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JP2009158838A - Electronic equipment - Google Patents

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Publication number
JP2009158838A
JP2009158838A JP2007337802A JP2007337802A JP2009158838A JP 2009158838 A JP2009158838 A JP 2009158838A JP 2007337802 A JP2007337802 A JP 2007337802A JP 2007337802 A JP2007337802 A JP 2007337802A JP 2009158838 A JP2009158838 A JP 2009158838A
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JP
Japan
Prior art keywords
frame
module substrate
substrate
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007337802A
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Japanese (ja)
Inventor
Daigo Suzuki
大悟 鈴木
Akihiko Happoya
明彦 八甫谷
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Toshiba Corp
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Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2007337802A priority Critical patent/JP2009158838A/en
Priority to US12/248,748 priority patent/US20090168386A1/en
Publication of JP2009158838A publication Critical patent/JP2009158838A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve a circuit mounting density and attain a miniaturization while reducing the number of parts and man-hour for mounting, in mounting on a module substrate whose both sides are mounted with circuit parts. <P>SOLUTION: An electronic apparatus has a frame 10 with a frame-shaped section 11 forming a space section, shielding films SP put on the internal surface of the frame-shaped section 11 and a plurality of connecting terminals 13 forming lead sections on the external surface of the frame-shaped section 11 and being fitted to the frame 10. The electronic apparatus further has a module substrate 30 mounted with the circuit parts 31 and 32 on a rear surface, while placing the circuit part 32 on the rear side on the frame 10 in the state housed in the space section, wherein the circuit parts 31 and 32 are connected to the connecting terminal 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、高周波信号を扱う回路部に適用して好適な電子機器および基板実装方法に関する。   The present invention relates to an electronic apparatus and a substrate mounting method that are suitable for application to a circuit unit that handles high-frequency signals.

電子回路を構成する回路基板において、高密度実装を可能にする手段として、小基板の両面に回路部品を実装してモジュール基板を構成し、このモジュール基板を多層プリント配線板を用いたユニット基板に電子部品（実装部品）として実装する基板実装技術が適用される。従来では、この基板実装技術を実現する手段として、ピン貫通型の端子構造を有するスペーサ、若しくはコネクタ機構を用いて実現していた。スペーサを用いた構成では、帯状の樹脂構体に一定の間隔で貫通ピンを配列したスペーサを用い、上記貫通ピンを基板相互の接続端子として、モジュール基板をユニット基板上に支持していた。またコネクタ機構を用いた基板実装技術は、ユニット基板とモジュール基板の双方に、互いに結合するコネクタ（コネクタプラグとコネクタリセプタクル）を設け、このコネクタ機構によりユニット基板上にモジュール基板を支持していた。   As a means for enabling high-density mounting in a circuit board constituting an electronic circuit, a circuit board is mounted on both sides of a small board to form a module board, and this module board is formed into a unit board using a multilayer printed wiring board. A substrate mounting technique for mounting as an electronic component (mounting component) is applied. Conventionally, as a means for realizing this board mounting technology, a spacer having a pin-through terminal structure or a connector mechanism has been used. In the configuration using spacers, the module substrate is supported on the unit substrate by using spacers in which through pins are arranged at regular intervals in a belt-shaped resin structure and using the through pins as connection terminals between the substrates. In the board mounting technique using the connector mechanism, connectors (connector plugs and connector receptacles) that are coupled to each other are provided on both the unit board and the module board, and the module board is supported on the unit board by this connector mechanism.

スペーサを用いた基板実装技術は、モジュール基板とユニット基板の双方に、それぞれ上記貫通ピンの貫通用孔を設け、貫通ピンを貫通用孔にはんだ付けする実装構造であることから、スペーサの取付に特殊な実装技術を必要とし、かつ構成が煩雑となることから生産性並びに歩留まり面の問題があった。さらに、モジュール基板並びにユニット基板の双方において貫通ピンの貫通部分の領域が各層に亘り配線不可領域となることから、配線密度の制約受け基板の大型化を招来するという問題があった。コネクタを用いた基板実装技術は、モジュール基板並びにユニット基板の双方にコネクタの実装スペースを確保して、モジュール基板とユニット基板とにそれぞれコネクタ（コネクタプラグとコネクタリセプタクル）を実装しなければならないことから、小型軽量化並びに部品点数の削減化を図る上で問題があるとともに、生産性、歩留まり、製品コスト等の面でも問題があった。   The substrate mounting technology using spacers is a mounting structure in which through holes for the through pins are provided on both the module substrate and the unit substrate, and the through pins are soldered to the through holes. Since special mounting technology is required and the configuration becomes complicated, there are problems in productivity and yield. Furthermore, since the region of the penetrating portion of the penetrating pin in each of the module substrate and the unit substrate becomes a non-wiring region across each layer, there is a problem in that the size of the substrate receiving the restriction on the wiring density is increased. Board mounting technology using connectors requires that connector mounting space be secured on both the module board and unit board, and connectors (connector plugs and connector receptacles) must be mounted on the module board and unit board, respectively. However, there are problems in reducing the size and weight and reducing the number of parts, as well as in productivity, yield, product cost, and the like.

さらに高周波帯の高速動作信号を扱うモジュール基板において、モジュール基板のユニット基板の板面と対向する面に設けられた回路部品を電磁遮蔽する必要があるとき、従来では、モジュール基板とユニット基板との間に、別途用意したシールドカバーを設けて上記回路部品を電磁遮蔽する実装構造となることから、上記した各問題点がより顕著になるという問題があった。   Furthermore, in a module board that handles high-speed operation signals in the high frequency band, when it is necessary to electromagnetically shield circuit components provided on the surface of the module board that faces the unit board, conventionally, the module board and the unit board There is a problem that each of the above-described problems becomes more prominent because a mounting structure is provided in which a shield cover prepared separately is provided to electromagnetically shield the circuit components.

電磁シールドを必要とする他の基板実装技術として、上基板と下基板の一部間隙に壁部材を設け、この壁部材に形成された導体部により基板相互を回路接続し、導体部が形成されていない壁部材の側面に板金部材の嵌め込み溝とめっき層を設けて、嵌め込み溝に板金部材を嵌め込み、板金部材とめっき層により下基板に実装された回路部品を電磁遮蔽する基板実装技術が存在した。しかしながら、この基板実装技術においても、実装部品点数の増加と組立工数の増加を招き生産性並びに歩留まりの面で実用性に乏しいという問題がある。
特開２００６−１５６８８５号公報 As another board mounting technology that requires an electromagnetic shield, a wall member is provided in a partial gap between the upper board and the lower board, and circuit boards are connected to each other by the conductor part formed on the wall member to form a conductor part. There is a board mounting technology in which a sheet metal member fitting groove and a plating layer are provided on the side surface of a non-wall member, the sheet metal member is fitted into the fitting groove, and the circuit component mounted on the lower substrate is electromagnetically shielded by the sheet metal member and the plating layer. did. However, this board mounting technique also has a problem that the number of mounting parts and the number of assembling steps increase, resulting in poor practicality in terms of productivity and yield.
JP 2006-156885 A

上述したように、従来では、両面に回路部品を実装したモジュール基板の基板実装技術において、生産性並びに歩留まりのよい実用化が容易に可能な基板実装技術が存在しないという問題があった。   As described above, in the related art, there has been a problem that there is no board mounting technique that can be easily put into practical use with good productivity and yield in the board mounting technique of the module board having circuit components mounted on both sides.

