JP2010190819A - Sensor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a miniaturizable sensor device for preventing cut-off of electric connection between a sensor chip and a terminal. <P>SOLUTION: The sensor chip 40 is supported by a connector case 20 so that its sensing part 40a is exposed to the inside of a medium introduction hole 34 of a housing 30. The sensor chip 40 is electrically connected to the terminal 22 in the fixed state to each terminal 22, and is sealed in the connector case 20 together with each terminal 22 except the sensing part 40a so that a longitudinal direction of the sensor chip 40 is parallel to a medium introduction direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sensor device in which a sensor chip capable of outputting a signal according to the state of a measurement medium is arranged in the longitudinal direction in parallel with the medium introduction direction.

  Conventionally, a pressure sensor shown in the following Patent Document 1 is known as a technique related to a sensor device in which a sensor chip capable of outputting a signal corresponding to the state of a measurement medium is arranged in the longitudinal direction in parallel with the medium introduction direction. . In this pressure sensor, the pressure receiving surface of the sensor chip is arranged in parallel to the introduction direction of the pressure medium (measuring medium), and even if the pressure medium directly contacts the pressure receiving surface or a bonding wire connected to the pressure receiving surface, It is configured to protect the detection element and prevent electrical leakage.

  Specifically, the pressure sensor described in Patent Document 1 includes a housing that introduces a pressure medium, a case attached to the housing, and a pressure detection element that is provided in the case and receives a pressure from the pressure medium. As a sensor chip, a terminal provided around the sensor chip in the case, a bonding wire having one end electrically connected to the pressure receiving surface side of the sensor chip and the other end electrically connected to the terminal And.

  In this pressure sensor, an intermediate portion between one end portion and the other end portion of the bonding wire is covered with an electrically insulating first coating material having resistance to a pressure medium. In addition, the connection portion between the bonding wire and the sensor chip, the connection portion between the bonding wire and the terminal, and the pressure receiving surface of the sensor chip are covered with an electrically insulating second coating material having resistance to the pressure medium.

  The sensor chip is provided on the case so that the pressure receiving surface is perpendicular to the pressure medium introduction direction. The bonding wire is extended from the pressure receiving surface of the sensor chip in a direction perpendicular to the pressure medium introduction direction, and is connected to a terminal arranged on the same plane as the pressure receiving surface. Further, the housing and the case are sealed through an O-ring which is a seal member arranged so as to surround the sensor chip, the bonding wire, and the terminal.

  In the pressure sensor, the pressure medium is directly introduced into the pressure receiving surface of the sensor chip. However, the pressure receiving surface of the bonding wire or sensor chip is covered with a coating material, so that the sensor chip can be protected. Electric leakage can be prevented.

JP 2006-208088 A

  However, in the above prior art, the pressure receiving surface of the sensor chip is arranged perpendicular to the direction of introduction of the measurement medium, so that the bonding wire is extended from the pressure receiving surface of the sensor chip to the same plane as the pressure receiving surface. It was necessary to increase the outer diameter of the. In this case, the outer diameter must be set in consideration of the arrangement of the O-ring surrounding the terminal or the like. Thus, there exists a problem that the outer diameter of a pressure sensor will become large. In addition, a similar problem occurs in a sensor device for detecting the temperature of the measurement medium.

  Moreover, although the 1st coating material coat | covered with a bonding wire fulfill | performs the function which protects a bonding wire from a measurement medium, the pressure of a measurement medium will act directly on a bonding wire. That is, there is a problem that the bonding wire is cut by the pulsation of the measurement medium, and the electrical connection between the sensor chip and the terminal is interrupted.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a sensor device that can prevent electrical connection between a sensor chip and a terminal and can be downsized. There is.

  In order to achieve the above object, in the sensor device according to claim 1, the sensor chip having a sensing unit capable of outputting a signal according to the state of the measurement medium, and the measurement medium as the sensing unit. A housing in which a medium introduction passage for introduction is formed, and the sensor chip that is assembled integrally with the housing so that the sensing portion is exposed in the medium introduction passage, and receives a signal from the sensing portion And a connector case having a terminal for taking out, wherein the sensor chip is electrically connected to the terminal in a state of being fixed to the terminal, and the longitudinal direction of the sensor chip is the medium introduction The sensing unit so as to be parallel to a medium introduction direction in which the measurement medium is introduced through a passage With the exception the terminal characterized in that it is sealed in the connector case.

  According to a second aspect of the present invention, in the sensor device according to the first aspect, the sensor chip is electrically connected to the terminal via a bump while being fixed to a fixing member together with the terminal. The connector case is sealed together with the terminal, the fixing member, and the bump except for the sensing portion so that the longitudinal direction is parallel to the medium introduction direction.

  According to a third aspect of the present invention, in the sensor device according to the first aspect, the sensor chip is fixed to the side surface by an adhesive provided between the side surface facing the side surface along the longitudinal direction of the terminal. Along with the terminal, the adhesive, and the bump except for the sensing unit, which is electrically connected to the terminal via a bump provided between the side surfaces, and the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The connector case is sealed.

  According to a fourth aspect of the present invention, there is provided the sensor device according to the first aspect, wherein the sensor chip outputs a signal from the sensing unit to an end surface facing an end surface that is an end surface on one end side in the longitudinal direction of the terminal. An electrode is provided, the electrode is electrically connected to the tip surface via a bump, and the terminal and the bump except for the sensing portion so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction And it is fixed to the terminal by being sealed in the connector case.

  A fifth aspect of the present invention is the sensor device according to the fourth aspect, wherein the sensor chip is fixed to a fixing member together with the terminal.

  According to a sixth aspect of the present invention, in the sensor device according to the first aspect, the sensor chip is electrically connected to the terminal via a bonding wire in a state of being fixed to a fixing member together with the terminal, and the sensor chip. The connector case is sealed together with the terminal, the fixing member, and the bonding wire except for the sensing portion so that the longitudinal direction of the connector is parallel to the medium introduction direction.

