JP2010022668A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve waterproof property of an electronic device. <P>SOLUTION: The electronic device characteristically includes: a chassis 20 which has a sensor module 50 which has one surface, the other surface opposite to the one surface and a plurality of solder balls 52 on the one surface; a wiring board 51 which has a first surface 51a and in which the solder balls 52 are electrically connected on the first surface 51a and the sensor module 50 is mounted; an adhesive member 70 which is bonded to the wiring board 51 and the sensor module 50 by being applied around the sensor module 50; an upper wall 20j; an opening 20D which is formed on the upper wall 20j and exposes the other surface of the sensor module 50; and a projecting portion 23 which is installed in the vicinity of the opening 20D around the opening 20D and is bonded to the wiring board 51 through the adhesive member 70. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device, and more particularly to an electronic device having a waterproof function.

2. Description of the Related Art There are electronic devices that employ a sealed structure that prevents water and moisture from entering and dust from entering. For example, Patent Document 1 discloses an information processing apparatus in which the periphery of a fingerprint sensor module is coated with a waterproof resin. In this information processing device, a packing material is disposed around the fingerprint sensor module, and the gap between the outer case and the substrate of the information processing device is sealed with the packing material to waterproof the fingerprint sensor portion exposed to the outside. ing.
JP 2007-143909 A (refer to the fourth item and FIG. 2)

  However, the conventional electronic device disclosed in Patent Document 1 cannot ensure high waterproof performance. That is, in the electronic device disclosed in the literature, no consideration is given to waterproofing in the gap formed between the housing opening and the module.

  Therefore, there has been a problem that water that has entered from the opening portion accumulates between the fingerprint sensor module and the packing material disposed around the fingerprint sensor module.

  Therefore, the present invention has been made to solve the above-described problem, and an object thereof is to improve the waterproofness of an electronic device.

  In order to solve the above-described problem, an electronic device according to the present invention has one surface and the other surface opposite to the one surface, and a plurality of solder balls on the one surface. A sensor module, a wiring board having a first surface and electrically mounting the plurality of solder balls on the first surface to mount the sensor module, and surrounding the sensor module Thus, an adhesive member joined to the wiring board and the sensor module, an upper wall, an opening formed on the upper wall and exposing the other surface of the sensor module, and the opening And a housing having a protruding portion joined to the wiring board via the adhesive member.

  An electronic device according to the present invention includes a sensor module having one surface and the other surface opposite to the one surface, and having a plurality of solder balls on the one surface, and the sensor. The sensor module has a first surface provided with a projecting portion surrounding the module mounting arrangement, and the plurality of solder balls are electrically connected to the sensor module mounting arrangement on the first surface. And an adhesive member bonded to the wiring board and the sensor module, and facing the protrusion, and being bonded to the sensor module including the protrusion and the periphery of the sensor module. A housing having an upper wall joined to the projecting portion through a member and an opening formed on the upper wall and exposing the other surface of the sensor module is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the waterproofness of an electronic device can be improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(Configuration of electronic equipment)
FIG. 1 is a schematic diagram showing an external appearance of an electronic apparatus according to an embodiment of the present invention. FIG. 1 discloses a notebook personal computer as an example of an embodiment of the present invention.

  The personal computer 100 according to the present embodiment includes a display unit 10A and a main body unit 20A. The display unit 10A and the main unit 20A are connected to each other by a hinge unit 15 so as to be freely opened and closed. The main body 20 </ b> A has a lower housing 20. The lower housing 20 is a printed circuit board on which electronic components such as a CPU (Central Processing Unit) and a memory are mounted, and houses a main body function unit 2 that processes information.

