JP2010026507A - Local heating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a local heating device of reducing production cost and a production time, and uniformly drying a coating liquid or a thermosetting member without imparting excessive stress to a substrate. <P>SOLUTION: This local heating device has: an upper face side heating unit 70a for heating the substrate 20 from the upper face in a non-contact state with the substrate 20; a lower face side heating unit 70b for heating the substrate 20 from the lower face in a contact state with the substrate 20 or in an approximate state thereto; a height adjustment unit vertically moving the substrate 20 in the contact state with the lower face of the substrate 20 to set it in reference height; a moving unit positioning the upper face side heating unit 70a and the lower face side heating unit 70b in a local position that is a heating target of the substrate 20; and a control unit performing control such that height of the upper face side heating unit 70a has a prescribed interval to the reference height of the substrate 20. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a local heating apparatus that forms a film by heating and drying a coating solution or a thermosetting member locally formed on a substrate.

  Conventionally, a technique for forming a film by drying a coating solution or a thermosetting member coated on a substrate has been used in many production apparatuses. In recent years, a patterning technique for forming a film at an arbitrary position on a substrate by drying a coating liquid has attracted attention. This technique uses a dispenser or an ink jet. These techniques are attracting attention as technologies that can use a vacuum removal process instead of a pattern generation method using a vacuum process by conventional photolithography.

  For example, as a production apparatus using an inkjet patterning technique, there is an apparatus for producing a color filter (CF) panel. In this apparatus, ink composed of each color of red (R), green (G), and blue (B) is landed in an RGB pixel region formed on a glass substrate. Then, a color filter (CF) is formed by filling each pixel. Here, the ink applied in the pixel region is dried to form a film by heating the entire substrate by an oven or the like.

  The patterning technique is widely used not only as a full-surface printing technique but also as a technique for repairing a defective portion such as color mixing or mixing or adhesion of impurities. For example, in a color filter (CF) panel, a defective pixel in which color mixing of ink has occurred or a defective pixel in which impurities are mixed. In this case, after removing the ink layer film of the defective pixel, the ink is again applied to the removed portion, and the pixel is re-formed by heating and drying.

  Patent Document 1 discloses a prior art document that discloses a method of drying an applied ink by heating the entire substrate with an oven or a hot plate. When heating the entire substrate, a dedicated large heating device or a transfer robot with excellent heat resistance is required. Moreover, in order to advance the heated substrate to the next process, a place and time for cooling are also required. For this reason, there are problems such as an increase in manufacturing cost and a longer manufacturing time.

  In particular, when there are few places to heat and dry, manufacturing cost and manufacturing time can be reduced by locally heating and drying. For this reason, there is a high expectation for a technique in which only the portion where the ink is applied is locally heated and dried.

  As a method of locally heating and drying, a method of drying by bringing a heating element used in a hot plate or the like close to the substrate can be considered. In addition, Patent Literature 2, Patent Literature 3 or Patent Literature 4 is a prior art document that discloses a method of heating a substrate using a laser, an infrared lamp (infrared heater), a halogen heater, or the like.

  Furthermore, as a method of heating from both the upper and lower surfaces of the substrate, there is Patent Document 5 or Patent Document 6 as a prior document disclosing a method of blowing hot air or a method of heating with a heater or the like. Patent Document 7 is a prior document disclosing a method for correcting a color filter (CF). Patent Document 7 discloses a method in which a new color filter material is embedded in a defective portion of a color filter layer, and a heated member is brought close to the defective portion from above to cure the color filter material.

  An apparatus for heating a substrate includes a reflow apparatus for soldering to an electronic circuit board. Some reflow apparatuses are provided with a mechanism for blowing cooling air onto a substrate or a mechanism for collecting hot air after heating. Patent Documents 8 to 12 are prior art documents disclosing such a reflow apparatus or reflow method. In the soldering method disclosed in Patent Document 8, the solder is melted with hot air and soldered, and cooling air is blown in order to prevent the hot air from diffusing to the electronic circuit side of the substrate.

  In the hot air jet type heating device disclosed in Patent Document 9, hot air is blown from a plurality of nozzles provided above the substrate to heat the substrate. The cold hot air that has changed its direction upon hitting the substrate is forcibly recovered from a recovery port provided between the nozzles to increase the efficiency of heat supply to the substrate.

  In the reflow apparatus disclosed in Patent Document 10, a temperature difference is formed between the upper surface and the lower surface of the circuit board by blowing cool air from below the circuit board. In this way, the electronic components that have already been soldered to the lower surface of the double-sided mounting circuit board in the previous process are prevented from falling off and being thermally deteriorated.

  In the reflow apparatus disclosed in Patent Document 11, when one surface of the substrate is heated by the heating means, cold air is supplied to the other surface of the substrate from the cold air blowing hole of the cooling plate to cool. In this way, the mounting components on the other surface are thermally protected.

  In the reflow soldering device disclosed in Patent Document 12, the printed circuit board and the electronic component pass under the hot air blow nozzle and then pass under the cold air blow nozzle. At this time, after the solder paste is melted, the solder is solidified. In this way, electronic components can be reliably mounted on the printed circuit board.

JP 2004-160296 A JP 2004-95356 A JP 2004-165140 A JP 2006-224460 A JP 2000-315860 A JP 2005-223000 A Japanese Patent No. 4019475 JP-A-6-151032 JP 2002-331357 A JP 2001-326455 A JP 2000-357870 A JP 2000-294918 A

  In the heating method using a laser described in Patent Document 2, since the temperature gradient between the heating place and the non-heating place is steep, stress is applied to the substrate. As a result, there is a problem that the mechanical strength in the vicinity of the heating place is weakened. In general, in a method using a lamp, the temperature gradient between a heated place and an unheated place is gentler than that of a laser. However, since the frequency of lamp replacement is high, the device must be stopped each time. Therefore, there is a problem that the operation rate of the apparatus is lowered and the production efficiency is lowered.

  In the heating method using a heater described in Patent Document 3 or Patent Document 4, the ink does not dry unless the gap between the heater and the ink droplet is narrowed. On the other hand, if the gap is too narrow, the solvent vapor does not diffuse, resulting in a high-concentration solvent atmosphere, and drying is suppressed. The heating methods described in Patent Document 5 and Patent Document 6 do not have a mechanism for moving the lower heat source in the horizontal direction. For this reason, when the substrate to be heated becomes large, the heating region becomes large, which causes a problem of increase in power consumption and increase in manufacturing cost.

  In the method for controlling solvent vapor described in Patent Document 1, a configuration in which a heating source is mounted on the control member is conceivable. In the method described in Patent Document 1, a plurality of holes are formed in the plate material in order to make the drying speed uniform. If this is applied in order to dry locally applied droplets, there is a problem that the drying speed varies depending on the relative positions of the plurality of holes and the application portion. In Patent Document 1, there is no description of means for solving this, and its application is difficult.

  Further, it is assumed that a heating source is attached to the plate material, and the plate material has a function as a heater. In this case, even if the gas (air) existing between the plate material and the substrate can be heated due to the presence of the plurality of holes, there is convection in which the heated air tends to rise upward in the vicinity of every hole. It happens. As a result, there is a problem that the flow of heated air hardly flows toward the application part, and the drying efficiency is lowered.

  In the method for correcting a color filter described in Patent Document 7, heating is performed only from above the defective portion when the substrate is heated. In this case, the solvent of the color filter material is dried from the surface portion. Therefore, a dry film is formed on the surface of the color filter material, which hinders drying of the solvent inside the color filter material. As a result, there is a problem that the drying time becomes long.

  In the soldering method described in Patent Document 8, since the solder is easily cured, when the substrate is heated, cold air is simultaneously blown onto the substrate. Therefore, although the diffusion of hot air can be suppressed, it is difficult to maintain the heating temperature on the substrate within a predetermined temperature range. Therefore, it is difficult to apply this soldering method to a method of drying a coating solution or a thermosetting member on a substrate.

  Since the hot-air jet type heating device described in Patent Document 9 is a device that heats a substrate over a wide range, a transport system having high heat resistance is required to transport the heated substrate. A conveyance system having heat resistance is expensive and causes an increase in manufacturing cost.

  The reflow apparatus described in Patent Document 10 has a furnace for heating the substrate. Since the furnace is formed so as to accommodate the substrate, when the substrate is enlarged, the furnace is also enlarged. Therefore, when processing a large substrate, the equipment cost increases, which causes an increase in manufacturing cost.

