JP2009156826A - Heat ray flow velocity sensor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat ray flow velocity sensor for improving the productivity and reliability at a high detection accuracy, and its manufacturing method. <P>SOLUTION: This heat ray flow velocity sensor 50 comprises an insulating substrate 52 having a hollow section 56, first and second electrode sections 60 and 62 formed of a conductive layer 54 formed on the insulating substrate 52 and insulated mutually, and a wire section 58 formed of the conductive layer 54 formed on the insulating substrate 52, arranged along a part of a periphery of an opening region of the hollow section 56, and electrically interconnecting the first and second electrode sections 60 and 62. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a hot wire flow rate sensor and a method for manufacturing the same.

  The heat ray flow rate sensor is used for speed control of automobiles, aircrafts, etc., and detects the angular velocity by utilizing the fact that the electric resistance of the heat ray is changed when the gas flow is deflected by the angular velocity. About the structure of such a heat ray flow velocity sensor, it is disclosed by patent document 1 and nonpatent literature 1, for example.

  Non-Patent Document 1 discloses a configuration of a heat ray flow rate sensor configured by connecting the tips of a pair of support needles called prongs supported by an insulator base with heat rays.

  FIG. 17 shows the basic configuration of a conventional hot-wire flow rate sensor. FIG. 17 schematically illustrates a perspective view of a sensor unit of a heat ray flow rate sensor. In this heat ray flow rate sensor, four pin-shaped electrodes 102, 104, 106, 108 are independently implanted on the substrate 100. A hot wire 110 is stretched between the pair of electrodes 102 and 104 by soldering or welding. A hot wire 112 is stretched between the pair of electrodes 106 and 108 by soldering or welding.

  A current is passed through each of the hot wires 110 and 112 and a gas flow 114 is applied. When the gas flow 114 is deflected by an angular velocity given from the outside, a temperature difference is generated in the heat wires 110 and 112, and a difference in electric resistance between the heat wires 110 and 112 is changed. Therefore, by detecting this change in electrical resistance, the angular velocity corresponding to the change can be detected.

  Further, Patent Document 1 discloses a heat ray flow rate sensor having a configuration in which a wire portion whose free ends are provided at the distal ends of a plurality of projecting arms projecting inwardly on the inner surface of a silicon frame-type substrate. Is disclosed.

JP 2007-205862 A Edited by the Japan Society of Mechanical Engineers, “Fluid Measurement Method”, The Japan Society of Mechanical Engineers, August 1985, p. 108-130

  Since the conventional heat ray flow velocity sensor is configured as described above, the following problems exist.

  In the configuration disclosed in Non-Patent Document 1, since the heat ray is stretched using soldering or the like, it is difficult to automate the work, and it is necessary to stretch the wire manually. Therefore, the yield is not constant, the productivity is low, and it is difficult to reduce the cost. Moreover, since the heat ray is a fine thin wire, there is a problem that it is difficult to handle the heat ray flow rate sensor and it is difficult to improve the reliability.

  Further, in the configuration disclosed in Patent Document 1, it is possible to improve the detection accuracy and sensitivity by forming a wire portion whose both ends are free ends, thereby preventing the occurrence of thermal stress during thermal expansion and contraction. However, since the heat ray is still a fine thin wire, similarly to the configuration disclosed in Non-Patent Document 1, it is difficult to handle the heat ray flow rate sensor and it is difficult to improve the reliability.

  Therefore, the present invention has been made in view of the technical problems as described above, and an object of the present invention is a hot-wire flow rate sensor capable of improving productivity and reliability with high detection accuracy, and its It is to provide a manufacturing method.

  In order to solve the above-described problems, the present invention provides an insulating substrate having a hollow portion, a first electrode portion and a second electrode portion which are formed of a conductive layer formed on the insulating substrate and are insulated from each other, and the insulating substrate. A heat ray flow velocity comprising a conductive layer formed thereon, arranged along a part of the periphery of the opening region of the hollow portion, and a wire portion that electrically connects the first and second electrode portions Related to sensors.

  According to the present invention, it is not necessary to manually create a wire portion that functions as a heat ray, and a heat ray flow rate sensor can be manufactured by a predetermined processing, thereby improving yield, increasing productivity, and reducing cost. Can do. In addition, since the wire portion is composed of a conductive layer formed on an insulating substrate, the possibility of disconnection or the like is extremely small even if it is a minute thin wire, and the decrease in reliability is suppressed with high detection accuracy. It becomes possible.

  Furthermore, according to the present invention, since the strength of the wire portion is reinforced by the insulating substrate, a metal having high thermal conductivity can be used as the metal material of the wire portion, so that the detection accuracy can be further improved. become.

  The present invention also includes an insulating substrate having first and second hollow portions, a first to a third electrode portion which are made of a conductive layer formed on the insulating substrate and are insulated from each other, and the insulating substrate. A first wire made of a conductive layer formed thereon, disposed along a part of the periphery of the opening region of the first hollow portion, and electrically connecting the first and second electrode portions And a conductive layer formed on the insulating substrate, disposed along a part of the periphery of the opening region of the second hollow portion, and electrically connecting the second and third electrode portions And a second wire portion to be connected, and is related to a heat ray flow rate sensor arranged on the main surface of the insulating substrate so that the direction of the first wire portion and the direction of the second wire portion intersect each other. To do.

  According to the present invention, it is not necessary to manually create the first and second wire portions functioning as heat rays, and the heat ray flow rate sensor can be manufactured by a predetermined processing process, thereby improving the yield and increasing the productivity. Cost reduction can be achieved. In addition, since the first and second wire portions are composed of the conductive layer formed on the insulating substrate, the possibility of disconnection or the like is extremely small even with a minute thin wire, and the detection accuracy is high. It becomes possible to suppress a decrease in reliability.

  Further, according to the present invention, each angular velocity component can be obtained for the two detection axes, so that the angular velocity can be detected with higher accuracy.

  Furthermore, according to the present invention, since the strength of the first and second wire portions is reinforced by the insulating substrate, a metal having high thermal conductivity can be used as the metal material of the first and second wire portions. Thus, the detection accuracy can be further improved.

  The present invention also includes an insulating substrate having first and second hollow portions, and a first to a third electrode that are insulated from each other, comprising a conductive layer formed on the first main surface of the insulating substrate. And a conductive layer formed on the first main surface of the insulating substrate, arranged along a part of the periphery of the opening region of the first hollow portion, and the first and second Part of the periphery of the opening region of the second hollow part, comprising: a first wire part for electrically connecting the electrode part of the second insulating part; and a conductive layer formed on the first main surface of the insulating substrate. And a second wire portion for electrically connecting the second and third electrode portions and a second main surface on the back surface of the first main surface of the insulating substrate. Formed on the second main surface of the insulating substrate and the fourth to sixth electrode portions, which are made of a conductive layer and insulated from each other A third wire portion made of an electric layer, disposed along a part of the periphery of the opening region of the first hollow portion, and electrically connecting the fourth and fifth electrode portions; and the insulation It comprises a conductive layer formed on the second main surface of the substrate, and is disposed along a part of the periphery of the opening region of the second hollow portion and electrically connects the fifth and sixth electrode portions. A fourth wire portion that is electrically connected, and arranged on the first main surface of the insulating substrate such that the direction of the first wire portion and the direction of the second wire portion intersect, In the second main surface of the insulating substrate, the present invention relates to a heat ray flow rate sensor arranged so that the direction of the third wire portion and the direction of the fourth wire portion intersect each other.

  According to the present invention, it is not necessary to manually create the first to fourth wire portions functioning as heat rays, and the heat ray flow rate sensor can be manufactured by a predetermined processing process, thereby improving the yield and increasing the productivity. Cost reduction can be achieved. In addition, since the first to fourth wire portions are composed of the conductive layer formed on the insulating substrate, the possibility of disconnection or the like is extremely small even with a minute thin wire, with high detection accuracy. It becomes possible to suppress a decrease in reliability.

  Further, according to the present invention, each component of the angular velocity can be obtained for two sets of two detection axes, so that the angular velocity can be detected in three dimensions with higher accuracy.

  Furthermore, according to the present invention, since the strength of the first to fourth wire portions is reinforced by the insulating substrate, a metal having high thermal conductivity can be used as the metal material of the first to fourth wire portions. Thus, the detection accuracy can be further improved.

  In the heat ray flow rate sensor according to the present invention, the insulating substrate may be a polyimide substrate.