  The lower housing 20 has an upper surface 20a, a bottom surface 20b, a left side surface 20e, a right side surface 20f, a front surface 20g, a back surface 20h, and a lower surface 20j. The lower housing 20 includes a character input unit 3 such as a keyboard for inputting characters and commands, a track pad 4A as a pointing device, a determination switch 4B for inputting selection / determination commands, and a user. And a fingerprint reading unit 5 used for authentication and the like. Openings 20A to 20D are opened in the upper surface 20a. A recess 21 is formed around the opening 20D on the upper surface 20a. The character input unit 3 is exposed from the opening 20A. The track pad 4A is exposed from the opening 20B. The decision switch 4B is exposed from the opening 20C. The fingerprint reading unit 5 is exposed from the opening 20D. The lower surface 20j will be described later with reference to FIG.

  The display unit 10 </ b> A has an upper housing 10. The upper housing 10 accommodates an image display unit 1 including a liquid crystal display panel that displays characters, images, and the like. The upper housing 10 has a front surface 20i. An opening 20E is opened in the front surface 20i. The image display unit 1 is exposed from the opening 20E. The personal computer 100 corresponds to the electronic device of the present invention. The lower housing 20 corresponds to the housing of the present invention. The lower surface 20j corresponds to the upper wall of the present invention. The opening 20D corresponds to the opening of the present invention.

  Between the openings 20A to E formed in the upper casing 10 and the lower casing 20 and the electronic components such as the image display unit 1 exposed from these openings 20A to E, respectively. There are gaps 21A-E. Therefore, when water overflows in the personal computer 100, it may be flooded from these gaps 21A-E. In the unlikely event of water immersion, the personal computer 100 may be damaged.

  Therefore, the personal computer 100 according to the present embodiment includes a structure for preventing water from entering the housing. Hereinafter, the waterproof structure in the present embodiment will be described using the configuration around the opening 20D from which the fingerprint reading unit 5 is exposed as an example.

(Configuration of fingerprint reader)
With reference to FIGS. 2 and 3, the configuration around the opening 20 </ b> D where the fingerprint reading unit 5 is exposed will be described. FIG. 2 is a perspective view illustrating the configuration of the fingerprint reading unit of the personal computer 100 according to the present embodiment. FIG. 3 is a perspective view showing each component of the fingerprint reading unit of the personal computer 100 according to the present embodiment.

The fingerprint reading unit 5 according to this embodiment includes a sensor mounting substrate 51, a fingerprint sensor 50, an adhesive member 70, and a recess 21.
The sensor mounting substrate 51 has an upper surface 51a and a lower surface 51b. The upper surface 51a faces the lower surface 20j of the lower housing 20, and the fingerprint sensor 50 is mounted thereon. The lower surface 50b is a surface opposite to the upper surface 51a, and for example, electronic components 80a and 80b are mounted thereon. Circuit wiring (not shown) for transmitting information from the fingerprint sensor 50 to the main body function unit 2 and the like is disposed on the upper surface 51a and the lower surface 51b.

  The fingerprint sensor 50 includes a sensor surface 50a, a sensor main body 50c, and solder balls 52. The sensor surface 50a includes a fingerprint reading surface 50b, resin surfaces 50c and 50d, and a line sensor A. The fingerprint reading surface 50b reads a fingerprint. The resin surfaces 50c and 50d are formed in a convex shape and guide the finger to the center of the fingerprint reading surface 50b. The line sensor A scans the surface of the slid user's finger two-dimensionally. The sensor main body 50c detects the fingerprint shape of the finger touching the sensor surface 50a based on the difference in capacitance. The solder ball 52 is heated to melt the solder paste, and the fingerprint sensor 50 and the sensor mounting substrate 51 are electrically and mechanically connected.

  The adhesive member 70 is an elastic body such as silicon. The adhesive member 70 is applied around the fingerprint sensor 50 by a dispenser or the like, and seals the solder ball 52. The adhesive member 70 closes the gap 21D formed between the opening 20D and the fingerprint sensor 50. In this embodiment, a material having a low material viscosity is used as the adhesive member 70. When a low-viscosity material is used as the adhesive member 70, by applying pressure to the adhesive member 70, the surface of the adhesive member 70 can be joined to the lower surface 20j, the fingerprint sensor 50, and the sensor mounting substrate 51 without unevenness. The water ingress path from the part 21D can be cut off.

