JP2009264483A - Shock absorbing member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shock absorbing member which is mounted on an external storage device such as a hard disc device not only for protecting the external storage device from impact but also for hardly causing the malfunction of the external storage device due to the vibration. <P>SOLUTION: Impact or disturbance vibration applied to a notebook PC 1 is transmitted from a storage part 1a through an impact absorbing part 6 and a vibration damping part 7 to the external storage device. Impact generated by the fall-down of the notebook PC 1 can be absorbed mainly by the impact absorbing part 6, and vibration generated by the shake of the notebook PC 1 or the rotation of the disc device can be damped mainly by the vibration damping part 7. This protects the hard disc device 2 from the impact or vibration applied to the notebook PC 1 and hardly causes the malfunction of the hard disc device 2 due to the impact or vibration. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention protects an external storage device such as a hard disk device housed in an information processing device such as a notebook type personal computer, a car audio device, a car navigation device, a portable audio player, and a digital video camera from shock and vibration. The present invention relates to a buffer member.

  As shown in FIG. 27, a storage unit 1a of a notebook type personal computer (hereinafter abbreviated as “notebook PC”) 1 serving as an information processing device is used as an external storage device that accommodates a disk-shaped storage medium. A hard disk device 2 is stored. The hard disk device 2 includes a box-shaped housing 3 having an upper surface 3a and a bottom surface 3b that are substantially rectangular, and a cushioning member 4 made of a rubber-like elastic body having a low hardness is mounted on the long side surface 3c of the housing 3. Has been.

As shown in FIG. 28, the buffer member 4 is formed with a side surface support portion 4a for protecting the longitudinal side surface 3c of the housing 3 in the hard disk device 2. The upper end and the lower end of the side surface support portion 4a The body 3 protrudes upward and downward from the surface edges of the upper surface 3a and the bottom surface 3b. Further, a top surface support portion 4b and a bottom surface support portion 4c that protrude in a cantilever form from the side surface support portion 4a are formed so as to cover the edge portions of the top surface 3a and the bottom surface 3b of the housing 3 continuously with the long side surface 3c. (Patent Document 1). When the hard disk device 2 is stored in the storage unit 1a of the notebook PC 1, the cushioning member 4 is disposed in a state where the buffer member 4 is sandwiched between the hard disk device 2 and the storage unit 1a. The shock-absorbing member 4 is deformed and the shock is reduced (absorbed) to protect the hard disk device 2.
JP 2005-38538 A

  By the way, although the hard disk device 2 may be subjected to vibrations to cause malfunction, up to now, emphasis was placed on countermeasures against impacts, and vibration countermeasures have not been sufficiently taken. Therefore, the necessity of countermeasures against vibration is increasing in addition to the above-described countermeasures against impact. However, when the loss tangent (tan δ) of the rubber-like elastic body is increased in order to increase the vibration damping property of the buffer member 4 made of a low-hardness rubber-like elastic body, the compression set of the rubber-like elastic body increases. There is a problem that the creep property of the buffer member 4 is deteriorated, and the dimensional stability at the time of mounting, transportation and repeated use is deteriorated.

  The present invention has been made against the background of the prior art as described above. That is, an object of the present invention is to provide a buffer member that is attached to an external storage device such as a hard disk device and protects the external storage device from impacts, and also makes it difficult to cause a malfunction due to vibration of the external storage device.

  In order to achieve the above object, the present invention is configured as follows. That is, the present invention relates to a cushioning member that elastically supports a box-shaped external storage device inside a storage unit provided in an information processing apparatus, and a soft rubber-like elastic body having a TYPE A hardness defined by JIS K6253 of 30 or less. And an impact absorbing portion in contact with either the external storage device or the storage portion, and a rubbery elastic body having a loss tangent (tan δ) at a temperature of 25 ° C. and a frequency of 10 Hz of 0.2 or more, and the external storage device or A shock-absorbing member comprising a vibration damping unit in contact with either one of the storage units is provided.

In the present invention, since the soft shock absorbing portion that contacts one of the external storage device or the storage portion and the vibration damping portion that contacts the other one are provided, the shock and vibration (disturbance vibration) applied to the information processing device are transmitted from the storage portion. It is transmitted to the external storage device through the shock absorbing portion and the vibration damping portion. Therefore, it is considered that the impact can be mainly absorbed by the impact absorbing portion, and the vibration can be mainly attenuated by the vibration attenuating portion. Therefore, the external storage device can be protected from the impact and vibration applied to the information processing apparatus, and malfunction of the external storage device due to the impact and vibration can be made difficult to occur.
That is, when viewed locally, since it has a vibration damping part made of a rubber-like elastic body with a tan δ of 0.2 or more at a temperature of 25 ° C. and a frequency of 10 Hz, it is subject to disturbance vibration from the information processing device to the external storage device. In addition, vibrations (internal vibrations) that occur inside the external storage device can also be attenuated, protecting the external storage device from vibrations and preventing the external storage device from malfunctioning.
In addition, since it has an impact absorbing portion made of a soft rubber-like elastic body having a type A hardness of 30 or less as defined in JIS K6253, it absorbs the impact transmitted to the external storage device due to the fall of the information processing device, It protects the external storage device from attack and prevents the external storage device from malfunctioning.
Furthermore, since the shock absorbing portion and the vibration damping portion are integrally provided, it is possible to compensate for the defect in properties. For example, a vibration attenuating part having high vibration attenuating performance has a large compression set and a poor creep property. Therefore, when the vibration attenuating part is compressed, it is crushed and deformed over time. However, in the present invention, since the vibration damping part and the shock absorbing part are integrated, the shock absorbing part is easily compressed, and compression of the vibration damping part can be suppressed. Therefore, it is possible to make it difficult for the vibration damping portion to be crushed over time, and the impact absorbing portion can compensate for the creep property of the vibration damping portion. In addition, the shock absorbing portion alone is soft and easily deformed and difficult to handle. However, since the shock absorbing portion and the vibration damping portion are integrated, the vibration damping portion contributes to maintaining the shape and the buffer member can be easily handled.

  The shock absorbing part may have a deflection hole that penetrates the wall thickness. If it does in this way, when a shock absorption part is compressed, the hole wall of a bending hole can be deform | transformed so that it may bulge in a hole, and the shock absorption property of a shock absorption part can be improved.

  About the said buffer member which has a bending hole in an impact-absorbing part, the uneven | corrugated surface which can deform | transform can be provided in the surface of an impact-absorbing part. If it does in this way, the surface side of an impact-absorbing part can be made easy to deform | transform, and the impact-absorbing property of an impact-absorbing part can further be improved.

  About the said buffer member which has a bending hole in an impact-absorbing part, a vibration damping part shall have an air hole which penetrates thickness and faces the bending hole of an impact-absorbing part. If it does in this way, when a bending hole deform | transforms, the air in a hole can be escaped from an air hole, and the hole wall of a bending hole can be easily swelled in a hole. Therefore, the impact absorbability of the impact absorbing portion can be increased.

  The shock absorbing portion and the vibration damping portion are each formed in a U-shaped cross section having an upper surface support portion, a side surface support portion, and a bottom surface support portion that elastically support the upper surface side, the side surface side, and the bottom surface side of the external storage device, respectively. can do. In this way, if the opening having a U-shaped cross section is inserted from the side of the external storage device, the buffer member can be easily attached to the external storage device.

  For the cushioning member formed in a U-shaped cross section, holding portions that are bent along the side surfaces adjacent to the side surfaces of the external storage device that the side surface support portions elastically support are provided at both ends of the side surface support portions. The holding protrusions protruding inward can be provided on the opposing inner surfaces of both holding portions. In this way, the holding portion can be locked to both side surfaces adjacent to the side surface elastically supported by the side surface supporting portion, and the buffer member can be easily attached to the external storage device. Furthermore, since the holding protrusions that project inward are provided on the inner surfaces of the two holding portions that face each other, the external storage device can be strongly held by the holding protrusions, and the buffer member can be securely attached to the external storage device. Can do.

