JP2009152638A - Component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the productivity when mounting components on boards, to eliminate stop of the whole of production lines caused by the partial fault of the production lines, and to simplify the production management required when mounting components. <P>SOLUTION: Component pick-up heads 43a, 43b pick up components from component feeding devices 45a, 45b, and mount the components on boards Sa, Sb carried-in respectively by two board carrying devices 10a, 10b. A component carrying and mounting device mounts concurrently or alternately the components on two boards carried-in by the two board devices. In the case of the two component pick-up heads, when one board is in the course of its carrying or when the board carrying device for carrying the one board is in the course of altering its width, the component pick-up head for mounting components on the one board so assists the component picking-up head for mounting components on the other board as to mount components on the other board. Either of the board carrying devices can be used as a bypass conveyer or a return conveyer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a component mounting equipment for mounting electronic components on a substrate.

This type of conventional component mounting apparatus mounts components supplied from a component supply apparatus on a single board carried by a single board transport apparatus by a single component transfer apparatus. Parts were mounted on each sheet .

Thus, the component mounting equipment of the prior art is to perform the component mounting for each sheet substrate, but transferring the number of components per unit time ho Isuzu is constant, also the substrate by the substrate transfer apparatus Since the mounting of components is interrupted during transportation, there has been a limit to improving the productivity of the board .

The invention, together with each providing two substrate transfer apparatus which performs loading and unloading of the substrate to the component mounting apparatus, and aims to solve such problems by carrying out the appropriate control.

In order to solve the above-described problems, the structural features of the invention described in claim 1 are that two board transfer apparatuses each transfer and position a board to a component mounting position, and the two board transfer apparatuses. Two component supply devices that are provided outside and supply a plurality of types of components to be mounted on the substrate, and a pair of fixed rails that are supported by a base and arranged parallel to each other on the upper side of the two substrate transfer devices And two head moving rails that are arranged orthogonal to the pair of fixed rails and whose both ends are movably supported by the pair of fixed rails and are moved in the substrate transport direction by a motor, by liftable suction nozzle is movably supported along the head moving rail by respective head moving rail motor to pick up the components is provided with two component picking head respectively provided, the That.

Structural feature of the invention according to Claim 2 resides in that in Claim 1, each component mounting position in the two substrate transport devices Ru der that were different from one another so as to separate the transport direction of the substrate.

In the invention according to claim 1 having the structure described above, since implementing hand portion products to two substrate carried by the two substrate transport device by the component transfer device, component mounting for each substrate In addition , for example, by shifting the timing of transporting each board by the two board transport devices, components are mounted on the other board while the board is being transported. a manner, it is possible to avoid the interruption of the component mounting by the transport of the substrate, transferring the number of components per unit time Ru can improve the productivity of the substrate be the same.

In the invention according to claim 2 configured as described above, the component mounting positions in the two substrate transfer apparatuses are different from each other so as to be separated from each other in the substrate transfer direction. two component picking head is gets rid may interfere with each other, to improve the efficiency of the component mounting for the substrates, also it is possible to simplify the program for controlling the operation of the component mounting apparatus.

1 is a plan view showing a schematic structure of a component mounting apparatus according to a first embodiment of the present invention. The expanded sectional view of the 1st and 2nd board | substrate conveyance apparatus along the 2-2 line of FIG. 3-3 sectional drawing of FIG. The block diagram which shows the control system of the component mounting apparatus shown in FIG. The schematic plan view explaining the action | operation of the reference example of a component mounting apparatus . The schematic plan view explaining the action | operation of the reference example of a component mounting apparatus . The schematic plan view explaining the action | operation of the reference example of a component mounting apparatus . The figure which shows the interference danger area | region where there exists a danger that the 1st, 2nd component extraction head in the 1st Embodiment of this invention may interfere. The schematic plan view explaining the action | operation of the 2nd Embodiment of this invention. The time chart explaining the action | operation of the 3rd Embodiment of this invention. The time chart explaining the action | operation of the 4th Embodiment of this invention. The schematic plan view explaining the action | operation of the 4th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view which shows the 6th Embodiment of this invention. The figure explaining the trial mounting state in the one-side production of the 7th Embodiment of this invention. The figure explaining the trial mounting state in the both-sides production of the 7th Embodiment of this invention. The schematic plan view which shows the 8th Embodiment of this invention. The schematic plan view explaining the action | operation of the 9th Embodiment of this invention. The schematic plan view explaining the action | operation of the 10th Embodiment of this invention. The flowchart explaining the action | operation of the 1st Embodiment of this invention. The flowchart explaining the action | operation of the 3rd Embodiment of this invention. The flowchart explaining the action | operation of the 4th Embodiment of this invention. The flowchart explaining the action | operation of the 6th Embodiment of this invention.

Hereinafter, the description of the first embodiment of the component mounting apparatus according to the present invention with reference to the accompanying drawings. As shown in FIGS. 1 to 3, the component mounting apparatus, the first and second substrate transport device 10a, and 10b, the substrate transfer apparatus 10a, the conveyor width changing device 30 accompanying the 10b, component transfer device 40 and first and second component supply devices 45a and 45b.

  Since the first and second substrate transfer apparatuses 10a and 10b have substantially the same structure, the first substrate transfer apparatus 10a will be mainly described. As shown in FIGS. 2 and 3, the pair of outer support legs 12 are erected and fixed on the base 11, and the pair of inner support legs 12 a opposed to the outer support legs 12 are the outer support legs 12. Is fixedly erected and fixed on a slider 15a guided and supported on a base 11 via a guide rail 15 orthogonal to the outer support leg 12. Both ends of the support plate 13 are fixed to the upper portions of the support legs 12 and 12a, and side rails 14 are fixed to the upper edges of the support plates 13 protruding upward from the support legs 12 and 12a. A flange portion 14 a that protrudes inward from the support rail 20 is formed at the upper edge of 14. The second substrate transfer device 10b is provided on the base 11 in parallel and symmetrically with the first substrate transfer device 10a so that the inner support legs 12a are adjacent to each other. A support plate 39 is erected and fixed to the base 11 outside the outer support legs 12 of the second substrate transport apparatus 10b.

  Both end portions of the transfer rotary shaft 16 arranged so as to be orthogonal to the support plate 13 are rotatably supported by one outer support leg 12 of each of the substrate transfer apparatuses 10a and 10b, and a spline shaft portion occupying most of the middle. 16a penetrates the corresponding inner support leg 12a so as to be rotatable and slidable in the axial direction. Outer drive pulleys 17 are fixed to both ends of the transport rotary shaft 16 in contact with the outer support legs 12. The inner driving pulley 17a is supported by a boss formed in a portion through which the spline shaft portion 16a of each inner support leg 12a passes so that the inner driving pulley 17a is freely rotatable and axial movement is restricted. 17a is slidably engaged with the spline shaft portion 16a so as to be able to transmit the rotation of the transport rotary shaft 16.

  As shown mainly in FIG. 3, the support plate 13 fixed to the inner support leg 12a has a pair of pulleys 18 and 19 that are freely rotatable at both ends slightly below the side rail 14 and below the inside. Also, pulleys 19a and 19b are rotatably provided below the intermediate portions of the pulleys 18 and 19, respectively. A conveyor belt 21 having a convex cross section is stretched between the inner driving pulley 17a and each of the pulleys 18, 19, 19a, 19b, and the pulley 17a, 18, 19a prevents the conveyor belt 21 from being detached. For this purpose, a circumferential groove is provided which engages with the convex part of the cross section of the conveyor belt 21. A part of each conveyor belt 21 stretched between the pair of pulleys 18 is maintained at a certain distance from the flange portion 14 a of each side rail 14. A longitudinal groove that engages with the convex portion of the belt 21 is formed, and a support rail 20 that supports this portion of the conveyor belt 21 is fixed to the support plate 13. A similar pulley 18, 19, 19a, 19b is also provided on the support plate 13 fixed to the outer support leg 12, and a conveyor belt is also provided between the outer drive pulley 17 and each of these pulleys 18, 19, 19a, 19b. A support rail 20 for supporting the conveyor belt 21 is provided.

  One end of the transfer rotating shaft 16 protrudes from the support plate 39 through the outer support leg 12 of the second substrate transfer apparatus 10b, and a pulley 16b is fixed to the tip thereof. A conveyor drive motor 22 is supported on the base 11 (the support structure is not shown), and a drive belt 23 is provided between a pulley 22a and a pulley 16b fixed to the output shaft of the conveyor drive motor 22 for conveying. The conveyor belt 21 is moved by rotating the driving pulleys 17 and 17 a via the rotating shaft 16. By the board transfer devices 10a and 10b described above, two linear transfer type conveyors for carrying the two boards Sa and Sb into and out of the component mounting apparatus are formed.