  According to the present invention, a thin hot wire flow rate sensor can be provided at low cost.

  In the hot wire flow rate sensor according to the present invention, gold may be used for forming the conductive layer.

  According to the present invention, since the thermal conductivity of the conductive layer can be increased, the sensitivity can be improved and the detection accuracy can be increased.

  The present invention also includes a hollow portion forming step of forming a hollow portion in an insulating substrate having a conductive layer formed on the substrate, and a conductive layer formed on the insulating substrate, the first and the first being insulated from each other. An electrode portion forming step for forming two electrode portions, and a wire portion for electrically connecting the first and second electrode portions so as to be arranged along a part of the periphery of the opening region of the hollow portion. The present invention relates to a manufacturing method of a heat ray flow rate sensor including a wire part forming step to be formed.

  According to the present invention, it is possible to form a thinned wire portion and first and second electrode portions connected to both ends of the wire portion by a very simple method. And it is not necessary to manually create a wire part that functions as a heat ray, and a heat ray flow rate sensor can be manufactured by a predetermined processing process, so that it is possible to improve yield and improve productivity and reliability with high detection accuracy. It becomes possible to provide a method for manufacturing a hot wire flow rate sensor.

  According to another aspect of the present invention, there is provided a hollow portion forming step of forming first and second hollow portions in an insulating substrate having a conductive layer formed on the substrate, and a first insulating layer formed of a conductive layer on the insulating substrate. An electrode part forming step for forming first to third electrode parts; and a first wire part for electrically connecting the first and second electrode parts on the insulating substrate. The second wire portion that electrically connects the second and third electrode portions is formed in the opening region of the second hollow portion, and is formed so as to be disposed along a part of the periphery of the opening region. A wire part forming step formed so as to be arranged along a part of the periphery, and in the wire part forming step, the direction of the first wire part and the direction of the second wire part intersect each other. It relates to the manufacturing method of the hot wire flow velocity sensor formed as described above.

  According to the present invention, the thinned first and second wire portions and the first to third electrode portions connected to both ends of these wire portions can be formed by a very simple method. become. And since it is not necessary to manually create the first and second wire portions functioning as heat rays and the heat ray flow rate sensor can be manufactured by a predetermined processing, the yield is improved, the productivity is increased, and the cost is reduced. Can be planned.

  Moreover, in the manufacturing method of the heat ray flow velocity sensor according to the present invention, the hollow portion forming step forms a hollow portion by irradiating a laser from above the main surface of the insulating substrate, and the wire portion forming step includes focused ions. A wire part can be formed by irradiating a beam from above the main surface of the insulating substrate.

  According to the present invention, since the wire portion is formed by focused ion beam processing instead of the laser, the wire portion can be formed as a fine wire with a reduced width, and the processed surface cannot be flattened by a laser using an oscillation state. Therefore, it is possible to provide a method for manufacturing a heat ray flow rate sensor with high detection accuracy.

  The present invention also provides a first main surface electrode portion forming step of forming first to third electrode portions made of a conductive layer and insulated from each other on a first main surface of an insulating substrate; A first wire portion that electrically connects the first and second electrode portions is disposed along a part of the periphery of the opening region of the first hollow portion of the insulating substrate. And the second wire portion that electrically connects the second and third electrode portions is arranged along a part of the periphery of the opening region of the second hollow portion of the insulating substrate. A first main surface wire portion forming step to be formed on the second main surface of the back surface of the first main surface of the insulating substrate, and fourth to sixth electrodes made of a conductive layer and insulated from each other. A second main surface electrode portion forming step for forming a portion, and electrically connecting the fourth and fifth electrode portions on the second main surface. Forming a third wire portion to be disposed along a part of the periphery of the opening region of the first hollow portion of the insulating substrate, and electrically connecting the fifth and sixth electrode portions. And a second main surface wire portion forming step of forming a fourth wire portion to be disposed along a part of the periphery of the opening region of the second hollow portion of the insulating substrate. Related to manufacturing method.

  According to the present invention, the thinned first to fourth wire portions and the first to sixth electrode portions connected to both ends of the wire portions can be formed by a very simple method. become. And since it is not necessary to manually create the first to fourth wire portions functioning as heat rays and the heat ray flow rate sensor can be manufactured by a predetermined processing, the yield is improved, the productivity is increased, and the cost is reduced. Can be planned.

  Moreover, in the manufacturing method of the heat ray flow velocity sensor according to the present invention, the first and second main surface wire portion forming steps irradiate the focused ion beam from above the first and second main surfaces of the insulating substrate. Thus, the wire portion can be formed.

  According to the present invention, since the wire portion is formed by focused ion beam processing instead of the laser, the wire portion can be formed as a fine wire with a reduced width, and the processed surface cannot be flattened by a laser using an oscillation state. Therefore, it is possible to provide a method for manufacturing a heat ray flow rate sensor with high detection accuracy.

  In the method for manufacturing a heat ray flow rate sensor according to the present invention, the insulating substrate may be a polyimide substrate.

  According to the present invention, it is possible to provide a method for manufacturing a thin hot-wire flow rate sensor at low cost.

  Moreover, in the manufacturing method of the heat ray flow velocity sensor according to the present invention, gold may be used for forming the conductive layer.

  According to the present invention, since the thermal conductivity of the conductive layer can be increased, it is possible to provide a method for manufacturing a hot wire flow rate sensor that improves sensitivity and increases detection accuracy.

  Hereinafter, a hot-wire flow rate sensor and a manufacturing method thereof according to the present invention will be described based on embodiments shown in the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Also, not all of the configurations described below are essential constituent requirements of the present invention.

Embodiment 1
FIG. 1 shows a schematic perspective view of a configuration of an angular velocity detecting device including a heat ray flow velocity sensor according to the first embodiment of the present invention.

  The angular velocity detection device 10 includes a cylindrical gas flow channel tube 12, a gas flow supply device 20 that supplies a gas flow to the gas flow channel tube 12, and a hot-wire flow rate sensor 50 that is disposed in the gas flow channel tube 12. And angular velocity detection processing device 30.

  The gas flow supply device 20 includes a nozzle 22 and supplies a gas flow from the nozzle 22 into the gas flow path pipe 12 by driving a piezoelectric element, for example. The hot wire flow rate sensor 50 has a hot wire (not shown in FIG. 1), and a gas flow from the nozzle 22 is applied in a state where an electric current is passed through the hot wire. The angular velocity detection processing device 30 performs angular velocity detection processing based on a change in signals (current or voltage) at both ends of the hot wire included in the hot wire flow velocity sensor 50.

  The angular velocity detection device 10 having such a configuration supplies a gas flow in a state where an electric current is supplied to the heat ray of the heat ray flow velocity sensor 50. For example, the angular velocity ω is given to the gas passage tube 12 (angular velocity detection device 10). The angular velocity ω can be detected by utilizing the fact that the electric resistance of the heat ray changes due to the deflection of the gas flow when it is generated.

In FIG. 2, the outline | summary of a structure of the heat ray flow velocity sensor 50 in Embodiment 1 is shown. FIG. 2 shows a top view of the hot wire flow rate sensor 50 of FIG.
FIG. 3 schematically shows a cross-sectional view taken along line AA of FIG.

  As shown in FIGS. 2 and 3, the heat ray flow velocity sensor 50 is formed on the main surface of the insulating substrate 52. A conductive layer 54 is formed on the main surface of the insulating substrate 52, and a wire portion (sensor portion) that functions as an electrode portion or a heat ray is formed by the conductive layer 54. The insulating substrate 52 can be a polyimide substrate, for example. Thereby, the heat ray flow velocity sensor 50 can be manufactured thinly at low cost. The conductive layer 54 can be gold plated, for example. Note that a layer containing another metal substance may be interposed between the main surface of the insulating substrate 52 and the conductive layer 54.

  Desirably, the thermal expansion coefficient of the insulating substrate 52 and the thermal expansion coefficient of the conductive layer 54 are substantially equal. By doing so, it is possible to suppress a decrease in reliability due to breakage such as disconnection of the wire portion resulting from the generation of stress due to the deflection of the gas flow.

