JP2009022823A - Inspection apparatus and substrate treatment system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a flatness of a substrate (particularly, the flatness of a part to be photographed) when the substrate is photographed, and to photograph the upper surface of the substrate exactly. <P>SOLUTION: In an inspection apparatus 1, a first conveying part 5 and a second conveying part 6 which are a roller conveying mechanism conveying the substrate 90 at a horizontal attitude are provided. Further, a supporting part 2 is provided between the first conveying part 5 and the second conveying part 6 to floatation-support the substrate 90 during the conveyance, and at the same time, the substrate 90 at the floatation-supported state by the supporting part 2 is photographed by a line camera 31 photographing a line of an x-axis direction. The supporting part 2 floatation-supports the substrate 90 by air discharged from a floating stage at a state apart from the substrate 90. In such a manner, in a position E (photographing position) of a y-axis direction, a member of the inspection apparatus 1 does not abut to the substrate 90 over the whole width of the x-axis direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technique for inspecting a substrate. More specifically, the present invention relates to a technique for accurately imaging the substrate by improving the flatness of the upper surface of the substrate to be inspected.

  There is known an inspection apparatus that captures light reflected by the surface of a substrate coated with a treatment liquid such as a resist liquid with a camera and inspects the application unevenness of the treatment liquid based on the photographed image data. ing. On the other hand, “reduction of tact time” is the most important issue in the substrate manufacturing process, and reduction of processing time is an important issue even for an inspection apparatus.

  Therefore, conventionally, an inspection apparatus has been proposed in which a line camera is provided above a transport mechanism for transporting a substrate in the horizontal direction, and the substrate to be inspected is photographed and inspected without being stopped. Such an inspection apparatus is described in Patent Documents 1 and 2, for example. By configuring in this way, the inspection of the substrate can be completed while the substrate is being transported, so that the time required for the inspection is significantly larger than when the substrate is separately carried in and out of the inspection apparatus. Can be shortened.

JP 2004-333198 A JP 2004-266014 A

  When the inspection is performed based on the image data obtained by photographing the substrate with the camera, if the substrate in the photographing region is bent, the substrate cannot be accurately photographed, and the inspection accuracy is lowered. Therefore, when the substrate being transported is photographed with a line camera, it is important to improve the flatness of at least the portion of the substrate that is photographed simultaneously (the portion extending in the direction orthogonal to the transport direction). .

  However, in the techniques described in Patent Document 1 and Patent Document 2, since the end of the portion to be photographed of the substrate is held at the time of photographing, between the held end and the central portion. There was a problem that the substrate was bent. In addition, a method has been proposed in which a support roller is supported from below without holding the end portion. However, even in this case, the substrate is bent between the portion where the transport roller is in contact with the other portion. I'll be stuck. That is, in the conventional technique, since the external force acting on the portion to be photographed is non-uniform, there is a problem that the portion is bent and the flatness is lowered.

  In order to make the external force acting on the portion extending in the direction orthogonal to the transport direction uniform, it is also conceivable to place the substrate on a flat stage and take an image while moving the stage. However, in this case, the flatness of the stage itself becomes a problem (particularly, it becomes difficult to process the stage flatly when the substrate becomes large). Further, since the stage is shuttled, it is necessary to deliver the substrate to the stage via an elevating pin or the like, and there is a problem that it takes time to deliver the substrate to the stage.

  The present invention has been made in view of the above problems, and improves the flatness of a substrate (particularly, the flatness of a portion to be imaged) with a simple configuration while suppressing an increase in transport time. The purpose is to accurately photograph the upper surface of the substrate.

  In order to solve the above-mentioned problems, the invention of claim 1 is an inspection apparatus for inspecting an inspection region set on the upper surface of a substrate, the transport means for horizontally transporting a substrate in a horizontal position in a first direction; Air is blown from below the substrate being transported by the transporting means, and the supported portion of the substrate spanning the entire width in the second direction perpendicular to the first direction is levitated and supported in a state of being separated from the supported portion. A support means; an exhaust means for exhausting an atmosphere below the substrate in a state where the supported part is supported by levitation by the support means; and the second direction among the supported parts supported by the support means. Imaging means for simultaneously imaging the imaging portion, wherein the conveying means is provided on a first drive roller provided on the upstream side in the first direction of the support means and on a downstream side in the first direction of the support means. Is And a second driving roller, and the first drive roller and the second drive roller by rotating, characterized in that the substrate of the horizontal position is horizontally conveyed in the first direction.

  The invention of claim 2 is the inspection apparatus according to the invention of claim 1, wherein the support means blows air over the entire width of the supported portion in the second direction.

  According to a third aspect of the present invention, there is provided the inspection apparatus according to the first or second aspect of the invention, wherein the imaging portion includes a full width of the inspection region of the substrate in the second direction.

  According to a fourth aspect of the present invention, there is provided the inspection apparatus according to any one of the first to third aspects of the present invention, further comprising positioning means for determining a position of the substrate in the second direction.

  The invention of claim 5 is the inspection apparatus according to any one of claims 1 to 4, further comprising changing means for changing the orientation of the substrate.

  According to a sixth aspect of the present invention, there is provided a substrate processing system comprising: an inspection apparatus that inspects an inspection region set on an upper surface of a substrate; a processing unit that processes the substrate; and a substrate that is transferred from the processing unit to the inspection apparatus. A loading means for carrying in, and a carrying out means for carrying out the substrate from the inspection apparatus. The inspection apparatus horizontally conveys a horizontally oriented substrate in a first direction; and the substrate being conveyed by the conveyance means. A support means for blowing and supporting air from below to support a floating portion of the substrate extending in the second direction orthogonal to the first direction in a state of being separated from the supported portion; and the support means. At the same time, an exhaust unit that exhausts the atmosphere below the substrate in a state where the supported part is supported by levitation and an imaging part that has the second direction as a longitudinal direction among the supported parts that are supported by the support unit. Imaging means, and the conveying means includes a first drive roller provided upstream of the support means in the first direction and a second drive roller provided downstream of the support means in the first direction. And the first driving roller and the second driving roller rotate to horizontally transport the horizontal substrate in the first direction by the transporting means, and the carry-in means moves the substrate to the first driving roller. The unloading means unloads the substrate from the second drive roller.

  According to the first to sixth aspects of the present invention, air is blown from below the substrate in a horizontal posture, and the supported portion over the entire width in the second direction of the substrate is levitated and supported while being separated from the supported portion. By simultaneously imaging the imaging part having the second direction as the longitudinal direction among the supported parts to be supported, the deflection of the imaging part of the substrate can be suppressed, and the flatness of the upper surface of the imaging part can be improved. Therefore, the substrate can be imaged with high accuracy, and the inspection accuracy is improved.

  By floating and supporting the supported portion of the substrate being transported by the transporting means, it is possible to capture an image without stopping the substrate, so that the tact time can be shortened.