本発明は、両面に回路部品を実装したモジュール基板の基板実装技術において、回路実装密度の向上並びに小型化が図れるとともに、部品点数の削減化と実装工数の低減化が図れる、生産性並びに歩留まりのよい、実用化が容易に可能な基板実装技術を実現可能にした電子機器および基板実装方法を提供することを目的とする。   The present invention can improve the circuit mounting density and reduce the size in the circuit board mounting technology of the module substrate on which the circuit components are mounted on both sides, reduce the number of components and the mounting man-hours, and improve productivity and yield. It is an object of the present invention to provide an electronic device and a substrate mounting method that can realize a good substrate mounting technology that can be easily put into practical use.

本発明は、空間部を形成する枠状部を有するフレームと、前記枠状部の内面に施されたシールド被膜と、前記枠状部の外面にリード部を形成して前記フレームに設けられた複数の接続端子と、表面および裏面に回路部品が実装され、少なくとも裏面側の前記回路部品が前記空間部に収納された状態に前記フレームに載置され、前記回路部品が前記接続端子に回路接続されたモジュール基板と、を具備した電子機器を提供する。   The present invention is provided on the frame having a frame having a frame-shaped portion forming a space, a shield coating applied to the inner surface of the frame-shaped portion, and a lead portion formed on the outer surface of the frame-shaped portion. A plurality of connection terminals and circuit components are mounted on the front surface and the back surface, and at least the circuit components on the back surface side are placed in the space so as to be housed in the space, and the circuit components are connected to the connection terminals in a circuit manner. And an electronic device comprising the module substrate.

また、本発明は、ユニット基板にモジュール基板を実装する基板実装方法において、前記モジュール基板の表面および裏面に回路部品を実装し、前記モジュール基板と前記ユニット基板との間に、内面に電磁シールドを施した空間部を形成し、外面に複数の接続端子を形成したフレームを介挿して、前記フレームの空間部に、前記モジュール基板の少なくとも裏面側の前記回路部品を収納し、前記フレームの内面部で前記モジュール基板の裏面に実装された前記回路部品を前記電磁シールドにより電磁遮蔽し、前記フレームの外面部で前記接続端子により前記モジュール基板を前記ユニット基板に回路接続する基板実装方法を提供する。   According to another aspect of the present invention, there is provided a substrate mounting method for mounting a module substrate on a unit substrate, wherein circuit components are mounted on the front and back surfaces of the module substrate, and an electromagnetic shield is provided on the inner surface between the module substrate and the unit substrate. A space having a plurality of connection terminals formed on an outer surface thereof, the circuit component on at least the back surface side of the module substrate being accommodated in the space portion of the frame, and an inner surface portion of the frame; The circuit component mounted on the back surface of the module substrate is electromagnetically shielded by the electromagnetic shield, and a circuit board mounting method is provided in which the module substrate is connected to the unit substrate by the connection terminal on the outer surface of the frame.

本発明によれば、両面に回路部品を実装したモジュール基板の基板実装において、回路実装密度の向上並びに小型化が図れるとともに、部品点数の削減化と実装工数の低減化が図れる。   According to the present invention, it is possible to improve the circuit mounting density and reduce the size of the module substrate on which circuit components are mounted on both sides, and to reduce the number of components and the number of mounting steps.

以下図面を参照して本発明の実施形態を説明する。
先ず図１乃至図１０を参照して本発明の第１実施形態を説明する。
本発明の第１実施形態に係る電子機器の要部の構成を図１および図２に示す。本発明の第１実施形態に係る電子機器は、図１に示すように、フレーム１０と、モジュール基板３０とを有して構成される。フレーム１０は、部品実装のための空間部を形成する枠状部１１と、枠状部１１の内面に施されたシールド被膜（ＳＰ）と、枠状部１１の外面にリード部を形成して設けられた複数の接続端子１３とを有して構成される。モジュール基板３０は、表面３０Ａおよび裏面３０Ｂにそれぞれ回路部品３１，３２を実装している。モジュール基板３０は、裏面側の回路部品３２が上記空間部に収納された状態で上記フレーム１０に載置され、上記回路部品３２が端子接合パッド３３を介して上記接続端子１３に回路接続されている。 Embodiments of the present invention will be described below with reference to the drawings.
First, a first embodiment of the present invention will be described with reference to FIGS.
The structure of the principal part of the electronic device which concerns on 1st Embodiment of this invention is shown in FIG. 1 and FIG. As shown in FIG. 1, the electronic apparatus according to the first embodiment of the present invention includes a frame 10 and a module substrate 30. The frame 10 includes a frame-shaped portion 11 that forms a space for mounting components, a shield coating (SP) applied to the inner surface of the frame-shaped portion 11, and lead portions formed on the outer surface of the frame-shaped portion 11. A plurality of connection terminals 13 are provided. The module substrate 30 has circuit components 31 and 32 mounted on the front surface 30A and the back surface 30B, respectively. The module substrate 30 is placed on the frame 10 with the circuit component 32 on the back side stored in the space, and the circuit component 32 is connected to the connection terminal 13 via the terminal bonding pad 33. Yes.

上記端子接合パッド３３は、上記フレーム１０に設けられた複数の接続端子１３に対応してモジュール基板３０の裏面に設けられ、図示しない配線パターンを介して回路部品３１，３２に回路接続されている。モジュール基板３０の裏面３０Ｂに設けられた回路部品３２は高周波信号を扱う、電磁シールドが必要な高周波回路部品である。この図１に示す実施形態では、モジュール基板３０の裏面３０Ｂに複数の回路部品３２を実装しているが、部品数、部品形状等が特定されるものではない。また、端子接合パッド３３の形状も図示した形状に限らず、例えば四角形状、多角形状、または楕円形状等であってもよい。また上記図１に示す実施形態では、モジュール基板３０の板面形状を枠状部１１の枠の形状より大きな形状としているが、例えばモジュール基板３０の板面形状と枠状部１１の枠の形状とを一致させた構造であってもよい。さらに、このモジュール基板３０に用いられるプリント配線板は多層または単板構造の何れも適用可能であるが、この実施形態では後述するユニット基板と同様に、グランド（ＧＮＤ）プレーンおよび電源プレーンを有する多層プリント配線板を用いて構成される。   The terminal bonding pad 33 is provided on the back surface of the module substrate 30 corresponding to the plurality of connection terminals 13 provided on the frame 10, and is circuit-connected to the circuit components 31 and 32 through a wiring pattern (not shown). . The circuit component 32 provided on the back surface 30B of the module substrate 30 is a high-frequency circuit component that handles a high-frequency signal and requires an electromagnetic shield. In the embodiment shown in FIG. 1, a plurality of circuit components 32 are mounted on the back surface 30B of the module substrate 30, but the number of components, the component shape, and the like are not specified. Further, the shape of the terminal bonding pad 33 is not limited to the illustrated shape, and may be, for example, a rectangular shape, a polygonal shape, an elliptical shape, or the like. In the embodiment shown in FIG. 1, the plate surface shape of the module substrate 30 is larger than the frame shape of the frame-shaped portion 11. For example, the plate surface shape of the module substrate 30 and the frame shape of the frame-shaped portion 11 are used. It may be a structure in which Furthermore, the printed circuit board used for the module substrate 30 can be either a multilayer or a single-plate structure. In this embodiment, a multilayer having a ground (GND) plane and a power plane, as with a unit substrate described later. It is configured using a printed wiring board.