Such a heat ray flow velocity sensor 50 has a tip portion provided so as to face the direction of gas flow when viewed from above, and the tip portion has a trapezoidal shape. The heat ray of the heat ray flow rate sensor 50 is provided at the tip portion. When one side of the tip (the trapezoidal short side) intersects the direction of the gas flow perpendicularly, the angle formed by the two hypotenuses (trapezoid hypotenuses) constituting the tip with respect to the direction perpendicular to the direction of the gas flow is θ _1, when θ _2, θ _1, θ ₂ is preferably both the same angle. More specifically, both θ ₁ and θ ₂ are desirably 45 degrees. By doing so, it is possible to flow the gas flow equally to the left and right of the hot wire flow velocity sensor 50, and to suppress a decrease in detection accuracy due to the non-uniform flow of the gas flow.

  On the insulating substrate 52, two electrode portions are formed that are insulated from each other when viewed from above except for the tip of the heat ray flow velocity sensor 50. Therefore, as shown in FIG. 3, a groove portion 70 from which the gold plating is removed is provided between the two electrode portions. These electrode portions are electrically connected to both ends of a heat wire formed at the tip portion. The voltage between these electrode portions is output to the angular velocity detection processing device 30 via the signal lines 80 and 82.

  In FIG. 4, the outline | summary of a structure of the front-end | tip part of the heat ray flow velocity sensor 50 in Embodiment 1 is shown. FIG. 4 shows a top view of the tip of the hot wire flow rate sensor 50 of FIG.

  As shown in FIG. 4, the heat ray flow velocity sensor 50 in the first embodiment includes an insulating substrate 52 having a hollow portion 56 and a conductive layer 54 formed on the insulating substrate 52, and is insulated from each other. Electrode portions 60 and 62 and a wire portion 58 functioning as a heat ray. The wire portion 58 includes a conductive layer 54 formed on the insulating substrate 52, and is disposed along a part of the periphery of the opening region of the hollow portion 56, and electrically connects the first and second electrode portions 60 and 62. Connect. Here, the opening region of the hollow portion 56 is a region of the cut surface of the hollow portion 56 in the main surface of the insulating substrate 52.

  Further, in FIG. 4, an end portion 64 of the tip portion that is insulated from the wire portion 58 is provided on the insulating substrate 52. That is, the groove portion 84 is provided between the end portion 64 and the wire portion 58, and the inner wall of the hollow portion 56 constitutes the side surface of the wire portion 58, thereby realizing thinning of the wire portion 58. In the first embodiment, the configuration may be such that the end portion 64 of the distal end portion is omitted.

  FIG. 5 schematically shows a perspective view of the heat ray flow rate sensor 50 of FIG. In FIG. 5, the same parts as those in FIG.

  As shown in FIG. 5, the wire portion 58 is arranged in a direction that intersects the direction of the gas flow from the gas flow supply device 20 (the direction of the detection axis). The first and second electrode portions 60 and 62 are connected to the angular velocity detection processing device 30 via a signal line (not shown), and a current is constantly supplied via the signal line. 58 generates heat due to its electrical resistance. Therefore, the gas flow is deflected by the input angular velocity ω and the detection component vx of the direction of the gas flow changes, and the temperature of the wire portion 58 changes according to the detection component vx. Therefore, the electrical resistance of the wire part 58 changes corresponding to the changed temperature. The angular velocity detection processing device 30 can detect this change in electrical resistance as a current change (voltage change) in the wire portion 58 and can detect an input angular velocity ω corresponding to this change.

  As described above, the hot-wire flow rate sensor 50 according to the first embodiment can detect the component vx constituting the direction of the gas flow with the direction perpendicular to the direction in which the wire portion 58 extends as the detection axis. The angular velocity detection processing device 30 can obtain the input angular velocity ω based on the detected component vx.

  FIG. 6 shows an example of a circuit diagram of a configuration example of the angular velocity detection processing device 30 of FIG. In FIG. 6, the same parts as those in FIG. 1 or FIG.

In FIG. 6, assuming that the electrical resistance of the wire portion 58 of the heat ray flow rate sensor 50 is R ₀ , the angular velocity detection processing device 30 includes a resistance element Rs ₀₁ , a wire portion 58 and a resistance element Rs ₀₁ connected in series with the wire portion 58. The resistor elements Rs ₁₁ and Rs ₁₂ are connected in parallel to the series resistor composed of In addition, the angular velocity detection processing device 30 includes a DC power source DC that supplies a voltage to a series resistor including the wire portion 58 and the resistor element Rs ₀₁ and a series resistor including the resistor elements Rs ₁₁ and Rs ₁₂ , and the wire portion 58 and the resistor element Rs. _And a differential amplifier DIF1 for amplifying a voltage ΔV between a series resistance connection node ND1 composed of ₀₁ and a series resistance connection node ND2 composed of resistance elements Rs ₁₁ and Rs ₁₂ .

When the x component of the input angular velocity ω is 0 in a state where current is supplied to the series resistor composed of the wire portion 58 and the resistor element Rs ₀₁ and the series resistor composed of the resistor elements Rs ₁₁ and Rs ₁₂ , the connection nodes ND1 and ND2 The resistance values of the resistance elements Rs ₀₁ , Rs ₁₁ , and Rs ₁₂ are set so that the voltage ΔV between them is zero. Therefore, when the x component of the input angular velocity ω is 0, the temperature of the wire portion 58 does not change and the voltage ΔV becomes 0. On the other hand, when the x component of the input angular velocity ω is given, the Coriolis force acts on the gas flow from the nozzle 22, the direction of the gas flow is deflected, and the temperature of the wire portion 58 changes.

Assuming that the velocity of the gas flow is v, the x component of the input angular velocity is ω, and the acceleration of the Coriolis force is α, the gas flow deflection amount can be approximated as follows:
α = 2 × v × ω

Here, assuming that the deflection amount in the range where the gas flow deflection amount is minute is δ and the minute time is Δt, the deflection amount can be approximated by the following equation.
δ = v · Δt × ω · Δt

When the distance from the tip of the nozzle 22 to the wire portion 58 is L, Δt is expressed by the following equation.
Δt = L / v

Therefore, the deflection amount δ of the gas flow is as follows.
δ = v · (L / v) × ω · (L / v) = ωL ² / v

  In this way, the deflection amount δ of the gas flow is proportional to the x component (component of the detection axis) of the input angular velocity ω, and the electrical resistance of the wire portion 58 that changes in temperature according to the deflection amount δ changes. The flowing current also changes. As a result, the voltage at the connection node ND1 changes, the voltage ΔV between the connection nodes ND1 and ND2 changes, and the voltage Vd is detected. If the deflection amount δ can be specified based on the voltage Vd, the input angular velocity ω (its x component) can be detected.

  According to the heat ray flow rate sensor 50 configured as described above, it is not necessary to manually create the wire portion 58 that functions as a heat ray, and the heat ray flow rate sensor 50 can be manufactured by a predetermined processing process. The cost can be reduced by improving the performance. In addition, since the wire portion 58 that functions as a heat ray is formed of a conductive layer formed on an insulating substrate, the possibility of disconnection or the like is extremely small even with a minute thin wire, and the detection is reliable with high detection accuracy. It is possible to suppress the deterioration of the property.

  Furthermore, according to the first embodiment, since the strength of the wire portion 58 is reinforced by the insulating substrate, gold (Au) having higher thermal conductivity than platinum (Pt) can be used as the metal material of the wire portion 58. become. Thereby, detection accuracy can be improved.

  Next, a method for manufacturing the hot wire flow rate sensor 50 in the first embodiment will be described.

In FIG. 7, the processing flow of the manufacturing method of the heat ray flow velocity sensor 50 in Embodiment 1 is shown.
8A to 8D are schematic explanatory diagrams of the steps in the processing flow of FIG. FIGS. 8A to 8D each show a cut surface along a cutting line shown in the top view on the left and the top view on the right. 8A to 8D, the same portions as those in FIG. 5 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  First, as a conductive layer forming step, an insulating substrate 52 such as a polyimide substrate is prepared, and gold, which is a conductive layer, is formed on the main surface of the insulating substrate 52 by using a known electrolytic plating method (step S10). As a result, as shown in FIG. 8A, gold is formed over the main surface of the insulating substrate 52. Note that gold may be formed after a layer containing a given metal material is interposed over the insulating substrate 52.

  Next, as an overall shape forming step, shape processing is performed with a UV (Ultraviolet) laser so that, for example, the shape shown in FIG. 2 is obtained when viewed from above (step S12). Thus, as shown in FIG. 8B, the outline of the outer shape is formed by the UV laser, and unnecessary portions of the insulating substrate 52 and the conductive layer 54 are cut away.

