JP2010163579A - Adhesive composition - Google Patents
Adhesive composition Download PDFInfo
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- JP2010163579A JP2010163579A JP2009009086A JP2009009086A JP2010163579A JP 2010163579 A JP2010163579 A JP 2010163579A JP 2009009086 A JP2009009086 A JP 2009009086A JP 2009009086 A JP2009009086 A JP 2009009086A JP 2010163579 A JP2010163579 A JP 2010163579A
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- Prior art keywords
- adhesive composition
- epoxy resin
- resin
- polyolefin
- composition according
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 51
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 51
- 239000000203 mixture Substances 0.000 title claims abstract description 44
- 239000003822 epoxy resin Substances 0.000 claims abstract description 46
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 46
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 29
- 239000006185 dispersion Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 229920000098 polyolefin Polymers 0.000 claims abstract description 11
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007787 solid Substances 0.000 claims abstract description 10
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 10
- 239000011593 sulfur Substances 0.000 claims abstract description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 7
- 229910000576 Laminated steel Inorganic materials 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract 1
- 239000011780 sodium chloride Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- -1 alkalis Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 150000008064 anhydrides Chemical class 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920001021 polysulfide Polymers 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- PXKKFBJFONPUED-UHFFFAOYSA-N 3-methyl-4-pent-2-enyloxolane-2,5-dione Chemical compound CCC=CCC1C(C)C(=O)OC1=O PXKKFBJFONPUED-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- OEMSKMUAMXLNKL-UHFFFAOYSA-N 5-methyl-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)=CCC2C(=O)OC(=O)C12 OEMSKMUAMXLNKL-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 208000020329 Zika virus infectious disease Diseases 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- QZUNEQNSDLPXCA-UHFFFAOYSA-N butan-2-one;pentan-2-one Chemical compound CCC(C)=O.CCCC(C)=O QZUNEQNSDLPXCA-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical group CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 231100000507 endocrine disrupting Toxicity 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000005556 hormone Substances 0.000 description 1
- 229940088597 hormone Drugs 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- IICQZTQZQSBHBY-UHFFFAOYSA-N non-2-ene Chemical compound CCCCCCC=CC IICQZTQZQSBHBY-UHFFFAOYSA-N 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000013615 primer Substances 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、ポリオレフィンと金属の接着に用いられる接着剤組成物に関するものである。 The present invention relates to an adhesive composition used for bonding a polyolefin and a metal.
従来から、家電外板、建築構造材の内装用部材、家具用素材などには、鋼板表面に塩化ビニル樹脂(以下、単に塩ビ樹脂ともいう)を被覆ないし積層(ラミネート)してなる、いわゆる塩ビ鋼板が使用されてきた。こうした塩ビ鋼板に用いられる塩ビ樹脂は、配合処方により良好な加工性、耐久性を示し、また着色等が容易なことから化粧性にも優れており、加えて安価なことから各方面に広く使用されている。
しかしながら、昨今環境問題が大きくクローズアップされ、塩ビ樹脂中のフタル酸系可塑剤ならびに塩ビ樹脂の焼却時等に発生するとされているダイオキシン類の一部が、内分泌撹乱作用が疑わしい化学物質(環境ホルモン)にリストアップされている。
そのため、こうした塩ビ樹脂の代替として各種ポリオレフィン系樹脂が提案されている。ポリオレフィン系樹脂は毒性がなく、酸、アルカリ、有機溶剤等に対して強い抵抗力を有し、機械的強度、耐磨耗性にも優れ、安価であることから、家電外板、建築構造材の内装用部材、家具用素材などに使用されつつある。しかしながら、ポリオレフィン系樹脂は非極性であることから、金属との接着が困難であった。
Conventionally, so-called polyvinyl chloride, which is made by coating or laminating a vinyl chloride resin (hereinafter also simply referred to as a vinyl chloride resin) on the surface of a steel sheet for home appliance outer panels, building interior materials, furniture materials, etc. Steel plates have been used. The vinyl chloride resin used in these PVC steel sheets shows good processability and durability due to the compounding prescription, is easy to color, etc., and is excellent in cosmetics. In addition, it is inexpensive and widely used in various fields. Has been.