上記フレーム１０は、上記モジュール基板３０を支持する支持構体を構成し、上記接続端子１３は、端縁が上記フレーム１０の枠状部１１の端面に露出して形成され、上記モジュール基板３０を上記フレーム１０に載置することにより上記回路部品３１，３２が端子接合パッド３３を介し上記接続端子１３に回路接続される端子構造を有して構成されている。   The frame 10 constitutes a support structure that supports the module substrate 30, and the connection terminal 13 is formed with an end edge exposed at an end surface of the frame-like portion 11 of the frame 10, and the module substrate 30 is The circuit components 31, 32 are configured to have a terminal structure in which the circuit components 31, 32 are connected to the connection terminals 13 via the terminal bonding pads 33 by being placed on the frame 10.

上記複数の接続端子１３のうち、一部の端子はグランド（ＧＮＤ）端子１３（Ｇ）として用いられる。このＧＮＤ端子１３（Ｇ）は枠状部１１の内面に施されたシールド被膜（ＳＰ）に延長され、シールド被膜（ＳＰ）に導通している。   A part of the plurality of connection terminals 13 is used as a ground (GND) terminal 13 (G). The GND terminal 13 (G) is extended to a shield coating (SP) applied to the inner surface of the frame-like portion 11 and is electrically connected to the shield coating (SP).

上記フレーム１０の枠状部１１は、一方に開口部を有し、他方に閉塞部１２を有し、上記開口部は、上記モジュール基板３０で閉塞されている。   The frame-like portion 11 of the frame 10 has an opening on one side and a closing portion 12 on the other side, and the opening is closed by the module substrate 30.

上記枠状部１１と閉塞部１２は樹脂により一体成型され、閉塞部１２を底面とした箱形形状の筐体部を形成している。   The frame-shaped part 11 and the closing part 12 are integrally formed of resin to form a box-shaped housing part with the closing part 12 as a bottom surface.

上記枠状部１１と閉塞部１２により形成された筐体部の内面全体に、金属めっき、例えば銅めっきにより、シールド被膜（ＳＰ）が施され、上記モジュール基板３０の裏面３０Ｂに実装された回路部品３２が上記シールド被膜（ＳＰ）により電磁遮蔽された状態で上記筐体部に収納されている。   A circuit in which a shield coating (SP) is applied to the entire inner surface of the casing portion formed by the frame-shaped portion 11 and the closing portion 12 by metal plating, for example, copper plating, and is mounted on the back surface 30B of the module substrate 30. The component 32 is housed in the casing in a state where the component 32 is electromagnetically shielded by the shield coating (SP).

モジュール基板３０の裏面に設けられた端子接合パッド３３と、上記フレーム１０の枠状部１１の端面に露出して形成された接続端子１３とをはんだ接合して、モジュール基板３０とフレーム１０を一体化した状態を図２に示している。この端子接続によりモジュール基板３０とフレーム１０を一体化することで、高周波回路部品３２を上記筐体部に密閉状態で収納し電磁遮蔽した支持部材一体型のモジュール基板３０が構成される。この支持部材一体型のモジュール基板３０は、単一の電子部品または特定の機能を有する電子機器を構成する。   The terminal board 33 provided on the back surface of the module board 30 and the connection terminal 13 formed exposed on the end face of the frame-like portion 11 of the frame 10 are soldered together to integrate the module board 30 and the frame 10 together. FIG. 2 shows the converted state. By integrating the module substrate 30 and the frame 10 by this terminal connection, the support substrate integrated module substrate 30 in which the high-frequency circuit component 32 is housed in the casing and sealed electromagnetically is configured. The support member integrated module substrate 30 constitutes a single electronic component or an electronic device having a specific function.

このフレーム１０を一体化して設けたモジュール基板３０は、当該モジュール基板３０を電子部品（実装部品）とする、後述するユニット基板に実装される。このモジュール基板３０のユニット基板への実装は、フレーム１０の枠状部１１に設けられた接続端子１３の底部がユニット基板（図１０の符号１参照）に設けられた端子接合パッド（図１０の符号４ｓ参照）にはんだ接合され、モジュール基板３０がフレーム１０の接続端子１３を介してユニット基板（１）に回路接続されることによってなされる。このユニット基板（１）への実装構造については後述する。   The module substrate 30 provided with the frame 10 integrated is mounted on a unit substrate, which will be described later, using the module substrate 30 as an electronic component (mounting component). The module substrate 30 is mounted on the unit substrate by connecting a terminal bonding pad (see FIG. 10) in which the bottom of the connection terminal 13 provided on the frame-like portion 11 of the frame 10 is provided on the unit substrate (see reference numeral 1 in FIG. And the module substrate 30 is connected to the unit substrate (1) via the connection terminals 13 of the frame 10 by soldering. The mounting structure on the unit substrate (1) will be described later.

上記第１実施形態に係る電子機器の組立並びに基板実装工程を図３乃至図１０に示す。図２乃至図６は各工程の斜視状態、図７乃至図１０は同工程の側断面状態をそれぞれ簡略化して示している。   The assembly of the electronic device and the substrate mounting process according to the first embodiment are shown in FIGS. 2 to 6 are simplified perspective views of the respective steps, and FIGS. 7 to 10 are simplified side sectional views of the respective steps.

図３および図７に示す工程Ａは、モジュール基板３０の部品実装工程であり、モジュール基板３０の表面に回路部品３１を実装し、モジュール基板３０の裏面に回路部品３２を実装する。   Step A shown in FIG. 3 and FIG. 7 is a component mounting process of the module substrate 30. The circuit component 31 is mounted on the front surface of the module substrate 30 and the circuit component 32 is mounted on the back surface of the module substrate 30.

図４および図８に示す工程Ｂは、上記モジュール基板３０をユニット基板上で一定の高さに支持するための支持構体となるフレーム１０の供給工程であり、フレーム１０をモジュール基板３０への取付部品として供給する。このフレーム１０は、上記図１に示したように、部品実装のための空間部を形成する枠状部１１および閉塞部１２と、枠状部１１および閉塞部１２の内面に施されたシールド被膜（ＳＰ）と、枠状部１１の外面にリード部を形成して設けられた複数の接続端子１３とを有して構成される。   Step B shown in FIG. 4 and FIG. 8 is a step of supplying the frame 10 serving as a support structure for supporting the module substrate 30 on the unit substrate at a certain height, and attaching the frame 10 to the module substrate 30. Supply as parts. As shown in FIG. 1, the frame 10 includes a frame-shaped portion 11 and a blocking portion 12 that form a space for mounting components, and a shield coating applied to the inner surfaces of the frame-shaped portion 11 and the blocking portion 12. (SP) and a plurality of connection terminals 13 provided by forming lead portions on the outer surface of the frame-shaped portion 11.