  For the buffer member formed in a U-shaped cross section, the thickness of the shock absorbing portion in the side support portion is made thicker than the thickness of the vibration damping portion, and the vibration damping in the upper surface support portion and the bottom surface support portion. The thickness of the portion can be made thicker than the thickness of the shock absorbing portion. Since the upper surface support portion and the bottom surface support portion are free to be deformed because the end portions on the inner surfaces of the surfaces that are elastically supported are exposed, they are more easily deformed than the side surface support portions. That is, the side surface support portion is less likely to be compressed and deformed than the upper surface support portion and the bottom surface support portion. Therefore, if the thickness of the shock absorbing portion is formed thicker than the thickness of the vibration damping portion in the side support portion, the shock absorbing portion can be easily compressed and deformed, and the shock absorption can be enhanced. In addition, since the shock absorbing part is easy to compress and deform at the upper surface support part and the bottom surface support part and has high shock absorbency, if the thickness of the vibration attenuating part is made thicker than the thickness of the shock absorbing part, the vibration attenuating property is improved. Can be increased. The “thickness” of the shock absorbing unit and the vibration attenuating unit means the thickness in the clamping direction between the storage unit and the external storage device, that is, the thickness in the direction in which the impact or disturbance vibration is transmitted from the storage unit to the external storage device.

  The shock absorbing unit may be in contact with the storage unit, and the vibration damping unit may be in contact with the external storage device. If the impact absorbing portion is brought into contact with the storage portion in this manner, the impact absorbing portion can be easily acted on an impact applied from the outside, and the impact absorbability can be enhanced.

About the said buffer member of this invention, a vibration damping part can be formed with the styrene-type thermoplastic elastomer containing 10% or more of styrene-isoprene-styrene copolymers (SIS). Since SIS has a damping property, if it constitutes 10% or more of the rubber-like elastic body forming the vibration damping part, tan δ of the vibration damping part can be increased to 0.2 or more. If it is less than 10%, it is difficult to increase tan δ of the vibration damping portion.
Since this SIS has poor heat resistance and weather resistance, if the vibration damping part is composed of SIS 100%, the compression set of the vibration damping part tends to increase. Therefore, if SIS and a saturated styrene-based elastomer are blended, the compression set of the vibration damping portion can be reduced. Examples of the saturated styrene-based thermoplastic elastomer include styrene-ethylene / butylene-styrene copolymer (SEBS), styrene-ethylene / propylene-styrene copolymer (SEPS), and styrene-isobutylene-styrene copolymer ( SIBS). Styrenic thermoplastic elastomer is easily blended with SIS in terms of molecular structure and can be easily blended, and is a suitable material for constituting a vibration damping part.

  According to the buffer member of the present invention, the external storage device can be protected from the impact and vibration applied to the information processing apparatus, and malfunction of the external storage device due to the impact and vibration can be made difficult to occur.

  Hereinafter, the present invention will be described based on embodiments with reference to the drawings. The embodiment described below is an example in which the buffer member of the present invention is applied to the hard disk device 2 mounted on the notebook PC 1, but a desktop personal computer, car audio device, car navigation device, portable audio player, digital video camera, etc. The present invention can also be applied to various disk media drive devices such as optical disk devices incorporated in other information processing apparatuses. In addition, duplication description is abbreviate | omitted about the structure and material which are common in each embodiment, an effect, and a manufacturing method.

First Embodiment [FIGS. 1 to 3]:
The shock-absorbing member 5 of the first embodiment is shown in FIG. 1, and its cross-sectional view is shown in FIG. FIG. 3 shows an attachment structure in which the buffer member 5 is attached to the hard disk device 2 and stored in the storage portion 1a. As shown in these figures, the buffer member 5 is mounted along the long side surface 3c to the end portions of the top surface 3a and the bottom surface 3b of the housing 3 in the hard disk device 2 on the long side surface 3c side.

The buffer member 5 of the first embodiment includes an impact absorbing unit 6 and a vibration damping unit 7.
The shock absorber 6 is a member mainly for absorbing a shock received by the hard disk device 2 from the outside, and is formed in a solid strip shape with a rubber-like elastic body.
The vibration attenuating unit 7 is a member for attenuating disturbance vibrations mainly received from the outside of the hard disk device 2 and internal vibrations generated from the hard disk device 2 itself, and is formed in a solid strip shape with a rubber-like elastic body. .
Comparing the thickness of the shock absorbing portion 6 and the vibration damping portion 7, the thickness of the vibration damping portion 7 is thinner than the thickness of the shock absorbing portion 6.

Next, the material of each of the above components constituting the buffer member 5 will be described.
The material of the “rubber-like elastic body” of the shock absorber 6 has a JIS K6253 TYPE A hardness of 30 or less. This is because if it exceeds 30, the shock absorption is poor. In addition, depending on the required performance such as dimensional accuracy, heat resistance, mechanical strength, durability, reliability, anti-vibration characteristics, control characteristics, etc., it is possible to select and use appropriate types from thermoplastic elastomers and thermosetting rubbers. it can. Examples of the thermoplastic elastomer include styrene thermoplastic elastomer, olefin thermoplastic elastomer, polyurethane thermoplastic elastomer, ester thermoplastic elastomer, vinyl chloride thermoplastic elastomer, and the like. Examples of the thermosetting rubber include butyl rubber, acrylic rubber, urethane rubber, ethylene propylene rubber, fluorine rubber, and silicone rubber. And about the above rubber-like elastic bodies, what added a flame retardant, a lubricant, etc. may be used.

  The material of the “rubber-like elastic body” of the vibration damping unit 7 has a loss tangent (tan δ) of 0.2 or more at a temperature of 25 ° C. and a frequency of 10 Hz. This is because if it is less than 0.2, it is difficult to produce an effect of damping the vibration. The vibration attenuating portion 7 is a rubber-like elastic body having a JIS K6353 TYPE A hardness of 30 to 70, which is different from the resin. As with the shock absorber 6, the vibration attenuating unit 7 is made of thermoplastic elastomer, heat, or the like depending on the required performance such as dimensional accuracy, heat resistance, mechanical strength, durability, reliability, anti-vibration characteristics, and control characteristics. An appropriate type can be selected and used from the curable rubber. Examples of the thermoplastic elastomer include styrene thermoplastic elastomer, olefin thermoplastic elastomer, polyurethane thermoplastic elastomer, ester thermoplastic elastomer, vinyl chloride thermoplastic elastomer, and the like. Examples of the thermosetting rubber include butyl rubber, acrylic rubber, urethane rubber, ethylene propylene rubber, fluorine rubber, and silicone rubber. And about the above rubber-like elastic bodies, what added a flame retardant, a lubricant, etc. may be used.

The buffer member 5 as described above has a two-layer structure including the shock absorbing unit 6 and the vibration damping unit 7, but the ratio of the thickness of the shock absorbing unit 6 and the vibration damping unit 7 in the thickness direction of the buffer member 5. Is 3: 1 to 1: 3, preferably 2: 1 to 1: 2. This is because when the range of 3: 1 to 1: 3 is exceeded, the impact of the shock absorbing portion 6 or the vibration damping portion 7 is reduced, and the shock absorbing property or the vibration damping property is deteriorated.
When the hard disk device 2 is mounted along the long side surface 3c with respect to the end portions of the top surface 3a and the bottom surface 3b of the housing 3 on the long side surface 3c side, both ends in the longitudinal direction are outside the short side surface 3d of the housing 3. Projecting in the direction (FIG. 1). When stored in the storage unit 1a, the shock absorbing unit 6 contacts the storage unit 1a, and the vibration damping unit 7 contacts the housing 3 (FIG. 3).