  The recess 21 has inclined surfaces 21a and 21b and side surfaces 21c and 21d around the opening 20D. The inclined surfaces 21a and 21b are inclined to guide the finger to the sensor surface 50a exposed from the opening 20D continuously from the upper surface 20a. The side surfaces 21c and 21d guide the finger so that the sliding direction is orthogonal to the fingerprint reading surface 50b. Note that the fingerprint sensor 50 of this embodiment corresponds to the sensor module of the present invention. The sensor surface 50a corresponds to one surface of the present invention. The sensor mounting substrate 51 corresponds to the wiring board of the present invention. The upper surface 51a corresponds to the first surface of the present invention. The solder ball 52 corresponds to the solder ball of the present invention. The adhesive member 70 corresponds to the adhesive member of the present invention.

  Next, the structure of the fingerprint reading unit 5 in this embodiment will be described with reference to FIGS. FIG. 4 is a diagram showing the structure of the recess 21 in the lower housing 20 of the present embodiment. FIG. 4A is a view of the recess 21 as seen from the upper surface 20a side. FIG. 4B is a view of the recess 21 as seen from the lower surface 20j side. FIG.4 (c) is sectional drawing in a BB part. FIG. 5 is a cross-sectional view taken along a line AA in FIG.

  In the lower case 20 of the personal computer 100 of the present embodiment, there is a protrusion 23 on the lower surface 20j (upper wall) facing the sensor mounting substrate 51 around the opening 20D. The protrusion 23 presses the adhesive member 70 between the sensor mounting substrate 51 and fixes the adhesive member 70. That is, the protrusion 23 can apply pressure to the adhesive member 70 to join the surface of the adhesive member 70 to the lower surface 20j, the fingerprint sensor 50, and the sensor mounting substrate 51 without unevenness.

  The protruding portion 23 has a cross-sectional shape protruding in a semicircular shape from the lower surface 20j. For this reason, the surface area which contact | connects the lower surface 20j which has the protrusion part 23, and the adhesive member 70 spreads, it becomes difficult to permeate water, and it can improve waterproofness. In addition, the protrusion part 23 of a present Example respond | corresponds to the protrusion part of this invention.

  As shown in FIG. 5, the height s of the protrusion 23 is designed to be equal to or less than the distance t between the lower surface 20 j of the lower housing 20 and the upper surface 51 a of the sensor mounting substrate 51. The distance u from the fingerprint sensor 50 to the protrusion 23 is designed to be equal to or less than the distance v from the fingerprint sensor 50 to the end of the adhesive member 70.

  In this embodiment, an example in which the cross-sectional shape of the protruding portion 23 is a semicircular shape has been shown. However, the present invention is not limited to this, and the gap portion 21D formed between the opening portion 20D and the fingerprint sensor 50 is closed evenly. Any cross-sectional shape such as a rectangle or a triangle may be adopted. Moreover, although the example in the case of surrounding the opening 20D with one protrusion 23 is shown in the present embodiment, even if the plurality of protrusions 23 are provided, the waterproof performance can be improved by surrounding the openings 20D in multiple layers. Good.

  As described above, in the present embodiment, the opening 20 </ b> D is surrounded by the protrusion 23 so that pressure is evenly applied to the adhesive member 70. As a result, the gap portion 21D formed between the opening 20D and the fingerprint sensor 50 can be closed without unevenness. Further, the adhesive member 70 can be firmly pressed and fixed. As a result, it is difficult for water to enter and the waterproofness is improved.

  Next, the mounting process of the fingerprint sensor 50 according to the present embodiment will be described with reference to FIGS. FIG. 6 is a diagram illustrating a process of mounting the fingerprint sensor 50 on the sensor mounting substrate 51 in the present embodiment. FIG. 7 is a diagram illustrating a process of applying the adhesive member 70 in the present embodiment. FIG. 8 is a diagram illustrating a process of mounting the fingerprint sensor 50 and the sensor mounting substrate 51 on the lower housing 20 in the present embodiment.

