JP2009038361A - Three-dimensional printed circuit board, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package substrate wherein a thin mounting substrate is indispensable for actualizing down-sizing, small thickness, light weight, high definition, multifunction or the like for mobile devices, or compact, low height and three-dimensional mounting corresponding to multifunction and multi pin of semiconductors can be easily actualized. <P>SOLUTION: The three-dimensional printed circuit board 15 is provided with a frame-like upper substrate 1, a planar lower substrate 2, and a connecting layer 3 connecting these substrates. In this case, the thickness of the lower substrate 2 is smaller than the total sum of those of the upper substrate 1 and the connecting layer 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a three-dimensional printed wiring board widely used in various electronic devices such as a personal computer, a mobile communication telephone, and a video camera.

  In recent years, electronic components are often mounted on thin printed circuit boards in order to cope with further downsizing and weight reduction of electronic devices, and the strength of the board itself is low, and warping and twisting are likely to occur. Has become difficult. In particular, when the thickness is 500 μm or less, because of warping and twisting, productivity in cream solder printing, which is a surface mounting process of electronic components, work in an electronic component automatic mounting machine, and a reflow process is reduced.

  Therefore, in order to solve the above-described problems, as a prior art, a thin printed wiring board using a carrier for conveyance that can improve productivity in a surface mounting process to a thin printed wiring board as shown in Patent Document 1 An implementation method has been proposed.

  As shown in FIG. 11, the carrier for transport 21 is formed by forming a weak adhesive layer 22 for releasably attaching a thin printed wiring board 25 on the surface of a base substrate 23 made of a plate. Yes, when the thin printed wiring board 25 is attached to the surface of the carrier 21 for transportation via the weak adhesive layer 22, the carrier 21 reinforces the thin printed wiring board 25, and the weak adhesive layer 22. Restricts warping and twisting of the thin printed wiring board 25 and fixes the position.

  As shown in FIG. 12, the thin printed wiring board mounting method using the carrier for carrier has (a) a weakly adhesive adhesive on the surface of the carrier 21 formed by forming a weakly adhesive layer 22 as shown in FIG. A thin printed wiring board 25 is pasted through the layer 22, and (b) a metal mask 31 having holes drilled at necessary locations is aligned with the surface of the thin printed wiring board 25 and polymerized, and then cream solder 32 (C) Next, after removing the metal mask, an electronic component such as a semiconductor chip 26 is mounted on the cream solder 32 remaining on the thin printed wiring board 25. Then, heating is performed using a reflow furnace or the like. (D) Thereafter, the carrier for transport is removed.

The weak adhesive layer is made of a weak adhesive resin that has high heat resistance and does not cause resin transfer even at room temperature or reflow, or has a very small transfer amount.
JP 2001-144430 A

  In particular, the printed wiring board with a thin total thickness is insufficient in rigidity, so when mounting large parts such as semiconductor chips at high temperatures such as in reflow processes, the process must be carried out without using the above carrier for transportation. I could not.

  The present invention has been made in view of the above problems, and has a thin mounting body that is small in warpage even after mounting a large part such as a semiconductor chip at a high temperature such as a reflow process, and does not require a carrier for transportation. A three-dimensional printed wiring board that can be configured is provided.

  In order to achieve the above object, the present invention is a three-dimensional printed wiring board comprising a frame-shaped upper substrate, a planar lower substrate, and a connection layer connecting these substrates. The three-dimensional printed wiring board is characterized in that the thickness of the lower substrate is configured to be thinner than the sum of the thicknesses of the upper substrate and the connection layer. Since the upper board has a frame-like frame shape, component mounting is possible in the formed recess, and the thickness as a printed wiring board can be increased, so that the rigidity of the board can be secured, Even during high temperatures during reflow processes and after mounting large parts such as semiconductor chips, warping is small, and it is possible to configure a thin mounting body without the need for a carrier for transport, realizing a thin three-dimensional printed wiring board be able to.

  As described above, the present invention can reduce warping and increase the wiring density in a substrate even during high temperatures such as a reflow process or after mounting a large component such as a semiconductor chip. Providing a mounting form that easily realizes small size, low profile, and three-dimensional mounting corresponding to high functionality and multiple pins of semiconductors necessary for realizing compact, thin, lightweight, high definition, multi-functionality, etc. It becomes possible to do.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view and a cross-sectional view of a three-dimensional printed wiring board according to an embodiment of the present invention. The three-dimensional printed wiring board according to the present embodiment includes a frame-shaped upper substrate 1, a planar lower substrate 2 on which wiring is formed on at least the surface, and a connection layer that connects these substrates 3, the upper substrate 1 and the lower substrate 2 have different shapes, so that a recess 4 serving as a cavity is formed as shown in FIG. In the present invention, the thickness of the lower substrate 2 is configured to be thinner than the total thickness of the upper substrate 1 and the connection layer 3.