  Between the inner and outer support rails 20 on the upper and lower portions of the substrate transfer devices 10a and 10b, a backup plate 24a that is lifted and lowered by a lifting device (not shown) and a large number of standing and fixed on the backup plate 24a. A backup device 24 comprising a backup pin 24b is provided. The illustrated backup device 24 is not variable in width in the direction orthogonal to the conveyance direction. Therefore, whenever the width in the direction orthogonal to the conveyance direction of the substrate conveyance devices 10a and 10b is changed by the conveyor width changing device 30 described later, the backup device 24 is backed up. The plate will be replaced. However, the backup device 24 is not limited to this, and it is assumed that the width is automatically changed in conjunction with the operation of the conveyor width changing device 30, and the backup device 24 is replaced every time the width of the substrate transfer devices 10a and 10b is changed. Can be eliminated. In FIG. 2, the backup device 24 is displayed only on the second substrate transfer device 10b in order to simplify the drawing, but the backup device 24 is also provided on the first substrate transfer device 10a.

  The boards Sa and Sb are supported by the respective conveyor belts 21 of the first and second board transfer devices 10a and 10b, carried into and out of the component mounting apparatus, and transferred to a predetermined position. If it raises, each board | substrate Sa and Sb will be lifted, will contact | abut to the flange part 14a of each side rail 14, and will be located in a component mounting position.

  In this embodiment, the transfer rotary shaft 16 is common to the first and second substrate transfer apparatuses 10a and 10b, and the conveyor belts 21 of both the substrate transfer apparatuses 10a and 10b are driven simultaneously. However, the drive device for the conveyor belt 21 is not limited to this, and the first and second substrate transfer devices 10a and 10b are each provided with a transfer rotary shaft 16 and rotated by different conveyor drive motors 22. In this case, the conveyor belts 21 of both the substrate transfer apparatuses 10a and 10b can be driven independently of each other. In this case, the transport rotary shafts 16 may be provided on the support legs 12 and 12a on the opposite sides in FIG.

  Next, the conveyor width changing device 30 will be described with reference to FIGS. A pair of first screw shafts 31 arranged in parallel with the transport rotation shaft 16 changes the distance between the support legs 12 and 12a of the first substrate transport apparatus 10a and the support plate 13 supported by the support legs 12. It is. Both ends of each first screw shaft 31 are rotatably supported by the outer support legs 12 of both of the substrate transfer apparatuses 10a and 10b, and the middle part rotates and slides the inner support legs 12a of the second substrate transfer apparatus 10b. A thread portion that penetrates freely and is mainly formed on the first substrate transport apparatus 10a side is screwed to a boss formed on the inner support leg 12a of the first substrate transport apparatus 10a. One end of each first screw shaft 31 protrudes from the support plate 39 through the outer support leg 12 of the second substrate transfer device 10b, and a pulley 31a is fixed to each tip, and one half of both pulleys 31a are interlocked. It is rotationally connected via a belt 32 for use. A first drive motor 33 is supported on the base 11 (the support structure is not shown), and a drive belt 34 is provided between the pulley 33a fixed to the output shaft of the first drive motor 33 and the remaining half of one pulley 31a. As a result, both first screw shafts 31 are rotated in conjunction with the first drive motor 33, and the width in the direction perpendicular to the transport direction of the first substrate transport apparatus 10a (supported by both support legs 12, 12a) is provided. The distance between the support plate 13 and the side rail 14) is changed.

  A pair of second screw shafts 35 arranged in parallel with the transfer rotating shaft 16 changes the distance between the support legs 12 and 12a of the second substrate transfer apparatus 10b and the support plate 13 supported by the support legs 12. It is. Both ends of each second screw shaft 35 are rotatably supported by the outer support legs 12 of both the substrate transfer apparatuses 10a and 10b, and the intermediate part is rotatable and slidable by the inner support legs 12a of the first substrate transfer apparatus 10a. , And a threaded portion formed mainly on the second substrate transport apparatus 10b side is screwed to a boss formed on the inner support leg 12a of the second substrate transport apparatus 10b. Since the structure of the other related parts is substantially the same as that of the first screw shaft 31, the corresponding member is given a reference number 4 larger than that of the first screw shaft 31, and detailed description thereof is omitted. When the second drive motor 37 is rotated, both the second screw shafts 35 are rotated in conjunction with each other, and the width in the direction orthogonal to the transport direction of the second substrate transport apparatus 10b is the width of the first substrate transport apparatus 10a. Is changed independently.

  In this embodiment, the outer support legs 12 of the substrate transfer apparatuses 10a and 10b are fixed to the base 11, and the inner support legs 12a are moved independently, so that the substrate transfer apparatuses 10a and 10b are moved. The width of can be changed independently. However, the present invention is not limited to this, and each inner support leg may be fixed to the base 11 and each outer support leg may be moved independently by two screw shafts, or one of the two substrate transfer apparatuses 10a and 10b. The other outer support leg and the other inner support leg may be fixed to the base 11, and the remaining inner support leg and outer support leg may be moved independently by two screw shafts. Alternatively, only one outer support leg of both the substrate transfer devices 10a and 10b is fixed to the base 11, the two inner support legs move together by a screw shaft, and the other outer support leg is two inner support legs. You may make it move with another screw axis independently of a leg.

  Next, as shown in FIG. 1, the component transfer device 40 includes a pair of fixed rails 41 arranged in parallel to each other above both end portions of both the substrate transfer devices 10 a and 10 b and supported by the base 11, Two head moving rails 42a and 42b which are arranged orthogonal to the fixed rail 41 and supported at both ends so as to be movable along the fixed rail 41, and are movable along the head moving rails 42a and 42b, respectively. It consists of two supported component picking heads 43a and 43b, and a fixed rail 41 and head moving rails 42a and 42b move the component picking heads 43a and 43b in two directions parallel to the surfaces of the substrates Sa and Sb. A head transfer mechanism is configured. Each of the component picking heads 43a and 43b includes a suction nozzle (not shown) that can be moved up and down to suck the component. The movements of the head moving rails 42a and 42b, the component picking heads 43a and 43b, and the suction nozzle are controlled by a servo motor, respectively, and the components supplied from the component supply devices 45a and 45b described below are sucked by the suction nozzle, and are described above. As described above, the circuit board is transferred and mounted on the boards Sa and Sb held at the component mounting positions of the board transfer devices 10a and 10b.

As shown in FIG. 1, the component supply devices 45 a and 45 b include a plurality of feeders installed side by side on a feeder table, and each feeder is, for example, a tape type. This tape-type feeder winds and holds a long and narrow tape enclosing components at a predetermined pitch around a supply reel, and the components picked up (collected) by the suction nozzle of the component picking head 43 one by one on the substrate transfer devices 10a and 10b side. It feeds into the tip of the tape type feeder. The tape consists of a tape body that holds the parts and a cover tape that covers them. The cover tape is peeled off at the tip of the feeder so that the parts can be sucked, and the tape body that has picked up the parts is folded downward and wound. It has come to be taken. Two component supply devices 45a and 45b are provided on both outer sides of the first and second substrate transfer devices 10a and 10b .

  As shown in FIG. 4, the operation of the component mounting apparatus is controlled by a control device 60, and the control device 60 further includes a communication unit 61, an input unit 64, a display unit 65, a storage unit 63, and a mounting plan creation unit 62. It is connected. The communication unit 61 communicates with a host computer that manages a production line including the component mounting apparatus. For example, mounting data for each type of product to be produced (component type to be mounted and data of its mounting coordinates). Production plan data (data indicating the production order and the number of products produced for each product type) is transmitted from the host computer to the component mounting apparatus.

  The mounting plan creation unit 62 creates a mounting program that is actually executed by the component mounting apparatus based on the mounting data and production plan data for each product type transmitted from the host computer. In other words, the optimal feeder arrangement in the component supply devices 45a and 45b according to the quantity of each board type to be produced and the mounting sequence considering the respective mounting speed ratios when two types are produced simultaneously are determined. A mounting program that avoids a situation in which the production efficiency is lowered such that the two substrate transfer apparatuses 10a and 10b are both transferring the substrates Sa and Sb is created. The mounting program creation process performed by the mounting plan creation unit 62 may be executed by the host computer, and the completed mounting program may be transmitted to the component mounting apparatus.

