JP2010012476A - Soldering system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a soldering system which is efficient in the use of energy by remarkably reducing power consumption and the peak power when a system is started in the soldering system which is constituted by having a lot of stages like a soldering device. <P>SOLUTION: In the soldering system having the preheating stage, the soldering stage and the cooling stage of a workpiece to be soldered, by providing a heat exchanging means for cooling and a heat exchanging means for heating on a heat pump, the system is constituted so that the thermal energy which is endothermically obtained from the heat exchanging means for cooling is released through the heat exchanging means for heating, the heat exchanging means for cooling is provided to the cooling stage of the soldering system and the heat exchanging means for heating is provided to the preheating stage of the soldering system. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering system for soldering and mounting electronic components on a workpiece to be soldered, for example, a printed wiring board.

  Soldering and mounting of electronic components on a printed wiring board is roughly divided into a flow soldering method for supplying molten solder to the soldered part and a solder (for example, cream solder) that has been supplied to the soldered part in advance. There is a reflow soldering method for melting.

  Any soldering method is performed by melting the solder to form an intermetallic compound in the soldered portion (forming “wetting” of the solder). Therefore, there is always a heating process for melting the solder in soldering mounting.

  Moreover, this soldering mounting is usually composed of a preheating step, a soldering step, and a cooling step in the order of the steps. In the flow soldering method, a flux application step is provided before the preheating step. Each process has a detailed role, but the basic role is as follows.

  The flux application process is provided to apply the flux to the soldered portion in the flow soldering method, and to promote the soldering in a subsequent preheating process or a soldering process.

  The preheating process has a role of heating the printed wiring board and the electronic component to a temperature slightly lower than the soldering temperature to alleviate heat shock generated in the next soldering process. Moreover, it also has a role of activating the flux supplied to the soldered portion and the flux in the cream solder in advance.

  In the soldering process, molten solder is supplied to the part to be soldered or solder that has been supplied in advance is melted to perform soldering. Therefore, not only the part to be soldered but also the printed wiring board and the electronic component are heated to the highest temperature in each step. In this soldering process, the flux is entirely activated to promote soldering.

  The cooling step promotes a decrease in the temperature of the molten solder supplied to the soldered portion, solidifies at a speed as fast as possible, promotes a decrease in temperature after solidification, and improves the soldering strength. By promoting the temperature drop of the solder, the segregation of the solder components, the coarsening of the solder structure, and the formation of nests can be suppressed, so that the soldering strength is improved.

  Thus, the main role of soldering mounting is the heating means, and usually soldering mounting is performed using the electric heater as the heating means because of its good controllability, and a large amount of power is consumed. In addition, when starting up a soldering device or soldering system, it is necessary to melt a large amount of solder or to heat the heating furnace to a predetermined temperature. Electric power reaches 3 to 5 times that of normal operation. By the way, in solder mounting of electronic components on a printed wiring board, it is usually heated to a temperature of about 250 ° C.

  Therefore, in Patent Document 1, when starting up a soldering apparatus, power is not supplied to a plurality of heaters in each unit all at once, but is supplied in order at intervals in time. And a technique for preventing the peak power from becoming large is disclosed.

Further, in Patent Document 2, in order to alleviate the heat shock that occurs during soldering, “a member to be soldered” in an inert liquid (for example, “Florinart”, a trade name of 3M Company) in which a temperature gradient is formed. Is disclosed. The use of a heat pump as a heating means or cooling means for the inert liquid is disclosed.
Japanese Patent Laid-Open No. 7-212027 JP 61-234518 A

  In recent years, reducing the amount of greenhouse gas released into the atmosphere has emerged as a global issue, and as one specific measure there has been a demand for a large-scale reduction in power consumption.

  However, with the technique of Patent Document 1, even though the peak power can be reduced, the power consumption itself cannot be reduced. In addition, there is a disadvantage that the starting time of the soldering apparatus becomes long.

  Moreover, in the technique of patent document 2, it is necessary to provide a high temperature part and a low temperature part in the inert liquid in one tank which forms a soldering environment. Therefore, a huge amount of heat is transferred from the high temperature portion to the low temperature portion, and the heating efficiency is extremely deteriorated. In addition, although the heat pump is used for heating and cooling the inert liquid, since the heat pump for heating and the heat pump for cooling are provided independently, the amount of heat released from the heat pump (heating heat amount or cooling heat amount) is also Not being used effectively.

  The present invention provides a soldering system that has a large number of processes, such as a soldering apparatus, and that significantly reduces power consumption and peak power at the time of system start-up, so that energy is not wasted. It aims at realizing.

  The present invention is characterized in that the amount of heat released in the cooling process of the soldering system is recycled to the preheating process or the soldering process and can be reused.