  According to a seventh aspect of the present invention, in the sensor device according to the first aspect, the sensor chip is attached to the distal end surface by an adhesive provided between an end surface facing the distal end surface which is an end surface on one end side in the longitudinal direction of the terminal. The terminal, the adhesive, and the bonding, except for the sensing unit, are electrically connected to the terminal via a bonding wire in a fixed state, and the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The connector case is sealed together with a wire.

  The invention according to claim 8 is the sensor device according to claim 1, wherein the terminal is configured such that two conducting members provided on one end side in the longitudinal direction are biased so as to be close to each other, and the sensor chip is In addition, the sensor chip is electrically connected to the terminal via either one of the two conductive members while being fixed to the terminal by being sandwiched between the two conductive members, and the longitudinal direction of the sensor chip is the medium introduction direction. The connector case is sealed together with the terminal except for the sensing part so as to be parallel to the connector.

  The invention of claim 9 is the sensor device according to any one of claims 1 to 8, wherein the sensor chip is connected to the terminal in a state in which an electrical connection portion with the terminal is sealed by a sealing member. The sensor chip is sealed in the connector case together with the terminal and the sealing member except for the sensing portion so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. .

  A tenth aspect of the present invention is the sensor device according to any one of the first to ninth aspects, wherein the housing is formed with a fastening portion for fastening the housing to an outer peripheral portion of the connector case side. When the sensor case is assembled to the connector case, the sensing portion is formed in a short length in the direction along the medium introduction passage so that the sensing portion is close to or protrudes from the opening on the side opposite to the connector case of the medium introduction passage. It is characterized by that.

  In the invention of claim 1, the sensor chip is supported by the connector case so that the sensing portion thereof is exposed in the medium introduction passage of the housing. The sensor chip is electrically connected to the terminal in a state of being fixed to the terminal, and is sealed in the connector case together with the terminal except for the sensing portion so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The

As a result, the width of the sensor chip in the direction perpendicular to the medium introduction direction (hereinafter also referred to as the radial direction) can be reduced to reduce the size of the sensor device, and the sensor chip and the terminal can be electrically connected. Sealing in the connector case in the state of being made can prevent the electrical connection from being interrupted.
Therefore, the electrical connection between the sensor chip and the terminal can be prevented from being interrupted, and the sensor device can be downsized.

  In the invention of claim 2, the sensor chip is electrically connected to the terminal through the bump in a state of being fixed to the fixing member together with the terminal, and sealed in the connector case together with the terminal, the fixing member and the bump except for the sensing portion. Is done.

  As a result, the sensor chip is fixed to the fixing member together with the terminal, so that the electrical connection via the bumps is surely cut off even when impact or vibration acts on the sensor device or when the sensor device is manufactured. Can be prevented. In particular, since the electrical connection is via bumps, the electrical connection part including the bumps does not interfere with the molding of the connector case.

  In a third aspect of the invention, the sensor chip is attached to the terminal via a bump provided between the side surfaces while being fixed to the side surface by an adhesive provided between the side surfaces facing the longitudinal direction of the terminal. It is electrically connected and sealed in the connector case together with the terminal, adhesive and bump except for the sensing part.

  Thereby, since both connection is strengthened, without fixing with a separate member with respect to a sensor chip and a terminal, compared with the case where it fixes with a separate member, size reduction of a sensor apparatus can further be achieved. In particular, since the gap between the side surfaces on which the adhesive is provided can be adjusted by the application amount of the adhesive and the like, an unreasonable load does not act on the electrical joint portion by the bump, so that the reliability of the bump joint can be improved. .

  In the invention of claim 4, the sensor chip is provided with an electrode for outputting a signal from the sensing portion on the end surface facing the tip surface of the terminal, and this electrode is electrically connected to the tip surface via the bump. The connector case is sealed together with the terminals and bumps except for the sensing portion.

  Accordingly, since the sensor chip and the terminal are arranged in a straight line in the longitudinal direction, the radial dimension of the electrical connection portion is reduced, and the sensor device can be further miniaturized.

  In the invention of claim 5, in contrast to the invention of claim 4, the sensor chip is fixed to the fixing member together with the terminal and sealed, so that the connection between the sensor chip and the terminal is further strengthened. The electrical connection portion can be reliably prevented from being interrupted.

  In the invention of claim 6, the sensor chip is electrically connected to the terminal through a bonding wire in a state of being fixed to the fixing member together with the terminal, and is attached to the connector case together with the terminal, the fixing member and the bonding wire except for the sensing portion. Sealed.

  As a result, the sensor chip is fixed to the fixing member together with the terminal, so that the electrical connection through the bonding wire is interrupted even when an impact, vibration or the like acts on the sensor device or when the sensor device is manufactured. It can be surely prevented.

  In the invention of claim 7, the sensor chip is electrically connected to the terminal via a bonding wire in a state of being fixed to the tip surface by an adhesive provided between the end surfaces facing the tip surface of the terminal, and sensing. The connector case is sealed together with the terminal, adhesive and bonding wire except for the portion.

  Thereby, since both connection is strengthened, without fixing with a separate member with respect to a sensor chip and a terminal, compared with the case where it fixes with a separate member, size reduction of a sensor apparatus can further be achieved. In particular, since the sensor chip and the terminal are arranged in a straight line in the longitudinal direction, the radial dimension of the electrical connection portion by the bonding wire is reduced, and the sensor device can be further miniaturized. .

  In the invention of claim 8, the sensor chip is electrically connected to the terminal via either one of the two conductive members while being fixed to the terminal by being sandwiched between the two conductive members, except for the sensing unit. Sealed in the connector case together with the terminal.