  In the reflow apparatus described in Patent Document 11, a cooling plate in which slits or a large number of small holes are formed is arranged in a direction orthogonal to the substrate transport direction. When the substrate is enlarged, a large cooling plate and a structure for cooling a large amount of air are required. Therefore, when processing a large substrate, the equipment cost increases, which causes an increase in manufacturing cost.

  In the reflow soldering apparatus described in Patent Document 12, heating and cooling are performed while a substrate is being transported, and thus heat resistance is required for the transport system. A conveyance system having heat resistance is expensive and causes an increase in manufacturing cost.

  The present invention has been made in view of the above problems, and reduces the manufacturing cost and the manufacturing time, and uniformly dries the coating solution or the thermosetting member without applying excessive stress to the substrate. An object of the present invention is to provide a local heating device that can perform the above-described process.

  The local heating device according to the present invention is a device that locally heats a substrate on which at least a part of a coating solution or a thermosetting member that forms a film when dried. The local heating device includes an upper surface side heating unit that heats the substrate from the upper surface in a non-contact state, and a lower surface side heating unit that heats the substrate from the lower surface in contact with or close to the substrate. In addition, the local heating device includes a height adjusting unit that sets the reference height by moving the substrate up and down while in contact with the lower surface of the substrate, and the upper surface side heating unit and the lower surface side heating unit are heated as the substrate. Moving means for positioning at a local position is provided. Further, the local heating apparatus includes a control unit that controls the height of the upper surface side heating unit to have a predetermined interval with respect to the reference height of the substrate.

  With this configuration, when heating the coating liquid or thermosetting member on the substrate, the upper surface side heating means heats the substrate in a non-contact state. Therefore, it is possible to prevent scratches or dust from adhering to the substrate. In addition, the lower surface side heating means heats the coating solution or thermosetting member from the substrate side in contact with or close to the substrate, so that the solvent inside the coating solution or thermosetting member can be efficiently dried. it can.

  In the local heating apparatus based on this invention, a lower surface side heating means may be comprised integrally with a height adjustment means, and you may make it provide the lower surface side heating apparatus which heats in the state which contacted the lower surface of the board | substrate. In this case, since it is not necessary to separately arrange the height adjusting means, the apparatus can be downsized and the number of parts can be reduced. Furthermore, since the reference height is set and heated while the lower surface side heating means is in contact with the lower surface of the local heating position on the substrate, the heating can be performed more precisely by adjusting the height condition.

  In the local heating device according to the present invention, the moving means may have a mechanism for independently moving the upper surface side heating means and the lower surface side heating means. In this case, an operation in which the operation timings of the upper surface side heating means and the lower surface side heating means are shifted in accordance with the characteristics of the coating solution or the thermosetting member is possible.

  In the local heating device based on this invention, a lower surface side heating means may be provided with a means to adsorb | suck a board | substrate. In this case, even if the substrate is warped, it can be heated with the substrate surface corrected. As a result, it becomes possible to more uniformly manage the heating conditions of the coating solution or thermosetting member on the substrate, so that the quality of the coating solution or thermosetting member after drying can be improved. .

  In the local heating device based on this invention, you may make it start the heating by a lower surface side heating means before the heating by an upper surface side heating means. In this case, the solvent component can be dried from the substrate side of the coating solution or the thermosetting member, in other words, from the inside of the member. As a result, since a uniform film can be formed, the quality of the coating solution after drying or the thermosetting member can be improved.

  In the local heating apparatus based on this invention, you may make it the heating temperature by a lower surface side heating means lower than the heating temperature by an upper surface side heating means. In this case, since the amount of power required for the lower surface side heating means can be reduced, the power consumption can be reduced.

  In the local heating apparatus based on this invention, you may make it provide the cover formed in the surroundings of at least one heating part of an upper surface side heating means and a lower surface side heating means, and the exhaust means which exhausts the air in a cover. In this case, it is possible to reduce the influence of heat on the substrate transport mechanism unit disposed around the heating unit. As a result, it is possible to reduce the running cost by reducing the deterioration of the performance of the board transfer mechanism and the deterioration of components. Moreover, it becomes possible to collect | recover the solvent component which volatilizes from a coating liquid or a thermosetting member by heating. Therefore, the workability around the apparatus can be improved.

  In the local heating apparatus based on this invention, you may make it provide the cover formed in the whole movable area | region of at least one of an upper surface side heating means and a lower surface side heating means, and the exhaust means which exhausts the air in a cover. In this case, since the structure is not complicated, the manufacturing cost of the apparatus can be reduced as compared with the case where a cover is formed around the heating unit.

  In the local heating apparatus based on this invention, you may make it provide the upper surface side cooling means which cools a local position from the upper surface of a board | substrate. Moreover, you may make it provide the lower surface side cooling means which cools a local position from the lower surface of a board | substrate. Furthermore, you may make it provide the cooling adjustment part which operates or stops an upper surface side cooling means and a lower surface side cooling means.

  In such a case, after heating the local position on the substrate, the cooling time can be shortened by operating the upper surface side cooling means and the lower surface side cooling means to cool the heated local position. The substrate processing time can be shortened.

  In the local heating device according to the present invention, the upper surface side cooling means and the lower surface side heating means are respectively separated from the substrate in comparison with the heating positions of the upper surface side heating means and the lower surface side heating means. The lower surface side cooling means may be positioned at the local position by the moving means to cool the local position of the substrate.

  In this case, with the upper surface side heating unit and the lower surface side heating unit having been heated from the local position being kept away, the upper surface side cooling unit and the lower surface side cooling unit are brought close to the local position to perform stable cooling. be able to.

  In the local heating device according to the present invention, the upper surface side heating unit and the lower surface side heating unit are separated from the substrate as compared with the heating positions of the upper surface side heating unit and the lower surface side heating unit, respectively, and the upper surface side heating unit and The upper surface side cooling unit and the lower surface side cooling unit may cool the local position of the substrate in a state where the lower surface side heating unit is positioned at the local position.

  In this case, the upper surface side heating unit and the lower surface side heating unit that have finished heating from the local position are moved away, and then the upper surface side cooling unit and the lower surface side cooling unit are operated without moving to cool the local position. be able to. Therefore, since the substrate can be cooled immediately after heating, the substrate processing time can be shortened.

  In the local heating apparatus based on this invention, you may make it further provide the height control means which controls the height of an upper surface side cooling means and a lower surface side cooling means. In this case, the upper surface side cooling means and the lower surface side heating means can be accurately arranged with respect to the local position, and cooling can be performed under suitable cooling conditions.

  The local heating device according to the present invention further includes a plate-like heat insulating plate having heat insulating properties, and the upper surface side cooling means and the lower surface side cooling means with the heat insulating plate inserted between the upper surface side heating means and the substrate. However, the local position of the substrate may be cooled. In this case, it is possible to prevent the residual heat of the upper surface side heating means after the heating from being transmitted to the substrate. Therefore, the substrate can be efficiently cooled in a short time.

  The local heating apparatus according to the present invention includes a plurality of upper surface side heating units and lower surface side heating units, and the plurality of upper surface side heating units and lower surface side heating units control temperature of the substrate to be different from each other. May be provided. In this case, it is possible to reduce the load on each heating means by sharing the heating process among the plurality of heating means on the upper surface side and the lower surface side of the substrate. Therefore, the life of the heating means can be extended, and the time required for periodic replacement and maintenance of the heating means can be shortened.

  ADVANTAGE OF THE INVENTION According to this invention, while reducing manufacturing cost and manufacturing time, the local heating apparatus which can dry a coating liquid or a thermosetting member uniformly can be provided, without giving an excessive stress to a board | substrate. .