  By evacuating the atmosphere below the substrate in a state where the supported portion is supported by the support by the support means, an adsorption action by the exhaust can be added, and a so-called edge cutting effect against vibration can be obtained. Therefore, the flatness can be further improved.

  According to the second aspect of the present invention, by blowing air over the entire width of the supported portion in the second direction, the flatness can be further improved as compared with the case of blowing air to a part of the supported portion.

  According to the third aspect of the present invention, since the imaging portion includes the entire width of the inspection region of the substrate in the second direction, it is not necessary to relatively move the imaging means and the substrate in the second direction. Therefore, the cost can be suppressed because the device configuration is simple.

  According to the fourth aspect of the present invention, since the position accuracy of the substrate is improved by determining the position of the substrate in the second direction, the inspection region can be accurately imaged.

  According to the fifth aspect of the invention, by changing the direction of the substrate, the substrate can be set in the direction corresponding to the inspection regardless of the direction of the substrate at the time of carrying in / out. Therefore, inspection accuracy can be improved. Further, the orientation of the substrate can be changed according to the orientation of the substrate required by the upstream or downstream device of the inspection apparatus.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

<1. Embodiment>
FIG. 1 is a plan view of a substrate processing system 100 including an inspection apparatus 1 according to the present invention.

  In FIG. 1, for the sake of illustration and explanation, the Z-axis direction is defined as the vertical direction and the XY plane is defined as the horizontal plane, but these are defined for convenience in order to grasp the positional relationship. The directions described below are not limited. The same applies to the following drawings.

  In addition to the inspection apparatus 1, the substrate processing system 100 includes a loading unit 101 into which a substrate 90 to be processed is loaded, a cleaning unit 102 that cleans and cleans the substrate 90, and a temperature control unit that adjusts the substrate 90 to a predetermined temperature. 103, 104, 106 are provided.

  Although not shown in detail, the temperature control units 103, 104, and 106 include a heating unit (hot plate) for heating the substrate 90, a cooling unit (cool plate) for cooling the substrate 90, and the substrate 90 between these units. A transport unit for transporting

  In addition, the substrate processing system 100 includes an application unit 105 that forms a thin film by applying a chemical solution such as a resist solution on the surface of the substrate 90, an exposure unit 107 that exposes a circuit pattern or the like on the surface of the substrate 90, and an exposed substrate 90. A developing unit 108 for developing the substrate 90 and an unloading unit 109 for unloading the substrate 90 that has been processed in the substrate processing system 100.

  The substrate processing system 100 having such a configuration uses a square glass substrate for manufacturing a screen panel of a liquid crystal display device as the substrate to be processed 90. The substrate processing system 100 includes a main controller (not shown), and data communication is possible between the main controller and each component (for example, the inspection apparatus 1).

  FIG. 2 is a plan view of the inspection apparatus 1. FIG. 3 is a side view of the inspection apparatus 1. Further, FIG. 4 is a diagram showing a supported portion 91 and an imaging portion 92 on the substrate 90. 2 to 4, a specific position in the Y-axis direction in the inspection apparatus 1 is shown as “E”.

  The inspection apparatus 1 includes a support unit 2 that floats and supports a supported portion 91 of a substrate 90, an imaging unit 3 that captures an imaging portion 92 of the substrate 90, and a transport unit 4 that transports the substrate 90 in a horizontal posture. Although details will be described later, the inspection apparatus 1 uses the imaging unit 3 to inspect the inspection area 93 set on the upper surface of the substrate 90 in the horizontal posture while horizontally transporting the substrate 90 in the (+ Y) direction by the transport unit 4. It is configured as an apparatus for imaging and inspecting. The inspection apparatus 1 is an apparatus that inspects unevenness particularly occurring on the surface of the substrate 90. In the present embodiment, the inspection apparatus 1 is an apparatus that detects development unevenness or coating unevenness.

  As shown in FIG. 4, the supported portion 91 and the imaging portion 92 are defined on the substrate 90 being transported by the relative positional relationship with respect to the position E fixed in the inspection apparatus 1.

  The supported portion 91, which is a part of the substrate 90, has the same size in the X axis direction as the size W 1 of the entire width of the substrate 90 in the X axis direction. That is, the supported portion 91 is a portion extending over the entire width of the substrate 90 in the X-axis direction. The size of the supported portion 91 in the Y-axis direction is “D”, and the approximate center in the Y-axis direction coincides with the position E. That is, as the substrate 90 moves in the (+ Y) direction (conveyance direction), the position of the supported portion 91 also moves sequentially in the (−Y) direction.

  An imaging portion 92 indicated by a thick line in FIG. 4 is a portion of the supported portion 91 whose longitudinal direction is the X-axis direction. The size of the imaging portion 92 in the Y-axis direction is very small, and will be described later in detail, but is the same as the size of the imaging region of the imaging unit 3 in the Y-axis direction. In addition, the position of the imaging portion 92 in the Y-axis direction is “E”, and the imaging portion 92 is also sequentially moved in the (−Y) direction as the substrate 90 is conveyed. In other words, the imaging part 92 is a part of the substrate 90 and becomes a subject of the imaging unit 3 at a certain moment. More specifically, the upper surface of the imaging part 92 is simultaneously imaged by the imaging unit 3.

In the present embodiment, as shown in FIG. 4, the entire upper surface of the substrate 90 is set as the inspection region 93. Thus, the size W ₁ of the total width of the X-axis direction of the substrate 90, and the size W ₂ in the X-axis direction of the entire width of the inspection area 93 are the same. However, the inspection region 93 may be set so as not to include a slight end region, for example.

  As shown in FIG. 3, the support unit 2 includes an exhaust mechanism 20, a supply mechanism 21, and a stage 22.

  The exhaust mechanism 20 includes a negative pressure source such as a vacuum pump, and drives the vacuum pump to exhaust the atmosphere below the substrate 90 in a state where the supported portion 91 is supported to be levitated as described later. It has a function. The supply mechanism 21 has a function as a positive pressure source for supplying gas (air) to the stage 22.

  FIG. 5 is a diagram showing the stage 22. As shown in FIG. 5, the stage 22 includes a floating stage 23 and a pair of suction stages 24. As shown in FIGS. 2 and 3, the stage 22 is disposed between the first transport unit 5 and the second transport unit 6.

The size W of the stage 22 in the X-axis direction is designed to be approximately the same as the size of the long axes 52 and 62 in the X-axis direction, and at least the size of the substrate 90 transported by the transport unit 4 in the X-axis direction. W is greater than _1.

The levitation stage 23 includes a chamber 26 and a porous member 27. As shown in FIG. 5, the size of the levitation stage 23 in the Y-axis direction is “D ₁ ”. The levitation stage 23 (stage 22) is arranged so that the center position of the levitation stage 23 in the Y-axis direction is “E”.