  The storage unit 63 stores various programs, data, logs, and the like related to the component mounting apparatus. In this embodiment, the mounting data and production plan data for each product type transmitted from the host computer, and the mounting program created by the mounting plan creation unit 62 based on them are stored. The input unit 64 is a keyboard and push buttons for inputting necessary data and commands. The display unit 65 is a display device using liquid crystal or CRT for displaying necessary information.

( Reference example )
First, referring to FIGS. 5 to 7, the operation of the reference example including the component transfer device 40 having two substrate transfer devices 10 a and 10 b, two component supply devices 45 a and 45 b, and one component sampling head 43 will be described. To do. As described above, the component mounting apparatus of this reference example is operated by a mounting program that avoids the situation where the two board transfer apparatuses 10a and 10b are both transferring the boards Sa and Sb.

The operation of the reference example will be described with reference to the flowchart shown in FIG. If neither of the substrate transfer apparatuses 10a and 10b is transferring the substrates Sa and Sb to be supported and the width of each is not being changed, the control device 60 performs the control operation from step 100 to step 101 to step 101. Go through 103 to step 104. In this step 104, the component picking head 43 of the component transfer device 40 sucks the component designated from the component supply devices 45a and 45b and holds the substrate Sa held at the component mounting position on both the substrate transfer devices 10a and 10b. , Sb are mounted at predetermined coordinate positions.

  The component mounting by the component picking head 43 of the component transfer device 40 is performed by mounting the component sucked from the second component supply device 45b on the substrate Sb held by the second substrate transport device 10b, for example, as shown in FIG. Next, the component sucked from the first component supply device 45a is mounted on the substrate Sa held by the first substrate transport device 10a, the component sucked from the second component supply device 45b is mounted again on the substrate Sb, and then The components may be alternately mounted on each of the substrates Sa and Sb such that the component sucked from the first component supply device 45a is mounted on the substrate Sa. Alternatively, as shown in FIG. 7, the mounting of the component by the component picking head 43 is performed once by mounting the component sucked from the second component supply device 45b on the substrate Sb, and then the first component supply device 45a. The operation of mounting the component adsorbed on the substrate Sa is repeated twice, the operation of mounting the component adsorbed from the second component supply device 45b on the substrate Sb once again, and then adsorbed from the first component supply device 45a. The mounting frequency of the components on each of the substrates Sa and Sb may be varied such that the operation of mounting the component on the substrate Sa is repeated twice. In this second example, the component mounting frequency ratio is 1 for mounting on the board Sb and 2 for mounting on the board Sa. However, if the number of repeated mounting of parts on the same board is different each time, This ratio can be set to an arbitrary value.

  In the two examples described above, the components are adsorbed from the component supply devices 45a and 45b closer to the mounted boards Sa and Sb. However, in some cases, the components are adsorbed from the distant component supply devices. Also good. Alternatively, a single component supply device may be provided in the component mounting apparatus, and the components may be sucked from only the component supply device and mounted on both the boards Sa and Sb.

  Returning to the description of the operation according to the flowchart shown in FIG. 24, as shown in FIG. 6, the second substrate transfer device 10b is transferring the substrate Sb, or the second substrate transfer device 10b is changing its width. In this case, the control device 60 advances the control operation from step 100 through step 101 to step 102 or step 103, and further advances to step 106. If the second substrate transport device 10b is transporting the substrate Sb or the second substrate transport device 10b is changing its width, components cannot be mounted on the substrate Sb. As shown in FIG. 6, the component picking head 43 of the component transfer device 40 sequentially picks up the components specified from the first component supply device 45a and holds the substrate Sa held at the component mounting position of the first substrate transfer device 10a. The parts are sequentially mounted only on the. In this way, the component picking head 43 does not mount the components on the substrate Sb, but instead performs the mounting of components on the substrate Sa held by the first substrate transport apparatus 10a in a concentrated manner. Mounting time is shortened and mounting efficiency is improved.

  Similarly, when the first substrate transport apparatus 10a is transporting the substrate Sa, or when the first substrate transport apparatus 10a is changing its width, the control device 60 performs the control operation from step 100 or step 101. Proceed to step 105. Also in this case, the component picking head 43 sequentially picks up the components designated from the second component supply device 45b, and sequentially mounts the components only on the substrate Sb held at the component mounting position of the second substrate transport device 10b. In this way, the component picking head 43 does not mount components on the substrate Sa, but instead performs concentrated component mounting on the substrate Sb held by the second substrate transport apparatus 10b. Mounting time is shortened and mounting efficiency is improved.

In the above-described reference example , the case of the component transfer apparatus 40 having one component extraction head has been described. However, the component mounting apparatus according to the first embodiment is a component transfer apparatus having two component extraction heads 43a and 43b. A mounting device 40 is provided . In the first embodiment, when neither of the two substrate transfer devices 10a and 10b is transferring a substrate and changing the width, the component sampling heads 43a and 43b are held by the corresponding substrate transfer devices 10a and 10b. The components are mounted on the substrates Sa and Sb simultaneously in parallel. When any one of the substrate transfer devices 10a (or 10b) is transferring a substrate or changing the width, the corresponding component picking head 43a (or 43b) complicit in component picking head 43b corresponding to the conveying device 10b (or 10a) (or 43a), intends row of parts mounting to the other substrate transport device 10b (or 10a) to be held substrates Sb (or Sa) . Also in this case, the mounting time of components on the substrate Sb (or Sa) is shortened, and the mounting efficiency is improved. In this case, for example, it is necessary to consider in order to avoid physical interference between the two component picking heads as described below.

  As shown in FIGS. 1 and 8, in the case of a component mounting apparatus including a component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and two component sampling heads 43. In order to reduce the moving distance of the mounted components and simplify the control program, the first component sampling head 43a exclusively mounts the components on the substrate Sa, and the second component sampling head 43b exclusively controls the substrate Sb. It is preferable to mount components on the above. Further, in this case, when both the component sampling heads 43a and 43b are in a predetermined interference danger area Si close to the central portion between the two substrates Sa and Sb, physical interference between both the component sampling heads 43a and 43b is caused. Avoidance is difficult. Note that the central portion here refers to a point-symmetrical center point of both substrates Sa and Sb stopped at the component mounting position for component mounting, and part or all of the edge portions of both substrates Sa and Sb are arranged in parallel to each other. In this case, it is the center line of the range in which the edges are arranged, and the predetermined interference danger area Si is each substrate Sa separated from the above-mentioned central part by a distance given by the planar shape of each component sampling head 43a, 43b. , Sb. Further, the range excluding the danger interference region Si on each of the substrates Sa and Sb is an interference safety region. Next, some embodiments for avoiding this interference will be described.

(Second Embodiment)
In the second embodiment shown in FIG. 9, the stop positions in the transport direction of the boards Sa and Sb at the time of component mounting in the two board transport apparatuses 10a and 10b are different from each other. If the stop position is more than an appropriate distance, the predetermined interference risk area Si approaching the central portion between the two boards Sa and Sb is eliminated at the time of component mounting. Therefore, when components are mounted on the boards Sa and Sb. There is no possibility that the two component picking heads 43a and 43b interfere with each other. Therefore, the efficiency of component mounting on the boards Sa and Sb is improved, and the program for controlling the operation of the component mounting apparatus is simplified.

(Third embodiment)
In the second embodiment described above, the interference between the two component sampling heads 43a and 43b described above is avoided by devising the physical arrangement of the stop positions of the substrates Sa and Sb. In the third embodiment shown in the chart and the flowchart in FIG. 25, this interference is avoided without having to shift the positions of the boards Sa and Sb by devising a control program for the component mounting apparatus. It is. As described above, the first component picking head 43a exclusively mounts components on the substrate Sa, and the second component picking head 43b exclusively mounts components on the substrate Sb. To do.