  Thereby, since the connection between the sensor chip and the terminal is strengthened, it is possible to reliably prevent the electrical connection portions from being interrupted. Moreover, since the positioning process of both at the time of electrical connection between the sensor chip and the terminal is simplified, the manufacturing cost can be reduced.

  In the invention of claim 9, the sensor chip is electrically connected to the terminal in a state in which the electrical connection portion with the terminal is sealed by the sealing member, and the connector case together with the terminal and the sealing member except for the sensing portion Sealed.

  As described above, since the connection between the sensor chip and the terminal is reinforced by the sealing member, it is possible to reliably prevent the electrical connection portions from being blocked.

  In the invention of claim 10, the housing is formed with a fastening portion for fastening the housing on the outer peripheral portion on the connector case side. The housing is formed with a short length in the direction along the medium introduction passage so that the sensing portion is close to or protrudes from the opening on the side opposite to the connector case of the medium introduction passage when assembled to the connector case. The

  Thereby, since the sensing part of a sensor chip can be made to adjoin to the measurement medium of the measured part to which a housing is fastened, the detection accuracy with respect to the measurement medium by a sensing part can be raised.

It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on this 1st Embodiment. FIG. 2 is an enlarged cross-sectional view around the sensor chip in FIG. 1. It is an expanded sectional view showing the sensor chip circumference of the sensor device concerning the modification of a 1st embodiment. It is an expanded sectional view showing the sensor chip circumference of the sensor device concerning this 2nd embodiment. It is an expanded sectional view showing a sensor chip circumference of a sensor device concerning a modification of a 2nd embodiment. It is an expanded sectional view showing the sensor chip circumference of the sensor device concerning a 3rd embodiment. It is an expanded sectional view showing the sensor chip circumference of the sensor device concerning the 1st modification in a 3rd embodiment. It is an expanded sectional view showing the sensor chip circumference of the sensor device concerning the 2nd modification in a 3rd embodiment. It is an expanded sectional view showing a sensor chip circumference of a sensor device concerning a 4th embodiment. It is an expanded sectional view showing a sensor chip circumference of a sensor device concerning a 5th embodiment. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on the 6th Embodiment.

[First Embodiment]
Hereinafter, a sensor device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a schematic configuration of a sensor device 10 according to the first embodiment. FIG. 2 is an enlarged cross-sectional view around the sensor chip 40 of FIG.

  The sensor device 10 according to the first embodiment is mounted on, for example, an automobile, and is employed as a sensor device that can detect the pressure, temperature, dielectric constant, and the like using fuel in a fuel pipe as a measurement medium. As shown in FIG. 1, the sensor device 10 includes a sensor chip 40 having a sensing unit 40a capable of outputting a signal corresponding to the state of the measurement medium, and a medium introduction hole 34 for introducing the measurement medium into the sensing unit 40a. , And a connector case 20 that is assembled integrally with the housing 30 and supports the sensor chip 40 so that the sensing portion 40a is exposed in the medium introduction hole 34.

  The connector case 20 forms a connector for outputting a signal corresponding to the state of the measurement medium detected by the sensing unit 40a to the outside. The sensor chip 40 excluding the sensing unit 40a is connected to a PPS (polyphenylene sulfide) or the like. It is formed by insert molding so as to be sealed with a thermoplastic resin such as PBT (polybutylene terephthalate). In the first embodiment, the connector case 20 has a cylindrical shape, for example.

  The connector case 20 has a plurality of insert-molded terminals 22 made of a metal rod-like member. One end of each terminal 22 is insert-molded in the connector case 20 and is sealed without being exposed from the connector case 20.

  On the other hand, the other end of the terminal 22 is disposed so as to be exposed in the opening 23 provided in the other end 20 b of the connector case 20. That is, the other end 20 b provided with the opening 23 in the connector case 20 is configured as a connector in the sensor device 10 together with the other end of each terminal 22 located in the opening 23. That is, an external connector (not shown) is connected to the opening 23 and electrically connected via a wiring member such as an ECU of an automobile. As a material of such a terminal 22, for example, a conductive material such as copper is employed.

  A columnar housing 30 is assembled to one end portion 20a of the connector case 20 having the above-described configuration. Specifically, a housing recess 31 is formed in the other end 30 b of the housing 30, and the connector case 20 and the housing 30 are inserted into the housing recess 31 by inserting the one end 20 a of the connector case 20. Is configured to be assembled.

  The housing 30 is a hollow metal case processed by cutting, cold forging, or the like. The outer periphery of the one end 30a of the housing 30 is a fastening portion that is fastened to an object to be measured such as a fuel pipe. A screw portion 32 is formed. An opening 33 is formed at the center of the end surface of the one end 30a of the housing 30, and a medium introduction hole 34 extending from the opening 33 to the other end 30b of the housing 30 is formed. 34 serves as a medium introduction path. In such a housing 30, the measurement medium is introduced from one end side of the housing 30 to the other end side through the medium introduction hole 34.

  Hereinafter, the direction in which the measurement medium moves from the opening 33 of the one end 30 a of the housing 30 toward the other end through the medium introduction hole 34 is referred to as a medium introduction direction.

  An annular groove 24 is formed on the front end surface 21 of the connector case 20 so as to surround the sensor chip 40 protruding from the connector case 20, and a sealing O-ring 51 and a backup ring 52 are formed in the groove 24. Is arranged. The backup ring 52 is made of resin and is used for high pressure measurement.

  Then, the end of the housing 30 on the side of the housing recess 31 is caulked to the one end 20a of the connector case 20, whereby the caulking portion 35 is formed, the inside of the housing 30 is sealed, and the housing 30, the connector case 20, Are assembled and integrated.