(1) A first invention according to the present invention is a soldering system having a preheating process, a soldering process, and a cooling process for a workpiece to be soldered, and includes a heat exchange means for cooling and a heat exchange means for heating in a heat pump. And the heat energy absorbed from the cooling heat exchanging means is discharged through the heating heat exchanging means, and the cooling heat exchanging means is provided for the cooling step of the soldering system and the heating heat exchanging means. Is configured to prepare for the preheating step of the soldering system.

  With the above configuration, the workpiece to be soldered that has become high temperature in the soldering process is cooled at a target cooling rate, that is, at a high speed by the cooling heat exchange means provided in the cooling process, and at that time, the workpiece to be soldered is deprived. The amount of heat transferred is returned to the heat exchange means for heating by a heat pump and reused for heating the work to be soldered in the preheating step. Therefore, less energy is discarded and the power consumption of the soldering system can be greatly reduced. Moreover, the COP (Coefficient Of Performance) of the heat pump is about 3 to 4, and the heating efficiency is very good.

(2) A second invention according to the present invention is a soldering system including a first preheating step, a flux application step, a second preheating step, a soldering step, and a cooling step of a work to be soldered. The heat pump is provided with a cooling heat exchange means and a heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is discharged through the heating heat exchange means, and the cooling heat exchange means is the solder In addition to preparing for the cooling process of the soldering system, the heat exchanging means for heating is configured to be included in at least either the first preheating process or the second preheating process of the soldering system.

  Similar to the first invention, the amount of heat taken from the work to be soldered in the cooling step by the above configuration is returned to the heating heat exchanging means by the heat pump, and the first preheating step or the second preheating step. It is reused for heating the work to be soldered. Since this is performed by a heat pump having a high COP, the heating efficiency is extremely high, and the power consumption of the soldering system can be greatly reduced.

(3) A third invention according to the present invention is a soldering system for performing soldering by heating and melting solder supplied in advance in a soldered portion of a work to be soldered in a hot atmosphere. In a soldering system having a preheating step, a soldering step, and a cooling step, the heat pump is provided with cooling heat exchange means and heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is used for the heating. The cooling heat exchange means is provided in the cooling process of the soldering system, and the heating heat exchange means is at least one of the preheating process and the soldering process of the soldering system. It is characterized by comprising.

  With this configuration, in this soldering system as well, in the same manner as in the first and second inventions, the amount of heat taken away from the work to be soldered in the cooling process is returned to the heat exchange means for heating by the heat pump, and the preliminary heating process Alternatively, it is used to heat the atmosphere in the soldering process, and thus to heat the work to be soldered.

  Since this is performed by a heat pump having a high COP, the heating efficiency is extremely high, and the power consumption of the soldering system can be greatly reduced.

(4) A fourth invention according to the present invention is a soldering system for performing soldering by heating and melting solder supplied in advance in a soldered part of a work to be soldered in a hot atmosphere. In a soldering system having a preheating step, a soldering step, and a cooling step, the heat pump is provided with cooling heat exchange means and heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is used for the heating. The cooling heat exchange means is provided in the cooling process of the soldering system, and the heating heat exchange means is at least one of the preheating process and the soldering process of the soldering system. And at least one of the preheating step and the soldering step of the soldering system is provided with an electric heater. Characterized by being configured.

  The present invention is a soldering system configured to further use an electric heater in addition to the configuration of the third invention. The electric heater to be used in combination is provided in the preheating process or the soldering process. In addition, you may provide in each of a preheating process and a soldering process.

  According to this configuration, the power consumption of the soldering system can be greatly reduced as in the third aspect. And it becomes possible to perform fine atmospheric temperature adjustment with the electric heater used together.

  In addition, when starting the soldering system, use a heat pump with a high COP. If the temperature of each part of the soldering system reaches the operating state, and shift to the operation by the heater, the peak power when starting the soldering system is increased. It can be greatly reduced (if COP is 3 to 4, it can be reduced to 1/3 to 1/4).

(5) A fifth invention according to the present invention includes a preheating process, a soldering process, and a cooling process for a workpiece to be soldered, and at least one of the preheating process and the soldering process. Alternatively, in a soldering system that supplies both an inert gas and the atmosphere, a heat exchange means for cooling and a heat exchange means for heating are provided in a heat pump, and the heat energy absorbed from the heat exchange means for cooling is used as the heat for heating. The cooling means is configured to discharge through the exchange means, the cooling heat exchange means is provided in the cooling process of the soldering system, and the inert gas or the inert gas and the atmosphere are heated together using the heating heat exchange means as a heating source. It is characterized by comprising supply gas heating means.

  According to this configuration, the amount of heat deprived from the work to be soldered in the cooling process is recirculated to the heat exchange means for heating by the heat pump, and the inert gas and the atmosphere are heated by the supply gas heating means, and the heated inert Gas and air can be supplied to the preheating process and the soldering process.