  Thereafter, as a hollow portion forming step and an electrode portion forming step, the hollow portion 56 of the insulating substrate 52 is formed by UV laser, and the groove portion 70 is formed to form the first and second electrode portions 60 and 62. Perform (step S14). As a result, as shown in FIG. 8C, the insulating substrate and the conductive layer corresponding to the hollow portion 56 are removed by the UV laser, and the conductive layer corresponding to the groove portion 70 is removed.

  And as a wire part formation process, the minute heat ray | wire of the wire part 58 is formed by focused ion beam (Focused Ion Beam: FIB) process (step S16), and a series of processes are complete | finished (end). That is, as shown in FIG. 8D, a minute width is placed from one side of the outer periphery of the hollow portion 56 so that the wire portion 58 is disposed along a part of the periphery of the opening region of the hollow portion 56. A groove portion 84 is formed between the end portion 64 and the wire portion 58 by FIB processing. As a result, the wire portion 58 can be formed as a minute heat ray, and the wire portion 58 can be configured to electrically connect the first and second electrode portions 60 and 62.

  As described above, the manufacturing method of the heat ray flow rate sensor 50 according to the first embodiment includes the hollow portion forming step of forming the hollow portion 56 in the insulating substrate 52 in which the conductive layer 54 is formed on the substrate, and the formation on the insulating substrate 52. Electrode portion forming step for forming first and second electrode portions 60 and 62 which are made of conductive layer 54 and insulated from each other, and wires for electrically connecting first and second electrode portions 60 and 62 A wire portion forming step of forming the portion 58 so as to be disposed along a part of the periphery of the opening region of the hollow portion 56. Accordingly, the thinned wire portion 58 and the first and second electrode portions 60 and 62 connected to both ends of the wire portion 58 can be formed by a very simple method.

  In the first embodiment, the hollow portion forming step forms a hollow portion 56 by irradiating a laser from above the main surface of the insulating substrate 52, and the wire portion forming step forms a focused ion beam with the main portion of the insulating substrate 52. The wire part 58 is formed by irradiating from above the surface. As described above, since the wire portion 58 is formed not by the UV laser but by FIB processing, the wire portion 58 can be formed as a fine line with a reduced width, and the detection accuracy can be improved. This is because the UV laser uses the oscillation state, so that the processed surface is uneven at a given period, while the processed surface can be flattened by FIB processing.

[Embodiment 2]
Although the heat ray flow rate sensor 50 according to the first embodiment detects only one direction (for example, the x direction) of the gas flow direction, the present invention is not limited to this. The heat ray flow velocity sensor according to the second embodiment of the present invention includes a plurality of wire portions according to the first embodiment and is arranged so that the detection axes are different from each other. ) Can be detected.

  Since the angular velocity detecting device to which the heat ray flow velocity sensor in the second embodiment is applied has the same configuration as the angular velocity detecting device in FIG. 1, detailed description thereof is omitted. In addition, the gas flow supply apparatus 20 of Embodiment 1 can be employ | adopted for the gas flow supply apparatus 20a of Embodiment 2. FIG. In the angular velocity detection processing device 30a of the second embodiment, a detection processing circuit similar to the angular velocity detection processing device 30 of the first embodiment is provided for each wire portion.

In FIG. 9, the outline | summary of a structure of the heat ray flow velocity sensor in Embodiment 2 is shown. FIG. 9 is a top view of the heat ray flow velocity sensor in the second embodiment. Note that, unlike FIG. 2, FIG. 9 shows the hollow portion at the tip as emphasized.
FIG. 10 schematically shows a cross-sectional view taken along the line BB of FIG.

  As shown in FIGS. 9 and 10, the heat ray flow velocity sensor 50a of the second embodiment is formed on the main surface of the insulating substrate 52a. A conductive layer 54a is formed on the main surface of the insulating substrate 52a, and a wire portion (sensor portion) that functions as an electrode portion or a heat ray is formed by the conductive layer 54a. The insulating substrate 52a can be a polyimide substrate, for example. The conductive layer 54a can be gold-plated, for example. Note that a layer containing another metal substance may be interposed between the main surface of the insulating substrate 52a and the conductive layer 54a.

Such a heat ray flow rate sensor 50a has a tip portion provided at a position facing the direction of gas flow when viewed from above, and this tip portion has a triangular shape. The heat ray of the heat ray flow rate sensor 50a is provided at the tip portion. When the direction that bisects the apex angle of the tip is the direction of the gas flow, the angles formed by the two hypotenuses constituting the tip with respect to the direction perpendicular to the direction of the gas flow are θ ₃ and θ ₄ . Then, it is desirable that both θ ₃ and θ ₄ have the same angle. More specifically, both θ ₃ and θ ₄ are preferably 45 degrees. By doing so, the gas flow can flow evenly on the left and right of the hot wire flow rate sensor 50a, and it is possible to suppress a decrease in detection accuracy due to the non-uniform flow of the gas flow.

  Except for the tip portion of the heat ray flow rate sensor 50a, three electrode portions that are insulated from each other are formed in a top view. Therefore, as shown in FIG. 10, groove portions 70a and 72a from which gold plating is removed are provided between two adjacent electrode portions. These electrode portions are electrically connected to both ends of a heat wire formed at the tip portion. Moreover, the voltage between these electrode parts is output to the angular velocity detection processing device 30a via the signal lines 80a, 82a and 84a.

  In FIG. 11, the outline | summary of a structure of the front-end | tip part of the heat ray flow velocity sensor 50a in Embodiment 2 is shown. FIG. 11 shows a top view of the tip of the hot-wire flow rate sensor 50a of FIG.

  As shown in FIG. 11, the heat ray flow rate sensor 50a according to the second embodiment includes an insulating substrate 52a having first and second hollow portions 150 and 152 and a conductive layer 54 formed on the insulating substrate 52a. The first to third electrode portions 160, 162, 164 and the conductive layer 54 formed on the insulating substrate 52a are arranged along a part of the periphery of the opening region of the first hollow portion 150. A first wire portion 170 that functions as a heat ray and a conductive layer 54 formed on the insulating substrate 52a, a second wire that is arranged along a part of the periphery of the opening region of the second hollow portion 152 and functions as a heat ray. Wire portion 172. The first wire part 170 electrically connects the first and second electrode parts 160 and 162. The second wire portion 172 electrically connects the second and third electrode portions 162 and 164. And it arrange | positions so that the direction (direction where the 1st wire part 170 is extended) of the 1st wire part 170 and the direction (direction where the 2nd wire part 172 is extended) of the 2nd wire part 172 cross | intersect. . That is, the first wire portion 170 and the second wire portion 172 are arranged so that the detection axes are different.

  In FIG. 11, the first end portion 180 of the tip portion that is insulated from the first wire portion 170 is provided on the insulating substrate 52 a. That is, the groove portion 182 is provided between the first end portion 180 and the first wire portion 170, and the inner wall of the first hollow portion 150 forms the side surface of the first wire portion 170. 1 wire portion 170 is thinned. In the second embodiment, a configuration in which the first end portion 180 of the tip portion is omitted may be used.

  Similarly, in FIG. 11, a second end portion 184 of a tip portion that is insulated from the second wire portion 172 is provided on the insulating substrate 52 a. That is, the groove portion 186 is provided between the second end portion 184 and the second wire portion 172, and the inner wall of the second hollow portion 152 constitutes the side surface of the second wire portion 172. Thinning of the second wire portion 172 is realized. In the second embodiment, the configuration in which the second end 184 at the tip is omitted may be used.

  FIG. 12 schematically shows a perspective view of the heat ray flow rate sensor 50a of FIG. 12, the same parts as those in FIG. 11 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

  As shown in FIG. 12, the first wire portion 170 is arranged in a direction that intersects the direction of the gas flow from the gas flow supply device 20a (the direction of the detection axis). The first and second electrode portions 160 and 162 are connected to the angular velocity detection processing device 30a via a signal line (not shown), and a current is constantly supplied via the signal line. The wire portion 170 generates heat due to its electrical resistance. Therefore, the gas flow is deflected by the input angular velocity ω and the detection component vx in the direction of the gas flow changes, and the temperature of the first wire portion 170 changes according to the detection component vx. Therefore, the electrical resistance of the first wire portion 170 changes corresponding to the changed temperature. The angular velocity detection processing device 30 can detect this change in electrical resistance as a current change (voltage change) in the first wire portion 170.