  The connection layer 3 desirably has a thickness of 30 to 300 μm, more preferably 30 to 250 μm. If the thickness is less than 30 μm, the embedding property of the wiring is deteriorated, and if it exceeds 300 μm, the via aspect ratio is maintained, so that it is difficult to reduce the diameter of the via or connection reliability may be impaired.

  As shown in FIG. 1B, by mounting the mounting component 5 in the recess 4, the total thickness of the mounting body can be reduced. In the present invention, the lower substrate 2 has a pole of 400 μm or less. Even a thin substrate can ensure rigidity. Further, in the present invention, the upper substrate 1 is provided as a frame-like frame shape in order to give the rigidity of the substrate body. In the present invention, the upper substrate 1 may or may not have wiring, and can be used as a frame regardless of whether or not it has a via. Moreover, if it is the structure which has rigidity as a three-dimensional printed wiring board, the sum total of the thickness of the upper board | substrate 1 and the connection layer 3 which were frame-shaped frame shape is the most among the mounting components 5 mounted in the recessed part 4. You may form with the thickness below the height of a high component.

  An enlarged cross-sectional view of the connection layer 3 in this embodiment is shown in FIG. The connection layer 3 is made of an insulating material in which an inorganic filler is dispersed in a thermosetting resin. In the present invention, as shown in FIG. 1C, a through hole may be formed at a predetermined position of the connection layer 3, and the via 7 may be formed by filling the through hole with the conductive paste 6. 7 may not be included.

  In the present invention, the inorganic filler in the connection layer 3 is preferably composed of at least one of silica, alumina, and barium titanate. Moreover, it is preferable that the particle size of the inorganic filler in the connection layer 3 is 1 to 15 μm, and the content of the inorganic filler is 70 to 90% by weight. If the content of the inorganic filler is less than 70%, the amount of the inorganic filler forming the connection layer 3 is less than the amount of the thermosetting resin and is in a rough state, and when the thermosetting resin flows during the press, At the same time, the inorganic filler also flows, and if it exceeds 90%, the resin amount of the connection layer 3 becomes too small, and the embeddability and adhesion of the wiring may be impaired.

  The conductive paste 6 used for the three-dimensional printed wiring board of the present invention is composed of copper, silver, gold, palladium, bismuth, tin, and alloys thereof, and preferably has a particle size of 1 to 20 μm.

  Next, the manufacturing process of the three-dimensional printed wiring board of this Embodiment is demonstrated in detail using FIGS.

  First, as shown in FIG. 2A, the PET film 8 is attached to both surfaces of the connection layer 3. Next, as shown in FIG. 2B, the connection layer 3 is cut into substantially the same shape as the upper substrate 1, and a through hole 9 is formed at a position where the wiring of the upper substrate 1 and the lower substrate 2 are connected. Thereafter, as shown in FIG. 2C, the through-hole 9 is filled with a conductive paste 6 made of copper or a copper alloy, and a via 7 is formed. Next, as shown in FIG. 2D, in order to bond the connection layer 3 to either the upper substrate 1 or the lower substrate 2, the PET film 8 on one surface is peeled off. Here, the lower PET film is peeled off in order to adhere to the lower substrate 2 first, but the upper PET film may be peeled off first.

  Next, as shown in FIG. 3 (A), the connection layer 3 is arranged while being aligned with a desired position of the planar lower substrate 2, and the connection layer 3 is connected as shown in FIG. 3 (B). The layer 3 is temporarily fixed on the wiring 10 formed on the lower substrate 2. The wiring 10 is embedded in the connection layer 3 during this lamination. By doing so, the conductive paste 6 is compressed, so that the connectivity with the wiring 10 is improved. Thereafter, as shown in FIG. 3C, the PET film 8 on the surface that has not been peeled first is peeled off. Here, the configuration in which the connection layer 3 includes the via 7 has been described. However, as described above, the connection layer 3 may or may not have the via 7.