  First, when neither of the first and second component picking heads 43a and 43b mounts a component in the corresponding danger area Si of the corresponding substrate Sa or Sb, the control device 60 performs the control operation in the flowchart of FIG. Proceed from step 110 to step 112 through step 111. In this step 112, the component picking heads 43a and 43b mount components in the interference safety areas of the substrates Sa and Sb of the corresponding substrate transfer apparatuses 10a and 10b. When the first component sampling head 43a mounts a component in the risk of interference area Si of the substrate Sa on the first substrate transport apparatus 10a, the control device 60 advances the control operation from step 110 to step 113 to extract the second component. The head 43b mounts components in the interference safety area of the substrate Sb on the second substrate transport apparatus 10b. Further, when the second component picking head 43b mounts components on the interference risk area Si of the substrate Sb on the second substrate transfer device 10b, the control device 60 advances the control operation from step 111 to step 114, and performs the first operation. The component picking head 43a mounts components in the interference safety area of the substrate Sa on the first substrate transport apparatus 10a. As a result, the component sampling heads 43a and 43b do not simultaneously mount components in the interference risk areas Si of both the boards Sa and Sb. Therefore, when mounting components on the boards Sa and Sb, the two component sampling heads 43a are installed. , 43b can be prevented from interfering with each other.

(Fourth embodiment)
In the fourth embodiment shown in FIGS. 11, 12 and 26, the two component picking heads 43a can also be obtained without deviating the positions of the two boards Sa and Sb by devising the control program for the component mounting apparatus. 43b are avoided. Next, the operation of the fourth embodiment will be described mainly with reference to the flowchart shown in FIG.

  First, when neither of the substrate transfer apparatuses 10a and 10b is transferring the substrates Sa and Sb to be supported and the widths of the substrates are not being changed, the control device 60 performs the control operation from step 120. Go to step 124 through 121-123. In this step 124, the component picking heads 43a and 43b of the component transfer device 40 suck the components from the component supply devices 45a and 45b and interfere with the substrates Sa and Sb held by both the substrate transfer devices 10a and 10b. A component is mounted at a predetermined coordinate position within the safety area.

  As shown in FIG. 12, when the second substrate transport apparatus 10b is transporting the substrate Sb, or when the second substrate transport apparatus 10b is changing its width, the control device 60 starts the control operation from step 120. The process proceeds to step 122 or step 123 through step 121, and further proceeds to step 126. In this step 126, the first component picking head 43a sequentially picks up the components designated from the first component supply device 45a, and the interference risk area Si of the substrate Sa held at the component mounting position of the first substrate transport device 10a. The components are sequentially mounted at predetermined positions. When the second substrate transport apparatus 10b is transporting the substrate Sb, or when the second substrate transport apparatus 10b is changing its width, no component is mounted on the substrate Sb, so the second component sampling head 43b. May be retracted to a position where there is no possibility of interfering with the first component picking head 43a (see FIG. 12), in which case the first component picking head 43a for mounting the component in the interference risk area Si of the substrate Sa There is no interference. Alternatively, the components may be mounted in the interference risk area Si of the substrate Sa in addition to the first component collecting head 43a, and the production efficiency of the substrate Sa can be increased. In this case, control for avoiding interference between the two component picking heads 43a and 43b is necessary.

  Similarly, when the first substrate transport apparatus 10a is transporting the substrate Sa or when the first substrate transport apparatus 10a is changing its width, the control device 60 performs the control operation from step 120 or step 121. Proceeding to step 125, the second component picking head 43b mounts the component at a predetermined position in the interference risk area Si of the substrate Sb held by the first substrate transport apparatus 10a. Also in this case, if the first component picking head 43a that does not mount the component on the board Sa is retracted, the first component picking head 43a may interfere with the second component collecting head 43b that mounts the component in the interference risk area Si of the board Sb. If the part is mounted in the interference risk area Si of the substrate Sb by taking part in the second component sampling head 43b, the production efficiency of the substrate Sb can be improved.

The mounting of components on the boards Sa and Sb by the component sampling heads 43a and 43b in the second to fourth embodiments is performed in the same manner as described with reference to FIGS. 5 to 7 in the first embodiment. Is called. In the second to fourth embodiments, the component sucked from the first component supply device 45a is mounted on the substrate Sa, and the component sucked from the second component supply device 45b is mounted on the substrate Sb. some components adsorbed from the first component supply device 45a mounted on the substrate Sb, the components adsorbed from the second component supply device 45b but it may also be so mounted on the substrate Sa.

(Fifth embodiment)
Next, a fifth embodiment shown in FIGS. 13 to 17 will be described. This embodiment uses a component mounting apparatus including a component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and two component sampling heads 43a and 43b. An example of the procedure for mounting components on the three types of boards shown in Table 1 below is shown.

  As a production sequence, first, the substrate A is transported by the first substrate transport device 10a and the substrate B is transported by the second substrate transport device 10b, whereby the production of the two substrates A and B is started. After the above, the substrate C is transferred by the second substrate transfer device 10b and the substrate A is continuously transferred by the first substrate transfer device 10a to produce two substrates A and C.

  In this case, prior to the start of production, as shown in FIG. 13, each conveyor width changing device 30 sets the width of the first substrate transfer device 10a to 10 cm and the width of the second substrate transfer device 10b to 15 cm. A feeder for production A is set on the feeder table of the first component supply device 45a, a feeder for production of substrate B is set on the feeder table of the second component supply device 45b, and a feeder for production of substrate C is second. Set on the feeder table of the component supply device 45b. In the illustrated example, since the feeder for producing the substrate C cannot be set on the feeder table of the second component supply device 45b, it is also set on the feeder table of the first component supply device 45a.

  In production, first, as shown in FIG. 14, the substrate A is sequentially carried in by the first substrate transfer device 10a, the components are mounted by the first component collecting head 43a (not shown), and the second substrate is concurrently formed. The board B is sequentially carried in by the transfer device 10b, and the components are mounted by the second component collecting head 43b (not shown). In order to avoid physical interference between the component sampling heads 43a and 43b in the interference risk area Si between the substrates Sa and Sb, the substrates Sa and Sb may have different stop positions in the transport direction ( (See FIG. 9).

  After the production of the substrate B, as shown in FIG. 15, the width of the second substrate transfer device 10 b is changed from 15 cm to 10 cm by the conveyor width changing device 30 of the second substrate transfer device 10 b in parallel with the component mounting on the substrate A. Change to During this change, the second component picking head 43b may be retracted to the retracted position. However, if the components are mounted on the board A in addition to the first component picking head 43a, the production efficiency can be improved. In this case, control for avoiding interference between the two component picking heads 43a and 43b is necessary.

  When the change of the width of the second substrate transfer device 10b is completed, as shown in FIG. 16, the substrate carried in by the second substrate transfer device 10b in parallel with the component mounting on the substrate A by the first component sampling head 43a. The component is mounted on C by the second component sampling head 43b. When the feeder of the component to be mounted on the substrate C is set on the feeder table on the first component supply device 45a side, the opportunity of interference between the component sampling heads 43a and 43b increases, and this interference is avoided. Measures are needed. In the example shown in the drawing, the stopping positions in the transport direction of the substrates Sa and Sb are made different from each other, and the feeder for producing the substrate A and the feeder for producing the substrate C are set on the feeder table of the first component supply device 45a. This is addressed by placing them apart. If this is not sufficient, as shown in FIG. 17, when the second component collection head 43b collects a component from the feeder on the first component supply device 45a side, the first component collection head 43a is temporarily moved. Control such as moving to the retracted position. After the production of the substrate A is finished, such control for avoiding interference becomes unnecessary.

  After the production of the substrate A in the first substrate transport apparatus 10a, if there are different types of substrates to be continuously produced, the first component sampling head 43a is in the process until the substrate is carried into the first substrate transport apparatus 10a. Waiting at the retracted position or mounting the component on the substrate C in addition to the second component picking head 43b. Similarly, when the scheduled production plan is completed, the first component picking head 43a waits at the retracted position, or takes part in the second component picking head 43b to mount the component on the substrate C.

(Sixth embodiment)
Next, a sixth embodiment shown in FIGS. 18 and 27 will be described. This embodiment, component mounting apparatus having two substrate transport devices 10a, 10b, the two component supply devices 45a, 45b and the two parts taken heads 4 3a, the component transfer device 40 having a 43b , One of the two substrate transfer apparatuses 10a and 10b is dedicated to the fixed production type that transfers only the product substrate of the fixed production type, and the other transfers the product substrate of the interrupt type having different substrate widths. It is intended for interrupt types.

  When it is planned to produce a large number of products of type A, if an instruction for interrupting production of products of type B is urgently input from the host computer to the control device 60, both the substrate transfer devices 10a and 10b are set. If the setup is changed so that the interrupted product is produced from the regular production type, the loss time required for the setup change increases. In particular, when the number of interrupted products produced is small, if both units are replaced, a large time loss occurs.