However, environmental problems have been greatly highlighted in recent years, and some of the dioxins that are thought to be generated during the incineration of phthalate plasticizers and PVC resins in PVC resins are chemical substances (environmental hormones) that are suspected of causing endocrine disruption. ) Is listed.
For this reason, various polyolefin resins have been proposed as alternatives to such vinyl chloride resins. Polyolefin resins are non-toxic, have strong resistance to acids, alkalis, organic solvents, etc., are excellent in mechanical strength and wear resistance, and are inexpensive. It is being used for interior materials and furniture materials. However, since the polyolefin resin is non-polar, it is difficult to adhere to a metal.
従来かかるポリオレフィン系樹脂と金属(家電外板、建築構造材の内装用部材、家具用素材などに用いられる鋼板等)との接着のため、種々の接着剤、塗料、プライマー等が提案されている。典型的なものとしては、エポキシ樹脂、フェノール樹脂、メラミン樹脂、ポリウレタン樹脂、ポリエステル樹脂、ポリアミド樹脂、塩化ビニル樹脂、酢酸ビニル樹脂、塩化ビニル−酢酸ビニル共重合樹脂、アクリル系樹脂などの熱硬化性樹脂あるいは熱可塑性樹脂を有機溶剤に溶解したベース接着剤や塗料に、溶剤分散型変性ポリオレフィン樹脂を混合したものであった。すなわち前記熱硬化性あるいは熱可塑性樹脂で金属部分へ接着させ、変性ポリオレフィン樹脂でポリオレフィンへ接着させるものであった。(特許文献1,2)
しかしながら、これらの接着剤は一定レベルの接着性は得られるものの、苛酷な加工を施される用途においては十分な接着性を有しているとは言い難い。ラミネート鋼板メーカーでは、顧客要求レベルの向上とともに、内部試験として煮沸後のエリクセン試験(JIS K6744(1992)参照)や塩温水試験を行うところが増えている。エリクセン試験に対しては、酸変性ポリオレフィン系樹脂溶剤分散体とエポキシ樹脂とからなる組成物に、新たな成分として1,2−ジヒドロキシベンゼン、1,2,3−トリヒドロキシベンゼンおよびこれらの誘導体よりなる群から選ばれてなる少なくとも1種のものを加えることで改善が見られた。(特許文献3)
しかし、上記接着剤はさらに苛酷な条件である塩温水試験後に剥離を生じさせないという要求特性(塩温水試験後の密着性)を十分に満足するとは言い難いものであった。
Conventionally, various adhesives, paints, primers, etc. have been proposed for bonding between such polyolefin resins and metals (steel plates for home appliances, interior materials for building structures, steel sheets used for furniture materials, etc.). . Typical examples are thermosetting resins such as epoxy resins, phenol resins, melamine resins, polyurethane resins, polyester resins, polyamide resins, vinyl chloride resins, vinyl acetate resins, vinyl chloride-vinyl acetate copolymer resins, acrylic resins, etc. A base adhesive or paint obtained by dissolving a resin or a thermoplastic resin in an organic solvent was mixed with a solvent-dispersed modified polyolefin resin. That is, the thermosetting or thermoplastic resin is used to adhere to the metal part, and the modified polyolefin resin is used to adhere to the polyolefin. (Patent Documents 1 and 2)
However, although these adhesives can obtain a certain level of adhesiveness, they cannot be said to have sufficient adhesiveness in applications where severe processing is performed. Laminated steel sheet manufacturers are increasing the level of customer demand and performing an Ericksen test after boiling (see JIS K6744 (1992)) and a salt warm water test as internal tests. For the Erichsen test, a composition comprising an acid-modified polyolefin resin solvent dispersion and an epoxy resin was added to 1,2-dihydroxybenzene, 1,2,3-trihydroxybenzene and their derivatives as new components. Improvement was seen by adding at least one selected from the group consisting of: (Patent Document 3)
However, it is difficult to say that the adhesive sufficiently satisfies the required characteristic (adhesion after the salt warm water test) that does not cause peeling after the salt warm water test, which is a more severe condition.
