JP2010182948A - Substrate storage container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate storage container capable of suppressing scale-up of a container body and damage of a substrate even if the warpage of the substrate is large, and taking out the substrate by preventing positional deviation of the substrate. <P>SOLUTION: In the substrate storage container, the container body 10 for storing the semiconductor wafer 1 is formed in a front open box, a lower supporting block 16 for vertically supporting the lower part of a circumferential edge 2 of the semiconductor wafer 1 is provided on the inner bottom surface of the container body, an upper retainer 21 for vertically supporting the upper part of the circumferential edge 2 of the semiconductor wafer 1 is juxtaposed so as to be elastic in a vertical direction in the inner surface of a top plate 22 of the container body 10, and a rear supporting block 23 for vertically supporting the rear of the upper part of the circumferential edge 2 of the semiconductor wafer 1 is provided on the inner surface of a back wall 27 of the container body 10. Since the semiconductor wafer 1 is supported upright, even if the semiconductor wafer 1 is ϕ450 mm type having a large warpage amount, the warpage of the semiconductor wafer 1 is prevented and the container body 10 can be prevented from scaling up to efficiently utilize a space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate storage container used when a substrate represented by a semiconductor wafer is stored, stored, transported, transported, or the like.

  Although not shown, a conventional substrate storage container is configured to include a front open box type container body that aligns and stores a plurality of semiconductor wafers, and a detachable lid that opens and closes the front surface of the container body. The semiconductor wafer is taken out horizontally by the clamp hand from the container body from which the lid is removed.

  The container body is provided with a pair of left and right teeth that horizontally support the semiconductor wafer on both sides of the container body, and the pair of left and right teeth are arranged at predetermined intervals in the vertical direction of the container body. Used for transportation. The rear of both sides of the inside of the container body is formed as an inclined surface that lifts the semiconductor wafer supported by the teeth by friction, reducing the contact area of the semiconductor wafer to prevent generation of particles due to rubbing, and during transportation It functions to reduce vibrations and shocks.

  An elastic retainer that lifts and presses and holds the front end of the peripheral edge of the semiconductor wafer supported by the teeth is attached to the facing surface facing the semiconductor wafer, and the lid is attached to and removed from the front surface of the container body. . This lid is not manually attached from the viewpoint of automation of handling, but is automatically attached and detached by a lid opening / closing device (see Patent Documents 1, 2, and 3). The clamp hand is inserted horizontally into the open front of the container body to hold the peripheral edge of the semiconductor wafer from below, and lifts to separate the semiconductor wafer from the pair of left and right teeth, and then holds the semiconductor wafer. In this state, it is pulled out horizontally from the front of the container body.

JP 2000-159288 A Japanese Patent Application Laid-Open No. 2002-110777 JP 2008-140949 A

  The conventional substrate storage container is configured as described above, and the semiconductor wafer is horizontally supported by the pair of left and right teeth. Therefore, when the semiconductor wafer is of a large φ300 mm or 450 mm type, the semiconductor wafer is surely secured. From the viewpoint of taking out, there is a problem that the arrangement interval between the pair of teeth arranged in the vertical direction of the container main body has to be increased, and the container main body becomes unnecessarily large. Further, when the amount of bending of the semiconductor wafer is large, there is a problem that it is easily damaged by vibration.

  In addition, when a semiconductor wafer is inspected, if it is intended to support the semiconductor wafer vertically, the semiconductor wafer may incline and contact in the direction of the adjacent semiconductor wafer, which may cause contamination of the semiconductor wafer. In addition, in the prior art, the semiconductor wafer is lifted by the retainer of the lid body on the inclined surfaces on both sides inside the container body, but even if the lid body is removed from the container body, the semiconductor wafer does not slide down to the home position of the teeth. As a result, there is a possibility that the semiconductor wafer may be displaced and hinder the removal or may be damaged.

  The present invention has been made in view of the above, and even when the amount of bending of the substrate is large, the container body can be prevented from being enlarged and the substrate can be prevented from being damaged, and the substrate can be taken out smoothly while preventing the displacement of the substrate. An object of the present invention is to provide a substrate storage container that can be used.

  In the present invention, in order to solve the above-mentioned problem, the substrate is stored in the container body, and the container body is formed in a front open box type having an open front, and the lower portion of the peripheral portion of the substrate is formed below the inside thereof. A lower support block is provided for vertical support, and an upper retainer for supporting the upper part of the peripheral edge of the substrate vertically is provided above the inside of the container body so as to be elastically deformable in the vertical direction. A rear support block is provided to vertically support the rear of the peripheral edge portion.