The size of the levitation stage 23 in the X-axis direction is “W”, which is the same as the size of the stage 22 in the X-axis direction, and is larger than the size W _{1 of} the substrate 90 in the X-axis direction. That is, the levitation stage 23 (the porous member 27) is disposed below the substrate 90 over the entire width of the substrate 90 in the X-axis direction.

  Although not shown in detail in FIG. 5, the chamber 26 is a substantially box-like structure without an upper surface, and the inside is hollow. A supply pipe of the supply mechanism 21 is connected below the chamber 26 so as to communicate with the inside of the chamber 26. With such a structure, the air supplied from the supply mechanism 21 is supplied into the chamber 26 through the supply pipe. That is, when the supply mechanism 21 is driven, air is supplied into the chamber 26 and the internal pressure of the chamber 26 increases.

  The porous member 27 is a plate-like member having a structure in which the surface and the inside communicate with each other. The porous member 27 is fixed to the upper portion of the chamber 26 and constitutes a lid portion of the chamber 26. Further, the side surface of the porous member 27 is sealed so that air supplied to the inside does not leak in the side surface direction. The sealing process is, for example, a process of filling holes formed in the side surface of the porous member 27 with putty or the like, but is not limited to this.

  As described above, when air is supplied into the chamber 26 by the supply mechanism 21 and the inside of the chamber 26 is pressurized, the inside of the porous member 27 is formed from a large number of holes formed on the entire back surface of the porous member 27. The air enters the air and is discharged from a number of holes formed on the entire upper surface of the porous member 27. That is, the porous member 27 has a function of causing the air supplied from the supply mechanism 21 to be discharged almost uniformly from the entire upper surface in the (+ Z) direction and generating an upflow at the position where the porous member 27 is disposed. .

  As described above, the porous member 27 is disposed below the substrate 90 that is transported between the first transport unit 5 and the second transport unit 6. Therefore, the upflow (air discharged from the porous member 27) generated by the porous member 27 is blown to the back surface of the substrate 90, and the portion to which the upflow is blown is supported by the levitation stage 23.

Of the portion of the substrate 90, the portion to which the air discharged from the porous member 27 is blown in this way becomes the supported portion 91 of the substrate 90. That is, although it has been described that the position of the supported portion 91 in the Y-axis direction is determined according to the position E, it is more directly determined by the arrangement position of the porous member 27 in the Y-axis direction. The size D of the supported portion 91 in the Y axis direction is determined by the size D ₁ of the porous member 27 in the Y axis direction.

Note that the size D ₁ of the levitation stage 23 in the Y-axis direction is determined according to the interval between the first transport unit 5 and the second transport unit 6. On the other hand, in order not to propagate the bending or the conveyance vibration of the substrate 90 generated in the first conveyance unit and the second conveyance unit 6 to the portion at the position E of the substrate 90 (imaging portion 92), the first conveyance unit 5 and the first conveyance unit 5 2 It is preferable that the distance from the transport unit 6 is wide. However, if the distance between the first transport unit 5 and the second transport unit 6 is too wide, the force required to float and support the supported portion 91 increases (the required capacity of the supply mechanism 21 increases). Therefore, the size D ₁ of the Y-axis direction of the floating stage 23 is appropriately determined according to various conditions.

The porous member 27 is arranged over a size W wider than the size W ₁ of the entire width of the substrate 90 in the X-axis direction. Therefore, the full width size W _{2 in} the X-axis direction of the supported portion 91, which is the portion to which the air discharged from the porous member 27 is blown, becomes the full width size W ₁ of the substrate 90 in the X-axis direction.

  With such a structure, the floating stage 23 of the inspection apparatus 1 discharges air over the entire width of the supported portion 91 in the X-axis direction while being separated from the supported portion 91 of the substrate 90. The supported portion 91 is lifted and supported. In other words, the inspection apparatus 1 has a structure in which any member of the inspection apparatus 1 does not contact the supported portion 91.

  The porous member 27 is made of a material having low light reflectivity on the outer surface. Thereby, the light projected from the rod illumination 30 and transmitted through the substrate 90 can be prevented from being reflected by the upper surface of the porous member 27 and entering the line camera 31.

  In addition, even if the porous member 27 is not a material with low reflectivity, the upper surface may be surface-treated so that the light reflected by the upper surface does not enter the line camera 31. Further, a plate-like member having low reflectivity may be attached to a part of the upper surface of the porous member 27. In either case, it is sufficient that the air discharge is not hindered.

  The pair of suction stages 24 are arranged adjacent to the vicinity of the levitation stage 23 so as to sandwich the levitation stage 23 from the front and rear in the transport direction (Y-axis direction) of the substrate 90. A suction groove 25 extending in the X-axis direction is provided on the upper surface of each suction stage 24. A plurality of suction ports are provided on the bottom surface of the suction groove 25, and these suction ports are connected to an exhaust pipe of the exhaust mechanism 20 connected to the back surface of the suction stage 24.

  With such a structure, when the exhaust mechanism 20 is driven, the atmosphere above each suction stage 24 (below the substrate 90) is sucked from the suction groove 25 and is external to the inspection apparatus 1 via the suction port and the exhaust pipe. Exhausted. That is, the suction stage 24 of the inspection apparatus 1 has a function of applying a uniform suction force (downward external force) in the X-axis direction to the substrate 90 transported upward.

  In this manner, in the vicinity of the position where the substrate 90 (supported portion 91) is levitated and supported, the atmosphere below the substrate 90 in a state where the supported portion 91 is levitated and supported is exhausted, and the vicinity of the position of the substrate 90 is detected. By applying a suction force (downward external force) to the substrate, the substrate 90 bending or transfer vibration generated in the first transfer unit 5 or the second transfer unit 6 propagates to the supported portion 91 (imaging portion 92). This can be suppressed, and a so-called edge cutting effect is exhibited.

  Therefore, the flatness of the supported portion 91 (imaging portion 92) can be further improved. As shown in FIG. 3, in the present embodiment, the suction of the suction stage 24 is performed so that the substrate 90 is not directly sucked (sticked) to the suction stage 24 even if the exhaust mechanism 20 is driven. The power is adjusted.

  Returning to FIG. 3, the imaging unit 3 includes a rod illumination 30 and a line camera 31.

  The rod illumination 30 is a rod-shaped illumination extending in the X-axis direction, and is set so as to illuminate a position where the upper surface of the substrate 90 and the position E coincide. The size of the rod illumination 30 in the X-axis direction is designed to be larger than the size of the imaging area of the line camera 31 in the X-axis direction. Thereby, the rod illumination 30 mainly has a function of illuminating the upper surface of the imaging portion 92 of the substrate 90.