  In order to manufacture the buffer member 5 of the present embodiment, when a thermoplastic elastomer is used for the shock absorbing portion 6 and the vibration damping portion 7, the shock absorbing portion 6 and the vibration damping are formed by injection molding such as two-color molding or insert molding. The buffer member 5 can be obtained by integral molding with the portion 7. In addition, the buffer member 5 can be obtained by fixing and integrating with an adhesive or a pressure-sensitive adhesive, or integration using molecular bonding at the interface between the shock absorbing unit 6 and the vibration damping unit 7.

Next, the operation and effect of the buffer member 5 of this embodiment will be described.
According to the buffer member 5, the impact or disturbance vibration applied to the notebook PC 1 is transmitted from the storage unit 1 a to the external storage device through the shock absorbing unit 6 and the vibration damping unit 7. Therefore, the impact caused by the drop of the notebook PC 1 can be absorbed mainly by the impact absorbing section 6, and the vibration caused by the swing of the notebook PC 1 or the rotation of the disk device can be attenuated mainly by the vibration attenuating section 7. it can. Therefore, it is possible to protect the hard disk device 2 from the impact and vibration applied to the notebook PC 1, and to prevent malfunction of the hard disk device 2 due to the impact and vibration.
Furthermore, since the shock absorbing portion 6 and the vibration damping portion 7 are integrally provided, it is possible to compensate for the defect in properties. Specifically, the shock absorbing part 6 can supplement the property of the vibration damping part 7 that is easily crushed and deformed with time, and the vibration damping part 7 supplements the flexible and difficult to handle property of the shock absorbing part 6. be able to.

  Since the shock absorbing unit 6 contacts the storage unit 1a and the vibration damping unit 7 contacts the hard disk device 2, the shock absorbing unit 6 can be easily applied to an externally applied shock, and the shock absorption is improved. be able to.

Modified example of the first embodiment (FIGS. 4 and 5):
FIG. 4 shows a perspective view of a buffer member 8 which is a modification of the first embodiment, and FIG. 5 shows a sectional view thereof. In the shock-absorbing member 5 of the first embodiment, both the shock absorbing portion 6 and the vibration damping portion 7 are formed in a solid strip shape. However, in the shock-absorbing member 8, the thickness in the holding direction of the storage portion 1a and the hard disk device 2 is increased. Six shock-absorbing portions 9 are provided with six circular holes 9 a penetrating through the hole. In this way, when the shock absorbing portion 9 is compressed in response to an impact, the hole wall of the flexure hole 9a can be deformed so as to bulge into the hole, and the shock absorbing property of the shock absorbing portion 9 can be increased. Can be increased.

Second Embodiment [FIG. 6]:
The buffer member 10 of 2nd Embodiment is shown in FIG. The buffer member 10 of the second embodiment is different from the buffer member 5 of the first embodiment in that it has a three-layer structure of an impact absorbing portion 6 and a vibration damping portion 7. And each edge part of a long direction and a short direction is made into the cut-off shape, and the impact-absorbing part 6 is exposed. In the buffer member 10 having such a structure, the vibration damping unit 7 not only contacts the hard disk device 2 but also contacts the storage unit 1 a and the housing 3 with the shock absorbing unit 6 interposed therebetween.

  According to the buffer member 10, even if the shock absorbing part 6 is sandwiched between the vibration attenuating parts 7, since the respective ends in the longitudinal direction and the short direction of the vibration attenuating part 7 are exposed, the shock absorbing part is compressed. Then, each end can be deformed so as to bulge outward, and the shock absorption can be enhanced. Moreover, since the vibration damping part 7 is provided with two layers, vibration damping can be improved.

Third Embodiment [FIGS. 7 to 9]:
A buffer member 11 of the third embodiment is shown in FIGS. FIG. 9 shows a mounting structure in which the buffer member 11 is mounted on the hard disk device 2 and stored in the storage unit 1a. The shock absorbing member 11 of the third embodiment is different from the shock absorbing member 5 of the first embodiment in the shapes of the shock absorbing portion 12 and the vibration damping portion 13.

As shown in FIG. 9, the shock absorber 12 includes a side support 12 a along the longitudinal side 3 c of the housing 3 in the hard disk device 2 and a top support that protrudes from one end of the side support 12 a to the top 3 a of the housing 3. The portion 12b and a bottom surface support portion 12c that similarly protrudes from the other end of the side surface support portion 12a to the bottom surface 3b have a U-shaped cross section.
Holding portions 12d and 12d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided at both ends in the longitudinal direction of the side support portion 12a.
The buffer member 11 is attached to the longitudinal side surface 3 c of the housing 3 in the hard disk device 2.

  The vibration attenuating unit 13 has the same structure as the shock absorbing unit 12. That is, the vibration damping unit 13 is the same as the side support part 13a along the long side surface 3c of the housing 3 in the hard disk device 2, and the top support part 13b protruding from one end of the side support part 13a to the top surface 3a of the housing 3. And a bottom surface support portion 13c that protrudes from the other end of the side surface support portion 13a to the bottom surface 3b. Further, holding portions 13 d and 13 d that are bent along the short side surface 3 d of the housing 3 of the hard disk device 2 are provided at both ends in the longitudinal direction of the side surface support portion 13 a. The vibration attenuating portion 13 is fixed to an inner surface having a U-shaped cross section formed by the shock absorbing portion 12.

  When the buffer member 11 as described above is attached to the hard disk device 2, the U-shaped inner surface of the vibration attenuating portion 13 comes into contact with the housing 3. And when it accommodates in the storage part 1a, the outer surface of the cross-sectional U shape of the impact-absorbing part 12 contacts the storage part 1a (FIG. 9).

  In order to manufacture the buffer member 11 of the third embodiment, similarly to the buffer member 5 of the first embodiment, a thermoplastic elastomer is used for the shock absorbing portion 12 and the vibration damping portion 13, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 12 and the vibration damping portion 13 can be integrally formed by molding. As another manufacturing method, the shock absorbing portion 12 and the vibration damping portion 13 are separately formed, and both are fixed and integrated with an adhesive or an adhesive, or the shock absorbing portion 12 and the vibration damping portion 13 are There is a method of integrating by utilizing molecular bonds at the interface.

  The vibration attenuating unit 13 that contacts the housing 3 of the hard disk device 2 elastically supports the top surface 3a side, the bottom surface 3b side, and the long side surface 3c side of the housing 3 respectively, the side surface supporting unit 13a, and the bottom surface supporting unit. The buffer member 11 can be easily attached to the hard disk device 2 by inserting an opening having a U-shaped cross section from the longitudinal side surface 3c side of the hard disk device 2.

Fourth Embodiment [FIGS. 10 and 11]:
A shock-absorbing member 14 of the fourth embodiment is shown in FIG. FIG. 11 shows a mounting structure in which the buffer member 14 is mounted on the hard disk device 2 and stored in the storage unit 1a. The buffer member 14 of the fourth embodiment is different from the buffer member 11 of the third embodiment in the configuration of the shock absorbing portion 15.

Similar to the shock absorber 12 of the third embodiment, the shock absorber 15 includes a side support 15a along the longitudinal side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side support 15a. The upper surface support portion 15b protruding to 3a and the bottom surface support portion 15c similarly protruding from the other end of the side surface support portion 15a to the bottom surface 3b are formed in a U-shaped cross section.
At both ends in the longitudinal direction of the side support portion 15a, holding portions 15d and 15d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided.
The difference from the shock absorbing part 12 is that a side hole 15a is provided with a bending hole 15e penetrating the wall thickness in the holding direction between the storage part 1a and the hard disk device 2. In the fourth embodiment, six circular bending holes 15e are formed, and when the shock absorbing portion 15 receives stress such as compression, the hole wall of the bending hole 15e is deformed so as to bulge into the hole.