It should be noted that a detachable lid that opens and closes the front of the container body can be provided, and an elastic front retainer that holds the peripheral edge of the substrate can be provided on the surface of the lid that faces the substrate.
In addition, a locking mechanism for locking the lid fitted to the front surface of the container main body is provided, and this locking mechanism is provided in the container main body and penetrates the front peripheral edge of the container main body and can be engaged with the peripheral wall of the lid body. An engagement claw and a spring member that engages the engagement claw with the peripheral wall of the lid can be included.

  Further, of the lower support block and the rear support block, at least the facing surface facing the substrate of the lower support block is bent along the peripheral portion of the substrate, and the peripheral surface of the substrate is supported on the facing surface of the lower support block. Support grooves can also be formed.

  Here, the substrate in the claims includes at least φ200 mm, 300 mm, and 450 mm type round semiconductor wafers, glass wafers, mask glass, liquid crystal glass, and storage disks. This board | substrate does not ask | require especially the amount of bending, or the number of one or more. Further, the container body and the lid may be transparent, opaque, or translucent. A transparent window for substrate observation, an IC tag for physical distribution management, and the like can be attached to the upper, rear and side portions of the container body.

  The upper retainer is preferably provided with an elastic piece that extends while inclining in the front-rear direction of the container body, and a holding block that supports the upper part of the peripheral edge of the substrate via a groove is formed on the elastic piece. Further, the engaging claw of the locking mechanism may be rotatable or slidable. The spring member includes at least a plurality of coil springs, leaf springs, torsion springs, and the like. Furthermore, the substrate storage container according to the present invention can be used for storing, storing, transporting, transporting, and the like of substrates.

  According to the present invention, since the substrate is supported not vertically but vertically by the lower support block and the rear support block in the container main body, it is possible to suppress the substrate from being bent or deformed regardless of the size of the substrate. The enlargement of the container body can be prevented. In addition, since the upper retainer that can be elastically deformed in the vertical direction supports the upper part of the peripheral edge of the substrate, the substrate is less likely to be displaced and the substrate is not laterally moved.

  According to the present invention, even when the amount of bending of the substrate is large, the container body can be prevented from being enlarged and the substrate can be prevented from being damaged, and the substrate can be taken out smoothly without being displaced. is there.

In addition, if a removable lid that opens and closes the front of the container body is provided, and an elastic front retainer that holds the peripheral edge of the substrate is provided on the opposite surface of the lid that faces the substrate, the substrate container is sealed. Performance can be ensured, and displacement and backlash of the substrate stored in the container body can be suppressed.
In addition, if a locking mechanism is provided on the container body instead of the lid, the lid can be made thin, the lid can be easily washed and dried, or the substrate can be moved in contact with the locking mechanism of the lid. Contamination can be suppressed.

  Further, of the lower support block and the rear support block, at least the facing surface facing the substrate of the lower support block is bent along the peripheral portion of the substrate, and the peripheral surface of the substrate is supported on the facing surface of the lower support block. If the support groove is formed, it is possible to appropriately support the substrate and prevent its displacement and backlash.

It is a whole perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is a partial section perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is a perspective explanatory view showing typically the lower support block in the embodiment of the substrate storage container concerning the present invention. It is a perspective explanatory view showing typically the upper retainer in the embodiment of the substrate storage container concerning the present invention. It is a section perspective explanatory view showing typically the back support block in the embodiment of the substrate storage container concerning the present invention. It is a perspective explanatory view showing typically a lid and a front retainer in an embodiment of a substrate storage container concerning the present invention. It is sectional explanatory drawing which shows typically the locking state of the locking mechanism in embodiment of the board | substrate storage container which concerns on this invention. It is sectional explanatory drawing which shows typically the unlocking state of the locking mechanism in embodiment of the board | substrate storage container which concerns on this invention. It is a partial section explanatory view showing typically the container main body from which the lid in the embodiment of the substrate storage container concerning the present invention was removed. It is a section explanatory view showing typically a 2nd embodiment of a substrate storage container concerning the present invention.