  Therefore, there is almost no increase in the amount of heating power in the preheating process or soldering process that occurs when an inert gas at normal temperature or the atmosphere is supplied, and the increase in power consumption can be eliminated. In addition, since it is difficult to disturb the temperature of the preheating process and the soldering process, it is possible to maintain a stable temperature parameter in these processes, and to improve the soldering mounting quality. Become.

  According to the present invention, it is possible to recycle the heat energy obtained from the work to be soldered in the cooling process by returning it to the preheating process, the soldering process, or the inert gas or air supplied to these processes. In addition, since this is done by a heat pump with a high COP, it is possible to significantly reduce the power consumption during operation of the soldering system and the peak power consumption during startup, and realize a soldering system that does not waste energy. can do.

  Next, an embodiment of the soldering system of the present invention will be described.

[First Embodiment]
FIG. 1 is a diagram for explaining an example of a soldering system using a flow soldering method, in which a conveyer for a work to be soldered is omitted by a one-dot chain line, and this conveyer (conveyance direction is an arrow A direction) Each device arranged along the line is depicted in a symbol diagram. The work to be soldered is a printed wiring board on which electronic components to be soldered are mounted.

  The present embodiment is an example of a system in which a flux application process is provided in the previous stage of a normal soldering system including a preheating process, a soldering process, and a cooling process. That is, this soldering system example includes a first preheating step 11, a flux application step 12, a second preheating step 13, a soldering step 15, and a cooling step 16 in the order of processes.

  The first preheating step 11 and the second preheating step 13 are provided with heat exchange means 111 and 121 for heating connected to the heat pump 103, and the cooling heat connected to the heat pump 103 is provided for the cooling step 16. An exchange means 131 is provided.

  The heating heat exchanging means 111 provided in the first preheating step 11 and the heating heat exchanging means 121 provided in the second preheating step 13 can be switched in the heat pump 103, and both of them are used for heating. It is also possible to operate the heat exchange means together. Although not shown, the heating heat exchanging means and the cooling heat exchanging means are provided with temperature sensors, and each temperature is controlled to a predetermined temperature by the temperature control means in the heat pump. .

  On the other hand, the heating heat exchanging means and the cooling heat exchanging means are provided with fans 112, 122, and 132, and hot air is blown to the printed wiring board 102 in the preheating process and cold air is blown in the cooling process. Further, a heating means using an electric heater 123 and a fan 124 is also provided at the subsequent stage of the heat exchange means 121 for heating provided in the second preheating step 13 to enhance the controllability of the heating profile in a high temperature range. . The electric heater 123 is provided with a temperature sensor and temperature control means (not shown) so that the surface temperature can be adjusted.

  In the soldering step 15, the jet wave 129 of the molten solder 126 is brought into contact with the surface to be soldered (the lower surface in the drawing) of the printed wiring board 102, and the molten solder is brought into contact with the soldered portion of the printed wiring board 102 by this contact. 126 is supplied and soldered.

  The jet wave 129 is formed by feeding the molten solder 126 in the solder bath 125 to the blow body 128 by the pump 127. The solder bath 125 has a heater, a temperature sensor, and temperature control means (not shown). Is provided so as to maintain the solder at a predetermined temperature in a molten state.

  The flux application step 12 is provided with a spray-type flux application device that atomizes and applies the flux. The flux to be supplied from the flux supply device 113 is sprayed from the spray nozzle 114 to be soldered surface of the printed wiring board 102. It is the structure which makes it apply | coat and apply | coat. The flux that has not been applied to the printed wiring board 102 is sucked by the exhaust fan 115 and collected by the filter 117 while being guided by the hood 116.

  The transfer conveyor for transferring the printed wiring board 102 as the work to be soldered includes a transfer conveyor 101a that takes charge of the first preheating step 11 and the flux application step 12, a second preheating step 13, a soldering step 15, and cooling. The process conveyor 16b is in charge of the process 16. In the soldering process 15, the printed wiring board 102 is transported in the elevation direction (angle of about 3 to 5 °). FIG. 1 shows an example of horizontal transport.

  In general, the first preheating step 11 and the flux application step 12 are housed in one case, and the second preheating step 13, the soldering step 15 and the cooling step 16 are included in one case. In many cases, a soldering system is configured by installing them separately as a flux application device and a soldering device.

  Next, the operation of the system of this embodiment will be described.

  The printed wiring board 102 on which electronic components are mounted is first heated with hot air supplied from the heat exchange means 111 for heating in the first preheating step 11, and then the flux sprayed from the spray nozzle 114 is applied. In addition, when spraying and applying a VOC free flux (VOC: Volatile Organic Compounds) containing water as a main solvent, the spread of the coating flux can be improved by heating the printed wiring board 102 in advance. Can do.