  When the buffer member 14 is mounted on the hard disk device 2, the U-shaped inner surface of the vibration damping unit 13 comes into contact with the housing 3. And when it accommodates in the storage part 1a, the outer surface of the U-shaped cross section of the impact-absorbing part 15 contacts the storage part 1a (FIG. 11).

  In order to manufacture the buffer member 14 of the fourth embodiment, similarly to the buffer member 11 of the third embodiment, a thermoplastic elastomer is used for the shock absorbing portion 15 and the vibration damping portion 13, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 15 and the vibration damping portion 13 can be integrally formed by molding. As another manufacturing method, the shock absorbing portion 15 and the vibration damping portion 13 are separately formed, and both are fixed and integrated with an adhesive or an adhesive, or the interface between the shock absorbing portion 15 and the vibration damping portion 13 is used. There is a method of making use of molecular bonds in the case of integration.

  Since the side support portion 15a is provided with the flexure hole 15e, when the impact absorbing portion 15 is compressed by receiving an impact, the hole wall of the flexure hole 15e can be deformed so as to bulge into the hole. The shock absorption property of the absorption part 15 can be improved.

First Modification of Fourth Embodiment [FIG. 12 (A)]:
FIG. 12A shows a perspective view of a buffer member 16 which is a first modification of the fourth embodiment. In the shock absorbing member 14 of the fourth embodiment, the circular bending hole 15e is formed in the side surface support portion 15a of the shock absorbing portion 15, but in the shock absorbing member 16, the shock absorbing portion 17 is replaced with the side surface supporting portion 17a and the upper surface supporting portion 17b. The bottom surface support portion 17c and the holding portion 17d are provided with two rectangular bending holes 17e on the side surface support portion 17a. In this way, when the impact absorbing portion 17 is compressed by receiving an impact, the hole wall of the bending hole 17e can be deformed so as to bulge into the hole, and the impact absorbing property of the impact absorbing portion 17 is enhanced. be able to.

Second Modification of Fourth Embodiment [FIG. 12B]:
FIG. 12B shows a perspective view of a buffer member 18 that is a second modification of the fourth embodiment. In the shock absorbing member 14 of the fourth embodiment, the circular bending hole 15e is formed in the side surface support portion 15a of the shock absorbing portion 15, but in the shock absorbing member 18, the shock absorbing portion 19 is replaced with the side surface supporting portion 19a and the top surface supporting portion 19b. The bottom surface support portion 19c and the holding portion 19d are provided with one rectangular deformation hole 19e larger than the deformation hole 17e of the first modification. In this way, when the impact absorbing portion 19 is compressed by receiving an impact, the hole wall of the bending hole 19e can be deformed so as to bulge into the hole, and the impact absorbing property of the impact absorbing portion 19 is enhanced. be able to.

Fifth Embodiment [FIGS. 13 and 14]:
A buffer member 20 of the fifth embodiment is shown in FIG. FIG. 14 shows a mounting structure in which the buffer member 20 is mounted on the hard disk device 2 and stored in the storage unit 1a. The buffer member 20 of the fifth embodiment is different from the buffer member 14 of the fourth embodiment in the configuration of the shock absorbing portion 21.

Similar to the shock absorber 15 of the fourth embodiment, the shock absorber 21 includes a side support 21a along the longitudinal side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side support 21a. The upper surface support portion 21b that protrudes to 3a and the bottom surface support portion 21c that similarly protrudes from the other end of the side surface support portion 21a to the bottom surface 3b have a U-shaped cross section.
At both ends in the longitudinal direction of the side support portion 21a, holding portions 21d and 21d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided. Further, the side support portion 21a is provided with six circular bending holes 21e penetrating the thickness in the holding direction between the storage portion 1a and the hard disk device 2.
The difference from the shock absorbing part 15 is that a relief groove 21f along the long side surface 3c of the housing 3 is provided on the outer surface of the side support part 21a, and the surface of the shock absorbing part 15 is made an "uneven surface" that can be deformed. is there. The escape grooves 21f are formed so as to connect the six escape holes 21e across both ends of the side support portion 21a in the longitudinal direction.

  When the shock-absorbing member 20 is attached to the hard disk device 2, the inner surface having a U-shaped cross section of the vibration damping unit 13 comes into contact with the housing 3. And when it accommodates in the storage part 1a, the cross-sectional outer shape of the shock absorption part 21 will contact the storage part 1a (FIG. 14).

  In order to manufacture the shock absorbing member 20 of the fifth embodiment, similarly to the shock absorbing member 14 of the fourth embodiment, a thermoplastic elastomer is used for the shock absorbing portion 21 and the vibration damping portion 13, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 21 and the vibration damping portion 13 can be integrally formed by molding. As another manufacturing method, the shock absorbing part 21 and the vibration attenuating part 13 are formed separately, and both are fixed and integrated with an adhesive or an adhesive, or the interface between the shock absorbing part 21 and the vibration attenuating part 13 is used. There is a method of making use of molecular bonds in the case of integration.

  Since the relief groove 21f is provided on the surface of the side support portion 21a in the shock absorbing portion 21, the relief groove 21f is deformed when the shock absorbing portion 21 receives stress such as compression, and the surface side of the shock absorbing portion 21 is easily deformed. It is possible to further improve the shock absorption of the shock absorbing portion 21.

Sixth Embodiment [FIGS. 15 and 16]:
A buffer member 22 of the sixth embodiment is shown in FIG. FIG. 16 shows a mounting structure in which the buffer member 22 is mounted on the hard disk device 2 and stored in the storage unit 1a. The buffer member 22 of the sixth embodiment is different from the buffer member 20 of the fifth embodiment in the configuration of the shock absorbing portion 23.

Similar to the shock absorber 21 of the fifth embodiment, the shock absorber 23 includes a side surface support 23a along the longitudinal side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side surface support 23a. The upper surface support portion 23b that protrudes to 3a and the bottom surface support portion 23c that similarly protrudes from the other end of the side surface support portion 23a to the bottom surface 3b have a U-shaped cross section.
At both ends in the longitudinal direction of the side support portion 23a, holding portions 23d and 23d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided.
The shock absorber 21 is different from the shock absorber 21 in that the side support 23a is provided with four circular deflection holes 23e that penetrate the wall thickness in the holding direction of the storage unit 1a and the hard disk device 2, and further the side support 23a. A relief recess 23f is formed for each of the deflection holes 23e with respect to the outer surface, and the surface of the shock absorbing portion 23 is a deformable surface that can be deformed.

  When the buffer member 22 is attached to the hard disk device 2, the inner surface having a U-shaped cross section of the vibration damping unit 13 comes into contact with the housing 3. And when it accommodates in the storage part 1a, the outer surface of the cross-sectional U-shape of the impact-absorbing part 23 will contact the storage part 1a (FIG. 16).

  In order to manufacture the buffer member 22 of the sixth embodiment, similarly to the buffer member 20 of the fifth embodiment, a thermoplastic elastomer is used for the shock absorbing portion 23 and the vibration damping portion 13, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 23 and the vibration damping portion 13 can be integrally formed by molding. As another manufacturing method, the shock absorbing portion 23 and the vibration damping portion 13 are separately formed, and both are fixed and integrated with an adhesive or an adhesive, or the interface between the shock absorbing portion 23 and the vibration damping portion 13 is formed. There is a method of making use of molecular bonds in the case of integration.

  Since the relief recess 23f is provided on the surface of the side support portion 23a in the impact absorbing portion 23, when the impact absorbing portion 23 receives a stress such as compression, the relief recess 23f is deformed and the surface side of the impact absorbing portion 23 is easily deformed. It is possible to further improve the shock absorption of the shock absorbing portion 23.

