JP2009206228A - Side emission type light emitting device and manufacturing method thereof, and lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a side emission type light emitting device which is improved in light extraction efficiency, to provide a manufacturing method thereof, and to provide a lighting device. <P>SOLUTION: The light emitting device includes: a molding having a light extraction surface where a recess having a first bottom surface and a second bottom surface shallower than the first bottom surface is formed and a fitting surface nearly orthogonal to the light extraction surface and fitted to a mounting member; a light emitting element fixed to the first bottom surface; a lead provided on the second bottom surface and connected to an electrode of the light emitting element; and a resin filled in the recess to cover the light emitting element and also having phosphors dispersedly arranged. The recess further has: an opening end whose length in a direction parallel to the fitting surface is larger than the length in a second direction perpendicular to the light fitting surface; first side surfaces with spacing therebetween becoming wider as moving from the first bottom surface to the second bottom surfaces and substantially parallel to the second direction; and second side surfaces with spacing therebetween becoming wider as moving from the first bottom surface to the opening end and substantially parallel to the first direction. Mixed light of emitted light from the light emitting element and wavelength-converted light from phosphors excited by the emitted light is emitted from the opening end, and the first side surfaces have a tilt smaller than that of the second side surfaces. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a side-type light-emitting device, a manufacturing method thereof, and a lighting device.

  Light-emitting devices that emit white light with high light extraction efficiency and high output have been increasingly used as backlight sources for illumination and display devices.

  For example, as a backlight light source used in a liquid crystal display device, it is convenient to use a side light-emitting device having a light extraction surface in a direction substantially perpendicular to the mounting surface. In this case, when the light extraction surface of the side surface type light emitting device is formed in an elongated rectangular shape, the liquid crystal display device can be made thin, and light can be easily spread uniformly along the light guide plate.

  In order to increase the light extraction efficiency from the rectangular side surface type light emitting device, a package having the inner surface of the concave portion of the molded body that reflects the emitted light from the light emitting element chip can be used.

There is a technology disclosure example regarding a side-surface type LED having a side wall reflection structure improved so that light emission efficiency and heat dissipation efficiency can be improved (Patent Document 1). In this example of technical disclosure, the highly reflective metal layer provided on the wall surface of the recess and the lead are insulated by an insulating layer. In this example of technical disclosure, light absorption at the inner wall of the recess can be reduced.
However, it is difficult to suppress light absorption by the phosphor in the recess having the rectangular light extraction surface, and the light extraction efficiency is not sufficient.
JP 2007-19505 A

  Provided are a side light-emitting device, a method for manufacturing the same, and a lighting device, in which light absorption by a phosphor is reduced and light extraction efficiency is improved.

  According to one aspect of the present invention, a light extraction surface in which a recess having a first bottom surface and a second bottom surface shallower than the first bottom surface is formed, and mounted substantially orthogonal to the light extraction surface. A molded body having an attachment surface attached to the member; a light emitting element fixed to the first bottom surface; and a second electrode provided on the second bottom surface, and electrically connected to the first electrode of the light emitting element. A first lead and a resin filled in the recess so as to cover the light emitting element and phosphors are dispersedly arranged, the recess being in a first direction parallel to the mounting surface An opening end having a length larger than a length in a second direction perpendicular to the light mounting surface, and widening from the first bottom surface toward the second bottom surface with respect to the second direction. First side surfaces that are substantially parallel to each other and from the first bottom surface toward the opening end. And a second side surface substantially parallel to the first direction, and radiation light from the light emitting element and wavelength converted light from the phosphor excited by the radiation light, The side light emitting device is provided in which the mixed light is emitted from the opening end, and the inclination of the first side surface is gentler than the inclination of the second side surface.

  According to another aspect of the present invention, in the method for manufacturing the side-type light-emitting device, the inner lead portion of the first lead is exposed in the recess, and the outer portion of the first lead is exposed. There is provided a method of manufacturing a side-type light-emitting device, comprising a step of forming a molded body so that a lead portion is pulled out from the mounting surface.