  As shown in FIG. 2, the sensor chip 40 includes a sensing unit 40a that can output a signal according to the state of the measurement medium, an output of a drive signal to the sensing unit 40a, an output of a detection signal to the outside, and a sensing unit. A circuit unit 40b including a control circuit having a function of inputting a signal from 40a, calculating and amplifying the signal, and outputting the signal to the outside. The sensing unit 40a includes a pressure detection unit 41 for detecting the pressure of the measurement medium, a temperature detection unit 42 for detecting the temperature of the measurement medium, and a dielectric constant detection for detecting the dielectric constant of the measurement medium. Part 43.

  In the first embodiment, the sensor chip 40 has, for example, a rectangular plate shape, and its longitudinal direction is parallel to the medium introduction direction, and its short direction is arranged perpendicular to the medium introduction direction. As a result, the width of the sensor chip 40 in the direction perpendicular to the medium introduction direction (hereinafter also referred to as the radial direction) is reduced to reduce the size of the sensor device 10.

  Specifically, the sensor chip 40 includes a plate-shaped first silicon substrate 44, an insulating layer 45 disposed on the first silicon substrate 44, and a second silicon substrate 46 disposed on the insulating layer 45. It is configured with. That is, the insulating layer 45 is sandwiched between the first silicon substrate 44 and the second silicon substrate 46.

  The circuit portion 40b is provided on the surface of the first silicon substrate 44 on which the insulating layer is provided. The circuit unit 40b is configured by transistor elements and various wirings formed by a semiconductor process or the like, and processes a signal input from the sensing unit 40a.

The insulating layer 45 is an electrically insulating film made of, for example, a silicon oxide film (SiO ₂ ). The insulating layer 45 bonds and fixes the first silicon substrate 44 and the second silicon substrate 46, and the second silicon substrate 46 and the circuit unit. It functions as an insulating bonding layer that is responsible for electrical insulation with 40b.

  In addition, a cavity 47 is provided in the laminated structure composed of both the silicon substrates 44 and 46 and the insulating layer 45. The cavity 47 is configured to be airtightly partitioned by covering a recess formed by opening the insulating layer 45 by etching or the like with both silicon substrates 44 and 46. That is, the cavity 47 is configured as a pressure reference chamber that is hermetically sealed and has a constant pressure such as a vacuum.

  A pressure detector 41 is provided in a portion of the second silicon substrate 46 that faces the cavity 47. Specifically, the portion of the second silicon substrate 46 located at a position corresponding to the cavity 47 is configured as a diaphragm 41a, and this diaphragm 41a is opposite to the surface on which the insulating layer 45 is provided on the second silicon substrate 46. It is distorted according to the pressure of the measuring medium acting on the surface. That is, the surface of the second silicon substrate 46 opposite to the surface on which the insulating layer 45 is provided is a pressure receiving surface.

  In addition, a strain gauge 41b is formed in a portion of the diaphragm 41a facing the cavity 47 by impurity implantation / diffusion. A bridge circuit is formed by the strain gauge 41b, and a change in the resistance value of the bridge circuit due to the strain of the diaphragm 41a is detected. As described above, the pressure detection unit 41 includes the diaphragm 41a and the strain gauge 41b.

  The strain gauge 41b is electrically connected to a circuit portion 40b provided on the first silicon substrate 44, and the pressure received by the diaphragm 41a is converted into a pressure signal by the strain gauge 41b, and this pressure signal is converted to the circuit portion 40b. The signal is processed by being input to.

  The temperature detection unit 42 is formed on the side opposite to the pressure detection unit 41 and embedded in the second silicon substrate 46. For example, the temperature detection unit 42 may be a resistor temperature sensor or a diode temperature. It is composed of sensors and the like. The temperature detection unit 42 performs signal processing by inputting a temperature signal corresponding to the detected temperature to the circuit unit 40b.

  The dielectric constant detection unit 43 is provided on the surface of the second silicon substrate 46 on the circuit unit side with respect to the pressure detection unit 41, and the dielectric constant detection unit 43 includes, for example, comb-like electrodes. The dielectric constant is detected in accordance with the capacitance between the electrodes. The dielectric constant detection unit 43 performs signal processing by inputting a dielectric constant signal corresponding to the detected dielectric constant to the circuit unit 40b.

  In addition, a plurality of electrodes 48 are provided on the surface of the first silicon substrate 44 for extracting signals output from the circuit unit 40b according to the state of the measurement medium detected by the sensing unit 40a.

  The sensor chip 40 configured in this manner has an L-shaped cross section together with each terminal 22 and is fixed to a non-conductive fixing member 61, and each electrode 48 is connected to the corresponding terminal 22 via the bump 62. Each is electrically connected.

  As shown in FIGS. 1 and 2, the sensor chip 40 is sealed in the connector case 20 together with one end of each terminal 22, the fixing member 61, and each bump 62 except for the sensing portion 40a. The sensor chip 40 protrudes from the connector case 20 so that the longitudinal direction thereof is parallel to the medium introduction direction and the sensing portion 40a is exposed in the medium introduction hole 34.

  Further, a seal member 53 is provided at a boundary portion between the sensor chip 40 and the distal end surface 21 of the connector case 20. Accordingly, the measurement medium is prevented from entering the connector case 20 via the boundary between the sensor chip 40 and the tip surface 21 of the connector case 20.

  Further, a sealing material (not shown) is provided at the joint between the sensor chip 40 and the connector case 20. As a result, the measurement medium is prevented from entering the connector case 20 via the joint between the sensor chip 40 and the connector case 20.

  Next, a manufacturing method of the connector case 20 in which the sensor chip 40 is installed and a manufacturing method of the sensor device 10 will be described. First, a method for manufacturing the connector case 20 in which the sensor chip 40 is installed will be described.