  The fingerprint sensor 50 of this embodiment is a ball grid array type (BGA) semiconductor package having solder balls 52. The solder ball 52 functions as an external terminal of the semiconductor package. As described above, the solder ball 52 is heated to melt the solder paste and mechanically connect the fingerprint sensor 50 and the sensor mounting substrate 51. The solder ball 52 electrically connects the fingerprint sensor 50 to the circuit wiring and electronic components 80a, 80b, etc. mounted on the sensor mounting board 51.

  After the fingerprint sensor 50 is mounted on the sensor mounting substrate 51, the adhesive member 70 is applied. In this coating process, a dispenser or the like is used. In the present embodiment, a certain amount of the adhesive member 70 can be disposed around the fingerprint sensor 50 by causing the needle of the dispenser from which the adhesive member 70 has been discharged to make a round on the fingerprint sensor 50.

After application of the adhesive member 70, the fingerprint sensor 50 is mounted on the lower housing 20 so that the sensor surface 50a is exposed from the opening 20D formed in the lower housing 20.
When the fingerprint sensor 50 is mounted on the lower housing 20, the adhesive member 70 is pressed by the protruding portion 23. The adhesive member 70 is bonded to the upper surface 51a, the lower surface 20j, and the fingerprint sensor 50 without a gap by the pressure from the protrusion 23. Thereby, it becomes possible to block the gap portion 21D formed between the housing and the module provided at the position exposed from the opening of the housing.

  In the present embodiment, since the adhesive member 70 is pressure-bonded and fixed by the protruding portion 23 provided in the lower housing 20, a soft material that does not cure at room temperature can be used for the adhesive member 70.

  However, when a material having a low material viscosity at the time of application is used as the adhesive member 70, the adhesive member 70 may flow without staying at the fixed position before being crimped by the protrusion 23. Therefore, a barrier for preventing the adhesive member 70 from flowing out on the sensor mounting substrate 51 and fixing the adhesive member 70 at a fixed position may be provided around the opening. Hereinafter, a configuration for preventing the adhesive member 70 from flowing out will be described with reference to FIGS. 9 and 10.

  FIG. 9 is a view showing the structure of the sensor mounting substrate 51 provided with a flow-out prevention wall for the adhesive member 70 of this embodiment. FIG. 9A is a view of the sensor mounting substrate 51 provided with a flow-out prevention wall of the adhesive member 70 of this embodiment as viewed from the upper surface 51a side. FIG. 9B is a cross-sectional view taken along the line CC.

  FIG. 10 is a diagram illustrating a process of applying the adhesive member 70 to the sensor mounting substrate 51 provided with the flow-out prevention wall of the adhesive member 70 of the present embodiment. FIG. 10A is a diagram illustrating a process of applying the adhesive member 70. FIG. 10B is a diagram illustrating a state after application of the adhesive member 70. FIG. 10C is a diagram illustrating a state where the fingerprint sensor 50 and the sensor mounting substrate 51 are mounted on the lower housing 20 after the adhesive member 70 is applied.

  The barrier 80 is provided so as to surround the fingerprint sensor 50 mounted on the sensor mounting board 51. The height p of the barrier wall 80 is higher than the distance r from the upper surface 51a of the sensor mounting substrate 51 to the tip of the protruding portion 23, and the distance l from the upper surface 51a of the sensor mounting substrate 51 to the upper surface 20a of the lower housing 20. Designed lower.

  When the height p of the barrier wall 80 is designed to be higher than the distance t from the upper surface 51a of the sensor mounting substrate 51 to the lower surface 20j of the lower housing 20, the barrier wall 80 is placed on the lower surface 20j of the lower housing 20. A recess 81 for adjusting the distance from the upper surface 51a to the lower surface 20j during mounting is formed.

  As described above, in this embodiment, the height of the barrier portion 80 is designed to be higher than the distance r from the upper surface 51a of the sensor mounting substrate 51 to the distal end portion of the protruding portion 23, so that the adhesive member 70 is increased until the distance r or more. Can be applied.