  The line camera 31 includes M CCD elements (not shown), and has a structure in which M CCD elements are arranged in a line. The array direction of the CCD elements in the line camera 31 is associated with the X-axis direction. With such a structure, the image capturing area of the line camera 31 (the area that can be imaged simultaneously) is 1 pixel in the Y-axis direction and M pixels in the X-axis direction. That is, the imaging area of the line camera 31 is an area extending in the X-axis direction.

The value of M (the number of CCD elements) in the line camera 31 is determined so that the M pixel size is larger than the size W _{2 in} the X-axis direction of the inspection region 93 of the substrate 90. By determining the value of M in this way, the line camera 31 can simultaneously capture the entire width of the inspection region 93 in the X-axis direction.

  In the present embodiment, the value of M is determined so that the size in the X-axis direction of the imaging region of the line camera 31 is “W”. Thereby, even if the line camera 31 is a board | substrate with the largest size of a X-axis direction among the board | substrates which the conveyance part 4 conveys, it becomes possible to image simultaneously about the full width of a X-axis direction. However, the value of M is not limited to this.

As shown in FIG. 3, the line camera 31 captures an area of the upper surface of the substrate 90 where the position in the Y-axis direction is “E”. In the above description, the imaging part 92 has been described as a part in which the position in the Y-axis direction is “E” in a part of the substrate 90, but more directly, the imaging part 92 has a line camera on the top surface. This is a portion that coincides with 31 imaging regions. Therefore, the size of the imaging portion 92 in the X-axis direction is “W ₁ (W ₂ )”, which is the same as that of the substrate 90 (inspection region 93), and the size in the Y-axis direction is one pixel size.

  Thus, since the size of the imaging region of the line camera 31 in the Y-axis direction is one pixel size (very small), in the inspection apparatus 1, the flatness in the Y-axis direction of the substrate 90 does not matter so much. Some deflection of the substrate 90 in the direction is allowed.

  As shown in FIG. 3, the substrate 90 in the inspection apparatus 1 includes the transport roller 54 attached to the long shaft 52 disposed on the most (+ Y) side of the first transport unit 5 and the most of the second transport unit 6. It is supported in a state of being stretched between the transport roller 64 attached to the long shaft 62 disposed on the (−Y) side. That is, the flatness of the substrate 90 decreases in the Y-axis direction as compared to the X-axis direction, but the influence on the inspection accuracy is suppressed because the imaging region is set narrower in the Y-axis direction.

  Furthermore, the line camera 31 captures an image at a timing according to a control signal from a control unit (not shown), generates image data for one line for each imaging according to the output value of the CCD element, and performs the control. To the output.

  Various methods have been proposed for inspecting the inspection region 93 set on the upper surface of the substrate 90 based on the image data obtained in this way, and will not be described in detail here. However, for example, whether or not coating unevenness occurs in the X-axis direction can be determined by determining variation in the value of each pixel (output value of each CCD element) in image data for one line.

  The imaging timing by the line camera 31 is preferably a timing at which the substrate 90 is conveyed in the (+ Y) direction by a distance corresponding to one pixel size. By controlling in this way, the line camera 31 can image the entire inspection region 93 while the substrate 90 is being transported. However, the imaging timing is not limited to this, and imaging may be performed by appropriately decimating the inspection region 93 by delaying the imaging timing.

  The transport unit 4 shown in FIG. 2 includes a first transport unit 5 disposed on the upstream side of the support unit 2 in the Y-axis direction, and a second transport unit 6 disposed on the downstream side of the support unit 2 in the Y-axis direction. And has a function of horizontally transporting the substrate 90 in the (+ Y) direction. Although details will be described later, the transport unit 4 transports the substrate 90 with a so-called roller transport mechanism.

  The first transport unit 5 is one of a pair of support members 50 arranged to face each other in the X-axis direction, a plurality of long shafts 52 whose both ends are attached to the pair of support members 50, and the pair of support members 50. And a plurality of short shafts 53 attached to only one side.

  Both the long axis 52 and the short axis 53 are arranged substantially parallel to each other along the X-axis direction. Although not shown in detail, the long shaft 52 and the short shaft 53 are fixed to the support member 50 and function as a support shaft, and are driven by rotating around the X-axis direction as a central axis by a driving force from a motor (not shown). Some function as axes.

  Further, at least one transport roller 54 is attached to the long shaft 52 and the short shaft 53. Although not shown in detail, the conveyance roller 54 is fixed to the long shaft 52 (or short shaft 53) and functions as a driving roller, and is attached rotatably to the long shaft 52 (or short shaft 53). And function as a driven roller. Of the conveying rollers 54, the one that functions as a driving roller mainly corresponds to the first driving roller in the present invention.

  The transport roller 54 supports the substrate 90 from the (−Z) direction (downward) by bringing the upper end into contact with the lower surface of the substrate 90. The height positions (positions in the Z-axis direction) of the upper ends of the plurality of transport rollers 54 are designed to be substantially the same, and the substrate 90 supported by the plurality of transport rollers 54 is supported in a horizontal posture. The

  The transport roller 54 fixed to the long shaft 52 (or the short shaft 53) functioning as the drive shaft rotates as the drive roller by the rotation of the drive shaft, and transports the supported substrate 90 in the (+ Y) direction.

  The second transport unit 6 includes a pair of support members 60 that are arranged to face each other in the X-axis direction, and a plurality of long shafts 62 whose both ends are attached to the pair of support members 60.

  The long shafts 62 are all arranged along the X-axis direction, and although not shown in detail, the long shaft 62 is fixed to the support member 60 and functions as a support shaft, and the X-axis is driven by a driving force from a motor (not shown). Some of them rotate as a central axis and function as a drive shaft.

  Further, a conveyance roller 64 is attached to the long shaft 62. Although details are not shown, there are a conveyance roller 64 that is fixed to the long shaft 62 and functions as a driving roller, and a conveyance roller 64 that is rotatably attached and functions as a driven roller. Of the conveying rollers 64, the one that functions as a driving roller mainly corresponds to the second driving roller in the present invention.

  The transport roller 64 supports the substrate 90 from the (−Z) direction (downward) by bringing the upper end into contact with the lower surface of the substrate 90. The height positions (positions in the Z-axis direction) of the upper ends of the plurality of transport rollers 64 are designed to be substantially the same, and the substrate 90 supported by the plurality of transport rollers 64 is supported in a horizontal posture. The

  Note that the height position of the upper end of the transport roller 64 is substantially the same as the height position of the upper end of the transport roller 54. As a result, the height position of the substrate 90 is not changed even when it is transferred from the first transport unit 5 to the second transport unit 6.

  The transport roller 64 fixed to the long shaft 62 functioning as the drive shaft rotates as the drive roller by the rotation of the drive shaft, and transports the supported substrate 90 in the (+ Y) direction.

  As shown in FIG. 2, the inspection apparatus 1 includes a positioning mechanism 7 that determines the position of the substrate 90 and a change mechanism 8 that changes the orientation of the substrate 90.