  In order to reduce the loss time of this setup change, one of the two substrate transfer devices 10a and 10b is set exclusively for the fixed production type for transferring only the fixed production type product substrate, and the other is set for the substrate width. Set for interrupt types that transport product boards of different interrupt types. As setting means for performing this setting, for example, “1” is set in the storage unit 63 when the substrate transfer device is dedicated to the fixed production type, and “0” is set when setting the interrupting type. A setting area is provided for each of the substrate transfer apparatuses 10a and 10b. For example, when the substrate transfer apparatus 10a is set for a fixed production type and the substrate transfer apparatus 10b is set for an interrupt type, "1" is set in each of the setting areas of the substrate transfer apparatuses 10a and 10b. “,“ 0 ”is input from the input unit 64 of the control device 60. Then, a feeder for product parts of a fixed production type is set over the entire surface of the parts supply device 45a on the substrate transport apparatus 10a side, and a product part of an interrupt product type is placed on the parts supply apparatus 45a on the substrate transport apparatus 10b side. Leave an empty slot to set the feeder.

  When the fixed production product board (A substrate) is transferred to the substrate transfer devices 10a and 10b and the fixed production product (A product) is normally produced (step 131), the interrupt product ( When the production of the (B product) is input from the host computer to the control device 60 (step 132), the interruption product substrate transfer device 10b performs a payout process for stopping and discharging the A substrate (step 133). The mounting program for mounting the component on the board transferred to the component mounting position by the board transfer device 10b is switched from the A product mounting program to the B product mounting program (step 134), and is orthogonal to the transfer direction of the board transfer device 10b. The width in the direction is changed to the rail width corresponding to the B board (step 135). Whether the component picking heads 43a and 43b do not interfere with each other even if components are mounted on the A substrate by the substrate transfer device 10a and components are mounted on the B substrate by the substrate transfer device 10b, it is determined whether or not simultaneous mounting is possible (step) 136) If possible, component mounting on the A board in the board transfer device 10a and component mounting on the B board in the board transfer device 10b are simultaneously performed (step 137). If simultaneous production is not possible, component mounting is halted in the board transfer device 10a, and component mounting is performed on the B board by the number specified in the board transfer device 10b (step 138). When component mounting is completed on the specified number of B boards (step 139), the board transfer device 10b is returned to A product production, and A products are normally produced by the board transfer apparatuses 10a and 10b.

(Seventh embodiment)
Next, a seventh embodiment shown in FIGS. 19 and 20 will be described. In this embodiment, when the board on which the component is mounted by the board transfer device is changed from the first type product board (A board) to the second type product board (B board), the board transfer device changes the board after the change. The component is trial mounted on the board, and if there is no problem, the actual mounting is started. Immediately after component mounting on the A substrate is completed by the substrate transport apparatus, component mounting is started on the B substrate, and if a quality defect occurs in component mounting on the B substrate, defective products and loss of production time occur. For this reason, when a production is switched at a production site, trial mounting of components on a B board in advance is performed by a board transfer device used after the change. However, after a long time has passed after trial mounting, the state of the component mounting device changes, and it is necessary to confirm that the feeder necessary for mounting the component on the B board is set in the component supply device. Considering it, it is preferable to perform trial mounting immediately before the start of component mounting on the B board. Therefore, utilizing the fact that the component mounting apparatus includes two board transfer apparatuses 10a and 10b, the B board is used in the other board transfer apparatus in parallel with the component mounting on the A board in one board transfer apparatus. Trial mount the parts.

  As shown in FIG. 19, for example, the substrate transfer device 10a is set for the fixed production type and the substrate transfer device 10b is set for the interrupt type, and the substrate transfer device 10a sets the product substrate (A substrate) of the first fixed production type. When one-sided production for mounting the product substrate (B substrate) of the second fixed production type is instructed when the component is fully mounted and one-sided production is performed in which the component mounting is not performed in the board transfer device 10b. A mounting program for mounting components on the B board is set by the board transfer device 10b, and the width of the board transfer device 10b is changed to a rail width corresponding to the B board. The component is actually mounted on the A board by the substrate transfer device 10a, and the component is trial-mounted on the B substrate by the substrate transfer device 10b. The timing of starting trial mounting is the production status of the product of the first fixed production type and the product of the second fixed production type when switching from the first fixed production type to the second fixed production type is determined in the production plan. It is determined in consideration of the trial production time and the time required for inspection and correction. When switching to the second production type is suddenly instructed, trial mounting on the product substrate of the second production type is started at the time when the switching command is issued. The B board on which the components are mounted is unloaded from the board transfer device 10b and subjected to reflow and inspection. The inspection is performed on items such as the mounting position and parts, incorrect feeder setting, mounting accuracy, and the like. If there is a problem as a result of the inspection, the problem portion is corrected, such as adjustment of component mounting on the B board in the board transfer device 10b and change of the set feeder. When the problem is solved, the actual mounting of the components on the B board is started by the board transfer device 10b, and the mounting is finished when the number of parts mounted on the A board by the board transfer device 10a reaches the planned number. Then, in order to change the setting of the substrate transfer device 10b for the fixed production type and the substrate transfer device 10a for the interrupt type, the setting areas of the substrate transfer devices 10a and 10b of the storage unit 63 of the control device 60 are set to “0”, “1” is input from the input unit 64.

  As shown in FIG. 20, the substrate transfer device 10a is set for the fixed production type, the substrate transfer device 10b is set for the interrupt type, and the substrate transfer devices 10a and 10b are used to place components on the first type product substrate (A substrate). When the both-side production to perform the main mounting is instructed when the both-side production to perform the main mounting is instructed to the second type product board (B board) when the both-side production for the main mounting is performed, the parts are first applied to the B board by the board transfer device 10b. In order to perform the trial mounting, the substrate transfer apparatus 10b stops the carry-in of the A substrate and performs a payout process. The mounting program for mounting components on the board by the board transfer device 10b is switched from the mounting program for board A to the mounting program for board B, and the width of the board transfer device 10b is changed to a rail width corresponding to the board B. The component is actually mounted on the A board by the substrate transfer device 10a, and the component is trial-mounted on the B substrate by the substrate transfer device 10b. The B board on which the trial component is mounted is unloaded from the board transfer device 10b and subjected to reflow and inspection. If there is a problem as a result of the inspection, the problem location is corrected, and the actual mounting of the component on the B board is started by the board transfer device 10b. Next, when the number of parts mounted on the A board in the board transfer apparatus 10a reaches the planned number, the board transfer apparatus 10a performs trial mounting of the parts on the B board as in the case of the board transfer apparatus 10b. After the points are identified and resolved, the actual mounting of the components on the B board is started.

(Eighth embodiment)
Next, an eighth embodiment will be described. This embodiment uses a component mounting apparatus including a component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and two component sampling heads 43a and 43b. In production, interference between the two component picking heads 43a and 43b is reduced.

  As shown in FIGS. 2 and 21, two substrate transfer apparatuses 10a and 10b for transferring a substrate in a direction parallel to each other are juxtaposed, and the substrate transfer apparatuses 10a and 10b are arranged on the outer side opposite to the adjacent central side. Are provided with two component supply devices 45a and 45b. Each substrate transport apparatus 10a, 10b is provided with two guide rails 25a, 26a and 25b, 26b for guiding both sides of the substrate. The support rails 20 and the side rails 14 forming the outer guide rails 25a and 25b adjacent to the component supply devices 45a and 45b are fixed to the outer support legs 12 and 12 which are erected and fixed on the base 11, and are arranged on the center side. The support rails 20 and the side rails 14 forming the guide rails 26a and 26b are fixed to inner support legs 12a and 12a that are guided and supported on the base 11 so as to be position adjustable in a direction orthogonal to the extending direction of the guide rails. Yes. The inner support leg 12a is moved by the first and second drive motors 33 and 37 via the first and second screw shafts 31 and 35 based on a command from the control device 60, and guide rails 26a and 26b on the center side. Is adjusted in a direction orthogonal to the extending direction of the guide rail, and the rail width of each of the substrate transfer devices 10a and 10b is changed according to the width of the substrate. The guide rail position adjusting means 27 for adjusting the position of the central guide rails 26a, 26b in the direction orthogonal to the extending direction thereof is the inner support leg 12a, the first and second drive motors 33, 37, the first, the second. It is comprised by the screw shafts 31 and 35, the control apparatus 60, etc. As a result, an excess space is generated between the movable guide rails 26a and 26b on the center side of the substrate transfer apparatuses 10a and 10b, which is generated when the width between the two guide rails 25a and 26a or 25b and 26b is narrowed. The two spaces are separated by this surplus space, and the possibility of interference between the component picking heads 43a and 43b can be reduced.