It is a perspective view which shows the structure of the local heating apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on the same embodiment. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 3 of this invention. FIG. 5 is a partial cross-sectional view showing a case where the substrate height is not adjusted in the local heating device according to Embodiment 3 shown in FIG. 4. (A) is a graph of the contents of Table 1, and (B) is a diagram showing the results of measuring the drying temperature and drying time of the coating liquid or thermosetting member formed on the substrate. . (A) is a schematic perspective view which shows the external appearance of a heater, (B) is a schematic perspective view which shows the structure of the heater provided with the mechanism to adsorb | suck a board | substrate. (A) is a schematic cross-sectional view showing the heating state of the coating liquid or thermosetting member on the substrate, and (B) is the coating liquid or thermosetting when the heating by the upper surface side heating means is performed first. It is a schematic cross section which shows the heating state of a property member. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 4 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 5 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 6 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 7 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 8 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 9 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 10 of this invention. It is a schematic diagram which shows an example of the attachment structure of a heat insulating board. It is a schematic diagram which shows the structure of the local heating apparatus which concerns on Embodiment 11 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 12 of this invention. It is sectional drawing which shows the structure of the local heating apparatus which concerns on Embodiment 13 of this invention.

Embodiment 1
Hereinafter, a local heating device according to an embodiment of the present invention based on the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing the structure of a local heating device according to Embodiment 1 of the present invention. As shown in FIG. 1, in the local heating device 1, support members 51 are arranged on the upper surface of the base 50 in two rows in parallel in the Y direction, in other words, in parallel with the substrate transport direction. A shaft is disposed between the two rows of support members 51 so as to be orthogonal to the support members 51, and a transport roller 30 for transporting the substrate 20 is attached to the shaft.

  On the upper surface of the support member 51, a chucking 31 for clamping or adsorbing the substrate 20 and a guide shaft 32 for moving the chucking 31 are arranged. The substrate 20 is clamped or attracted by the chucking 31, and the chucking 31 is transported by moving on the guide shaft 32.

  Two support columns 52 are arranged on the upper surface of the base 50, and a gantry 53 is bridged between the support columns 52. On the side surface of the gantry 53, an upper surface side heating unit 70a that is an upper surface side heating means for heating the substrate 20 from the upper surface side is disposed. Further, a guide shaft 41 a when the upper surface side heating unit 70 a moves and a ball screw 42 a for moving the upper surface side heating unit 70 a are provided in the longitudinal direction of the side surface of the gantry 53. A motor 40 a that rotates the ball screw 42 a is disposed at the upper right portion of the gantry 53. From these configurations, the upper surface side heating unit 70 a is movable in the X-axis direction, in other words, in the longitudinal direction of the gantry 53.

  On the upper surface of the base 50, a lower surface side heating unit 70b which is a lower surface side heating means is disposed at a position corresponding to the upper surface side heating unit 70a. A guide shaft 41b when the lower surface side heating unit 70b moves and a ball screw 42b for moving the lower surface side heating unit 70b are arranged in parallel to the ball screw 42a. A motor 40b for rotating the ball screw 41b is disposed on the upper surface of the base 50 corresponding to the position of the motor 40a. With these configurations, the lower surface side heating unit 70b is also movable in the X-axis direction. The motor 40a and the motor 40b are connected to the control unit 90. The upper surface side heating unit 70 a and the lower surface side heating unit 70 b are driven and controlled by the control unit 90.

  Below, the structure which moves the upper surface side heating unit 70a and the lower surface side heating unit 70b to the local heating position on the board | substrate 20 is demonstrated. In addition, before the board | substrate 20 is thrown into the local heating apparatus 1, the coating liquid or thermosetting member on the board | substrate 20 shall be formed. For example, the coating liquid is an organic EL material ink, and the thermosetting member is a thermosetting polyimide ink. It is assumed that information such as the area where the coating solution or thermosetting member is formed and the coordinates (Xn, Yn) (n ≧ 1) of the center position are known.

  The local heating device 1 includes a position sensor (not shown) that detects the end face of the substrate. The coordinate positioning in the Y-axis direction is performed by grasping the feed amount of the substrate 20 from the substrate end face. The coordinate positioning in the X-axis direction is performed by motors 40a and 40b that drive the upper surface side heating unit 70a and the lower surface side heating unit 70b in the X axis direction, respectively.

  As the motor, a stepping motor or a linear motor can be used. Since the motor 40a and the motor 40b have encoders that detect the number of rotations and the feed amount, accurate positioning control in the X-axis direction is possible. Since the upper surface side heating unit 70a and the lower surface side heating unit 70b are controlled by separate motors 40a and 40b, they can be moved independently. Although the transport system for the substrate 20 has been described with reference to the transport roller in FIG. 1, an air floating transport system is also possible.

  FIG. 2 is a cross-sectional view showing the structure of the local heating device according to this embodiment. In FIG. 1, the same components as those described are denoted by the same reference numerals, and description thereof will not be repeated. As shown in FIG. 2, a lower surface side heating unit 70b and a height adjusting unit 100 which is a height adjusting means for adjusting the height of the substrate are provided below the substrate 20. On the other hand, an upper surface side heating unit 70 a is provided above the substrate 20.

  The lower surface side heating unit 70b includes a heater 71b such as a ceramic heater, a holder 72b on which the heater 71b is mounted, a ball screw 74b that moves the holder 72b, and a stepping motor 75b that positions the holder 72b in the Z-axis direction. The guide shaft 73b when the holder 72b moves and a base 78b on which the guide shaft 73b is mounted. Further, the stepping motor 75b has an encoder (not shown) that detects the number of rotations, and accurate positioning control in the Z-axis direction is possible.

  The upper surface side heating unit 70a includes a heater 71a such as a ceramic heater or a hot air heater, a holder 72a on which the heater 71a is mounted, a ball screw 74a that moves the holder 72a, and a stepping that positions the holder 72a in the Z-axis direction. The motor 75a, the guide shaft 73a when the holder 72a moves, and the base 78a on which they are mounted. Further, the stepping motor 75a has an encoder (not shown) that detects the number of rotations, and accurate positioning control in the Z-axis direction is possible.

  The height adjustment unit 100 includes a terminal 101 in contact with the lower surface side of the substrate, a ball screw 74c that moves the terminal 101, a stepping motor 75c that positions the terminal 101 in the Z-axis direction, and a guide shaft when the terminal 101 moves. 73c and a base 78c for mounting them. Further, the stepping motor 78c has an encoder (not shown) that detects the number of rotations, and accurate positioning control in the Z-axis direction is possible.

  When heating is actually performed, first, the height of the substrate 20 is adjusted by the terminal 101 of the height adjustment unit 100. Specifically, the positioning in the Z-axis direction is performed by moving the terminal 101 up and down while contacting the lower surface of the substrate 20 so that the substrate 20 becomes the reference height. The reference height is a height that serves as a reference when the deflection due to the weight of the substrate is corrected by supporting the substrate from the lower surface.

  Next, the heater 71 b of the lower surface side heating unit 70 b is positioned substantially directly below the coating solution or thermosetting member 21 formed on the substrate 20. Specifically, the center of the heater 71b is aligned with the coordinates (Xn, Yn) of the center position of the coating liquid on the substrate 20 or the thermosetting member 21. Positioning in the Y-axis direction is performed by a substrate transport system including a transport roller 30 and chucking 31 and the like, and positioning in the X-axis direction is performed by a motor 40b which is a moving means shown in FIG. Positioning in the Z-axis direction is controlled by the stepping motor 75b so as to approach the lower surface of the substrate 20. In this case, the heater 71b may be in contact with the lower surface of the substrate 20.

  The heater 71 a of the upper surface side heating unit 70 a is positioned substantially immediately above the coating solution or thermosetting member 21 formed on the substrate 20. Specifically, the center of the heater 71a is adjusted to the coordinates (Xn, Yn) of the center position of the coating solution or the thermosetting member 21 on the substrate 20. Positioning in the Y-axis direction is performed by a substrate transport system including a transport roller 30 and chucking 31 and the like, and positioning in the X-axis direction is performed by a motor 40a which is a moving unit shown in FIG. The positioning in the Z-axis direction is controlled by the stepping motor 75a so that the distance from the upper surface of the substrate 20 is a predetermined distance h1.

  The heater 71a heats and dries the coating liquid or the thermosetting member 21 without contacting the upper surface of the substrate 20. A wiring pattern or the like is formed on the upper surface of the substrate 20. By heating in this way, the heater 71a and the substrate 20 are in contact with each other, and it is possible to prevent scratches or dust from adhering to the upper surface of the substrate 20.

  A heat source such as a ceramic heater or a hot air heater can be used as the heater 71a of the upper surface side heating unit 70a. Moreover, a ceramic heater etc. can be used for the heater 71b of the lower surface side heating unit 70b. In the practice of the present invention, a hot air heater is used as the heater 71a of the upper surface side heating unit 70a. A ceramic heater was used as the heater 71b of the lower surface side heating unit 70b.

