JP2010182746A - Light-emitting device, and light-emitting module and electrical device including the light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the adhesion of a sealing resin of a light-emitting device to that of the other light-emitting device even if the surface of the sealing resin is flat or protrusive. <P>SOLUTION: The light-emitting device 60 includes: a resin vessel 61 where a recess 61a formed at an opening surface 61c formed in a planar shape and a projection 61b formed continuous to the opening surface 61c in the same way are formed integrally; a lead 62 for an anode and a lead 63 for a cathode each composed of a lead frame integrated with the resin vessel 61; a semiconductor light-emitting element 64 mounted to a bottom face 70 of the recess 61a; and a sealing resin 65 provided while covering the recess 61a. In this case, the height (h) of the projection 61b from the opening surface 61c is set higher than the amount of a blister (d) of the top of the sealing resin 65. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device using a light emitting element, a light emitting module, and an electric device including the light emitting device.

In recent years, the use of semiconductor light emitting diodes (LEDs) for backlights of liquid crystal displays has led to dramatic increases in LED production. And adoption of LED is also examined in other illumination fields.
Here, the LED package is a light emitting device including a semiconductor light emitting element (LED), and is disposed, for example, so as to expose a lead frame inside a concave portion of a white resin case having a concave portion, and inside the concave portion. The semiconductor light emitting element is attached to the exposed lead frame, and these are electrically connected, and a sealing resin is formed so as to cover the semiconductor light emitting element. And sealing resin hits the part which the light from LED permeate | transmits.

  Patent Document 1 describes the structure of the LED package described above. In this, as a resin-encapsulated structure of a light emitting diode, a hole for mounting a light emitting diode element (LED element) is formed so as to penetrate from one side (back side) to the other side (front side). A printed circuit board is fixed so as to block one opening of the light reflecting case that is radially expanded, and the LED element die-bonded to the printed circuit board is sealed with an epoxy resin including a bonding wire.

  However, there are strict standards for color variations across the display surface of a liquid crystal display. For example, if it is defined as the chromaticity range of the CIE Yxy color system, it is required to suppress variations of about ± 0.008 in each of x and y. In order to keep the color variation on the entire display surface of the display within the aforementioned range, the light emitting device (LED package) also needs to be included in the range.

  For this reason, if the light emitting device is measured one by one with a handler tester or the like and a light emitting device whose characteristics deviate from the required range is found, the LED package is removed.

JP-A-6-53553

  By the way, since the sealing resin of the light emitting device is rich in adhesiveness (tack), it easily adheres (sticks easily) to sealing resins of other light emitting devices, and once attached, it is difficult to separate. In addition, since the sealing resin of the light emitting device is soft, the attached portions, particularly the central portion of the surface of the sealing resin, are damaged. A light emitting device having such a scratched portion cannot be used due to a decrease in luminance or the like, resulting in a decrease in yield.

On the other hand, in the handler tester, the light emitting device is thrown into the parts feeder provided in the handler tester as a lump. The light emitting devices are aligned while going up the spiral slide provided in the parts feeder. At this time, the parts feeder applies vibrations to separate the light emitting devices individually. As a result, the light emitting devices move around, and the sealing resins of the light emitting devices are more likely to adhere to each other.
Therefore, in order to prevent the sealing resins from adhering to each other, the surface of the sealing resin of the light emitting device has been recessed by 20 μm to 30 μm at the center.
However, if the surface of the sealing resin is recessed, the emitted light from the LED spreads at the portion that has exited from the surface of the sealing resin, and there is a problem that the light extraction efficiency is reduced.

  The present invention provides a light emitting device capable of suppressing the sealing resin of a light emitting device (LED package) from adhering to the sealing resin of another light emitting device even when the surface of the sealing resin is flat or convex. Objective.

  For such a purpose, a light emitting device to which the present invention is applied is a resin in which an opening surface formed in a planar shape, a recess formed in the opening surface, and a protrusion formed on the opening surface are formed. A container, a conductor formed in the resin container, a light emitting element provided inside the recess of the resin container and electrically connected to the conductor, and a recess in the resin container, And a sealing resin for sealing the light emitting element, wherein the height of the convex portion from the opening surface of the resin container is larger than the height from the opening surface to the top of the sealing resin. To do.

In the light emitting device of the present invention, it is preferable that the convex portion is formed continuously from the opening surface (the convex portion is formed on the opening surface) and is integrally formed with the resin container. Further, the convex portion can be characterized in that it is an annular projection formed continuously or discontinuously around the opening surface.
Furthermore, the convex portion may be a plate-like protrusion formed on the opening surface. Further, the convex portion may be a columnar projection formed on the opening surface.
Furthermore, the present invention can be characterized in that the sealing resin is composed of a silicone resin.

