JP2009164025A - Light-emitting device, method of manufacturing the same, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device that can simplify a structure to reduce variations in the luminance, and to provide a method of manufacturing such a light-emitting device and an electronic apparatus. <P>SOLUTION: An organic EL device 1 includes a number of light-emitting elements 21 on which light-emitting layers 40 are interposed between positive electrodes 10 and negative electrodes 11, and a number of coloring layers 37R-1 and 37R-2 arranged corresponding to a number of light-emitting elements 21. The thicknesses of the coloring layers 37R-1 and 37R-2 corresponding to the light-emitting elements 21 are set up according to the light-emitting luminance of the light emitted from the light-emitting elements 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device, a method for manufacturing the light emitting device, and an electronic apparatus.

  In recent years, with the diversification of information equipment and the like, there is an increasing need for light-emitting devices with low power consumption and light weight. As one of such light emitting devices, an organic electroluminescence device (hereinafter referred to as “organic EL device”) is known. This organic EL device generally includes a light emitting element having a light emitting layer between an anode (first electrode) and a cathode (second electrode). Since the organic EL device has the property that the light emitting layer itself of the light emitting element emits light, it has advantages such as low power consumption, high contrast, and good viewing angle characteristics, and as a light emitting device to replace LCD (Liquid Crystal Display). Attention has been paid.

  By the way, in the above-described organic EL device, the light emission luminance changes in proportion to the drive current flowing through the light emitting element and the film thickness of the light emitting layer. For this reason, a decrease in light emission luminance or luminance unevenness occurs due to a voltage drop due to the power supply line, variations in threshold voltage / mobility of the driving TFT, current-light output characteristics (IL characteristics) of the light emitting elements themselves, and the like. There is a problem of doing.

Therefore, various techniques have been proposed in order to suppress the luminance unevenness of the organic EL device. For example, as shown in Patent Document 1, a configuration of an embedded circuit for compensating for variations in threshold voltage is known. Further, for example, as shown in Patent Document 2, a configuration is known in which emission luminance reduction due to power supply voltage drop is complemented based on power supply voltage drop for each pixel calculated by a voltage drop calculation unit.
Japanese Patent Laid-Open No. 2003-22049 JP 2003-280590 A

  However, since the above-described conventional technique is configured to perform electrical control in order to suppress luminance unevenness, it is necessary to provide a correction circuit in the organic EL device. Therefore, there is a problem that the circuit configuration of the organic EL device becomes complicated. Further, as described above, since various causes are considered as the cause of occurrence of luminance unevenness, it is not possible to correct all the causes. Furthermore, since the light emitting element deteriorates with time, even if the electrical correction can be performed to improve the luminance unevenness at the initial light emission, the deterioration rate of the light emitting element varies depending on the difference in the current value flowing through each light emitting element. As a result, there is a risk of luminance unevenness.

  Accordingly, the present invention has been made to solve the above-described problems, and provides a light-emitting device, a method for manufacturing the light-emitting device, and an electronic apparatus that can suppress luminance unevenness while simplifying the structure. The purpose is to do.

In order to achieve the above object, a light emitting device according to the present invention includes a plurality of light emitting elements in which a light emitting layer is sandwiched between a first electrode and a second electrode, and the light emitting devices are disposed corresponding to the plurality of light emitting elements. In a light emitting device comprising a plurality of colored layers, the light transmittance of the colored layer corresponding to the light emitting elements is corrected according to the light emission luminance of light emitted from the plurality of light emitting elements. Features.
According to this configuration, the luminance unevenness of the light emitted from the light emitting element can be suppressed by correcting the light transmittance of the colored layer according to the light emission luminance of the light emitted from the light emitting element. In other words, the light emitted from the light emitting element is transmitted through the colored layer, so that even when luminance unevenness occurs in the light emitting element due to various causes, the emission luminance of the light extracted from the display surface (emission side of the colored layer) is reduced. It can be made uniform. Therefore, as compared with the conventional case where the light emission luminance of the light emitting element is corrected by electrical control, the luminance unevenness can be suppressed while the structure is simplified.

Further, the thickness of the colored layer corresponding to the light emitting element is set according to the light emission luminance of light emitted from the plurality of light emitting elements.
According to this structure, the transmittance | permeability of the light which permeate | transmits a colored layer can be adjusted by setting the film thickness of a colored layer. In other words, by setting the film thickness of the colored layer according to the light emission luminance of light emitted from the light emitting element, the light emission luminance of light extracted from the display surface through the colored layer can be made uniform.

In addition, among the plurality of light emitting elements, the thickness of the colored layer corresponding to the light emitting element having high emission luminance is formed thicker than the thickness of the colored layer corresponding to the light emitting element having low emission luminance. It is characterized by.
According to this configuration, as the colored layer is formed thicker, the light transmittance decreases and the amount of light absorbed by the colored layer increases. Will decline. Thereby, the light emission luminance of the light transmitted through the colored layer corresponding to the light emitting element having a high light emission luminance can be brought close to the light emission luminance transmitting through the colored layer corresponding to the light emitting element having a low light emission luminance. That is, by setting the film thickness of the colored layer in accordance with the light emission intensity of light emitted from the light emitting element, the light emission luminance of light extracted from the display surface through the colored layer can be made uniform.

Further, the density of the color material of the colored layer corresponding to the light emitting element is set according to the light emission luminance of light emitted from the plurality of light emitting elements.
According to this structure, the transmittance | permeability of the light which permeate | transmits a colored layer can be adjusted by setting the density | concentration of the coloring material of a colored layer. That is, by setting the colorant concentration of the colored layer according to the emission intensity of the light emitted from the light emitting element, the emission luminance of the light that is transmitted through the colored layer and extracted from the display surface can be made uniform. it can.

Further, among the plurality of light emitting elements, the color material concentration of the colored layer corresponding to the light emitting element having high light emission luminance is higher than the color material concentration of the color layer corresponding to the light emitting element having low light emission luminance. It is characterized by being deeply formed.
According to this configuration, as the color material concentration of the colored layer is increased, the light transmittance is reduced and the amount of light absorbed by the colored layer is increased, so that light emitted from the light emitting element is emitted. The strength decreases. Thereby, the light emission intensity of the light transmitted through the colored layer corresponding to the light emitting element having a high light emission intensity can be brought close to the light emission intensity transmitted through the colored layer corresponding to the light emitting element having a low light emission intensity. That is, by setting the colorant concentration of the colored layer according to the emission intensity of the light emitted from the light emitting element, the emission luminance of the light that is transmitted through the colored layer and extracted from the display surface can be made uniform. it can.