Seventh Embodiment [FIGS. 17 and 18]:
The buffer member 24 of the seventh embodiment is shown in FIG. FIG. 18 shows a mounting structure in which the buffer member 24 is mounted on the hard disk device 2 and stored in the storage unit 1a. The shock absorbing member 25 of the seventh embodiment differs from the shock absorbing member 14 of the fourth embodiment in the configuration of the shock absorbing portion 25.

Similar to the shock absorbing unit 15 of the fourth embodiment, the shock absorbing unit 25 includes a side surface supporting unit 25a along the long side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side surface supporting unit 25a. The upper surface support portion 25b protruding to 3a and the bottom surface support portion 25c similarly protruding from the other end of the side surface support portion 25a to the bottom surface 3b are formed in a U-shaped cross section.
At both ends in the longitudinal direction of the side support portion 25a, holding portions 25d and 25d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided.
The shock absorber 15 differs from the shock absorber 15 in that the side support 25a is provided with four circular bending holes 21e that penetrate the wall thickness in the holding direction of the storage unit 1a and the hard disk device 2, and further the side support 25a. Five rectangular protrusions 25f are provided so as to sandwich the escape holes 25e with respect to the outer surface, and the surface of the shock absorbing portion 25 can be deformed as an “uneven surface”.

  When the buffer member 24 is attached to the hard disk device 2, the inner surface of the vibration damping portion 13 having a U-shaped cross section comes into contact with the housing 3. When stored in the storage portion 1a, the outer surfaces of the upper surface support portion 25b and the bottom surface support portion 25c and the end surface of the contact projection 25f in the shock absorbing portion 25 come into contact with the storage portion 1a (FIG. 18).

  In order to manufacture the shock absorbing member 24 of the seventh embodiment, similarly to the shock absorbing member 14 of the fourth embodiment, thermoplastic elastomer is used for the shock absorbing portion 25 and the vibration damping portion 13, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 25 and the vibration damping portion 13 can be integrally formed by molding. As another manufacturing method, the shock absorbing portion 25 and the vibration damping portion 13 are separately formed, and both are fixed and integrated with an adhesive or an adhesive, or the interface between the shock absorbing portion 25 and the vibration damping portion 13 is used. There is a method of making use of molecular bonds in the case of integration.

  Since the bump projection 25f is provided on the surface of the side support portion 25a in the shock absorber 25, the bump projection 25f can be crushed and deformed when the shock absorber 25 is subjected to stress such as compression. Can be further enhanced.

Eighth Embodiment (FIGS. 19 and 20):
A buffer member 26 of the eighth embodiment is shown in FIG. FIG. 20 shows a mounting structure in which the buffer member 26 is mounted on the hard disk device 2 and stored in the storage unit 1a. The shock absorbing member 26 of the eighth embodiment is different from the shock absorbing member 24 of the seventh embodiment in the configuration of the shock absorbing portion 27.

Similar to the shock absorbing unit 25 of the seventh embodiment, the shock absorbing unit 27 includes a side support 27a along the long side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side support 27a. The upper surface support portion 27b that protrudes to 3a and the bottom surface support portion 27c that similarly protrudes from the other end of the side surface support portion 27a to the bottom surface 3b have a U-shaped cross section.
At both ends in the longitudinal direction of the side support portion 27a, holding portions 27d and 27d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided.
The shock absorber 25 is different from the shock absorber 25 in that the side support 27a is provided with two rectangular bent holes 27e penetrating the thickness in the holding direction of the storage unit 1a and the hard disk device 2, and the side support 27a. A rectangular contact protrusion 27f is provided at each hole edge of each escape hole 27e with respect to the outer surface of each of the outer surfaces, and the surface of the shock absorbing portion 27 can be deformed as an “uneven surface”. And one surface of the hole wall surface in the rectangular escape hole 27e and one surface of the side surface of the rectangular contact protrusion 27f are formed flush with each other.

  When the buffer member 26 is mounted on the hard disk device 2, the U-shaped inner surface of the vibration damping unit 13 contacts the housing 3. When stored in the storage portion 1a, the outer surfaces of the upper surface support portion 27b and the bottom surface support portion 27c and the end surface of the contact protrusion 27f in the shock absorbing portion 27 come into contact with the storage portion 1a (FIG. 20).

  In order to manufacture the buffer member 26 according to the eighth embodiment, similarly to the buffer member 24 according to the seventh embodiment, a thermoplastic elastomer is used for the shock absorbing portion 27 and the vibration damping portion 13, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 27 and the vibration damping portion 13 can be integrally formed by molding. As another manufacturing method, the shock absorbing part 27 and the vibration damping part 13 are formed separately, and both are fixed and integrated with an adhesive or an adhesive, or the interface between the shock absorbing part 27 and the vibration damping part 13 is used. It is a method of making use of molecular bonds in the integration.

  The impact absorbing portion 27 is subjected to a stress such as compression because a part of the hole wall surface and a portion of the side surface of the relief hole 27e are flush with the surface of the side support portion 27a in the shock absorbing portion 27. The protrusion 27f can be crushed and deformed while expanding the hole wall of the bending hole 27e into the hole, and the shock absorption of the shock absorbing portion 27 can be further enhanced.

First Modification of Eighth Embodiment [FIG. 21A]:
FIG. 21A shows a perspective view of a buffer member 28 that is a first modification of the eighth embodiment. In the shock-absorbing member 26 of the eighth embodiment, one rectangular contact protrusion 27f is provided at each hole edge of the two escape holes 27e. However, in the shock-absorbing member 28, the shock absorbing portion 29 is supported by the side surface support portion 29a and the upper surface support. It comprises a portion 29b, a bottom surface support portion 29c, and a holding portion 29d, and two rectangular contact projections 29f are provided at the hole edges of the two rectangular bending holes 29e provided in the side surface support portion 29a. That is, the side support portion 29a has two hole wall surfaces formed flush with one surface of the side surface of the rectangular contact protrusion 29f, and two rectangular escape holes 29e facing each other are provided. Provided. Even in this way, when the shock absorbing portion 29 receives stress such as compression, the contact projection 29f can be crushed and deformed while the hole wall of the bending hole 29e is expanded into the hole, and the shock absorbing property of the shock absorbing portion 29 is reduced. Can be further enhanced.

Second Modification of Eighth Embodiment [FIG. 21B]:
FIG. 21B shows a perspective view of a buffer member 30 that is a second modification of the eighth embodiment. In the cushioning member 26 of the eighth embodiment, one rectangular contact protrusion 27f is provided at each hole edge of the two escape holes 27e. However, in the cushioning member 30, the shock absorbing portion 31 is supported by the side surface support portion 31a and the upper surface support. A rectangular ring-shaped protrusion 31f is provided at the edge of two rectangular bent holes 31e provided in the side surface support 31a. In other words, the side support portion 31a is provided with two rectangular relief holes 29e each having four hole wall surfaces formed flush with the inner side surface of the rectangular annular contact protrusion 31f. Even in this case, when the shock absorbing portion 31 receives a stress such as compression, the contact protrusion 31f can be crushed and deformed while the hole wall of the bending hole 31e bulges into the hole. Can be further enhanced.

Ninth Embodiment [FIGS. 22 and 23]:
The buffer member 32 of the ninth embodiment is shown in FIG. Further, FIG. 23 shows a mounting structure in which the buffer member 32 is mounted on the hard disk device 2 and stored in the storage unit 1a. The buffer member 32 of the ninth embodiment is different from the buffer member 14 of the fourth embodiment in the configuration of the vibration damping unit 33.

Similarly to the vibration attenuating unit 13 of the fourth embodiment, the vibration attenuating unit 33 includes a side support 33a along the long side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side support 33a. The upper surface support portion 33b protruding to 3a and the bottom surface support portion 33c protruding from the other end of the side surface support portion 33a to the bottom surface 3b are formed in a U-shaped cross section.
At both ends in the longitudinal direction of the side support portion 33a, holding portions 33d and 33d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided. The vibration attenuating portion 33 is fixed to the inner surface having a U-shaped cross section formed by the shock absorbing portion 15.
The difference from the vibration attenuating unit 13 is that an air hole 33e that penetrates the wall thickness in the holding direction of the storage unit 1a and the hard disk device 2 through the side surface support unit 33a and faces the bending hole 15e of the shock absorbing unit 15 is provided. is there.