From another viewpoint, the light emitting module to which the present invention is applied includes a substrate and a plurality of light emitting devices attached to the substrate. The light emitting device includes an opening surface formed in a planar shape, an opening A resin container in which a concave portion formed on the surface and a convex portion formed on the opening surface are formed; a conductor portion formed in the resin container; and provided inside the concave portion of the resin container. And a sealing resin that is formed in a flat or convex shape with respect to the opening surface in the concave portion of the resin container and seals the light emitting element, the convex portion extending from the opening surface of the resin container Is characterized by being larger than the height from the opening surface to the top of the sealing resin.
Furthermore, the present invention provides an electric device including the light emitting device described above.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that sealing resin of a light-emitting device adheres with sealing resin of another light-emitting device.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
<Embodiment 1>
FIG. 1 is an example of an overall configuration of a liquid crystal display device to which the present embodiment is applied. The liquid crystal display device includes a liquid crystal display module 50 and a backlight device 10 provided on the back side (lower side in FIG. 1) of the liquid crystal display module 50.

  The backlight device 10 includes a backlight frame 11 and a plurality of light emitting modules 12 in which semiconductor light emitting elements are arranged and accommodated in the backlight frame 11. In addition, the backlight device 10 is a laminated body of optical films, and has a diffusion plate 13 that is a plate (or film) that scatters and diffuses light in order to make the entire surface uniform brightness, and a light collecting effect forward. Prism sheets 14 and 15 are provided. Further, a diffusion / reflection type brightness enhancement film 16 for improving the brightness is provided as necessary.

  On the other hand, the liquid crystal display module 50 is laminated on a liquid crystal panel 51 formed by sandwiching liquid crystal between two glass substrates, and each glass substrate of the liquid crystal panel 51, and restricts the vibration direction of light to a certain direction. Polarizing plates 52 and 53. Furthermore, peripheral members such as a driving LSI (not shown) are also mounted on the liquid crystal display device.

  The liquid crystal panel 51 as an example of the display panel is configured to include various components not shown. For example, two glass substrates are provided with a display electrode (not shown), an active element such as a thin film transistor (TFT), a liquid crystal, a spacer, a sealant, an alignment film, a common electrode, a protective film, a color filter, and the like. .

  FIG. 2 is a diagram illustrating an example of the structure of the backlight device 10. Here, FIG. 2A is a top view of the backlight frame 11 to which the light emitting module 12 is mounted as seen from the liquid crystal display module 50 side shown in FIG. 1, and FIG. 2B is a plan view of FIG. It is IIB-IIB sectional drawing of. In the present embodiment, a direct type backlight structure in which a light source is placed directly under the back surface of the liquid crystal display module 50 is employed. In this backlight structure, the light emitting devices 60 having the light emitting elements are arranged substantially evenly with respect to the entire back surface of the liquid crystal display module 50. The light emitting device 60 used in the present embodiment is generally called an LED package.

  The backlight frame 11 forms a housing structure made of, for example, aluminum, magnesium, iron, or a metal alloy containing them. And the polyester film etc. which have the performance of white high reflection, for example are affixed inside the housing | casing structure, and it functions also as a reflector. The casing structure includes a back surface portion 11a provided corresponding to the size of the liquid crystal display module 50 and side surface portions 11b surrounding the four corners of the back surface portion 11a. And the heat-radiation sheet 18 can be provided on this back surface part 11a.

  In the example shown in FIG. 2, a plurality of light emitting modules 12 (eight in this example) are provided. Each light emitting module 12 is fixed to the backlight frame 11 via a heat dissipating sheet 18 by a plurality of screws 17 (two in this example for one light emitting module 12).

  The light emitting module 12 includes a wiring board 20 as an example of a board and a plurality (28 in this example) of light emitting devices 60 mounted on the wiring board 20.

  FIG. 3 is a diagram illustrating an example of the configuration of the light emitting device 60 used in the present embodiment. Here, FIG. 3A shows a top view of the light emitting device 60, and FIG. 3B shows a IIIB-IIIB sectional view of FIG.

The light emitting device 60 includes a resin container 61 in which a concave portion 61a formed on a flat opening surface 61c and a convex portion 61b formed continuously with the opening surface 61c are integrally formed. Anode lead portion 62 and cathode lead portion 63 made of a lead frame integrated with resin container 61, semiconductor light emitting element 64 as an example of a light emitting element attached to bottom surface 70 of recess 61a, and recess 61a are covered. And a sealing resin 65 provided on the surface. In FIG. 3A, the description of the sealing resin 65 is omitted.
Here, the opening surface 61c of the resin container 61 refers to a planar surface on which the concave portion 61a is formed, excluding the convex portion 61b. And the inner side surrounded by the edge of the recessed part 61a in the opening surface 61c is called the opening part 71. FIG. The surface on the opening surface 61 c side of the resin container 61 is referred to as the upper surface of the resin container 61.