Further, the area of the surface facing the light emitting region of the colored layer corresponding to the light emitting region of the light emitting device is set according to the light emission luminance of the light emitted from the plurality of light emitting devices. To do.
According to this configuration, by adjusting the area of the colored layer corresponding to the light emitting region, the surface of the colored layer facing the light emitting region, part of the light emitted from the light emitting element is transmitted through the colored layer and remains. This light is not transmitted through the colored layer, but is extracted from the display surface in the state of light emitted from the light emitting element. That is, light that does not pass through the colored layer is not absorbed by the colored layer, and the emission intensity in a state of being emitted from the light emitting element can be maintained. Specifically, as the area of the facing surface between the colored layer and the light emitting region is reduced, the amount of light absorbed by the colored layer decreases, and the light emission intensity of light emitted from the light emitting element is maintained. . Therefore, it is possible to make the light emission luminance of the light transmitted through the colored layer and extracted from the display surface uniform.

In addition, among the plurality of light emitting elements, an area of a surface facing the light emitting region of the colored layer corresponding to the light emitting region of the light emitting element having high light emission luminance is the color corresponding to the light emitting element having low light emission luminance. The layer is formed larger than the area of the surface facing the light emitting region.
According to this configuration, the light emission intensity of the light transmitted through the colored layer corresponding to the light emitting element having a high light emission intensity can be brought close to the light emission intensity transmitted through the colored layer corresponding to the light emitting element having a low light emission intensity. In other words, as the area of the opposing surface between the colored layer and the light emitting region of the light emitting element having a low light emission intensity is formed smaller, the amount of light absorbed by the colored layer decreases, so that the colored layer passes through the colored layer. The light emission luminance of light extracted from the display surface can be made uniform.

The light emitted from the light emitting element and incident on the colored layer corresponding to the adjacent light emitting element is set so as to satisfy the total reflection condition.
According to this configuration, the light emitted from the light emitting element does not pass through the colored layer of the adjacent light emitting element and is not emitted from the display surface. That is, light emitted from the light emitting element and incident on the colored layer of the adjacent light emitting element does not pass through the boundary surface between the display surface and air, but is reflected to the light emitting element side. For this reason, for example, without providing a non-light-emitting region such as a black matrix layer between colored layers, light leakage between adjacent light-emitting elements can be prevented and color reproducibility can be maintained.

Further, the light emitting layer emits white light.
According to this configuration, since the light emitted from the light emitting element is colored and extracted by the colored layer, full color display can be performed at low cost while improving manufacturing efficiency.

The first electrode is light transmissive, the second electrode is transflective, and a light reflecting layer is disposed on the opposite side of the light emitting layer across the first electrode, An optical resonator structure for resonating light emitted from the light emitting element is formed between the light reflecting layer and the second electrode.
According to this configuration, by configuring an optical resonance structure that resonates the light emitted from the light emitting element, a condition for the resonance wavelength corresponding to the optical distance between the light reflecting layer and the second electrode from the light emitting element. Only light that satisfies is amplified and extracted. That is, a light emitting device capable of full color display can be provided by forming a light emitting element having a resonance wavelength corresponding to each color of red (R), green (G), and blue (B). Thereby, the light itself that has passed through the periphery of the colored layer without passing through the colored layer also has a color corresponding to each light emitting region. Then, the image displayed from the display surface is displayed by light colored by the colored layer and light having a color corresponding to each light emitting area and extracted without passing through the colored layer. Therefore, in addition to obtaining high luminance at a low current, color reproducibility can be improved.
Even when the viewing angle is large, it is possible to improve the viewing angle characteristics of light emission luminance and color purity.

Further, a light emitting element forming step for forming a plurality of light emitting elements in which a light emitting layer is sandwiched between the first electrode and the second electrode, and a colored layer for forming a plurality of colored layers corresponding to the plurality of light emitting elements. Forming the color layer, comprising: a light emission luminance detection step for detecting light emission luminance of light emitted from the light emitting element prior to the color layer formation step. In the step, the light transmittance of the colored layer is corrected based on the detection result of the light emission luminance detection step.
According to this configuration, the luminance unevenness of the light emitted from the light emitting element can be suppressed by correcting the light transmittance of the colored layer based on the light emission luminance detecting step. In other words, the light emitted from the light emitting element is transmitted through the colored layer, so that even when luminance unevenness occurs in the light emitting element due to various causes, the emission luminance of the light extracted from the display surface (emission side of the colored layer) is reduced. It can be made uniform. Therefore, as compared with the conventional case where the light emission luminance of the light emitting element is corrected by electrical control, the luminance unevenness can be suppressed while the structure is simplified.

Further, the emission luminance detecting step includes a step of measuring luminance unevenness of the plurality of light emitting elements, and a step of calculating light emission luminance of light emitted from the light emitting element based on the light emission unevenness. Features.
According to this configuration, since the light emission luminance of the light emitting element itself can be calculated, the colored layer can be easily corrected based on the detection result.

The light emission luminance detecting step includes a step of measuring a current value of a drive current flowing through the light emitting element, and a step of calculating light emission luminance of light emitted from the light emitting element based on the current value. It is characterized by that.
According to this configuration, since the light emission luminance of the light emitting element itself can be calculated, the colored layer can be easily corrected based on the detection result.

In the colored layer forming step, the colored layer forming material is applied by a droplet discharge method.
According to this configuration, by setting the discharge conditions of the droplet discharge method, the colored layers can be formed with high accuracy in the formation regions of the respective colored layers.

On the other hand, an electronic apparatus according to the present invention includes the light emitting device.
According to this configuration, since the light emitting device of the present invention is provided, luminance unevenness can be suppressed while the structure is simplified.

(First embodiment)
(Organic EL device)
FIG. 1 is a schematic diagram showing a wiring structure of the organic EL device of the present embodiment. In FIG. 1, reference numeral 1 denotes the organic EL device.
This organic EL device 1 is of an active matrix type using a thin film transistor (hereinafter referred to as TFT) as a switching element, and intersects a plurality of scanning lines 101 at right angles to each scanning line 101. And a plurality of power lines 103 extending in parallel to each signal line 102, and in the vicinity of the intersections of the scanning lines 101 and the signal lines 102. A pixel region (unit pixel region) X... Is formed.
Of course, according to the technical idea of the present invention, an active matrix using TFT or the like is not indispensable. Even if the present invention is implemented using an element substrate for a simple matrix and the simple matrix is driven, the same effect can be obtained at low cost. can get.

  A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. Further, a scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  Further, in each pixel region X, a switching TFT (switching element) 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel shared from the signal line 102 via the switching TFT 112 are provided. A holding capacitor 113 for holding a signal, a driving TFT (switching element) 123 to which a pixel signal held by the holding capacitor 113 is supplied to a gate electrode, and the power supply line 103 through the driving TFT 123 are electrically connected An anode 10 into which drive current flows from the power supply line 103 when connected, and a light emitting layer 40 sandwiched between the anode 10 and the cathode 11 are provided.