  Next, as shown in FIG. 4 (A), the upper substrate 1 having a frame-like frame shape is disposed on the connection layer 3, and then, as shown in FIG. The three-dimensional printed wiring board 15 is completed. The wiring 10 is embedded in the connection layer 3 during this lamination. By doing so, the conductive paste 6 is further compressed, so that the connectivity with the wiring 10 is greatly improved.

  In the three-dimensional printed wiring board of the present invention, since the upper substrate 1 is provided in a frame-like frame shape, the rigidity of the substrate is ensured even if the lower substrate 2 is a thin printed wiring board of 400 μm or less. Is possible.

  In the present invention, it is preferable that a solder resist is formed in advance on the surface of the upper substrate 1 together with the lower substrate 2 before the connection layer 3 is disposed, and the surface layer wiring formed on the upper substrate 1 after the solder resist is formed. It is more preferable to roughen at least the region in contact with the connection layer.

  In this embodiment, the lower substrate 2 and the connection layer 3 are overlapped and then the upper substrate 1 is overlapped. However, the upper substrate 1 and the connection layer 3 are overlapped first, and then the lower substrate 2 is overlapped. They may be laminated together.

  In general, in the case of a structure having a dent, that is, a recess, dust, base powder, and the like are easily collected in the corner of the recess. In the case of a smooth printed wiring board having no recess, dust and powder were easily removed with a dust-removing adhesive roll, but it was difficult to remove the corner portion of the recess with the adhesive roll.

  Therefore, in order to prevent dust and powder from entering the recess 4, powder scattering to the recess 4 of the upper substrate 1, lower substrate 2 and connection layer 3, adhesion of dust and the like to the recess 4, and so on In order to prevent mounting defects due to the above, as shown in FIG. 5, a dry film-like permanent resist 11 having a thickness of 5 to 30 μm is pasted to cover the walls of the upper substrate 1, the lower substrate 2, and the connection layer 3. It is more preferable as the three-dimensional printed wiring board of the present invention. As a result, it is possible to prevent the powder and dust from adhering to the corner portions of the recess 4 in particular. When the thickness of the permanent resist 11 is less than 5 μm, pinholes are likely to be generated, resulting in insufficient coating. When the thickness exceeds 30 μm, the followability to the substrate may be deteriorated.

  The thermal expansion coefficient of the connection layer 3 of the present invention is desirably lower than the thermal expansion coefficient of the upper substrate 1 and the lower substrate 2, that is, 65 ppm / ° C. or lower, or lower than the thermal expansion coefficient of the printed wiring board.

  When it exceeds 65 ppm / ° C. or higher than the thermal expansion coefficients of the upper substrate 1 and the lower substrate 2, warping or deformation of the three-dimensional printed wiring board may easily occur due to deformation of the connection layer 3.

  Further, the glass transition point (DMA method Dynamic Mechanical Analysis dynamic viscoelasticity measurement method) of the connection layer 3 is desirably 185 ° C. or higher or higher by 10 ° C. or more than the upper substrate 1 and the lower substrate 2. If the temperature is less than 185 ° C. or the difference is less than 10 ° C., the warpage or undulation of the substrate may become a complicated shape or become irreversible in a process requiring a high temperature such as reflow.

  Moreover, the connection layer 3 uses the structure which does not contain core materials, such as a woven fabric, a nonwoven fabric, and a film. When the core material is included, it is difficult to embed the wiring patterns formed on the upper and lower printed wiring board surfaces as described above.

  The minimum melt viscosity of the connection layer 3 is suitably 1000 to 100,000 Pa · s as shown in the melt viscosity curve of FIG. If the pressure is less than 1000 Pa · s, the resin flow becomes large and may flow into the recess 4. If the pressure exceeds 100000 Pa · s, poor adhesion to the printed wiring board or poor embedding in the wiring 10 occurs. There is a fear.

  The connection layer 3 may contain a colorant. In this case, mountability and light reflectivity are improved.

  Moreover, in order to suppress the resin flow of the connection layer 3, that is, since it is necessary to prevent the resin from flowing into the recess 4, an elastomer for suppressing the resin flow is contained.

  In the present embodiment, a shield layer may be provided so as to cover the concave portion 4, whereby the strength of the three-dimensional printed wiring board 15 can be further improved and the shielding effect can be improved.

  The upper substrate 1 and the lower substrate 2 are not particularly limited as long as they are resin substrates such as through-hole wiring boards and all-layer IVH structure ALIVH wiring boards, and even double-sided boards are multilayer boards. May be. Also, a plurality of printed wiring boards and connection layers may be laminated alternately.