  First, each terminal 22, the sensor chip 40, and the fixing member 61 are prepared. Specifically, a plurality of terminals 22 are formed by pressing a metal plate that is a copper alloy. Further, a circuit portion 40 b is provided on one surface of the plate-like first silicon substrate 44, and an insulating layer 45 is formed on the first silicon substrate 44 so as to cover the circuit portion 40 b. Then, a portion of the insulating layer 45 that becomes the cavity 47 is opened by etching or the like. On the other hand, a second silicon substrate 46 having a strain gauge 41b, a temperature detector 42, and a dielectric constant detector 43 formed on one surface is prepared, and the second silicon substrate 46 is placed on the insulating layer 45 so that the strain gauge 41b faces the cavity 47. Is pasted to constitute the sensor chip 40.

  Subsequently, after the sensor chip 40 and each terminal 22 are fixed to the fixing member 61, each electrode 48 of the sensor chip 40 and the corresponding terminal 22 are electrically connected via the bumps 62. The sensor chip 40 and each terminal 22 may be fixed to the fixing member 61 after each electrode 48 and the corresponding terminal 22 are electrically connected via the bump 62.

  Then, after the sensor chip 40 fixed by the fixing member 61 and electrically connected by the bumps 62 and one end of each terminal 22 are arranged in a predetermined mold, the molten resin is poured into the mold. At this time, by providing a sealing material (not shown) on a part of the surface of the sensor chip 40, the sealing performance of the joint portion between the sensor chip 40 and the connector case 20 is improved by the sealing material.

  In this manner, the electrical connection portion of the sensor chip 40 and each terminal 22 is sealed with resin, and the opening 23 and the groove 24 are formed, so that the connector case 20 from which a part of the sensor chip 40 protrudes is completed. .

  Next, a method for manufacturing the sensor device 10 will be described. First, a connector case 20 from which a part of the sensor chip 40 shown in FIG. 1 protrudes is prepared. Further, a backup ring 52 and an O-ring 51 are disposed in the groove 24 of the distal end surface 21 of the connector case 20.

  On the other hand, a housing 30 in which an accommodation recess 31, a screw portion 32, a medium introduction hole 34, and the like are formed is prepared. Subsequently, the housing 30 is lowered from the top so as to be fitted to the connector case 20 while being kept horizontal.

  Thereafter, the caulking portion 35 is formed by caulking the end portion of the housing 30 to the one end portion 20 a of the connector case 20. Thus, by integrating the housing 30 and the connector case 20, the connector case 20 and the housing 30 are assembled and fixed by the caulking portion 35. In this way, the sensor device 10 shown in FIG. 1 is completed.

Next, a basic detection operation of the sensor device 10 according to the first embodiment will be described.
The sensor device 10 is attached to a fuel pipe or the like in the vehicle as described above via the screw portion 32 of the housing 30. For example, fuel as a measurement medium is introduced from the opening 33 of the housing 30 into the sensing unit 40 a of the sensor chip 40 through the medium introduction hole 34.

  Then, the fuel pressure of the introduced fuel acts on the diaphragm 41a of the pressure detection unit 41 of the sensing unit 40a. And the pressure signal according to the pressure which acts is output to the circuit part 40b from the pressure detection part 41 as a sensor signal. Further, a temperature signal corresponding to the temperature of the introduced fuel is output from the temperature detection unit 42 to the circuit unit 40b as a sensor signal. In addition, a dielectric constant signal corresponding to the dielectric constant of the introduced fuel is output from the dielectric constant detection unit 43 to the circuit unit 40b as a sensor signal.

  The sensor signal thus processed by the circuit unit 40b is transmitted to the external circuit via the bump 62 and the terminal 22, and for example, the fuel pressure, the fuel temperature, and the fuel dielectric constant are detected. In this way, the state of the measurement medium in the sensor device 10 is detected.

  As described above, in the sensor device 10 according to the first embodiment, the sensor chip 40 is supported by the connector case 20 so that the sensing portion 40a is exposed in the medium introduction hole 34 of the housing 30. The sensor chip 40 is electrically connected to the terminal 22 in a state of being fixed to each terminal 22, and each terminal except the sensing unit 40a so that the longitudinal direction of the sensor chip 40 is parallel to the medium introduction direction. 22 and the connector case 20 are sealed together.

Accordingly, the sensor device 10 can be reduced in size by reducing the width of the sensor chip 40 in the radial direction, and the sensor chip 40 and each terminal 22 are electrically connected and sealed in the connector case 20. By doing so, interruption of electrical connection can be prevented.
Therefore, the electrical connection between the sensor chip 40 and each terminal 22 can be prevented from being interrupted, and the sensor device 10 can be downsized.

  In the sensor device 10 according to the first embodiment, the sensor chip 40 is electrically connected to the terminals 22 via the bumps 62 in a state of being fixed to the fixing member 61 together with the terminals 22, and the sensing unit. The connector case 20 is sealed together with the terminals 22, the fixing member 61 and the bumps 62 except for 40 a.

  As a result, the sensor chip 40 is fixed to the fixing member 61 together with each terminal 22, so that the bump 62 is interposed even when an impact, vibration, or the like acts on the sensor device 10 or when the sensor device 10 is manufactured. It is possible to reliably prevent the electrical connection from being interrupted. In particular, since the electrical connection is via the bumps 62, the electrical connection portion including the bumps 62 does not interfere with the molding of the connector case 20 into the insert case.

FIG. 3 is an enlarged cross-sectional view showing the periphery of the sensor chip 40 of the sensor device 10 according to the modified example of the first embodiment.
As a modification of the first embodiment, as shown in FIG. 3, the fixing member 61 described above is eliminated, and the sensor chip 40 and each terminal 22 are fixed by an adhesive 63 having an adhesive function such as underfill, and each electrode. 48 and the corresponding terminal 22 may be electrically connected via the bumps 62. At this time, the adhesive 63 is provided between the opposing side surfaces of the side surface along the longitudinal direction of the sensor chip 40 and the side surface along the longitudinal direction of the terminal 22. Note that the adhesive 63 is made of a material that can maintain adhesive fixation even at high temperatures during insert molding.