  According to the organic EL device 1, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and according to the state of the holding capacitor 113. The on / off state of the driving TFT 123 is determined. Then, a current flows from the power supply line 103 to the anode 10 through the channel of the driving TFT 123, and further a current flows to the cathode 11 through the light emitting layer 40. The light emitting layer 40 emits light according to the amount of current flowing through it.

  Next, specific modes of the organic EL device of the present embodiment will be described with reference to FIGS. Here, FIG. 2 is a plan view schematically showing the configuration of the organic EL device. FIG. 3 is a cross-sectional view taken along line A-A ′ of FIG. 2, and is a cross-sectional view schematically showing the organic EL device.

First, the configuration of the organic EL device 1 will be described with reference to FIG.
FIG. 2 is a diagram showing a TFT element substrate (hereinafter referred to as “element substrate”) 20 </ b> A that causes the light emitting layer 40 to emit light by the above-described various wirings, TFTs, and various circuits formed on the substrate body 20.
The element substrate 20A of the organic EL device includes an actual display region 4 (inside the two-dot chain line in FIG. 2) in the center portion and a dummy region 5 (between the one-dot chain line and the two-dot chain line) arranged around the actual display region 4. Area).

  One of red light (R), green light (G), and blue light (B) is extracted from the pixel region X shown in FIG. 1, and the display region RGB shown in FIG. 2 is formed. In the actual display area 4, the display areas RGB are arranged in a matrix. In addition, each of the display areas RGB is arranged in the same color in the vertical direction of the paper, and constitutes a so-called stripe arrangement. The display area RGB is combined into one display unit pixel, and the display unit pixel mixes RGB light emission to perform full color display.

  Scan line drive circuits 80 and 80 are arranged on both sides of the actual display area 4 in FIG. 2 and on the lower layer side of the dummy area 5. Further, an inspection circuit 90 is disposed above the actual display area 4 in FIG. 2 and below the dummy area 5. This inspection circuit 90 is a circuit for inspecting the operating state of the organic EL device 1, and includes, for example, inspection information output means (not shown) for outputting the inspection result to the outside, and the organic EL during production or at the time of shipment. The apparatus 1 is configured to be able to inspect the quality and defects.

  As shown in FIG. 3, the organic EL device 1 according to the present embodiment is a so-called “top emission structure” organic EL device. The organic EL device 1 includes a plurality of light emitting elements 21 having an organic functional layer 12 sandwiched between an anode 10 and a cathode 11 on an element substrate 20A, and pixels that divide the light emitting elements 21 into pixel regions XR, XG, and XB. A partition wall 13 and a sealing substrate 31 disposed to face the element substrate 20A are provided. Since the organic EL device 1 is configured to extract emitted light from the side of the sealing substrate 31 that is opposite to the element substrate 20A, any of a transparent substrate and an opaque substrate can be used as the material of the element substrate 20A. . Examples of the opaque substrate include a thermosetting resin and a thermoplastic resin in addition to a ceramic sheet such as alumina and a metal sheet such as stainless steel that has been subjected to an insulation treatment such as surface oxidation.

An inorganic insulating layer 14 made of silicon nitride or the like is formed on the element substrate 20A.
On the inorganic insulating layer 14, a planarizing layer 16 is formed in which a metal reflector (light reflecting layer) 15 made of an aluminum alloy or the like is housed. The planarization layer 16 is formed of a heat-resistant insulating resin such as acrylic or polyimide, and is formed to eliminate surface irregularities due to the driving TFT 123 or the like.

  An anode 10 is formed on the planarization layer 16. The anode 10 is formed of an oxide-based transparent conductive material, and specifically, ITO (Indium Tin Oxide) is suitably used. The anode 10 is formed corresponding to each light emitting element 21, and one end thereof is connected to the driving TFT 123 via a contact hole (not shown) formed in the inorganic insulating layer 14.

  A pixel partition wall 13 is formed on the anode 10. The pixel partition 13 has an opening on the anode 10 and separates the plurality of light emitting elements 21 independently. That is, a region surrounded by the pixel partition wall 13 is a pixel region X (see FIG. 1) of the light emitting element 21, and each of red light, blue light, and green light is extracted from the sealing substrate 31 side. Assigned as pixel regions XR, XG, and XB. In addition, as a material for forming the pixel partition wall 13, for example, an insulating organic material such as polyimide or acrylic can be used. The material for forming the pixel partition wall 13 may be a combination of an inorganic material and an organic material.

The light emitting element 21 includes a hole injection / transport layer 30 and a light emitting layer 40.
The hole injection / transport layer 30 is for injecting and transporting holes of the anode 10 to the light emitting layer 40, and is formed across the pixel partition walls 13 on the element substrate 20A. As a material for forming the hole injection / transport layer 30, an aqueous dispersion of 3,4-polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) is particularly preferably used. The material for forming the hole injection / transport layer 30 is not limited to those described above, and various materials can be used. For example, a material obtained by dispersing polystyrene, polypyrrole, polyaniline, polyacetylene or a derivative thereof in an appropriate dispersion medium such as the aforementioned polystyrene sulfonic acid can be used.

  The light emitting layer 40 is a part where electrons injected from the cathode 11 and holes injected from the hole injection / transport layer 30 are combined to emit light of a predetermined wavelength. It is formed over the entire upper area. The light emitting layer 40 employs a white light emitting layer in which red, green, and blue light emitting materials are laminated to emit white light. As described above, by adopting the white light emitting layer, the light emitted from the light emitting element 21 is colored and extracted by the coloring layers 37R, 37G, and 37B described later, so that the manufacturing efficiency is improved and the cost is low. Full color display can be performed. As the constituent material of the light emitting layer 40, for example, polyfluorene derivative (PF), polyparaphenylene vinylene derivative (PPV), polyparaphenylene derivative (PPP), polyvinylcarbazole (PVK), polythiophene derivative, polymethylphenylsilane ( A high molecular organic material such as polysilane such as (PMPS) can be used. In addition, the polymer organic material doped with a low molecular organic material such as perylene dye, coumarin dye, rhodamine dye, rubrene, 9,10-diphenylanthracene, tetraphenylbutadiene, nile red, quinacridone, etc. May be used. Moreover, it is preferable to form an electron transport layer or a hole block layer on the light emitting layer 40.

  The cathode 11 is formed over the entire area of the light emitting layer 40 across the pixel partition walls 13. As a material for forming the cathode 11, since this embodiment has a top emission structure, it needs to be a light-transmitting material, and thus a transparent conductive material is used. As the transparent conductive material, ITO is suitable, but other than this, for example, an indium oxide / zinc oxide based amorphous transparent conductive film (Indium Zinc Oxide: IZO) is used. be able to. In the present embodiment, ITO is used.