  Hereinafter, a preferred embodiment of a substrate storage container according to the present invention will be described with reference to the drawings. The substrate storage container in this embodiment stores a plurality of semiconductor wafers 1 as shown in FIGS. The container body 10 includes a container body 10, a detachable lid body 40 that opens and closes the front surface of the container body 10, and a locking mechanism 60 that locks the lid body 40 fitted to the front surface of the container body 10. The semiconductor wafer 1 supported vertically from the inside is taken out by a clamp hand.

  As shown in FIGS. 2 and 3, the semiconductor wafer 1 is made of, for example, a silicon wafer having a large deflection of φ450 mm sliced into a thin and round disk, and is vertically arranged in a container body 10 with 25 or 26 sheets. Aligned and stored.

  The container body 10 and the lid body 40 are each molded from a molding material containing a predetermined resin. Examples of the resin of the molding material include polycarbonate, polyether ether ketone, polyether imide, cyclic olefin resin, and alloy resins thereof having excellent mechanical properties and heat resistance. Carbon, carbon fiber, metal fiber, carbon nanotube, conductive polymer, antistatic agent, flame retardant or the like is selectively added to the resin as necessary.

  As shown in FIGS. 1 to 3 and 10, the container body 10 is injection-molded into a transparent front open box type whose front face is opened vertically with a predetermined molding material, and a lower support block 16 is mounted below the inside. In addition, a plurality of upper retainers 21 are mounted in the upper part of the interior so as to be elastically deformable in the vertical direction, and a rear support block 26 is mounted in the rear of the interior, and is horizontally mounted on the table 34 of the semiconductor processing apparatus 33. Installed.

  The container body 10 includes a vertically long bottom plate 11 in the front-rear direction, and a plurality of positioning tools 12 having a substantially M-shaped cross section or a substantially concave cross-sectional shape are provided on both sides of the front portion and the rear center of the bottom surface of the bottom plate 11. The plurality of positioning tools 12 are directly and indirectly arranged, and the container main body 10 is positioned with high accuracy by removably fitting the positioning pins 12 protruding from the table 34 of the semiconductor processing apparatus 33 from above. The

  The front peripheral edge portion 13 of the container body 10 is bent and formed in a substantially Z-shaped cross section and bulges outward, and functions to restrict excessive fitting of the lid body 40. Slots 14 for the locking mechanism 60 are respectively drilled on both sides of the front peripheral portion 13. In addition, a rotating pin for changing the posture / orientation of the container body 10 and a handle for gripping operation are selectively mounted on the outer surfaces of both side walls of the container body 10.

  The lower support block 16, the plurality of upper retainers 21, and the rear support block 26 are each molded from a molding material containing a predetermined resin. Examples of the resin of the molding material include polycarbonate, polyetherimide, polyetheretherketone, cyclic olefin resin, polybutylene terephthalate, their alloy resins, and polyester thermoplastic resins. Carbon, carbon fiber, metal fiber, carbon nanotube, conductive polymer, antistatic agent, flame retardant or the like is selectively added to the resin.

  As shown in FIGS. 2 to 4, the lower support block 16 is basically formed in a plate shape extending in the front-rear direction of the container body 10, and the rear portion 18 protrudes slightly higher than the front portion 17. It is attached to the center of the inner surface of the bottom plate 11 of the main body 10 via a mounting rib 19 and functions to support the peripheral edge 2 of the semiconductor wafer 1 vertically.

  The surface of the lower support block 16 facing the semiconductor wafer 1 is curved and formed in a semicircular arc shape in section so as to follow the peripheral edge 2 of the semiconductor wafer 1, and this concave surface has a semicircular arc in the front-rear direction of the container body 10. A plurality of support grooves 20 that extend while curving into a shape are formed to be recessed in the left-right direction, and each support groove 20 vertically supports the lower portion of the peripheral edge 2 of the semiconductor wafer 1. Each support groove 20 is formed in a substantially V-shaped cross section, and the front part is positioned on the front side of the container body 10 to have a low height (depth), and the rear part is positioned on the rear side of the container body 10. And the removal of the semiconductor wafer 1 is facilitated.

  As shown in FIGS. 3 and 5, the plurality of upper retainers 21 are juxtaposed on the inner surface of the top plate 22 of the container body 10 and arranged at a predetermined pitch in the left-right direction, and the peripheral portions 2 of the plurality of semiconductor wafers 1. Function to support each. Each upper retainer 21 includes an elongated elastic piece 23 that is attached to the inner surface of the top plate 22 of the container body 10 and extends linearly in the front-rear direction. The elastic piece 23 has a distal end portion of the semiconductor wafer 1. A holding block 24 that vertically supports the upper portion of the peripheral edge 2 is integrally formed.