  The resin container 61 is formed by injection-molding a thermoplastic resin (referred to as white resin in the following description) containing a white pigment in a metal lead portion including the anode lead portion 62 and the cathode lead portion 63. ing.

  In addition, since there are a plurality of processes that require temperature such as solder reflow in the manufacturing process, a material that sufficiently considers heat resistance is selected for the white resin. PPA (polyphthalamide) is most commonly used as the base resin, but may be a liquid crystal polymer, an epoxy resin, polystyrene, or the like. Among these, in this embodiment, nylon 4T, nylon 6T, nylon 6I, nylon 9T, and nylon M5T, which are copolymers of diamine and isophthalic acid or terephthalic acid, can be particularly preferably used as PPA.

  The recess 61 a provided in the resin container 61 includes a circular bottom surface 70, a circular opening 71, and a wall surface 80 that rises from the periphery of the bottom surface 70 toward the opening 71. I have. Here, the bottom surface 70 is formed by the anode lead portion 62 and the cathode lead portion 63 exposed in the recess 61a, and the white resin in the resin container 61 in the gap between the anode lead portion 62 and the cathode lead portion 63. It is configured. However, more than half of the bottom surface 70 is occupied by the anode lead portion 62 and the cathode lead portion 63. On the other hand, the wall surface 80 is made of a white resin constituting the resin container 61. The shape of the bottom surface 70 may be any of a circle, a rectangle, an ellipse, and a polygon. Further, the shape of the opening 71 may be any of a circle, a rectangle, an ellipse, and a polygon, and may be the same as the shape of the bottom surface, or may be different as in the present embodiment.

The convex portion 61b provided on the resin container 61 is an annular protrusion provided in an annular shape so as to rise from the opening surface 61c and surround the opening surface 61c. And the convex part 61b is height h from the opening surface 61c. Also, from the edge _{B 1} of the concave portion 61a in the aperture plane 61c (also the edge of the opening 71), until the rising _{B 2} of the convex portion 61b of the opening surface 61c is a distance w.
Furthermore, the convex portion 61 b is provided at a position that is almost invisible in the field of view when the opening 71 is looked up from the semiconductor light emitting element 64. By doing in this way, the convex part 61b can avoid affecting the characteristics, such as the light output of the light-emitting device 60. FIG.
Here, it referred to as the angle viewed Allegiance edge B ₁ of the recessed portion 61a from the semiconductor light emitting element 64 and the elevation angle theta.

  The anode lead part 62 and the cathode lead part 63 as an example of the conductor part are held while being sandwiched in the resin container 61, and the other part is exposed to the outside of the resin container 61. And serves as a terminal for applying a current to the semiconductor light emitting element 64. Assuming surface mounting, as shown in FIG. 3, the anode lead portion 62 and the cathode lead portion 63 are bent to the back side of the resin container 61 and the tips thereof are disposed at the bottom of the resin container 61. Is desirable.

  The anode lead portion 62 and the cathode lead portion 63, that is, the lead frame are metal plates having a thickness of about 0.1 mm to 0.5 mm, and are based on a metal conductor such as a copper alloy, and the surface thereof is silver. A silver plating layer is formed by plating.

The semiconductor light emitting element 64 is bonded and fixed to the cathode lead portion 63 disposed on the bottom surface 70 of the recess 61a with a die bond agent made of silicone resin or epoxy resin.
The semiconductor light emitting device 64 has an n-type electrode and a p-type electrode, and the p-type electrode is connected to the anode lead portion 62 and the n-type electrode is connected to the cathode lead portion 63 via bonding wires. Has been. In the light emitting device 60 used in the present embodiment, as shown in FIG. 3A, the semiconductor light emitting element 64 is attached to the substantially central portion of the bottom surface 70 having a circular shape.

  The semiconductor light emitting device 64 emits blue light having a main emission peak in a wavelength region of 430 nm or more and 500 nm or less, and includes a seed layer made of AlN formed on a sapphire substrate, and a bottom layer formed on the seed layer. It includes at least a base layer and a laminated semiconductor layer mainly composed of GaN. The laminated semiconductor layer is configured by laminating a base layer, an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer in this order from the substrate side.