Embodiment 2
FIG. 3 is a cross-sectional view showing the structure of the local heating device according to Embodiment 2 of the present invention. As shown in FIG. 3, a lower surface side heating unit 70 b and a height adjusting unit 100 that adjusts the height of the substrate are provided below the substrate 20. On the other hand, an upper surface side heating unit 70 a is provided above the substrate 20. Except for the height adjustment unit 100, the description is not repeated because it is the same as that of the first embodiment.

  The height adjustment unit 100 includes a terminal 101 in contact with the lower surface side of the substrate, a ball screw 74c that moves the terminal 101, a stepping motor 75c that positions the terminal 101 in the Z-axis direction, and a guide shaft when the terminal 101 moves. 73c and a base 78d for mounting them. Further, the stepping motor 75c has an encoder (not shown) that detects the number of rotations, and can perform accurate positioning control in the Z-axis direction.

  The base 78d is connected to the base 78b of the lower surface side heating unit 70b on the ball screw 42b that moves the lower surface side heating unit 70b. Therefore, the height adjustment unit 100 can be moved in conjunction with the lower surface side heating unit 70b. As a result, it is possible to prevent the occurrence of a deviation in the X-axis direction between the position where the height adjustment unit 100 adjusts the height of the substrate 20 and the position where the lower surface side heating unit 70b heats, thereby further improving the position accuracy. It is possible to improve the heating.

Embodiment 3
FIG. 4 is a cross-sectional view showing the structure of the local heating device according to Embodiment 3 of the present invention. As shown in FIG. 4, a lower surface side heating unit 70 b is provided below the substrate 20. On the other hand, an upper surface side heating unit 70 a is provided above the substrate 20. Since upper surface side heating unit 70a is the same as that of the first embodiment, description thereof will not be repeated. In the embodiment of the present invention, the lower surface side heating unit 70 b is configured integrally with a height adjusting means for adjusting the height of the substrate 20.

  When heating is performed, first, the heater 71 b of the lower surface side heating unit 70 b is positioned substantially directly below the coating solution or thermosetting member 21 formed on the substrate 20. Specifically, the center of the heater 71b is aligned with the coordinates (Xn, Yn) of the center position of the coating liquid on the substrate 20 or the thermosetting member 21. Positioning in the Y-axis direction is performed by a substrate transport system including transport rollers 30 and chucking 31, and positioning in the X-axis direction is performed by a motor 40b shown in FIG.

  Next, the height of the substrate 20 is adjusted by the lower surface side heating unit 70b. Specifically, the positioning in the Z-axis direction is performed by moving the heater 71b up and down while contacting the lower surface of the substrate 20 so that the substrate 20 becomes the reference height. Positioning in the Z-axis direction is controlled by a stepping motor 75b.

  By configuring the lower surface side heating unit 70b integrally with the height adjusting means, the height of the substrate 20 can be adjusted at the position where the lower surface side heating unit 70b actually heats. Therefore, the predetermined distance h1 between the upper surface side heating unit 70a and the upper surface of the substrate 20 is a distance at a position where the heating is actually performed, so that the heating conditions can be managed more strictly. Furthermore, the number of parts of the apparatus can be reduced, and the apparatus can be miniaturized.

  FIG. 5 is a partial cross-sectional view showing a case where the height adjustment of substrate 20 is not performed in the local heating device in the third embodiment shown in FIG. When the height adjustment is not performed by the lower surface side heating unit 70b, there is a gap L between the transport rollers 30, so that the deflection h2 occurs due to the weight of the substrate 20. As a result, the distance between the upper surface side heating unit 70a and the substrate 20 increases by the deflection h2.

  Heating of the coating solution or the thermosetting member 21 on the substrate 20 by the upper surface side heating unit 70a is performed in a non-contact state between the upper surface side heating unit 70a and the substrate 20. When the deflection h2 of the substrate 20 occurs, the distance between the heater 71a and the coating liquid or the thermosetting member 21 on the substrate 20 becomes long, so that the heating temperature on the substrate 20 is lowered and the time required for drying is long. Become.

  Table 1 shows the results of measuring the temperature of the back surface of the substrate 20 by changing the distance (gap) between the upper surface of the substrate 20 and the lower surface of the heater 71a when the heater 71a is heated using a hot air heater. FIG. 6A is a graph of the contents of Table 1. As shown in FIG. 6A, when the distance between the heater 71a and the substrate 20 is increased by 5 mm, the substrate back surface temperature is decreased by about 10 ° C.

  FIG. 6B is a diagram showing the results of measuring the drying temperature and drying time of the coating liquid or thermosetting member 21 formed on the substrate 20. The vertical axis represents the drying time, and the horizontal axis represents the drying temperature. Generally, the drying time of the coating solution or the thermosetting member 21 is shortened as the drying temperature is higher. As shown in FIG. 6B, when the temperature of the substrate 20 decreased from t2 to t1, the drying time increased from M2 to M1. As a cause of this temperature change, as shown in FIG. 6A, there is a change in the distance between the substrate 20 and the heater 71a.

  Accordingly, when the substrate 20 is processed by sequence control for performing drying for a predetermined time, if the variation in the distance (h1 + h2) between the substrate 20 and the heater 71a is large, the substrate 20 is insufficiently dried and the quality of the substrate 20 after drying is improved. A big difference occurs. Further, if the drying time is set long so as to absorb the variation in the distance (h1 + h2) between the substrate 20 and the heater 71a, the processing tact increases and the production efficiency decreases.

  Therefore, in order to maintain the quality of the coating liquid after drying or the thermosetting member 21 and to shorten the processing tact, the distance between the substrate 20 and the upper surface side heating unit 70a is adjusted to a predetermined distance h1. There is a need to. The lower surface side heating unit 70b is used as a means for adjusting the distance between the substrate 20 and the upper surface side heating unit 70a to a predetermined distance h1. The stepping motor 75b that controls the height of the lower surface side heating unit 70b can perform high-precision positioning of 1 mm or less, and can accurately adjust the height of the substrate 20. As a result, it becomes possible to stabilize the heating conditions of the coating solution or the thermosetting member 21.

  Positioning of the upper surface side heating unit 70a and the lower surface side heating unit 70b is controlled by the control unit 90 shown in FIG. Further, although it is necessary to control the heating time and the heating temperature depending on the amount of the coating liquid or the thermosetting member 21 on the substrate 20, these are also controlled by the control unit 90.

  The heater 71b of the lower surface side heating unit 70b will be described. FIG. 7A is a schematic perspective view showing the appearance of the heater. As shown in FIG. 7A, the heater 71b is provided on a holder 72b, and includes a heater 171b and a thermocouple 172b for measuring the temperature of the heater 171b. The heater 171b has a heating element mounted therein, and is connected to a controller (not shown) by wiring.

  The controller is connected to the control unit 90, and controls the adjustment of the voltage applied to the heater 171b and the ON / OFF of the power source in accordance with a signal transmitted from the control unit 90. The thermocouple 172b is connected to the control unit 90 via a temperature controller (not shown). For example, a ceramic heater can be used as the heater 171b. For example, a ceramic adhesive is used for fixing the heater 171b, the thermocouple 172b, and the holder 72b.

  FIG. 7B is a schematic perspective view showing the structure of the heater 71c provided with a mechanism for attracting the substrate 20 to the heater 71b. Basically, the heater 71c is formed by disposing a suction table 176b on the outer periphery of the heater 71b shown in FIG.

  The suction table 176b has one or more suction holes 173b on the surface where the heater 171b contacts the substrate 20. Each suction hole 173b is connected by a pipe 174b inside the suction table 176b, and the pipe 174b is connected to a pipe 175b connected to the outside. The suction table 176b can suck the substrate 20 by bringing the suction hole 173b into contact with the substrate 20 and evacuating the pipe 175b.

  By adsorbing the substrate 20 to the lower surface side heating unit 70b as described above, it becomes possible to correct the local warpage of the substrate 20, and to manage the distance between the upper surface side heating unit 70a and the substrate 20 more uniformly. Is possible. When releasing the adsorption after the heat treatment is completed, the adsorption can be reliably released by supplying compressed air or nitrogen to the pipe 174b.