  Subsequently, the printed wiring board 102 is conveyed to the second preheating step 13 and heated with hot air supplied from the heat exchange means 121 for heating to promote evaporation of the solvent of the flux. Activation is performed.

  In the case of VOC-free flux, water is the main solvent, so that the drying rate can be increased by drying with hot air. The preheating temperature for the main purpose of drying is preferably about 50 ° C. to 80 ° C. If the temperature is too high, thermal stress on the electronic components and the printed wiring board is increased. Then, preliminary heating by the electric heater 123 and the fan 124 is performed as necessary, and a target heating profile is formed and conveyed to the next soldering step 15.

  In the soldering process 15, the soldered surface of the printed wiring board 102, that is, the lower surface of the drawing is brought into contact with the jet wave 129 of the molten solder 126, and the molten solder 126 is supplied to the soldered portion to perform soldering. Done.

  Subsequently, the printed wiring board 102 is transported to the cooling step 16 where cooling is accelerated by the cold air supplied from the cooling heat exchanging means 131, and the printed wiring board 102 is supplied to the printed wiring board 102, the electronic component, and the most important part to be soldered. The solder temperature is quickly lowered, and a series of soldering operations are completed.

  The heat pump 103 recirculates the heat energy obtained when cooling the printed wiring board 102 in the cooling step 16 to the heat exchange means for heating, and the printed wiring board in the first preheating step 11 and the second preheating step 13. Reused as heating energy for heating 102 and drying the flux. Therefore, in order to improve the recovery efficiency of thermal energy in the cooling process 16, the cooling process 16 may be configured as a chamber structure having a carry-in port and a carry-out port, and an atmosphere circulation type cooling process may be configured.

  Of course, in order to increase the heating efficiency in the first preheating step 11 and the second preheating step 13, the preheating step is similarly used as a chamber structure having a carry-in port and a carry-out port, and an atmosphere circulation type pre-heat step May be configured. By doing so, the energy circulation efficiency seen in the entire soldering system is increased, and energy loss can be reduced.

  Since the COP of a normal heat pump is usually about 3 to 4, even if the cooling process is not made into a chamber structure, the heat energy is acquired from the atmosphere in addition to the printed wiring board, and 3 to 3 than in the case of using an electric heater. The printed wiring board can be preheated with four times the power efficiency.

  As a result, the power consumption of the entire soldering system is greatly reduced, and as a result, the release of greenhouse gases into the atmosphere can be reduced. In addition, the printed wiring board can be soldered and mounted at low cost.

  By using a high-temperature output heat pump with a COP of 3 to 4 and an output temperature of 150 ° C. to 300 ° C., it is possible to heat the solder in the solder bath with the heat pump, and the soldering temperature is about 250 ° C. All of the mounting heating can also be performed by a heat pump.

  When the heat exchange means for heating is provided in the solder tub, it may be provided in the solder tub and configured as a direct heating method, or may be provided on the outer wall surface of the solder tub and configured as an indirect heating method. In this case, since only the thermal energy obtained from the cooling process is insufficient, the thermal energy is also absorbed from the atmosphere. For example, in addition to the cooling heat exchanging means provided in the cooling process, a heat exchanging means for absorbing thermal energy from the atmosphere is also provided (see the heat exchanging means drawn by a broken line in FIG. 1).

  Incidentally, there is a soldering system that does not require the first preheating step in FIG. 1, but in that case, the heat exchange means for heating provided in the step is unnecessary.

[Second Embodiment]
FIG. 2 is a diagram for explaining a first example of a soldering system using a reflow soldering method, and is a side sectional view of the system cut longitudinally along a conveyor and viewed from the cut surface. And the conveyance conveyor (a conveyance direction is an arrow A direction) of the workpiece | work to be soldered is abbreviate | omitted with the dashed-dotted line, and the heat pump is drawn with the symbol figure.

  The system of this embodiment is an example in which the inside of the heating furnace 210 is divided into three chambers along the conveyor 201 and the cooling chamber 220 is subsequently provided. The preheating step 24 is composed of two heating chambers, the subsequent soldering step 25 is composed of one heating chamber, and the cooling step 26 is composed of one cooling chamber. In addition, although this system example has shown the example which has a heating means and a cooling means only in the upper side of a figure, it is good also as a structure which provides a heating means and a cooling means symmetrically up and down centering on a conveyance conveyor.

  Each heating chamber and cooling chamber is configured such that an atmosphere circulation channel is formed by a circulation channel forming plate 213 and the atmosphere of each heating chamber is circulated by a fan 212 driven by a motor. In the circulation process, an atmosphere is blown to the printed wiring board 202 which is a work to be soldered.