  According to yet another aspect of the present invention, the side surface light-emitting device, an incident surface that faces the opening end and receives the mixed light, and is substantially parallel to the attachment surface, from the incident surface. A light scattering surface that reflects the incident mixed light, and a light emitting surface that faces the light scattering surface substantially in parallel and transmits the incident collimation light and the reflected mixed light. A lighting device is provided.

  Provided are a side-type light-emitting device, a method for manufacturing the same, and a lighting device, in which light absorption by a phosphor is reduced and light extraction efficiency is improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view of a side-type light emitting device according to a first embodiment of the present invention. 1A is a perspective view of the mounted state, FIG. 1B is a cross-sectional view taken along the line AA, FIG. 1C is a cross-sectional view taken along the line BB, and FIG. FIG. 1E is a cross-sectional view taken along the line BB of the modification. The molded body 22 containing a resin material or the like is an elongated rectangular parallelepiped. And the molding 22 has the light extraction surface 22b in which the recessed part 30 enclosed by the opening end 30a was formed. The molded body 22 is mounted such that the mounting surface 22a faces the mounting surface 50 of a mounting member such as a substrate. Here, the attachment surface 22a is substantially orthogonal to the light extraction surface 22b having the open end 30a.

  In this specification, a direction parallel to the attachment surface 22a and the light extraction surface 22b of the molded body is referred to as a first direction, and a direction perpendicular to the attachment surface 22a is referred to as a second direction. In FIG. 1A, line AA represents a first direction parallel to the attachment surface 22a and the light extraction surface 22b, and is substantially the same as the direction in which the first and second leads 24 and 26 extend. In the same direction. On the other hand, the BB line represents a second direction perpendicular to the attachment surface 22a and is orthogonal to the first direction.

  The first lead 24 made of metal has an inner lead portion 24a that is the inside of the molded body 22 and an outer lead portion 24b that is drawn to the outside. The inner lead portion 24a is molded using a resin so that a region electrically connected to one electrode of the light emitting element 20 is exposed. The second lead 26 made of metal has an inner lead portion 26 a that is the inside of the molded body 22 and an outer lead portion 26 b that is drawn to the outside. The inner lead portion 26a is molded using a resin so as to expose a region connected to the other electrode of the light emitting element 20 by a bonding wire 28 or the like. In this manner, the outer leads 24b and 26b become external terminals that are drawn out and exposed from the mounting surface 22a of the molded body 22, and are bonded to the mounting surface 50 of a mounting member such as a substrate. This package structure belongs to a surface mounted type (SMD).

  The light emitting element 20 is mounted on the exposed portion of the inner lead 24a using AuSn eutectic solder, conductive adhesive, or the like. The other electrode of the light emitting element 20 and the exposed inner lead 26 a are electrically connected by a bonding wire 28. For this purpose, the molded body 22 is provided with a recess 30.

  The recess 30 is provided between the opening end 30a having a rectangular shape elongated in the first direction of the molded body 22, the first bottom surface 32 on which the light emitting element 20 is disposed, and between the first bottom surface 32 and the opening end 30a. The second bottom surface 33 is exposed to expose the second lead 26 that is shallower than the first bottom surface 32 and is substantially parallel to the first bottom surface 32. The recess 30 further expands from the first bottom surface 32 to the second bottom surface 33 toward the opening end 30a and is substantially parallel to the second direction, and from the second bottom surface 33. A fourth side surface 35 that expands toward the opening end 30a up to the opening end 30a and substantially parallel to the second direction, and expands from the first bottom surface 32 to the opening end 30a and extends in the first direction. And a second side surface 37 that is substantially parallel.