  FIG. 8A is a schematic cross-sectional view showing a heating state of the coating liquid or the thermosetting member 21 on the substrate 20. As the order of heating the substrate 20, it is desirable to perform heating by the lower surface side heating unit 70b prior to the upper surface side heating unit 70a.

  As shown in FIG. 8A, the substrate 20 on which the coating solution or the thermosetting member 21 is formed is heated in a state where the lower surface side heating unit 70b is in contact with the lower surface side. Heat generated by the heater 71b of the lower surface side heating unit 70b is transmitted in the direction indicated by the arrow from the lower surface of the substrate 20 toward the upper surface. Therefore, the temperature in the substrate 20 decreases as it travels from the high temperature portion in contact with the heater 71b to the upper surface of the substrate 20 via the thermal diffusion portion 20b.

  The heat transmitted to the upper surface of the substrate 20 is transmitted from the contact surface 21 a side between the substrate 20 and the coating solution or thermosetting member 21. Therefore, drying of the coating liquid or the thermosetting member 21 is started in the direction indicated by the arrow from the contact surface 21a side with the substrate 20. As a result, the coating solution or the solvent inside the thermosetting member 21 can be sufficiently dried, and the quality of the substrate 20 after drying can be kept high.

  FIG. 8B is a schematic cross-sectional view showing a heating state of the coating liquid or the thermosetting member 21 when the heating by the upper surface side heating unit 70a is performed first. The heat generated by the heater 71a of the upper surface side heating unit 70a is transmitted to the surface portion 21b of the coating solution or the thermosetting member 21. Therefore, the solvent of the coating solution or the thermosetting member 21 is dried from the surface portion 21b.

  As shown in FIG. 8B, a film is formed on the surface portion 21b of the coating solution or thermosetting member 21, and the solvent remaining on the contact surface 21a side of the coating solution or thermosetting member 21 is dried. It will be a hindrance. As a result, more heating time is required to keep the quality of the dried substrate 20 uniform. Therefore, it can be seen that the heating by the lower surface side heating unit 70b is preferably performed before the upper surface side heating unit 70a as the order of heating the substrate 20.

  Next, the heating temperature of the upper surface side heating unit 70a and the lower surface side heating unit 70b will be described. The heat applied to the substrate 20 needs to dry the coating solution or thermosetting member 21 on the substrate 20 within a predetermined time. Since the heating by the upper surface side heating unit 70a is performed in a non-contact state on the substrate 20 and the coating solution or the thermosetting member 21, the heat of the heater 71a is transmitted through the air. Since the thermal conductivity of nitrogen, which is the main component of air, is as small as 0.026E-2 [W / cm / deg] (at a temperature of 300 [K]), the heating temperature by the upper surface side heating unit 70a needs to be high. is there.

On the other hand, when glass mainly composed of SiO ₂ is considered as the substrate 20, its thermal conductivity is 0.014 [W / cm / deg] (at a temperature of 274 [K]), which is 50% of the thermal conductivity of air. It is about twice. Therefore, the heat applied from the lower surface side heating unit 70b can be set less than the heat applied from the upper surface side heating unit 70a. Furthermore, when the substrate 20 is rapidly heated in a short time, stress is generated in the substrate 20 due to a temperature difference between the heated portion and the non-heated portion, and deformation or cracking is likely to occur. Therefore, it is important to set the heating temperature by the lower surface side heating unit 70b low.

Embodiment 4
FIG. 9 is a cross-sectional view showing the structure of the local heating device according to Embodiment 4 of the present invention. Since upper surface side heating unit 70a and lower surface side heating unit 70b are the same as in the third embodiment, description thereof will not be repeated. As shown in FIG. 9, in the local heating device 1 according to the embodiment of the present invention, the upper surface side heating unit 70a and the lower surface side heating unit 70b are covered with covers 76a and 76b, respectively. Further, exhaust units 77a and 77b for exhausting the air in the cover are provided. The cover and the exhaust unit may be provided in only one of the upper surface side heating unit 70a and the lower surface side heating unit 70b.

  By exhausting with the exhaust units 77a and 77b, the air in the covers 76a and 76b moves in the direction of the arrow and is exhausted. Therefore, it is possible to prevent the heat released from the heaters 71a and 71b from diffusing around. Moreover, it becomes possible to collect | recover the solvent and gas which volatilized from the coating liquid or the thermosetting member 21, and the working environment around an apparatus part can be improved. Further, high temperature air from the heater 71b of the lower surface side heating unit 70b can be prevented from deteriorating the transport roller 30 of the substrate transport system, and stable operation and long life of the apparatus can be achieved.

  The exhaust units 77a and 77b are constituted by pipes or blowers, and their attachment positions are not limited to the positions shown in FIG. 9, but the airflow due to the shapes of the upper surface side heating unit 70a and the lower surface side heating unit 70b. It should be arranged in consideration of the flow.

Embodiment 5
FIG. 10 is a cross-sectional view showing the structure of the local heating device according to Embodiment 5 of the present invention. Since upper surface side heating unit 70a and lower surface side heating unit 70b are the same as in the third embodiment, description thereof will not be repeated. As shown in FIG. 10, in the local heating device 1 according to the embodiment of the present invention, the entire movable region of the upper surface side heating unit 70a and the lower surface side heating unit 70b is covered with covers 79a and 79b. Further, exhaust units 77a and 77b for exhausting the air in the cover are arranged. The cover and the exhaust unit may be provided only in either one of the entire movable region of the upper surface side heating unit 70a or the lower surface side heating unit 70b.

  With this configuration, it is not necessary to dispose the cover and the exhaust unit on the base on which the upper surface side heating unit 70a or the lower surface side heating unit 70b is mounted, and the configuration is simplified. Therefore, cost reduction can be achieved in the apparatus compared to the case where a cover is formed around the heating unit. Further, since the space covered by the cover is large, heat is easily dispersed, and the influence of heat on the components of the upper surface side heating unit 70a and the lower surface side heating unit 70b is reduced. Exhaust units 77a and 77b are constituted by pipes or blowers, and their mounting positions are not limited to the positions shown in FIG. 10, and airflows depending on the shapes of upper surface side heating unit 70a and lower surface side heating unit 70b. Should be arranged in consideration of the flow of

Embodiment 6
FIG. 11 is a cross-sectional view showing the structure of the local heating device according to Embodiment 6 of the present invention. Since upper surface side heating unit 70a is the same as that in the first embodiment, description thereof will not be repeated. As shown in FIG. 11, the local heating device 1 according to the embodiment of the present invention includes a substrate 20 height adjustment unit in the substrate 20 transport system. The distance between the upper surface side heating unit 70a and the substrate 20 is adjusted by the substrate conveyance system including the conveyance roller 30 and the chucking 31.

  Specifically, the substrate transport system includes a transport roller 30, a chucking 31, and a Z-axis stage 54 that can move the supporting member 51 in the Z-axis direction. The lower surface heating unit 70b is moved closer to the substrate 20 by moving the substrate 20 downward by the Z-axis stage 54 so that the lower surface of the substrate 20 approaches the height of the upper end of the heater 71b.

  Since the substrate 20 is moved up and down by the substrate transfer system, the substrate 20 can be moved while the substrate 20 is held by the transfer roller 30 and the chucking 31 with good balance. The lower surface side heating unit 70b may have an adsorption mechanism shown in FIG.

Embodiment 7
FIG. 12 is a cross-sectional view showing the structure of the local heating device according to Embodiment 7 of the present invention. Since upper surface side heating unit 70a is the same as that in the first embodiment, description thereof will not be repeated. As shown in FIG. 12, the local heating device 1 according to the embodiment of the present invention employs an air floating type as a substrate 20 transfer system. This is a transport system in which air 33 is blown onto the substrate 20 from above the support member 51 to float and transport. Specifically, the transport system includes an air nozzle (not shown) that supplies air 33 to the substrate 20, chucking 31 that holds the substrate 20, and support members 51 thereof.

  In the air levitation type, the substrate 20 is transported by floating above a predetermined height. At the time of heating, the air supply is cut off at a predetermined position, whereby the substrate 20 is lowered and approaches the lower surface side heating unit 70b. Therefore, since the board | substrate 20 does not roll on the conveyance roller 30, generation | occurrence | production of the damage | wound during conveyance can be prevented. The lower surface side heating unit 70b may have an adsorption mechanism shown in FIG.