  The preheating step 24 is provided with heating heat exchanging means 211 a and b connected to the heat pump 203, and the cooling step 26 is provided with cooling heat exchanging means 221 connected to the heat pump 203. As in the case of the system example of the first embodiment, when only the thermal energy obtained from the cooling step 26 is insufficient, the thermal energy is also obtained from the atmosphere. For example, in addition to the cooling heat exchanging means 221 provided in the cooling step 26, a heat exchanging means 204 that absorbs heat energy from the atmosphere is also provided. Reference numeral 205 denotes a blower fan.

  Furthermore, although not shown in the figure, the heat exchange means for heating and the heat exchange means for cooling are provided with temperature sensors, and the temperature control means in the heat pump controls each temperature to a predetermined temperature.

  On the other hand, an electric heater 214 is provided in the soldering step 25, and an atmosphere having a predetermined temperature is formed by the temperature sensor 215 and a temperature control means (not shown).

  Next, the operation of the system example of this embodiment will be described.

  The printed wiring board 202 on which electronic components are mounted and solder is supplied to the soldered portion in advance is first supplied with an amount of heat from the atmosphere heated by the heat exchange means 211a, b for heating in the preheating step 24. It is heated and heated to a temperature somewhat lower than the soldering temperature with a target temperature profile by setting the ambient temperature of each chamber.

  As a result, the flux previously supplied to the soldered part, such as the flux in the cream solder, is activated in advance, and the heat shock of the printed wiring board and the electronic component generated in the subsequent soldering process is suppressed. ease.

  Subsequently, the printed wiring board 202 is conveyed to the soldering step 25, the solder supplied in advance to the soldered portion is heated to a melting temperature or higher, and soldering is performed with the molten solder.

  Thereafter, the printed wiring board 202 is transported to the cooling step 26, where cooling is accelerated by the cold air supplied from the cooling heat exchange means 221, and the printed wiring board 202 is supplied to the printed wiring board 202, the electronic component, and the most important soldered portion. A series of soldering operations are completed by quickly lowering the solder temperature.

  The heat pump 203 recirculates the heat energy obtained when cooling the printed wiring board 202 in the cooling process 26 to the heat exchange means 211a, b for heating, and heating energy for heating the printed wiring board 202 in the preheating process 24. Therefore, it is possible to increase the heat energy utilization efficiency of the soldering system. If only the heat energy obtained from the cooling process 26 is insufficient, the heat exchange means 204 and the fan 205 absorb the heat energy from the atmosphere together, and heating for heating the printed wiring board 202 in the preheating process 24. Reused as energy.

  Since the COP of a normal heat pump is usually about 3 to 4, the printed wiring board can be preheated with a power efficiency 3 to 4 times higher than when an electric heater is used.

  As a result, the power consumption of the entire soldering system is greatly reduced, and as a result, the release of greenhouse gases into the atmosphere can be reduced. In addition, the printed wiring board can be soldered and mounted at low cost.

[Third Embodiment]
FIG. 3 is a diagram for explaining a second example of a soldering system using the reflow soldering method, and is a side sectional view of the system cut longitudinally along the transport conveyor and viewing the cut surface. And the conveyance conveyor (a conveyance direction is an arrow A direction) of the workpiece | work to be soldered is abbreviate | omitted with the dashed-dotted line, and the heat pump is drawn with the symbol figure.

  This system example of the present embodiment is an example in which the inside of the heating furnace 310 is divided into three chambers along the conveyor 301 and then two cooling chambers are provided. The preheating step 34 is constituted by two heating chambers, the subsequent soldering step 35 is constituted by one heating chamber, and the cooling step 36 is further divided into two chambers, a first cooling chamber 320a and a second cooling chamber 320b. It consists of a cooling chamber. In addition, although this system example has shown the example which has a heating means and a cooling means only in the upper side of a figure, it is good also as a structure which provides a heating means and a cooling means symmetrically up and down centering on a conveyance conveyor.

  As described above, if the heating furnace 310 is not only composed of a plurality of heating chambers as in the preheating step 34 and the soldering step 35, but the cooling step 36 is also composed of a plurality of cooling chambers, the variable adjustment range of the heating profile is possible. In addition, the variable adjustment range of the cooling profile is widened, and the controllability of the temperature profile of the printed wiring board 302 is significantly improved.

  Similarly to the system of the second embodiment, each heating chamber and each cooling chamber is formed with an atmosphere circulation channel by the circulation channel forming plate 313, and the atmosphere of each heating chamber or each cooling chamber is circulated by the fan 312. In this configuration, an atmosphere is blown to the printed wiring board 302.

  The heating heat exchanging means 314 in the soldering process 35 and the cooling heat exchanging means 321a in the first cooling chamber 320a are connected to the high temperature output heat pump 306 as a pair, and the heat exchanging in the preheating process 34 is performed. The means 311a, b and the cooling heat exchange means 321b of the second cooling chamber 320b are paired and connected to a heat pump 303 different from the previous one.