  The second wire portion 172 is arranged in a direction that intersects the direction of the gas flow from the gas flow supply device 20a (the direction of the detection axis). The second and third electrode portions 162 and 164 are connected to the angular velocity detection processing device 30a via a signal line (not shown), and a current is constantly supplied via the signal line. The wire portion 172 generates heat due to its electrical resistance. Therefore, the gas flow is deflected by the input angular velocity ω and the detection component vy in the direction of the gas flow changes, and the temperature of the second wire portion 172 changes according to the detection component vy. Therefore, the electrical resistance of the second wire portion 172 changes corresponding to the changed temperature. The angular velocity detection processing device 30 can detect this change in electrical resistance as a current change (voltage change) in the second wire portion 172, and can detect an input angular velocity ω corresponding to this change.

  As described above, the heat ray flow velocity sensor 50a according to the second embodiment detects the component vx that constitutes the direction of the gas flow with the direction perpendicular to the direction in which the first wire portion 170 extends as the first detection axis, and the second wire The component vy constituting the direction of gas flow can be detected with the direction perpendicular to the direction in which the portion 172 extends as the second detection axis. The angular velocity detection processing device 30a can obtain the input angular velocity ω based on the detected components vx and vy.

  In FIG. 13, an example of the circuit diagram of the structural example of the angular velocity detection processing apparatus 30a of Embodiment 2 is shown. In FIG. 13, the same parts as those in FIG. 1 or FIG.

In FIG. 13, when the electric resistance of the first wire portion 170 of the heat ray flow rate sensor 50a is R ₀ a, the angular velocity detection processing device 30a includes a resistance element Rs ₀₁ a connected in series with the first wire portion 170, It has resistance elements Rs ₁₁ a and Rs ₁₂ a connected in parallel with the series resistance composed of the first wire portion 170 and the resistance element Rs ₀₁ a. The angular velocity detecting apparatus 30a includes a first wire 170 and the resistor _{Rs 01} a series resistor and the resistor _{Rs 11} consisting of a, _{Rs 12} series resistor and a DC power source DC1 to supply a voltage to the consisting of a, a differential amplifier DIF1a for amplifying the first wire 170 and the resistor _{Rs 01} connected in series resistance consisting of a node ND1a the resistive element _{Rs 11} a, the voltage ΔVx between the connection node ND2a series resistor consisting of _{Rs 12} a Including.

When the x component of the input angular velocity ω is 0 in a state where current is supplied to the series resistance composed of the first wire portion 170 and the resistance element Rs ₀₁ a and the series resistance composed of the resistance elements Rs ₁₁ a and Rs ₁₂ a The resistance values of the resistance elements Rs ₀₁ a, Rs ₁₁ a, and Rs ₁₂ a are set so that the voltage ΔVx between the connection nodes ND1a and ND2a becomes zero. Therefore, when the x component of the input angular velocity ω is 0, the temperature of the first wire portion 170 does not change and the voltage ΔVx becomes 0. On the other hand, when the input angular velocity ω is given, the Coriolis force acts on the gas flow from the nozzle 22, the direction of the gas flow is deflected, and the temperature of the first wire portion 170 changes.

  The deflection amount δx of the x component of the gas flow obtained in the same manner as in the first embodiment is proportional to the x component of the input angular velocity ω, and the electrical resistance of the first wire portion 170 that changes in temperature according to the deflection amount δx changes. The current flowing through the first wire portion 170 also changes. As a result, the voltage at the connection node ND1a changes, the voltage ΔVx between the connection nodes ND1a and ND2a changes, and the voltage Vdx is detected. If the deflection amount δx can be specified based on the voltage Vdx, the x component of the input angular velocity ω can be detected.

When the electric resistance of the second wire portion 172 of the heat ray flow rate sensor 50a is R ₁ a, the angular velocity detection processing device 30a includes a resistance element Rs ₂₁ a connected in series with the second wire portion 172, the second wire. It has resistance elements Rs ₃₁ a and Rs ₃₂ a connected in parallel with a series resistor composed of the portion 172 and the resistance element Rs ₂₁ a. The angular velocity detecting apparatus 30a includes a second wire portion 172 and the resistor _{Rs 21} series resistor and a resistor element made of a _{Rs 31} a, series resistor and the DC power source DC2 to supply a voltage to the consisting of _{Rs 32} a, a differential amplifier DIF2a for amplifying the series resistance of the connection node ND3a of two wire portions 172 and the resistor _{Rs 21} a resistive element _{Rs 31} a, the voltage ΔVy between the connection node ND4a series resistor consisting of _{Rs 32} a Including.

When the y component of the input angular velocity ω is 0 in a state where a current is supplied to the series resistance composed of the second wire portion 172 and the resistance element Rs ₂₁ a and the series resistance composed of the resistance elements Rs ₃₁ a and Rs ₃₂ a The resistance values of the resistance elements Rs ₂₁ a, Rs ₃₁ a, and Rs ₃₂ a are set so that the voltage ΔVy between the connection nodes ND3a and ND4a becomes zero. Therefore, when the y component of the input angular velocity ω is 0, there is no temperature change of the second wire portion 172, and the voltage ΔVy becomes 0. On the other hand, when the input angular velocity ω is given, Coriolis force acts on the gas flow from the nozzle 22, the direction of the gas flow is deflected, and the temperature of the second wire portion 172 changes.

  The y component deflection amount δy of the gas flow obtained in the same manner as in the first embodiment is proportional to the y component of the input angular velocity ω, and the electrical resistance of the second wire portion 172 that changes in temperature according to the deflection amount δy changes. The current flowing through the second wire portion 172 also changes. As a result, the voltage of the connection node ND3a changes, the voltage ΔVy between the connection nodes ND3a and ND4a changes, and the voltage Vdy is detected. If the deflection amount δy can be specified based on the voltage Vdy, the y component of the input angular velocity ω can be detected.

  Then, the angular velocity detection processing device 30a can obtain the voltages Vdx and Vdy, and can obtain the input angular velocity ω using the voltages Vdx and Vdy.

  According to the heat ray flow rate sensor 50a configured as described above, it is not necessary to manually create the first and second wire portions 170 and 172 that function as heat rays, and the heat ray flow rate sensor 50a can be manufactured by a predetermined processing. Therefore, the yield can be improved, the productivity can be increased, and the cost can be reduced. In addition, since the first and second wire portions 170 and 172 functioning as heat rays are composed of a conductive layer formed on an insulating substrate, there is a high possibility of disconnection or the like even with a minute thin wire. It becomes small and it becomes possible to suppress the fall of reliability with high detection accuracy.

  Also, since each component of the input angular velocity ω can be obtained for the two detection axes, the input angular velocity ω can be detected with higher accuracy than in the first embodiment.

  Furthermore, according to the second embodiment, since the strength of the first and second wire portions 170 and 172 is reinforced by the insulating substrate, the metal material of the first and second wire portions 170 and 172 conducts heat more than platinum. Gold with a high rate can be used. Thereby, detection accuracy can be improved.

  Next, a manufacturing method of the heat ray flow rate sensor 50a in the second embodiment will be described. Since the manufacturing method of the heat ray flow velocity sensor 50a in the second embodiment is substantially the same as the processing flow of the manufacturing method of the heat ray flow velocity sensor 50 in the first embodiment shown in FIG. 7, the illustration of the processing flow is omitted.

  14 (A) to 14 (D) are schematic explanatory diagrams of steps in the process flow of the method for manufacturing the heat ray flow velocity sensor 50a of the second embodiment. FIGS. 14A to 14D each show a cut surface along a cutting line shown in the top view on the left and the top view on the right. 14A to 14D, the same portions as those in FIG. 12 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  First, as a conductive layer forming step, an insulating substrate 52a such as a polyimide substrate is prepared, and gold, which is a conductive layer, is formed on the main surface of the insulating substrate 52a using a known electrolytic plating method (step S10 in FIG. 7). ). As a result, as shown in FIG. 14A, gold is formed over the main surface of the insulating substrate 52a. Note that gold may be formed after a layer containing a given metal material is interposed over the insulating substrate 52a.

  Next, as an overall shape forming step, shape processing is performed with a UV (Ultraviolet) laser so that, for example, the shape shown in FIG. 9 is obtained when viewed from above (step S12 in FIG. 7). Thus, as shown in FIG. 14B, the outline of the outer shape is formed by the UV laser, and unnecessary portions of the insulating substrate 52a and the conductive layer 54a are cut off.