  Thereby, since both connection is strengthened, without fixing to the sensor chip 40 and each terminal 22 with another member, compared with the case where it fixes with another member, size reduction of the sensor apparatus 10 is further aimed at. Can do. In particular, since the gap between the side surfaces on which the adhesive 63 is provided can be adjusted by the application amount of the adhesive 63 and the like, an unreasonable load does not act on the electrical joint portion by the bump 62, so that the reliability of the bump joint is improved. be able to.

[Second Embodiment]
Next, a sensor device 10 according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is an enlarged cross-sectional view showing the periphery of the sensor chip 70 of the sensor device 10 according to the second embodiment.

  As shown in FIG. 4, in the second embodiment, the sensor chip 70 is used instead of the sensor chip 40, and the fixing member 61 is eliminated, which is the same as the sensor device described in the first embodiment. Different. Therefore, substantially the same components as those of the sensor device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  Unlike the sensor chip 40 described above, the sensor chip 70 has a portion of the L-shaped electrode 48a that is electrically connected to each electrode 48 facing the distal end surface 22a that is the end surface on one end side in the longitudinal direction of the terminal 22. A plurality of end surfaces are formed.

  Specifically, each electrode 48a is, for example, a wafer stage before each sensor chip is cut, and a recess is formed between each sensor chip in which the sensing unit 40a and the like are formed and in the vicinity of each electrode 48, An aluminum material or the like for forming the electrode 48a on each electrode 48 and the recess is deposited at a predetermined position by CVD or the like, and then is subjected to a dicing process so as to remove the bottom of each recess.

A method for manufacturing the connector case 20 in which the sensor chip 70 configured as described above is installed will be described.
First, the sensor chip 70 and each terminal 22 are prepared, and each electrode 48a of the sensor chip 70 is electrically connected to each other through the bump 62 in a state where the corresponding tip end surface 22a of the terminal 22 is opposed. .

  And after arrange | positioning the sensor chip 70 and the one end part of each terminal 22 to a predetermined metal mold | die, the melted resin is poured into this metal mold | die. In this way, the electrical connection portion of the sensor chip 70 and each terminal 22 is sealed with resin, and the opening 23 and the groove 24 are formed, so that the connector case 20 from which a part of the sensor chip 70 protrudes is completed. .

  As described above, in the sensor device 10 according to the second embodiment, the sensor chip 70 is provided with the electrodes 48 a on the end surface facing the tip surface 22 a of each terminal 22, and the electrodes 48 a have bumps 62. The sensor chip 70 is sealed to the connector case 20 together with the terminals 22 and the bumps 62 except for the sensing portion 40a so that the longitudinal direction of the sensor chip 70 is parallel to the medium introduction direction.

  Thereby, since the sensor chip 70 and each terminal 22 are arranged on a straight line in the longitudinal direction, the radial dimension of the electrical connection portion is reduced, and the sensor device 10 is further reduced in size. Can do.

FIG. 5 is an enlarged cross-sectional view showing the periphery of the sensor chip 70 of the sensor device 10 according to a modification of the second embodiment.
As a modification of the second embodiment, as shown in FIG. 5, a fixing member 71 for fixing the sensor chip 70 and each terminal 22 may be provided. Thereby, since the connection between the sensor chip 70 and each terminal 22 is further strengthened, it is possible to reliably prevent the electrical connection portions from being interrupted.

[Third Embodiment]
Next, a sensor device 10 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is an enlarged sectional view showing the periphery of the sensor chip 80 of the sensor device 10 according to the third embodiment.

  As shown in FIG. 6, in the third embodiment, the sensor chip 80, the fixing member 81, and the bonding wire 82 are used in place of the sensor chip 40, the fixing member 61, and the bump 62. Mainly different from the sensor device described in. Therefore, substantially the same components as those of the sensor device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  Unlike the sensor chip 40 described above, the sensor chip 80 is formed with an electrode 48 on the surface of the second silicon substrate 46 for extracting a signal from the circuit unit 40b.

  Then, after the sensor chip 80 and the terminals 22 configured as described above are fixed to the non-conductive fixing member 81 in a straight line, the terminals 22 corresponding to the electrodes 48 of the sensor chip 80 and Are electrically connected by bonding wires 82.

  And after arrange | positioning the end part of these sensor chips 80 and each terminal 22 to a predetermined metal mold | die, the melted resin is poured into this metal mold | die. In this manner, the electrical connection portion of the sensor chip 80 and each terminal 22 is sealed with resin, and the opening 23 and the groove 24 are formed, so that the connector case 20 from which a part of the sensor chip 80 protrudes is completed. .

  As described above, in the sensor device 10 according to the third embodiment, the sensor chip 80 is electrically connected to each terminal 22 via the bonding wire 82 while being fixed to the fixing member 81 together with each terminal 22. Then, the connector case 20 is sealed together with the terminal 22, the fixing member 81 and the bonding wire 82 except for the sensing portion 40 a.

  As a result, the sensor chip 80 is fixed to the fixing member 81 together with the terminals 22, so that even when an impact, vibration, or the like acts on the sensor device 10 or when the sensor device 10 is manufactured, the bonding chip 82 is interposed. Therefore, it is possible to reliably prevent the electrical connection from being interrupted.

FIG. 7 is an enlarged cross-sectional view showing the periphery of the sensor chip 80 of the sensor device 10 according to the first modification example of the third embodiment.
As a modification of the third embodiment, as shown in FIG. 7, the fixing member 81 described above is abolished, and the sensor chip 80 and each terminal 22 are fixed with an adhesive 83 having an adhesive function such as underfill and each electrode. 48 and the corresponding terminal 22 may be electrically connected via a bonding wire 82. At this time, the adhesive 83 is provided between the end surfaces of the front end surface 22a of the terminal 22 and the end surface of the sensor chip 80 facing the front end surface 22a. The adhesive 83 is made of a material that can maintain the adhesive fixation even at a high temperature during insert molding.