Embodiment 8
FIG. 13: is sectional drawing which shows the structure of the local heating apparatus based on Embodiment 8 of this invention. Since upper surface side heating unit 70a is the same as that in the first embodiment, description thereof will not be repeated. As shown in FIG. 13, the height adjusting means for the substrate 20 of the local heating device 1 according to the embodiment of the present invention includes a transport roller 30, a chucking 31, a support member 55, and a Z-axis stage 56. . The conveyance roller 30 and the chucking 31 are disposed above the support member 55. The conveying roller 30 is moved up and down in the Z-axis direction by the Z-axis stage 56 to adjust the height of the substrate 20.

  The height of the transport roller 30 is controlled so as to be raised when transported and lowered when heated, so that the substrate 20 approaches the lower surface side heating unit 70b. Since the substrate 20 is moved up and down by the substrate transfer system, the substrate 20 can be moved while the substrate 20 is held by the transfer roller 30 and the chucking 31 with good balance. The lower surface side heating unit 70b may have an adsorption mechanism shown in FIG.

  Further, a guide shaft 73b, a ball screw 74b, and a stepping motor 75b may be provided so that the lower surface side heating unit 70b can be moved in the Z-axis direction. In this case, the conveyance roller 30 may be moved up and down in the Z-axis direction by the Z-axis stage 56 and the lower surface side heating unit 70b may be moved up and down in the Z-axis direction at the same time. The lower surface side heating unit 70b may have an adsorption mechanism shown in FIG.

Embodiment 9
FIG. 14 is a cross-sectional view showing the structure of the local heating device according to Embodiment 9 of the present invention. As shown in FIG. 14, in the local heating device according to the present embodiment, an upper surface side heating unit 70a and an upper surface side cooling unit 80a that is an upper surface side cooling means are mounted on a base 78a that is movable in the X-axis direction. ing. In addition, a lower surface side heating unit 70b and a lower surface side cooling unit 80b which is a lower surface side cooling means are mounted on a base 78b movable in the X-axis direction. Since the configuration other than the upper surface side cooling unit 80a and the lower surface side cooling unit 80b is the same as that of the first embodiment, description thereof will not be repeated.

  The upper surface side cooling unit 80a includes a cooling nozzle 81a that ejects cold air. The cooling nozzle 81 a is arranged so that the ejection port of the cooling nozzle 81 a faces the substrate 20. Further, a pipe (not shown) for supplying cold air is connected to the cooling nozzle 81a. Further, an electromagnetic valve for turning on / off the supply of cold air is connected as a cooling adjustment unit for operating or stopping the upper surface side cooling unit 80a.

  Further, the upper surface side cooling unit 80a includes a holder 82a on which the cooling nozzle 81a is mounted, a ball screw 84a for moving the holder 82a, and a stepping that is a height control means for positioning the holder 82a in the Z-axis direction. The motor 85a and a guide shaft 83a when the holder 82a moves are configured. The stepping motor 85a has an encoder (not shown) that detects the number of rotations, and enables accurate positioning control in the Z-axis direction.

  The lower surface side cooling unit 80b includes a cooling nozzle 81b for ejecting cold air. The cooling nozzle 81 b is disposed so that the ejection port of the cooling nozzle 81 b faces the substrate 20. Further, a pipe (not shown) for supplying cold air is connected to the cooling nozzle 81b. Further, an electromagnetic valve for turning on / off the supply of cold air is connected as a cooling adjustment unit for operating or stopping the lower surface side cooling unit 80b.

  Further, the lower surface side cooling unit 80b includes a holding tool 82b on which the cooling nozzle 81b is mounted, a ball screw 84b for moving the holding tool 82b, and a stepping which is a height control means for positioning the holding tool 82b in the Z-axis direction. The motor 85b and a guide shaft 83b when the holder 82b moves are configured. The stepping motor 85b has an encoder (not shown) that detects the number of rotations, and enables accurate positioning control in the Z-axis direction.

  Hereinafter, a method for heating and cooling the local position of the substrate 20 using the local heating apparatus 1 of the present embodiment will be described. The substrate 20 will be described as being disposed at a reference height.

  When heating is performed, the heater 71 a of the upper surface side heating unit 70 a is positioned substantially immediately above the coating solution or thermosetting member 21 formed on the substrate 20. In addition, the heater 71 b of the lower surface side heating unit 70 b is positioned almost directly below the coating solution or thermosetting member 21 formed on the substrate 20.

  Thereafter, the heater 71b of the lower surface side heating unit 70b is heated in a state of being in contact with or close to the lower surface of the substrate 20. Further, the heater 71a of the upper surface side heating unit 70a is heated with a predetermined interval h1 with respect to the upper surface of the substrate.

  At the time of this heating, the upper surface side cooling unit 80a and the lower surface side cooling unit 80b are in a state in which the solenoid valves that adjust the supply of cold air are closed so that they are stopped. In this way, it is possible to prevent the time for heating the substrate 20 from being extended to a predetermined temperature by the cold air flowing into the heated local position.

  After the heating is completed, the heater 71a of the upper surface side heating unit 70a is moved upward away from the upper surface of the substrate 20. Further, the heater 71b of the lower surface side heating unit 70b is moved away from the 20 lower surface of the substrate. Both the heater 71a and the heater 71b are preferably moved to such an extent that the heat is not affected on the substrate 20.

  Thereafter, the base 78a is moved so that the coating liquid or the thermosetting member 21 is located immediately below the outlet of the cooling nozzle 81a of the upper surface side cooling unit 80a. Similarly, the base 78b is moved so that the coating liquid or the thermosetting member 21 is located immediately above the ejection port of the cooling nozzle 81b of the lower surface side cooling unit 80b. Specifically, the base 78a and the base 78b were moved by a distance x1 in the X-axis direction.

  Next, the cooling nozzle 81a and the cooling nozzle 81b are adjusted by the height control means so as to have a predetermined interval with respect to the substrate 20, respectively. This predetermined interval is an interval suitable for cooling, and is determined by the type of the coating liquid or the thermosetting member 21 and the temperature of the cooling air.

  The positioning of the cooling nozzle 81a in the Z-axis direction is controlled by a stepping motor 85a which is a height control means so that the distance from the upper surface of the substrate 20 is a predetermined distance. The positioning of the cooling nozzle 81b in the Z-axis direction is controlled by the stepping motor 85b, which is a height control means, so that the distance from the lower surface of the substrate 20 is a predetermined distance. Thereafter, the coating liquid or the thermosetting member 21 is cooled until it cools to a predetermined temperature. In the local heating apparatus of this embodiment, the height control means is provided. However, when it is not necessary to change the height of the cooling nozzles 81a and 81b with respect to the substrate 20, the height control means is not provided. Good.

  After the local position on the substrate 20 is heated, the upper surface side cooling unit 80a and the lower surface side cooling unit 80b are moved closer to the local position and operated, so that the cooling time can be shortened and the substrate processing time can be shortened. it can.

  As described above, in the local heating device 1 of the present embodiment, the substrate 20 does not move while heating and cooling, and the substrate 20 is stopped on the transport roller 30. That is, the substrate 20 is heated and hot and does not pass over the transport roller 30. Therefore, it is not always necessary to use a heat resistant material for the transport roller 30.

  Moreover, in the local heating apparatus 1 of this embodiment, the local position on the board | substrate 20 can be heated and cooled, and since there is no need to heat and cool the whole board | substrate 20, heater 71a, 71b and cooling nozzle 81a, 81b. Can be miniaturized. As a result, the apparatus cost can be kept low, and the running cost such as electric power used for heating and cooling can be kept low.

Embodiment 10
FIG. 15 is a cross-sectional view showing the structure of the local heating device according to Embodiment 10 of the present invention. As shown in FIG. 15, in the local heating apparatus according to Embodiment 10 of the present invention, a heat insulating plate 110 is provided on the upper surface side heating unit 70a. The heat insulating plate 110 is formed of a heat insulating plate, and a plate made of ceramic or resin can be used.