  The positioning mechanism 7 includes a pair of first positioning units 70 that determine the position of the substrate 90 on the first transport unit 5 in the Y-axis direction, and a pair of second positioning units that are disposed so as to face each other in the X-axis direction. 71 and 72 are provided.

  The pair of first positioning portions 70 are fixed to the same long axis 52 so that the positions in the Y-axis direction are substantially the same. As will be described in detail later, the pair of first positioning units 70 is used to stop the substrate 90 being transported by the first transport unit 5 above the change mechanism 8.

  The long shaft 52 to which the first positioning unit 70 is fixed is the long shaft 52 having a structure that does not rotate, and the transport roller 54 attached to the long shaft 52 is a driven roller that can rotate with respect to the long shaft 52. . However, the pair of first positioning portions 70 may be fixed to the support member 50, for example. That is, as long as the structure does not move in the Y-axis direction, it may be fixed to any member.

  Although not shown in detail, each first positioning portion 70 includes a pin member that can advance and retract in the Z-axis direction. When the substrate 90 is positioned (when the substrate 90 is stopped above the change mechanism 8), each first positioning unit 70 advances the pin member in the (+ Z) direction to a height position where the substrate 90 is conveyed. Let When the substrate 90 is transported in this state, the tip end portion (+ Y side end portion) of the substrate 90 abuts on the pin member, and the position of the substrate 90 in the Y-axis direction is determined.

  On the other hand, when the first transport unit 5 transports the substrate 90 further in the (+ Y) direction, each first positioning unit 70 retracts the pin member in the (−Z) direction, and the pin member contacts the substrate 90. Avoid contact. Thereby, the substrate 90 can pass over the first positioning portion 70.

  Since the pair of second positioning parts 71 and 72 arranged so as to face each other in the X-axis direction have the same structure, only the structure of the second positioning part 71 will be described below.

  FIG. 6 is a side view showing the second positioning portion 71 from the (−X) direction. FIG. 7 is a side view showing the second positioning portion 71 from the (−Y) direction.

  The second positioning portion 71 includes an attachment member 73 that is fixed to a gantry (not shown), a drive portion 74, and an urging portion 75. The drive unit 74 fixed to the attachment member 73 is a general linear motion mechanism, and has a function of moving the urging unit 75 forward and backward in the X-axis direction according to a control signal from a control unit (not shown). The position of the urging unit 75 in the X-axis direction is determined by controlling the driving distance of the driving unit 74.

  The urging portion 75 includes a support portion 76, a pair of shaft portions 77a and 77b, and pads 78a and 78b, and can be moved forward and backward integrally in the X-axis direction by the drive portion 74 as described above. It is said that.

  The support portion 76 that functions as a base of the urging portion 75 is disposed so that the longitudinal direction is a direction along the Y-axis direction. A driving unit 74 is connected to the support unit 76, and the driving force of the driving unit 74 is transmitted.

  The pair of shaft portions 77a and 77b are rod-shaped members that are arranged in an upright state in the Z-axis direction at both ends of the support portion 76 in the Y-axis direction. That is, the end portions in the (−Z) direction of the shaft portions 77a and 77b are all fixed to the support portion 76, and the shaft portions 77a and 77b and the support portion 76 constitute an integral structure. Yes.

  The pads 78a and 78b are attached to the tip portions of the shaft portions 77a and 77b, respectively, so as to be rotatable about the Z-axis direction as a central axis. It abuts on the end side surface of 90.

  The pair of pads 78a and 78b of the second positioning portion 71 are opposed to each other in the Y-axis direction, and are arranged so that the positions in the X-axis direction are equal to each other. Therefore, when both of the pair of pads 78a and 78b are in contact with the end portion of the substrate 90, the extending direction of the end portion is the Y-axis direction. That is, when the pads 78a and 78b of the second positioning portion 71 abut on the substrate 90, the end of the substrate 90 on the (−X) side is adjusted so that the extending direction is the Y-axis direction. On the other hand, when the pads 78a and 78b of the second positioning portion 72 abut on the substrate 90, the end of the substrate 90 on the (+ X) side is adjusted so that the extending direction is the Y-axis direction. Therefore, the second positioning portions 71 and 72 have a function of accurately finely adjusting the orientation of the substrate 90.

  Further, the drive unit 74 determines the positions of the pads 78a and 78b in the X-axis direction by moving the urging unit 75 in the X-axis direction in accordance with the control signal from the control unit described above. Thereby, the position of the end part of the board | substrate 90 which contact | abuts to pad 78a, 78b is determined in the X-axis direction. That is, the inspection apparatus 1 moves the pads 78a and 78b of the pair of second positioning portions 71 and 72 facing each other to predetermined positions in the X-axis direction, whereby the substrate 90 on the first transport unit 5 is moved. The position in the X axis direction is determined.

  Further, since the pads 78a and 78b are attached so as to be rotatable about the Z-axis direction, the substrate 90 can be moved in the Y-axis direction while remaining in contact with the pads 78a and 78b. Yes.

  FIG. 8 is a side view showing a configuration related to the changing mechanism 8. The change mechanism 8 includes a table 80, support pins 81, support members 82, a base 83, an elevating mechanism 84, a rotation shaft 85, a rotation motor 86, and a timing belt 87.

  The table 80 is a substantially rectangular plate-like member and is arranged in a substantially horizontal posture. Further, the table 80 is disposed at the center in the X-axis direction of the transport path of the substrate 90 by the first transport unit 5.

  As shown in FIG. 2, four support pins 81 are erected near the corners of the upper surface of the table 80. The front end (upper end) of each support pin 81 is at the same height position, and the upper end of each support pin 81 comes into contact with the back surface of the substrate 90, so that the change mechanism 8 brings the substrate 90 into a predetermined position in a horizontal posture. It is possible to hold. In FIG. 2, only four support pins 81 are illustrated, but the number of support pins 81 is not limited to four, and three or more support pins may be provided.

  A columnar column member 82 is suspended from the center of the back surface of the table 80 in the direction along the Z axis, and the table 80 and the column member 82 constitute an integral structure. Further, as will be described later, the column member 82 is connected to the lifting mechanism 84.

  The base 83 is a member that functions as a base to which the lifting mechanism 84 and the rotation shaft 85 are attached.

  The elevating mechanism 84 fixed to the base 83 is a general linear motion mechanism, and is connected to the support member 82 as described above. The elevating mechanism 84 has a function of elevating the support member 82 in the Z-axis direction. As the elevating mechanism 84 raises and lowers the column member 82, the table 80 fixed to the column member 82 moves up and down between a lower position and an upper position.

  The lower position is a position where the table 80 is lowered (retracted) in the (−Z) direction so that the support pins 81 do not contact the substrate 90 supported by the first transport unit 5. More specifically, when the table 80 is disposed at the lower position, the height position of the upper end of each support pin 81 is lower than the height position of the upper end of each conveyance roller 54 of the first conveyance unit 5. Thus, the lifting mechanism 84 lowers the table 80 to the lower position, so that the substrate 90 can be transported by the first transport unit 5 without interfering with the changing mechanism 8.

