature is used. When the piston 72 filled in is raised to a certain temperature, the thermoplastic material 73 is melted and fluidized, and the piston rod 71 of the piston 72 is lowered.

(D) Next, as shown in FIG. 7C, the pressure is returned to the atmospheric pressure, and the pressure of about 100 kPa is applied to the upper portion of the ITO substrate 1 in a state where the adhesive layer 16 is softened. The adhesive layer 16, the organic EL element 40, the ITO substrate 10, and the sealing substrate 18 are brought into close contact with each other by compressing 72 a and 72 b. Since heating is performed from the sealing substrate 18 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened. 7B, the bonding layer 16 and the organic EL element 40 are not bonded to each other due to the effects of the pistons 72a and 72b, and pressing is performed after vacuum heating as shown in FIG. 7B. Thus, as shown in FIG. 7C, the pistons 72a and 72b are compressed, and the adhesive layer 16 and the organic EL element 40 are pasted together. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 72a and 72b are bonded together with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 have a compressive strength that does not come into contact with each other, and are compressed by a press so that the adhesive layer 16 and the organic EL element 40 are bonded together.

(E) Finally, it cools to room temperature, the contact bonding layer 16 is hardened, and the solid sealing organic electroluminescent apparatus 1 shown in FIGS. 1-2 is completed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

  According to the manufacturing method of the solid-sealed organic EL device according to the third embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state, Even if there is a foreign matter such as dust on the surface of the organic EL element 40, the adhesive layer 16 takes in the foreign matter such as dust or dust into the inside, so that the bonding can be performed without damaging the organic EL element 40. . In addition, since the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the third embodiment, since the sheet-like thermosetting resin, thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 at room temperature. Can be held. This is advantageous in terms of manufacturing process for increasing the size of the solid-sealed organic EL device.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the third embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, in the manufacturing process, a roll type The supply form can be taken. This makes it possible to improve the efficiency of the manufacturing process.

  According to the method for manufacturing the solid-sealed organic EL device according to the third embodiment, the yield can be improved.

(Manufacturing device for solid-sealed organic EL device)
As shown in FIGS. 7 (a) to 7 (c), the manufacturing apparatus for a solid-sealed organic EL device according to the third embodiment has a sealed structure in which pistons 72a and 72b and an adhesive layer 16 are formed on the upper surface. A jig 50 on which the stop substrate 18 and pistons 72a and 72b are mounted on both ends, and jigs 54a and 54b that hold the ITO substrate 10 on which the organic EL element 40 is mounted on both ends are provided.

  As shown in FIG. 7 (b), the pistons 72a and 72b are not bonded to each other as shown in FIG. 7B. As shown in (c), the adhesive layer 16 and the organic EL element 40 are bonded together by being compressed. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 72a and 72b are bonded together with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 have such a pressure strength that they do not come into contact with each other, and are compressed by a press so that the adhesive layer 16 and the organic EL element 40 are bonded together.

  Further, for example, when the sealing substrate 18 has a substantially square shape in plan view, the plurality of pistons are arranged at the four corners. For example, when the sealing substrate 18 has an elongated rectangular shape in plan view, the sealing substrate 18 may be disposed at two locations on both ends of the rectangle.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the third embodiment, for example, a thermoplastic sheet-like resin material is used for solid-sealing the organic EL element 40 as the adhesive layer 16. In addition, since the thermoplastic sheet-like resin material is heated in a vacuum state and the resin is sufficiently melted, it can be bonded using the jig 50 equipped with the pistons 72a and 72b. The thermoplastic sheet resin material can be brought into close contact with the organic EL element 40 without causing physical damage.

  When the jig 50 having the pistons 72a and 72b and the jigs 54a and 54b for holding the ITO substrate 10 at both ends are moved up and down, signals from various sensors such as a temperature sensor and a pressure sensor are used as electrical signals. By detecting and moving up and down the jig, the ITO substrate on which the organic EL element 40 is mounted and the sealing substrate can be bonded together.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the third embodiment, since the jig that can be bonded under vacuum heating is used, the bonding layer 16 is bonded in a soft state. Therefore, workability is improved and mass production can be achieved.