  Thereby, since both connection is strengthened, without fixing to the sensor chip 80 and each terminal 22 with another member, compared with the case where it fixes with another member, further size reduction of the sensor apparatus 10 is aimed at. Can do. In particular, since the sensor chip 80 and each terminal 22 are arranged in a straight line in the longitudinal direction, the radial dimension at the electrical connection portion by the bonding wire 82 is reduced, and the sensor device 10 can be downsized. Further efforts can be made.

FIG. 8 is an enlarged cross-sectional view showing the periphery of the sensor chip 80 of the sensor device 10 according to the second modification example of the third embodiment.
As a second modification of the third embodiment, as shown in FIG. 8, the fixing member 81 described above is abolished, the sensor chip 80 and each terminal 22 are fixed by an adhesive 83, and terminals corresponding to the electrodes 48 are used. 22 may be electrically connected to each other through a bonding wire 82. At this time, the adhesive 83 is provided between the opposing side surfaces of the side surface along the longitudinal direction of the sensor chip 80 and the side surface along the longitudinal direction of the terminal 22.

  Even if it does in this way, since both connection is strengthened without fixing to the sensor chip 80 and each terminal 22 with a separate member, compared with the case where it fixes with a separate member, size reduction of the sensor apparatus 10 is achieved. Further efforts can be made.

[Fourth Embodiment]
Next, a sensor device 10 according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is an enlarged cross-sectional view showing the periphery of the sensor chip 40 of the sensor device 10 according to the fourth embodiment.

  As shown in FIG. 9, in the fourth embodiment, the fixing member 61 and the bump 62 are eliminated, and the terminal 22 b is used instead of the terminal 22 in that the sensor device described in the first embodiment is used. Mainly different. Therefore, substantially the same components as those of the sensor device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The terminal 22b is configured to be urged so that two conductive members 25 and 26 provided on one end side (sensor chip side) in the longitudinal direction are close to each other. The sensor chip 40 is electrically connected to the terminal 22b via the conductive member 25 and the electrode 48 while being fixed to the terminal 22b by being sandwiched between the conductive members 25 and 26.

  In particular, the conducting member 26 is elastically urged so that the tip portion 26b is close to the conducting member 25 because the intermediate portion 26a is formed in a curved shape. When sandwiched between the conductive members 25 and 26, the conductive member 25 and the electrode 48 can be reliably connected by the biasing force from the conductive member 26.

  In the case where the electrode 48 is disposed on the second silicon substrate 46 side, for example, the conductive member 26 and the corresponding electrode 48 may be electrically connected. Further, the terminal 22 described above is used as one conducting member, and a conducting member in which one end side is fixed to the terminal 22 and the other end side is urged to the tip of the terminal 22 is provided as the other conducting member. Good.

  The sensor chip 40 is sandwiched between the conductive members 25 and 26 of each terminal 22 b configured as described above, and the sensor chip 40 and each terminal 22 b are electrically connected via the conductive member 25 and the electrode 48. .

  As described above, in the sensor device 10 according to the fourth embodiment, the sensor chip 40 is sandwiched between the conductive members 25 and 26 and is fixed to the terminals 22b via the conductive member 25. The terminals 22b are electrically connected to each other, and are sealed in the connector case 20 together with the terminals 22b except for the sensing portion 40a.

  Thereby, since the connection between the sensor chip 40 and the terminal 22b is strengthened, it is possible to reliably prevent the electrical connection portions from being blocked. Moreover, since the positioning process of both at the time of electrical connection of the sensor chip 40 and the terminal 22b is simplified, manufacturing cost can be reduced.

[Fifth Embodiment]
Next, a sensor device 10 according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 10 is an enlarged cross-sectional view showing the periphery of the sensor chip 40 of the sensor device 10 according to the fifth embodiment.

  As shown in FIG. 10, in the fifth embodiment, the electrical connection portion between the sensor chip 40 and each terminal 22 is electrically connected to each terminal 22 while being sealed by the sealing member 90. This is mainly different from the sensor device described in the first embodiment. Therefore, substantially the same components as those of the sensor device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The sealing member 90 is made of, for example, a thermosetting resin such as epoxy. The sensor chip 40 and each terminal 22 are sealed with each electrical connection portion before the connector case 20 is formed by insert molding. Pre-molded by the stop member 90. This pre-mold is formed by transfer formation for the purpose of low cost on the premise of mass production, for example. Further, as will be described later, since the sealing member 90 is insert-molded with respect to the connector case 20, a thermosetting resin is employed as a material constituting the sealing member 90. As in the first embodiment, a thermoplastic resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate) is employed.

  As described above, in the sensor device 10 according to the fifth embodiment, the sensor chip 40 is electrically connected to each terminal 22 in a state where the electrical connection portion with each terminal 22 is sealed by the sealing member 90. Since the connection between the sensor chip 40 and each terminal 22 is reinforced by the sealing member 90, the electrical connection portions can be reliably prevented from being blocked.

  In addition, sealing of each electrical connection part by the sealing member 90 may be applied to the second to fourth embodiments. Even if it does in this way, interruption | blocking of each electrical connection part can be prevented reliably like this 5th Embodiment.

[Sixth Embodiment]
Next, a sensor device 10 according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view illustrating a schematic configuration of the sensor device 10 according to the sixth embodiment.

  As shown in FIG. 11, the sixth embodiment is mainly different from the sensor device described in the first embodiment in that a housing 30 c is employed instead of the housing 30. Therefore, substantially the same components as those of the sensor device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The housing 30 c is formed so that the length in the medium introduction direction is shorter than the housing 30 so that the sensing portion 40 a of the sensor chip 40 is close to the opening 33 when assembled to the connector case 20. The housing 30c may be formed with a short length in the medium introduction direction so that the sensing unit 40a protrudes from the opening 33.