  The recess 30 is filled with a transparent resin 40 in which phosphor particles are dispersed and a light extraction surface 22 b that is the surface of the transparent resin 40 is formed at the opening end 30 a of the recess 30. The inner lead portions 24 a and 26 a exposed in the recess 30 are embedded in the package by the transparent resin 40. When the light emitting layer of the light emitting element 20 is a nitride semiconductor, ultraviolet to green light is emitted. The phosphor that has absorbed the emitted light is wavelength-converted to emit light having a longer wavelength. For example, the emitted light from the light-emitting element 20 can be blue light having a wavelength of 440 to 460 nm, and yellow light can be obtained using a silicate-based yellow phosphor. For this reason, for example, white light or a light bulb color can be obtained as a mixed color of yellow light and blue light.

  In the first embodiment, the opening end 30a of the recess 30 has a rectangular shape of L> M, where L is the length in the first direction, M is the length in the second direction. In addition, the cross section of the recess 30 in the first direction shown in FIG. 1B has a two-stage structure having a first bottom surface 32, a first side surface 34, a second bottom surface 33, and a fourth side surface 35. It is said. On the other hand, the cross section of the concave portion 30 in the second direction shown in FIG. 1C does not have the second bottom surface, and is constituted by the second side surface 37 from the first bottom surface 32 to the opening end 30a. .

  In the present embodiment, the angle α1 formed by the first bottom surface 32 and the first side surface 34 is smaller than the angle β1 formed by the first bottom surface 32 and the second side surface 37, that is, the inclination is relaxed.

  In FIG. 1B, the upward radiated light G1 directed from the light emitting element 20 toward the opening surrounded by the opening end 30a is extracted to the outside, and the radiated light directed from the light emitting element 20 toward the first side surface 34 is reflected to reflect the side surface reflected light. G2 is taken out. In addition, phosphors are dispersedly disposed in the recesses 30, and the wavelength converted light G5 is emitted near the upper radiation G1, and the wavelength converted light G6 is emitted near the side surface reflected light G2. When the upper radiation light G1, the side surface reflected light G2, and the wavelength converted light G5 and G6 are set to an appropriate mixing ratio, a mixed color such as white light can be obtained.

  Further, in FIG. 1C, the radiated light traveling from the light emitting element 20 toward the second side surface 37 is reflected to be converted into side surface reflected light G3 and extracted outside. The wavelength-converted light G7 is emitted in the vicinity of the side-surface reflected light G3 by the phosphor. When the upper radiation light G1, the side surface reflected light G3, and the wavelength conversion lights G5 and G7 are set to appropriate mixing ratios, a mixed color such as white light can be obtained.

  The inclination α1 of the first side surface 34 is made smaller than the inclination β1 of the second side surface 37, and the spread of the side reflected light G2 in the first direction is made larger than the spread of the side reflected light G3 in the second direction. It can be enlarged. By appropriately selecting α1 and β1, the spread of light extracted in the first direction can be controlled to a desired angle.

  As shown in FIG. 1D, for example, outer lead portions 24 b and 26 b are drawn out to the attachment surface 22 a on the surface of the molded body 22. On the other hand, electrodes 50a and 50b are provided on a mounting surface 50 of a mounting member such as a substrate. The outer leads 24a and the electrodes 50a are bonded using a solder material so that the mounting surface 22a and the mounting surface 50 face each other, and the outer leads 26a and the electrodes 50b are used using a solder material or the like. Glued together. The shape of the outer leads 24a and 26b is not limited to the shape shown in FIG. 1D, and may be, for example, a bent shape.

  Thus, in the side surface type light emitting device of this embodiment, the mixed light of the emitted light from the light emitting element 20 and the wavelength converted light excited by the emitted light and emitted from the phosphor is substantially the same as the mounting surface 50. The light is extracted from the opening surrounded by the opening end 30a of the vertical light extraction surface 22b. That is, the opening end 30 a is attached so that the first direction is substantially parallel to the mounting surface 50 and the second direction is substantially perpendicular to the mounting surface 50.

  When the side light-emitting device according to the present embodiment in which the opening formed by the opening end 30a of the light extraction surface 22b is an elongated rectangular shape, the liquid crystal display device can be made thin, and the chromaticity deviation along the light guide plate is reduced. It is easy to spread light uniformly.