  According to the method of manufacturing a solid-sealed organic EL device and the manufacturing device thereof according to the third embodiment, the resin becomes soft when the thermoplastic resin of the adhesive layer 16 comes into contact with the organic EL element 40 for the first time. Therefore, since the organic EL element 40 can be bonded without physically damaging, the manufacturing yield is improved even in an environment where foreign matter exists.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the third embodiment, the solid-sealing technology can be applied, so that it can be applied to a flexible element.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the third embodiment, it is possible to perform bonding using a jig with an up-and-down lifting function, which can greatly reduce the cost of the manufacturing apparatus. it can.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the third embodiment, since the bonding is performed under vacuum, the possibility that air bubbles remain when the bonding is performed is drastically reduced.

  According to the third embodiment, a method for manufacturing a solid-sealed organic EL device, which does not physically damage the organic EL element during solid-sealing, and the manufacturing yield is improved, its manufacturing apparatus, and solid-sealing An organic EL device can be provided.

(Fourth embodiment)
As shown in FIG. 8, the piston 82 applied to the method for manufacturing the solid-sealed organic EL device according to the fourth embodiment includes a piston cylinder 80 filled with a predetermined temperature-sensitive gel 83, a piston rod 81, Is provided. The thermosensitive gel 83 is a gel in which a gel (crosslinked polymer) containing a large amount of solvent causes a phase separation (separation phenomenon) in which the solvent in the gel separates from the gel itself due to a temperature change, and the volume of the gel changes. It is. That is, as shown in FIG. 8, when the temperature of the piston cylinder 80 filled with the temperature-sensitive gel 83 and the gas 85 such as air, nitrogen gas, or rare gas rises and reaches a predetermined temperature, the temperature-sensitive gel 83 is phase-separated and separated into the temperature-sensitive gel 83 that is not phase-separated from the phase-separated temperature-sensitive gel 84, and the piston rod 81 is lowered because the viscosity of the phase-separated temperature-sensitive gel 84 is low. . Also in the manufacturing method of the solid-sealed organic EL device according to the fourth embodiment, since the height of the piston rod 81 is constant, there is no need for pressurization, and bonding is performed under normal conditions. This is the same as in the second embodiment.

  As an example of the temperature-sensitive gel 83, a gel having a large amount of ionic liquid (ionic liquid) in the structure can be applied. Specifically, a polystyrene-based gel having a quaternary onium salt, an imidazolium salt A gel or the like containing can be applied.

(Method for producing solid-sealed organic EL device)
The manufacturing method of the solid-sealed organic EL device according to the fourth embodiment is expressed as shown in FIGS. 9 (a) to 9 (c).

(A) First, as shown in FIG. 9A, a jig 50 having a sealing substrate 18 with an adhesive layer 16 formed on the upper surface and pistons 82a and 82b on both ends is formed. Also, jigs 54a and 54b are formed to hold the ITO substrate 10 on which the organic EL element 40 is mounted on the upper surface at both ends. Here, the method of forming the adhesive layer 16 on the upper surface of the sealing substrate 18 and the method of forming the organic EL element 40 on the upper surface of the ITO substrate 10 are the same as in the first embodiment.

(B) Next, as shown in FIG. 9A, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are bonded to the adhesive layer 16 and the organic EL. The element 40 is made to face each other and the jigs 54a and 54b are made to face the pistons 82a and 82b to prepare for bonding.

(C) Next, as shown in FIG. 9B, for example, in an argon atmosphere, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are formed. Positioning is performed so that the adhesive layer 16 and the organic EL element 40 face each other, and the pistons 82a and 82b are pushed down by the weights of the jigs 54a and 54b, the ITO substrate 10 and the organic EL element 40. Further, for example, vacuuming is performed to about 1 to 10 kPa, and the jig 50 side is heated at about 60 to 90 ° C. at a temperature T, for example, to soften the adhesive layer 16. At the same time, the temperature-sensitive gel 83 filled in the piston cylinder 80 is made of a material that has high viscosity at room temperature but causes phase separation and lowers viscosity when the temperature is raised to a certain temperature. For this reason, when the piston 82 filled with the temperature-sensitive gel 83 rises to a certain temperature, the temperature-sensitive gel 83 changes to a temperature-sensitive gel 84 that has undergone phase separation, and the piston rod 81 of the piston 82 Go down.