  The elastic piece 23 is attached so as to gradually descend toward the front surface opened from the back wall 27 side of the container body 10, and is given flexibility to bend in the vertical direction of the container body 10. In addition, a V-groove 25 that holds the upper portion of the peripheral edge 2 of the semiconductor wafer 1 in a pressure contact state is notched on the lower surface of the holding block 24 that faces the semiconductor wafer 1.

  As shown in FIGS. 2, 3, and 6, the rear support block 26 is basically formed in an elongated block shape, and is attached to the lower part of the inner surface of the back wall 27 of the container body 10 via the mounting rib 19 to be a semiconductor. The peripheral edge 2 of the wafer 1 is supported vertically. The surface of the rear support block 26 facing the semiconductor wafer 1 is formed obliquely and its lower part protrudes in the front direction of the container body 10, and a plurality of guide support grooves 28 are respectively formed in the left and right directions above and below this surface. The guide support grooves 28 guide the lower rear portion of the peripheral edge 2 of the semiconductor wafer 1 and support it vertically, and regulate the insertion position of the semiconductor wafer 1.

  Each guide support groove 28 is formed to have a substantially V-shaped cross section for restricting the position of the semiconductor wafer 1 with the inclined surface 29 facing each other, and the deepest trough portion 30 is formed on a flat surface wider than the thickness of the semiconductor wafer 1. In such a guide support groove 28, the opposed inclined surface 29 does not contact the semiconductor wafer 1, and the deepest valley portion 30 contacts the semiconductor wafer 1.

  As shown in FIGS. 1 to 3, 7, and 10, the lid body 40 includes a vertically long casing 41 that is detachably fitted to the opened front surface of the container body 10, and an opening of the casing 41. A surface plate 50 that covers the surface is detachably vacuum-sucked by a lid opening / closing device 51 that can be moved up and down in the vicinity of the semiconductor processing device 33 and automatically attached to and removed from the front surface of the container body 10.

  The casing 41 is formed in a substantially dish-shaped cross section, and an endless gasket 42 that can be elastically deformed is fitted to the peripheral wall. The gasket 42 elastically contacts the stepped portion 15 in the front peripheral portion 13 of the container body 10. To ensure sealing performance. Engagement protrusions 43 for the locking mechanism 60 proximate to the slot 14 of the container body 10 are formed on both sides of the peripheral wall of the casing 41 in a protruding manner.

  The central portion of the facing surface 44 facing the semiconductor wafer 1 of the housing 41 is curved and recessed along the front of the peripheral portion 2 of the semiconductor wafer 1, and the rear support block 26 and the like are formed above and below the facing surface 44. An elastic front retainer 45 formed of the same molding material is disposed, and the pair of front retainers 45 elastically press and hold the upper and lower portions of the peripheral edge 2 of the semiconductor wafer 1.

  As shown in FIGS. 2, 3, 7, and 10, each front retainer 45 is disposed on the upper or lower portion of the facing surface 44 of the housing 41 and protrudes toward the back wall 27 of the container body 10. The rib 46 is configured to include a plurality of elastic pieces 47 that are obliquely stretched between the front end portion of the protruding rib 46 and the facing surface 44 of the housing 41 and are arranged in the left-right direction. Each elastic piece 47 is bent and formed in a substantially M shape having alternating crests and troughs, and holding parts 48 are integrally formed on a plurality of crests, and the peripheral edge of the semiconductor wafer 1 is formed on each holding part 48. A holding groove 49 having a substantially V-shaped cross section for holding the portion 2 vertically is formed as a recess.

  As shown in FIGS. 1, 8, and 9, the locking mechanism 60 includes slide shafts 61, which are operated from the outside by the lid opening / closing device 51, on both sides near the front peripheral edge 13 of the container body 10. Engaging claws 62 are integrally formed on the peripheral surface of each slide shaft 61 so as to penetrate the slot 14 of the container body 10 from the outside and engage with the engaging protrusion 43 of the lid 40 from the front side. The engaging claws 62 are bent and formed in a substantially L shape. Each slide shaft 61 is formed to extend in the vertical direction and is slidable in the same direction, and is fitted with a coil spring 63 for elastic biasing. The coil spring 63 always slides downward to engage the engaging claw 62. It functions to engage with the engaging protrusion 43 of the lid 40.