The outer support leg 12 is guided and supported on the base 11 so that the position thereof can be adjusted in the same manner as the inner support leg 12a, and can be moved via a screw shaft by a drive motor, and the outer guide rails 25a and 25b are connected to the guide rail. Even when the position adjustment means 27 can adjust the position in the direction orthogonal to the extending direction, the outer guide rails 25a and 25b are positioned closest to the outside on the component supply devices 45a and 45b side by control, and the center guide If the positions of the rails 26a and 26b are adjusted so that the rail width of each of the substrate transfer devices 10a and 10b is changed according to the width of the substrate to be transferred, the excess space generated on the center side of each of the substrate transfer devices 10a and 10b it is possible to reduce 43a of the component picking head, the possibility of interference 43b. In this case, it is determined in advance whether or not the feeder of the component mounted on the substrate conveyed by the substrate conveying devices 10a and 10b is also set in the component supply devices 45b and 45a on the far side, and the component on the near side If the control is performed so that the outer guide rails 25a and 25b are positioned closest to the component supply devices 45a and 45b as described above only when they are set only on the supply devices 45a and 45b, the parts are collected. The moving distance of the heads 43a and 43b can be shortened and interference can be prevented.

  Next, a component mounting system in a production line using the component mounting apparatus described with reference to FIGS. 1 to 4 will be described according to ninth and tenth embodiments.

(Ninth embodiment)
In a ninth form status of implementation of, as shown in FIG. 22, the two implementations stations 50 and 51 consisting of the component mounting apparatus are described above are arranged in series, the first shift in the carry-in side of the first mounting station 50 The apparatus 52 uses a production line (a part thereof) in which the second shift device 53 is arranged on the carry-out side of the second mounting station 51. The first shift device 52 includes first and second inlet-side substrate transfer devices 52a and 52b including a conveyor width changing device 30 similar to the substrate transfer devices 10a and 10b. The first and second outlet side substrate transfer devices 53a and 53b are provided in the same manner as the first and second inlet side substrate transfer devices 52a and 52b. The first entrance side substrate transport device 52a of the first shift device 52, the first substrate transport device 10a in the two mounting stations 50 and 51, and the first exit side substrate transport device 53a of the second shift device 53 are: Each conveyor width changing device 30 is connected continuously in the longitudinal direction with the same width, and similarly, the second inlet side substrate transfer device 52b, the two second substrate transfer devices 10b, and the second outlet side substrate transfer. The device 53b is also connected continuously in the longitudinal direction with the same width. As a result, each substrate can be continuously moved independently of each other on one of the substrate transfer devices 52a, 10a, 10a, 53a and on the other of the substrate transfer devices 52b, 10b, 10b, 53b. Yes. Since the first and second substrate transfer devices 10a and 10b are changed to have the same width, the respective substrates are sorted and carried into the first and second substrate transfer devices 10a and 10b by the first shift device 52, and the second The shift device 53 can join the first outlet side substrate transfer device 53a and carry it out.

  Based on a command from the control device 60, the first shift device 52 sends the plurality of types of substrates Sa and Sb carried into the first inlet side substrate transfer device 52a from the previous process to the first substrate transfer device 10a. And the substrate Sb to be sent to the second substrate transfer device 10b, the former is sent as it is to the first substrate transfer device 10a of the first mounting station 50, and the latter is transferred to the second inlet side substrate transfer device 52b. It is sent to the second substrate transfer device 10b of the first mounting station 50, and is provided with an entrance side shift mechanism (indicated only by an N-shaped arrow, the detailed structure is omitted) for performing such transfer. In FIG. 22, the substrate from the previous step is shown as being carried into the first inlet-side substrate transfer device 52a. However, this substrate may be carried into the second inlet-side substrate transfer device 52b or both inlets. You may make it carry in to the side board | substrate conveyance apparatus 52a, 52b, and the specific function and structure of an entrance side shift mechanism become a little different.

  The second shift device 53 needs to continue to mount the components among the substrates Sa and Sb carried into the exit side substrate transfer devices 53a and 53b from the mounting stations 50 and 51 based on a command from the control device 60. Some are transferred to the first exit side board transfer device 53a and carried out to the next mounting station, and those which have been mounted are transferred to the board carry-out device 54 and carried out. Is provided with an exit side shift mechanism (shown only by an N-shaped arrow, and a detailed structure is omitted).

The ninth form status of implementation of is to be operated by selecting either one of the first and second two production modes described below. First, in the first production mode, the first shift device 52 transfers the plurality of types of substrates Sa and Sb carried into the first inlet-side substrate transfer device 52a from the previous process to the first substrate transfer in the mounting stations 50 and 51, respectively. The former is divided into a board Sa for mounting components on the apparatus 10a and a board Sb for mounting parts on the second board transfer device 10b in each of the mounting stations 50 and 51. The former is the first board transfer of the first mounting station 50. The latter is sent to the apparatus 10a, and the latter is sent to the second substrate transfer apparatus 10b of the first mounting station 50. Each of the boards Sa and Sb is mounted with a component mounting device in each of the mounting stations 50 and 51 and sent to the outlet side substrate transfer devices 53a and 53b of the second shift device 53, and it is necessary to continue mounting the components. The boards Sa and Sb are carried out from the first exit side board transfer device 53a to the next mounting station, and the boards Sa and Sb on which the component mounting is completed are carried out from the board carry-out device 54.

  In the second production mode, the first shift device 52 transfers the plurality of types of substrates Sa and Sb carried into the first inlet side substrate transfer device 52a from the previous process into the first substrate transfer in the mounting stations 50 and 51, respectively. The board Sa on which components are mounted on the apparatus 10a and the board Sb on which no parts are mounted at each mounting station 50, 51 are separated, and the former is sent to the first board transfer device 10a of the first mounting station 50, and the latter is the first. It is sent to the second substrate transfer device 10b of the first mounting station 50. Components are mounted on the first substrate transfer device 10a of the component mounting apparatus of each mounting station 50, 51 and the substrate Sa is sent to the first outlet side substrate transfer device 53a of the second shift device 53, and the substrate Sb The two substrate transfer device 10 b bypasses the component mounting devices in the mounting stations 50 and 51 without stopping and is sent to the second outlet side substrate transfer device 53 b of the second shift device 53. Similarly to the case of the first production mode, the boards Sa and Sb that need to be continuously mounted with the components are unloaded from the first outlet side substrate transfer device 53a to the next mounting station, and the mounting of the components Sa is completed. , Sb is unloaded from the substrate unloading device 54. In the second production mode, the second substrate transfer device 10b in both the mounting stations 50 and 51 is used as a bypass conveyor that bypasses the substrate Sb on which components are not mounted on the first substrate transfer device 10a.

  In the first production mode of the ninth embodiment, even when a plurality of types of substrates Sa and Sb are randomly sent, the substrates Sa and Sb are automatically sent to the corresponding substrate transfer apparatuses 10a and 10b. Since each component mounting apparatus can mount components, it is possible to increase the flexibility of board production. Further, in the second production mode, a board that does not require component mounting at a certain mounting station can be sent ahead by bypassing such mounting station, and is not stopped in the middle of the production line. Therefore, the productivity of the substrate can be improved.

  Furthermore, in a production line in which a plurality of component mounting apparatuses as shown in FIG. 22 are connected in series, the entire production line normally stops when a failure occurs in the component transfer apparatus 40 of some of the component mounting apparatuses. However, if the board is bypassed by applying the second production mode to a component mounting apparatus in which such a failure has occurred in the production line, components can be mounted by a component mounting apparatus other than the component mounting apparatus. The entire production line will never stop. If a component that could not be mounted by the failed component mounting apparatus is mounted again, the substrate can be corrected in a relatively short time to obtain a finished product.

(Tenth embodiment)
Next, the tenth embodiment shown in FIG. 23 will be described. In this embodiment, in the ninth embodiment, the first shift device 52 arranged on the carry-in side of the first mounting station 50 is replaced with a shift device 55, and the second shift device arranged on the carry-out side of the second mounting station 51 is used. The shift device 53 is replaced with a shift device 56 with an inspection process, and a function of returning the substrate from the second outlet side substrate transfer device 56b to the second inlet side substrate transfer device 55b is added to the substrate transfer device 10b.