図５および図９に示す工程Ｃは、モジュール基板３０にフレーム１０をはんだ実装するリフロー工程であり、モジュール基板３０を、裏面側の回路部品３２が枠状部１１により形成された空間部１１ａに収納された状態で上記フレーム１０上に載置し、フレーム１０の接続端子１３をモジュール基板３０の端子接合パッド３３にはんだ接合することによって、モジュール基板３０に実装された回路部品３１，３２が端子接合パッド３３を介して接続端子１３に回路接続され、かつモジュール基板３０の裏面に実装された高周波回路部品３２がフレーム１０の枠状部１１により形成された空間部に密封状態で納められ電磁遮蔽された状態で、モジュール基板３０とフレーム１０が一体化される。   Process C shown in FIGS. 5 and 9 is a reflow process in which the frame 10 is solder-mounted on the module substrate 30, and the module substrate 30 is placed in the space portion 11 a where the circuit component 32 on the back side is formed by the frame-shaped portion 11. The circuit components 31 and 32 mounted on the module substrate 30 are terminals by placing the connection terminals 13 of the frame 10 on the frame 10 in a housed state and soldering the connection terminals 13 of the frame 10 to the terminal connection pads 33 of the module substrate 30. The high-frequency circuit component 32 that is connected to the connection terminal 13 through the bonding pad 33 and mounted on the back surface of the module substrate 30 is sealed in a space formed by the frame-like portion 11 of the frame 10 and is electromagnetically shielded. In this state, the module substrate 30 and the frame 10 are integrated.

図６および図１０に示す工程Ｄは、ユニット基板１に部品をはんだ実装するリフロー工程であり、フレーム１０を一体化して設けたモジュール基板３０をユニット基板１にはんだ実装する。このユニット基板１へのモジュール基板３０のはんだ実装により、モジュール基板３０がフレーム１０に支持された状態でユニット基板１上に実装され、モジュール基板３０に実装された回路部品３１，３２がモジュール基板３０に設けられた端子接合パッド３３および枠状部１１に設けられた接続端子１３を介してユニット基板１の端子接合パッド４ｓに回路接続される。   A process D shown in FIGS. 6 and 10 is a reflow process in which components are solder-mounted on the unit substrate 1, and a module substrate 30 with the frame 10 integrated therein is solder-mounted on the unit substrate 1. By mounting the module substrate 30 on the unit substrate 1 by soldering, the module substrate 30 is mounted on the unit substrate 1 while being supported by the frame 10, and the circuit components 31 and 32 mounted on the module substrate 30 are connected to the module substrate 30. Are connected to the terminal bonding pads 4 s of the unit substrate 1 through the terminal bonding pads 33 provided on the frame substrate 11 and the connection terminals 13 provided on the frame-like portion 11.

このように、図１に示すフレーム１０を用いて、両面に回路部品３１，３２を実装したモジュール基板３０をユニット基板１に実装することにより、例えばスペーサによる基板双方へのピンの嵌挿、基板双方へのコネクタ部材の取付等、面倒な実装工程を排除して省力化された工程により、表裏両面に回路部品３１，３２を実装したモジュール基板３０をユニット基板１に実装することができる。さらに、シールドケース、シールド板等の金属部材を実装部品として用意することなく、電磁シールドを必要とする高周波回路部品３２を密閉構造内で電磁遮蔽でき、例えば低電圧で動作する高速信号を扱うＩＣ部品などの高周波部品に対して、外来ノイズによる影響を確実に抑制した信頼性の高いＥＭＩシールド効果を得ることができる。なお、ユニット基板１は多層プリント配線板を用いて構成され、内層に、グランド層（ＧＮＤプレーン）１ａ、および電源層（電源プレーン）１ｂを有している。枠状部１１の内面に形成されたシールド被膜（ＳＰ）は枠状部１１の外面に形成されたＧＮＤ端子１３（Ｇ）、およびユニット基板１の端子接合パッド４ｓを介して上記ＧＮＤプレーン１ａに回路接続されている。   Thus, by using the frame 10 shown in FIG. 1 and mounting the module substrate 30 with the circuit components 31 and 32 mounted on both sides on the unit substrate 1, for example, the insertion of pins on both the substrates by spacers, the substrate The module substrate 30 on which the circuit components 31 and 32 are mounted on both front and back surfaces can be mounted on the unit substrate 1 by a labor-saving process such as attaching the connector member to both sides and eliminating laborious mounting processes. Furthermore, without preparing a metal member such as a shield case or a shield plate as a mounting component, the high-frequency circuit component 32 requiring an electromagnetic shield can be electromagnetically shielded in a sealed structure, for example, an IC that handles a high-speed signal that operates at a low voltage. It is possible to obtain a highly reliable EMI shielding effect that reliably suppresses the influence of external noise on high-frequency components such as components. The unit substrate 1 is configured by using a multilayer printed wiring board, and has a ground layer (GND plane) 1a and a power supply layer (power supply plane) 1b as inner layers. The shield coating (SP) formed on the inner surface of the frame-shaped portion 11 is applied to the GND plane 1a via the GND terminal 13 (G) formed on the outer surface of the frame-shaped portion 11 and the terminal bonding pad 4s of the unit substrate 1. The circuit is connected.

上記第１実施形態に係るフレーム１０を用いた他の基板実装構造例を図１１乃至図１４に示している。なお、図１１乃至図１４に示す構成要素について、上記した図１乃至図１０に示す第１実施形態の構成要素と同一部分には同一符号を付し、その説明を省略する。また、図１１乃至図１４では、モジュール基板３０の端子接合パッド３３と、枠状部１１の接続端子１３との接合部分（はんだ接合部分）の構造を省略して示している。   Other substrate mounting structure examples using the frame 10 according to the first embodiment are shown in FIGS. In addition, about the component shown in FIG. 11 thru | or FIG. 14, the same code | symbol is attached | subjected to the same part as the component of 1st Embodiment shown in FIG. 1 thru | or FIG. 10, and the description is abbreviate | omitted. In addition, in FIGS. 11 to 14, the structure of the joint portion (solder joint portion) between the terminal joint pad 33 of the module substrate 30 and the connection terminal 13 of the frame-like portion 11 is omitted.

図１１に示す基板実装構造は、モジュール基板３０にシールドケース５１を被嵌して、モジュール基板３０の裏面に実装された回路部品３２に加え、モジュール基板３０の表面に実装された回路部品３１を電磁遮蔽している。このような構成とすることで、モジュール基板３０の実装部品全体を電磁シールドでき、頼性の高いＥＭＩシールド効果を得ることができる。   The board mounting structure shown in FIG. 11 includes a circuit board 31 mounted on the surface of the module board 30 in addition to the circuit parts 32 mounted on the back surface of the module board 30 by fitting the shield case 51 on the module board 30. Electromagnetic shielding. With such a configuration, the entire mounted component of the module substrate 30 can be electromagnetically shielded, and a highly reliable EMI shielding effect can be obtained.

図１２に示す基板実装構造は、モジュール基板３０の裏面に実装された回路部品３２に放熱路を形成したもので、回路部品３２とフレーム１０の閉塞部１２との間に、放熱部材（放熱グリスや放熱シートなど）５２を介挿して、回路部品３２が発生した熱を放熱部材５２およびフレーム１０を介して外部に放熱している。   The substrate mounting structure shown in FIG. 12 is a circuit component 32 mounted on the back surface of the module substrate 30 with a heat dissipation path formed between the circuit component 32 and the closed portion 12 of the frame 10. The heat generated by the circuit component 32 is dissipated to the outside through the heat dissipating member 52 and the frame 10.

