JP2009123058A5 - - Google Patents

Claims (17)

First loop antenna that will be disposed on the base film, is connected to the first loop antenna, an IC chip having the diversity function, and connected to said IC chip, they are arranged perpendicular to the first loop antenna an inlet having a second loop antenna, the that,
A first secondary antenna disposed on one side of the base film at a position close to the first loop antenna;
A non-contact IC tag comprising:
A second secondary antenna that is a conductive pattern is superimposed and attached to the non-contact IC tag from the outside at a position close to the second loop antenna, and the first loop antenna and the first loop antenna according to reception strength. A contactless IC tag, wherein the second loop antenna is switched and selected. It said first secondary antenna close to the selected first loop antenna, or the second secondary antenna close to the selected second loop antenna impedance and, of the IC chip 3 2. The non-contact type IC tag according to claim 1 , wherein matching with impedance is taken .   The second secondary antenna is formed on an object, and the non-contact type IC tag is mounted so that the second secondary antenna and the second loop antenna are arranged in parallel at close positions. The non-contact type IC tag according to claim 1 or 2, wherein It said first secondary antenna and the second secondary antenna claims 1 to 3 non-contact IC tag according portions juxtaposed with said inlet is characterized by a linear shape.   2. The first secondary antenna is disposed on a surface on the first loop antenna side or on the opposite side of the first loop antenna in parallel with one side of the loop antenna. The non-contact type IC tag according to claim 4. Base film Ru disposed on the loop antenna, connected to the loop antenna, an IC chip having the diversity function, and connected to said IC chip, a non-contact formed of an antenna, which is arranged perpendicular to the loop antenna Type IC tag,
A secondary antenna, which is a conductive pattern, is superimposed and attached to the non-contact IC tag from the outside at a position close to the loop antenna, and the loop antenna and the antenna are switched and selected according to reception strength. A non-contact type IC tag characterized. The impedance of the secondary antenna in proximity to the selected said loop antenna, the non-contact IC tag according to claim 6, wherein the matching of the impedance of the IC chip is taken.   The non-contact type IC tag is mounted so that the secondary antenna is formed on an object, and the secondary antenna and the loop antenna are arranged in parallel at close positions. Item 8. The non-contact type IC tag according to Item 7. 9. The non-contact type IC tag according to claim 6, wherein a portion of the secondary antenna juxtaposed with the loop antenna has a linear shape. A non-contact type IC tag manufacturing method comprising an inlet having a base film, a first loop antenna, an IC chip having a diversity function, and a second loop antenna, and a first secondary antenna. ,
The first loop antenna is disposed on the base film, the IC chip is connected to the first loop antenna, the second loop antenna is connected to the IC chip, and the first loop antenna is connected. (A) forming the inlet by vertically arranging
On one side on the base film, the step (b) of the first secondary antenna is disposed at a position close to the first loop antenna, to form the non-contact IC tag,
A step (c) of superimposing and attaching a second secondary antenna to the non-contact type IC tag from the outside at a position close to the second loop antenna;
The manufacturing method of the non-contact-type IC tag characterized by including these.   In the step (c), the second secondary antenna is formed on an object, and the second secondary antenna and the second loop antenna are arranged in parallel so as to be in close proximity to each other. A non-contact type IC tag manufacturing method according to claim 10, wherein a type IC tag is attached. Before the step (c), a step (d) of covering the upper surface of the inlet on the IC chip side with a surface protective film,
The method of manufacturing a non-contact type IC tag according to claim 10 or 11 , further comprising : In the step (a), a pattern of the first secondary antenna is formed so that a portion juxtaposed with the inlet has a linear shape,
13. The non-contact type according to claim 10, wherein the step (b) forms the pattern of the second secondary antenna so that a portion juxtaposed with the inlet has a linear shape. IC tag manufacturing method. A base film, a loop antenna, an IC chip having a diversity function, and a method of manufacturing a non-contact type IC tag formed from an antenna,
The non-contact type IC tag is provided by arranging the loop antenna on the base film, connecting the IC chip to the loop antenna, connecting the antenna to the IC chip and vertically arranging the loop antenna. Forming step (a);
A step (b) of superimposing and attaching a secondary antenna to the non-contact IC tag from the outside at a position close to the loop antenna;
The manufacturing method of the non-contact-type IC tag characterized by including these.   In the step (b), the non-contact type IC tag is mounted so that the secondary antenna is formed on an object, and the secondary antenna and the loop antenna are arranged in parallel at close positions. The method of manufacturing a non-contact type IC tag according to claim 14. Before the step (b), a step (c) of covering the upper surface of the non-contact IC tag on the IC chip side with a surface protective film,
The method of manufacturing a non-contact type IC tag according to claim 14 or 15 , further comprising : 17. The non-contact type IC according to claim 14, wherein in the step (b), the pattern of the secondary antenna is formed so that a portion juxtaposed with the loop antenna has a linear shape. Tag manufacturing method.