JP2009095876A - レーザ加工装置、レーザ加工方法およびレーザ加工プログラム - Google Patents
レーザ加工装置、レーザ加工方法およびレーザ加工プログラム Download PDFInfo
- Publication number
- JP2009095876A JP2009095876A JP2007271673A JP2007271673A JP2009095876A JP 2009095876 A JP2009095876 A JP 2009095876A JP 2007271673 A JP2007271673 A JP 2007271673A JP 2007271673 A JP2007271673 A JP 2007271673A JP 2009095876 A JP2009095876 A JP 2009095876A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- irradiation
- modulation element
- spatial modulation
- malfunctioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007271673A JP2009095876A (ja) | 2007-10-18 | 2007-10-18 | レーザ加工装置、レーザ加工方法およびレーザ加工プログラム |
TW097136865A TW200918223A (en) | 2007-10-18 | 2008-09-25 | Laser processing device and laser processing method |
KR1020080101975A KR20090039646A (ko) | 2007-10-18 | 2008-10-17 | 레이저 가공 장치 및 레이저 가공 방법 |
CNA2008101672782A CN101412151A (zh) | 2007-10-18 | 2008-10-17 | 激光加工装置以及激光加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007271673A JP2009095876A (ja) | 2007-10-18 | 2007-10-18 | レーザ加工装置、レーザ加工方法およびレーザ加工プログラム |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009095876A true JP2009095876A (ja) | 2009-05-07 |
Family
ID=40593006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007271673A Withdrawn JP2009095876A (ja) | 2007-10-18 | 2007-10-18 | レーザ加工装置、レーザ加工方法およびレーザ加工プログラム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009095876A (ko) |
KR (1) | KR20090039646A (ko) |
CN (1) | CN101412151A (ko) |
TW (1) | TW200918223A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102922133A (zh) * | 2012-11-09 | 2013-02-13 | 武汉市楚源光电有限公司 | 一种自动光学检测激光焊接系统 |
JP2022174212A (ja) * | 2017-03-10 | 2022-11-22 | テキサス インスツルメンツ インコーポレイテッド | デジタルマイクロミラーデバイス及びスタティックリフレクタを用いたヘッドランプ |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5554753B2 (ja) * | 2011-06-29 | 2014-07-23 | 株式会社日立ハイテクノロジーズ | 露光方法及びその装置 |
JP6801312B2 (ja) * | 2016-09-07 | 2020-12-16 | 村田機械株式会社 | レーザ加工機、及びレーザ加工方法 |
CN111940423B (zh) * | 2020-08-07 | 2021-07-13 | 武汉金顿激光科技有限公司 | 一种飞机非导电复合涂层的原位激光清洗方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4770057B2 (ja) * | 2001-05-14 | 2011-09-07 | 三菱電機株式会社 | レーザ加工機及びレーザ加工方法 |
JP2004191660A (ja) * | 2002-12-11 | 2004-07-08 | Fuji Photo Film Co Ltd | 露光装置 |
CN1925945A (zh) * | 2004-03-05 | 2007-03-07 | 奥林巴斯株式会社 | 激光加工装置 |
JP2006227198A (ja) * | 2005-02-16 | 2006-08-31 | Olympus Corp | レーザ加工装置 |
JP4947933B2 (ja) * | 2005-07-26 | 2012-06-06 | オリンパス株式会社 | レーザリペア装置 |
JP4804911B2 (ja) * | 2005-12-22 | 2011-11-02 | 浜松ホトニクス株式会社 | レーザ加工装置 |
-
2007
- 2007-10-18 JP JP2007271673A patent/JP2009095876A/ja not_active Withdrawn
-
2008
- 2008-09-25 TW TW097136865A patent/TW200918223A/zh unknown
- 2008-10-17 CN CNA2008101672782A patent/CN101412151A/zh active Pending
- 2008-10-17 KR KR1020080101975A patent/KR20090039646A/ko not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102922133A (zh) * | 2012-11-09 | 2013-02-13 | 武汉市楚源光电有限公司 | 一种自动光学检测激光焊接系统 |
CN102922133B (zh) * | 2012-11-09 | 2015-09-16 | 武汉市楚源光电有限公司 | 一种自动光学检测激光焊接系统 |
JP2022174212A (ja) * | 2017-03-10 | 2022-11-22 | テキサス インスツルメンツ インコーポレイテッド | デジタルマイクロミラーデバイス及びスタティックリフレクタを用いたヘッドランプ |
JP7616515B2 (ja) | 2017-03-10 | 2025-01-17 | テキサス インスツルメンツ インコーポレイテッド | デジタルマイクロミラーデバイス及びスタティックリフレクタを用いたヘッドランプ |
Also Published As
Publication number | Publication date |
---|---|
CN101412151A (zh) | 2009-04-22 |
TW200918223A (en) | 2009-05-01 |
KR20090039646A (ko) | 2009-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100929 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20111121 |