JP2010027720A - Ring frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ring frame that eliminates a possibility of bending of a resin-made frame. <P>SOLUTION: The ring frame includes a hollow ring type resin frame 10 which stores a semiconductor wafer 1 and an adhesive tape 12 stuck removably on a flat reverse surface of the resin frame 10 to adhesively hold the stored semiconductor wafer 1, wherein ring-shaped support ribs 13 which secure rigidity are formed projecting on a flat surface of the resin frame 10 and have their upper surfaces flattened, the support ribs 13 being positioned between nearby an inner peripheral edge or the inner peripheral edge itself, and an outer peripheral edge of the resin frame 10. Thus, the support ribs 13 enhancing the strength are formed on the surface of the resin frame 10 in one body, so even when the frame is molded out of a molding material containing a predetermined resin, there is no deficiency in rigidity and the possibility of arcuate bending of the resin frame 10 is effectively eliminated. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a ring frame used in a semiconductor dicing process or the like.

  In the semiconductor dicing process, a ring frame called a tape frame is used. This type of ring frame includes a frame that houses a semiconductor wafer (not shown) and a semiconductor that is detachably adhered to the back surface of the frame. And an adhesive tape for adhering and holding the wafer (see Patent Documents 1 and 2). The frame is formed into a hollow ring-shaped flat plate using a SUS material so that, for example, a semiconductor wafer having a diameter of 300 mm can be accommodated.

By the way, in recent years, a φ450 mm type semiconductor wafer has been developed in view of expansion of memory capacity and improvement of productivity. Manufacture using a molding material containing a predetermined resin has been studied.
JP 2003-197581 A JP 2007-123362 A

  In recent years, ring frames have been increased in size as described above, and manufacturing with molding materials has been studied. In this case, although light weight and convenience are excellent, the frame lacks rigidity and is heavier than before. As the semiconductor wafer is held, the frame may be bent like a bow.

  The present invention has been made in view of the above, and an object of the present invention is to provide a ring frame that can eliminate the fear of bending of a resin frame.

In order to solve the above-described problems, the present invention includes a hollow resin frame that accommodates a semiconductor wafer, and an adhesive tape that adheres and holds the semiconductor wafer that is detachably adhered to the back surface of the resin frame. Because
A support rib that secures rigidity is formed on the surface of the resin frame so that the upper surface thereof is flat. The support rib is positioned near the inner periphery of the resin frame or between the inner periphery and the outer periphery of the resin frame. It is characterized by that.

The support rib can be formed in a ring shape, and a detachable ring spacer can be fitted into the support rib.
Moreover, it is good to form a drainage inclined surface on the inner surface of the support rib.

  Here, the semiconductor wafer in the claims includes a φ450 mm type in addition to a large φ300 mm type, and does not particularly ask the presence or absence of bumps for circuit connection. The support rib may be composed of a plurality of semicircular arc pieces that define a circle, or may be a ring shape. Furthermore, the ring frame according to the present invention is used at least in a semiconductor dicing process, a cleaning process, and the like.

  According to the present invention, the support rib formed on the surface of the resin frame reinforces the structure of the resin frame and improves the rigidity of the resin frame. Accordingly, when the semiconductor wafer is held on the resin frame via the adhesive tape, the possibility that the resin frame is bent can be reduced.

  According to the present invention, since the support ribs for securing the rigidity are formed on the surface of the resin frame so as to protrude, there is an effect that the possibility that the resin frame is bent can be eliminated.

  Further, if the support rib is formed in a ring shape and a detachable ring spacer is fitted into the support rib, deformation of the adhesive tape of the resin frame located above when a plurality of resin frames are stacked can be prevented. Therefore, fluttering of the semiconductor wafer mounted on the adhesive tape can be suppressed.

  Furthermore, if an inclined surface with excellent drainage is formed on the inner surface of the support rib, it is possible to suppress the liquid from remaining in the hollow of the ring frame and adversely affecting the semiconductor wafer.