  The insulating material used for the upper substrate 1 and the lower substrate 2 is a composite of glass woven fabric and epoxy resin, but is selected from organic fibers, glass fibers, and alumina fibers selected from aramid and wholly aromatic polyesters. When composed of a composite material of a woven fabric composed of any of inorganic fibers and a thermosetting resin, p-aramid, polyimide, poly-p-phenylene benzobisoxazole, wholly aromatic polyester, PTFE, polyether A case where it is made of a composite material of a non-woven fabric and a thermosetting resin composed of organic fibers and glass fibers selected from sulfone and polyetherimide, and inorganic fibers selected from alumina fibers; and p-aramid and poly-p- Phenylenebenzobisoxazole, wholly aromatic polyester, polyetherimide, polyether keto Using a composite material in which a thermosetting resin layer is formed on both sides of a synthetic resin film of at least one of polyether ether ketone, polyethylene terephthalate, polytetrafluoroethylene, polyether sulfone, polyester terephthalate, polyimide and polyphenylene sulfide An insulating material may be formed.

  As the thermosetting resin, at least one thermosetting resin selected from an epoxy resin, a polybutadiene resin, a phenol resin, a polyimide resin, a polyamide resin, and a cyanate resin can be used.

(Embodiment 2)
Embodiment 2 of the present invention will be described below with reference to the drawings. In addition, about what has the same structure as Embodiment 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  FIG. 7 is a perspective view and a sectional view of a three-dimensional printed wiring board according to the embodiment of the present invention. The three-dimensional printed wiring board of the present embodiment has the same configuration as the three-dimensional printed wiring board of the first embodiment. A feature of the second embodiment is that the connection layer 3 is made of an insulating material containing a thermoplastic resin.

  When the connection layer 3 has paste vias, the conductive paste 6 used for the three-dimensional printed wiring board of the present invention is made of copper, silver, gold, palladium, bismuth, tin and alloys thereof as in the first embodiment. It is comprised from the inside and it is preferable that a particle size is 1-20 micrometers. The connection layer 3 may or may not have vias.

  As shown in FIG. 7B, by mounting the mounting component 5 in the recess 4, the total thickness of the mounting body can be reduced. In the present invention, the lower substrate 2 has a pole of 400 μm or less. Even a thin substrate can ensure rigidity. That is, in the present invention, the upper substrate 1 is provided in a frame-like frame shape in order to give the rigidity of the substrate body. In the present invention, the upper substrate 1 may or may not have wiring, and can be used as a frame regardless of whether or not it has a via. Moreover, if it is the structure which has rigidity as a three-dimensional printed wiring board, the sum total of the thickness of the upper board | substrate 1 and the connection layer 3 which were frame-shaped frame shape is the most among the mounting components 5 mounted in the recessed part 4. You may form with the thickness below the height of a high component.

  Next, the manufacturing process of the three-dimensional printed wiring board of this Embodiment is demonstrated in detail using FIG.

  First, since the connection layer 3 in the present embodiment does not have adhesiveness, the adhesive layer 12 made of a thermosetting resin having a thickness of 1 to 10 μm is formed as a temporary fixing means for attaching the cover film 13. In addition, when the thickness is less than 1 μm, pinholes are generated, and when the thickness is 10 μm, the cover film 13 may not be peeled off in a subsequent process, which is inappropriate. After forming the adhesive layer 12, cover films 13 are attached to both surfaces of the connection layer 3. This state is shown in FIG. Note that the adhesive layer 12 may be attached to an insulating material in which the connection layer described in Embodiment 1, that is, an inorganic filler is dispersed in a thermosetting resin.

  The adhesive layer 12 preferably has no tackiness at room temperature in order to improve laminating properties. Next, as shown in FIG. 8B, the connection layer 3 is cut into the shape of the upper substrate 1, and a through hole 9 is formed at a position where the wiring of the upper substrate 1 and the lower substrate 2 are connected. Next, as shown in FIG. 8C, the through-hole 9 is filled with a conductive paste 6 made of copper or a copper alloy, and a via 7 is formed. Next, as shown in FIG. 8D, in order to adhere the connection layer 3 to the upper substrate 1 and the lower substrate 2, the cover films 13 on both sides are peeled off.