図１３に示す基板実装構造は、モジュール基板３０の裏面にＧＮＤ端子を設けたもので、フレーム１０の底面部を形成する閉塞部１２に、該閉塞部１２を貫通するビア（例えばレーザビア、またはスルーホール）５３を配置して、シールド被膜（ＳＰ）およびモジュール基板３０のグランド（ＧＮＤ）プレーンに導通するＧＮＤ端子５３を設けている。さらに、回路部品３２とフレーム１０の閉塞部１２との間に、放熱部材（放熱グリスや放熱シートなど）５２を介挿し、回路部品３２が発生した熱を上記ＧＮＤ端子を構成するビア５３を介して外部に放熱している。   The board mounting structure shown in FIG. 13 is provided with a GND terminal on the back surface of the module board 30, and a via (for example, a laser via or a through hole) that penetrates the closing part 12 that forms the bottom part of the frame 10. A hole terminal 53 is disposed, and a GND terminal 53 is provided which is electrically connected to the shield coating (SP) and the ground (GND) plane of the module substrate 30. Further, a heat radiating member (heat radiating grease, heat radiating sheet, etc.) 52 is inserted between the circuit component 32 and the closed portion 12 of the frame 10, and the heat generated by the circuit component 32 is passed through the via 53 constituting the GND terminal. To dissipate heat to the outside.

このＧＮＤ端子（ビア）５３を設けたフレーム１０を一体に設けたモジュール基板３０を電子部品（実装部品）としてユニット基板１に実装した基板実装例を図１４に示している。この図１４に示す構成は、フレーム１０の底部に設けられたＧＮＤ端子５３がユニット基板１の配線パターン２にはんだ接合される。このような構成により、シールド被膜（ＳＰ）をより低インピーダンスでユニット基板１のグランド（ＧＮＤ）に接地できるとともに、モジュール基板３０の裏面に実装された回路部品３２から発生した熱を放熱部材５２、ＧＮＤ端子（ビア）５３、およびユニット基板１の配線パターン２を介して外部に放熱する放熱路（Ｄ）を形成できる。   FIG. 14 shows a substrate mounting example in which the module substrate 30 integrally provided with the frame 10 provided with the GND terminal (via) 53 is mounted on the unit substrate 1 as an electronic component (mounting component). In the configuration shown in FIG. 14, the GND terminal 53 provided at the bottom of the frame 10 is soldered to the wiring pattern 2 of the unit substrate 1. With such a configuration, the shield coating (SP) can be grounded to the ground (GND) of the unit substrate 1 with lower impedance, and the heat generated from the circuit component 32 mounted on the back surface of the module substrate 30 can be radiated from the heat dissipation member 52, A heat radiation path (D) for radiating heat to the outside can be formed through the GND terminal (via) 53 and the wiring pattern 2 of the unit substrate 1.

本発明の第２実施形態に係る電子機器の要部の構成を図１５に示す。この第２実施形態の構成が上記した第１実施形態の構成ととくに異なる部分は、上記第１実施形態に示したフレーム１０は枠状部１１に閉塞部１２を有しているが、この第２実施形態では、枠状部に閉塞部を有していない構造としている。   The structure of the principal part of the electronic device which concerns on 2nd Embodiment of this invention is shown in FIG. The part in which the configuration of the second embodiment is particularly different from the configuration of the first embodiment described above is that the frame 10 shown in the first embodiment has a closed portion 12 in the frame-shaped portion 11. In 2 embodiment, it is set as the structure which does not have the obstruction | occlusion part in a frame-shaped part.

本発明の第２実施形態に係る電子機器は、図１５に示すように、フレーム２０と、モジュール基板３０とを有して構成される。フレーム２０は、部品実装のための空間部を形成する枠状部２１と、枠状部２１の内面に施されたシールド被膜（ＳＰ）と、枠状部２１の外面にリード部を形成して設けられた複数の接続端子２３とを有して構成される。モジュール基板３０は、表面３０Ａおよび裏面３０Ｂにそれぞれ回路部品３１，３２を実装している。モジュール基板３０は、裏面側の回路部品３２が上記空間部に収納された状態で上記フレーム２０に載置され、回路部品３２が端子接合パッド３３を介して上記接続端子２３に回路接続されている。   As shown in FIG. 15, the electronic apparatus according to the second embodiment of the present invention includes a frame 20 and a module substrate 30. The frame 20 includes a frame-shaped portion 21 that forms a space for mounting components, a shield coating (SP) applied to the inner surface of the frame-shaped portion 21, and lead portions formed on the outer surface of the frame-shaped portion 21. A plurality of connection terminals 23 are provided. The module substrate 30 has circuit components 31 and 32 mounted on the front surface 30A and the back surface 30B, respectively. The module substrate 30 is placed on the frame 20 in a state where the circuit component 32 on the back side is housed in the space, and the circuit component 32 is connected to the connection terminal 23 via the terminal bonding pad 33. .

上記フレーム２０は、方形の枠状部２１を有して上記モジュール基板３０を支持する支持構体を構成し、上記接続端子２３は、端縁が上記フレーム２０の枠状部２１の端面に露出して形成され、上記モジュール基板３０を上記フレーム２０に載置することにより、上記回路部品３１，３２が端子接合パッド３３を介し上記接続端子１３に回路接続される端子構造を有して構成されている。   The frame 20 has a rectangular frame-shaped portion 21 and constitutes a support structure that supports the module substrate 30, and the connection terminal 23 is exposed at the end surface of the frame-shaped portion 21 of the frame 20. By forming the module substrate 30 on the frame 20, the circuit components 31 and 32 are configured to have a terminal structure in which the circuit components 31 and 32 are connected to the connection terminals 13 via the terminal bonding pads 33. Yes.

上記複数の接続端子２３のうち、一部の端子はグランド（ＧＮＤ）端子２３（Ｇ）として用いられる。このＧＮＤ端子２３（Ｇ）は枠状部２１の内面に施されたシールド被膜（ＳＰ）に延長され、シールド被膜（ＳＰ）に導通している。   Some of the plurality of connection terminals 23 are used as ground (GND) terminals 23 (G). The GND terminal 23 (G) is extended to a shield coating (SP) applied to the inner surface of the frame-shaped portion 21 and is electrically connected to the shield coating (SP).

上記方形の枠状部２１には、内面全体に、金属めっき、例えば銅めっきにより、シールド被膜（ＳＰ）が施され、この枠内の空間部に、上記モジュール基板３０の裏面３０Ｂに実装された回路部品３２の外側面周囲が上記シールド被膜（ＳＰ）により電磁遮蔽された状態で収納されている。   A shield coating (SP) is applied to the entire inner surface of the rectangular frame-shaped portion 21 by metal plating, for example, copper plating, and the space inside the frame is mounted on the back surface 30B of the module substrate 30. The periphery of the outer surface of the circuit component 32 is housed in a state where it is electromagnetically shielded by the shield coating (SP).

モジュール基板３０の裏面に設けられた端子接合パッド３３と、上記フレーム２０の枠状部２１の端面に露出して形成された接続端子２３とをはんだ接合して、モジュール基板３０とフレーム２０を一体化することで、高周波回路部品３２の外側面周囲を上記枠状部２１の内面で囲い電磁シールドした支持部材一体型のモジュール基板３０が構成される。この支持部材一体型のモジュール基板３０は、単一の電子部品または特定の機能を有する電子機器を構成する。   The terminal board 33 provided on the back surface of the module substrate 30 and the connection terminal 23 formed exposed on the end face of the frame-like portion 21 of the frame 20 are soldered to each other so that the module board 30 and the frame 20 are integrated. As a result, the support member-integrated module substrate 30 in which the periphery of the outer surface of the high-frequency circuit component 32 is surrounded by the inner surface of the frame-shaped portion 21 and electromagnetically shielded is configured. The support member integrated module substrate 30 constitutes a single electronic component or an electronic device having a specific function.