本発明は、金属とポリオレフィン系樹脂双方へ良好な接着性を有し、組成物の貯蔵安定性・初期接着強度に優れ、特に耐塩温水接着性に優れた接着剤組成物、ならびにこれを用いてなるポリオレフィンラミネート鋼板およびポリオレフィン金属接着構造体を提供することである。 The present invention provides an adhesive composition having good adhesion to both metals and polyolefin resins, excellent in storage stability and initial adhesive strength of the composition, particularly excellent in salt-warm water resistance, and using the same It is providing the polyolefin laminated steel plate and polyolefin metal adhesion structure which become.
本発明者らは上記課題を解決するために鋭意研究を行い、酸変性ポリオレフィン系樹脂分散体(A)とS(イオウ)元素を含有する化合物(B)とを含む接着剤組成物あることを発明した。即ち、
[1] 酸変性ポリオレフィン系樹脂分散体(A)とS(イオウ)元素を含有する化合物(B)とを含む接着剤組成物。
[2]S元素含有量が接着剤組成物の固形分中に1〜10重量%である[1]記載の接着剤組成物。
[3]S元素を含有する化合物(B)がエポキシ樹脂(C)である[1]または[2]記載の接着剤組成物。
[4]酸変性ポリオレフィン系樹脂溶剤分散体(A)の固形分換算100重量部に対し前記エポキシ樹脂(C)が50〜1000重量部である[3]記載の接着剤組成物。
[5]前記エポキシ樹脂(C)が、ポリサルファイド変性エポキシ樹脂である[3]記載の接着剤組成物。
[6]更に、S元素を含有するエポキシ樹脂(C)以外のエポキシ樹脂(D)を含む [1]記載の接着剤組成物。
[7]前記エポキシ樹脂(D)がビスフェノールA型エポキシ樹脂である[6]記載の接着剤組成物。
[8]前記接着剤組成物が有機溶剤中に溶解もしくは分散している[8]記載の接着剤組成物。
[9]金属とポリオレフィン系樹脂とを、[1]記載の接着剤組成物を用いて接着してなるポリオレフィン/金属接着構造体。
[10]鋼板とポリオレフィン系樹脂のフィルムまたはシートとを、[1]記載の接着剤組成物を用いてラミネート接着してなるポリオレフィンラミネート鋼板。
尚、ここでS(イオウ)はイオウ元素の意味である。
In order to solve the above-mentioned problems, the present inventors have conducted intensive research and found that there is an adhesive composition containing an acid-modified polyolefin resin dispersion (A) and a compound (B) containing an S (sulfur) element. Invented. That is,
[1] An adhesive composition comprising an acid-modified polyolefin resin dispersion (A) and a compound (B) containing an S (sulfur) element.
[2] The adhesive composition according to [1], wherein the S element content is 1 to 10% by weight in the solid content of the adhesive composition.
[3] The adhesive composition according to [1] or [2], wherein the compound (B) containing an S element is an epoxy resin (C).
[4] The adhesive composition according to [3], wherein the epoxy resin (C) is 50 to 1000 parts by weight with respect to 100 parts by weight in terms of solid content of the acid-modified polyolefin resin solvent dispersion (A).
[5] The adhesive composition according to [3], wherein the epoxy resin (C) is a polysulfide-modified epoxy resin.
[6] The adhesive composition according to [1], further including an epoxy resin (D) other than the epoxy resin (C) containing an S element.
[7] The adhesive composition according to [6], wherein the epoxy resin (D) is a bisphenol A type epoxy resin.
[8] The adhesive composition according to [8], wherein the adhesive composition is dissolved or dispersed in an organic solvent.
[9] A polyolefin / metal bonded structure obtained by bonding a metal and a polyolefin resin using the adhesive composition according to [1].
[10] A polyolefin-laminated steel sheet obtained by laminating and bonding a steel sheet and a polyolefin resin film or sheet using the adhesive composition according to [1].
Here, S (sulfur) means a sulfur element.