(D) Next, as shown in FIG. 9C, the pressure is returned to the atmospheric pressure, and the pressure of about 100 kPa is applied to the upper portion of the ITO substrate 1 with the adhesive layer 16 softened, and the piston The adhesive layer 16, the organic EL element 40, the ITO substrate 10, and the sealing substrate 18 are brought into close contact with each other by compressing 82 a and 82 b. Since heating is performed from the sealing substrate 18 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened. 9B, the bonding layer 16 and the organic EL element 40 are not bonded to each other due to the effects of the pistons 82a and 82b as shown in FIG. 9B. Thus, as shown in FIG. 9C, the pistons 82a and 82b are compressed, and the adhesive layer 16 and the organic EL element 40 are pasted together. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 82a and 82b are bonded with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 have a compressive strength that does not come into contact with each other, and are compressed by a press so that the adhesive layer 16 and the organic EL element 40 are bonded together.

(E) Finally, it cools to room temperature, the contact bonding layer 16 is hardened, and the solid sealing organic electroluminescent apparatus 1 shown in FIGS. 1-2 is completed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

  According to the method for manufacturing the solid-sealed organic EL device according to the fourth embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state. Even if there is a foreign matter such as dust on the surface of the organic EL element 40, the adhesive layer 16 takes in the foreign matter such as dust or dust into the inside, so that the bonding can be performed without damaging the organic EL element 40. . In addition, since the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Further, according to the method for manufacturing the solid-sealed organic EL device according to the fourth embodiment, since the sheet-like thermosetting resin, thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 at room temperature. Can be held. This is advantageous in terms of manufacturing process for increasing the size of the solid-sealed organic EL device.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the fourth embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, in the manufacturing process, a roll type The supply form can be taken. This makes it possible to improve the efficiency of the manufacturing process.

  According to the method for manufacturing the solid-sealed organic EL device according to the fourth embodiment, the yield can be improved.

(Manufacturing device for solid-sealed organic EL device)
As shown in FIGS. 9 (a) to 9 (c), a manufacturing apparatus for a solid-sealed organic EL device according to the fourth embodiment has a sealed structure in which pistons 82a and 82b and an adhesive layer 16 are formed on the upper surface. A jig 50 on which the stop substrate 18 and pistons 82a and 82b are mounted at both ends, and jigs 54a and 54b for holding the ITO substrate 10 on which the organic EL element 40 is mounted on both ends are provided.

  As shown in FIG. 9 (b), the pistons 82a and 82b are not bonded to each other as shown in FIG. 9B. As shown in (c), the adhesive layer 16 and the organic EL element 40 are bonded together by being compressed. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 82a and 82b are bonded together with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 have such a pressure strength that they do not come into contact with each other, and are compressed by a press so that the adhesive layer 16 and the organic EL element 40 are bonded together.

  Further, for example, when the sealing substrate 18 has a substantially square shape in plan view, the plurality of pistons are arranged at the four corners. For example, when the sealing substrate 18 has an elongated rectangular shape in plan view, the sealing substrate 18 may be disposed at two locations on both ends of the rectangle.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the fourth embodiment, as the adhesive layer 16, for example, when a thermoplastic sheet-like resin material is used for solid-sealing the organic EL element 40 In addition, since the thermoplastic sheet-like resin material is heated in a vacuum state and the resin is sufficiently melted, it can be bonded using the jig 50 equipped with the pistons 82a and 82b. The thermoplastic sheet resin material can be brought into close contact with the organic EL element 40 without causing physical damage.

  When the jig 50 having the pistons 82a and 82b and the jigs 54a and 54b holding the ITO substrate 10 at both ends are moved up and down, signals from various sensors such as a temperature sensor and a pressure sensor are used as electrical signals. By detecting and moving up and down the jig, the ITO substrate on which the organic EL element 40 is mounted and the sealing substrate can be bonded together.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the fourth embodiment, since the jig that can be bonded under vacuum heating is used, the bonding layer 16 is bonded in a soft state. Therefore, workability is improved and mass production can be achieved.