  Thereafter, as the hollow portion forming step and the electrode portion forming step, the first and second hollow portions 150 and 152 of the insulating substrate 52a are formed by the UV laser, and the groove portions 70a and 72a are formed. The electrode portions 160, 162, and 164 are processed and formed (step S14 in FIG. 7). As a result, as shown in FIG. 14C, the insulating substrate and the conductive layer corresponding to the first and second hollow portions 150 and 152 are removed by the UV laser, and the conductivity corresponding to the groove portions 70a and 72a is removed. The layer is removed.

  And as a wire part formation process, the minute heat ray of the 1st and 2nd wire parts 170 and 172 is formed by FIB processing (Step S16 of Drawing 7), and a series of processings are ended (end). That is, as shown in FIG. 14D, the outer periphery of the first hollow portion 150 is arranged so that the first wire portion 170 is disposed along a part of the periphery of the opening region of the first hollow portion 150. A groove 182 is formed between the first end part 180 and the first wire part 170 by FIB processing with a small width from one side. As a result, the first wire portion 170 can be formed as a minute heat ray, and the first wire portion 170 can be configured to electrically connect the first and second electrode portions 160 and 162.

  Similarly, in the wire portion forming step of the second embodiment, as shown in FIG. 14D, the second wire portion 172 is disposed along a part of the periphery of the opening region of the second hollow portion 152. As described above, the groove portion 186 is formed between the second end portion 184 and the second wire portion 172 by FIB processing with a minute width from one side of the outer periphery of the second hollow portion 152. As a result, the second wire portion 172 can be formed as a minute heat ray, and the second wire portion 172 can be configured to electrically connect the second and third electrode portions 162 and 164.

  In the wire portion forming step of the second embodiment, the first and second wire portions 170 and 172 are formed so that their directions intersect each other.

  As described above, the manufacturing method of the heat ray flow rate sensor 50a according to the second embodiment includes a hollow part forming step of forming the first and second hollow parts 56a in the insulating substrate 52a in which the conductive layer 54a is formed on the substrate, An electrode portion forming step of forming first to third electrode portions 160, 162, 164 which are made of a conductive layer 54a formed on the insulating substrate 52a and are insulated from each other; and first and second electrode portions 160, The first wire part 170 for electrically connecting the 162 is formed so as to be arranged along a part of the periphery of the opening region of the first hollow part 150 and the second and third electrode parts 162 and 164 are formed. A wire portion forming step of forming a second wire portion 172 that electrically connects the second hollow portion 152 so as to be disposed along a part of the periphery of the opening region of the second hollow portion 152. Then, in the wire part forming step, the first wire part 170 and the second wire part 172 are formed so that the direction intersects. Thereby, the thinned first and second wire portions 170 and 172 and the first to third wire portions 170 and 172 connected to both ends of the first and second wire portions 170 and 172 in a very simple manner. The electrode portions 160, 162, and 164 can be formed.

  In the second embodiment, the hollow portion forming step forms the first and second hollow portions 150 and 152 by irradiating a laser from above the main surface of the insulating substrate 52a, and the wire portion forming step is focused. The first and second wire portions 170 and 172 are formed by irradiating the ion beam from above the main surface of the insulating substrate 52a. As described above, since the first and second wire portions 170 and 172 are formed by FIB processing instead of the UV laser, the first and second wire portions 170 and 172 are formed as thin lines with a reduced width. The detection accuracy can be improved. This is because the UV laser uses the oscillation state, so that the processed surface is uneven at a given period, while the processed surface can be flattened by FIB processing.

[Embodiment 3]
In the first or second embodiment, the wire portion and the electrode portion are formed on the main surface of the insulating substrate and the detection shaft is provided in one or two directions. However, the present invention is not limited to this. Absent. In Embodiment 3 according to the present invention, the first and second wire portions and the first to third electrode portions of Embodiment 2 are formed on both surfaces of the insulating substrate.

  The angular velocity detection device to which the heat ray flow velocity sensor in the third embodiment is applied has the same configuration as that of the angular velocity detection device in FIG. In addition, the gas flow supply apparatus 20 of Embodiment 1 can be employ | adopted for the gas flow supply apparatus 20b of Embodiment 3. FIG. In the angular velocity detection processing device 30b of the third embodiment, a detection processing circuit similar to the angular velocity detection processing device 30 of the first embodiment is provided for each wire portion.

  15A and 15B show an outline of the configuration of the heat ray flow rate sensor in the third embodiment. FIG. 15A shows a top view of the heat ray flow velocity sensor in the third embodiment. FIG. 15B schematically shows a cross-sectional view taken along the line CC of FIG. Note that, unlike FIG. 2, FIG. 15A illustrates the hollow portion at the tip portion so as to be emphasized.

  The configuration of one of the main surfaces of the insulating substrate of the heat ray flow velocity sensor 50b in the third embodiment is the same as that of the heat ray flow velocity sensor 50a in the second embodiment shown in FIG. The same reference numerals will be given, and description thereof will be omitted as appropriate. That is, the heat ray flow velocity sensor 50b of the third embodiment is formed on the first main surface of the insulating substrate 52a and the second main surface on the back surface of the first main surface. The first and second wire portions 170 and 172 and the first to third electrode portions 160, 162, and 164 are formed on the first main surface of the insulating substrate 52a, similarly to the heat ray flow velocity sensor 50a of the second embodiment. Is done.

  More specifically, a conductive layer 54a is formed on the first main surface of the insulating substrate 52a, and a wire portion (sensor portion) that functions as an electrode portion or a heat ray is formed by the conductive layer 54a. The insulating substrate 52a can be a polyimide substrate, for example. The conductive layer 54a can be gold-plated, for example. Note that a layer containing another metal substance may be interposed between the first main surface of the insulating substrate 52a and the conductive layer 54a. A conductive layer 54b is formed on the second main surface of the insulating substrate 52a, and a wire portion (sensor portion) that functions as an electrode portion or a heat ray is formed by the conductive layer 54b. The conductive layer 54b can be gold-plated, for example. Note that a layer containing another metal substance may be interposed between the second main surface of the insulating substrate 52a and the conductive layer 54b.

Such a heat ray flow rate sensor 50b has a tip provided at a position facing the direction of gas flow when viewed from above, and the tip has a triangular shape. The heat ray of the heat ray flow rate sensor 50b is provided at the tip portion. When the direction that bisects the apex angle of the tip is the direction of the gas flow, the angles formed by the two hypotenuses constituting the tip with respect to the direction perpendicular to the direction of the gas flow are θ ₅ and θ ₆ . Then, it is desirable that both θ ₅ and θ ₆ have the same angle. More specifically, both θ ₅ and θ ₆ are preferably 45 degrees. By doing so, the gas flow can flow evenly on the left and right of the hot wire flow rate sensor 50b, and it is possible to suppress a decrease in detection accuracy due to the non-uniform flow of the gas flow.

  Except for the front end portion of the heat ray flow rate sensor 50a, three electrode portions insulated from each other are formed on the first and second main surfaces in a top view. Accordingly, as shown in FIG. 15A, grooves 70a and 72a from which gold plating is removed are provided between two adjacent electrode portions on the first main surface, and adjacent to each other on the second main surface. Between the two electrode portions that match, groove portions 70b and 72b from which gold plating has been removed are provided. These electrode portions are electrically connected to both ends of a heat wire formed at the tip portion. Moreover, the voltage between these electrode parts is output to the angular velocity detection processing apparatus 30b via a signal line.

  FIGS. 16A and 16B show an outline of the configuration of the heat ray flow rate sensor 50b in the third embodiment. FIG. 16A illustrates a top view of the insulating substrate 52a as viewed from above the first main surface. FIG. 16B is a top view of the insulating substrate 52a as viewed from above the second main surface.

  Since the structure of the first main surface of the insulating substrate 52a is the same as that of the second embodiment, the same reference numerals in FIG. 16A denote the same parts as in FIG. In FIG. 16B, the same portions as those in FIG. 16A are denoted by the same reference numerals and will be described as appropriate.