  The shift device 55 has substantially the same structure as that of the first shift device 52, but in addition to the function of the first shift device 52 described above, the shift device with inspection process 56 has a second structure in both mounting stations 50 and 51. A function of transferring the substrate Sb returned to the second entrance-side substrate transport device 55b through the substrate transport device 10b to the first entrance-side substrate transport device 55a and sending it to the first substrate transport device 10a of the first mounting station 50 have.

  The shift device with inspection process 56 has substantially the same structure as the second shift device 53 in the ninth embodiment, but in addition to the functions of the second shift device 53 described above, the mounting stations 50 and 51 The board Sa carried into the first exit side board transfer device 56a is inspected, and the board Sa that can be remounted with a component missing is transferred to the second board transfer device 10b. The substrate Sa that cannot be mounted has a function of being transferred to the substrate carry-out device 57.

The tenth form status of implementation of is to be operated by selecting either one of the first and second two production modes described below. First, in the first production mode, as in the first production mode of the ninth embodiment described above, the shift device 55 includes a plurality of types of substrates Sa, which are carried into the first inlet side substrate transport device 55a from the previous step. Sb is divided into two parts and sent to the first substrate transfer device 10a and the second substrate transfer device 10b of the first mounting station 50, respectively. Components are mounted on the boards Sa and Sb by the component mounting apparatuses in the mounting stations 50 and 51, respectively, and sent to the outlet-side board transfer devices 56a and 56b of the shift device with inspection process 56, and the components are subsequently mounted. The necessary substrates Sa and Sb are unloaded from the first exit side substrate transfer device 56a to the next mounting station, and the substrates Sa and Sb on which the component mounting is completed are unloaded from the substrate unloading device 57.

  In the second production mode, the shift device 55 first sends all the substrates Sa carried into the first inlet side substrate transport device 52a from the previous process to the first substrate transport device 10a of the first mounting station 50. The shift device with inspection process 56 inspects the board Sa on which the components are mounted on the first board transfer device 10a of the component mounting apparatus of each of the mounting stations 50 and 51 and carried into the first outlet side board transfer device 56a. Then, a substrate that can be remounted although there is a missing component is placed on the second substrate transport device 10b, and a defective substrate that is missing and cannot be remounted is placed on the substrate unloader 57. The defective substrate transferred to the substrate carry-out device 57 is carried out as it is. The substrate transferred to the second substrate transfer device 10b passes through the second substrate transfer device 10b in each of the mounting stations 50 and 51 as the substrate Sb, and the second entrance side substrate transfer device 55b of the shift device 55 without stopping midway. The information on the missing part of the board Sb is input to the control device 60. The substrate Sb returned to the second entrance-side substrate transfer device 55b is transferred to the first entrance-side substrate transfer device 55a by the shift device 55 controlled by the control device 60, and the first substrates of both the mounting stations 50 and 51 are transferred. The missing parts are automatically remounted based on the missing part information sent to the transport apparatus 10a and input to the control apparatus 60. In the second production mode, the second substrate transfer device 10b in both the mounting stations 50 and 51 is used as a return conveyor that returns the missing substrate Sb from the shift device with inspection process 56 to the shift device 55.

  In the first production mode of the tenth embodiment, as in the first production mode of the ninth embodiment, the substrate production flexibility can be increased. In the second production mode, parts that can be reworked are generated on the board Sa that is mounted on the first board transfer device 10a in each of the mounting stations 50 and 51 and sent to the shift device 56 with an inspection process. In this case, the shift device 56 with the inspection process automatically detects such a missing component, and the second substrate transport device 10b returns the substrate Sa to the shift device 55 on the front side of the mounting stations 50 and 51, thereby missing the component. The parts can be automatically remounted. Therefore, it is not necessary to re-mount components again after the mounting of the components on the production line is completed, so that production management for missing components can be simplified.

  In each of the above-described embodiments, the two board transfer apparatuses 10a and 10b are provided for each component mounting apparatus. In this way, the width of each board transfer apparatus 10a and 10b can be changed at the end of one lot. This can be done every time the substrate passes through the component mounting apparatus, and the waiting time until the production of the substrate of the next lot can be shortened. However, the present invention is not limited to this, and the substrate transfer apparatus can be implemented as one unit for the entire production line.

  DESCRIPTION OF SYMBOLS 10a, 10b ... Board | substrate conveyance apparatus, 25a, 25b ... Outer guide rail, 26a, 26b ... Center side guide rail, 30 ... Conveyor width change apparatus, 40 ... Component transfer apparatus, 41, 42a, 42b ... Head transfer mechanism (Fixed rail, head moving rail), 43a, 43b ... component picking head, 45a, 45b ... component supply device, 52 ... first shift device, 55 ... shift device, 56 ... shift device with inspection process, 60 ... control device, 63 ... Storage unit, 64 ... Input unit, Sa, Sb ... Substrate, Si ... Interference risk area.

Claims (27)