このフレーム２０を一体化して設けたモジュール基板３０は、当該モジュール基板３０を電子部品（実装部品）とする図１０に示したユニット基板１に実装される。このモジュール基板３０のユニット基板への実装は、フレーム２０の枠状部２１に設けられた接続端子２３の底部が図１０に示すユニット基板１に設けられた端子接合パッド４ｓにはんだ接合され、モジュール基板３０がフレーム２０の接続端子２３を介してユニット基板１に回路接続されることによってなされる。   The module substrate 30 provided with the frame 20 integrated is mounted on the unit substrate 1 shown in FIG. 10 using the module substrate 30 as an electronic component (mounting component). When the module substrate 30 is mounted on the unit substrate, the bottom of the connection terminal 23 provided on the frame-like portion 21 of the frame 20 is solder-bonded to the terminal bonding pad 4s provided on the unit substrate 1 shown in FIG. The circuit board 30 is connected to the unit board 1 via the connection terminals 23 of the frame 20.

この第２実施形態のフレーム２０を用いた基板実装構造は、モジュール基板３０の裏面３０Ｂに実装された回路部品３２の外側面周囲は上記シールド被膜（ＳＰ）により覆われるが、回路部品３２の上面部（モジュール基板３０への実装面部と反対側の面部）は枠状部１１から露出し、電磁シールドされていない。しかし、モジュール基板３０をユニット基板１上でフレーム２０により支持した状態で実装することにより、回路部品３２の電磁シールドされていない部分は、ユニット基板１の内層に設けられたグランド層（ＧＮＤプレーン）１ａ若しくは電源層（電源プレーン）１ｂにより電磁シールドされる。従って上記フレーム２０を一体化したモジュール基板３０を上記図１０示したユニット基板１に実装することによって、回路部品３２が電磁遮蔽された状態となる。通常、高密度実装を可能にする多層回路基板は、図１０に示すように、内層にＧＮＤプレーン（ＧＮＤ側のベタパターン）を形成するグランド層と、電源プレーン（電源側のベタパターン）を形成する電源層を有して構成されている。この多層回路基板に上記第２実施形態のフレーム構造を適用することで、モジュール基板３０の裏面に実装された回路部品３２に対して十分なＥＭＩシールド効果が得られる。   In the board mounting structure using the frame 20 of the second embodiment, the outer periphery of the circuit component 32 mounted on the back surface 30B of the module substrate 30 is covered with the shield coating (SP). The portion (surface portion opposite to the mounting surface portion on the module substrate 30) is exposed from the frame-shaped portion 11 and is not electromagnetically shielded. However, when the module substrate 30 is mounted on the unit substrate 1 while being supported by the frame 20, a portion of the circuit component 32 that is not electromagnetically shielded is a ground layer (GND plane) provided in the inner layer of the unit substrate 1. Electromagnetically shielded by 1a or power supply layer (power supply plane) 1b. Therefore, by mounting the module substrate 30 in which the frame 20 is integrated on the unit substrate 1 shown in FIG. 10, the circuit component 32 is electromagnetically shielded. Normally, a multilayer circuit board that enables high-density mounting, as shown in FIG. 10, forms a ground layer that forms a GND plane (GND-side solid pattern) on the inner layer and a power plane (solid pattern on the power-supply side). The power supply layer is configured. By applying the frame structure of the second embodiment to the multilayer circuit board, a sufficient EMI shielding effect can be obtained for the circuit component 32 mounted on the back surface of the module board 30.

上記第２実施形態に係るフレーム２０を用いた他の基板実装構造例を図１６乃至図２０に示している。なお、図１６乃至図２０に示す各構成要素について、上記した図１乃至図１４、および図１５に示す構成要素と同一部分には同一符号を付し、その説明を省略する。また、図１７乃至図２０では、モジュール基板３０の端子接合パッド３３と、枠状部２１の接続端子２３との接合部分（はんだ接合部分）の構造を省略して示している。   Examples of other board mounting structures using the frame 20 according to the second embodiment are shown in FIGS. 16 to FIG. 20, the same components as those shown in FIG. 1 to FIG. 14 and FIG. 15 described above are denoted by the same reference numerals, and the description thereof is omitted. 17 to 20, the structure of the joint portion (solder joint portion) between the terminal joint pad 33 of the module substrate 30 and the connection terminal 23 of the frame-like portion 21 is omitted.

図１６に示す基板実装構造は、ユニット基板１上のフレーム２０を実装する面部に、接続端子２３（ＧＮＤ端子を除く）のはんだ接合部分（端子接合パッド）を避けて、ＧＮＤパターン１ＳＰを配設する。このユニット基板１に、上記フレーム２０を一体に設けたモジュール基板３０をはんだ実装したとき、フレーム２０のＧＮＤ端子２３（Ｇ）を上記ＧＮＤパターン１ＳＰに同時にはんだ接合する。これにより、モジュール基板３０の裏面に実装された回路部品３２をフレーム２０の枠状部２１の内面に形成されたシールド被膜（ＳＰ）とＧＮＤパターン１ＳＰとで囲み電磁シールドした（すなわち、高周波回路部品３２をシールド被膜（ＳＰ）とＧＮＤパターン１ＳＰとモジュール基板３０の図示しないＧＮＤパターンとで形成される電磁遮蔽室内に収容した）、信頼性の高いＥＭＩシールド効果が得られる。   In the substrate mounting structure shown in FIG. 16, the GND pattern 1SP is disposed on the surface portion on which the frame 20 on the unit substrate 1 is mounted, avoiding the solder joint portions (terminal joint pads) of the connection terminals 23 (excluding the GND terminals). To do. When the module substrate 30 with the frame 20 integrally provided on the unit substrate 1 is solder-mounted, the GND terminal 23 (G) of the frame 20 is simultaneously solder-bonded to the GND pattern 1SP. As a result, the circuit component 32 mounted on the back surface of the module substrate 30 is surrounded by the shield coating (SP) formed on the inner surface of the frame-shaped portion 21 of the frame 20 and the GND pattern 1SP and electromagnetically shielded (that is, the high-frequency circuit component). 32 is accommodated in an electromagnetic shielding chamber formed by a shield coating (SP), a GND pattern 1SP, and a GND pattern (not shown) of the module substrate 30), and a highly reliable EMI shielding effect is obtained.

なお、本発明の第２実施形態に係るフレーム構造（枠形フレーム構造）の場合においても、上記図１０に示したユニット基板１のグランド層（ＧＮＤプレーン）１ａを用いて電磁シールドを形成することが可能であるが、上記図１６に示す電磁シールド構造とすることで、より枠状部２１に収容した回路部品３２の電磁シールド効果を高めることができる。   Even in the case of the frame structure (frame-shaped frame structure) according to the second embodiment of the present invention, an electromagnetic shield is formed using the ground layer (GND plane) 1a of the unit substrate 1 shown in FIG. However, by using the electromagnetic shield structure shown in FIG. 16, the electromagnetic shield effect of the circuit component 32 accommodated in the frame-like portion 21 can be further enhanced.