  The upper position is a position where the table 80 is raised in the (+ Z) direction so that the height position of the lower surface of the table 80 is higher than the height position of the upper end of each conveyance roller 54 of the first conveyance unit 5. It is. In this way, the raising / lowering mechanism 84 raises the table 80 to the upper position, so that the changing mechanism 8 receives the substrate 90 transferred to the upper side of the changing mechanism 8 by the first transfer unit 5 from the first transfer unit 5. Is possible. Further, the table 80 at the upper position can rotate around the axis P without interfering with the first transport unit 5 (described later).

  The rotating shaft 85 is suspended from the back surface side of the base 83 so that the axis P becomes the central axis. A timing belt 87 is stretched between the rotary shaft 85 and the rotary motor 86, and the rotational driving force generated by the rotary motor 86 is transmitted to the rotary shaft 85 via the timing belt 87.

  With such a configuration, when the rotary motor 86 is driven to rotate, the rotary shaft 85 rotates about the axis P, whereby the table 80 rotates in a substantially horizontal plane. The rotation angle of the rotary motor 86 is controlled to be approximately 90 °. The changing mechanism 8 in the present embodiment rotates the table 80 by 90 ° while holding the substrate 90 by the support pins 81, thereby rotating the held substrate 90 by 90 ° in a substantially horizontal plane. Change the orientation.

  Depending on the state of the substrate 90, the shape and nature of the unevenness formed on the surface may be different, and the ease of detection may differ depending on the imaging direction. Therefore, if there is a direction in which unevenness is easily detected empirically, it is preferable to adjust the direction according to the characteristics of the substrate.

  Thus, even when the orientation of the substrate 90 carried into the inspection apparatus 1 (the first transport unit 5) is not suitable for the inspection, the inspection apparatus 1 causes the change mechanism 8 to change the orientation of the substrate 90 in advance. It can be changed to a direction suitable for inspection. Therefore, the inspection apparatus 1 can further improve the inspection accuracy.

  2 illustrates the changing mechanism 8 that changes the orientation of the substrate 90 transported by the first transport unit 5, the changing mechanism 8 changes the orientation of the substrate 90 transported by the second transport unit 6. You may arrange so that. In this case, the changing mechanism 8 can change the direction of the substrate 90 unloaded from the inspection apparatus 1 according to the direction required by the apparatus on the downstream side of the inspection apparatus 1 (the unloading unit 109 in this embodiment). it can. Further, the inspection apparatus 1 may include two change mechanisms 8.

  The above is the description of the configuration and functions of the inspection apparatus 1 in the present embodiment. Next, a method for inspecting the inspection region 93 set on the upper surface of the substrate 90 using the inspection apparatus 1 will be described.

  FIG. 9 and FIG. 10 are flowcharts showing an inspection method using the inspection apparatus 1.

  First, as an initial state, the inspection apparatus 1 raises the pin of the first positioning unit 70 and stops the substrate 90 using the pin. Further, the urging portions 75 of the second positioning portions 71 and 72 are retracted so that the substrate 90 being conveyed does not interfere with the pads 78a and 78b. Further, the table 80 is retracted to the lower position so that the substrate 90 being conveyed does not interfere with the table 80 and the support pins 81 of the changing mechanism 8. In such an initial state, the inspection apparatus 1 stands by until the substrate 90 is loaded (step S10).

  When the substrate 90 is carried into the first transport unit 5 of the inspection apparatus 1, the inspection apparatus 1 determines Yes in step S10, starts transporting the substrate 90 by the first transport unit 5 (step S11), and transports. It is monitored whether or not the substrate 90 being in contact with the first positioning unit 70 (step S12). In the present embodiment, the determination in step S <b> 12 monitors the passage of time sufficient for the leading end of the substrate 90 to reach the first positioning unit 70 according to the transport speed and transport distance of the first transport unit 5. By doing. However, a sensor for detecting the position of the tip of the substrate 90 may be provided.

  When the front end portion on the (+ Y) side of the substrate 90 contacts the first positioning unit 70 (Yes in step S12), the first transport unit 5 stops transporting the substrate 90 (step S13). As a result, the position of the substrate 90 in the Y-axis direction is determined by the first positioning unit 70 and stops at a predetermined position above the change mechanism 8.

  Next, the inspection apparatus 1 lowers the pin of the first positioning unit 70 (step S14) and determines whether or not the orientation of the substrate 90 needs to be changed (step S15). In the inspection apparatus 1, information indicating the orientation in which the substrate 90 is carried in from the upstream apparatus in advance, information on the orientation of the substrate 90 suitable for inspection, and the substrate requested by the downstream apparatus Information indicating the direction or the like is given, and the determination in step S15 is performed accordingly.

  If it is not necessary to change the orientation (No in step S15), the inspection apparatus 1 proceeds to the next process without changing the orientation of the substrate 90 by skipping steps S16 to S18 described later.

  On the other hand, when it is necessary to change the direction (Yes in step S15), the changing mechanism 8 of the inspection apparatus 1 drives the lifting mechanism 84 to raise the table 80 in the (+ Z) direction to the upper position (step). S16). In the process of executing step S16, the support pin 81 comes into contact with the back surface of the substrate 90, and the table 80 (support pin 81) is further lifted, so that the substrate 90 is separated from the transport roller 54. 1 is transferred from the transport unit 5 to the change mechanism 8.

  When the table 80 is raised to the upper position, the changing mechanism 8 stops the elevating mechanism 84 and drives the rotary motor 86. Then, the rotational driving force of the rotary motor 86 is transmitted to the rotary shaft 85 through the timing belt 87, the rotary shaft 85 rotates about the axis P, and the table 80 similarly rotates about the axis P in conjunction with this. To do. In this way, the changing mechanism 8 rotates the table 80 by 90 ° to change the orientation of the substrate 90 on the table 80 by 90 ° (step S17).

  When the direction change is completed, the change mechanism 8 drives the lifting mechanism 84 to lower the table 80 in the (−Z) direction to the lower position (step S18). In the process of executing step S18, the upper end of the transport roller 54 comes into contact with the back surface of the substrate 90, and the table 80 (support pin 81) is further lowered, whereby the substrate 90 is separated from the support pin 81. Is transferred from the change mechanism 8 to the first transport unit.

  When it is determined No in step S15 or when the process of step S18 is completed, the inspection apparatus 1 determines the position of the substrate 90 in the X-axis direction by the second positioning units 71 and 72 (step S20). That is, the driving units 74 of the second positioning units 71 and 72 are driven to move the urging units 75 in the direction in which the substrate 90 exists. Thereby, each pad 78a, 78b contacts the end of the substrate 90, the position of the substrate 90 in the X-axis direction is determined, and fine adjustment of the orientation of the substrate 90 is completed. Note that the position of the substrate 90 in the X-axis direction is preferably the center position in the X-axis direction of the transport path.