  In addition, when only the heat energy obtained from the cooling step 36 is insufficient, the heat energy is also absorbed from the atmosphere. For example, in addition to the heat exchange means 321a, b for cooling provided in the cooling step 36, heat exchange means 304, 307 for absorbing thermal energy from the atmosphere are also provided. Reference numerals 305 and 308 denote blower fans.

  Of course, a temperature sensor is provided in the heat exchange means for heating and the heat exchange means for cooling, and each temperature is controlled to a predetermined temperature by the temperature control means in the heat pump.

  Next, the operation of this system example will be described.

  This system example is different from the system example of the second embodiment in that the heating in the soldering process 35 is performed by using the heat exchange means 314 for heating connected to the heat pump 306 as a heating source, and the printed wiring board 302 Cooling is performed by two stages of the first cooling chamber 320a and the second cooling chamber 320b.

  The heat energy of the printed wiring board 302 that has reached the highest temperature by the heat pump 306 is absorbed in the first cooling chamber 320a and returned to the soldering step 35, and then the heat energy absorbed in the second cooling chamber 320b is Recycled to the preheating step 34 for reuse. Therefore, the utilization efficiency of the thermal energy as a soldering system can be improved. When the thermal energy obtained from the cooling process 36 is insufficient, the thermal energy is absorbed together from the atmosphere and re-used as the heating energy for heating the printed wiring board 302 in the preheating process 34 and the soldering process 35. Used.

  Today, even if it is a high-temperature output type heat pump, the COP value of about 3 to 4 can be obtained, so that it is possible to heat the printed wiring board with power efficiency 3 to 4 times higher than when using an electric heater. Yes, it can be used as a high-efficiency heating source for melting solder in the soldering process.

  As a result, the power consumption of the entire soldering system is significantly reduced, and as a result, the release of greenhouse gases into the atmosphere can be reduced. In addition, the printed wiring board can be soldered and mounted at low cost.

[Fourth Embodiment]
FIG. 4 is a diagram for explaining a third example of the soldering system using the reflow soldering method, and is a side sectional view of the system cut longitudinally along the conveyor and viewed from the cut surface. And the conveyance conveyor (a conveyance direction is the arrow A direction) of the workpiece | work to be soldered is abbreviate | omitted with the dashed-dotted line, and the heat pump and the control system are drawn with the symbol figure.

  The system of the present embodiment is an example in which the inside of the heating furnace 410 is divided into three chambers along the conveyor 401, and then the cooling chamber 420 is provided. The preheating step 44 is composed of two heating chambers, the subsequent soldering step 45 is composed of one heating chamber, and the cooling step 46 is composed of one cooling chamber. In addition, although this system example has shown the example which has a heating means and a cooling means only in the upper side of a figure, it is good also as a structure which provides a heating means and a cooling means symmetrically up and down centering on a conveyance conveyor.

  As in the system examples of the second and third embodiments, each heating chamber and each cooling chamber has an atmosphere circulation channel formed by the circulation channel forming plate 413, and the atmosphere of each heating chamber is circulated by the fan 412. In this process, an atmosphere is blown to the printed wiring board 402.

  The preheating step 44 and the soldering step 45 are provided with heating heat exchanging means 411a, b and 416 connected to the heat pump 403, and the cooling step 46 is provided with the cooling heat exchanging means 421 connected to the heat pump 403. It is provided. As in the case of the system example of the first embodiment, when only the thermal energy obtained from the cooling process is insufficient, the thermal energy is also absorbed from the atmosphere. For example, in addition to the cooling heat exchanging means 421 provided in the cooling step 46, a heat exchanging means 404 that absorbs heat energy from the atmosphere is also provided. Reference numeral 405 denotes a blower fan.

  Further, the preheating step 44 and the soldering step 45 are also provided with electric heaters 414a, b, 417, and the temperature control device 409 refers to the detection signals Ts1, Ts2, Ts3 of the temperature sensors 415a, b, 418 to It is configured such that an atmosphere with a predetermined temperature can be formed by controlling the electric power Ph1, Ph2, Ph3 supplied to the heater.

  The control device 406 is configured by a computer system, and includes an instruction operation unit 407 such as a keyboard and a display unit 408 such as an LCD. Further, the operation state (heating temperature or cooling temperature) of the heat pump can be controlled from the output port by the communication signal Sp, and the heating temperature by the electric heater can be controlled by the communication signal Sh.

  That is, in this system example, heating and cooling by the heat pump 403 and heating by the electric heaters 414a, b, and 417 can be used in combination or switched, and an optimum operating state can be obtained in accordance with the operating state of the soldering system. It can be selected.

  Next, the operation of this system example will be described.

  This system example is different from the system examples of the second embodiment and the third embodiment in that all heating chambers are provided with heating heat exchange means and electric heaters connected to a heat pump.