本発明は、ポリオレフィンと金属の接着において、組成物の貯蔵安定性・初期接着強度に優れ、特に耐塩温水接着性に優れた接着剤組成物であり、各種接着剤・ヒートシール剤に有用である。 INDUSTRIAL APPLICABILITY The present invention is an adhesive composition excellent in storage stability and initial adhesive strength of a composition in bonding polyolefin and metal, and particularly excellent in salt-and-warm water resistance, and useful for various adhesives and heat sealants. .
本発明について以下、詳細に説明する。
本発明は、酸変性ポリオレフィン系樹脂分散体(A)とS元素を含有する化合物(B)とを含む接着剤組成物である。S元素の含有量は、該組成物の固形分中に通常1〜10、好ましくは2〜7、更に好ましくは4〜6重量%である。S元素の含有量が上記範囲であれば、耐塩温水接着性の点で好ましい。
尚、本発明でのS元素の含有量は、イオンクロマトグラフ法によりDionex社製DX−500を使用して測定された元素分析である。
The present invention will be described in detail below.
The present invention is an adhesive composition comprising an acid-modified polyolefin resin dispersion (A) and a compound (B) containing an S element. Content of S element is 1-10 normally in solid content of this composition, Preferably it is 2-7, More preferably, it is 4-6 weight%. If content of S element is the said range, it is preferable at the point of salt hot water adhesiveness.
In addition, content of S element in this invention is the elemental analysis measured using DX-500 by Dionex company by the ion chromatograph method.
[酸変性ポリオレフィン系樹脂溶剤分散体(A)]
本発明に用いる酸変性ポリオレフィン系樹脂溶剤分散体(A)は、酸変性されたポリオレフィン樹脂を溶媒中に分散させたものである。ポリオレフィン樹脂としてはポリエチレン、ポリプロピレン、ポリブテン−1、ポリ4−メチルペンテン−1等、エチレン又は炭素原子を3〜20個含むα−オレフィンのホモ重合体、エチレンと炭素原子を3〜20個含むα−オレフィンとの共重合体、及び、2種類以上の、炭素原子を3〜20個含むα−オレフィンの共重合体等が挙げられる。
[Acid-modified polyolefin resin solvent dispersion (A)]
The acid-modified polyolefin resin solvent dispersion (A) used in the present invention is obtained by dispersing an acid-modified polyolefin resin in a solvent. Polyolefin resins such as polyethylene, polypropylene, polybutene-1, poly-4-methylpentene-1, etc., ethylene or α-olefin homopolymers containing 3 to 20 carbon atoms, α containing ethylene and carbon atoms 3 to 20 -The copolymer with an olefin, the copolymer of the alpha olefin containing 3-20 carbon atoms of 2 or more types, etc. are mentioned.
前記ポリオレフィン樹脂の変性に用いる酸は、不飽和ジカルボン酸無水物としては具体的に、無水マレイン酸、無水ハイミック酸、4−メチルシクロヘキセ−4−エン−1,2−ジカルボン酸無水物、ビシクロ[2.2.2]オクト−5−エン−2,3−ジカルボン酸無水物、1,2,3,4,5,8,9,10−オクタヒドロナフタレン−2,3−ジカルボン酸無水物、2−オクタ−1,3−ジケトスピロ[4.4]ノン−7−エン、ビシクロ[2.2.1]ヘプト−5−エン−2,3−ジカルボン酸無水物、テトラヒドロフタル酸無水物、x−メチル−ビシクロ[2.2.1]ヘプト−5−エン−2,3−ジカルボン酸無水物、x−メチル−ノルボルネン−5−エン−2,3−ジカルボン酸無水物、ノルボルン−5−エン−2,3−ジカルボン酸無水物などを挙げることができる。
不飽和ジカルボン無水物の中では、特に無水マレイン酸または無水ハイミック酸が好ましい。勿論、必要に応じてこれらの不飽和ジカルボン酸無水物の開環物も使用することができる。また、上記不飽和カルボン酸無水物を2種以上組み合せて使用することもできるし、不飽和ジカルボン酸無水物と不飽和ジカルボン酸無水物の開環物を組み合わせて使用することもできる。
Examples of the unsaturated dicarboxylic acid anhydride include maleic anhydride, hymic anhydride, 4-methylcyclohex-4-ene-1,2-dicarboxylic acid anhydride, and bicyclocarboxylic acid. [2.2.2] Oct-5-ene-2,3-dicarboxylic acid anhydride, 1,2,3,4,5,8,9,10-octahydronaphthalene-2,3-dicarboxylic acid anhydride 2-octa-1,3-diketospiro [4.4] non-7-ene, bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid anhydride, tetrahydrophthalic acid anhydride, x-methyl-bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic anhydride, x-methyl-norbornene-5-ene-2,3-dicarboxylic anhydride, norborn-5 En-2,3-Zika , And the like Bon anhydride.