  Next, the inspection apparatus 1 drives the supply mechanism 21 to start supplying air into the chamber 26 of the levitation stage 23 (step S21). Thereby, the discharge of air from the porous member 27 is started, and thereafter, air is blown to the back surface of the substrate 90 that has reached the upper side of the porous member 27, and the portion (supported portion 91) is levitated and supported. .

  Moreover, the inspection apparatus 1 starts the exhaust by the pair of suction stages 24 by driving the exhaust mechanism 20 (step S22). As a result, exhaust from the suction groove 25 is started, and thereafter, a suction force acts on the back surface of the substrate 90 that has reached the upper side of the suction stage 24, and the bending and vibration are cut off.

  Further, the inspection apparatus 1 starts imaging by the imaging unit 3 (step S23), and starts transporting the substrate 90 by the first transport unit 5 and the second transport unit 6 (step S24). As a result, while the substrate 90 is transported in the Y-axis direction, the entire width in the X-axis direction (the upper surface of the imaging portion 92) of the inspection region 93 of the substrate 90 is sequentially imaged to generate image data.

  Note that the processing of steps S21 to S24 may be executed simultaneously in parallel. Or you may comprise so that an appropriate step may be performed in an appropriate order according to the position of the board | substrate 90. FIG. It is only necessary that steps S21 to S23 have been started at least until step S24 is started and the tip of the substrate 90 in the (+ Y) direction reaches position E.

  When the processing of steps S21 to S24 is started, the inspection apparatus 1 continues to carry the substrate 90 and image by the imaging unit 3 while monitoring whether or not the substrate 90 has reached the carry-out position (step S25). .

  In parallel with these processes, the inspection apparatus 1 inspects the inspection region 93 based on the image data obtained by the imaging unit 3, and outputs the inspection results as appropriate. As a method for outputting the inspection result, for example, it is conceivable to store the inspection result in the history information of the substrate 90 or to give a warning to the operator by a display unit (display or lamp) (not shown). Or you may change the conveyance destination (unloading position) of the board | substrate 90 according to a test result.

  If it determines with the board | substrate 90 having reached | attained the carrying-out position, it will determine with Yes in step S25, and the inspection apparatus 1 will stop conveyance of the board | substrate by the 2nd conveyance part 6 (step S26).

  Although details are not described, by the time the step S26 is executed, the conveyance of the substrate 90 by the first conveyance unit 5 is stopped, the suction by the exhaust mechanism 20 is stopped, the supply of air by the supply mechanism 21 is stopped, and the imaging is performed. Processing such as stopping imaging of the substrate 90 by the unit 3 is executed. The timing for executing these processes is preferably determined according to the position of the substrate 90 in the Y-axis direction (how far the substrate 90 has been transported).

  When step S26 is executed and the substrate 90 stops at the unloading position, the inspection apparatus 1 waits until the substrate 90 is unloaded from the inspection apparatus 1, and then whether or not there is another substrate 90 to be inspected (the inspection is finished). (Step S27).

  If there is a new substrate 90 to be inspected, the inspection apparatus 1 returns to the initial state and repeats the processing from step S10. On the other hand, when the inspection is completed for all the substrates 90, the inspection apparatus 1 ends the processing.

  In the above description, the introduction of the new substrate 90 into the inspection apparatus 1 has been described as being performed after the completion of the unloading of the substrate 90 that has been inspected. However, as long as a sufficient time interval is provided in the inspection apparatus 1 so that the front and rear substrates 90 do not interfere with each other, a new substrate 90 may be loaded without necessarily waiting for the unloaded substrate 90 to be unloaded. .

  As described above, the inspection apparatus 1 according to the present embodiment blows air from below the horizontally oriented substrate 90 to separate the supported portion 91 across the entire width of the substrate 90 in the X-axis direction from the supported portion 91. In this state, the imaging portion 92 having the X-axis direction as the longitudinal direction is simultaneously imaged by the imaging unit 3. Thereby, at the position E (imaging position) in the Y-axis direction, the member of the inspection apparatus 1 does not come into contact with the substrate 90 over the entire width in the X-axis direction. Is made uniform. Therefore, since the bending of the imaging part 92 of the substrate 90 is suppressed, the flatness of the upper surface of the imaging part 92 is improved. Therefore, the imaging part 92 can be imaged with high accuracy, and the inspection accuracy is improved.

  Further, by blowing air over the entire width of the supported portion 91 in the X-axis direction, the flatness can be further improved as compared with the case where air is blown to a part of the supported portion 91.

  Further, since the imaging portion 92 includes the entire width of the inspection region 93 of the substrate 90 in the X-axis direction, the imaging unit 3 and the substrate 90 are moved in the X-axis direction in order to image the entire width of the inspection region 93 in the X-axis direction. There is no need for relative movement.

  Further, the substrate 90 is further provided with a transport unit 4 that horizontally transports the substrate 90 in the horizontal position in the Y-axis direction, and the supported portion 91 of the substrate 90 transported by the transport unit 4 is levitated to support the substrate 90. Since the image can be captured without any problem, the tact time can be shortened.

  Further, by evacuating the atmosphere below the substrate 90 in a state where the supported portion 91 is supported in a floating manner by the support portion 2, an adsorption action by the exhaust can be added, and a so-called vibration cutting effect is obtained. Therefore, the flatness can be further improved.

  In addition, since the position accuracy of the substrate 90 is improved by determining the position of the substrate 90 in the X-axis direction by the second positioning portions 71 and 72, the inspection region can be accurately imaged.

  Furthermore, by changing the orientation of the substrate 90, it is possible to set the substrate 90 in a direction corresponding to the inspection regardless of the orientation of the substrate 90 during loading / unloading.

<2. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

For example, the imaging unit 3 may not be configured to capture the entire width of the substrate 90 in the X-axis direction (the imaging portion 92 does not necessarily have to cover the entire width of the substrate 90 in the X-axis direction). That is, the size of the imaging region of the line camera 31 in the X-axis direction may be smaller than the size W ₁ of the substrate 90 in the X-axis direction. For example, if the inspection area 93 is set as an area excluding the end portion in the X-axis direction, it is sufficient if at least an area including the inspection area 93 can be imaged. As described above, as long as the flatness of the supported portion 91 is ensured, the imaging portion 92 does not necessarily have to be a portion extending over the entire width of the substrate 90 in the X-axis direction.

Further, the levitation stage 23 may not be blown against the entire width of the supported portion 91 in the X-axis direction. That is, the size W in the X-axis direction of the levitation stage 23 (porous member 27) may be smaller than the size W ₁ of the substrate 90 in the X-axis direction. If the deflection of the substrate 90 is sufficiently small even if only the central portion of the substrate 90 is levitated and supported, for example, air may not be blown to both ends of the substrate 90 in the X-axis direction.