  An organic buffer layer 18 is formed on the cathode 11. Due to the influence of the shape of the pixel partition wall 13, it is arranged so as to fill the uneven portion of the cathode 11 formed in an uneven shape, and its upper surface is formed substantially flat. The organic buffer layer 18 has a function of relieving stress generated by warpage and volume expansion of the element substrate 20A and preventing the cathode 11 from peeling from the pixel partition wall 13 having an unstable shape. In addition, since the upper surface of the organic buffer layer 18 is substantially flattened, a gas barrier layer 19 (to be described later) made of a hard film formed on the organic buffer layer 18 is also flattened. Therefore, there is no portion where stress is concentrated, and thereby, generation of cracks in the gas barrier layer 19 can be prevented.

  A gas barrier layer 19 is formed on the organic buffer layer 18 so as to cover the organic buffer layer 18. The gas barrier layer 19 is for preventing oxygen and moisture from entering into the light emitting element 21, thereby suppressing deterioration of the light emitting element 21 due to oxygen and moisture. The material of the gas barrier layer 19 is preferably formed of a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like in consideration of transparency, gas barrier properties, and water resistance.

  A seal layer 22 is formed on the gas barrier layer 19 so as to cover the gas barrier layer 19. The sealing layer 22 fixes the sealing substrate 31 on the gas barrier layer 19 and has a buffering function against mechanical shock from the outside, and protects the light emitting layer 40 and the gas barrier layer 19. The sealing layer 22 is formed of an adhesive made of a material that is softer than the sealing substrate 31 and has a low glass transition point, for example, a resin such as urethane, acrylic, epoxy, or polyolefin.

  The sealing substrate 31 is disposed to face the element substrate 20A described above. Since the upper surface of the sealing substrate 31 functions as a display surface for extracting emitted light, the sealing substrate 31 is made of a light transmissive material such as glass or transparent plastic (polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, or the like). Yes.

  On the lower surface of the sealing substrate 31, a color filter 37 in which a red colored layer 37R, a green colored layer 37G, and a blue colored layer 37B are arranged in a matrix is configured. Each of the colored layers 37R, 37G, and 37B is a layer formed by mixing a pigment or a dye with a transparent binder layer. By selecting a pigment, the target red (R), green (G), or blue (B) Has been adjusted. The colored layers 37R, 37G, and 37B may be formed by patterning a color resist of each color. The colors of the colored layers 37R, 37G, and 37B may be light blue, light cyan, white, or the like depending on the purpose. As a result, among the light emitted from the light emitting layer 40, only the light corresponding to the wavelength of each color (for example, red light has a wavelength of 610 nm, green light has a wavelength of 530 nm, and blue light has a wavelength of 470 nm) is colored layers 37R, 37G, Each of the light beams 37B is transmitted to the viewer side as each color light. As described above, since only the light transmitted through the colored layers 37R, 37G, and 37B is extracted, the organic EL device 1 with better color reproducibility can be provided.

  A black matrix layer 32 is formed between the regions of the colored layers 37R, 37G, and 37B. The black matrix layer 32 is configured as a non-light-emitting portion by dividing the colored layers 37R, 37G, and 37B, and prevents light leakage between adjacent pixel regions XR, XG, and XB. The constituent material of the black matrix layer 32 is a light shielding layer made of a resin mixed with a pigment such as carbon black. The black matrix layer 32 may be mixed with a liquid repellent resin such as a fluororesin.

FIG. 4 is a cross-sectional view taken along line BB ′ of FIG. 2, and is a cross-sectional view schematically showing the organic EL device. In addition, since the structure of the colored layer of each color is substantially the same, in this embodiment, it demonstrates taking a red colored layer as an example.
By the way, the light emission luminance of the organic EL device 1 changes in proportion to the drive current flowing through the light emitting element 21 and the film thickness of the light emitting layer 40. In the prior art, since the electric control is performed in order to suppress luminance unevenness, it is necessary to provide a correction circuit in the organic EL device. Therefore, there is a problem that the circuit configuration of the organic EL device becomes complicated. Moreover, since the various causes mentioned above can be considered as a cause of occurrence of luminance unevenness, it is not possible to correct all of them. As a result, the light emission luminance of the light emitting element varies, which may cause luminance unevenness.

  Therefore, as shown in FIG. 4, in the present embodiment, the colored layers 37 </ b> R, 37 </ b> G, and 37 </ b> B corresponding to the light emitting elements 21 are used according to the light emission luminance of the light emitted from the light emitting elements 21 (see FIG. 3). In this configuration, the light transmittance is corrected. Specifically, the red colored layer 37R-1 corresponding to the light emitting element 21 having a high emission luminance of light emitted from the light emitting element 21 has a large thickness and the colored layer 37R- corresponding to the light emitting element 21 having a low emission luminance. 2 is formed thin. That is, the film thickness of the colored layer 37R-1 corresponding to the light emitting element 21 with high emission luminance is formed thicker than the film thickness of the color layer 37R-2 corresponding to the light emitting element 21 with low emission luminance.

  Thus, by setting the film thickness of the colored layers 37R, 37G, and 37B (see FIG. 3), the transmittance of light that passes through the colored layers 37R, 37G, and 37B can be adjusted. Specifically, as the colored layers 37R, 37G, and 37B are formed thicker, the light transmittance decreases and the amount of light absorbed by the colored layers 37R, 37G, and 37B increases. The light emission luminance of the light transmitted through the layers 37R, 37G, and 37B decreases. That is, by setting the film thickness of the colored layers 37R, 37G, and 37B in accordance with the light emission luminance of the light emitted from the light emitting element 21, the colored layer 37R, 37G, and 37B is transmitted through the display surface (sealing substrate). The emission luminance of light extracted from the surface 31) can be made uniform (see the arrow in FIG. 4).

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device 1 according to the present embodiment will be described with reference to FIGS.
Here, FIG. 5 is a process diagram on the element substrate 20A side of the organic EL device 1, and FIG. 6 is a process diagram on the sealing substrate 31 side.

As a light emitting element forming step, first, as shown in FIG. 5A, the hole injection / transport layer 30 is formed on the element substrate 20A on which the anode 10 and the pixel partition walls 13 are laminated. Specifically, it is formed by applying a functional liquid (PEDOT / PSS dispersion) (not shown) on the element substrate 20A using a spin coat method or the like, and drying and baking.
Next, as shown in FIG. 5B, the light emitting layer 40 is formed on the hole injection / transport layer 30. Specifically, a functional liquid (not shown) (functional liquid containing a material for forming the light emitting layer) is applied by spin coating or the like, and dried and annealed.

  Then, as shown in FIG. 5C, the cathode 11 is formed on the light emitting layer 40. Specifically, it is formed so as to cover the light emitting layer 40 by a vacuum deposition method or the like. Thereby, the light emitting element 21 is formed on the element substrate 20A.