The semiconductor light emitting element 64 may be one that emits red light made of GaAlAs or GaAlInP or one that emits green light made of GaP. Alternatively, the phosphor mixed in the sealing resin 65 may emit light by emitting blue light to make it white.
In this case, for example, the sealing resin 65 includes two or more types of phosphors (hereinafter also referred to as phosphor powder) that absorb blue light emitted from the semiconductor light emitting element 64 and emit light having a longer wavelength, and phosphors. And a transparent resin containing the powder in a uniformly dispersed state. In this example, a green phosphor that absorbs blue light and emits green light and a red phosphor that absorbs blue light and emits red light are included. A known silicate phosphor (BaSiO ₄ : Eu ²⁺ ) is preferably used as the green phosphor, and a known nitride phosphor (CaAlSiN ₃ : Eu ²⁺ ) is used as the red phosphor.
Since the red phosphor is also excited by the light emitted from the green phosphor, white light is emitted by adjusting the ratio of the green and red phosphors by adjusting the chromaticity. In lighting applications, in order to improve the color rendering (the degree that looks the same as the color seen under sunlight), the wavelength distribution is adjusted as much as possible to that of sunlight. On the other hand, in the case of a backlight application of a liquid crystal display device, the color reproduction range needs to be as wide as possible on the three chromaticity coordinates of blue, green and red. That is, it is important that the color purity is as high as possible. For this purpose, adjustments such as making the wavelength distribution of the three primary colors as sharp as possible are performed.

The sealing resin 65 is made of a transparent resin. And as transparent resin which comprises the sealing resin 65, transparent various resin in a visible region may be applied.
For example, as the transparent resin 65, a curable resin that seals so as to cover the concave portion, a curing agent that cures the curable resin, and further blended as necessary, for example, an antioxidant, a discoloration preventing agent, a photodegradation preventing agent, Those containing reactive diluents, inorganic fillers, flame retardants, organic solvents and the like are preferred.
Specific examples of the curable resin include silicone resin, epoxy resin, epoxy silicone hybrid resin, acrylic resin, and polyimide resin. Among these, from the viewpoint of heat resistance, a silicone resin and an epoxy resin are preferable, and a silicone resin is particularly preferable.
Further, the sealing resin 65 is provided with an emission surface 65c for emitting light. In this example, as shown in FIG. 3B, an emission surface 65 c is formed on the opening 71 side of the resin container 61.

Further, in the light emitting device 60, as shown in FIG. 3B, the central portion of the emission surface 65c swells more convexly than the upper surface of the resin container 61. The amount of swelling d is 20 μm to 100 μm from the opening surface 61 c. Swelling amount d becomes the difference of the height of the edge B ₁ of the opening 71 of the resin vessel 61, the height of the highest portion of the exit surface 65c (sealing resin 65). Here, when the height of the edge B ₁ of the opening 71 of the resin vessel 61 as a reference (0), the semiconductor light emitting element 64 as a lower side, the side closer to the semiconductor light emitting element 64 minus - as () Yes. Therefore, the range in which the bulge amount d is 20 μm to 100 μm from the opening surface 61 c means that the height of the topmost portion of the emission surface 65 c is an opening when the height of the edge B ₁ of the opening 71 of the resin container 61 is 0 μm. It means that it is located on the opposite side to the semiconductor light emitting element 64 in the range of 20 μm to 100 μm from the surface 61c.
In addition, the center part of the output surface 65c may be planar shape with a small bulge.

The bulge amount d is set by virtually setting an extended surface L (which coincides with the opening surface 61c) of the edge of the opening 71 of the resin container 61, and A is the center point of the sealing resin 65 cured in the recess 61a. , From the distance between the point A and the extended surface L. Actual measurement can be performed with a laser displacement meter (for example, ZSHLD2 manufactured by OMRON).
In addition, the center part of the output surface 65c may be planar shape with a small bulge.

In the light emitting device 60, the horizontal D1 not including the lead frame is, for example, 3.2 mm, the vertical D2 is, for example, 2.8 mm, and the height H is, for example, 1.9 mm. Furthermore, the elevation angle θ is 45 °, for example. And the height h of the convex part 61b from the opening surface 61c is 0.2 mm, for example. Distance w from the edge _{B 1} of the opening 71 to the leading edge _{B 2} of the convex portion 61b is, for example 0.1 mm.
Thus, the height h of the convex portion 61 b from the opening surface 61 c is set to be larger than the bulging amount d of the sealing resin 65. That is, when the semiconductor light emitting element 64 is on the lower side, the height h of the convex portion 61b from the opening surface 61c of the resin container 61 is larger than the height d from the opening surface 61c to the topmost portion of the sealing resin 65. become.

Now, the light emission operation of the light emitting device 60 shown in FIG. 3 will be described.
When a current is passed through the semiconductor light emitting device 64 with the anode lead 62 as the positive electrode and the cathode lead 63 as the negative electrode, the semiconductor light emitting device 64 outputs blue light. The blue light output from the semiconductor light emitting element 64 travels through the sealing resin 65 and is emitted to the outside from the emission surface 65 c directly or after being reflected by the bottom surface 70 or the wall surface 80. However, part of the light traveling toward the emission surface 65c is reflected by the emission surface 65c and travels through the sealing resin 65 again.