  Hereinafter, a preferred embodiment of a ring frame according to the present invention will be described with reference to the drawings. The ring frame in this embodiment includes a resin frame 10 that houses a thin semiconductor wafer 1 as shown in FIG. 1 and FIG. And a flexible adhesive tape 12 that holds the semiconductor wafer 1 adhered and accommodated in the resin frame 10, and a support rib 13 that ensures high rigidity is integrally formed on the surface of the resin frame 10. After being used in a semiconductor dicing process and a cleaning process, they are horizontally stored in a storage cassette (not shown).

  As shown in FIG. 1 and FIG. 2, the semiconductor wafer 1 is of a large φ450 mm type that improves productivity more than the conventional one. If necessary, a plurality of semiconductor wafers 1 can be easily connected to electronic parts on the exposed circuit surface. The bumps 2 are selectively formed and are accommodated in the hollow 11 of the resin frame 10 through a gap.

  As shown in FIG. 1 and FIG. 2, the resin frame 10 is injection-molded into a hollow ring-shaped flat plate using a molding material containing a predetermined resin so that, for example, a φ450 mm semiconductor wafer 1 can be accommodated. If necessary, a plurality of semiconductor wafers 1 are stacked and transported and transported in the vertical direction. The predetermined resin is not particularly limited, and examples thereof include polycarbonate and glass fiber reinforced epoxy resin excellent in impact resistance, water resistance, acid resistance and the like. A predetermined filler such as a reinforcing agent is added to the molding material as necessary.

  The adhesive tape 12 is made of, for example, a UV type tape whose adhesive strength is weakened by UV irradiation. The adhesive tape 12 is detachably adhered to the flat back surface of the resin frame 10 to cover the hollow 11 from below, and the outer peripheral edge of the resin frame 10. The semiconductor wafer 1 that is cut into a flat circle along the surface and accommodated in the hollow 11 of the resin frame 10 functions so as to be detachably mounted and adhered and held.

  As shown in the figure, the support ribs 13 are formed in a flat ring shape on the flat surface of the resin frame 10 and are located in the vicinity of the inner peripheral edge of the resin frame 10 to ensure the rigidity of the entire resin frame 10. To do. The support ribs 13 are formed in, for example, a rectangular cross-section standing along the inner peripheral surface of the resin frame 10, and the upper surface is a flat surface. The flat upper surface is the upper resin when the resin frames 10 are stacked. The adhesive tape 12 on the back surface of the frame 10 is supported by contact. Each support rib 13 is formed to a height of, for example, 8 to 20 mm so that a plurality of resin frames 10 can be smoothly aligned and stored in the storage cassette.

  According to the above configuration, since the support ribs 13 that increase the strength are protruded from the surface of the resin frame 10 and the bending strength of the resin frame 10 is improved, even if the frame is molded from a molding material containing a predetermined resin, There is no lack of rigidity. Therefore, when the semiconductor wafer 1 is held, the resin frame 10 is hardly bent like a bow.

  In addition, since the resin frame 10 does not need to be thickly formed by utilizing the molding material containing the predetermined resin and the support ribs 13, the lightness and convenience of the resin frame 10 can be remarkably improved. Further, since it is not necessary to increase the thickness of the resin frame 10, a manufacturing apparatus, a transfer apparatus, a robot, a storage cassette, etc. for the semiconductor wafer 1 having a diameter of 300 mm can be used as they are.

  Further, since the flat upper surface of the support rib 13 contacts and supports the adhesive tape 12 on the back surface of the upper resin frame 10, a sufficient clearance is formed between the upper adhesive tape 12 and the semiconductor wafer 1. And the semiconductor wafer 1 do not come into contact with each other during transportation or transportation. Therefore, it becomes possible to prevent damage to the semiconductor wafer 1 and the bumps 2 due to contact.

  Further, since the support ribs 13 are positioned not in the vicinity of the outer peripheral edge of the resin frame 10 but in the vicinity of the inner peripheral edge, the support rib 13 becomes an obstacle for gripping when the robot grips the outer periphery of the resin frame 10 as a gripping margin. This makes it possible to suppress and prevent deterioration in handleability.