図１７に示す基板実装構造は、モジュール基板３０の支持機構にフレーム２０を適用することで、ユニット基板１のフレーム２０で囲繞された領域内に回路部品３を実装可能にしている。   In the board mounting structure shown in FIG. 17, the circuit component 3 can be mounted in an area surrounded by the frame 20 of the unit board 1 by applying the frame 20 to the support mechanism of the module board 30.

図１８に示す基板実装構造は、上記図１７に示す基板実装構造において、モジュール基板３０の裏面に実装された回路部品３２とユニット基板１との間に、放熱部材５２を介在させることにより、回路部品３２の放熱路（Ｄ）を形成している。   The board mounting structure shown in FIG. 18 is the same as the board mounting structure shown in FIG. 17 described above, with a heat dissipation member 52 interposed between the circuit component 32 mounted on the back surface of the module board 30 and the unit board 1. A heat radiation path (D) of the component 32 is formed.

図１９に示す基板実装構造は、フレーム２０を複数の枠状部２１により形成して、これら枠状部２１のシールド被膜（ＳＰ）をユニット基板１のグランドパターン２ｇにはんだ接合し、モジュール基板３０の裏面に実装された回路部品３２と、ユニット基板１に実装された回路部品３とをシールド被膜（ＳＰ）により電磁遮蔽している。さらにモジュール基板３０の裏面に実装された回路部品３２とユニット基板１との間に、放熱部材５２を介在させ、回路部品３２の放熱路（Ｄ）を形成している。   In the substrate mounting structure shown in FIG. 19, the frame 20 is formed by a plurality of frame-shaped portions 21, and the shield coating (SP) of these frame-shaped portions 21 is soldered to the ground pattern 2 g of the unit substrate 1. The circuit component 32 mounted on the back surface of the circuit board 3 and the circuit component 3 mounted on the unit substrate 1 are electromagnetically shielded by a shield coating (SP). Further, a heat dissipation member 52 is interposed between the circuit component 32 mounted on the back surface of the module substrate 30 and the unit substrate 1 to form a heat dissipation path (D) of the circuit component 32.

図２０に示す基板実装構造は、フレーム２０を一体に設けたモジュール基板３０を複数積み重ねることによって、多段モジュールを構成している。下段のモジュール基板３０は、裏面に実装された回路部品３２が下段のフレーム２０のシールド被膜（ＳＰ）により電磁遮蔽され、表面に実装された回路部品３１が上段のフレーム２０のシールド被膜（ＳＰ）により電磁遮蔽されている。上段のモジュール基板３０は、裏面に実装された回路部品３２が上段のフレーム２０のシールド被膜（ＳＰ）により電磁遮蔽され、表面に実装された回路部品３１がシールドケース５１により電磁遮蔽されている。   The board mounting structure shown in FIG. 20 constitutes a multistage module by stacking a plurality of module boards 30 integrally provided with a frame 20. In the lower module substrate 30, the circuit component 32 mounted on the back surface is electromagnetically shielded by the shield coating (SP) of the lower frame 20, and the circuit component 31 mounted on the surface is shielded (SP) of the upper frame 20. Is electromagnetically shielded. In the upper module substrate 30, the circuit component 32 mounted on the back surface is electromagnetically shielded by the shield coating (SP) of the upper frame 20, and the circuit component 31 mounted on the front surface is electromagnetically shielded by the shield case 51.

なお、この発明は、上述した実施の形態そのままに限定されるものではなく、実施段階では本発明の要旨を逸脱しない範囲で、構成要素を変形、変更して実施可能である。例えば、図１、図１０、図１２乃至図１９の各構成において、モジュール基板３０の表面側に、図１１に示すようなシールドケース（シールドキャップ）を被嵌させることにより、モジュール基板３０の裏面側に実装された高周波回路部品３２のはんだ実装面側の電磁シールドに関し、モジュール基板３０の図示しないＧＮＤプレーン（または電源プレーン）と、上記シールドケースとによる二重の電磁シールド効果をもたせることができる。また、上記図１に示した箱形のフレーム１０をモジュール基板３０のシールドキャップとして流用することも可能である。さらに、上記した実施形態では、フレームの枠状部を方形としているが、例えば円筒形または多角形であってもよい。   Note that the present invention is not limited to the above-described embodiment as it is, and can be implemented by modifying and changing the components without departing from the gist of the present invention in the implementation stage. For example, in each of the configurations of FIGS. 1, 10, 12 to 19, a back surface of the module substrate 30 can be obtained by fitting a shield case (shield cap) as shown in FIG. With regard to the electromagnetic shield on the solder mounting surface side of the high-frequency circuit component 32 mounted on the side, a double electromagnetic shielding effect can be provided by the GND plane (or power plane) (not shown) of the module substrate 30 and the shield case. . Further, the box-shaped frame 10 shown in FIG. 1 can be used as a shield cap for the module substrate 30. Furthermore, in the above-described embodiment, the frame-shaped portion of the frame is rectangular, but it may be, for example, cylindrical or polygonal.

本発明の第１実施形態に係る電子機器の要部の構成を示す分解斜視図。1 is an exploded perspective view showing a configuration of a main part of an electronic device according to a first embodiment of the present invention. 上記第１実施形態に係る電子機器の要部の構成を示す斜視図。The perspective view which shows the structure of the principal part of the electronic device which concerns on the said 1st Embodiment. 上記第１実施形態に係る電子機器の組立工程を示す斜視図。The perspective view which shows the assembly process of the electronic device which concerns on the said 1st Embodiment. 上記第１実施形態に係る電子機器の組立工程を示す斜視図。The perspective view which shows the assembly process of the electronic device which concerns on the said 1st Embodiment. 上記第１実施形態に係る電子機器の組立工程を示す斜視図。The perspective view which shows the assembly process of the electronic device which concerns on the said 1st Embodiment. 上記第１実施形態に係る電子機器の組立工程を示す斜視図。The perspective view which shows the assembly process of the electronic device which concerns on the said 1st Embodiment. 上記第１実施形態に係る電子機器の組立工程を示す側断面図。FIG. 6 is a side cross-sectional view illustrating an assembly process of the electronic device according to the first embodiment. 上記第１実施形態に係る電子機器の組立工程を示す側断面図。FIG. 6 is a side cross-sectional view illustrating an assembly process of the electronic device according to the first embodiment. 上記第１実施形態に係る電子機器の組立工程を示す側断面図。FIG. 6 is a side cross-sectional view illustrating an assembly process of the electronic device according to the first embodiment. 上記第１実施形態に係る電子機器の組立工程を示す側断面図。FIG. 6 is a side cross-sectional view illustrating an assembly process of the electronic device according to the first embodiment. 上記第１実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the first embodiment. 上記第１実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the first embodiment. 上記第１実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the first embodiment. 上記第１実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the first embodiment. 本発明の第２実施形態に係る電子機器の要部の構成を示す分解斜視図。The disassembled perspective view which shows the structure of the principal part of the electronic device which concerns on 2nd Embodiment of this invention. 上記第２実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the second embodiment. 上記第２実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the second embodiment. 上記第２実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the second embodiment. 上記第２実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the second embodiment. 上記第２実施形態に係る電子機器の他の構成例を示す側断面図。FIG. 6 is a side sectional view showing another configuration example of the electronic apparatus according to the second embodiment.