  When the buffer member 32 is attached to the hard disk device 2, the U-shaped inner surface of the vibration damping portion 33 comes into contact with the housing 3. And when it accommodates in the storage part 1a, the outer surface of the cross-sectional U shape of the impact-absorbing part 15 contacts the storage part 1a (FIG. 23).

  In order to manufacture the buffer member 32 of the ninth embodiment, similarly to the buffer member 14 of the fourth embodiment, a thermoplastic elastomer is used for the shock absorbing portion 15 and the vibration damping portion 33, and injection such as two-color molding or insert molding is performed. The impact absorbing portion 15 and the vibration damping portion 33 can be integrally formed by molding. As another manufacturing method, the shock absorbing part 15 and the vibration damping part 33 are formed separately, and both are fixed and integrated with an adhesive or an adhesive, or the interface between the shock absorbing part 15 and the vibration damping part 33 is used. There is a method of making use of molecular bonds in the case of integration.

  Since the side support portion 33a has an air hole 33e that penetrates the wall thickness and faces the bending hole 15e of the shock absorbing portion 15, when the bending hole 15e is deformed by receiving an impact or the like, the air in the hole is changed into the air hole 33e. The hole wall of the bending hole 15e can be easily expanded into the hole. Therefore, the impact absorbability of the impact absorbing portion 15 can be increased.

  Hereinafter, modifications common to the respective embodiments will be described. In addition, although the modified example of the buffer member 11 in 3rd Embodiment is demonstrated as a typical example, the characteristic structure in the following each modified example is the buffer member 14,16,18,20,22,24 of other embodiment. , 26, 28, 30, 32 can also be applied.

First modification common to the third to ninth embodiments:
In the buffer member 11 according to the third embodiment, as described above, the shock absorber 12 is attached to the hard disk device 2 so that the shock absorber 12 contacts the storage unit 1a and the vibration attenuator 13 contacts the housing 3. The hard disk device 2 can also be mounted so that the portion 12 contacts the housing 3 and the vibration damping portion 13 contacts the storage portion 1a.
In the shock absorber 5 of the first embodiment, the shock absorber 6 is attached to the hard disk device 2 so that the shock absorber 6 is in contact with the storage unit 1 a and the vibration damping unit 7 is in contact with the housing 3. Can be attached to the hard disk device 2 so that the vibration attenuating unit 7 contacts the storage unit 1a.

Second modification common to the third to ninth embodiments (FIGS. 24 and 25):
The buffer member 34 of the second modification is shown in FIG. 24, and an enlarged cross-sectional view is shown in FIG. The buffer member 34 of the second modified example is different from the buffer member 11 of the third embodiment in the configuration of the vibration damping unit 35.

Similar to the vibration attenuation unit 13 of the third embodiment, the vibration attenuation unit 35 includes a side surface support unit 35a along the longitudinal side surface 3c of the housing 3 in the hard disk device 2, and an upper surface of the housing 3 from one end of the side surface support unit 35a. The upper surface support portion 35b that protrudes to 3a and the bottom surface support portion 35c that similarly protrudes from the other end of the side surface support portion 35a to the bottom surface 3b have a U-shaped cross section.
Holding portions 35d and 35d that are bent along the short side surface 3d of the housing 3 of the hard disk device 2 are provided at both ends in the longitudinal direction of the side surface support portion 35a. The vibration attenuating portion 35 is fixed to the inner surface of the shock absorbing portion 15 having a U-shaped cross section.
The difference from the vibration attenuating portion 13 is that restraining projections 35e and 35e projecting inward are provided on the opposing inner surfaces of the holding portions 35d and 35d.

  In this way, since the holding protrusion 35e is provided on the holding portion 35d, the case 3 of the hard disk device 2 can be firmly held by both the holding protrusions 35e and 35e, and the buffer member 34 can be securely attached to the hard disk device 2. Can be installed.

Third modification common to the third to ninth embodiments (FIG. 26):
A buffer member 36 of a third modification is shown in FIG. The buffer member 36 of the third modification is different from the buffer member 11 of the third embodiment in the configuration of the shock absorbing portion 37 and the vibration damping portion 38.

Similarly to the shock absorbing portion 12 of the third embodiment, the shock absorbing portion 37 is configured by a side surface support portion 37a, an upper surface support portion 37b, and a bottom surface support portion 37c in a U-shaped cross section, and the longitudinal direction of the side surface support portion 37a is Holding portions 37d and 37d are provided at both ends of the. Similarly to the vibration attenuating portion 13 of the third embodiment, the vibration attenuating portion 38 is also formed in a U-shaped cross section with a side surface supporting portion 38a, an upper surface supporting portion 38b, and a bottom surface supporting portion 38c, and is long in the side surface supporting portion 38a. Holding portions 38d and 38d are provided at both ends in the direction. The vibration attenuating portion 38 is fixed to the inner surface having a U-shaped cross section formed by the shock absorbing portion 37.
Further, the thickness t1 of the side surface support portion 37a in the shock absorbing portion 37 is formed thicker than the thickness t2 of the side surface support portion 38a in the vibration damping portion 38.
The shock absorbing portion 37 and the vibration attenuating portion 38 are different in that the thickness t3 of the upper surface support portion 38b, the wall thickness t4 of the bottom surface support portion 38c, and the wall thickness t5 of the holding portion 38d are impacted. It can be formed thicker than the thickness t6 of the upper surface support portion 37b, the thickness t7 of the bottom surface support portion 37c, and the thickness t8 of the holding portion 37d.

  In this way, when the buffer member 36 is mounted on the hard disk device 2 and stored in the storage unit 1a, the upper surface support portion in the shock absorbing unit 37 even if the buffer member 36 is sandwiched between the storage unit 1a and the hard disk device 2. 37b, the bottom support portion 37c, and the holding portion 37d are free to be deformed because the end portions are exposed, and thus are easily compressed and highly shock-absorbing. Therefore, if the upper surface support portion 38b, the bottom surface support portion 38c, and the holding portion 38d of the vibration damping portion 38 are thick, the vibration damping performance can be improved. High shock absorption and high vibration damping can be realized.

Fourth Modified Example of Third to Ninth Embodiments As described above, the shock absorbing member 11 of the third embodiment has the two-layer structure of the shock absorbing portion 12 and the vibration damping portion 13. A three-layer structure with the part 13 can also be used. In such a three-layer structure, the vibration damping unit 13 not only contacts the hard disk device 2 but also contacts the storage unit 1 a and the housing 3 with the shock absorbing unit 12 interposed therebetween.

  Next, the present invention will be described in more detail with reference to examples and comparative examples.

A. Manufacture of cushioning members:

  Predetermined materials, configurations, and the like that serve as the shock absorbing portions (12, 15) and the vibration damping portion (13) are shown below. These materials were molded in two colors by an injection molding machine and integrated to produce a buffer member (11) to be sample 1 to sample 8 and sample 11 below, and a buffer member (14) to be sample 12. In addition, only the material for the shock absorbing portion was formed in a single color and the sample 9 was produced, and only the material for the vibration damping portion was formed in a single color and the buffer member of the sample 10 was produced. In the following display, “hardness” is the hardness according to JIS K6253 TYPE A, and “loss tangent (tan δ)” is a temperature of 25 ° C. using a dynamic viscoelasticity measuring instrument (DM6100 manufactured by Seiko Instruments Inc.). The value at a frequency of 10 Hz, “compression permanent set (CS)”, indicates that processed for 24 hours in an atmosphere of 25% compression and 70 ° C. according to JIS K6262.