  Moreover, each process shown in FIG. 9 and FIG. 10 is an illustration to the last, Comprising: It is not limited to such a processing content or order. That is, as long as the same effect can be obtained, the processing content and order may be changed as appropriate.

  As shown in FIG. 3, in the above embodiment, the stage 22 is between the first transport unit 5 (support member 50) and the second transport unit 6 (support member 60) (space in the Y-axis direction). Is designed to be larger than the width in the Y-axis direction, but is not limited to such a dimensional relationship.

  In the above embodiment, the position of the lower surface of the stage 22 in the Z-axis direction is the same as the position of the lower ends of the support member 50 and the support member 60 in the Z-axis direction (see FIG. 3). However, for example, the position of the lower surface of the stage 22 in the Z-axis direction may be designed to be higher than the positions of the lower ends of the support member 50 and the support member 60 in the Z-axis direction.

  Moreover, in the said embodiment, the position of the Z-axis direction of the upper surface of the stage 22 is lower than the position of the upper end of the supporting member 50 and the supporting member 60 in the Z-axis direction (refer FIG. 3). However, for example, the position of the upper surface of the stage 22 in the Z-axis direction may be designed to be substantially the same as the position of the upper ends of the support member 50 and the support member 60 in the Z-axis direction.

  Further, the position where the inspection apparatus 1 is provided is not limited to between the temperature control unit 103 and the carry-out unit 109. For example, if uneven application is detected, the inspection apparatus 1 may be provided on the downstream side of the temperature adjustment unit 106 or in the temperature adjustment unit 106 so that the inspection is performed after the baking process after the application process. .

  Moreover, although the said embodiment demonstrated the example in which the one stage 22 floats the board | substrate 90, the number of the stages 22 is not limited to this. FIG. 11 is a diagram illustrating a state in which the substrate 90 is levitated and supported in the modified example. In the example shown in FIG. 11, two stages 22 are installed with a gap in the Y-axis direction, and a plate member 28 is installed at a position E in the Y-axis direction. That is, in the configuration shown in FIG. 11, the supported portion 91 of the substrate 90 is levitated and supported by the two stages 22, but air is not blown to the back surface of the imaging portion 92. The plate member 28 is a plate-like member made of a material having low reflectivity. As described above, if the supported portion 91 of the substrate 90 is supported by levitation, the substrate 90 may be supported by levitation at a position not directly below the position E. With this configuration, the plate member 28 can be arranged at the position E so that the light transmitted through the substrate 90 does not go to the line camera 31.

  Further, in the above embodiment, the substrate processing system 100 includes the coating unit 105 and the developing unit 108, and the inspection apparatus 1 is configured as a device that detects coating unevenness and development unevenness. However, the substrate processing system 100 may include an etching unit or a peeling unit as a processing unit. In such a case, the inspection apparatus 1 may be disposed in the etching part in order to inspect the etching unevenness, or may be disposed in the peeling part in order to inspect the peeling unevenness.

1 is a plan view of a substrate processing system according to the present invention. It is a top view of an inspection device. It is a side view of an inspection device. It is a figure which shows the supported part and imaging part in a board | substrate. It is a figure which shows a stage. It is a side view which shows a 2nd positioning part from the (-X) direction. It is a side view which shows a 2nd positioning part from the (-Y) direction. It is a side view which shows the structure which concerns on a change mechanism. It is a flowchart which shows the inspection method using an inspection apparatus. It is a flowchart which shows the inspection method using an inspection apparatus. It is a figure which shows a mode that a board | substrate is levitated and supported in a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Substrate processing system 1 Inspection apparatus 2 Support part 20 Exhaust mechanism 21 Supply mechanism 23 Levitation stage 24 Adsorption stage 27 Porous member 3 Imaging part 31 Line camera 4 Conveyance part 5 1st conveyance part 54 Conveyance roller (1st drive roller)
6 2nd conveyance part 64 conveyance roller (2nd drive roller)
DESCRIPTION OF SYMBOLS 7 Positioning mechanism 70 1st positioning part 71,72 2nd positioning part 8 Change mechanism 90 Substrate 91 Supported part 92 Imaging part 93 Inspection area

Claims (6)

An inspection apparatus for inspecting an inspection area set on an upper surface of a substrate,
Transport means for horizontally transporting a horizontal substrate in a first direction;
Air is blown from below the substrate being transported by the transport means, and the supported portion of the substrate spanning the entire width in the second direction orthogonal to the first direction is levitated and supported in a state of being separated from the supported portion. Supporting means for
Exhaust means for exhausting the atmosphere below the substrate in a state where the supported portion is supported by the support means;
An imaging unit that simultaneously images an imaging part having the second direction as a longitudinal direction among the supported parts that are levitated and supported by the support unit;
With
The conveying means is
A first drive roller provided upstream of the support means in the first direction;
A second drive roller provided downstream in the first direction of the support means;
With
An inspection apparatus characterized in that a horizontal substrate is horizontally conveyed in the first direction by rotating the first drive roller and the second drive roller. The inspection apparatus according to claim 1,
The inspection apparatus is characterized in that the support means blows air over the entire width of the supported portion in the second direction. The inspection apparatus according to claim 1 or 2,
The inspection apparatus, wherein the imaging portion includes a full width of the inspection region of the substrate in the second direction. The inspection apparatus according to any one of claims 1 to 3,
An inspection apparatus further comprising positioning means for determining a position of the substrate in the second direction. The inspection apparatus according to any one of claims 1 to 4,
An inspection apparatus further comprising changing means for changing the orientation of the substrate. A substrate processing system,
An inspection apparatus for inspecting an inspection area set on the upper surface of the substrate;
A processing unit for processing a substrate;
Carry-in means for carrying a substrate from the processing unit to the inspection apparatus;
Unloading means for unloading the substrate from the inspection apparatus;
With
The inspection device includes:
Transport means for horizontally transporting a horizontal substrate in a first direction;
Air is blown from below the substrate being transported by the transport means, and the supported portion of the substrate spanning the entire width in the second direction orthogonal to the first direction is levitated and supported in a state of being separated from the supported portion. Supporting means for
Exhaust means for exhausting the atmosphere below the substrate in a state where the supported portion is supported by the support means;
An imaging unit that simultaneously images an imaging part having the second direction as a longitudinal direction among the supported parts that are levitated and supported by the support unit;
With
The conveying means is
A first drive roller provided upstream of the support means in the first direction;
A second drive roller provided downstream in the first direction of the support means;
With
When the first driving roller and the second driving roller rotate, a horizontal posture substrate is horizontally conveyed in the first direction by the conveying means,
The carry-in means carries the substrate into the first drive roller,
The substrate processing system, wherein the unloading means unloads the substrate from the second drive roller.

Images