符号の説明Explanation of symbols

１…ユニット基板、 １ａ…グランド層、１ｂ…電源層、１ＳＰ…ＧＮＤパターン、２…配線パターン、 ２ｇ…グランドパターン、３…回路部品、４ｓ…端子接合パッド、１０…フレーム、１１…枠状部、１１ａ…空間部、１２…閉塞部、１３…接続端子、２０…フレーム、２１…枠状部、２３…接続端子、３０…モジュール基板、３０Ａ…表面、３０Ｂ…裏面、３１．３２…回路部品、３３…端子接合パッド、５１…シールドケース、５２…放熱部材、５３…ビア（ＧＮＤ端子）、ＳＰ…シールド被膜。   DESCRIPTION OF SYMBOLS 1 ... Unit board | substrate, 1a ... Ground layer, 1b ... Power supply layer, 1SP ... GND pattern, 2 ... Wiring pattern, 2g ... Ground pattern, 3 ... Circuit component, 4s ... Terminal joining pad, 10 ... Frame, 11 ... Frame-shaped part , 11a: space portion, 12: closed portion, 13: connection terminal, 20 ... frame, 21 ... frame-shaped portion, 23 ... connection terminal, 30 ... module substrate, 30A ... front surface, 30B ... back surface, 31.32 ... circuit component 33 ... Terminal bonding pad, 51 ... Shield case, 52 ... Heat dissipation member, 53 ... Via (GND terminal), SP ... Shield coating.

Claims (10)

空間部を形成する枠状部を有するフレームと、
前記枠状部の内面に施されたシールド被膜と、
前記枠状部の外面にリード部を形成して前記フレームに設けられた複数の接続端子と、
表面および裏面に回路部品が実装され、少なくとも裏面側の前記回路部品が前記空間部に収納された状態に前記フレームに載置され、前記回路部品が前記接続端子に回路接続されたモジュール基板と、
を具備したことを特徴とする電子機器。 A frame having a frame-like portion forming a space portion;
A shield coating applied to the inner surface of the frame-shaped portion;
A plurality of connection terminals provided on the frame by forming lead portions on the outer surface of the frame-shaped portion;
A circuit board is mounted on the front surface and the back surface, and at least the circuit component on the back surface side is placed on the frame in a state of being housed in the space, and the circuit board is connected to the connection terminal in a circuit board,
An electronic apparatus comprising: 前記フレームは、前記モジュール基板を支持する支持構体を構成し、前記接続端子は、端縁が前記フレームの枠状部の端面に露出して形成され前記モジュール基板を前記フレームに載置することにより前記回路部品が前記接続端子に回路接続される端子構造を有して構成されていることを特徴とする請求項１に記載の電子機器。   The frame constitutes a support structure that supports the module substrate, and the connection terminal is formed with an end edge exposed on an end surface of a frame-like portion of the frame, and the module substrate is placed on the frame. The electronic device according to claim 1, wherein the circuit component is configured to have a terminal structure in which the circuit component is connected to the connection terminal. 前記フレームの枠状部は、一方に開口部を有し、他方に閉塞部を有し、前記開口部は、前記モジュール基板で閉塞されていることを特徴とする請求項２に記載の電子機器。   The electronic apparatus according to claim 2, wherein the frame-shaped portion of the frame has an opening on one side and a closing portion on the other, and the opening is closed by the module substrate. . 前記枠状部と前記閉塞部は一体成形され、前記閉塞部を底面とした箱形形状の筐体部を形成していることを特徴とする請求項３に記載の電子機器。   The electronic apparatus according to claim 3, wherein the frame-shaped portion and the closing portion are integrally formed to form a box-shaped housing portion having the closing portion as a bottom surface. 前記筐体部の内面全体に金属めっきにより前記シールド被膜が施され、前記モジュール基板の裏面に実装された回路部品が前記シールド被膜により電磁遮蔽された状態で前記筐体部に収納されていることを特徴とする請求項４に記載の電子機器。   The shield coating is applied to the entire inner surface of the casing by metal plating, and the circuit components mounted on the back surface of the module substrate are housed in the casing in a state of being electromagnetically shielded by the shield coating. The electronic apparatus according to claim 4. 前記フレームは前記モジュール基板を実装部品とするユニット基板に実装され、前記フレームの枠状部に設けられた接続端子を介して前記モジュール基板が前記ユニット基板に回路接続されていることを特徴とする請求項１に記載の電子機器。   The frame is mounted on a unit substrate having the module substrate as a mounting component, and the module substrate is circuit-connected to the unit substrate via a connection terminal provided on a frame-shaped portion of the frame. The electronic device according to claim 1. 前記フレームは、前記枠状部の内面で前記モジュール基板の裏面に実装された前記回路部品を前記シールド被膜により電磁遮蔽し、前記枠状部の外面で前記接続端子により前記モジュール基板を前記ユニット基板に回路接続していることを特徴とする請求項６に記載の電子機器。   The frame electromagnetically shields the circuit component mounted on the back surface of the module substrate on the inner surface of the frame-shaped portion by the shield coating, and the module substrate is connected to the unit substrate by the connection terminal on the outer surface of the frame-shaped portion. The electronic apparatus according to claim 6, wherein the electronic apparatus is connected to a circuit. 前記シールド被膜は前記複数の接続端子に含まれるグランド端子に導体接続され、さらに前記グランド端子を介して前記ユニット基板のグランドパターンに回路接続されていることを特徴とする請求項７に記載の電子機器。   8. The electron according to claim 7, wherein the shield coating is conductively connected to a ground terminal included in the plurality of connection terminals, and is further connected to a ground pattern of the unit substrate via the ground terminal. machine. 前記フレームは、前記枠状部を複数有して構成され、少なくとも一つの枠状部の内面全体に前記シールド被膜が施されていることを特徴とする請求項１に記載の電子機器。   The electronic device according to claim 1, wherein the frame includes a plurality of the frame-shaped portions, and the shield coating is applied to an entire inner surface of at least one frame-shaped portion. ユニット基板にモジュール基板を実装する基板実装方法において、
前記モジュール基板の表面および裏面に回路部品を実装し、
前記モジュール基板と前記ユニット基板との間に、内面に電磁シールドを施した空間部を形成し、外面に複数の接続端子を形成したフレームを介挿して、
前記フレームの空間部に、前記モジュール基板の少なくとも裏面側の前記回路部品を収納し、
前記フレームの内面部で前記モジュール基板の裏面に実装された前記回路部品を前記電磁シールドにより電磁遮蔽し、前記フレームの外面部で前記接続端子により前記モジュール基板を前記ユニット基板に回路接続する
ことを特徴とする基板実装方法。 In a board mounting method for mounting a module board on a unit board,
Circuit components are mounted on the front and back surfaces of the module substrate,
Between the module substrate and the unit substrate, forming a space portion with an electromagnetic shield on the inner surface, interposing a frame having a plurality of connection terminals on the outer surface,
In the space portion of the frame, the circuit component on at least the back side of the module substrate is stored,
The circuit component mounted on the back surface of the module substrate at the inner surface portion of the frame is electromagnetically shielded by the electromagnetic shield, and the module substrate is connected to the unit substrate by the connection terminal at the outer surface portion of the frame. A board mounting method that is characterized.
JP2007337802A 2007-12-27 2007-12-27 Electronic equipment Pending JP2009158838A (en)

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