Experimental example 1:
The shock absorbing member (11) having the shape shown in the third embodiment was manufactured, and a drop test and a vibration transmission test were performed to evaluate the shock absorbing property and the vibration damping property of the shock absorbing member (11).

Sample 1:
Shock absorber (12): Styrenic thermoplastic elastomer made of styrene-ethylene-butylene-styrene copolymer (SEBS); Hardness = 20; tan δ = 0.1; CS = 14%; Wall thickness = 2 mm
Vibration damping part (13): Styrenic thermoplastic elastomer by a blend material obtained by melt-kneading 80 wt% of SEBS and 20 wt% of styrene-isoprene-styrene copolymer (SIS); Hardness = 55; tan δ = 0.3; CS = 26 %; Wall thickness = 1 mm
Configuration: The shock absorbing portion (12) is in contact with the storage portion (1a), and the vibration damping portion (13) is in contact with the hard disk device (2).

Sample 2:
Shock absorber (12): Same as sample 1 (material and thickness)
Vibration damping part (13): Styrenic thermoplastic elastomer by blend material obtained by melt-kneading SEBS 60 wt% and SIS 40 wt%; Hardness = 55; tan δ = 0.6; CS = 44%; Wall thickness = 1 mm
Configuration: Same as Sample 1

Sample 3:
Shock absorber (12): Same as sample 1 (material and thickness)
Vibration damping part (13): Styrenic thermoplastic elastomer using a blend material obtained by melt-kneading SEBS 30 wt% and SIS 70 wt%; Hardness = 55; tan δ = 0.9; CS = 54%; Wall thickness = 1 mm
Configuration: Same as Sample 1

Sample 4:
Shock absorber (12): Same as sample 1 (material and thickness)
Vibration damping part (13): Styrenic thermoplastic elastomer according to SIS 100 wt%; Hardness = 55; tan δ = 1.3; CS = 94%; Wall thickness = 1 mm
Configuration: Same as Sample 1

Sample 5:
Shock absorber (12): Same as sample 1 (material); wall thickness = 1 mm
Vibration damping part (13): Same as sample 1 (material); Thickness = 2mm
Configuration: Same as Sample 1

Sample 6:
Shock absorber (12): Same as sample 1 (material); wall thickness = 1 mm
Vibration damping part (13): Styrenic thermoplastic elastomer using a blend material obtained by melt-kneading SEBS 90 wt% and SIS 10 wt%; Hardness = 55; tan δ = 0.2; CS = 22%; Wall thickness = 2 mm
Configuration: Same as Sample 1

Sample 7:
Shock absorber (12): Same as sample 1 (material and thickness)
Vibration damping part (13): Same as sample 1 (material and thickness)
Configuration: The shock absorbing part (12) is in contact with the hard disk device (2), and the vibration damping part (13) is in contact with the storage part (1a).

Sample 8:
Shock absorber (12): Same as sample 1 (material); wall thickness = 1 mm
Vibration damping part (13): Same as sample 1 (material); Thickness = 2mm
Configuration: Same as Sample 7

Sample 9:
As a material for the shock absorbing part, the same styrenic thermoplastic elastomer made of SEBS as that of Sample 1 was used, and a single-color molding was performed by an injection molding machine to manufacture a buffer member having only the shock absorbing part. The thickness of the sample 9 in the holding direction between the storage portion (1a) and the hard disk device (2) is 3 mm.

Sample 10:
As a material for the vibration damping part, a styrene-based thermoplastic elastomer made of a blend of SEBS 80 wt% and SIS 20 wt% was used in the same manner as in the sample 1 and was molded in a single color by an injection molding machine to produce a buffer member having only the vibration damping part. . The thickness of the sample 10 in the holding direction between the storage portion (1a) and the hard disk device (2) is 3 mm.

Sample 11:
It was manufactured by two-color molding in the same manner as Sample 1.
Shock absorber (12): Same as sample 1 (material); wall thickness = 1 mm
Vibration damping part (13): Styrenic thermoplastic elastomer with SEBS 100 wt%; Hardness = 55; tan δ = 0.1; CS = 18%; Wall thickness = 2 mm
Configuration: Same as Sample 1

Experimental example 2:
The shock absorbing member (14) having the shape shown in the fourth embodiment was manufactured, and a drop test and a vibration transmission test were performed to evaluate the shock absorbing property and the vibration damping property of the shock absorbing member (14).

Sample 12:
Shock absorber (15): Same as sample 1 (material); wall thickness = 1 mm
Vibration damping part (13): Same as sample 1 (material); Thickness = 2mm
Configuration: The shock absorbing portion (15) is in contact with the storage portion (1a), and the vibration damping portion (13) is in contact with the hard disk device (2).

B. test:
The details of the drop test and vibration transmission test are as follows.

  “Drop test”: First, the buffer member of each sample was mounted on the longitudinal side surface (3c) of the casing (3) of the 1.8 inch hard disk device (2) and the acceleration pickup was mounted. Next, an ABS resin box-shaped jig (90 mm long, 75 mm short, 30 mm high, 10 mm thick, and weight) with the hard disk device (2) equipped with a buffer member for each sample as the storage and lid of the digital video camera. About 400 g). Then, this box-shaped jig is attached to the arm of the drop tester, and from the height of 0.2 m and 1 m, the box-shaped jig is dropped vertically onto the concrete collision surface while maintaining the posture of the box jig, and the acceleration G generated at the time of the collision And the action time ms was measured. The acceleration G and the action time ms were measured 5 times, and the average values were evaluated. The smaller the acceleration G, the higher the shock absorption, and the longer the action time ms, the higher the shock absorption. Here, the arm of the drop tester can fix the posture of the box-shaped jig until just before the collision, and can be disconnected at the time of the collision. It can prevent a collision. The results are shown in Tables 1 to 3. The X direction indicates the falling direction in which the short side surface (3d) side of the casing (3) collides, the Y direction indicates the falling direction in which the long side surface (3c) side of the casing (3) collides, and the Z direction indicates The direction of drop where the upper surface (3a) collides is shown. The results are shown in Tables 1 to 3.

  “Vibration transmission test”: First, the buffer member of each sample was mounted on the longitudinal side surface (3c) of the housing (3) of the hard disk device (2), and the hard disk device (2) was placed on a vibrator. The operating condition of the vibrator was a frequency of 10 Hz to 50 Hz, an acceleration of 0.5 G, and a sweep time of 3 minutes, and the resonance frequency Hz and the resonance magnification dB were measured. The results are shown in Tables 1 to 3.

C. Rating:
As shown in Tables 1 to 3, the samples 1 to 8 and the sample 12 have a maximum resonance magnification of 9.7, and the resonance magnification of the sample 9 including only the shock absorbing portion is 14.0. In comparison, the vibration damping performance can be improved. Further, for example, when comparing the shock absorbing performance from the Z-direction shock absorbing performance (0.2 m high), the shock absorbing properties of Sample 1 to Sample 8 and Sample 12 have a maximum acceleration of 293, and include only a vibration damping portion. Compared to the acceleration of the sample 10 being 468, the shock absorption performance can be improved.
Comparing sample 6 and sample 11, sample 6 with 10% SIS and tan δ of the vibration damping part of 0.2 has a resonance magnification of 8.4 and can have good vibration damping properties. The sample 11 in which the tan δ of the vibration attenuating part is 0.1 and the resonance magnification is 12.8, and the vibration attenuating property is not sufficient.

  Further, comparing Sample 1 and Sample 7, and Sample 5 and Sample 8, respectively, the sample 1 and the sample 1 in which the shock absorbing portion (12) is in contact with the storage portion and the vibration damping portion (13) is in contact with the hard disk device (2). It can be seen that the sample 5 has higher shock absorption performance and vibration damping performance than the samples 7 and 8.