Among the unsaturated dicarboxylic anhydrides, maleic anhydride or hymic anhydride is particularly preferable. Of course, ring opening products of these unsaturated dicarboxylic acid anhydrides can also be used if necessary. Further, two or more of the unsaturated carboxylic acid anhydrides may be used in combination, or a ring-opened product of the unsaturated dicarboxylic acid anhydride and the unsaturated dicarboxylic acid anhydride may be used in combination.
前記酸変性ポリオレフィン系樹脂及び後述のエポキシ樹脂を溶解、または分散させるための有機溶媒としては、特に限定されないが、例えば、ベンゼン、トルエン、キシレン等の芳香族炭化水素、ヘキサン、ヘプタン、オクタン、デカン等の脂肪族系炭化水素、シクロヘキサン、シクロヘキセン、メチルシクロヘキサン、エチルシクロへキサン等の脂環族炭化水素、メタノール、エタノール、イソプロピルアルコール、ブタノール、ペンタノール、ヘキサノール、プロパンジオール、フェノール等のアルコール、アセトン、メチルイソブチルケトン、メチルエチルケトンペンタノン、ヘキサノン、シクロヘキサノン、イソホロン、アセトフェノン等のケトン系溶媒、メチルセルソルブ、エチルセルソルブ等のセルソルブ類、酢酸メチル、酢酸エチル酢酸ブチル、プロピオン酸メチル、ギ酸ブチル等のエステル類、トリクロルエチレン、ジクロルエチレン、クロルベンゼン等のハロゲン化炭化水素等を挙げることができる。
これらの中では、芳香族炭化水素、脂肪族炭化水素、脂環族炭化水素類が好ましい。
分散状態にある酸変性ポリオレフィン系樹脂の粒子形状は一般に、また好ましくは球状であるが、必ずしも球状である必要はない。粒子の平均粒径(測定機:Multisizer 3 Coulter Counter)は通常1ないし20μ、好ましくは5ないし15μである。また分散物中の不揮発分(固形分濃度)は通常5〜40重量%である。
The organic solvent for dissolving or dispersing the acid-modified polyolefin resin and the epoxy resin described below is not particularly limited, and examples thereof include aromatic hydrocarbons such as benzene, toluene, xylene, hexane, heptane, octane, decane. Aliphatic hydrocarbons such as cyclohexane, cyclohexene, alicyclic hydrocarbons such as methylcyclohexane, ethylcyclohexane, alcohols such as methanol, ethanol, isopropyl alcohol, butanol, pentanol, hexanol, propanediol, phenol, acetone, Ketone solvents such as methyl isobutyl ketone, methyl ethyl ketone pentanone, hexanone, cyclohexanone, isophorone, acetophenone, cellsolves such as methyl cellosolve, ethyl cellosolve, methyl acetate, acetic acid Butyl chill acetate, methyl propionate, and butyl formate, trichlorethylene, dichloroethylene, and halogenated hydrocarbons such as chlorobenzene.
Among these, aromatic hydrocarbons, aliphatic hydrocarbons, and alicyclic hydrocarbons are preferable.
The particle shape of the acid-modified polyolefin resin in a dispersed state is generally and preferably spherical, but is not necessarily spherical. The average particle size of the particles (measuring device: Multisizer 3 Coulter Counter) is usually 1 to 20 μ, preferably 5 to 15 μ. Moreover, the non volatile matter (solid content concentration) in a dispersion is 5 to 40 weight% normally.