  Next, as shown in FIG. 5D, an organic buffer layer 18 is formed on the cathode 11 by a screen printing method or the like, and then organically formed by a high density plasma film forming method such as an ECR sputtering method or an ion plating method. A gas barrier layer 19 is formed on the buffer layer 18. Thus, the process on the element substrate 20A side is completed.

  Here, the light emission luminance of the light emitting element 21 is detected (light emission luminance measurement step). Specifically, when the process on the element substrate 20A side is completed, the light emitting element 21 is caused to emit light, and the luminance unevenness of each light emitting element 21 is measured using the unevenness measuring device. Then, the light emission luminance of each light emitting element 21 is calculated from the measured luminance unevenness. Note that the emission luminance detection step may be performed before the organic buffer layer 18 is formed.

  On the other hand, as shown in FIG. 6A, a black matrix layer 32 is first formed on the surface of the sealing substrate 31 on the sealing substrate 31 side. Specifically, the material liquid of the black matrix layer 32 is applied by a non-contact coating method such as an ink jet method.

  Here, as shown in FIG. 6B, colored layers 37R, 37G, and 37B are formed between the black matrix layers 32 (colored layer forming step). In the colored layer forming step, first, the optimum film thickness of the colored layers 37R, 37G, and 37B corresponding to each light emitting element 21 is calculated based on the light emission luminance data of each light emitting element 21 calculated in the above-described light emission luminance detecting step. (Film thickness calculation step). The film thicknesses of the colored layers 37R, 37G, and 37B can be obtained by the product of the respective light emission luminances of the light emitting elements 21 and the transmittances of the colored layers 37R, 37G, and 37B.

  Then, the light emission luminance of the light that passes through the colored layers 37R, 37G, and 37B and is emitted from the display surface is set to be uniform among the light emitting elements 21. Specifically, the light transmittance in the red colored layer 37R-1 (see FIG. 4) corresponding to the light emitting element 21 with high emission luminance is the colored layer 37R-2 (see FIG. 4) corresponding to the light emitting element 21 with low emission luminance. 4)) to be higher than the light transmittance. That is, the film thickness of the colored layer 37R-1 corresponding to the light emitting element 21 with high emission luminance is formed thicker than the film thickness of the color layer 37R-2 corresponding to the light emitting element 21 with low emission luminance. As a result, the light emission luminance of the light transmitted through the red colored layer 37R-1 corresponding to the light emitting element 21 having a high light emission luminance is set to the light emission luminance of the light transmitted through the red colored layer 37R-2 corresponding to the light emitting element 21 having a low light emission luminance. It can be close to the brightness.

  The colored layers 37R, 37G, and 37B are formed by applying the material liquid of the colored layers 37R, 37G, and 37B using the inkjet method using the black matrix layer 32 as a partition. Specifically, the colored layers 37R, 37G, and 37B calculated in the above-described film thickness calculating step are formed by adjusting discharge conditions such as the discharge amount of the ink jet method and the number of discharges. As described above, by using the ink jet method, the colored layers 37R, 37G, and 37B can be accurately formed in the formation regions of the colored layers 37R, 37G, and 37B. The colored layers 37R, 37G, and 37B may be formed by a non-contact coating method other than the ink jet method.

Next, the sealing layer 22 is applied on the sealing substrate 31 on which the colored layers 37R, 37G, and 37B and the black matrix layer 32 are formed by a dispensing method or the like.
Finally, the element substrate 20A side (see FIG. 4D) on which the gas barrier layer 19 is formed and the sealing substrate 31 coated with the seal layer 22 are bonded together. As described above, the desired organic EL device 1 (see FIG. 3) in the present embodiment described above can be obtained.

  Thus, according to the present embodiment, the light emitted from the light emitting element 21 is corrected by correcting the light transmittance in the colored layers 37R, 37G, and 37B according to the light emission luminance of the light emitted from the light emitting element 21. The brightness unevenness of the light can be suppressed. Specifically, by setting the film thickness of the colored layers 37R, 37G, and 37B in accordance with the light emission luminance of the light emitted from the light emitting element 21, the transmittance of the light transmitted through the colored layers 37R, 37G, and 37B can be set. Can be adjusted. That is, the light emitted from the light emitting element 21 is transmitted through the colored layers 37R, 37G, and 37B, so that even when luminance unevenness occurs in the light emitting element 21 due to the various causes described above, the final light extracted from the display surface is obtained. The light emission luminance can be made uniform.

Therefore, it is not necessary to provide a drive current correction circuit as compared with the conventional case where the light emission luminance of the light emitting element 21 is corrected by electrical control. Therefore, the structure is simplified and the manufacturing efficiency is maintained. Regardless of the cause of the occurrence of luminance unevenness, the luminance unevenness can be comprehensively suppressed.
Further, since it is not necessary to individually correct the drive currents flowing through the light emitting elements 21, there is no variation in the deterioration rate of the light emitting elements 21 due to the difference in the current value flowing through each light emitting element 21, and the light emission luminance is increased. Therefore, it is not necessary to pass a large amount of current in the battery, so that the life can be extended.

  Note that, as the above-described light emission luminance detecting step, it is also possible to calculate the light emission luminance of light emitted from the light emitting element 21 by measuring the current value of the drive current flowing through the light emitting element 21. Specifically, a current is passed through the driving TFT 123 (see FIG. 3), and a current value flowing through each driving TFT 123 is measured. At this time, the larger the current value flowing through the driving TFT 123, the larger the current value flowing through each light emitting element 21, and the higher the light emission luminance. And the dispersion | variation in the light emission luminance of each light emitting element 21 is detected, and the film thickness of the colored layers 37R, 37G, and 37B is calculated based on this detection result. Thereby, there can exist the same effect as a 1st embodiment mentioned above. In the light emission luminance detection step, both measurement of luminance unevenness of each light emitting element 21 and measurement of the current value of the driving TFT 123 may be performed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described based on FIG. FIG. 7 is a cross-sectional view corresponding to the line BB ′ of FIG. 2, and is a cross-sectional view schematically showing the organic EL device of the second embodiment. This embodiment is different from the above-described first embodiment in that the color material density of the colored layer is set according to the light emission luminance of light emitted from a plurality of light emitting elements. In addition, about the structure similar to 1st Embodiment mentioned above, the same code | symbol is attached | subjected and description is abbreviate | omitted. Moreover, since the structure of the colored layer of each color is substantially the same, in this embodiment, it demonstrates taking a red colored layer as an example.