  Among these, the light directed toward the bottom surface 70 and the wall surface 80 is repeatedly reflected by the silver plating layer and the white resin constituting the bottom surface 70 and the wall surface 80, and finally exits to the emission surface 65c.

  In the present embodiment, the resin container 61 is made of a white resin that absorbs little light, and a silver plating layer is formed on the surfaces of the anode lead part 62 and the cathode lead part 63 constituting the lead frame, The light absorptance of visible light in the recess 61a is reduced.

FIG. 4 is a diagram illustrating an example of a method for manufacturing the light emitting device 60.
First, a white resin is injection-molded into a lead frame in which the anode lead part 62 and the cathode lead part 63 are integrated to form a resin container 61 having a concave part 61a and a convex part 61b. Next, the semiconductor light emitting element 64 is bonded and fixed onto the cathode lead portion 63 exposed on the bottom surface 70 of the concave portion 61a of the resin container 61, and the p-type electrode, the n-type electrode of the semiconductor light emitting element 64, and the anode lead are bonded with bonding wires. The part 62 and the cathode lead part 63 are connected to each other.

Next, the uncured transparent resin R is filled in the recess 61a. At that time, the semiconductor light emitting element 64 and the bonding wire are covered with an uncured transparent resin R.
At this time, the surface of the transparent resin R filled in the concave portion 61a has a convex shape in which the central portion swells due to surface tension.

  The filling of the uncured transparent resin R into the recess 61a of the resin container 61 may be performed by a podding method using a discharge device. This discharge device includes a discharge nozzle N that discharges a transparent resin R and a control unit (not shown).

  Next, the uncured transparent resin R is cured to form the sealing resin 65. The curing process may be performed by heating, for example. Thereafter, the lead frame is cut into an anode lead part 62 and a cathode lead part 63 and the lead frame is bent, whereby the light emitting device 60 is obtained.

Here, the reason why the light emitting device 60 of the present embodiment can suppress the adhesion between the sealing resins 65 of the light emitting device 60 will be described.
FIG. 5 is a schematic diagram of the handler tester 100.
The handler tester 100 includes a parts feeder 110 that aligns the light emitting device 60, a light emitting device tester 120 that measures the characteristics of the light emitting device 60, and an anode lead 62 and a cathode lead 63 of the light emitting device 60. A test socket 122 for connecting to the wiring of the tester 120, a taping machine 140 for mounting the light emitting device 60 having a predetermined characteristic range on the carrier tape 141, the light emitting device 60 from the parts feeder 110 to the test socket 122, and A transport head 130 for transporting the test socket 122 to the taping machine 140. Furthermore, the handler tester 100 includes a discard box 135 for discarding the light emitting device 60 that does not fall within a predetermined characteristic range.

  Here, the light emitting device tester 120 measures, for example, electrical characteristics such as an IV characteristic of the light emitting device 60 and optical characteristics such as a light emission wavelength and light distribution.

The parts feeder 110 includes a bowl part 111 having a slide provided inside in a spiral shape, and a controller part 112 that applies vibration to the bowl part 111.
Then, the parts feeder 110 sorts the light emitting devices 60 thrown in a lump while giving vibrations, and pushes up a spirally provided slide from the bottom upward to align the light emitting devices 60 in the same direction. .

  The aligned light emitting devices 60 are sequentially inserted into the test socket 122 by the transport head 130, and the electrical characteristics and optical characteristics are measured by the light emitting device tester 120. Then, only the light emitting device 60 having a characteristic in a predetermined range is sent to the taping machine 140 by the transport head 130. And it mounts on the carrier tape 141 provided with the emboss.

  Thereafter, the tape on which the light emitting device 60 is mounted is shipped to an assemble maker that manufactures the backlight device 10. Then, the light emitting device 60 mounted on the carrier tape 141 and wound around the reel 142 by an automatic mounter or the like is detached from the carrier tape 141 and mounted on the wiring board 20.

Note that the handler tester 100 puts the light emitting device 60 that does not exhibit characteristics in a predetermined range into the disposal box 135.
The handler tester 100 may set a plurality of light emission wavelengths, for example, as the center of the light emitting device 60, and classify the light emitting devices 60 into a plurality of groups based on these settings.

  FIG. 6 is a diagram for explaining the reason why it is possible to suppress the adhesion of the sealing resin 65 between the light emitting devices 60 in the present embodiment. FIG. 6A shows the case of the light emitting device 60 without the convex portion 61b, and FIG. 6B shows the case of the light emitting device 60 with the convex portion 61b.