[S元素を含有する化合物(B)]
本発明のS元素を含有する化合物(B)は、チオール樹脂、硫黄樹脂、ポリサルファイドポリマー、S元素を含有するエポキシ樹脂等が挙げられる。
これらの中で、ポリサルファイドポリマー、S元素を含有するエポキシ樹脂が好ましく、S元素を含有するエポキシ樹脂が更に好ましい。
[Compound containing element S (B)]
Examples of the compound (B) containing an S element of the present invention include a thiol resin, a sulfur resin, a polysulfide polymer, and an epoxy resin containing an S element.
Among these, a polysulfide polymer and an epoxy resin containing an S element are preferable, and an epoxy resin containing an S element is more preferable.
S元素を含有するエポキシ樹脂(C)
S元素を含有するエポキシ樹脂(C)としては、ポリサルファイド骨格(−SS−)を主鎖に持つポリサルファイド変性エポキシ樹脂、例えばFLEP−50及びFLEP−60(東レファインケミカル(株)製)等を挙げることができる。金属密着性及び防食性の点から、ポリサルファイド変性エポキシ樹脂は好適である。
前記(C)のエポキシ当量は、耐塩温水接着性の点で、通常200〜4000、好ましくは200〜1000、更に好ましくは200〜500である。また、前記(C)は耐腐食性、特に耐塩温水接着性の向上に寄与する。
Epoxy resin containing element S (C)
Examples of the epoxy resin (C) containing S element include polysulfide-modified epoxy resins having a polysulfide skeleton (-SS-) in the main chain, such as FLEP-50 and FLEP-60 (manufactured by Toray Fine Chemical Co., Ltd.). Can do. From the viewpoint of metal adhesion and corrosion resistance, polysulfide-modified epoxy resins are preferred.
The epoxy equivalent of (C) is usually 200 to 4000, preferably 200 to 1000, and more preferably 200 to 500, from the viewpoint of salt warm water adhesiveness. Further, (C) contributes to the improvement of corrosion resistance, in particular, salt hot water adhesion.
上記酸変性ポリオレフィン系樹脂溶剤分散体(A)と上記エポキシ樹脂(C)との量比は、初期接着強度及び耐腐食性の点で、(A)成分の固形分換算100重量部に対し、エポキシ樹脂成分が通常50〜1000、好ましくは100〜700更に好ましくは150〜400重量部である。
本発明では、S元素を含有するエポキシ樹脂(C)以外のエポキシ樹脂(D)を更に、好適に用いることができる。エポキシ樹脂(D)としては、例えばビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、多官能エポキシ樹脂、可撓性エポキシ樹脂、臭素化エポキシ樹脂、グリシジルエステル型エポキシ樹脂、高分子型エポキシ樹脂、ビフェニル型エポキシ樹脂等を用いることができる。これらの中で、初期接着強度の向上の点でビスフェノールA型エポキシ樹脂が好ましい。
ビスフェノールA型エポキシ樹脂の分子量は、初期接着強度の点で、1万〜5万、好ましくは3万〜5万である。
The amount ratio of the acid-modified polyolefin-based resin solvent dispersion (A) and the epoxy resin (C) is in terms of initial adhesive strength and corrosion resistance, with respect to 100 parts by weight in terms of solid content of the component (A), The epoxy resin component is usually 50 to 1000, preferably 100 to 700, and more preferably 150 to 400 parts by weight.
In the present invention, an epoxy resin (D) other than the epoxy resin (C) containing an S element can be further suitably used. Examples of the epoxy resin (D) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyfunctional epoxy resin, flexible epoxy resin, brominated epoxy resin, glycidyl ester type epoxy resin, polymer type epoxy resin, and biphenyl. A type epoxy resin or the like can be used. Among these, bisphenol A type epoxy resins are preferable in terms of improving the initial adhesive strength.
The molecular weight of the bisphenol A type epoxy resin is 10,000 to 50,000, preferably 30,000 to 50,000 in terms of initial adhesive strength.