  FIG. 1E shows a side light-emitting device according to a modification of the present embodiment. The second side surface 37 expands upward from the first bottom surface 32 to the third bottom surface 66, and expands from the third bottom surface 66 to the opening end 30a toward the opening end 30a. A two-stage structure including the side surface 37b. If the inclination α1 of the first side surface 34 is made gentler than any of the inclinations of the side surfaces 37a and 37b, the spread of light can be controlled more.

  FIG. 2 is a schematic diagram of a side-type light emitting device according to a comparative example. 2A is a perspective view of the mounted state, FIG. 2B is a cross-sectional view taken along line CC, and FIG. 1C is a cross-sectional view taken along line DD. A molded body 122 made of a resin material or the like has an elongated rectangular shape. The CC line represents the first direction and is substantially the same direction as the direction in which the first and second leads 124 and 126 extend. On the other hand, the DD line represents a second direction substantially orthogonal to the first direction.

  The light emitting element 120 is mounted on the first lead 124 made of metal. The second lead made of metal is connected to the electrode of the light emitting element 20 by a bonding wire 128. The molded body 122 is formed so that the insulating portion 123 is between the first lead 124 and the second lead 126. The concave portion 130 provided in the molded body 122 includes a side surface 134 in the first direction of the opening end 130a, a side surface 137 in the second direction, and a bottom surface 132.

  The concave portion 130 is filled with a transparent resin 140 in which phosphor particles are dispersedly arranged. In this comparative example, as shown in FIG. 2B, phosphors are also distributed in the vicinity of the corner 150 (represented by an elliptical broken line) in the longitudinal direction of the recess 130. Of the radiated light from the light emitting element 120, the light G114 directed in the direction of the side surface 134 in the longitudinal direction is absorbed by the phosphor because the optical path to the side surface 134 and the opening end 130a is long, and attenuation is increased. That is, the light extraction efficiency of the radiated light from the light emitting element 120 is lowered.

  For this reason, in the light extracted in the vicinity of the end 152 (represented by a dot line) in the longitudinal direction of the opening end 130a, the ratio of the light G114 directed from the light emitting element 120 to the side surface decreases, and the ratio of the wavelength converted light G115 increases. To do. That is, in the longitudinal direction of the opening end 130a, the mixing ratio of the light G114 and G115 tends to be different from that near the center of the opening end 130a. For this reason, the difference between the chromaticity of the mixed color in the vicinity of the center portion of the opening end 130a and the chromaticity of the mixed color in the vicinity of the end portion 152 in the longitudinal direction tends to be large.

  On the other hand, in the first embodiment, the concave portion 30 has a two-stage configuration along the first direction (longitudinal direction), and the light emitted from the light emitting element 20 is reflected by the side surface 34 and extracted upward. Can do. That is, attenuation of light emitted from the light emitting element 20 can be suppressed in the longitudinal direction. As a result, it can suppress that the mixing ratio of radiated light and wavelength conversion light changes along a longitudinal direction, and can prevent chromaticity shift.

  FIG. 3 is a flowchart of the method for manufacturing the side-type light emitting device according to the embodiment of the present invention. The first lead 24 and the second lead 26 are formed into a lead frame shape made of a copper alloy material having a thickness of about 0.5 mm, for example, and the lead frame is inserted into a molding die (S200).

  In the case of FIG. 1, the first lead 24 and the second lead 26 have a step. Inner lead portions 24a and 26a of the first and second leads 24 and 26 electrically connected to the light emitting element 20 are exposed in the recess 30 and are substantially perpendicular to the light extraction surface 22b on which the opening end 30a is formed. The resin is injected into the molding die so that the outer lead portions 24b and 26b of the first and second leads 24 and 26 are exposed on the mounting surface 22a of the molded body 22 that is substantially parallel to the first direction. (S202).