  When the substrate 71 is heated, the heater 71a is controlled such that the interval between the ejection port of the heater 71a and the substrate 20 is a predetermined interval h1. Therefore, since the heater 71a moves toward the substrate 20 during heating, the heat insulating plate 110 is retracted so as not to be positioned between the heater 71a and the substrate 20. When the heating is finished and cooling is performed, the heater 71a moves away from the substrate 20, and the heat insulating plate 110 is inserted between the heater 71a and the substrate 20. By doing in this way, it can prevent that the remaining heat of the heater 71a after a heating reaches the board | substrate 20. FIG. Therefore, it can cool efficiently and can aim at shortening of cooling time.

  In the local heating device of the present embodiment, the cooling nozzle 81a of the upper surface side cooling unit 80a and the cooling nozzle 81b of the lower surface side cooling unit 80b are directed to the coating solution or the thermosetting member 21 on the substrate 20 during heating. Yes. Specifically, in the state where the upper surface side heating unit 70a and the lower surface side heating unit 70b are positioned at the heating position, the jet nozzles of the cooling nozzles 81a and 81b are directed to the coating liquid or the thermosetting member 21.

  In this way, after the heating is finished, the bases 78a and 78b are moved to start cooling without positioning the upper surface side cooling unit 80a and the lower surface side cooling unit 80b on the coating liquid or the thermosetting member 21. be able to. Therefore, the processing time of the substrate 20 can be shortened. About another structure, since it is the same as that of the local heating apparatus of Embodiment 9, description is not repeated.

  FIG. 16 is a schematic diagram illustrating an example of a heat insulating plate mounting structure. As shown in FIG. 16, a guide rail 117 when the heat insulating plate 110 moves is arranged, and the heat insulating plate 110 slides in the X-axis direction along the guide rail 117. A metal fitting 114 for attaching the wire 112 and the spring 115 is provided on the upper surface of the heat insulating plate 110.

  One end of the spring 115 is attached to the fixing portion 116 on the base 78 a and the other end is attached to the metal fitting 114 of the heat insulating plate 110. Therefore, the heat insulating plate 110 is urged by the spring 115 in a direction away from directly below the heater 71a. One end of the wire 112 is attached to the fixing portion 111 provided on the side surface of the holder 72 a, and the other end is attached to the metal fitting 114 via the pulley 113. With this configuration, the heat insulating plate 110 can be moved in the X-axis direction in conjunction with the movement of the heater 71a in the Z-axis direction.

  Although the heat insulating plate 110 is provided in the local heating device of the present embodiment, the heat insulating plate 110 may not be provided. Also in this case, since the bases 78a and 78b can be cooled without moving after the heating, the substrate processing time can be shortened.

Embodiment 11
FIG. 17 is a schematic diagram showing the structure of a local heating device according to Embodiment 11 of the present invention. As shown in FIG. 17, in the local heating apparatus according to Embodiment 11 of the present invention, a heat insulating plate 110 is provided on the upper surface side heating unit 70a. Since it is the same as that of the local heating apparatus of Embodiment 9 about structures other than the heat insulation board 110, description is not repeated.

  In the local heating apparatus of this embodiment, after the heating is finished, the heaters 71a and 71b are moved in the Z-axis direction so as to be separated from the substrate 20. At this time, the heat insulating plate 110 is inserted between the heater 71 a and the substrate 20. In this way, the remaining heat of the heater 71a is prevented from reaching the substrate 20.

  Thereafter, the bases 78a and 78b are moved by a distance x1 in the X-axis direction to position the upper surface side cooling unit 80a and the lower surface side cooling unit 80b with respect to the coating liquid on the substrate 20 or the thermosetting member 21. Next, the cooling nozzle 81a of the upper surface side cooling unit 80a and the cooling nozzle 81b of the lower surface side cooling unit 80b are moved with respect to the substrate 20 so as to have a predetermined interval. In this state, the substrate 20 is cooled.

  Thus, in this embodiment, the upper surface side cooling unit 80a and the lower surface side cooling unit 80b are optimal for cooling the substrate while preventing the remaining heat of the heater 71a after heating from reaching the substrate 20 by the heat insulating plate 110. Can be placed at a distance to cool. Therefore, it can cool efficiently and cooling time can be shortened.

Embodiment 12
FIG. 18 is a cross-sectional view showing the structure of the local heating device according to Embodiment 12 of the present invention. As shown in FIG. 18, the local heating apparatus according to Embodiment 12 of the present invention includes upper surface side heating units 70a and 70a ′ and lower surface side heating units 70b and 70b ′. In the present embodiment, two upper surface side heating units and two lower surface side heating units are provided, but three or more may be provided.

  The heating temperatures of the substrate 20 in the upper surface side heating unit 70a and the upper surface side heating unit 70a 'are controlled to be different from each other. Basically, the heating temperature of the upper surface side heating unit 70a 'is set to be higher than the heating temperature of the upper surface side heating unit 70a. Similarly, the heating temperature of the substrate 20 between the lower surface side heating unit 70b and the lower surface side heating unit 70b 'is controlled to be different. Basically, the heating temperature of the lower surface side heating unit 70b 'is set to be higher than the heating temperature of the lower surface side heating unit 70b.

  The upper surface side heating units 70a and 70a 'and the lower surface side heating units 70b and 70b' are provided with a temperature control unit (not shown) which is a temperature control means for controlling the heating temperature. About another structure, since it is the same as that of the local heating apparatus of Embodiment 9, description is not repeated.

  As shown in FIG. 18, the upper surface side heating unit 70a, the upper surface side heating unit 70a ', and the upper surface side cooling unit 80a are mounted on the base 78a. The upper surface side heating unit 70a 'has the same structure as the upper surface side heating unit 70a.

  A lower surface side heating unit 70b, a lower surface side heating unit 70b ', and a lower surface side cooling unit 80b are mounted on the base 78b. The lower surface side heating unit 70b 'has the same structure as the lower surface side heating unit 70b.

  Hereinafter, the heating and cooling method of the local heating device according to the present embodiment will be described. First, the upper surface side heating unit 70 a and the lower surface side heating unit 70 b are positioned at the position of the coating solution or the thermosetting member 21 on the substrate 20. Thereafter, the lower surface side heating unit 70b heats the substrate 20 in contact with or close to the lower surface of the substrate 20. The upper surface side heating unit 70a heats the substrate 20 with a predetermined distance h1 from the substrate 20.

  The upper surface side heating unit 70a and the lower surface side heating unit 70b move in the Z-axis direction so as to be separated from the substrate 20 after the heating is completed. Next, the base 78a and the base 78b are moved by a distance x1 in the X-axis direction, and the upper surface side heating unit 70a ′ and the lower surface side heating unit 70b ′ are placed at the position of the coating liquid or the thermosetting member 21 on the substrate 20. Position.

  By the temperature control unit, the heating temperature of the upper surface side heating unit 70a ′ is set higher than the heating temperature of the upper surface side heating unit 70a, and the heating temperature of the lower surface side heating unit 70b ′ is set higher than the heating temperature of the lower surface side heating unit 70b. Has been. The lower surface side heating unit 70 b ′ heats the substrate 20 in contact with or close to the lower surface of the substrate 20. The upper surface side heating unit 70 a ′ heats the substrate 20 with a predetermined distance from the substrate 20.

  The upper surface side heating unit 70 a ′ and the lower surface side heating unit 70 b ′ move in the Z-axis direction so as to be separated from the substrate 20 after the heating is completed. Next, the base 78a and the base 78b are moved by a distance x2 in the X-axis direction, and the upper surface side cooling unit 80a and the lower surface side cooling unit 80b are positioned at the position of the coating solution or thermosetting member 21 on the substrate 20. .

  Each of the upper surface side cooling unit 80a and the lower surface side cooling unit 80b cools the substrate 20 with a predetermined interval. After completion of cooling, the upper surface side cooling unit 80a and the lower surface side cooling unit 80b move in the Z-axis direction so as to be separated from the substrate 20.

  In this way, by heating the substrate 20 using a plurality of heating units, the load on each heating unit can be reduced. Therefore, the life of the heating unit can be extended. As a result, maintenance time such as periodic replacement of the heating unit can be shortened, and manufacturing time can be shortened.

  Further, by providing a plurality of heating units, it becomes possible to continue production even if one heating unit fails, and to improve the stability of the apparatus. Furthermore, it becomes possible to heat the heating target in stages at different heating temperatures, and a high-quality film can be formed by heating in a heating process according to the type of the coating liquid or the thermosetting member 21. it can.