  As shown in FIG. 7, the organic EL device 2 of the present embodiment has a red color corresponding to the light emitting element 21 having a high light emission luminance of the light emitted from the light emitting element 21 based on the detection result of the light emission luminance detection step described above. The coloring material 137R-1 has a high color material concentration, and the red coloring layer 137R-2 has a low color material concentration corresponding to the light emitting element 21 having low emission luminance. That is, the density of the color material of the red coloring layer 137R-1 corresponding to the light emitting element 21 with high emission luminance is higher than the concentration of the color material of the red coloring layer 137R-2 corresponding to the light emitting element 21 with low emission luminance. It is formed as follows. The concentration of the color material in each of the colored layers 137R-1 and 137R-2 can be adjusted by changing the mixing ratio of the colorant and additive contained in the forming material of the colored layers 137R-1 and 137R-2. is there.

  Thus, by adjusting the density of the color material of the colored layers 37R, 37G, and 37B (see FIG. 3), the transmittance of light transmitted through the colored layers 37R, 37G, and 37B can be adjusted. Specifically, as the color material density of the colored layers 37R, 37G, and 37B is increased, the light transmittance decreases, and the amount of light absorbed by the colored layers 37R, 37G, and 37B increases. The light emission luminance of the light transmitted through the colored layers 37R, 37G, and 37B decreases. That is, by setting the density of the color material of the colored layers 37R, 37G, and 37B according to the light emission luminance of the light emitted from the light emitting element 21, the colored layers 37R, 37G, and 37B are transmitted through and extracted from the display surface. It is possible to make the emission luminance of the emitted light uniform.

  Therefore, according to the present embodiment, in addition to the same effects as those of the first embodiment described above, the concentration of the color material of the colored layers 37R, 37G, and 37B is set when the colored layers 37R, 37G, and 37B are formed. Since only adjustment is required, manufacturing efficiency can be improved.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a cross-sectional view corresponding to the line BB ′ of FIG. 2, and is a cross-sectional view schematically showing the organic EL device of the third embodiment. FIG. 9 is a plan view of FIG. In FIG. 8, only the colored layer and the black matrix layer are shown for easy understanding. In the present embodiment, the area of the surface facing the light emitting region of the colored layer corresponding to each light emitting region of the light emitting device is set according to the light emission luminance of light emitted from the plurality of light emitting devices, This is different from the first and second embodiments described above. In addition, about the structure similar to 1st Embodiment mentioned above, the same code | symbol is attached | subjected and description is abbreviate | omitted. Moreover, since the structure of the colored layer of each color is substantially the same, in this embodiment, it demonstrates taking a red colored layer as an example.

  As shown in FIGS. 8 and 9, the organic EL device 3 of the present embodiment has a light emitting region 50 </ b> R of the light emitting element 21 having a high light emission luminance among the light emitting elements 21 based on the detection result of the light emission luminance detection process described above. -1 of the red colored layer 237R-1 corresponding to the light emitting region 50R-1 has a large area facing the light emitting region 50R-1, and the light emitting luminance of the red colored layer 237R-2 corresponding to the light emitting element 21 is low. The area of the opposing surface is formed small. That is, the area of the surface facing the light emitting region 50R-1 of the red colored layer 237R-1 corresponding to the light emitting element 21 having high light emission luminance is the light emission of the red colored layer 237R-2 corresponding to the light emitting element 21 having low light emission luminance. It is formed to be larger than the area of the region 50R-2.

  Specifically, the light emitting element 21 with low light emission luminance is formed such that the area of the light emitting region 50R-2 and the red colored layer 237R-2 overlapped in plan view is smaller than the area of the light emitting region 50R-2. Yes. Further, the red colored layer 237R-2 is disposed so as to overlap with the central portion in plan view of the light emitting region 50R-2. Accordingly, the transmission area F is formed in a region where the light emitting region 50R-2 and the red colored layer 237R-2 do not overlap in a plan view, that is, around the red colored layer 237R-2. The transmission area F is an area formed between the black matrix layer 32 and the red colored layer 237R-2 so as to surround the red colored layer 237R-2. In the transmission area F, the white light emitted from the light emitting element 21 passes through the sealing substrate 31 as it is. Note that the above-described light emitting regions (for example, reference numerals 50R-1 and 50R-2 in FIGS. 8 and 9) are regions in which three layers of the anode 10, the light emitting layer 40, and the cathode 11 are laminated, that is, the anode 10 and the cathode 11. The region where the light emitting layer 40 is sandwiched by and substantially contributes to light emission is shown. Moreover, the shape of the colored layer is not limited to a rectangular shape, and various shapes such as a circular shape can be employed.

Thus, according to the present embodiment, part of the light emitted from the light emitting element 21 is transmitted through the red colored layer 237R-2, and the remaining light is transmitted through the red colored layer 237R-2. Therefore, since the light passes through the transmission area F, it passes through the sealing substrate 31 in the state of white light emitted from the light emitting layer 40. That is, the light extracted from the sealing substrate 31 is composed of light transmitted through the red colored layer 237R-2 and light transmitted through the transmission area F.
Here, since the light extracted from the transmission area F is extracted without being absorbed by the red colored layer 237R-2, the light emission luminance in the state of being emitted from the light emitting element 21 can be maintained. The image displayed from the display surface of the sealing substrate 31 is displayed by light colored by the red colored layer 237R-2 and high-luminance light transmitted through the transmission area F. Accordingly, as in the first embodiment described above, even when luminance unevenness occurs in the light emitting element 21 due to various causes, the final light emission luminance of light extracted from the display surface can be made uniform.

In addition, since the red colored layer 237R-2 is disposed so as to overlap only in the central portion of the light emitting region 50R-2 having low light emission luminance, the display surface is viewed obliquely, that is, when the viewing angle is large. In addition, a desired light emission luminance can be ensured. That is, when the viewing angle is large, light with high emission luminance transmitted from the transmission area F formed around the red colored layer 237R-2 is seen, so that the viewing angle characteristic of the emission luminance is improved. Can do. In addition, by forming the red colored layer 237R-2 at the center of the light emitting region 50R-2, an error in forming the red colored layer 237R-2 can be allowed, so that alignment becomes easy.
When the area of the transmissive area F is large and the color purity is low, the color purity of each of the colored layers 37R, 37G, and 37B is changed by changing the thickness of the colored layers 37R, 37G, and 37B and the density of the coloring material. By improving it, it is possible to adjust the overall color reproducibility.

(Optical resonator structure)
Next, another configuration of the organic EL device of the present invention will be described with reference to FIG. FIG. 10 is a cross-sectional view schematically showing another configuration of the organic EL device. FIG. 10 is different from the third embodiment in that an optical resonance structure that resonates light emitted from the light emitting layer between the metal reflector and the cathode described above is employed. Therefore, the same components as those in the third embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 10, the cathode 111 of the organic EL device 6 in the present embodiment transmits part of the light emitted from the light emitting layer 40 and reflects part or all of the remaining light to the metal reflector 15 side. It is semi-transmissive reflective and is formed so as to cover the pixel partition wall 13 and the light emitting layer 40. In general, the above-described translucent conductive film such as ITO has a reflectivity of about 10% at the interface with the atmospheric layer, and such a translucent conductive film is used unless special measures are taken. The negative electrode 111 has a transflective property as described above.