  As shown in FIG. 16A, the heat ray flow velocity sensor 50a in the third embodiment includes an insulating substrate 52a having first and second hollow portions 150 and 152, and a conductive layer 54a formed on the insulating substrate 52a. The first to third electrode portions 160, 162, 164 that are insulated from each other, and the conductive layer 54 formed on the insulating substrate 52a, along a part of the periphery of the opening region of the first hollow portion 150. 1st wire part 170 which is arranged and functions as a heat ray and conductive layer 54a formed on insulating substrate 52a, and is arranged along a part of the circumference of the opening region of second hollow part 152 and functions as a heat ray. And a second wire portion 172. The first wire part 170 electrically connects the first and second electrode parts 160 and 162. The second wire portion 172 electrically connects the second and third electrode portions 162 and 164. And it arrange | positions so that the direction (direction where the 1st wire part 170 is extended) of the 1st wire part 170 and the direction (direction where the 2nd wire part 172 is extended) of the 2nd wire part 172 cross | intersect. . That is, the first wire portion 170 and the second wire portion 172 are arranged so that the detection axes are different.

  Further, the heat ray flow rate sensor 50b includes fourth to sixth electrode portions 260, which are made of a conductive layer 54b formed on the second main surface of the back surface of the first main surface of the insulating substrate 52a and are insulated from each other. 262 and 264, and a third wire portion 270 that is formed along a part of the periphery of the opening region of the first hollow portion 150, which is composed of the conductive layer 54b formed on the second main surface of the insulating substrate 52a. And a fourth wire portion 272 made of a conductive layer 54b formed on the second main surface of the insulating substrate 52a and disposed along a part of the periphery of the opening region of the second hollow portion 152. . The third wire portion 270 electrically connects the fourth and fifth electrode portions 260 and 262. The fourth wire portion 272 electrically connects the fifth and sixth electrode portions 262 and 264. The direction of the third wire portion 270 (the direction in which the third wire portion 270 extends) and the direction of the fourth wire portion 272 (the direction in which the fourth wire portion 272 extends) are arranged to intersect each other. . That is, the third wire portion 270 and the fourth wire portion 272 are arranged so that the detection axes are different.

  Further, in FIG. 16A, a first end portion 180 of a tip portion that is insulated from the first wire portion 170 is provided on the insulating substrate 52a. That is, the groove portion 182 is provided between the first end portion 180 and the first wire portion 170, and the inner wall of the first hollow portion 150 forms the side surface of the first wire portion 170. 1 wire portion 170 is thinned. In the third embodiment, a configuration in which the first end portion 180 at the distal end portion is omitted may be employed.

  Similarly, in FIG. 16A, the second end portion 184 of the distal end portion that is insulated from the second wire portion 172 is provided on the insulating substrate 52a. That is, the groove portion 186 is provided between the second end portion 184 and the second wire portion 172, and the inner wall of the second hollow portion 152 constitutes the side surface of the second wire portion 172. Thinning of the second wire portion 172 is realized. In the third embodiment, a configuration in which the second end 184 at the tip is omitted may be used.

  Further, in FIG. 16B, a third end portion 280 of a tip end portion insulated from the third wire portion 270 is provided on the insulating substrate 52a. That is, the groove portion 282 is provided between the third end portion 280 and the third wire portion 270, and the inner wall of the first hollow portion 150 forms the side surface of the third wire portion 270. The thinning of the third wire portion 270 is realized. In the third embodiment, the configuration in which the third end portion 280 of the distal end portion is omitted may be used.

  Similarly, in FIG. 16B, a fourth end portion 284 of a tip end portion insulated from the fourth wire portion 272 is provided on the insulating substrate 52a. That is, the groove portion 286 is provided between the fourth end portion 284 and the fourth wire portion 272, and the inner wall of the second hollow portion 152 forms the side surface of the fourth wire portion 272, thereby The thinning of the four wire portions 272 is realized. In the third embodiment, a configuration in which the second end 284 at the tip is omitted may be used.

  In the heat ray flow velocity sensor 50b having such a configuration, the fourth to sixth electrode portions 260, 262, and 264 are connected to the angular velocity detection processing device 30b, similarly to the first to third electrode portions 160, 162, and 164. In the state where current is passed through the third and fourth wire portions 270 and 272, a change in electrical resistance of the third and fourth wire portions 270 and 272 is detected as a voltage change with the same configuration as in FIG. .

  According to the heat ray flow rate sensor 50b configured as described above, it is not necessary to manually create the first to fourth wire portions 170, 172, 270, and 272 that function as heat rays, and the heat ray flow rate sensor can be obtained by a predetermined processing. Since 50b can be manufactured, yield can be improved, productivity can be increased, and cost can be reduced. In addition, since the first to fourth wire portions 170, 172, 270, and 272 that function as heat rays are composed of a conductive layer formed on an insulating substrate, disconnection or the like is performed even with a minute thin wire. The possibility becomes extremely small, and it becomes possible to suppress a decrease in reliability with high detection accuracy.

  Further, since each component of the input angular velocity ω can be obtained for two sets of two detection axes, the input angular velocity ω can be detected in three dimensions with higher accuracy than in the second embodiment.

  Furthermore, according to the third embodiment, since the strength of the first to fourth wire portions 170, 172, 270, 272 is reinforced by the insulating substrate, the first to fourth wire portions 170, 172, 270, 272 are strengthened. As the metal material, gold having higher thermal conductivity than platinum can be used. Thereby, detection accuracy can be improved.

  Moreover, the hot-wire flow rate sensor 50b in Embodiment 3 can be manufactured by the same method as the manufacturing method of the main surface of the hot-wire flow rate sensor 50a of Embodiment 2. That is, the first main surface of the insulating substrate 52a constituting the heat ray flow velocity sensor 50b is manufactured by the same flow as that of FIGS. 7 and 14A to 14D, and the insulation constituting the heat ray flow velocity sensor 50b is produced. What is necessary is just to manufacture about the 2nd main surface of the board | substrate 52a with the flow similar to FIG.7 and FIG.14 (A)-FIG.14 (D).

  Therefore, the manufacturing method of the heat ray flow rate sensor 50b in the third embodiment includes the first to third electrode portions 160 and 162 which are made of the conductive layer 54a formed on the first main surface of the insulating substrate 52a and are insulated from each other. 1st main surface electrode part formation process which forms H.164, and the 1st wire part 170 which electrically connects the 1st and 2nd electrode parts 160 and 162 to the 1st hollow part of the insulated substrate 52a The second wire portion 172 for electrically connecting the second and third electrode portions 162 and 164 is formed along a part of the periphery of the 150 open region, and the second wire portion 172 of the insulating substrate 52a is electrically connected. And a first main surface wire portion forming step that is formed so as to be arranged along a part of the periphery of the opening region of the second hollow portion 152.

  Furthermore, the manufacturing method of the heat ray flow rate sensor 50b in the third embodiment includes the conductive layers 54b formed on the second main surface of the back surface of the first main surface of the insulating substrate 52a and insulated from each other. The second main surface electrode portion forming step for forming the sixth electrode portions 260, 262, 264, and the third main surface electrically connecting the fourth and fifth electrode portions 260, 262 on the second main surface. The wire portion 270 is formed so as to be disposed along a part of the periphery of the opening region of the first hollow portion 150 of the insulating substrate 52a, and the fifth and sixth electrode portions 262 and 264 are electrically connected. A second main surface wire portion forming step for forming the fourth wire portion 272 to be connected so as to be arranged along a part of the periphery of the opening region of the second hollow portion 152 of the insulating substrate 52a. Can do.

  Then, in the first and second main surface wire portion forming steps, the first to fourth wire portions 170 and 172 are irradiated by irradiating the focused ion beam from above the first and second main surfaces of the insulating substrate 52a. 270, 272 are formed. In the first main surface wire part forming step, the first wire part 170 and the second wire part 172 are formed so that the direction intersects. Further, in the second main surface wire portion forming step, the third wire portion 270 and the fourth wire portion 272 are formed so as to intersect with each other.

  According to the manufacturing method as described above, the first and second wire portions 170 and 172 that are thinned and the both ends of the first and second wire portions 170 and 172 are connected in a very simple manner. The first to third electrode portions 160, 162, and 164 can be formed. Further, the thinned third and fourth wire portions 270 and 272, and the fourth to sixth electrode portions 260, 262, and 264 connected to both ends of the third and fourth wire portions 270 and 272, and Can be formed.

  As mentioned above, although the hot-wire flow velocity sensor of the present invention and the manufacturing method thereof have been described based on each of the above-described embodiments, the present invention is not limited to this, and can be implemented without departing from the gist thereof. For example, the following modifications are possible.

  (1) In the third embodiment, it has been described that the same wire portion and electrode portion as those in the second embodiment are formed on the back surface of the main surface of the insulating substrate, but the present invention is not limited to this. Wire portions and electrode portions similar to those of the first embodiment may be formed on the back surface of the main surface of the insulating substrate.