また、S元素を含有するエポキシ樹脂(C)とそれ以外のエポキシ樹脂(D)との割合は、物性のバランスの点で、(C)100重量部に対して、(D)が通常50〜400、好ましくは50〜200、更に好ましくは50〜150重量部である。
本発明の接着剤組成物は溶剤中に溶解もしくは分散していることが好ましい。溶剤として水又は有機溶剤が上げられる。溶剤の量は、全成分の固形分換算100重量部に対し、通常、500〜1000重量部である。使用する有機溶剤は前記の種類が挙げられる。
本発明の接着剤組成物は、上記(A)〜(D)成分を室温で混合するか、混合後に晶析(加熱溶解及び冷却)をすることにより得ることができる。
Moreover, the ratio of the epoxy resin (C) containing S element and the other epoxy resin (D) is the balance of physical properties, and (D) is usually 50 to 100 parts by weight of (C). 400, preferably 50 to 200, more preferably 50 to 150 parts by weight.
The adhesive composition of the present invention is preferably dissolved or dispersed in a solvent. Water or an organic solvent is raised as the solvent. The amount of the solvent is usually 500 to 1000 parts by weight with respect to 100 parts by weight in terms of solid content of all components. Examples of the organic solvent to be used include those described above.
The adhesive composition of the present invention can be obtained by mixing the above components (A) to (D) at room temperature or by crystallization (heating dissolution and cooling) after mixing.
本発明は、本発明の接着剤組成物を用いた、ポリオレフィン/金属接着構造体である。
また、本発明は、鋼板とポリオレフィン系樹脂のフィルムまたはシートとを本発明の接着剤組成物を用いてラミネート接着してなるポリオレフィンラミネート鋼板である。
これら接着構造体の製造方法は、鋼板表面に接着剤樹脂を塗布し、その接着剤樹脂を焼き付け・乾燥した後、接着剤樹脂層が溶融状態にある間に、その上面にポリオレフィンフィルムを連続的に積層して接着する。
本発明の接着剤組成物は、初期接着強度・低温貯蔵安定性に優れ、特に耐塩温水接着性に優れた接着剤組成物であるので船舶・自動車部品等に好適に用いることができる。
The present invention is a polyolefin / metal bonded structure using the adhesive composition of the present invention.
Moreover, this invention is a polyolefin laminated steel plate formed by laminating | bonding the steel plate and the polyolefin resin film or sheet | seat using the adhesive composition of this invention.
These adhesive structures are manufactured by applying an adhesive resin to the steel sheet surface, baking and drying the adhesive resin, and then continuously applying a polyolefin film on the upper surface while the adhesive resin layer is in a molten state. Laminate and adhere.
The adhesive composition of the present invention is excellent in initial adhesive strength and low-temperature storage stability, and is particularly excellent in salt-resistant hot water adhesiveness, and therefore can be suitably used for ships, automobile parts and the like.
以下、実施例及び比較例により本発明をより具体的に説明するが、本発明はこれらの実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention more concretely, this invention is not limited to these Examples.
[塗布、焼き付け、接着工程]
ステンレス基板(SUS430 No.4)表面にバーコーターNo.12でサンプル溶液を塗布した。溶剤を乾燥させた後、200℃で60秒焼き付けを行った。ヒートシーラーの上段のみを加熱し、300μm厚、巾25mmの、PPシート、またはTPOシートの上に塗布面が下になるようステンレス基板を重ね、200℃、1kg/cm2、1秒ヒートシールを行った。
[Coating, baking, bonding process]
Bar coater No. on the surface of a stainless steel substrate (SUS430 No. 4). 12 applied the sample solution. After drying the solvent, baking was performed at 200 ° C. for 60 seconds. Only the upper part of the heat sealer is heated, and a stainless steel substrate is laminated on the PP sheet or TPO sheet having a thickness of 300 μm and a width of 25 mm, and the heat seal is performed at 200 ° C., 1 kg / cm 2, for 1 second. It was.
[接着性:剥離強度の測定]
島津製オートグラフを使用して、剥離角度180°、剥離速度100mm/minで剥離を行った。ヒートシールを行ったサンプルの剥離強度を測定し、3点の平均値をもとめた。
[Adhesion: Measurement of peel strength]
Using an autograph manufactured by Shimadzu, peeling was performed at a peeling angle of 180 ° and a peeling speed of 100 mm / min. The peel strength of the heat-sealed sample was measured, and the average value of 3 points was obtained.