  According to the method of manufacturing a solid-sealed organic EL device and the manufacturing device thereof according to the fourth embodiment, the resin becomes soft when the thermoplastic resin of the adhesive layer 16 comes into contact with the organic EL element 40 for the first time. Therefore, since the organic EL element 40 can be bonded without physically damaging, the manufacturing yield is improved even in an environment where foreign matter exists.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the fourth embodiment, the solid-sealing technology can be applied, so that it can be applied to a flexible element.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the fourth embodiment, it is possible to perform bonding using a jig with an up-and-down lifting function, which can greatly reduce the cost of the manufacturing apparatus. it can.

  According to the method for manufacturing a solid-sealed organic EL device and the manufacturing apparatus thereof according to the fourth embodiment, since the bonding is performed under vacuum, the possibility that bubbles remain when bonded is drastically reduced.

  According to the fourth embodiment, a method for manufacturing a solid-sealed organic EL device, which does not physically damage the organic EL element during solid-sealing, and the manufacturing yield is improved, its manufacturing apparatus, and solid-sealing An organic EL device can be provided.

(Fifth embodiment)
As shown in FIG. 10, the piston 92 applied to the method for manufacturing the solid-sealed organic EL device according to the fifth embodiment includes a piston cylinder 90 that encloses a balloon 93 and a piston rod 91. As the gas in the balloon 93, a gas (air, nitrogen, argon, etc.) that is generally less harmful can be applied. The balloon 93 may be reusable or disposable.

  The piston 92 applied to the manufacturing method of the solid-sealed organic EL device according to the fifth embodiment is of a pressure sensing type, and when the outside air reaches a certain degree of vacuum, the gas inside expands and the balloon 93 Use something that breaks. As a result of the balloon 93 being torn, it looks like a deflated balloon 94 and the piston rod 91 is lowered.

(Method for producing solid-sealed organic EL device)
A method for manufacturing a solid-sealed organic EL device according to the fifth embodiment is expressed as shown in FIGS.

(A) First, as shown in FIG. 11A, a jig 50 having a sealing substrate 18 with an adhesive layer 16 formed on the upper surface and pistons 92a and 92b on both ends is formed. Also, jigs 54a and 54b are formed to hold the ITO substrate 10 on which the organic EL element 40 is mounted on the upper surface at both ends. Here, the method of forming the adhesive layer 16 on the upper surface of the sealing substrate 18 and the method of forming the organic EL element 40 on the upper surface of the ITO substrate 10 are the same as in the first embodiment.

(B) Next, as shown in FIG. 11A, the sealing substrate 18 with the adhesive layer 16 formed on the upper surface and the ITO substrate 10 with the organic EL element 40 mounted on the upper surface are bonded to the adhesive layer 16 and the organic EL. The element 40 is made to face each other and the jigs 54a and 54b are made to face the pistons 82a and 82b to prepare for bonding.

(C) Next, as shown in FIG. 11B, for example, in an argon atmosphere, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are formed. Positioning is performed so that the adhesive layer 16 and the organic EL element 40 face each other, and the pistons 92a and 92b are pushed down by the weights of the jigs 54a and 54b, the ITO substrate 10 and the organic EL element 40. Further, for example, vacuuming is performed to about 1 to 10 kPa, and the jig 50 side is heated at about 60 to 90 ° C. at a temperature T, for example, to soften the adhesive layer 16. At the same time, when the balloon 93 contained in the piston cylinder 90 reaches a certain degree of vacuum, the inside gas expands and the balloon 93 is broken. As a result of the balloon 93 being torn, it looks like a deflated balloon 94 and the piston rod 91 is lowered.

(D) Next, as shown in FIG. 11 (b), the pressure is returned to the atmospheric pressure, and with the adhesive layer 16 softened, a pressure P of about 100 kPa is applied to the upper portion of the ITO substrate 1 to The adhesive layer 16, the organic EL element 40, the ITO substrate 10, and the sealing substrate 18 are brought into close contact with each other by compressing 82 a and 82 b. Since heating is performed from the sealing substrate 18 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened.