First, the case of the light emitting device 60 not provided with the convex portion 61b will be described with reference to FIG.
Now, since the light emitting devices 60 are put in the parts feeder 110 in a lump, the directions of the respective light emitting devices 60 are random. For this reason, the sealing resin 65 of the light emitting device 60 may adhere to the sealing resin 65 of another light emitting device 60. In particular, when the sealing resin 65 is in a convex state (d> 0) in a direction away from the semiconductor light emitting element 64 from the opening surface 61c, the sealing resin 65 of the light emitting device 60 and the sealing resin of another light emitting device 60 are used. 65 is easy to contact.

In particular, in the parts feeder 110, since the vibration is given, the light-emitting device 60 is constantly moving. As a result, the possibility that the sealing resin 65 of the light emitting device 60 faces the sealing resin 65 of another light emitting device 60 is increased.
Once the sealing resins 65 of the light emitting device 60 adhere to each other, they are not easily separated due to the high tackiness of the sealing resin 65 itself. In an extreme case, it is necessary to remove the attached light emitting device 60 manually.
In particular, this tendency becomes more pronounced when the sealing resin 65 is a silicone resin that is softer and has a higher tack (tack) property than when the sealing resin 65 is an epoxy resin.

Next, as shown in FIG. 6B, the case of the light emitting device 60 provided with the convex portion 61b will be described.
When there are the convex portions 61b, when the two light emitting devices 60 face each other on the sealing resin 65 side, the height from the opening surface 61c to the topmost portion of the sealing resin 65 is the convex portion from the opening surface 61c. Since it is smaller than the height to the topmost part of 61b, the sealing resin 65 of each light-emitting device 60 does not contact each other.

Even if the two light-emitting devices 60 face each other at a slightly shifted position that is not directly facing each other, the convex portion 61b prevents the sealing resin 65 from contacting each other. At this time, even if the sealing resin 65 comes into contact, the convex portion 61b is formed. And since the convex part 61b (PPA) has weak adhesiveness, even if the sealing resin 65 and the convex part 61b contact, it can leave | separate easily. For this reason, compared with the case where the sealing resins 65 are in contact with each other, the effect of reducing scratches on the topmost portion of the sealing resin 65 is obtained. The same applies to the case where the sealing resin 65 contacts another portion of the resin container 61, for example, the side surface of the resin container 61 other than the convex portion 61b.
The same applies when the sealing resin 65 comes into contact with the anode lead portion 62 and the cathode lead portion 63. This is because the anode lead portion 62 and the cathode lead portion 63 also have low adhesiveness.

<Embodiment 2>
FIG. 7 is a diagram for explaining the configuration of the light emitting device 60 to which the present exemplary embodiment is applied. Here, FIG. 7A shows a top view of the light emitting device 60, and FIG. 7B shows a sectional view taken along the line VIIB-VIIB of FIG. 7A.

The basic configuration of the light emitting device 60 is substantially the same as that used in the first embodiment. However, the convex portion 61 b is formed continuously on the opening surface 61 c, and is a plate-like protrusion provided along the vertical edge of the light emitting device 60 with the opening portion 71 sandwiched between two sides of the upper surface of the resin container 61. It is.
In the light emitting device 60, the horizontal D1 not including the lead frame is, for example, 3.2 mm, the vertical D2 is, for example, 2.8 mm, and the height H is, for example, 1.9 mm. Furthermore, the elevation angle θ is 45 °, for example. And the height h of the convex part 61b from the opening surface 61c is 0.2 mm, for example. The shortest distance from the edge _{B 1} to the leading edge _{B 2} of the convex portion 61b of the opening 71 w (distance in VIIB-VIIB section in FIG. 7 (a) w) is, for example 0.1 mm.
Even if it does in this way, it can suppress that sealing resin 65 of the resin container 61 mutually contacts.

<Embodiment 3>
FIG. 8 is a diagram illustrating an example of the configuration of the light emitting device 60 to which the exemplary embodiment is applied. Here, FIG. 8A shows a top view of the light emitting device 60, and FIG. 8B shows a VIIIB-VIIIB cross-sectional view of FIG. 8A.

The basic configuration of the light emitting device 60 is substantially the same as that used in the first embodiment. However, the convex portions 61 b are columnar protrusions having a flat surface provided at two corners of the upper surface of the resin container 61.
In the light emitting device 60, the horizontal D1 not including the lead frame is, for example, 3.2 mm, the vertical D2 is, for example, 2.8 mm, and the height H is, for example, 1.9 mm. Furthermore, the elevation angle θ is 45 °, for example. And the height h of the convex part 61b from the opening surface 61c is 0.2 mm, for example. The shortest distance to the rising _{B 2} of the convex portion 61b from the edge _{B 1} of the opening 71 w (distance in VIIIB-VIIIB section of FIG. 8 (a) w) is, for example 0.1 mm.