  As the resin material, for example, a thermoplastic resin that is a nylon resin such as polyphthalamide (PPA), an epoxy resin, an acrylic resin, or the like can be used. It is preferable to mix a material having high reflectance such as potassium titanate with this resin because the light reflectance can be increased and the light emission efficiency can be improved. In this manner, the first side surface 34, the second side surface 37, and the fourth side surface 35 can be used as light reflectors. Further, ceramic or the like can be used as the material of the molded body 22.

  As the coating layer on the surface of the lead frame, for example, Ag or Ni / Pd / Au laminated in this order can be used. The thickness of Ag is, for example, about 10 μm. The thickness of the laminated structure is, for example, about 1 μm for Ni, 0.03 μm for Pd, and about 0.01 μm for Au. Such coating can increase the light reflectance in the inner lead portions 24a and 26a. In addition, the solder joint strength of the first and second leads 24 and 26 can be increased.

  Subsequently, the light emitting element 20 is mounted on the exposed region of the inner lead 24a by using a eutectic solder material such as AuSn (melting point near 280 ° C.) or a conductive adhesive (S204).

  Subsequently, for example, one electrode provided on the surface of the light emitting element 20 and the exposed region of the inner lead 26a are bonded using a bonding wire 28 such as a gold wire (S206). For this reason, it is preferable that the surface of the inner lead 26 a constituting the second bottom surface 33 is parallel to the first bottom surface 32.

  Subsequently, a transparent resin such as a silicone resin mixed with phosphor particles is filled and thermally cured (S208). The upper surface of the transparent resin 40 is formed at the opening end 30 a of the recess 30. An epoxy resin or the like can be used as the transparent resin 40.

  The outer leads 24b and 26b are cut from the lead frame to separate the side light emitting devices individually. If necessary, the outer leads 24b and 26b are formed to facilitate mounting (S210). In this way, a side-type light emitting device with high mass productivity is provided.

  FIG. 4 is a schematic diagram of a side-type light-emitting device according to the second embodiment. On the side not requiring wire bonding, a third side surface 36 with an inclination α2 extends from the first bottom surface 32 to the open end 30a in the first direction. In this case, a relationship of α2 <α3 <β2 (inclination of the second side surface 37) is established between the side surface inclinations.

In this way, it is possible to shorten the optical path from the light emitting element 20 until the light emitted in the longitudinal direction of the recess 30 is extracted to the outside. That is, it is possible to reduce the attenuation of the light emitted from the light emitting element 20 toward the longitudinal direction of the recess 30 due to being excessively absorbed by the phosphor. As a result, the chromaticity shift in the longitudinal direction of the recess 30 can be suppressed.
Even on the side where the bonding wire 28 is provided, only the bonding region may be flattened and other portions may be inclined.

  FIG. 5 is a schematic view of a side-type light-emitting device according to the third embodiment. For the side surface constituting the recess 30, the inclination of the first side surface 34 of the cross section along the line AA is α1, the inclination of the second side surface 37 of the cross section along the line BB is β1, and α1 < Let β1. For example, the first side surface 34 may be a part of a curved surface constituting a first elliptical frustum, and the second side surface 37 may be a part of a curved surface constituting a second elliptical frustum. Further, either the first side surface 34 or the second side surface 37 may be an elliptic frustum.

  FIG. 6 is a schematic diagram of a side-type light-emitting device according to the fourth embodiment. 6A is a perspective view, FIG. 6B is a cross-sectional view taken along the line AA, and FIG. 6C is a cross-sectional view taken along the line BB. As shown in the figure, the side cross section may be a curved line instead of a straight line. In FIG. 6B, when the cross section in the first direction of the first side face 62 includes a curve, the inclination α4 is set at the height P of the second bottom surface 33 of the cross section in the first direction. Expressed by the slope of the tangent. The inclination α4 is made gentler than the inclination of the second side surface that is a linear cross section.

  If it does in this way, the condensing efficiency of the light radiated | emitted from the light emitting element 20 toward the longitudinal direction of the recessed part 30 can be raised, and it can reduce that it absorbs and attenuate | damps too much with fluorescent substance. As a result, the chromaticity shift in the longitudinal direction of the recess 30 can be suppressed. The curved first side surface 62 is a curved surface that becomes concave toward the opening end 30a, and the spread of light can be controlled by changing the curvature.