  In such a locking mechanism 60, when the lid 40 is attached, the slide shaft 61 is slid downward by the coil spring 63 to engage the engagement claw 62 and the engagement protrusion 43 of the lid 40 (see FIG. 8). When the lid 40 is removed, the slide shaft 61 is slid upward to release the engagement between the engagement claw 62 and the engagement protrusion 43 of the lid 40 (see FIG. 9), and the lid 40 can be removed. To do.

  Although not shown, the clamp hand includes, for example, a substantially Y-shaped clamp arm that can hold the semiconductor wafer 1 vertically, and is rotatably mounted on a dedicated robot (not shown) to move forward and backward with respect to the container body 10.

  In the above configuration, when the semiconductor wafer 1 supported vertically from the container main body 10 from which the lid 40 of the substrate storage container is removed is taken out by the clamp hand, the clamp hand is horizontally placed in the front of the container main body 10 opened. The peripheral edge 2 of the semiconductor wafer 1 is held by being inserted. When the semiconductor wafer 1 is held by the clamp hand in this way, the clamp hand is moved slightly upward to avoid interference between the semiconductor wafer 1 and the lower support block 16, and the clamp hand is pulled out from the front of the container body 10 and retracted. Then, the vertically supported semiconductor wafer 1 can be taken out easily and reliably.

  When the semiconductor wafer 1 is taken out, each upper retainer 21 is gradually bent toward the inner surface of the top plate 22 of the container body 10 to contribute to the smooth take-out of the semiconductor wafer 1.

  After retreating, the clamp hand rotates to change the posture of the semiconductor wafer 1 from a standing state to a horizontal state, and inserts the semiconductor wafer 1 into a container body (not shown) of the substrate storage container for the process. Store. Thereafter, the semiconductor wafer 1 is appropriately taken out from the in-process substrate storage container and subjected to various processing and processing.

  According to the above configuration, since the semiconductor wafer 1 is supported upright in the container body 10, even if the semiconductor wafer 1 is a φ450 mm type having a large deflection amount, the semiconductor wafer 1 is bent by its own weight. In addition, since the interval between the adjacent semiconductor wafers 1 and 1 can be narrowed, the container body 10 can be prevented from being enlarged, and the space for storage and transportation can be effectively used. Further, by changing the support posture of the semiconductor wafer 1, it is possible to prevent the semiconductor wafer 1 having a large amount of bending from being easily damaged by vibration.

  Further, since the semiconductor wafer 1 is supported by the support groove 20 of the lower support block 16 and is held at a fixed position, the semiconductor wafer 1 is less likely to come into contact with the adjacent semiconductor wafer 1 in an inclined direction, and the semiconductor wafer 1 The prevention of contamination can be greatly expected. Since the upper retainer 21 that can swing in the vertical direction is attached to the inner surface of the top plate 22 of the container body 10 and elastically contacted above the peripheral edge 2 of the semiconductor wafer 1. There is no displacement in the direction, the semiconductor wafer 1 does not sway, and the handling of the robot is not hindered.

  In addition, since the position of the semiconductor wafer 1 can be prevented by the upper retainer 21, the peripheral edge 2 of the semiconductor wafer 1 is tightly fitted in the support groove 20 of the lower support block 16 and the guide support groove 28 of the rear support block 26. Therefore, it is possible to suppress a large stress from acting on the semiconductor wafer 1 through this.

  Further, since the semiconductor wafer 1 is not lifted by sliding the inclined surfaces on both sides inside the container body 10 by the pair of front retainers 45, the semiconductor wafer 1 is not removed from the container body 10 even if the lid 40 is removed. It is possible to effectively eliminate the possibility of being caught due to frictional resistance in the middle of the 10 inclined surfaces and being displaced and hindering the removal or damage. Furthermore, since the locking mechanism 60 is attached to the vicinity of the front peripheral portion 13 of the container body 10 instead of the lid 40, the lid 40 can be formed thin, the lid 40 can be easily washed and dried, and the semiconductor wafer 1 Contamination can be suppressed.