In the present embodiment, since the proportion of the convex portion 61b in the upper surface of the resin container 61 is smaller than that in the first or second embodiment, the sealing resin 65 of the light emitting device 60 is used for other light emitting devices. The possibility of coming into contact with 60 sealing resins 65 will increase.
However, even with the convex portion 61b having such a shape, the opportunity for the sealing resins 65 of the resin container 61 to contact each other can be reduced. This structure is effective when the convex portion 61b is not provided on the upper surface of the resin container 61 and the convex portion 61b cannot be provided as in the first or second embodiment.

<Embodiment 4>
FIG. 9 is a diagram illustrating an example of a configuration of a light emitting device 60 to which the present exemplary embodiment is applied. Here, FIG. 9A shows a top view of the light emitting device 60, and FIG. 9B shows an IXB-IXB sectional view of FIG. 9A.

  The basic configuration of the light emitting device 60 is substantially the same as that used in the first embodiment. However, the protrusions 61 b in the present embodiment are columnar protrusions provided at three corners on the upper surface of the resin container 61. The inner surface of these convex portions 61b is formed in a shape corresponding to a cylindrical side surface with the semiconductor light emitting element 64 as the center, and the outer surface of these convex portions 61b is formed in a shape obtained by extending the outer wall of the resin container 61. Has been. And the upper surface of these convex parts 61b is formed flat. Therefore, the convex portion 61b in the present embodiment is a columnar projection having a complicated side surface. This structure is effective when the area where the convex portion 61b is provided on the upper surface of the resin container 61 is small.

In the light emitting device 60, the horizontal D1 not including the lead frame is, for example, 3.2 mm, the vertical D2 is, for example, 2.8 mm, and the height H is, for example, 1.9 mm. Furthermore, the elevation angle θ is 45 °, for example. And the height h of the convex part 61b from the opening surface 61c is 0.2 mm, for example. The distance w to rising _{B 2} of the convex portion 61b from the edge _{B 1} of the opening 71 is, for example 0.1 mm.
Even in this case, the opportunity for the sealing resins 65 of the resin container 61 to contact each other can be reduced.

As described above, by providing the resin container 61 with the convex portion 61b, it is possible to suppress the sealing resin 65 from contacting and adhering to each other.
In the present invention, the shape of the convex portion 61b is not limited to the shape described in the first to fourth embodiments. Further, the place where the convex portion 61 b is formed may be appropriately provided in a portion excluding the opening 71 on the upper surface of the resin container 61.

In the first to fourth embodiments, the convex portion 61 b is provided at a position that is not visible in the visual field when the opening 71 is looked up from the semiconductor light emitting element 64. By doing in this way, the convex part 61b does not affect characteristics, such as the light output of the light-emitting device 60. FIG.
When the light output of the light emitting device 60 can be lowered, the height h and the distance w of the convex portion 61b may be set within a range where the output can be lowered.

  In this embodiment, the example in which the light emitting module 12 configured using the light emitting device 60 is applied to the backlight device 10 of the liquid crystal display device has been described, but the present invention is not limited to this. For example, by combining the light emitting module 12 with a shade or the like, the light emitting module 12 can be used as an illumination device that illuminates a space or an object.

  In addition to the liquid crystal display device and the illumination device, for example, the light emission described above for an electric device such as a traffic light, a light source device for a scanner, an exposure device for a printer, an illumination device for vehicle installation, an LED display device using an LED dot matrix The device 60 can be incorporated and used.

  Furthermore, in the present embodiment, the case where one semiconductor light emitting element 64 that outputs blue light is used inside the resin container 61 is shown. A plurality of semiconductor elements may be used.

Hereinafter, the present invention will be described in more detail with reference to examples.
Group III nitride compound semiconductor element 64 (blue light-emitting element) was prepared according to the method described in International Publication WO2008 / 087930. The light emitting device 60 having the size described in the first embodiment (FIG. 3), the second embodiment (FIG. 7), the third embodiment (FIG. 8) and the fourth embodiment (FIG. 9) is injection-molded. The resin container 61 was integrally molded with a white resin in each size together with the lead frame.
That is, a white resin was injection-molded into a lead frame in which the anode lead portion 62 and the cathode lead portion 63 were integrated to form a resin container 61 having a recess. The semiconductor light-emitting element 64 is die-bonded using a die attach paste on the cathode lead portion 63 exposed on the bottom surface 70 of the concave portion of the resin container 61, and is cured by heating at 150 ° C. for 2 hours. Wire bonding was used to connect the p-type electrode and the n-type electrode of the semiconductor light emitting element 64 to the anode lead portion 62 and the cathode lead portion 63, respectively.
And what mounted one semiconductor light emitting element 64 in one resin container 61 was produced.