  Here, the light emitting layer 40 is sandwiched between the above-described cathode 111 having a transflective function and the metal reflector 15, and is emitted from the light emitting layer 40 between the cathode 111 and the metal reflector 15. An optical resonance structure for resonating the emitted light is formed. According to this configuration, the light emitted from the light emitting layer 40 reciprocates between the metal reflector 15 and the cathode 111 and has a resonance wavelength corresponding to the optical distance between the metal reflector 15 and the cathode 111. Only light is amplified and extracted (see arrow in FIG. 5). For this reason, light with high emission luminance and sharp spectrum can be extracted.

  The resonance wavelength of each light emitting element 21 is the optical distance between the metal reflector 15 and the cathode 111, that is, each layer formed between the metal reflector 15 and the cathode 111 (for example, the organic functional layer 12 and the anode 110). ) Of each product of the film thickness and the refractive index. In the present embodiment, the resonance wavelength of each pixel region XR, XG, XB is adjusted by adjusting the optical distance between the metal reflector 15 and the cathode 111 in the optical resonator structure of each pixel region XR, XG, XB. Are different. That is, since the plurality of light emitting elements 21 having different resonance wavelengths in the optical resonator structure are included, different colors (for example, red light, green light, and blue light) are emitted from the light emitting layer 40 that emits white light. It comes to be taken out.

  In the case of this embodiment, these resonance wavelengths are preferably adjusted by the film thickness of the anode 110 of the light emitting element 21. Specifically, the film thickness of the anode 110 in each of the pixel regions XR, XG, and XB is the maximum for the anode 110R of the pixel region XR where the resonance wavelength is the largest, and then the anode 110G and the pixel region of the pixel region XG. The film thickness decreases in the order of the XB anode 110B. Further, the optical distance is set so that the light emitting element 21 that emits each color has the optimum resonance wavelength condition when the display surface (the surface of the sealing substrate 31) is viewed from the front, that is, when the viewing angle is 0 °. ing. Specifically, the optical distance is L, the phase shift generated when the light emitted from the light emitting layer 40 is reflected by the anode 10 or the cathode 111 is Φ (for example, −3 / 2π (rad)), and the light emitting layer 40 If the peak wavelength of the spectrum of light to be extracted out of the emitted light is λ, 2L = λ (m−Φ / 2π) (m is an integer). The viewing angle described above is an angle formed between the visual direction and the normal line of the display surface of the sealing substrate 31.

As described above, according to the present embodiment, in addition to the same effects as those of the third embodiment, since the optical resonance structure that resonates the light emitted from the light emitting layer 40 is employed, each pixel region XR, XG, XB Only the light satisfying the condition of the resonance wavelength corresponding to the optical distance between the metal reflector 15 and the cathode 111 is amplified and extracted. That is, the organic EL device 6 capable of full-color display is provided by forming the light emitting elements 21 having resonance wavelengths corresponding to the colors of red light (R), green light (G), and blue light (B). Can do.
As a result, the light itself that has not passed through the red colored layer 237R-2 (see FIG. 9) and has passed through the transmissive area F (see FIG. 9) is also the pixel regions XR, XG, It can be extracted as light of a color corresponding to XB. Then, the image displayed from the display surface of the sealing substrate 31 has light colored by the red colored layer 237R-2 and high brightness transmitted through the transmission area F and colors corresponding to the pixel regions XR, XG, and XB. It is displayed by the light it has. Therefore, in addition to obtaining high luminance at a low current, color reproducibility can be improved.
Even when the viewing angle is large, it is possible to improve the viewing angle characteristics of light emission luminance and color purity.

  In the above-described embodiment, the case where the black matrix layer 32 is formed between the colored layers has been described. However, the black matrix layer 32 is not formed, and a region between the colored layers is configured as a light transmission region. It is also possible. In this case, in the light transmission region, the light incident on the colored layer corresponding to the adjacent light emitting element 21 from the light emitting element 21 is set so as to satisfy the total reflection condition at the boundary surface between the sealing substrate 31 and the air. It is preferable. This total reflection condition is n1, n2 where n1 is the refractive index of the sealing substrate 31, n2 is the refractive index of air, θ1 is the incident angle to the sealing substrate 31, and θ2 is the exit angle from the sealing substrate 31. , Sin θ1 and sin θ2 are n1 sin θ1 = n2 sin θ2. In order to satisfy the total reflection condition, n1 and sin θ1 may be set so that θ2 ≧ 90 °. Specifically, by adjusting the horizontal and vertical distances between the arbitrary light emitting region and the colored layer of the adjacent light emitting region, the incident angle θ1 of light emitted from the arbitrary light emitting region and incident on the adjacent colored layer is set. adjust. It is also possible to adjust the refractive index n1 of the sealing substrate. In this case, the light satisfying θ2 ≧ 90 ° does not pass through the boundary surface between the sealing substrate 31 and the air, but is reflected on the element substrate 20A side. Thereby, the light emitted from the light emitting region does not pass through the colored layer corresponding to the adjacent light emitting region. Therefore, for example, without providing a non-light emitting region such as a black matrix layer between the colored layers, light leakage between adjacent pixel regions can be prevented and color reproducibility can be maintained.

(Electronics)
Next, the electronic apparatus of the present invention will be described.
The electronic apparatus has the above-described organic EL device (for example, organic EL devices 1 to 3 and 6) as a display unit, and specifically, the one shown in FIG.
FIG. 11A is a perspective view showing an example of a mobile phone. In FIG. 11A, a mobile phone 1000 includes a display unit 1001 using the organic EL device described above.
FIG. 11B is a perspective view showing an example of a wristwatch type electronic device. In FIG. 11B, a timepiece (electronic device) 1100 includes a display unit 1101 using the organic EL device described above.
FIG. 11C is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 11C, the information processing apparatus 1200 includes an input unit 1202 such as a keyboard, a display unit 1206 using the above-described organic EL device, and an information processing apparatus body (housing) 1204.
FIG. 11D is a perspective view showing an example of a thin large-screen television. In FIG. 11D, a thin large-screen TV 1300 includes a thin large-screen TV main body (housing) 1302, an audio output unit 1304 such as a speaker, and a display unit 1306 using the organic EL device 1 described above.

  Each of the electronic devices shown in FIGS. 11A to 11D includes the display portions 1001, 1101, 1206, and 1306 having the above-described organic EL devices, so that the display portion can obtain high luminance with low current. It is intended.

  Moreover, not only the case where an organic EL device is provided as a display unit, but also an electronic device provided as a light emitting unit. For example, a page printer (image forming apparatus) including an organic EL device as an exposure head (line head) may be used.