(E) Finally, it cools to room temperature, the contact bonding layer 16 is hardened, and the solid sealing organic electroluminescent apparatus 1 shown in FIGS. 1-2 is completed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

  According to the manufacturing method of the solid-sealed organic EL device according to the fifth embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state, Even if there is a foreign matter such as dust on the surface of the organic EL element 40, the adhesive layer 16 takes in the foreign matter such as dust or dust into the inside, so that the bonding can be performed without damaging the organic EL element 40. . In addition, since the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the fifth embodiment, since the sheet-like thermosetting resin, the thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 at room temperature. Can be held. This is advantageous in terms of manufacturing process for increasing the size of the solid-sealed organic EL device.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the fifth embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, in the manufacturing process, a roll type The supply form can be taken. This makes it possible to improve the efficiency of the manufacturing process.

  According to the method for manufacturing the solid-sealed organic EL device according to the fifth embodiment, the yield can be improved.

(Manufacturing device for solid-sealed organic EL device)
As shown in FIGS. 11 (a) to 11 (c), the manufacturing apparatus for a solid-sealed organic EL device according to the fifth embodiment has a sealing structure in which pistons 92a and 92b and an adhesive layer 16 are formed on the upper surface. A jig 50 on which the stop substrate 18 and pistons 92a and 92b are mounted at both ends, and jigs 54a and 54b for holding the ITO substrate 10 on which the organic EL element 40 is mounted on both ends are provided.

  As shown in FIG. 11 (a), the pistons 92a and 92b are not attached to each other as shown in FIG. 11 (a). As shown in (b), the adhesive layer 16 and the organic EL element 40 are bonded together by being compressed. That is, when the upper and lower jigs 54a, 54b, 50 are aligned, the pistons 92a and 92b are bonded together with a set weight including the upper jigs 54a, 54b, the organic EL element 40, and the ITO substrate 10. The layer 16 and the organic EL element 40 are provided with such a pressure strength that they do not come into contact with each other. As a result of the outside air becoming a certain degree of vacuum, the gas inside expands and the balloon 93 is torn, it becomes like a deflated balloon 94, the piston rod 91 is lowered, and the adhesive layer 16 and the organic EL element 40 are Are pasted together.

  Further, for example, when the sealing substrate 18 has a substantially square shape in plan view, the plurality of pistons are arranged at the four corners. For example, when the sealing substrate 18 has an elongated rectangular shape in plan view, the sealing substrate 18 may be disposed at two locations on both ends of the rectangle.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the fifth embodiment, for example, a thermoplastic sheet-like resin material is used as the adhesive layer 16 for solid-sealing the organic EL element 40. In addition, since the thermoplastic sheet-like resin material is heated in a vacuum state and the resin is sufficiently melted, it can be bonded using the jig 50 equipped with the pistons 92a and 92b. The thermoplastic sheet resin material can be brought into close contact with the organic EL element 40 without causing physical damage.

  When the jig 50 having the pistons 92a and 92b and the jigs 54a and 54b holding the ITO substrate 10 at both ends are moved up and down, signals from various sensors such as a temperature sensor and a pressure sensor are used as electrical signals. By detecting and moving up and down the jig, the ITO substrate on which the organic EL element 40 is mounted and the sealing substrate can be bonded together.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the fifth embodiment, since a jig that can be bonded under vacuum heating is used, bonding is performed with the adhesive layer 16 in a soft state. Therefore, workability is improved and mass production can be achieved.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the fifth embodiment, the resin becomes soft when the thermoplastic resin of the adhesive layer 16 is in contact with the organic EL element 40 for the first time. Therefore, since the organic EL element 40 can be bonded without physically damaging, the manufacturing yield is improved even in an environment where foreign matter exists.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the fifth embodiment, since the solid-sealing technique is applied, it can be applied to a flexible element.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the fifth embodiment, it is possible to perform bonding using a jig with an up-and-down lifting function, which can greatly reduce the cost of the manufacturing apparatus. it can.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the fifth embodiment, since the bonding is performed under vacuum, the possibility of bubbles remaining at the time of bonding is greatly reduced.

  According to the fifth embodiment, a method for manufacturing a solid-sealed organic EL device, which does not physically damage the organic EL element during solid-sealing, and the manufacturing yield is improved, its manufacturing apparatus, and solid-sealing An organic EL device can be provided.

(Sixth embodiment)
(Method for producing solid-sealed organic EL device)
A method for manufacturing a solid-sealed organic EL device according to the sixth embodiment is expressed as shown in FIGS.