  Further, comparing sample 5 and sample 12, it can be seen that sample 12 including the shock absorbing portion (15) provided with the flexure hole (15e) can improve the shock absorbing performance in the Y direction more than sample 5.

FIG. 3 is an external perspective view showing a state in which the buffer member of the first embodiment is mounted on the hard disk device. FIG. 3 is a sectional view taken along line SA-SA in FIG. 1. FIG. 3 is an internal explanatory view schematically showing an attachment structure in which the buffer member according to the first embodiment is mounted on the hard disk device and stored in the storage unit. The external appearance perspective view which shows the modification of the buffer member in 1st Embodiment. SB-SB sectional view taken on the line of FIG. FIG. 3 is a cross-sectional view corresponding to FIG. 2 illustrating a buffer member according to a second embodiment. The external appearance perspective view which shows the state which mounted | wore the hard disk drive with the buffer member of 3rd Embodiment. The external appearance perspective view which shows the buffer member of 3rd Embodiment. The internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 3rd Embodiment. The external appearance perspective view which shows the buffer member of 4th Embodiment. Internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 4th Embodiment. It is explanatory drawing which shows the modification of the buffer member in 4th Embodiment, A part view (A) is an external appearance perspective view of a 1st modification, and a part view (B) is an external appearance perspective view of a 2nd modification. The external appearance perspective view which shows the buffer member of 5th Embodiment. Internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 5th Embodiment. The external appearance perspective view which shows the buffer member of 6th Embodiment. Internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 6th Embodiment. The external appearance perspective view which shows the buffer member of 7th Embodiment. Internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 7th Embodiment. The external appearance perspective view which shows the buffer member of 8th Embodiment. Internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 8th Embodiment. It is explanatory drawing which shows the modification of the buffer member in 8th Embodiment, and a part view (A) is an external appearance perspective view of a 1st modification, and a part view (B) is an external appearance perspective view of a 2nd modification. The external appearance perspective view which shows the buffer member of 9th Embodiment. The internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk apparatus and accommodated in the storage part the buffer member of 9th Embodiment. The perspective view which shows the 2nd modification common to the buffer member of each embodiment. The cross-sectional view of the 2nd modification common to the buffer member of each embodiment. It is explanatory drawing which shows the state with which the 3rd modification common to the buffer member of each embodiment was mounted | worn with the hard disk apparatus, a part (A) is a cross-sectional view, and a part (B) is a longitudinal cross-sectional view. The external appearance perspective view of the hard-disk apparatus and notebook PC which show the attachment state of the buffer member by one prior art example. The internal explanatory drawing which shows typically the attachment structure which mounted | wore the hard disk device with the buffer member of the prior art example, and accommodated in the storage part.

Explanation of symbols

1 Notebook PC (information processing device)
DESCRIPTION OF SYMBOLS 1a Storage part 1b Cover 1c Through-hole 2 Hard disk drive (external storage device)
3 Housing 3a Upper surface 3b Bottom surface 3c Long side surface 3d Short side surface 4 Buffer member (conventional example)
4a Side support 4b Top support 4c Bottom support 5 Cushioning member (first embodiment)
6 Shock absorbing part 7 Vibration damping part 8 Buffer member (modified example of the first embodiment)
9 Shock absorber 9a Deflection hole 10 Buffer member (second embodiment)
11 Buffer member (third embodiment)
12 shock absorber 12a side support 12b top support 12c bottom support 12d holding part 13 vibration damping part 13a side support 13b top support 13c bottom support 13d holding part 14 buffer member (fourth embodiment)
DESCRIPTION OF SYMBOLS 15 Shock absorption part 15a Side surface support part 15b Upper surface support part 15c Bottom surface support part 15d Holding part 15e Deflection hole 16 Buffer member (1st modification of 4th Embodiment)
17 Shock absorber 17a Side support 17b Top support 17c Bottom support 17d Holding part 17e Deflection hole 18 Buffer member (second modification of the fourth embodiment)
19 Shock absorber 19a Side support 19b Top support 19c Bottom support 19d Holding part 19e Deflection hole 20 Buffer member (fifth embodiment)
21 shock absorber 21a side support 21b top support 21c bottom support 21d holding part 21e bending hole 21f escape groove 22 cushioning member (sixth embodiment)
23 Shock absorber 23a Side support 23b Top support 23c Bottom support 23d Holding part 23e Deflection hole 23f Escape recess 24 Buffer member (seventh embodiment)
25 Shock absorber 25a Side support 25b Top support 25c Bottom support 25d Holding part 25e Deflection hole 25f Bump 26 Buffer member (Eighth embodiment)
27 Shock absorber 27a Side support 27b Top support 27c Bottom support 27d Holding part 27e Deflection hole 27f Contact projection 28 Buffer member (first modification of the eighth embodiment)
29 shock absorbing portion 29a side surface support portion 29b upper surface support portion 29c bottom surface support portion 29d holding portion 29e bending hole 29f contact projection 30 buffer member (second modification of the eighth embodiment)
31 Shock absorbing portion 31a Side support portion 31b Top support portion 31c Bottom support portion 31d Holding portion 31e Deflection hole 31f Abutting projection 32 Buffer member (9th embodiment)
33 Vibration damping portion 33a Side surface support portion 33b Top surface support portion 33c Bottom surface support portion 33d Holding portion 33e Air hole 34 Buffer member (second modification common to each embodiment)
35 Vibration damping portion 35a Side surface support portion 35b Top surface support portion 35c Bottom surface support portion 35d Holding portion 35e Holding protrusion 36 Buffer member (third modification common to each embodiment)
37 Shock absorber 37a Side support part 37b Top support part 37c Bottom support part 37d Holding part 38 Vibration damping part 38a Side support part 38b Top support part 38c Bottom support part 38d Holding part

Claims (9)

In the buffer member that elastically supports the external storage device inside the storage unit provided in the information processing device,
An impact absorbing portion made of a soft rubber-like elastic body having a TYPE A hardness of 30 or less as defined in JIS K6253, and in contact with either the external storage device or the storage portion;
A vibration damping unit that is made of a rubber-like elastic body having a loss tangent (tan δ) at a temperature of 25 ° C. and a frequency of 10 Hz of 0.2 or more;
And a cushioning member.   The shock-absorbing member according to claim 1, wherein the shock absorbing portion has a flexure hole penetrating the wall thickness.   The buffer member according to claim 2, wherein a deformable uneven surface is provided on a surface of the shock absorbing portion.   The shock-absorbing member according to claim 2 or 3, wherein the vibration damping part has an air hole that penetrates the thickness of the vibration damping part and faces the bending hole of the shock absorbing part.   The shock absorbing portion and the vibration damping portion are each formed in a U-shaped cross section having an upper surface support portion, a side surface support portion, and a bottom surface support portion that elastically support the upper surface side, the side surface side, and the bottom surface side of the external storage device, respectively. The buffer member according to any one of claims 1 to 4. A holding portion that bends along the side surface adjacent to the side surface of the external storage device that is elastically supported by the side surface support portion is provided at both ends of the side surface support portion,
The buffer member according to claim 5, wherein a pressing protrusion that protrudes inward is provided on each of the opposing inner surfaces of the holding portions. In the side support part, the thickness of the shock absorbing part is made thicker than the thickness of the vibration damping part,
The shock-absorbing member according to claim 5 or 6, wherein the thickness of the vibration damping portion in the upper surface support portion and the bottom surface support portion is thicker than the thickness of the shock absorbing portion.   The shock-absorbing member according to any one of claims 1 to 7, wherein the shock absorbing portion contacts the storage portion, and the vibration damping portion contacts the external storage device.   The buffer member according to any one of claims 1 to 8, wherein the vibration damping portion is made of a styrene thermoplastic elastomer containing 10 wt% or more of a styrene-isoprene-styrene copolymer.

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