  The distance q from the fingerprint sensor 50 to the barrier 80 is designed to be longer than the distance u from the fingerprint sensor 50 to the protrusion 23. That is, in the present embodiment, the barrier portion 80 is formed so as to surround the protruding portion 23. In this embodiment, the barrier unit 80 may be designed to be detachable. For example, by using a fluorine-processed material such as Teflon (registered trademark) as the barrier 80, the adhesive member 70 can be removed without peeling off. In this case, if the height p of the barrier 80 is designed to be greater than the distance t, it is not necessary to form the recess 81.

  As described above, in this embodiment, the adhesive member 70 can be applied to the position where the protrusion 23 is pressed. Therefore, the adhesive member 70 can be made of a soft material that does not harden at room temperature or a material that has a low material viscosity at the time of application. When a resin material with high hardness such as underfill is used, stress interference with the housing may occur, or strict dimensional management at the time of design is required, but a soft material should be used as the adhesive member 70 If this is possible, there will be no stress interference with the housing, and there will be no physical or electrical influence on the surroundings. In addition, strict dimensional management at the time of designing becomes unnecessary, and the design efficiency is improved.

  In the present embodiment, an example in which the protruding portion is formed on the lower surface 20j of the lower housing 20 is shown, but the present invention is not limited to this, and the adhesive member 70 is spaced from the upper surface 51a, the lower surface 20j, and the fingerprint sensor 50. The structure may be formed on the upper surface 51 a of the sensor mounting substrate 51 as long as the structure can be closely adhered. Hereinafter, the configuration when the protrusion is formed on the upper surface 51a of the sensor mounting substrate 51 will be described with reference to FIGS.

  FIG. 11 is a perspective view showing an assembly configuration of the fingerprint reading unit when the protruding portion is formed on the upper surface 51 a of the sensor mounting substrate 51. FIG. 12 is a cross-sectional view of the fingerprint reading unit when the protrusion is formed on the upper surface 51 a of the sensor mounting substrate 51.

  As shown in FIG. 11, the protrusion 24 is formed so as to surround the mounting position 53 of the fingerprint sensor 50 in the adhesive member application region 54 of the sensor mounting substrate upper surface 51 a. In the structure in which the protrusion 24 is formed on the sensor mounting substrate upper surface 51a, the adhesive member 70 can be pressure-bonded between the protrusion 24 and the lower surface 20j of the lower housing 20, as shown in FIG. The effect similar to the structure in which the protrusion 23 described in FIG. 10 is formed on the lower surface 20j of the lower housing 20 can be obtained. In the case of the structure in which the protruding portion 24 is formed on the sensor mounting substrate upper surface 51a, the protruding portion 24 needs to be formed at a position facing the lower surface 20j in order to press the adhesive member 70 between the lower surface 20j.

  As described above, in this embodiment, the surface of the adhesive member 70 is joined to the lower surface 20j, the fingerprint sensor 50, and the sensor mounting substrate 51 without unevenness by applying pressure to the adhesive member 70 using the protrusions 23 and 24. Can cut off the water ingress path. Therefore, the gap 21D formed between the opening 20D and the fingerprint sensor 50 is blocked by the adhesive member 70 and can prevent entry of water, moisture, dust, or the like. Thus, according to the present embodiment, the waterproofness of the electronic device can be improved.

  The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine a component suitably in different embodiment.