(A) First, as shown in FIG. 12, the sealing substrate 18 on which the adhesive layer 16 is formed is disposed on the springs 51a to 51c, and the jig 50 on which the springs 51a to 51c are mounted is formed. In addition, the ITO substrate 10 on which the organic EL element 40 is mounted is formed. Here, the method of forming the adhesive layer 16 on the upper surface of the sealing substrate 18 and the method of forming the organic EL element 40 on the upper surface of the ITO substrate 10 are the same as in the first embodiment. In addition, a metal and a plastic can be used as a material of the springs 51a to 51c. Further, as shown in FIG. 12, the sealing substrate 18 having the springs 51a to 51c and the adhesive layer 16 formed on the upper surface is disposed in a groove formed in the jig 50, and on the shoulder of the side wall of the groove. Are formed with ITO substrate fitting portions 55a and 55b capable of fitting the ITO substrate 10 on which the organic EL element 40 is mounted.

(B) Next, as shown in FIG. 13, for example, in an argon atmosphere, the sealing substrate 18 having the adhesive layer 16 formed on the upper surface and the ITO substrate 10 having the organic EL element 40 mounted on the upper surface are bonded to the adhesive layer 16. And the organic EL element 40 face each other so as to face each other. Here, the ITO substrate 10 on which the organic EL element 40 is mounted is fitted to the ITO substrate fitting portions 55a and 55b. In the state shown in FIG. 13, as indicated by the dotted line portion A, the organic EL element 40 and the adhesive layer 16 are not in contact.

(C) Next, as shown in FIG. 13, vacuuming is performed to about 1 to 10 kPa, and the jig 50 side is heated at about 60 to 90 ° C., for example, at a temperature T, and the adhesive layer 16 is softened. To do.

(D) Next, as shown in FIG. 14, the springs 51 a to 51 c are made of a metal material having a high thermal expansion, so that the sealing substrate 18 is lifted by utilizing the thermal expansion of the metal by heating. Can do. As a result, the organic EL element 40 and the adhesive layer 16 are in contact with each other. The adhesive layer 16 contacts in a sufficiently melted state. As shown in FIG. 14, the springs 51 a to 51 c can lift the sealing substrate 18 by utilizing the thermal expansion of metal by heating, and can also lift the ITO substrate 10.

(D) Next, as shown in FIG. 15, the pressure is returned to the atmospheric pressure, and with the adhesive layer 16 softened, a pressure P of about 100 kPa is applied to the top of the ITO substrate 1, and the springs 51 a to 51 c. The adhesive layer 16 and the organic EL element 40 and the ITO substrate 10 and the sealing substrate 18 are brought into close contact with each other. Since heating is performed from the sealing substrate 18 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened. 12 to 15 show side views, and the anode layer 12, the organic EL layer 30, the protective film 20, and the cathode layer 14 are omitted and simplified.

  As shown in FIG. 13, the adhesive layer 16 and the organic EL element 40 are not attached to each other only by performing alignment, and the springs 51 a to 51 c are stretched after vacuum heating, as shown in FIG. 14. The adhesive layer 16 and the organic EL element 40 are in contact with each other, and are further bonded together by pressing as shown in FIG.

(E) Finally, it cools to room temperature, the contact bonding layer 16 is hardened, and the solid sealing organic electroluminescent apparatus 1 shown in FIGS. 1-2 is completed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

  According to the method for manufacturing the solid-sealed organic EL device according to the sixth embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state. Even if there is a foreign matter such as dust on the surface of the organic EL element 40, the adhesive layer 16 takes in the foreign matter such as dust or dust into the inside, so that the bonding can be performed without damaging the organic EL element 40. . In addition, since the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Further, according to the method for manufacturing a solid-sealed organic EL device according to the sixth embodiment, since the sheet-like thermosetting resin, thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 at room temperature. Can be held. This is advantageous in terms of manufacturing process for increasing the size of the solid-sealed organic EL device.

  Moreover, according to the manufacturing method of the solid-sealed organic EL device according to the sixth embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, in the manufacturing process, a roll type The supply form can be taken. This makes it possible to improve the efficiency of the manufacturing process.

  According to the method for manufacturing the solid-sealed organic EL device according to the sixth embodiment, the yield can be improved.

