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JP2009095876A - レーザ加工装置、レーザ加工方法およびレーザ加工プログラム - Google Patents

レーザ加工装置、レーザ加工方法およびレーザ加工プログラム Download PDF

Info

Publication number
JP2009095876A
JP2009095876A JP2007271673A JP2007271673A JP2009095876A JP 2009095876 A JP2009095876 A JP 2009095876A JP 2007271673 A JP2007271673 A JP 2007271673A JP 2007271673 A JP2007271673 A JP 2007271673A JP 2009095876 A JP2009095876 A JP 2009095876A
Authority
JP
Japan
Prior art keywords
workpiece
irradiation
modulation element
spatial modulation
malfunctioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007271673A
Other languages
English (en)
Japanese (ja)
Inventor
Yutaka Uchiki
裕 内木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2007271673A priority Critical patent/JP2009095876A/ja
Priority to TW097136865A priority patent/TW200918223A/zh
Priority to KR1020080101975A priority patent/KR20090039646A/ko
Priority to CNA2008101672782A priority patent/CN101412151A/zh
Publication of JP2009095876A publication Critical patent/JP2009095876A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
JP2007271673A 2007-10-18 2007-10-18 レーザ加工装置、レーザ加工方法およびレーザ加工プログラム Withdrawn JP2009095876A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007271673A JP2009095876A (ja) 2007-10-18 2007-10-18 レーザ加工装置、レーザ加工方法およびレーザ加工プログラム
TW097136865A TW200918223A (en) 2007-10-18 2008-09-25 Laser processing device and laser processing method
KR1020080101975A KR20090039646A (ko) 2007-10-18 2008-10-17 레이저 가공 장치 및 레이저 가공 방법
CNA2008101672782A CN101412151A (zh) 2007-10-18 2008-10-17 激光加工装置以及激光加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007271673A JP2009095876A (ja) 2007-10-18 2007-10-18 レーザ加工装置、レーザ加工方法およびレーザ加工プログラム

Publications (1)

Publication Number Publication Date
JP2009095876A true JP2009095876A (ja) 2009-05-07

Family

ID=40593006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007271673A Withdrawn JP2009095876A (ja) 2007-10-18 2007-10-18 レーザ加工装置、レーザ加工方法およびレーザ加工プログラム

Country Status (4)

Country Link
JP (1) JP2009095876A (ko)
KR (1) KR20090039646A (ko)
CN (1) CN101412151A (ko)
TW (1) TW200918223A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102922133A (zh) * 2012-11-09 2013-02-13 武汉市楚源光电有限公司 一种自动光学检测激光焊接系统
JP2022174212A (ja) * 2017-03-10 2022-11-22 テキサス インスツルメンツ インコーポレイテッド デジタルマイクロミラーデバイス及びスタティックリフレクタを用いたヘッドランプ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5554753B2 (ja) * 2011-06-29 2014-07-23 株式会社日立ハイテクノロジーズ 露光方法及びその装置
JP6801312B2 (ja) * 2016-09-07 2020-12-16 村田機械株式会社 レーザ加工機、及びレーザ加工方法
CN111940423B (zh) * 2020-08-07 2021-07-13 武汉金顿激光科技有限公司 一种飞机非导电复合涂层的原位激光清洗方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770057B2 (ja) * 2001-05-14 2011-09-07 三菱電機株式会社 レーザ加工機及びレーザ加工方法
JP2004191660A (ja) * 2002-12-11 2004-07-08 Fuji Photo Film Co Ltd 露光装置
CN1925945A (zh) * 2004-03-05 2007-03-07 奥林巴斯株式会社 激光加工装置
JP2006227198A (ja) * 2005-02-16 2006-08-31 Olympus Corp レーザ加工装置
JP4947933B2 (ja) * 2005-07-26 2012-06-06 オリンパス株式会社 レーザリペア装置
JP4804911B2 (ja) * 2005-12-22 2011-11-02 浜松ホトニクス株式会社 レーザ加工装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102922133A (zh) * 2012-11-09 2013-02-13 武汉市楚源光电有限公司 一种自动光学检测激光焊接系统
CN102922133B (zh) * 2012-11-09 2015-09-16 武汉市楚源光电有限公司 一种自动光学检测激光焊接系统
JP2022174212A (ja) * 2017-03-10 2022-11-22 テキサス インスツルメンツ インコーポレイテッド デジタルマイクロミラーデバイス及びスタティックリフレクタを用いたヘッドランプ
JP7616515B2 (ja) 2017-03-10 2025-01-17 テキサス インスツルメンツ インコーポレイテッド デジタルマイクロミラーデバイス及びスタティックリフレクタを用いたヘッドランプ

Also Published As

Publication number Publication date
CN101412151A (zh) 2009-04-22
TW200918223A (en) 2009-05-01
KR20090039646A (ko) 2009-04-22

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