  Two substrate transfer devices each for transferring a substrate, a component supply device that supplies a plurality of types of components to be mounted on the substrate, and a component supplied from the component supply device is collected and mounted on the substrate A component mounting apparatus comprising a component transfer head including a component transfer head and a component transfer device including a head transfer mechanism that moves the component pickup head in at least two directions parallel to the surface of the substrate. A component mounting apparatus that mounts a component that is to be replaced or replaced at the same time on two substrates transported to a component mounting position by the substrate transport apparatus.   2. The component mounting according to claim 1, wherein the two board transfer devices are arranged in parallel with each other by a linear transfer type conveyor, and the component supply device is arranged on each outer side of each of the board transfer devices. apparatus.   3. The component mounting apparatus according to claim 1, wherein a width in a direction orthogonal to a transport direction of each board transport device can be changed.   4. The component mounting apparatus according to claim 1, wherein the number of the component collecting head is one.   The component mounting apparatus according to claim 4, wherein the component sampling head alternately mounts components extracted from the component supply device on the two substrates.   5. The component mounting apparatus according to claim 4, wherein the component sampling head mounts components extracted from the component supply device on the two substrates in place of different mounting frequencies.   5. The component picking head according to claim 4, wherein when one of the substrates is being transferred after completion of component mounting, or when the substrate transfer device that transfers the one substrate is changing the width, A component mounting apparatus characterized in that mounting of components on the other substrate is concentrated.   4. The component mounting apparatus according to claim 1, wherein the number of the component sampling heads is two, and each component sampling head is independently moved by a different head transfer mechanism.   9. The method according to claim 8, wherein any one of the component picking heads exclusively performs mounting of components on any one of the substrates, and the other component sampling head exclusively performs mounting of components on the other of the substrates. Component mounting device.   10. The component for the one board according to claim 9, wherein when any one of the boards is being transported after completion of component mounting, or when the board transport device for transporting the one board is being changed in width. One of the component picking heads that exclusively mounts the component is mounted on the other substrate by the other component picking head, and mounts the component on the other substrate.   9. The component mounting apparatus according to claim 8, wherein stop positions of the boards at the time of component mounting in the two board transfer apparatuses are made different from each other.   9. When the component is mounted on any one of the substrates in a predetermined interference risk area in which any one of the component sampling heads approaches a central portion between the two substrates, The component mounting apparatus, wherein the component picking head mounts components on the other substrate in an interference safety area excluding the interference danger area.   9. The component picking head according to claim 8, wherein when any one of the substrates is being transported after completion of component mounting or when the substrate transporting device that transports the one substrate is being changed in width. A component mounting apparatus, wherein a component is mounted on the other substrate in a predetermined interference risk area close to a central portion between the substrates.   14. The device according to claim 1, wherein one of the two substrate transfer devices is dedicated to a fixed-product type that transfers only a fixed-product-type product substrate, and the other is used for an interrupt-type product having a different substrate width. A component mounting apparatus comprising means for setting an interrupt type for transferring a board.   15. In the case of switching from the first fixed production type in which the fixed production type is mounted on one board transfer device to the second fixed production type in claim 14, the second fixed production type is mounted on the other board transfer device before switching. In this case, the means for trial production and the other substrate transport device at the time of switching are dedicated to a predetermined product type that transports only the product substrate of the fixed production product type, and one substrate transport device is used for an interrupt product product substrate of a different product width. A component mounting apparatus comprising means for changing and setting the setting means so as to change the interrupt type to be conveyed.   14. The method according to claim 1, wherein when the product type mounted on the two substrate transfer devices is changed from the first product type to the second product type, the first product type is changed by the one substrate transfer device. Means for trial mounting the second product type with the other substrate transfer device during mounting, and after the second product type has started to be fully mounted with the other substrate transfer device, A component mounting apparatus comprising means for trial mounting two types.   Two substrate transport devices each having two guide rails for guiding both sides of the substrate and transporting the substrates in directions parallel to each other, and an outer side opposite to the adjacent central sides of the two substrate transport devices Each of two component supply devices, a component collection head for collecting the components supplied from the component supply device and mounting them on the substrate, and the component collection head at least parallel to the surface of the substrate. In the component mounting apparatus including the component transfer device including the head transfer mechanism that moves in the direction, each of the two guide rails of each of the substrate transfer devices is fixed to each of the outer guide rails adjacent to the component supply device. The component mounting apparatus is characterized in that the position of each guide rail on the center side can be adjusted in a direction orthogonal to the extending direction of the guide rail.   Two substrate transfer devices each having two guide rails for guiding both sides of the substrate and transferring the substrate in a direction parallel to each other, and an outer side opposite to the adjacent central sides of the two substrate transfer devices The two component supply devices provided in each, the guide rail position adjusting means for adjusting the position of each guide rail in the direction orthogonal to the extending direction, and the components supplied from the component supply device In the component mounting apparatus comprising a component transfer device comprising a component picking head to be mounted on the substrate and a head transfer mechanism for moving the component picking head in at least two directions parallel to the surface of the substrate. When the adjusting means positions the outer guide rails adjacent to the component supply device among the two guide rails at a position closest to the component supply device. Moni, the component mounting apparatus characterized by positioning in accordance with the width of the substrate for carrying the respective guide rails on the center side.   Two substrate transfer devices each for transferring a substrate, at least one component supply device for supplying a plurality of types of components to be mounted on the substrate, and collecting the components supplied from the component supply device A component provided with at least one component picking head to be mounted thereon and a component transfer device comprising the same number of head picking mechanisms as the component picking head for moving the component picking head in at least two directions parallel to the surface of the substrate. In the program for controlling the operation of the mounting device, the component transfer device mounts a replacement component simultaneously or on two substrates transported to the component mounting position by the two substrate transport devices. When the board is being transported after component mounting is complete, or when the board transport device that transports one of the boards is changing the width, Goods picking head Programs and controlling to perform to concentrate part of the mounting to the other of said substrate.   Two substrate transfer devices each for transferring a substrate, at least one component supply device for supplying a plurality of types of components to be mounted on the substrate, and collecting the components supplied from the component supply device Operation of a component mounting apparatus comprising two component picking heads to be mounted thereon and a component transfer device comprising two head transfer mechanisms for moving each of these component picking heads in at least two directions parallel to the surface of the substrate. In the program to be controlled, the component transfer device mounts a component to be replaced simultaneously with or on the two substrates transported to the component mounting position by the two substrate transport devices, and one of the component sampling heads When a component is mounted on any one of the substrates in a predetermined interference risk area close to the center between the two substrates, the other component sampling head Program and controlling to perform component mounting to the other of the substrate in the interference safety area excluding the interference dangerous zone.   Two substrate transfer devices, a component supply device that supplies a plurality of types of components to be mounted on the substrate, a component sampling head that collects components supplied from the component supply device and mounts them on the substrate, and this component Of the two substrate transfer devices and the component transfer device having a head transfer mechanism that moves the sampling head in at least two directions parallel to the surface of the substrate, one of the two substrate transfer devices transfers only a product substrate of a fixed production type A part that is dedicated to a predetermined product type, and has the other means for setting an interrupt product type for transporting product boards of interrupt product types having different board widths, and a rail width changing device for changing the rail width of each board transfer device. In the program for controlling the operation of the mounting device, according to the production command of the interrupted product other than the fixed production product, the product board of the fixed production product is discharged from the other substrate transfer device, The mounting program executed by the other board transfer device is switched to the mounting program corresponding to the interrupt type, the other board transfer device is changed to a rail width corresponding to the product board of the interrupt type, and the other board transfer device is changed. A program characterized in that a board for a product of the interrupt type is loaded into a board transfer device and a component is mounted thereon.   Two substrate transfer devices, a component supply device that supplies a plurality of types of components to be mounted on the substrate, a component sampling head that collects components supplied from the component supply device and mounts them on the substrate, and this component Of the two substrate transfer devices, one of the component transfer device having a head transfer mechanism that moves the sampling head in at least two directions parallel to the surface of the substrate, and one of the two substrate transfer devices conveys only a substrate for product of a fixed production type In the program for controlling the operation of the component mounting apparatus, which is dedicated to the fixed production type, and the other is a setting means for setting the interrupt type for transferring the product board of the interrupt type having a different board width, the fixed production type is selected. When switching from the first fixed production type mounted on one board transfer device to the second fixed production type, the second fixed production type is mounted on the other board transfer device and trial production is performed before switching. The other board transfer device is dedicated to the fixed production type that transfers only the fixed production product board, and the other board transfer device is changed to the interrupt type that transfers the product board of the interrupt type with a different board width. A program characterized by changing the setting of the setting means.   Two substrate transfer devices, a component supply device that supplies a plurality of types of components to be mounted on the substrate, a component sampling head that collects components supplied from the component supply device and mounts them on the substrate, and this component In a program for controlling the operation of a component mounting apparatus comprising a component transfer device having a head transfer mechanism for moving a sampling head in at least two directions parallel to the surface of the substrate, the program is mounted by the two substrate transfer devices. When changing the product type from the first product type to the second product type, the second product type is tested on the other substrate transfer device while the first product type is being mounted on the one substrate transfer device. A program which is mounted and controlled so that the second board is trial-mounted by the one board transfer device after the second board type is fully mounted by the other board transfer machine.   Two substrate transport devices each having two guide rails for guiding both sides of the substrate and transporting the substrate in a direction parallel to each other, and a side opposite to the side where the two substrate transport devices are adjacent to each other Two component supply devices provided, guide rail position adjusting means for adjusting the position of each guide rail in a direction orthogonal to the extending direction thereof, and collecting components supplied from the component supply device on the substrate A program for controlling the operation of a component mounting apparatus comprising a component transfer device comprising a component picking head to be mounted and a head transfer mechanism for moving the component picking head in at least two directions parallel to the surface of the substrate, Of the two guide rails, each outer guide rail adjacent to the component supply device is positioned closest to the component supply device, and the center side A program characterized by positioning in accordance with the width of the substrate for carrying the respective guide rail.   Two substrate transfer devices each for transferring a substrate, a component supply device that supplies a plurality of types of components to be mounted on the substrate, and a component supplied from the component supply device is collected and mounted on the substrate In the component mounting system using the component mounting apparatus provided with the component transfer apparatus, the two component transfer apparatuses respectively transfer the two substrates transferred to the component mounting position by the two substrate transfer apparatuses. A first production mode for mounting components, and one of the substrate transfer devices is used as a mounting conveyor for mounting components on the substrate by the component transfer device, and the other substrate transfer device is used for the component transfer. One of the second production modes used as a bypass conveyor for bypassing a substrate on which no component is mounted by the mounting device can be selected. Implementation system.   Two substrate transfer devices each for transferring a substrate, a component supply device that supplies a plurality of types of components to be mounted on the substrate, and a component supplied from the component supply device is collected and mounted on the substrate In the component mounting system using the component mounting apparatus provided with the component transfer apparatus, the two component transfer apparatuses respectively transfer the two substrates transferred to the component mounting position by the two substrate transfer apparatuses. A first production mode for mounting components, and one of the substrate transfer devices is used as a mounting conveyor for mounting components on the substrate by the component transfer device, and the other substrate transfer device is used for the component transfer. Either one of the second production modes used as a return conveyor for returning the substrate that needs to be mounted again by the mounting device to the carry-in side of the component mounting device can be selected. Component mounting system according to claim Rukoto. 27. The component mounting system according to claim 26, wherein a shift device is provided on the carry-in side of the component mounter for transferring the substrate returned to the carry-in side by the other substrate carrying device to the one substrate carrying device, On the carry-out side of the component mounting apparatus, an inspection process for inspecting the board carried out by the one board transport device and replacing a board that is re-mountable although there is a missing part with the other board transport device. A component mounting system characterized in that a shift device is provided.

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