  In addition, a screw portion 32a is formed on the outer peripheral portion (the outer peripheral portion on the connector case side) of the other end portion 30b of the housing 30c as a fastening portion that is fastened to the measured object.

  As described above, in the sensor device 10 according to the sixth embodiment, since the screw portion 32a is formed on the outer peripheral portion of the other end 30b of the housing 30c, the housing 30c is compared with the first embodiment. The length in the medium introduction direction can be shortened. And since the sensing part 40a is adjoining to the opening part 33, the detection accuracy with respect to the measurement medium by the sensing part 40a can be improved.

  Note that the shortening of the length in the medium introduction direction by adopting the housing 30c may be applied to the second to fifth embodiments. Even if it does in this way, the detection accuracy with respect to the measurement medium by the sensing part 40a can be improved like this 6th Embodiment.

The present invention is not limited to the above embodiments, and may be embodied as follows. Even in this case, the same operations and effects as those of the above embodiments can be obtained.
(1) The sensor chips 40, 70, and 80 are not limited to the pressure detector 41, the temperature detector 42, and the dielectric constant detector 43, but may be provided with at least one. The sensor chips 40, 70, 80 may be provided with a detection unit for detecting another state of the measurement medium.

(2) The circuit unit 40b outputs a signal obtained by processing the pressure signal at a predetermined timing, for example, the first timing, from a signal obtained by processing the pressure signal, temperature signal, dielectric constant signal, etc. from the sensing unit 40a. By outputting a signal obtained by processing the temperature signal at the timing 2 and outputting a signal obtained by processing the dielectric constant signal at the third timing, the terminal 22 can be shared and the number of the terminals 22 can be reduced. Good.

DESCRIPTION OF SYMBOLS 10 ... Sensor apparatus 20 ... Connector case 22, 22b ... Terminal 25, 26 ... Conductive member 30, 30c ... Housing 30a ... One end part 30b ... Other end part 32, 32a ... Screw part (fastening part)
33 ... Opening 34 ... Medium introduction hole 40, 70, 80 ... Sensor chip 40a ... Sensing part 40b ... Circuit part 41 ... Pressure detection part 41a ... Diaphragm 41b ... Strain gauge 42 ... Temperature detection part 43 ... Dielectric constant detection part 48, 48a ... Electrodes 61, 71, 81 ... Fixing member 62 ... Bump 63, 83 ... Adhesive 82 ... Bonding wire 90 ... Sealing member

Claims (10)

A sensor chip having a sensing unit capable of outputting a signal according to the state of the measurement medium;
A housing in which a medium introduction passage for introducing the measurement medium into the sensing unit is formed;
A connector case that is integrally assembled with the housing and supports the sensor chip so that the sensing unit is exposed in the medium introduction passage and has a terminal for taking out a signal from the sensing unit;
A sensor device comprising:
The sensor chip is electrically connected to the terminal while being fixed to the terminal, and the longitudinal direction of the sensor chip is parallel to the medium introduction direction in which the measurement medium is introduced through the medium introduction passage. Thus, the sensor device is sealed with the connector case together with the terminal except for the sensing part.   The sensor chip is electrically connected to the terminal through bumps in a state of being fixed to a fixing member together with the terminal, and the sensing unit is arranged so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The sensor device according to claim 1, wherein the sensor device is sealed together with the terminal, the fixing member, and the bump except for the connector case.   The sensor chip is electrically connected to the terminal via a bump provided between the side surfaces in a state of being fixed to the side surface by an adhesive provided between a side surface facing the longitudinal direction of the terminal and an opposite side surface. 2. The connector case is sealed together with the terminal, the adhesive, and the bump except for the sensing portion so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The sensor device described.   In the sensor chip, an electrode for outputting a signal from a sensing unit is provided on an end surface facing an end surface which is an end surface on one end side in the longitudinal direction of the terminal, and the electrode is provided on the end surface via a bump. The sensor chip is fixed to the terminal by being electrically connected and sealed in the connector case together with the terminal and the bump except for the sensing portion so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The sensor device according to claim 1.   The sensor device according to claim 4, wherein the sensor chip is fixed to a fixing member together with the terminal.   The sensor chip is electrically connected to the terminal via a bonding wire in a state of being fixed to a fixing member together with the terminal, and the sensing unit is configured such that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The sensor device according to claim 1, wherein the sensor case is sealed together with the terminal, the fixing member, and the bonding wire.   The sensor chip is electrically connected to the terminal via a bonding wire in a state of being fixed to the tip surface by an adhesive provided between the end surface facing the tip surface which is an end surface on one end side in the longitudinal direction of the terminal. The sensor case is sealed together with the terminal, the adhesive, and the bonding wire except for the sensing portion so that the longitudinal direction of the sensor chip is parallel to the medium introduction direction. 2. The sensor device according to 1. The terminal is configured to be urged so that two conducting members provided on one end side in the longitudinal direction are close to each other,
The sensor chip is electrically connected to the terminal via either one of the two conductive members while being fixed to the terminal by being sandwiched between the two conductive members, and the longitudinal direction of the sensor chip is 2. The sensor device according to claim 1, wherein the sensor case is sealed together with the terminal except for the sensing unit so as to be parallel to the medium introduction direction.   The sensor chip is electrically connected to the terminal in a state where an electrical connection portion with the terminal is sealed by a sealing member, and the longitudinal direction of the sensor chip is parallel to the medium introduction direction. The sensor device according to claim 1, wherein the sensor case is sealed together with the terminal and the sealing member except for the sensing unit. The housing is
A fastening portion for fastening the housing to the outer peripheral portion on the connector case side is formed,
When assembled to the connector case, the sensing portion is formed to have a short length in the direction along the medium introduction passage so that the sensing portion is close to or protrudes from the opening on the side opposite to the connector case of the medium introduction passage. The sensor device according to any one of claims 1 to 9, wherein

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