  The heat energy given to the printed wiring board 402 by the preheating process 44 and the soldering process 45 is absorbed by the cooling process 46 by the heat pump 403 and is recycled to the preheating process 44 and the soldering process 45 for reuse. . In addition, heating by an electric heater is also performed. In addition to heating by heat conduction from the atmosphere, heating is also performed by infrared rays emitted from the electric heater.

  Therefore, fine heating control of the printed wiring board 402 can be performed, and at the same time, utilization efficiency of heat energy as a soldering system can be improved. If the heat energy obtained from the cooling process is insufficient, the heat energy is absorbed from the atmosphere by the heat exchanging means 404 or the like, and the heating energy for heating the printed wiring board in the preheating process or the soldering process. As reused.

  As described above, the power consumption of the entire soldering system can be significantly reduced by the heat pump having a high COP, and the release of the warming gas into the atmosphere can be reduced. In addition, the printed wiring board can be soldered and mounted at low cost.

  On the other hand, it is possible to perform heating with a heat pump only when the soldering system is activated. For example, in a soldering system in which heating is performed by a heat pump until the atmospheric temperature in the heating furnace rises to about 100 ° C. to 150 ° C., and only a corresponding heating chamber is switched to heating by an electric heater when heating to a temperature higher than that. How to start.

  By adopting such a starting method, it becomes possible to reduce the power consumption necessary for starting the soldering system to 1 / (1 / COP value) of the heat pump COP value. It is possible to reduce the power consumption at the start-up, which was required 3 to 5 times, to a value about 1 to 1.3 times that during normal operation.

[Fifth Embodiment]
FIG. 5 is a diagram for explaining a fourth example of a soldering system using the reflow soldering method, and is a side sectional view of the system cut longitudinally along a conveyor and viewed from the cut surface. The conveying conveyor of the work to be soldered (the conveying direction is the direction of arrow A) is omitted by a one-dot chain line, and the heat pump is illustrated by a symbol diagram.

  In this system example, the heat energy obtained in the cooling step 56 is used to heat the inert gas or the atmosphere supplied to the heating chamber (the preheating step 54 and the soldering step 55) of the heating furnace 510. In each heating chamber and cooling chamber 520, an atmosphere circulation channel is formed by the circulation channel forming plate 513, and the atmosphere is blown to the printed wiring board 502 in the process of circulating the atmosphere of each heating chamber by the fan 512. is there. In addition, the atmosphere heating of each heating chamber is performed by the electric heater 511.

  The purpose of supplying the inert gas to the heating chamber is to perform reflow soldering in an inert gas atmosphere with a low oxygen concentration in the heating chamber, and the purpose of supplying the atmosphere together with the inert gas supply flow rate is This is because the oxygen concentration in the heating chamber is adjusted by adjusting the ratio.

  Generally, when the inert gas supply flow rate per unit time to the heating chamber is extremely reduced, so-called hunting in which the oxygen concentration in the heating chamber fluctuates in an unstable manner occurs. Therefore, by supplying the atmosphere together and adjusting the ratio of the inert gas supply flow rate, the sum of the inert gas supply flow rate and the atmospheric supply flow rate is maintained at a constant flow rate, and a stable oxygen concentration is maintained. .

  On the other hand, the supply of an inert gas or air into the heating chamber acts as a disturbance in temperature control in a reflow soldering method that needs to maintain an atmosphere having a predetermined temperature. That is, by supplying an inert gas or air at about room temperature (about 25 ° C.) or a heated room atmosphere at about 180 ° C. or 230 ° C., an atmosphere having a uniform temperature is formed through a process in which gases having different temperatures are mixed. Because of this, this mixed process acts as a disturbance. In other words, the supply of an inert gas or air to the heating chamber is a matter that should not exist in reflow soldering where a stable and uniform temperature atmosphere is required.

  Therefore, in order to use the heat energy obtained in the cooling process as the heat energy for heating the inert gas supplied to the heating chamber and the atmosphere, the cooling process 56 includes a cooling heat exchange means 521 connected to the heat pump 503. And a heat exchange means 504 for heating is provided in the supply gas heating chamber 505.

  Next, the operation of this system example will be described.

  A printed wiring board 502 that is a work to be soldered is conveyed in the A direction by a conveying conveyor 501, and is soldered by a preheating process 54 and a soldering process 55. Subsequently, the printed wiring board 502 heated to the maximum temperature in the soldering process 55 is transported to the cooling process 56, where it is cooled and the heat energy of the printed wiring board 502 is exchanged for cooling. It is pumped up by the heat pump 503 through the means 521 and refluxed to the heat exchange means 504 for heating.