  In addition, in FIG. 6C, when the cross section in the second direction of the second side face 64 includes a curve, the inclination β3 is set to the height of the second bottom surface 33 of the cross section in the second direction. Expressed by the slope of the tangent at Q. α4 <β3. In this way, since the phosphor can be efficiently arranged in the vicinity of the optical path of the upward radiated light G1 and the side surface reflected light G12 from the light emitting element 20, the upward radiated light G1, the side surface reflected light G12, and the wavelength converted lights G5 and G13 are Useless absorption by the phosphor can be reduced. The curved second side surface 64 is a curved surface that becomes concave toward the opening end 30a. If this curvature is changed, the spread of light can be controlled. If at least one of the first side face 62 and the second side face 64 is curved, light spreading control can be facilitated. It is easy to form the molded body 22 by using a mold having such a curved surface.

  If the second to fourth embodiments are used, the degree of freedom increases in the control of the spread of light in the first and second directions.

  As described above, in the first to fourth embodiments, while maintaining the light extraction efficiency high, the mixing ratio of the light emitted from the light emitting element 20 and the side surface reflected light and the wavelength converted light by the phosphor is set to In the direction 1, it is easy to approach the vicinity of the center of the opening formed by the opening end 30a and the vicinity of the end of the opening formed by the opening end 30a, and it is easy to make the chromaticity more uniform. It becomes.

  The phosphor is not limited to a silicate yellow phosphor. For example, when red, orange, yellow, and green phosphors made of YAG (yttrium aluminum garnet) material are used, three colors can be mixed. Further, an oxynitride phosphor may be used.

  FIG. 7 is a schematic perspective view showing a liquid crystal display device. This is an application example in which the side light-emitting device 10 of the present embodiment is used as a backlight light source. Five side light emitting devices 10 are arranged on the mounting surface 50 and used as an illuminating device serving as a backlight light source of a liquid crystal display device. The radiated light that spreads in the first direction from the side light emitting device 10 enters from the side surface (incident surface) 90c of the light guide plate 90.

  Incident light traveling upward passes through the light emitting surface 90a. Further, the downward incident light is reflected by the light scattering surface 90b, which is the lower surface of the light guide plate 90, and passes through the light emitting surface 90a. A liquid crystal display panel 92 is provided above the light emitting surface 90a, and light from the light emitting surface 90a is incident thereon. By using the backlight light source in which the chromaticity deviation is reduced in the first direction and the light extraction efficiency is improved, the image quality of the liquid crystal display device is improved and the power consumption can be reduced.

  The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to these embodiments. For example, the light-emitting device of the present invention is not limited to the backlight of the display device. In addition, for example, the light-emitting device of the present embodiment is disposed on the side surface of the light guide plate and light is incident from the side surface. The same effect can be obtained by using the same in a planar light emitting device that extracts light in a planar manner from the surface. Even if those skilled in the art have changed the design regarding the light emitting element, light emission wavelength, molded body, recessed portion, lead frame, transparent resin, phosphor material, shape, size, arrangement, etc. constituting the side light emitting device, It is included in the scope of the present invention without departing from the gist of the present invention.

1 is a schematic diagram of a side light-emitting device according to a first embodiment of the present invention. Schematic diagram of a side-type light emitting device according to a comparative example The flowchart of the manufacturing method of the side surface type light-emitting device concerning 1st Embodiment. The schematic diagram of the side surface type light-emitting device concerning 2nd Embodiment. The schematic diagram of the side surface type light-emitting device concerning 3rd Embodiment. The schematic diagram of the side surface type light-emitting device concerning 4th Embodiment Schematic perspective view showing a liquid crystal display device