(Manufacturing device for solid-sealed organic EL device)
The manufacturing apparatus for a solid-sealed organic EL device according to the sixth embodiment has an adhesive layer 16 facing the organic EL element 40 so as to face the ITO substrate 10 on which the elevating means and the organic EL element 40 are mounted. A sealing substrate 18 formed on the upper surface is disposed on the lifting means, and a jig 50 on which the lifting means is mounted is provided. The sealing substrate 18 is moved up and down by the lifting means, and the adhesive layer 16 is pressed against the organic EL element 40 in a softened state under vacuum heating, so that the ITO substrate 10 and the sealing substrate 18 are bonded.

  When the jig 50 and the ITO substrate 10 are aligned, the elevating means has a degree of contraction that does not allow the adhesive layer 16 and the organic EL element 40 to come into contact with each other, and expands under vacuum heating. The adhesive layer 16 and the organic EL element 60 can be bonded to each other by pressing so that the organic EL element 40 is brought into contact with the organic EL element 40.

  In the manufacturing apparatus for a solid-sealed organic EL device according to the sixth embodiment, the elevating means uses springs 51a to 51c.

  As shown in FIGS. 12 to 15, the manufacturing apparatus of the solid-sealed organic EL device according to the sixth embodiment arranges the sealing substrate 18 having the adhesive layer 16 formed on the upper surface on the springs 51 a to 51 c. And a jig 50 on which the springs 51a to 51c are mounted. Further, the sealing substrate 18 on which the springs 51a to 51c and the adhesive layer 16 are formed is arranged in a groove formed in the jig 50, and the organic EL element 40 is placed on the shoulder of the side wall of the groove. ITO substrate fitting portions 55a and 55b capable of fitting the ITO substrate 10 mounted on the upper surface are formed. As a material for the springs 51a to 51c, as described above, metal or plastic can be used.

  As shown in FIG. 13, the springs 51 a to 51 c are not attached to each other as shown in FIG. 13, and are pressed after being heated in vacuum, as shown in FIG. 15. In addition, the adhesive layer 16 and the organic EL element 40 are stretched to have a strength enough to be bonded to each other.

  In addition, for example, when the sealing substrate 18 has a substantially rectangular shape in plan view, the plurality of springs may be arranged at the four corners. For example, when the sealing substrate 18 has an elongated rectangular shape in plan view, the sealing substrate 18 may be disposed at two locations on both ends of the rectangle.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the sixth embodiment, as the adhesive layer 16, for example, a thermoplastic sheet-like resin material is used for solid-sealing the organic EL element 40. In addition, since the thermoplastic sheet-like resin material is heated in a vacuum state and can be bonded in a sufficiently melted state using the jig 50 equipped with the springs 51a to 51c, the organic EL element 40 can be bonded. The thermoplastic sheet resin material can be brought into close contact with the organic EL element 40 without causing physical damage.

  Note that when the jig 50 mounted with the springs 51a to 51c and the ITO substrate 10 are moved up and down, signals from various sensors such as a temperature sensor and a pressure sensor are detected as electrical signals, and moved up and down. The ITO substrate on which the element 40 is mounted and the sealing substrate can be bonded together.

  In the sixth embodiment, a piston can be applied as the lifting means instead of the springs 51a to 51c, as in the second to fourth embodiments. Alternatively, a balloon can be applied as in the fifth embodiment. In this case, for example, in order to keep a deflated state at first, the balloon is liquid at a low temperature and heated at a heating temperature of, for example, about 60 ° C. to 100 ° C. A solvent that lifts the stop substrate 18 may be filled.

  According to the manufacturing method and the manufacturing apparatus of the solid-sealed organic EL device according to the sixth embodiment, since the jig that can be bonded under vacuum heating is used, the bonding layer 16 is bonded in a soft state. Therefore, workability is improved and mass production can be achieved.

  According to the method for manufacturing a solid-sealed organic EL device and the manufacturing device according to the sixth embodiment, the resin becomes soft when the thermoplastic resin of the adhesive layer 16 first contacts the organic EL element 40. Therefore, since the organic EL element 40 can be bonded without physically damaging, the manufacturing yield is improved even in an environment where foreign matter exists.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the sixth embodiment, the solid-sealing technique can be applied, so that it can be applied to a flexible element.