  The heat exchange means 504 for heating is provided in the supply gas heating chamber 505, and the heat exchange means 504 for heating, the inert gas supply pipe 506a, and the atmospheric supply pipe 506b are thermally coupled to each other, and this inert gas The inert gas flowing through the supply pipe 506a and the air flowing through the air supply pipe 506b are heated by the heat energy recirculated by the heat pump 503 and then supplied to the heating chamber.

  Therefore, the temperature disturbance generated in the heating chamber becomes extremely small, and an atmosphere having a stable temperature can be formed. In addition, since the inert gas or air is heated and then supplied to the heating chamber, there is almost no increase in power consumption necessary for heating the heating chamber atmosphere.

  The soldering system of the present invention can be used as a system having a highly efficient heating source when an electronic component is soldered and mounted on a printed wiring board. Therefore, it becomes possible to reduce the emission of greenhouse gases with energy saving, which can greatly contribute to the electronics industry.

The figure explaining the example of the soldering system using the flow soldering method which is the 1st Embodiment of this invention. The figure explaining the 1st example of the soldering system using the reflow soldering method which is the 2nd Embodiment of this invention. The figure explaining the 2nd example of the soldering system using the reflow soldering method which is the 3rd Embodiment of this invention. The figure explaining the 3rd example of the soldering system using the reflow soldering method which is the 4th Embodiment of this invention. The figure explaining the 4th example of the soldering system using the reflow soldering method which is the 5th Embodiment of this invention.

Explanation of symbols

11, 13, 24, 34, 44, 54 Preheating process 12 Flux application process 15, 25, 35, 45, 55 Soldering process 16, 26, 36, 46, 56 Cooling process 101, 201, 301, 401, 501 Conveyor 102, 202, 302, 402, 502 Printed wiring board 103, 203, 303, 403, 503 Heat pump 306 High-temperature output heat pump 111, 121, 211, 311, 314, 411, 416, 504 Heat exchange means 112 for heating 115, 122, 124, 132, 205, 305, 308, 405 Fan 113 Flux supply device 114 Spray nozzle 116 Hood 117 Filter 123, 214, 414, 417, 511 Heater 125 Solder bath 126 Molten solder 127 Pump 128 Blowing Mouth body 129 Jet wave 131,221,321,421,521 Heat exchange means for cooling 204,304,307,404 Heat exchange means 210,310,410,510 Heating furnace 212,312,412,512 Fan 213,313 413, 513 Circulating flow path forming plate 215, 415, 418 Temperature sensor 220, 320, 420, 520 Cooling chamber 505 Supply gas heating chamber 506 Supply pipe

Claims (5)

In a soldering system having a preheating process, a soldering process, and a cooling process for a workpiece to be soldered,
The heat pump is provided with a cooling heat exchange means and a heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is discharged through the heating heat exchange means, and the cooling heat exchange means is the solder Preparing for the cooling step of the soldering system and providing the heat exchange means for heating in the preliminary heating step of the soldering system;
Features a soldering system. In a soldering system having a first preheating step, a flux application step, a second preheating step, a soldering step, and a cooling step of a work to be soldered,
The heat pump is provided with a cooling heat exchange means and a heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is discharged through the heating heat exchange means, and the cooling heat exchange means is the solder Preparing for the cooling step of the soldering system and providing the heat exchange means for heating in at least either the first preheating step or the second preheating step of the soldering system;
Features a soldering system. A soldering system for performing soldering by heating and melting solder supplied in advance to a soldered part of a work to be soldered in a hot atmosphere, and includes a preheating process, a soldering process, and a cooling process. In soldering system,
The heat pump is provided with a cooling heat exchange means and a heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is discharged through the heating heat exchange means, and the cooling heat exchange means is the solder Preparing for the cooling process of the soldering system and providing the heat exchange means for heating at least in either the preheating process or the soldering process of the soldering system,
Features a soldering system. A soldering system for performing soldering by heating and melting solder supplied in advance to a soldered part of a work to be soldered in a hot atmosphere, and includes a preheating process, a soldering process, and a cooling process. In soldering system,
The heat pump is provided with a cooling heat exchange means and a heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is discharged through the heating heat exchange means, and the cooling heat exchange means is the solder In addition to at least one of the preheating step and the soldering step of the soldering system, the heat exchanging means for heating is provided at least in either the preheating step or the soldering step of the soldering system. With an electric heater,
Features a soldering system. Solder having a preheating process, a soldering process, and a cooling process for a workpiece to be soldered and supplying an inert gas or an inert gas and air to at least one of the preheating process or the soldering process Mounting system,
The heat pump is provided with a cooling heat exchange means and a heating heat exchange means, and the heat energy absorbed from the cooling heat exchange means is discharged through the heating heat exchange means, and the cooling heat exchange means is the solder And a supply gas heating means for heating the inert gas or the inert gas and the atmosphere together with the heat exchange means for heating as a heating source.
Features a soldering system.

Images