Next, FIG. 3 shows a second embodiment of the present invention. In this case, the support rib 13 surrounding the hollow 11 is not from the vicinity of the inner periphery of the resin frame 10 but from the inner periphery of the resin frame 10. The portion between the outer peripheral edges, in other words, the center portion of the surface of the resin frame 10 is positioned. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same effects as those in the above embodiment can be expected, and the configuration of the support ribs 13 can be diversified.

  Next, FIG. 4 shows a third embodiment of the present invention. In this case, the support rib 13 is positioned in the vicinity of the inner peripheral edge of the resin frame 10, The water draining taper 14 that gradually spreads upward is formed to be inclined, and the cornerless taper 14 smoothly drains liquid such as cleaning liquid to the outside so as to improve drainage of the resin frame 10. Yes. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and when the semiconductor wafer 1 is cleaned by rotating the ring frame holding the semiconductor wafer 1 in the cleaning process after dicing, the ring frame is hollow. 11 is guided by the taper 14 and flows out to the outside, so that the cleaning liquid does not remain in the hollow 11 of the ring frame. Therefore, it is clear that the remaining cleaning liquid can effectively suppress the possibility of adversely affecting the semiconductor wafer 1 and causing the adhesive tape 12 to peel off.

  Next, FIG. 5 shows a fourth embodiment of the present invention. In this case, a support rib 13 is positioned at the center of the surface of the resin frame 10, and the upper resin frame is placed in the support rib 13. 10 A ring spacer 15 that contacts and supports the adhesive tape 12 on the back surface is detachably fitted so that the upper surface of the support rib 13 and the upper surface of the ring spacer 15 are aligned and aligned. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above embodiment can be expected, and the ring spacer 15 substantially enlarges the contact area of the support rib 13 with the adhesive tape 12 and presses the adhesive tape 12 from its peripheral side. It is obvious that fluttering of the semiconductor wafer 1 can be effectively prevented with a simple configuration since fluttering of the adhesive tape 12 and uneven deformation are prevented.

  The resin frame 10 may be injection-molded into a hollow ring-shaped flat plate, but both side portions of the resin frame 10 may be cut linearly, or a plurality of positioning notches may be formed on the outer peripheral edge. . Further, a support rib 13 may be positioned at the center of the surface of the resin frame 10, and a draining taper 14 that gradually spreads upward may be formed on the inner peripheral surface of the support rib 13 in an inclined manner.

  Further, a support rib 13 is positioned in the vicinity of the inner peripheral edge of the resin frame 10, and a ring spacer 15 that contacts and supports the adhesive tape 12 on the back surface of the upper resin frame 10 is detachably fitted in the support rib 13. good. Furthermore, the support rib 13 can be positioned on the surface of the resin frame 10, and a water draining taper 14 can be formed on the upper portion of the inner peripheral surface so that the ring spacer 15 can be detachably fitted into the support rib 13. .

It is a section explanatory view showing typically an embodiment of a ring frame concerning the present invention. It is a section explanatory view showing typically the lamination state of a plurality of frames in the embodiment of the ring frame concerning the present invention. It is a section explanatory view showing typically a 2nd embodiment of a ring frame concerning the present invention. It is a section explanatory view showing typically a 3rd embodiment of a ring frame concerning the present invention. It is a section explanatory view showing typically a 4th embodiment of a ring frame concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Bump 10 Resin frame 11 Hollow 12 Adhesive tape 13 Support rib 14 Taper (inclined surface)
15 Ring spacer

Claims (3)

A ring frame comprising a hollow resin frame that accommodates a semiconductor wafer, and an adhesive tape that adheres and holds the semiconductor wafer that is detachably adhered to the back surface of the resin frame,
A support rib that secures rigidity is formed on the surface of the resin frame so that the upper surface thereof is flat. The support rib is positioned near the inner periphery of the resin frame or between the inner periphery and the outer periphery of the resin frame. A ring frame characterized by that.   The ring frame according to claim 1, wherein the support rib is formed in a ring shape, and a detachable ring spacer is fitted in the support rib.   The ring frame according to claim 1 or 2, wherein a drainage inclined surface is formed on an inner surface of the support rib.

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