Embodiment 13
FIG. 19 is a cross-sectional view showing the structure of the local heating device according to Embodiment 13 of the present invention. As shown in FIG. 19, the local heating apparatus according to Embodiment 13 of the present invention includes upper surface side heating units 70a and 70a ′ and lower surface side heating units 70b and 70b ′. In the present embodiment, two upper surface side heating units and two lower surface side heating units are provided, but three or more may be provided. The upper surface side heating units 70a and 70a ′ are provided with heat insulating plates 110 and 110 ′.

  In the cooling nozzles 81a and 81b of the upper surface side cooling unit 80a and the lower surface side cooling unit 80b, the upper surface side heating unit 70a ′ and the lower surface side heating unit 70b ′ are positioned on the coating liquid or the thermosetting member 21 on the substrate 20. In this state, the spout is directed to the coating solution or the thermosetting member 21. About another structure, since it is the same as that of the local heating apparatus of Embodiment 10, description is not repeated.

  Hereinafter, the heating and cooling method of the local heating device according to the present embodiment will be described. First, the upper surface side heating unit 70 a and the lower surface side heating unit 70 b are positioned at the position of the coating solution or the thermosetting member 21 on the substrate 20. Thereafter, the lower surface side heating unit 70b heats the substrate 20 in contact with or close to the lower surface of the substrate 20. The upper surface side heating unit 70a heats the substrate 20 with a predetermined distance h1 from the substrate 20.

  The upper surface side heating unit 70a and the lower surface side heating unit 70b move in the Z-axis direction so as to be separated from the substrate 20 after the heating is completed. The heat insulating plate 110 is inserted between the upper surface side heating unit 70a and the substrate 20 in conjunction with the movement of the upper surface side heating unit 70a. Next, the base 78a and the base 78b are moved by a distance x1 in the X-axis direction, and the upper surface side heating unit 70a ′ and the lower surface side heating unit 70b ′ are placed at the position of the coating liquid or the thermosetting member 21 on the substrate 20. Position.

  By the temperature control unit, the heating temperature of the upper surface side heating unit 70a ′ is set higher than the heating temperature of the upper surface side heating unit 70a, and the heating temperature of the lower surface side heating unit 70b ′ is set higher than the heating temperature of the lower surface side heating unit 70b. Has been. The lower surface side heating unit 70 b ′ heats the substrate 20 in contact with or close to the lower surface of the substrate 20. The upper surface side heating unit 70 a ′ heats the substrate 20 with a predetermined distance from the substrate 20.

The upper surface side heating unit 70a ′ and the lower surface side heating unit 70b ′ move in the Z-axis direction so as to be separated from the substrate 20 after the heating is completed. The heat insulating plate 110 ′ is inserted between the upper surface side heating unit 70 a ′ and the substrate 20 in conjunction with the movement of the upper surface side heating unit 70 a ′. Next, the upper surface side cooling unit 80a and the lower surface side cooling unit 80b cool the coating liquid or the thermosetting member 21 by blowing cooling air without moving the bases 78a and 78b.

  Thus, by heating the substrate 20 using a plurality of heating units, the load on each heating unit can be reduced. Therefore, the life of the heating unit can be extended. As a result, maintenance time such as periodic replacement of the heating unit can be shortened, and manufacturing time can be shortened.

  Further, after the heating is completed, the cooling can be started without moving the bases 78a and 78b and positioning the upper surface side cooling unit 80a and the lower surface side cooling unit 80b on the coating liquid or the thermosetting member 21. Therefore, the processing time of the substrate 20 can be shortened.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiment, but is defined based on the description of the scope of claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

  DESCRIPTION OF SYMBOLS 1 Local heating apparatus, 20 Substrate, 20b Thermal diffusion part, 21 Coating liquid or thermosetting member, 21a Contact surface, 21b Surface part, 30 Conveyance roller, 31 Chucking, 32, 41a, 41b, 83a, 83b Guide shaft , 33 Air, 40a, 40b Motor, 50 Base, 51, 55 Support member, 52 Post, 53 Gantry, 54, 56 Z-axis stage, 70a, 70a ′ Upper surface side heating unit, 70b, 70b ′ Lower surface side heating unit, 71a , 71a ′, 71b, 71b ′, 71c heater, 72a, 72a′72b, 72b′82a, 82b holder, 73a, 73a ′, 73b, 73b ′, 73c guide shaft, 74, 74a ′, 74b, 74b′84a 84b Ball screw, 75a, 75b, 75c, 78c, 85a, 85b Stepping motor, 76a, 9a cover, 77a exhaust unit, 78a, 78b, 78c, 78d base, 80a upper surface side cooling unit, 80b lower surface side cooling unit, 81a, 81b cooling nozzle, 90 control unit, 100 height adjustment unit, 101 terminal, 110 heat insulating plate 111, 116 fixing part, 112 wire, 113 pulley, 114 metal fitting, 115 spring, 117 guide rail, 171b heater, 172b thermocouple, 173b adsorption hole, 174b, 175b piping, 176b adsorption table.

Claims (14)

A device for locally heating a substrate on which at least a part of a coating solution or a thermosetting member that forms a film when dried is formed,
From the upper surface of the substrate, an upper surface side heating means for heating the substrate in a non-contact state;
A lower surface side heating means for heating from the lower surface of the substrate in contact with or close to the substrate;
A height adjusting means for moving the substrate up and down to set a reference height in contact with the lower surface of the substrate;
Moving means for positioning the upper surface side heating means and the lower surface side heating means at a local position to be heated of the substrate;
A local heating apparatus comprising: control means for controlling the upper surface side heating means to have a predetermined interval with respect to the reference height of the substrate.   The local heating apparatus according to claim 1, wherein the lower surface side heating unit is configured integrally with the height adjusting unit, and includes the lower surface side heating unit that performs heating while being in contact with the lower surface of the substrate.   The local heating apparatus according to claim 1, wherein the moving unit includes a mechanism that independently moves the upper surface side heating unit and the lower surface side heating unit.   The local heating apparatus according to claim 1, wherein the lower surface side heating unit includes a unit that adsorbs the substrate.   The local heating device according to any one of claims 1 to 4, wherein heating by the lower surface side heating unit is started prior to heating by the upper surface side heating unit.   The local heating device according to claim 1, wherein a heating temperature by the lower surface side heating unit is lower than a heating temperature by the upper surface side heating unit. A cover formed around the heating part of at least one of the upper surface side heating means and the lower surface side heating means;
The local heating device according to claim 1, further comprising an exhaust unit that exhausts the air in the cover. A cover formed over the entire movable region of at least one of the upper surface side heating means and the lower surface side heating means;
The local heating device according to claim 1, further comprising an exhaust unit that exhausts the air in the cover. An upper surface side cooling means for cooling the local position from the upper surface of the substrate;
A lower surface side cooling means for cooling the local position from the lower surface of the substrate;
The local heating device according to any one of claims 1 to 8, further comprising a cooling adjustment unit that operates or stops the upper surface side cooling unit and the lower surface side cooling unit. The upper surface side heating means and the lower surface side heating means are respectively separated from the substrate in comparison with the heating positions of the upper surface side heating means and the lower surface side heating means,
The local heating apparatus according to claim 9, wherein the upper surface side cooling unit and the lower surface side cooling unit are positioned at the local position by the moving unit to cool the local position of the substrate. The upper surface side heating means and the lower surface side heating means are separated from the substrate and compared with the heating positions of the upper surface side heating means and the lower surface side heating means, respectively, and the upper surface side heating means and the lower surface side With the heating means positioned at the local position,
The local heating device according to claim 9, wherein the upper surface side cooling unit and the lower surface side cooling unit cool the local position of the substrate.   The local heating device according to any one of claims 9 to 11, further comprising a height control unit that controls heights of the upper surface side cooling unit and the lower surface side cooling unit. It further comprises a plate-like heat insulating plate having heat insulating properties,
With the heat insulating plate inserted between the upper surface side heating means and the substrate,
The local heating apparatus according to claim 9, wherein the upper surface side cooling unit and the lower surface side cooling unit cool the local position of the substrate. A plurality of the upper surface side heating means and the lower surface side heating means,
The local heating apparatus according to any one of claims 9 to 13, wherein a plurality of the upper surface side heating means and the lower surface side heating means are provided with temperature control means for controlling the heating temperature of the substrate to be different from each other. .

Images