It is the schematic which shows the external appearance of the personal computer which concerns on this embodiment. It is a perspective view which shows the structure of the fingerprint reading part of the personal computer which concerns on this embodiment. It is a perspective view which shows the assembly structure of the fingerprint reading part of the personal computer which concerns on this embodiment. It is the figure which showed the protrusion part of the personal computer which concerns on this embodiment. It is sectional drawing of the fingerprint reading part of the personal computer which concerns on this embodiment. It is the figure which showed the process of mounting the fingerprint sensor in this embodiment on a sensor mounting board. It is the figure which showed the application | coating process of the adhesive member in this embodiment. It is the figure which showed the mounting process of the fingerprint reading part of the personal computer which concerns on this embodiment. It is the figure which showed the barrier part of the personal computer which concerns on this embodiment. It is the figure which showed the mounting process of the fingerprint reading part in the case of having the barrier part of the personal computer concerning this embodiment. It is a perspective view which shows the assembly structure of the fingerprint reading part in case the protrusion part which concerns on this embodiment is formed in the sensor mounting substrate upper surface. It is sectional drawing of the fingerprint reading part in case the protrusion part which concerns on this embodiment is formed in the sensor mounting substrate upper surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Image display part 2 ... Main body function part 3 ... Character input part 4A ... Trackpad 4B ... Decision switch 5 ... Fingerprint reading part 10A ... Display part 10 ... Upper housing | casing 20A ... Main body part 20 ... Lower housing | casing (casing)
20a ... upper surface 20b ... bottom surface 20e ... left side surface 20f ... right side surface 20g ... front surface 20h ... back surface 20i ... front surface 20j ... lower surface 21 ... depression 21a ... slope 21b ... slope 21c ... side surface 21d ... side surface 21e ... opening (opening)
23, 24 ... Projection (projection)
50 ... Fingerprint sensor (sensor module)
50a ... Sensor surface (one surface)
50b ... fingerprint reading surface 50c ... resin surface 50d ... resin surface 50e ... mounting surface 51 ... sensor mounting substrate (wiring board)
51a ... Mounting surface 52 ... Solder ball (solder ball)
53 ... Fingerprint sensor mounting position 54 ... Adhesive member application area 70 ... Adhesive member (adhesive member)
80 ... concave portion 80a ... electronic component 100 ... personal computer (electronic device)
l: Distance from the top surface of the sensor mounting substrate to the top surface of the lower housing p: Height of the barrier wall q: Distance from the fingerprint sensor to the barrier wall r: Distance s from the top surface of the sensor mounting substrate to the tip of the protruding portion ... Height t of the protruding portion ... Distance between the lower surface of the lower housing and the upper surface of the sensor mounting substrate u ... Distance between the fingerprint sensor and the protruding portion v ... Distance from the fingerprint sensor to the edge of the adhesive member

Claims (8)

A sensor module having one surface and the other surface opposite to the one surface, and having a plurality of solder balls on the one surface;
A wiring board having a first surface and mounting the sensor module by electrically connecting the plurality of solder balls on the first surface;
By being applied around the sensor module, an adhesive member joined to the wiring board and the sensor module;
An upper wall, an opening formed on the upper wall and exposing the other surface of the sensor module, and provided in the vicinity of the opening surrounding the opening, and the wiring board via the adhesive member A housing having a joined protrusion, and
An electronic device characterized by comprising:   The electronic device according to claim 1, wherein the adhesive member closes a gap formed between the opening and the sensor module.   The electronic device according to claim 2, wherein the protruding portion has a cross-sectional shape protruding in a semicircular shape from the upper wall.   The electronic device according to claim 3, wherein the projecting portion is provided in the vicinity of the opening so as to surround the opening and is joined to the wiring board via the adhesive portion.   The electronic device according to claim 2, wherein the wiring board includes a barrier portion formed so as to surround an outer edge of an application position of the adhesive member. A sensor module having one surface and the other surface opposite to the one surface, and having a plurality of solder balls on the one surface;
A first surface provided with a projecting portion surrounding the mounting arrangement of the sensor module; and the plurality of solder balls are electrically connected to the mounting arrangement of the sensor module on the first surface, A wiring board mounted with a sensor module;
An adhesive member joined to the wiring board and the sensor module by being applied around the sensor module including the protruding portion, and
A housing having an upper wall facing the projecting portion and joined to the projecting portion via the adhesive member, and an opening formed on the upper wall and exposing the other surface of the sensor module;
An electronic device characterized by comprising:   The electronic device according to claim 6, wherein the adhesive member closes a gap formed between the opening and the sensor module.   The electronic device according to claim 7, wherein the protruding portion has a cross-sectional shape protruding in a semicircular shape from the wiring board.

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