  Next, the mixed resin paste containing the phosphor powder and the uncured transparent resin 65 was filled in the recess 61a. At that time, the semiconductor light emitting element 64 and the bonding wire were covered with the mixed resin paste, and a bulging surface was formed by projecting the liquid surface of the mixed resin paste in a range of 20 μm to 100 μm from the upper surface of the resin container 61. Nylon 9T (Kuraray Genestar (trade name)) was used as the base resin of the resin container 61. The base resin of the uncured transparent resin 65 includes a curable silicone resin (a vinyl group-containing polydimethylsiloxane as a main component, a SiH group-containing polydimethylsiloxane as a curing agent, and a platinum group metal catalyst as a curing reaction accelerator). It was used.

In addition, the light emitting device 60 used in Comparative Example 1 was prepared and evaluated in the same manner as in Example, a resin container 61 in which the convex portion 61b as described in Examples 1 to 4 was not formed on the opening surface 61c. .
By using the above-described method, the adhesion suppression rate between the light emitting device 60 and another light emitting device 60 was examined using a sealing resin (transparent resin) in the recess 61 a of the resin container 61. The results are summarized in Table 1. Note that the adhesion suppression rate is determined by putting 100 light emitting devices 60 into the parts feeder 110 for the handler tester 100 and attaching the sealing resin of the light emitting device 60 and the sealing resin of another light emitting device 60 to the parts feeder. The number of light-emitting devices 60 remaining inside was counted.

  According to the results of Table 1, in Examples 1 to 4, the light emitting device 60 and the other light emitting devices 60 do not adhere, and 100% of the light emitting devices thrown into the parts feeder 110 are transferred into the handler tester 100. It was. However, in Comparative Example 1, most of the light emitting devices 60 adhered to each other and could not be transferred into the handler tester 100.

It is a figure of an example which shows the whole structure of a liquid crystal display device. It is a figure of an example for demonstrating the structure of a backlight apparatus. 3 is a diagram for illustrating a configuration of a light-emitting device according to Embodiment 1. FIG. It is an example for demonstrating the manufacturing method of a light-emitting device. It is a schematic diagram of a handler tester. It is a figure explaining the reason which can suppress adhesion of sealing resin. 6 is a diagram for illustrating a configuration of a light-emitting device according to Embodiment 2. FIG. 6 is a diagram for illustrating a configuration of a light emitting device according to Embodiment 3. FIG. 10 is a diagram for illustrating a configuration of a light-emitting device of Embodiment 4. FIG.

DESCRIPTION OF SYMBOLS 10 ... Backlight apparatus, 12 ... Light emitting module, 50 ... Liquid crystal display module, 51 ... Liquid crystal panel, 60 ... Light emitting device, 61 ... Resin container, 61a ... Recessed part, 61b ... Convex part, 61c ... Opening surface, 62 ... For anode Lead part, 63 ... Lead part for cathode, 64 ... Semiconductor light emitting element, 65 ... Sealing resin, 65c ... Outgoing surface, 70 ... Bottom surface, 80 ... Wall surface

Claims (7)

A resin container in which an opening surface formed in a planar shape, a recess formed in the opening surface, and a protrusion formed on the opening surface are formed;
A conductor formed in the resin container;
A light emitting element provided inside the concave portion of the resin container and electrically connected to the conductor portion;
A sealing resin that is formed in a planar or convex shape with respect to the opening surface in the concave portion of the resin container, and seals the light emitting element;
The height of the said convex part from the said opening surface of the said resin container is larger than the height from the said opening surface to the topmost part of the said sealing resin. The light-emitting device characterized by the above-mentioned.   The light emitting device according to claim 1, wherein the convex portion is an annular protrusion formed so as to surround the opening surface.   The light emitting device according to claim 1, wherein the convex portion is a plate-like protrusion.   The light emitting device according to claim 1, wherein the convex portion is a columnar protrusion.   The light emitting device according to claim 1, wherein the sealing resin is made of a silicone resin. A substrate,
A plurality of light emitting devices attached to the substrate,
The light emitting device
A resin container in which an opening surface formed in a planar shape, a recess formed in the opening surface, and a protrusion formed on the opening surface are formed;
A conductor formed in the resin container;
A light emitting element provided inside the concave portion of the resin container and electrically connected to the conductor portion;
A sealing resin that is formed in a planar or convex shape with respect to the opening surface in the concave portion of the resin container, and seals the light emitting element;
The height of the convex part from the opening surface of the resin container is larger than the height from the opening surface to the topmost part of the sealing resin.   An electric device comprising the light-emitting device according to claim 1.

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