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Side surface light-emitting device, 20 Light emitting element, 22 Molded body, 22a Mounting surface, 22b Light extraction surface, 24, 24a, 24b First lead, 26, 26a, 26b Second lead, 30 Recess, 30a Open end, 32 First bottom surface, 33 Second bottom surface, 34, 62 First side surface, 36 Third side surface, 37, 37a, 37b, 64 Second side surface, 40 Transparent resin, 50 Mounting surface, 66 Third Bottom,
G1 upward radiated light, G2, G3, G8, G10, G12 side reflected light, G5, G6, G7, G9, G11, G13 wavelength converted light

Claims (12)

A light extraction surface in which a recess having a first bottom surface and a second bottom surface shallower than the first bottom surface is formed; and an attachment surface that is substantially orthogonal to the light extraction surface and attached to a mounting member. Having a molded body,
A light emitting element fixed to the first bottom surface;
A first lead provided on the second bottom surface and electrically connected to the first electrode of the light emitting element;
A resin filled in the concave portion so as to cover the light emitting element, and phosphors are dispersedly arranged;
With
The recess includes an opening end having a length in a first direction parallel to the mounting surface that is greater than a length in a second direction perpendicular to the light mounting surface, and the first bottom surface to the first recess. And a first side surface that expands toward the bottom surface of the second plate and is substantially parallel to the second direction, and expands from the first bottom surface toward the opening end and substantially extends in the first direction. A parallel second side; and
The mixed light of the emitted light from the light emitting element and the wavelength converted light from the phosphor excited by the emitted light is emitted from the opening end,
The side-type light-emitting device characterized in that the inclination of the first side surface is gentler than the inclination of the second side surface. The molded body further includes a second lead connected to the second electrode of the light emitting element,
The side-type light-emitting device according to claim 1, wherein the first lead and the second lead are drawn out from the mounting surface of the molded body. The concave portion further includes a third bottom surface provided between the first bottom surface and the opening end,
The second side surface includes a side surface extending from the first bottom surface to the third bottom surface, and a side surface extending from the third bottom surface to the opening end. 3. The side-type light emitting device according to 1 or 2.   The side-type light emitting device according to any one of claims 1 to 3, wherein the first side surface includes a flat surface or a curved surface constituting an elliptical frustum.   The side-type light-emitting device according to claim 1, wherein the second side surface includes a flat surface or a curved surface constituting an elliptical frustum. An intersection line between the first side surface and a plane parallel to the attachment surface includes a curve,
The side-type light emitting device according to any one of claims 1 to 3, wherein the inclination of the first side surface is an inclination of a tangent to the curve at a height of the second bottom surface. An intersection line between the second side surface and a plane perpendicular to the attachment surface and the light extraction surface includes a curve,
The side light emission according to any one of claims 1 to 3, wherein the inclination of the second side surface is an inclination of a tangent line of the curve at a height of the second bottom surface. apparatus. The concave portion further has a third side surface that expands from the first bottom surface to the opening end and is substantially parallel to the second direction,
The third side surface is provided on the opposite side of the first side surface across the light emitting element,
The side-type light-emitting device according to claim 1, wherein an inclination of the third side surface is gentler than an inclination of the second side surface.   9. The side-type light emitting device according to claim 8, wherein the third side surface includes a flat surface or a curved surface constituting a third elliptical frustum. A cross section of the third side surface along the first direction includes a curve;
The side-type light emitting device according to claim 8, wherein the inclination of the third side surface is an inclination of a tangent line at a height of the second bottom surface. It is a manufacturing method of the side type light-emitting device according to any one of claims 1 to 10,
A side surface comprising a step of forming a molded body so that an inner lead portion of the first lead is exposed in the recess and an outer lead portion of the first lead is pulled out from the mounting surface. Type light emitting device manufacturing method. A side-type light-emitting device according to any one of claims 1 to 10,
An incident surface that faces the opening end and receives the mixed light, a light scattering surface that is substantially parallel to the mounting surface, reflects the mixed light incident from the incident surface, and is substantially parallel to the light scattering surface. A light guide plate having a light-emitting surface facing and transmitting the incident mixed light and the reflected mixed light; and
An illumination device comprising:

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