[貯蔵安定性の評価]
調製サンプルを0℃で30日間保管した後に溶液状態(固化、ゲル化の有無等)の確認を行い、ゲル化しなかったものを○、ゲル化したのを×とした。
[Evaluation of storage stability]
After the prepared sample was stored at 0 ° C. for 30 days, the state of the solution (solidification, presence or absence of gelation, etc.) was confirmed.
[耐塩温水接着性]
接着したPPシート/ステンレス基板を5wt%、50℃の塩水に浸漬した。浸漬後の剥離の有無から接着性を評価した。
[Salt-resistant hot water adhesion]
The bonded PP sheet / stainless steel substrate was immersed in 5 wt%, 50 ° C. salt water. Adhesiveness was evaluated from the presence or absence of peeling after immersion.
[実施例1]
酸変性ポリオレフィン系樹脂溶剤分散体(A)としてユニストールR−200A(三井化学製;固形分25%)、S元素を含有するエポキシ樹脂(C)としてFLEP50(東レファインケミカル(株)製)を、エポキシ樹脂(D)としてビスフェノールA型エポキシ樹脂であるEXA−123(DIC(株)製)をそれぞれ使用した。
[Example 1]
Unistor R-200A (manufactured by Mitsui Chemicals; solid content 25%) as the acid-modified polyolefin resin solvent dispersion (A), FLEP50 (manufactured by Toray Fine Chemical Co., Ltd.) as the epoxy resin (C) containing S element, As the epoxy resin (D), EXA-123 (manufactured by DIC Corporation), which is a bisphenol A type epoxy resin, was used.
酸変性ポリオレフィン系樹脂溶剤分散体(A)/S(イオウ)元素を含有する化合物(B)/ビスフェノールA型エポキシ樹脂を重量比30/35/35の割合で室温において混合した。前記の方法で塗布、焼き付け、接着を行い、剥離強度の測定及び耐塩温水接着試験を行った。その結果を表2に示す。
尚、本例のS元素のイオンクロマトグラフ法によりDionex社製DX−500を使用して測定された含有量は0.51wt%であり、計算値は0.49wt%であった。
The compound (B) / bisphenol A type epoxy resin containing the acid-modified polyolefin resin solvent dispersion (A) / S (sulfur) element was mixed at a weight ratio of 30/35/35 at room temperature. Application, baking and adhesion were carried out by the above-described methods, and peel strength was measured and a salt warm water adhesion test was conducted. The results are shown in Table 2.
In addition, the content measured using ion-chromatography method of S element of this example using DX-500 made from Dionex was 0.51 wt%, and the calculated value was 0.49 wt%.
[実施例2〜5]
実施例1と同様の化合物を使用し、表1に示す割合で混合した。また、実施例1と同様の方法で塗布、焼き付け、接着を行い、剥離強度の測定及び耐塩温水接着試験を行った。
その結果を表2に示す。
[Examples 2 to 5]
The same compounds as in Example 1 were used and mixed in the proportions shown in Table 1. Moreover, application | coating, baking, and adhesion | attachment were performed by the method similar to Example 1, and the peeling strength measurement and the salt-warm water-resistant adhesion test were done.
The results are shown in Table 2.
[比較例1]
実施例1と同様の化合物を使用し、表1に示す割合で混合した。また、実施例1と同様の方法で塗布、焼き付け、接着を行い、剥離強度の測定及び耐塩温水接着試験を行った。
その結果を表2に示す。
[Comparative Example 1]
The same compounds as in Example 1 were used and mixed in the proportions shown in Table 1. Moreover, application | coating, baking, and adhesion | attachment were performed by the method similar to Example 1, and the peeling strength measurement and the salt-warm water-resistant adhesion test were done.
The results are shown in Table 2.
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CN104059579A (en) * | 2013-03-19 | 2014-09-24 | 藤森工业株式会社 | Adhesive resin composition, adhesive resin molded article and adhesive resin laminate |
KR20160018726A (en) | 2013-07-08 | 2016-02-17 | 아사히 가세이 케미칼즈 가부시키가이샤 | Modified resin and resin composition |
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