  (2) In each of the above embodiments, the heat ray flow rate sensor is described as being applied to the angular velocity detection device, but the present invention is not limited to this.

  (3) In each of the above embodiments, the tip portion of the heat ray flow velocity sensor has been described as having a trapezoidal or triangular shape, but the present invention is not limited to this.

FIG. 3 is a perspective view of the outline of the configuration of the angular velocity detection device including the heat ray flow velocity sensor of the first embodiment. The figure which shows the outline | summary of a structure of the heat ray flow velocity sensor in Embodiment 1. FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. The figure which shows the outline | summary of a structure of the front-end | tip part of the heat ray flow velocity sensor in Embodiment 1. FIG. The perspective view of the heat ray flow rate sensor of FIG. The figure which shows an example of the circuit diagram of the angular velocity detection processing apparatus of FIG. FIG. 2 is a flowchart of a method for manufacturing a heat ray flow rate sensor in the first embodiment. FIG. 8A to FIG. 8D are schematic explanatory diagrams of the steps in FIG. The figure which shows the outline | summary of a structure of the heat ray flow rate sensor in Embodiment 2. FIG. BB sectional drawing of FIG. The figure which shows the outline | summary of a structure of the front-end | tip part of the heat ray flow velocity sensor in Embodiment 2. FIG. The perspective view of the heat ray flow rate sensor of FIG. FIG. 6 is a diagram illustrating an example of a circuit diagram of an angular velocity detection processing apparatus according to a second embodiment. 14A to 14D are schematic explanatory diagrams of the steps in FIG. FIG. 15A and FIG. 15B are diagrams showing an outline of the configuration of the heat ray flow rate sensor in the third embodiment. FIGS. 16A and 16B are diagrams showing an outline of a configuration of a heat ray flow velocity sensor in the third embodiment. The figure which shows the fundamental structure of the conventional heat ray flow velocity sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Angular velocity detection apparatus, 12 ... Gas flow path pipe, 20 ... Gas flow supply apparatus,
22 ... Nozzle 30, 30a ... Angular velocity detection processing device,
50, 50a, 50b ... Heat ray flow rate sensor, 52, 52a ... Insulating substrate,
54, 54a, 54b ... conductive layer, 56 ... hollow part, 58 ... wire part,
60, 160 ... 1st electrode part, 62, 162 ... 2nd electrode part, 64 ... End part,
70, 70a, 70b, 72a, 72b, 84, 182, 184, 282, 286 ... groove, 80, 80a, 82, 82a, 84a ... signal line, 100 ... substrate,
102, 104, 106, 108 ... electrode, 110, 112 ... hot wire, 114 ... gas flow,
150 ... 1st hollow part, 152 ... 2nd hollow part, 170 ... 1st wire part,
172 ... the second wire part, 164 ... the third electrode part, 180 ... the first end part,
184 ... second end, 260 ... fourth electrode, 262 ... fifth electrode,
264 ... sixth electrode part, 270 ... third wire part, 272 ... fourth wire part,
280 ... third end, 284 ... fourth end

Claims (12)

An insulating substrate having a hollow portion;
A first electrode portion and a second electrode portion which are made of a conductive layer formed on the insulating substrate and are insulated from each other;
A conductive layer formed on the insulating substrate, disposed along a part of the periphery of the open area of the hollow portion, and a wire portion for electrically connecting the first and second electrode portions; A hot-wire flow rate sensor comprising: An insulating substrate having first and second hollow portions;
A first to a third electrode part comprising a conductive layer formed on the insulating substrate and insulated from each other;
A conductive layer formed on the insulating substrate, disposed along a part of the periphery of the opening region of the first hollow portion, and electrically connecting the first and second electrode portions; 1 wire part;
A conductive layer formed on the insulating substrate, disposed along a part of the periphery of the opening region of the second hollow portion, and electrically connecting the second and third electrode portions; Two wire portions,
A heat ray flow rate sensor, wherein the direction of the first wire part and the direction of the second wire part intersect each other on the main surface of the insulating substrate. An insulating substrate having first and second hollow portions;
A first to a third electrode part which are made of a conductive layer formed on the first main surface of the insulating substrate and are insulated from each other;
The first and second electrode portions are made of a conductive layer formed on the first main surface of the insulating substrate, and are arranged along a part of the periphery of the opening region of the first hollow portion. A first wire portion for electrically connecting
The second and third electrode portions are made of a conductive layer formed on the first main surface of the insulating substrate and are arranged along a part of the periphery of the opening region of the second hollow portion. A second wire portion for electrically connecting
4th to 6th electrode parts, which are made of a conductive layer formed on the second main surface of the back surface of the first main surface of the insulating substrate and are insulated from each other;
4th and 5th electrode part which consists of a conductive layer formed on the said 2nd main surface of the said insulated substrate, and is arrange | positioned along a part of circumference | surroundings of the opening area | region of the said 1st hollow part. A third wire portion for electrically connecting
The fifth and sixth electrode portions are made of a conductive layer formed on the second main surface of the insulating substrate, and are arranged along a part of the periphery of the opening region of the second hollow portion. And a fourth wire part for electrically connecting
In the first main surface of the insulating substrate, the direction of the first wire portion and the direction of the second wire portion intersect each other,
The hot-wire flow rate sensor, wherein the direction of the third wire portion and the direction of the fourth wire portion intersect with each other on the second main surface of the insulating substrate. In any one of Claims 1 thru | or 3,
The heat ray flow rate sensor, wherein the insulating substrate is a polyimide substrate. In any one of Claims 1 thru | or 4,
A heat ray flow rate sensor, wherein gold is used to form the conductive layer. A hollow part forming step of forming a hollow part in an insulating substrate having a conductive layer formed on the substrate;
An electrode part forming step of forming first and second electrode parts made of a conductive layer formed on the insulating substrate and insulated from each other;
And a wire portion forming step of forming a wire portion for electrically connecting the first and second electrode portions so as to be disposed along a part of the periphery of the opening region of the hollow portion. Manufacturing method of a heat ray flow velocity sensor. A hollow portion forming step of forming first and second hollow portions in an insulating substrate having a conductive layer formed on the substrate;
An electrode part forming step of forming first to third electrode parts made of a conductive layer and insulated from each other on the insulating substrate;
A first wire portion for electrically connecting the first and second electrode portions is formed on the insulating substrate so as to be disposed along a part of the periphery of the opening region of the first hollow portion. And forming a second wire portion that electrically connects the second and third electrode portions so as to be disposed along a part of the periphery of the opening region of the second hollow portion. Forming process,
The method of manufacturing a hot wire flow rate sensor, wherein the wire part forming step is formed so that the direction of the first wire part and the direction of the second wire part intersect each other. In claim 6 or 7,
The hollow part forming step forms a hollow part by irradiating a laser from above the main surface of the insulating substrate,
In the wire part forming step, the wire part is formed by irradiating a focused ion beam from above the main surface of the insulating substrate. A first main surface electrode part forming step of forming first to third electrode parts made of a conductive layer and insulated from each other on the first main surface of the insulating substrate;
On the first main surface, a first wire portion that electrically connects the first and second electrode portions is disposed along a part of the periphery of the opening region of the first hollow portion of the insulating substrate. And the second wire portion that electrically connects the second and third electrode portions is disposed along a part of the periphery of the opening region of the second hollow portion of the insulating substrate. A first main surface wire part forming step to be formed,
A second main surface electrode portion forming step of forming fourth to sixth electrode portions made of a conductive layer on the second main surface on the back surface of the first main surface of the insulating substrate; ,
On the second main surface, a third wire portion that electrically connects the fourth and fifth electrode portions is disposed along a part of the periphery of the opening region of the first hollow portion of the insulating substrate. And a fourth wire portion that electrically connects the fifth and sixth electrode portions is disposed along a part of the periphery of the opening region of the second hollow portion of the insulating substrate. And a second main surface wire portion forming step that is formed as described above. In claim 9,
In the first and second main surface wire portion forming steps, a wire portion is formed by irradiating a focused ion beam from above the first and second main surfaces of the insulating substrate. Sensor manufacturing method. In any of claims 6 to 10,
The method for manufacturing a heat ray flow rate sensor, wherein the insulating substrate is a polyimide substrate. In any of claims 6 to 11,
A method of manufacturing a heat ray flow rate sensor, wherein gold is used to form the conductive layer.

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