  According to the manufacturing method and the manufacturing apparatus for a solid-sealed organic EL device according to the sixth embodiment, it is possible to perform bonding using a jig with an up-and-down lifting function, which can greatly reduce the cost of the manufacturing apparatus. it can.

  According to the method for manufacturing a solid-sealed organic EL device and the device for manufacturing the same according to the sixth embodiment, since the bonding is performed under vacuum, the possibility that bubbles remain when bonded is drastically reduced.

  According to the sixth embodiment, a method of manufacturing a solid-sealed organic EL device, which does not physically damage the organic EL element during solid-sealing, and the manufacturing yield is improved, its manufacturing apparatus, and solid-sealing An organic EL device can be provided.

(Other embodiments)
As described above, the present invention has been described according to the first to sixth embodiments. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

  The manufacturing method of the solid-sealed organic EL device of the present invention, the manufacturing device thereof, and the solid-sealed organic EL device can be applied to the field of flexible electronics such as the organic EL display field and the organic EL lighting field.

Is available.

DESCRIPTION OF SYMBOLS 1 ... Solid sealing organic EL apparatus 10 ... ITO board | substrate 12 ... Anode layer 14 ... Cathode layer 16 ... Adhesion layer 18 ... Sealing substrate 20 ... Protective film 30 ... Organic EL layer 31 ... Electron transport layer 32 ... Hole transport layer 40 ... Organic EL elements 50, 54a, 54b ... Jigs 51a, 51b, 51c, 52a, 52b ... Springs 55a, 55b ... ITO substrate fitting portions 60, 70, 80, 90 ... Piston cylinders 61, 71, 81, 91 ... Pistons Rod 62, 62a, 62b, 72, 72a, 72b, 82, 82a, 82b, 92, 92a, 92b ... Piston 63, 85, 95 ... Gas 73 ... Thermoplastic material 83 ... Temperature sensitive gel 84 ... Phase separated feeling Thermal gel 93, 94 ... Balloons

Claims (5)

Forming an adhesive layer on the surface of the sealing substrate;
Forming an organic EL element on the substrate;
Forming a first jig mounted with lifting means on both ends of the sealing substrate;
Forming a second jig for gripping the substrate;
The sealing substrate and the substrate are opposed to each other so that the adhesive layer and the organic EL element face each other, and the second jig is opposed to the elevating means, and the substrate is placed on the sealing substrate. Aligning, and
A step of pressing the substrate against the sealing substrate in a state where the adhesive layer is softened by vacuum heating, and bonding the organic EL element and the adhesive layer together. Device manufacturing method. Forming an adhesive layer on the surface of the sealing substrate;
Forming an organic EL element on the substrate;
Forming a first jig for mounting the sealing substrate via a lifting means;
The sealing substrate and the substrate are opposed to each other so that the adhesive layer and the organic EL element face each other, and the substrate is aligned on the sealing substrate;
A step of pressing the substrate against the sealing substrate in a state where the adhesive layer is softened by vacuum heating, and bonding the organic EL element and the adhesive layer together. Device manufacturing method. Elevating means;
A first jig on which a sealing substrate having an adhesive layer formed on the upper surface and the elevating means are mounted;
A second jig that holds a substrate on which an organic EL element is mounted, and the first and second jigs are moved up and down by the lifting means to soften the adhesive layer under vacuum heating. An apparatus for manufacturing a solid-sealed organic EL device, wherein the organic EL element and the sealing substrate are pressed in a state to bond the substrate and the sealing substrate. Elevating means;
A sealing substrate on which an adhesive layer facing the organic EL element is formed on the upper surface facing the substrate on which the organic EL element is mounted, and a jig on which the lifting means is mounted. The sealing substrate is lifted and lowered by the lifting means, and the adhesive layer is pressed against the organic EL element in a softened state under vacuum heating to bond the substrate and the sealing substrate together. An apparatus for producing a solid-sealed organic EL device characterized by the above. A substrate,
An organic EL element disposed on the substrate;
An adhesive layer disposed so as to cover the organic EL element;
A sealing substrate that seals the organic EL element through the adhesive layer, and the adhesive layer presses the organic EL element and the sealing substrate in a softened state under vacuum heating, A solid-sealed organic EL device, wherein the substrate and the sealing substrate are bonded together.

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