  FIG. 11 shows a second embodiment of the present invention. In this case, the elastic piece 23 of the upper retainer 21 is gradually bent from the front side of the container body 10 toward the back wall 27 side. The elastic piece 23 is attached so as to be lowered while being flexible so that it can be bent in the vertical direction of the container body 10. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In the present embodiment, the same effect as the above embodiment can be expected, and the elastic piece 23 of the upper retainer 21 is curved to generate rigidity, so that the reaction force of the elastic piece 23 ensures that the semiconductor wafer 1 is securely attached. Obviously it can be retained.

In the above embodiment, the plurality of positioning tools 12 are disposed on the bottom plate 11 of the container body 10. However, a bottom plate is attached to the bottom plate 11 of the container body 10, and the plurality of positioning tools 12 are disposed on the bottom plate. May be. In addition, the rear support block 26 may be mounted not on the lower part of the inner surface of the back wall 27 of the container body 10 but on the center of the inner surface of the back wall 27 or the like. In this case, the rear support block 26 is shaped according to the lower support block 16, and the opposing surface of the rear support block 26 facing the semiconductor wafer 1 is curved along the peripheral edge of the semiconductor wafer 1. A support groove that supports the peripheral edge of the semiconductor wafer 1 may be formed on the facing surface.

  Further, the upper or lower portion of the peripheral edge 2 of the semiconductor wafer 1 may be elastically held by one front retainer 45 instead of the pair of front retainers 45. The holding portion 48 of the front retainer 45 may be increased or decreased as necessary. The holding groove 49 of the front retainer 45 can be formed to have a substantially U-shaped cross section or a substantially Y-shaped cross section. Further, the locking mechanism 60 is supported by the lid body 40 and is rotated from the outside, and a plurality of advancing and retracting bodies connected to the rotary body and advanced and retracted in the inner and outer directions of the lid body 40 with the rotation. An engaging claw provided on each forward / backward moving body and penetrating the peripheral wall of the lid body 40 and engaging with the front peripheral edge portion 13 of the container main body 10 can be used.

  The locking mechanism 60 is composed of a rotating body and an advance / retreat bar that is connected to the rotating body and moves forward and backward in the direction of the lid 40 along with the rotation. The locking mechanism 60 is built in the lid 40 so as to be operable from the outside. A latch mechanism or a structure in which an engaging claw is engaged in the front peripheral edge portion 13 of the container main body 10 using a rack and a pinion can be used. Further, the locking mechanism 60 is detachably attached to the clamp part of the container body 10 rotatably supported by the plurality of clamp parts protruding from the outer periphery of the front peripheral part 13 of the container body 10 and the peripheral wall of the lid body 40. It is also possible to comprise from the clamp piece engaged with.

1 Semiconductor wafer (substrate)
2 peripheral edge 10 container main body 11 bottom plate 13 front peripheral edge 14 slot 16 lower support block 17 front 18 rear 20 support groove 21 upper retainer 22 top plate 23 elastic piece 24 holding block 25 V groove 26 rear support block 27 back wall 28 Guide support groove 40 Lid 41 Housing 43 Engagement projection 44 Opposing surface 45 Front retainer 46 Projection rib 47 Elastic piece 48 Holding part 49 Holding groove 50 Surface plate 60 Locking mechanism 61 Slide shaft 62 Engaging claw 63 Coil spring (spring member)

Claims (4)

  A substrate storage container for storing a substrate in a container body, wherein the container body is formed into a front open box type with an open front, and a lower support block for vertically supporting the lower part of the peripheral edge of the substrate is provided below the inside of the container body An upper retainer that vertically supports the upper edge of the peripheral edge of the substrate is provided above the inside of the container body so as to be elastically deformable in the vertical direction, and the rear of the peripheral edge of the substrate is vertically supported at the rear inside the container main body. A substrate storage container provided with a rear support block.   2. The substrate storage container according to claim 1, further comprising a detachable lid that opens and closes the front of the container body, and an elastic front retainer that holds the peripheral edge of the substrate is provided on a surface of the lid facing the substrate.   A locking mechanism that locks the lid fitted on the front surface of the container body is provided. The locking mechanism is provided on the container body, and engages with the peripheral wall of the lid body through the front peripheral edge of the container body. 3. The substrate storage container according to claim 2, further comprising a claw and a spring member that engages the engaging claw with the peripheral wall of the lid.   Of the lower support block and the rear support block, at least a facing surface facing the substrate of the lower support block is bent along the peripheral edge of the substrate, and a support groove for supporting the peripheral edge of the substrate is formed on the facing surface of the lower support block. The substrate storage container according to claim 1, 2, or 3.

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