  It should be noted that the technical scope of the present invention is not limited to the above-described embodiments, and includes those in which various modifications are made to the above-described embodiments without departing from the spirit of the present invention. For example, the ink composition for the hole injection / transport layer or the light emitting layer described above is effective regardless of the molecular form such as low molecule, polymer, dendrimer, and the material for forming the light emitting layer is effective for both fluorescent and phosphorescent materials. is there.

In addition, the first to third embodiments described above can be appropriately combined, or a correction circuit for correcting the drive current can be provided in addition to the configuration of each embodiment.
Further, in the above-described embodiment, the case where the film thickness, concentration, area, and the like of the colored layer corresponding to each light emitting element is adjusted has been described. Etc.) and can be adjusted. In this case, the method for forming the colored layer is not limited to the ink jet method, and it is possible to adjust the rotational speed of the spin coating method for each region, or to form the screen by a screen printing method or the like.

In the optical resonator structure described above, the case where the film thickness of the anode is adjusted as a method for setting the optical distance has been described. However, the organic functional layer may be formed thick.
It is also possible to adjust the optical distance by adjusting the refractive index by changing the constituent material of the organic functional layer and the anode.
Further, a red light emitting layer, a green light emitting layer, and a blue light emitting layer may be formed between pixel partition walls (pixel regions), and a colored layer of each color may be disposed corresponding to the light emitting layer of each color.

It is a figure which shows the wiring structure of the organic electroluminescent apparatus in embodiment of this invention. It is a schematic diagram which shows the structure of the organic electroluminescent apparatus in embodiment of this invention. It is sectional drawing which shows typically the organic electroluminescent apparatus in alignment with the A-A 'line | wire of FIG. 2 in embodiment of this invention. It is process drawing by the side of the element substrate of the organic EL device in an embodiment of the present invention. It is process drawing by the side of the sealing substrate of the organic electroluminescent apparatus in embodiment of this invention. It is sectional drawing which shows typically the organic electroluminescent apparatus which follows the B-B 'line | wire of FIG. 2 in 1st Embodiment of this invention. It is sectional drawing which shows typically the organic electroluminescent apparatus equivalent to the B-B 'line | wire of FIG. 2 in 2nd Embodiment of this invention. It is sectional drawing which shows typically the organic electroluminescent apparatus corresponded to the B-B 'line | wire of FIG. 2 in 3rd Embodiment of this invention. FIG. 7 is a plan view of FIG. 6. It is sectional drawing which shows typically the organic electroluminescent apparatus which has the optical resonator structure corresponded to the A-A 'line | wire of FIG. 2 in embodiment of this invention. It is a figure which shows the electronic device which concerns on embodiment of this invention.

Explanation of symbols

  1, 2, 3, 4 ... Organic EL device (light emitting device) 10, 110, 110R, 110G, 110B ... Anode (first electrode) 11, 111 ... Cathode (second electrode) 15 ... Metal reflector (light reflecting layer) 21 ... Light emitting element 37R, 37G, 37B, 37R-1, 37R-2, 137R-1, 137R-2, 237R-1, 237R-2 ... Colored layer 40 ... Light emitting layer 50R-1, 50R-2 ... Light emitting Area 1000: Mobile phone (electronic device), 1100 ... Clock (electronic device), 1200 ... Information processing device (electronic device), 1300 ... Thin large-screen TV (electronic device), 1001, 1101, 1206, 1306 ... Display ( Light emitting device) X, XR, XG, XB ... Pixel area

Claims (15)

A plurality of light emitting elements each having a light emitting layer sandwiched between a first electrode and a second electrode;
A plurality of colored layers arranged corresponding to the plurality of light emitting elements, and a light emitting device comprising:
A light-emitting device, wherein the light transmittance of the colored layer corresponding to the light-emitting element is corrected in accordance with light emission luminance of light emitted from the plurality of light-emitting elements.   The light emitting device according to claim 1, wherein a thickness of the colored layer corresponding to the light emitting element is set according to light emission luminance of light emitted from the plurality of light emitting elements.   Among the plurality of light emitting elements, the colored layer corresponding to the light emitting element having high emission luminance is formed thicker than the thickness of the colored layer corresponding to the light emitting element having low emission luminance. The light-emitting device according to claim 2.   4. The color material concentration of the colored layer corresponding to the light emitting element is set according to the light emission luminance of light emitted from the plurality of light emitting elements. The light emitting device according to claim 1.   Among the plurality of light emitting elements, the color material concentration of the colored layer corresponding to the light emitting element having high light emission luminance is higher than the color material concentration of the color layer corresponding to the light emitting element having low light emission luminance. The light emitting device according to claim 4, wherein the light emitting device is formed.   The area of the surface facing the light emitting region of the colored layer corresponding to the light emitting region of the light emitting device is set according to the light emission luminance of the light emitted from the plurality of light emitting devices. The light-emitting device according to any one of claims 1 to 5.   Of the plurality of light emitting elements, an area of the colored layer corresponding to the light emitting region of the light emitting element having a high light emission luminance is a surface of the colored layer corresponding to the light emitting element having a low light emission luminance. The light emitting device according to claim 6, wherein the light emitting device is formed to be larger than an area of a surface facing the light emitting region.   8. The light emitting device according to claim 1, wherein light emitted from the light emitting element and incident on the colored layer corresponding to the adjacent light emitting element satisfies a total reflection condition. 9. .   The light emitting device according to any one of claims 1 to 8, wherein the light emitting layer emits white light.   The first electrode is light transmissive, the second electrode is transflective, a light reflecting layer is disposed on the opposite side of the light emitting layer across the first electrode, and the light reflecting 10. The optical resonator structure for resonating light emitted from the light emitting element is formed between the layer and the second electrode. 10. Light-emitting device. A light emitting element forming step of forming a plurality of light emitting elements in which a light emitting layer is sandwiched between the first electrode and the second electrode;
A colored layer forming step of forming a plurality of colored layers corresponding to the plurality of light emitting elements,
Prior to the colored layer forming step, a light emission luminance detecting step for detecting light emission luminance of light emitted from the light emitting element,
In the colored layer forming step, the light transmittance of the colored layer is corrected based on the detection result of the emission luminance detecting step. The emission luminance detecting step includes measuring luminance unevenness of the plurality of light emitting elements;
The method of manufacturing a light emitting device according to claim 11, further comprising: calculating a light emission luminance of light emitted from the light emitting element based on the luminance unevenness. The light emission luminance detection step includes a step of measuring a current value of a drive current flowing through the light emitting element,
The method for manufacturing a light emitting device according to claim 11, further comprising: calculating light emission luminance of light emitted from the light emitting element based on the current value.   The method for manufacturing a light emitting device according to claim 11, wherein in the colored layer forming step, a material for forming the colored layer is applied by a droplet discharge method.   An electronic apparatus comprising the light-emitting device according to claim 1.

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