  Next, as shown in FIG. 9A, the connection layer 3 is arranged so as to be overlapped while being aligned with desired positions of the upper substrate 1 and the lower substrate 2 which are frame frames. 3), the connection layer 3 is overlapped so as to be sandwiched between the upper substrate 1 and the lower substrate 2 and laminated while being heated and pressed to complete the three-dimensional printed wiring board 15. The wiring 10 is embedded in the connection layer 3 during this lamination. By doing so, the conductive paste 6 is further compressed, so that the connectivity with the wiring 10 is greatly improved. In this embodiment, the stacking method of FIGS. 3 to 4 of Embodiment 1 may be used.

  Further, as in the first embodiment, since the upper substrate 1 is provided in a frame-like frame shape, the rigidity of the substrate is ensured even if the lower substrate 2 is a thin printed wiring board of 400 μm or less. Is possible.

  Also in the first embodiment, the adhesive layer 12 may be formed before the PET film 8 is formed on the connection layer 3. In this case, the effect of preventing the material of the connection layer 3 from being crushed can be obtained.

  As in the first embodiment, in order to prevent dust and the like from adhering to the upper substrate 1, the lower substrate 2, and the concave portion 4 and mounting defects due to this, as shown in FIG. It is more preferable for the three-dimensional printed wiring board of the present invention to apply a dry film-like permanent resist 11 having a thickness to cover the wall surfaces of the upper substrate 1, the lower substrate 2 and the connection layer 3. As a result, it is possible to prevent dust and the like from adhering to the corners of the recess 4. When the thickness of the permanent resist 11 is less than 5 μm, pinholes are likely to be generated, resulting in insufficient coating. When the thickness exceeds 30 μm, the followability to the substrate may be deteriorated.

  As the thermoplastic resin of the connection layer 3 in the present embodiment, PPS (polyphenylene sulfide), PEEK (polyether ether ketone), PES (polyether sulfone), thermoplastic polyimide, or the like is used.

  The thermal expansion coefficient of the connection layer 3 of the present invention is desirably lower than the thermal expansion coefficient of the upper substrate 1 and the lower substrate 2, that is, 65 ppm / ° C. or lower, or lower than the thermal expansion coefficient of the printed wiring board.

  The glass transition point (DMA method) of the connection layer 3 is preferably 185 ° C. or higher or higher by 10 ° C. or more than the upper substrate 1 and the lower substrate 2.

  Moreover, the connection layer 3 uses the structure which does not contain core materials, such as a woven fabric, a nonwoven fabric, and a film. When the core material is included, it is difficult to embed the wiring patterns formed on the upper and lower printed wiring board surfaces as described above.

  As in the first embodiment, the minimum melt viscosity of the connection layer 3 is suitably 1000 to 100,000 Pa · s as shown in the melt viscosity curve of FIG.

  In the present embodiment, a shield layer may be provided so as to cover the concave portion 4, whereby the strength of the three-dimensional printed wiring board 15 can be further improved and the shielding effect can be improved.

  The upper substrate 1 and the lower substrate 2 are not particularly limited as long as they are resin substrates such as through-hole wiring boards and all-layer IVH structure ALIVH wiring boards, and even double-sided boards are multilayer boards. May be. Also, a plurality of printed wiring boards and connection layers may be laminated alternately.

  The insulating material used for the upper substrate 1 and the lower substrate 2 is a composite of glass woven fabric and epoxy resin, but is selected from organic fibers, glass fibers, and alumina fibers selected from aramid and wholly aromatic polyesters. When composed of a composite material of a woven fabric composed of any of inorganic fibers and a thermosetting resin, p-aramid, polyimide, poly-p-phenylene benzobisoxazole, wholly aromatic polyester, PTFE, polyether A case where it is made of a composite material of a non-woven fabric and a thermosetting resin composed of organic fibers and glass fibers selected from sulfone and polyetherimide, and inorganic fibers selected from alumina fibers; and p-aramid and poly-p- Phenylenebenzobisoxazole, wholly aromatic polyester, polyetherimide, polyether keto Using a composite material in which a thermosetting resin layer is formed on both sides of a synthetic resin film of at least one of polyether ether ketone, polyethylene terephthalate, polytetrafluoroethylene, polyether sulfone, polyester terephthalate, polyimide and polyphenylene sulfide An insulating material may be formed.

  As the thermosetting resin, at least one thermosetting resin selected from an epoxy resin, a polybutadiene resin, a phenol resin, a polyimide resin, a polyamide resin, and a cyanate resin can be used.

  The three-dimensional printed wiring board according to the present invention can be formed with a thin total board thickness as a mounting body after component mounting, so that it is small, thin, lightweight, high definition, multifunctional such as a personal computer, a digital camera, a mobile phone, etc. It can be used as a substrate for dealing with the above and the like, and can be used as one of methods for easily realizing a low-profile and three-dimensional mounting of a semiconductor package, and can be applied to applications related to these mounting substrates.

The perspective view and sectional drawing which show an example of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows an example of the three-dimensional printed wiring board in Embodiment 1 of this invention The figure which shows the melt viscosity of the connection layer of the three-dimensional printed wiring board in Embodiment 1, 2 of this invention The perspective view and sectional drawing which show an example of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional drawing which shows an example of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional view of a conventional printed wiring board Sectional view of a conventional printed wiring board

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Upper substrate 2 Lower substrate 3 Connection layer 4 Recessed part 5 Mounting component 6 Conductive paste 7 Via 8 PET film 9 Through-hole 10 Wiring 11 Permanent resist 12 Glue layer 13 Cover film 15 Three-dimensional printed wiring board

Claims (15)

A three-dimensional printed wiring board composed of an upper substrate having a frame-like frame shape, a planar lower substrate, and a connection layer connecting these substrates, and the thickness of the lower substrate is A three-dimensional printed wiring board characterized by being configured to be thinner than the total thickness of the upper substrate and the connection layer. 2. The three-dimensional printed wiring board according to claim 1, wherein a sum of thicknesses of the upper substrate having a frame-like frame shape and the connection layer is equal to or less than a height of a highest component among components to be mounted. A three-dimensional printed wiring board comprising an upper substrate having a frame-like frame shape, a planar lower substrate, and a connection layer connecting these substrates, wherein the connection layer includes an insulating resin The three-dimensional printed wiring board according to claim 1, wherein the three-dimensional printed wiring board is made of a conductive material, and has a through hole formed at a predetermined position of the insulating layer, and the through hole is filled with a conductive paste. The three-dimensional printed wiring board according to claim 1, wherein the connection layer is formed by dispersing an inorganic filler in a thermosetting resin. The three-dimensional printed wiring board according to claim 1, wherein the connection layer is made of a thermoplastic resin. The three-dimensional printed wiring board according to claim 1, wherein the connection layer does not include a core material. The three-dimensional printed wiring board according to claim 1, wherein wall surfaces of the connection layer, the upper substrate, and the lower substrate are covered with an insulating film. The three-dimensional printed wiring board according to claim 7, wherein the insulating coating contains an antistatic agent. The three-dimensional printed wiring board according to claim 1, wherein the connection layer contains a colorant. An upper substrate having a frame-like frame shape, a lower substrate having wiring formed on at least a surface thereof, and a connection layer having an insulating material containing a resin for connecting between the substrates are prepared. Cutting the connection layer into a shape substantially the same as the upper substrate to form a shape, overlaying the connection layer on the lower substrate or the upper substrate while aligning the lower substrate, and the lower substrate And a step of laminating the connection layer and the upper substrate while being heated and pressed. A method for producing a three-dimensional printed wiring board, comprising: The manufacturing method of the three-dimensional printed wiring board of Claim 10 provided with the process of forming a through-hole in the predetermined position of a connection layer, and the process of filling the said through-hole with an electrically conductive paste. Before preparing a connection layer having an insulating substrate containing a resin for connecting between these substrates, an upper substrate having a frame-like frame shape, a lower substrate having wiring formed on at least the surface, The manufacturing method of the three-dimensional printed wiring board of Claim 10 provided with the process of forming a soldering resist previously on the surface of the said lower side board | substrate. The manufacturing method of the three-dimensional printed wiring board of Claim 12 provided with the process of previously forming a soldering resist on the surface of an upper board | substrate. Before the step of laminating the lower substrate, the connection layer, and the upper substrate, the method includes a step of roughening at least a region in contact with the connection layer in the surface layer wiring previously formed on the lower substrate. The manufacturing method of the three-dimensional printed wiring board of Claim 10. Before the step of laminating the lower substrate, the connection layer, and the upper substrate, the method includes a step of roughening at least a region in contact with the connection layer in the surface layer wiring previously formed on the upper substrate. The manufacturing method of the three-dimensional printed wiring board of Claim 10.

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